Display panel, manufacturing method thereof and display device

Abstract

The invention discloses a display panel, a manufacturing method thereof and a display device, and belongs to the technical field of display. The display panel comprises: a substrate; the backboard wiring layer comprises a first source-drain electrode layer, a first flat layer, a second source-drain electrode layer, a second flat layer and a third source-drain electrode layer which are stacked; an encapsulation layer; a touch electrode layer; the touch wires are electrically connected with the touch electrodes, and the touch wires are arranged in the non-display area and extend to the binding area through the bending area; the touch wire comprises a first wire part and a second wire part which are electrically connected, the first wire part crosses the bending area, and the second wire part is not overlapped with the bending area; the first wiring part is located on the third source-drain electrode layer, and the second wiring part is located on the touch electrode layer. The third source and drain electrode layer is used for replacing the second source and drain electrode layer to achieve transmission of touch signals in the bending area, so that punching of a film layer between the third source and drain electrode layer and the second source and drain electrode layer is omitted, and the thickness of the film layer needing punching is reduced.

Description

Display panel, manufacturing method thereof, and display device Technical Field

[0001] The present application relates to the field of display technology, and in particular to a display panel and a manufacturing method thereof, and a display device. Background Art

[0002] A display device includes a display panel and an integrated circuit (IC). The touch electrode layer in the display panel is connected to a backplane routing layer via touch traces, and the backplane routing layer is connected to the IC via touch traces. The backplane routing layer can transmit signals from the touch electrode layer to the IC, so that the IC can determine the touch position in the display panel based on the signals. However, current implementations of display panels including the touch electrode layer and backplane routing layer are relatively simple.

[0003] Summary of the Invention

[0004] The present invention provides a display panel and a method for manufacturing the same, as well as a display device. The technical solution is as follows:

[0005] In one aspect, an embodiment of the present application provides a display panel, comprising:

[0006] A base substrate, comprising a display area and a non-display area surrounding the display area, wherein the non-display area comprises a bending area and a binding area on a side of the bending area away from the display area;

[0007] A backplane wiring layer is provided on the base substrate, and includes a first source-drain electrode layer, a first planar layer, a second source-drain electrode layer, a second planar layer, and a third source-drain electrode layer that are stacked;

[0008] An encapsulation layer, provided on the backplane wiring layer;

[0009] a touch electrode layer, disposed on the encapsulation layer, comprising touch electrodes, and located at least in the display area;

[0010] A touch trace is electrically connected to the touch electrode, the touch trace is arranged in the non-display area, and extends to the binding area through the bending area; the touch trace includes a first trace portion and a second trace portion that are electrically connected, the first trace portion spans the bending area, and the second trace portion does not overlap with the bending area; the first trace portion is located in the third source and drain electrode layer, and the second trace portion is located in the touch electrode layer.

[0011] In another aspect, an embodiment of the present application provides a method for manufacturing a display panel, the method comprising:

[0012] A substrate is provided, the substrate comprising:

[0013] A display area and a non-display area surrounding the display area, wherein the non-display area includes a bending area and a binding area on a side of the bending area away from the display area;

[0014] forming a backplane wiring layer on the base substrate, wherein the backplane wiring layer includes a first source-drain electrode layer, a first planar layer, a second source-drain electrode layer, a second planar layer, and a third source-drain electrode layer that are stacked;

[0015] forming a packaging layer on a side of the backplane wiring layer away from the substrate;

[0016] forming a touch electrode layer on a side of the encapsulation layer away from the base substrate, wherein the touch electrode layer includes touch electrodes and is at least located in the display area;

[0017] A touch routing line is provided, the touch routing line being electrically connected to the touch electrode, the touch routing line being provided in the non-display area, and extending to the binding area through the bending area; the touch routing line includes a first routing portion and a second routing portion that are electrically connected, the first routing portion spanning the bending area, and the second routing portion not overlapping with the bending area; the first routing portion is located in the third source-drain electrode layer, and the second routing portion is located in the touch electrode layer.

[0018] On the other hand, an embodiment of the present application provides a display panel, comprising:

[0019] A base substrate, comprising a display area and a non-display area surrounding the display area, wherein the non-display area comprises a bending area and a binding area on a side of the bending area away from the display area;

[0020] A backplane wiring layer is provided on the base substrate, and includes a first source-drain electrode layer, a first planar layer, a second source-drain electrode layer, a second planar layer, and a third source-drain electrode layer that are stacked;

[0021] An encapsulation layer, provided on the backplane wiring layer;

[0022] a touch electrode layer, disposed on the encapsulation layer, comprising touch electrodes, and located at least in the display area;

[0023] A touch routing line is electrically connected to the touch electrode, the touch routing line is arranged in the non-display area and extends to the binding area through the bending area; the touch routing line includes an electrically connected first routing portion, a second routing portion and a third routing portion, the first routing portion spans the bending area, the second routing portion does not overlap with the bending area, and the orthographic projection of the third routing portion on the base substrate at least partially overlaps with the orthographic projection of the first routing portion on the base substrate; the first routing portion is located in the second source-drain electrode layer, the second routing portion is located in the touch electrode layer, and the third routing portion is located in the third source-drain electrode layer, the first routing portion includes a first sub-portion and a second sub-portion, the second flat layer isolates the first sub-portion from the third routing portion, and the second sub-portion is electrically connected to the third routing portion through a staggered via hole penetrating the second flat layer.

[0024] In another aspect, an embodiment of the present application provides a method for manufacturing a display panel, the method comprising:

[0025] A substrate is provided, the substrate comprising:

[0026] A display area and a non-display area surrounding the display area, wherein the non-display area includes a bending area and a binding area on a side of the bending area away from the display area;

[0027] forming a backplane wiring layer on the base substrate, wherein the backplane wiring layer includes a first source-drain electrode layer, a first planar layer, a second source-drain electrode layer, a second planar layer, and a third source-drain electrode layer that are stacked;

[0028] forming a packaging layer on a side of the backplane wiring layer away from the substrate;

[0029] forming a touch electrode layer on a side of the encapsulation layer away from the base substrate, wherein the touch electrode layer includes touch electrodes and is at least located in the display area;

[0030] A touch routing is provided, wherein the touch routing is electrically connected to the touch electrode, the touch routing is provided in the non-display area, and extends to the binding area through the bending area; the touch routing includes an electrically connected first routing portion, a second routing portion, and a third routing portion, wherein the first routing portion spans the bending area, the second routing portion does not overlap with the bending area, and the orthographic projection of the third routing portion on the base substrate at least partially overlaps with the orthographic projection of the first routing portion on the base substrate; the first routing portion is located in the second source-drain electrode layer, the second routing portion is located in the touch electrode layer, and the third routing portion is located in the third source-drain electrode layer, the first routing portion includes a first sub-portion and a second sub-portion, the second flat layer isolates the first sub-portion from the third routing portion, and the second sub-portion is electrically connected to the third routing portion through a staggered via hole penetrating the second flat layer.

[0031] On the other hand, an embodiment of the present application provides a display device, which includes any of the above-mentioned display panels.

[0032] The technical solutions provided by the embodiments of the present application bring at least the following beneficial effects:

[0033] In the technical solution provided in the embodiment of the present application, the first routing portion of the touch routing in the display panel is arranged on the third source-drain electrode layer, replacing the second source-drain electrode layer to realize the transmission of the touch signal in the bending area of ​​the display panel, thereby eliminating the need to punch the film layer between the second source-drain electrode layer and the third source-drain electrode layer, that is, reducing the thickness of the film layer to be punched, avoiding the problem of the film layer via being unable to be opened due to the thick thickness of the film layer to be punched, and further avoiding the problem of electrical connection failure of the touch routing in the bending area of ​​the display panel. Alternatively, the first routing portion of the touch routing in the display panel includes a first sub-portion and a second sub-portion, the first sub-portion is isolated from the third source-drain electrode layer by the second flat layer, and the second sub-portion is connected to the third source-drain electrode layer through the staggered vias in the second flat layer, thereby realizing the transmission of the touch signal in the bending area of ​​the display panel and enriching the implementation scheme of the touch signal transmission in the bending area of ​​the display panel. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0035] FIG1 is a schematic structural diagram of a display panel provided in an embodiment of the present application;

[0036] FIG2 is a schematic structural diagram of a cross-section of a touch wiring area of ​​a display panel provided by an embodiment of the present application;

[0037] FIG3 is a schematic diagram of the structure of a touch wiring provided by an embodiment of the present application;

[0038] FIG4 is a schematic structural diagram of a cross-section of a first transition region of a display panel provided in an embodiment of the present application;

[0039] FIG5 is a flow chart of a method for manufacturing a display panel provided in an embodiment of the present application;

[0040] FIG6 is a schematic structural diagram of a cross-section of a touch wiring area of ​​a display panel provided by an embodiment of the present application;

[0041] FIG7 is a schematic structural diagram of a cross-section of a first transition region of a display panel provided in an embodiment of the present application;

[0042] FIG8 is a flow chart of a method for manufacturing a display panel provided in an embodiment of the present application;

[0043] FIG9 is a schematic structural diagram of a display device provided in an embodiment of the present application. DETAILED DESCRIPTION

[0044] In order to make the objectives, technical solutions and advantages of this application clearer, the implementation methods of this application will be further described in detail below with reference to the accompanying drawings.

[0045] It should be noted that the terms "first", "second", etc. (if any) in the specification of the present application are used to distinguish similar objects and are not necessarily used to describe a specific order or sequential order. It should be understood that the data used in this way can be interchangeable where appropriate, so that the embodiments of the present application described herein can be implemented in an order other than those illustrated or described herein. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with the present application. On the contrary, they are merely examples of devices and methods consistent with some aspects of the present application.

[0046] The display device includes a display panel and an integrated circuit, wherein the touch electrode layer in the display panel is connected to a backplane routing layer, which is in turn connected to the IC. The backplane routing layer can transmit signals from the touch electrode layer to the IC, allowing the IC to determine the touch position in the display panel based on the signals. However, current implementations of display panels including the aforementioned touch electrode layer and backplane routing layer are relatively simple. The technical solutions provided in the embodiments of the present application enrich the implementation methods of display panels.

[0047] Referring to Figure 1 , Figure 1 provides a schematic structural diagram of a display panel, which includes a display area 101 and a bending area 102. The touch signal generated by the display area 101 of the display panel is transmitted to subsequent modules via the bending area 102. The area 103 in Figure 1 includes the wiring of the bending area 102 and the areas on both sides of the display panel, and the area 104 in Figure 1 includes the wiring of the display panel from the display area 101 to the bending area 102. Referring to Figure 2 , the area shown in Figure 2 is area 103 in Figure 1 , i.e., a schematic structural diagram of a cross-section of the touch wiring area of ​​the display panel.

[0048] In order to enrich the implementation methods of touch lines from the display area 225 to the bending area 227 of the display panel, an embodiment of the present application provides a display panel, which includes a base substrate 201, a backplane wiring layer 202, an encapsulation layer 210, a touch electrode layer 211 and touch lines.

[0049] The base substrate 201 is a substrate used in the manufacture of microelectronic products such as semiconductor devices and electronic components. The materials of the base substrate 201 include, but are not limited to, single crystal silicon, polycrystalline silicon, quartz glass, and alumina ceramics. In the embodiments of this application, the material of the base substrate 201 is not limited. During the production and manufacturing of the display panel, the base substrate 201 is used to support and secure structures other than the base substrate 201 located on at least one side of the base substrate 201.

[0050] Exemplarily, the base substrate 201 includes a display area 225 and a non-display area 226, wherein the display area 225 is the area of ​​the display panel used to display images, and the non-display area 226 is the area of ​​the display panel other than the display area 225. The non-display area 226 includes a bending area 227 and a binding area 228 located on the side of the bending area 227 away from the display area 225. The bending area 227 is located between the display area 225 and the binding area 228, and is used to transmit data signals from the display area 225 to the binding area 228. The binding area 228 includes a plurality of binding structures, which are used to be connected to and conducted with the pins in the FPC (Flexible Printed Circuit) to facilitate the transmission of corresponding signals. The embodiment of the present application does not limit the connection method of the binding structure and the pins.

[0051] The backplane wiring layer 202 is located on one side of the base substrate 201 and includes a stacked first source / drain electrode layer 203, a first planar layer 204, a second source / drain electrode layer 205, a second planar layer 206, and a third source / drain electrode layer 207. The third source / drain electrode layer 207 is used to transmit touch signals within the bend region 227 in the present embodiment. Materials for the first, second, and third source / drain electrode layers 203, 205, and 207 include metals, alloys, metal nitrides, conductive metal oxides, and transparent conductive materials. The first, second, and third source / drain electrode layers 203, 205, and 207 can be single-layer or multi-layer structures composed of metals, such as Mo (Molybdenum) / Al (Aluminum) / Mo or Ti (Titanium) / Al / Ti. The present embodiment does not limit the materials and compositions of the first source-drain electrode layer 203, the second source-drain electrode layer 205, and the third source-drain electrode layer 207. The materials of the first planar layer 204 and the second planar layer 206 include organic insulating materials, such as resin materials such as polyimide, epoxy resin, acrylic, polyester, photoresist, polyacrylate, polyamide, and siloxane, or elastic materials such as urethane or thermoplastic polyurethane. The present embodiment does not limit the materials of the first planar layer 204 and the second planar layer 206.

[0052] The encapsulation layer 210 is located on the side of the backplane wiring layer 202 away from the base substrate 201. The encapsulation layer 210 covers the organic light-emitting diodes in the display area 225 to seal the organic light-emitting diodes, thereby reducing or preventing the degradation of the organic light-emitting diodes caused by moisture and / or oxygen included in the environment. The encapsulation layer 210 can be a single-layer structure or a multi-layer structure, and the multi-layer structure includes a structure in which an inorganic layer and an organic layer are stacked. For example, the encapsulation layer 210 may include a first inorganic encapsulation layer, an organic encapsulation layer, and a second inorganic encapsulation layer arranged in sequence. The embodiment of the present application does not limit the material and composition structure of the encapsulation layer 210. The material of the encapsulation layer 210 may include insulating materials such as silicon oxynitride (SiON), silicon oxide (SiOx), silicon nitride (SiNx), and polymer resins. Inorganic materials such as silicon oxynitride, silicon oxide and silicon nitride can prevent the intrusion of water, oxygen, etc.; the material of the organic encapsulation layer can be a polymer material containing a desiccant or a polymer material that can block water vapor, etc. For example, the surface of the display substrate can be planarized using materials such as polymer resins, and the stress of the first and second inorganic encapsulation layers can be relieved. It can also include water-absorbing materials such as desiccants to absorb water, oxygen and other substances that invade the interior.

[0053] The touch electrode layer 211 is located on the side of the packaging layer 210 away from the base substrate 201. The touch electrode layer 211 is used to generate a touch signal. The touch signal includes relative position information of the touch, so that the display panel can determine the position of the touch operation based on the relative position information of the touch, and thus determine the user's touch intention based on the position of the touch operation, thereby realizing the touch operation and interactive function of the display panel. The embodiment of the present application does not limit the process of generating the touch signal. For example, the touch signal of the touch electrode layer 211 can be generated based on the touch structure. According to the working principle, the touch structure can be divided into resistive, capacitive or infrared types. The embodiment of the present application does not limit the structural form of the touch structure.

[0054] Exemplarily, the structure of the touch electrode layer 211 includes a first touch buffer layer 212, a first touch metal layer 215, a first touch insulating layer 216, and a second touch metal layer 217, stacked on the side of the encapsulation layer 210 away from the base substrate 201. The first touch buffer layer 212 is used to isolate the first touch metal layer 215 from the encapsulation layer 210, preventing the occurrence of material purity reduction caused by diffusion between the first touch metal layer 215 and the encapsulation layer 210. The material of the first touch buffer layer 212 includes, but is not limited to, inorganic materials such as silicon oxide, silicon nitride, and / or silicon oxynitride. This embodiment of the application does not limit the material of the first touch buffer layer 212. Furthermore, the first touch buffer layer 212 can be a single layer or multiple layers. This embodiment of the application uses a single-layer first touch buffer layer 212 as an example. The touch metal layer is a layer structure of the touch electrode layer 211, capable of sensing touch operations and generating touch signals based on the touch operations.

[0055] The first touch insulating layer 216 is disposed between the first touch metal layer 215 and the second touch metal layer 217. The first touch insulating layer 216 is used to insulate the first touch metal layer 215 and the second touch metal layer 217 from each other. Furthermore, the first touch insulating layer 216 can provide support for the second touch metal layer 217. Preferably, the material of the first touch insulating layer 216 is an organic material, which can be a resin material such as polyimide, epoxy resin, acrylic, polyester, photoresist, polyacrylate, polyamide, and silicone, or an elastic material such as urethane or thermoplastic polyurethane. The present embodiment does not limit the material of the first touch insulating layer 216.

[0056] In one possible embodiment, the touch electrode is located in the display area 225 and is configured to detect the occurrence of a touch in the display area 225. For example, the touch electrode includes a first touch electrode and a second touch electrode (not shown in the figure). A plurality of first touch electrodes constitute a first touch electrode line extending along a first direction, and a plurality of second touch electrodes constitute a second touch electrode line extending along a second direction. The plurality of first touch electrode lines and the plurality of second touch electrode lines intersect with each other, thereby forming a touch capacitor at the intersection of the first touch electrode line and the second touch electrode line. The touch position is detected by detecting the change in the touch capacitor caused by the approach of a finger during touch. The display panel includes a plurality of touch signal lines, each of which is configured to be electrically connected to a touch electrode in the display area 225. The touch signal lines include a first touch signal line and a second touch signal line, each first touch signal line being electrically connected to a first touch electrode line extending along the first direction, and each second touch signal line being electrically connected to a second touch electrode line extending along the second direction. In this way, the touch signal generated by each touch electrode can be transmitted to the non-display area 226 of the display panel through the touch signal line, and then transmitted to the flexible printed circuit board.

[0057] The touch lines are divided into different parts according to the different display panels. The embodiment of the present application is described by taking the touch lines including the first line portion 220 and the second line portion as an example. The touch lines are used to transmit touch signals so that the touch function of the display panel can be normally realized. Among them, the first line portion 220 spans the bending area 227, that is, the first line portion 220 is continuously arranged on the side of the bending area 227 close to the display area 225, the bending area 227, and the side of the bending area 227 away from the display area 225, thereby realizing the transmission of the touch signal in the bending area 227 of the display panel. The second line portion does not overlap with the bending area 227. The second line portion is located in the touch electrode layer 211 and the second line portion is electrically connected to the first line portion 220. That is, the second line portion transmits the touch signal of the touch electrode layer 211 to the first line portion 220 in the area outside the bending area 227.

[0058] The electrical connection between the first trace 220 and the second trace in an area outside the bending region 227 can reduce the thickness of the bending region 227 and prevent the electrical connection between the first trace 220 and the second trace from being disconnected due to the bending of the bending region 227. The present embodiment does not limit the material of the touch traces, and for example, the materials may include metals, metal alloys, metal nitrides, conductive metal oxides, and transparent conductive materials.

[0059] Exemplarily, the first routing portion 220 is located in the third source-drain electrode layer 207, which is disposed between the second planar layer 206 and the encapsulation layer 210. The third source-drain electrode layer 207 is encapsulated by the encapsulation layer 210. Disposing the first routing portion 220 in the third source-drain electrode layer 207 can reduce the corrosion effects of external moisture and other factors on the first routing portion 220. The third source-drain electrode layer 207 can be located in the first transition region 229, the bending region 227, and the second transition region 230 of the non-display area 226. The first transition region 229 is located on the side of the bending region 227 close to the display area 225, and the second transition region 230 is located on the side of the bending region 227 away from the display area 225. In an embodiment of the present application, the wiring layer is changed in the first transition zone 229 and the second transition zone 230, that is, the wiring is connected between different layers. For example, in the first transition zone 229, the touch signal from the touch electrode layer 211 can be transmitted to the first wiring portion 220 located in the third source-drain electrode layer 207 mentioned in the embodiment of the present application, and in the second transition zone 230, the touch signal can be transmitted to the subsequent module so that the signal can be transmitted to the FPC.

[0060] In the embodiment of the present application, the transmission of touch signals between the first transition region 229 and the second transition region 230 relies on the electrical connection of the touch traces, which is achieved through a first via located in the first transition region 229 and a second via 234 located in the second transition region 230. This embodiment of the present application uses the layer switching of the traces in the first transition region 229 as an example. The layer switching pattern of the traces in the second transition region 230 can refer to the layer switching pattern of the traces in the first transition region 229. Therefore, the vias mentioned below refer to the first vias in the first transition region 229. The first vias include the first sub-via 221, the inorganic via 222, and the organic via 223.

[0061] Illustratively, in the first transition region 229, the first routing portion 220 in the third source-drain electrode layer 207 can be electrically connected to the second routing portion (including the first sub-portion 218 and the second sub-portion 219). The display panel is bent in the bending region 227, and the third source-drain electrode layer 207 must ensure that it will not break in the bending region 227. The material of the third source-drain electrode layer 207 may include metals, alloys, metal nitrides, conductive metal oxides, and transparent conductive materials. For example, the third source-drain electrode layer 207 may be a single layer or multiple layers of metal, such as Mo / Al / Mo or Ti / Al / Ti. The embodiment of the present application does not limit the material of the third source-drain electrode layer 207.

[0062] Exemplarily, the second routing portion is located in the first touch metal layer 215 and / or the second touch metal layer 217. The second routing portion is electrically connected to the first routing portion 220 via second sub-vias (222, 223) extending through the first touch buffer layer 212. Preferably, the second routing portion includes a first sub-portion 218 located in the first touch metal layer 215 and a second sub-portion 219 located in the second touch metal layer 217. The first sub-portion 218 and the second sub-portion 219 are electrically connected via a first insulating via 224 in the first touch insulating layer 216, thereby reducing the transmission resistance of the touch routing.

[0063] The present embodiment does not limit the method of electrical connection. For example, the material of the second routing portion may be deposited at the second sub-via location, enabling electrical connection between the second routing portion and the first routing portion 220. Alternatively, a via adapter may be present at the second sub-via location, thereby establishing electrical connections between the second routing portion and the via adapter, and then between the via adapter and the first routing portion 220. The present embodiment does not limit the material of the via adapter; it only requires that the via adapter be capable of transmitting touch signals between the second routing portion and the first routing portion 220.

[0064] In one possible implementation, the display panel provided in the embodiment of the present application further includes a light-emitting layer 209, and a third flat layer 208 located between the light-emitting layer 209 and the third source-drain electrode layer 207; the via hole penetrates the third flat layer 208. The light-emitting layer 209 includes a small molecule organic material or a polymer molecule organic material, a fluorescent light-emitting material or a phosphorescent light-emitting material, and can emit red light, green light, blue light and white light. Furthermore, as needed, the light-emitting layer 209 may include a hole injection layer, a hole transport layer, an electron injection layer and an electron transport layer, etc. The embodiment of the present application does not limit the structure and material of the light-emitting layer 209. The third flat layer 208 is located on the side of the third source-drain electrode layer 207 away from the base substrate 201.

[0065] Exemplarily, the third flat layer 208, the first touch buffer layer 212, the first touch metal layer 215, the first touch insulating layer 216 and the second touch metal layer 217 may exist in the same display panel. In addition, the second routing portion is electrically connected to the first routing portion 220 through a via hole passing through the first touch buffer layer 212 and the first touch insulating layer 216. In addition, there is a first sub-via 221 located in the third flat layer 208. The second routing portion is also electrically connected to the first routing portion 220 through the first sub-via 221, that is, the first sub-portion 218 of the second routing portion is electrically connected to the second sub-portion 219 through the first insulating via 224 passing through the first touch insulating layer 216 of the touch electrode layer 211, wherein the first insulating via 224 is located on the side of the first via close to the display area 225, and the first sub-portion 218 is electrically connected to the first routing portion 220 through the via hole passing through the first touch buffer layer 212 and the first sub-via 221.

[0066] Exemplarily, the material of the third planar layer 208 may include an organic insulating material, such as resin materials such as polyimide, epoxy resin, acrylic, polyester, photoresist, polyacrylate, polyamide, and silicone. Another example of such an organic insulating material is an elastic material such as urethane and thermoplastic polyurethane. The material of the third planar layer 208 may be the same as or different from that of the first planar layer 204 and the second planar layer 206. A first sub-via 221 is provided in the third planar layer 208. The first sub-via 221 is used to provide a path for electrical connection between the second routing portion and the first routing portion 220 in the first transition region 229.

[0067] Exemplarily, the first touch buffer layer 212 and the third planar layer 208 include an organic insulating layer, and the vias include a first sub-via 221 located in the third planar layer 208 and a second sub-via located in the first touch buffer layer 212, wherein the first sub-via 221 is larger than the second sub-via. Furthermore, the vias include an insulating via 224 that penetrates the first touch insulating layer 216. The first touch buffer layer 212 and the third planar layer 208 may be multi-layered, including an organic insulating layer. The organic insulating layer may be made of, for example, resin materials such as polyimide, epoxy resin, acrylic, polyester, photoresist, polyacrylate, polyamide, and siloxane, or elastic materials such as urethane and thermoplastic polyurethane.

[0068] Exemplarily, the first touch buffer layer 212 includes an inorganic buffer layer 213 and an organic buffer layer 214 stacked on the side of the encapsulation layer 210 away from the base substrate 201. The second sub-vias in the first touch buffer layer 212 can be divided into inorganic vias 222 in the inorganic buffer layer 213 and organic vias 223 in the organic buffer layer 214, based on the inorganic buffer layer 213 and the organic buffer layer 214. The organic vias 223 are larger than the inorganic vias 222. The relative sizes of the vias are set based on the design function of the display panel, and the sizes of the vias mentioned in the embodiments of the present application are for illustrative purposes only.

[0069] For example, in the embodiment of the present application, the second routing portion located in the first touch metal layer 215 is referred to as the first sub-portion 218, and the second routing portion located in the second touch metal layer 217 is referred to as the second sub-portion 219. In the first transition region 229, the first sub-portion 218 and the second sub-portion 219 are electrically connected via the first insulating via 224 located in the first touch insulating layer 216, thereby achieving the aforementioned function of transmitting the same touch signal between the first touch metal layer 215 and the second touch metal layer 217. The first sub-portion 218 of the second routing portion is electrically connected to the first routing portion 220 located in the third source / drain electrode layer 207 via the second sub-via (including the inorganic via 222 and the organic via 223) extending through the first touch buffer layer 212, and the first sub-via 221 extending through the third planar layer 208.

[0070] For example, the first routing portion 220 located in the third source / drain electrode layer 207 switches layers in the second transition region 230. This embodiment of the present application does not limit the level of this layer change in the second transition region 230; it is sufficient that the touch signal from the first routing portion 220 is transmitted to the next film layer. In this embodiment of the present application, the first routing portion 220 switches layers with the third routing portion in the second transition region 230. The third routing portion includes a third sub-portion 231 located in the third touch metal layer 236 and a fourth sub-portion 232 located in the fourth touch metal layer 238. The first touch metal layer 215 and the third touch metal layer 236 are located on the same layer, and the second touch metal layer 217 and the fourth touch metal layer 238 are located on the same layer. After the routing switches layers in the second transition region 230, the touch signal is transmitted to subsequent modules, including an FPC, thereby achieving touch signal transmission. This embodiment of the present application does not limit the structures involved in the subsequent transmission process; it is sufficient that the touch signal is transmitted to an IC outside the display panel.

[0071] In one possible embodiment, in the second transition region 230, the first routing portion 220 is electrically connected to the third routing portion of the touch routing through a second via 234. The third routing portion is located in the touch electrode layer of the second transition region 230. The structure of the touch electrode layer of the second transition region 230 can be referenced to the structure of the touch electrode layer 211 of the display region 627 and will not be further described here. The third routing portion includes a third sub-portion 231 and a fourth sub-portion 232 connected in parallel. The third sub-portion 231 is located in the third touch metal layer 236 of the touch electrode layer, and the fourth sub-portion 232 is located in the fourth touch metal layer 238 of the touch electrode layer. In the second transition region 230, the third sub-section 231 is electrically connected to the fourth sub-section 232 through a second insulating via 233 that penetrates the second touch insulating layer 237 of the touch electrode layer. The second insulating via 233 is located on the side of the second via 234 away from the display area 225. The third sub-section 231 is electrically connected to the first routing section 220 through a second via 234 that penetrates the second touch buffer layer 235 and the third flat layer 208.

[0072] Refer to the structural schematic diagram of the touch wiring shown in Figure 3. The structural schematic diagram of the touch wiring shown in Figure 3 shows the 104 area in Figure 1. A cross-section is taken along the position shown in 301 in Figure 3, where 302 is the first transition zone on the side of the bending zone close to the display area, and 303 is the boundary line between the first transition zone and the bending zone, resulting in a structural schematic diagram of the cross-section of the first transition zone of the display panel as shown in Figure 4.

[0073] For example, the cross-sectional view shown in FIG4 corresponds to the region of the first transition region 229 shown in FIG2 . In FIG4 , 401 corresponds to the base substrate 201 in FIG2 ; 402 corresponds to the first planar layer 204 in FIG2 ; 403 corresponds to the second planar layer 206 in FIG2 ; 404 corresponds to the third source / drain electrode layer 207 in FIG2 ; 405 corresponds to the third planar layer 208 in FIG2 ; 406 corresponds to the inorganic buffer layer 213 in FIG2 ; 407 corresponds to the organic buffer layer 214 in FIG2 ; and 408 corresponds to the second routing portion (including the first sub-portion 218 and the second sub-portion 219) in FIG2 . The second routing portion 408 is electrically connected to the first routing portion located in the third source / drain electrode layer 404 at the position shown in FIG4 through the organic vias in the organic buffer layer 407 , the inorganic vias in the inorganic buffer layer 406 , and the first sub-via in the third planar layer 405 .

[0074] In summary, the embodiments of the present application provide a display panel that, by disposing the first routing portion of the touch routing in the third source-drain electrode layer, replaces the second source-drain electrode layer, thereby achieving a connection between the touch electrode layer in the display panel and the third source-drain electrode layer in the backplane routing layer via the touch routing. The third source-drain electrode layer is connected to the IC via the touch routing, thereby eliminating the need to punch holes in the film layer between the second source-drain electrode layer and the third source-drain electrode layer. This reduces the thickness of the film layer that needs to be punched, thereby avoiding the problem of the organic casing hole not being able to be opened due to the thick perforated film layer. In addition, reducing the thickness of the film layer that needs to be punched can increase the removal rate of residual glue at the punching position after processes such as exposure, thereby avoiding the problem of circuit connection failure caused by residual glue.

[0075] Based on the display panel provided in the above embodiment of the application, referring to FIG5 , the embodiment of the present application provides a method for manufacturing a display panel, which includes steps 501 to 503 .

[0076] Step 501: Provide a substrate.

[0077] A substrate is a substrate used in the manufacture of microelectronic products such as semiconductor devices and electronic components. Materials for substrates include, but are not limited to, single-crystal silicon, polycrystalline silicon, quartz glass, and alumina ceramics. The present embodiments do not specify the material of the substrate. During the production and manufacturing of display panels, the substrate is used to support and secure structures other than the substrate located on at least one side of the substrate.

[0078] Exemplarily, the substrate includes a display area and a non-display area, wherein the display area is the area of ​​the display panel used to display images, and the non-display area is the area of ​​the display panel other than the display area. The non-display area includes a bending area and a binding area located on the side of the bending area away from the display area. The bending area is located between the display area and the binding area and is used to transmit data signals from the display area to the binding area. The binding area includes multiple binding structures, which are used to conduct and connect to the pins in the FPC to facilitate the transmission of corresponding signals. The embodiments of the present application do not limit the connection method of the binding structures and pins.

[0079] Step 502: forming a backplane wiring layer on the base substrate, forming an encapsulation layer on the side of the backplane wiring layer away from the base substrate, and forming a touch electrode layer on the side of the encapsulation layer away from the base substrate. The touch electrode layer, including the touch electrodes, is at least located in the display area.

[0080] The backplane wiring layer includes a first source-drain electrode layer, a first planar layer, a second source-drain electrode layer, a second planar layer and a third source-drain electrode layer that are stacked.

[0081] For example, the embodiment of the present application does not limit the method of forming the source-drain electrode layer. A flat layer is deposited on the side of the formed first source-drain electrode layer away from the substrate as the first flat layer, a first flattening film covering the first flat layer is formed on the side of the first flat layer away from the substrate, and a photoresist is deposited on the first flattening film. The embodiment of the present application does not limit the type of photoresist. The photoresist is exposed using a mask. The mask can be a gray mask or a halftone mask. The mask includes a completely transparent area, a partially transparent area and an opaque area. The transmittance of the partially transparent area is less than the transmittance of the completely transparent area. Therefore, during the exposure process, the portion of the photoresist corresponding to the completely transparent area is completely exposed, the portion of the photoresist corresponding to the partially transparent area is partially exposed, and the portion of the photoresist corresponding to the opaque area is not exposed.

[0082] Exemplarily, the photoresist is developed to obtain a photoresist pattern, which includes completely removed areas corresponding to the opaque areas, partially retained areas corresponding to the partially transparent areas, and completely retained areas corresponding to the completely transparent areas. The first planarization film is etched using this photoresist pattern. For example, the portion of the first planarization film corresponding to the completely removed areas is completely etched away; next, the photoresist pattern is ashed to thin the photoresist in the completely retained areas and completely remove the photoresist in the partially retained areas; the portion of the first planarization film corresponding to the partially retained areas is etched away; and finally, the remaining photoresist is stripped. Ultimately, a first planarization layer is obtained. The subsequent methods for forming the second source / drain electrode layer, the second planarization layer, and the third source / drain electrode layer can refer to the relevant contents described in the above-mentioned solution and are not described in detail here.

[0083] Exemplarily, the encapsulation layer is located on the side of the backplane wiring layer away from the base substrate, and the encapsulation layer covers the organic light-emitting diodes in the display area to seal the organic light-emitting diodes, thereby reducing or preventing degradation of the organic light-emitting diodes caused by moisture and / or oxygen included in the environment.

[0084] Exemplarily, the touch electrode is located in the display area and is configured to detect the occurrence of a touch in the display area. The touch electrode layer is located on the side of the packaging layer away from the base substrate. The touch electrode layer is used to generate a touch signal. The touch signal includes relative position information of the touch, so that the display panel can determine the position of the touch operation based on the relative position information of the touch, and thus determine the user's touch intention based on the position of the touch operation, thereby realizing the touch operation and interactive function of the display panel. The touch buffer layer is used to isolate the first touch metal layer and the packaging layer to prevent the occurrence of a reduction in material purity caused by diffusion of substances between the first touch metal layer and the packaging layer.

[0085] Step 503: Set touch routing.

[0086] Setting up touch traces involves transmitting touch signals through traces in the original display panel. In this embodiment, the first trace portion of the touch trace is set on the third source / drain electrode layer, and the second trace portion of the touch trace is set on the touch electrode layer. This facilitates touch signal transmission within the display panel provided by the aforementioned embodiment. The specific transmission path is detailed in the relevant description of the display panel and is not further elaborated here.

[0087] 6 , the area shown in FIG6 is area 103 in FIG1 , ie, a schematic structural diagram of a cross section of a touch wiring area of ​​a display panel.

[0088] In order to enrich the implementation methods of touch lines from the display area 627 to the bending area 629 of the display panel, an embodiment of the present application provides another display panel, which includes a base substrate 601, a backplane wiring layer 602, an encapsulation layer 610, a touch electrode layer 611 and touch lines.

[0089] The structures and compositions of the substrate 601, backplane wiring layer 602, first source-drain electrode layer 603, first planar layer 604, second planar layer 606, third source-drain electrode layer 607, and encapsulation layer 610 can be referred to the relevant contents described in the above embodiments and will not be described in detail here. In addition, the structures and compositions of the substrate 601, backplane wiring layer 602, and encapsulation layer 610 mentioned in the embodiments of the present application are merely examples. In addition to the structures mentioned in the embodiments of the present application, structures that can meet the relevant functions of the embodiments of the present application should also be within the scope of protection of the embodiments of the present application.

[0090] For example, the touch traces mentioned in the embodiment of the present application are electrically connected to the touch electrodes. The touch traces are at least partially disposed in the non-display area 628 and extend through the bending area 629 to the binding area 630. The touch traces are divided into different parts depending on the display panel. The embodiment of the present application uses the example of a touch trace including an electrically connected first trace portion 620, a second trace portion, and a third trace portion 622 as an example.

[0091] Illustratively, the touch traces are used to transmit touch signals from the touch electrode layer 611 to enable the touch function of the display panel to function properly. The first trace portion 620 spans the bend region 629, meaning that the first trace portion 620 at least connects the side of the bend region 629 closest to the display region 627 with the side of the bend region 629 further away from the display region 627, thereby enabling the transmission of touch signals across the bend region 629 of the display panel. The second trace portion does not overlap with the bend region 629, meaning that the second trace portion is located outside the bend region 629. The orthographic projection of the third routing portion 622 on the substrate 601 at least partially overlaps with the orthographic projection of the first routing portion 620 on the substrate 601, that is, a portion of the third routing portion 622 is located in the same area as the first routing portion 620. Alternatively, the orthographic projection of a portion of the third routing portion 622 on the substrate 601 may be within the orthographic projection of the first routing portion 620 on the substrate 601; or the orthographic projection of the entire third routing portion 622 on the substrate 601 may be within the orthographic projection of the first routing portion 620 on the substrate 601; or the orthographic projection of the first routing portion 620 on the substrate 601 may be within the orthographic projection of the third routing portion 622 on the substrate 601. This embodiment of the present application does not limit this. This embodiment of the present application does not limit the material of the touch routing, and for example, it may include metals, metal alloys, metal nitrides, conductive metal oxides, and transparent conductive materials.

[0092] Exemplarily, the first wiring portion 620 is located in the second source-drain electrode layer 605, and the second source-drain electrode layer 605 is disposed between the first planar layer 604 and the second planar layer 606. The second source-drain electrode layer 605 may be located in the first transition region 631, the bending region 629, and the second transition region 632 of the non-display region 628. The first transition region 631 is located on the side of the bending region 629 close to the display region 627, and the second transition region 632 is located on the side of the bending region 629 away from the display region 627. In the embodiment of the present application, the wiring layer is changed in the first transition zone 631 and the second transition zone 632, that is, the wiring is connected between different layers. For example, in the first transition zone 631, the touch signal from the touch electrode layer 611 can be transmitted to the third wiring portion 622 located in the third source-drain electrode layer 607 mentioned in the embodiment of the present application, and then transmitted from the third wiring portion 622 located in the third source-drain electrode layer 607 to the first wiring portion 620 located in the second source-drain electrode layer 605. In the second transition zone 632, the touch signal can be transmitted to the subsequent module so that the signal can be transmitted to the FPC.

[0093] In the embodiment of the present application, the transmission of touch signals between the first transition zone 631 and the second transition zone 632 relies on the electrical connection of the touch traces, and the electrical connection of the touch traces is achieved through the first via hole located in the first transition zone 631 and the second via hole 638 located in the second transition zone 632. The embodiment of the present application takes the layer change of the traces in the first transition zone 631 as an example, and the layer change pattern of the traces in the second transition zone 632 can refer to the layer change pattern of the traces in the first transition zone 631. Therefore, the via mentioned below is the first via hole in the first transition zone 631. The staggered via hole 621 corresponds to the second subsection 634 of the first trace portion 620, and the third trace portion 622 is electrically connected to the second subsection 634 of the first trace portion 620 through the staggered via hole 621.

[0094] Exemplarily, the second routing portion is located in the first touch metal layer 615 and / or the second touch metal layer 617. The second routing portion is electrically connected to the third routing portion 622 via second sub-vias (624, 625) extending through the first touch buffer layer 612. Preferably, the second routing portion includes a third sub-portion 618 located in the first touch metal layer 615 and a fourth sub-portion 619 located in the second touch metal layer 617. The third sub-portion 618 and the fourth sub-portion 619 are electrically connected via a first insulating via 626 in the first touch insulating layer 616, thereby reducing the transmission resistance of the touch routing.

[0095] This embodiment of the application does not limit the method of electrical connection. For example, the material of the second routing portion may be deposited at the via hole location, enabling electrical connection between the second routing portion and the third routing portion 622. Alternatively, a via adapter device may be provided at the via hole location, thereby establishing electrical connections between the second routing portion and the via adapter device, and then between the via adapter device and the third routing portion 622. This embodiment of the application does not limit the material of the via adapter device; it only needs to be able to transmit touch signals between the second routing portion and the third routing portion 622.

[0096] Illustratively, in the first transition region 631, the third wiring portion 622 in the third source-drain electrode layer 607 can be electrically connected to the second wiring portion. The display panel is bent in the bending region 629, and the second source-drain electrode layer 605 must ensure that it does not break in this region. The material of the second source-drain electrode layer 605 may include metals, alloys, metal nitrides, conductive metal oxides, and transparent conductive materials. For example, the second source-drain electrode layer 605 may be a single layer or multiple layers of metal, such as Mo / Al / Mo or Ti / Al / Ti. The embodiment of the present application does not limit the material of the second source-drain electrode layer 605.

[0097] Exemplarily, the first routing portion 620 is divided into a first sub-portion 633 and a second sub-portion 634. The second planar layer 606 isolates the first sub-portion 633 from the third routing portion 622. The second sub-portion 634 is electrically connected to the third routing portion 622 via an offset via 621 extending through the second planar layer 606. The second planar layer 606 is located between the first routing portion 620 and the third routing portion 622. The material of the second planar layer 606 may include an organic insulating material, such as a resin material such as polyimide, epoxy resin, acrylic, polyester, photoresist, polyacrylate, polyamide, and silicone. Another example of the organic insulating material includes an elastic material such as urethane and thermoplastic polyurethane. The second planar layer 606 isolates the first sub-portion 633 of the first routing portion 620 from the third routing portion 622 within a predetermined region, preventing the transmission of touch signals in that region. A staggered via 621 is located in the area of ​​the second planar layer 606 corresponding to the second subsection 634 of the first routing portion 620. This provides an electrical connection between the second subsection 634 of the first routing portion 620 and the third routing portion 622. This facilitates the transmission of touch signals from the third routing portion 622 to the first routing portion 620 through the staggered via 621.

[0098] In one possible implementation, the display panel provided in this embodiment of the present application further includes a light-emitting layer 609 and a third planar layer 608 located between the light-emitting layer 609 and the third source-drain electrode layer 607. A first sub-via 623 extends through the third planar layer 608. The light-emitting layer 609 may be made of materials including small molecule organic materials, polymer molecule organic materials, fluorescent materials, or phosphorescent materials, and may emit red, green, blue, or white light. Furthermore, as needed, the light-emitting layer 609 may include a hole injection layer, a hole transport layer, an electron injection layer, and an electron transport layer. This embodiment of the present application does not limit the structure and materials of the light-emitting layer 609. The third planar layer 608 is located on the side of the third source-drain electrode layer 607 away from the base substrate 601. The material of the third planar layer 608 may be the same as or different from that of the first planar layer 604 and the second planar layer 606. A first sub-via 623 is located in the third planar layer 608. The first sub-via 623 is used to provide an electrical connection between the second trace portion and the third trace portion 622 in the first transition region 631.

[0099] Exemplarily, the third flat layer 608, the first touch buffer layer 612, the first touch metal layer 615, the first touch insulating layer 616 and the second touch metal layer 617 may exist in the same display panel. In addition, the second routing portion is electrically connected to the third routing portion 622 through a via hole passing through the first touch buffer layer 612 and the first touch insulating layer 616. In addition, there is a first sub-via 623 located in the third flat layer 608. The second routing portion is also electrically connected to the third routing portion 622 through the first sub-via 623, that is, the third sub-portion 618 of the second routing portion is electrically connected to the fourth sub-portion 619 through the first insulating via 626 passing through the first touch insulating layer 616 of the touch electrode layer 611, wherein the first insulating via 626 is located on the side of the first via close to the display area 627, and the third sub-portion 618 is electrically connected to the third routing portion 622 through the via hole passing through the first touch buffer layer 612 and the first sub-via 623.

[0100] Exemplarily, the first touch buffer layer 612 and the third planar layer 608 include an organic insulating layer, and the via includes a first sub-via 623 located in the third planar layer 608 and a second sub-via located in the first touch buffer layer 612, wherein the first sub-via 623 is larger than the second sub-via. The first touch buffer layer 612 and the third planar layer 608 may be multi-layered, including an organic insulating layer. The organic insulating layer may be made of, for example, a resin material such as polyimide, epoxy resin, acrylic, polyester, photoresist, polyacrylate, polyamide, or silicone, or an elastic material such as urethane or thermoplastic polyurethane.

[0101] Illustratively, the first touch buffer layer 612 includes an inorganic buffer layer 613 and an organic buffer layer 614 stacked on the side of the encapsulation layer 610 away from the base substrate 601. The second sub-vias in the first touch buffer layer 612 can be divided into inorganic vias 624 in the inorganic buffer layer 613 and organic vias 625 in the organic buffer layer 614, based on the inorganic buffer layer 613 and the organic buffer layer 614. The organic vias 625 are larger than the inorganic vias 624. The relative sizes of the vias are set based on the design function of the display panel, and the sizes of the vias mentioned in the embodiments of the present application are for illustrative purposes only.

[0102] For example, in the embodiment of the present application, the second trace portion includes a third sub-portion 618 located in the first touch metal layer 615 and a fourth sub-portion 619 located in the second touch metal layer 617. In the first transition region 631, the third sub-portion 618 and the fourth sub-portion 619 are electrically connected through the first insulating via 626 of the first touch insulating layer 616, thereby achieving the functions described in the above embodiment, such as enabling the first touch metal layer 615 and the second touch metal layer 617 to transmit the same touch signal. The third sub-portion 618 of the second routing portion is electrically connected to the third routing portion 622 located in the third source-drain electrode layer 607 through the second sub-via (including the inorganic via 624 and the organic via 625) passing through the first touch insulation layer 616, and the first sub-via 623 passing through the third flat layer 608. The third routing portion 622 located in the third source-drain electrode layer 607 is electrically connected to the second sub-portion 634 of the first routing portion 620 located in the second source-drain electrode layer 605 through the staggered via 621 passing through the second flat layer 606.

[0103] For example, the first routing portion 620 located in the second source / drain electrode layer 605 switches layers in the second transition region 632. This embodiment of the present application does not limit the level of layer switching in the second transition region 632; it is sufficient that the touch signal from the first routing portion 620 is transmitted to the next film layer. For example, in the second transition region 632, the first routing portion 620 switches layers with the fourth routing portion. The fourth routing portion includes a fifth sub-portion 635 located in the third touch metal layer 640 and a sixth sub-portion 636 located in the fourth touch metal layer 642. The first touch metal layer 615 and the third touch metal layer 640 are located on the same layer, and the second touch metal layer 617 and the fourth touch metal layer 642 are located on the same layer. After switching layers in the second transition region 632, the touch signal is transmitted to subsequent modules, including an FPC, thereby achieving touch signal transmission. This embodiment of the present application does not limit the structures involved in the subsequent transmission process; it is sufficient that the touch signal is transmitted to an IC outside the display panel.

[0104] In one possible implementation, in the second transition region 632, the first routing portion 620 is electrically connected to the fourth routing portion of the touch routing through a second via 638. The fourth routing portion is located in the touch electrode layer of the second transition region 632. The structure of the touch electrode layer of the second transition region 632 can be referenced to the structure of the touch electrode layer 611 of the display region 627 and will not be further described here. The fourth routing portion includes a fifth sub-portion 635 and a sixth sub-portion 636 connected in parallel. The fifth sub-portion 635 is located in the third touch metal layer 640 of the touch electrode layer, and the sixth sub-portion 636 is located in the fourth touch metal layer 642 of the touch electrode layer. In the second transition region 632, the fifth sub-section 635 is electrically connected to the sixth sub-section 636 through a second insulating via 637 that penetrates the second touch insulating layer 641 of the touch electrode layer. The second insulating via 637 is located on the side of the second via 638 away from the display area 627. The fifth sub-section 635 is electrically connected to the first routing section 620 through a second via 638 that penetrates the second touch buffer layer 639, the third flat layer 608 and the second flat layer 606.

[0105] Refer to the structural schematic diagram of the touch wiring shown in Figure 3. The structural schematic diagram of the touch wiring shown in Figure 3 shows the 104 area in Figure 1. A cross-section is taken along the position shown in 301 in Figure 3, where 302 is the first transition zone of the bending area close to the display area side. A structural schematic diagram of the cross-section of the first transition zone of the display panel can also be obtained as shown in Figure 7.

[0106] The exemplary cross-sectional view shown in FIG7 corresponds to the region of the first transition region 631 shown in FIG6 . In FIG7 , 701 corresponds to the substrate 601 in FIG6 ; 702 corresponds to the first planar layer 604 in FIG6 ; 703 corresponds to the second source-drain electrode layer 605 in FIG6 ; 704 corresponds to the second planar layer 606 in FIG6 ; 705 corresponds to the third planar layer 608 in FIG6 ; 706 corresponds to the inorganic buffer layer 613 in FIG6 ; 707 corresponds to the organic buffer layer 614 in FIG6 ; 708 corresponds to the second routing portion (including the third sub-portion 618 and the fourth sub-portion 619 ) in FIG6 ; 709 corresponds to the third source-drain electrode layer 607 in FIG6 ; 710 corresponds to the region corresponding to the first routing portion 620 in FIG6 where the first sub-portion 633 of the first routing portion 620 is located; and 711 corresponds to the region corresponding to the first routing portion 620 in FIG6 where the second sub-portion 634 of the first routing portion 620 is located. Among them, the second routing portion 708 is electrically connected to the third routing portion located in the third source-drain electrode layer 709 in the first area 710 through the organic vias of the organic buffer layer 707, the inorganic vias of the inorganic buffer layer 706 and the first sub-via of the third flat layer 705, and the third routing portion located in the third source-drain electrode layer 709 is electrically connected to the first routing portion located in the second source-drain electrode layer 703 through the staggered vias located in the second flat layer 704 in the second area 711.

[0107] In summary, the embodiments of the present application provide a display panel that achieves touch signal transmission from the second routing portion to the third routing portion and then to the first routing portion by disposing the first routing portion in the second source-drain electrode layer, the second routing portion in the touch electrode layer, and the third routing portion in the third source-drain electrode layer. Furthermore, the first routing portion includes a first sub-portion and a second sub-portion, wherein a second planar layer isolates the first sub-portion from the third routing portion, and the second sub-portion is electrically connected to the third routing portion via a staggered via extending through the second planar layer. This allows for the transmission of touch signals from the second routing portion to the third routing portion and then to the first routing portion, thereby transmitting the touch signals to the IC.

[0108] Based on the display panel provided in the above embodiment of the application, referring to FIG8 , the embodiment of the present application provides a method for manufacturing a display panel, which includes steps 801 to 803 .

[0109] The formation methods of step 801 and step 802 can be found in the relevant descriptions of step 501 and step 502 in the corresponding method of FIG5 , and will not be elaborated here.

[0110] Step 803: Set touch routing.

[0111] Setting up touch routing means transmitting touch signals through the routing in the original display panel. In the embodiment of the present application, the first routing portion of the touch routing is set in the second source-drain electrode layer, the second routing portion of the touch routing is set in the touch electrode layer, and the third routing portion of the touch routing is set in the third source-drain electrode layer. In addition, the first routing portion includes a first sub-portion and a second sub-portion. The second flat layer isolates the first sub-portion from the third routing portion. The second sub-portion is electrically connected to the third routing portion via a staggered via penetrating the second flat layer. In order to achieve the transmission of touch signals in the display panel provided by the above embodiment, the specific transmission path is detailed in the relevant description of the display panel in the above embodiment and is not repeated here.

[0112] 9 , an embodiment of the present application provides a display device, wherein the display device 903 includes any display panel 901 mentioned in the above embodiments. In addition, the display device 903 may further include an IC 902 to respond to touch signals of the display panel 901 in the display device 903 .

[0113] It should be understood that the term "plurality" used herein refers to two or more. "And / or" describes a relationship between associated objects, indicating that three possible relationships exist. For example, "A and / or B" can mean: A exists alone, A and B exist simultaneously, or B exists alone. The character " / " generally indicates an "or" relationship between the associated objects.

[0114] The above description is merely an exemplary embodiment of the present application and is not intended to limit the present application. Any modifications, equivalent replacements, improvements, etc. made within the principles of the present application shall be included in the scope of protection of the present application.

Claims

1. A display panel, characterized in that: The display panel comprises: A base substrate, comprising a display area and a non-display area around the display area, wherein the non-display area comprises a bending area and a binding area on a side of the bending area away from the display area; A backplane wiring layer is arranged on the base substrate, and includes a first source-drain electrode layer, a first flat layer, a second source-drain electrode layer, a second flat layer and a third source-drain electrode layer which are stacked; A packaging layer, arranged on the backplane wiring layer; A touch electrode layer, disposed on the encapsulation layer, comprising touch electrodes, and located at least in the display area; A touch routing line is electrically connected to the touch electrode, the touch routing line is arranged in the non-display area, and extends to the binding area through the bending area; the touch routing line includes a first routing portion and a second routing portion that are electrically connected, the first routing portion spans the bending area, and the second routing portion does not overlap with the bending area; the first routing portion is located in the third source and drain electrode layer, and the second routing portion is located in the touch electrode layer.

2. The display panel according to claim 1, characterized in that: The touch electrode layer includes a first touch buffer layer, a first touch metal layer, a first touch insulating layer and a second touch metal layer which are sequentially stacked on the side of the packaging layer away from the base substrate; the second routing portion is located in the first touch metal layer and / or the second touch metal layer, and the second routing portion is electrically connected to the first routing portion through a via hole penetrating the first touch buffer layer and the first touch insulating layer.

3. The display panel according to claim 1, characterized in that: The display panel further includes: a light-emitting layer, and a third flat layer located between the light-emitting layer and the third source-drain electrode layer; a first sub-via hole exists in the third flat layer, and the second wiring portion is electrically connected to the first wiring portion through the first sub-via hole.

4. The display panel according to claim 1, characterized in that: The non-display area includes a first transition area and a second transition area adjacent to the bending area, the first transition area is located on the side of the bending area close to the display area, and the second transition area is located on the side of the bending area away from the display area; there is a first via hole in the first transition area, and there is a second via hole in the second transition area, the touch electrode layer is also located in the second transition area, the second wiring portion is electrically connected to the first wiring portion through the first via hole, the first wiring portion is electrically connected to the third wiring portion of the touch wiring through the second via hole, and the third wiring portion is located in the touch electrode layer in the second transition area.

5. The display panel according to claim 3, characterized in that: The first touch buffer layer of the touch electrode layer and the third flat layer include an organic insulating layer, the non-display area includes a first transition area adjacent to the bending area, the first transition area is located on the side of the bending area close to the display area, a first via hole exists in the first transition area, the first via hole includes the first sub-via hole located in the third flat layer and the second sub-via hole located in the first touch buffer layer, the second routing portion is electrically connected to the first routing portion through the first sub-via hole and the second sub-via hole, and the first sub-via hole is larger than the second sub-via hole.

6. The display panel according to claim 5, characterized in that: The first touch buffer layer includes an inorganic buffer layer and an organic buffer layer stacked in sequence, the second sub-via includes an inorganic via located in the inorganic buffer layer and an organic via located in the organic buffer layer, the second routing portion is electrically connected to the first routing portion through the inorganic via, the organic via and the first sub-via, and the organic via is larger than the inorganic via.

7. The display panel according to claim 4, characterized in that: The second routing portion includes a first sub-portion and a second sub-portion connected in parallel, the first sub-portion is located at the first touch metal layer of the touch electrode layer, and the second sub-portion is located at the second touch metal layer of the touch electrode layer; in the first transition zone, the first sub-portion is electrically connected to the second sub-portion through a first insulating via hole that penetrates the first touch insulating layer of the touch electrode layer, and the first insulating via hole is located on a side of the first via hole close to the display area; the first sub-portion is electrically connected to the first routing portion through the first via hole.

8. A method for manufacturing a display panel, characterized in that: The method comprises: Providing a base substrate, the base substrate comprising: a display area and a non-display area around the display area, the non-display area comprising a bending area and a binding area on a side of the bending area away from the display area; Forming a backplane wiring layer on the base substrate, the backplane wiring layer comprising a first source-drain electrode layer, a first flat layer, a second source-drain electrode layer, a second flat layer and a third source-drain electrode layer which are stacked; Forming a packaging layer on a side of the backplane wiring layer away from the substrate substrate; forming a touch electrode layer on a side of the packaging layer away from the base substrate, wherein the touch electrode layer includes touch electrodes and is at least located in the display area; A touch routing is provided, wherein the touch routing is electrically connected to the touch electrode, the touch routing is provided in the non-display area, and extends to the binding area through the bending area; the touch routing includes a first routing portion and a second routing portion which are electrically connected, the first routing portion spans the bending area, and the second routing portion does not overlap with the bending area; the first routing portion is located in the third source-drain electrode layer, and the second routing portion is located in the touch electrode layer.

9. A display panel, characterized in that: The display panel comprises: A base substrate, comprising a display area and a non-display area around the display area, wherein the non-display area comprises a bending area and a binding area on a side of the bending area away from the display area; A backplane wiring layer is arranged on the base substrate, and includes a first source-drain electrode layer, a first flat layer, a second source-drain electrode layer, a second flat layer and a third source-drain electrode layer which are stacked; A packaging layer, arranged on the backplane wiring layer; A touch electrode layer, disposed on the encapsulation layer, comprising touch electrodes, and located at least in the display area; A touch routing line is electrically connected to the touch electrode, the touch routing line is arranged in the non-display area, and extends to the binding area through the bending area; the touch routing line includes an electrically connected first routing portion, a second routing portion, and a third routing portion, the first routing portion spans the bending area, the second routing portion does not overlap with the bending area, and the orthographic projection of the third routing portion on the substrate at least partially overlaps with the orthographic projection of the first routing portion on the substrate; the first routing portion is located in the second source-drain electrode layer, the second routing portion is located in the touch electrode layer, and the third routing portion is located in the third source-drain electrode layer, the first routing portion includes a first sub-portion and a second sub-portion, the second flat layer isolates the first sub-portion from the third routing portion, and the second sub-portion is electrically connected to the third routing portion through a staggered via hole penetrating the second flat layer.

10. The display panel according to claim 9, characterized in that: The touch electrode layer includes a first touch buffer layer, a first touch metal layer, a first touch insulating layer and a second touch metal layer which are sequentially stacked on a side of the packaging layer away from the base substrate; the second routing portion is located in the first touch metal layer and / or the second touch metal layer, and the second routing portion is electrically connected to the third routing portion through a via hole penetrating the first touch buffer layer and the first touch insulating layer.

11. The display panel according to claim 9, characterized in that: The display panel further includes: a light-emitting layer, and a third flat layer located between the light-emitting layer and the third source-drain electrode layer; a first sub-via hole exists in the third flat layer, and the second wiring portion is electrically connected to the third wiring portion through the first sub-via hole.

12. The display panel according to claim 9, characterized in that: The non-display area includes a first transition area and a second transition area adjacent to the bending area, the first transition area is located on the side of the bending area close to the display area, and the second transition area is located on the side of the bending area away from the display area; there is a first via hole in the first transition area, and there is a second via hole in the second transition area, the touch electrode layer is also located in the second transition area, the second wiring portion is electrically connected to the third wiring portion through the first via hole, the first wiring portion is electrically connected to the fourth wiring portion of the touch wiring through the second via hole, and the fourth wiring portion is located in the touch electrode layer in the second transition area.

13. The display panel according to claim 11, characterized in that: The first touch buffer layer of the touch electrode layer and the third flat layer include an organic insulating layer, the non-display area includes a first transition area adjacent to the bending area, the first transition area is located on the side of the bending area close to the display area, a first via hole exists in the first transition area, the first via hole includes the first sub-via hole located in the third flat layer and the second sub-via hole located in the first touch buffer layer, the second routing portion is electrically connected to the third routing portion through the first sub-via hole and the second sub-via hole, and the first sub-via hole is larger than the second sub-via hole.

14. The display panel according to claim 13, characterized in that: The first touch buffer layer includes an inorganic buffer layer and an organic buffer layer stacked in sequence, the second sub-via includes an inorganic via located in the inorganic buffer layer and an organic via located in the organic buffer layer, the second routing portion is electrically connected to the third routing portion through the inorganic via, the organic via and the first sub-via, and the organic via is larger than the inorganic via.

15. The display panel according to claim 12, characterized in that: The second routing portion includes a third sub-portion and a fourth sub-portion connected in parallel, the third sub-portion is located at the first touch metal layer of the touch electrode layer, and the fourth sub-portion is located at the second touch metal layer of the touch electrode layer; in the first transition zone, the third sub-portion is electrically connected to the fourth sub-portion through a first insulating via that penetrates the first touch insulating layer of the touch electrode layer, and the first insulating via is located on a side of the first via close to the display area; the third sub-portion is electrically connected to the third routing portion through the first via.

16. A method for manufacturing a display panel, characterized in that: The method comprises: Providing a base substrate, the base substrate comprising: a display area and a non-display area around the display area, the non-display area comprising a bending area and a binding area on a side of the bending area away from the display area; Forming a backplane wiring layer on the base substrate, the backplane wiring layer comprising a first source-drain electrode layer, a first flat layer, a second source-drain electrode layer, a second flat layer and a third source-drain electrode layer which are stacked; Forming a packaging layer on a side of the backplane wiring layer away from the substrate substrate; forming a touch electrode layer on a side of the packaging layer away from the base substrate, wherein the touch electrode layer includes touch electrodes and is at least located in the display area; A touch line is provided, the touch line is electrically connected to the touch electrode, the touch line is provided in the non-display area, and extends to the binding area through the bending area; the touch line includes an electrical The first routing portion, the second routing portion and the third routing portion are connected, the first routing portion spans the bending area, the second routing portion does not overlap with the bending area, and the orthographic projection of the third routing portion on the substrate at least partially overlaps with the orthographic projection of the first routing portion on the substrate; the first routing portion is located in the second source-drain electrode layer, the second routing portion is located in the touch electrode layer, and the third routing portion is located in the third source-drain electrode layer, the first routing portion includes a first sub-portion and a second sub-portion, the second flat layer isolates the first sub-portion from the third routing portion, and the second sub-portion is electrically connected to the third routing portion through a staggered via hole penetrating the second flat layer.

17. A display device, characterized in that: The display device comprises the display panel described in any one of claims 1-7, or the display panel described in any one of claims 9-15.

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