Coating jig and coating equipment

Abstract

The invention provides a coating jig and coating equipment. The film coating jig comprises a substrate carrier, the middle of the substrate carrier is a hollow area, a plurality of supporting claws are arranged around the edge of the hollow area, each supporting claw is provided with a bearing part extending into the hollow area, and each bearing part is provided with a supporting face; the pressing mechanisms comprise pressing pieces, the pressing pieces are provided with pressing parts extending to the supporting faces of the supporting claws, and the multiple pressing mechanisms are arranged around the edge of the hollow area and correspond to the supporting claws in a one-to-one mode; and at least one spring ejector pin is arranged in the substrate carrier and extends into the hollow area along the direction from the edge of the substrate carrier to the hollow area. The coating equipment comprises the coating jig. When the coating jig is used for coating the substrate, product defects can be reduced, particularly shadow defects can be reduced, expansion of the shadow defects can be inhibited, the product yield is greatly improved, and the production cost is reduced.

Description

Technical Field

[0001] The present application relates to the field of semiconductor manufacturing, and in particular to a coating jig and coating equipment. Background Art

[0002] In the semiconductor manufacturing process, a series of processes need to be performed on the substrate, many of which will apply thin films or coatings on the substrate. For example, in the OLED panel manufacturing process, it is necessary to deposit an organic material film on the surface of the glass substrate; in the chip manufacturing process, it is necessary to make a coating on the surface of the wafer.

[0003] In all of these coating processes for making thin films or coatings, a mask plate is usually required to obtain a thin film or coating with a specific pattern. During the process of making a thin film or coating, the substrate to be coated needs to be loaded into a coating fixture containing a mask plate.

[0004] In the past, in order to facilitate the placement and removal of substrates, the grooves of the coating jig for accommodating substrates are usually made larger than the size of the substrates they accommodate. However, when the substrates are coated with such existing coating jigs, it is easy to cause evaporation defects in the coated products, for example, shadow defects or the expansion of shadow defects, etc.

[0005] In view of the actual demand for improving product evaporation defects and increasing product yield in the existing technology, it is urgent to provide a new solution. Summary of the invention

[0006] In order to solve or improve the above-mentioned technical problems existing in the prior art, the present application provides a coating jig and a coating device, which can at least be used in the manufacturing process of OLED panels or chips. The coating jig is used to apply a thin film or coating to a substrate, so that the mask plate and the substrate can be fully fitted, thereby improving the processing accuracy of the thin film or coating.

[0007] A first aspect of the present application provides a coating jig, the coating jig comprising: A substrate carrier, wherein the middle part is a hollow area, a plurality of supporting claws are arranged around the edge of the hollow area, the supporting claws have a supporting portion extending into the hollow area, and the supporting portion has a supporting surface; and The clamping mechanism comprises a pressing piece, wherein the pressing piece has a pressing portion extending toward the supporting surface of the claw, A plurality of clamping mechanisms are arranged around the edge of the hollow area and correspond one to one with the claws; and The spring ejector pin is at least one spring ejector pin disposed in the substrate carrier and extending from the edge of the substrate carrier to the hollow area into the hollow area.

[0008] In the above technical solution, the claws are used to support the substrate to be vapor-deposited in the hollow area of ​​the substrate carrier. The surrounding arrangement of multiple claws can provide uniform support for the edge of the substrate, which not only helps to improve the reliability of substrate support, but also reduces the deformation of the substrate to a certain extent. The clamping mechanism is used to press the substrate from the other side of the substrate and restrict the substrate on the claws. The clamping mechanism corresponds to the claws one by one. The pressing part of the pressing piece extends toward the supporting surface of the claws to apply pressure to the part of the substrate supported by it. The force-applying part of the pressing part on the substrate corresponds to the position of the claws, which can reduce the deformation of the substrate surface caused by the single-sided force on the substrate. The spring ejector pin is used to press the substrate from the edge of the substrate, limit the position of the substrate in the hollow area of ​​the substrate carrier, and prevent the substrate from moving in the hollow area.

[0009] The coating jig of the present application is used to coat the substrate. The supporting claws, clamping mechanism and spring pins configured in the coating jig work together. The substrate is not only restricted in the thickness direction of the substrate by the supporting claws and the clamping mechanism, but also blocked by the spring pins on the edge of the substrate, which can effectively suppress the movement of the substrate in the hollow area of ​​the substrate carrier. In practice, even if the coating jig is in motion for a long time during operation (for example, rotating), the substrate is not easy to shift in the hollow area of ​​the substrate carrier. Therefore, the coating jig of the present application can reduce the occurrence of product defects, especially reduce the generation of shadow defects and suppress the expansion of shadow defects, greatly improve product yield, and reduce production costs.

[0010] Furthermore, the clamping mechanism further includes a first spring and a main bolt rod. The pressing piece has a cavity, and the cavity runs from one end of the pressing piece to the other end of the pressing piece along a direction perpendicular to the surface of the substrate carrier. The first spring and the main bolt rod are arranged in the cavity, the front end of the main bolt rod extends out of the cavity and engages with the surface of the substrate carrier, and the first spring is sleeved on the middle section of the main bolt rod. A support bottom is provided in the cavity near the other end of the pressing piece, a bolt head is provided at the rear end of the main bolt rod, and the first spring is limited between the support bottom of the cavity and the bolt head of the main bolt rod.

[0011] In the above technical solution, the pressing piece is restricted by the first spring and the main bolt rod arranged in its cavity, and can move along the main bolt rod within the telescopic range of the first spring. When performing the operation of installing the substrate, first lift the pressing piece and separate its pressing part from the supporting claw. At this time, the first spring is squeezed by the bolt head of the main bolt rod and the supporting bottom in the cavity to shrink and store elastic potential energy. Then the substrate is placed in the hollow area of ​​the substrate carrier and supported by the supporting claw. After the substrate is placed, release the pressing piece, the first spring rebounds to reset the pressing piece, and the pressing part of the pressing piece presses the substrate on the supporting surface of the supporting claw. When performing the operation of taking out the substrate, lift the pressing piece in the same way as above, and release the pressing piece after the substrate is successfully taken out to allow it to complete its reset under the action of the first spring.

[0012] The coating jig of the present application, based on the aforementioned structural design of the clamping mechanism therein, can facilitate the loading and unloading operations of the substrate, thereby improving the efficiency of the product coating processing to a certain extent.

[0013] Furthermore, the clamping mechanism also includes a secondary bolt rod. The outer wall of the pressing piece is provided with an outwardly extending protruding portion, the protruding portion is provided with a bolt rod insertion hole, the bolt rod insertion hole extends in a direction perpendicular to the surface of the substrate carrier and passes through the protruding portion, The auxiliary bolt rod is arranged in the bolt rod insertion hole, and the front end of the auxiliary bolt rod is engaged with the surface of the substrate carrier.

[0014] In the above technical solution, the auxiliary bolt is used to limit the movement of the pressing piece, so that the pressing piece can only move in the extension direction of the main and auxiliary bolts, but cannot deflect around the main bolt. By providing the auxiliary bolt, the pressure part is prevented from detaching from the substrate due to accidental deflection of the pressing piece.

[0015] Furthermore, the spring ejector pin is parallel to the supporting surface of the claw and has the same height, so that the spring ejector pin can reliably abut against the edge of the substrate supported by the supporting surface of the claw.

[0016] Furthermore, At least one spring ejector pin is arranged along a first direction, and At least one spring ejector pin is arranged along the second direction, The first direction and the second direction intersect at a certain angle within the plane.

[0017] In the above technical solution, by arranging spring pins in any two intersecting directions respectively, the movement of the substrate can be restricted in multiple directions, which can further reduce the possibility of the substrate shifting in the hollow area of ​​the substrate carrier and improve the yield of the coated product.

[0018] Furthermore, the length of the spring ejector extending into the hollow area can be adjusted. By adjusting the length of the spring ejector extending into the hollow area of ​​the substrate carrier, the blocking force of the spring ejector on the substrate can be changed. Under the appropriate blocking force, it is helpful to further reduce the possibility of the substrate deflecting in the hollow area of ​​the substrate carrier, thereby improving the yield of the coating product.

[0019] Furthermore, the edge of the hollow area is provided with a plurality of notches, which are arranged on opposite sides of the hollow area. During the process of loading and unloading the substrate, the notches arranged at the edge of the hollow area can provide sufficient operating space for the grasping machine or human hands, making the loading and unloading operation of the substrate more convenient and safe.

[0020] Furthermore, it also includes a mask assembly, which includes a mask frame and a mask plate, the mask frame is annular, the mask plate is joined to one side of the mask frame and covers the annular area of ​​the mask frame, The middle part of the mask plate is a patterned opening area, and a plurality of clearance holes are arranged around the periphery of the patterned opening area; The mask assembly is joined to one side of the substrate carrier, and the side with the mask plate faces the substrate carrier, and the mask plate covers the hollow area in the middle of the substrate carrier. The clearance holes correspond one to one with the supporting claws of the substrate carrier, The supporting claws extend from one side of the mask plate through the corresponding clearance holes to the other side of the mask plate, and the supporting surface of the supporting claws is flush with the surface of the mask plate facing the substrate carrier.

[0021] In the above technical solution, by setting a clearance hole at the corresponding position of the mask plate, the claws of the substrate carrier are avoided, so that the mask plate can approach or fit the substrate supported by the claws without restriction. Based on this design, it is helpful to obtain an ideal mask plate and substrate fit state and improve the coating accuracy.

[0022] Furthermore, it also includes a magnet plate assembly, which is detachably connected to a side of the substrate carrier away from the mask assembly and covers the hollow area of ​​the substrate carrier.

[0023] This solution further adds a magnet plate assembly on the basis of the aforementioned design solution. By means of the magnet plate assembly, a magnetic attraction force is applied to the mask plate, which can reduce or even eliminate the sagging of the mask plate, so that the mask plate is fully and flatly attached to the surface of the substrate, achieving an ideal mask plate and substrate bonding state, and the film layer obtained by coating has higher precision.

[0024] A second aspect of the present application provides a coating device, which includes the coating jig provided by the first aspect of the present application.

[0025] One advantage of using the coating equipment in the present application is that it helps to reduce or eliminate the uncontrollable offset of the substrate in the coating jig, thereby reducing or eliminating product defects such as the generation or expansion of shadow defects caused by the uncontrollable offset; the second advantage is that the sagging of the mask can be reduced or even eliminated, which can ensure that the substrate and the mask plate are evenly fitted and accurately aligned, thereby improving the coating accuracy to a certain extent.

[0026] In addition, other additional aspects and advantages of the present application will be given in part in the following description, and in part will become obvious from the following description, or will be understood through the practice of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figure 1 is a schematic structural diagram of a coating fixture in an embodiment of the present application; Figure 2 yes Figure 1 An exploded view of a coating fixture in FIG. 1 , showing various components of the coating fixture; Figure 3 is a structural schematic diagram of a substrate carrier in an embodiment of the present application, wherein a partial enlarged view of the substrate carrier at the ejector pin hole and the supporting claw is shown; Figure 4 is a schematic diagram of an embodiment of the present application, in which the support surface of the claw is flush with the surface of the mask plate around it; Figure 5 is a schematic diagram of an embodiment of the present application, in which the support surface of the claw exceeds the surrounding mask plate surface by a certain height; Figure 6 is a structural schematic diagram of a clamping mechanism in an embodiment of the present application; Figure 7 is a schematic structural diagram of a spring ejector in an embodiment of the present application; Figure 8 is a schematic diagram of an embodiment of the present application in which spring ejectors are arranged on the edges in the first direction and the second direction to limit the position of the substrate; Fig. 9 is a schematic diagram of an embodiment of the present application, in which a coating jig is in an open state when assembling / disassembling a substrate, and the coating jig shown includes a magnet plate assembly; Fig.10 is an exploded view of a magnet plate assembly in an embodiment of the present application, wherein various components of the magnet plate assembly are shown; Note in the figure: 1: mask assembly; 11: mask frame; 111: clearance groove; 12: mask plate; 120: patterned opening area; 121: clearance hole; 2: substrate carrier; 21: hollow area; 22: claw; 220: supporting portion; 221: supporting surface; 23: convex portion; 24: ejector pin hole; 25: pressing mechanism assembly groove; 26: notch; 3: First fastening screw; 4: clamping mechanism; 41: pressing piece; 411: cavity; 412: supporting bottom; 42: first spring; 43: main bolt rod; 431: bolt head; 44: pressing part; 440: extending part; 441: bolt rod insertion hole; 45: auxiliary bolt rod; 451: limiting end; 452: threaded end; 5: spring ejector pin; 51: housing; 511: inner cavity; 512: opening; 52: second spring; 53: ejector pin; 6: magnet plate assembly; 61: back plate; 611: cover plate slot; 612: magnet slot; 62: magnet; 63: cover plate; 7: second fastening screw; 8: connecting piece; 81: first connecting piece; 82: second connecting piece; 9: base plate. DETAILED DESCRIPTION

[0028] The present application will now be described more fully below with reference to the accompanying drawings. However, the present application can be implemented in many different ways. The "embodiments" and "implementations" used herein are exemplary descriptions, which are non-limiting examples of the jigs or devices disclosed herein, so the scope of protection of the present application should not be interpreted as limited to the implementations described herein. As a purpose, providing these implementations herein will make the present application more detailed and complete, and fully convey the scope of the present application to those skilled in the art.

[0029] It should be noted that in this article, when it comes to terms with directional indications such as "upper", "upper side", "lower", "lower side", etc., such terms are only used to explain the relative positional relationship between various elements or structures under a certain posture (such as the placement direction of the fixture shown in the figure). If the specific posture changes, the directional indication will also change accordingly. However, when an element is said to be "on" another element, has a structure, or an element is said to be "on" another element, the term "on" does not necessarily have a directional indication, and can only be used to indicate that there is a connection between the two elements (direct connection, or there may be an intermediate element), or to indicate that the structure is part of the element.

[0030] When referring to the terms "first", "second", etc., although the terms "first", "second", etc. may be used herein to describe various types of elements, these elements should not be limited by these terms. These terms are used to distinguish one element from another element and do not indicate order, importance, or quantity limitation. Therefore, without departing from the teachings of the present disclosure, the first element discussed below may be referred to as the second element.

[0031] When referring to an element having "one end" and "the other end", the terms "one end" and "the other end" may refer to the two ends of an element in a shape such as a strip or a rod in the length direction, or may be used only to distinguish two different parts on the element (whether physical ends or functional distinctions), and should not be limitedly understood to mean that the element must have a similar shape such as a strip or a rod.

[0032] When referring to terms such as "first direction" and "second direction", such terms do not refer to a single direction, but include two opposite directions. "First direction" and "second direction" may be any direction and are not limited to a specific angle or relative relationship unless otherwise specified. For example, see the attached Figure 8 As shown in the figure, the first direction includes not only the direction indicated by the arrow in the figure, but also the opposite direction of the direction indicated by the arrow. In addition, consistent with the "first direction", it should be understood to be the same as or parallel to the "first direction".

[0033] When the terms "annular", "surrounding" and the like are mentioned, the "ring" referred to is not limited to a circular ring, but may also be a rectangular ring, an elliptical ring or other irregularly shaped rings.

[0034] In the present application, "long waist hole" refers to a long hole that is different from a circular hole and a regular polygonal hole, and the length of the hole is significantly greater than its width. The two ends of the "long waist hole" can be semicircular, rectangular or other shapes.

[0035] In the present application, "pattern opening" may refer to a through opening or a graphic area containing several through openings. "Pattern opening" is used to define a deposition area or a shielding area during the coating process. Correspondingly, the "mask" in the present application may represent various types of masks. For example, when the "mask" is a universal mask (CMM) for making a common layer on an OLED display panel, the "pattern opening" represents a through opening. For another example, when the "mask" is a precision mask (FMM) for making pixels on an OLED display panel, the "pattern opening" represents a graphic area containing several pixel openings, while the "longitudinal ribs" and "transverse ribs" represent the portions between adjacent graphic areas, rather than the portions between adjacent pixels.

[0036] In addition, the technical solutions between the various implementation methods of this application can be combined with each other, but it must be based on the fact that ordinary technicians in this field can implement it. When the combination of technical solutions is contradictory or cannot be implemented, it should be considered that such combination of technical solutions does not exist and is not within the scope of protection required by this application. The combination of technical solutions should be based on the premise that it does not exceed the scope disclosed in this application.

[0037] Unless otherwise specified, the same reference numerals refer to the same objects throughout this document.

[0038] In the past, the slots used to hold substrates in coating jigs were usually made larger than the size of the substrates they held, so that the substrates to be processed could be easily placed in the slots and the substrates that had been coated could be easily taken out of the slots. However, defects in products produced by coating jigs of this type frequently occur, resulting in low product yields and increased production costs. For example, most product defects are manifested as shadow defects.

[0039] The applicant further discovered that the gap between the slots for accommodating substrates and the substrates placed therein caused the substrates to move in the slots. In addition, the coating jigs in operation were often in a rotating state in the evaporation equipment, which caused the substrates to frequently move in the coating jigs. This is one of the main reasons for the frequent defects in evaporation products.

[0040] In view of the actual situation of the above-mentioned prior art, considering the various deficiencies in the prior art, and not wishing to be bound by any theory, the first aspect of the present application provides an embodiment of a coating jig, which can at least be used to deposit a functional film layer on the surface of a substrate in a chemical vapor deposition process. The substrates referred to include but are not limited to glass substrates and flexible substrates used to make OLED display panels, and wafers and ceramic substrates used to make chips, etc.

[0041] See attached Figure 1 As shown, the coating fixture provided by the present application includes a substrate carrier 2, a clamping mechanism 4 and a spring ejector 5, wherein: See attached Figure 3 As shown in the figure, the middle part of the substrate carrier 2 is a hollow area 21, and a plurality of claws 22 are arranged around the edge of the hollow area 21. The claws 22 have a supporting portion 220 extending into the hollow area 21, and the supporting portion 220 has a supporting surface 221. The claws 22 are used to support the substrate to be evaporated and processed in the hollow area 21 of the substrate carrier 2, and the supporting surface 221 directly contacts the substrate and applies the support to the substrate. The surrounding arrangement of a plurality of claws 22 allows the edge of the substrate to be uniformly supported, which not only helps to improve the reliability of the substrate support, but also reduces the deformation of the substrate to a certain extent.

[0042] For example, see the attached Figure 3 As shown in FIG. 1 , the hollow area 21 is a window that penetrates the upper and lower surfaces of the substrate carrier 2. It should be understood that the shape of the hollow area 21 is not limited to the following. Figure 3 The rectangular shape shown may also be a circle or other regular or irregular shapes.

[0043] See attached Figure 6As shown in , the pressing mechanism 4 includes a pressing member 41, and the pressing member 41 has a pressing portion 44 extending toward the supporting surface 221 of the claw 22. It should be noted that in different states, the pressing portion 44 can be close to or contact the supporting surface 221, for example: when a substrate is loaded on the claw 22, the pressing portion 44 presses against the surface of the substrate without directly contacting the supporting surface 221; when no substrate is loaded on the claw 22, the pressing portion 44 can directly press against the supporting surface 221.

[0044] See attached Figure 1 As shown in FIG. 1 , a plurality of clamping mechanisms 4 are arranged around the edge of the hollow area 21 and correspond one to one with the claws 22. Figure 3 As shown in FIG. 1 , a clamping mechanism assembly groove 25 is provided at a position corresponding to the supporting claw 22 around the edge of the hollow area 21 of the substrate carrier 2 , and the clamping mechanism 4 is fixedly installed in the corresponding clamping mechanism assembly groove 25 .

[0045] In the embodiment, a clamping mechanism 4 is provided to cooperate with the supporting claw 22 to press the substrate from the other side of the substrate, and the substrate is restricted on the supporting claw 22. The one-to-one arrangement of the clamping mechanism 4 and the supporting claw 22 can ensure that the force-applying position of the pressing portion 44 of the pressing member 41 on the substrate corresponds to the position of the supporting claw 22, so that the same position of the substrate is subjected to the external force applied by the pressing member 41 and the supporting claw 22 at the same time, reducing the situation where the substrate is subjected to force on one side, and thus can reduce the deformation of the substrate surface caused by the substrate being subjected to force on one side.

[0046] See also Figure 1 and Figure 2 As shown in the figure, at least one spring ejector pin 5 is provided, which is provided in the substrate carrier 2 and extends into the hollow area 21 along the direction from the edge of the substrate carrier 2 to the hollow area 21. By providing the spring ejector pin 5 to press against the substrate from the edge of the substrate, the position of the substrate in the hollow area 21 of the substrate carrier 2 is limited in this way, and the substrate is prevented from moving in the hollow area 21.

[0047] In the described embodiment, the supporting claws 22, the clamping mechanism 4 and the spring ejector pin 5 configured in the coating jig work in coordination, and the substrate is not only restricted in the thickness direction of the substrate by the supporting claws 22 and the clamping mechanism 4, but also blocked by the spring ejector pin 5 on the edge of the substrate, thereby effectively suppressing the movement of the substrate in the hollow area 21 of the substrate carrier 2.

[0048] Practice shows that when the coating jig of the present application is used to coat the substrate, even if the coating jig is in motion (for example, rotating) for a long time during operation, the substrate is not easily offset in the hollow area 21 of the substrate carrier 2. Therefore, the coating jig of the present application can reduce the occurrence of product defects, especially reduce the generation of shadow defects and inhibit the expansion of shadow defects, greatly improve product yield, and reduce production costs.

[0049] In a typical embodiment, see the attached Figure 6 As shown in FIG, the pressing mechanism 4 includes a pressing member 41, a first spring 42, a main bolt rod 43 and a secondary bolt rod 45. Among them: The pressing member 41 has a cavity 411 , and the cavity 411 penetrates from one end of the pressing member 41 to the other end of the pressing member 41 along a direction perpendicular to the surface of the substrate carrier 2 .

[0050] The first spring 42 and the main bolt rod 43 are disposed in the cavity 411 . The front end of the main bolt rod 43 extends out of the cavity 411 and engages with the surface of the substrate carrier 2 . The first spring 42 is sleeved on the middle section of the main bolt rod 43 .

[0051] A support bottom 412 is provided in the cavity 411 near the other end of the pressing piece 41 , a bolt head 431 is provided at the rear end of the main bolt rod 43 , and the first spring 42 is restricted between the support bottom 412 of the cavity 411 and the bolt head 431 of the main bolt rod 43 .

[0052] The outer wall of the pressing piece 41 has an outwardly extending protruding portion 440, and the protruding portion 440 has a bolt rod insertion hole 441. The bolt rod insertion hole 441 extends in a direction perpendicular to the surface of the substrate carrier 2 and passes through the protruding portion 440. The auxiliary bolt rod 45 is arranged in the bolt rod insertion hole 441, and the front end of the auxiliary bolt rod 45 is engaged with the surface of the substrate carrier 2.

[0053] The pressing piece 41 is restricted by the first spring 42 and the main bolt rod 43 disposed in the cavity 411 thereof, and can move along the main bolt rod 43 within the telescopic range of the first spring 42. Based on this, the operation steps of loading the substrate can be: i. Lift the pressing piece 41 and separate the pressing portion 44 from the claw 22. At this time, the first spring 42 is squeezed by the bolt head 431 of the main bolt rod 43 and the supporting bottom 412 in the cavity 411 to shrink and store elastic potential energy.

[0054] ii. Place the substrate into the hollow area 21 of the substrate carrier 2 and support it with the claws 22 .

[0055] iii. Release the pressing member 41. At this time, the first spring 42 rebounds to reset the pressing member 41, and the pressing portion 44 of the pressing member 41 presses the substrate onto the supporting surface 221 of the claw 22. The substrate loading is completed.

[0056] Correspondingly, when the operation of taking out the substrate is performed, the pressing piece 41 is lifted in the same manner as in the substrate loading operation step, and after the substrate is successfully taken out, the pressing piece 41 is released to be reset under the action of the first spring 42 .

[0057] In the embodiment, based on the structural design of the clamping mechanism 4, the loading and unloading operations of the substrate can be made very convenient, thereby improving the efficiency of the product coating processing to a certain extent.

[0058] In addition, in the embodiment, the auxiliary bolt 45 is used to limit the movement of the pressing piece 41, so that the pressing piece 41 can only move in the extension direction of the main bolt 43 and the auxiliary bolt 45, and cannot deflect around the main bolt 43. Therefore, by providing the auxiliary bolt 45, the occurrence of the situation where the pressing part 44 is separated from the substrate due to accidental deflection of the pressing piece 41 is eliminated.

[0059] There are many ways to connect the main bolt rod 43, the auxiliary bolt rod 45 and the surface of the substrate carrier 2, including detachable and non-detachable ways, for example, including but not limited to threaded connection or welding.

[0060] Preferably, the main bolt rod 43 is threadedly connected to the surface of the substrate carrier 2, that is, the front end of the main bolt rod 43 has an external thread, and the surface of the substrate carrier 2 has a threaded hole adapted thereto, and the front end of the main bolt rod 43 is screwed into the threaded hole. The degree of compression of the first spring 42 can be changed by adjusting the depth of the front end of the main bolt rod 43 screwed into the threaded hole, thereby adjusting the degree of compression of the pressing portion 44 of the pressing member 41 on the substrate.

[0061] Preferably, the secondary bolt rod 45 is threadedly connected to the surface of the substrate carrier 2. Figure 6 As shown in the figure, the bolt rod insertion hole 441 is an internal threaded hole, and the front end of the auxiliary bolt rod 45 is a threaded end 452 adapted to the internal threaded hole. The rear end of the auxiliary bolt rod 45 has a limiting end 451 with an outer diameter greater than the inner diameter of the bolt rod insertion hole 441.

[0062] The bolt rod insertion hole 441 is an internal threaded hole, and the sub-bolt rod 45 has a limiting end 451 and a threaded end 452, which are used to limit the sub-bolt rod 45 and the pressing member 41 so that they cannot be easily separated from each other. For example, when performing the operation of lifting the pressing member 41, the limiting end 451 at the rear end of the sub-bolt rod 45 can limit the lifting stroke of the pressing member 41, so as to avoid the extension 440 of the pressing member 41 from being separated from the sub-bolt rod 45 due to the erroneous operation of over-lifting the pressing member 41. For another example, when the front end of the sub-bolt rod 45 is disconnected from the substrate carrier 2 due to erroneous operation, the threaded end 452 of the sub-bolt rod 45 is still restricted by the internal thread of the bolt rod insertion hole 441 and will not be easily separated from the extension 440 of the pressing member 41.

[0063] In addition, the bolt rod insertion hole 441 can also be a smooth hole.

[0064] In an embodiment different from the above-mentioned embodiment, the clamping mechanism 4 does not include the auxiliary bolt rod 45 and the bolt rod insertion hole 441 matched therewith, and only relies on the first spring 42 and the main bolt rod 43 to restrict the pressing member 41. Compared with the above-mentioned embodiment, other structures in the clamping mechanism 4 remain unchanged.

[0065] In a typical embodiment, the spring ejector pin 5 is parallel to the support surface 221 of the claw 22 and has the same height, so that the spring ejector pin 5 can reliably resist the edge of the substrate supported by the support surface 221 of the claw 22, thereby preventing the spring ejector pin 5 from losing its blocking effect on the substrate. It should be pointed out that the parallel includes substantially parallel, that is, the extension direction of the spring ejector pin 5 is roughly parallel to the support surface 221 within the allowable deviation range, and the deviation range is preferably 0° to 5°. Similarly, the height consistency includes being roughly the same height, that is, the spring ejector pin 5 and the support surface 221 are roughly at the same height position in the thickness direction of the substrate carrier 2, and the allowable deviation should not cause the spring ejector pin 5 to fail to contact the side of the substrate.

[0066] Preferably, the coating jig includes at least one spring pin 5 arranged along a first direction, and at least one spring pin 5 arranged along a second direction, and the first direction and the second direction intersect at a certain angle in a plane.

[0067] In the embodiment, by arranging spring pins 5 in two intersecting directions respectively, the movement of the substrate 9 can be restricted from multiple directions, thereby further reducing the possibility of the substrate shifting in the hollow area 21 of the substrate carrier 2 and improving the yield of the coated product.

[0068] For further information, see Appendix Figure 8 As shown in , when the substrate 9 is rectangular, the spring ejector pins 5 in the first direction and the spring ejector pins 5 in the second direction are respectively perpendicular to one side of any group of adjacent sides of the substrate 9, and the first direction and the second direction are perpendicular to each other.

[0069] Furthermore, two spring ejector pins 5 facing each other may be provided in the first direction, and the two spring ejector pins 5 facing each other are respectively arranged on both sides of the substrate along the first direction; and two spring ejector pins 5 facing each other are provided in the second direction, and are respectively arranged on both sides of the substrate along the second direction. Alternatively, such provision may be made only in the first direction or the second direction.

[0070] In addition, when the substrate is circular or in other shapes, the intersection angle between the first direction and the second direction can be arbitrarily selected within the angle range of (0°, 90°].

[0071] In a typical embodiment, the length of the spring ejector 5 extending into the hollow area 21 can be adjusted. By adjusting the length of the spring ejector 5 extending into the hollow area 21 of the substrate carrier 2, the blocking force of the spring ejector 5 on the substrate can be changed. Under a suitable blocking force, it is helpful to further reduce the possibility of the substrate deflecting in the hollow area 21 of the substrate carrier 2, thereby improving the yield rate of the coating product.

[0072] Preferably, see the attached Figure 3 As shown, the substrate carrier 2 is provided with an ejector hole 24, which is an internal threaded hole (the internal thread in the ejector hole is not shown in the figure), and the outer surface of the spring ejector 5 has an external thread (not shown in the figure) adapted to the ejector hole 24, and the spring ejector 5 is threadedly connected in the ejector hole 24. When it is necessary to adjust the length of the spring ejector 5 extending into the hollow area 21 of the substrate carrier 2, the length of the spring ejector 5 extending into the hollow area 21 of the substrate carrier 2 can be adjusted by rotating the spring ejector 5 forward or reversely, which is more convenient in operation.

[0073] Specifically, the ejector pin hole 24 extends from the outer edge of the substrate carrier 2 to the inner edge of the hollow area 21. Figure 3 As shown, a convex portion 23 is provided on the lower side of the substrate carrier 2 , and a pinhole 24 is partially provided on the convex portion 23 to ensure that the pinhole 24 and the supporting surface 221 of the claw 22 are at the same height in the thickness direction of the substrate carrier 2 .

[0074] In addition, the ejector hole 24 can also be a smooth hole. The spring ejector 5 is embedded in the ejector hole 24. The embedding depth is predetermined according to the length requirement of the spring ejector 5 extending into the hollow area 21 of the substrate carrier 2. When the length requirement changes, the length of the spring ejector 5 extending into the hollow area 21 of the substrate carrier 2 can be changed by re-embedding.

[0075] In one embodiment, see the attached Figure 7 As shown in , the spring ejector 5 includes a housing 51, a second spring 52 and an ejector 53. The housing 51 has an inner cavity 511. The front end of the housing 51 has an opening 512 connected to the inner cavity 511. The second spring 52 and the ejector 53 are arranged in the inner cavity 511. The front end of the ejector 53 extends out of the opening 512. The second spring 52 is compressed between the rear end of the ejector 53 and the rear end of the inner cavity 511. The second spring 52 is provided so that the ejector 53 is flexible in blocking the edge of the substrate, which can avoid the adverse effects that may be caused by the use of rigid blocking, such as deformation or damage to the edge of the substrate.

[0076] In one embodiment, see the attached Figure 3As shown in FIG, a plurality of notches 26 are provided at the edge of the hollow area 21, and the notches 26 are respectively arranged at two opposite sides of the hollow area 21. During the process of loading and unloading the substrate, the notches 26 provided at the edge of the hollow area 21 can provide sufficient operating space for a grasping machine or a human hand, making the loading and unloading operation of the substrate more convenient and safe.

[0077] In one embodiment, see the attached Figure 1 and attached Figure 2 As shown in , the coating fixture further includes a mask assembly 1, and the mask assembly 1 includes a mask frame 11 and a mask plate 12. Wherein: The mask frame 11 is annular in shape, and the mask plate 12 is joined to one side of the mask frame 11 and covers the annular region of the mask frame 11 .

[0078] The middle portion of the mask plate 12 is a patterned opening area 120 . The patterned opening area 120 has a pattern opening therein. A plurality of clearance holes 121 are disposed around the periphery of the patterned opening area 120 .

[0079] The mask assembly 1 is joined to one side of the substrate carrier 2, and the side with the mask plate 12 faces the substrate carrier 2, and the mask plate 12 covers the hollow area 21 in the middle of the substrate carrier 2. Figure 1 and attached Figure 2 As shown in FIG, the mask assembly 1 and the substrate carrier 2 are detachably connected via a plurality of first fastening screws 3 to facilitate assembly and disassembly.

[0080] The clearance holes 121 of the mask plate 12 correspond one-to-one with the supporting claws 22 of the substrate carrier 2. The supporting claws 22 extend from one side of the mask plate 12 through the corresponding clearance holes 121 to the other side of the mask plate 12. The supporting surface 221 of the supporting claws 22 is flush with the surface of the mask plate 12 facing the substrate carrier 2.

[0081] In the embodiment, by setting a clearance hole 121 at the corresponding position of the mask plate 12, the claws 22 of the substrate carrier 2 are avoided, so that the mask plate 12 can be unrestrictedly close to or attached to the substrate supported by the claws 22. Based on this design, it is helpful to obtain an ideal state of attachment between the mask plate 12 and the substrate, and improve the coating accuracy.

[0082] It should be noted that, given that the mask plate 12 may have a certain amount of droop in a natural state, its surface may be a curved surface rather than a flat surface. Therefore, when the mask plate 12 droops and its surface is curved, the surface of the mask plate 12 that is flush with the support surface 221 can be understood as the local portion of the surface located around the claws 22.

[0083] In addition, it should be pointed out that the said leveling includes being approximately leveling, that is, the support surface 221 and the surface of the mask plate 12 are approximately in the same plane, and the allowable deviation range is preferably 0 to 300 μm.

[0084] For example, the ideal situation is, see Appendix Figure 4 As shown in , the supporting surface 221 of the claw 22 is absolutely flush with the surface of the mask plate 12 facing the substrate carrier 2 . At this time, the substrate 9 loaded in the substrate carrier 2 is supported by the supporting surface 221 of the claw 22 and the mask plate 12 .

[0085] For example, see Appendix Figure 5 As shown in the figure, the supporting surface 221 of the claw 22 is higher than the upper surface of the mask plate 12. Preferably, the vertical distance between the supporting surface 221 and the upper surface of the mask plate 12 (or the local part of the surface located around the claw 22) is not more than 300 μm. At this time, the substrate 9 loaded in the substrate carrier 2 is mainly supported by the supporting surface 221 of the claw 22.

[0086] In addition, see Appendix Figure 2 As shown in , the mask frame 11 is provided with a clearance groove 111 , and the clearance groove 111 is matched with the protrusion 23 on the substrate carrier 2 to avoid the installation space of the protrusion 23 .

[0087] In one embodiment, see the attached Fig. 9 As shown in , the coating fixture further includes a magnet plate assembly 6 , which is detachably connected to a side of the substrate carrier 2 away from the mask assembly 1 and covers the hollow area 21 of the substrate carrier 2 .

[0088] In the embodiment, by further adding a magnet plate assembly 6 and applying magnetic attraction to the mask plate 12 with the help of the magnet plate assembly 6, the sagging of the mask plate 12 can be reduced or even eliminated, so that the mask plate 12 can be fully and flatly attached to the surface of the substrate 9, achieving an ideal state of adhesion between the mask plate 12 and the substrate 9, and the film layer obtained by coating has higher precision.

[0089] For further information, see Appendix Fig.10 As shown in the figure, the magnet plate assembly 6 includes a back plate 61, a plurality of magnets 62 and a cover plate 63. A cover plate groove 611 is provided on the surface of the back plate 61 on one side away from the mask assembly 1. A plurality of magnet grooves 612 are distributed in an array at the bottom of the cover plate groove 611. The magnets 62 are arranged in the magnet grooves 612 one by one. The cover plate 63 covers and is fixed in the cover plate groove 611 so as to encapsulate the magnet 62 in the magnet groove 612 at the bottom of the cover plate groove 611.

[0090] Preferably, see the attached Fig. 9As shown in , the magnet plate assembly 6 is detachably connected to the substrate carrier 2 by a plurality of second fastening screws 7. When loading and unloading the substrate 9, the magnet plate assembly 6 can be easily removed from the substrate carrier 2, which can improve the loading and unloading efficiency of the substrate 9 to a certain extent.

[0091] In one embodiment, see the attached Figure 1 and attached Figure 2 As shown in , the coating jig also includes a connector 8, which is used to connect to a connection part in a coating device (for example, a vapor deposition machine for making an OLED display panel). Further, the connector 8 includes a plurality of first connectors 81 and a plurality of second connectors 82. Preferably, the first connector 81 is a plug connector, and the second connector 82 is a column with a screw hole. By using the two connectors together, the installation efficiency can be improved while taking into account the reliability of the installation.

[0092] A second aspect of the present application provides an embodiment of a coating device, wherein the coating device is configured with the coating jig described in the aforementioned embodiment.

[0093] The above is only a specific implementation of the embodiment of the present application, but the protection scope of the embodiment of the present application is not limited thereto. Any technician familiar with the technical field can easily think of changes or replacements within the technical scope disclosed in the embodiment of the present application, which should be included in the protection scope of the embodiment of the present application. Therefore, the protection scope of the embodiment of the present application shall be based on the protection scope of the claims.

Claims

1. A coating fixture, characterized in that: include: A substrate carrier, wherein the middle part is a hollow area, a plurality of supporting claws are arranged around the edge of the hollow area, the supporting claws have a supporting portion extending into the hollow area, and the supporting portion has a supporting surface; and The clamping mechanism comprises a pressing piece, wherein the pressing piece has a pressing portion extending toward the supporting surface of the claw, A plurality of clamping mechanisms are arranged around the edge of the hollow area and correspond one to one with the claws; and The spring ejector pin is at least one spring ejector pin disposed in the substrate carrier and extending from the edge of the substrate carrier to the hollow area into the hollow area.

2. The coating fixture according to claim 1, characterized in that: The clamping mechanism also includes a first spring and a main bolt rod. The pressing piece has a cavity, and the cavity runs from one end of the pressing piece to the other end of the pressing piece along a direction perpendicular to the surface of the substrate carrier. The first spring and the main bolt rod are arranged in the cavity, the front end of the main bolt rod extends out of the cavity and engages with the surface of the substrate carrier, and the first spring is sleeved on the middle section of the main bolt rod. A support bottom is provided in the cavity near the other end of the pressing piece, a bolt head is provided at the rear end of the main bolt rod, and the first spring is limited between the support bottom of the cavity and the bolt head of the main bolt rod.

3. The coating fixture according to claim 2, characterized in that: The clamping mechanism also includes a secondary bolt rod, The outer wall of the pressing piece is provided with an outwardly extending protruding portion, the protruding portion is provided with a bolt rod insertion hole, the bolt rod insertion hole extends in a direction perpendicular to the surface of the substrate carrier and passes through the protruding portion, The auxiliary bolt rod is arranged in the bolt rod insertion hole, and the front end of the auxiliary bolt rod is engaged with the surface of the substrate carrier.

4. The coating fixture according to claim 1, characterized in that: The spring ejector pin is parallel to the supporting surface of the supporting claw and has the same height.

5. The coating jig according to claim 1, characterized in that: At least one spring ejector pin is arranged along a first direction, and At least one spring ejector pin is arranged along the second direction, The first direction and the second direction intersect at a certain angle within the plane.

6. The coating fixture according to claim 1, characterized in that: The spring ejector pin can be extended into the hollow area in an adjustable manner.

7. The coating fixture according to claim 1, characterized in that: The edge of the hollow area is provided with a plurality of notches, and the notches are respectively arranged on two opposite sides of the hollow area.

8. The coating fixture according to claim 1, characterized in that: The invention also includes a mask assembly, which includes a mask frame and a mask plate. The mask frame is annular, and the mask plate is joined to one side of the mask frame and covers the annular area of ​​the mask frame. The middle part of the mask plate is a patterned opening area, and a plurality of clearance holes are arranged around the periphery of the patterned opening area; The mask assembly is joined to one side of the substrate carrier, and the side with the mask plate faces the substrate carrier, and the mask plate covers the hollow area in the middle of the substrate carrier. The clearance holes correspond one to one with the supporting claws of the substrate carrier, The supporting claws extend from one side of the mask plate through the corresponding clearance holes to the other side of the mask plate, and the supporting surface of the supporting claws is flush with the surface of the mask plate facing the substrate carrier.

9. The coating fixture according to claim 8, characterized in that: The invention also comprises a magnet plate assembly, which is detachably connected to a side of the substrate carrier away from the mask assembly and covers the hollow area of ​​the substrate carrier.

10. A coating device, characterized in that: It comprises a coating jig as described in any one of claims 1 to 9.

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