A battery management system, a battery and a vehicle

Abstract

The application relates to the field of battery management system heat dissipation technology, in particular to a battery management system, a battery and an automobile, wherein the battery management system comprises a circuit board, a heat dissipation assembly and a shell, the shell has a containing cavity, the circuit board is located in the containing cavity, the heat dissipation assembly is attached to the inner wall surface of the containing cavity, and the heat dissipation assembly surrounds from one surface of the circuit board to the opposite surface of the one surface of the circuit board. The application can improve the heat dissipation efficiency.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of battery management system heat dissipation, in particular to a battery management system, a battery and an automobile. BACKGROUND

[0002] A battery is an energy assembly for powering electrical components such as motors of an automobile, which can provide power for these electrical components through a plurality of battery cells.

[0003] The battery generally includes a battery management system and battery cells, each of which stores a certain amount of electricity in the form of chemical energy, and the battery management system is used to regulate the voltage of each battery cell so that the voltage difference between each battery cell is kept within a stable range.

[0004] In related technologies, the equalization resistor of the battery management system generally reduces the voltage difference by discharging the battery cells, and thus is prone to overheating. SUMMARY

[0005] In view of this, the present application provides a battery management system, a battery and an automobile to improve the efficiency of heat dissipation.

[0006] Specifically, the technical solutions include the following:

[0007] The first aspect of the present application provides a battery management system, which includes a circuit board, a heat dissipation assembly and a housing, wherein,

[0008] The housing has a receiving cavity;

[0009] The circuit board is located in the receiving cavity;

[0010] The heat dissipation assembly is attached to the inner wall surface of the receiving cavity, and the heat dissipation assembly surrounds from one side of the circuit board to the opposite side of the one side of the circuit board.

[0011] Optionally, the heat dissipation assembly includes a first heat dissipation part and a second heat dissipation part, the first heat dissipation part has a first cooling channel, the second heat dissipation part has a second cooling channel, and the two ends of the first cooling channel and the two ends of the second cooling channel are in one-to-one correspondence and in communication.

[0012] Optionally, the circuit board has an equalization resistor, the equalization resistor is arranged on both sides of the circuit board, wherein the first cooling channel has a first expansion section, the equalization resistor is located in the orthographic projection of the first expansion section on the circuit board, and / or the second cooling channel has a second expansion section, and the equalization resistor is located in the orthographic projection of the second expansion section on the circuit board.

[0013] Optionally, the battery management system further includes a first thermally conductive part located between the circuit board and the first expansion section, and / or the battery management system further includes a second thermally conductive part located between the circuit board and the second expansion section.

[0014] Optionally, the heat dissipation assembly includes a conductive portion, through which the end of the first cooling channel and the end of the second cooling channel are connected.

[0015] Optionally, the circuit board has a positioning hole that extends from one side of the circuit board to the opposite side, and the conductive portion passes through the positioning hole.

[0016] Optionally, the outer shell includes an upper shell and a lower shell, the edges of the upper shell and the lower shell being connected to form the receiving cavity.

[0017] Optionally, the upper housing has a first flange and the lower housing has a second flange, with the first flange and the second flange being fitted together.

[0018] A second aspect of this application provides a battery, the battery including the battery management system described in the above technical solutions.

[0019] A third aspect of this application provides an automobile that includes a battery as described in the above technical solutions.

[0020] The beneficial effects of the technical solution provided in this application include at least the following: capacitors can be arranged on one side of the circuit board, thereby reducing the voltage difference between the cells by consuming the power of the battery cells. The heat dissipation assembly can guide the heat generated on one side of the circuit board due to power consumption to the opposite side, thus improving the heat dissipation efficiency. The heat dissipation assembly is attached to the inner wall of the receiving cavity, and can guide the heat received from the circuit board to the outside through the outer shell, thus further improving the heat dissipation efficiency. Attached Figure Description

[0021] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0022] Figure 1 This is an exploded view of the structure of a battery management system provided in an embodiment of this application;

[0023] Figure 2 This is a full cross-sectional schematic diagram of a battery management system provided in an embodiment of this application.

[0024] The reference signs in the drawings designate:

[0025] 1, circuit board; 11, equalizing resistor; 100, positioning hole;

[0026] 2, heat dissipation assembly; 21, first heat dissipation part; 210, first cooling channel; 2101, first expansion section; 2102, first connecting section; 22, second heat dissipation part; 220, second cooling channel; 2201, second expansion section; 2202, second connecting section;

[0027] 3, shell; 300, accommodating cavity; 31, upper shell body; 311, first flange; 312, first clamping part; 32, lower shell body; 321, second flange; 322, second clamping part;

[0028] 4, first heat conduction part;

[0029] 5, second heat conduction part;

[0030] 61, first cylinder; 62, second cylinder;

[0031] 7, sealing plug.

[0032] The specific embodiments of the present application have been shown in the above drawings, and will be described in more detail hereinafter. These drawings and the written description are not intended to restrict the scope of the present application concept in any way, but to illustrate the present application concept to those skilled in the art by referring to specific embodiments. DETAILED DESCRIPTION

[0033] The technical solutions in the embodiments of the present application will be described clearly and completely below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only some of the embodiments of the present application, rather than all the embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of the present application.

[0034] The positional nouns such as “upper”, “lower”, “lateral” and the like involved in the embodiments of the present application are generally based on the relative relationship of the positions shown in the drawings, and these positional nouns are used only to more clearly describe the structure and the relationship between the structures, and are not intended to describe absolute positions. When the product is placed in different attitudes, the positions may change, for example, “upper” and “lower” may be interchanged. Figure 1

[0035] Unless otherwise defined, all the technical terms used in the embodiments of the present application have the same meanings as commonly understood by those skilled in the art.

[0036] ​In order to make the technical solutions and advantages of the present application clearer, the embodiments of the present application will be further described in detail below with reference to the drawings.

[0037] At present, the BMS (Battery Manager System) balancing methods of new energy vehicles mainly include active balancing and passive balancing. Considering the cost disadvantage, most host manufacturers do not adopt the active balancing scheme. At present, the BMS balancing method of new energy vehicles mainly adopts passive balancing. The passive balancing mainly discharges the battery cells through the balancing resistors on the BMS circuit board to reduce the voltage difference between the battery cells and maintain the safety and stability of the battery pack.

[0038] Due to the consistency difference between the battery cells in the battery pack, the BMS can discharge through the balancing resistors on the balancing circuit as a load while collecting the single cell voltage, so as to reduce the voltage difference. The balancing is affected by the heat generated by the balancing resistors, so that the balancing current is small and the balancing efficiency is low. The passive balancing method is relatively simple in hardware circuit design. The balancing resistors are mainly connected in series on each single cell voltage collection circuit. However, the number of resistors is large. Considering the small size of the BMS hardware circuit board design, it is difficult to select a large package power resistor, which limits the balancing current. In order to achieve good balancing effect, the energy transferred to the resistor needs to be released in time to avoid the accumulation of energy and the burning of the resistor and even the entire circuit.

[0039] The first aspect of the present application provides a battery management system, as shown in Figure 1 and Figure 2 The battery management system includes a circuit board 1, a heat dissipation component 2 and a shell 3, wherein,

[0040] The shell 3 has a receiving cavity 300;

[0041] The circuit board 1 is located in the receiving cavity 300;

[0042] The heat dissipation component 2 is attached to the inner wall surface of the receiving cavity 300, and the heat dissipation component 2 surrounds from one side of the circuit board 1 to the opposite side of the one side of the circuit board 1.

[0043] It can be understood that one side of the circuit board 1 can be arranged with a capacitor device to consume the electric quantity of the battery cells and reduce the voltage difference between the battery cells. The heat dissipation component 2 can guide the heat generated by one side of the circuit board 1 due to the consumption of the electric quantity to the opposite side, so as to improve the efficiency of heat dissipation. The heat dissipation component 2 is attached to the inner wall surface of the receiving cavity 300, which can guide the heat received from the circuit board 1 to the outside through the shell 3, so as to further improve the efficiency of heat dissipation.

[0044] In the embodiments of the present application, the circuit board 1 is located in the accommodating cavity 300, and can be directly connected with the inner wall of the accommodating cavity 300 to realize the fixation of the position, or can be supported by the heat dissipation assembly 2 to realize the fixation of the position.

[0045] In the embodiments of the present application, the heat dissipation assembly 2 can receive the heat from the circuit board 1 by liquid cooling or air cooling, and transmit the heat to the other side of the circuit board 1 and the side wall of the accommodating cavity 300 to dissipate to the outside, so as to realize the cooling effect on the circuit board 1.

[0046] In the embodiments of the present application, the shell 3 can be made of metal with strong heat conduction capacity, such as copper, aluminum or alloy of the two.

[0047] In the embodiments of the present application, the heat dissipation assembly 2 can be completely located in the accommodating cavity 300, and realize the conduction of the heat of the circuit board 1 through the inner wall of the accommodating cavity 300.

[0048] In some embodiments of the present application, as shown in Figure 1 and Figure 2 , the heat dissipation assembly 2 includes a first heat dissipation part 21 and a second heat dissipation part 22, the first heat dissipation part 21 has a first cooling channel 210, the second heat dissipation part 22 has a second cooling channel 220, and the two ends of the first cooling channel 210 and the two ends of the second cooling channel 220 correspondingly communicate.

[0049] It can be understood that the first cooling channel 210 and the second cooling channel 220 can accommodate cooling liquid, and the cooling liquid can dissipate the heat of the circuit board 1 to realize the cooling effect. Among them, the first cooling channel 210 can be close to the heat resistance device of the circuit board 1, so that the heat enters the cooling liquid, and then enters the second cooling channel 220 and the shell 3 with the cooling liquid, and the second cooling channel 220 and the shell 3 dissipate the heat to the outside after receiving the heat, so as to realize the cooling effect.

[0050] In the embodiments of the present application, the outer wall of the first cooling channel 210 can be attached to the inner wall of the accommodating cavity 300, so as to improve the efficiency of heat dissipation.

[0051] In the embodiments of the present application, the outer wall of the second cooling channel 220 can be attached to the inner wall of the accommodating cavity 300, so as to improve the efficiency of heat dissipation.

[0052] In the embodiments of the present application, the two ends of the first cooling channel 210 and the two ends of the second cooling channel 220 correspondingly communicate, which can mean that the two ends of the first cooling channel 210 and the second cooling channel 220 located on the same side of the accommodating cavity 300 communicate, or can mean that the two ends of the first cooling channel 210 and the second cooling channel 220 located on different sides of the accommodating cavity 300 communicate.

[0053] In some embodiments of the present application, as shown in Figure 1 The circuit board 1 has the equalization resistor 11 arranged on both sides of the circuit board 1, wherein the first cooling channel 210 has the first expansion section 2101, and the equalization resistor 11 is located within the orthographic projection of the first expansion section 2101 on the circuit board 1.

[0054] It can be understood that the equalization resistor 11 can convert the electric energy of the battery cell into heat energy, so as to reduce the pressure difference between the battery cells. The equalization resistor 11 is located within the orthographic projection of the first expansion section 2101 on the circuit board 1, which is beneficial to the first expansion section 2101 receiving heat from the equalization resistor 11 and dissipating the heat to the inner wall of the second cooling channel 220 and the containing cavity 300 by the cooling liquid, so as to reduce the situation that the circuit board 1 generates excessive heat accumulation during operation.

[0055] In the embodiments of the present application, the first cooling channel 210 includes the first connecting section 2102, and the two ends of the first expansion section 2101 are respectively communicated with one first connecting section 2102. Each first connecting section 2102 is communicated with the second cooling channel 220, wherein the bottom surface of the first expansion section 2101 is flush with or higher than the bottom surface of the first connecting section 2102, so as to avoid the situation that the cooling liquid stays in the first expansion section 2101 for a long time, resulting in the decrease of the heat dissipation efficiency.

[0056] In the embodiments of the present application, the height of the first expansion section 2101 is higher than the height of the first connecting section 2102, so as to improve the heat dissipation effect of the first expansion section 2101 on the equalization resistor 11.

[0057] In some embodiments of the present application, as shown in Figure 1 and Figure 2 The circuit board 1 has the equalization resistor 11 arranged on both sides of the circuit board 1, wherein the second cooling channel 220 has the second expansion section 2201, and the equalization resistor 11 is located within the orthographic projection of the second expansion section 2201 on the circuit board 1.

[0058] It can be understood that the equalization resistor 11 can convert the electric energy of the battery cell into heat energy, so as to reduce the pressure difference between the battery cells. The equalization resistor 11 is located within the orthographic projection of the second expansion section 2201 on the circuit board 1, which is beneficial to the second expansion section 2201 receiving heat from the equalization resistor 11 and dissipating the heat to the inner wall of the second cooling channel 220 and the containing cavity 300 by the cooling liquid, so as to reduce the situation that the circuit board 1 generates excessive heat accumulation during operation.

[0059] In the embodiments of the present application, the second cooling channel 220 comprises a second connecting section 2202, and the two ends of the second expansion section 2201 are respectively communicated with a second connecting section 2202. Each second connecting section 2202 is communicated with the first cooling channel 210. The bottom surface of the second expansion section 2201 is flush with or higher than the bottom surface of the second connecting section 2202, which is beneficial to avoid the long residence of the cooling liquid in the second expansion section 2201 and reduce the heat dissipation efficiency.

[0060] In some embodiments of the present application, as shown in Figure 1 and Figure 2 , the circuit board 1 is provided with the balancing resistor 11 on the opposite surfaces of the circuit board 1. The first cooling channel 210 has the first expansion section 2101, and the balancing resistor 11 is located in the orthographic projection of the first expansion section 2101 on the circuit board 1. The second cooling channel 220 has the second expansion section 2201, and the balancing resistor 11 is located in the orthographic projection of the second expansion section 2201 on the circuit board 1. The first expansion section 2101 is in contact with the surface of the circuit board 1 on which one balancing resistor 11 is located, and the second expansion section 2201 is in contact with the surface of the circuit board 1 on which another balancing resistor 11 is located.

[0061] In the embodiments of the present application, since the number of the balancing resistors 11 generally corresponds to the number of the battery cells, and all the balancing resistors 11 do not work at the same time, the first expansion section 2101 is in contact with the surface of the circuit board 1 on which one balancing resistor 11 is located, and the second expansion section 2201 is in contact with the surface of the circuit board 1 on which another balancing resistor 11 is located, which can make full use of all the cooling liquid in the heat dissipation assembly 2 to improve the heat dissipation efficiency of the working balancing resistor 11.

[0062] In the embodiments of the present application, the first expansion section 2101 can be in contact with the balancing resistor 11 through an intermediate medium to reduce the short circuit of the circuit board 1 caused by the leakage of the cooling liquid.

[0063] In some embodiments of the present application, as shown in Figure 1 , the battery management system further comprises a first heat conduction part 4, and the first heat conduction part 4 is located between the circuit board 1 and the first expansion section 2101.

[0064] It can be understood that the first heat conduction part 4 is beneficial to improve the heat conduction speed of the balancing resistor 11 to the first expansion section 2101, which is beneficial to improve the conduction efficiency of the cooling liquid in the first cooling channel 210.

[0065] In the embodiment of the present application, the first heat-conducting part 4 can be a silica gel pad, so as to improve the heat conduction efficiency of the equalizing resistor 11 to the first expansion section 2101. In addition, if the equalizing resistor 11 is accompanied by voltage during operation, the silica gel pad can insulate the equalizing resistor 11, thereby reducing the electrification of the heat dissipation assembly 2 and the shell 3.

[0066] In the embodiment of the present application, the first heat-conducting part 4 can be a heat-conducting silica gel pad, which can insulate electrical components, conduct heat, fill the gap between the surface of the insulating resistor and the surface of the heat dissipation component, enhance buffering, and transfer heat.

[0067] In the embodiment of the present application, the first expansion section 2101 has a gap of 2 mm with the surface of the equalizing resistor 11 of the circuit board 1, and the gap is filled by the first heat-conducting part 4, thereby realizing the heat conduction function.

[0068] In the embodiment of the present application, the orthographic projection of the first expansion section 2101 on the circuit board 1 is located in the orthographic projection of the first heat-conducting part 4 on the circuit board 1, which is beneficial to improve the efficiency of the first heat-conducting part 4 in completely conducting heat to the first expansion section 2101.

[0069] In some embodiments of the present application, as shown in Figure 1 The battery management system further includes a second heat-conducting part 5, which is located between the circuit board 1 and the second expansion section 2201.

[0070] It can be understood that the second heat-conducting part 5 is beneficial to improve the heat conduction speed of the equalizing resistor 11 to the second expansion section 2201, which is beneficial to improve the conduction efficiency of the cooling liquid in the second cooling channel 220.

[0071] In the embodiment of the present application, the second heat-conducting part 5 can be a silica gel pad, so as to improve the heat conduction efficiency of the equalizing resistor 11 to the second expansion section 2201. In addition, if the equalizing resistor 11 is accompanied by voltage during operation, the silica gel pad can insulate the equalizing resistor 11, thereby reducing the electrification of the heat dissipation assembly 2 and the shell 3.

[0072] In the embodiment of the present application, the first heat-conducting part 4 can be a heat-conducting silica gel pad, which can insulate electrical components, conduct heat, fill the gap between the surface of the insulating resistor and the surface of the heat dissipation component, enhance buffering, and transfer heat.

[0073] In the embodiment of the present application, the orthographic projection of the first expansion section 2101 on the circuit board 1 is located in the orthographic projection of the first heat-conducting part 4 on the circuit board 1, which is beneficial to improve the efficiency of the first heat-conducting part 4 in completely conducting heat to the first expansion section 2101.

[0074] In the embodiment of the present application, the second expansion section 2201 has a gap of 2mm between the surface where the equalizing resistor 11 of the circuit board 1 is located, and the gap is filled by the second heat-conducting part 5 to achieve the effect of conducting heat.

[0075] In some embodiments of the present application, the battery management system further comprises a first heat-conducting part 4 located between the circuit board 1 and the first expansion section 2101, and further comprises a second heat-conducting part 5 located between the circuit board 1 and the second expansion section 2201.

[0076] It can be understood that such an arrangement is conducive to improving the heat dissipation efficiency of the heat dissipation assembly 2.

[0077] In some embodiments of the present application, as shown in Figure 1 and Figure 2 The heat dissipation assembly 2 comprises a through part, and the end of the first cooling channel 210 and the end of the second cooling channel 220 are communicated through the through part.

[0078] It can be understood that the through part provides conditions for the flow of the cooling liquid between the first cooling channel 210 and the second cooling channel 220, and the cooling liquid in the first cooling channel 210 can transfer heat to the cooling liquid in the second cooling channel 220 when heated, and the cooling liquid in the second cooling channel 220 can also transfer heat to the first cooling channel 210 when heated, which is conducive to the heat dissipation efficiency of the heat dissipation assembly 2.

[0079] In the embodiment of the present application, the number of through parts can be one, and one through part communicates the first cooling channel 210 and the second cooling channel 220 at one end on the same side, or communicates the first cooling channel 210 and the second cooling channel 220 at one end on the opposite side.

[0080] In the embodiment of the present application, the number of through parts can be two, wherein one through part communicates the first cooling channel 210 and the second cooling channel 220 at one end on the same side, and the other through part communicates the first cooling channel 210 and the second cooling channel 220 at the other end on the same side.

[0081] In the embodiment of the present application, the through part can be integrally formed with the first heat dissipation part 21, and is in communication with the second cooling channel 220 of the second heat dissipation part 22 through the plug-in mode.

[0082] In the embodiment of the present application, the through part can be integrally formed with the second heat dissipation part 22, and is in communication with the first cooling channel 210 of the first heat dissipation part 21 through the plug-in mode.

[0083] In the embodiment of the present application, the shell 3 can be provided with a liquid injection hole in communication with the first cooling channel 210, so that the liquid can be replenished in time when the cooling liquid is lost after the assembly is completed.

[0084] In the embodiment of the present application, the through portion can include a first cylinder 61 and a second cylinder 62, the first cylinder 61 extends through the first cooling channel 210 in the vertical direction, and the second cylinder 62 extends from one end of the second cooling channel 220 in the vertical direction, the first cylinder 61 is sleeved on the outside of the second cylinder 62, the second cylinder 62 extends into the liquid injection hole of the shell through the first heat dissipation portion 21, a sealing ring is arranged between the first cylinder 61 and the second cylinder 62 for sealing the gap between the first cylinder 61 and the second cylinder 62, and openings can be arranged on the first cylinder 61 and the second cylinder 62 for the circulation of the cooling liquid between the first cooling channel 210 and the second cooling channel 220. The end of the first cylinder 61 can be provided with a liquid injection port, which can be sealed by a sealing plug 7.

[0085] In the embodiment of the present application, the end of the first cylinder 61 abuts against the surface of the second heat dissipation portion 22, so that the first heat dissipation portion 21 and the second heat dissipation portion 22 can maintain a relatively fixed distance by the interference of the second heat dissipation portion 22 to accommodate the circuit board 1.

[0086] In the embodiment of the present application, the sum of the volume of the cooling liquid in the first cooling channel 210 and the volume of the cooling liquid in the second cooling channel 220 accounts for 90% of the volume of the first cooling channel 210 and the volume of the second cooling channel 220, a first temperature sensor is arranged in the first cooling channel 210, a second temperature sensor is arranged in the second cooling channel 220, and a water pump is arranged in the first cooling channel 210. When there is a large temperature difference between the temperatures sensed by the first temperature sensor and the second temperature sensor, the water pump works to drive the cooling liquid in the first cooling channel 210 to circulate, so that the cooling liquid in the first cooling channel 210 and the cooling liquid in the second cooling channel 220 can circulate, thereby improving the cooling efficiency.

[0087] In the embodiment of the present application, the temperature difference can be 5°C, 6°C or 7°C.

[0088] In some embodiments of the present application, as shown in Figure 1 and Figure 2 The circuit board 1 has a positioning hole 100 extending through from one side to the opposite side, and the through portion is arranged in the positioning hole 100.

[0089] It can be understood that the positioning hole 100 can limit the through portion, and the through portion located in the positioning hole 100 is interfered by the positioning hole 100, and the space for the radial movement of the through portion along the positioning hole 100 is small enough, which is beneficial to the normal work of the heat dissipation assembly 2.

[0090] In the embodiments of the present application, the number of positioning holes 100 and the number of conducting portions can each be one, two, three, or four. When the number of both is two or more, they can be arranged on opposite sides of the circuit board 1 and close to the same side or opposite sides of the circuit board 1.

[0091] In some embodiments of the present application, as shown in Figure 1 and Figure 2 The shell 3 includes an upper shell 31 and a lower shell 32, and the edges of the upper shell 31 and the lower shell 32 are connected to form a containing cavity 300.

[0092] It can be understood that the upper shell 31 and the lower shell 32 are beneficial to the forming of the containing cavity 300, and at the same time, the arrangement of the heat dissipation assembly 2 and the circuit board 1 can be completed by connecting the edges of the two during assembly, which is beneficial to the protection of the two by the shell 3.

[0093] In the embodiments of the present application, the upper shell 31 and the lower shell 32 can be connected by forming recessed cavities, and the recessed cavities of the two are opposite and connected to form the containing cavity 300.

[0094] In the embodiments of the present application, the upper shell 31 and the lower shell 32 can be connected by bolts.

[0095] In some embodiments of the present application, as shown in Figure 1 and Figure 2 The upper shell 31 has a first flange 311, and the lower shell 32 has a second flange 321, and the first flange 311 and the second flange 321 are connected in close contact.

[0096] It can be understood that the first flange 311 and the second flange 321 are beneficial to increasing the contact area between the upper shell 31 and the lower shell 32, so that the connection of the upper shell 31 and the lower shell 32 can be realized, and the sealing performance of the containing cavity 300 can be improved.

[0097] In the embodiments of the present application, the opposite sides of the upper shell 31 are arranged with the first flange 311, and the opposite sides of the upper shell 31 are arranged with the second flange 321, and the connection of the first flange 311 and the second flange 321 can realize the connection of the upper shell 31 and the lower shell 32. The first flange 311 and the second flange 321 can be connected by bolts.

[0098] In the embodiment of the present application, the first shell can be arranged with two first clamping portions 312, both of which are adjacent to the two first flanges 311, the second shell can be arranged with two second clamping portions 322, both of which are adjacent to the two second flanges 321, and the two first clamping portions 312 and the two second clamping portions 322 are clamped one by one, so as to improve the connection performance between the upper shell 31 and the lower shell 32.

[0099] The second aspect of the present application provides a battery, which comprises the battery management system of the above embodiment.

[0100] It can be understood that, due to the adoption of the battery management system of the above embodiment, the battery of the present application has the same technical effects as the above embodiment, which will not be repeated here.

[0101] In the embodiment of the present application, the balancing resistor of the battery management system can be connected to the plurality of battery cells one by one, so as to consume the electricity of the battery cells to reduce the pressure difference between different battery cells.

[0102] The third aspect of the present application provides an automobile, which comprises the battery of the above technical solution.

[0103] It can be understood that, due to the adoption of the battery of the above embodiment, the automobile of the present application has the same technical effects as the above embodiment, which will not be repeated here.

[0104] In the embodiment of the present application, the automobile can be an automobile with an engine as a power source, or an automobile with an electric motor as a power source.

[0105] In the present application, the terms "first" and "second" are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance. The term "plurality" refers to two or more, unless otherwise explicitly limited.

[0106] Other embodiments of the present application will be apparent to those skilled in the art from consideration of the specification and practice of the application disclosed herein. The present application is intended to cover any variations, uses, or adaptations of the application following, in general, the principles of the application and including such variations, uses, or adaptations of the application as come within the true scope of the application. The specification and examples are to be regarded as exemplary only.

[0107] It should be understood that the present application is not limited to the precise construction that has been described above and shown in the accompanying drawings, and that various modifications and changes can be made by those skilled in the art without departing from the scope of the present application. The scope of the present application is limited only by the appended claims.

Claims

1. A battery management system, characterized by, The battery management system comprises a circuit board (1), a heat dissipation assembly (2) and a shell (3), wherein, The shell (3) has a containing cavity (300); The circuit board (1) is located in the containing cavity (300); The heat dissipation assembly (2) is attached to the inner wall surface of the containing cavity (300), and the heat dissipation assembly (2) surrounds from one side of the circuit board (1) to the opposite side of the circuit board (1); The heat dissipation assembly (2) comprises a first heat dissipation part (21) and a second heat dissipation part (22), the first heat dissipation part (21) has a first cooling channel (210), and the second heat dissipation part (22) has a second cooling channel (220); The circuit board (1) has a balancing resistor (11), and the balancing resistor (11) is arranged on both sides of the circuit board (1), wherein, The first cooling channel (210) has a first expansion section (2101) and a first connecting section (2102), the balancing resistor (11) is located in the first expansion section (2101) in the orthographic projection of the circuit board (1), and the two ends of the first expansion section (2101) are respectively communicated with one of the first connecting sections (2102), and the bottom surface of the first expansion section (2101) is higher than the bottom surface of the first connecting section (2102); And / or, The second cooling channel (220) has a second expansion section (2201) and a second connecting section (2202), the balancing resistor (11) is located in the second expansion section (2201) in the orthographic projection of the circuit board (1), and the two ends of the second expansion section (2201) are respectively communicated with one of the second connecting sections (2202), and the bottom surface of the second expansion section (2201) is higher than the bottom surface of the second connecting section (2202).

2. The battery management system of claim 1, wherein, The two ends of the first cooling channel (210) are communicated with the two ends of the second cooling channel (220) one by one.

3. The battery management system of claim 2, wherein, The battery management system further comprises a first heat conduction part (4), and the first heat conduction part (4) is located between the circuit board (1) and the first expansion section (2101), And / or, The battery management system further comprises a second heat conduction part (5), and the second heat conduction part (5) is located between the circuit board (1) and the second expansion section (2201).

4. The battery management system of claim 2, wherein, The heat dissipation assembly (2) comprises a through part, and the end of the first cooling channel (210) and the end of the second cooling channel (220) are communicated through the through part.

5. The battery management system of claim 4, wherein, The circuit board (1) has a positioning hole (100), the positioning hole (100) penetrates from one side of the circuit board (1) to the opposite side, and the through part is arranged in the positioning hole (100).

6. The battery management system of claim 1, wherein, The shell (3) comprises an upper shell (31) and a lower shell (32), and the edge of the upper shell (31) is connected with the edge of the lower shell (32) to form the containing cavity (300).

7. The battery management system of claim 6, wherein, The upper shell (31) has a first flange (311), the lower shell (32) has a second flange (321), and the first flange (311) is connected with the second flange (321).

8. A battery, characterized by The battery comprises a battery management system as claimed in any of claims 1 to 7.

9. An automobile characterized by comprising: The car comprises a battery as claimed in claim 8.

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