Multi-channel data collector DIP packaging device and method

Abstract

The invention provides a multi-channel data collector DIP packaging device and method, and relates to the technical field of chip packaging devices and methods, and the multi-channel data collector DIP packaging device comprises an upper template; the lower mold plate is detachably connected with the upper mold plate, a mold cavity is formed between the upper mold plate and the lower mold plate, an air exhaust hole communicated with the mold cavity is formed in the lower mold plate, and a glue injection hole communicated with the mold cavity is formed in the upper mold plate; the negative pressure mechanism communicates with the air exhaust hole, and the negative pressure mechanism is used for vacuumizing the interior of the mold cavity; the valve element is arranged on the lower die plate and used for blocking the air exhaust hole in an openable and closable mode; and the sealing piece is arranged on the upper template and is used for carrying out openable and closable sealing on the glue injection hole. Due to the fact that the mode that the interior of the die cavity is vacuumized is adopted, a good exhaust effect can be achieved, and the packaging quality is effectively improved.

Description

Technical Field

[0001] The present application relates to the technical field of chip packaging devices and methods, and in particular to a multi-channel data acquisition device DIP packaging method. Background Art

[0002] The main function of the data collector is to convert the analog signal of the sensor into a digital signal, which is convenient for the back-end data analysis and processing. With the increase of the complexity of the application scenario system, the number of measurement sensor points increases, resulting in an increasing number of channels in the data collector, and the circuit size of the data collector is getting larger and larger, which is very unfavorable for various application scenarios that are very sensitive to volume and weight. In addition, when enterprises are faced with the task of customizing and developing batch multi-channel data collectors, the R&D team often faces the dilemma of repeated development, resulting in a huge waste of R&D resources. To this end, the relevant technology adopts DIP packaging technology to encapsulate the circuit modules such as the signal conditioning circuit, amplification circuit, data acquisition module and FPGA signal processing module used in the data collector into a DIP chip, so as to realize the multi-channel analog signal data acquisition and conditioning function of a single DIP chip, thereby greatly reducing the size and weight of the circuit board and reducing the design complexity of the data acquisition system.

[0003] The DIP chip packaging process includes the steps of plug-in, welding, component pin cutting, glue filling and curing. During the glue filling process, if the gas in the mold cavity is not completely removed, defects such as pinholes, sand holes, bubbles, etc. may be formed inside the glue filling body, affecting the reliability of the product. To solve this problem, the invention application with the publication number CN118299291A discloses a semiconductor chip packaging device, which includes a packaging table, a packaging component is provided on the surface of the packaging table, and two symmetrically arranged kneading components are provided on the surface of the packaging component. The kneading component squeezes the bottom glue-wrapped spring sheet and the top glue-wrapped spring sheet toward the middle, wraps and squeezes the polyetherether copper packaging colloid wrapped around the periphery of the semiconductor chip, eliminates bubbles in the colloid, squeezes the colloid into a solid plate, and improves the packaging and sealing effect of the semiconductor chip.

[0004] However, when the semiconductor chip packaging device squeezes the colloid through the spring, the colloid will flow, so that the pressure of the spring on the colloid cannot be concentrated, so only larger bubbles in the colloid can be eliminated. For smaller bubbles in the colloid, the elimination effect is poor, thereby affecting the final packaging quality. Summary of the invention

[0005] The purpose of the present application is to provide a multi-channel data acquisition DIP packaging device and method, which is used to solve the problem that the packaging device in the related art has poor effect on eliminating smaller bubbles in the colloid during the glue filling process of the chip packaging process, thereby affecting the final packaging quality.

[0006] The present application provides a multi-channel data acquisition device and method using the following technical solutions:

[0007] In the first aspect, the present application provides a multi-channel data acquisition device DIP packaging device adopts the following technical solution:

[0008] A multi-channel data collector DIP packaging device, comprising:

[0009] Upper template;

[0010] A lower template, wherein the lower template is detachably connected to the upper template, a mold cavity is formed between the upper template and the lower template, an air extraction hole communicating with the mold cavity is provided on the lower template, and a glue injection hole communicating with the mold cavity is provided on the upper template;

[0011] A negative pressure mechanism, the negative pressure mechanism is connected to the air extraction hole, and the negative pressure mechanism is used to evacuate the interior of the mold cavity;

[0012] A valve core, which is arranged on the lower template and is used to open and close the air extraction hole;

[0013] A closing piece is arranged on the upper template and is used to open and close the glue injection hole.

[0014] Optionally, it also includes a vacuum gauge and a sealing block, wherein the upper template is provided with a measuring hole connected to the mold cavity, the vacuum gauge is arranged on the upper template and connected to the mold cavity through the measuring hole, and the sealing block is arranged on the upper template and used to open and close the measuring hole.

[0015] Optionally, it also includes a belt conveyor, which is provided with two groups. The lower template can be placed on the conveyor belts of the two groups of belt conveyors, and the conveyor belts of the belt conveyors are provided with positioning bosses for limiting the lower template.

[0016] Optionally, it also includes a position sensor and a positioning member, wherein the position sensor is electrically connected to the belt conveyor and corresponds to the lower template. When the belt conveyor transports the lower template to the glue pouring position, the position sensor can control the belt conveyor to stop, and the positioning member is used to position the lower template transported to the glue pouring position.

[0017] Optionally, the negative pressure mechanism includes a vacuum pump, an exhaust head and a lifting member, wherein the lifting member is connected to the exhaust head and can drive the exhaust head to rise and fall relative to the lower template, the exhaust head is connected to the vacuum pump, the exhaust head can be plugged into the exhaust hole, and is connected to the valve core through a linkage assembly. When the lifting member drives the exhaust head to rise and fall, the valve core can be driven to open and close through the linkage assembly.

[0018] Optionally, the linkage assembly includes a first rotating shaft, which is rotatably arranged on the lower template, and a first gear is provided on the first rotating shaft. The vacuum head is provided with a first rack that can mesh with the first gear. The vacuum hole of the lower template is provided with a conical hole and a step surface, the valve core is provided with a conical table that can be engaged with the conical hole, and a channel opposite to the step surface. The first rotating shaft is connected to the valve core through a transmission member, and can drive the valve core to rise and fall when the first rotating shaft rotates.

[0019] Optionally, the transmission member includes a sleeve and a first worm, an external thread is provided on the peripheral wall of the valve core, the sleeve is rotatably provided on the lower template and is threadedly connected to the valve core through the external thread, a limiting portion for limiting the rotation of the valve core is provided on the lower template, a first worm wheel is provided on the periphery of the sleeve, the first worm is rotatably provided on the lower template and meshes with the first worm wheel, and the first worm is connected to the first rotating shaft.

[0020] Optionally, the negative pressure mechanism also includes a sealing sleeve and an elastic member, wherein the sealing sleeve is slidably mounted on the outside of the vacuum head, and the sealing sleeve can abut against the end surface of the vacuum hole of the lower template, and the elastic member is disposed on the vacuum head and acts on the sealing sleeve, and the elastic member is used to provide an elastic force for pressing the sealing sleeve against the lower template.

[0021] Optionally, the closing member includes two closing plates, and the two closing plates can be opened and closed at the glue injection holes of the upper template. The first rotating shaft is connected to the two closing plates through a connecting component. When the first rotating shaft rotates, the two closing plates can be driven to open or close through the connecting component.

[0022] In the second aspect, the present application provides a multi-channel data collector DIP packaging method using the following technical solutions:

[0023] A DIP packaging method for a multi-channel data collector comprises the following steps:

[0024] Step 1. Insert the signal conditioning circuit, amplifying circuit, data acquisition module and FPGA signal processing module onto the motherboard, weld them, and then place them in the mold cavity;

[0025] Step 2. The injection hole is sealed by a sealing member, the valve core is opened at the same time, and the inside of the mold cavity is vacuumed by a negative pressure mechanism;

[0026] Step 3. After the vacuuming is completed, the air extraction hole is blocked by the valve core, and the sealing part is opened, and then glue is injected into the mold cavity through the glue injection hole;

[0027] Step 4. After the glue injection is completed, the colloid in the mold cavity is heated and solidified. After the solidification is completed, the mold is removed to complete the DIP packaging of the multi-channel data acquisition device.

[0028] In summary, the present application includes at least the following beneficial technical effects: when the data acquisition device is DIP packaged by the multi-channel data acquisition device DIP packaging device of the present application, after the signal conditioning circuit, the amplifying circuit, the data acquisition module and the FPGA signal processing module are inserted into the motherboard and welded in the mold cavity, the injection hole is blocked by the sealing member, the valve core is opened at the same time, and the inside of the mold cavity is evacuated by the negative pressure mechanism. After the vacuuming is completed, the air extraction hole is blocked by the valve core, the sealing member is opened, and then the glue is injected into the mold cavity through the injection hole. Since the method of evacuating the inside of the mold cavity is adopted, a better exhaust effect can be achieved, which effectively improves the packaging quality. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] Figure 1 This is a structural schematic diagram of a DIP packaging device for a multi-channel data collector in an embodiment of the present application;

[0030] Figure 2 for Figure 1 A partial enlarged schematic diagram of part A;

[0031] Figure 3 It is a cross-sectional view of the DIP packaging device of the multi-channel data acquisition device in the embodiment of the present application from a first viewing angle;

[0032] Figure 4 for Figure 3 A partial enlarged schematic diagram of part B2;

[0033] Figure 5 A cross-sectional view of the DIP packaging device of the multi-channel data acquisition device in the embodiment of the present application from a second viewing angle;

[0034] Figure 6 for Figure 5 A partial enlarged schematic diagram of the C1 part;

[0035] Figure 7 for Figure 5 A partial enlarged schematic diagram of the C2 part;

[0036] Figure 8 for Figure 4 A partial enlarged schematic diagram of the B21 section;

[0037] Fig. 9 for Figure 3 A partial enlarged schematic diagram of part B1 in the middle;

[0038] Fig.10 It is a cross-sectional view of the DIP packaging device of the multi-channel data acquisition device in the embodiment of the present application from a third viewing angle;

[0039] Fig.11 for Fig.10 A partial enlarged schematic diagram of part D in the middle;

[0040] Fig.12 for Figure 3 A partial enlarged schematic diagram of part B3;

[0041] Fig.13 This is a connection block diagram of the signal conditioning circuit, amplification circuit and other parts in the embodiment of the present application.

[0042] Description of reference numerals:

[0043] 10. Upper template; 11. Glue injection hole; 12. Annular flange; 13. Measuring hole; 14. Guide groove; 15. Adjustment screw hole; 20. Lower template; 21. Air extraction hole; 22. Cone hole; 23. Step surface; 24. Boss; 25. Cone positioning groove; 30. Cavity; 40. Belt conveyor; 41. Frame; 42. Roller; 43. Conveyor belt; 431. Positioning boss; 44. Conveyor drive motor;

[0044] 50. Negative pressure mechanism; 51. Vacuum pump; 52. Vacuum head; 521. First rack; 522. First baffle; 523. Second baffle; 53. Lifting member; 54. First rotating shaft; 541. First gear; 542. First bevel gear; 543. Fifth bevel gear; 55. Screw sleeve; 551. First worm gear; 56. First worm; 561. Second bevel gear; 57. Transmission shaft; 571. Third bevel gear; 572. Fourth bevel gear; 58. Sealing sleeve; 59. Spring;

[0045] 60, valve core; 61, cone; 62, channel; 63, external thread; 64, slide groove; 70, closing plate; 71, second rack; 80, connecting assembly; 81, second rotating shaft; 811, sixth bevel gear; 812, groove; 82, third rotating shaft; 821, plug connector; 822, second worm; 83, fourth rotating shaft; 831, second gear; 832, second worm wheel;

[0046] 90. Glue injection head; 91. Sealing plate; 100. Vertical drive member; 110. Vacuum gauge; 120. Sealing block; 130. Adjusting screw; 140. Position sensor; 150. Positioning electric push rod; 151. Telescopic rod; 160. Hose; 170. Bolt. DETAILED DESCRIPTION

[0047] The following is combined with Figure 1 -Attached Fig.13 , further details of this application are given.

[0048] The embodiment of the present application discloses a DIP packaging device for a multi-channel data collector.

[0049] A multi-channel data acquisition device DIP packaging device includes an upper template 10, a lower template 20, a negative pressure mechanism 50, a valve core 60, a closure, a vacuum gauge 110, a blocking block 120, an adjusting screw 130, a belt conveyor 40, a position sensor 140, a positioning member, a glue injection head 90 and a vertical drive member 100.

[0050] Reference Figures 1 to 4 The lower template 20 and the upper template 10 can be detachably connected by connecting parts such as bolts 170, and a mold cavity 30 is formed between the upper template 10 and the lower template 20. The lower template 20 is provided with an exhaust hole 21 connected to the mold cavity 30, and the upper template 10 is provided with a glue injection hole 11 connected to the mold cavity 30.

[0051] The valve core 60 is arranged on the lower template 20 and is used to open and close the air extraction hole 21. More specifically, the valve core 60 is slidably inserted in the air extraction hole 21. The air extraction hole 21 of the lower template 20 is provided with a tapered hole 22 and a step surface 23. The valve core 60 is provided with a frustum 61 that can be engaged with the tapered hole 22, and a channel 62 opposite to the step surface 23. When the frustum 61 is engaged with the tapered hole 22, the step surface 23 blocks the channel 62, and the air extraction hole 21 is in a closed state; when the frustum 61 is withdrawn from the tapered hole 22, the step surface 23 loses the ability to block the channel 62, and the air extraction hole 21 is in an open state.

[0052] Reference Figure 3 and Figure 4 The negative pressure mechanism 50 is connected to the air extraction hole 21, and the negative pressure mechanism 50 is used to evacuate the inside of the mold cavity 30. In an optional embodiment, the negative pressure mechanism 50 can adopt the following structure:

[0053] The negative pressure mechanism 50 includes a vacuum pump 51, an exhaust head 52 and a lifting member 53. The lifting member 53 is connected to the exhaust head 52 and can drive the exhaust head 52 to rise and fall relative to the lower template 20. The lifting member 53 can adopt a linear screw lifting module.

[0054] The vacuum head 52 is connected to the vacuum pump 51 through the hose 160. The vacuum head 52 can be plugged into the vacuum hole 21 and connected to the valve core 60 through a linkage assembly. When the lifting member 53 drives the vacuum head 52 to rise and fall, the valve core 60 can be driven to open and close through the linkage assembly.

[0055] When the interior of the mold cavity 30 is evacuated by the negative pressure mechanism 50, the vacuum head 52 is driven to rise by the lifting member 53 and inserted into the vacuum hole 21. When the vacuum head 52 is inserted into the vacuum hole 21 and continues to rise, the valve core 60 is driven to open by the linkage assembly to connect the vacuum head 52 with the mold cavity 30, so that the interior of the mold cavity 30 can be evacuated.

[0056] Reference Figures 4 to 7 In an optional embodiment, the structure of the linkage assembly, and the connection relationship between the vacuum head 52, the linkage assembly and the valve core 60 are as follows:

[0057] The linkage assembly includes a first rotating shaft 54, which is rotatably arranged on the lower template 20. The first rotating shaft 54 ​​is provided with a first gear 541. The vacuum head 52 is provided with a first rack 521 that can mesh with the first gear 541. The first rotating shaft 54 ​​is connected to the valve core 60 through a transmission member. When the first rotating shaft 54 ​​rotates, it can drive the valve core 60 to rise and fall.

[0058] After the vacuum head 52 is driven to rise by the lifting member 53 and inserted into the vacuum hole 21, the first rack 521 engages with the first gear 541, and then the vacuum head 52 continues to rise, and drives the first gear 541 and the first rotating shaft 54 ​​to rotate through the first rack 521, and then drives the valve core 60 to descend through the first rotating shaft 54, so that the cone 61 withdraws from the cone hole 22, and the vacuum head 52 can be connected to the inside of the mold cavity 30 through the channel 62 and the vacuum hole 21 to achieve vacuum extraction.

[0059] Reference Figures 4 to 8 In an optional embodiment, the specific structure of the transmission member, and the specific connection relationship between the first rotating shaft 54, the transmission member and the valve core 60 are as follows:

[0060] The transmission part includes a sleeve 55, a first worm gear 56 and a transmission shaft 57. An external thread 63 is provided on the peripheral wall of the valve core 60. The sleeve 55 is rotatably arranged on the lower template 20 and is threadedly connected to the valve core 60 through the external thread 63. The lower template 20 is provided with a limiting portion for limiting the rotation of the valve core 60. The limiting portion is a protrusion 24 arranged on the lower template 20. A sliding groove 64 is provided on the valve core 60, and the valve core 60 is slidably engaged with the protrusion 24 through the sliding groove 64.

[0061] The circumference of the screw sleeve 55 is provided with a first worm gear 551, and the first worm 56 is rotatably provided on the lower mold plate 20 and meshed with the first worm gear 551. The first worm 56 is connected to the first rotating shaft 54, more specifically, the first rotating shaft 54 ​​is provided with a first bevel gear 542, the first worm 56 is provided with a second bevel gear 561, and the transmission shaft 57 is rotatably provided on the lower mold plate 20, and the two ends of the transmission shaft 57 are respectively provided with a third bevel gear 571 and a fourth bevel gear 572 meshed with the first bevel gear 542 and the second bevel gear 561.

[0062] When the first rotating shaft 54 ​​rotates, the transmission shaft 57 is driven through the first bevel gear 542 and the third bevel gear 571, and then the first worm 56 is driven to rotate through the fourth bevel gear 572 and the second bevel gear 561, and then the screw sleeve 55 is driven to rotate through the first worm 56, and under the interaction of the screw sleeve 55 and the external thread 63, the valve core 60 is driven to descend or rise, so that the exhaust hole 21 is opened or closed.

[0063] Reference Figure 4 In an optional embodiment, when the vacuum head 52 is driven to rise by the lifting member 53 and inserted into the vacuum hole 21, the vacuum head 52 can be sealed and connected with the vacuum hole 21 through the sealing sleeve 58 and the elastic member. More specifically, the sealing sleeve 58 is slidably sleeved on the outside of the vacuum head 52, and the sealing sleeve 58 can abut against the end surface of the vacuum hole 21 of the lower template 20. The elastic member is provided on the vacuum head 52 and acts on the sealing sleeve 58. The elastic member is used to provide elastic force to press the sealing sleeve 58 against the lower template 20.

[0064] The elastic member can be a spring 59. More specifically, a first baffle 522 and a second baffle 523 are provided on the vacuum head 52, and a sealing sleeve 58 is provided between the first baffle 522 and the second baffle 523. One end of the sealing sleeve 58 can abut against the first baffle 522. The spring 59 is sleeved on the outside of the vacuum head 52, and both ends of the spring 59 abut against the second baffle 523 and the other end of the sealing sleeve 58 respectively.

[0065] When the vacuum head 52 is driven to rise by the lifting member 53 and inserted into the vacuum hole 21, the sealing sleeve 58 first contacts the end face of the vacuum hole 21 of the lower template 20 to achieve sealing, and then the vacuum head 52 continues to rise and compresses the spring 59, and the valve core 60 opens at the same time, and then the vacuum operation can be achieved. After the vacuum is completed, the vacuum head 52 is driven to descend by the lifting member 53. During the descent process, the valve core 60 is closed first, and then the vacuum head 52 continues to descend to a certain height, and the sealing sleeve 58 can be separated from the end face of the lower template 20, thereby preventing the outside air from entering the mold cavity 30 during the separation of the vacuum head 52 and the vacuum hole 21.

[0066] Reference Figure 2 , Figure 3 and Fig. 9 The closing member is arranged on the upper template 10 and is used to open and close the glue injection hole 11. More specifically, the closing member includes two closing plates 70. The two closing plates 70 are openably arranged at the glue injection hole 11 of the upper template 10. The first rotating shaft 54 ​​is connected to the two closing plates 70 through a connecting component 80. When the first rotating shaft 54 ​​rotates, the two closing plates 70 can be driven to open or close through the connecting component 80.

[0067] When the interior of the mold cavity 30 is vacuumed, when the vacuum head 52 is driven up by the lifting member 53 and inserted into the vacuum hole 21, the first rotating shaft 54 ​​rotates and drives the two closing plates 70 to close through the connecting assembly 80, thereby sealing the mold cavity 30 and preventing outside air from entering the mold cavity 30 through the glue injection hole 11.

[0068] Reference Figure 2 , Figure 6 , Figure 7 and Fig. 9 , the specific structure of the connecting assembly 80, and the connection relationship between the first rotating shaft 54, the connecting assembly 80 and the closing plate 70 are as follows:

[0069] The connecting assembly 80 includes a second rotating shaft 81, a third rotating shaft 82 and a fourth rotating shaft 83. The second rotating shaft 81 is rotatably disposed on the lower mold plate 20 and connected to the first rotating shaft 54. More specifically, the first rotating shaft 54 ​​is provided with a fifth bevel gear 543, and the second rotating shaft 81 is provided with a sixth bevel gear 811 meshing with the fifth bevel gear 543.

[0070] The third rotating shaft 82 is rotatably disposed on the upper template 10 and can be detachably connected to the second rotating shaft 81. More specifically, the second rotating shaft 81 is provided with a groove 812 with a square cross-section, and the third rotating shaft 82 is provided with a plug connector 821 whose cross-section is adapted to the groove 812 and can be snap-connected with the groove 812.

[0071] The fourth rotating shaft 83 is rotatably arranged on the upper mold plate 10 , and is provided with a second gear 831 and a second worm gear 832 . The two closing plates 70 are respectively provided with a second rack 71 meshing with the second gear 831 , and the third rotating shaft 82 is provided with a second worm 822 meshing with the second worm gear 832 .

[0072] When the inside of the mold cavity 30 is vacuumed, when the vacuum head 52 is driven to rise and inserted into the vacuum hole 21 by the lifting member 53, the first rotating shaft 54 ​​rotates, and then the second rotating shaft 81 is driven to rotate through the fifth bevel gear 543 and the sixth bevel gear 811, and then the third rotating shaft 82 and the second worm 822 are driven to rotate through the second rotating shaft 81, and the second worm gear 832 and the fourth rotating shaft 83 are driven to rotate through the second worm 822, and then under the interaction of the second gear 831 and the second rack 71, the two closing plates 70 are driven to move towards each other to close the injection hole 11.

[0073] Reference Fig.10 and Fig.11 The upper template 10 is provided with a measuring hole 13 connected with the mold cavity 30. The vacuum gauge 110 is provided on the upper template 10 and connected with the mold cavity 30 through the measuring hole 13. When the inside of the mold cavity 30 is evacuated by the negative pressure mechanism 50, the vacuum degree inside the mold cavity 30 can be measured by the vacuum gauge 110.

[0074] The blocking block 120 is arranged on the upper template 10 and is used to open and close the measuring hole 13. More specifically, the upper template 10 is provided with a guide groove 14, and the blocking block 120 is slidably arranged in the guide groove 14. The upper template 10 is provided with an adjusting screw hole 15, and the adjusting screw 130 is screwed to the upper template 10 through the adjusting screw hole 15, and is rotatably connected to the blocking block 120.

[0075] After the vacuuming is completed, the adjusting screw 130 is rotated to drive the blocking block 120 to slide along the guide groove 14 to block the measuring hole 13 to prevent the colloid from entering the vacuum gauge 110 during the glue filling.

[0076] Reference Figure 1 and Figure 2 There are two groups of belt conveyors 40, and the lower template 20 can be placed on the conveyor belts 43 of the two groups of belt conveyors 40. The conveyor belts 43 of the belt conveyors 40 are provided with positioning bosses 431 for limiting the lower template 20. The lower template 20 is placed between adjacent positioning bosses 431 to limit the lower template 20.

[0077] The belt conveyor 40 can adopt the following structure: the belt conveyor 40 includes a frame 41, rollers 42, a conveyor belt 43 and a conveying drive motor 44. There are multiple rollers 42, which are rotatably arranged on the frame 41 respectively. The conveyor belt 43 is wound around the outside of the multiple rollers 42. The conveying drive motor 44 is fixed on the frame 41 and connected to the rollers 42.

[0078] Reference Figure 3 , Figure 4 and Fig.12 The position sensor 140 is fixed on the frame 41. The position sensor 140 is electrically connected to the belt conveyor 40 and corresponds to the lower template 20. When the belt conveyor 40 transports the lower template 20 to the glue pouring position, the position sensor 140 can control the belt conveyor 40 to stop. The positioning member is used to position the lower template 20 transported to the glue pouring position.

[0079] The positioning member can adopt a positioning electric push rod 150. More specifically, conical positioning grooves 25 are respectively provided on both sides of the lower template 20. The positioning electric push rod 150 is fixed on the frame 41. The end of the telescopic rod 151 of the positioning electric push rod 150 is a cone corresponding to the conical positioning groove 25 and can be plugged into the conical positioning groove 25.

[0080] Reference Figure 1 , Figure 2 and Fig. 9The vertical driving member 100 is connected to the glue injection head 90 and is used to drive the glue injection head 90 to move vertically. The vertical driving member 100 can adopt a vertical linear screw module. The glue injection hole 11 of the upper template 10 is provided with an annular flange 12, and the glue injection head 90 is provided with a sealing plate 91 that can abut against the end surface of the annular flange 12.

[0081] The embodiment of the present application also discloses a DIP packaging method for a multi-channel data collector.

[0082] A DIP packaging method for a multi-channel data collector comprises the following steps:

[0083] Step 1. Reference Fig.13 , three signal conditioning circuits, three amplifying circuits, three data acquisition modules and one FPGA signal processing module are inserted into the motherboard and welded, and then the welded whole is placed in the mold cavity 30.

[0084] The signal conditioning circuit is used to amplify and filter the input analog signal to make it suitable for the input range of the data acquisition module. The amplifier circuit is used to amplify the conditioned analog signal. The data acquisition module is an ADC chip, which is used to sample the analog signal, and after holding, quantizing and encoding, the converted digital signal is transmitted to the FPGA signal processing module through the serial data interface inside the ADC chip. The FPGA signal processing module is used to generate 3-way ADC sampling synchronization clock and perform data processing on the digital signals output by the 3-way ADC chip.

[0085] Step 2. The lower template 20 and the upper template 10 and other components are conveyed to the bottom of the glue injection head 90 by the belt conveyor 40. When the belt conveyor 40 conveys the lower template 20 to the glue injection position, the position sensor 140 senses the lower template 20 and controls the belt conveyor 40 to stop. Then, the telescopic rod 151 of the positioning electric push rod 150 is controlled to extend and plug into the conical positioning groove 25 to position the lower template 20. At this time, the glue injection head 90 is located directly above the glue injection hole 11, and the vacuum head 52 is located directly below the vacuum hole 21.

[0086] Then, the injection hole 11 is blocked by the sealing member, the valve core 60 is opened, and the inside of the mold cavity 30 is evacuated by the negative pressure mechanism 50. The specific steps are as follows:

[0087] The vacuum head 52 is driven to rise and inserted into the vacuum hole 21 by the lifting member 53, and at the same time, the sealing sleeve 58 abuts against the end face of the vacuum hole 21 of the lower template 20. Then the vacuum head 52 continues to rise, so that the first rack 521 is engaged with the first gear 541, and the first gear 541 and the first rotating shaft 54 ​​are driven to rotate by the first rack 521. Then the first rotating shaft 54 ​​drives the valve core 60 to descend through the transmission member, so that the cone 61 withdraws from the cone hole 22, and the vacuum head 52 is connected to the inside of the mold cavity 30 through the channel 62 and the vacuum hole 21.

[0088] While the first rotating shaft 54 ​​rotates, the two closing plates 70 are driven to close through the connecting assembly 80 to seal the mold cavity 30 , and then the vacuum pump 51 is turned on to evacuate the inside of the mold cavity 30 , and the vacuum degree inside the mold cavity 30 is measured by the vacuum gauge 110 .

[0089] Step 3. After vacuuming is completed, the glue injection head 90 is driven downward by the vertical driving member 100 until the sealing plate 91 contacts the annular flange 12, and the adjusting screw 130 is rotated to drive the blocking block 120 to slide along the guide groove 14 to block the measuring hole 13. Then, the vacuum head 52 is driven downward by the lifting member 53 to exit the vacuum hole 21, the vacuum hole 21 is blocked by the valve core 60, and the sealing member is opened by the first rotating shaft and the connecting assembly 80, and then the glue injection head 90 injects glue into the mold cavity 30 through the glue injection hole 11;

[0090] Step 4. After the glue injection is completed, the lower template 20 and the upper template 10 and other components are transported to the baking equipment through the belt conveyor 40, and the colloid in the mold cavity 30 is heated and cured. After the curing is completed, the mold is removed to complete the DIP packaging of the multi-channel data acquisition device.

Claims

1. A multi-channel data acquisition device DIP packaging device, characterized in that: include: Upper template (10); A lower template (20), the lower template (20) being detachably connected to the upper template (10), a mold cavity (30) being formed between the upper template (10) and the lower template (20), the lower template (20) being provided with an air extraction hole (21) communicating with the mold cavity (30), and the upper template (10) being provided with a glue injection hole (11) communicating with the mold cavity (30); A negative pressure mechanism (50), the negative pressure mechanism (50) being in communication with the air extraction hole (21), and the negative pressure mechanism (50) being used to evacuate the interior of the mold cavity (30); A valve core (60), the valve core (60) being arranged on the lower template (20) and used for opening and closing the air extraction hole (21); A closing piece is arranged on the upper template (10) and is used to openably and closably seal the glue injection hole (11).

2. A multi-channel data acquisition device DIP packaging device according to claim 1, characterized in that: The invention also comprises a vacuum gauge (110) and a sealing block (120); a measuring hole (13) communicating with the mold cavity (30) is provided on the upper mold plate (10); the vacuum gauge (110) is provided on the upper mold plate (10) and communicates with the mold cavity (30) through the measuring hole (13); the sealing block (120) is provided on the upper mold plate (10) and is used for opening and closing the measuring hole (13).

3. A multi-channel data acquisition device DIP packaging device according to claim 1, characterized in that: It also includes a belt conveyor (40), wherein the belt conveyor (40) is provided with two groups, and the lower template (20) can be placed on the conveyor belts (43) of the two groups of the belt conveyors (40), and the conveyor belts (43) of the belt conveyor (40) are provided with a positioning boss (431) for limiting the lower template (20).

4. A multi-channel data acquisition device DIP packaging device according to claim 3, characterized in that: It also includes a position sensor (140) and a positioning member. The position sensor (140) is electrically connected to the belt conveyor (40) and corresponds to the lower template (20). When the belt conveyor (40) transports the lower template (20) to the glue pouring position, the position sensor (140) can control the belt conveyor (40) to stop. The positioning member is used to position the lower template (20) transported to the glue pouring position.

5. A multi-channel data acquisition device DIP packaging device according to claim 1, characterized in that: The negative pressure mechanism (50) includes a vacuum pump (51), an exhaust head (52) and a lifting member (53). The lifting member (53) is connected to the exhaust head (52) and can drive the exhaust head (52) to rise and fall relative to the lower template (20). The exhaust head (52) is connected to the vacuum pump (51). The exhaust head (52) can be plugged into the exhaust hole (21) and connected to the valve core (60) through a linkage assembly. When the lifting member (53) drives the exhaust head (52) to rise and fall, the valve core (60) can be driven to open and close through the linkage assembly.

6. A multi-channel data acquisition device DIP packaging device according to claim 5, characterized in that: The linkage assembly comprises a first rotating shaft (54), the first rotating shaft (54) is rotatably arranged on the lower template (20), a first gear (541) is arranged on the first rotating shaft (54), a first rack (521) capable of meshing with the first gear (541) is arranged on the air extraction head (52), a conical hole (22) and a step surface (23) are arranged at the air extraction hole (21) of the lower template (20), a conical table (61) capable of engaging with the conical hole (22), and a channel (62) opposite to the step surface (23) are arranged on the valve core (60), the first rotating shaft (54) is connected to the valve core (60) through a transmission member, and when the first rotating shaft (54) rotates, the valve core (60) can be driven to rise and fall.

7. A multi-channel data acquisition device DIP packaging device according to claim 6, characterized in that: The transmission member comprises a screw sleeve (55) and a first worm (56); an external thread (63) is provided on the peripheral wall of the valve core (60); the screw sleeve (55) is rotatably arranged on the lower template (20) and is threadedly connected to the valve core (60) through the external thread (63); a limiting portion for limiting the rotation of the valve core (60) is provided on the lower template (20); a first worm wheel (551) is provided on the periphery of the screw sleeve (55); the first worm (56) is rotatably arranged on the lower template (20) and is meshed with the first worm wheel (551); and the first worm (56) is connected to the first rotating shaft (54).

8. The multi-channel data collector DIP packaging device according to claim 5, characterized in that: The negative pressure mechanism (50) further comprises a sealing sleeve (58) and an elastic member. The sealing sleeve (58) is slidably sleeved on the outside of the vacuum head (52). The sealing sleeve (58) can abut against the end surface of the vacuum hole (21) of the lower template (20). The elastic member is arranged on the vacuum head (52) and acts on the sealing sleeve (58). The elastic member is used to provide an elastic force for pressing the sealing sleeve (58) against the lower template (20).

9. A multi-channel data acquisition device DIP packaging device according to claim 6, characterized in that: The closing member comprises two closing plates (70), and the two closing plates (70) are arranged at the glue injection hole (11) of the upper template (10) in an openable and closable manner. The first rotating shaft (54) is connected to the two closing plates (70) via a connecting component (80). When the first rotating shaft (54) rotates, the two closing plates (70) can be driven to open or close via the connecting component (80).

10. A DIP packaging method for a multi-channel data collector, characterized in that: The following steps are involved: Step 1. Insert the signal conditioning circuit, the amplifying circuit, the data acquisition module and the FPGA signal processing module onto the motherboard, weld them, and then place them in the mold cavity (30); Step 2. The injection hole (11) is sealed by a sealing member, the valve core (60) is opened at the same time, and the inside of the mold cavity (30) is evacuated by a negative pressure mechanism (50); Step 3. After the vacuuming is completed, the air extraction hole (21) is blocked by the valve core (60), and the sealing member is opened, and then glue is injected into the mold cavity (30) through the glue injection hole (11); Step 4. After the glue injection is completed, the glue in the mold cavity (30) is heated and solidified. After the solidification is completed, the mold is removed to complete the DIP packaging of the multi-channel data acquisition device.

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