Loop heat pipe, housing member, and electronic device

Abstract

The invention discloses a loop heat pipe, a shell component and electronic equipment. The loop heat pipe comprises a base body assembly, a first capillary structure and a second capillary structure. The base body assembly is provided with a pipeline unit, a separation part and at least two evaporation cavities. The pipeline unit is provided with a liquid supplementing channel, a backflow channel and steam channels in one-to-one correspondence with the evaporation cavities. The evaporation cavity comprises a steam outlet communicated with one end of the steam channel and a liquid supplementing opening communicated with the liquid supplementing channel. The backflow channel is arranged between every two adjacent evaporation cavities. The separating part is arranged between the liquid supplementing channel and the steam channel. And at least part of the first capillary structure is arranged in the at least two evaporation cavities. The second capillary structures are arranged on at least one of the liquid supplementing channels and the evaporation cavities so as to shield the liquid supplementing openings of the corresponding evaporation cavities and make contact with the first capillary structures. The loop heat pipe can carry out heat dissipation on at least two heat sources respectively. The loop heat pipe is applied to the shell component and the electronic equipment.

Description

Technical Field

[0001] The present disclosure relates to the field of electronic technology, and in particular to a loop heat pipe, a housing component, and an electronic device. Background Art

[0002] Electronic devices such as mobile phones and tablets have become indispensable technology products in people's lives, learning and entertainment. With the development of electronic devices, the temperature rise experience has gradually become an important consideration for consumers when purchasing electronic devices.

[0003] In the related art, loop heat pipes are usually used to improve the heat dissipation efficiency. The loop heat pipe further improves the heat dissipation efficiency through the gas-liquid separation structure. Some electronic devices have at least two heat sources. The traditional heat dissipation method requires a loop heat pipe to be set up for each heat source, which takes up a lot of space. Some loop heat pipes can dissipate heat for at least two heat sources separately, but their manufacturing cost is too high, which is not conducive to reducing the cost of electronic equipment. Summary of the invention

[0004] The present disclosure provides a loop heat pipe, a housing component, and an electronic device. The loop heat pipe can dissipate heat from at least two heat sources separately, is easy to manufacture, and can effectively reduce manufacturing costs. The housing component and the electronic device use the loop heat pipe and have good heat dissipation performance, which is conducive to reducing the heat dissipation cost of the electronic device.

[0005] The technical solution is as follows:

[0006] According to a first aspect of an embodiment of the present disclosure, a loop heat pipe is provided, comprising a base assembly, a first capillary structure and a second capillary structure. The base assembly is provided with a pipeline unit, a partition and at least two evaporation chambers. The pipeline unit is provided with a liquid replenishment channel, a reflux channel and a steam channel corresponding to the evaporation chambers one by one. At least two evaporation chambers are arranged on the base assembly at intervals, and the evaporation chamber includes a steam outlet connected to one end of the steam channel and a liquid replenishment port connected to the liquid replenishment channel. The reflux channel is connected to the liquid replenishment channel, and the reflux channel is arranged between two adjacent evaporation chambers, and the reflux channel is connected to the other ends of the two adjacent steam channels. The partition is arranged between the liquid replenishment channel and the steam channel to separate the liquid replenishment channel and the steam channel. At least part of the first capillary structure is arranged in the liquid replenishment channel and at least two evaporation chambers. The second capillary structure is arranged in at least one of the liquid replenishment channel and the evaporation chamber. The second capillary structure includes a first body corresponding to the evaporation chamber one by one. The first body blocks the liquid replenishment port of the corresponding evaporation chamber, and at least part of the first body is in contact with the first capillary structure.

[0007] The technical solution provided by the embodiments of the present disclosure may have the following beneficial effects:

[0008] The loop heat pipe has at least two evaporation chambers, which can dissipate heat for at least two heat sources. The two adjacent evaporation chambers are separated by the first partition, so that the heat between the adjacent evaporation chambers will not interfere with each other. At the same time, the first body is set in at least one of the liquid replenishment channel and the evaporation chamber to block the liquid replenishment port, and an anti-backflow structure can be formed. Then the liquid contained in each evaporation chamber is heated and evaporated into steam, which will flow out from the steam outlet to the pipeline unit due to the obstruction of the liquid replenishment port. The steam flows to the cold end through the pipeline unit and condenses into liquid, and flows back to the liquid replenishment port through the liquid replenishment channel. In this process, the first body will absorb the condensed liquid and transport it to the first capillary structure in contact with it, and replenish the liquid back to each evaporation chamber through the first capillary structure to improve the heat dissipation performance of the loop heat pipe. In this way, the loop heat pipe can dissipate heat for at least two heat sources separately, and form an anti-backflow structure through the capillary structure, so that the steam formed by evaporation is difficult to flow out from the liquid replenishment port, and realize the gas-liquid separation of the loop heat pipe. This makes the loop heat pipe easy to manufacture and implement, and can effectively reduce manufacturing costs.

[0009] The technical solution of the present disclosure is further described below:

[0010] In one embodiment, the first body is stacked on the first capillary structure to cover the liquid replenishing port.

[0011] Alternatively, at least a portion of the first body is filled in the fluid infusion channel to cover the fluid infusion port.

[0012] In one of the embodiments, the loop heat pipe further includes a working medium disposed in the pipe unit and in at least two evaporation chambers, and the first body shields the liquid replenishing port so that the vapor working medium moves toward the steam outlet.

[0013] And / or, at least two evaporation chambers are arranged on the base component at intervals along the length direction of the base component.

[0014] In one embodiment, the thickness of the first capillary structure is H1, 0.02 mm≤H1≤0.1 mm.

[0015] And / or, the second capillary structure includes at least one capillary structure layer. And / or, the thickness of the second capillary structure is H2, 0.1 mm≤H2≤0.3 mm.

[0016] In one embodiment, the maximum thickness of the loop heat pipe is 0.2 mm to 0.5 mm.

[0017] In one embodiment, the second capillary structure covers the fluid replenishment channel.

[0018] And / or, at least a portion of the second capillary structure is disposed in the reflux channel.

[0019] In one embodiment, the first capillary structure covers the evaporation chamber, the liquid replenishment channel and the reflux channel.

[0020] And / or, part of the first capillary structure is disposed in the steam channel and close to the steam chamber.

[0021] In one embodiment, the at least two evaporation chambers include a first evaporation chamber and a second evaporation chamber. The first evaporation chamber and the second evaporation chamber are spaced apart at both ends of the substrate component along the length direction of the substrate component, and the evaporation area of ​​the first evaporation chamber is larger than the evaporation area of ​​the second evaporation chamber.

[0022] In one embodiment, there are at least two steam channels, including a first steam channel communicating with the first evaporation chamber and a second steam channel communicating with the second evaporation chamber. Relative to the first evaporation chamber, the reflux channel is disposed close to the second evaporation chamber, so that the length of the first steam channel is greater than the length of the second steam channel.

[0023] In one embodiment, the liquid replenishment channel includes a first liquid replenishment channel communicating with the first evaporation chamber and a second liquid replenishment channel communicating with the second evaporation chamber.

[0024] At least a portion of the first capillary structure and at least a portion of the second capillary structure are stacked to fill the first fluid replenishment channel and the second fluid replenishment channel.

[0025] In one embodiment, the partition includes a first partition arranged between the first fluid replenishment channel and the first steam channel and a second partition arranged between the second fluid replenishment channel and the second steam channel. The first partition and the second partition are arranged at intervals along the length direction of the base component to form a gap.

[0026] The reflux channel is communicated with the first fluid infusion channel and the second fluid infusion channel through the notch.

[0027] And / or, part of the second capillary structure passes through the gap to contact the reflux channel and blocks the gap.

[0028] In one embodiment, the base assembly includes a first plate and a second plate, the first plate and the second plate cooperate to form a receiving chamber. The partition is disposed in the receiving chamber to divide the receiving chamber into a steam channel, a reflux channel, a liquid replenishing channel and an evaporation chamber.

[0029] In one embodiment, the partition includes a partition plate, and two ends of the partition plate are respectively in contact with the first plate body and the second plate body.

[0030] Alternatively, the partition includes a welding layer, and the welding layer is welded and fixed to the first plate body and the second plate body.

[0031] In one embodiment, at least one of the first plate and the second plate is provided with a groove, and the other of the first plate and the second plate covers the groove to form a receiving cavity.

[0032] In one embodiment, the first plate body is provided with a groove, the first capillary structure covers the bottom of the groove, and the first capillary structure is provided with an avoidance groove for avoiding the partition part, and the second capillary structure is arranged on the first capillary structure.

[0033] And / or, the partition and the second plate are formed by stamping.

[0034] In one embodiment, the second plate body is provided with a support column, which avoids the second capillary structure and protrudes toward the first capillary structure.

[0035] The supporting column is in abutment with the first capillary structure.

[0036] Alternatively, when the second plate is in a non-pressurized state, the support column and the first capillary structure are in gap fit. When the second plate and / or the first plate are in a pressurized state, the support column and the first capillary structure are in contact and fit to support the first plate and the second plate.

[0037] In one embodiment, one of the first plate and the second plate includes a middle frame or a battery cover.

[0038] According to a second aspect of the embodiments of the present disclosure, a shell component is further provided, comprising a shell assembly and the loop heat pipe in any of the above embodiments, wherein the loop heat pipe is arranged in the shell assembly.

[0039] The technical solution provided by the embodiments of the present disclosure may have the following beneficial effects:

[0040] The housing component integrates the loop heat pipe into the housing assembly, so that the evaporation chamber is used to dissipate heat from at least two heat sources installed on the housing assembly, and then the heat is transferred to the cooling part by the pipe unit, so that the space of the housing assembly can be fully utilized for heat dissipation, and the heat dissipation performance of the housing assembly can be improved, which is convenient for improving the heat dissipation efficiency of the components integrated into the housing assembly, especially the heat sources that are easy to generate heat (such as the motherboard chip, that is, the CPU, etc.). In this way, the housing component has good heat dissipation performance.

[0041] The technical solution of the present disclosure is further described below:

[0042] In one embodiment, the housing assembly is provided with a receiving hole, and at least a portion of the loop heat pipe is disposed in the receiving hole, so that at least a portion of the loop heat pipe is embedded in the housing. In this way, at least a portion of the loop heat pipe is embedded in the housing through the receiving hole, and the thickness space of the housing can be fully utilized to integrate the loop heat pipe, that is, the protruding thickness of the heat dissipation structure can be actively reduced, which is conducive to achieving a thin and light electronic device.

[0043] In one embodiment, the base assembly is provided with a skirt, the shell is provided with a carrier disposed on the side wall of the accommodating hole, and the skirt is fixedly connected to the carrier.

[0044] According to the third aspect of the embodiments of the present disclosure, an electronic device is also provided, comprising a heat source and the loop heat pipe in any of the above embodiments, or a shell component in any of the above embodiments, wherein the heat source comprises at least two heat sources, which correspond one-to-one to the evaporation chambers, and the heat source cooperates with the base assembly for heat dissipation, and on the positive projection surface in the thickness direction of the loop heat pipe, at least part of the heat source overlaps with the evaporation chamber.

[0045] The technical solution provided by the embodiments of the present disclosure may have the following beneficial effects:

[0046] The electronic device uses the loop heat pipe in any of the above embodiments or the housing component in any of the above embodiments, and can use the loop heat pipe to dissipate heat from at least two heat sources, thereby preventing the electronic device from being partially overheated and affecting its performance or causing damage. The electronic device uses the loop heat pipe and has good heat dissipation performance, and the manufacturing cost of the loop heat pipe is low, which is conducive to reducing the heat dissipation cost of the electronic device.

[0047] It is to be understood that the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the present disclosure. BRIEF DESCRIPTION OF THE DRAWINGS

[0048] BRIEF DESCRIPTION OF THE DRAWINGS The accompanying drawings are provided to help understand the present invention. The schematic accompanying drawings and their descriptions of the present invention are used to explain the technical solution of the present invention and do not constitute an improper limitation on the protection scope of the present invention.

[0049] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly introduces the drawings required for describing the embodiments. Obviously, the drawings described below are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained based on these drawings without creative work.

[0050] Figure 1 It is a schematic diagram of the structure of an electronic device shown in an embodiment.

[0051] Figure 2 for Figure 1 The schematic diagram of the structure of the shell components is shown.

[0052] Figure 3 Schematic diagram of the structure of a loop heat pipe shown in one embodiment.

[0053] Figure 4 for Figure 2Schematic diagram of the structure of the loop heat pipe shown (the primary heat source and the secondary heat source are in working state).

[0054] Figure 5 for Figure 2 Schematic diagram of the internal structure of the loop heat pipe shown (the main heat source is in working state).

[0055] Figure 6 for Figure 5 The loop heat pipe shown is a schematic cross-sectional view in the A-axis direction.

[0056] Figure 7 for Figure 5 The loop heat pipe shown is a schematic cross-sectional view in the B-axis direction.

[0057] Figure 8 for Figure 5 The loop heat pipe shown is a schematic cross-sectional view in the C-axis direction.

[0058] Fig. 9 for Figure 5 Schematic diagram of the structural explosion of the loop heat pipe shown.

[0059] Fig.10 for Figure 1 The half-section schematic diagram of the electronic device shown in the X-axis direction.

[0060] Fig.11 FIG. 1 is a partial cross-sectional schematic diagram of a loop heat pipe shown in another embodiment.

[0061] Fig.12 It is a half-section schematic diagram of a shell component shown in another embodiment.

[0062] Fig.13 FIG. 4 is a schematic diagram of a hardware structure of an electronic device shown in an embodiment.

[0063] Description of reference numerals:

[0064] 10. Electronic device; 11. Processing component; 12. Memory; 13. Power supply component; 14. Multimedia component; 15. Audio component; 16. Input / output interface; 17. Sensor component; 18. Communication component; 10a. Shell component; 100. Shell component; 110. Accommodation hole; 120. Carrier; 200. Loop heat pipe; 210. Base component; 211. Pipe unit; 201. Refill channel; 201a. First refill channel; 201b. Second refill channel; 202. Reflux channel; 203. Steam channel; 203a. First steam channel; 203b. second steam channel; 212, evaporation chamber; 204, steam outlet; 205, liquid replenishing port; 206, first evaporation chamber; 207, second evaporation chamber; 213, partition; 2131, first partition; 2132, second partition; 2133, notch; 214, first plate; 208, groove; 215, second plate; 209, support column; 216, skirt; 220, first capillary structure; 221, avoidance groove; 230, second capillary structure; 231, first body; 232, second body; 300, heat source; 310, primary heat source; 320, secondary heat source; 400, battery. DETAILED DESCRIPTION

[0065] In order to make the purpose, technical solution and advantages of the present disclosure more clear, the present disclosure is further described in detail below in conjunction with the accompanying drawings and specific implementation methods. It should be understood that the specific implementation methods described here are only used to explain the present disclosure and do not limit the protection scope of the present disclosure.

[0066] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art to which the present disclosure belongs. The terms used herein in the specification of the present disclosure are only for the purpose of describing specific embodiments and are not intended to limit the present disclosure.

[0067] Electronic devices such as mobile phones and tablets have become indispensable technological products in people's lives, studies and entertainment. With the development of electronic devices, the internal structure is becoming more and more compact, and although the performance of related devices is becoming more and more powerful, the heat generation is also increasing. For example, the number of cores of the CPU (Central Processing Unit) of electronic devices increases, the performance is increasingly enhanced, and the heat generation is greater. This leads to an increase in the heat generated by electronic devices, which poses an increasingly high challenge to the heat dissipation performance of electronic devices. In particular, in recent years, the temperature rise experience has gradually become an important consideration for consumers when purchasing electronic devices.

[0068] However, at present, if the heat dissipation technology solutions for related electronic devices need to improve the heat dissipation efficiency, it is necessary to continue to increase the volume of the heat dissipation structure, which requires occupying the internal space of the electronic device. In order to improve the heat dissipation efficiency, more and more electronic devices use loop heat pipes with gas-liquid separation structures to improve the heat dissipation efficiency. Some electronic devices have at least two heat sources, and the traditional heat dissipation method requires a loop heat pipe to be set up separately for heat dissipation, which will take up a lot of space. Some loop heat pipes can dissipate heat for at least two heat sources separately, but their manufacturing cost is too high. When used in electronic devices, the heat dissipation cost of the electronic equipment will be too high.

[0069] Based on this, the present disclosure provides a loop heat pipe, which can dissipate heat for at least two heat sources separately, is easy to manufacture, and can effectively reduce manufacturing costs.

[0070] In order to better understand the loop heat pipe of the present disclosure, an electronic device to which the loop heat pipe is applied is used for illustration.

[0071] like Figure 1 as well as Figure 2 As shown, the present disclosure discloses an electronic device 10 , which may be: a mobile phone, a tablet computer, an e-reader, a notebook computer, a vehicle-mounted device, etc., which includes a heat source 300 and a loop heat pipe 200 .

[0072] Among them, Figures 2 to 5 As shown, the loop heat pipe 200 includes a base component 210, a first capillary structure 220 and a second capillary structure 230. The base component 210 is provided with a pipe unit 211, a partition 213 and at least two evaporation chambers 212. The pipe unit 211 is provided with a liquid replenishment channel 201, a reflux channel 202 and a steam channel 203 corresponding to the evaporation chamber 212. At least two evaporation chambers 212 are arranged on the base component 210 at intervals, and the evaporation chamber 212 includes a steam outlet 204 connected to one end of the steam channel 203 and a liquid replenishment port 205 connected to the liquid replenishment channel 201. The reflux channel 202 is connected to the liquid replenishment channel 201, and the reflux channel 202 is arranged between two adjacent evaporation chambers 212, and the reflux channel 202 is connected to the other ends of the two adjacent steam channels 203. The partition 213 is disposed between the liquid replenishment channel 201 and the steam channel 203 to separate the liquid replenishment channel 201 and the steam channel 203. At least a portion of the first capillary structure 220 is disposed in the liquid replenishment channel 201 and at least two evaporation chambers 212. The second capillary structure 230 is disposed in at least one of the liquid replenishment channel 201 and the evaporation chamber 212. The second capillary structure 230 includes a first body 231 corresponding to the evaporation chamber 212. The first body 231 blocks the liquid replenishment port 205 of the corresponding evaporation chamber 212, and at least a portion of the first body 231 contacts the first capillary structure 220.

[0073] Combined with Figure 2 As shown, the heat source 300 includes at least two, and corresponds to the evaporation chamber 212 one by one. The heat source 300 cooperates with the base assembly 210 for heat dissipation, and on the thickness direction of the positive projection surface of the loop heat pipe 200, at least part of the heat source 300 overlaps with the evaporation chamber 212.

[0074] The loop heat pipe 200 has at least two evaporation chambers 212, which can dissipate heat for at least two heat sources 300. The two adjacent evaporation chambers 212 are separated by the first partition 2131, so that the heat between the adjacent evaporation chambers 212 will not interfere with each other. The liquid replenishment port 205 of the evaporation chamber 212 is connected to one end of the liquid replenishment channel 201, the steam outlet 204 of the evaporation chamber 212 is connected to one end of the pipeline unit, and the other end of the pipeline unit 211 is connected to the liquid replenishment channel 201. At the same time, by setting the first body 231 in at least one of the liquid replenishment channel 201 and the evaporation chamber 212 to block the liquid replenishment port 205, an anti-backflow structure can be formed. In this way, during the use of the electronic device 10, the heat generated by the operation of each heat source 300 will be transferred to the corresponding evaporation chamber 212 through the base assembly 210. Then the liquid contained in each evaporation chamber 212 is heated and evaporated into steam. The steam is difficult to flow out from the liquid replenishing port 205 due to the obstruction of the liquid replenishing port 205, and will flow out from the steam outlet 204 to the pipeline unit 211. The steam flows to the cold end of the electronic device 10 through the pipeline unit 211 and condenses into liquid, and flows back to the liquid replenishing port 205 through the liquid replenishing channel 201. In this process, the first body 231 will absorb the condensed liquid and transport it to the first capillary structure 220 in contact with it, and replenish the liquid back to the evaporation chamber 212 through the first capillary structure 220, so as to continuously evaporate and dissipate heat, realize cooling of the heat source 300, avoid local overheating of the electronic device 10 and affect its performance or cause damage, and improve the heat dissipation performance of the electronic device 10.

[0075] In addition, the second capillary structure 230 absorbs the condensed liquid, and the liquid fills the capillary pores of the second capillary structure 230 , so that the second capillary structure 230 can better block the steam from flowing out of the liquid replenishing port 205 .

[0076] It can be understood that the loop heat pipe 200 can dissipate heat for at least two heat sources 300 separately, and form an anti-backflow structure through a capillary structure, so that the steam formed by evaporation is difficult to flow out from the liquid replenishment port 205, thereby realizing the gas-liquid separation of the loop heat pipe 200. In addition, the loop heat pipe 200 is easy to manufacture and implement, and can effectively reduce the manufacturing cost. In this way, the electronic device 10 using the loop heat pipe 200 has good heat dissipation performance, and the manufacturing cost of the loop heat pipe 200 is low, which is conducive to reducing the heat dissipation cost of the electronic device 10.

[0077] Moreover, the reflux channel 202 is disposed between two adjacent evaporation chambers 212, and is connected to the other ends of two adjacent steam channels 203, and refluxes to at least two evaporation chambers 212 through the liquid replenishment channel 201. This makes the arrangement of the evaporation chamber 212 more flexible, and enables heat sources 300 on the electronic device 10 with a certain distance to be cooled separately.

[0078] In an example, Figure 4 as well as Figure 5 As shown, the length direction of the base assembly 210 and the length direction of the electronic device 10 are both arranged along the X-axis direction. The width direction of the base assembly 210 and the width direction of the electronic device 10 are both arranged along the Y-axis direction. In some embodiments, at least two evaporation chambers 212 are arranged on the base assembly 210 at intervals along the length direction of the base assembly 210. In this way, the evaporation chambers 212 can be used to dissipate heat from at least two heat sources 300 arranged at intervals along the length direction of the electronic device 10.

[0079] Combination Figure 4 as well as Figure 5 As shown, the steam channel 203 is separated from the liquid replenishing channel 201 along the width direction (Y-axis direction) of the base component 210 .

[0080] It should be noted that "heat source 300 and base component 210 cooperate in heat dissipation" should be understood in a broad sense, including direct or indirect contact between the heat source 300 and the base component 210 to achieve heat conduction, and using the base component 210 to dissipate heat from the heat source 300 to avoid local overheating of the heat source 300.

[0081] In some embodiments, the heat source 300 cooperates with the base assembly 210 to dissipate heat through a heat-conducting medium. The heat-conducting medium includes but is not limited to heat-conducting silica gel, a heat-conducting middle frame, and the like.

[0082] It should be noted that "the second capillary structure 230 is disposed in at least one of the liquid replenishment channel 201 and the evaporation chamber 212" includes the second capillary structure 230 being disposed in the liquid replenishment channel 201, the second capillary structure 230 being disposed in the evaporation chamber 212, and the second capillary structure 230 being disposed between the liquid replenishment channel 201 and the evaporation chamber 212. The liquid replenishment port 205 can be shielded without affecting the conveying function of the pipeline unit 211, and the evaporation function of the evaporation chamber 212 is sufficient.

[0083] It should be noted that “the second capillary structure 230 blocks the fluid infusion port 205 ” is to be understood in a broad sense, including but not limited to the second capillary structure 230 blocking part of the fluid infusion port 205 to reduce the hollow area of ​​the fluid infusion port 205 , and the second capillary structure 230 filling the fluid infusion port 205 to reduce the hollow area of ​​the fluid infusion port 205 .

[0084] It should be noted that the second capillary structure 230 is used to block the liquid infusion port 205. It can be understood that the second capillary structure 230 can block the steam at the evaporation chamber 212 from flowing to the liquid infusion port 205, but will not affect the liquid at the liquid infusion port 205 from flowing to the evaporation chamber 212. The second capillary structure 230 is arranged between the evaporation chamber 212 and the liquid infusion port 205. The second capillary structure 230 can be stacked or arranged side by side with the first capillary structure 220. When the first capillary structure 220 and the second capillary structure 230 are stacked, the sum of the dimensions of the first capillary structure 220 and the second capillary structure 230 in the thickness direction is equal to the inner dimension of the pipeline unit 211 in the thickness direction (such as Fig. 9 When the first capillary structure 220 and the second capillary structure 230 are arranged side by side, the dimension of the second capillary structure 230 in the thickness direction is equal to the inner dimension of the pipeline unit 211 in the thickness direction.

[0085] The first capillary structure 220 and the second capillary structure 230 may be capillary structures with the same or different capillary densities. For example, the first capillary structure 220 and the second capillary structure 230 may be capillary structures with different thicknesses and the same capillary density. The thickness of the first capillary structure 220 is less than that of the second capillary structure 230. In this way, the first capillary structure 220 is used to transport the liquid working medium, and the second capillary structure 230 is used to block the gaseous working medium from flowing toward the liquid replenishing port 205. In addition, the thickness and capillary density of the first capillary structure 220 and the second capillary structure 230 may be adjusted according to actual stacking requirements.

[0086] It should be noted that the embodiment of the present disclosure does not specifically limit the configuration mode and thickness and other parameters of the first capillary structure 220 and the second capillary structure 230 , and the above description is only an example and not a limitation.

[0087] It should be noted that there are many specific implementations of the first capillary structure 220 and the second capillary structure 230, such as a groove capillary structure, a mesh (woven) capillary structure, a fiber capillary structure, and a sintered capillary structure.

[0088] like Figure 2 As shown, in some embodiments, the electronic device 10 further includes a housing assembly 100, and the loop heat pipe 200 is disposed in the housing assembly 100. In this way, the loop heat pipe 200 is integrated into the housing assembly 100, so that the evaporation chamber 212 is used to dissipate heat from the heat source 300 installed in the housing assembly 100, and then the pipe unit 211 is used to transfer the heat to the cooling part, so that the space of the housing assembly 100 can be fully utilized for heat dissipation, and the heat dissipation performance of the housing assembly 100 can be improved, so as to improve the heat dissipation efficiency of the components integrated into the housing assembly 100, especially the heat source 300 (such as the processor, i.e., the CPU, etc.) that is easy to generate heat.

[0089] It should be noted that the housing assembly 100 may be a middle frame, a battery 400 cover or a rear cover, etc. It is understandable that the loop heat pipe 200 is integrated with the housing assembly 100, for example, the loop heat pipe 200 is embedded in the middle frame to form an integrated middle frame component, or the loop heat pipe 200 and the battery 400 cover are integrated into an integrated housing component 10a. In other words, the embodiment of the present disclosure does not specifically limit the type of the housing assembly 100.

[0090] Optionally, the housing assembly 100 and the loop heat pipe 200 are modularly assembled to form the housing component 10 a , so that the housing component 10 a has good heat dissipation performance and is convenient for improving the assembly efficiency of the electronic device 10 .

[0091] In some embodiments, the heat source 300 may be a control mainboard, a screen module, or a camera module provided with a processor. The housing assembly 100 is provided with a heat source 300 heat conduction area (not shown), and is arranged opposite to the evaporation chamber 212 along the thickness direction of the housing assembly 100. The heat source 300 cooperates with the evaporation chamber 212 in heat dissipation through the heat source 300 heat conduction area. In addition, the heat source 300 can increase the heat dissipation area through the housing assembly 100, and can also use the loop heat pipe 200 to improve the heat dissipation efficiency, effectively avoiding overheating of the heat source 300.

[0092] In the disclosed embodiment, the housing assembly 100 may be a bearing structure of the electronic device 10. In addition to the integrated loop heat pipe 200, at least some components of the electronic device 10 may be directly or indirectly disposed on the housing assembly 100 to assemble the electronic device 10. For example, the control motherboard is mounted on the housing assembly 100 so that the processor and the evaporation chamber 212 are disposed opposite to each other along the thickness direction of the housing assembly 100.

[0093] Optionally, in some embodiments, the housing assembly 100 may be disposed inside the electronic device 10, and the edge of the housing assembly 100 may be designed to be part of the housing of the electronic device 10. When the edge of the housing assembly 100 serves as the housing of the electronic device 10, it may protect the electronic device 10.

[0094] Optionally, in some embodiments, the housing assembly 100 may have a plane or a structure similar to a plane, so that two sides of the housing assembly 100 can be visually distinguished, and the two sides can be referred to as the front and back of the housing assembly 100, or the two sides can also be referred to as one side and the other side of the housing assembly 100. The interior of the housing assembly 100 can be partially hollowed out as needed to arrange other components in the electronic device 10.

[0095] It should be noted that part or all of the housing assembly 100 may be made of metal or alloy material (eg, aluminum alloy). Of course, the housing assembly 100 may also be made of other materials, which are not specifically limited in the embodiment of the present disclosure.

[0096] In some embodiments, the housing assembly 100 is made of aluminum alloy or steel, so that the housing assembly 100 has good thermal conductivity, which facilitates the transfer of heat from the heat source 300 to the loop heat pipe 200 .

[0097] It should be noted that, in addition to being disposed in the housing assembly 100 , the loop heat pipe 200 may also be disposed in other parts of the electronic device 10 .

[0098] For example, in some embodiments, the loop heat pipe 200 is disposed between the screen and the middle frame.

[0099] Furthermore, in some embodiments, the loop heat pipe 200 is disposed on one side of the battery 400 cover (also referred to as the back cover).

[0100] That is, the loop heat pipe 200 is superimposed on other load-bearing components, heat dissipation components or the heat source 300 along the thickness direction of the electronic device 10 to directly or indirectly improve the heat dissipation efficiency of the heat source 300 and avoid local overheating of the electronic device 10 .

[0101] In the embodiment of the present disclosure, the heat source 300 refers to a device in the electronic device 10 that radiates more heat.

[0102] In actual application, the heat radiated by the components is usually positively correlated with the power consumption of the components. The greater the power consumption of the components, the greater the heat radiated by the components. Accordingly, the heat source 300 in the present disclosure can be a device in the electronic device 10 whose power consumption exceeds M% of the total power consumption of the device, and M can be 20, 30, 40, 50, etc.

[0103] In some embodiments, the heat source 300 may include a central processing unit, a processing device integrating processing and storage functions, a power supply component (such as a battery 400), an ISP chip, a charging chip, a screen PMIC chip, etc. Of course, the heat source 300 may also be other, such as an image sensor, etc., which is not specifically limited in the embodiments of the present disclosure.

[0104] It should be noted that the “cold end of the electronic device 10 ” generally refers to a location where the temperature rises slower than that of the heat source 300 , that is, when the electronic device 10 is in use, the location where the internal temperature of the electronic device 10 is lower than that of the “heat source 300 ”.

[0105] like Figure 4 as well as Figure 5As shown, in some embodiments, the loop heat pipe 200 further includes a working medium disposed in the pipe unit 211 and in at least two evaporation chambers 212, and the first body 231 shields the liquid replenishing port 205 so that the vapor-state working medium moves toward the steam outlet 204. In this way, the liquid working fluid can be evaporated into vapor. The vapor-state working fluid can flow into the pipe unit 211 through the steam outlet 204, and can be re-liquefied in the pipe unit 211 and then transported to the liquid replenishing port 205 through the capillary structure.

[0106] Specifically, during the use of the electronic device 10, the heat generated by the heat source 300 will be transferred to the evaporation chamber 212 through the base assembly 210. Then, the working medium contained in the evaporation chamber 212 is heated and evaporated into steam. The steam is difficult to flow out from the liquid replenishment port 205, but will flow out from the steam outlet 204 to the pipeline unit 211. The steam flows to the cold end of the electronic device 10 through the pipeline unit 211 and condenses back into a liquid working medium, and flows back to the liquid replenishment port 205 through the liquid replenishment channel 201. In this process, the second capillary structure 230 will absorb the condensed working medium and transport it to the first capillary structure 220 in contact with it, and replenish the working medium back to the evaporation chamber 212 through the first capillary structure 220, so as to continuously evaporate and dissipate heat, thereby cooling the heat source 300, so as to avoid local overheating of the electronic device 10 and affect its performance or cause damage, and improve the heat dissipation performance of the electronic device 10.

[0107] It should be noted that the "working medium" includes but is not limited to coolant and other fluids that can be applied to the loop heat pipe 200, and the boiling point of the "working medium" can be adjusted according to actual needs and is not limited here.

[0108] In some embodiments, the first capillary structure 220 is disposed in the evaporation chamber 212 to form an evaporator.

[0109] Furthermore, in some embodiments, at least part of the first capillary structure 220 is disposed in the liquid replenishment channel 201, the reflux channel 202, and at least two evaporation chambers 212. In this way, the first capillary structure 220 can better transfer the liquid working medium, replenish the evaporator in time, and improve the heat dissipation performance of the loop heat pipe 200.

[0110] Optionally, in some embodiments, part of the first capillary structure 220 is disposed in the steam channel 203 and close to the steam chamber, which is beneficial to increase the evaporation area and the heat dissipation area of ​​the heat source 300 .

[0111] Based on any of the above embodiments, Figure 4 , Figure 5 as well as Fig. 9As shown, in some embodiments, the first body 231 is stacked on the first capillary structure 220 to cover the liquid replenishing port 205. In this way, the contact area between the second capillary structure 230 and the first capillary structure 220 can be increased, and the liquid stored in the second capillary structure 230 can be better transported to the first capillary structure 220, so that the liquid can be replenished back to the evaporation chamber 212 through the first capillary structure 220.

[0112] Alternatively, in some other embodiments, at least a portion of the first body 231 is filled in the fluid infusion channel 201 to shield the fluid infusion port 205. Thus, the second capillary structure 230 can be directly filled in the fluid infusion channel 201 to shield the fluid infusion port 205, making the arrangement of the first capillary structure 220 and the second capillary structure 230 more flexible.

[0113] In an example, Figure 6 to Figure 7 As shown, the thickness direction of the base component 210 , the thickness direction of the housing component 100 , the thickness direction of the first capillary structure 220 , and the thickness direction of the second capillary structure 230 are respectively arranged along the Z-axis direction.

[0114] Based on any of the above embodiments, in some embodiments, the thickness of the first capillary structure 220 is H1, 0.02mm≤H1≤0.2mm. In this way, the thickness of the first capillary structure 220 can be flexibly set so that the evaporation chamber 212 has enough evaporation space to quickly evaporate the liquid stored in the first capillary structure 220 into gas.

[0115] In some embodiments, 0.1 mm ≤ H1 ≤ 0.2 mm.

[0116] In some embodiments, H1 = 0.02 mm, 0.03 mm, 0.04 mm, 0.05 mm, 0.06 mm, 0.07 mm, 0.08 mm, 0.09 mm, 0.1 mm, 0.12 mm, 0.15 mm, 0.18 mm, 0.2 mm.

[0117] It should be noted that H1 can be any value within the range of 0.02 mm to 0.2 mm, and the above examples are only examples and are not limiting.

[0118] In some embodiments, the second capillary structure 230 includes at least one capillary structure layer. Thus, the second capillary structure 230 may be formed by a single capillary structure layer or by stacking multiple capillary structures.

[0119] For example, a capillary structure is cut into a set shape, and multiple layers of the capillary structure are stacked to form the second capillary structure 230. The capillary structure can also be cut into the first capillary structure 220. In this way, the first capillary structure 220 and the second capillary structure 230 can be formed using one capillary structure, which is conducive to cost saving.

[0120] In some embodiments, the thickness of the second capillary structure 230 is H2, 0.1 mm ≤ H2 ≤ 0.3 mm. Thus, the thickness of the second capillary structure 230 can be reasonably set according to the size of the liquid infusion port 205, so as to cover the liquid infusion port 205 without affecting the reflux of the liquid.

[0121] In some embodiments, 0.1 mm ≤ H2 ≤ 0.2 mm.

[0122] In some embodiments, H2=0.1 mm, 0.12 mm, 0.15 mm, 0.18 mm, 0.2 mm, 0.21 mm, 0.23 mm, 0.25 mm, 0.27 mm, 0.3 mm.

[0123] It should be noted that H2 can be any value within the range of 0.1 mm to 0.3 mm, and the above examples are only examples and are not limiting.

[0124] Based on any of the above embodiments, in some embodiments, the maximum thickness of the loop heat pipe 200 is 0.2 mm to 0.5 mm. In this way, the loop heat pipe 200 is made as light and thin as possible to meet the requirements of the light and thin design of the electronic device 10.

[0125] In some embodiments, the maximum thickness of the loop heat pipe 200200 is one of 0.2mm, 0.22mm, 0.25mm, 0.28mm, 0.3mm, 0.31mm, 0.33mm, 0.35mm, 0.37mm, 0.4mm, 0.41mm, 0.43mm, 0.45mm, 0.47mm, 0.5mm, etc. to adapt to the thinness of the electronic device 10.

[0126] It should be noted that the maximum thickness of the loop heat pipe 200 can be any value within the range of 0.2 mm to 0.5 mm, and the above examples are only examples and are not limiting.

[0127] like Figures 5 to 8 As shown, in some embodiments, the second capillary structure 230 covers the liquid replenishment channel 201. In this way, the second capillary structure 230 can cooperate with the first capillary structure 220 to fill the liquid replenishment channel 201 to increase the smoothness of liquid reflux. At the same time, it can prevent the vapor working medium from entering the liquid replenishment channel 201, and realize the gas-liquid separation of the loop heat pipe 200.

[0128] Optionally, in some embodiments, the second capillary structure 230 includes a second body 232 disposed in the liquid replenishing channel 201, and the first body 231 is in contact with the first capillary structure 220 and connected to the second body 232 to shield the liquid replenishing port 205. In this way, the first body 231 is disposed in the evaporation chamber 212 and in contact with the first capillary structure 220, so that the liquid can be quickly transported to the evaporation chamber 212, and the second body 232 is disposed in the liquid replenishing channel 201, so that the liquid absorption speed can be increased, and thus the liquid replenishing speed of the evaporation chamber 212 can be further increased.

[0129] It can be understood that connecting the second body 232 with at least two first bodies 231 is beneficial to increasing the barrier thickness, improving the barrier effect on steam, and further improving the anti-backflow performance of the loop heat pipe 200.

[0130] like Figure 5 as well as Figure 8 As shown, in some embodiments, at least a portion of the second capillary structure 230 is disposed in the reflux channel 202. In this way, the liquid in the reflux channel 202 can be quickly guided into the liquid replenishment channel 201, which is beneficial to improving the liquid replenishment efficiency.

[0131] Reference Figure 1 as well as Fig.10 As shown, in the actual working process of a large electronic device 10 such as a mobile phone or a tablet computer, its heat source 300 is often not single. In addition to the main heat source 310 such as the CPU, the heat source 300 with high power consumption also has secondary heat sources 320 such as the ISP chip, the charging chip, and the screen PMIC chip. For example, in special usage scenarios such as playing games during charging, when the main heat source 310 and the secondary heat source 320 are working at the same time, the temperature of each heat source 300 will rise at the same time, and the heat flow between each other will crosstalk. If the heat dissipation is not timely, the temperature uniformity effect will decrease, the temperature of the whole machine and the chip will rise, and the electronic device 10 will not be able to perform at its best, affecting the gaming experience. And using the above technical solution. The evaporation chamber 212 is arranged along the length direction of the base assembly 210, which can span the battery 400 area, and dissipate the heat of the CPU and the charging chip at both ends of the battery 400. When the main heat source 310 and the secondary heat source 320 are working at the same time, the heat dissipation of both can be taken into account, thereby improving the heat dissipation capacity and performance of the whole machine.

[0132] In combination with any of the above embodiments, Figures 4 to 8As shown, in some embodiments, at least two evaporation chambers 212 include a first evaporation chamber 206 and a second evaporation chamber 207, and the first evaporation chamber 206 and the second evaporation chamber 207 are arranged at two ends of the base component 210 along the length direction of the base component 210, and the evaporation area of ​​the first evaporation chamber 206 is larger than the evaporation area of ​​the second evaporation chamber 207. In this way, the first evaporation chamber 206 is used to dissipate the main heat source 310 of the electronic device 10, and the second evaporation chamber 207 is used to dissipate the secondary heat source 320 of the electronic device 10, so as to reasonably distribute the heat dissipation performance of the loop heat pipe 200 and improve the heat dissipation capacity and performance of the whole device.

[0133] Furthermore, in some embodiments, there are at least two steam channels 203, including a first steam channel 203a connected to the first evaporation chamber 206 and a second steam channel 203b connected to the second evaporation chamber 207. Relative to the first evaporation chamber 206, the reflux channel 202 is arranged close to the second evaporation chamber 207 so that the length of the first steam channel 203a is greater than the length of the second steam channel 203b. In this way, due to the large calorific value of the main heat source 310, when the loop heat pipe 200 is used to dissipate heat to it, the volume of the vapor evaporated from the first evaporation chamber 206 is larger and the heat is also greater. Furthermore, the length of the first steam channel 203a is greater than the length of the second steam channel 203b, and there is enough space to condense the working medium evaporated into the vapor state by the main heat source 310, which can ensure that the main heat source 310 dissipates heat in a timely manner.

[0134] Alternatively, if Figures 4 to 8 As shown, in some embodiments, the liquid replenishment channel 201 includes a first liquid replenishment channel 201a connected to the first evaporation chamber 206 and a second liquid replenishment channel 201b connected to the second evaporation chamber 207. At least part of the first capillary structure 220 and at least part of the second capillary structure 230 are stacked to fill the first liquid replenishment channel 201a and the second liquid replenishment channel 201b. In this way, the second capillary structure 230 can cooperate with the first capillary structure 220 to fill the liquid replenishment channel 201 to increase the patency of liquid reflux. At the same time, it can prevent the vapor working medium from entering the liquid replenishment channel 201, and realize the gas-liquid separation of the loop heat pipe 200.

[0135] Specifically, Figure 4 As shown, when the primary heat source 310 and the secondary heat source 320 work at the same time, the loop heat pipe 200 can form two heat dissipation routes with distinct gas and liquid, respectively dissipating heat for the primary heat source 310 and the secondary heat source 320, thereby improving the heat dissipation capacity and performance of the entire machine.

[0136] like Figure 5As shown, when the main heat source 310 is working, the liquid working medium in the first evaporation chamber 206 absorbs the heat of the main heat source 310 and evaporates into a vapor-state working medium, and flows to the first steam channel 203a. During the flow of the working medium in the first steam channel 203a, the working medium condenses back into a liquid working medium, and is transported to the liquid replenishment channel 201 through the reflux channel 202, and the liquid working medium is transported back to the first steam chamber through the first liquid replenishment channel 201a, so as to continuously replenish the liquid working medium for the first evaporation chamber 206. In this process, the liquid replenishment port 205 is blocked by the first body 231 to prevent the vapor-state working medium from entering the first liquid replenishment channel 201a and causing gas-liquid mixing, thereby ensuring the circulation speed of the loop heat pipe 200 and improving the heat dissipation performance of the loop heat pipe 200.

[0137] Continue to refer to Figure 5 As shown, when the heat of the main heat source 310 is too large, the second steam channel 203b, the second evaporation chamber 207 and the second liquid replenishment channel 201b can also be used to dissipate heat, and the heat dissipation performance of the loop heat pipe 200 can be fully utilized to dissipate heat for the main heat source 310, further improving the heat dissipation efficiency of the single heat source.

[0138] Similarly, when the secondary heat source 320 is working at the same time, the liquid working medium in the second evaporation chamber 207 will absorb the heat of the secondary heat source 320 and evaporate into a vapor-state working medium, and flow to the second steam channel 203b. While the working medium flows in the second steam channel 203b, it condenses back into a liquid working medium, and is transported to the second refill channel 201b through the reflux channel 202. The liquid working medium is then transported back to the second steam chamber through the refill channel 201, so as to continuously replenish the second evaporation chamber 207 with liquid working medium. In this process, the refill port 205 is blocked by the first body 231 to prevent the vapor-state working medium from entering the second refill channel 201b and causing gas-liquid mixing, thereby ensuring the circulation speed of the loop heat pipe 200 and improving the heat dissipation performance of the loop heat pipe 200. In this process,

[0139] like Figure 4 as well as Figure 5 As shown, in some embodiments, the partition 213 includes a first partition 2131 disposed between the first fluid replenishment channel 201a and the first steam channel 203a and a second partition 2132 disposed between the second fluid replenishment channel 201b and the second steam channel 203b, and the first partition 2131 and the second partition 2132 are spaced apart along the length direction of the base component 210 to form a notch 2133. The reflux channel 202 is connected to the first fluid replenishment channel 201a and the second fluid replenishment channel 201b through the notch 2133. The first partition 2131 and the second partition 2132 are spaced apart along the length direction of the base component 210 to form the notch 2133, so that the reflux channel 202 is easily connected to the fluid replenishment channel 201.

[0140] like Figure 5 as well as Figure 8 As shown, in some embodiments, part of the second capillary structure 230 passes through the notch 2133 and contacts the reflux channel 202, and blocks the notch 2133. In this way, the second capillary structure 230 can cooperate with the first capillary structure 220 to block the notch 2133, so as to prevent the vapor-state working medium from entering the liquid replenishing channel 201 through the notch 2133 and causing gas-liquid mixing, thereby ensuring the circulation speed of the loop heat pipe 200 and improving the heat dissipation performance of the loop heat pipe 200.

[0141] It should be noted that there may be many specific implementations of the first partition 2131, including at least one of a partition, an isolation belt, an isolation hole, etc.

[0142] like Fig. 9 As shown, in some embodiments, the first partition 2131 includes a first partition, and the first partition is disposed between the liquid infusion channel 201 and the steam channel 203. In this way, the liquid infusion channel 201 and the steam channel 203 are separated by the partition to reduce mutual interference, which is easy to implement.

[0143] Optionally, in some embodiments, the first partition 2131 includes a first isolation hole, and the first isolation hole is used to separate adjacent fluid infusion channels 201 and steam channels 203. In this way, the isolation hole can be used to separate adjacent fluid infusion channels 201 and steam channels 203 to reduce mutual interference. At the same time, the isolation hole allows the adjacent fluid infusion channels 201 and steam channels 203 to be spaced apart, reducing the direct transfer of heat through the base component 210, further reducing mutual interference.

[0144] Optionally, in some embodiments, the first partition 2131 includes a first partition and a first isolation hole, and the first isolation hole cooperates with the first partition to separate adjacent fluid infusion channels 201 and steam channels 203 .

[0145] It should be noted that there are many specific implementations of the base assembly 210, as long as it can form the pipeline unit 211 and the evaporation chamber 212. For example, a plate assembly, a frame assembly, etc.

[0146] Based on any of the above embodiments, Figures 4 to 9As shown, in some embodiments, the base assembly 210 includes a first plate 214 and a second plate 215, and the first plate 214 and the second plate 215 cooperate to form a receiving chamber. The partition 213 is disposed in the receiving chamber to divide the receiving chamber into a steam channel 203, a reflux channel 202, a liquid replenishing channel 201, and an evaporation chamber 212. In this way, through the cooperation of the first plate 214 and the second plate 215 with the partition 213, it is convenient to divide the receiving chamber into at least two steam channels 203, a reflux channel 202, a liquid replenishing channel 201, and at least two evaporation chambers 212 corresponding to the steam channel 203, which is easy to implement.

[0147] It should be noted that the first plate body 214 and the second plate body 215 may be manufactured in a variety of ways, including but not limited to stamping, etching, laser engraving, milling, etc.

[0148] Optionally, the first plate 214 and / or the second plate 215 is 0.1 mm to 0.2 mm.

[0149] In some embodiments, the first plate 214 and the second plate 215 are stamped and formed separately and then assembled together.

[0150] In some embodiments, such as Figure 7 as well as Fig. 9 As shown, the partition 213 includes a partition. Two ends of the partition are respectively in contact with the first plate 214 and the second plate 215. In this way, the steam channel 203 and the liquid replenishing channel 201 are easily separated by the partition, reducing the mixing of gas and liquid and affecting the heat dissipation efficiency of the loop heat pipe 200.

[0151] Optionally, in some embodiments, the partition 213 includes a welding layer, and the welding layer is welded and fixed to the first plate 214 and the second plate 215. In this way, a portion of the first plate 214 is welded and fixed to the second plate 215 through the welding layer, and a portion of the steam channel 203 is separated from the liquid replenishing channel 201, so that the structure is compact and the connection is reliable.

[0152] Furthermore, in some embodiments, the isolation holes are opened in the welding layer. Thus, by opening the isolation holes in the welding layer, the adjacent steam channels 203 and the liquid replenishing channels 201 are spaced apart, reducing the direct transfer of heat through the base component 210 and further reducing mutual interference.

[0153] Based on any of the above embodiments of the first plate 214, Figures 6 to 8 As shown, in some embodiments, at least one of the first plate 214 and the second plate 215 is provided with a groove 208, and the other of the first plate 214 and the second plate 215 covers the groove 208 to form a receiving cavity. In this way, the groove 208 is used to facilitate the formation of the receiving cavity.

[0154] Optionally, the first plate 214 is provided with a groove 208, and the second plate 215 is used as a cover plate, that is, the second plate 215 is covered on the opening side of the groove 208 of the first plate 214, and the groove 208 on the first plate 214 and the second plate 215 together enclose a closed pipeline unit 211 and an evaporation chamber 212.

[0155] Optionally, the second plate 215 is provided with a groove 208 and the first plate 214 is used as a cover plate, that is, the first plate 214 is covered on the opening side of the groove 208 of the second plate 215 , and the groove 208 of the second plate 215 and the first plate 214 together enclose a closed pipeline unit 211 and an evaporation chamber 212 .

[0156] Optionally, the first plate 214 and the second plate 215 are both provided with a groove 208 , that is, the openings of the grooves 208 on the first plate 214 and the second plate 215 are arranged opposite to each other, and the grooves 208 of the second plate 215 and the first plate 214 together enclose a closed pipeline unit 211 and an evaporation chamber 212 .

[0157] Based on the above embodiments, Figures 6 to 9 As shown, in some embodiments, the first plate 214 is provided with a groove 208, the first capillary structure 220 covers the bottom of the groove 208, and the first capillary structure 220 is provided with an avoidance groove 221 for avoiding the partition 213. In this way, the first capillary structure 220 is covered on the bottom of the groove 208, and the partition 213 is avoided by the avoidance groove 221, so that the first capillary structure 220 is easily integrated into the first plate 214, and then covered with the second capillary structure 230, and then assembled with the second plate 215, so that the loop heat pipe 200 can be manufactured, so that the assembly efficiency of the loop heat pipe 200 is high.

[0158] Based on any of the above embodiments, Figure 8 As shown, in some embodiments, the second plate 215 is provided with a support column 209, and the support column 209 avoids the second capillary structure 230 and protrudes toward the first capillary structure 220. The support column 209 is in abutment with the first capillary structure 220. In this way, by providing the support column 209, the first plate 214 and the second plate 215 will not be easily deformed to cause the pipe unit 211 or the evaporation chamber 212 to be squeezed and disconnected, which is conducive to improving the reliability of the loop heat pipe 200.

[0159] Or, if Fig.11As shown, in another embodiment, when the second plate 215 is in a non-pressurized state, the support column 209 and the first capillary structure 220 are in clearance fit; when the second plate 215 and / or the first plate 214 are in a pressurized state, the support column 209 and the first capillary structure 220 are in contact and fit to support the first plate 214 and the second plate 215. In this way, since there is a gap between the first capillary structure 220 and the support portion, the support portion will not block the vaporized cooling medium in the first capillary structure 220, which can improve the flow efficiency of the cooling medium. When the body is deformed, the support portion contacts the first capillary structure 220 to support the body. Thus, the first capillary structure 220 can be used to buffer the force on the body, which can suppress or avoid deformation of the body, and avoid partial areas of the body from being unable to obtain effective support due to offset, thereby causing the area to deform and affecting the heat dissipation effect.

[0160] Optionally, in some embodiments, one of the first plate 214 and the second plate 215 includes a middle frame or a battery 400 cover. In this way, one of the first plate 214 and the second plate 215 is integrally formed with the middle frame or the battery 400 cover, so as to fully utilize the thickness space of the middle frame or the battery 400 cover to integrate the loop heat pipe 200, which is conducive to achieving a thin and light electronic device 10.

[0161] Based on any of the above embodiments of the reflux channel 202, in some embodiments, the first capillary structure 220 is disposed in the evaporation chamber 212, the liquid replenishing channel 201, the steam channel 203 and the reflux channel 202, and is spaced apart from the inner wall of the base assembly 210. In this way, the provision of the first capillary structure 220 will not cause the pipeline of the loop heat pipe 200 to be blocked.

[0162] Based on any of the above embodiments of the housing, Fig.12 As shown, in some embodiments, the housing is provided with a receiving hole 110, and at least a portion of the loop heat pipe 200 is disposed in the receiving hole 110, so that at least a portion of the loop heat pipe 200 is embedded in the housing. In this way, at least a portion of the loop heat pipe 200 is embedded in the housing through the receiving hole 110, and the thickness space of the housing can be fully utilized to integrate the loop heat pipe 200, that is, the protruding thickness dimension of the heat dissipation structure can be actively reduced, which is conducive to achieving a thin and light electronic device 10.

[0163] In some embodiments, the base assembly 210 is provided with a skirt 216, the housing is provided with a carrier 120 disposed on the side wall of the receiving hole 110, and the skirt 216 is fixedly connected to the carrier 120. In this way, when the loop heat pipe 200 is assembled with the central control, the skirt 216 is clamped on the carrier 120, and then the skirt 216 is fixedly connected to the carrier 120 by welding or bonding, etc., so that at least a part of the loop heat pipe 200 can be easily embedded in the housing.

[0164] It should be noted that the "carrier 120" can be "a part of the shell", that is, the "carrier 120" and the "other parts of the shell, such as the shell body" are manufactured as one piece; it can also be an independent component separable from the "other parts of the shell, such as the shell body", that is, the "carrier 120" can be manufactured independently and then combined with the "other parts of the shell, such as the shell body" into a whole.

[0165] Equivalently, "some body" or "some part" can be a part of the corresponding "component", that is, "some body" or "some part" can be integrally formed with the "other parts of the component"; or it can be an independent component that can be separated from the "other parts of the component", that is, "some body" or "some part" can be independently manufactured and then combined with the "other parts of the component" into a whole. The expression of the above-mentioned "some body" or "some part" in this disclosure is only one of the embodiments, for the convenience of reading, and not to limit the scope of protection of this disclosure. As long as it contains the above-mentioned features and has the same function, it should be understood as an equivalent technical solution of this disclosure.

[0166] It should be noted that the "second plate 215" can be one of the parts of the "base component 210" module, that is, it can be assembled into a module with the "other components of the base component 210" and then assembled modularly; it can also be relatively independent of the "other components of the base component 210" and can be installed separately, that is, it can form a whole with the "other components of the base component 210" in this device.

[0167] Equivalently, the components included in the "unit", "assembly" and "terminal" of the present disclosure can also be flexibly combined, that is, modular production can be carried out according to actual conditions, modular assembly can be carried out as an independent module; or they can be assembled separately to form a module in the present device. The division of the above components in the present disclosure is only one of the embodiments, for the convenience of reading, and not to limit the scope of protection of the present disclosure. As long as the above components are included and have the same functions, it should be understood that it is an equivalent technical solution of the present disclosure.

[0168] The present invention has the following technical effects:

[0169] The thickness can be 0.18mm~0.3mm and the effective area is 2000mm 2 ~7000mm 2 Large area loop heat pipe 200.

[0170] Compared with traditional heat spreaders, the heat transfer performance of the multi-heat source 300 is improved by more than 100% when working, and the heat transfer performance of the single heat source 300 is improved by more than 200% when working.

[0171] It can realize dual-channel multi-heat source 300 heat dissipation, and the layout of the heat source 300 of the whole machine is more flexible, which can reduce the absolute temperature of the motherboard area (CPU).

[0172] Reference Fig.13 As shown, in some embodiments, the electronic device 10 may also include one or more of the following components: a processing component 11, a memory 12, a power component 13, a multimedia component 14, an audio component 15, an input / output interface 16, a sensor component 17, and a communication component 18.

[0173] The processing component generally controls the overall operation of the electronic device, such as operations associated with display, phone calls, data communications, camera operations, and recording operations. The processing component may include one or more processors to execute instructions to complete all or part of the steps of the above-mentioned method. In addition, the processing component may include one or more modules to facilitate interaction between the processing component and other components. For example, the processing component may include a multimedia module to facilitate interaction between the multimedia component and the processing component.

[0174] The memory is configured to store various types of data to support operations on the electronic device. Examples of such data include instructions for any application or method configured to operate on the electronic device, contact data, phone book data, messages, pictures, videos, etc. The memory can be implemented by any type of volatile or non-volatile storage device or a combination thereof, such as static random access memory (SRAM), electrically erasable programmable read-only memory (EEPROM), erasable programmable read-only memory (EPROM), programmable read-only memory (PROM), read-only memory (ROM), magnetic memory, flash memory, magnetic disk or optical disk.

[0175] The control motherboard includes a processing component and a memory.

[0176] The power supply assembly provides power to various components of the electronic device. The power supply assembly may include a power management system, one or more power supplies, and other components associated with generating, managing, and distributing power to the electronic device.

[0177] The multimedia component includes the display module of the present disclosure, which is convenient for human-computer interaction. If the display module includes a touch panel, the display module can be implemented as a touch screen to receive input signals from the user. The touch panel includes one or more touch sensors to sense touch, slide, and gestures on the touch panel. The touch sensor can not only sense the boundaries of the touch or slide action, but also detect the duration and pressure associated with the touch or slide operation. In some embodiments, the multimedia component includes a front camera and / or a rear camera. When the electronic device is in an operating mode, such as a shooting mode or a video mode, the front camera and / or the rear camera can receive external multimedia data. Each front camera and rear camera can be a fixed optical lens system or have focal length and optical zoom capabilities.

[0178] The audio component is configured to output and / or input audio signals. For example, the audio component includes a microphone (MIC), and when the electronic device is in an operating mode, such as a call mode, a recording mode, and a voice recognition mode, the microphone is configured to receive an external audio signal. The received audio signal can be further stored in a memory or sent via a communication component. In some embodiments, the audio component also includes a speaker configured to output an audio signal.

[0179] The input / output interface provides an interface between the processing component and the peripheral interface module, which may be a keyboard, a click wheel, buttons, etc. These buttons may include but are not limited to: a home button, a volume button, a start button, and a lock button.

[0180] The sensor assembly includes one or more sensors configured to provide various aspects of status assessment for the electronic device. For example, the sensor assembly can detect the on / off state of the electronic device, the relative positioning of components, such as the display and keypad of the electronic device, and the sensor assembly can also detect the position change of the electronic device or a component of the electronic device, the presence or absence of user contact with the electronic device, the orientation or acceleration / deceleration of the electronic device, and the temperature change of the electronic device. The sensor assembly may include a proximity sensor configured to detect the presence of nearby objects without any physical contact. The sensor assembly may also include a photosensitive element, such as a CMOS or CCD image sensor, configured to be used in imaging applications. In some embodiments, the sensor assembly may also include an accelerometer, a gyroscope sensor, a magnetic sensor, a pressure sensor, or a temperature sensor.

[0181] The communication component is configured to facilitate wired or wireless communication between the electronic device and other devices. The electronic device can access a wireless network based on a communication standard, such as WiFi, 2G, 3G, 4G or 6G, etc., or a combination thereof. In an exemplary embodiment, the communication component receives a broadcast signal or broadcast-related information from an external broadcast management system via a broadcast channel. In an exemplary embodiment, the communication component also includes a near field communication (NFC) module to facilitate short-range communication. For example, the NFC module can be implemented based on radio frequency identification (RFID) technology, infrared data association (IrDA) technology, ultra-wideband (UWB) technology, Bluetooth (BT) technology and other technologies.

[0182] The technical features of the above embodiments may be combined arbitrarily. To make the description concise, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0183] The above embodiments only express several implementation methods of the present disclosure, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the invention patent. It should be pointed out that, for ordinary technicians in this field, several variations and improvements can be made without departing from the inventive concept of the present disclosure, and these all belong to the protection scope of the present disclosure.

Claims

1. A loop heat pipe, characterized in that: include: A base component, provided with a pipeline unit, a partition and at least two evaporation chambers, the pipeline unit is provided with a liquid replenishment channel, a reflux channel and steam channels corresponding to the evaporation chambers one by one, the at least two evaporation chambers are arranged on the base component at intervals, the evaporation chamber comprises a steam outlet connected to one end of the steam channel and a liquid replenishment port connected to the liquid replenishment channel, the reflux channel is connected to the liquid replenishment channel, and the reflux channel is arranged between two adjacent evaporation chambers, the reflux channel is connected to the other ends of the two adjacent steam channels, and the partition is arranged between the liquid replenishment channel and the steam channel to separate the liquid replenishment channel and the steam channel; a first capillary structure, at least a portion of which is disposed in the liquid replenishing channel and the at least two evaporation chambers; as well as A second capillary structure, wherein the second capillary structure is disposed in at least one of the liquid replenishing channel and the evaporation chamber, the second capillary structure comprises a first body corresponding to the evaporation chamber one by one, the first body shields the corresponding liquid replenishing port of the evaporation chamber, and at least a portion of the first body contacts the first capillary structure.

2. The loop heat pipe according to claim 1, characterized in that: The first body is stacked on the first capillary structure to cover the liquid replenishing port; Alternatively, at least a portion of the first body is filled in the fluid infusion channel to cover the fluid infusion port.

3. The loop heat pipe according to claim 1, characterized in that: The loop heat pipe further includes a working medium disposed in the pipe unit and the at least two evaporation chambers, and the first body shields the liquid replenishing port so that the working medium in a vapor state moves toward the steam outlet; And / or, the at least two evaporation chambers are arranged on the base component at intervals along the length direction of the base component.

4. The loop heat pipe according to claim 1, characterized in that: The thickness of the first capillary structure is H1, 0.02 mm ≤ H1 ≤ 0.1 mm; And / or, the second capillary structure includes at least one layer of capillary structure; and / or, the thickness of the second capillary structure is H2, 0.1 mm≤H2≤0.3 mm.

5. The loop heat pipe according to claim 1, characterized in that: The maximum thickness of the loop heat pipe is 0.2 mm to 0.5 mm.

6. The loop heat pipe according to claim 1, characterized in that: The second capillary structure covers the fluid replenishment channel; And / or, at least a portion of the second capillary structure is disposed in the reflux channel.

7. The loop heat pipe according to claim 1, characterized in that: The first capillary structure covers the evaporation chamber, the liquid replenishment channel and the reflux channel; And / or, part of the first capillary structure is arranged in the steam channel and close to the steam chamber.

8. The loop heat pipe according to claim 1, characterized in that: The at least two evaporation chambers include a first evaporation chamber and a second evaporation chamber. The first evaporation chamber and the second evaporation chamber are spaced apart at two ends of the base component along the length direction of the base component, and the evaporation area of ​​the first evaporation chamber is larger than the evaporation area of ​​the second evaporation chamber.

9. The loop heat pipe according to claim 8, characterized in that: There are at least two steam channels, including a first steam channel connected to the first evaporation chamber and a second steam channel connected to the second evaporation chamber. Relative to the first evaporation chamber, the reflux channel is arranged close to the second evaporation chamber so that the length of the first steam channel is greater than the length of the second steam channel.

10. The loop heat pipe according to claim 9, characterized in that: The liquid replenishment channel includes a first liquid replenishment channel communicating with the first evaporation chamber and a second liquid replenishment channel communicating with the second evaporation chamber; At least a portion of the first capillary structure and at least a portion of the second capillary structure are stacked to fill the first fluid replenishment channel and the second fluid replenishment channel.

11. The loop heat pipe according to claim 10, characterized in that: The partition includes a first partition disposed between the first liquid replenishing channel and the first steam channel and a second partition disposed between the second liquid replenishing channel and the second steam channel, the first partition and the second partition being spaced apart from each other along the length direction of the base component to form a gap; The reflux channel is connected with the first fluid replenishment channel and the second fluid replenishment channel through the notch; And / or, part of the second capillary structure passes through the gap to contact the reflux channel and blocks the gap.

12. The loop heat pipe according to any one of claims 1 to 11, characterized in that: The base assembly includes a first plate and a second plate, the first plate cooperates with the second plate to form a receiving chamber, and the partition is arranged in the receiving chamber to divide the receiving chamber into the steam channel, the reflux channel, the liquid replenishing channel and the evaporation chamber.

13. The loop heat pipe according to claim 12, characterized in that: The partition portion includes a partition plate, and two ends of the partition plate are respectively in contact with the first plate body and the second plate body; Alternatively, the partition includes a welding layer, and the welding layer is welded and fixed to the first plate body and the second plate body.

14. The loop heat pipe according to claim 12, characterized in that: At least one of the first plate body and the second plate body is provided with a groove, and the other of the first plate body and the second plate body covers the groove to form the accommodating cavity.

15. The loop heat pipe according to claim 14, characterized in that: The first plate body is provided with the groove, the first capillary structure covers the bottom of the groove, and the first capillary structure is provided with an avoidance groove for avoiding the partition, and the second capillary structure is arranged on the first capillary structure; And / or, the partition and the second plate are formed by stamping.

16. The loop heat pipe according to claim 12, characterized in that: The second plate body is provided with a support column, the support column avoids the second capillary structure and protrudes toward the first capillary structure; The support column is in abutment with the first capillary structure; Alternatively, when the second plate body is in a non-pressurized state, the support column and the first capillary structure are gap-fitted; when the second plate body and / or the first plate body are in a pressurized state, the support column and the first capillary structure are in contact and fit to support the first plate body and the second plate body.

17. The loop heat pipe according to claim 12, characterized in that: One of the first plate body and the second plate body includes a middle frame or a battery cover.

18. A housing component, characterized in that: It comprises a shell assembly and the loop heat pipe according to any one of claims 1 to 17, wherein the loop heat pipe is arranged in the shell assembly.

19. The housing component according to claim 18, characterized in that The shell component is provided with a receiving hole, and at least a portion of the loop heat pipe is arranged in the receiving hole, so that at least a portion of the loop heat pipe is embedded in the shell component.

20. The housing component according to claim 19, characterized in that The base component is provided with a skirt, and the shell component is provided with a carrier arranged on the side wall of the accommodating hole, and the skirt is fixedly connected to the carrier.

21. An electronic device, characterized in that: It comprises a heat source and the loop heat pipe according to any one of claims 1 to 17, or the shell component according to any one of claims 18 to 20, wherein the heat source comprises at least two and corresponds to the evaporation chambers one by one, the heat source cooperates with the base assembly for heat dissipation, and on the positive projection surface in the thickness direction of the loop heat pipe, at least part of the heat source overlaps with the corresponding evaporation chamber.

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