Methods, devices, equipment, and media for monitoring the offset between onboard vias and copper disk layers.

Abstract

This application relates to the field of circuit board technology, and particularly to a method, apparatus, device, and medium for monitoring the offset between onboard vias and copper disk layers. The method involves laser drilling a first onboard annular hole in a carrier board with a laminated circular copper disk. Then, windows are created around the first onboard annular hole, resulting in at least three arc-shaped windows exposing the circular copper disk. Based on these three windows, the coordinates of the first center of the circular copper disk are determined. At least three target points are selected on the outer arc of the first onboard annular hole. Based on these three target points, the coordinates of the second center of the first onboard annular hole are determined. Based on the first and second center coordinates, a first deviation between the first onboard annular hole and the copper disk is determined. This first deviation is used to monitor the offset of the laser-drilled vias. The monitoring results are effectively quantified using a design approach, thereby identifying anomalies, improving the product process monitoring mechanism and capability, and effectively increasing the product yield.

Description

Technical Field

[0001] This application relates to the field of circuit board technology, and in particular to a method, apparatus, device and medium for monitoring the offset between onboard vias and copper disk layers. Background Technology

[0002] Currently, for offset inspection after drilling and pattern exposure during multilayer board processing, the usual method is to scan each unit within the product using X-ray and AOI to check for hole offset. This can only qualitatively confirm whether there is an abnormality in hole offset, but cannot quantify the value. In this process, monitoring the hole pad design size and processing capability of ball grid array (BGA) carrier boards or printed circuit boards (PCB) multilayer boards can only qualitatively determine whether there is an abnormality through actual AOI hole offset. Furthermore, X-ray inspection or AOI scanning can only be performed after the product processing is completed. If the offset accuracy is abnormal, the product is directly scrapped.

[0003] In addition, concentric circles are added to the edge of the plate to check for broken discs. Although this process can detect abnormalities during product processing, it cannot measure the specific offset value or the measurement value is inaccurate due to the small single aperture.

[0004] Therefore, how to quantify the offset of drilling during circuit board processing, so as to accurately adjust the processing and improve the yield of circuit boards, has become an urgent problem to be solved. Summary of the Invention

[0005] In view of this, embodiments of this application provide a method, apparatus, device and medium for monitoring the offset between onboard holes and copper disk layers, in order to solve the problem of how to quantify the offset of drilling during circuit board processing, thereby accurately adjusting the processing process to improve the yield of circuit boards.

[0006] In a first aspect, embodiments of this application provide a method for monitoring the offset between an onboard via and a copper disk layer, including:

[0007] After laser drilling a first onboard annular hole in the carrier plate of the pressed circular copper disk, windows are made around the first onboard annular hole to obtain at least three arc-shaped windows that expose the circular copper disk. Based on the at least three windows, the coordinates of the first center of the circular copper disk are determined.

[0008] Select at least three target points on the outer arc of the first onboard annular hole, and determine the coordinates of the second center of the first onboard annular hole based on the at least three target points;

[0009] Based on the first center coordinates and the second center coordinates, a first deviation between the first onboard annular hole and the copper disk is determined. The first deviation is used to monitor the offset of the laser drilling.

[0010] In one embodiment, after determining the first deviation between the first onboard annular hole and the copper disk based on the first center coordinates and the second center coordinates, the method further includes:

[0011] Detect whether the first deviation is greater than the first threshold;

[0012] If the first deviation is detected to be greater than the first threshold, the first onboard annular hole is determined to be abnormal, and the abnormality is recorded in the process control log.

[0013] In one embodiment, after determining the second center coordinates of the first onboard annular hole based on at least three target points, the method further includes:

[0014] Electroplating and outer layer patterning are performed sequentially on the carrier plate to obtain a patterned carrier plate;

[0015] Laser drilling is performed on the outer layer pattern of the graphic carrier plate to form a second carrier annular hole;

[0016] The coordinates of the third center of the outer layer pattern are calculated based on the points on the arc of the outer layer pattern, and the coordinates of the fourth center of the second plate-mounted annular hole are calculated based on the points on the outer arc of the second plate-mounted annular hole.

[0017] Based on the third and fourth center coordinates, a second deviation between the second onboard annular hole and the outer layer pattern is determined. This second deviation is used to monitor the offset of the laser drilling.

[0018] In one embodiment, after determining the second deviation between the second onboard annular hole and the outer layer pattern based on the third and fourth center coordinates, the method further includes:

[0019] Detect whether the second deviation is greater than the second threshold;

[0020] If the second deviation is detected to be greater than the second threshold, the second onboard annular hole is determined to be abnormal, and the abnormality is recorded in the process control log.

[0021] In one embodiment, it further includes:

[0022] A first carrier plate center hole is formed by laser drilling at the second center coordinate. The first carrier plate center hole is used to perform visual deviation observation before performing electroplating and outer layer pattern making on the carrier plate in sequence to obtain a patterned carrier plate.

[0023] A second carrier plate center hole is formed by laser drilling at the fourth center coordinate. The second carrier plate center hole is used for visual deviation observation after laser drilling is performed on the outer layer pattern in the patterned carrier plate to form the second carrier plate annular hole.

[0024] In one embodiment, the laser drilling is a ring formed by stacking internal holes of the same diameter to create an onboard annular hole, wherein the width of the annular hole is not less than 1.5 times the diameter of the internal holes.

[0025] In one embodiment, the diameter of the circular copper disk is set between 300 μm and 400 μm, and the diameter of the window is set to be greater than 100 μm.

[0026] Secondly, embodiments of this application provide an offset monitoring device between an onboard via and a copper disk layer, comprising:

[0027] The first center determination module is used to make windows around the first plate-mounted annular hole after laser drilling the carrier plate of the pressed circular copper disk to obtain at least three open windows that expose the circular copper disk. Based on the at least three open windows, the first center coordinates of the circular copper disk are determined.

[0028] The second center determination module is used to select at least three target points on the outer arc of the first onboard annular hole, and determine the coordinates of the second center of the first onboard annular hole based on the at least three target points.

[0029] The first offset monitoring module is used to determine the first deviation between the first onboard annular hole and the copper disk based on the first center coordinate and the second center coordinate. The first deviation is used to monitor the offset of the laser drilling hole.

[0030] In one embodiment, the offset monitoring device further includes:

[0031] The first detection module is used to detect whether the first deviation is greater than a first threshold after the first deviation between the first onboard annular hole and the copper disk is determined based on the first center coordinate and the second center coordinate.

[0032] The first anomaly determination module is used to determine that the first onboard annular hole is abnormal if the detected first deviation is greater than the first threshold, and to record the anomaly in the process control.

[0033] In one embodiment, the offset monitoring device further includes:

[0034] The graphic creation module is used to perform electroplating and outer layer graphic creation on the carrier plate sequentially after determining the second center coordinates of the first plate-mounted annular hole based on at least three target points, to obtain a graphic carrier plate.

[0035] An outer drilling module is used to perform laser drilling in the outer pattern of the patterned carrier board to form a second onboard annular hole;

[0036] The coordinate calculation module is used to calculate the third center coordinate of the outer layer graphic based on the point on the arc of the outer layer graphic, and to calculate the fourth center coordinate of the second plate-mounted annular hole based on the point on the outer arc of the second plate-mounted annular hole.

[0037] The second offset monitoring module is used to determine the second deviation between the second onboard annular hole and the outer layer pattern based on the third and fourth center coordinates. The second deviation is used to monitor the offset of the laser drilling.

[0038] In one embodiment, the offset monitoring device further includes:

[0039] The second detection module is used to detect whether the second deviation is greater than a second threshold after determining the second deviation between the second onboard annular hole and the outer layer pattern based on the third and fourth center coordinates.

[0040] The second anomaly determination module is used to determine that the second onboard annular hole is abnormal if the detected second deviation is greater than the second threshold, and to record the anomaly in the process control.

[0041] In one embodiment, the offset monitoring device further includes:

[0042] The first center hole making module is used to form a first carrier plate center hole by laser drilling at the second center coordinate. The first carrier plate center hole is used to perform visual deviation observation before performing the electroplating operation and outer layer pattern making on the carrier plate in sequence to obtain a patterned carrier plate.

[0043] The second center hole fabrication module is used to form a second carrier plate center hole at the fourth center coordinate using laser drilling. The second carrier plate center hole is used for visual deviation observation after laser drilling is performed on the outer layer pattern in the graphic carrier plate to form a second carrier plate annular hole.

[0044] In one embodiment, the laser drilling is a ring formed by stacking internal holes of the same diameter to create an onboard annular hole, wherein the width of the annular hole is not less than 1.5 times the diameter of the internal holes.

[0045] In one embodiment, the diameter of the circular copper disk is set between 300 μm and 400 μm, and the diameter of the window is set to be greater than 100 μm.

[0046] Thirdly, embodiments of this application provide a computer device, the computer device including a processor, a memory, and a computer program stored in the memory and executable on the processor, wherein when the processor executes the computer program, it implements the offset monitoring method between on-board vias and copper disk layers as described in the first aspect.

[0047] Fourthly, embodiments of this application provide a computer-readable storage medium storing a computer program that, when executed by a processor, implements the offset monitoring method between onboard vias and copper disk layers as described in the first aspect.

[0048] The beneficial effects of this application embodiment compared with the prior art are as follows: After laser drilling a first on-board annular hole in the carrier plate of the pressed circular copper disk, windows are opened around the first on-board annular hole to obtain at least three open windows with arcs exposing the circular copper disk. Based on the at least three open windows, the first center coordinates of the circular copper disk are determined. At least three target points are selected on the outer arc of the first on-board annular hole. Based on the at least three target points, the second center coordinates of the first on-board annular hole are determined. Based on the first center coordinates and the second center coordinates, the first deviation between the first on-board annular hole and the copper disk is determined. The first deviation is used to monitor the offset of the laser drilling. The monitoring results are effectively quantified through the design of Kebang, thereby identifying anomalies, improving the product process monitoring mechanism and capability, and effectively improving the product qualification rate. Attached Figure Description

[0049] To more clearly illustrate the technical solutions in the embodiments of this application, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0050] Figure 1 This is a schematic diagram of an application environment for a method for monitoring the offset between an onboard via and a copper disk layer, as provided in Embodiment 1 of this application.

[0051] Figure 2This is a flowchart illustrating a method for monitoring the offset between an onboard via and a copper disk layer, provided in Embodiment 2 of this application.

[0052] Figure 3 This is a schematic diagram illustrating the principle of the monitoring method provided in Embodiment 2 of this application;

[0053] Figure 4 This is a flowchart illustrating a method for monitoring the offset between an onboard via and a copper disk layer, as provided in Embodiment 3 of this application.

[0054] Figure 5 This is a schematic diagram of the offset monitoring device between the onboard hole and the copper disk layer provided in Embodiment 4 of this application;

[0055] Figure 6 This is a schematic diagram of the structure of a computer device provided in Embodiment 5 of this application. Detailed Implementation

[0056] In the following description, specific details such as particular system architectures and techniques are set forth for illustrative purposes and not for limitation, in order to provide a thorough understanding of the embodiments of this application. However, those skilled in the art will understand that this application may also be implemented in other embodiments without these specific details. In other instances, detailed descriptions of well-known systems, apparatuses, circuits, and methods have been omitted so as not to obscure the description of this application with unnecessary detail.

[0057] It should be understood that, when used in this application specification and the appended claims, the term "comprising" indicates the presence of the described features, integrals, steps, operations, elements and / or components, but does not exclude the presence or addition of one or more other features, integrals, steps, operations, elements, components and / or a collection thereof.

[0058] Furthermore, in the description of this application and the appended claims, the terms "first," "second," "third," etc., are used only to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0059] References to "one embodiment" or "some embodiments" as described in this specification mean that one or more embodiments of this application include a specific feature, structure, or characteristic described in connection with that embodiment. Therefore, the phrases "in one embodiment," "in some embodiments," "in other embodiments," "in still other embodiments," etc., appearing in different parts of this specification do not necessarily refer to the same embodiment, but rather mean "one or more, but not all, embodiments," unless otherwise specifically emphasized. The terms "comprising," "including," "having," and variations thereof mean "including but not limited to," unless otherwise specifically emphasized.

[0060] It should be understood that the sequence number of each step in the following embodiments does not imply the order of execution. The execution order of each process should be determined by its function and internal logic, and should not constitute any limitation on the implementation process of the embodiments of this application.

[0061] To illustrate the technical solution of this application, specific embodiments are described below.

[0062] The method for monitoring the offset between onboard vias and copper disk layers provided in Embodiment 1 of this application can be applied to, for example... Figure 1 In this application environment, the server connects to the client, which is used to collect relevant data. The client can be a microscope device used to obtain the coordinates of points on an arc. The server includes, but is not limited to, PDAs, desktop computers, laptops, Ultra-Mobile Personal Computers (UMPCs), netbooks, cloud computing devices, and Personal Digital Assistants (PDAs).

[0063] See Figure 2 This is a flowchart illustrating a method for monitoring the offset between an onboard via and a copper disk layer, as provided in Embodiment 2 of this application. The method includes the following steps:

[0064] Step S201: After laser drilling a hole in the carrier plate of the pressed circular copper disk to form the first on-board annular hole, windows are made around the first on-board annular hole to obtain at least three open windows that expose the circular copper disk. Based on the at least three open windows, the coordinates of the first center of the circular copper disk are determined.

[0065] Step S202: Select at least three target points on the outer arc of the first onboard annular hole, and determine the coordinates of the second center of the first onboard annular hole based on the at least three target points.

[0066] Step S203: Determine the first deviation between the first onboard annular hole and the copper disk based on the first and second center coordinates. The first deviation is used to monitor the offset of the laser drilling.

[0067] For BGA carrier boards or PCB multilayer boards, the following processing flow can be used: drilling of bare copper plates, electroplating, pattern transfer, lamination, laser drilling, hole deviation check, electroplating, pattern, pattern deviation check.

[0068] Hole misalignment check is performed by executing steps S201 to S203 above, and pattern misalignment check is performed by executing subsequent steps S301 to S304. Of course, in one embodiment, it is not necessary to print patterns on the BGA carrier board or PCB multilayer board, so only hole misalignment check needs to be performed.

[0069] In the inspection of hole deviation, a circular copper pad (i.e., a circular copper disk) is designed for the inner layer pattern. When the outer layer is laser-drilled, a window is opened at the edge of the circular copper pad to expose it. During measurement, the four sides of the copper pad can be selected to form a circle. Then, the outer layer laser drilling is designed to drill a ring using the inner hole. The deviation d value of the distance between the center of the arc and the center of the inner layer copper pad can be measured with a microscope, as well as the corresponding components dx and dy, which characterize the offset direction and degree of the laser drilling and the inner layer pattern.

[0070] It should be understood that "Kebang" refers to a design in the circuit board industry where the surface of a product has an exposed bottom copper layer; "broken pad" refers to the process in which, during the drilling process of a circuit board, the corresponding hole needs to be drilled onto the copper pad formed after the pattern exposure and etching. If the hole is drilled outside the copper pad or partially breaks out of the copper pad, it is called a broken pad; "alignment" refers to the difference between the actual product and the theoretical design pattern during the pattern transfer or laser drilling process, which may occur due to the processing precision of the equipment or the expansion and contraction of the product itself. The difference between the theoretical design value of the pattern or hole and the actual position value of the pattern or hole is called the alignment; "pad" refers to the copper pad produced after pattern exposure and etching.

[0071] like Figure 3 The diagram shown illustrates the principle of the monitoring method provided in Embodiment 2 of this application. Specifically, during microscope measurement, three points are taken from the arc edge of the exposed copper disk through the window to form a circle, and the center coordinates are automatically generated. Similarly, during microscope measurement, three points are taken from the arc edge of the annular hole to form a circle, and the center coordinates are automatically generated. The distance between the centers formed by the two center coordinates is the offset. The dx value can be used to characterize the offset in the X (horizontal) direction, and the dy value can be used to characterize the offset in the Y (vertical) direction.

[0072] In this embodiment, after laser drilling a first on-board annular hole in the carrier plate of the pressed circular copper disk, windows are made around the first on-board annular hole to obtain at least three arc-shaped windows that expose the circular copper disk. Based on the at least three windows, the first center coordinates of the circular copper disk are determined. At least three target points are selected on the outer arc of the first on-board annular hole. Based on the at least three target points, the second center coordinates of the first on-board annular hole are determined. Based on the first and second center coordinates, the first deviation between the first on-board annular hole and the copper disk is determined. The first deviation is used to monitor the offset of the laser drilling. The monitoring results are effectively quantified through the design of Kebang, thereby identifying anomalies, improving the product process monitoring mechanism and capability, and effectively improving the product qualification rate.

[0073] In one embodiment, after determining the first deviation between the first onboard annular hole and the copper disk based on the first and second center coordinates, the method further includes:

[0074] Detect whether the first deviation is greater than the first threshold;

[0075] If the detected first deviation is greater than the first threshold, the first onboard annular hole is determined to be abnormal, and the abnormality is recorded in the process control log.

[0076] The first threshold is a value set according to user needs. It can find an optimal data point while ensuring efficiency and accuracy, thus accurately identifying anomalies while maintaining product processing efficiency. Statistical Process Control (SPC) records offset values ​​to manage product process capabilities.

[0077] In one embodiment, the laser drilling is performed by stacking internal holes of the same diameter to form an on-board annular hole, and the width of the annular hole is not less than 1.5 times the diameter of the internal holes.

[0078] When using laser drilling, the internal holes of the same diameter are stacked to form an arc, with the stacked hole width being at least 1.5 times the internal hole diameter. The arcs are then joined together to form a ring.

[0079] In one embodiment, the diameter of the circular copper disk is set between 300 μm and 400 μm, and the diameter of the window is set to be greater than 100 μm.

[0080] The copper pad design is around 350um, which facilitates the design of the hole ring, the opening of the copper pad, and the measurement of the center deviation. The inner copper pad opening uses a laser drilling hole with a diameter of 100um or more to make it easier to select the edge or to capture the copper edge when the copper layer expands or contracts during measurement.

[0081] like Figure 4 The diagram shown is a flowchart illustrating a method for monitoring the offset between an onboard via and a copper disk layer according to Embodiment 3 of this application. After determining the second center coordinates of the first onboard annular via based on at least three target points in step S202, the method further includes the following steps:

[0082] Step S401: Perform electroplating and outer layer pattern fabrication on the carrier plate sequentially to obtain a carrier plate with pattern.

[0083] Step S402: Laser drilling is performed on the outer layer pattern of the patterned substrate to form a second substrate annular hole.

[0084] Step S403: Calculate the coordinates of the third center of the outer layer pattern based on the points on the arc of the outer layer pattern, and calculate the coordinates of the fourth center of the second plate-mounted annular hole based on the points on the outer arc of the second plate-mounted annular hole.

[0085] Step S404: Based on the coordinates of the third and fourth centers, determine the second deviation between the second onboard annular hole and the outer layer pattern. The second deviation is used to monitor the offset of the laser drilling.

[0086] In this design, the inner ring is drilled using the inner hole for laser drilling. A circular copper pad is designed for the outer layer pattern. During measurement, the deviation between the center of the copper pad and the center of the inner ring is measured. This deviation of the outer layer pattern from the inner laser drilling hole represents the direction and degree of offset between the laser drilling hole and the outer layer pattern.

[0087] In one embodiment, after determining the second deviation between the second onboard annular hole and the outer layer pattern based on the third and fourth center coordinates, the method further includes:

[0088] Detect whether the second deviation is greater than the second threshold;

[0089] If the second deviation is detected to be greater than the second threshold, the second onboard annular hole is determined to be abnormal, and the abnormality is recorded in the process control log.

[0090] In one embodiment, the method further includes:

[0091] A laser drill is used to form the first carrier plate center hole at the second center coordinate. The first carrier plate center hole is used to perform visual deviation observation before performing electroplating and outer layer pattern making on the carrier plate in sequence to obtain a patterned carrier plate.

[0092] A second carrier plate center hole is formed by laser drilling at the fourth center coordinate. The second carrier plate center hole is used to perform visual deviation observation after laser drilling is performed on the outer layer pattern of the patterned carrier plate to form the second carrier plate annular hole.

[0093] The device features a single internal aperture at the center of the inner circle, allowing for visual inspection to check for concentric circle deviations. This enables simultaneous visual inspection of the remaining devices when performing microscopic sampling on a portion of the device.

[0094] Corresponding to the offset monitoring method between the onboard via and the copper disk layer in the above embodiment, Figure 5 This diagram illustrates the structural block diagram of the offset monitoring device between the onboard via and the copper disk layer provided in Embodiment 4 of this application. The offset monitoring device is applied to... Figure 1The server in the diagram connects to the client, which is used to collect relevant data. The client can be a microscope device used to obtain the coordinates of points on an arc. For ease of explanation, only the parts relevant to the embodiments of this application are shown.

[0095] See Figure 5 The offset monitoring device includes:

[0096] The first center determination module 51 is used to make windows around the first plate-mounted annular holes after laser drilling the carrier plate of the pressed circular copper disk to obtain at least three open windows with arcs protruding from the circular copper disk, and to determine the first center coordinates of the circular copper disk based on the at least three open windows.

[0097] The second center determination module 52 is used to select at least three target points on the outer arc of the first onboard annular hole, and determine the second center coordinates of the first onboard annular hole based on the at least three target points.

[0098] The first offset monitoring module 53 is used to determine the first deviation between the first onboard annular hole and the copper disk based on the first center coordinate and the second center coordinate. The first deviation is used to monitor the offset of the laser drilling hole.

[0099] Optionally, the offset monitoring device also includes:

[0100] The first detection module is used to determine whether the first deviation between the first onboard annular hole and the copper disk is greater than a first threshold after determining the first deviation based on the first center coordinates and the second center coordinates.

[0101] The first anomaly determination module is used to determine that the first onboard annular hole is abnormal if the detected first deviation is greater than the first threshold, and to record the anomaly in the process control record.

[0102] Optionally, the offset monitoring device also includes:

[0103] The graphic creation module is used to perform electroplating and outer layer graphic creation on the carrier plate sequentially after determining the second center coordinates of the annular hole on the first plate based on at least three target points, so as to obtain a carrier plate with graphic.

[0104] The outer drilling module is used to perform laser drilling in the outer pattern of the graphic carrier board to form a second onboard annular hole.

[0105] The coordinate calculation module is used to calculate the coordinates of the third center of the outer layer graphic based on the points on the arc of the outer layer graphic, and to calculate the coordinates of the fourth center of the second plate-mounted annular hole based on the points on the outer arc of the second plate-mounted annular hole.

[0106] The second offset monitoring module is used to determine the second deviation between the second onboard annular hole and the outer layer pattern based on the third and fourth center coordinates. The second deviation is used to monitor the offset of the laser drilling.

[0107] Optionally, the offset monitoring device also includes:

[0108] The second detection module is used to detect whether the second deviation is greater than the second threshold after determining the second deviation between the second onboard annular hole and the outer layer pattern based on the third and fourth center coordinates.

[0109] The second anomaly determination module is used to determine that the second onboard annular hole is abnormal if the detected second deviation is greater than the second threshold, and to record the anomaly in the process control record.

[0110] Optionally, the offset monitoring device also includes:

[0111] The first center hole making module is used to form the first carrier plate center hole by laser drilling at the second center coordinate. The first carrier plate center hole is used to perform visual deviation observation before performing electroplating operation and outer layer pattern making on the carrier plate in sequence to obtain a patterned carrier plate.

[0112] The second center hole creation module is used to form the second carrier plate center hole by laser drilling at the fourth center coordinate. The second carrier plate center hole is used for visual deviation observation after laser drilling is performed on the outer layer pattern of the graphic carrier plate to form the second carrier plate annular hole.

[0113] Optionally, the laser drilling is used to form an onboard annular hole by stacking internal holes of the same diameter, and the width of the annular hole is not less than 1.5 times the diameter of the internal hole.

[0114] Optionally, the diameter of the circular copper disk is set between 300μm and 400μm, and the diameter of the window is set to be greater than 100μm.

[0115] It should be noted that the information interaction and execution process between the above modules are based on the same concept as the method embodiments of this application. For details on their specific functions and technical effects, please refer to the method embodiments section, and they will not be repeated here.

[0116] Figure 6 This is a schematic diagram of the structure of a computer device provided in Embodiment 5 of this application. Figure 6 As shown, the computer device of this embodiment includes: at least one processor ( Figure 6 Only one is shown in the diagram, along with a memory and a computer program stored in the memory that can run on at least one processor. When the processor executes the computer program, it implements the steps in the embodiments of the mining method for any of the aforementioned entity enhancement rules.

[0117] Those skilled in the art will understand that Figure 6 This is merely an example of a device and does not constitute a limitation on the vehicle computer system. The vehicle computer system may include more or fewer components than shown in the figure, or a combination of certain components, or different components.

[0118] The processor referred to can be a CPU, but it can also be other general-purpose processors, digital signal processors (DSPs), application-specific integrated circuits (ASICs), field-programmable gate arrays (FPGAs), or other programmable logic devices, discrete gate or transistor logic devices, discrete hardware components, etc. A general-purpose processor can be a microprocessor or any conventional processor.

[0119] Memory includes readable storage media, internal memory, etc., wherein internal memory can be the RAM of a computer device, providing an environment for the operation of the operating system and computer-readable instructions stored in the readable storage media. The readable storage media can be the hard drive of a computer device, or in other embodiments, it can be an external storage device of the computer device, such as a plug-in hard drive, Smart Media Card (SMC), Secure Digital (SD) card, or Flash Card. Furthermore, memory can include both internal storage units and external storage devices of the computer device. Memory is used to store the operating system, applications, bootloader, data, and other programs, such as program code for computer programs. Memory can also be used to temporarily store data that has been output or will be output.

[0120] In the above embodiments, the descriptions of each embodiment have different focuses. For parts that are not described in detail or recorded in a certain embodiment, please refer to the relevant descriptions of other embodiments.

[0121] Those skilled in the art will recognize that the units and algorithm steps of the various examples described in conjunction with the embodiments disclosed herein can be implemented in electronic hardware, or a combination of computer software and electronic hardware. Whether these functions are implemented in hardware or software depends on the specific application and design constraints of the technical solution. Those skilled in the art can use different methods to implement the described functions for each specific application, but such implementation should not be considered beyond the scope of this application.

[0122] In the embodiments provided in this application, it should be understood that the disclosed apparatus / control devices and methods can be implemented in other ways. For example, the apparatus / control device embodiments described above are merely illustrative. For instance, the division of modules or units is only a logical functional division, and in actual implementation, there may be other division methods. For example, multiple units or components may be combined or integrated into another system, or some features may be ignored or not executed. Furthermore, the coupling or direct coupling or communication connection shown or discussed may be through some interfaces; the indirect coupling or communication connection between apparatuses or units may be electrical, mechanical, or other forms.

[0123] The units described as separate components may or may not be physically separate. The components shown as units may or may not be physical units; that is, they may be located in one place or distributed across multiple network units. Some or all of the units can be selected to achieve the purpose of this embodiment according to actual needs.

[0124] The above embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this application, and should all be included within the protection scope of this application.

Claims

1. A method for monitoring the offset between an onboard via and a copper disk layer, characterized in that, The method comprises the following steps: After a first plate-loaded circular ring hole is formed by laser drilling on a carrier plate for pressing a circular copper disc, windowing is performed around the first plate-loaded circular ring hole to obtain at least three windowing holes leaking out of the circular arc of the circular copper disc, and a first center coordinate of the circular copper disc is determined according to the at least three windowing holes; At least three target points are selected on the outer side circular arc of the first plate-loaded circular ring hole, and a second center coordinate of the first plate-loaded circular ring hole is determined according to the at least three target points; A first deviation between the first plate-loaded circular ring hole and the copper disc is determined according to the first center coordinate and the second center coordinate, and the first deviation is used for offset monitoring of laser drilling; After the second center coordinate of the first plate-loaded circular ring hole is determined according to the at least three target points, the method further comprises the following steps: The carrier plate is sequentially subjected to electroplating and outer layer pattern making to obtain a patterned carrier plate; A second plate-loaded circular ring hole is formed by laser drilling in the outer layer pattern of the patterned carrier plate; A third center coordinate of the outer layer pattern is calculated according to the points on the circular arc of the outer layer pattern, and a fourth center coordinate of the second plate-loaded circular ring hole is calculated according to the points on the outer side circular arc of the second plate-loaded circular ring hole; A second deviation between the second plate-loaded circular ring hole and the outer layer pattern is determined according to the third center coordinate and the fourth center coordinate, and the second deviation is used for offset monitoring of laser drilling.

2. The method of via-to-copper-pad offset monitoring on board as claimed in claim 1, wherein, After the first deviation between the first plate-loaded circular ring hole and the copper disc is determined according to the first center coordinate and the second center coordinate, the method further comprises the following steps: It is detected whether the first deviation is greater than a first threshold value; If it is detected that the first deviation is greater than the first threshold value, it is determined that the first plate-loaded circular ring hole is abnormal, and the abnormality is recorded in statistical process control.

3. The method of on-board hole-to-copper-pit layer offset monitoring of claim 1, wherein, After the second deviation between the second plate-loaded circular ring hole and the outer layer pattern is determined according to the third center coordinate and the fourth center coordinate, the method further comprises the following steps: It is detected whether the second deviation is greater than a second threshold value; If it is detected that the second deviation is greater than the second threshold value, it is determined that the second plate-loaded circular ring hole is abnormal, and the abnormality is recorded in statistical process control.

4. The method of on-board hole-to-copper-pit layer offset monitoring of claim 1, wherein, The method further comprises the following steps: A first carrier plate center hole is formed by laser drilling at the second center coordinate, and the first carrier plate center hole is used for visual deviation observation before the patterned carrier plate is obtained by sequentially performing electroplating and outer layer pattern making on the carrier plate; A second carrier plate center hole is formed by laser drilling at the fourth center coordinate, and the second carrier plate center hole is used for visual deviation observation after the second plate-loaded circular ring hole is formed by laser drilling in the outer layer pattern of the patterned carrier plate.

5. The method of on-board hole-to-copper-pit layer offset monitoring of claim 1, wherein, The laser drilling is a circular ring of a plate-loaded circular ring hole formed by overlapping holes using a content hole with the same diameter, and the width of the circular ring is not less than 1.5 times the diameter of the content hole.

6. The method of on-board hole-to-copper pad layer offset monitoring of claim 1, wherein, The diameter of the circular copper disc is set to be between 300 μm and 400 μm, and the diameter of the windowing hole is set to be greater than 100 μm.

7. An on-board hole-to-copper pad layer offset monitoring device, characterized by, The method comprises the following steps: The first center determination module is configured to, after forming a first plate-mounted circular ring hole by laser drilling a carrier plate on which a compression circular copper disc is arranged, perform windowing around the first plate-mounted circular ring hole to obtain at least three windowing holes through which a circular arc of the circular copper disc leaks, and determine a first center coordinate of the circular copper disc according to the at least three windowing holes. The second center determination module is configured to select at least three target points on an outer side circular arc of the first plate-mounted circular ring hole, and determine a second center coordinate of the first plate-mounted circular ring hole according to the at least three target points. The first offset monitoring module is configured to determine a first deviation amount between the first plate-mounted circular ring hole and the copper disc according to the first center coordinate and the second center coordinate, and use the first deviation amount for offset monitoring of laser drilling. Further comprising: The graphic production module is configured to, after determining the second center coordinate of the first plate-mounted circular ring hole according to the at least three target points, sequentially perform an electroplating operation and an outer layer graphic production on the carrier plate to obtain a graphic carrier plate. The outer layer drilling module is configured to perform laser drilling in the outer layer graphic of the graphic carrier plate to form a second plate-mounted circular ring hole. The coordinate calculation module is configured to calculate a third center coordinate of the outer layer graphic according to a point on a circular arc of the outer layer graphic, and calculate a fourth center coordinate of the second plate-mounted circular ring hole according to a point on an outer side circular arc of the second plate-mounted circular ring hole. The second offset monitoring module is configured to determine a second deviation amount between the second plate-mounted circular ring hole and the outer layer graphic according to the third center coordinate and the fourth center coordinate, and use the second deviation amount for offset monitoring of laser drilling.

8. A computer device, comprising: The computer device comprises a processor, a memory, and a computer program stored in the memory and executable on the processor, and the processor implements the offset monitoring method between a plate-mounted hole and a copper disc layer when executing the computer program.

9. A computer-readable storage medium storing a computer program, the computer program comprising instructions that, when executed by a computer, cause the computer to perform the method of any one of claims 1 to 8. The computer program is executed by the processor to implement the offset monitoring method between a plate-mounted hole and a copper disc layer.

Images