High-thermal-conductivity silica gel material and preparation method thereof

Abstract

The invention relates to the field of silica gel, in particular to a high-thermal-conductivity silica gel material and a preparation method thereof.The silica gel material is prepared from, by weight, 25-50 parts of vinyl-terminated polysiloxane, 135-185 parts of thermal conductive filler, 10-20 parts of hydrogen-containing silicone oil, 0.8-1.6 parts of a catalyst, 2.1-3.8 parts of a stabilizer and 0.02-0.08 part of an inhibitor; wherein the heat-conducting filler is modified silicon carbide. The heat-conducting filler used in the invention is a modified silicon carbide material, so that the silica gel material is endowed with better heat-conducting property, and the strength, hardness and aging resistance of the silica gel material are greatly improved.

Description

Technical Field

[0001] The invention relates to the field of silica gel, and in particular to a high thermal conductivity silica gel material and a preparation method thereof. Background Art

[0002] As the integration of electronic equipment and industrial equipment becomes higher and higher, the heat generated is also increasing. Especially for some large industrial equipment, the temperature generated by the heat accumulation even exceeds 250°C for a long time. The ideal requirement is to be able to dissipate the heat generated by the equipment as quickly as possible. However, these large industrial equipment usually have large tolerance gaps, and materials with good thermal conductivity and heat resistance (such as graphite sheets, etc.) are difficult to meet the requirements of large gaps. Therefore, the material that can meet the requirements of large gap heat transfer is still mainly thermal conductive sheets.

[0003] Thermally conductive silicone material is a thermally conductive medium material synthesized by a special process with silicone as the base material and various auxiliary materials such as metal oxides. It can fill gaps, open up the heat channel between the heating part and the heat dissipation part, effectively improve the heat transfer efficiency, and also play the role of insulation, shock absorption, sealing, etc., which can meet the design requirements of miniaturization and ultra-thinness of equipment. It is a highly processable, practical, and widely applicable thermally conductive filling material. However, the thermal conductivity of the silicone material itself is generally poor, so it is necessary to add thermally conductive fillers to improve its thermal conductivity. At present, the most commonly used thermally conductive fillers on the market are copper, aluminum, aluminum oxide, aluminum nitride, silicon carbide and other materials. The higher the filling amount of the thermally conductive filler, the higher the thermal conductivity of the silicone. However, as the use of thermally conductive fillers increases, the strength and performance of the thermal silicone material decrease significantly, which ultimately affects the performance stability of the thermally conductive silicone sheet. Summary of the invention

[0004] In view of the problems existing in the prior art, the object of the present invention is to provide a high thermal conductivity silicone material and a preparation method thereof.

[0005] The purpose of the present invention is achieved by the following technical solutions:

[0006] In a first aspect, the present invention provides a high thermal conductivity silicone material, calculated by weight, comprising:

[0007] 25-50 parts of vinyl-terminated polysiloxane, 135-185 parts of thermally conductive filler, 10-20 parts of hydrogen-containing silicone oil, 0.8-1.6 parts of catalyst, 2.1-3.8 parts of stabilizer and 0.02-0.08 parts of inhibitor.

[0008] Preferably, the weight average molecular weight of the vinyl-terminated polysiloxane is 10,000-20,000, and the molar content of vinyl groups is 0.2%-0.8%.

[0009] Preferably, the thermally conductive filler is modified silicon carbide.

[0010] Preferably, the hydrogen content of the hydrogen-containing silicone oil is 1.52-1.66%, the weight average molecular weight is 3400-5800, and the viscosity is 50-90 mm 2 / s.

[0011] Preferably, the catalyst is a platinum-vinylsiloxane complex, wherein the mass proportion of platinum is 0.6-1.2%.

[0012] Preferably, the stabilizer is an organic polysilazane, including IOTA 9150 or IOTA 9108.

[0013] Preferably, the inhibitor is an acetylenic alcohol inhibitor, including one of 1-ethynylcyclohexanol, 3-methyl-1-dodecyn-3-ol, and 3,7,11-trimethyldodecyn-3-ol.

[0014] Preferably, the method for preparing modified silicon carbide comprises the following steps:

[0015] S1. Weigh silicon carbide powder and add it to an aqueous solution of ethanol, then add γ-aminopropyltriethoxysilane, treat at 50-60° C. for 10-20 hours, and then filter, rinse and dry to obtain amino silicon carbide;

[0016] S2, weigh terephthalaldehyde and add it to ethanol, mix well, then add amino silicon carbide, stir at 30-40° C. for 10-20 hours, then filter, rinse and dry to obtain aldehyde silicon carbide;

[0017] S3, adding vinyl silicone oil and 3-amino-5-mercapto-1,2,4-triazole to carbon tetrachloride, fully dispersing, then adding a photosensitizer, stirring for 0.6-1.8h under ultraviolet light, then removing the solvent under reduced pressure, washing with water and drying to obtain modified silicone oil;

[0018] S4. Weigh the modified silicone oil and add it to toluene. After fully mixing, add formaldehyde-modified silicon carbide and then drop glacial acetic acid. Reflux at 110-120°C for 3-8h. After the reaction is completed, remove the solvent under reduced pressure. After rinsing and drying, the modified silicon carbide is obtained.

[0019] Preferably, in S1, the particle size of the silicon carbide powder is 200-500 nm, the mass fraction of ethanol in the ethanol aqueous solution is 20%-60%, and the mass volume ratio of the silicon carbide powder, γ-aminopropyltriethoxysilane and the ethanol aqueous solution is 1 g: (0.1-0.5) g: (10-20) mL.

[0020] Preferably, in S2, the mass volume ratio of amino silicon carbide, terephthalaldehyde and ethanol is 1 g: (0.14-0.42) g: (15-25) mL.

[0021] Preferably, in S3, the weight average molecular weight of the vinyl silicone oil is 1500-2500, the molar content of vinyl is 3.2%-5.8%, and the boiling point is 162-166° C. More preferably, the weight average molecular weight of the vinyl silicone oil is 2000, and the molar content of vinyl is 4.6%.

[0022] Preferably, in S3, the mass volume ratio of vinyl silicone oil, 3-amino-5-mercapto-1,2,4-triazole and carbon tetrachloride is 10 g:(0.93-1.86) g:(60-100) mL.

[0023] Preferably, in S3, the photosensitizer is benzoin dimethyl ether or benzoin diethyl ether, and the amount of the photosensitizer added is 0.6%-1.2% of the mass of the vinyl silicone oil; the wavelength of the ultraviolet light is 365nm, and the intensity is 80-160mW / cm 2 .

[0024] Preferably, in S4, the mass volume ratio of aldehyded silicon carbide, modified silicone oil and toluene is 1 g:(0.26-0.52) g:(20-40) mL.

[0025] Preferably, in S4, the amount of glacial acetic acid added is 1%-5% of the mass of the modified silicone oil.

[0026] In a second aspect, the present invention provides a method for preparing a high thermal conductivity silicone material, comprising the following steps:

[0027] Step 1, firstly, mixing the vinyl-terminated polysiloxane, hydrogen-containing silicone oil, a catalyst, a stabilizer and an inhibitor in a stirrer, and stirring them thoroughly until they are uniform, to obtain a first mixed material;

[0028] Step 2, adding a thermally conductive filler to the first mixture, and stirring the mixture again to obtain a second mixture;

[0029] Step 3, vacuum degassing the second mixed material, and then curing and molding it at 110-130° C. to obtain a high thermal conductive silicone material.

[0030] The beneficial effects of the present invention are:

[0031] 1. The present invention prepares a high thermal conductivity silicone material, which uses vinyl-terminated polysiloxane as the main ingredient, hydrogen-containing silicone oil as a cross-linking agent, and adds a thermal conductive filler as a thermal conductive filler. In addition, additives such as stabilizers, catalysts and inhibitors are also added. The thermal conductive filler used in the present invention is a modified silicon carbide material, which not only gives the silicone material better thermal conductivity, but also greatly improves the strength, hardness and aging resistance of the silicone material.

[0032] 2. In the present invention, the thermal conductive filler uses high-hardness and high-thermal-conductivity silicon carbide as a matrix material, and its surface is modified. The modification process includes: firstly subjecting the surface of the silicon carbide material to amination treatment, and then subjecting it to formaldehyde modification with a multi-aldehyde monomer terephthalaldehyde to obtain formaldehyde-modified silicon carbide; then using vinyl silicone oil and 3-amino-5-mercapto-1,2,4-triazole containing a mercapto group to a mercapto-ethylene click chemical reaction to obtain a modified silicone oil containing an amino group, a thioether group and a triazole group; finally, using the modified silicone oil containing an amino group to a Schiff base reaction of amine-aldehyde condensation with the formaldehyde-modified silicon carbide to prepare the modified silicon carbide.

[0033] 3. The thermal conductive filler prepared by the present invention is an organic-inorganic coated material, and its organic layer is a modified silicone oil containing groups such as thioether groups, Schiff bases and triazoles. It has good compatibility with silica gel materials. Moreover, it has been found through testing that it has a good enhancing effect on the thermal conductivity, strength, hardness and aging resistance of silica gel materials. DETAILED DESCRIPTION

[0034] The technical solution of the present invention is described below through specific examples. It should be understood that the one or more method steps mentioned in the present invention do not exclude the existence of other method steps before and after the combination step or the insertion of other method steps between these explicitly mentioned steps; it should also be understood that these embodiments are only used to illustrate the present invention and are not used to limit the scope of the present invention. Moreover, unless otherwise specified, the numbering of each method step is only a convenient tool for identifying each method step, and is not intended to limit the order of arrangement of each method step or to limit the scope of the present invention. The change or adjustment of the relative relationship thereof shall also be regarded as the scope of the present invention without substantially changing the technical content.

[0035] In order to better understand the above technical scheme, the exemplary embodiments of the present invention are described in more detail below. Although exemplary embodiments of the present invention are shown, it should be understood that the present invention can be implemented in various forms and should not be limited by the embodiments set forth herein. On the contrary, these embodiments are provided in order to enable a more thorough understanding of the present invention and to enable the scope of the present invention to be fully communicated to those skilled in the art.

[0036] The present invention will be further described below in conjunction with the following examples.

[0037] Example 1

[0038] A high thermal conductivity silicone material, calculated by weight, comprising:

[0039] 35 parts of vinyl-terminated polysiloxane, 160 parts of thermally conductive filler, 15 parts of hydrogenated silicone oil, 1.2 parts of catalyst, 2.7 parts of stabilizer and 0.05 parts of inhibitor.

[0040] The weight average molecular weight of the vinyl-terminated polysiloxane is 15,000, and the molar content of vinyl is 0.6%. The hydrogen content of the hydrogen-containing silicone oil is 1.58%, the weight average molecular weight is 4,200, and the viscosity is 60 mm 2 / s; the catalyst is a platinum-vinylsiloxane complex, in which the mass proportion of platinum is 0.9%; the stabilizer is the organic polysilazane IOTA 9150; and the inhibitor is 1-ethynylcyclohexanol.

[0041] The preparation method of modified silicon carbide comprises the following steps:

[0042] S1. Weigh silicon carbide powder with a particle size of 200-500 nm and add it to a 40wt% ethanol aqueous solution, then add γ-aminopropyltriethoxysilane, the mass volume ratio of silicon carbide powder, γ-aminopropyltriethoxysilane and ethanol aqueous solution is 1g:0.3g:15mL, treat at 55°C for 15h, then filter, rinse and dry to obtain amino silicon carbide;

[0043] S2, weigh terephthalaldehyde and add it to ethanol, mix well and then add amino silicon carbide, the mass volume ratio of amino silicon carbide, terephthalaldehyde and ethanol is 1g:0.28g:20mL, stir at 35°C for 15h, then filter, rinse and dry to obtain aldehyded silicon carbide;

[0044] S3, vinyl silicone oil (Mw: 2000, Et%: 4.6mol%) and 3-amino-5-mercapto-1,2,4-triazole were added to carbon tetrachloride, the mass volume ratio of vinyl silicone oil, 3-amino-5-mercapto-1,2,4-triazole and carbon tetrachloride was 10g:1.39g:80mL, after fully dispersed, benzoin dimethyl ether was added, the amount added was 0.9% of the mass of vinyl silicone oil, at a wavelength of 365nm and an intensity of 120mW / cm 2 The mixture was irradiated with ultraviolet light and stirred for 1.2 hours, and then the solvent was removed under reduced pressure, washed with water and dried to obtain modified silicone oil;

[0045] S4. Weigh the modified silicone oil and add it to toluene. After fully mixing, add formaldehyded silicon carbide. The mass volume ratio of formaldehyded silicon carbide, modified silicone oil and toluene is 1g:0.39g:30mL. Then add 3% glacial acetic acid by mass of the modified silicone oil dropwise. Reflux at 115°C for 5h. After the reaction is completed, remove the solvent under reduced pressure. After rinsing and drying, the modified silicon carbide is obtained.

[0046] The method for preparing the above-mentioned high thermal conductivity silicone material comprises the following steps:

[0047] Step 1, firstly, mixing the vinyl-terminated polysiloxane, hydrogen-containing silicone oil, a catalyst, a stabilizer and an inhibitor in a stirrer, and stirring them thoroughly until they are uniform, to obtain a first mixed material;

[0048] Step 2, adding a thermally conductive filler to the first mixture, and stirring the mixture again to obtain a second mixture;

[0049] Step 3, vacuum degassing the second mixed material, and then curing and molding it at 120° C. to obtain a high thermal conductive silicone material.

[0050] Example 2

[0051] A high thermal conductivity silicone material, calculated by weight, comprising:

[0052] 25 parts of vinyl-terminated polysiloxane, 135 parts of thermally conductive filler, 10 parts of hydrogenated silicone oil, 0.8 parts of catalyst, 2.1 parts of stabilizer and 0.02 parts of inhibitor.

[0053] The weight average molecular weight of the vinyl-terminated polysiloxane is 10,000, and the molar content of vinyl is 0.2%. The hydrogen content of the hydrogen-containing silicone oil is 1.58%, the weight average molecular weight is 4,200, and the viscosity is 60 mm 2 / s; the catalyst is a platinum-vinylsiloxane complex, in which the mass proportion of platinum is 0.6%; the stabilizer is the organic polysilazane IOTA 9108; and the inhibitor is 3-methyl-1-dodecyne-3-ol.

[0054] The preparation method of modified silicon carbide comprises the following steps:

[0055] S1. Weigh silicon carbide powder with a particle size of 200-500 nm and add it to a 20wt% ethanol aqueous solution, then add γ-aminopropyltriethoxysilane, the mass volume ratio of silicon carbide powder, γ-aminopropyltriethoxysilane and ethanol aqueous solution is 1g:0.1g:10mL, treat at 50°C for 10h, then filter, rinse and dry to obtain amino silicon carbide;

[0056] S2, weigh terephthalaldehyde and add it to ethanol, mix well and then add amino silicon carbide, the mass volume ratio of amino silicon carbide, terephthalaldehyde and ethanol is 1g:0.14g:15mL, stir at 30°C for 10h, then filter, rinse and dry to obtain aldehyded silicon carbide;

[0057] S3, vinyl silicone oil (Mw: 2000, Et%: 4.6mol%) and 3-amino-5-mercapto-1,2,4-triazole were added to carbon tetrachloride, the mass volume ratio of vinyl silicone oil, 3-amino-5-mercapto-1,2,4-triazole and carbon tetrachloride was 10g:0.93g:60mL, after fully dispersed, benzoin diethyl ether was added, the amount added was 0.6% of the mass of vinyl silicone oil, at a wavelength of 365nm and an intensity of 80mW / cm 2 The mixture was irradiated with ultraviolet light and stirred for 0.6 h, and then the solvent was removed under reduced pressure, washed with water and dried to obtain modified silicone oil;

[0058] S4. Weigh the modified silicone oil and add it to toluene. After fully mixing, add formaldehyded silicon carbide. The mass volume ratio of formaldehyded silicon carbide, modified silicone oil and toluene is 1g:0.26g:20mL. Then add glacial acetic acid with a mass% of the modified silicone oil dropwise. Reflux at 110°C for 3h. After the reaction is completed, remove the solvent under reduced pressure. After rinsing and drying, the modified silicon carbide is obtained.

[0059] The method for preparing the above-mentioned high thermal conductivity silicone material comprises the following steps:

[0060] Step 1, firstly, mixing the vinyl-terminated polysiloxane, hydrogen-containing silicone oil, a catalyst, a stabilizer and an inhibitor in a stirrer, and stirring them thoroughly until they are uniform, to obtain a first mixed material;

[0061] Step 2, adding a thermally conductive filler to the first mixture, and stirring the mixture again to obtain a second mixture;

[0062] Step 3, vacuum degassing the second mixed material, and then curing and molding it at 110° C. to obtain a high thermal conductive silicone material.

[0063] Example 3

[0064] A high thermal conductivity silicone material, calculated by weight, comprising:

[0065] 50 parts of vinyl-terminated polysiloxane, 185 parts of thermally conductive filler, 20 parts of hydrogen-containing silicone oil, 1.6 parts of catalyst, 3.8 parts of stabilizer and 0.08 parts of inhibitor.

[0066] The weight average molecular weight of the vinyl-terminated polysiloxane is 20,000, and the molar content of vinyl is 0.8%; the hydrogen content of the hydrogen-containing silicone oil is 1.58%, the weight average molecular weight is 4,200, and the viscosity is 60 mm2 / s; the catalyst is a platinum-vinylsiloxane complex, in which the mass proportion of platinum is 1.2%; the stabilizer is the organic polysilazane IOTA 9150; and the inhibitor is 3,7,11-trimethyldodecyne-3-ol.

[0067] The preparation method of modified silicon carbide comprises the following steps:

[0068] S1. Weigh silicon carbide powder with a particle size of 200-500 nm and add it to a 60wt% ethanol aqueous solution, then add γ-aminopropyltriethoxysilane, the mass volume ratio of silicon carbide powder, γ-aminopropyltriethoxysilane and ethanol aqueous solution is 1g:0.5g:20mL, treat at 60°C for 20h, then filter, rinse and dry to obtain amino silicon carbide;

[0069] S2, weigh terephthalaldehyde and add it to ethanol, mix well and then add amino silicon carbide, the mass volume ratio of amino silicon carbide, terephthalaldehyde and ethanol is 1g:0.42g:25mL, stir at 40°C for 20h, then filter, rinse and dry to obtain aldehyded silicon carbide;

[0070] S3, vinyl silicone oil (Mw: 2000, Et%: 4.6mol%) and 3-amino-5-mercapto-1,2,4-triazole were added to carbon tetrachloride, the mass volume ratio of vinyl silicone oil, 3-amino-5-mercapto-1,2,4-triazole and carbon tetrachloride was 10g:1.86g:100mL, after fully dispersed, benzoin dimethyl ether was added, the amount added was 1.2% of the mass of vinyl silicone oil, at a wavelength of 365nm and an intensity of 160mW / cm 2 The mixture was irradiated with ultraviolet light and stirred for 1.8 hours, and then the solvent was removed under reduced pressure, washed with water and dried to obtain modified silicone oil;

[0071] S4. Weigh the modified silicone oil and add it to toluene. After fully mixing, add formaldehyded silicon carbide. The mass volume ratio of formaldehyded silicon carbide, modified silicone oil and toluene is 1g:0.52g:40mL. Then add glacial acetic acid with a mass% of the modified silicone oil dropwise. Reflux at 120°C for 8h. After the reaction is completed, remove the solvent under reduced pressure. After rinsing and drying, the modified silicon carbide is obtained.

[0072] The method for preparing the above-mentioned high thermal conductivity silicone material comprises the following steps:

[0073] Step 1, firstly, mixing the vinyl-terminated polysiloxane, hydrogen-containing silicone oil, a catalyst, a stabilizer and an inhibitor in a stirrer, and stirring them thoroughly until they are uniform, to obtain a first mixed material;

[0074] Step 2, adding a thermally conductive filler to the first mixture, and stirring the mixture again to obtain a second mixture;

[0075] Step 3, vacuum degassing the second mixed material, and then curing and molding it at 130° C. to obtain a high thermal conductive silicone material.

[0076] Comparative Example 1

[0077] A silica gel material, which differs from Example 1 in that the thermal conductive filler is replaced by silicon carbide powder, and other components and preparation methods are the same as those of Example 1.

[0078] Calculated by weight, including:

[0079] 35 parts of vinyl-terminated polysiloxane, 160 parts of silicon carbide powder, 15 parts of hydrogenated silicone oil, 1.2 parts of catalyst, 2.7 parts of stabilizer and 0.05 parts of inhibitor.

[0080] Comparative Example 2

[0081] A silica gel material, which is different from Example 1 in that the thermal conductive filler is replaced by a mixture of silicon carbide powder and vinyl silicone oil (Mw: 2000, Et%: 4.6mol%), and other components and preparation methods are the same as those of Example 1.

[0082] Calculated by weight, including:

[0083] 35 parts of vinyl-terminated polysiloxane, 115 parts of silicon carbide, 45 parts of vinyl silicone oil, 15 parts of hydrogen-containing silicone oil, 1.2 parts of catalyst, 2.7 parts of stabilizer and 0.05 parts of inhibitor.

[0084] Comparative Example 3

[0085] A silicone material, which differs from Example 1 in that the thermal conductive filler is replaced by a mixture of silicon carbide powder and modified silicone oil, the preparation of the modified silicone oil is the same as that of Example 1, and the other components and preparation methods are the same as those of Example 1.

[0086] Calculated by weight, including:

[0087] 35 parts of vinyl-terminated polysiloxane, 115 parts of silicon carbide, 45 parts of modified silicone oil, 15 parts of hydrogen-containing silicone oil, 1.2 parts of catalyst, 2.7 parts of stabilizer and 0.05 parts of inhibitor.

[0088] After the silica gel prepared in Example 1 and Comparative Examples 1-3 is cured, its performance is tested respectively, including: the testing standards of tensile strength and elongation at break refer to GB / T 528-2009; the surface hardness is Shore A hardness test; the testing standard of tear strength refers to ISO34-1:2015; the testing standard of thermal conductivity refers to ASTM D5930; the aging test is to test the change rate of tensile strength after being placed at 250°C for 8 hours. The results are shown in Table 1:

[0089] Table 1 Detection parameters of different silicone materials

[0090] Example 1 Comparative Example 1 Comparative Example 2 Comparative Example 3 Tensile strength(MPa) 11.2 8.5 9.1 9.8 Elongation at break (%) 425 413 410 422 Surface hardness (Shore A) 61 53 52 57 Tear strength (kN / m) 34 26 29 31 Thermal conductivity (W / (m·K)) 3.2 3.7 2.8 3.0 Change rate of tensile strength after aging (%) -2.9 -8.1 -7.5 -4.3

[0091] It can be seen from the test results in Table 1 that the silicone material prepared in Example 1 can have better strength and hardness while maintaining a relatively high thermal conductivity. In addition, even after aging, the silicone material in Example 1 has a smaller change rate and can maintain a higher tensile strength. In summary, compared with the comparative example, the silicone material prepared in Example 1 of the present invention has better thermal conductivity, strength, hardness and aging resistance.

[0092] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representation of the above terms should not be understood as necessarily being directed to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art may combine and combine different embodiments or examples described in this specification.

[0093] Although the embodiments of the present invention have been shown and described above, it is to be understood that the above embodiments are exemplary and are not to be construed as limitations of the present invention. A person skilled in the art may change, modify, replace and vary the above embodiments within the scope of the present invention.

Claims

1. A high thermal conductivity silicone material, characterized in that: Calculated by weight, including: 25-50 parts of vinyl-terminated polysiloxane, 135-185 parts of thermally conductive filler, 10-20 parts of hydrogenated silicone oil, 0.8-1.6 parts of catalyst, 2.1-3.8 parts of stabilizer and 0.02-0.08 parts of inhibitor; Wherein, the thermally conductive filler is modified silicon carbide.

2. A high thermal conductivity silicone material according to claim 1, characterized in that: The weight average molecular weight of the vinyl-terminated polysiloxane is 10,000-20,000, and the vinyl molar content is 0.2%-0.8%; the hydrogen mass content of the hydrogen-containing silicone oil is 1.52-1.66%, the weight average molecular weight is 3,400-5,800, and the viscosity is 50-90 mm 2 / s.

3. A high thermal conductivity silicone material according to claim 1, characterized in that: The catalyst is a platinum-vinylsiloxane complex; the stabilizer is an organic polysilazane, including IOTA 9150 or IOTA 9108.

4. The high thermal conductivity silicone material according to claim 1, characterized in that: The inhibitor is an alkynol inhibitor, including one of 1-ethynyl cyclohexanol, 3-methyl-1-dodecene-3-ol, and 3,7,11-trimethyldodecene-3-ol.

5. The high thermal conductivity silicone material according to claim 1, characterized in that: The preparation method of the modified silicon carbide comprises the following steps: S1. Weigh silicon carbide powder and add it to an aqueous solution of ethanol, then add γ-aminopropyltriethoxysilane, treat at 50-60° C. for 10-20 hours, and then filter, rinse and dry to obtain amino silicon carbide; S2, weigh terephthalaldehyde and add it to ethanol, mix well, then add amino silicon carbide, stir at 30-40° C. for 10-20 hours, then filter, rinse and dry to obtain aldehyde silicon carbide; S3, adding vinyl silicone oil and 3-amino-5-mercapto-1,2,4-triazole to carbon tetrachloride, fully dispersing, then adding a photosensitizer, stirring for 0.6-1.8h under ultraviolet light, then removing the solvent under reduced pressure, washing with water and drying to obtain modified silicone oil; S4. Weigh the modified silicone oil and add it to toluene. After fully mixing, add formaldehyde-modified silicon carbide and then drop glacial acetic acid. Reflux at 110-120°C for 3-8h. After the reaction is completed, remove the solvent under reduced pressure. After rinsing and drying, the modified silicon carbide is obtained.

6. A high thermal conductivity silicone material according to claim 5, characterized in that: In S1, the particle size of the silicon carbide powder is 200-500 nm, the mass fraction of ethanol in the ethanol aqueous solution is 20%-60%, and the mass volume ratio of the silicon carbide powder, γ-aminopropyltriethoxysilane and the ethanol aqueous solution is 1 g: (0.1-0.5) g: (10-20) mL.

7. The high thermal conductivity silicone material according to claim 5, characterized in that: In S2, the mass volume ratio of amino silicon carbide, terephthalaldehyde and ethanol is 1g:(0.14-0.42)g:(15-25)mL.

8. The high thermal conductivity silicone material according to claim 5, characterized in that: In S3, the mass volume ratio of vinyl silicone oil, 3-amino-5-mercapto-1,2,4-triazole and carbon tetrachloride is 10g:(0.93-1.86)g:(60-100)mL.

9. The high thermal conductivity silicone material according to claim 5, characterized in that: In the S4, the mass volume ratio of aldehyded silicon carbide, modified silicone oil and toluene is 1 g:(0.26-0.52) g:(20-40) mL.

10. A method for preparing the high thermal conductivity silicone material according to claim 1, characterized in that: The following steps are involved: Step 1, firstly, mixing the vinyl-terminated polysiloxane, hydrogen-containing silicone oil, a catalyst, a stabilizer and an inhibitor in a stirrer, and stirring them thoroughly until they are uniform, to obtain a first mixed material; Step 2, adding a thermally conductive filler to the first mixture, and stirring the mixture again to obtain a second mixture; Step 3, vacuum degassing the second mixed material, and then curing and molding it at 110-130° C. to obtain a high thermal conductive silicone material.