Device and method for measuring thermal expansion coefficient of micro-ball sample

Abstract

The invention belongs to the technical field of nuclear power, and particularly relates to a device and method for measuring the thermal expansion coefficient of a micro-ball sample. According to the invention, the micro-sphere is placed in the specific container, and the overall linear expansion amount is derived according to the displacement amount of the container cover, so that the linear expansion coefficient of the single sphere can be derived. Therefore, a tiny thermal expansion amount can be identified through a stacking method. And compared with a single spherical sample, the sample is easier to fix, and the position is not easy to change in the testing process.

Description

Technical Field

[0001] The invention belongs to the technical field of nuclear power, and in particular relates to a device and method for measuring the thermal expansion coefficient of a micro-spherical sample. Background Art

[0002] The linear expansion coefficient of a material is a characterization of the change in length caused by a unit temperature change when an object is heated or cooled, and is one of the basic thermophysical parameters of a substance. In engineering technology, for structural materials used under temperature changes, the thermal expansion coefficient is not only an important performance of the material, but also a key parameter for structural design. The importance of the thermal expansion performance of a material is also reflected in its close relationship with the material's ability to resist thermal shock, and the distribution and size of thermal stress after heating. Accurately measuring the linear expansion coefficient of a material is of great value to basic scientific research, technological innovation, and engineering applications.

[0003] There are many methods for testing the thermal expansion coefficient, and the ejector method is a commonly used method for measuring the thermal expansion coefficient of materials in China due to its simple device, wide measurement range and high accuracy. The ejector method adopts the mechanical measurement principle, that is, one end of the sample is fixed on the end of the support, and the other end is in contact with the ejector. The sample, support and ejector are heated at the same time, and the thermal expansion is transmitted by the ejector and measured.

[0004] Since the principle of the push rod method is to measure the linear expansion coefficient of the sample by the displacement of the push rod, the sample is usually required to be cylindrical and can be placed firmly on the support. At the same time, in order to ensure a certain resolution of sample size change, the height of the sample is usually required to be no less than 20mm. When the sample is a micro spherical sample (the diameter of the microsphere can be, for example, less than 0.5mm), it is difficult to use the push rod method to measure the expansion of the micro spherical sample. In view of this situation, it is urgent to solve the problem of measuring the linear expansion coefficient of the micro spherical sample. Summary of the invention

[0005] In order to overcome the problems existing in the related art, a device and method for measuring the thermal expansion coefficient of a micro-sphere sample are provided.

[0006] According to one aspect of an embodiment of the present disclosure, there is provided a device for measuring the thermal expansion coefficient of a micro-sphere sample, the device comprising: a displacement measuring instrument, a temperature measuring thermocouple, a heating furnace, a sample, a control device, a mandrel, a support tube, and a temperature-controlled thermocouple;

[0007] The lower end of the support tube is fixedly connected in the heating furnace, and the upper end of the support tube protrudes out of the heating furnace and is located within the measuring range of the displacement measuring instrument, which is used to monitor the displacement of the upper end of the push rod;

[0008] The sample includes a container, in which one or more layers of microspheres to be tested are placed, and a top cover is provided on the top layer of microspheres, and the top cover can move relative to the side wall of the container; the lower end of the container is fixedly mounted on a support platform at the lower end of a support tube, and is located in the middle of a heating furnace, so that the sample can be heated more fully and evenly; the lower end of the top rod is vertically connected to the top cover;

[0009] The temperature measuring thermocouple is close to the outer wall of the container and is used to collect the heating temperature in the heating furnace; the temperature controlling thermocouple is arranged in the heating furnace and is used to collect the temperature in the heating furnace; the control device is connected to the temperature measuring thermocouple and the temperature controlling thermocouple respectively, and can obtain temperature data from the temperature measuring thermocouple and the temperature controlling thermocouple.

[0010] In a possible implementation, the device measures the expansion coefficient of each microsphere using the following steps:

[0011] Step 101, the control device controls the heating furnace to increase the temperature at a uniform rate to heat the sample to a preset temperature;

[0012] Step 102, the control device determines the total expansion amount according to the displacement of the ejector collected by the displacement measuring instrument; the control device also determines the temperature rise of the sample according to the temperature of the sample collected by the temperature measuring thermocouple;

[0013] Step 103, the control device determines the linear expansion coefficient of each microsphere according to the overall expansion amount and the temperature rise of the sample using Formula 1 or Formula 2:

[0014] When the number of microsphere layers S = 1:

[0015]

[0016] When the number of microsphere layers S ≥ 2:

[0017]

[0018] Among them, α is the overall expansion coefficient, α0 is the linear expansion coefficient of a single microsphere, r0 is the radius of the microsphere before expansion, r1 is the radius of the microsphere after expansion, S is the number of layers of microspheres in the container, n is the number of microspheres on the bottom diameter of the container, and ΔT is the average temperature rise.

[0019] In one possible implementation, in step 1, the control device obtains the temperature collected by the temperature-controlling thermocouple at a preset frequency, and when it is determined that the temperature value collected by the temperature-controlling thermocouple is less than the preset temperature, the control device continuously controls the heating furnace to heat until the temperature collected by the temperature-controlling thermocouple matches the preset temperature.

[0020] In a possible implementation, the microspheres are in contact with each other, and the microspheres are in contact with the inner wall of the container and the top cover, but no extrusion occurs.

[0021] In a possible implementation, the container is located in the middle of the heating furnace.

[0022] According to one aspect of an embodiment of the present disclosure, a method for measuring the thermal expansion coefficient of a microsphere sample is provided, the method comprising:

[0023] Step 101, controlling the heating furnace to increase the temperature at a uniform rate to heat the sample to a preset temperature;

[0024] Step 102, determining the total expansion amount according to the displacement of the mandrel collected by the displacement measuring instrument; and determining the temperature rise of the sample according to the temperature of the sample collected by the temperature measuring thermocouple;

[0025] Step 103, according to the overall expansion amount and the temperature rise of the sample, the linear expansion coefficient of each microsphere is determined using Formula 1 or Formula 2:

[0026] When the number of microsphere layers S = 1:

[0027]

[0028] When the number of microsphere layers S ≥ 2:

[0029]

[0030] Among them, α is the overall expansion coefficient, α0 is the linear expansion coefficient of a single microsphere, r0 is the radius of the microsphere before expansion, r1 is the radius of the microsphere after expansion, S is the number of layers of microspheres in the container, n is the number of microspheres on the bottom diameter of the container, and ΔT is the average temperature rise.

[0031] According to one aspect of an embodiment of the present disclosure, a device for measuring thermal expansion coefficient of a microsphere sample is provided, the device comprising:

[0032] The heating module is used to control the uniform heating rate of the heating furnace and heat the sample to the preset temperature;

[0033] The acquisition module is used to determine the total expansion amount according to the displacement of the ejector collected by the displacement measuring instrument; and to determine the temperature rise of the sample according to the temperature of the sample collected by the temperature measuring thermocouple;

[0034] The determination module is used to determine the linear expansion coefficient of each microsphere according to the overall expansion amount and the temperature rise of the sample using Formula 1 or Formula 2:

[0035] When the number of microsphere layers S = 1:

[0036]

[0037] When the number of microsphere layers S ≥ 2:

[0038]

[0039] Among them, α is the overall expansion coefficient, α0 is the linear expansion coefficient of a single microsphere, r0 is the radius of the microsphere before expansion, r1 is the radius of the microsphere after expansion, S is the number of layers of microspheres in the container, n is the number of microspheres on the bottom diameter of the container, and ΔT is the average temperature rise.

[0040] According to another aspect of the present disclosure, a device for measuring thermal expansion coefficient of a microsphere sample is provided, the device comprising:

[0041] processor;

[0042] a memory for storing processor-executable instructions;

[0043] Wherein, the processor is configured to execute the above method.

[0044] According to another aspect of an embodiment of the present disclosure, a non-volatile computer-readable storage medium is provided, on which computer program instructions are stored, and the computer program instructions implement the above method when executed by a processor.

[0045] The beneficial effect of the present disclosure is that the present disclosure places the microsphere in a specific container, and deduces the overall linear expansion amount according to the displacement of the container cover, thereby being able to deduce the linear expansion coefficient of a single sphere. Thus, the tiny thermal expansion amount can be identified by the stacking method. Compared with a single spherical sample, it is easier to fix the sample, and the position is not easily changed during the test.

[0046] Through the method disclosed in the present invention, the experimental values ​​of the thermal expansion coefficients of various fuel pellets (TRISO, BISO, etc.) with different numbers of coating layers are measured for the first time, achieving a breakthrough in the thermal expansion coefficient of fourth-generation nuclear power fuel microspheres from theoretical values ​​to experimental values. BRIEF DESCRIPTION OF THE DRAWINGS

[0047] Figure 1 It is a schematic diagram of a device for measuring the thermal expansion coefficient of a micro-sphere sample shown in an embodiment of the present disclosure.

[0048] Figure 2 It is a schematic diagram of a sample in a device for measuring thermal expansion coefficient of a micro-sphere sample shown in an embodiment of the present disclosure.

[0049] Figure 3 It is a schematic diagram of a method for measuring the thermal expansion coefficient of a microsphere sample shown in an embodiment of the present disclosure.

[0050] Figure 4 It is a block diagram of a device for measuring the thermal expansion coefficient of a micro-sphere sample shown in an embodiment of the present disclosure.

[0051] In the figure:

[0052] 1: Displacement measuring instrument, 2: Temperature measuring thermocouple, 3: Heating furnace, 4: Sample, 5: Control device,

[0053] 6: ejector rod, 7: support tube, 8: temperature-controlling thermocouple, 41: top cover, 42: container, 43: microsphere. DETAILED DESCRIPTION

[0054] The present disclosure is further described in detail below with reference to the accompanying drawings and specific embodiments.

[0055] Unless otherwise defined, the technical and scientific terms used in the present disclosure have the same meanings as those generally understood by those skilled in the art to which the present disclosure belongs; the terms used in the present disclosure are only for the purpose of describing specific embodiments and are not intended to limit the present disclosure; the term "including" and any variations thereof in the present disclosure are intended to cover non-exclusive inclusions. Obviously, the embodiments described in the present disclosure are only part of the embodiments of the present disclosure, not all of the embodiments. Based on the embodiments in the present disclosure, all other embodiments obtained by ordinary technicians in the field without making creative efforts are within the scope of protection of the present disclosure.

[0056] Reference to "embodiments" in this disclosure means that a particular feature, structure, or characteristic described in conjunction with the embodiments may be included in at least one embodiment of the disclosure. The appearance of the phrase in various places in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment that is mutually exclusive with other embodiments. It is explicitly and implicitly understood by those skilled in the art that the embodiments described herein may be combined with other embodiments.

[0057] Figure 1 Schematic diagram of a device for measuring thermal expansion coefficient of a micro-sphere sample according to an embodiment of the present disclosure. Figure 1 As shown, the device includes: a displacement measuring instrument 1, a temperature measuring thermocouple 2, a heating furnace 3, a sample, a control device 5, a mandrel 6, a support tube 7 and a temperature controlling thermocouple 8.

[0058] The lower end of the support tube 7 is fixedly connected in the heating furnace 3, the upper part of the support tube 7 protrudes out of the heating furnace 3, and the upper end of the support tube 7 is connected to the displacement measuring instrument 1, which is used to monitor the displacement of the upper end of the top rod 6; Figure 2 As shown, the sample 4 includes a container 42, in which one or more layers of microspheres 43 to be tested are placed, and a top cover 41 is provided on the top layer of microspheres, and the top cover 41 can move relative to the side wall of the container 42. Among them, the microspheres are in contact with the inner wall of the container and the top cover, but no extrusion occurs.

[0059] The lower end of the container 42 is fixedly mounted on the support platform at the lower end of the support tube 7 and is located in the middle of the heating furnace 3, so that the sample 4 can be heated more fully and evenly. The lower end of the top rod 6 is vertically connected to the top cover.

[0060] The temperature measuring thermocouple 2 is close to the outer wall of the container and is used to collect the heating temperature in the heating furnace 3; the temperature controlling thermocouple 8 is arranged in the heating furnace 3 and is used to collect the temperature in the heating furnace 3; the control device 5 is respectively connected to the temperature measuring thermocouple 2 and the temperature controlling thermocouple 8, obtains the container temperature change value from the temperature measuring thermocouple 2, and obtains the heating temperature in the heating furnace 3 from the temperature controlling thermocouple 8.

[0061] The device disclosed herein measures the expansion coefficient of each microsphere using the following steps.

[0062] Step 101, the control device controls the heating furnace to heat up at a uniform speed to heat the sample to a preset temperature. In step 1, the control device obtains the temperature collected by the temperature-controlled thermocouple at a preset frequency, and when it is determined that the temperature value collected by the temperature-controlled thermocouple is less than the preset temperature, the control device continuously controls the heating furnace to heat until the temperature collected by the temperature-controlled thermocouple matches the preset temperature.

[0063] Step 102, the control device determines the total expansion amount according to the displacement of the ejector collected by the displacement measuring instrument; the control device also determines the temperature rise of the sample according to the temperature of the sample collected by the temperature measuring thermocouple. The expansion amount of the microsphere sample is transferred to the ejector through the container cover to generate displacement, and the control device can obtain the displacement of the ejector collected by the displacement measuring instrument.

[0064] Step 103: The control device determines the linear expansion coefficient of each microsphere using Formula 1 or Formula 2 according to the overall expansion amount and the temperature rise of the sample.

[0065] When the number of microsphere layers S = 1:

[0066]

[0067] When the number of microsphere layers S ≥ 2:

[0068]

[0069] Among them, α is the overall expansion coefficient, α0 is the linear expansion coefficient of a single microsphere, r0 is the radius of the microsphere before expansion, r1 is the radius of the microsphere after expansion, S is the number of layers of microspheres in the container, n is the number of microspheres on the bottom diameter of the container, and ΔT is the average temperature rise.

[0070] The present invention places a micro-sphere in a specific container, and derives the overall linear expansion according to the displacement of the container cover, thereby being able to derive the linear expansion coefficient of a single sphere. Thus, tiny thermal expansion can be identified by the stacking method. Compared with a single spherical sample, it is easier to fix the sample, and the position is not easily changed during the test. Through the method disclosed in the present invention, the experimental values ​​of the thermal expansion coefficients of various fuel pellets (TRISO, BISO, etc.) with different numbers of coating layers are measured for the first time, achieving a breakthrough in the thermal expansion coefficient of the fourth-generation nuclear power fuel microspheres from theoretical values ​​to experimental values.

[0071] Figure 3 FIG. 1 is a schematic diagram of a method for measuring the thermal expansion coefficient of a microsphere sample according to an embodiment of the present disclosure. Figure 3 As shown, the method includes:

[0072] Step 101, controlling the heating furnace to increase the temperature at a uniform rate to heat the sample to a preset temperature;

[0073] Step 102, determining the total expansion amount according to the displacement of the mandrel collected by the displacement measuring instrument; and determining the temperature rise of the sample according to the temperature of the sample collected by the temperature measuring thermocouple;

[0074] Step 103, according to the overall expansion amount and the temperature rise of the sample, the linear expansion coefficient of each microsphere is determined using Formula 1 or Formula 2:

[0075] When the number of microsphere layers S = 1:

[0076]

[0077] When the number of microsphere layers S ≥ 2:

[0078]

[0079] Among them, α is the overall expansion coefficient, α0 is the linear expansion coefficient of a single microsphere, r0 is the radius of the microsphere before expansion, r1 is the radius of the microsphere after expansion, S is the number of layers of microspheres in the container, n is the number of microspheres on the bottom diameter of the container, and ΔT is the average temperature rise.

[0080] In a possible implementation, a device for measuring thermal expansion coefficient of a microsphere sample is provided, the device comprising:

[0081] The heating module is used to control the uniform heating rate of the heating furnace and heat the sample to the preset temperature;

[0082] The acquisition module is used to determine the total expansion amount according to the displacement of the ejector collected by the displacement measuring instrument; and to determine the temperature rise of the sample according to the temperature of the sample collected by the temperature measuring thermocouple;

[0083] The determination module is used to determine the linear expansion coefficient of each microsphere according to the overall expansion amount and the temperature rise of the sample using Formula 1 or Formula 2:

[0084] When the number of microsphere layers S = 1:

[0085]

[0086] When the number of microsphere layers S ≥ 2:

[0087]

[0088] Among them, α is the overall expansion coefficient, α0 is the linear expansion coefficient of a single microsphere, r0 is the radius of the microsphere before expansion, r1 is the radius of the microsphere after expansion, S is the number of layers of microspheres in the container, n is the number of microspheres on the bottom diameter of the container, and ΔT is the average temperature rise.

[0089] The description of the above method and device has been explained in detail in the description of the above method and will not be repeated here.

[0090] Figure 4 1900 is a block diagram of a device for measuring thermal expansion coefficient of a micro-sphere sample according to an embodiment of the present disclosure. For example, the device 1900 may be provided as a server. Figure 4 , the apparatus 1900 includes a processing component 1922, which further includes one or more processors, and a memory resource represented by a memory 1932 for storing instructions, such as an application, that can be executed by the processing component 1922. The application stored in the memory 1932 may include one or more modules, each corresponding to a set of instructions. In addition, the processing component 1922 is configured to execute instructions to perform the above method.

[0091] The device 1900 may also include a power supply component 1926 configured to perform power management of the device 1900, a wired or wireless network interface 1950 configured to connect the device 1900 to a network, and an input / output (I / O) interface 1958. The device 1900 may operate based on an operating system stored in the memory 1932, such as Windows Server™, MacOS X™, Unix™, Linux™, FreeBSD™, or the like.

[0092] In an exemplary embodiment, a non-volatile computer-readable storage medium is also provided, such as a memory 1932 including computer program instructions, which can be executed by the processing component 1922 of the device 1900 to perform the above method.

[0093] The present disclosure may be a system, a method and / or a computer program product. The computer program product may include a computer-readable storage medium carrying computer-readable program instructions for causing a processor to implement various aspects of the present disclosure.

[0094] A computer-readable storage medium may be a tangible device that can hold and store instructions used by an instruction execution device. A computer-readable storage medium may be, for example, but not limited to, an electrical storage device, a magnetic storage device, an optical storage device, an electromagnetic storage device, a semiconductor storage device, or any suitable combination of the foregoing. More specific examples of computer-readable storage media (a non-exhaustive list) include: a portable computer disk, a hard disk, a random access memory (RAM), a read-only memory (ROM), an erasable programmable read-only memory (EPROM or flash memory), a static random access memory (SRAM), a portable compact disk read-only memory (CD-ROM), a digital versatile disk (DVD), a memory stick, a floppy disk, a mechanical encoding device, such as a punch card or a raised structure in a groove on which instructions are stored, and any suitable combination of the foregoing. As used herein, a computer-readable storage medium is not to be interpreted as a transient signal per se, such as a radio wave or other freely propagating electromagnetic wave, an electromagnetic wave propagating through a waveguide or other transmission medium (e.g., a light pulse through a fiber optic cable), or an electrical signal transmitted through a wire.

[0095] The computer-readable program instructions described herein can be downloaded from a computer-readable storage medium to each computing / processing device, or downloaded to an external computer or external storage device via a network, such as the Internet, a local area network, a wide area network, and / or a wireless network. The network can include copper transmission cables, optical fiber transmissions, wireless transmissions, routers, firewalls, switches, gateway computers, and / or edge servers. The network adapter card or network interface in each computing / processing device receives the computer-readable program instructions from the network and forwards the computer-readable program instructions for storage in the computer-readable storage medium in each computing / processing device.

[0096] The computer program instructions for performing the operation of the present disclosure may be assembly instructions, instruction set architecture (ISA) instructions, machine instructions, machine-related instructions, microcode, firmware instructions, state setting data, or source code or object code written in any combination of one or more programming languages, including object-oriented programming languages, such as Smalltalk, C++, etc., and conventional procedural programming languages, such as "C" language or similar programming languages. Computer-readable program instructions may be executed completely on a user's computer, partially on a user's computer, as an independent software package, partially on a user's computer, partially on a remote computer, or completely on a remote computer or server. In the case of a remote computer, the remote computer may be connected to the user's computer via any type of network, including a local area network (LAN) or a wide area network (WAN), or may be connected to an external computer (e.g., using an Internet service provider to connect via the Internet). In some embodiments, an electronic circuit, such as a programmable logic circuit, a field programmable gate array (FPGA), or a programmable logic array (PLA), may be customized by utilizing the state information of the computer-readable program instructions, and the electronic circuit may execute the computer-readable program instructions, thereby realizing various aspects of the present disclosure.

[0097] Various aspects of the present disclosure are described herein with reference to the flowcharts and / or block diagrams of the methods, devices (systems) and computer program products according to the embodiments of the present disclosure. It should be understood that each box in the flowchart and / or block diagram and the combination of each box in the flowchart and / or block diagram can be implemented by computer-readable program instructions.

[0098] These computer-readable program instructions can be provided to a processor of a general-purpose computer, a special-purpose computer, or other programmable data processing device, thereby producing a machine, so that when these instructions are executed by the processor of the computer or other programmable data processing device, a device that implements the functions / actions specified in one or more boxes in the flowchart and / or block diagram is generated. These computer-readable program instructions can also be stored in a computer-readable storage medium, and these instructions cause the computer, programmable data processing device, and / or other equipment to work in a specific manner, so that the computer-readable medium storing the instructions includes a manufactured product, which includes instructions for implementing various aspects of the functions / actions specified in one or more boxes in the flowchart and / or block diagram.

[0099] Computer-readable program instructions may also be loaded onto a computer, other programmable data processing apparatus, or other device so that a series of operating steps are performed on the computer, other programmable data processing apparatus, or other device to produce a computer-implemented process, thereby causing the instructions executed on the computer, other programmable data processing apparatus, or other device to implement the functions / actions specified in one or more boxes in the flowchart and / or block diagram.

[0100] The flow chart and block diagram in the accompanying drawings show the possible architecture, function and operation of the system, method and computer program product according to multiple embodiments of the present disclosure. In this regard, each square box in the flow chart or block diagram can represent a part of a module, program segment or instruction, and the part of the module, program segment or instruction contains one or more executable instructions for realizing the specified logical function. In some alternative implementations, the function marked in the square box can also occur in a sequence different from that marked in the accompanying drawings. For example, two continuous square boxes can actually be executed substantially in parallel, and they can sometimes be executed in the opposite order, depending on the functions involved. It should also be noted that each square box in the block diagram and / or flow chart, and the combination of the square boxes in the block diagram and / or flow chart can be implemented with a dedicated hardware-based system that performs the specified function or action, or can be implemented with a combination of special hardware and computer instructions.

[0101] The embodiments of the present disclosure have been described above, and the above description is exemplary, not exhaustive, and is not limited to the disclosed embodiments. Many modifications and changes will be apparent to those of ordinary skill in the art without departing from the scope and spirit of the described embodiments. The selection of terms used herein is intended to best explain the principles of the embodiments, practical applications, or improvements to the technology in the market, or to enable other persons of ordinary skill in the art to understand the embodiments disclosed herein.

Claims

1. A device for measuring the thermal expansion coefficient of a micro-sphere sample, characterized in that: The device comprises: a displacement measuring instrument, a temperature measuring thermocouple, a heating furnace, a sample, a control device, a mandrel, a support tube and a temperature controlling thermocouple; The lower end of the support tube is fixedly connected in the heating furnace, and the upper end of the support tube protrudes out of the heating furnace and is located within the measuring range of the displacement measuring instrument, which is used to monitor the displacement of the upper end of the push rod; The sample includes a container, in which one or more layers of microspheres to be tested are placed, and a top cover is provided on the top layer of microspheres, and the top cover can move relative to the side wall of the container; the lower end of the container is fixedly mounted on a support platform at the lower end of a support tube, and is located in the middle of a heating furnace, so that the sample can be heated more fully and evenly; the lower end of the top rod is vertically connected to the top cover; The temperature measuring thermocouple is close to the outer wall of the container and is used to collect the heating temperature in the heating furnace; the temperature controlling thermocouple is arranged in the heating furnace and is used to collect the temperature in the heating furnace; the control device is connected to the temperature measuring thermocouple and the temperature controlling thermocouple respectively, and can obtain temperature data from the temperature measuring thermocouple and the temperature controlling thermocouple.

2. The device according to claim 1, characterized in that The device measures the expansion coefficient of each microsphere using the following steps: Step 101, the control device controls the heating furnace to increase the temperature at a uniform rate to heat the sample to a preset temperature; Step 102, the control device determines the total expansion amount according to the displacement of the ejector collected by the displacement measuring instrument; the control device also determines the temperature rise of the sample according to the temperature of the sample collected by the temperature measuring thermocouple; Step 103, the control device determines the linear expansion coefficient of each microsphere according to the overall expansion amount and the temperature rise of the sample using Formula 1 or Formula 2: When the number of microsphere layers S = 1: When the number of microsphere layers S ≥ 2: Among them, α is the overall expansion coefficient, α0 is the linear expansion coefficient of a single microsphere, r0 is the radius of the microsphere before expansion, r1 is the radius of the microsphere after expansion, S is the number of layers of microspheres in the container, n is the number of microspheres on the bottom diameter of the container, and ΔT is the average temperature rise.

3. The device according to claim 2, characterized in that In step 1, the control device obtains the temperature collected by the temperature-controlling thermocouple at a preset frequency, and when it is determined that the temperature value collected by the temperature-controlling thermocouple is less than the preset temperature, the control device continuously controls the heating furnace to heat until the temperature collected by the temperature-controlling thermocouple matches the preset temperature.

4. The device according to claim 1, characterized in that There is contact between the microspheres, the inner wall of the container and the top cover, but no extrusion occurs.

5. The device according to claim 1, characterized in that The container is located in the middle of the heating furnace.

6. A method for measuring the thermal expansion coefficient of a microsphere sample, characterized in that: The method comprises: Step 101, controlling the heating furnace to increase the temperature at a uniform rate to heat the sample to a preset temperature; Step 102, determining the total expansion amount according to the displacement of the mandrel collected by the displacement measuring instrument; and determining the temperature rise of the sample according to the temperature of the sample collected by the temperature measuring thermocouple; Step 103, according to the overall expansion amount and the temperature rise of the sample, the linear expansion coefficient of each microsphere is determined using Formula 1 or Formula 2: When the number of microsphere layers S = 1: When the number of microsphere layers S ≥ 2: Among them, α is the overall expansion coefficient, α0 is the linear expansion coefficient of a single microsphere, r0 is the radius of the microsphere before expansion, r1 is the radius of the microsphere after expansion, S is the number of layers of microspheres in the container, n is the number of microspheres on the bottom diameter of the container, and ΔT is the average temperature rise.

7. A device for measuring the thermal expansion coefficient of a micro-sphere sample, characterized in that: The device comprises: The heating module is used to control the uniform heating rate of the heating furnace and heat the sample to the preset temperature; The acquisition module is used to determine the total expansion amount according to the displacement of the ejector collected by the displacement measuring instrument; and to determine the temperature rise of the sample according to the temperature of the sample collected by the temperature measuring thermocouple; The determination module is used to determine the linear expansion coefficient of each microsphere according to the overall expansion amount and the temperature rise of the sample using Formula 1 or Formula 2: When the number of microsphere layers S = 1: When the number of microsphere layers S ≥ 2: Among them, α is the overall expansion coefficient, α0 is the linear expansion coefficient of a single microsphere, r0 is the radius of the microsphere before expansion, r1 is the radius of the microsphere after expansion, S is the number of layers of microspheres in the container, n is the number of microspheres on the bottom diameter of the container, and ΔT is the average temperature rise.

8. A device for measuring the thermal expansion coefficient of a micro-sphere sample, characterized in that: The device comprises: processor; a memory for storing processor-executable instructions; The processor is configured to execute the method according to any one of claims 1 to 6.

9. A non-volatile computer-readable storage medium having computer program instructions stored thereon, characterized in that: When the computer program instructions are executed by a processor, the method according to any one of claims 1 to 6 is implemented.

Images