A high-speed VCSEL semiconductor chip protection packaging device and a packaging method

Abstract

The present invention relates to the technical field of encapsulation devices, specifically a high-speed VCSEL semiconductor chip protection encapsulation device and an encapsulation method. While realizing chip encapsulation dispensing, it can better improve the filling quality and filling efficiency of the filling glue, and has better chip encapsulation quality and is more practical. It includes a support bracket, a rotating dispensing system, and a indexing clamping system. The rotating dispensing system includes a delivery pump, a first servo motor, a rotating cylinder, and a plurality of dispensing tubes. The delivery pump and the first servo motor are both installed on the support bracket. The rotating cylinder is rotatably connected within the support bracket. The first servo motor is used to drive the rotation of the rotating cylinder relative to the support bracket. A vertical tube is fixedly connected within the rotating cylinder. The plurality of dispensing tubes are all communicated with the vertical tube, and the vertical tube is communicated with the delivery pump. The indexing clamping system includes a suspension bracket and a second servo motor. The suspension bracket is fixedly connected to the support bracket, and a revolving shaft is rotatably connected between the suspension bracket and the support bracket. The second servo motor is installed on the suspension bracket.

Description

Technical Field

[0001] The present invention relates to the technical field of packaging devices, and particularly relates to a high-speed VCSEL semiconductor chip protection packaging device and a packaging method. Background Art

[0002] As is well known, high-speed VCSEL semiconductor chips play a key role in modern communication and sensing technologies. To facilitate the protection packaging operation during the preparation of high-speed VCSEL semiconductor chips, we propose a high-speed VCSEL semiconductor chip protection packaging device and a packaging method.

[0003] After retrieval, a patent with the Chinese patent publication number CN115831823A discloses an integrated circuit semiconductor chip packaging device and a packaging method thereof. It is generally described as including a base, a support rod, a top plate, a support bracket, a transmission member, a rotation motor, a sliding limit rod, a lifting member, a screw transmission member, a sliding support member, a lateral sliding motor, a limiting member, and a pressing member. The top of the base is connected to the support rod, and the end of the support rod away from the base is connected to the top plate. The top of the top plate is connected to the support bracket, and the interior of the support bracket is hollow. When in use, the chip is placed on a limiting groove with a corresponding shape and size, and a metal protection shell is pressed and installed on the top surface of the semi-finished chip by vertical pressing. A patent with the Chinese patent publication number CN218647911U discloses a limiting fixture suitable for semiconductor chip packaging. It is generally described as including a base and a clamping portion. The base is fixedly connected to the workbench through four fixing bolts. The base is a convex structure, and when the fixing bolts are tightened, both sides of the base are elastically bent. The clamping portion is composed of a fixture seat, an elastic telescopic rod, a clamping plate, a piston bottle, a connecting pipe, and a jet pipe. There are eight clamping portions in total, and the eight clamping portions are arranged in pairs and oppositely. When in use, the semiconductor chip is clamped and positioned by the clamping plates on both sides.

[0004] Both of the above two prior art solutions cover the auxiliary clamping and positioning structures in the chip packaging process. Although both sets of clamping and positioning structures can cooperate with the chip to form auxiliary pressing and positioning, most of the chip packaging links involve glue application operations. Especially during the chip dispensing process of flip-chip chips, since flip-chip chips are connected to the substrate of the circuit board by bumps, if there is a thermal expansion difference, stress will be generated on the connection points. Therefore, underfill glue needs to be filled between the chip and the substrate to relieve the stress fatigue of the connection points. For the dispensing quality of this part of the underfill glue, higher requirements are imposed, and parameters such as the dispensing amount need to be strictly controlled during the packaging process. Summary of the Invention

[0005] In view of the problems in the prior art, the present invention provides a high-speed VCSEL semiconductor chip protection packaging device and a packaging method, which can better improve the filling quality and filling efficiency of the filling glue while realizing chip packaging dispensing, and has better chip packaging quality and is more practical.

[0006] The technical solution adopted by the present invention to solve its technical problems is: a high-speed VCSEL semiconductor chip protection packaging device, including a support bracket, a rotating dispensing system and a transposition clamping system;

[0007] The rotating dispensing system includes a delivery pump, a first servo motor, a rotating cylinder and a plurality of cloth pipes. The delivery pump and the first servo motor are both installed at the bottom end of the support bracket. The rotating cylinder is rotatably connected inside the support bracket. The first servo motor is used for driving the rotation of the rotating cylinder relative to the support bracket. A vertical pipe is fixedly connected inside the rotating cylinder. A plurality of the cloth pipes are all communicated with the vertical pipe, and the vertical pipe is communicated with the delivery pump;

[0008] The transposition clamping system includes a suspension bracket and a second servo motor. The suspension bracket is fixedly connected to the support bracket, and a rotating shaft is rotatably connected between the suspension bracket and the support bracket. The second servo motor is installed on the suspension bracket. The second servo motor is used for driving the rotation of the rotating shaft. A rotating plate frame is fixedly connected to the rotating shaft. A plurality of circular openings are formed in the rotating plate frame. A plurality of centrifugal cylinders are arranged in the plurality of circular openings. A plurality of positioning jigs are installed in the plurality of centrifugal cylinders. A support ring is rotatably connected outside each of the plurality of centrifugal cylinders. A plurality of support springs are connected between each of the plurality of support rings and the rotating plate frame. A driving structure matching the centrifugal cylinder is installed on the suspension bracket. The driving structure is used for driving the centrifugal cylinder to press into and rotate relative to the rotating cylinder.

[0009] Specifically, each of the plurality of positioning jigs includes a fixed bottom frame. A plurality of flat plates are fixedly connected inside each of the plurality of centrifugal cylinders. The plurality of fixed bottom frames are respectively fixedly connected to the plurality of flat plates. A double-pressure elastic member is installed in each of the plurality of fixed bottom frames. A lifting bracket is slidably connected to each of the plurality of fixed bottom frames. A limiting bolt is threadedly connected to each of the plurality of fixed bottom frames. The plurality of limiting bolts are respectively used for relatively pressing and limiting the plurality of lifting brackets relative to the plurality of fixed bottom frames. A sliding frame is slidably connected to each of the plurality of lifting brackets. An auxiliary pressure spring is connected between each of the plurality of sliding frames and the plurality of lifting brackets respectively. A synchronous through shaft is connected between each of the plurality of sliding frames and the plurality of double-pressure elastic members respectively. An enlarged pressing plate frame is slidably connected to each of the plurality of sliding frames. A threaded rod is rotatably connected to each of the plurality of enlarged pressing plate frames. The plurality of threaded rods are respectively threadedly connected to the plurality of sliding frames.

[0010] Specifically, multiple of the double-pressure elastic members each include an installation synchronization shaft. Multiple of the installation synchronization shafts are respectively rotatably connected within multiple of the fixed chassis. Multiple fixed chassis are each fixedly connected with a synchronization spring. Multiple of the synchronization springs are respectively fixedly connected to multiple of the installation synchronization shafts. A first spring pressing plate and a second spring pressing plate are fixedly connected to each of the multiple installation synchronization shafts. Two strip hole frames are provided on each of the multiple synchronization through shafts. The multiple strip hole frames are respectively fixedly connected to multiple of the first spring pressing plates and multiple of the second spring pressing plates.

[0011] Specifically, a horizontal fine adjustment hole matching the synchronization through shaft is formed in the sliding frame, and a horizontal wide adjustment hole matching the synchronization through shaft is formed in the lifting bracket.

[0012] Specifically, a support limit plate and multiple outward extending mounting ears are fixedly connected to the outside of each of the multiple support rings. A guiding hole is formed in each of the multiple support limit plates. A guiding rod is slidably connected within each of the multiple guiding holes. The multiple guiding rods are respectively fixedly connected to the revolving plate frame. A synchronization ring is fixedly connected to each of the multiple guiding rods. The multiple outward extending mounting ears are respectively fixedly connected to multiple of the support springs.

[0013] Specifically, the driving structure includes an electric lifting rod and a third servo motor. The electric lifting rod is installed at the top of the suspension bracket. A lifting shell is fixedly connected to the lifting rod of the electric lifting rod. A downward pressing alignment block is rotatably connected within the lifting shell. A recessed groove matching the downward pressing alignment block is provided at the top of each of the multiple centrifugal cylinders. The third servo motor is installed on the lifting shell, and the third servo motor is used for driving the relative rotation of the downward pressing alignment block with respect to the lifting shell.

[0014] Specifically, driving gears are installed on the output shafts of the first servo motor and the third servo motor. Two of the driving gears are each engaged with a transmission tooth ring. The two transmission tooth rings are respectively fixedly connected to the rotating cylinder and the downward pressing alignment block.

[0015] Specifically, the delivery pump is communicated with a fixed pipe. The vertical pipe is communicated with the fixed pipe and is rotatably connected to the fixed pipe.

[0016] Specifically, a support limit ring is rotatably connected within the rotating cylinder, and the support limit ring is used for the auxiliary limitation of the centrifugal cylinder.

[0017] A packaging method for a high-speed VCSEL semiconductor chip protection packaging device includes the following steps:

[0018] S1. Before use, first install a control circuit for the transfer pump, the first servo motor, the second servo motor and the driving structure. Through the control circuit, the transfer pump, the first servo motor, the second servo motor and the driving structure can be powered on and operated. Then, install a storage container filled with filling glue to be dispensed at the suction end of the transfer pump, so that when the transfer pump is powered on, it can suck the filling glue in the storage container and pump it into the vertical pipe;

[0019] S2. When chip encapsulation operations are required, use the positioning fixture to complete the matching clamping operations for the chips to be encapsulated and the supporting circuit boards. Multiple positioning fixtures are equipped in a single centrifuge tube, so multiple sets of circuit boards and chips can be correspondingly clamped and installed in a single centrifuge tube. After the circuit boards and chips that are matched with each other are positioned, start the second servo motor. The second servo motor is powered on and operates to drive the rotation of the swivel shaft. The rotation of the swivel shaft drives the rotation of the swivel plate frame. The rotation of the swivel plate frame realizes the synchronous revolution of multiple centrifuge tubes until the axis of the centrifuge tube with the chip clamped inside coincides with the axis of the rotating tube;

[0020] S3. After the axis of the centrifuge tube with the chip enters the state of coincidence with the axis of the rotating tube, pause the operation of the second servo motor. Then, the driving structure is powered on and operates to realize the downward pushing of the centrifuge tube directly below the driving structure, so that the centrifuge tube is inserted into the rotating tube. Before the centrifuge tube is inserted into the rotating tube, the driving structure controls the centrifuge tube to rotate and align itself, so that the positioning fixture in the centrifuge tube can be rotationally misaligned relative to multiple dispensing tubes, so as to avoid interference of the positioning fixture relative to the dispensing tubes during the insertion of the centrifuge tube relative to the rotating tube;

[0021] S4. After the centrifuge tube is inserted into the rotating tube in place, multiple dispensing tubes will be respectively obliquely misaligned up and down relative to multiple chips to be dispensed. Then, according to the specific positions of the chips, the driving structure and the first servo motor are powered on and operate to realize the relative rotation adjustment of the centrifuge tube inserted into the rotating tube and the rotating tube, so that the dispensing tubes and the chips are aligned for up and down glue dispensing;

[0022] S5. Then, both the driving structure and the first servo motor are powered on and operate to realize the synchronous rotation between the centrifuge tube and the rotating tube, so that the mutually supporting circuit boards and chips enter the state of bearing centrifugal force. Then, the transfer pump operates to pump the filling glue into the vertical pipe. The filling glue entering the vertical pipe is dispersed and guided by multiple dispensing tubes. The filling glue guided by the dispensing tubes will flow out from the holes at the bottom of the end of the dispensing tubes and finally drip and fill the gap between the chips and the circuit boards. Moreover, the filling glue entering the gap will form a flowing coverage and tight filling under the action of its own gravity and centrifugal force.

[0023] The beneficial effects of the present invention are:

[0024] The high-speed VCSEL semiconductor chip protection packaging device described in the present invention forms a positioning clamping structure that matches the circuit board and the chip through the design of the indexing clamping system. On the one hand, it can realize the relative position determination of the circuit board and the chip during the chip packaging process, and on the other hand, it can also make the mutually matched circuit board and chip enter a state of bearing centrifugal force, so as to improve the filling quality of the filling glue after dispensing during the chip packaging process.

[0025] The high-speed VCSEL semiconductor chip protection packaging device described in the present invention can form a dispensing operation in conjunction with a rotating circuit board and chip through the design of a rotating dispensing system. On the one hand, it can realize dynamic dispensing in conjunction with a rotating circuit board and chip, and on the other hand, it can also realize synchronous dispensing operations of multiple groups of circuit boards and chips, which is more practical and has a higher chip packaging efficiency.

[0026] The high-speed VCSEL semiconductor chip protection packaging device described in the present invention facilitates the downward pressure adjustment and rotational drive adjustment of the centrifugal cylinder relative to the rotating cylinder through the design of the driving structure, and then facilitates the relative position matching adjustment of multiple distribution tubes relative to multiple chips, thereby finally forming the dispensing position of the dispensing point relative to the chip. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] The present invention is further described below in conjunction with the accompanying drawings and embodiments.

[0028] Figure 1 It is a schematic diagram of the overall three-dimensional structure of the present invention;

[0029] Figure 2 For the present invention Figure 1 A schematic diagram of the local enlarged structure at point A in the middle;

[0030] Figure 3 It is a schematic diagram of the exploded three-dimensional structure of the expanded pressing plate frame, the threaded rod and the installation synchronous shaft of the present invention;

[0031] Figure 4 It is a schematic diagram of the exploded three-dimensional structure of the suspension bracket, the second servo motor and the lifting shell of the present invention;

[0032] Figure 5 It is a schematic diagram of the three-dimensional structure of the delivery pump, the material distribution pipe and the vertical pipe of the present invention;

[0033] Figure 6 It is a schematic diagram of the three-dimensional structure of the swing plate frame, the support ring and the support spring of the present invention;

[0034] Figure 7 It is a schematic diagram of the three-dimensional structure of the supporting bracket, the rotating drum and the material distributing pipe of the present invention;

[0035] Figure 8Schematic diagram of the overall upward view of the three-dimensional structure of the present invention;

[0036] Figure 9 For the present invention Figure 8 Partial enlarged structural schematic diagram at position B in the present invention;

[0037] Figure 10 For the present invention Figure 8 Partial enlarged structural schematic diagram at position C in the present invention;

[0038] Figure 11 Schematic diagram of the exploded upward view of the three-dimensional structure of the cooperation of the suspension bracket, lifting shell, downward pressing and aligning block, etc. of the present invention;

[0039] Figure 12 Schematic diagram of the upward view of the three-dimensional structure of the cooperation of the delivery pump, vertical pipe, fixed pipe, etc. of the present invention;

[0040] Figure 13 Schematic diagram of the upward view of the three-dimensional structure of the cooperation of the flat plate, lifting bracket, enlarged pressing plate frame, etc. of the present invention;

[0041] Figure 14 Schematic diagram of the exploded three-dimensional structure of the cooperation of the sliding frame, auxiliary pressing spring, synchronous through shaft, etc. of the present invention;

[0042] Figure 15 Schematic diagram of the three-dimensional structure of the centrifugal cylinder and the rotating cylinder before their axes coincide and are relatively inserted.

[0043] In the figure: 1, support bracket; 2, delivery pump; 3, first servo motor; 4, rotating cylinder; 5, cloth pipe; 6, vertical pipe; 7, suspension bracket; 8, second servo motor; 9, rotating shaft; 10, rotating plate frame; 11, centrifugal cylinder; 12, support ring; 13, support spring; 14, fixed bottom frame; 15, flat plate; 16, lifting bracket; 17, limit bolt; 18, sliding frame; 19, auxiliary pressing spring; 20, synchronous through shaft; 21, enlarged pressing plate frame; 22, threaded rod; 23, installation synchronous shaft; 24, synchronous spring; 25, first spring pressing plate; 26, second spring pressing plate; 27, strip hole frame; 28, horizontal fine adjustment hole; 29, horizontal wide adjustment hole; 30, support limit plate; 31, outward extension installation ear; 32, guide rod; 33, synchronous ring; 34, electric lifting rod; 35, lifting shell; 36, downward pressing and aligning block; 37, recessed groove; 38, driving gear; 39, transmission gear ring; 40, fixed pipe; 41, support limit ring; 42, third servo motor. Detailed implementation manners

[0044] In order to make the technical means, creative features, achieved purposes and effects of the present invention easy to understand, the present invention will be further described below in conjunction with specific implementation manners.

[0045] Example, please refer toFigures 1 - 15 , a high-speed VCSEL semiconductor chip protection and packaging device, comprising a support bracket 1, a rotating dispensing system and a indexing clamping system. The rotating dispensing system includes a delivery pump 2, a first servo motor 3, a rotating cylinder 4 and a plurality of dispensing tubes 5. The delivery pump 2 and the first servo motor 3 are both installed at the bottom end of the support bracket 1. The rotating cylinder 4 is rotatably connected within the support bracket 1. The first servo motor 3 is used to drive the rotation of the rotating cylinder 4 relative to the support bracket 1. A vertical tube 6 is fixedly connected within the rotating cylinder 4. The plurality of dispensing tubes 5 are all communicated with the vertical tube 6, and the vertical tube 6 is communicated with the delivery pump 2. Through the design of the rotating dispensing system, it can cooperate with the rotating circuit board and chip to form a dispensing operation. On the one hand, it can realize dynamic dispensing with the rotating circuit board and chip. On the other hand, it can also realize the synchronous dispensing operation of multiple groups of circuit boards and chips. It is more practical and the packaging efficiency of the chip is also higher. The delivery pump 2 is communicated with a fixed tube 40. The vertical tube 6 is communicated with the fixed tube 40, and the vertical tube 6 is rotatably connected with the fixed tube 40, ensuring the connection effect between the vertical tube 6 and the delivery pump 2 while enabling the vertical tube 6 to rotate synchronously with the rotating cylinder 4.

[0046] It should be further noted that the indexing clamping system includes a suspension bracket 7 and a second servo motor 8. The suspension bracket 7 is fixedly connected to the support bracket 1, and a rotating shaft 9 is rotatably connected between the suspension bracket 7 and the support bracket 1. The second servo motor 8 is installed on the suspension bracket 7 and is used to drive the rotation of the rotating shaft 9. A rotating plate frame 10 is fixedly connected to the rotating shaft 9. A plurality of circular openings are provided in the rotating plate frame 10, and a plurality of centrifugal cylinders 11 are arranged in the plurality of circular openings. A plurality of positioning jigs are installed in the plurality of centrifugal cylinders 11. The plurality of positioning jigs each include a fixed bottom frame 14. A plurality of flat plates 15 are fixedly connected in the plurality of centrifugal cylinders 11. The plurality of fixed bottom frames 14 are respectively fixedly connected to the plurality of flat plates 15. A plurality of double-pressure elastic members are installed in the plurality of fixed bottom frames 14. A lifting bracket 16 is slidably connected to each of the plurality of fixed bottom frames 14. A limit bolt 17 is threadedly connected to each of the plurality of fixed bottom frames 14, and the plurality of limit bolts 17 are respectively used for relative pressing and limiting of the plurality of lifting brackets 16 relative to the plurality of fixed bottom frames 14. A sliding frame 18 is slidably connected to each of the plurality of lifting brackets 16. An auxiliary pressure spring 19 is connected between each of the plurality of sliding frames 18 and each of the plurality of lifting brackets 16. A synchronous through shaft 20 is connected between each of the plurality of sliding frames 18 and each of the plurality of double-pressure elastic members. An enlarged pressing plate frame 21 is slidably connected to each of the plurality of sliding frames 18. A threaded rod 22 is rotatably connected to each of the plurality of enlarged pressing plate frames 21, and the plurality of threaded rods 22 are respectively threadedly connected to the plurality of sliding frames 18. The plurality of double-pressure elastic members each include an installation synchronous shaft 23. The plurality of installation synchronous shafts 23 are respectively rotatably connected in the plurality of fixed bottom frames 14. A synchronous spring 24 is fixedly connected to each of the plurality of fixed bottom frames 14, and the plurality of synchronous springs 24 are respectively fixedly connected to the plurality of installation synchronous shafts 23. A first elastic pressing plate 25 and a second elastic pressing plate 26 are fixedly connected to each of the plurality of installation synchronous shafts 23. Two strip hole frames 27 are provided on each of the plurality of synchronous through shafts 20, and the plurality of strip hole frames 27 are respectively fixedly connected to the plurality of first elastic pressing plates 25 and the plurality of second elastic pressing plates 26. Through the design of the indexing clamping system, a positioning and clamping structure matching the circuit board and the chip is formed. On the one hand, it can realize the determination of the relative positions of the circuit board and the chip during the chip packaging process. On the other hand, it can also make the mutually cooperating circuit board and chip enter a state of bearing centrifugal force, so as to improve the filling quality of the filling glue after dispensing during the chip packaging process. A horizontal fine adjustment hole 28 matching the synchronous through shaft 20 is provided in the sliding frame 18, and a horizontal wide adjustment hole 29 matching the synchronous through shaft 20 is provided in the lifting bracket 16, so as to realize the sequential and coherent driving of the enlarged pressing plate frame 21, the first elastic pressing plate 25 and the second elastic pressing plate 26.

[0047] It should be further noted that support rings 12 are rotatably connected to the outside of multiple centrifugal cylinders 11, and multiple support springs 13 are connected between multiple support rings 12 and the rotary plate frame 10. A driving structure matching the centrifugal cylinders 11 is installed on the suspension bracket 7. The driving structure is used for the pressing-in drive and rotational drive of the centrifugal cylinders 11 relative to the rotating cylinder 4. The driving structure includes an electric lifting rod 34 and a third servo motor 42. The electric lifting rod 34 is installed at the top of the suspension bracket 7. A lifting shell 35 is fixedly connected to the lifting rod of the electric lifting rod 34. A downward pressing and alignment block 36 is rotatably connected inside the lifting shell 35. Recessed grooves 37 matching the downward pressing and alignment block 36 are provided at the tops of multiple centrifugal cylinders 11. The third servo motor 42 is installed on the lifting shell 35. The third servo motor 42 is used for the rotational drive of the downward pressing and alignment block 36 relative to the lifting shell 35. Through the design of the driving structure, it is convenient to adjust the downward pressing and placement and rotational drive of the centrifugal cylinders 11 relative to the rotating cylinder 4, and further convenient to adjust the relative positions of multiple cloth tubes 5 relative to multiple chips respectively, and finally form the formation of the dispensing position of the dispensing points relative to the chips. Support limit plates 30 and multiple outward extending mounting ears 31 are fixedly connected to the outside of multiple support rings 12. Multiple support limit plates 30 are each provided with a guiding hole. Guide rods 32 are slidably connected inside multiple guiding holes, forming a direction guide for the support rings 12 during height adjustment. Multiple guide rods 32 are fixedly connected to the rotary plate frame 10. A synchronous ring 33 is fixedly connected to multiple guide rods 32 to improve the structural strength between multiple guide rods 32. Multiple outward extending mounting ears 31 are respectively fixedly connected to multiple support springs 13, forming the specific connection structure at the top of the support springs 13. Driving gears 38 are installed on the output shafts of the first servo motor 3 and the third servo motor 42. Both driving gears 38 are engaged with a transmission gear ring 39. The two transmission gear rings 39 are respectively fixedly connected to the rotating cylinder 4 and the downward pressing and alignment block 36. A support limit ring 41 is rotatably connected inside the rotating cylinder 4. The support limit ring 41 is used for the auxiliary limitation of the centrifugal cylinders 11.

[0048] The delivery pump 2, the first servo motor 3, the second servo motor 8, the electric lifting rod 34 and the third servo motor 42 in this embodiment are all conventional devices well-known to those skilled in the art and purchased on the market. In the present invention, we only use them and do not improve their structures and functions. Their setting methods, installation methods and electrical connection methods can be debugged and operated by those skilled in the art as long as they follow the requirements of their operation manuals. Therefore, they will not be elaborated here.

[0049] In summary, the working principle of the high-speed VCSEL semiconductor chip protection packaging device and the packaging method is as follows. Before use, first install a control circuit for the delivery pump 2, the first servo motor 3, the second servo motor 8 and the driving structure. Through the control circuit, the power-on operation of the delivery pump 2, the first servo motor 3, the second servo motor 8 and the driving structure can be realized. Then, install a filling glue storage container that needs to be dispensed at the suction end of the delivery pump 2, so that when the delivery pump 2 is powered on, it can suck the filling glue in the filling glue storage container and pump it into the vertical pipe 6. When chip packaging operation is required, first pull the expanding pressure plate frame 21 to elastically stretch the auxiliary pressure spring 19. During this process, the sliding frame 18 slides away from the lifting bracket 16. Due to the function of the horizontal fine adjustment hole 28, at the initial stage when the sliding frame 18 is pulled, the synchronous through shaft 20 forms a relative position change in the horizontal fine adjustment hole 28 until the synchronous through shaft 20 moves to the limit position relative to the horizontal fine adjustment hole 28. After that, the synchronous through shaft 20 moves synchronously with the sliding frame 18, and the horizontal wide adjustment hole 29 provides enough movement space for the synchronous through shaft 20. The movement of the synchronous through shaft 20 respectively drives the rotation of the first elastic pressure plate 25 and the second elastic pressure plate 26 through the two strip hole frames 27 provided at both ends thereof. The synchronous rotation of the first elastic pressure plate 25 and the second elastic pressure plate 26 will drive the installation synchronous shaft 23 between the two to rotate, causing the synchronous spring 24 to elastically expand and contract. Place the circuit board corresponding to the packaged chip on the lifting bracket 16. First, partially relax the pulling of the sliding frame 18 to make the first elastic pressure plate 25 and the second elastic pressure plate 26 move in the reverse direction and reset until both the first elastic pressure plate 25 and the second elastic pressure plate 26 are in relative contact and pressing with respect to the circuit board. Then, place the chip at an appropriate position relative to the circuit board and completely release the pulling effect on the sliding frame 18. Under the elastic reset action of the auxiliary pressure spring 19, the expanding pressure plate frame 21 forms contact and pressing with respect to the chip, finally achieving the relative positioning between the chip and the circuit board and the common positioning of the chip and the circuit board in the centrifugal cylinder 11. Moreover, there is a sequence between the expanding pressure plate frame 21 and the first elastic pressure plate 25 and between the expanding pressure plate frame 21 and the second elastic pressure plate 26, so it is more convenient for the sequential positioning and installation of the circuit board and the chip. And by relaxing the pressing effect of the limit bolt 17 on the lifting bracket 16, the height of the lifting bracket 16 can be adjusted to achieve the adaptation adjustment of circuit boards of various specifications. By rotating the threaded rod 22, the relative height between the expanding pressure plate frame 21 and the sliding frame 18 can also be adjusted, finally achieving the matching adjustment of the installation positions of different chips relative to different circuit boards. Finally, when the centrifugal cylinder 11 is inserted relative to the rotating cylinder 4 and completed, the circuit board and the chip installed and positioned in the centrifugal cylinder 11 through the positioning fixture in the centrifugal cylinder 11 have an appropriate relative height with respect to the cloth pipe 5, so that the cloth gap between the cloth pipe 5 and the circuit board and the chip has an appropriate distance and relative position.

[0050] Further, the matching clamping operation of the chip to be encapsulated and the supporting circuit board is completed by the positioning fixture. A plurality of positioning fixtures are provided in a single centrifuge cylinder 11. Therefore, multiple sets of circuit boards and chips can be correspondingly clamped and installed in a single centrifuge cylinder 11. After the matching positioning of the mutually supporting circuit board and chip is completed, the second servo motor 8 is started. The second servo motor 8 is powered on and runs to drive the rotation of the rotary shaft 9. The rotation of the rotary shaft 9 drives the rotation of the rotary plate frame 10. The rotation of the rotary plate frame 10 realizes the synchronous revolution rotation of multiple centrifuge cylinders 11 until the axis of the centrifuge cylinder 11 with the chip clamped inside coincides with the axis of the rotating cylinder 4. After the axis of the centrifuge cylinder 11 with the chip inserted coincides with the axis of the rotating cylinder 4, the second servo motor 8 is paused. Then the driving structure is powered on and runs to push down the centrifuge cylinder 11 located directly below the driving structure, so that the centrifuge cylinder 11 is inserted into the rotating cylinder 4. Before the centrifuge cylinder 11 is inserted into the rotating cylinder 4, the driving structure controls the centrifuge cylinder 11 to form its own rotation alignment, so that the positioning fixture in the centrifuge cylinder 11 can form a rotational dislocation relative to the plurality of cloth pipes 5, so as to avoid interference between the positioning fixture and the cloth pipe 5 during the insertion of the centrifuge cylinder 11 relative to the rotating cylinder 4. That is, the electric lifting rod 34 in the driving structure is powered on and runs to realize the downward adjustment of the lifting shell 35 relative to the suspension bracket 7. During this process, the downward pressing alignment block 36 will synchronously fall along with the falling of the lifting shell 35. That is, the downward pressing alignment block 36 approaches and contacts the centrifuge cylinder 11 below it. Since the rotation freedom between the downward pressing alignment block 36 and the lifting shell 35 is restricted in the stopped state of the third servo motor 42, the downward pressing alignment block 36 will be inserted into the recessed groove 37 on the centrifuge cylinder 11 during the falling process, so that the centrifuge cylinder 11 forms an active rotation adjustment. At the same time, after the first servo motor 3 and the second servo motor 8 both enter the stopped state, there is a fixed angle between the downward pressing alignment block 36 and the suspension bracket 7, and there is also a fixed angle between the rotating cylinder 4 and the support bracket 1, so as to ensure that each centrifuge cylinder 11 forms an appropriate angle with the rotating cylinder 4 during the insertion process relative to the rotating cylinder 4, so that the positioning fixtures in each centrifuge cylinder 11 form a fixed rotational dislocation with the cloth pipe 5.

[0051] Further, when the downward pressure alignment block 36 continues to fall later, it will drive the centrifugal cylinder 11 downward. After the centrifugal cylinder 11 is inserted into place relative to the rotating cylinder 4, the support limit ring 41 supports and limits the bottom wall of the centrifugal cylinder 11. The multiple dispensing tubes 5 will be respectively obliquely misaligned up and down relative to the multiple chips to be dispensed. Then, according to the specific positions of the chips, the driving structure and the first servo motor 3 are powered on and run. That is, the third servo motor 42 in the driving structure is powered on and run. Through the meshing transmission of the driving gear 38 and the transmission gear ring 39, the rotational drive of the downward pressure alignment block 36 is realized. The rotation of the downward pressure alignment block 36 realizes the rotational drive of the centrifugal cylinder 11 that abuts against it up and down. The first servo motor 3 is powered on and run. Through the meshing transmission of the driving gear 38 and the transmission gear ring 39, the rotational drive of the rotating cylinder 4 is realized. By controlling the rotation speeds of the third servo motor 42 and the first servo motor 3, the relative rotational adjustment between the centrifugal cylinder 11 inserted into the rotating cylinder 4 and the rotating cylinder 4 can be realized, so that the dispensing tubes 5 and the chips are aligned for up and down glue application. Then, the first servo motor 3 and the third servo motor 42 in the driving structure are controlled to run synchronously, realizing the synchronous rotation between the centrifugal cylinder 11 and the rotating cylinder 4, so that the mutually supporting circuit board and chip enter the state of bearing centrifugal force, and the multiple dispensing tubes 5 are respectively in a relatively stationary state relative to the multiple chips. Then the transfer pump 2 runs to pump the filling glue into the vertical tube 6. The filling glue entering the vertical tube 6 is dispersed and guided by the multiple dispensing tubes 5. The filling glue guided by the dispensing tubes 5 will flow out from the holes at the bottom of the ends of the dispensing tubes 5 and finally drip and fill the gap between the chip and the circuit board. The filling glue entering this gap will form a flowing coverage and tight filling under the action of its own gravity and centrifugal force. During the filling process of the filling glue, the synchronous rotation speed of the rotating cylinder 4 and the centrifugal cylinder 11 can be controlled to adjust and control the centrifugal force borne by the filling glue entering the gap between the circuit board and the chip, and finally control the pressing force borne by the filling glue. Since the filling glue is in a viscous state as a whole and the centrifugal force is strictly controlled not to produce a large mutation, it can prevent the filling glue entering the gap between the circuit board and the chip from deviating from the gap between the circuit board and the chip. At the same time, to improve the curing efficiency of the filling glue, a heating device can be added to create a dry and hot environment in the rotating cylinder 4 to promote the rapid curing of the filling glue.

[0052] For those skilled in the art, it is obvious that the present invention is not limited to the details of the above exemplary embodiments, and without departing from the spirit or basic characteristics of the present invention, the present invention can be implemented in other specific forms. Therefore, from any point of view, the embodiments should be regarded as exemplary and non-limiting. The scope of the present invention is defined by the appended claims rather than the above description. Therefore, all changes falling within the meaning and scope of the equivalent elements of the claims are intended to be included in the present invention. Any reference signs in the claims should not be regarded as limiting the claimed rights.

[0053] In addition, it should be understood that although this specification is described according to embodiments, not every embodiment only contains an independent technical solution. This narrative way of the specification is only for clarity. Those skilled in the art should regard the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

Claims

1. A high-speed VCSEL semiconductor chip protection packaging device, characterized in that: It comprises a support bracket (1), a rotating glue dispensing system and a transposition clamping system; The rotary dispensing system comprises a delivery pump (2), a first servo motor (3), a rotating cylinder (4) and a plurality of material dispensing tubes (5); the delivery pump (2) and the first servo motor (3) are both mounted at the bottom end of the support bracket (1); the rotating cylinder (4) is rotatably connected in the support bracket (1); the first servo motor (3) is used to drive the rotating cylinder (4) to rotate relative to the support bracket (1); a vertical tube (6) is fixedly connected in the rotating cylinder (4); the plurality of material dispensing tubes (5) are all connected to the vertical tube (6), and the vertical tube (6) is connected to the delivery pump (2); The indexing clamping system comprises a suspension bracket (7) and a second servo motor (8), wherein the suspension bracket (7) is fixedly connected to the support bracket (1), and a swivel shaft (9) is rotatably connected between the suspension bracket (7) and the support bracket (1), wherein the second servo motor (8) is mounted on the suspension bracket (7), and the second servo motor (8) is used for rotatably driving the swivel shaft (9), and a swivel plate frame (10) is fixedly connected to the swivel shaft (9), wherein the swivel plate frame (10) is provided with a plurality of circular openings, wherein a centrifugal cylinder (11) is disposed in each of the plurality of circular openings, wherein a plurality of positioning fixtures are installed in each of the plurality of centrifugal cylinders (11), wherein a support ring (12) is rotatably connected to the outside of each of the plurality of centrifugal cylinders (11), wherein a plurality of support springs (13) are connected between each of the plurality of support rings (12) and the swivel plate frame (10), and wherein a driving structure matching the centrifugal cylinder (11) is mounted on the suspension bracket (7), wherein the driving structure is used for pressing-in driving and swivel driving of the centrifugal cylinder (11) relative to the rotating cylinder (4).

2. A high-speed VCSEL semiconductor chip protection packaging device according to claim 1, characterized in that: The plurality of positioning fixtures each comprise a fixed base frame (14), the plurality of centrifugal barrels (11) are each fixedly connected to a plurality of planar plates (15), the plurality of fixed base frames (14) are respectively fixedly connected to the plurality of planar plates (15), the plurality of fixed base frames (14) are each installed with a double-pressure elastic member, the plurality of fixed base frames (14) are each slidably connected to a lifting bracket (16), the plurality of fixed base frames (14) are each threadedly connected to a limiting bolt (17), the plurality of limiting bolts (17) being respectively used for the plurality of lifting brackets (16) to move relative to the plurality of fixed base frames ( 14), a plurality of lifting brackets (16) are slidably connected to a sliding frame (18), a plurality of the sliding frames (18) are respectively connected to the plurality of lifting brackets (16) with auxiliary pressure springs (19), a plurality of the sliding frames (18) are respectively connected to the plurality of double-pressure elastic members with synchronous through-shafts (20), a plurality of the sliding frames (18) are slidably connected to an enlarged pressure plate frame (21), a plurality of the enlarged pressure plate frames (21) are rotatably connected to a threaded rod (22), and a plurality of the threaded rods (22) are respectively threadedly connected to a plurality of the sliding frames (18).

3. A high-speed VCSEL semiconductor chip protection packaging device according to claim 2, characterized in that: The plurality of double-pressure elastic members each include a mounting synchronous shaft (23), the plurality of mounting synchronous shafts (23) are rotatably connected in the plurality of fixed base frames (14), the plurality of fixed base frames (14) are each fixedly connected with a synchronous spring (24), the plurality of synchronous springs (24) are each fixedly connected with the plurality of mounting synchronous shafts (23), the plurality of mounting synchronous shafts (23) are each fixedly connected with a first spring-pressure plate (25) and a second spring-pressure plate (26), the plurality of synchronous through-shafts (20) are each provided with two strip hole frames (27), the plurality of strip hole frames (27) are each fixedly connected with the plurality of first spring-pressure plates (25) and the plurality of second spring-pressure plates (26).

4. A high-speed VCSEL semiconductor chip protection packaging device according to claim 3, characterized in that: The sliding frame (18) is provided with a transverse fine adjustment hole (28) matching the synchronous through-axis (20), and the lifting bracket (16) is provided with a transverse wide adjustment hole (29) matching the synchronous through-axis (20).

5. A high-speed VCSEL semiconductor chip protection packaging device according to claim 4, characterized in that: A plurality of the support rings (12) are fixedly connected to support limit plates (30) and a plurality of outwardly extending mounting ears (31) on the outside, a plurality of the support limit plates (30) are provided with guide holes, a plurality of the guide holes are slidably connected to guide rods (32), a plurality of the guide rods (32) are fixedly connected to the revolving plate frame (10), a plurality of the guide rods (32) are fixedly connected to a synchronization ring (33), and a plurality of the outwardly extending mounting ears (31) are respectively fixedly connected to a plurality of the support springs (13).

6. A high-speed VCSEL semiconductor chip protection packaging device according to claim 5, characterized in that: The driving structure comprises an electric lifting rod (34) and a third servo motor (42); the electric lifting rod (34) is mounted on the top end of the suspension bracket (7); a lifting shell (35) is fixedly connected to the lifting rod of the electric lifting rod (34); a downward pressure calibration block (36) is rotatably connected inside the lifting shell (35); the top ends of the plurality of centrifugal barrels (11) are all provided with a recessed groove (37) matching the downward pressure calibration block (36); the third servo motor (42) is mounted on the lifting shell (35); and the third servo motor (42) is used for driving the downward pressure calibration block (36) to rotate relative to the lifting shell (35).

7. A high-speed VCSEL semiconductor chip protection packaging device according to claim 6, characterized in that: A driving gear (38) is mounted on the output shafts of the first servo motor (3) and the third servo motor (42), and the two driving gears (38) are meshed with a transmission gear ring (39). The two transmission gear rings (39) are respectively fixedly connected to the rotating cylinder (4) and the downward pressure calibration block (36).

8. The high-speed VCSEL semiconductor chip protection packaging device according to claim 7, characterized in that: The delivery pump (2) is connected to a fixed pipe (40), the vertical pipe (6) is connected to the fixed pipe (40), and the vertical pipe (6) is rotatably connected to the fixed pipe (40).

9. A high-speed VCSEL semiconductor chip protection packaging device according to claim 8, characterized in that: A support and limiting ring (41) is rotatably connected inside the rotating cylinder (4), and the support and limiting ring (41) is used for auxiliary limiting of the centrifugal cylinder (11).

10. A packaging method for a high-speed VCSEL semiconductor chip protection packaging device, characterized in that: A high-speed VCSEL semiconductor chip protection packaging device and packaging method according to any one of claims 1 to 9 is used, comprising the following steps: S1. Before use, firstly, a control circuit is installed for the delivery pump (2), the first servo motor (3), the second servo motor (8) and the drive structure, so that the delivery pump (2), the first servo motor (3), the second servo motor (8) and the drive structure can be powered on and operated by the control circuit. Then, a filling glue storage container that needs to be dispensed is installed at the suction end of the delivery pump (2), so that when the delivery pump (2) is powered on and operated, it can absorb the filling glue in the filling glue storage container and pump it into the vertical pipe (6); S2. When it is necessary to package the chip, the chip to be packaged and the matching circuit board are matched and clamped by a positioning fixture. A single centrifugal cylinder (11) is equipped with multiple positioning fixtures, so that multiple sets of circuit boards and chips can be clamped and installed in the single centrifugal cylinder (11). After the matching positioning of the circuit boards and chips is completed, the second servo motor (8) is started, and the second servo motor (8) is powered on to realize the rotation drive of the rotary shaft (9). The rotation of the rotary shaft (9) realizes the rotation drive of the rotary plate frame (10). The rotation of the rotary plate frame (10) realizes the synchronous revolution rotation of multiple centrifugal cylinders (11), until the axis of the centrifugal cylinder (11) holding the chip inside is in a mutually overlapping state relative to the axis of the rotating cylinder (4); S3, after the axis of the centrifugal cylinder (11) to be loaded with the chip is in a mutually overlapping state relative to the axis of the rotating cylinder (4), the second servo motor (8) is stopped, and then the driving structure is powered on to operate, so as to push the centrifugal cylinder (11) located directly below the driving structure downward, so that the centrifugal cylinder (11) is inserted into the rotating cylinder (4). Before the centrifugal cylinder (11) is inserted into the rotating cylinder (4), the driving structure controls the centrifugal cylinder (11) to form its own rotational alignment, so that the positioning fixture in the centrifugal cylinder (11) can form a rotational misalignment relative to the plurality of distribution tubes (5), so as to avoid interference between the positioning fixture and the distribution tubes (5) during the process of the centrifugal cylinder (11) being inserted into the rotating cylinder (4); S4, after the centrifugal cylinder (11) is inserted into position relative to the rotating cylinder (4), the plurality of material dispensing tubes (5) will respectively form an upper and lower oblique offset correspondence relative to the plurality of chips to be glued, and then according to the specific position of the chip, the driving structure and the first servo motor (3) are powered on to realize the relative rotation adjustment of the centrifugal cylinder (11) inserted into the rotating cylinder (4) and the rotating cylinder (4), so that the material dispensing tubes (5) and the chip form an upper and lower glue coating alignment; S5, then the driving structure and the first servo motor (3) are powered on to realize synchronous rotation between the centrifugal cylinder (11) and the rotating cylinder (4), so that the matching circuit board and chip enter a state of bearing centrifugal force, and then the delivery pump (2) is operated to pump filling glue into the vertical pipe (6). The filling glue entering the vertical pipe (6) is dispersed and guided by a plurality of distribution tubes (5). The filling glue guided by the distribution tubes (5) will flow out from the holes at the bottom of the ends of the distribution tubes (5) and finally drip and fill the gap between the chip and the circuit board. The filling glue entering the gap will form a flow covering and tight filling under the action of its own gravity and centrifugal force.

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