Computer hardware heat dissipation box with dustproof net convenient to disassemble

Abstract

The computer hardware heat dissipation box comprises a bottom plate, a water storage tank is fixedly connected to the center of the top of the bottom plate, a heat dissipation case is fixedly connected to the top of the water storage tank, and a heat conduction device is fixedly connected to the bottom of an inner cavity of the heat dissipation case; an air cooling heat dissipation mechanism is fixedly connected to the top of the heat conduction device, a water cooling heat dissipation mechanism is fixedly connected to the top of the heat dissipation case, mounting mechanisms are fixedly connected to the two sides of the heat dissipation case, an air pump machine is fixedly connected to the position, located on the left side of the water storage tank, of the top of the bottom plate, and an air conveying pipe is fixedly connected to the top of the air pump machine; the invention belongs to the field of computer hardware heat dissipation. According to the computer hardware heat dissipation box with the dustproof net convenient to disassemble, the problem that the temperature in a case of an existing computer hardware heat dissipation box with the dustproof net convenient to disassemble cannot be observed in real time is solved.

Description

Technical Field

[0001] The present invention relates to the field of computer hardware heat dissipation, and in particular to a computer hardware heat dissipation box with a dustproof net that is easy to disassemble. Background Art

[0002] Computer cooling boxes provide users with a stable, efficient and beautiful computer environment through efficient heat dissipation design, reducing hardware temperature, keeping the system running smoothly, reducing noise, avoiding dust accumulation, good compatibility and beautiful personalization. The heat dissipation box can quickly take away the heat generated inside the computer through efficient heat dissipation design, ensuring that the hardware runs at a lower temperature, thereby improving the stability and reliability of the system. Through effective heat dissipation design, such as the flow of cooling liquid and the circulation of air, the heat dissipation box can significantly reduce the temperature of key hardware such as CPU, memory, graphics card, etc., thereby extending the service life of the hardware and reducing the risk of system crash or hardware damage caused by high temperature. Compared with traditional air-cooled heat dissipation systems, water-cooled heat dissipation systems usually have lower noise levels, providing users with a quieter use environment. The design of the heat dissipation box usually includes dust-proof measures, such as filters and sealing designs, which can effectively prevent dust from entering the chassis, keep the interior clean, and reduce the impact of dust on the hardware. Some cooling box designs focus on appearance and personalization, such as a chassis with ARGB lighting effects, which not only improves the aesthetics of the chassis, but also can show the user's personality through lighting effects. Existing computer hardware cooling boxes with easy-to-remove dust screens cannot observe the temperature inside the chassis in real time, making it inconvenient to adjust the cooling power. Summary of the invention

[0003] In view of the deficiencies in the prior art, the present invention provides a computer hardware heat dissipation box with an easily removable dust net, which solves the problem that the existing computer hardware heat dissipation box with an easily removable dust net cannot observe the temperature inside the box in real time and is not convenient for adjusting the heat dissipation power.

[0004] To achieve the above objectives, the present invention is implemented through the following technical solutions: a computer hardware heat dissipation box with an easy-to-remove dustproof net, comprising a bottom plate, a water storage tank is fixedly connected to the center position of the top of the bottom plate, a heat dissipation chassis is fixedly connected to the top of the water storage tank, a heat conduction device is fixedly connected to the bottom of the inner cavity of the heat dissipation chassis, an air-cooled heat dissipation mechanism is fixedly connected to the top of the heat conduction device, a water-cooled heat dissipation mechanism is fixedly connected to the top of the heat dissipation chassis, mounting mechanisms are fixedly connected to both sides of the heat dissipation chassis, two mounting mechanisms are provided, and regular cleaning mechanisms are fixedly connected to the outer surfaces of the two mounting mechanisms, an air pump is fixedly connected to the top of the bottom plate located on the left side of the water storage tank, an air supply pipe is fixedly connected to the top of the air pump, and one end of the air supply pipe away from the air pump is fixedly connected to the left side of the water storage tank; The air-cooling heat dissipation mechanism includes a main frame, a rectifier bridge, an air outlet, an engaging groove, a slot, an insert plate, a heat conducting pin, a fan frame, and a disassembly component. The main frame is a component of an inverted "U" structure, and the air outlet is formed by the gap at the lower end of the main frame. The top of the main frame is fixedly connected to a top plate, and the bottom of the top plate is fixedly connected to a plug plate. An engaging groove adapted to the rectifier bridge is provided at the middle position of the top of the main frame, and slots adapted to the plug plate are symmetrically provided on both sides of the engaging groove at the top of the main frame. Heat conducting pins adapted to the engaging groove are fixedly connected at equal intervals at the inner top of the main frame, and the lower end of the main frame is located below the air outlet and is fixedly connected to the fan frame, a blowing fan is installed in the fan frame, and disassembly components are fixedly connected to the outer walls on both sides of the main frame.

[0005] Preferably, the disassembly assembly includes a socket, a fixing frame, a snap-fit ​​groove, and an elastic steel frame. Sockets are symmetrically provided at both ends of the fan frame, a fixing frame is fixedly connected between the two sockets on the same side of the fan frame, snap-fit ​​grooves are provided on both sides of the fan frame, and an elastic steel frame adapted to the snap-fit ​​groove is fixedly connected to one side of the fixing frame.

[0006] Preferably, a heat dissipation component is fixedly connected to the inner walls on both sides of the inner cavity of the main frame, and the heat dissipation component includes a heat sink, a through slot, a separation sheet, and a ventilation duct. A through slot adapted to the plug-in board is opened on the top of the heat sink, and the heat sink is separated from one end of the through slot to form mutually symmetrical separation sheets, and the gap between the two separation sheets forms a ventilation duct.

[0007] Preferably, the water-cooled heat dissipation mechanism includes a hot air ventilation box, a fan box, a cooling fan, a hot air filter plate, a condenser box, a condenser tube, and a water circulation device. The top of the heat dissipation box is fixedly connected to the hot air ventilation box, the top of the hot air ventilation box is fixedly connected to the fan box, the top of the inner cavity of the fan box is rotatably connected to the cooling fan, hot air filter plates are fixedly connected on both sides of the inner wall of the hot air ventilation box, and a water circulation device is fixed to the right outer wall of the water storage tank.

[0008] Preferably, a condensing box is fixedly connected to the top of the base plate in front of the water storage tank, a condensing pipe is fixedly connected to the top of the condensing box, and one end of the condensing pipe away from the condensing box is fixedly connected to the outer wall of the front side of the heat dissipation chassis.

[0009] Preferably, the water circulation device includes a water pipe, a filter box, an impurity filter plate, a water pump, a lifting pipe, a water spray pipe, and an atomizing nozzle. The right outer wall of the water storage tank is fixedly connected with a water pipe, the end of the water pipe away from the water storage tank is fixedly connected with the filter box, an impurity filter plate is erected and fixedly connected between the top and bottom inner walls of the inner cavity of the filter box, the top of the filter box is fixedly connected with a water pump, the top of the water pump is fixedly connected with a lifting pipe, the side of the lifting pipe away from the water pump is fixedly connected with a water spray pipe, the bottom of the water spray pipe is fixedly connected with an atomizing nozzle, and a plurality of atomizing nozzles are provided.

[0010] Preferably, the heat-conducting device includes a heat-conducting base, a cavity, a superconducting liquid, a temperature sensor, an electric wire, an electric slider, a sliding rod, and a support rod. The heat-conducting base is fixedly connected to the top of the inner cavity of the heat dissipation chassis, a cavity is opened on one side of the heat-conducting base, and superconducting liquid is placed inside the cavity. The temperature sensor is fixedly connected to the left side of the heat-conducting base, a sliding rod is fixedly connected to the left side of the heat-conducting base between the front and rear inner walls of the heat dissipation chassis, and the electric slider is slidably connected to the outer surface of the sliding rod. The electric wire is fixedly connected to the side of the electric slider close to the heat-conducting base, and the side of the wire away from the electric slider is fixedly connected to the temperature sensor, and the side of the electric slider away from the temperature sensor is fixedly connected to the support rod.

[0011] Preferably, the regular cleaning mechanism includes a dustproof frame, a dustproof net, a motor, a screw, a slider, and a cleaning brush. The dustproof frame is fixedly connected to the left outer wall of the heat dissipation chassis, and dustproof nets are installed on both sides of the inner wall of the dustproof frame through an installation mechanism. The inner walls on both sides of the bottom of the dustproof frame are rotatably connected to a screw, one end of the screw is rotatably connected to the motor, the outer surface of the screw is slidably connected to a slider, and the top of the slider is fixedly connected to a cleaning brush.

[0012] Preferably, the mounting mechanism includes a mounting rod, a mounting groove, a spring, a limiting rod, and a limiting hole. The mounting rod is fixedly connected to the outer walls on both sides of the bottom of the dustproof frame. The front and rear sides of the mounting rod are provided with mounting grooves. A spring is fixedly connected to one side of the interior of the mounting groove. One end of the spring away from the mounting groove is fixedly connected to the limiting rod. One end of the spring of the limiting rod is located in the mounting groove, and one end of the limiting rod away from the spring is located in the limiting hole.

[0013] The present invention provides a computer hardware heat dissipation box with a dustproof net that is easy to disassemble. It has the following beneficial effects: 1) The computer hardware heat sink with easy-to-remove dust net is provided with an air-cooled heat sink. Different heat dissipation methods are adopted according to the different temperatures in the case. When the computer hardware is generally heated, the plug-in board is inserted into the slot, and the lower end of the rectifier bridge body is embedded in the fitting groove. At this time, the lower end of the plug-in board is inserted into the through groove, which is conducive to the temperature on the rectifier bridge body being transferred to the main frame. The heat dissipation fan is started to allow air to enter the main frame from the air outlet. Under the inverted "U" structure of the main frame, the wind blown into the equipment can better contact with the heat dissipation component, thereby improving the heat dissipation effect of the heat dissipation component. By setting the separation sheet, the heat exchange area between the heat sink and the air is increased. Under the setting of the ventilation duct, the air flow is pulled, thereby improving the heat dissipation effect of the heat dissipation component. In addition, the fixing frame is inserted into the jack. At this time, the elastic steel frame is moved so that the elastic steel frame is embedded in the fitting groove, thereby realizing the fixing of the fan, facilitating the loading and unloading of the fan frame, and improving the practicality of the equipment. 2) The computer hardware heat sink with easy-to-remove dust net is provided with a water-cooling heat sink. When the computer hardware is heated to a high temperature, the water pump draws water from the water storage tank and sprays it evenly from the atomizing nozzle through the water spray pipe. At this time, water droplets fall on the hot air pipe to form a large amount of water vapor. The process of water evaporating into water vapor requires heat absorption, so it will take away part of the heat on the hot air pipe. The cooling fan on the top of the hot air box extracts water vapor under the drive of the driving motor. The fan transports the external dry air to the inside of the tower through the air inlet pipe. The inlet and outlet of the condenser are connected to the external condenser box. Under the joint cooling effect of the dry air and the condenser, the continuous and rapid circulation cooling inside the heat sink is realized, so that the overall temperature inside the heat sink is maintained at a relatively low level. 3) The computer hardware heat sink with easy-to-remove dust net is provided with a regular cleaning device. When the temperature sensor detects that the temperature of the chassis is further increased, the electric slide moves along the slide rod, thereby driving the support rod on the left side to move, and the support rod drives the dust frame to move, and the dust frame is moved away, thereby increasing the heat dissipation area and allowing the chassis to dissipate heat better; when too much dust accumulates on the surface of the dust net after working for a period of time, the motor is started, and the rotation of the motor drives the screw rod to rotate, thereby driving the slider on the outer surface of the screw rod to move, and the slider drives the cleaning brush to contact the surface of the dust net, and the purpose of cleaning the dust net is achieved by rotating the motor forward and reversely.

[0014] 4) The computer hardware heat sink with easy-to-remove dust net is provided with a mounting mechanism and a heat conduction mechanism. The mounting mechanism includes a mounting rod, a mounting slot, a spring, a limit rod, and a limit hole. The mounting rod is fixedly connected to the outer walls on both sides of the bottom of the dust frame. The front and rear sides of the mounting rod are provided with mounting slots. A spring is fixedly connected to one side of the mounting slot. The end of the spring away from the mounting slot is fixedly connected to the limit rod. One end of the limit rod spring is located in the mounting slot, and the end of the limit rod away from the spring is located in the limit hole. The heat conduction device includes a heat conduction base, a cavity, a superconducting liquid, a temperature sensor, an electric wire, an electric slider, a slide rod, and a support rod. The top of the inner cavity of the heat dissipation chassis is fixedly connected to the heat conduction base. A cavity is provided on one side of the heat conduction base. Superconducting liquid is placed in the cavity. A temperature sensor is fixedly connected to the left side of the heat conduction base. The temperature in the heat dissipation chassis is detected by the temperature sensor to achieve the effect of adjusting different heat dissipation methods according to the temperature in the chassis. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a schematic diagram of the overall structure of the present invention; Figure 2 It is a schematic diagram of the internal structure of the present invention; Figure 3 This is a schematic diagram of the structure of the air-cooling heat dissipation mechanism of the present invention; Figure 4 This is a schematic diagram of the structure of the water circulation device of the present invention; Figure 5 It is a schematic diagram of the structure of the heat dissipation component of the present invention; Figure 6 This is a schematic diagram of the disassembly assembly structure of the present invention; Figure 7 It is a schematic diagram of the structure of the heat conducting device of the present invention; Figure 8 This is a schematic diagram of the structure of the periodic cleaning mechanism of the present invention. Fig. 9 It is a schematic diagram of the installation mechanism of the present invention.

[0016] In the figure: 1, bottom plate; 2, water storage tank; 3, heat dissipation chassis; 4, heat conduction device; 41, heat conduction base; 42, cavity; 44, temperature sensor; 45, wire; 46, electric slider; 47, slide bar; 48, support rod; 5, air cooling mechanism; 50, heat dissipation component; 501, heat sink; 502, through groove; 503, separation sheet; 504, ventilation duct; 51, main frame; 52, rectifier bridge; 521, top plate; 53, air outlet; 54, fitting groove; 55, slot; 56, plug board; 57, heat conduction pin; 58, fan frame; 581, blowing fan; 59, disassembly component; 591, socket; 592, fixing frame; 593, fitting groove; 594. Elastic steel frame; 6. Water-cooled heat dissipation mechanism; 61. Hot air flow box; 62. Fan box; 63. Refrigeration fan; 64. Hot air filter plate; 7. Mounting mechanism; 71. Mounting rod; 72. Mounting slot; 73. Spring; 74. Limit rod; 8. Regular cleaning mechanism; 81. Dustproof frame; 82. Dustproof net; 83. Motor; 84. Screw rod; 85. Slider; 86. Cleaning brush; 9. Air pump; 10. Air pipe; 11. Condensation box; 12. Condensation pipe; 13. Water circulation device; 131. Water pipe; 132. Filter box; 133. Filter plate; 134. Water pump; 135. Lifting pipe; 136. Water spray pipe; 137. Atomizing nozzle. DETAILED DESCRIPTION

[0017] The following will be combined with the accompanying drawings in the examples of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0018] See also Figure 1-9 The present invention provides a technical solution: a computer hardware heat dissipation box with an easy-to-remove dustproof net, comprising a bottom plate 1, a water storage tank 2 is fixedly connected to the center position of the top of the bottom plate 1, a heat dissipation chassis 3 is fixedly connected to the top of the water storage tank 2, a heat conduction device 4 is fixedly connected to the bottom of the inner cavity of the heat dissipation chassis 3, an air-cooling heat dissipation mechanism 5 is fixedly connected to the top of the heat conduction device 4, a water-cooling heat dissipation mechanism 6 is fixedly connected to the top of the heat dissipation chassis 3, mounting mechanisms 7 are fixedly connected to both sides of the heat dissipation chassis 3, two mounting mechanisms 7 are provided, and regular cleaning mechanisms 8 are fixedly connected to the outer surfaces of the two mounting mechanisms 7, an air pump 9 is fixedly connected to the top of the bottom plate 1 located on the left side of the water storage tank 2, an air delivery pipe 10 is fixedly connected to the top of the air pump 9, and an end of the air delivery pipe 10 away from the air pump 9 is fixedly connected to the left side of the water storage tank 2; The air cooling heat dissipation mechanism 5 includes a main frame 51, a rectifier bridge 52, an air outlet 53, an interlocking groove 54, a slot 55, a plug plate 56, a heat conducting pin 57, a fan frame 58, and a disassembly assembly 59. The main frame 51 is a member of an inverted "U" structure, and the air outlet 53 is formed in the gap at the lower end of the main frame 51. The top of the main frame 51 is fixedly connected to a top plate 521, and the bottom of the top plate 521 is fixedly connected to the plug plate 56. The middle position of the top of the main frame 51 is provided with a heat conducting pin 57, which is connected to the rectifier bridge 52. The main frame 51 has an adapted fitting groove 54, and the top of the main frame 51 is symmetrically provided with slots 55 adapted to the plug plate 56 on both sides of the fitting groove 54. The inner top of the main frame 51 is evenly fixedly connected with heat conducting pins 57 adapted to the fitting groove 54. The lower end of the main frame 51 is located below the air outlet 53 and is fixedly connected with a fan frame 58. A blowing fan 581 is installed in the fan frame 58. The outer walls on both sides of the main frame 51 are fixedly connected with disassembly components 59, and the rectifier bridge 52 is an existing device.

[0019] The disassembly assembly 59 includes a socket 591, a fixing frame 592, a snap-fit ​​groove 593, and an elastic steel frame 594. The sockets 591 are symmetrically provided at both ends of the fan frame 58. The fixing frame 592 is fixedly connected between the two sockets 591 on the same side of the fan frame 58. The snap-fit ​​grooves 593 are provided on both sides of the fan frame 58. An elastic steel frame 594 adapted to the snap-fit ​​groove 593 is fixedly connected to one side of the fixing frame 592.

[0020] The inner walls on both sides of the inner cavity of the main frame 51 are fixedly connected with the heat dissipation assembly 50, and the heat dissipation assembly 50 includes a heat sink 501, a through slot 502, a separation sheet 503, and a ventilation duct 504. A through slot 502 adapted to the plug-in board 56 is opened on the top of the heat sink 501, and the end of the heat sink 501 away from the through slot 502 is separated to form mutually symmetrical separation sheets 503, and the gap between the two separation sheets 503 forms a ventilation duct 504.

[0021] The water-cooled heat dissipation mechanism 6 includes a hot air ventilation box 61, a fan box 62, a cooling fan 63, a hot air filter plate 64, a condensation box 11, a condensation pipe 12, and a water circulation device 13. The top of the heat dissipation box 3 is fixedly connected to the hot air ventilation box 61, the top of the hot air ventilation box 61 is fixedly connected to the fan box 62, the top of the inner cavity of the fan box 62 is rotatably connected to the cooling fan 63, the hot air filter plates 64 are fixedly connected to the inner walls of the hot air ventilation box 61 on both sides, and the water circulation device 13 is fixed to the right outer wall of the water storage tank 2.

[0022] A condensation box 11 is fixedly connected to the top of the bottom plate 1 in front of the water storage tank 2 , a condensation pipe 12 is fixedly connected to the top of the condensation box 11 , and one end of the condensation pipe 12 away from the condensation box 11 is fixedly connected to the outer wall of the front side of the heat dissipation chassis 3 .

[0023] The water circulation device 13 includes a water pipe 131, a filter box 132, an impurity filter plate 133, a water pump 134, a lifting pipe 135, a water spray pipe 136, and an atomizing nozzle 137. The water pipe 131 is fixedly connected to the right outer wall of the water storage tank 2, and the end of the water pipe 131 away from the water storage tank 2 is fixedly connected to the filter box 132, and the impurity filter plate 133 is vertically fixedly connected between the top and bottom inner walls of the inner cavity of the filter box 132. The top of the filter box 132 is fixedly connected to the water pump 134, and the top of the water pump 134 is fixedly connected to the lifting pipe 135. The side of the lifting pipe 135 away from the water pump 134 is fixedly connected to the water spray pipe 136, and the bottom of the water spray pipe 136 is fixedly connected to the atomizing nozzle 137, and a plurality of atomizing nozzles 137 are provided.

[0024] The heat conducting device 4 includes a heat conducting base 41, a cavity 42, a superconducting liquid 43, a temperature sensor 44, an electric wire 45, an electric slider 46, a slide rod 47, and a support rod 48. The heat conducting base 41 is fixedly connected to the top of the inner cavity of the heat dissipation chassis 3, a cavity 42 is opened on one side of the heat conducting base 41, and a temperature sensor 44 is fixedly connected to the left side of the heat conducting base 41. A slide rod 47 is fixedly connected to the left side of the heat conducting base 41 between the front and rear inner walls of the heat dissipation chassis 3, and an electric slider 46 is slidably connected to the outer surface of the slide rod 47. The side of the electric slider 46 close to the heat conducting base 41 is fixedly connected to the electric wire 45, and the electric slider 46 is an existing device. The side of the electric wire 45 away from the electric slider 46 is fixedly connected to the temperature sensor 44, and the temperature sensor 44 is an existing device. The side of the electric slider 46 away from the temperature sensor 44 is fixedly connected to the support rod 48.

[0025] The regular cleaning mechanism 8 includes a dustproof frame 81, a dustproof net 82, a motor 83, a screw 84, a slider 85, and a cleaning brush 86. The dustproof frame 81 is fixedly connected to the left outer wall of the heat dissipation chassis 3, and the dustproof net 82 is installed on both sides of the inner wall of the dustproof frame 81 through the installation mechanism 7. The inner walls on both sides of the bottom of the dustproof frame 81 are rotatably connected with the screw 84, one end of the screw 84 is rotatably connected with the motor 83, the outer surface of the screw 84 is slidably connected with the slider 85, and the top of the slider 85 is fixedly connected with a cleaning brush 86.

[0026] The mounting mechanism 7 includes a mounting rod 71, a mounting groove 72, a spring 73, and a limiting rod 74. The mounting rod 71 is fixedly connected to the outer walls on both sides of the bottom of the dustproof frame 81. The front and rear sides of the mounting rod 71 are provided with mounting grooves 72. A spring 73 is fixedly connected to one side of the mounting groove 72. The end of the spring 73 away from the mounting groove 72 is fixedly connected to the limiting rod 74.

[0027] When in use, different heat dissipation methods are adopted according to the different temperatures in the heat dissipation chassis 3. When the heat generation of the computer hardware is relatively normal, the plug-in board 56 is inserted into the slot 55, and the lower end of the rectifier bridge 52 is embedded in the fitting groove 54. At this time, the lower end of the plug-in board 56 is inserted into the through groove 502, which is conducive to the temperature on the rectifier bridge 52 being transferred to the main frame 51. Then, the blowing fan 581 is started to allow air to enter the main frame 51 through the air outlet 53. Under the inverted "U" structure of the main frame 51, the wind blown into the equipment can better contact with the heat dissipation component 50, thereby improving the heat dissipation effect of the heat dissipation component 50. The arrangement of 503 increases the heat exchange area between the heat sink 501 and the air, and under the arrangement of the ventilation duct 504, the air flow is pulled, thereby improving the heat dissipation effect of the heat dissipation component 50; in addition, the fixing frame 592 is inserted into the inside of the plug hole 591, at this time, the elastic steel frame 594 is moved so that the elastic steel frame 594 is embedded in the inside of the snap-fit ​​groove 593, thereby achieving the fixation of the fan frame 58, facilitating the loading and unloading of the fan frame 58, and improving the practicality of the equipment; when the computer hardware is heated to a high temperature, the water pump 134 draws water from the water storage tank 2, passes through the filter box 132, and then enters the water spray pipe 136 through the lifting pipe 135, and then the clean water is discharged from the atomizing nozzle 137 The atomized clean water is sprayed out evenly, and the atomized clean water contacts the heat generated by the computer hardware to form a large amount of water vapor. The process of water evaporating into water vapor requires heat absorption, so it will take away part of the heat of the heat dissipation chassis 3. The cooling fan 63 on the top of the hot air box 61 extracts the water vapor under the drive of the driving motor, and the air pump 9 transports the external dry air to the inside of the heat dissipation chassis 3 through the air pipe 10. The inlet and outlet of the condenser tube 12 are connected to the external condensation box 11. Under the joint cooling effect of the dry air and the condenser tube 12, the continuous and rapid circulation cooling inside the heat dissipation chassis 3 is realized, so that the overall temperature inside the heat dissipation chassis 3 is maintained at a relatively low level; when the temperature When the temperature sensor 44 detects that the temperature of the heat dissipation chassis 3 further increases, the electric slider 46 moves along the slide rod 47, thereby driving the support rod 48 on its left side to move, and the support rod 48 drives the dustproof frame 81 to move, and the dustproof frame 81 is moved away, thereby increasing the heat dissipation area, so that the heat dissipation chassis 3 can dissipate heat better; when too much dust accumulates on the surface of the dustproof net 82 after working for a period of time, the motor 83 is started, and the rotation of the motor 83 drives the screw rod 84 to rotate, thereby driving the slider 85 on the outer surface of the screw rod 84 to move, and the slider 85 drives the cleaning brush 86 to contact the surface of the dustproof net 82, and the purpose of cleaning the dustproof net 82 is achieved by reversing the motor 83.

[0028] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions. The sentence "includes an element defined by..." does not exclude the existence of other identical elements in the process, method, article or device including the element".

[0029] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A computer hardware heat dissipation box with a dust screen that is easy to remove, comprising a bottom plate (1), characterized in that: A water storage tank (2) is fixedly connected to the center of the top of the base plate (1), a heat dissipation chassis (3) is fixedly connected to the top of the water storage tank (2), a heat conduction device (4) is fixedly connected to the bottom of the inner cavity of the heat dissipation chassis (3), an air cooling heat dissipation mechanism (5) is fixedly connected to the top of the heat conduction device (4), a water cooling heat dissipation mechanism (6) is fixedly connected to the top of the heat dissipation chassis (3), mounting mechanisms (7) are fixedly connected to both sides of the heat dissipation chassis (3), two mounting mechanisms (7) are provided, and regular cleaning mechanisms (8) are fixedly connected to the outer surfaces of the two mounting mechanisms (7), an air pump (9) is fixedly connected to the top of the base plate (1) located on the left side of the water storage tank (2), an air supply pipe (10) is fixedly connected to the top of the air pump (9), and an end of the air supply pipe (10) away from the air pump (9) is fixedly connected to the left side of the water storage tank (2); The air-cooling heat dissipation mechanism (5) comprises a main frame (51), a rectifier bridge (52), an air outlet (53), an engaging groove (54), a slot (55), an insert plate (56), a heat-conducting pin (57), a fan frame (58), and a disassembly component (59); the main frame (51) is a member of an inverted "U"-shaped structure, and a gap at the lower end of the main frame (51) forms the air outlet (53); the top end of the main frame (51) is fixedly connected to a top plate (521); the bottom of the top plate (521) is fixedly connected to an insert plate (56); and a central portion of the top end of the main frame (51) is provided with a There is an engaging groove (54) adapted to the rectifier bridge (52), and the top end of the main frame (51) is located on both sides of the engaging groove (54) and has slots (55) adapted to the plug board (56) symmetrically opened, and the top end of the main frame (51) is fixedly connected with heat conducting pins (57) adapted to the engaging groove (54) at equal intervals, and the lower end of the main frame (51) is located below the air outlet (53) and is fixedly connected with a fan frame (58), and a blowing fan (581) is installed in the fan frame (58), and the outer walls on both sides of the main frame (51) are fixedly connected with disassembly components (59).

2. A computer hardware heat dissipation box with an easily removable dust screen according to claim 1, characterized in that: The disassembly assembly (59) comprises a plug hole (591), a fixing frame (592), a snap-fitting groove (593), and an elastic steel frame (594); the plug holes (591) are symmetrically provided at both ends of the fan frame (58); a fixing frame (592) is fixedly connected between two plug holes (591) on the same side of the fan frame (58); snap-fitting grooves (593) are provided on both sides of the fan frame (58); and an elastic steel frame (594) adapted to the snap-fitting groove (593) is fixedly connected to one side of the fixing frame (592).

3. The computer hardware heat dissipation box with easily removable dust screen according to claim 2, characterized in that: The inner walls on both sides of the inner cavity of the main frame (51) are fixedly connected with heat dissipation components (50), and the heat dissipation components (50) include a heat sink (501), a through slot (502), a separation sheet (503), and a ventilation duct (504). The top of the heat sink (501) is provided with a through slot (502) adapted to the plug board (56), and one end of the heat sink (501) away from the through slot (502) is separated to form mutually symmetrical separation sheets (503), and the gap between the two separation sheets (503) forms the ventilation duct (504).

4. The computer hardware heat dissipation box with easily removable dust screen according to claim 3, characterized in that: The water-cooled heat dissipation mechanism (6) comprises a hot air ventilation box (61), a fan box (62), a cooling fan (63), a hot air filter plate (64), a condensation box (11), a condensation pipe (12), and a water circulation device (13); the top of the heat dissipation box (3) is fixedly connected to the hot air ventilation box (61); the top of the hot air ventilation box (61) is fixedly connected to the fan box (62); the top of the inner cavity of the fan box (62) is rotatably connected to the cooling fan (63); the hot air filter plates (64) are fixedly connected to both sides of the inner wall of the hot air ventilation box (61); and the water circulation device (13) is fixedly connected to the right outer wall of the water storage tank (2).

5. A computer hardware heat dissipation box with an easily removable dust screen according to claim 4, characterized in that: The top of the bottom plate (1) is located in front of the water storage tank (2) and is fixedly connected to a condensation tank (11), the top of the condensation tank (11) is fixedly connected to a condensation pipe (12), and one end of the condensation pipe (12) away from the condensation tank (11) is fixedly connected to the outer wall of the front side of the heat dissipation chassis (3).

6. A computer hardware heat dissipation box with an easily removable dust screen according to claim 5, characterized in that: The water circulation device (13) comprises a water pipe (131), a filter box (132), an impurity filter plate (133), a water pump (134), a lifting pipe (135), a water spray pipe (136), and an atomizing nozzle (137). The right outer wall of the water storage tank (2) is fixedly connected to the water pipe (131). One end of the water pipe (131) away from the water storage tank (2) is fixedly connected to the filter box (132). The top and bottom of the inner cavity of the filter box (132) are An impurity filtering plate (133) is erected and fixedly connected between the inner walls of the filter box (132), a water pump (134) is fixedly connected to the top of the filter box (132), a lifting pipe (135) is fixedly connected to the top of the water pump (134), a water spray pipe (136) is fixedly connected to the side of the lifting pipe (135) away from the water pump (134), and an atomizing nozzle (137) is fixedly connected to the bottom of the water spray pipe (136), and a plurality of atomizing nozzles (137) are provided.

7. A computer hardware heat dissipation box with an easily removable dust screen according to claim 6, characterized in that: The heat conduction device (4) comprises a heat conduction base (41), a cavity (42), a superconducting liquid (43), a temperature sensor (44), an electric wire (45), an electric slider (46), a slide bar (47), and a support rod (48). The heat conduction base (41) is fixedly connected to the top of the inner cavity of the heat dissipation chassis (3). The cavity (42) is provided on one side of the heat conduction base (41). The temperature sensor (44) is fixedly connected to the left side of the heat conduction base (41). A slide bar (47) is fixedly connected to the left side of the heat conduction base (41) between the front and rear inner walls of the heat dissipation chassis (3). The electric slider (46) is slidably connected to the outer surface of the slide bar (47). The electric slider (46) is fixedly connected to a side close to the heat conduction base (41) with the electric wire (45). The side of the electric wire (45) away from the electric slider (46) is fixedly connected to the temperature sensor (44). The side of the electric slider (46) away from the temperature sensor (44) is fixedly connected to the support rod (48).

8. The computer hardware heat dissipation box with easily removable dust screen according to claim 7, characterized in that: The periodic cleaning mechanism (8) comprises a dustproof frame (81), a dustproof net (82), a motor (83), a screw (84), a slider (85), and a cleaning brush (86); the dustproof frame (81) is fixedly connected to the left outer wall of the heat dissipation chassis (3); the dustproof net (82) is installed on both sides of the inner wall of the dustproof frame (81) through a mounting mechanism (7); the inner walls on both sides of the bottom of the dustproof frame (81) are rotatably connected to the screw (84); one end of the screw (84) is rotatably connected to the motor (83); the outer surface of the screw (84) is slidably connected to the slider (85); and the top of the slider (85) is fixedly connected to the cleaning brush (86).

9. The computer hardware heat dissipation box with easily removable dust screen according to claim 8, characterized in that: The mounting mechanism (7) comprises a mounting rod (71), a mounting groove (72), a spring (73), and a limiting rod (74); the mounting rod (71) is fixedly connected to the outer walls on both sides of the bottom of the dustproof frame (81); the mounting groove (72) is provided on the front and rear sides of the mounting rod (71); a spring (73) is fixedly connected to one side of the mounting groove (72); and one end of the spring (73) away from the mounting groove (72) is fixedly connected to the limiting rod (74).

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