Silicon wafer battery drying equipment capable of detecting size

Abstract

The invention relates to the technical field of silicon wafer drying, and discloses silicon wafer battery drying equipment capable of conducting size detection.The silicon wafer battery drying equipment comprises a rack and a drying chamber, the drying chamber comprises a drying cylinder, a rotating cylinder, a placement base and a silicon wafer basket, gas is introduced into the drying cylinder, and the rotating cylinder is arranged in the drying cylinder; the placing seat is fixed on the inner wall of the rotating cylinder and is provided with a placing groove; a plurality of groups of inclined cavity channels are formed in the placing seat, and an acute angle is formed between a connecting line of two ends of each cavity channel and the side wall of the adjacent placing groove; the silicon wafer basket is arranged in the placement groove, a sliding groove communicated with the cavity channel is formed in the side wall of the silicon wafer basket, pushing surfaces are arranged at the two ends of the sliding groove, and the sliding groove and the cavity channel jointly form a clamping channel; when the clamping ball abuts against the side, close to the containing groove, of the sliding groove, the clamping ball is partially embedded into the cavity channel, and the center of the clamping ball is located in the sliding groove. The silicon wafer drying device has the effect of improving the space utilization rate of the drying area while improving the silicon wafer drying efficiency.

Description

Technical Field

[0001] The present application relates to the technical field of silicon wafer drying, and in particular to a silicon wafer battery drying device capable of performing size detection. Background Art

[0002] Silicon wafer cells are solar cells that use silicon wafers as the main base material and are made through multiple processes such as cutting, cleaning, texturing, diffusion, coating, and printing. They can convert light energy into electrical energy.

[0003] During the silicon wafer cleaning process, an aqueous solution is used, which causes residual moisture on the surface of the silicon wafer. The drying process is crucial because it can completely remove moisture and prevent it from contaminating the silicon wafer or affecting the performance of the battery in subsequent processes. If there is moisture or water stains on the surface of the silicon wafer, the photoelectric conversion efficiency of the battery will decrease, so the drying effect is directly related to the conversion efficiency of the battery.

[0004] At present, silicon wafer battery drying mainly relies on drying furnaces, drying boxes and drying rooms. The principle is to heat the air through the heater, and the hot air is blown to the surface of the silicon wafer through the hot air outlet to promote the evaporation of moisture. The dehumidification equipment will also recycle the treated air and remove water and dry it, and then introduce the low-humidity air into the drying room to improve the drying effect.

[0005] Silicon wafer batteries are usually placed in a silicon wafer basket, which is carried into the drying room by the basket during drying. Traditional drying equipment is mostly trough-type drying. The specific process is to load the silicon wafers on the basket, put the basket into the drying trough with a robot, use hot air to dry the basket and silicon wafers, and then take them out with a robot after drying. However, this method of carrying the basket with a robot has the problem of small amount of silicon wafers dried at one time and low drying efficiency. Summary of the invention

[0006] In order to improve the efficiency of drying silicon wafers while improving the space utilization of the drying area, the present application provides a silicon wafer battery drying equipment that can perform size detection.

[0007] The present application provides a silicon wafer battery drying device capable of size detection, which adopts the following technical solution:

[0008] A silicon wafer battery drying device capable of performing size detection comprises a drying chamber, wherein the drying chamber comprises a drying cylinder, a rotating cylinder, a placement seat, a silicon wafer basket and a heating shunt assembly, wherein:

[0009] The rotating cylinder is arranged inside the drying cylinder and gas is introduced into the rotating cylinder;

[0010] The placement seat is fixed to the rotating drum, and a placement groove extending along the axial direction is provided on one side of the placement seat close to the axis of the rotating drum;

[0011] The placement seat is provided with a cavity, the silicon wafer basket is slidably arranged in the placement groove, the side wall of the silicon wafer basket is provided with a slide groove connected with the cavity, the slide groove is provided with a pushing surface, and the slide groove and the cavity together form a clamping channel;

[0012] A clamping ball is arranged in the clamping channel. When the clamping ball abuts against a side of the slide groove close to the placement groove, the clamping ball is partially embedded in the cavity and the ball center is located in the slide groove.

[0013] Optionally, the heating and diverting assembly comprises a heating portion and a diverting portion, wherein:

[0014] Gas is introduced into the heating part;

[0015] The diversion part is arranged at the axis of the rotating cylinder and is communicated with the heating part. The air outlet of the diversion part is close to the position of the silicon wafer basket.

[0016] Optionally, the heating unit includes a heat conducting plate, a sealing plate and a heating element, wherein:

[0017] There are at least two heat conducting plates;

[0018] The sealing plate, the placement seat and the wall of the rotating cylinder together form a heating chamber;

[0019] The heating element is in contact with the heat conducting plate.

[0020] Optionally, the flow dividing portion includes a flow dividing cylinder and a flow dividing plate, wherein:

[0021] A plurality of first diversion holes close to the silicon wafer basket are arranged on the wall of the diversion cylinder;

[0022] The flow dividing plate is disposed on the inner wall of the flow dividing plate, and a plurality of second flow dividing holes connected to the heating part are arranged on the flow dividing plate, and a plurality of second flow dividing holes are distributed circumferentially along the axis direction of the flow dividing cylinder, and form a plurality of flow dividing areas with the flow dividing cylinder;

[0023] A plurality of guide plates are arranged inside the diversion area.

[0024] Optionally, the wall of the drying cylinder includes an inner wall and an outer wall, a gas flow channel is formed between the inner wall and the outer wall, and a water pipe is connected to the outer wall.

[0025] Optionally, a water leakage hole penetrating the wall of the rotating cylinder is provided on one side of the groove wall of the placement groove away from the axis of the rotating cylinder, and a wiper strip is provided on the outer wall of the rotating cylinder.

[0026] Optionally, a plurality of drying chambers are arranged in parallel along the axial direction of the rotating drum to form an integral drying chamber, and the rotating drum between two adjacent drying chambers is driven by a connecting portion.

[0027] Optionally, a blocking bar is provided between the placement seat and the rotating cylinder, a temporary storage cavity is formed between the placement seat, the blocking bar and the rotating cylinder, a blocking plate is provided inside the temporary storage cavity, and a notch communicating with the temporary storage cavity is provided on one side of the blocking bar close to the placement seat.

[0028] Optionally, a first locking block with a locking opening is provided at the end of the silicon wafer basket, and a conveying assembly is provided near the end of the drying chamber, the conveying assembly includes a conveying platform and a sliding block, wherein:

[0029] The sliding block slides back and forth on the conveying table along the axis direction of the drying chamber;

[0030] The sliding block is provided with a second locking block, and the second locking block is provided with a rotating locking head which is plugged and matched with the locking opening.

[0031] Optionally, an openable and closable sealed door is provided at the end of the drying chamber, and the sealed door includes a fixed plate and a movable plate, wherein:

[0032] The fixed plate is installed on the drying drum;

[0033] The movable plate is arranged on the fixed plate;

[0034] A visual camera for detecting the size of silicon wafers is provided on the fixed plate.

[0035] In summary, the present application includes at least one of the following beneficial technical effects:

[0036] 1. While pushing the silicon wafer basket into the drying chamber through the conveying component, the dried silicon wafer basket can be pushed out to achieve simultaneous operation and reduce the waiting time of silicon wafers during the drying process. In addition, the silicon wafer basket is placed in the placement tank to drain water, which reduces the accumulation of water on the silicon wafers and the water vapor inside the drying chamber. With the rotation of the rotating drum and the heating and diversion of the gas by the heating diversion component, the hot air flow can fully contact the silicon wafers. The air flow and the heating environment work together to quickly dry the silicon wafers, which greatly improves the overall drying efficiency.

[0037] 2. When the silicon wafer basket is placed inside the placement groove, the cavity of the placement groove, the groove wall of the slide groove and the clamping ball cooperate with each other, and the silicon wafer basket can be clamped during the rotation of the rotating drum to prevent the silicon wafer basket from escaping from the placement groove due to rotation, thereby improving the stability of the silicon wafer basket during rotation, ensuring the smooth progress of the silicon wafer drying process, and avoiding damage to the silicon wafer or uneven drying due to the instability of the basket;

[0038] 3. The baffle plate inside the temporary storage cavity guides the water to facilitate its discharge. The scraper strip pushes the water inside the drying drum to the position close to the two ends of the water pipe to improve the drainage efficiency. It can also scrape the residual water onto the inner wall of the drying drum to facilitate rapid evaporation by airflow. The water vapor is discharged through the water guide hole, so that the drying chamber can be quickly in a dry state, further improving the drying effect and reducing energy waste. BRIEF DESCRIPTION OF THE DRAWINGS

[0039] Figure 1 It is a schematic diagram of the overall structure of an embodiment of the present application.

[0040] Figure 2 It is a schematic diagram of a single drying chamber structure in an embodiment of the present application.

[0041] Figure 3 It is a schematic diagram of the drying drum structure in the embodiment of the present application.

[0042] Figure 4 It is a schematic diagram showing the position of the blocking bar in the embodiment of the present application.

[0043] Figure 5 It is a schematic diagram of the rotating drum structure in the embodiment of the present application.

[0044] Figure 6 It is a schematic diagram of the structure of the heating shunt component in the embodiment of the present application.

[0045] Figure 7 It is the position of the clamping beads when the silicon wafer flower basket is just placed in the placement groove in the embodiment of the present application.

[0046] Figure 8 It is the position of the clamping beads when the silicon wafer basket rotates to the highest position in the embodiment of the present application.

[0047] Fig. 9 It is a schematic diagram of the silicon wafer flower basket structure in the embodiment of the present application.

[0048] Fig.10 It is a schematic diagram showing the positional relationship between the silicon wafer basket and the slide slot in the embodiment of the present application.

[0049] Fig.11 It is a schematic diagram of the structure of the clamping portion in the embodiment of the present application.

[0050] Fig.12 yes Figure 1 Enlarged schematic diagram of part A.

[0051] Description of reference numerals:

[0052] 1. Frame; 2. Drying chamber; 21. Drying cylinder; 211. Outer cylinder wall; 212. Inner cylinder wall; 213. Plug-in slot; 22. Rotating cylinder; 221. Ventilation port; 23. Placement seat; 231. Placement slot; 232. Leakage hole; 233. Cavity; 234. Snap-in ball; 24. Wafer basket; 241. Slide; 242. Push surface; 243. First locking block; 244. Protrusion; 245. Groove; 25. Blocking strip; 251. Notch; 252. Snap-in slot; 26. Wiper strip; 27. Water guide pipe; 28. Blocking plate; 3. Conveying assembly; 31. Conveyor platform; 32. Sliding block; 33. Ball screw linear module; 34. Rotary locking head; 35. Second locking block; 4. Sealing door; 41. Fixed plate; 42. Movable plate; 5. Connecting part; 51. Connecting ring; 52. Snap-in strip; 53. Plug-in ring; 6. Heating shunt assembly; 61. Heating part; 611. Heat conducting plate; 612. Sealing plate; 613. Heating element; 614. Connecting pipe; 62. shunt part; 621. shunt cylinder; 622. shunt plate; 623. Guide plate; 7. Support frame; 71. Support block; 72. Rotating shaft; 73. Rotating wheel; 74. Motor. DETAILED DESCRIPTION

[0053] The following is combined with Figure 1-Figure 12 This application is described in further detail.

[0054] The embodiment of the present application discloses a silicon wafer battery drying device capable of performing size detection.

[0055] A silicon wafer battery drying device capable of size detection comprises a frame 1, a drying chamber 2 and a conveying assembly 3. The drying chamber 2 is mounted on the frame 1, and multiple drying chambers 2 are arranged in parallel along the central axis direction of the drying chamber 2. The multiple drying chambers 2 form a drying whole chamber, and both ends of the drying whole chamber are provided with openable and closable sealing doors 4, and the sealing doors 4 are provided with visual cameras. Two conveying assemblies 3 are provided, and the two conveying assemblies 3 are respectively located near the input end and the output end of the drying whole chamber.

[0056] The washed silicon wafers are placed in a silicon wafer basket 24, which is then placed on a conveying assembly 3 by a robotic arm. The silicon wafer basket 24 is then conveyed to the drying chamber 2 by the conveying assembly 3. In the process of conveying the silicon wafer basket 24 to the drying chamber 2, the size of the silicon wafers is photographed by a visual camera on the sealing door 4 and uploaded to the system. The size of the batch of silicon wafers is analyzed by the system, so as to control parameters such as the drying time and temperature according to the size of the silicon wafers, thereby further improving the efficiency of drying the silicon wafers.

[0057] When the silicon wafer basket 24 is pushed into the drying chamber 2 by the conveying assembly 3, the silicon wafer basket 24 on the conveying assembly 3 contacts the end of the silicon wafer basket 24 inside the drying chamber 2 and pushes the silicon wafer basket 24 inside the drying chamber 2 to move, thereby pushing the dried silicon wafers and the silicon wafer basket 24 out of the drying chamber 2, and the silicon wafer basket 24 enters and is removed from the drying chamber 2 simultaneously, thereby reducing the opening time of the sealing door 4, reducing the possibility of a large amount of heat inside the drying chamber 2 escaping from the drying chamber 2, and saving energy damage to the heating gas.

[0058] When the silicon wafers in the silicon wafer basket 24 are dried, the sealing door 4 is closed to reduce the possibility of a large amount of heat leakage inside the drying chamber 2, thereby saving energy consumption.

[0059] The drying chamber 2 includes a drying cylinder 21, a rotating cylinder 22, a placement seat 23 and a silicon wafer basket 24. Dry gas is introduced into the drying cylinder 21. The rotating cylinder 22 is coaxially installed inside the drying cylinder 21. The rotating cylinder 22 can intermittently rotate around its own axis. A connecting portion 5 is provided between two adjacent rotating cylinders 22, and the connection portion 5 is used for transmission. The connecting portion 5 is rotated in coordination with the drying cylinder 21, and the rotating cylinder 22 is installed inside the drying cylinder 21 through the connecting portion 5. When the rotating cylinder 22 stops rotating, the placement seat 23 is just at the lowest position, so that the silicon wafer basket 24 can be pushed into the placement seat 23, and the silicon wafer basket 24, which is also at a low position in the drying chamber 2, can be pushed out of the drying chamber 2.

[0060] The placement seat 23 is fixedly mounted on the inner wall of the rotating cylinder 22, and multiple placement seats 23 are evenly distributed along the axial direction of the rotating cylinder 22. In the embodiment of the present application, three placement seats 23 are provided. A placement groove 231 is provided on one side of the placement seat 23 close to the axis of the rotating cylinder 22 along the axis of the rotating cylinder 22, and the placement groove 231 runs through both ends of the placement seat 23. The silicon wafer basket 24 is placed inside the placement groove 231, and slides with the placement groove 231 along the axis of the rotating cylinder 22.

[0061] The placement seat 23 is provided with multiple groups of cavities 233 along the axis direction of the rotating cylinder 22. In the embodiment of the present application, there are five groups of cavities 233. Each group of cavities 233 includes two cavities 233, and the two cavities 233 are respectively located on the groove walls on the opposite sides of the placement groove 231. The connecting line between the two ends of each cavity 233 and the side wall of the adjacent placement groove 231 is set at an acute angle. In the embodiment of the present application, each cavity 233 is set in an arc shape.

[0062] The silicon wafer basket 24 is placed inside the placement groove 231 and slides with the placement groove 231 along the axial direction of the rotating cylinder 22. A slide groove 241 is provided on one side of the silicon wafer basket 24 close to the side wall of the placement groove 231 along the axial direction of the rotating cylinder 22. Push surfaces 242 are provided at both ends of the slide groove 241. The push surfaces 242 are arranged in an inclined surface. The slide groove 241 is connected with the cavity 233 and forms a clamping channel with the cavity 233 as a whole.

[0063] A locking ball 234 is provided inside the locking channel, and the locking ball 234 can roll inside the locking channel. When the locking ball 234 contacts the side of the slide groove 241 close to the placement groove 231, part of the locking ball 234 is located inside the cavity 233, and the center of the locking ball 234 is located inside the slide groove 241.

[0064] When the rotating cylinder 22 drives the placement seat 23 to rotate, the locking channel is gradually tilted and locked, and the locking ball 234 moves inside the inclined locking channel until it is inside the slide groove 241, completing the locking of the silicon wafer basket 24 by the placement seat 23. During the rotation of the rotating cylinder 22, the silicon wafer basket 24 is gradually locked through the different tilt angles of the placement seat 23, without the need for additional control devices, thereby improving the convenience of locking the silicon wafer basket 24.

[0065] The conveying assembly 3 includes a conveying platform 31 and a sliding block 32. The conveying platform 31 is fixedly installed at a position close to the drying chamber 2, the sliding block 32 is located above the conveying platform 31, and slides with the conveying platform 31 along the axial direction of the rotating cylinder 22. A ball screw linear module 33 is provided on the conveying platform 31, and the sliding block 32 moves on the conveying platform 31 through the ball screw linear module 33.

[0066] In order to facilitate the movement of the silicon wafer basket 24, first locking blocks 243 are provided on the sides of the two ends of the silicon wafer basket 24 that are away from each other. When the silicon wafer basket 24 is inside the drying chamber 2, the first locking blocks 243 of two adjacent silicon wafer baskets 24 abut against each other, thereby completing the positioning of the silicon wafer basket 24.

[0067] The first locking block 243 is provided with a locking opening, the sliding block 32 is provided with a second locking block 35, and the second locking block 35 is provided with a rotating locking head 34 that is plugged and matched with the locking opening. In the embodiment of the present application, an arc groove is provided on the inner wall of the locking opening.

[0068] A groove 245 is formed on the top of the first locking block 243 , and both ends of the silicon wafer basket 24 are formed on the protrusions 244 . When the first locking blocks 243 are installed at both ends of the silicon wafer basket 24 , the protrusions 244 are inserted into the grooves 245 for positioning.

[0069] When it is necessary to dry the washed silicon wafers, the silicon wafer basket 24 loaded with silicon wafers is placed on the conveying platform 31 by the mechanical arm, and the length direction of the silicon wafer basket 24 is consistent with the axis direction of the rotating cylinder 22, and then the sliding block 32 is moved toward the direction close to the silicon wafer basket 24 by the ball screw linear module 33, and the rotary locking head 34 is inserted into the locking port, and then the rotary locking head 34 is rotated so that the rotary locking head 34 is placed in the arc groove inside the locking port, and the rotary locking head 34 is limited by the inner wall of the arc groove, so as to facilitate the process of pushing the silicon wafer basket 24 into the drying chamber 2 or pulling the silicon wafer basket 24 out of the drying chamber 2. While pushing the silicon wafer basket 24 into the drying chamber 2, the original silicon wafer basket 24 in the drying chamber 2 is pushed out, thereby reducing the resistance of pushing the silicon wafer basket 24 into the drying chamber 2 and reducing the possibility of the silicon wafer basket 24 being damaged by excessive extrusion during operation.

[0070] In the process of pushing the silicon wafer basket 24 into the drying chamber 2, the locking blocks on the silicon wafer basket 24 on the conveying table 31 and the locking blocks on the silicon wafer basket 24 in the drying chamber 2 contact each other, and thereby gradually squeeze the silicon wafer basket 24 in the drying chamber 2 onto the conveying table 31, thereby realizing the simultaneous operation of conveying the silicon wafer basket 24 into the drying chamber 2 and pushing the silicon wafer basket 24 out of the drying chamber 2.

[0071] After the silicon wafer basket 24 is pushed into the placement groove 231, the silicon wafer basket 24 is left to stand for a period of time. In the embodiment of the present application, the silicon wafers in the silicon wafer basket 24 are drained to reduce water accumulation on the silicon wafers, reduce the water vapor inside the drying chamber 2 when drying the silicon wafers, and improve the drying efficiency.

[0072] Blocking bars 25 are installed between the two ends of the placement seat 23 and the rotating drum 22, and a temporary storage cavity is formed between the placement seat 23, the blocking bar 25 and the inner wall of the rotating drum 22. A plurality of water leakage holes 232 are provided on the side of the groove wall of the placement groove 231 away from the rotating drum 22, and penetrate the rotating drum 22. A wiper strip 26 is provided on the outer wall of the rotating drum 22, and the outer drum wall 211 of the drying drum 21 is connected to the water guide pipe 27.

[0073] Blocking bars 25 are provided between the two ends of the placement seat 23 and the rotating cylinder 22, and a temporary storage cavity is formed between the placement seat 23, the blocking bar 25 and the rotating cylinder 22. A blocking plate 28 is provided inside the temporary storage cavity. The side of the blocking bar 25 close to the axis of the rotating cylinder 22 is flush with the side of the placement groove 231 away from the axis of the rotating cylinder 22, and a notch 251 connected to the temporary storage cavity is provided on the side of the blocking bar 25 close to the placement seat 23.

[0074] The water drained from the silicon wafers in the silicon wafer basket 24 flows into the temporary storage cavity from the water leakage hole 232, flows into the wall of the drying cylinder 21 through the inner wall of the rotating cylinder 22, and is discharged from the water guide pipe 27. The water guide pipe 27 is located near the two ends of the drying cylinder 21, and the wiper strip 26 is close to the inner wall of the drying cylinder 21. When the rotating cylinder 22 rotates, the wiper strip 26 pushes the water gathered inside the drying cylinder 21 to the position close to the two ends of the water guide pipe 27, thereby improving the efficiency of water discharge. The side wall of the wiper strip 26 is provided with an arc surface, so as to quickly discharge the water to the two ends of the drying cylinder 21 and quickly discharge the water.

[0075] At the same time, the wiper strip 26 scrapes the remaining water onto the inner wall of the drying cylinder 21, so that the water vapor inside the drying cylinder 21 can be quickly evaporated by the airflow, and the water vapor is also discharged through the water guide holes, thereby quickly making the drying chamber 2 dry.

[0076] When the rotating drum 22 rotates, the water inside the temporary storage cavity may not be discharged from the leakage hole 232 in time, and some of the water may still accumulate inside the temporary storage cavity. When the water inside the temporary storage cavity flows with the rotating drum 22, the blocking plate 28 inside the temporary storage cavity guides the water to a position close to the blocking bar 25 and is discharged from the notch 251 on the blocking bar 25, thereby reducing the possibility of the water inside the temporary storage cavity flowing back to the silicon wafer and contaminating the silicon wafer.

[0077] When the rotating drum 22 rotates, in the embodiment of the present application, the rotating drum 22 rotates slowly in a clockwise direction. As the rotating drum 22 rotates, the snap-in beads on the placement seat 23 of the newly placed silicon wafer basket 24 gradually contact the groove wall of the slide groove 241 under the action of gravity, and the center of the snap-in ball 234 is placed inside the slide groove 241.

[0078] When the flower basket inside the placement groove 231 tends to be separated from the placement groove 231 under the action of gravity, the cavity 233 of the placement groove 231, the groove wall of the slide groove 241 and the catch ball 234 cooperate with each other to catch the silicon wafer flower basket 24, so as to improve the stability of the silicon wafer flower basket 24 during the rotation process. When it is necessary to move the silicon wafer flower basket 24 out of the placement groove 231, the silicon wafer flower basket 24 is moved to the lowest position under the action of the rotating cylinder 22, and then the silicon wafer flower basket 24 is moved in the placement groove 231 along the axis direction of the rotating cylinder 22. At this time, the catch ball 234 moves inside the slide groove 241. Since the two ends of the slide groove 241 are provided with a push surface 242, during the contact process between the catch ball 234 and the push surface 242, the push surface 242 gradually pushes the catch ball 234 back to the cavity 233 to contact the limit of the catch ball 234 on the silicon wafer flower basket 24. The silicon wafer basket 24 can be locked and unlocked by placing the placement seat 23 at different positions and inclination angles, thereby improving the convenience and reliability of locking the silicon wafer basket 24.

[0079] The cylinder wall of the drying cylinder 21 includes an inner cylinder wall 212 and an outer cylinder wall 211. A gas flow channel is formed between the inner cylinder wall 212 and the outer cylinder wall 211. Gas flows into the gas flow channel. The inner cylinder wall 212 is circumferentially provided with a plurality of gas delivery ports along the axial direction of the inner cylinder wall 212.

[0080] The drying chamber 2 also includes a heating diversion assembly 6, which includes a heating portion 61 and a diversion portion 62. The heating portion 61 is mounted on the wall of the rotating drum 22 and is axially distributed along the axis of the rotating drum 22. The heating portion 61 is located between two adjacent placement seats 23 and is connected to the drying drum 21 through the wall of the rotating drum 22. A vent 221 is provided on the wall of the rotating drum 22 near the heating portion 61.

[0081] The diverter 62 is located at the axis of the rotating drum 22 and is connected to the heating part 61. The dry gas enters the gas flow channel and enters the heating part 61 from the gas delivery port for heating, and then enters the diverter 62, and the heated gas is directed to the adjacent silicon wafer basket 24. The silicon wafers are dried through the coordination of airflow and temperature rise, thereby improving the drying efficiency.

[0082] The heating part 61 includes a heat conducting plate 611, a sealing plate 612, a heating element 613 and a connecting pipe 614. The heat conducting plate 611 is fixedly installed between the wall of the rotating cylinder 22 and two adjacent placement seats 23, and a plurality of heat conducting plates 611 are arranged in parallel. The sealing plate 612 is fixedly installed on the heat conducting plate 611, and the sealing plate 612, the placement seat 23 and the wall of the rotating cylinder 22 together form a heating chamber. The heating element 613 is a heating pipe, and the heating pipe runs through the heat conducting plate 611. The connecting pipe 614 connects the diverter 62 and the heating chamber.

[0083] A heating channel is formed between two adjacent heat conducting plates 611. When the gas enters the heating interior from the vent 221, the heat generated by the heating tube is transferred to the heat conducting plate 611 and heats the passing gas, thereby improving the heating efficiency of the gas. While the multiple heat conducting plates 611 improve the installation stability of the heating tube, they are also convenient for quickly dissipating the heat of the heating tube, thereby reducing the excessive temperature of the heating tube and affecting its lifespan.

[0084] The diverter portion 62 includes a diverter tube 621 and a diverter plate 622. The axis of the diverter tube 621 is parallel to the axis of the rotating tube 22, and a first diverter hole is provided on the tube wall of the diverter tube 621 near the placement seat 23. A plurality of diverter plates 622 are installed on the inner wall of the diverter tube 621 and are circumferentially distributed along the axis direction of the inner wall of the diverter tube 621. The diverter plate 622 divides the interior of the diverter tube 621 into a plurality of diverter areas. The diverter plate 622 is provided with a plurality of second diverter holes connected to the connecting pipe 614. In the embodiment of the present application, three diverter plates 622 are provided, and the three diverter plates 622 divide the interior of the diverter plate 622 into three diverter areas. The three diverter areas correspond to the three placement seats 23 one by one, so that the gas after heating directly flows into the placement groove 231, so that the moisture on the silicon wafer can be quickly separated.

[0085] A plurality of guide plates 623 are provided between two adjacent diverter plates 622 and the inner wall of the diverter cylinder 621. The adjacent guide plates 623 form an airflow channel to reduce the possibility of gas turbulence. When the silicon wafer basket 24 gradually rotates and rises with the rotating cylinder 22, the silicon wafers in the silicon wafer basket 24 will also be finely adjusted in position under the action of gravity. At this time, there will be a certain gap between the silicon wafers and the silicon wafer basket 24 to facilitate the passage of hot air, so as to dry the contact surface between the silicon wafer basket 24 and the silicon wafer, and reduce the possibility of moisture on the contact surface between the silicon wafer and the silicon wafer basket 24.

[0086] The sealing door 4 includes a fixed plate 41 and a movable plate 42. The fixed plate 41 is mounted on the drying drum 21, and the movable plate 42 is mounted on the fixed plate 41 and intermittently moves in the vertical direction on the fixed plate 41 to realize the opening and closing of the sealing door 4. The visual camera is fixedly mounted on the fixed plate 41 so as to take pictures of the silicon wafers during the transportation of the silicon wafer basket 24 on the conveying platform 31, and upload the pictures to the system, and the size of the silicon wafers in the pictures is measured by the system, and the drying temperature and drying time of the silicon wafers in the drying chamber 2 are controlled according to the size of the silicon wafers.

[0087] The connecting portion 5 includes a connecting ring 51 and a clamping strip 52. The connecting ring 51 and the rotating cylinder 22 are coaxially arranged, and the clamping strips 52 are fixedly installed on both sides of the connecting ring 51. A plurality of clamping strips 52 are provided circumferentially along the axial direction of the connecting ring 51 on each side of the connecting ring 51. In the embodiment of the present application, three clamping strips 52 are provided on each side of the connecting ring 51, and the three clamping strips 52 correspond to the three blocking strips 25 one by one. A clamping groove 252 for inserting the clamping strip 52 is provided on one side of the blocking strip 25 close to the connecting ring 51.

[0088] The connection ring 51 and the drying drum 21 rotate in coordination, and the drying drum 21 supports the rotating drum 22 through the connection ring 51, thereby improving the working stability of the rotating drum 22. Two support frames 7 are provided on the frame 1, and the two support frames 7 are respectively located on both sides of the drying drum 21. The support frame 7 includes a support block 71, a rotating shaft 72 and a rotating wheel 73.

[0089] A plug-in ring 53 is coaxially provided on the side wall of the connecting ring 51, and a plug-in groove 213 is provided at the end of the inner wall 212 of the drying cylinder 21. The plug-in ring 53 is placed inside the plug-in groove 213, and the plug-in ring 53 and the plug-in groove 213 are rotatably matched. The connecting ring 51 and the drying cylinder 21 are rotatably matched, and the drying cylinder 21 supports the rotating cylinder 22 through the connecting ring 51, thereby improving the working stability of the rotating cylinder 22.

[0090] The support block 71 is fixedly mounted on the frame 1. Several support blocks 71 are arranged along the axis direction of the drying drum 21. The support blocks 71 are in contact with the outer wall of the drying drum 21. The support blocks 71 of the two support frames 7 cooperate to support the drying drum 21. The rotating shaft 72 passes through the support block 71 and rotates with the support block 71. The rotating wheel 73 is coaxially fixedly mounted on the rotating shaft 72. The rotating wheel 73 contacts the outer wall of the connecting ring 51 and rolls with the outer wall of the connecting ring 51. The rotating shaft 72 is transmission-connected with a motor 74. The motor 74 drives the connecting ring 51 to rotate through the rotating wheel 73 on the rotating shaft 72, thereby driving the rotating drum 22 to rotate.

[0091] The implementation principle of a silicon wafer battery drying device capable of size detection in the embodiment of the present application is as follows: first, the silicon wafer basket 24 loaded with washed silicon wafers is placed on the conveying platform 31 of the conveying assembly 3 near the input end of the drying chamber 2 by a mechanical arm, so that the length direction of the silicon wafer basket 24 is consistent with the axis direction of the rotating cylinder 22. Then, the ball screw linear module 33 drives the sliding block 32 to move, and the rotating locking head 34 is inserted and rotated into the arc groove of the locking mouth to achieve the locking of the silicon wafer basket 24. Then, the silicon wafer basket 24 is pushed into the drying chamber 2. At this time, the first locking block 243 of the silicon wafer basket 24 on the conveying platform 31 contacts the first locking block 243 of the silicon wafer basket 24 in the drying chamber 2, and the internal silicon wafer basket 24 is gradually squeezed out to the conveying platform 31, completing the operation of simultaneously conveying into the drying chamber 2 and pushing out of the drying chamber 2. After the silicon wafer basket 24 enters the placement groove 231, it is left to stand and drain to reduce water accumulation. The drained water flows into the temporary storage cavity through the leaking hole 232, and flows into the drying cylinder 21 from the rotating cylinder 22. When the rotating cylinder 22 rotates, the blocking plate 28 in the temporary storage cavity guides the water, and the remaining water in the temporary storage cavity is discharged from the notch 251 of the blocking bar 25. The wiper bar 26 pushes the water in the drying cylinder 21 to the two ends of the water pipe 27 for discharge, thereby improving the drainage efficiency. At the same time, the wiper bar 26 scrapes off the residual water to facilitate airflow evaporation, and the water vapor is discharged through the water guide hole, so that the drying chamber 2 is dried quickly. During the clockwise rotation of the rotating cylinder 22, the newly placed silicon wafer basket 24 is clamped in the basket by the action of the clamping ball 234 and the slide groove 241 to improve stability. When the basket needs to be removed, it is first moved to the lowest position, and then moved along the axial direction. The clamping ball 234 is pushed back to the cavity 233 by the pushing surface 242 to release the limit. The dry gas enters the heating part 61 from the gas delivery port through the gas flow channel for heating, and then enters the diverter part 62 to be guided to the silicon wafer basket 24, and the silicon wafer is dried in coordination with the airflow and the temperature rise environment. The heat conducting plate 611, the sealing plate 612, the heating element 613 and the connecting pipe 614 of the heating part 61 cooperate to improve the heating efficiency, and the diverter cylinder 621, the diverter plate 622 and the guide plate 623 of the diverter part 62 ensure that the heated gas flows to the silicon wafer basket 24 in an orderly manner. When the silicon wafer basket 24 rotates and rises with the rotating cylinder 22, a gap is generated between the silicon wafer and the bottom of the silicon wafer basket 24 to facilitate the passage of hot air flow and dry the bottom of the silicon wafer basket 24. The connecting ring 51 and the clamping strip 52 of the connecting part 5 cooperate with the blocking strip 25, the connecting ring 51 cooperates with the drying cylinder 21 in rotation, and the supporting block 71, the rotating shaft 72, the rotating wheel 73 and the motor 74 of the supporting frame 7 cooperate to drive the rotating cylinder 22 to rotate. The whole process realizes efficient drying of silicon wafers through the cooperation of various components.

[0092] The above are all preferred embodiments of the present application, and the protection scope of the present application is not limited thereto. Therefore, any equivalent changes made according to the structure, shape, and principle of the present application should be included in the protection scope of the present application.

Claims

1. A silicon wafer battery drying device capable of size detection, comprising a drying chamber, characterized in that: The drying chamber includes a drying cylinder, a rotating cylinder, a placement seat, a silicon wafer basket and a heating and diversion assembly, wherein: The rotating cylinder is arranged inside the drying cylinder and gas is introduced into the rotating cylinder; The placement seat is fixed to the rotating drum, and a placement groove extending along the axial direction is provided on one side of the placement seat close to the axis of the rotating drum; The placement seat is provided with a cavity, the silicon wafer basket is slidably arranged in the placement groove, the side wall of the silicon wafer basket is provided with a slide groove connected with the cavity, the slide groove is provided with a pushing surface, and the slide groove and the cavity together form a clamping channel; A clamping ball is arranged in the clamping channel. When the clamping ball abuts against a side of the slide groove close to the placement groove, the clamping ball is partially embedded in the cavity and the ball center is located in the slide groove.

2. The silicon wafer battery drying device capable of size detection according to claim 1 is characterized in that: The heating and diverting assembly comprises a heating part and a diverting part, wherein: Gas is introduced into the heating part; The diversion part is arranged at the axis of the rotating cylinder and is communicated with the heating part. The air outlet of the diversion part is close to the position of the silicon wafer basket.

3. The silicon wafer battery drying device capable of size detection according to claim 2 is characterized in that: The heating part includes a heat conducting plate, a sealing plate and a heating element, wherein: There are at least two heat conducting plates; The sealing plate, the placement seat and the wall of the rotating cylinder together form a heating chamber; The heating element is in contact with the heat conducting plate.

4. The silicon wafer battery drying device capable of size detection according to claim 2 is characterized in that: The flow dividing part includes a flow dividing cylinder and a flow dividing plate, wherein: A plurality of first diversion holes close to the silicon wafer basket are arranged on the wall of the diversion cylinder; The flow dividing plate is disposed on the inner wall of the flow dividing plate, and a plurality of second flow dividing holes connected to the heating part are arranged on the flow dividing plate, and a plurality of second flow dividing holes are distributed circumferentially along the axis direction of the flow dividing cylinder, and form a plurality of flow dividing areas with the flow dividing cylinder; A plurality of guide plates are arranged inside the diversion area.

5. The silicon wafer battery drying device capable of size detection according to claim 1 is characterized in that: The cylinder wall of the drying cylinder comprises an inner cylinder wall and an outer cylinder wall, a gas flow channel is formed between the inner cylinder wall and the outer cylinder wall, and a water pipe is connected to the outer cylinder wall.

6. The silicon wafer battery drying device capable of performing size detection according to claim 1, characterized in that: A water leakage hole penetrating the wall of the rotating cylinder is arranged on one side of the groove wall of the placement groove away from the axis of the rotating cylinder, and a water scraping strip is arranged on the outer wall of the rotating cylinder.

7. The silicon wafer battery drying device capable of performing size detection according to claim 1, characterized in that: A plurality of drying chambers are arranged in parallel along the axial direction of the rotating drum to form an integral drying chamber, and the rotating drum between two adjacent drying chambers is driven by a connecting part.

8. The silicon wafer battery drying device capable of performing size detection according to claim 1, characterized in that: A blocking bar is arranged between the placement seat and the rotating cylinder, a temporary storage cavity is formed between the placement seat, the blocking bar and the rotating cylinder, a blocking plate is arranged inside the temporary storage cavity, and a notch communicating with the temporary storage cavity is arranged on one side of the blocking bar close to the placement seat.

9. The silicon wafer battery drying device capable of performing size detection according to claim 1, characterized in that: A first locking block with a locking opening is provided at the end of the silicon wafer basket, and a conveying assembly is provided near the end of the drying chamber. The conveying assembly includes a conveying platform and a sliding block, wherein: The sliding block slides back and forth on the conveying table along the axis direction of the drying chamber; The sliding block is provided with a second locking block, and the second locking block is provided with a rotating locking head which is plugged and matched with the locking opening.

10. The silicon wafer battery drying device capable of performing size detection according to claim 1, characterized in that: The end of the drying chamber is provided with an openable and closable sealed door, which includes a fixed plate and a movable plate, wherein: The fixed plate is installed on the drying drum; The movable plate is arranged on the fixed plate; A visual camera for detecting the size of silicon wafers is provided on the fixed plate.

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