Surface deicing structure, surface deicing device and surface deicing method

Abstract

The invention discloses a surface deicing structure, a surface deicing device and a surface deicing method, and relates to the field of object surface deicing. The surface deicing structure comprises a base body and an interdigital electrode. The surface of the base body is provided with a hydrophobic area and hydrophilic areas, the hydrophilic areas are arranged on the two sides of the hydrophobic area, the surface of the base body is provided with channels, and the channels form the hydrophilic areas. The interdigital electrodes are arranged on the base body, and the interdigital electrodes are used for being communicated with the two adjacent channels and used for forming discharge electrodes together with saline water in the channels. When the hydrophobic area and the channel are communicated by saline water to form a loop, the saline water in the hydrophobic area is used as a resistor to be heated. The surface deicing device provided by the embodiment of the invention is high and stable in deicing efficiency, and solves the problem that in the prior art, liquid water is difficult to permeate and freeze in the via hole between the upper electrode and the lower electrode, so that the defect of low deicing efficiency is caused.

Description

Technical Field

[0001] The present invention relates to the field of deicing on object surfaces, and in particular to a surface deicing structure, a surface deicing device and a surface deicing method. Background Art

[0002] Under the influence of low temperature climates such as polar regions and cold regions, the hulls, superstructures and various equipment of sailing ships and marine engineering equipment will be covered with a large amount of ice and snow, causing changes in the draft and center of gravity of the ships, thereby reducing the stability of the ships and the reliability of the superstructure structures; the large amount of ice accumulated on the equipment will also affect the operation of the equipment and bring serious safety risks.

[0003] In the prior art, there are devices that can perform surface deicing. These devices all have a common pain point, that is, the deicing efficiency is not high. For example, the surface deicing structure disclosed in CN117395819A uses steam pressure to impact the ice layer, thereby reducing the adhesion at the bottom of the ice layer and promoting the cracking and peeling of the ice layer. However, this solution has the problem that the inner and outer electrodes are arranged in layers, and liquid water is difficult to penetrate and freeze in the conductive hole between the upper and lower electrodes, resulting in the defect of low deicing efficiency.

[0004] Therefore, providing a structure that can efficiently and stably de-ice a surface is a technical problem that needs to be solved urgently by those skilled in the art. Summary of the invention

[0005] The present invention discloses a surface deicing structure, a surface deicing device and a surface deicing method, so as to at least partially improve the above technical problems.

[0006] In order to solve the above problems, the present invention adopts the following technical solutions: On the one hand, an embodiment of the present application provides a surface deicing structure, comprising: a substrate and an interdigital electrode. The surface of the substrate has a hydrophobic area and a hydrophilic area, and the hydrophilic area is arranged on both sides of the hydrophobic area, wherein the surface of the substrate is provided with a groove, and the groove forms the hydrophilic area. The interdigital electrode is arranged on the substrate, and the interdigital electrode is used to conduct with two adjacent grooves, and to form a discharge electrode together with the salt water in the groove. When the hydrophobic area and the groove are connected by salt water, a loop is formed, and the salt water in the hydrophobic area is heated as a resistor.

[0007] In one embodiment, the surface deicing structure further comprises: a porous electrode material, wherein the porous electrode material is disposed in the hydrophilic region and in contact with the interdigital electrodes.

[0008] In one embodiment, the spacing between adjacent porous electrode materials is 10 to 50 times the width of the channel; And / or, the depth of the groove is less than or equal to the thickness of the hydrophobic film layer; and / or, the width of the groove is less than or equal to 1 mm; And / or, the spacing between adjacent grooves is less than or equal to 6 times the width of the groove.

[0009] In one embodiment, the surface deicing structure further includes: a zero pole, which is electrically connected to the interdigitated electrodes, and the zero pole is used to form a loop with the porous electrode material and the interdigitated electrodes, and at this time the porous electrode material is used as a resistor for heating.

[0010] In one embodiment, the surface deicing structure further includes: a hydrophobic film layer, and the hydrophobic film layer is disposed on the surface of the substrate to form the hydrophobic area.

[0011] In one embodiment, the thickness of the hydrophobic film layer is less than or equal to 100 μm.

[0012] In one embodiment, the extension direction of the hydrophilic region is consistent with the flow direction of the salt water.

[0013] On the other hand, an embodiment of the present application further provides a surface deicing device, comprising a power supply and the surface deicing structure as described above, wherein the power supply is electrically connected to the interdigital electrodes.

[0014] In one embodiment, the surface deicing device also includes a temperature sensor, which is electrically connected to the power supply. The temperature sensor is configured to control the power supply to be turned off when the temperature of the loop formed by the connection of the hydrophobic area and the channel with brine rises to a specified temperature.

[0015] In another aspect, the present application also provides a surface deicing method, comprising the following steps: The aforementioned surface deicing structure is arranged on the part of the target object where deicing is required; When an ice layer is formed on the surface of the surface deicing structure and deicing is required, a voltage or pulse is applied to the interdigital electrodes.

[0016] The technical solution adopted by the present invention can achieve the following beneficial effects: The surface deicing structure provided in the embodiment of the present application is provided with a groove for draining water from the hydrophobic area as a hydrophilic area on the substrate, and a forked electrode is provided. The forked electrode and the salt water in the guide groove are used to form a discharge electrode. When the hydrophobic area is connected by salt water between two adjacent discharge electrodes to form a loop, the salt water in the hydrophobic area will be heated as a resistor, thereby achieving the surface deicing effect of the hydrophobic area. The surface deicing device provided in the embodiment of the present application has high and stable deicing efficiency. It only needs to form a loop and perform deicing operation when the salt water connects the groove and the hydrophobic area, which solves the defect or problem of low deicing efficiency caused by the difficulty of liquid water infiltrating and freezing in the conductive hole between the upper and lower electrodes in the prior art. The above-mentioned problem can also be solved when the above-mentioned surface deicing structure is applied to the surface deicing device and the surface deicing method. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0018] Figure 1 A schematic diagram of a structure in which a surface deicing structure is attached to an object to be protected in one embodiment of the present application is shown; Figure 2 for Figure 1 The enlarged view of point A in the middle; Figure 3 A schematic structural diagram showing another perspective of a surface deicing structure attached to an object to be protected in one embodiment of the present application; Figure 4 for Figure 3 The enlarged view of point B in the middle; Figure 5 A schematic structural diagram of a surface deicing structure in one embodiment of the present application is shown, in which a partial structure of the surface deicing structure is attached to an object to be protected; Figure 6 for Figure 5 Enlarged view of point C in the middle; Figure 7 A working principle diagram of a surface deicing structure in one embodiment of the present application is shown; Figure 8 A schematic structural diagram of a surface deicing structure in one embodiment of the present application is shown; Fig. 9 A flow chart of a surface deicing method in one embodiment of the present application is shown.

[0019] In the figure: 1. surface deicing device; 10. surface deicing structure; 110. substrate; 111. hydrophobic area; 112. hydrophilic area; 113. groove; 120. interdigitated electrode; 130. porous electrode material; 140. hydrophobic membrane layer; 20. temperature sensor; 30. salt water; 40. ice layer; 50. power supply; 2. object to be protected. DETAILED DESCRIPTION

[0020] To make the purpose, technical solution and advantages of the present invention clearer, the technical solution of the present invention will be described in detail below. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other implementation methods obtained by ordinary technicians in this field without creative work belong to the scope of protection of the present invention.

[0021] The terms "first", "second", etc. in the specification and claims of the present application are used to distinguish similar objects, and are not used to describe a specific order or sequence. It should be understood that the data used in this way can be interchangeable under appropriate circumstances, so that the embodiments of the present application can be implemented in an order other than those illustrated or described here, and the objects distinguished by "first", "second", etc. are generally of one type, and the number of objects is not limited. For example, the first object can be one or more. In addition, "and / or" in the specification and claims represents at least one of the connected objects, and the character " / " generally indicates that the objects associated with each other are in an "or" relationship.

[0022] The inventive concept of the present application is described here: Under the influence of low temperature climates such as polar regions and cold regions, the hulls, superstructures and various equipment of sailing ships and marine engineering equipment will be covered with a large amount of ice and snow, causing changes in the draft and center of gravity of the ships, thereby reducing the stability of the ships and the reliability of the superstructure structures; the large amount of ice accumulated on the equipment will also affect the operation of the equipment and bring serious safety risks.

[0023] In the prior art, there are devices that can perform surface deicing. These devices all have a common pain point, that is, the deicing efficiency is not high. For example, the surface deicing structure disclosed in CN117395819A uses steam pressure to impact the ice layer, thereby reducing the adhesion at the bottom of the ice layer and promoting the cracking and peeling of the ice layer. However, this solution has the problem that the inner and outer electrodes are arranged in layers, and liquid water is difficult to penetrate and freeze in the conductive hole between the upper and lower electrodes, resulting in the defect of low deicing efficiency.

[0024] Based on this, the inventors provide a surface deicing structure, a surface deicing device and a surface deicing method, wherein the surface deicing structure utilizes the brine in the groove and the interdigitated electrodes to form a discharge electrode. When adjacent discharge electrodes are connected by brine to form a loop, this part of the brine will be used as a resistor for heating, thereby achieving surface deicing.

[0025] The following is combined with Figure 1-Figure 9 , the surface deicing structure 10, the surface deicing device 1 and the surface deicing method provided in the present application are described in detail through specific embodiments and their application scenarios.

[0026] Please also see Figure 1-Figure 6 The surface deicing structure 10 provided in the embodiment of the present application may include: a substrate 110 and interdigital electrodes 120 .

[0027] The substrate 110 can be made of insulating material, such as EVA (ethylene-vinyl acetate copolymer) or POE film (Polyolefin Elastomer), PET film (Polyethylene terephthalate), to ensure that the subsequent electric heating structure and the surface to be protected have good insulation performance and weather resistance. The substrate 110 can be attached to the surface of the object 2 to be protected to avoid or reduce the possibility of ice on the surface of the object 2 to be protected.

[0028] See also Figure 1 and Figure 2 The surface of the substrate 110 may have a hydrophobic region 111 and a hydrophilic region 112 , and the hydrophilic region 112 may be disposed on both sides of the hydrophobic region 111 . In a specific embodiment, the hydrophilic region 112 and the hydrophobic region 111 may be disposed at intervals.

[0029] The embodiments of the present application do not limit the specific formation methods of the hydrophobic region 111 and the hydrophilic region 112. For example, in one embodiment, the surface of the substrate 110 may be provided with a groove 113, and the groove 113 may form the hydrophilic region 112. When water accumulates on the surface of the substrate 110, the accumulated water will preferentially enter the groove 113. Furthermore, in one embodiment, the extension direction of the hydrophilic region 112 may be consistent with the flow direction of the accumulated water, specifically, the extension direction of the groove 113 may be consistent with the flow direction of the accumulated water, which can facilitate the liquid film formed by the accumulated water on the surface of the substrate 110 to be sheared downward by the airflow, thereby avoiding the accumulation of excessive water on the surface of the substrate, which also prevents the formation of an ice layer 40 on the surface of the substrate 110.

[0030] See also Figure 3 and Figure 4, the hydrophobic region 111 may be a hydrophobic film layer 140 disposed on the surface of the substrate 110, that is, in one embodiment, the surface deicing structure 10 may also include a hydrophobic film layer 140, and the hydrophobic film layer 140 may be disposed on the surface of the substrate 110 to form the hydrophobic region 111. The embodiment of the present application does not limit the specific form and structure of the hydrophobic film layer 140. For example, in one embodiment, the hydrophobic film layer 140 may be made of materials such as PFA (polytetrafluoroethylene modified material), PTFE (polytetrafluoroethylene), fluorinated polyethylene, fluorocarbon wax or other synthetic fluorine-containing polymers. The hydrophobic film layer 140 made of these materials may be disposed on the surface of the substrate 110 as an external insulating layer, weather-resistant layer and protective layer of the substrate 110, and at the same time needs to have strong long-term hydrophobic properties. In addition, in this embodiment, the thickness of the hydrophobic film layer 140 is less than or equal to 100 μm, so that the specific surface can have a hydrophobic area 111 while reducing the thickness of the hydrophobic area 111, thereby reducing the weight of the entire surface deicing structure 10, so as to facilitate the carrying and installation of the surface deicing structure 10.

[0031] As mentioned above, the grooves 113 arranged at intervals on the hydrophobic region 111 of the substrate 110 can utilize the surface tension gradient force between the hydrophobic region 111 and the grooves 113 to cause the supercooled droplets in the freezing process to spontaneously gather toward the grooves 113, and form a liquid film layer inside the grooves 113 that is thicker and flows slower than that on the hydrophobic region 111 or a conventional flat surface.

[0032] The embodiment of the present application does not limit the specific depth of the groove 113. For example, in this embodiment, according to engineering experience, the thickness of the liquid film when the aircraft encounters supercooled water freezing is about 10μm. According to the thickness of the hydrophobic film layer 140 material, the depth of the groove 113 can be less than or equal to the thickness of the hydrophobic film layer 140. Specifically, it can be designed comprehensively according to factors such as the surface tension of the hydrophilic area 112 and the hydrophobic area 111, the gradient force, the thickness of the liquid film in the anti-icing environment, and the freezing time of the liquid film to ensure that 70% of the accumulated water between adjacent grooves 113 enters the interior of the groove 113, so as to ensure that the salt water 30 can smoothly enter the hydrophilic area 112, and at the same time ensure that the thickness of the water film in the groove 113 is in the order of 100um, thereby facilitating continuous conduction and heat storage. For a typical aircraft encountering supercooled water freezing, the depth of the groove 113 is about 30μm, the width of the groove 113 should be 500 microns, and the spacing is 1500μm.

[0033] See also Figure 5 and Figure 6The interdigital electrodes 120 can be arranged on the substrate 110. Specifically, the interdigital electrodes 120 can be arranged in the substrate 110 and below the hydrophobic region 111. When the hydrophobic film layer 140 is used as the hydrophobic region 111, the interdigital electrodes 120 can be located between the substrate 110 and the hydrophobic film layer 140. The interdigital electrodes 120 are manufactured by referring to the manufacturing process of the mature flexible PCB (printed circuit board), or the flexible circuit board (Flexible Printed Circuit Board, referred to as "soft board", commonly known as FPC in the industry) to manufacture the electric heating circuit layer, so that the interdigital electrodes 120 can be adapted to substrates 110 of different shapes, which is conducive to improving the applicability of the entire surface deicing structure 10.

[0034] In this embodiment, the interdigital electrode 120 can be used to communicate with two adjacent grooves 113, and together with the salt water 30 in the groove 113, form a discharge electrode. The interdigital electrode 120 and the salt water 30 in one of the guide grooves also form a positive electrode, and the interdigital electrode 120 and the salt water 30 in the other groove 113 form a negative electrode. When the hydrophobic area 111 and the groove 113 are connected by the salt water 30 to form a loop, the salt water 30 in the hydrophobic area 111 is heated as a resistor, and the surface of the hydrophobic area 111 can be de-iced. It should be noted that the embodiment of the present application does not limit the specific form of the aforementioned salt water 30, for example, it can be solid or liquid.

[0035] For further information, please refer again to Figure 1 and Figure 2 In one embodiment, the surface deicing structure 10 may further include: a porous electrode material 130. The porous electrode material 130 may be disposed in the hydrophilic region 112, specifically in the guide groove. The porous electrode material 130 may be in contact with the interdigital electrode 120. The porous electrode material 130 may be used as a conductive material between the interdigital electrode 120 and the external salt water 30. The embodiment of the present application does not limit the specific material and form of the porous electrode. In this embodiment, the porous conductive electrode should have good electrical conductivity, and should have corrosion resistance, impact resistance, etc., and at the same time have a porous structure inside, so that the porous electrode material 130 can adsorb a large amount of salt ions. For example, in some embodiments, an ORR (oxygen reduction reaction) electrode material made of MOFs (metal organic framework compound) material, a glassy carbon electrode, etc. may be used as the porous electrode material 130.

[0036] Specifically, in this embodiment, the bottom of the porous electrode material 130 can be in contact with the interdigitated electrode 120, and the top can be flush with the depth direction of the groove 113. A plurality of porous electrode materials 130 can be provided and can be evenly distributed in the groove 113. Adjacent porous electrode materials 130 can be arranged at intervals, and the space between adjacent porous electrode materials 130 can be filled with insulating and hydrophilic materials, such as polyvinyl alcohol (PVA), polyacrylic acid (PAA), polyacrylamide (PAM), etc.

[0037] In a specific embodiment, the width of the groove 113 is less than or equal to 1 mm. Considering the processing technology, the width of the groove 113 is set to be less than or equal to 1 mm, which can ensure that the aerodynamic surface is limitedly rough, thereby reducing the influence of the airflow on the deicing effect of the surface deicing structure 10.

[0038] In addition, in this embodiment, the spacing between adjacent grooves 113 is less than or equal to 6 times the width of the grooves 113. If the spacing between the grooves 113 is too large, the adjacent grooves 113 will not be easily connected, which will result in low deicing efficiency and easy to have residual ice on the surface. If the spacing between the grooves 113 is too small, the spatial groove density on the surface of the substrate 110 will be too large, which is not conducive to the processing of the substrate 110, and the conduction frequency between adjacent grooves 113 is too high, which will cause the entire surface deicing structure 10 to heat up similarly to the surface of the entire substrate 110, which will lead to excessive energy consumption of the entire surface deicing structure 10.

[0039] Further, the spacing between adjacent porous electrode materials 130 may be 10 to 50 times the width of the groove 113. It is understandable that the spacing between the porous electrode materials 130 is similar to the distance between each electric heating wire in the series circuit. Since the width of the groove 113 is limited, setting the spacing between adjacent porous electrode materials 130 to 10 to 50 times the width of the groove 113 can make the spacing between adjacent porous electrode materials 130 also in the order of mm, which is the effective range of the thermal effect / vaporization damage effect generated by the local discharge of the discharge electrode.

[0040] In another embodiment, the surface deicing structure 10 may further include: a zero pole, which may be electrically connected to the interdigitated electrode 120, and the zero pole may be used to form a loop with the porous electrode material 130 and the interdigitated electrode 120, in which case the porous electrode material 130 may be added as a resistor.

[0041] It should be noted that the circuit formed by the zero pole, the interdigital electrodes 120 and the porous electrode material 130 and the circuit formed by the discharge electrode and the salt water 30 connecting the hydrophobic area 111 and the groove 113 are two independent and mutually exclusive circuits. For the convenience of explanation, the first circuit mentioned above is referred to as the first circuit, and the second circuit mentioned above is referred to as the second circuit. That is to say, in this embodiment, when the first circuit is turned on, the second circuit cannot be turned on, and when the second circuit is turned on, the first circuit cannot be turned on.

[0042] Please also see Figure 1 , Figure 2 and Figure 7 The working principle of the surface deicing structure 10 provided in the embodiment of the present application is as follows: When it is necessary to protect the object attached to the surface deicing structure 10 from icing, the first circuit can be turned on and the second circuit can be blocked. At this time, the porous electrode material 130 can generate heat to protect the surface of the substrate 110 from icing.

[0043] When it is necessary to de-ice the object attached to the surface de-icing structure 10 , the second circuit can be opened and the first circuit can be blocked. At this time, the brine 30 connecting the hydrophobic area 111 with the groove 113 can be heated to de-ice the surface of the substrate 110 .

[0044] Among them, when the de-icing power requirement is low, a medium or low power supply voltage is used for the interdigital electrode 120, and the power supply basis of the groove 113 being filled with salt water 30 or salt ice and fully conductive is utilized to heat the thin salt water 30 liquid film on the hydrophobic area 111 between adjacent grooves 113 to achieve the de-icing effect.

[0045] When the de-icing power requirement is high and the liquid film freezes quickly, a medium to high power supply voltage is used for the interdigitated electrodes 120 , and the salt water 30 liquid film or salt ice on the hydrophobic area 111 between adjacent grooves 113 is heated by utilizing the power supply basis that is fully conductive and filled with salt water 30 or salt ice inside each groove 113 .

[0046] When both a salt water 30 liquid film and salt water ice exist on the hydrophobic region 111 between adjacent grooves 113, the electric current will preferentially heat the low-resistance salt water 30 film portion to vaporize it quickly to achieve a de-icing effect; and when only salt water ice exists on the hydrophobic region 111 between adjacent grooves 113, due to the skin effect of the electric current, salt water 30 will first be generated on the bottom interface where the ice layer 40 is the thickest, and then vaporization and ice breaking will first occur at this location.

[0047] The surface deicing structure 10 provided in the embodiment of the present application is provided with a groove 113 for draining from the hydrophobic area 111 as the hydrophilic area 112 on the substrate 110, and a forked electrode 120 is provided. The forked electrode 120 and the salt water 30 in the guide groove are used to form a discharge electrode. When the hydrophobic area 111 is connected by the salt water 30 between two adjacent discharge electrodes to form a loop, the salt water 30 located in the hydrophobic area 111 will be heated as a resistor, thereby achieving the surface deicing effect of the hydrophobic area 111. The surface deicing device 1 provided in the embodiment of the present application has high and stable deicing efficiency. It only needs to form a loop and perform deicing operation when the salt water 30 connects the groove 113 and the hydrophobic area 111. The depth of the groove 113 is small. Therefore, even if there is only a small amount of salt water 30 on the surface of the surface deicing structure 10, the deicing operation can be performed, thereby preventing the accumulation of the ice layer 40. This solves the defect or problem of low deicing efficiency caused by the difficulty of liquid water in penetrating and freezing in the conductive hole between the upper and lower electrodes in the prior art. In addition, the surface deicing structure 10 provided in the embodiment of the present application has the advantages of simple structure and high utilization rate of anti-icing energy control, which can achieve the purpose of reducing the adhesion of the bottom of the ice layer 40 and promoting the cracking and peeling of the ice layer 40.

[0048] See also Figure 8 The embodiment of the present application further provides a surface deicing device 1, which may include a power supply 50 and the surface deicing structure 10 as described above, wherein the power supply 50 may be electrically connected to the interdigital electrodes 120 and used to supply power to the interdigital electrodes 120. The present application does not limit the specific form and parameters of the power supply 50, for example, in one embodiment, the power supply may be set to a low voltage (<100V), high current (within 10A), low frequency pulse (<100Hz) power supply.

[0049] In one embodiment, the surface deicing device 1 may also include a temperature sensor 20, which may be electrically connected to the power supply 50, and the temperature sensor 20 may be configured to: when the temperature of the loop formed by the connection of the brine 30 between the hydrophobic area 111 and the groove 113 rises to a specified temperature, the power supply 50 is controlled to be turned off. This can further play a role in energy saving. It should be noted that the embodiment of the present application does not limit the specific structure and form of the temperature sensor 20. Considering the compactness of the circuit structure, a bimetallic strip, a polymer PTC thermistor and other snap-type thermostats are preferred, so that the temperature of a single circuit is automatically disconnected within 40~150°C; or similar to the idea of ​​electric vehicle power management, an SMD (Surface Mounted Devices, referring to surface mount devices) flat chip temperature sensor is selected to detect the temperature of the interdigital electrode 120 circuit in each groove 113, and the digital circuit is combined to perform on-off control of the circuit.

[0050] See also Fig. 9The present application also provides a surface deicing method, which can be applied to aircraft, ships, and coastal buildings. The method may include steps S100-S200: Step S100: The above-mentioned surface deicing structure is arranged on a portion of the target object where deicing is required.

[0051] The embodiments of the present application do not limit the specific form of the above-mentioned settings, for example, it can be bonded or clamped, etc., and can be specifically set according to actual conditions. Since the thickness of the surface deicing structure provided in the embodiments of the present application is relatively thin, it will not cause excessive burden on the target object.

[0052] Step S200: When an ice layer is formed on the surface of the surface deicing structure and deicing is required, a voltage or pulse is applied to the interdigital electrodes.

[0053] In this embodiment, according to different scenarios, different modes such as the deicing mode or the anti-icing mode mentioned above can be used to apply different voltages or pulses to the interdigital electrodes to achieve the deicing or anti-icing effect.

[0054] It should be noted that, in this article, the terms "include", "comprises" or any other variations thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, an element defined by the sentence "comprises a ..." does not exclude the existence of other identical elements in the process, method, article or device including the element.

[0055] In addition, it should be noted that the scope of the methods and devices in the embodiments of the present application is not limited to performing functions in the order shown or discussed, and may also include performing functions in a substantially simultaneous manner or in a reverse order according to the functions involved. For example, the described methods may be performed in an order different from that described, and various steps may be added, omitted, or combined. In addition, features described with reference to certain examples may be combined in other examples.

[0056] The above description is only a specific implementation mode of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can easily think of changes or substitutions within the technical scope disclosed by the present invention, which should be covered by the protection scope of the present invention.

Claims

1. A surface deicing structure, characterized in that: include: A substrate, wherein the surface of the substrate has a hydrophobic region and a hydrophilic region, and the hydrophilic region is arranged on both sides of the hydrophobic region; wherein the surface of the substrate is provided with a groove, and the groove forms the hydrophilic region; and, An interdigital electrode, the interdigital electrode being disposed on the substrate, the interdigital electrode being used to be connected to two adjacent channels and to form a discharge electrode together with the salt water in the channels; When the hydrophobic area and the channel are connected by salt water to form a loop, the salt water in the hydrophobic area is heated as a resistor.

2. The surface deicing structure according to claim 1, characterized in that: The surface deicing structure further includes a porous electrode material, which is disposed in the hydrophilic region and in contact with the interdigital electrodes.

3. The surface deicing structure according to claim 2, characterized in that: The spacing between adjacent porous electrode materials is 10 to 50 times the width of the channel; And / or, the depth of the groove is less than or equal to the thickness of the hydrophobic film layer; and / or, the width of the groove is less than or equal to 1 mm; And / or, the spacing between adjacent grooves is less than or equal to 6 times the width of the groove.

4. The surface deicing structure according to claim 2, characterized in that: The surface deicing structure also includes: a zero pole, which is electrically connected to the interdigital electrodes. The zero pole is used to form a loop with the porous electrode material and the interdigital electrodes. At this time, the porous electrode material is used as a resistor for heating.

5. The surface deicing structure according to claim 1, characterized in that: The surface deicing structure further includes: a hydrophobic film layer, and the hydrophobic film layer is arranged on the surface of the substrate to form the hydrophobic area.

6. The surface deicing structure according to claim 5, characterized in that: The thickness of the hydrophobic film layer is less than or equal to 100 μm.

7. The surface deicing structure according to any one of claims 1 to 6, characterized in that: The extending direction of the hydrophilic region is consistent with the flow direction of the salt water.

8. A surface deicing device, characterized in that: The invention comprises a power source and the surface deicing structure according to any one of claims 1 to 7, wherein the power source is electrically connected to the interdigital electrodes.

9. The surface deicing device according to claim 8, characterized in that: The surface deicing device also includes a temperature sensor, which is electrically connected to the power supply. The temperature sensor is configured to control the power supply to be turned off when the temperature of the loop formed by the connection of the hydrophobic area and the channel with brine rises to a specified temperature.

10. A method for deicing a surface, characterized in that: The following steps are involved: A surface deicing structure as claimed in any one of claims 1 to 7 is arranged at a location of the target object where deicing is required; When an ice layer is formed on the surface of the surface deicing structure and deicing is required, a voltage or a pulse is applied to the interdigital electrodes.

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