Display substrate and display device

Abstract

Display substrate and display device. The application provides a display substrate and a display device. The display substrate comprises a first barrier portion and a second barrier portion. The second barrier portion is located at the periphery of the first barrier portion and a gap is formed between the first barrier portion and the second barrier portion. The second barrier portion and the driving substrate or the pixel definition layer form a gap. The orthographic projection of the second barrier portion on the driving substrate completely covers the orthographic projection of the gap on the driving substrate. Thus, the upper part of the gap is completely covered by the second barrier portion, and the two sides of the gap are completely blocked by the first barrier portion or the second barrier portion. When the evaporation of the light emitting material is carried out, no matter from which angle the light emitting material is sprayed, the light emitting material cannot enter the gap. Thus, when the evaporation of the light emitting material of the light emitting layer is carried out, the gap can isolate the light emitting layer, so that the light emitting layer is disconnected at the position of the gap. Thus, the light emitting layer between the two adjacent pixel openings is discontinuous, and the pixel crosstalk between the two adjacent sub-pixels is completely blocked.

Description

Technical Field

[0001] This application relates to the field of display technology, and more particularly to a display substrate and a display device. Background Technology

[0002] Organic light-emitting diodes (OLEDs) are widely used in mobile phones and wearable products, and excellent display performance is an essential characteristic of OLEDs. However, due to the presence of common layers in OLEDs, leakage current, or crosstalk, inevitably exists between different sub-pixels. Therefore, effectively solving the crosstalk between adjacent sub-pixels is a problem that urgently needs to be addressed. Summary of the Invention

[0003] In view of this, the purpose of this application is to provide a display substrate and a display device.

[0004] To achieve the above objectives, the first aspect of this application provides a display substrate, comprising:

[0005] Drive substrate;

[0006] A pixel defining layer is disposed on the driving substrate, and a plurality of pixel openings are arrayed on the pixel defining layer, and a first electrode layer is disposed in each pixel opening;

[0007] The blocking structure includes a first blocking part and a second blocking part. The first blocking part is located between two adjacent pixel openings. The second blocking part is located on the outer periphery of the first blocking part and forms a gap with the first blocking part. A notch is formed between the second blocking part and the driving substrate or pixel defining layer. The notch communicates with the gap. The orthogonal projection of the second blocking part on the driving substrate completely covers the orthogonal projection of the notch on the driving substrate.

[0008] The light-emitting layer covers the pixel defining layer, the first electrode layer, and the blocking structure and is separated by the notch.

[0009] Optionally, the driving substrate includes a plurality of partition grooves on the side near the pixel defining layer, the first blocking portion is located in the partition groove, the second blocking portion is located between the driving substrate and the pixel defining layer, and the orthographic projection of the second blocking portion on the driving substrate covers the orthographic projection of the edge of the partition groove on the driving substrate so that the gap is formed between the second blocking portion and the bottom wall of the partition groove.

[0010] Optionally, the first blocking portion includes a first surface disposed away from the driving substrate, and the orthographic projection of the first surface on the driving substrate covers the orthographic projection of the edge of the second blocking portion on the driving substrate.

[0011] Optionally, the first blocking portion includes a first surface disposed away from the driving substrate, the orthographic projection of the first surface on the driving substrate and the orthographic projection of the second blocking portion on the driving substrate do not overlap, the depth of the partition groove is greater than the thickness of the light-emitting layer, wherein the depth direction and the thickness direction are both perpendicular to the driving substrate.

[0012] Optionally, the second blocking portion includes a second surface disposed away from the driving substrate, the second surface having a height difference with the first surface, and the first surface being located on the side of the second surface away from the driving substrate.

[0013] Optionally, the height difference is greater than or equal to 0.5 times the sum of the thickness of the second blocking portion and the depth of the partition groove, wherein the depth direction and the thickness direction are both perpendicular to the driving substrate.

[0014] Optionally, both the first blocking portion and the second blocking portion are located on the pixel defining layer and between two adjacent pixel openings, and the sidewall of the second blocking portion is inclined so that the gap is formed between the sidewall and the pixel defining layer.

[0015] Optionally, the first blocking portion includes a first surface disposed away from the driving substrate, and the second blocking portion includes a second surface disposed away from the driving substrate, wherein the orthographic projection of the first surface on the driving substrate overlaps the orthographic projection of the edge of the second surface on the driving substrate.

[0016] Optionally, the first blocking portion includes a first surface disposed away from the driving substrate, and the second blocking portion includes a second surface disposed away from the driving substrate. The orthographic projection of the first surface on the driving substrate and the orthographic projection of the second surface on the driving substrate do not overlap. The height of the notch is greater than the thickness of the light-emitting layer, and the height direction and thickness direction are perpendicular to the driving substrate.

[0017] Optionally, there is a height difference between the second surface and the first surface, with the first surface located on the side of the second surface away from the driving substrate.

[0018] Optionally, the height difference is greater than or equal to 0.5 times the thickness of the second blocking portion, wherein the thickness direction is perpendicular to the driving substrate.

[0019] Optionally, the first blocking portion further includes a third surface disposed opposite to the first surface, wherein the orthographic projection of the third surface on the driving substrate is located within the orthographic projection of the first surface on the driving substrate, the distance between the edge of the orthographic projection of the first surface on the driving substrate and the edge of the orthographic projection of the third surface on the driving substrate is L, and the thickness of the first blocking portion is H, where L ≥ 1 / 3H, and the thickness direction is perpendicular to the driving substrate.

[0020] A second aspect of this application provides a display device including the display substrate described in any one of the first aspects above.

[0021] As can be seen from the above, the display substrate and display device provided in this application, by setting a first blocking part and a second blocking part, control the second blocking part to be located on the outer periphery of the first blocking part and form a gap between the second blocking part and the first blocking part, and form a gap between the second blocking part and the driving substrate or pixel defining layer, the orthographic projection of the second blocking part on the driving substrate completely covers the orthographic projection of the gap on the driving substrate. Thus, the upper part of the gap is completely covered by the second blocking part, and the two sides of the gap are completely blocked by the first blocking part or the second blocking part. In specific implementation, when the light-emitting material is vaporized, no matter from which angle the light-emitting material is sprayed, the light-emitting material cannot enter the gap. This ensures that when the light-emitting material of the light-emitting layer is vaporized, the setting of the gap can isolate the light-emitting layer, so that the light-emitting layer is broken at the position of the gap. In this way, the light-emitting layer between two adjacent pixel openings is discontinuous, completely isolating the pixel crosstalk between two adjacent sub-pixels. Attached Figure Description

[0022] To more clearly illustrate the technical solutions in this application or related technologies, the drawings used in the description of the embodiments or related technologies will be briefly introduced below. Obviously, the drawings described below are only embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0023] Figure 1 This is a first cross-sectional schematic diagram of the display substrate according to an embodiment of this application;

[0024] Figure 2 This is a second cross-sectional schematic diagram of the display substrate according to an embodiment of this application;

[0025] Figure 3 This is a third cross-sectional view of the display substrate according to an embodiment of this application;

[0026] Figure 4 This is a fourth cross-sectional view of the display substrate according to an embodiment of this application;

[0027] Figure 5 This is a fifth cross-sectional view of the display substrate according to an embodiment of this application;

[0028] Figure 6 This is a top view of the display substrate according to an embodiment of this application;

[0029] Figure 7 This is a sixth cross-sectional view of the display substrate according to an embodiment of this application;

[0030] Figure 8 This is a seventh cross-sectional view of the display substrate according to an embodiment of this application;

[0031] Figure 9 This is an eighth cross-sectional view of the display substrate according to an embodiment of this application;

[0032] Figure 10 This is a ninth cross-sectional view of the display substrate according to an embodiment of this application;

[0033] Figure 11 This is a tenth cross-sectional view of the display substrate according to an embodiment of this application;

[0034] Figure 12 This is an eleventh cross-sectional view of the display substrate according to an embodiment of this application;

[0035] Figure 13 This is a first cross-sectional schematic diagram of the display substrate manufacturing process according to an embodiment of this application;

[0036] Figure 14 This is a second cross-sectional view of the display substrate manufacturing process according to an embodiment of this application;

[0037] Figure 15 This is a third cross-sectional view of the display substrate manufacturing process according to an embodiment of this application;

[0038] Figure 16 This is a fourth cross-sectional view of the display substrate manufacturing process according to an embodiment of this application.

[0039] In the figure: 1. Driving substrate; 11. Driving base; 111. Substrate substrate; 112. Gate insulating layer; 113. Interlayer insulating layer; 114. Source electrode; 115. Drain electrode; 116. Active layer; 117. Gate electrode; 12. Planarization layer; 121. Partition trench;

[0040] 2. Pixel limiting layer; 21. Pixel opening; 3. Blocking structure; 31. First blocking part; 311. First sub-part; 312. Second sub-part; 313. First surface; 314. Third surface; 32. Second blocking part; 321. Second surface; 4. Gap; 5. Notch; 6. First electrode layer; 7. Light emitting layer; 8. Partition structure; 9. Isolation groove; 10. Isolation blocking part. Detailed Implementation

[0041] To make the objectives, technical solutions, and advantages of this application clearer, the following detailed description is provided in conjunction with specific embodiments and the accompanying drawings.

[0042] It should be noted that, unless otherwise defined, the technical or scientific terms used in the embodiments of this application should have the ordinary meaning understood by one of ordinary skill in the art to which this application pertains. The terms "first," "second," and similar terms used in the embodiments of this application do not indicate any order, quantity, or importance, but are merely used to distinguish different components. Terms such as "comprising" or "including" mean that the element or object preceding the word encompasses the elements or objects listed after the word and their equivalents, without excluding other elements or objects. Terms such as "connected" or "linked" are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. Terms such as "upper," "lower," "left," and "right" are only used to indicate relative positional relationships; when the absolute position of the described object changes, the relative positional relationship may also change accordingly.

[0043] Organic light-emitting diodes (OLEDs) are widely used in mobile phones and wearable products, and excellent display performance is an essential characteristic of OLEDs. To further reduce the power consumption of OLEDs and improve product brightness, stacked OLED products have emerged. However, regardless of whether it's a single-layer or stacked OLED, due to the presence of common layers, leakage current, or crosstalk, exists between different sub-pixels to varying degrees. This crosstalk is particularly pronounced in stacked OLEDs.

[0044] In this application, in order to reduce crosstalk between adjacent sub-pixels of OLED, the concept of isolation structure design is proposed. By using some special structures, the light-emitting layer is directly disconnected in certain places during the fabrication process, thereby reducing the mutual crosstalk between sub-pixels.

[0045] Figure 1 This is an exemplary schematic diagram of the partition structure 8 design using a negative adhesive solution. Because... Figure 1 The structure shown is in the process of OLED coating, so the entire structure is inverted.

[0046] In some embodiments, see Figure 1 As shown, a trapezoidal partition structure 8 is formed on the side of the pixel limiting layer 2 away from the driving substrate 1 using negative adhesive. Since the top of the trapezoidal partition structure 8, i.e. the surface away from the driving substrate 1, has a larger surface area, the top of the pillar can act as a blocking part to block the light-emitting material from entering the angle formed between the bottom of the pillar and the pixel limiting layer 2, thereby blocking the light-emitting layer 7.

[0047] The negative adhesive partition structure 8 has an excellent morphology, but its isolation effect is poor. This is because the inclination angle of the sidewalls of the negative adhesive partition structure 8 is not large enough. At certain locations, the partition structure 8 cannot block the luminescent material in certain evaporation directions, resulting in the luminescent material remaining continuous at the location of the partition structure 8, thus leading to poor isolation. For example, as... Figure 1 As shown, Figure 1 The partition structure 8 is perpendicular to the evaporation source (line source). At this position, the partition structure 8 does not provide any shielding effect for the evaporation material at most angles, such as... Figure 1 As shown in direction A, the luminescent material evaporated from direction A can enter the angle formed between the column base and the pixel-defining layer 2 without obstruction, so that the luminescent material layer is not broken at the angle, and thus the luminescent layer 7 remains continuous, making it impossible to effectively isolate the luminescent layer 7.

[0048] Figure 2 This is an exemplary schematic diagram of the partition structure 8 design of the isolation groove 9 scheme.

[0049] In some embodiments, see Figure 2 As shown, an isolation groove 9 is provided on the planarization layer 12, and an isolation blocking portion 10 is provided on the side of the planarization layer 12 away from the driving substrate 1. A groove is formed between the bottom and sidewall of the isolation blocking portion 10 and the isolation groove 9, and the width inside the groove is greater than the width of the opening of the blocking portion. The groove has a certain depth, generally greater than the thickness of the entire light-emitting layer 7. In this way, the inwardly recessed structure combined with the height difference can break the light-emitting material in the groove, thereby reducing crosstalk.

[0050] However, due to limitations in manufacturing processes, the isolation effect of isolation trench 9 may vary at different locations. Figure 2 As shown, the vapor deposition position is the same as... Figure 1 If the grooves or recesses are not deep enough in certain locations, the luminescent material can form a continuous structure within the grooves, resulting in differences in the partitioning effect at different locations. For example, such as... Figure 2As shown, the luminescent material evaporated from direction B can enter the groove without obstruction. If the groove is not deep enough, the luminescent material inside the groove will form a continuous structure with the luminescent material outside the groove, thus making the luminescent layer 7 still continuous and unable to achieve effective isolation of the luminescent layer 7. If the groove is deep enough, the cost of the entire manufacturing process will be high.

[0051] Therefore, in order to ensure that the light-emitting layer 7 can be effectively isolated at certain locations to solve the crosstalk problem between sub-pixels, this application has made further optimizations.

[0052] In some embodiments, see Figure 3 , Figure 4 , Figure 5 and Figure 6 As shown, the display substrate provided in this application includes: a driving substrate 1; a pixel defining layer 2 disposed on the driving substrate 1, wherein a plurality of pixel openings 21 are arrayed on the pixel defining layer 2, and a first electrode layer 6 is disposed in each pixel opening 21; a blocking structure 3 including a first blocking portion 31 and a second blocking portion 32, wherein the first blocking portion 31 is located between two adjacent pixel openings 21, the second blocking portion 32 is located on the outer periphery of the first blocking portion 31 and a gap 4 is formed between the second blocking portion 32 and the driving substrate 1 or the pixel defining layer 2, the gap 5 is connected to the gap 4, and the orthogonal projection of the second blocking portion 32 on the driving substrate 1 completely covers the orthogonal projection of the gap 5 on the driving substrate 1; and a light-emitting layer 7 covering the pixel defining layer 2, the first electrode layer 6 and the blocking structure and being separated by the gap 5.

[0053] Specifically, the driving substrate 1 includes a driving substrate 11 and a planarization layer 12. The driving substrate 11 includes a substrate 111 and a driving layer located on the substrate 111.

[0054] The substrate 111 can support and protect various components of the display substrate. The substrate 111 can be formed of glass, quartz, ceramic, or a flexible plastic material. For example, when the substrate 111 is formed of a plastic material, it can be formed of polyimide (PI).

[0055] The substrate 111 can be flexible, stretchable, foldable, bendable and / or rollable, so the display substrate can also be flexible, stretchable, foldable, bendable and / or rollable.

[0056] The substrate 111 includes a display area and a non-display area.

[0057] The display area is the region on the display substrate where an image is displayed. Light-emitting units and various driving elements for driving the light-emitting units can be disposed within the display area. For example, a light-emitting unit may include a first electrode, a light-emitting layer 7, and a second electrode. Furthermore, various components such as wiring, capacitors, or thin-film transistors for driving the light-emitting units can be disposed within the display area.

[0058] The display area may include an array of subpixels. A subpixel is the smallest unit for configuring the screen, and each of the multiple subpixels may include a light-emitting unit and driving circuitry. Each of the multiple subpixels may emit light of a different wavelength. For example, the multiple subpixels may include red, green, and blue subpixels. However, the multiple subpixels are not limited to this and may also include white subpixels.

[0059] The driving circuit of a subpixel is a circuit used to control the driving of the light-emitting unit. For example, the driving circuit can be configured to include a thin-film transistor and a capacitor, but is not limited to this.

[0060] The non-display area is an area where no image is displayed, and where various components for driving the multiple sub-pixels set in the display area can be located. For example, drivers that provide signals for driving the multiple sub-pixels, flexible films, etc., can be located in the non-display area.

[0061] The non-display area can be an area surrounding the display area, but is not limited to this. For example, the non-display area can be an area extending from the display area.

[0062] A driving layer is disposed on the substrate 111. The driving layer is a driving element of the display substrate and is used to define the light-emitting units. Exemplarily, the driving layer may include a thin-film transistor, which is a driving element of the display substrate. The thin-film transistor includes an active layer 116, a gate electrode 117, a source electrode 114, and a drain electrode 115.

[0063] An active layer 116 is disposed on a substrate 111. The active layer 116 may be made of amorphous, polycrystalline semiconductor, oxide semiconductor, or organic semiconductor material. In addition, the active layer 116 includes a channel region that is not doped with impurities and a source region and a drain region that are doped with impurities and disposed on the opposite side of the channel region.

[0064] A gate insulating layer is disposed on the active layer 116. The gate insulating layer is a layer used to electrically insulate the gate electrode 117 from the active layer 116, and can be formed of an insulating material. For example, the gate insulating layer can be formed as a single layer of silicon nitride (SiNx) or silicon oxide (SiOx) as an inorganic material, or as a multilayer of silicon nitride (SiNx) or silicon oxide (SiOx), but the implementation is not limited to this.

[0065] The gate electrode 117 is disposed on the gate insulating layer. The gate electrode 117 may be stacked with at least some of the active layers 116 and may be stacked with the channel region. The gate electrode 117 may be any of a variety of metallic materials, such as any of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd), and copper (Cu), or an alloy of two or more of them, or a multilayer thereof, but the embodiments are not limited thereto.

[0066] An interlayer insulating layer 113 is disposed on the gate electrode 117 and the gate insulating layer. The interlayer insulating layer 113 can be made of inorganic insulating material or organic insulating material.

[0067] Contact holes (not shown in the figure) are formed in the gate insulating layer and the interlayer insulating layer 113, which overlap with at least a portion of the active layer 116.

[0068] Source electrode 114 and drain electrode 115 are disposed on interlayer insulating layer 113. Source electrode 114 and drain electrode 115 are disposed on the same layer and spaced apart from each other. Furthermore, source electrode 114 and drain electrode 115 are connected to the source region and drain region of active layer 116, respectively, through contact holes. Source electrode 114 and drain electrode 115 can be formed from any one or more of a variety of metallic materials, for example, from any one of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd), and copper (Cu), or from an alloy of two or more of them, or from multiple layers thereof, but the embodiments are not limited thereto.

[0069] As described above, the active layer 116, the gate electrode 117, the source electrode, and the drain electrode constitute a thin-film transistor.

[0070] The structure of a thin-film transistor is not limited to the foregoing example and can be modified to various alternative structures. A light-emitting diode display may include a switching transistor and a driving transistor, with the aforementioned thin-film transistor serving as the driving transistor. Although not shown, a switching thin-film transistor may be provided.

[0071] A planarization layer 12 is disposed on the thin-film transistor and the interlayer insulating layer 113. The planarization layer 12 is used to remove and / or flatten the steps in the aforementioned structure, thereby increasing the luminous efficiency of the light-emitting unit to be formed thereon. At least some contact holes stacked with the drain electrode are formed in the planarization layer 12.

[0072] The planarization layer 12 may be formed from polyacrylate resin, epoxy resin, phenolic resin, polyamide resin, polyimide resin, unsaturated polyester resin, polyphenylene resin, polyphenylene sulfide resin and / or benzocyclobutene (BCB).

[0073] The array of light-emitting units is disposed on the planarization layer 12. Each light-emitting unit includes a first electrode layer 6, a second electrode layer disposed on the first electrode layer 6, and a light-emitting layer 7 disposed between the first electrode layer 6 and the second electrode layer. Here, the light-emitting unit can be a light-emitting diode or an organic light-emitting diode.

[0074] A pixel defining layer 2 is disposed on the planarization layer 12, and a plurality of pixel openings 21 are arrayed on the pixel defining layer 2. Each pixel opening 21 is provided with a first electrode layer 6, which is disposed on the planarization layer 12. The first electrode layer 6 can be formed of a transparent conductive material such as indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), indium oxide (In2O3), etc., or of a metal such as lithium (Li), calcium (Ca), lithium fluoride / calcium (LiF / Ca), lithium fluoride / aluminum (LiF / Al), aluminum (Al), silver (Ag), magnesium (Mg), gold (Au). The first electrode layer 6 is electrically connected to the drain electrode of the thin-film transistor through a contact hole formed in the planarization layer 12, so as to serve as the anode of the light-emitting unit.

[0075] The first electrode layer 6 may include a first transparent electrode and a second transparent electrode comprising a transparent conductive material, and a semi-transparent layer disposed between the first transparent electrode and the second transparent electrode to form a microcavity together with the second electrode layer. For example, the first electrode layer 6 may be formed as a multilayer comprising a layer made of a transparent conductive material and a layer made of a reflective metallic material.

[0076] The blocking structure 3 includes a first blocking part 31 and a second blocking part 32. The first blocking part 31 is located between two adjacent pixel openings 21. For example, the first blocking part 31 can be located on the pixel limiting layer 2 between two adjacent pixel openings 21, or it can be located on the planarization layer 12 between two adjacent pixel openings 21. The specific setting is based on actual needs, as long as the first blocking part 31 is located between two adjacent pixel openings 21.

[0077] The second blocking part 32 is located on the outer periphery of the first blocking part 31 and a gap 4 is formed between them. See also... Figure 5 As shown, during the evaporation of the luminescent material, the second blocking part 32, which surrounds the first blocking part 31, can block the luminescent material (such as light emitted from the side towards the first blocking part 31) Figure 5 As shown in Figure F, the first blocking part 31 blocks the light-emitting material from entering the gap 4 between the two parts. At the same time, the first blocking part 31 can block the light-emitting material (such as light emitted from the side towards the second blocking part 32) Figure 5As shown in G, the light-emitting material is blocked to prevent it from entering the gap 4 between the two. In this way, the amount of light-emitting material that ultimately enters the gap 4 is very small, and only the light-emitting material that is incident on the gap 4 from a specific angle (such as...) Figure 5 Only those who can enter this gap 4 (as shown in C, D, and E) can do so.

[0078] Furthermore, a gap 5 is formed between the second blocking portion 32 and the driving substrate 11 or the pixel defining layer 2, that is, a gap 5 is formed between the top surface, bottom surface or side wall of the second blocking portion 32 and the driving substrate 11 or the pixel defining layer 2. For example, the gap 5 can be a void, that is, a void is formed between the top surface or bottom surface of the second blocking portion 32 and the top surface of the driving substrate 11 or the pixel defining layer 2; the gap 5 can also be an angle, that is, an angle is formed between the side wall of the second blocking portion 32 and the top surface of the driving substrate 11 or the pixel defining layer 2.

[0079] The orthographic projection of the second blocking part 32 on the driving substrate 1 completely covers the orthographic projection of the notch 5 on the driving substrate 1. Thus, the notch 5 is completely covered by the second blocking part 32. During the evaporation of the light-emitting material, the light-emitting material that is directed toward the notch 5 from a direction perpendicular to the driving substrate 1 or from a direction with a small angle to the vertical direction will be blocked by the second blocking part 32, preventing the light-emitting material from entering the notch 5.

[0080] The luminescent material (such as light emitted from a direction that makes a large angle with the vertical direction) is directed toward notch 5. Figure 5 As shown in F and G, all light-emitting materials (such as those emitted from a specific angle towards gap 4) will be blocked by the second blocking part 32 or the first blocking part 31. Figure 5 As shown in C, D, and E, the light-emitting material can only enter the gap 4, but cannot enter the notch 5 blocked by the second blocking part 32. Therefore, no matter from which angle the light-emitting material is sprayed, the light-emitting material cannot enter the notch 5. This ensures that when the light-emitting material of the light-emitting layer 7 is deposited, the notch 5 can isolate the light-emitting layer 7, so that the light-emitting layer 7 is broken at the position of the notch 5. In this way, the light-emitting layer 7 between two adjacent pixel openings 21 is discontinuous, completely isolating the pixel crosstalk between two adjacent sub-pixels.

[0081] In this application, by setting a first blocking part 31 and a second blocking part 32, the second blocking part 32 is controlled to be located on the outer periphery of the first blocking part 31 and a gap 4 is formed between the second blocking part 31 and the first blocking part 31. A notch 5 is formed between the second blocking part 32 and the driving substrate 11 or the pixel defining layer 2. The orthographic projection of the second blocking part 32 on the driving substrate 1 completely covers the orthographic projection of the notch 5 on the driving substrate 1. Thus, the top of the notch 5 is completely covered by the second blocking part 32, and the two sides of the notch 5 are completely blocked by the first blocking part 31 or the second blocking part 32. In specific implementation, when the light-emitting material is deposited, no matter from which angle the light-emitting material is sprayed, the light-emitting material cannot enter the notch 5. This ensures that when the light-emitting material of the light-emitting layer 7 is deposited, the setting of the notch 5 can isolate the light-emitting layer 7, so that the light-emitting layer 7 is broken at the position of the notch 5. Thus, the light-emitting layer 7 between two adjacent pixel openings 21 is discontinuous, completely isolating the pixel crosstalk between two adjacent sub-pixels.

[0082] In some embodiments, the lateral width of the gap 4 should be as small as possible to minimize the amount of light-emitting material entering the gap 4 and ensure the blocking effect of the notch 5 on the light-emitting layer 7. However, the lateral width of the gap 4 should be at least greater than or equal to 0.2 μm to facilitate the actual etching process; if the lateral width of the gap 4 is less than 0.2 μm, the size of the gap 4 is too small, which is not conducive to the etching process.

[0083] In some embodiments, see continue to see Figure 3 As shown, the driving substrate 1 includes a plurality of partition grooves 121 on the side near the pixel limiting layer 2. The first blocking part 31 is located in the partition groove 121, and the second blocking part 32 is located between the driving substrate 1 and the pixel limiting layer 2. The orthographic projection of the second blocking part 32 on the driving substrate 1 covers the orthographic projection of the edge of the partition groove 121 on the driving substrate 1, so that the gap 5 is formed between the second blocking part 32 and the bottom wall of the partition groove 121.

[0084] Specifically, the planarization layer 12 of the driving substrate 1 includes a plurality of partition grooves 121 on the side near the pixel defining layer 2.

[0085] The orthographic projection of the second blocking part 32 on the drive substrate 1 covers the orthographic projection of the edge of the partition groove 121 on the drive substrate 1, and the gap 5 is formed between the second blocking part 32 and the bottom wall of the partition groove 121, and the second blocking part 32 completely covers the gap 5.

[0086] Thus, the upper part of the notch 5 is completely covered and blocked by the second blocking part 32, the left side of the notch 5 is completely blocked by the second blocking part 32 and the side wall of the partition groove 121, and the right side of the notch 5 is completely blocked by the first blocking part 31 located in the partition groove 121. In specific implementation, when the light-emitting material is deposited, no matter from which angle the light-emitting material is sprayed, the light-emitting material cannot enter the notch 5. This ensures that when the light-emitting material of the light-emitting layer 7 is deposited, the notch 5 can isolate the light-emitting layer 7, making the light-emitting layer 7 disconnected at the position of the notch 5. In this way, the light-emitting layer 7 between two adjacent pixel openings 21 is discontinuous, completely isolating the pixel crosstalk between two adjacent sub-pixels.

[0087] In some embodiments, see continue to see Figure 3 and Figure 7 As shown, the first blocking portion 31 includes a first surface 313 disposed away from the driving substrate 1, and the orthographic projection of the first surface 313 on the driving substrate 1 covers the orthographic projection of the edge of the second blocking portion 32 on the driving substrate 1.

[0088] Specifically, the first blocking part 31 can be as follows: Figure 3 The inverted trapezoidal structure shown has an inclined sidewall of the first blocking part 31. At this time, the orthographic projection of the first surface 313 of the first blocking part 31 on the driving substrate 1 covers the orthographic projection of the edge of the second blocking part 32 on the driving substrate 1.

[0089] The first blocking part 31 can also be as follows: Figure 7 In the structure shown, the first blocking part 31 includes a first sub-part 311 and a second sub-part 312. The second sub-part 312 is located on the side of the first sub-part 311 away from the driving substrate 1. Both the second sub-part 312 and the first sub-part 311 are cylindrical structures, and the orthographic projection of the second sub-part 312 on the driving substrate 1 completely covers the orthographic projection of the first sub-part 311 on the driving substrate 1. At this time, the sidewall of the first blocking part 31 is not inclined, and the first surface 313 is the surface of the second sub-part 312 away from the driving substrate 1.

[0090] When the first blocking portion 31 includes a first sub-portion 311 and a second sub-portion 312, the first sub-portion 311 and the second sub-portion 312 can be made of the same material or different materials. When the first sub-portion 311 and the second sub-portion 312 are made of different materials, the etching rate of the first sub-portion 311 is greater than the etching rate of the second sub-portion 312. Thus, in the same etching process, the above structure is obtained based on the difference in etching rate.

[0091] When the orthographic projection of the first surface 313 on the driving substrate 1 covers the orthographic projection of the edge of the second blocking part 32 on the driving substrate 1, the gap 4 between the first blocking part 31 and the second blocking part 32 is also covered by the first surface 313. In this way, the light-emitting material emitted from the direction perpendicular to the driving substrate 1 toward the gap 4 is blocked by the first surface 313 and will not enter the gap 4, further reducing the amount of light-emitting material that may enter the gap 4.

[0092] At this time, since the amount of light-emitting material that may enter the gap 4 is very small, the amount of light-emitting material that can enter the partition groove 121 through the gap 4 is also very small. In this case, there is no need to limit the depth of the partition groove 121. Even if the depth of the partition groove 121 is shallow, it will not cause the light-emitting material inside the partition groove 121 to form a continuous structure with the light-emitting material outside the partition groove 121. Therefore, the etching depth of the partition groove 121 does not need to be strictly controlled, which greatly reduces the difficulty of the manufacturing process and reduces the manufacturing cost.

[0093] In some embodiments, see Figure 8 As shown, the first blocking portion 31 includes a first surface 313 disposed away from the driving substrate 1. The orthographic projection of the first surface 313 on the driving substrate 1 does not overlap with the orthographic projection of the second blocking portion 32 on the driving substrate 1. The depth of the partition groove 121 is greater than the thickness of the light-emitting layer 7, wherein both the depth direction and the thickness direction are perpendicular to the driving substrate 1 (i.e., Figure 8 Q direction in ).

[0094] Specifically, the orthographic projection of the first surface 313 on the driving substrate 1 does not overlap with the orthographic projection of the second blocking part 32 on the driving substrate 1. In this way, the light-emitting material emitted from a direction perpendicular to the driving substrate 1 or a direction with a small angle to the vertical direction toward the gap 4 can all pass through the gap 4 and enter the partition groove 121.

[0095] At this time, if the evaporation angle of the light-emitting material is all vertical or at an angle of about 0 to 5 degrees from the vertical direction, all the light-emitting material can enter the partition groove 121 through the gap 4 at this angle. Therefore, the depth of the partition groove 121 must be controlled to ensure that the depth of the partition groove 121 is greater than the thickness of the light-emitting layer 7, so that there is still a gap 4 between the top surface of the light-emitting layer 7 in the partition groove 121 and the bottom surface of the second blocking part 32, that is, the gap 5 is not filled by the light-emitting layer 7. This ensures that the gap 5 can separate the light-emitting layer 7 in the partition groove 121 from the light-emitting layer 7 outside the partition groove 121, so that the light-emitting layer 7 is discontinuous at the gap 5, thereby effectively solving the crosstalk problem between adjacent sub-pixels.

[0096] If the depth of the partition groove 121 is less than or equal to the thickness of the light-emitting layer 7, there will be no gap 4 between the top surface of the light-emitting layer 7 in the partition groove 121 and the bottom surface of the second blocking part 32, that is, the gap 5 will be filled by the light-emitting layer 7. In this way, the light-emitting layer 7 in the partition groove 121 and the light-emitting layer 7 outside the partition groove 121 will form a continuous structure that cannot be broken, and thus the crosstalk problem between adjacent sub-pixels cannot be effectively solved.

[0097] In some embodiments, see continue to see Figure 9 As shown, the second blocking portion 32 includes a second surface 321 disposed away from the driving substrate 1. There is a height difference between the second surface 321 and the first surface 313. The first surface 313 is located on the side of the second surface 321 away from the driving substrate 1.

[0098] Specifically, the first surface 313 is located on the side of the second surface 321 away from the driving substrate 1, that is, the top of the first blocking part 31 is higher than the top of the second blocking part 32. In this way, the first blocking part 31 can block the entire sidewall of the second blocking part 32 and the top edge near the first blocking part 31, so that the light-emitting material will not be deposited onto the entire sidewall of the second blocking part 32 and the top edge near the first blocking part 31. This ensures that no light-emitting material enters the gap 5 covered by the edge of the second blocking part 32, and ensures that the light-emitting layer 7 can be isolated at the position of the gap 5, effectively avoiding crosstalk between two adjacent sub-pixels.

[0099] In some embodiments, the height difference is greater than or equal to 0.5 times the sum of the thickness of the second blocking portion 32 and the depth of the partition groove 121, wherein the depth direction and the thickness direction are both perpendicular to the driving substrate 1.

[0100] Specifically, the height difference is Figure 9 As shown in H2-H1.

[0101] The height difference is greater than or equal to the sum of the thickness of the second blocking part 32 and the depth of the partition groove 121 (i.e., Figure 9 The height difference between the first surface 313 and the second surface 321 is 0.5 times that shown in H1 in the diagram. This ensures that the height difference between the first surface 313 and the second surface 321 is large enough, and the first blocking part 31 can effectively block the second blocking part 32.

[0102] If the height difference is less than the sum of the thickness of the second blocking part 32 and the depth of the partition groove 121 (i.e.) Figure 9 As shown in H1, the height difference between the first surface 313 and the second surface 321 is small, and the height difference between the two is not significant. Therefore, the first blocking part 31 cannot effectively block the sidewall of the second blocking part 32.

[0103] In some embodiments, see Figure 10 and Figure 11 As shown, the first blocking part 31 and the second blocking part 32 are both located on the pixel limiting layer 2 and between two adjacent pixel openings 21. The sidewall of the second blocking part 32 is inclined so that the gap 5 is formed between the sidewall and the pixel limiting layer 2.

[0104] Specifically, the sidewall of the second blocking portion 32 is inclined so that the gap 5 is formed between the sidewall and the pixel defining layer 2. Thus, the upper and left sides of the gap 5 are completely covered and blocked by the sidewall of the second blocking portion 32. In practical implementation, when the luminescent material is deposited, luminescent material directed towards the gap 5 from a direction perpendicular to the driving substrate 1 or from a direction with a very small angle to the perpendicular direction will be blocked by the second blocking portion 32, preventing the luminescent material from entering the gap 5.

[0105] The luminescent material (such as light emitted from a direction that makes a large angle with the vertical direction) is directed toward notch 5. Figure 11 As shown in K and L, all light-emitting materials (such as those emitted from a specific angle towards gap 4) will be blocked by the second blocking part 32 or the first blocking part 31. Figure 11 As shown in H and I, the light-emitting material can only enter the gap 4, but cannot enter the notch 5 blocked by the second blocking part 32. Therefore, no matter from which angle the light-emitting material is sprayed, the light-emitting material cannot enter the notch 5. This ensures that when the light-emitting material of the light-emitting layer 7 is deposited, the setting of the notch 5 can isolate the light-emitting layer 7, so that the light-emitting layer 7 is broken at the position of the notch 5. In this way, the light-emitting layer 7 between two adjacent pixel openings 21 is discontinuous, completely isolating the pixel crosstalk between two adjacent sub-pixels.

[0106] In some embodiments, see continue to see Figure 10 As shown, the first blocking portion 31 includes a first surface 313 disposed away from the driving substrate 1, and the second blocking portion 32 includes a second surface 321 disposed away from the driving substrate 1. The orthographic projection of the first surface 313 on the driving substrate 1 covers the orthographic projection of the edge of the second surface 321 on the driving substrate 1.

[0107] Specifically, when the orthographic projection of the first surface 313 on the driving substrate 1 covers the orthographic projection of the edge of the second surface 321 on the driving substrate 1, the gap 4 between the first blocking part 31 and the second blocking part 32 is also covered by the first surface 313. In this way, the light-emitting material emitted from the direction perpendicular to the driving substrate 1 toward the gap 4 is blocked by the first surface 313 and will not enter the gap 4, further reducing the amount of light-emitting material that may enter the gap 4.

[0108] At this point, since the amount of light-emitting material that may enter the gap 4 is very small, the amount of light-emitting material that can enter the gap 4 is also very small. In this case, there is no need to limit the height of the notch 5. Even if the height of the notch 5 is small, it will not cause the light-emitting material inside the notch 5 to form a continuous structure with the light-emitting material outside the notch 5. Therefore, the etching depth of the notch 5 does not need to be strictly controlled, which greatly reduces the difficulty of the preparation process and reduces the preparation cost.

[0109] In some embodiments, see Figure 12 As shown, the first blocking portion 31 includes a first surface 313 disposed away from the driving substrate 1, and the second blocking portion 32 includes a second surface 321 disposed away from the driving substrate 1. The orthographic projection of the first surface 313 on the driving substrate 1 and the orthographic projection of the second surface 321 on the driving substrate 1 do not overlap. The height of the notch 5 is greater than the thickness of the light-emitting layer 7, and the height direction and thickness direction are perpendicular to the driving substrate 1.

[0110] Specifically, the orthographic projection of the first surface 313 on the driving substrate 1 does not overlap with the orthographic projection of the second surface 321 on the driving substrate 1. In this way, all light-emitting materials emitted from a direction perpendicular to the driving substrate 1 or from a direction with a small angle to the vertical direction can pass through and enter the gap 4.

[0111] At this time, if the evaporation angle of the light-emitting material is all vertical or at an angle of about 0 to 5 degrees from the vertical direction, all the light-emitting material can enter the gap 4 at this angle. Therefore, the height of the gap 5 must be controlled to ensure that the height of the gap 5 is greater than the thickness of the light-emitting layer 7. In this way, even if all the light-emitting material enters the gap 4, the light-emitting material will not fill the gap 5. This ensures that the gap 5 can separate the light-emitting layer 7 inside the gap 5 from the light-emitting layer 7 outside the gap 5, making the light-emitting layer 7 discontinuous at the gap 5, thereby effectively solving the crosstalk problem between adjacent sub-pixels.

[0112] If the height of the gap 5 is less than or equal to the thickness of the light-emitting layer 7, when all the light-emitting materials enter the gap 4, the light-emitting materials will fill the gap 5. In this way, the light-emitting layer 7 inside the gap 5 and the light-emitting layer 7 outside the gap 5 will form a continuous structure that cannot be broken, and thus cannot effectively solve the crosstalk problem between adjacent sub-pixels.

[0113] In some embodiments, see continue to see Figure 10 As shown, there is a height difference between the second surface 321 and the first surface 313, and the first surface 313 is located on the side of the second surface 321 away from the driving substrate 1.

[0114] Specifically, the first surface 313 is located on the side of the second surface 321 away from the driving substrate 1, that is, the top of the first blocking part 31 is higher than the top of the second blocking part 32. In this way, the first blocking part 31 can block the entire sidewall of the second blocking part 32 and the top edge near the first blocking part 31, so that the light-emitting material will not be deposited onto the entire sidewall of the second blocking part 32 and the top edge near the first blocking part 31. This ensures that no light-emitting material enters the gap 5 covered by the edge of the second blocking part 32, and ensures that the light-emitting layer 7 can be isolated at the position of the gap 5, effectively avoiding crosstalk between two adjacent sub-pixels.

[0115] In some embodiments, see continue to see Figure 10 As shown, the height difference is greater than or equal to 0.5 times the thickness of the second blocking part 32, wherein the thickness direction is perpendicular to the driving substrate 1.

[0116] Specifically, the height difference is Figure 9 As shown in H2-H3.

[0117] The height difference is greater than or equal to the thickness of the second blocking part 32 (i.e. Figure 10 The height difference between the first surface 313 and the second surface 321 is 0.5 times that shown in H3 in the figure. This ensures that the height difference between the first surface 313 and the second surface 321 is large enough, and the first blocking part 31 can effectively block the second blocking part 32.

[0118] If the height difference is less than 0.5 times the thickness of the second blocking part 32, then the height difference between the first surface 313 and the second surface 321 is small, and the height difference between the two is not significant. Therefore, the first blocking part 31 cannot effectively block the sidewall of the second blocking part 32.

[0119] In some embodiments, see continue to see Figure 9 and Figure 10 As shown, the first blocking portion 31 further includes a third surface disposed opposite to the first surface 313. The orthographic projection of the third surface on the driving substrate 1 is located within the orthographic projection of the first surface 313 on the driving substrate 1. The distance between the edge of the orthographic projection of the first surface 313 on the driving substrate 1 and the edge of the orthographic projection of the third surface on the driving substrate 1 is L. The thickness of the first blocking portion 31 is H, and L≥1 / 3H, wherein the thickness direction is perpendicular to the driving substrate 1.

[0120] Specifically, the orthographic projection of the third surface on the driving substrate 1 is located within the orthographic projection of the first surface 313 on the driving substrate 1, that is, the first blocking part 31 has an inverted trapezoidal structure. This structure, on the one hand, allows the first surface 313 to completely cover the edge of the second surface 321, ensuring the blocking effect of the first blocking part 31 on the second blocking part 32 and the notch 5. On the other hand, it makes the gap 4 between the first blocking part 31 and the second blocking part 32 form a structure that is smaller at the top and larger at the bottom, thereby reducing the amount of light-emitting material entering the gap 4 and ensuring the blocking effect of the notch 5.

[0121] L≥1 / 3H, which makes the inclination angle of the sidewall of the first shielding part larger, and the area difference between the first surface 313 and the second surface 321 is larger. This makes the first surface 313 larger, which can completely cover the edge of the second surface 321, and the third surface smaller, which makes the sum of the lateral width of the notch 5 and the gap 4 larger, thus improving the partition effect.

[0122] When L < 1 / 3H, the inclination angle of the sidewall of the first shielding part is too small, and the area difference between the first surface 313 and the third surface is small. When the areas of the first surface 313 and the second surface 321 are both large, the sum of the lateral widths of the notch 5 and the gap 4 is small, which is not conducive to the etching process. When the areas of the first surface 313 and the second surface 321 are both small, the first shielding part cannot effectively shield the second shielding part, resulting in a poor blocking effect of the notch 5.

[0123] In some embodiments, when the first shielding part is an inverted trapezoidal structure, the angle between the organic evaporation source angle plate and the vertical direction can be controlled between 30° and 75°. The smaller the angle, the less material evaporates into the cavity, and the better the blocking effect. The cathode layer (metal source) angle plate can be appropriately increased. The larger the angle, the more material can enter the cavity, the lower the OLED resistance, which is beneficial for reducing the operating voltage and power consumption.

[0124] In some embodiments, during the preparation Figure 10 When using the blocking structure shown, there are two possible approaches:

[0125] The first method: First, coat a layer of negative adhesive, then prepare three small second blocking parts 32 by exposure and development (e.g., Figure 13 (As shown), then a layer of negative adhesive is coated on the middle second blocking part 32, so that another structural layer is formed on the middle second blocking part 32, finally forming the first blocking part 31 (as shown). Figure 14 (As shown).

[0126] The second method: First, coat a layer of negative adhesive, then prepare two small second blocking parts 32 by exposure and development (e.g. Figure 15As shown), a thicker layer of negative adhesive is then applied between the two second blocking portions 32, forming a large first blocking portion 31 in the middle (as shown). Figure 16 (As shown).

[0127] This application also provides a display device, including the display substrate described in any of the above embodiments.

[0128] The display device can be a product with image display function, such as: monitor, television, billboard, digital photo frame, laser printer with display function, telephone, mobile phone, personal digital assistant (PDA), digital camera, portable camcorder, viewfinder, navigator, vehicle, large wall area, home appliance, information query equipment (such as business query equipment of e-government, bank, hospital, power and other departments, monitor, etc.).

[0129] The display device has the technical effects described in any of the above embodiments, which will not be elaborated here.

[0130] It should be noted that the above description describes some embodiments of this application. Other embodiments are within the scope of the appended claims. In some cases, the actions or steps recorded in the claims can be performed in a different order than that shown in the above embodiments and still achieve the desired result. Furthermore, the processes depicted in the drawings do not necessarily require a specific or sequential order to achieve the desired result. In some embodiments, multitasking and parallel processing are also possible or may be advantageous.

[0131] Those skilled in the art should understand that the discussion of any of the above embodiments is merely exemplary and is not intended to imply that the scope of this application is limited to these examples; under the concept of this application, the technical features of the above embodiments or different embodiments can also be combined, the steps can be implemented in any order, and there are many other variations of different aspects of the embodiments of this application as described above, which are not provided in detail for the sake of brevity.

[0132] The embodiments of this application are intended to cover all such substitutions, modifications, and variations that fall within the broad scope of this application. Therefore, any omissions, modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the embodiments of this application should be included within the protection scope of this application.

Claims

1. A display substrate, characterized in that, include: Drive substrate; A pixel defining layer is disposed on the driving substrate, and a plurality of pixel openings are arrayed on the pixel defining layer, and a first electrode layer is disposed in each pixel opening; The blocking structure includes a first blocking part and a second blocking part. The first blocking part is located between two adjacent pixel openings. The second blocking part is located on the outer periphery of the first blocking part and forms a gap with the first blocking part. A notch is formed between the second blocking part and the driving substrate. The notch communicates with the gap. The orthogonal projection of the second blocking part on the driving substrate completely covers the orthogonal projection of the notch on the driving substrate. A light-emitting layer covers the pixel defining layer, the first electrode layer, and the blocking structure and is separated by the notch; The driving substrate includes a plurality of partition grooves on the side near the pixel defining layer. A first blocking portion is located within the partition groove, and a second blocking portion is located between the driving substrate and the pixel defining layer. The orthographic projection of the second blocking portion on the driving substrate overlaps the orthographic projection of the edge of the partition groove on the driving substrate, thereby forming the gap between the second blocking portion and the bottom wall of the partition groove. The first blocking portion includes a first surface disposed away from the driving substrate, and the orthographic projection of the first surface on the driving substrate overlaps the orthographic projection of the edge of the second blocking portion on the driving substrate. Alternatively, the first blocking portion includes a first surface disposed away from the driving substrate, and the orthographic projection of the first surface on the driving substrate does not overlap with the orthographic projection of the second blocking portion on the driving substrate. The depth of the partition groove is greater than the thickness of the light-emitting layer, wherein both the depth direction and the thickness direction are perpendicular to the driving substrate.

2. The display substrate according to claim 1, characterized in that, The second blocking portion includes a second surface disposed away from the driving substrate, the second surface having a height difference from the first surface, and the first surface being located on the side of the second surface away from the driving substrate.

3. The display substrate according to claim 2, characterized in that, The height difference is greater than or equal to 0.5 times the sum of the thickness of the second blocking part and the depth of the partition groove, wherein the depth direction and the thickness direction are both perpendicular to the driving substrate.

4. A display substrate, characterized in that, include: Drive substrate; A pixel defining layer is disposed on the driving substrate, and a plurality of pixel openings are arrayed on the pixel defining layer, and a first electrode layer is disposed in each pixel opening; The blocking structure includes a first blocking portion and a second blocking portion. The first blocking portion is located between two adjacent pixel openings. The second blocking portion is located on the outer periphery of the first blocking portion and forms a gap with the first blocking portion. A notch is formed between the second blocking portion and the pixel defining layer. The notch communicates with the gap. The orthogonal projection of the second blocking portion on the driving substrate completely covers the orthogonal projection of the notch on the driving substrate. A light-emitting layer covers the pixel defining layer, the first electrode layer, and the blocking structure and is separated by the notch; The first blocking portion and the second blocking portion are both located on the pixel defining layer and between two adjacent pixel openings. The sidewall of the second blocking portion is inclined so that the gap is formed between the sidewall and the pixel defining layer.

5. The display substrate according to claim 4, characterized in that, The first blocking portion includes a first surface disposed away from the driving substrate, and the second blocking portion includes a second surface disposed away from the driving substrate. The orthographic projection of the first surface on the driving substrate covers the orthographic projection of the edge of the second surface on the driving substrate.

6. The display substrate according to claim 4, characterized in that, The first blocking portion includes a first surface disposed away from the driving substrate, and the second blocking portion includes a second surface disposed away from the driving substrate. The orthographic projection of the first surface on the driving substrate and the orthographic projection of the second surface on the driving substrate do not overlap. The height of the notch is greater than the thickness of the light-emitting layer, and the height direction and thickness direction are perpendicular to the driving substrate.

7. The display substrate according to any one of claims 5 to 6, characterized in that, There is a height difference between the second surface and the first surface, and the first surface is located on the side of the second surface away from the driving substrate.

8. The display substrate according to claim 7, characterized in that, The height difference is greater than or equal to 0.5 times the thickness of the second blocking part, wherein the thickness direction is perpendicular to the driving substrate.

9. The display substrate according to any one of claims 1 or 5, characterized in that, The first blocking portion further includes a third surface disposed opposite to the first surface. The orthographic projection of the third surface on the driving substrate is located within the orthographic projection of the first surface on the driving substrate. The distance between the edge of the orthographic projection of the first surface on the driving substrate and the edge of the orthographic projection of the third surface on the driving substrate is L. The thickness of the first blocking portion is H, and L≥1 / 3H, wherein the thickness direction is perpendicular to the driving substrate.

10. A display device, characterized in that, Includes the display substrate as described in any one of claims 1 to 9.

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