Control method of soldering flux spraying machine

Abstract

The embodiment of the invention provides a control method of a scaling powder spraying machine. Wherein the soldering flux spraying machine comprises a soldering flux tank, a pipeline, a spray head and a flow controller; the scaling powder tank is connected with the spray head through the pipeline, and the flow controller is arranged on the pipeline; the control method comprises the steps that circuit board data are obtained, and the circuit board data comprise position parameters of all spraying points on the circuit board and set spraying quantities corresponding to all the spraying points; and based on the position parameters of all the spraying points, the spray head is driven to move to the positions opposite to all the spraying points, and based on the set spraying amount corresponding to the current spraying point, the flow controller is used for adjusting the supply amount of scaling powder supplied to the spray head, so that the scaling powder is sprayed to the spray head. And the actual spraying amount of the scaling powder sprayed to the current spraying point by the spraying head is matched with the set spraying amount of the current spraying point.

Description

Technical Field

[0001] The present application relates to the technical field of flux spraying, and in particular to a control method for a flux spraying machine. Background Art

[0002] Flux is a chemical substance used to assist soldering in the soldering process. The functions of flux include removing oxides on the metal surface, reducing the surface tension of the solder and preventing secondary oxidation. Before the SMT equipment implements the SMT process, the flux is generally sprayed onto the pads of the circuit board by a flux sprayer.

[0003] The flux spraying machine includes a flux tank, a nozzle, a pipe and a driver. The flux is stored in the flux tank and is transported to the nozzle by a gas such as nitrogen supplied by a pressure gas source. The nozzle is driven by the driver to move to a position relative to the pad, and then the nozzle sprays the flux to the pad.

[0004] In the related art, the amount of flux is generally regulated by controlling the spraying time of the nozzle. Since the pressure of the pressure gas source will also affect the amount of flux, and during the operation of the flux sprayer, the pressure of the pressure gas source will fluctuate to a certain extent, so that the amount of flux used will deviate from the theoretical value to a certain extent. Summary of the invention

[0005] The embodiment of the present application provides a control method for a flux sprayer to solve the problem of how to improve the spraying accuracy of the flux.

[0006] In order to solve the above technical problems, this application is implemented as follows:

[0007] The control method of the flux sprayer provided in the embodiment of the present application is applied to the flux sprayer, wherein the flux sprayer includes a flux tank, a pipeline, a nozzle and a flow controller; the flux tank is connected to the nozzle via the pipeline, and the flow controller is arranged on the pipeline; the control method of the flux sprayer includes: obtaining circuit board data, wherein the circuit board data includes position parameters of each spraying point on the circuit board and a set spraying amount corresponding to each spraying point; based on the position parameters of each spraying point, driving the nozzle to move to a position relative to each spraying point respectively, and based on the set spraying amount corresponding to the current spraying point, using the flow controller, adjusting the flux supply amount supplied to the nozzle, so that the actual spraying amount of the flux sprayed by the nozzle to the current spraying point matches the set spraying amount of the current spraying point.

[0008] Optionally, the control method of the flux sprayer further includes: determining the set spraying amount corresponding to each of the spraying points based on a penetration test.

[0009] Optionally, the method of determining the set spraying amount corresponding to each of the spraying points based on the penetration test includes: step one, obtaining a first test circuit board, and setting a test paper on the back of the first test circuit board, wherein the parameter specification of the first test circuit board is the same as the parameter specification of the circuit board, and the first test circuit board includes a plurality of first test spraying points; step two, spraying flux to each of the first test spraying points with a first preset spraying amount corresponding to each of the first test spraying points; step three, determining whether the first preset spraying amount corresponding to each of the first test spraying points meets the welding process requirements based on the flux marks formed on the test paper; and determining whether the first preset spraying amount corresponding to each of the first test spraying points meets the welding process requirements based on the flux marks formed on the test paper. If the first preset spraying amount corresponding to each of the first test spraying points meets the welding process requirements, reduce the first preset spraying amount corresponding to each of the first test spraying points, and repeat steps one to three until the first preset spraying amount corresponding to each of the first test spraying points does not meet the welding process requirements; if the first preset spraying amount corresponding to each of the first test spraying points does not meet the welding process requirements, the first preset spraying amount corresponding to each of the first test spraying points adopted in the previous test process is used as the first minimum spraying amount corresponding to each of the first test spraying points; based on the first minimum spraying amount corresponding to each of the first test spraying points, determine the set spraying amount corresponding to each of the spraying points.

[0010] Optionally, the method of determining the set spraying amount corresponding to each of the spraying points based on the first minimum spraying amount corresponding to each of the first test spraying points includes: step 4, obtaining a second test circuit board, wherein the parameter specification of the second test circuit board is the same as the parameter specification of the circuit board, and the second test circuit board includes a plurality of second test spraying points; step 5, spraying flux to each of the second test spraying points with a second preset spraying amount corresponding to each of the second test spraying points; step 6, performing a patch process on the second test circuit board, performing solder joint detection on the second test circuit board after the patch process is performed, and determining the second test circuit board whether the quality of each solder joint is qualified; if the quality of each solder joint of the second test circuit board is qualified, reduce the second preset spraying amount corresponding to each second test spraying point, and repeat the steps four to six until the quality of each solder joint of the second test circuit board is unqualified; if the quality of each solder joint of the second test circuit board is unqualified, the second preset spraying amount corresponding to each second test spraying point adopted in the previous test process is used as the second minimum spraying amount corresponding to each second test spraying point; based on the second minimum spraying amount corresponding to each second test spraying point, determine the set spraying amount corresponding to each spraying point.

[0011] Optionally, the determining, based on the flux marks formed on the test paper, whether the first preset spraying amount corresponding to each first test spraying point meets the welding process requirements includes: analyzing the flux marks formed on the test paper based on image recognition, and determining whether the first preset spraying amount corresponding to each first test spraying point meets the welding process requirements.

[0012] Optionally, the analyzing the solder flux marks formed on the test paper based on image recognition includes: acquiring outer contour parameters of the solder flux marks formed on the test paper based on image recognition.

[0013] Optionally, the control method of the flux sprayer further includes: using the flow controller to determine the flux consumption; and determining the remaining amount of flux in the flux tank based on the flux consumption.

[0014] Optionally, the control method of the flux sprayer further includes: when the remaining amount of the flux is less than a preset value, replacing the flux tank.

[0015] Optionally, the control method of the flux sprayer further includes: determining whether the nozzle is clogged, and if the nozzle is clogged, cleaning the nozzle.

[0016] Optionally, the soldering flux sprayer further comprises a nozzle cleaning device; the nozzle cleaning device comprises a cleaning agent ejector and a compressed gas ejector.

[0017] At least one of the above technical solutions adopted in the embodiments of the present application can achieve the following beneficial effects:

[0018] In the embodiment of the present application, the position parameters of each spraying point on the circuit board and the set spraying amount corresponding to each spraying point can be obtained respectively, and then, based on the set spraying amount corresponding to each spraying point, the flux supply amount supplied to the nozzle can be matched with the set spraying amount of each spraying point by using a flow controller. In this way, the amount of flux sprayed to each spraying point can be made more accurate, so as to avoid waste of flux and prevent welding quality problems due to insufficient flux spraying.

[0019] Additional aspects and advantages of the present invention will be given in part in the following description and in part will be obvious from the following description, or will be learned through practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the related technologies, the drawings required for use in the embodiments or the related technical descriptions are briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.

[0021] Figure 1 A flow chart of a control method for a flux sprayer provided in an embodiment of the present application. DETAILED DESCRIPTION

[0022] In order to make the purpose, technical solution and advantages of the present application clearer, the technical solution of the present application will be clearly and completely described below in combination with the specific embodiments of the present application and the corresponding drawings. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present application.

[0023] In the description of this application, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a direct connection, or an indirect connection through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0024] In addition, although the terms used in this application are selected from well-known and commonly used terms, some terms mentioned in the specification of this application may be selected by the applicant at his or her discretion, and their detailed meanings are explained in the relevant parts of the description of this article.

[0025] Furthermore, it is required that the present application be understood not only by the actual terms used but also by the meanings connoted by each term.

[0026] The technical solutions provided by various embodiments of the present application are described in detail below in conjunction with the accompanying drawings.

[0027] The embodiment of the present application provides a control method for a soldering flux sprayer. The control method for a soldering flux sprayer provided in the embodiment of the present application is applied to a soldering flux sprayer.

[0028] For example, the flux sprayer can be used in conjunction with a patch device. The patch device is also called a patch machine, a mounter, or a surface mount system. For example, a flux sprayer can be used to spray flux onto a circuit board, and then the circuit board sprayed with flux can be transported to the patch device, so that the components can be soldered onto the circuit board using the patch device.

[0029] Exemplarily, the patch equipment includes a flux sprayer and a wave soldering machine. A circuit board with electronic components mounted on the surface can be soldered by the wave soldering machine after being sprayed with flux.

[0030] In an embodiment of the present application, the flux sprayer includes a flux tank, a pipeline, a nozzle and a flow controller. The flux tank is connected to the nozzle via a pipeline, and the flow controller is arranged on the pipeline. The flow controller can be used to accurately measure and control the flow of the liquid. Exemplarily, the flow controller can be a mass flow controller (Mass Flow Controller, MFC for short). Exemplarily, the flux can be rosin.

[0031] refer to Figure 1 The control method of the flux sprayer provided in the embodiment of the present application includes:

[0032] Step 110, obtaining circuit board data, wherein the circuit board data includes position parameters of each spraying point on the circuit board and a set spraying amount corresponding to each spraying point.

[0033] It should be noted that, generally speaking, a plurality of pads are provided on a circuit board. For example, some pads are used for soldering electronic components with large pins, and some pads are used for soldering electronic components with small pins. This makes the pads on the circuit board different in size. Since the solder pin sizes of the electronic components to be soldered are different for different pads, the amount of solder flux that needs to be sprayed on each pad will also be different.

[0034] In order to avoid using the same amount of flux for different pads, which would lead to flux waste, different set spraying amounts can be used for each pad to spray flux. In other words, each spraying point (pad is a spraying point) needs to be set with a corresponding set spraying amount.

[0035] It should be noted that the position parameters of each spray point on the circuit board can be obtained by the flux sprayer based on the electronic drawing of the circuit board by sending the electronic drawing of the circuit board to the flux sprayer. In addition, the set spray amount of each spray point can be sent to the flux sprayer through the human-computer interaction system of the flux sprayer. It should be noted that, illustratively, the set spray amount of each spray point can be determined based on an experimental method, or can be manually set based on the experience accumulated during the production process.

[0036] Step 120, based on the position parameters of each spraying point, drive the nozzle to move to a position relative to each spraying point, and based on the set spraying amount corresponding to the current spraying point, use the flow controller to adjust the flux supply to the nozzle, so that the actual spraying amount of the flux sprayed by the nozzle to the current spraying point matches the set spraying amount of the current spraying point.

[0037] After the flux sprayer obtains the circuit board data, it can drive the nozzle to move to a position relative to each spraying point based on the position parameters of each spraying point, and spray flux to the spraying point based on the set spraying amount corresponding to the current spraying point.

[0038] Exemplarily, the circuit board data acquired by the flux sprayer include: the center of the first spray point is located at position (1, 1), and the set spray volume of the first spray point is 1 ml; the center of the second spray point is located at position (1, 2), and the set spray volume of the second spray point is 1 ml; the center of the third spray point is located at position (2, 2), and the set spray volume of the third spray point is 1.2 ml; ...

[0039] After the flux spraying machine obtains the circuit board data, the nozzle moves to a position relative to the (1, 1) position of the circuit board, and the flow controller controls the supply of 1 ml of flux to the nozzle, and the nozzle sprays 1 ml of flux to the first spraying point. The nozzle moves to a position relative to the (1, 2) position of the circuit board, and the flow controller controls the supply of 1 ml of flux to the nozzle, and the nozzle sprays 1 ml of flux to the second spraying point. The nozzle moves to a position relative to the (2, 2) position of the circuit board, and the flow controller controls the supply of 1.2 ml of flux to the nozzle, and the nozzle sprays 1.2 ml of flux to the third spraying point. ……. In this way, under the control of the flow controller, the flux can be supplied to the nozzle more accurately, so that the nozzle sprays the flux to each spraying point.

[0040] In this way, in the embodiment of the present application, the position parameters of each spray point on the circuit board and the set spray amount corresponding to each spray point can be obtained respectively, and then, based on the set spray amount corresponding to each spray point, the flow controller can be used to make the flux supply amount supplied to the nozzle match the set spray amount of each spray point. In this way, the amount of flux sprayed to each spray point can be made more accurate, so as not to cause waste of flux, and not to cause welding quality problems due to too little flux spraying.

[0041] In order to facilitate those skilled in the art to better implement the solution provided in the embodiment of the present application, a more detailed method for determining the set spraying amount corresponding to each spraying point is provided below.

[0042] In some embodiments, the control method of the flux spraying machine further includes: determining a set spraying amount corresponding to each spraying point based on a penetration test.

[0043] Among them, based on the penetration test, the set spraying amount corresponding to each spraying point is determined, specifically including:

[0044] Step 1: obtain a first test circuit board, and set a test paper on the back of the first test circuit board, wherein the parameter specification of the first test circuit board is the same as the parameter specification of the circuit board, and the first test circuit board includes multiple first test spraying points.

[0045] Step 2: spraying flux to each first test spraying point with a first preset spraying amount corresponding to each first test spraying point.

[0046] Step three, based on the flux marks formed on the test paper, determine whether the first preset spraying amount corresponding to each first test spraying point meets the welding process requirements.

[0047] When the first preset spray amount corresponding to each first test spray point meets the welding process requirements, reduce the first preset spray amount corresponding to each first test spray point, and repeat steps one to three until the first preset spray amount corresponding to each first test spray point does not meet the welding process requirements.

[0048] The first preset spraying amount corresponding to each first test spraying point does not meet the welding process requirements. The first preset spraying amount corresponding to each first test spraying point adopted in the previous test process is used as the first minimum spraying amount corresponding to each first test spraying point.

[0049] Based on the first minimum spraying amount corresponding to each first test spraying point, a set spraying amount corresponding to each spraying point is determined.

[0050] It should be noted that the theoretical basis of the penetration test is that the spraying point on the circuit board is provided with a through hole for inserting electronic components. In the process of spraying flux to the spraying point, the flux will pass through the through hole and stain the test paper, thereby forming a flux mark on the test paper. Furthermore, based on the flux mark formed on the test paper, it can be determined whether the amount of flux sprayed meets the welding process requirements.

[0051] For example, when the diameter of the flux mark is 2 to 4 mm, the amount of flux sprayed meets the welding process requirements. When the diameter of the flux mark is less than 1 mm, the amount of flux sprayed is too little, and the solder joint is prone to quality problems. When the diameter of the flux mark is greater than 5 mm, the amount of flux sprayed is too much, and the amount of flux waste is large. Therefore, based on the diameter of the flux mark, it can be determined that the amount of flux sprayed meets the welding process requirements.

[0052] For example, during the first penetration test of the first test circuit board, the first preset spraying amount corresponding to each first test spraying point can be set according to the upper limit of the flux spraying experience value. Then, after the flux is sprayed to each spraying point of the first test circuit board according to the first preset spraying amount corresponding to each first test spraying point set for the first time, each flux mark on the test paper can be observed. For example, by observing the outer contour size and shape of the flux mark, it is determined whether the flux spraying amount meets the welding process requirements.

[0053] Furthermore, when the first preset spraying amount corresponding to each first test spraying point set for the first time meets the welding process requirements, a second penetration test can be performed on the first test circuit board. It should be noted that the first test circuit board used in the second penetration test can be the first test circuit board used in the first penetration test after cleaning; or, it can be a new first test circuit board.

[0054] During the second penetration test of the first test circuit board, the amount is reduced based on the first preset spraying amount corresponding to each first test spraying point set for the first time. For example, the first preset spraying amount corresponding to each first test spraying point set for the first time includes: 2 ml for the first spraying point; 2 ml for the second spraying point; 2.5 ml for the third spraying point; ... Then, based on the first preset spraying amount corresponding to each first test spraying point set for the first time, after the amount is reduced, the first preset spraying amount corresponding to each first test spraying point set for the second time includes: 1.9 ml for the first spraying point; 1.9 ml for the second spraying point; 2.35 ml for the third spraying point; ...

[0055] In this way, when it is determined that the first preset spray amount corresponding to each first test spray point meets the welding process requirements based on the flux marks formed on the test paper, the next penetration test is performed until the first preset spray amount corresponding to each first test spray point does not meet the welding process requirements.

[0056] For example, in the previous penetration test in which the first preset spraying amount corresponding to each first test spraying point does not meet the welding process requirements, the first preset spraying amount corresponding to each first test spraying point includes: 1.1 ml for the first spraying point; 1.1 ml for the second spraying point; 1.35 ml for the third spraying point; ... Then, the first preset spraying amount corresponding to each first test spraying point set in the previous penetration test is used as the first minimum spraying amount corresponding to each first test spraying point. That is, the first spraying point is 1.1 ml; the second spraying point is 1.1 ml; the third spraying point is 1.35 ml; ...; as the first minimum spraying amount corresponding to each first test spraying point.

[0057] Furthermore, based on the first minimum spraying amount corresponding to each first test spraying point, the set spraying amount corresponding to each spraying point is determined.

[0058] In some embodiments, determining a set spraying amount corresponding to each spraying point based on a first minimum spraying amount corresponding to each first test spraying point includes:

[0059] Step 4: Obtain a second test circuit board, wherein the parameter specifications of the second test circuit board are the same as the parameter specifications of the circuit board, and the second test circuit board includes a plurality of second test spraying points.

[0060] Step 5: spraying flux to each second test spraying point with a second preset spraying amount corresponding to each second test spraying point.

[0061] Step six, performing a patch process on the second test circuit board, and performing solder joint detection on the second test circuit board after the patch process to determine whether the quality of each solder joint of the second test circuit board is qualified.

[0062] When the quality of each solder joint of the second test circuit board is qualified, the second preset spraying amount corresponding to each second test spraying point is reduced, and steps 4 to 6 are repeated until the quality of each solder joint of the second test circuit board is unqualified.

[0063] If the quality of each solder joint of the second test circuit board is unqualified, the second preset spraying amount corresponding to each second test spraying point adopted in the previous test process is used as the second minimum spraying amount corresponding to each second test spraying point.

[0064] Based on the second minimum spraying amount corresponding to each second test spraying point, a set spraying amount corresponding to each spraying point is determined.

[0065] Exemplarily, during the first patch test of the second test circuit board, the second preset spraying amount corresponding to each second test spraying point can be set based on the first minimum spraying amount corresponding to each first test spraying point. Furthermore, after spraying flux to each spraying point of the second test circuit board according to the second preset spraying amount corresponding to each second test spraying point set for the first time, the second test circuit board can be subjected to a patch test, so that the quality of each solder joint can be detected to see whether it is qualified. It should be noted that the patch process can be performed by a patch device. As for how to use the patch device to perform the patch process on the circuit board, you can refer to the relevant technology, which will not be described in detail here. In addition, the quality inspection of the solder joints can refer to the corresponding test standards, and the detection method for quality inspection of the solder joints will not be described in detail here.

[0066] Further, when the second preset spraying amount corresponding to each second test spraying point is set for the first time, so that the quality of each solder joint of the second test circuit board is qualified, the second test circuit board can be subjected to a second patch test. It should be noted that the second test circuit board used in the second patch test can be a new second test circuit board.

[0067] During the second patch test of the second test circuit board, the amount is reduced based on the second preset spraying amount corresponding to each second test spraying point set for the first time. For example, the second preset spraying amount corresponding to each second test spraying point set for the first time includes: 1.1 ml for the first spraying point; 1.1 ml for the second spraying point; 1.35 ml for the third spraying point; ... Then, based on the second preset spraying amount corresponding to each second test spraying point set for the first time, after the amount is reduced, the second preset spraying amount corresponding to each second test spraying point set for the second time includes: 1.05 ml for the first spraying point; 1.05 ml for the second spraying point; 1.28 ml for the third spraying point; ...

[0068] In this way, after determining the second preset spraying amount corresponding to each second test spraying point based on the patch experiment so that the quality of each solder joint of the second test circuit board is qualified, the next patch experiment is carried out until the second preset spraying amount corresponding to each second test spraying point makes the quality of each solder joint of the second test circuit board unqualified.

[0069] For example, in the previous patch test in which the second preset spraying amount corresponding to each second test spraying point makes the quality of each solder joint of the second test circuit board unqualified, the second preset spraying amount corresponding to each second test spraying point includes: 1 ml for the first spraying point; 1 ml for the second spraying point; 1.2 ml for the third spraying point; ... Then, the second preset spraying amount corresponding to each second test spraying point set in the previous patch test is used as the second minimum spraying amount corresponding to each second test spraying point. That is, the first spraying point is 1 ml; the second spraying point is 1 ml; the third spraying point is 1.2 ml; ...; as the second minimum spraying amount corresponding to each second test spraying point.

[0070] Further, based on the second minimum spraying amount corresponding to each second test spraying point, the set spraying amount corresponding to each spraying point is determined. For example, the set spraying amount corresponding to each spraying point is: 1 ml for the first spraying point; 1 ml for the second spraying point; 1.2 ml for the third spraying point; ...

[0071] It should be noted that by adopting the penetration test in combination with the patch test, the set spraying amount corresponding to each spraying point can be determined more conveniently. Among them, the penetration test does not require the patch process, so the test time can be shortened and the test cost can be saved; and the first minimum spraying amount corresponding to each first test spraying point can be preliminarily determined more quickly.

[0072] Furthermore, based on the first minimum spraying amount corresponding to each first test spraying point, the second minimum spraying amount corresponding to each second test spraying point can be more accurately determined by patch testing. Thus, the set spraying amount corresponding to each spraying point can be determined based on the second minimum spraying amount corresponding to each second test spraying point.

[0073] In this way, the set spraying amount corresponding to each spraying point is more accurate, thereby effectively avoiding the waste of flux, thereby achieving the effect of reducing flux consumption and improving the environmental protection of the flux spraying machine.

[0074] In some embodiments, based on the flux marks formed on the test paper, determining whether the first preset spray amount corresponding to each first test spray point meets the welding process requirements includes: analyzing the flux marks formed on the test paper based on image recognition, and determining whether the first preset spray amount corresponding to each first test spray point meets the welding process requirements.

[0075] In some embodiments, the solder flux marks formed on the test paper are analyzed based on image recognition, including: obtaining outer contour parameters of the solder flux marks formed on the test paper based on image recognition.

[0076] Exemplarily, the outer contour parameters of the flux mark include the size of the outer contour of the flux mark and the smoothness of the outer contour curve. It is understandable that if there are many "burrs" on the outer contour of the flux mark, it means that the quality of the flux spraying is not good. It should be noted that on the circuit board, the perforations set at the spraying point are round holes. If the outer contour curve of the flux mark is smoother and the size matches the empirical value, it can be considered that the flux spraying amount meets the process requirements.

[0077] It should also be noted that since a circuit board may have dozens or hundreds of spray points, dozens or hundreds of spray points will be formed on the test paper. If the operator manually detects the flux marks, there is a problem of high labor intensity for the operator. Therefore, the outer contour parameters of the flux marks formed on the test paper can be obtained based on image recognition, so as to determine whether the obtained outer contour parameters are consistent with the outer contour parameters of the flux marks that meet the process requirements. In this way, it can be determined whether the flux spraying amount meets the process requirements.

[0078] In some embodiments, the control method of the flux sprayer further includes: determining the flux consumption by using a flow controller; and determining the remaining flux in the flux tank based on the flux consumption. In some embodiments, the control method of the flux sprayer further includes: replacing the flux tank when the remaining flux is less than a preset value.

[0079] For example, when the remaining amount of flux in the flux tank is insufficient, the human-machine interaction system of the flux sprayer can issue a prompt message to remind the operator to manually replace the flux tank. Alternatively, the flux sprayer includes a plurality of flux tanks, each of which is connected to the nozzle through an electric control valve. Thus, the flux tank can be automatically replaced by controlling the opening and closing of the electric control valve.

[0080] In some embodiments, the control method of the flux sprayer further comprises: determining whether the nozzle is blocked, and cleaning the nozzle if the nozzle is blocked. In some embodiments, the flux sprayer further comprises a nozzle cleaning device; the nozzle cleaning device comprises a cleaning agent ejector and a compressed gas ejector.

[0081] Exemplarily, whether the nozzle is clogged can be determined based on the actual supply amount of the flow controller and the set spraying amount stored in the flux sprayer. For example, in the case of a clogged nozzle, the nozzle can be controlled to move to a position relative to the nozzle cleaning device. Thus, the cleaning agent ejector can spray cleaning agents such as alcohol to the nozzle. After the cleaning agent ejector ejects a fixed amount of cleaning agent to the nozzle, the compressed gas ejector can eject compressed gas to the nozzle, thereby blowing away the residual cleaning agent on the nozzle.

[0082] In some embodiments, the control method of the flux sprayer further includes: acquiring equipment data, where "equipment" refers to "flux sprayer". Exemplarily, the equipment data includes: nozzle movement speed, flux flow rate, nozzle spray speed, spraying time, number of spraying points, circuit board conveying speed, flux tank pressure, equipment maintenance cycle and other parameters.

[0083] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device.

[0084] Although the embodiments of the present application have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the embodiments of the present application, and the scope of the embodiments of the present application is defined by the appended claims and their equivalents.

Claims

1. A control method for a flux spraying machine, characterized in that: The soldering flux sprayer comprises a soldering flux tank, a pipeline, a nozzle and a flow controller; the soldering flux tank is connected to the nozzle via the pipeline, and the flow controller is arranged on the pipeline; The control method of the flux spraying machine comprises: Acquire circuit board data, wherein the circuit board data includes position parameters of each spraying point on the circuit board and a set spraying amount corresponding to each spraying point; Based on the position parameters of each spraying point, the nozzle is driven to move to a position relative to each spraying point, and based on the set spraying amount corresponding to the current spraying point, the flow controller is used to adjust the amount of flux supplied to the nozzle, so that the actual spraying amount of the flux sprayed by the nozzle to the current spraying point matches the set spraying amount of the current spraying point.

2. The control method of the flux spraying machine according to claim 1, characterized in that: The control method of the flux spraying machine further includes: determining the set spraying amount corresponding to each of the spraying points based on a penetration test.

3. The control method of the flux spraying machine according to claim 2, characterized in that: The step of determining the set spraying amount corresponding to each of the spraying points based on the penetration test includes: Step 1, obtaining a first test circuit board, and setting a test paper on the back of the first test circuit board, wherein the parameter specification of the first test circuit board is the same as the parameter specification of the circuit board, and the first test circuit board includes a plurality of first test spray points; Step 2, spraying flux to each of the first test spraying points with a first preset spraying amount corresponding to each of the first test spraying points; Step three, based on the flux marks formed on the test paper, determining whether the first preset spraying amount corresponding to each of the first test spraying points meets the welding process requirements; When the first preset spraying amount corresponding to each of the first test spraying points meets the welding process requirements, the first preset spraying amount corresponding to each of the first test spraying points is reduced, and steps 1 to 3 are repeatedly performed until the first preset spraying amount corresponding to each of the first test spraying points does not meet the welding process requirements; The first preset spraying amount corresponding to each of the first test spraying points does not meet the welding process requirements, and the first preset spraying amount corresponding to each of the first test spraying points used in the previous test process is used as the first minimum spraying amount corresponding to each of the first test spraying points; The set spraying amount corresponding to each of the spraying points is determined based on the first minimum spraying amount corresponding to each of the first test spraying points.

4. The control method of the flux spraying machine according to claim 3, characterized in that: The step of determining the set spraying amount corresponding to each of the spraying points based on the first minimum spraying amount corresponding to each of the first test spraying points includes: Step 4, obtaining a second test circuit board, wherein the parameter specifications of the second test circuit board are the same as the parameter specifications of the circuit board, and the second test circuit board includes a plurality of second test spraying points; Step 5, spraying flux to each of the second test spraying points with a second preset spraying amount corresponding to each of the second test spraying points; Step 6, performing a patch process on the second test circuit board, and performing solder joint detection on the second test circuit board after the patch process, to determine whether the quality of each solder joint of the second test circuit board is qualified; When the quality of each solder joint of the second test circuit board is qualified, reducing the second preset spraying amount corresponding to each second test spraying point, and repeatedly performing step 4 to step 6 until the quality of each solder joint of the second test circuit board is unqualified; If the quality of each solder joint of the second test circuit board is unqualified, the second preset spraying amount corresponding to each second test spraying point adopted in the previous test process is used as the second minimum spraying amount corresponding to each second test spraying point; The set spraying amount corresponding to each of the spraying points is determined based on the second minimum spraying amount corresponding to each of the second test spraying points.

5. The control method of the flux spraying machine according to claim 3, characterized in that: The determining, based on the flux marks formed on the test paper, whether the first preset spraying amount corresponding to each of the first test spraying points meets the welding process requirements includes: Based on the image recognition method, the flux marks formed on the test paper are analyzed to determine whether the first preset spraying amount corresponding to each first test spraying point meets the welding process requirements.

6. The control method of the flux spraying machine according to claim 5, characterized in that: The method of analyzing the solder flux marks formed on the test paper based on image recognition includes: Based on the image recognition method, the outer contour parameters of the soldering flux marks formed on the test paper are obtained.

7. The control method of the flux spraying machine according to claim 1, characterized in that: The control method of the flux spraying machine also includes: Determining flux consumption using the flow controller; Based on the flux consumption, the remaining amount of flux in the flux tank is determined.

8. The control method of the flux spraying machine according to claim 7, characterized in that: The control method of the soldering flux sprayer further includes: when the remaining amount of the soldering flux is less than a preset value, replacing the soldering flux tank.

9. The control method of the flux spraying machine according to claim 1, characterized in that: The control method of the soldering flux spraying machine further includes: determining whether the nozzle is clogged; and cleaning the nozzle if the nozzle is clogged.

10. The control method of the flux spraying machine according to claim 9, characterized in that: The soldering flux spraying machine also includes a nozzle cleaning device; the nozzle cleaning device includes: a cleaning agent ejector and a compressed gas ejector.

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