Semiconductor wafer chemical nickel plating production line and working method thereof

Abstract

The invention discloses a semiconductor wafer chemical nickel plating production line and a working method thereof, and relates to the technical field of semiconductor wafer processing, the semiconductor wafer chemical nickel plating production line comprises an operation table, and one side of the operation table is fixedly connected with a rack. According to the invention, one end of the drainage pipe is communicated with the treatment box, wastewater can be fed into the treatment box through the water pump, the wastewater is mixed with an agent, and fusion of the agent and the wastewater can be accelerated through the stirring rod, so that rapid generation of precipitation is assisted, the wastewater is filtered by the filter plate, and interference of precipitation and impurities on use of the flat ultrafiltration membrane assembly can be reduced; the flat plate ultrafiltration membrane assembly is used for treating wastewater again, the wastewater treatment effect is improved, environmental pollution caused by direct discharge of the wastewater is avoided, nickel ions in the wastewater can be recycled conveniently, waste gas can be doubly filtered through the filter element and the filter screen, the waste gas can be subjected to spraying treatment through the spraying pipe, the content of harmful substances in the waste gas is reduced, and the waste gas treatment cost is reduced. The influence of the waste gas on the air quality is reduced.

Description

Technical Field

[0001] The invention relates to the technical field of semiconductor wafer processing, in particular to a semiconductor wafer chemical nickel plating production line and a working method thereof. Background Art

[0002] Chemical nickel plating on semiconductor wafers is a process of forming a nickel coating on the surface of semiconductor wafers. Nickel plating can improve the conductivity of the wafer and prevent corrosion. It is widely used in the processing of semiconductor wafers.

[0003] For example, Chinese patent CN118497757A discloses a semiconductor wafer chemical plating equipment and an operating method thereof, including a frame, on which are respectively provided a degreasing position, a micro-etching position, two zinc deposition positions, a zinc stripping position between the two zinc deposition positions, a chemical nickel plating position, a chemical palladium plating position, a chemical gold immersion position and a drying position, a QDR position is provided between each of the above-mentioned stations, and a loading position and a unloading position are provided at both ends of the frame, respectively. At the same time, a mechanical gripper of the equipment is also provided on the frame, and the mechanical gripper of the equipment is used to transfer workpieces between each station.

[0004] In the above patent, although the problem of low efficiency of manual loading and unloading of chemical plating equipment is solved by mechanical grippers and swing devices, a large amount of wastewater will be generated during the chemical nickel plating process, which contains harmful substances such as nickel ions, reducing agents, and chelating agents. If the wastewater is discharged directly without treatment, it will cause serious pollution to the environment. Summary of the invention

[0005] The purpose of the present invention is to provide a semiconductor wafer chemical nickel plating production line and a working method thereof, so as to solve the problem that a large amount of wastewater containing harmful substances such as nickel ions, reducing agents, and chelating agents will be generated during the chemical nickel plating process proposed in the above-mentioned background technology. If the wastewater is directly discharged without treatment, it will cause serious pollution to the environment.

[0006] To achieve the above-mentioned purpose, the present invention provides the following technical solutions: a semiconductor wafer chemical nickel plating production line, comprising an operating table, one side of the operating table is fixedly connected to a frame, one side of the frame is snap-connected with a protective plate, one side of the frame is provided with a wastewater treatment mechanism, the wastewater treatment mechanism comprises a treatment box, a servo motor and a connecting strip, one side of the inner wall of the treatment box is fixedly connected to a fixed plate, the top of the fixed plate is fixedly connected to the servo motor, one end of the output shaft of the servo motor passes through the fixed plate and is fixedly connected to a stirring rod, and one side of the fixed plate is fixedly connected to a filter plate, and one side of the filter plate is provided with a flat ultrafiltration Membrane assembly, the bottom of the flat ultrafiltration membrane assembly is snap-connected with the bottom of the inner cavity of the treatment box, a baffle is slidably connected inside the filter plate, the top of the baffle is fixedly connected to the connecting strip, the bottom of the connecting strip is fixedly connected to a hydraulic push rod, the bottom of the hydraulic push rod is fixedly connected to one side of the treatment box, and a drainage pipe is inserted through the inside of the treatment box, the bottom of the drainage pipe is fixedly connected to a water pump, the water inlet of the water pump is fixedly connected to a connecting pipe, one end of the connecting pipe passes through the frame and is fixedly connected to a water tank, the bottom of the water tank is snap-connected to an operating table, a processing tank is provided above the water tank, and one side of the processing tank is fixedly connected to the operating table.

[0007] Preferably, one side of the treatment box is fixedly connected to a sewage pipe, one side of the sewage pipe is provided with a scraper, and the bottom of the scraper is slidably connected to the bottom of the inner cavity of the treatment box.

[0008] Preferably, a cleaning plate is fixedly connected to one side of the scraper, a guide rod is inserted through the inside of the cleaning plate, one end of the guide rod is fixedly connected to the inner wall of the processing box, and the guide rod and the cleaning plate are slidably connected.

[0009] Preferably, one side of the cleaning plate is connected to a screw via a thread, one end of the screw is rotatably connected to the processing box, the other end of the screw is fixedly connected to the output shaft of servo motor 2, and one side of servo motor 2 is fixedly connected to the processing box.

[0010] Preferably, an air collecting hood is fixedly connected to the top of the frame, an exhaust fan is installed inside the air collecting hood, and the bottom of the exhaust fan passes through the top side wall of the frame.

[0011] Preferably, a purification mechanism is provided on one side of the wind collecting hood, and the purification mechanism includes a purification box, a guide pipe and an auxiliary tube. One side of the purification box is fixedly connected to the wind collecting hood, and a filter element and a filter screen are clamped on the inner wall of the purification box.

[0012] Preferably, the top of the purification box is fixedly connected to the guide pipe, one end of the guide pipe is fixedly connected to an axial flow fan, and the bottom of the axial flow fan is fixedly connected to an extension pipe.

[0013] Preferably, the bottom of the extension tube passes through the top side wall of the auxiliary tube, and one side of the auxiliary tube is fixedly connected to an exhaust pipe.

[0014] Preferably, a spray pipe is fixedly connected to the top of the inner cavity of the auxiliary tube, an atomizing nozzle is fixedly connected to the bottom of the spray pipe, and an infusion tube is fixedly connected to the top of the spray pipe, and the infusion tube passes through the top side wall of the auxiliary tube.

[0015] A working method of a semiconductor wafer chemical nickel plating production line comprises the following steps:

[0016] S1, fix the semiconductor wafer by a clamp above the processing tank, drive the wafer into different processing tanks by a driving structure above the processing tank, perform pre-cleaning and chemical nickel plating, and perform post-processing cleaning on the wafer after chemical nickel plating;

[0017] S2. During the nickel plating process of the wafer, the waste gas generated is collected by the wind collecting hood and sent to the purification box. After being processed by the filter screen and filter element inside the purification box, it enters the auxiliary cylinder and is discharged after being sprayed by the spray pipe.

[0018] S3. Wastewater generated during nickel plating and cleaning can be collected in a water tank, and sent to a treatment box by a water pump and a drainage pipe, where it is added with chemicals for precipitation. Then, the hydraulic push rod drives the connecting strip and the baffle plate to move upward, and the wastewater is filtered through the filter plate and enters the other side of the filter plate, and then is filtered and treated by the flat ultrafiltration membrane assembly. The treated liquid can be discharged through a pipe on one side of the treatment box;

[0019] S4. Use the cleaning plate to move along the lead screw, the cleaning plate scrapes one side of the filter plate, and the scraper scrapes the bottom of the inner cavity of the treatment box to reduce the accumulation of sediment and impurities at the bottom of the inner cavity of the treatment box and one side of the filter plate, and accelerate the discharge of sewage from the sewage pipe.

[0020] Compared with the prior art, the present invention has the following beneficial effects:

[0021] 1. In the present invention, both ends of the water pump are connected to the connecting pipe and the drainage pipe respectively, and one end of the drainage pipe is connected to the treatment box. The wastewater can be sent into the treatment box through the water pump to mix the wastewater with the reagent. The stirring rod can accelerate the fusion of the reagent and the wastewater, thereby assisting the rapid generation of precipitation. The filter plate filters the wastewater, which can reduce the interference of precipitation and impurities on the use of the flat ultrafiltration membrane assembly. The flat ultrafiltration membrane assembly is used to treat the wastewater again, thereby improving the treatment effect of the wastewater, reducing the content of harmful substances, avoiding the pollution to the environment caused by direct discharge of wastewater, and facilitating the recovery of nickel ions in the wastewater, thereby reducing resource waste.

[0022] 2. In the present invention, one end of the lead screw is connected to the second servo motor, and the cleaning plate is slidably connected to the guide rod. When the lead screw drives the cleaning plate to rotate, the cleaning plate slides along the guide rod, and the cleaning plate and the scraper scrape one side of the filter plate and the bottom of the inner cavity of the processing box respectively, thereby cleaning the processing cavity on the left side of the filter plate, accelerating the discharge of sedimentation and stains, and ensuring the normal use of the filter plate.

[0023] 3. In the present invention, one side of the exhaust fan is fixedly connected to the wind collecting hood, and the top of the wind collecting hood is connected to the purification box. The exhaust fan accelerates the flow of exhaust gas above the treatment tank, so that the gas passes through the wind collecting hood and enters the purification box for treatment. The filter element and the filter screen can double filter the exhaust gas, and the exhaust gas can be sprayed through the spray pipe to reduce the content of harmful substances in the exhaust gas, thereby reducing the impact of the exhaust gas on the air quality. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 This is a schematic diagram of the overall structure of a semiconductor wafer chemical nickel plating production line of the present invention;

[0025] Figure 2 This is a schematic diagram of the connection between the purification box and the guide tube structure of a semiconductor wafer chemical nickel plating production line of the present invention;

[0026] Figure 3 This is a schematic diagram of the installation structure of an axial flow fan for a semiconductor wafer chemical nickel plating production line according to the present invention;

[0027] Figure 4 This is a schematic diagram of the installation of a spray pipe structure of a semiconductor wafer chemical nickel plating production line according to the present invention;

[0028] Figure 5 It is a schematic diagram of the installation of a fixed plate structure of a semiconductor wafer chemical nickel plating production line of the present invention;

[0029] Figure 6 This is a schematic diagram of the installation of a stirring blade structure of a semiconductor wafer chemical nickel plating production line according to the present invention;

[0030] Figure 7 The present invention is a schematic diagram of the installation of a servo motor structure of a semiconductor wafer chemical nickel plating production line.

[0031] In the figure:

[0032] 1. Operation table; 2. Rack; 3. Protection plate; 4. Purification mechanism; 41. Purification box; 411. Filter element; 412. Filter screen; 42. Guide pipe; 421. Axial flow fan; 422. Extension pipe; 43. Auxiliary tube; 431. Exhaust pipe; 432. Spray pipe; 5. Wind hood; 51. Exhaust fan; 6. Wastewater treatment mechanism; 61. Treatment box; 611. Drain pipe; 62. Flat ultrafiltration membrane assembly; 63. Servo motor one; 64. Fixed plate; 65. Connecting strip; 651. Baffle; 66. Stirring rod; 67. Filter plate; 68. Hydraulic push rod; 69. Cleaning plate; 691. Screw; 692. Guide rod; 693. Scraper; 694. Servo motor two; 7. Water tank; 71. Connecting pipe; 72. Water pump; 73. Drainage pipe; 8. Treatment tank. DETAILED DESCRIPTION

[0033] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the implementation regulations described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0034] Example 1: Reference Figure 1-Figure 7 As shown: a semiconductor wafer chemical nickel plating production line, including an operating table 1, one side of the operating table 1 is fixedly connected to a frame 2, one side of the frame 2 is snap-connected with a protective plate 3, one side of the frame 2 is provided with a wastewater treatment mechanism 6, the wastewater treatment mechanism 6 includes a treatment box 61, a servo motor 63 and a connecting strip 65, one side of the inner wall of the treatment box 61 is fixedly connected to a fixed plate 64, the top of the fixed plate 64 is fixedly connected to the servo motor 63, one end of the output shaft of the servo motor 63 passes through the fixed plate 64 and is fixedly connected to a stirring rod 66, and one side of the fixed plate 64 is fixedly connected to a filter plate 67, one side of the filter plate 67 is provided with a flat ultrafiltration membrane assembly 62, and the flat ultrafiltration membrane assembly The bottom of the component 62 is snap-connected with the bottom of the inner cavity of the processing box 61, a baffle 651 is slidably connected inside the filter plate 67, the top of the baffle 651 is fixedly connected to the connecting strip 65, the bottom of the connecting strip 65 is fixedly connected to a hydraulic push rod 68, the bottom of the hydraulic push rod 68 is fixedly connected to one side of the processing box 61, and a drainage pipe 73 is inserted through the inside of the processing box 61, the bottom of the drainage pipe 73 is fixedly connected to a water pump 72, the water inlet of the water pump 72 is fixedly connected to a connecting pipe 71, one end of the connecting pipe 71 passes through the frame 2 and is fixedly connected to a water tank 7, the bottom of the water tank 7 is snap-connected with the operating table 1, a processing tank 8 is provided above the water tank 7, and one side of the processing tank 8 is fixedly connected to the operating table 1.

[0035] One side of the processing box 61 is fixedly connected to a sewage pipe 611, and one side of the sewage pipe 611 is provided with a scraper 693. The bottom of the scraper 693 is slidably connected to the bottom of the inner cavity of the processing box 61, and one side of the scraper 693 is fixedly connected to a cleaning plate 69, and a guide rod 692 is inserted through the inside of the cleaning plate 69, one end of the guide rod 692 is fixedly connected to the inner wall of the processing box 61, and the guide rod 692 is slidably connected to the cleaning plate 69, and one side of the cleaning plate 69 is connected to a lead screw 691 by a thread, one end of the lead screw 691 is rotatably connected to the processing box 61, and the other end of the lead screw 691 is fixedly connected to the output shaft of the servo motor 2 694, and one side of the servo motor 2 694 is fixedly connected to the processing box 61.

[0036] In this embodiment, the operating table 1 is used to support and reinforce one side of the rack 2 to ensure the stable installation and use of the rack 2. The protective plate 3 is used to shield one side of the rack 2 to prevent the escape of exhaust gas during wafer processing. The protective plate 3 is engaged with the rack 2. After the wafer processing is completed, the protective plate 3 rotates to quickly remove the wafer. The fixing plate 64 can support the bottom of the servo motor 63, and the servo motor 63 can drive the stirring rod 66 to rotate, thereby stirring the wastewater inside the processing box 61. , accelerate the fusion of wastewater and medicine, the treatment box 61 can support the installation of the hydraulic push rod 68, the hydraulic push rod 68 can drive the connection bar 65 to rise and fall, thereby changing the height of the baffle 651 inside the inner cavity of the filter plate 67, controlling the connection between the two sides of the filter plate 67, thereby preventing the wastewater from passing through the filter plate 67 when it is not precipitated, and the connection between the water tank 7 and the water pump 72 can be realized through the connecting pipe 71, which can guide the flow of wastewater, and the wastewater can be sent to the treatment box 61 through the drainage pipe 73 for centralized treatment;

[0037] At the same time, the sewage discharge can be assisted by the sewage pipe 611. The synchronous movement between the cleaning plate 69 and the scraper 693 can be achieved by the fixed connection between the scraper 693 and the cleaning plate 69. The guide rod 692 can be used to guide the movement of the cleaning plate 69 inside the treatment box 61, thereby improving the stability of the cleaning plate 69 during movement and ensuring the scraping effect of the cleaning plate 69 on one side of the filter plate 67. At the same time, the scraper 693 can scrape the bottom of the inner cavity of the treatment box 61 to reduce the adhesion of sediment on the bottom of the inner cavity of the treatment box 61, which is convenient for the subsequent rapid discharge of sediment. By scraping and cleaning one side of the filter plate 67, the sediment can be avoided from blocking one side of the filter plate 67, thereby ensuring the filtering effect of the filter plate 67 on wastewater.

[0038] Embodiment 2: According to Figure 1-Figure 4As shown, an air collecting hood 5 is fixedly connected to the top of the frame 2, an exhaust fan 51 is installed inside the air collecting hood 5, and the bottom of the exhaust fan 51 passes through the top side wall of the frame 2. A purification mechanism 4 is arranged on one side of the air collecting hood 5, and the purification mechanism 4 includes a purification box 41, a guide pipe 42 and an auxiliary tube 43. One side of the purification box 41 is fixedly connected to the air collecting hood 5, and a filter element 411 and a filter screen 412 are engaged with the inner wall of the purification box 41. The top of the purification box 41 is fixedly connected to the guide pipe 42, and an axial flow fan 421 is fixedly connected to one end of the guide pipe 42. An extension pipe 422 is fixedly connected to the bottom of the axial flow fan 421, and the bottom of the extension pipe 422 passes through the top side wall of the auxiliary tube 43. An exhaust pipe 431 is fixedly connected to one side of the auxiliary tube 43, and a spray pipe 432 is fixedly connected to the top of the inner cavity of the auxiliary tube 43. An atomizing nozzle is fixedly connected to the bottom of the spray pipe 432, and an infusion pipe is fixedly connected to the top of the spray pipe 432, and the infusion pipe passes through the top side wall of the auxiliary tube 43.

[0039] In this embodiment, the top of the wind hood 5 can be supported by the frame 2, and the frame 2 and the wind hood 5 are connected to facilitate the circulation of air. The exhaust fan 51 can accelerate the flow of gas into the wind hood 5 and then into the purification box 41. The filter element 411 and the filter screen 412 can improve the filtering and adsorption effect of the exhaust gas and realize the preliminary treatment of the exhaust gas. The flow of gas can be guided by the guide pipe 42, and the axial flow fan 421 can accelerate the flow of gas inside the guide pipe 42. The extension pipe 422 facilitates the gas to smoothly enter the auxiliary tube 43. The spray pipe 432 can realize the re-purification of the gas. The exhaust pipe 431 can assist the discharge of the gas, thereby balancing the air pressure inside the auxiliary tube 43. The treatment liquid is externally connected through the infusion tube to ensure a stable supply of the treatment liquid.

[0040] Embodiment 3: A working method of a semiconductor wafer chemical nickel plating production line, comprising the following steps:

[0041] Step 1: fix the semiconductor wafer by a fixture above the processing tank 8, drive the wafer into different processing tanks 8 by a driving structure above the processing tank 8, perform pre-cleaning and chemical nickel plating, and perform post-processing cleaning on the wafer after chemical nickel plating;

[0042] Step 2: During the nickel plating process of the wafer, the waste gas generated is collected by the wind collecting hood 5 and sent to the purification box 41. After being processed by the filter screen 412 and the filter element 411 inside the purification box 41, it enters the auxiliary cylinder 43 and is discharged after being sprayed by the spray pipe 432.

[0043] Step 3: The wastewater generated during nickel plating and cleaning can be collected in the water tank 7, and the wastewater is sent to the treatment box 61 by using the water pump 72 and the drainage pipe 73, and the treatment box 61 is used for drug addition and precipitation, and then the hydraulic push rod 68 drives the connecting bar 65 and the baffle 651 to move upward, and the wastewater is filtered by the filter plate 67 and enters the other side of the filter plate 67, and then is filtered and treated by the flat ultrafiltration membrane assembly 62, and the treated liquid can be discharged through the pipeline on one side of the treatment box 61;

[0044] Step 4: Use the cleaning plate 69 to move along the screw 691, and the cleaning plate 69 scrapes one side of the filter plate 67, and the scraper 693 scrapes the bottom of the inner cavity of the treatment box 61 to reduce the accumulation of sediment and impurities at the bottom of the inner cavity of the treatment box 61 and one side of the filter plate 67, thereby accelerating the discharge of sewage from the sewage pipe 611.

[0045] The working method and working principle of the device are as follows: first, the wafers can be pre-cleaned and subjected to chemical nickel plating in a plurality of processing tanks 8 on the operating table 1, and the exhaust fan 51 is used to accelerate the air flow inside the air hood 5, so that negative pressure is generated at the top of the inner cavity of the air hood 5 and the rack 2, and the waste gas generated during the processing is sent into the purification box 41, and the waste gas is first filtered by the filter screen 412 and then adsorbed by the filter element 411 with activated carbon, and the axial flow fan 421 is turned on to accelerate the flow of gas inside the guide tube 42, so that the gas is sent into the auxiliary tube 43 through the extension tube 422, and the spray pipe 432 is externally connected to an alkaline treatment agent, and the treatment agent enters the spray pipe 432 and is sprayed out through the nozzle, so as to treat the acidic substances remaining in the gas, and the treated gas can be discharged through the exhaust pipe 431, and the remaining liquid can be discharged from the drain pipe on one side of the auxiliary tube 43;

[0046] After the processing is completed, the valve on the top of the water tank 7 is opened to allow the wastewater to enter the water tank 7, enter the water pump 72 through the connecting pipe 71, and then be sent to the treatment box 61 through the water pump 72 and the drainage pipe 73. The servo motor 63 is used to drive the stirring rod 66 to rotate to accelerate the fusion of the reagent and the wastewater, so that the impurities in the wastewater are quickly precipitated. After the precipitation is completed, the hydraulic push rod 68 is used to drive the connecting bar 65 to move up, and the baffle 651 slides in the inner cavity of the filter plate 67, and no longer isolates the inner cavity of the filter plate 67. At this time, the precipitated sewage can pass through the through holes on the filter plate 67 to complete the filtration. The water is treated again by the flat ultrafiltration membrane assembly 62. The nanofiltration membrane in the flat ultrafiltration membrane assembly 62 can intercept divalent ions to separate nickel ions from other small molecules, thereby realizing the recovery of nickel ions. When treating sewage, the servo motor 694 drives the lead screw 691 to rotate. At this time, the cleaning plate 69 moves along the lead screw 691 and the guide rod 692. One side of the cleaning plate 69 scrapes the filter plate 67. The scraper 693 moves with the cleaning plate 69 to scrape the bottom of the processing box 61 to prevent precipitation and stains from blocking one side of the filter plate 67.

[0047] Although the present invention has been described in detail with reference to the aforementioned embodiments, it is still possible for those skilled in the art to modify the technical solutions described in the aforementioned embodiments, or to make equivalent substitutions for some of the technical features therein. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A semiconductor wafer chemical nickel plating production line, comprising an operating table (1), one side of the operating table (1) is fixedly connected to a frame (2), one side of the frame (2) is snap-connected to a protective plate (3), characterized in that: A wastewater treatment mechanism (6) is provided on one side of the frame (2), and the wastewater treatment mechanism (6) comprises a treatment box (61), a servo motor (63) and a connecting strip (65); a fixing plate (64) is fixedly connected to one side of the inner wall of the treatment box (61); the top of the fixing plate (64) is fixedly connected to the servo motor (63); one end of the output shaft of the servo motor (63) passes through the fixing plate (64) and is fixedly connected to a stirring rod (66); a filter plate (67) is fixedly connected to one side of the fixing plate (64); a flat ultrafiltration membrane assembly (62) is provided on one side of the filter plate (67); the bottom of the flat ultrafiltration membrane assembly (62) is snap-connected to the bottom of the inner cavity of the treatment box (61); the filter plate (67) is internally slidably connected to the inner wall of the filter plate (67); A baffle (651) is connected, the top of the baffle (651) is fixedly connected to the connecting strip (65), the bottom of the connecting strip (65) is fixedly connected to a hydraulic push rod (68), the bottom of the hydraulic push rod (68) is fixedly connected to one side of the processing box (61), and a drainage pipe (73) is inserted through the inside of the processing box (61), the bottom of the drainage pipe (73) is fixedly connected to a water pump (72), the water inlet of the water pump (72) is fixedly connected to a connecting pipe (71), one end of the connecting pipe (71) passes through the frame (2) and is fixedly connected to a water tank (7), the bottom of the water tank (7) is snap-connected to the operating table (1), a processing tank (8) is provided above the water tank (7), and one side of the processing tank (8) is fixedly connected to the operating table (1).

2. The semiconductor wafer chemical nickel plating production line according to claim 1, characterized in that: One side of the processing box (61) is fixedly connected to a sewage discharge pipe (611), and one side of the sewage discharge pipe (611) is provided with a scraper (693), and the bottom of the scraper (693) is slidably connected to the bottom of the inner cavity of the processing box (61).

3. The semiconductor wafer chemical nickel plating production line according to claim 2, characterized in that: A cleaning plate (69) is fixedly connected to one side of the scraper (693), a guide rod (692) is inserted through the interior of the cleaning plate (69), one end of the guide rod (692) is fixedly connected to the inner wall of the processing box (61), and the guide rod (692) and the cleaning plate (69) are slidably connected.

4. The semiconductor wafer chemical nickel plating production line according to claim 3, characterized in that: One side of the cleaning plate (69) is connected to a lead screw (691) via a thread, one end of the lead screw (691) is rotatably connected to the processing box (61), the other end of the lead screw (691) is fixedly connected to the output shaft of a second servo motor (694), and one side of the second servo motor (694) is fixedly connected to the processing box (61).

5. The semiconductor wafer chemical nickel plating production line according to claim 1, characterized in that: The top of the frame (2) is fixedly connected with an air collecting hood (5), an exhaust fan (51) is installed inside the air collecting hood (5), and the bottom of the exhaust fan (51) passes through the top side wall of the frame (2).

6. The semiconductor wafer chemical nickel plating production line according to claim 5, characterized in that: A purification mechanism (4) is provided on one side of the wind collecting hood (5), and the purification mechanism (4) comprises a purification box (41), a guide tube (42) and an auxiliary tube (43); one side of the purification box (41) is fixedly connected to the wind collecting hood (5), and a filter core (411) and a filter screen (412) are clamped on the inner wall of the purification box (41).

7. The semiconductor wafer chemical nickel plating production line according to claim 6, characterized in that: The top of the purification box (41) is fixedly connected to the guide tube (42), one end of the guide tube (42) is fixedly connected to an axial flow fan (421), and the bottom of the axial flow fan (421) is fixedly connected to an extension tube (422).

8. The semiconductor wafer chemical nickel plating production line according to claim 7, characterized in that: The bottom of the extension tube (422) passes through the top side wall of the auxiliary tube (43), and one side of the auxiliary tube (43) is fixedly connected to an exhaust pipe (431).

9. The semiconductor wafer chemical nickel plating production line according to claim 8, characterized in that: The top of the inner cavity of the auxiliary tube (43) is fixedly connected to a spray pipe (432), the bottom of the spray pipe (432) is fixedly connected to an atomizing nozzle, and the top of the spray pipe (432) is fixedly connected to an infusion tube, which passes through the top side wall of the auxiliary tube (43).

10. A working method of a semiconductor wafer chemical nickel plating production line, characterized in that: A semiconductor wafer chemical nickel plating production line according to any one of claims 1 to 9 is used, comprising the following steps: S1, fixing the semiconductor wafer by a clamp above the processing tank (8), driving the wafer into different processing tanks (8) by a driving structure above the processing tank (8), performing pre-cleaning and chemical nickel plating, and performing post-processing cleaning on the wafer after chemical nickel plating; S2. During the nickel plating process of the wafer, the waste gas generated is collected by the wind collecting hood (5) and sent to the purification box (41). After being processed by the filter screen (412) and the filter element (411) inside the purification box (41), the waste gas enters the auxiliary cylinder (43), and is discharged after being sprayed by the spray pipe (432); S3, wastewater generated during nickel plating and cleaning can be collected in the water tank (7), and the wastewater is sent to the treatment box (61) by using the water pump (72) and the drainage pipe (73), and the treatment box (61) is used for drug addition and precipitation, and then the hydraulic push rod (68) drives the connecting bar (65) and the baffle (651) to move upward, and the wastewater is filtered by the filter plate (67) and enters the other side of the filter plate (67), and then is filtered and treated by the flat ultrafiltration membrane assembly (62), and the treated liquid can be discharged through the pipeline on one side of the treatment box (61); S4. The cleaning plate (69) is moved along the lead screw (691), the cleaning plate (69) scrapes one side of the filter plate (67), and the scraper (693) scrapes the bottom of the inner cavity of the treatment box (61), thereby reducing the accumulation of sediment and impurities at the bottom of the inner cavity of the treatment box (61) and one side of the filter plate (67), and accelerating the discharge of sewage from the sewage pipe (611).

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