Production process suitable for 0.01mm ultra-thin single-sided adhesive tape

Abstract

The present application relates to a kind of production process suitable for 0.01mm ultra-thin single-sided tape, produced by high-speed rotary die-cutting machine, by splitting the first die-cutting process into three die-cutting processes, and removing the transition release film in two intervals, although more in the process, but still can maintain high overall production efficiency, by the transition protection film breaking line method and step-by-step waste removal method, on the one hand, ultra-thin double-sided tape can be directly compounded with product release film without transfer, on the other hand, it can also avoid forming knife mark on the finished product release film strip, thereby avoiding the situation of glue leakage into the knife mark during long-term storage, so that the ultra-thin single-sided tape product can be more easily peeled off during subsequent use, and finally the yield of normal use of the product is increased to more than 96%, greatly reducing the waste during use and saving cost.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of precision die-cutting assembly production, in particular to a production process suitable for 0.01mm ultra-thin single-sided adhesive tape. BACKGROUND

[0002] With the development of the electronic product industry, the precision requirement of spare parts products is getting higher and higher. In some high-precision products, 0.01mm thickness level ultra-thin single-sided adhesive assembly needs to be used, which only has a single-sided adhesive layer and a release film layer. They are small in thickness and specification. In the existing production process, an isolation paper is often used for winding after one-time die cutting and waste removal. Although the process is simple, the product itself is not easy to transfer due to its small thickness, and the release film tape will inevitably have knife marks after one-time die cutting. With the extension of storage time after winding, the glue on the single-sided adhesive tape is easy to penetrate into the knife marks, so that the single-sided adhesive block is not easy to peel off, which makes the defective rate of the product reach 60% in subsequent use, causing great waste of materials and cost. SUMMARY

[0003] The purpose of the present application is to overcome the above-mentioned shortcomings of the prior art and provide a production process suitable for 0.01mm ultra-thin single-sided adhesive tape.

[0004] The technical solution adopted by the present application is: a production process suitable for 0.01mm ultra-thin single-sided adhesive tape, including a release film tape and an ultra-thin single-sided adhesive block arranged on the release film tape. The production process uses a high-speed rotary die-cutting machine to produce, takes the running direction of the release film tape as the main tape running direction, and the release surface of the release film tape faces upward. The production process includes the following steps:

[0005] Step a, on the upper front of the release film ribbon, the first bottom supporting film ribbon, the first protective film ribbon containing the self-adhesive film are sequentially compounded in the opposite direction of the main ribbon running direction and from bottom to top, and the first round knife die roller group is used for first die cutting, the first die cutting cuts the first protective film ribbon into several thin strip first protective film ribbons along the length direction of the ribbon; then the self-adhesive film of the first protective film ribbon is removed, and then the upper thin single-sided adhesive tape ribbon and the first transition release film ribbon are sequentially compounded, the adhesive surface of the thin single-sided adhesive tape ribbon faces upward, at this time, the compounded ribbon is sequentially from bottom to top: the first bottom supporting film ribbon, the several thin strip first protective film ribbons arranged adjacent to each other along the length direction of the ribbon, the thin single-sided adhesive tape ribbon, and the first transition release film ribbon; the second round knife die roller group is used for second die cutting on the compounded ribbon, the second die cutting cuts and forms the thin single-sided adhesive tape block, the thin single-sided adhesive tape block is arranged in several rows along the length direction of the ribbon, and it is ensured that each row of thin single-sided adhesive tape blocks has a straight die cutting line below, that is, each row of thin single-sided adhesive tape blocks has two thin strip first protective film ribbons supporting below; then the first transition release film ribbon waste, the thin single-sided adhesive tape ribbon waste outside the thin single-sided adhesive tape block, and the first transition release film waste in the thin single-sided adhesive tape block area are removed, and the ribbon is turned over by the turnover roller to be compounded with the release film ribbon below;

[0006] At this time, the main ribbon is sequentially from bottom to top: the release film ribbon with the release surface upward, the thin single-sided adhesive tape block with the adhesive surface downward, the several thin strip first protective film ribbons completely covering the thin single-sided adhesive tape block, and the first bottom supporting film ribbon;

[0007] Step b, after the main ribbon runs out of the front of the first round knife die roller group, the waste is removed from above twice, the first time, the first bottom supporting film ribbon and part of the thin strip first protective film ribbon are removed, and it is ensured that there is still a thin strip first protective film ribbon compounded on each row of thin single-sided adhesive tape blocks; after an interval of one roller position, the remaining thin strip first protective film ribbon is removed; at this time, the main ribbon is sequentially from bottom to top: the release film ribbon with the release surface upward, and the thin single-sided adhesive tape block with the adhesive surface downward;

[0008] Step c: the second bottom supporting film ribbon is compounded below the release film ribbon, and then the third round knife die roller group is used for third die cutting, the third die cutting forms the profile lines on both sides of the release film ribbon and a row of positioning holes; then the second bottom supporting film ribbon and the hole waste in the positioning hole are removed, and the waste on both sides of the release film ribbon is removed; finally, the release paper ribbon is compounded below the release film ribbon, and the finished product is obtained after winding.

[0009] In step a, after the first die cutting, the self-adhesive film of the first protective film ribbon is removed, and before the thin single-sided adhesive tape ribbon is compounded, the first surface static electricity removal treatment is performed on the thin strip first protective film ribbon;

[0010] In step b, the second surface static electricity removal treatment is performed on the material belt before winding after the third die cutting removes the upper and lower layer waste materials.

[0011] In step a, the first circular knife die cutting roller group is provided with a plurality of first cutting edges capable of cutting parallel straight lines on the die, and the depth of the first cutting edges is just enough to cut through the first protective film material belt.

[0012] In step a, the second circular knife die cutting roller group is provided with a plurality of second cutting edges capable of cutting the closed contour line of the ultra-thin single-sided adhesive material block, and the depth of the second cutting edges is just enough to cut through the ultra-thin single-sided adhesive material belt.

[0013] In step c, the third circular knife die cutting roller group is provided with two third cutting edges capable of cutting the contour lines of the release film material belt on both sides and a positioning hole cutting edge capable of cutting a row of closed positioning hole contour lines on one side edge of the release film material belt, and the depth of the third cutting edges and the positioning hole cutting edge is just enough to cut through the release film material belt.

[0014] The process of the present application divides the first die cutting process into three die cutting processes and removes the transition release film twice with an interval, which increases the process, but uses high-speed rotary die cutting process, and still maintains high overall production efficiency. The transition protective film breaking line method and the step-by-step waste removal method can directly composite the ultra-thin double-sided adhesive with the product release film without transfer, and can avoid forming knife marks on the finished product release film, thereby avoiding the situation of glue leakage into the knife marks during long-term storage, making the ultra-thin single-sided adhesive product more convenient to peel during subsequent use, and finally increasing the normal use yield of the product to more than 96%, greatly reducing the waste during use and saving costs. BRIEF DESCRIPTION OF DRAWINGS

[0015] Figure 1 is a structural schematic diagram of an embodiment of the ultra-thin single-sided adhesive assembly of the present application.

[0016] Figure 2is a product single product decomposition structure schematic diagram of the embodiment of the present application;

[0017] Figure 3 is a process flow schematic diagram of the present application process;

[0018] Figure 4-1 、 Figure 4-2 、 Figure 4-3 is the die cutting effect schematic diagram of the first circular knife die cutting roller group, the second circular knife die cutting roller group and the third circular knife die cutting roller group respectively in the present application.

[0019] Figure 4-4 is Figure 4-1 、 Figure 4-2 、 Figure 4-3 the die cutting effect after superimposition of the schematic diagram. DETAILED DESCRIPTION

[0020] As shown in Figure 1 、 Figure 2 , the present application is a kind of production process suitable for 0.01mm ultra-thin single-sided tape, ultra-thin single-sided tape includes release film strip L1 and arrange in release film strip L1 on ultra-thin single-sided adhesive block 1;

[0021] Combined with Figure 3 、 Figures 4-1 to 4-4 , the production process uses high-speed rotary die cutting machine production, with the running direction of release film strip 1 as the main material strip running direction, the release surface of release film strip L1 upward, the production process includes the following steps:

[0022] Step a, on the upper front of the release film ribbon L1, the first bottom supporting film ribbon T1, the first protective film ribbon B1 containing the self-adhesive film are sequentially compounded in the opposite direction of the main ribbon running direction and from bottom to top, and the first round knife die roller set M1 is used for first die cutting. A plurality of first cutting edges R101 capable of cutting parallel straight line die cutting lines M101 are arranged on the die of the first round knife die roller set M1. The depth of the first cutting edge R101 is just enough to cut through the first protective film ribbon B1, that is, the first die cutting divides the first protective film ribbon B1 into a plurality of thin strip first protective film ribbons B11 along the length direction of the ribbon. Then, the self-adhesive film B12 of the first protective film ribbon B1 is removed by the first waste roller P1, and then the upper ultra-thin single-sided adhesive tape D1 (the self-adhesive film D11 thereof is peeled off by the second waste roller P2) and the first transition release film ribbon G1 are sequentially compounded. The adhesive surface of the ultra-thin single-sided adhesive tape D1 faces upwards. At this time, the compound ribbon is sequentially from bottom to top: the first bottom supporting film ribbon T1, a plurality of thin strip first protective film ribbons B11 arranged adjacent to each other along the length direction of the ribbon, the ultra-thin single-sided adhesive tape D1, and the first transition release film ribbon G1. The second round knife die roller set M2 is used for second die cutting of the compound ribbon. A plurality of second cutting edges R201 capable of cutting the closed contour line M201 of the ultra-thin single-sided adhesive block 1 are arranged on the die of the second round knife die roller set M2. The depth of the second cutting edge R201 is just enough to cut through the ultra-thin single-sided adhesive tape D1, that is, the second die cutting cuts and forms the ultra-thin single-sided adhesive block 1 from the first transition release film ribbon G1 and the ultra-thin single-sided adhesive tape D1. The ultra-thin single-sided adhesive block 1 is arranged in a plurality of rows along the length direction of the ribbon, and each row of ultra-thin single-sided adhesive blocks has a straight line die cutting line M101 generated by the first die cutting below, that is, each row of ultra-thin single-sided adhesive blocks has two thin strip first protective film ribbons B11 supporting below. Then, the first waste adhesive tape P31 and the third waste roller P3 are used to remove the ultra-thin single-sided adhesive tape waste D12 and the first transition release film waste in the area of the ultra-thin single-sided adhesive block in addition to the first transition release film ribbon waste, the ultra-thin single-sided adhesive block, and the release film ribbon L1 is compounded by the turnover roller Z1.

[0023] At this time, the main ribbon is sequentially from bottom to top: the release film ribbon L1 with the release surface facing upwards, the ultra-thin single-sided adhesive block 1 with the adhesive surface facing downwards, a plurality of thin strip first protective film ribbons B11 completely covering the ultra-thin single-sided adhesive block 1, and the first bottom supporting film ribbon T1.

[0024] Step b, after the main ribbon runs out of the front of the first round knife die roller set M1, the waste is removed from above twice. As shown in Figure 4-4 , the first time, the fourth waste roller P4 is used to remove the first bottom supporting film ribbon T1 and part of the thin strip first protective film ribbon B11, and ensure that there is still a thin strip first protective film ribbon compounded on each row of ultra-thin single-sided adhesive blocks. In this embodiment, a part of the thin strip first protective film ribbon is first removed at intervals, that is,Figure 4-4 The first thin strip protection film strip B11 in the strip-shaped area shown in the middle 1, 3, 5; after another interval of the roller position, the remaining thin strip first protection film strip is removed by the fifth row of waste rollers P5, that is Figure 4-4 The first thin strip protection film strip B11 in the strip-shaped area shown in the middle 2, 4, 6; at this time, the main strip is sequentially from bottom to top: the release film strip L1 with the release surface upward, the ultra-thin single-sided adhesive block 1 with the adhesive surface downward;

[0025] Step c: compound the second bottom supporting film strip T2 under the release film strip, and then perform the third die cutting by the third circular knife die cutting roller group M3, the knife die of the third circular knife die cutting roller group M3 is provided with two third knife edges R301 capable of die cutting the profile lines M301 of the two sides of the release film strip and positioning hole edges R302 capable of die cutting a row of closed positioning hole profile lines M302 on one side edge of the release film strip L1, the depth of the third knife edges R301 and the positioning hole edges R302 is just enough to cut through the release film strip L1; that is, the profile lines of the two sides of the release film strip L1 and a row of positioning holes L101 are formed by the third die cutting; then the second bottom supporting film strip T2 and the positioning hole inner hole waste are removed by the sixth row of waste rollers P6 below, and the waste L11 of the two sides of the release film strip is removed by the seventh row of waste rollers P7 above; the positioning hole edges are provided with a thimble to remove the positioning hole inner hole waste L12 together with the second bottom supporting film strip T2; finally, the finished product is obtained after the release paper strip L2 is compounded below the release film strip and is wound.

[0026] Further, in step a, after removing the self-film B12 of the first protection film strip B1 after the first die cutting and before compounding the ultra-thin single-sided adhesive strip D1, the first surface electrostatic removal treatment C1 is performed on the thin strip first protection film strip B11 (for example, by placing an electrostatic eliminator to remove static electricity); in step b, after removing the upper and lower layer waste after the third die cutting and before winding, the second surface electrostatic removal treatment C2 is performed on the strip. The surface electrostatic removal treatment can remove static electricity on the strip, avoid high-voltage discharge damage to the material, and avoid static adsorption of dust, so as to ensure the product quality.

[0027] By adopting the process of the present application, although the process is more, but high-speed rotary die cutting process is adopted, but the overall production efficiency can still be maintained, by the transition protection film breaking line method and the step-by-step waste removal method, on the one hand, the ultra-thin double-sided adhesive can be directly compounded with the product release film without being turned and pasted, on the other hand, the knife mark can be avoided on the finished product release film strip, so that the glue leakage into the knife mark during long-term storage is avoided, the ultra-thin single-sided adhesive product can be more conveniently peeled off during subsequent use, and finally the yield of the product normally used is increased to 96% or more, the waste during use is greatly reduced, and the cost is saved.

[0028] The above embodiments are merely exemplary embodiments adopted for illustrating the principles of the present application, and the present application is not limited thereto. Various modifications and improvements can be made by those of ordinary skill in the art without departing from the spirit and essential characteristics of the present application, and such modifications and improvements are also considered to be within the scope of the present application.

Claims

1. A production process for 0.01 mm ultra-thin single-sided adhesive tape, comprising a release film strip and ultra-thin single-sided adhesive blocks arranged on the release film strip, the production process using a high-speed rotary die-cutting machine, characterized by: The production process includes the following steps: Step a, in front of the upper portion of the release film strip, in the opposite direction to the running direction of the main strip and from bottom to top, the first supporting film strip and the first protective film strip containing the self-contained film are compounded in sequence and die-cut for the first time through the first circular knife die-cutting roller group. The first die-cutting cuts the first protective film strip into a plurality of thin strips of the first protective film strip along the length direction of the strip; then the self-contained film of the first protective film strip is removed, and then the ultra-thin single-sided adhesive tape and the first transition release film strip are compounded in sequence, with the adhesive surface of the ultra-thin single-sided adhesive tape facing upward. At this time, the composite tape is, from bottom to top, the first supporting film strip, a plurality of thin strips of the first protective film strip arranged adjacent to each other along the length direction of the strip, the ultra-thin single-sided adhesive tape, the first transition release film strip film material strip; then the composite material strip is die-cut for the second time by the second circular knife die-cutting roller group, and the second die-cutting cuts the first transition release film material strip and the ultra-thin single-sided adhesive material strip and forms ultra-thin single-sided adhesive material blocks, and the ultra-thin single-sided adhesive material blocks are arranged in several rows along the length direction of the material strip, and ensure that there is a straight die-cutting line generated by the first die-cutting below each row of ultra-thin single-sided adhesive material blocks, that is, each row of ultra-thin single-sided adhesive material blocks is supported by two thin strips of the first protective film material strip; then the waste of the first transition release film material strip, the waste of the ultra-thin single-sided adhesive material strip outside the ultra-thin single-sided adhesive material block, and the waste of the first transition release film in the ultra-thin single-sided adhesive material block area are removed, and then the material strip is flipped by the flip roller to be compounded with the release film material strip below; At this time, the main material strips are, from bottom to top, the release film strip with the release surface facing upward, the ultra-thin single-sided adhesive block with the adhesive surface facing downward, several thin strips of the first protective film strip that completely cover the ultra-thin single-sided adhesive block, and the first bottom film strip; Step b: After the main material strip runs out of the front of the first circular die-cutting roller group, waste is removed from the top in two steps. The first step is to remove the first base film strip and part of the thin strip of the first protective film strip, and ensure that there is still a thin strip of the first protective film strip laminated on each row of ultra-thin single-sided adhesive blocks; after a roller position, the remaining thin strip of the first protective film strip is removed; at this time, the main material strip is composed of: release film strip with the release surface facing up, and ultra-thin single-sided adhesive blocks with the adhesive surface facing down from bottom to top; Step c: Compound a second bottom film strip under the release film strip, and then perform a third die-cutting through a third circular die-cutting roller group, the third die-cutting forming the contour lines on both sides of the release film strip and a row of positioning holes; then remove the waste in the second bottom film strip and the positioning holes, and remove the waste on both sides of the release film strip; finally, compound a release paper strip under the release film strip and reel it up to obtain the finished product.

2. The production process for 0.01 mm ultra-thin single-sided adhesive tape according to claim 1, characterized in that: In step a, after the first die-cutting to remove the self-film of the first protective film material strip and before laminating the ultra-thin single-sided adhesive material strip, the first surface static elimination treatment is performed on the thin strip of the first protective film material strip.

3. The production process for 0.01 mm ultra-thin single-sided adhesive tape according to claim 1, characterized in that: In step c, after the third die-cutting to remove the upper and lower layer waste materials and before winding, the material strip is subjected to a second surface anti-static treatment.

4. The production process for 0.01 mm ultra-thin single-sided adhesive tape according to claim 1, characterized in that: In step a, the die of the first circular die-cutting roller group is provided with a plurality of first blades that can die-cut parallel straight die-cutting lines, and the blade depth of the first blade is just enough to cut through the first protective film strip; the self-contained film of the first protective film strip is removed by the first row of waste rollers.

5. The production process for 0.01 mm ultra-thin single-sided adhesive tape according to claim 1 or 4, characterized in that: In step a, the cutting die of the second circular die-cutting roller group is provided with several groups of second blades that can die-cut the closed contour line of the ultra-thin single-sided adhesive block, and the blade depth of the second blade is just enough to cut through the ultra-thin single-sided adhesive tape; the waste of the first transition release film tape, the waste of the ultra-thin single-sided adhesive tape outside the ultra-thin single-sided adhesive block, and the waste of the first transition release film in the ultra-thin single-sided adhesive block area are removed by the waste tape and the third row of waste rollers; in step b, the first bottom film tape and part of the thin strips of the first protective film tape are removed by the fourth row of waste rollers, and it is ensured that there is still a thin strip of the first protective film tape compounded on each row of ultra-thin single-sided adhesive blocks; after another roller position is separated, the remaining thin strips of the first protective film tape are removed by the fifth row of waste rollers.

6. The production process for 0.01 mm ultra-thin single-sided adhesive tape according to claim 1 or 4, characterized in that: In step c, the cutting die of the third circular die-cutting roller group is provided with two third blades that can die-cut the contour lines of both sides of the release film material strip, and a positioning hole blade that can die-cut the contour lines of a row of closed positioning holes on the edge of one side of the release film material strip. The blade depths of the third blade and the positioning hole blade just cut through the release film material strip; then the second bottom film material strip and the waste in the positioning hole are removed by the sixth row of waste rollers below, and the waste on both sides of the release film material strip is removed by the seventh row of waste rollers above; a ejector pin is installed in the positioning hole blade to remove the waste in the positioning hole together with the second bottom film material strip.

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