Broadband packaging antenna unit and array suitable for 5G communication

Abstract

The invention relates to the technical field of antenna design, and discloses a broadband packaging antenna unit and array suitable for 5G communication. The antenna unit comprises a bottom feeder layer, a first dielectric layer, a grounding plate, a second dielectric layer, a first sub-patch, a third dielectric layer and a second sub-patch which are sequentially arranged from bottom to top; a first metal through hole is formed in the first dielectric layer; a bonding pad is arranged on the grounding plate, a second metal via hole is formed in the second dielectric layer, and the bottom feeder layer feeds power to the first sub-patch through the first metal via hole and the second metal via hole respectively; symmetrical rectangular grooves are formed in the second sub-patch; the antenna array comprises four antenna units arranged on the substrate in a 1 * 4 mode, a transition structure located from the grounding coplanar waveguide to the microstrip line, and a microstrip line feed network of a one-to-four symmetrical structure. The packaging antenna is low in cost and simple in structure, has the broadband characteristic, and solves the problems that an existing packaging antenna is narrow in bandwidth, complex in structure, too high in processing cost and the like.

Description

Technical Field

[0001] The present invention relates to the field of antenna design technology, and specifically to a broadband packaged antenna unit and array suitable for 5G communication. Background Art

[0002] With the rapid development of 5G technology, the design requirements for antenna systems include not only high performance and multi-functions, but also the advantages of small size, high integration and low cost. Packaged antennas can integrate antennas into the package carrying the chip, thereby improving system integration, reducing losses, and improving system performance, making the antenna part have higher gain and higher radiation efficiency, and taking into account size, antenna performance and cost. Therefore, it has received widespread attention in the field of 5G communications. At the same time, in the millimeter wave frequency band, the bandwidth of the antenna is particularly critical, especially in application scenarios that pursue high data transmission rates. The inherent bandwidth limitations of existing packaged antennas have brought technical challenges to the further development of millimeter wave antennas. To this end, researchers have proposed some methods to increase the bandwidth of antennas, including changing packaging materials, stacking patch antenna structures, metasurface technology, and using L-shaped probe feeding technology.

[0003] Microstrip patch antennas have the advantages of simple structure, low cost, and small profile, and have been widely used in millimeter wave systems. At the same time, microstrip patch antennas with stacked structure design can effectively improve antenna bandwidth and maintain a small antenna size. Antenna gain is an important technical indicator in the antenna design process, and its gain directly affects the radiation performance of the antenna. Due to the technical particularity of broadband antennas, the key lies in how to improve the antenna structure to maintain high gain within a wide frequency band, which is the key to improving the antenna radiation capability.

[0004] Typically, the electrical characteristics of an antenna, such as standing wave ratio, directivity parameters, radiation pattern, and polarization characteristics, will change with frequency. Therefore, the bandwidth of an antenna depends on how these characteristics change with frequency. In order to determine the operating frequency band of an antenna, the intersection of frequency bands that can meet all electrical characteristic requirements is usually selected. Generally speaking, if the relative bandwidth of an antenna is between 10% and 25%, then the antenna is considered a broadband antenna. When the relative bandwidth of an antenna exceeds 25%, it is usually called an ultra-wideband antenna. Relative bandwidth The calculation formula is as follows: ; in, and are the highest and lowest frequencies within the bandwidth respectively.

[0005] The prior art and its shortcomings are as follows: 1. The article "Design Considerations of Packaged Antennas for Ka-Band 5G Communication Applications" published in Volume 65, Issue 12, Pages 6372-6379 of the IEEE Antennas and Propagation magazine in December 2017 introduces a packaged antenna suitable for the Ka-band, which consists of eleven dielectric substrates and fourteen metal layers, and uses a multi-layer dielectric substrate for stacking design. A 4.9% -10dB impedance bandwidth was achieved, and only 3.8dBi of antenna gain was achieved. In addition, the antenna was made using the HDI process, which increased the antenna processing cost and difficulty.

[0006] 2. The article "Low Sidelobe Substrate Integrated Waveguide Antenna Array and Its Application in Millimeter Wave Mobile Terminals - Design Based on Broadband Unequal Feed Network" published in Volume 64, Issue 3, Pages 2908-2921 of the IEEE Antennas and Propagation Magazine in March 2016 introduced a 28GHz broadband substrate integrated waveguide (SIW) antenna array suitable for millimeter wave devices. The antenna array is realized by stacking a multilayer structure of three dielectric substrates and copper plates, and an 8-way integrated circuit waveguide feeding network is proposed to expand the bandwidth. Only 8.08% impedance bandwidth is achieved, and the antenna gain is 13.97dBi, but the antenna size is 69.72×63.21×2.024mm 3 , which is large in size and not suitable for integration with RF chips.

[0007] 3. The article "Compact Active Integrated Antenna in Ceramic Package with GaAs Amplifier for Ka-Band" published in the IEEE Antennas and Wireless Propagation magazine, Vol. 16, pp. 221-231 in 2017 introduces a Ka-band active integrated package antenna designed and manufactured using a sealed QFN packaging process. The antenna only achieves 10% impedance bandwidth, which is a relatively narrow bandwidth. In addition, the sealed QFN packaging process requires high processing accuracy, and the processing cost and complexity are higher.

[0008] 4. The article "Low-cost Ka-band circularly polarized passive phased array antenna for mobile satellites" published in the IEEE Antennas and Propagation magazine, Volume 67, Pages 221-231, January 2019, introduces a Ka-band circularly polarized passive phased array packaged antenna system. The antenna system consists of three layers of dielectric substrate and three layers of metal. The top layer of the elliptical patch has TM 11 e,o The two main resonant modes, odd mode and even mode, resonate at different frequencies to expand the bandwidth, but the antenna only obtains an impedance bandwidth of about 3.3%, with a maximum gain of 7.4dBi, and a narrow bandwidth.

[0009] Terminology explanation: 5G communication: The fifth generation mobile communication technology (5G for short) is a new generation of broadband mobile communication technology with the characteristics of high speed, low latency and large connection. 5G communication facilities are the network infrastructure for the interconnection of man, machine and things. The International Telecommunication Union (ITU) has defined three major application scenarios for 5G, namely enhanced mobile broadband (eMBB), ultra-reliable and low-latency communication (uRLLC) and massive machine communication (mMTC).

[0010] Broadband antenna: An antenna whose electrical characteristics remain unchanged or change little within a wide frequency band is called a broadband antenna, which is usually defined by relative bandwidth, i.e. , usually considered to be 10% ≤ Antennas with a relative bandwidth of ≤25% are considered wideband antennas. Antennas with a power efficiency of ≥25% are called ultra-wideband antennas. However, broadband antennas and ultra-wideband antennas are usually referred to as broadband antennas.

[0011] Packaged antenna: Antenna-in-package (AiP) is a technology based on packaging materials and processes that integrates antennas and chips in a package to achieve system-level wireless functions. The antenna is integrated with the RF transceiver system to become a standard surface mount device.

[0012] Return loss (S 11 ): refers to the ratio of incident wave power to reflected wave power. The unit is dB, and its size depends on the reflection condition reflected at the input port after the transmission system and the load work together. It is usually used to describe the reflection characteristics of the antenna and measure the degree of reflection loss of the antenna.

[0013] Gain: refers to the ratio of the signal power density generated by the actual antenna and the ideal radiating unit at the same point in space under the same input power conditions. It quantifies the antenna's ability to radiate the input power in a concentrated manner. The gain is closely related to the antenna's radiation pattern. The narrower the main lobe and the smaller the side lobe, the higher the gain.

[0014] Radiation pattern: The antenna radiation pattern refers to a curve graph showing how the relative field strength (normalized modulus) of the radiation field varies with direction at a certain distance from the antenna. It is usually represented by two mutually perpendicular plane patterns passing through the direction of maximum radiation of the antenna. Summary of the invention

[0015] In view of the above problems, the purpose of the present invention is to provide a broadband packaged antenna unit and array suitable for 5G communication, which has small size, wide bandwidth, simple structure and low cost, and solves the problems of existing packaged antennas, such as large size, narrow bandwidth, complex structure and high processing cost. The technical solution is as follows: A broadband packaged antenna unit suitable for 5G communication, comprising a bottom feeder layer, a first dielectric layer, a ground plate, a second dielectric layer, a first sub-patch, a third dielectric layer, and a second sub-patch arranged from bottom to top; The ground plate is provided with a pad, the first dielectric layer is provided with a first metal via connected to the bottom of the pad, and the second dielectric layer is provided with a second metal via connected to the top of the pad; the first sub-patch is provided on the second dielectric layer (the second sub-patch is provided on the third dielectric layer); the bottom feeder layer feeds electricity to the first sub-patch through the first metal via and the second metal via respectively; The outer edge of the pad on the ground plate is also excavated with a circular ring to achieve isolation between the first metal via and the second metal via and the ground plate; The second sub-patch is arranged on the third dielectric layer, and its size is equal to that of the first sub-patch; the second sub-patch is also provided with a symmetrical rectangular groove.

[0016] Furthermore, the lengths of the first sub-patch and the second sub-patch are With width They are: (1); (2); (3) (4); (5) in, is the speed of light, is the relative dielectric constant, is the guided wavelength in the medium, is the effective dielectric constant, is the dielectric substrate thickness, is the gap length of the radiation unit; is the operating frequency.

[0017] Furthermore, the symmetrical rectangular groove is four strip holes parallel to the four sides of the second sub-patch, and the length of the strip holes is and width 0.8mm and 0.3mm respectively.

[0018] Furthermore, the radius of the first metal via and the radius of the second metal via Ris 0.1mm, the radius of the pad The radius of the ring They are 0.13mm and 0.2mm respectively.

[0019] An antenna array based on a broadband packaged antenna unit suitable for 5G communication, comprising a microstrip line feed network layer, a first dielectric layer, a ground plane, a second dielectric layer, a first sub-patch, a third dielectric layer, and a second sub-patch arranged from bottom to top; four antenna units are arranged in a 1×4 manner, that is, four first sub-patches are arranged on the second dielectric layer, and four second sub-patches are arranged on the third dielectric layer; It also includes a transition structure from a grounded coplanar waveguide to a microstrip line and a microstrip line feeding network with a one-to-four symmetrical structure located below the first dielectric layer; The transition structure is located in an area next to the antenna unit arrangement area, and includes a first external metal patch and a second external metal patch arranged below the first dielectric layer, and a third external metal patch arranged above the third dielectric layer; A channel is left between the first external metal patch and the second external metal patch, and the outer edge of the channel is a signal input port; the first external metal patch, the second external metal patch and the third external metal patch are respectively connected to the ground plate through a plurality of metallized through holes; The microstrip line feeding network is arranged below the first dielectric layer to feed the antenna array, and includes a first microstrip line, a second microstrip line, a third microstrip line, a fourth microstrip line, a fifth microstrip line, a sixth microstrip line and a seventh microstrip line; The first microstrip line passes through the channel between the first external metal patch and the second external metal patch, one end of which is connected to the signal input port, and the other end of which extends vertically toward the antenna unit and is vertically connected to the midpoint of the second microstrip line arranged horizontally, the right end of the second microstrip line is connected to one end of the third microstrip line arranged horizontally, the other end of the third microstrip line is connected to the bottom end of the fourth microstrip line arranged vertically, the top end of the fourth microstrip line is connected to the midpoint of the fifth microstrip line arranged horizontally, the two ends of the fifth microstrip line are respectively connected to the long side ends of the two L-shaped sixth microstrip lines, the short side ends of the two sixth microstrip lines are respectively connected to the bottom ends of the two vertically arranged seventh microstrip lines, and the top end of the seventh microstrip line is a feeding output port; the structures connected at the left and right ends of the second microstrip line and the fifth microstrip line are symmetrical.

[0020] Furthermore, the first microstrip line, the third microstrip line, the fourth microstrip line and the seventh microstrip line are impedance =50Ω microstrip line; the length h1 of the first microstrip line is 13.8mm, the length h3 of the third microstrip line is 5.16mm, the length h4 of the fourth microstrip line is 1.8mm, and the length h5 of the seventh microstrip line is 2mm; the line widths of the first microstrip line, the third microstrip line, the fourth microstrip line and the seventh microstrip line are all 0.39mm; the second microstrip line is an impedance =50Ω to impedance =70.7Ω linear gradient line, the width of the second microstrip line is 0.22mm, the length h2 of the second microstrip line is 1.7mm; the fifth microstrip line is impedance =100Ω to impedance = 70.7Ω linear gradient line, the length h7 of the fifth microstrip line is 1.6mm, the width of the fifth microstrip line is 0.1mm; the sixth microstrip line is an impedance =70.7Ω to impedance =50Ω linear gradient line, the lengths h6 and h8 of the two sections of the sixth microstrip line are 1.72mm and 0.69mm respectively, and the width of the sixth microstrip line is 0.22mm.

[0021] Furthermore, the spacing between two adjacent antenna units =7.2mm; the length of the entire antenna array and width They are 36.6mm and 21.4mm respectively.

[0022] Furthermore, all the microstrip lines are provided with cut corners.

[0023] Furthermore, the signal input port adopts a 2.92 mm interface, and the area where the transition structure is located is also provided with a first through hole and a second through hole for fixing the connector.

[0024] The beneficial effects of the present invention are: 1. The present invention adopts a stacked patch antenna method to improve the bandwidth and designs an antenna structure with three dielectric layers and four metal layers. A second sub-patch is added to the top layer of the patch antenna unit to expand the bandwidth, and a symmetrical rectangular slot is introduced to improve the return loss and bandwidth of the antenna to achieve broadband performance.

[0025] 2. The present invention constructs a 1×4 antenna array based on the antenna unit to improve the gain. The microstrip line feeding network composed of a quarter impedance transformation line feeds from the microstrip line at the bottom of the antenna and feeds to the radiation patch through the first metal via and the second metal via. The structure is simple.

[0026] 3. The present invention is manufactured using a multi-layer printed circuit board (PCB) process with low cost. It meets the economic value of being applied in 5G communication systems and can be easily integrated with radio frequency chips. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figure 1 This is an exploded diagram of the antenna unit.

[0028] Figure 2 This is a structural diagram of the second sub-patch on the third dielectric layer.

[0029] Figure 3 This is the structural diagram of the grounding plate.

[0030] Figure 4 A bottom view of a broadband packaged antenna array suitable for 5G communications.

[0031] Figure 5 A top view of a broadband packaged antenna array suitable for 5G communications.

[0032] Figure 6 is the return loss of the antenna unit (S 11 )Simulation result diagram.

[0033] Figure 7 is the return loss of the antenna array (S 11 )Simulation result diagram.

[0034] Figure 8 This is the gain simulation result diagram of the antenna unit.

[0035] Fig. 9 This is the gain simulation result diagram of the antenna array.

[0036] Figure 10 (a) shows the xoz plane radiation pattern corresponding to the antenna unit at 25 GHz.

[0037] Figure 10(b) shows the yoz plane radiation pattern corresponding to the antenna unit at 25 GHz.

[0038] Figure 11 (a) shows the xoz surface radiation pattern corresponding to the antenna array at 25 GHz.

[0039] Figure 11(b) shows the yoz surface radiation pattern corresponding to the antenna array at 25 GHz.

[0040] The meanings of the numbers in the figure are: 1-bottom feeder layer; 2-first dielectric layer; 3-ground plate; 4-second dielectric layer; 5-first sub-patch; 6-third dielectric layer; 7-second sub-patch; 8-second metal via; 9-soldering pad; 10-first metal via; 11-symmetrical rectangular groove; 12-circular ring; 13-microstrip line feeding network; 14-transition structure; 15-first microstrip line, 16-second microstrip line; 17-third microstrip line; 18-fourth microstrip line; 19-fifth microstrip line; 20-sixth microstrip line; 21-seventh microstrip line; 22-first through hole; 23-second through hole; 24-first external metal patch; 25-second external metal patch; 26-metallized through hole; 27-third external metal patch. DETAILED DESCRIPTION

[0041] The present invention is further described in detail below with reference to the accompanying drawings and specific embodiments.

[0042] like Figure 1 As shown in the exploded diagram of the antenna unit, a broadband package antenna unit suitable for 5G communication includes a bottom feeder layer 1 arranged from bottom to top; a first dielectric layer 2, a ground plane 3, a second dielectric layer 4, a first sub-patch 5, a third dielectric layer 6, a second sub-patch 7, a second metal via 8, a pad 9, and a first metal via 10. The first dielectric layer 2 is arranged on the bottom feeder layer 1 and includes a feeding first metal via 10, the ground plane 3 is located on the first dielectric layer 2 and includes a pad 9, the second dielectric layer 4 is arranged on the ground plane 3, and includes a second metal via 8, the first sub-patch 5 is arranged on the second dielectric layer 4, the third dielectric layer 6 is arranged on the second dielectric layer 4, and the second sub-patch 7 is arranged on the third dielectric layer 6.

[0043] The dielectric substrates are all Rogers RO4350B with a dielectric constant of 3.66, and their length L and width W are both 6 mm, and the height is 1 mm. The length of the first sub-patch and the second sub-patch arranged above the second dielectric layer and the third dielectric layer is With width Both are 2.6mm.

[0044] like Figure 2 As shown, the second sub-patch 7 introduces a symmetrical rectangular groove 11, the length of which is and width 0.8mm and 0.3mm respectively, which can increase the impedance bandwidth and reduce the return loss.

[0045] like Figure 3 As shown, the bottom feeder layer 1 feeds the first sub-patch through the first metal via 10 and the second metal via 8. Metal via radius RThe radius of the pad is 0.1 mm. A pad 9 is added between the two metal vias to achieve the transition of the inter-layer signal, so as to better transmit energy to the antenna. A ring 12 is dug out on the ground plate 3 to isolate the first metal via 10 and the second metal via 8 from the ground plate to avoid short circuit. The radius of the ring They are 0.13mm and 0.2mm respectively.

[0046] The lengths of the first sub-patch 5 and the second sub-patch 7 With width Calculated according to the following formula: (1); (2); (3); (4); (5); in, is the speed of light, is the relative dielectric constant, is the guided wavelength in the medium, is the effective dielectric constant, is the dielectric substrate thickness, is the gap length of the radiation unit, is the operating frequency.

[0047] like Figure 4 (Bottom view of a wideband packaged antenna array for 5G communications) and Figure 5 (Top view of broadband packaged antenna array suitable for 5G communication) shows a broadband packaged antenna array suitable for 5G communication. Based on the antenna unit, the antenna array is arranged in a 1×4 manner, that is, four first sub-patches 5 are arranged on the second dielectric layer 4, and four second sub-patches 7 are arranged on the third dielectric layer 6. The antenna array is fed by a cascaded two-stage one-to-two equally divided microstrip line feeding network 13, which is arranged below the first dielectric layer 2 and uses a gradient quarter impedance transformation line to form a microstrip line feeding network. At the corners of the microstrip line, a cut-angle design is performed to achieve better impedance matching between the microstrip lines.

[0048] In order to facilitate testing, a transition structure 14 from grounded coplanar waveguide to microstrip line and a one-to-four microstrip line feeding network 13 are designed to excite the antenna array. A 2.92 mm connector is used for measurement, and a first through hole 22 and a second through hole 23 are provided for fixing the connector.

[0049] The transition structure 14 is located in the area next to the antenna unit arrangement area, including a first external metal patch 24 and a second external metal patch 25 arranged below the first dielectric layer 2, and a third external metal patch 27 arranged above the third dielectric layer 6; a channel is left between the first external metal patch 24 and the second external metal patch 25, and the outer edge of the channel is a signal input port; the first external metal patch 24, the second external metal patch 25 and the third external metal patch 27 are respectively connected to the ground plate 3 through a circle of metallized through holes 26.

[0050] The one-to-four microstrip line feeding network is an equally divided symmetrical structure, which is arranged below the first dielectric layer 2 to feed the antenna array, and includes a first microstrip line 15, a second microstrip line 16, a third microstrip line 17, a fourth microstrip line 18, a fifth microstrip line 19, a sixth microstrip line 20 and a seventh microstrip line 21; the first microstrip line 15 passes through a channel between a first external metal patch 24 and a second external metal patch 25, one end of which is connected to a signal input port, and the other end of which extends vertically toward the antenna unit arrangement area and is vertically connected to the midpoint of a second microstrip line 16 arranged horizontally, and the second microstrip line 18 is connected to a signal input port at one end of the first microstrip line 15. The right end of 16 is connected to one end of the third microstrip line 17 arranged horizontally, the other end of the third microstrip line 17 is connected to the bottom end of the fourth microstrip line 18 arranged vertically, the top end of the fourth microstrip line 18 is connected to the midpoint of the fifth microstrip line 19 arranged horizontally, the two ends of the fifth microstrip line 19 are respectively connected to the long side ends of the two L-shaped sixth microstrip lines 20, the short side ends of the two sixth microstrip lines 20 are respectively connected to the bottom ends of the two vertically arranged seventh microstrip lines 21, and the top end of the seventh microstrip line 21 is a feeding output port; the structure of the left end connection of the second microstrip line 16 and the fifth microstrip line 19 is symmetrical to the right end. Among them, the first microstrip line 15, the third microstrip line 17, the fourth microstrip line 18 and the seventh microstrip line 21 are impedance =50Ω microstrip line; the length h1 of the first microstrip line 15 is 13.8mm, the length h3 of the third microstrip line 17 is 5.16mm, the length h4 of the fourth microstrip line 18 is 1.8mm, and the length h5 of the seventh microstrip line 21 is 2mm; the line widths of the first microstrip line 15, the third microstrip line 17, the fourth microstrip line 18 and the seventh microstrip line 21 are all 0.39mm; the second microstrip line 16 is an impedance =50Ω to impedance =70.7Ω linear gradient line, the width of the second microstrip line 16 is 0.22mm, the length h2 of the second microstrip line 16 is 1.7mm; the fifth microstrip line 19 is an impedance =100Ω to impedance = 70.7Ω linear gradient line, the length h7 of the fifth microstrip line 19 is 1.6mm, the width of the fifth microstrip line 19 is 0.1mm; the sixth microstrip line 20 is an impedance =70.7Ω to impedance =50Ω linear gradient line, the lengths of the two sections h6 and h8 of the sixth microstrip line 20 are 1.72mm and 0.69mm respectively, and the width of the sixth microstrip line 20 is 0.22mm. The seventh microstrip line 21 is an output port, port 1 is a signal input port, a 2.92mm interface is used, and a first through hole 22 and a second through hole 23 are provided for fixing the connector. The spacing between two adjacent antenna units =7.2mm. The length of the entire antenna array and width They are 36.6mm and 21.4mm respectively.

[0051] The working principle of the present invention is as follows: while the antenna adopts a stacked patch antenna structure, a symmetrical rectangular slot design is added to the top patch to improve the antenna bandwidth and return loss. First, a single patch antenna unit is designed. The antenna unit adopts a composite structure of two dielectric substrates and three metal layers. In order to obtain a wider bandwidth and higher gain, a suitable dielectric layer thickness should be selected. The microstrip line at the bottom of the antenna unit feeds the patch through a metal via, and the reflection loss of the single patch antenna unit is relatively high. Subsequently, a parasitic patch (i.e., the second sub-patch) is added to the top layer of the single patch antenna unit to improve the return loss of the antenna unit and expand the bandwidth. Its function is similar to that of a traditional patch antenna. A second resonance point is generated, which explains the principle of widening the bandwidth. When the parasitic patch and the main radiation patch (i.e., the first sub-patch) are stacked, a mutual coupling effect is generated, which excites multiple resonant modes to broaden the working bandwidth. Compared with the single patch antenna unit, the antenna unit generates two resonance points, at 24 GHz and 26 GHz, respectively, because the mutual superposition between the two patches generates a double resonance point. By adding parasitic patches, the impedance bandwidth is widened. Finally, a symmetrical rectangular slot design is introduced on the top patch to change the current distribution of the patch, thereby improving the impedance matching of the antenna and optimizing the antenna bandwidth. For the antenna array, the unit spacing It is a very important indicator. By optimizing the unit spacing, a stable radiation pattern can be obtained and better broadband antenna performance can be achieved.

[0052] The present invention is described in detail in combination with the simulation results: Figure 6 The return loss (S) of the antenna unit of the present invention is given. 11 ) simulation results show that the -10dB impedance bandwidth of the antenna unit is 23.3GHz-26.6GHz, and its relative bandwidth is 13.2%. Figure 8The gain simulation results of the antenna unit of the present invention are given. It can be seen that as the frequency increases, the gain tends to increase. The maximum gain of the antenna unit is 5.71dBi at the center frequency of 25GHz. Figures 10 (a) and 10 (b) show the xoz and yoz radiation patterns of the antenna unit of the present invention at 25GHz.

[0053] Figure 7 The return loss (S) of the antenna array of the present invention is given. 11 ) simulation results show that the -10dB impedance bandwidth of the antenna array is 23.1GHz-26.2GHz, and its relative bandwidth is 12.6%. The bandwidth of the antenna unit is reduced by 0.6%. This is due to the loss between the dielectrics and the attenuation of the feed network at high frequencies during the design of the array antenna, which is normal dielectric loss. Fig. 9 The gain simulation results of the antenna array of the present invention are given. It can be seen that the gain tends to increase with the increase of frequency. The maximum gain of the antenna array is 12.22dBi. Figures 11 (a) and 11 (b) show the xoz and yoz radiation patterns of the antenna array of the present invention at 25GHz. The present invention maintains stable radiation characteristics within the working frequency band.

Claims

1. A broadband packaged antenna unit suitable for 5G communication, characterized in that: It comprises, arranged from bottom to top, a bottom feeder layer (1), a first dielectric layer (2), a ground plane (3), a second dielectric layer (4), a first sub-patch (5), a third dielectric layer (6) and a second sub-patch (7); The ground plate (3) is provided with a pad (9), the first dielectric layer (2) is provided with a first metal via (10) connected to the bottom of the pad (9), and the second dielectric layer (4) is provided with a second metal via (8) connected to the top of the pad (9); the first sub-patch (5) is arranged on the second dielectric layer (4); The bottom feeder layer (1) feeds electricity to the first sub-patch (5) through the first metal via (10) and the second metal via (8); The outer edge of the pad (9) on the grounding plate (3) is also excavated with a circular ring (12) to achieve isolation between the first metal via (10) and the second metal via (8) and the grounding plate (3); The second sub-patch (7) is arranged on the third dielectric layer (6), and its size is equal to that of the first sub-patch (5). A symmetrical rectangular groove (11) is also provided on the second sub-patch (7).

2. The broadband packaged antenna unit suitable for 5G communication according to claim 1, characterized in that: The lengths of the first sub-patch (5) and the second sub-patch (7) are With width They are: （1）； （2）； （3）； （4）； （5）； in, is the speed of light, is the relative dielectric constant, is the guided wavelength in the medium, is the effective dielectric constant, is the dielectric substrate thickness, is the gap length of the radiation unit; is the operating frequency.

3. The broadband packaged antenna unit suitable for 5G communication according to claim 1, characterized in that: The symmetrical rectangular grooves (11) are four strip-shaped holes respectively parallel to the four sides of the second sub-patch (7), and the length of the strip-shaped holes is and width 0.8mm and 0.3mm respectively.

4. The broadband packaged antenna unit suitable for 5G communication according to claim 1, characterized in that: The radius of the first metal via (10) and the second metal via (8) R The radius of the pad (9) is 0.1 mm. with the radius of the ring (12) They are 0.13mm and 0.2mm respectively.

5. An antenna array based on the broadband packaged antenna unit suitable for 5G communication according to claim 1, characterized in that: The invention comprises a microstrip line feeding network (13), a first dielectric layer (2), a ground plane (3), a second dielectric layer (4), a first sub-patch (5), a third dielectric layer (6) and a second sub-patch (7) arranged from bottom to top; four antenna units are arranged in a 1×4 manner, that is, four first sub-patches (5) are arranged on the second dielectric layer (4), and four second sub-patches (7) are arranged on the third dielectric layer (6); It also includes a transition structure (14) from a grounded coplanar waveguide to a microstrip line and a microstrip line feeding network (13) with a one-to-four symmetrical structure located below the first dielectric layer (2); The transition structure (14) is located in an area beside the antenna unit arrangement area, and includes a first external metal patch (24) and a second external metal patch (25) arranged below the first dielectric layer (2), and a third external metal patch (27) arranged above the third dielectric layer (6); A channel is left between the first external metal patch (24) and the second external metal patch (25), and the outer edge of the channel is a signal input port; the first external metal patch (24), the second external metal patch (25) and the third external metal patch (27) are respectively connected to the ground plate (3) through a plurality of metallized through holes (26); The microstrip line feeding network (13) is arranged below the first dielectric layer (2) to feed the antenna array, and comprises a first microstrip line (15), a second microstrip line (16), a third microstrip line (17), a fourth microstrip line (18), a fifth microstrip line (19), a sixth microstrip line (20) and a seventh microstrip line (21); The first microstrip line (15) passes through a channel between the first external metal patch (24) and the second external metal patch (25), one end of which is connected to a signal input port, the other end of which extends vertically in the direction of the antenna unit arrangement area and is vertically connected to the midpoint of a second microstrip line (16) arranged horizontally, the right end of the second microstrip line (16) is connected to one end of a third microstrip line (17) arranged horizontally, and the other end of the third microstrip line (17) is connected to the bottom end of a fourth microstrip line (18) arranged vertically. The top of the fourth microstrip line (18) is connected to the midpoint of the fifth microstrip line (19) arranged horizontally, the two ends of the fifth microstrip line (19) are respectively connected to the long side ends of two L-shaped sixth microstrip lines (20), the short side ends of the two sixth microstrip lines (20) are respectively connected to the bottom ends of two vertically arranged seventh microstrip lines (21), and the top of the seventh microstrip line (21) is a feeding output port; the structure of the connection between the left end of the second microstrip line (16) and the fifth microstrip line (19) is symmetrical to the right end.

6. The antenna array of the broadband packaged antenna unit suitable for 5G communication according to claim 5, characterized in that: The first microstrip line (15), the third microstrip line (17), the fourth microstrip line (18) and the seventh microstrip line (21) are impedance =50Ω microstrip line; the length h1 of the first microstrip line (15) is 13.8 mm, the length h3 of the third microstrip line (17) is 5.16 mm, the length h4 of the fourth microstrip line (18) is 1.8 mm, and the length h5 of the seventh microstrip line (21) is 2 mm; The line widths of the first microstrip line (15), the third microstrip line (17), the fourth microstrip line (18) and the seventh microstrip line (21) are all 0.39 mm; the second microstrip line (16) has an impedance of =50Ω to impedance =70.7Ω linear gradient line, the width of the second microstrip line (16) is 0.22mm, the length h2 of the second microstrip line (16) is 1.7mm; the fifth microstrip line (19) is an impedance =100Ω to impedance =70.7Ω linear gradient line, the length h7 of the fifth microstrip line (19) is 1.6 mm, the width of the fifth microstrip line (19) is 0.1 mm; the sixth microstrip line (20) is an impedance =70.7Ω to impedance =50Ω linear gradient line, the lengths h6 and h8 of the two sections of the sixth microstrip line (20) are 1.72 mm and 0.69 mm respectively, and the width of the sixth microstrip line (20) is 0.22 mm.

7. The antenna array of the broadband packaged antenna unit suitable for 5G communication according to claim 5, characterized in that: The distance between two adjacent antenna units =7.2mm; the length of the entire antenna array and width They are 36.6mm and 21.4mm respectively.

8. The antenna array of the broadband packaged antenna unit suitable for 5G communication according to claim 5, characterized in that: All microstrip lines have cut corners.

9. The antenna array of the broadband packaged antenna unit suitable for 5G communication according to claim 5, characterized in that: The signal input port adopts a 2.92 mm interface, and the area where the transition structure (14) is located is also provided with a first through hole (22) and a second through hole (23) for fixing the connector.

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