High-resolution laser engraving machine and using method and application thereof

Abstract

The invention discloses a high-resolution laser engraving machine and a using method and application thereof, and relates to the field of laser engraving, the high-resolution laser engraving machine is characterized by comprising a machine body, an equipment main control processing center, a laser source, a multi-axis numerical control platform, a machined part clamp and a real-time monitoring mechanism, and the equipment main control processing center is used for receiving and transmitting equipment data; the laser source is configured with lt; the light spot diameter is 5 microns; the focusing depth is greater than or equal to 15mm; the multi-axis numerical control platform has an X-Y-Z three-axis linkage function, the positioning precision is smaller than or equal to + / -1 micron, and the multi-axis numerical control platform is used for driving the laser source to move. The real-time monitoring mechanism integrates a visual positioning module, a material state monitoring module and an environment monitoring module, and the real-time monitoring mechanism controls the multi-axis numerical control platform to adjust the dotting position of the laser source according to the visual positioning module, the machining material state and the machining environment. According to the invention, the spot diameter lt is configured; the precision gt of a traditional laser engraving machine is broken through through a laser source of 5 micrometers and a multi-axis numerical control platform with the positioning precision smaller than or equal to + / -1 micrometer. And due to the limitation of 10 microns, the micron-grade processing capacity is realized.

Description

Technical Field

[0001] The present invention relates to the field of laser engraving, and more particularly to a high-resolution laser engraving machine and a use method and application thereof. Background Art

[0002] Laser engraving machine is a kind of equipment that uses laser beam to accurately process the material to be engraved. It can realize multiple functions such as engraving, cutting, marking, etc. The laser engraving machine generates high-energy laser beams through lasers. These laser beams are irradiated on the surface of the material with specific intensity and position under the control of the numerical control system. The high energy density of the laser beam can cause chemical or physical changes on the surface of the material in a very short time, such as melting, vaporization or burning, thereby removing or changing the material and forming the required pattern or text.

[0003] Laser engraving machines are widely used in various industries, including but not limited to: Advertising production industry: used for cutting and engraving of various signs, display boards, light boxes, and advertising characters.

[0004] Crafts and gifts industry: used for engraving patterns and texts on handicrafts, bamboo and wooden slips, packaging boxes, porcelain, trophies and other items.

[0005] Home decoration industry: used for carving and decoration of wooden floors, furniture, lighting, etc. to enhance the artistic sense of the home.

[0006] Electronics industry: used for marking and labeling of electrical housings, keyboards, electronic components, circuit boards, etc.

[0007] Leather garment processing industry: used for engraving text and graphics on genuine leather, synthetic leather, cloth and other materials, as well as cutting, carving and hollowing.

[0008] Stone industry: used for fine carving of marble, quartz, granite and other stones.

[0009] Packaging industry: used for engraving and printing rubber plates, plastic plates and other materials, as well as plate making and cutting of cartons and paper.

[0010] Model industry: used for cutting and engraving architectural models, aircraft models, etc.

[0011] A 3D texture fiber laser engraving machine disclosed in a Chinese patent with publication number CN102501695A includes a supporting and rotating mechanism for supporting a pressure roller to be engraved and rotating the pressure roller to be engraved along its axial center line, a laser engraving device and a 3D texture engraving control system, characterized in that: it also includes a servo linear motor, the laser engraving device includes a laser source, an optical path transmission system and a laser focusing lens, the input end of the optical fiber generator is connected to the 3D texture engraving control system, and the output end is connected to the input end of the laser focusing lens through the optical path transmission system, the servo linear motor includes a linear guide rail, a load platform disposed on the linear guide rail and capable of sliding along the length direction of the linear guide rail, the linear guide rail is disposed on one side of the pressure roller to be engraved on the supporting and rotating mechanism, a crossbeam is vertically mounted on the load platform, a guide rail is disposed on the crossbeam, the laser focusing lens of the laser engraving device is slidably disposed on the guide rail of the crossbeam through a feeding stepping motor, and the feeding stepping motor and the servo linear motor are electrically connected to the 3D texture engraving control system respectively.

[0012] Traditional laser engraving machines have the disadvantages of limited processing accuracy (>10μm), slow processing efficiency and inability to produce three-dimensional relief.

[0013] Therefore, a new solution needs to be proposed to solve this problem. Summary of the invention

[0014] In view of the deficiencies in the prior art, the present invention aims to provide a high-resolution laser engraving machine and a method for using and application thereof.

[0015] The above technical objectives of the present invention are achieved through the following technical solutions: A high-resolution laser engraving machine, including a machine body, a main control processing center of the equipment, a laser source, a multi-axis CNC platform, a workpiece fixture and a real-time monitoring mechanism, wherein The device master control processing center is used for sending and receiving device data; The laser source is configured with a spot diameter of <5 μm and a focus depth of ≥15 mm; The multi-axis CNC platform has an XYZ three-axis linkage function, a positioning accuracy of ≤±1μm, and is used to drive the laser source to move; The real-time monitoring mechanism integrates visual positioning, material status monitoring, and environmental monitoring modules. The real-time monitoring mechanism controls the multi-axis CNC platform to adjust the laser source dot position according to the visual positioning, the processing material status, and the processing environment.

[0016] The present invention is further configured as follows: a plurality of laser sources are provided, and the plurality of laser sources realize segmented operation of multiple workstations.

[0017] The present invention is further configured as follows: the laser source uses optical fiber laser to generate a high-frequency light source through an acousto-optic modulator, and then forms a micron-level controllable light spot after focusing.

[0018] The present invention is further configured such that: the laser source controls multi-channel laser dot marking through array laser.

[0019] The present invention is further configured as follows: the machine body is also provided with an expansion unit processing center controlled by a device main control processing center; the machine body is provided with a start condition detection unit; the start condition detection unit includes dust removal detection feedback, air pressure detection feedback, temperature and humidity detection feedback, and protection sensor detection feedback; the dust removal detection feedback, air pressure detection feedback, temperature and humidity detection feedback, and protection sensor detection feedback are used to determine whether the laser engraving machine can be started.

[0020] The present invention is further configured as follows: the visual positioning includes a high frame rate CCD vision system and a laser interferometer, the high frame rate CCD vision system includes a CCD camera as an input end, the high frame rate CCD vision system is used to realize online comparison of the engraving contour, and the laser interferometer measures the change in the distance between the laser head and the workpiece in real time to compensate for the Z-axis drift caused by thermal expansion.

[0021] The present invention is further configured as follows: the material state monitoring includes an infrared thermal imager for monitoring the distribution of the temperature field on the workpiece surface and predicting the thermal deformation of the material.

[0022] The present invention is further configured as follows: the machine body is also provided with a chip suction mechanism controlled by the main control processing center of the equipment, the chip suction mechanism includes a negative pressure forming device, a suction pipe, a chip suction cover, a blowing device and a blowing pipe, wherein the chip suction cover is fixedly connected to the laser output end of the laser source, the chip suction cover is provided with a bayonet for approaching the surface of the workpiece, the laser source performs dotting on the part of the workpiece located in the bayonet, the infrared thermal imager, the CCD camera and the laser interferometer are all located in the chip suction cover and integrated at the laser output end of the laser source The blowing pipe is located below the infrared thermal imager, the CCD camera and the laser interferometer and is connected to the bottom of the chip suction cover. The inside of the chip suction cover is blown by the blowing device. The suction pipe is provided with two and is respectively located on both sides of the suction pipe and connected to the chip suction cover. The inside of the chip suction cover is sucked by the negative pressure forming device. The environmental monitoring module includes a vibration sensor and an air pressure sensor. The vibration sensor is used to detect mechanical resonance and external interference vibration. The air pressure sensor detects air pressure to control the negative pressure stability of the chip suction mechanism.

[0023] A method for using a high-resolution laser engraving machine, applicable to any one of claims 1 to 8, characterized in that it comprises the following steps: S1 fixes the workpiece by a workpiece fixture; The main control processing center of the S2 equipment restores the pattern to the workpiece with high precision through photoelectric conversion; S3 controls the movement of the laser source through a multi-axis CNC platform, and uses the laser source to laser engrave the workpiece. During the engraving process, the laser source dot position is adjusted through a real-time monitoring mechanism; If S4 needs to process three-dimensional patterns, it can achieve three-dimensional relief engraving by repeatedly laser engraving through the laser source.

[0024] An application of a high-resolution laser engraving machine, applicable to any one of claims 1-8, characterized in that it is applied to processing metals, ceramics, chips, rubber, wood, stone, and printing rubber rollers, wherein the processed printing rubber rollers can be used for anti-counterfeiting pattern imprinting and chip nano-imprinting.

[0025] In summary, the present invention has the following beneficial effects: by configuring a laser source with a spot diameter of <5μm and a multi-axis CNC platform with a positioning accuracy of ≤±1μm, the limitation of the traditional laser engraving machine with an accuracy of >10μm is broken through, and micron-level processing capability is achieved. The integrated visual positioning, material state monitoring and environmental monitoring modules can compensate for thermal expansion errors (such as Z-axis drift) and material deformation in real time, and improve the processing stability in complex environments. The focusing depth of ≥15mm expands the processing thickness range and is suitable for multi-layer materials or three-dimensional relief engraving. Multiple laser sources work in segments to achieve parallel processing, improve efficiency, avoid long-term high-load operation of a single laser source, and extend equipment life. According to the needs of three-dimensional relief, different laser sources can be divided into detail and rough processing. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 It is a structural schematic diagram of the present invention; Figure 2 It is a schematic diagram of the local structure of the present invention Figure 1 ; Figure 3 It is a schematic diagram of the local structure of the present invention Figure 2 ; Figure 4 It is a schematic diagram of the structure of the chip suction cover shell in the present invention.

[0027] In the figure: 1. Machine body; 2. Equipment main control processing center; 3. Laser source; 4. Multi-axis CNC platform; 5. Workpiece fixture; 6. CCD camera; 7. Laser interferometer; 8. Infrared thermal imager; 9. Negative pressure forming device; 10. Suction pipe; 11. Chip suction cover; 12. Blowing device; 13. Blowing pipe; 14. Bayonet; 15. Precision linear guide. DETAILED DESCRIPTION

[0028] The present invention is described in detail below in conjunction with the accompanying drawings and embodiments. Example

[0029] A high-resolution laser engraving machine, such as Figure 1 , Figure 2 and Figure 3 As shown, it includes a machine body 1, a main control processing center 2, a laser source 3, a multi-axis CNC platform 4, a workpiece fixture 5 and a real-time monitoring mechanism, wherein The body 1 adopts a high-strength box-type sheet metal structure, using thickened steel plates and aviation aluminum profile rails, which can ensure stability and rigidity; The equipment main control processing center 2 is used for the sending and receiving of equipment data. The equipment main control processing center 2 adopts a high-performance embedded industrial controller (such as a microcontroller based on the ARMCortex-M4 core) or a 32-bit DSP chip, supports multi-axis linkage (such as five-axis synchronous control) and nanometer-level interpolation accuracy, and integrates PID control, adaptive algorithm and path optimization functions to achieve dynamic adjustment of engraving speed and laser power, and supports complex curve interpolation (such as arc and discrete point fitting). The equipment main control processing center 2 is equipped with USB, Ethernet, RS-485 and other interfaces, supports direct reading of U disks, import of graphic files (AI / DXF / PLT format) and multi-device online control, built-in dual optical magnetic limit sensors, emergency stop switches, overheat protection and leakage protection mechanisms, and monitors the equipment status in real time through sensors; The laser source 3 is configured with a spot diameter of <5μm and a focus depth of ≥15mm. Specifically, the laser source 3 uses a fiber laser to generate a high-frequency light source through an acousto-optic modulator, and then forms a micron-level controllable light spot after focusing. The acousto-optic modulator generates a high-frequency light source, which can achieve precise control of the laser pulse width and frequency, and is suitable for complex patterns, such as chip nanocircuits. High-frequency short pulses can reduce the heat-affected area. The laser source 3 is equipped with an optical system. The laser source 3 includes a focusing lens (with adjustable focal length), a galvanometer scanning system and a red light preview function, which supports switching of the spot size from micron level to millimeter level. The laser source 3 uses air cooling and water cooling for dual heat dissipation. The output power of the fiber laser is stable, reducing the impact of thermal fluctuations on the processing quality. The multi-axis CNC platform 4 has an XYZ three-axis linkage function. Having an XYZ three-axis linkage function is a common technology used by technical personnel in this field. Therefore, in order to mark the specific structure in the attached drawings of this embodiment, a high-subdivision three-phase stepper motor (such as a 57 stepper motor) or a servo motor is selected, and a vector control driver is used. The positioning accuracy is ≤±1μm, and it is used to drive the laser source 3 to move. Among them, the X / Y axis is driven by a synchronous belt or a ball screw, and the precision linear guide 15 set in the body 1 is cooperated to achieve high-speed movement. The body 1 is equipped with a precision linear guide 15 (such as a J5-level guide imported from South Korea), with a straightness tolerance of ≤0.08mm, and the bearing adopts the Japanese NSK / NACHI brand, with a runout tolerance of only 0.005mm to ensure the smoothness of movement. The Z axis adopts a precision screw + linear module to support automatic focus and height adjustment.

[0030] The real-time monitoring mechanism integrates visual positioning, material status monitoring, and environmental monitoring modules. The real-time monitoring mechanism controls the multi-axis CNC platform 4 to adjust the dot position of the laser source 3 according to the visual positioning, the processing material status, and the processing environment.

[0031] By configuring a laser source 3 with a spot diameter of <5μm and a multi-axis CNC platform 4 with a positioning accuracy of ≤±1μm, the limitation of the traditional laser engraving machine with an accuracy of >10μm has been broken, and micron-level processing capability has been achieved. The integrated visual positioning, material status monitoring and environmental monitoring modules can compensate for thermal expansion errors (such as Z-axis drift) and material deformation in real time, and improve processing stability in complex environments. The focusing depth of ≥15mm expands the processing thickness range and is suitable for multi-layer materials or three-dimensional relief engraving.

[0032] Further, such as Figure 2 As shown, there are several laser sources 3. In the attached figure of this embodiment, only one laser source 3 is provided. When multiple laser sources 3 are provided, it is only necessary to install multiple laser sources 3 in the attached figure of this embodiment on the precision linear guide rail 15. Several laser sources 3 realize segmented work at multiple workstations. The segmented work of multiple laser sources 3 can realize parallel processing, improve efficiency, avoid long-term high-load operation of a single laser source 3, extend equipment life, and for the needs of three-dimensional relief, different laser sources 3 can be divided into detail processing and rough processing.

[0033] like Figure 2 and Figure 3 As shown, the laser source 3 controls multiple laser dots through array laser, and realizes multi-spot synchronous engraving through array laser control, which significantly improves efficiency. Multiple spots can be divided into high-density areas to reduce the number of repeated processing of a single point, avoid local overheating, and improve material compatibility. Multiple laser sources 3 work together to form a "distributed + parallel" processing mode, which greatly improves processing efficiency.

[0034] like Figure 3 and Figure 4As shown, the visual positioning includes a high frame rate CCD vision system and a laser interferometer 7. The high frame rate CCD vision system includes a CCD camera 6 as an input end. The high frame rate CCD vision system is used to realize online comparison of the engraving contour. The laser interferometer 7 measures the distance change between the laser head and the workpiece in real time and compensates for the Z-axis drift caused by thermal expansion. The laser interferometer 7 measures the Z-axis distance change in real time and compensates for the thermal expansion error. The high frame rate CCD vision system can quickly identify processing deviations and ensure the restoration of complex patterns. Combined with the multi-axis CNC platform 4, the positioning accuracy of three-dimensional engraving is improved.

[0035] like Figure 3 As shown, the material state monitoring includes an infrared thermal imager 8, which is used to monitor the temperature field distribution on the workpiece surface and predict the thermal deformation of the material. The infrared thermal imager 8 can monitor the temperature field distribution, adjust the laser parameters in advance, avoid local overheating and cause changes in material properties, and can adjust the engraving speed or power through temperature feedback, providing data support for high-frequency modulation and Z-axis compensation, thereby forming a "heat-deformation-position" comprehensive monitoring network.

[0036] like Figure 1 and Figure 3As shown, the machine body 1 is also provided with a chip suction mechanism controlled by the equipment main control processing center 2, and the chip suction mechanism includes a negative pressure forming device 9, a suction pipe 10, a chip suction cover 11, a blowing device 12 and a blowing pipe 13, wherein the chip suction cover 11 is fixedly connected to the laser output end of the laser source 3, and a bayonet 14 for approaching the surface of the workpiece is provided on the chip suction cover 11, and the laser source 3 marks the part of the workpiece located in the bayonet 14, and the infrared thermal imager 8, the CCD camera 6 and the laser interferometer 7 are all located in the chip suction cover 11 and integrated Below the laser output end of the laser source 3, the blowing pipe 13 is located below the infrared thermal imager 8, the CCD camera 6 and the laser interferometer 7 and is connected to the bottom of the chip suction cover 11. The blowing device 12 is used to blow air into the chip suction cover 11. The suction pipe 10 is provided with two suction pipes 10 and is respectively located on both sides of the suction pipe 10 and connected to the chip suction cover 11. The negative pressure forming device 9 is used to suck air into the chip suction cover 11. The environmental monitoring module includes a vibration sensor and an air pressure sensor. The vibration sensor is used to detect mechanical resonance and external interference vibration. The air pressure sensor detects the air pressure to control the negative pressure stability of the chip suction mechanism. The negative pressure forming device 9 is a vacuum pump, which continuously forms negative pressure through the suction pipe 10 to suck away the debris generated by laser engraving, and the blowing device 12 and the blowing pipe 13 can prevent the debris from affecting the normal use of visual positioning and material status monitoring. The vibration sensor and the air pressure sensor can be installed in more positions on the body 1, and the vibration sensor and the air pressure sensor are sensors commonly used by technicians in this field, so they are not marked in the drawings of this embodiment. The vibration sensor is used to monitor mechanical resonance and external interference vibration. The air pressure sensor detects the air pressure to control the negative pressure stability of the chip suction mechanism. The vibration sensor can detect the vibration frequency and amplitude of the equipment in real time to help determine whether mechanical resonance has occurred, so that the operator can make adjustments in time, reduce mechanical resonance interference, and improve the reliability of high-precision engraving. The air pressure sensor can assist the negative pressure control of the chip suction mechanism. The negative pressure control prevents debris from affecting the optical path or the material surface, thereby adapting to the processing requirements of different materials (such as metal requires high negative pressure to absorb chips, and wood requires low negative pressure to prevent cracking).

[0037] The machine body 1 is also provided with an expansion unit processing center controlled by the equipment main control processing center 2. The machine body 1 is provided with a start condition detection unit, which includes dust removal detection feedback, air pressure detection feedback, temperature and humidity detection feedback, and protection sensor detection feedback. Among them, the dust removal detection feedback adopts a laser dust sensor (MMD6500), which adopts the principle of laser scattering and can detect the concentration of 0.3~10μm particles with a resolution of 1μg / m³. It monitors the dust concentration in real time, and triggers the dust suction mechanism to start or adjust the power by real-time monitoring the dust concentration in the working area, so as to reduce the interference of dust on the laser light path and avoid the reduction of engraving accuracy; the air pressure detection feedback The feedback uses differential pressure sensors and flow sensors. The differential pressure sensor monitors the air pressure difference of the gas path system (such as the gas path of the chip suction mechanism) to determine the smoothness of the air flow. The flow sensor detects the gas flow rate to ensure that the chip suction efficiency meets the design requirements. The air pressure data is used to determine whether the chip suction pipeline is blocked or leaking. If the air pressure is abnormal, the equipment operation is suspended to avoid dust retention or material burning due to insufficient suction. In addition, combined with the dynamic adjustment capability of the expansion unit, the fan speed and air pressure matching can be optimized; the temperature and humidity detection feedback includes temperature sensors and humidity sensors. High temperature may cause equipment overheating or material deformation, and high humidity may cause circuit short circuit or laser tube condensation. The temperature and humidity detection feedback can trigger The temperature control system (such as a fan, a dehumidifier) ​​installed in the machine body 1 adjusts the environment. The temperature control system installed in the machine body 1 is a common design, so it will not be described here. The temperature and humidity detection feedback can be combined with the material properties to dynamically adjust the laser power to adapt to the temperature and humidity changes; the protection sensor detection feedback includes a safety door switch sensor, a flame sensor, an overturning sensor and a laser tube temperature sensor. The safety door switch sensor is used to detect whether the protective cover is closed. The flame sensor is used to monitor the risk of combustion and trigger an emergency shutdown. The overturning sensor (three-axis accelerometer) can detect whether the equipment is tilted or collided. The laser tube temperature sensor: monitors the laser temperature to prevent overheating and burning. The dust removal detection feedback The sensors used for the air pressure detection feedback, temperature and humidity detection feedback, and protection sensor detection feedback can be installed at the corresponding position of the body 1. They are not marked in the drawings of this embodiment. The dust removal detection feedback, air pressure detection feedback, temperature and humidity detection feedback, and protection sensor detection feedback are used to determine whether the laser engraving machine can be started, so that the equipment can be ensured to operate in the best environment through dust removal, temperature and humidity detection, etc., reduce dust interference, and protect sensors (such as air pressure anomaly detection) to prevent equipment failure or material damage. The expansion unit processing center supports future function upgrades (such as adding sensors or algorithm modules), provides startup conditions for the chip suction mechanism, and forms a closed-loop control with the real-time monitoring mechanism.

[0038] A method for using a high-resolution laser engraving machine, applicable to the above-mentioned high-resolution laser engraving machine, comprises the following steps: S1 fixes the workpiece by the workpiece fixture 5. In this embodiment, the high-resolution laser engraving machine is used to engrave the rubber printing roller, wherein the workpiece fixture 5 is a chuck used to fix the two ends of the rubber printing roller; The S2 equipment main control processing center 2 restores the pattern to the workpiece with high precision through photoelectric conversion. The photoelectric conversion technology ensures the accurate restoration of pattern details. S3 controls the movement of the laser source 3 through the multi-axis CNC platform 4, and laser engraves the workpiece through the laser source 3. During the engraving process, the dot position of the laser source 3 is adjusted through the real-time monitoring mechanism, and the real-time monitoring mechanism corrects the error during the engraving process to improve the yield rate; If S4 needs to process a three-dimensional pattern, it can achieve three-dimensional relief engraving by repeatedly laser engraving through laser source 3. Through multi-axis linkage and repeated engraving, it breaks through the traditional plane limitations.

[0039] An application of a high-resolution laser engraving machine is suitable for the above-mentioned high-resolution laser engraving machine and is used for processing metals, ceramics, chips, rubber, wood, stone, and printing rubber rollers. It has a wide range of applicability from metals to ceramics. When processing different things, different processing part fixtures 5 can be replaced. For example, the printing rubber roller processed in this embodiment can use a chuck as the processing part fixture 5.

[0040] Among them, the processed printing rubber roller can be used for anti-counterfeiting pattern imprinting and chip nano-imprinting. The micron-level light spot can process nano-level anti-counterfeiting patterns, and high-precision engraving can achieve complex textures, which plays the role of anti-counterfeiting for the printing rubber roller.

[0041] The processed rubber roller is engraved on the surface at the nano level to form a microstructure mold, and the pattern is transferred to the anti-counterfeiting label or currency surface using nano-imprinting technology. This structure can produce unique optical effects (such as dynamic color change, invisible fluorescence), and can generate anti-counterfeiting elements such as micro text and invisible coding. For example, the nano pattern is solidified on the surface of the anti-counterfeiting material through ultraviolet light curing nano-imprint glue (UV-NIL), realizing micro-level anti-counterfeiting verification, which cannot be replicated by traditional printing. The processed rubber roller can also be adapted to a variety of materials such as polymers and metal films, and combined with nano-lithography technology to produce a composite anti-counterfeiting layer to enhance wear resistance and corrosion resistance.

[0042] The processed rubber roller is the core component of the imprinting mold. Through heat pressing or UV curing process, the pre-engraved nanoscale circuit pattern is transferred to the silicon wafer or flexible substrate. The template engraved by the rubber roller can support a pattern density of <6nm half pitch, breaking through the diffraction limit of traditional lithography. For example, in storage chips (such as NAND flash memory), nanoimprint technology uses rubber roller molds to achieve efficient replication of three-dimensional stacked structures. For scenes such as AR / VR optical elements and flexible display screens, the processed rubber roller can be used to emboss nanoscale photonic crystals or microlens arrays on flexible substrates (such as PET) to improve the performance of optical devices and reduce energy consumption. Nanoimprinting does not require a complex optical system, and the equipment cost is only 1 / 10 of that of traditional lithography. Through the above technical path, high-precision printed rubber rollers have shown disruptive potential in anti-counterfeiting and chip manufacturing. The core lies in the deep integration of mechanical imprinting and nanoscale processing to provide efficient and low-cost solutions for the field of micro-nano manufacturing.

[0043] The above is only a preferred embodiment of the present invention, and the protection scope of the present invention is not limited to the above embodiments. All technical solutions under the concept of the present invention belong to the protection scope of the present invention. It should be pointed out that for ordinary technicians in this technical field, some improvements and modifications without departing from the principle of the present invention should also be regarded as the protection scope of the present invention.

Claims

1. A high-resolution laser engraving machine, characterized by: The invention comprises a machine body (1), a main control processing center (2), a laser source (3), a multi-axis numerical control platform (4), a workpiece fixture (5) and a real-time monitoring mechanism, wherein The device main control processing center (2) is used for sending and receiving device data; The laser source (3) is configured with a spot diameter of <5 μm and a focus depth of ≥15 mm; The multi-axis numerical control platform (4) has an XYZ three-axis linkage function, a positioning accuracy of ≤±1 μm, and is used to drive the laser source (3) to move; The real-time monitoring mechanism integrates visual positioning, material state monitoring, and environmental monitoring modules. The real-time monitoring mechanism controls the multi-axis numerical control platform (4) to adjust the dot position of the laser source (3) according to the visual positioning, the state of the processed material, and the processing environment.

2. The high-resolution laser engraving machine according to claim 1, characterized in that: A plurality of the laser sources (3) are provided, and the plurality of the laser sources (3) realize segmented operation of multiple workstations.

3. The high-resolution laser engraving machine according to claim 1, characterized in that: The laser source (3) uses optical fiber laser to generate a high-frequency light source through an acousto-optic modulator, and then forms a micrometer-level controllable light spot through focusing.

4. The high-resolution laser engraving machine according to claim 1, characterized in that: The laser source (3) controls multi-channel laser dot marking through array laser.

5. The high-resolution laser engraving machine according to claim 1, characterized in that: The machine body (1) is also provided with an expansion unit processing center controlled by the equipment main control processing center (2); the machine body (1) is provided with a start condition detection unit, the start condition detection unit includes dust removal detection feedback, air pressure detection feedback, temperature and humidity detection feedback, and protection sensor detection feedback; the dust removal detection feedback, air pressure detection feedback, temperature and humidity detection feedback, and protection sensor detection feedback are used to determine whether the laser engraving machine can be started.

6. The high-resolution laser engraving machine according to claim 1, characterized in that: The visual positioning comprises a high frame rate CCD visual system and a laser interferometer (7), wherein the high frame rate CCD visual system comprises a CCD camera (6) as an input end, the high frame rate CCD visual system is used to realize online comparison of the engraving contour, and the laser interferometer (7) measures the distance change between the laser head and the workpiece in real time to compensate for the Z-axis drift caused by thermal expansion.

7. The high-resolution laser engraving machine according to claim 6, characterized in that: The material state monitoring comprises an infrared thermal imager (8) for monitoring the temperature field distribution on the surface of the workpiece and predicting the thermal deformation of the material.

8. The high-resolution laser engraving machine according to claim 7, characterized in that: The machine body (1) is also provided with a chip suction mechanism controlled by the equipment main control processing center (2), the chip suction mechanism comprising a negative pressure forming device (9), a suction pipe (10), a chip suction cover (11), a blowing device (12) and a blowing pipe (13), wherein the chip suction cover (11) is fixedly connected to the laser output end of the laser source (3), the chip suction cover (11) is provided with a bayonet (14) for approaching the surface of the workpiece, the laser source (3) performs dotting on the part of the workpiece located in the bayonet (14), the infrared thermal imager (8), the CCD camera (6) and the laser interferometer (7) are all located in the chip suction cover (11) and integrated in the laser source (3). Below the laser output end, the blowing pipe (13) is located below the infrared thermal imager (8), the CCD camera (6) and the laser interferometer (7) and is connected to the bottom of the chip suction cover (11), and the inside of the chip suction cover (11) is blown by the blowing device (12). The suction pipe (10) is provided with two and is respectively located on both sides of the suction pipe (10) and connected to the chip suction cover (11). The inside of the chip suction cover (11) is sucked by the negative pressure forming device (9). The environmental monitoring module includes a vibration sensor and an air pressure sensor. The vibration sensor is used to detect mechanical resonance and external interference vibration. The air pressure sensor detects air pressure for controlling the negative pressure stability of the chip suction mechanism.

9. A method for using a high-resolution laser engraving machine, applicable to any high-resolution laser engraving machine in claims 1-8, characterized in that: The steps include: S1 fixes the workpiece by means of a workpiece fixture (5); The S2 equipment main control processing center (2) restores the pattern to the workpiece with high precision through photoelectric conversion; S3 controls the movement of the laser source (3) through a multi-axis numerical control platform (4), and performs laser engraving on the workpiece through the laser source (3). During the engraving process, the dot position of the laser source (3) is adjusted through a real-time monitoring mechanism; If a three-dimensional pattern needs to be processed, S4 uses a laser source (3) to repeatedly perform laser engraving to achieve three-dimensional relief engraving.

10. An application of a high-resolution laser engraving machine, applicable to any high-resolution laser engraving machine in claims 1-8, characterized in that: It is used for processing metals, ceramics, chips, rubber, wood, stone, and printing rubber rollers. The processed printing rubber rollers can be used for anti-counterfeiting pattern imprinting and chip nanoimprinting.

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