Wearable device circuit board automatic production testing system and method
By designing a wearable device circuit board automation production and testing system, using the combination of server and test box, the problem that existing systems cannot test multiple circuit boards at the same time is solved, and automated production and testing of multiple circuit boards is achieved, improving the flexibility and efficiency of the system.
Patent Information
- Application Number
- CN202510062338.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-01-15
- Publication Date
- 2025-05-13
AI Technical Summary
The existing circuit board production and testing system cannot test multiple circuit boards of different models at the same time, and cannot meet the demand for production and testing of circuit boards of different signals.
An automated production and testing system for wearable equipment circuit boards is designed, including a server and a test box that corresponds to the circuit board under test. The test box can obtain the firmware matching the circuit board to be tested from the server and write it to the circuit board. At the same time, it sends a test signal to the circuit board, starts the self-test program, completes the self-test and sends test data to the server.
It realizes automated production and testing of many different models of circuit boards, improving the flexibility and testing efficiency of production and testing systems.
Smart Images

Figure CN119986313A_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to the technical field of circuit board production and testing, and in particular to an automated production and testing system and method for a wearable device circuit board. Background Art
[0002] The contents in this section merely provide background information related to the present invention and may not constitute prior art.
[0003] As wearable devices have more and more functions, the density of components on their circuit boards is getting higher and higher, and the number of circuit board models is also increasing. Factories cannot guarantee that all the circuit boards they produce are intact, so they must test the circuit boards to ensure that their parameters meet the requirements.
[0004] However, in the related circuit board production testing technology, the firmware of the circuit board is pre-written into the circuit board, so that a set of circuit board production testing system can usually only test a single model of circuit board, and cannot meet the demand for production testing of circuit boards with multiple different signals. Summary of the invention
[0005] In view of this, the first purpose of the present invention is to provide an automated production and testing system for wearable device circuit boards, so that a set of production and testing systems can be used to perform production and testing on circuit boards of various models. The second purpose of the present invention is to provide a production and testing method for testing circuit boards using the production and testing system.
[0006] The purpose of the present invention is achieved through the following technical solutions:
[0007] On the one hand, the present invention discloses an automated production and testing system for a wearable device circuit board, comprising a server and a test box corresponding one-to-one to the circuit board under test;
[0008] The circuit board under test includes a processing chip with a self-test program embedded therein;
[0009] The server is communicatively connected to the test box, and the server is configured to provide the test box with firmware matching the circuit board under test;
[0010] The test box is electrically connected to the corresponding circuit board under test; the test box is configured to be able to write firmware matching the circuit board under test into the circuit board under test; and the test box is also configured to be able to send a test signal to the circuit board under test, and the circuit board under test can respond to the test signal and start the self-test program to complete the self-test.
[0011] Further, the circuit board under test is configured to be able to send test data obtained after self-testing to the test box, so that the test data is sent to the server through the test box;
[0012] The server is further configured to receive and store the test data sent by the test box to classify and manage the test data.
[0013] Further, the test box includes an MCU, and a storage unit and a production test interface electrically connected to the MCU;
[0014] The storage unit stores firmware matching multiple models of the tested circuit boards;
[0015] The production test interface is used for electrical connection between the test box and the circuit board under test.
[0016] Furthermore, the production test interface includes an in-place identification GPIO, and the in-place identification GPIO is used to identify whether the circuit board under test is in place.
[0017] Furthermore, the server is also configured to provide the test box with firmware matching the test box.
[0018] Furthermore, it also includes a fixture corresponding to the circuit board under test; the fixture includes a positioning groove, a test probe and a pressing member;
[0019] The positioning groove is configured to receive and position the circuit board under test, one end of the test probe is electrically connected to the test box; the other end of the test probe is located in the positioning groove and contacts the test pin on the circuit board under test to form an electrical connection;
[0020] The pressing member is configured to apply pressure toward the positioning groove to the circuit board under test positioned in the positioning groove.
[0021] On the other hand, the present invention discloses a production and testing method, which uses the above-mentioned wearable device circuit board automated production and testing system;
[0022] The production testing method comprises:
[0023] Step S1. The test box is powered on and establishes a communication connection with the server;
[0024] Step S2. Entering the model of the circuit board under test in the test box;
[0025] Step S3. Determine whether the circuit board under test is in place; if the circuit board under test is in place, the test box supplies power to the circuit board under test;
[0026] Step S4. The test box writes the firmware matching the circuit board under test into the circuit board under test;
[0027] After the firmware matching the circuit board under test is written, the test box sends a test signal to the circuit board under test, and the circuit board under test responds to the test signal and starts a self-test program to complete the self-test.
[0028] Further, in step S4, the test box is configured to wait for the circuit board under test to send test data after self-test within a predetermined time period;
[0029] Among them, if the test box does not receive the test data sent by the circuit board under test within a predetermined time period, the test box writes a fault code and ends the test; if the test box receives the test data sent by the circuit board under test within a predetermined time period, the test box sends the test data to the server, and the server stores the test data in a database and classifies and manages it.
[0030] The technical solution of the embodiment of the present invention has at least the following advantages and beneficial effects:
[0031] The production test system disclosed in the present invention pre-stores the firmware of various models of tested circuit boards through a server. During actual testing, the subsequent test on the tested circuit board can be completed by allowing the test box to obtain the firmware matching the tested circuit board from the server and writing the firmware matching the tested circuit board into the tested circuit board. This method enables the production test system to test various different models of tested circuit boards, and the entire test process can be performed automatically, which effectively improves the flexibility and test efficiency of the production test system. BRIEF DESCRIPTION OF THE DRAWINGS
[0032] Figure 1 An architectural diagram of an automated production and testing system for a wearable device circuit board provided by an embodiment of the present invention;
[0033] Figure 2 An architectural diagram of a test box provided by an embodiment of the present invention;
[0034] Figure 3 A schematic diagram of the structure of a fixture provided by an embodiment of the present invention;
[0035] Figure 4 The present invention provides a flowchart of a production test method according to an embodiment of the present invention. DETAILED DESCRIPTION
[0036] In order to make the purpose, technical solution and advantages of the present invention clearer, the technical solution of the present invention will be clearly and completely described in conjunction with specific implementation methods below. The same figure marks in the accompanying drawings represent the same components. It should be noted that the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the described embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.
[0037] Compared to the embodiments shown in the drawings, feasible embodiments within the scope of the present invention may have fewer components, other components not shown in the drawings, different components, differently arranged components, or differently connected components, etc. In addition, two or more components in the drawings may be implemented in a single component, or a single component shown in the drawings may be implemented as multiple separate components.
[0038] The embodiment of the present invention discloses an automated production and testing system for a wearable device circuit board (hereinafter referred to as the “production and testing system”). Figure 1 As shown, it shows the overall architecture of an exemplary production test system disclosed in the present invention. The production test system disclosed in the present invention may include a server and a plurality of test boxes corresponding to the circuit boards under test.
[0039] The circuit board under test disclosed in the present invention includes a processing chip (such as an MCU chip), and the processing chip is embedded with a self-test program, so that the circuit board under test can start the self-test program to complete the self-test. Among them, the self-test of the circuit board under test can at least complete the test of its own processing chip and sensor chips and other devices.
[0040] In some embodiments of the present invention, the server is in communication connection with the test box. The server stores firmware of various types of circuit boards under test, so that the server can provide the test box with firmware matching the circuit board under test, so that the subsequent test box can write the firmware matching the circuit board under test into the circuit board under test according to the burning protocol.
[0041] At the same time, considering that the test box itself also needs to upgrade its firmware, the server also stores firmware that matches the test box, and the server can provide the test box with firmware that matches the test box, so that the test box can obtain the firmware that matches itself from the server and complete its own firmware upgrade.
[0042] The test box is electrically connected to the corresponding circuit board under test through a test line group. Among them, one test box is electrically connected to a circuit board under test to complete the test of a circuit board under test. When the test box is electrically connected to the corresponding circuit board under test, the test box can supply power to the circuit board under test so that the circuit board under test can be powered on and work normally. At the same time, the test box can also write the firmware matching the circuit board under test into the circuit board under test so that the circuit board under test can run normally and complete subsequent tests. In addition, the test box can also send a test signal to the circuit board under test, and the circuit board under test can respond to the test signal sent by the test box and start the self-test program to complete the self-test, and the circuit board under test can send the test data obtained after the self-test to the test box, and the test box can store the test data and send the test data to the server.
[0043] In addition, the server can also receive and store the test data sent by the test box to classify and manage the test data of different models of tested circuit boards, so as to facilitate the subsequent acquisition of the test data of the tested circuit boards of corresponding models in the database of the server.
[0044] It is worth noting that by pre-storing the firmware of various models of circuit boards under test on the server, during actual testing, the subsequent testing of the circuit board under test can be completed by allowing the test box to obtain the firmware matching the circuit board under test from the server and write the firmware matching the circuit board under test into the circuit board under test. This method enables the production test system to test various different models of circuit boards under test, and the entire test process can be automated, effectively improving the flexibility and test efficiency of the production test system.
[0045] Figure 2 The overall architecture of the exemplary test box disclosed in the present invention is shown. The test box may include an MCU, and a human-computer interaction unit, a WIFI unit, a storage unit, a Bluetooth unit, an environmental monitoring unit, a microphone sensor, a buzzer, a backup interface, and a production test interface electrically connected to the MCU.
[0046] MCU is mainly used for system calculation, task scheduling and logic control, etc. In order to enable MCU to connect more sensors and expand more production and testing interfaces, MCU can use single-chip microcomputers with more GPIO and peripheral interfaces, for example, MCU can be but not limited to STC51, MSP430, STM32, APOLL, PIC and other single-chip microcomputers.
[0047] The human-computer interaction unit is mainly used to realize UI human-computer interaction, and can realize menu display, data display, touch interaction, parameter setting, function selection and other functions. For example, when testing the circuit board under test, the model of the circuit board under test can be set through the human-computer interaction unit, so that the test box can know the model of the circuit board under test and smoothly complete the subsequent test process, or the test results during the test process can be displayed in real time through the human-computer interaction unit. Among them, the human-computer interaction unit can be but not limited to an LCD touch screen.
[0048] The WIFI unit is mainly used to realize the communication connection between the test box and the server, so that the test box can send test data to the server and obtain the firmware matching the tested circuit board or the firmware matching the test box from the server. In addition, the WIFI unit can also cooperate with the tested circuit board to test the WIFI of the tested circuit board. The specific test process will be described later.
[0049] The storage unit stores firmware matching various types of circuit boards under test. It is worth noting that, through the setting of the storage unit, when the test box establishes a communication connection with the server, the firmware matching the circuit board under test obtained by the test box from the server can be stored through the storage unit; when the test box does not establish a communication connection with the server, the firmware matching the circuit board under test stored in the test box can be directly written into the circuit board under test through the test box to complete the test of the circuit board under test, thereby improving the flexibility of the production test system when used. In addition, the storage unit is also suitable for storing the test data obtained after the self-test of the circuit board under test as described above. Among them, the storage unit can be, but is not limited to, Flash.
[0050] The Bluetooth unit is mainly used to test the Bluetooth function of the circuit board under test. The specific test process will be described later.
[0051] The environmental monitoring unit is mainly used to obtain environmental information of the environment in which the circuit board under test is located, such as temperature and air pressure, and provide it to the circuit board under test to test the environmental monitoring components of the circuit board under test. The specific test process will be described later. Among them, considering that the circuit board of the wearable device is generally equipped with a temperature sensor and an air pressure sensor for monitoring the ambient temperature and air pressure, the environmental monitoring unit of the test box can include a temperature sensor and an air pressure sensor.
[0052] The microphone sensor is mainly used to cooperate with the test of the audio playback function of the circuit board under test, that is, when testing the audio playback function of the circuit board under test, it can obtain the sound signal emitted by the circuit board under test to test the audio playback function of the circuit board under test.
[0053] The buzzer is mainly used to cooperate with the testing of the microphone sensor of the tested circuit board. That is, when testing the microphone sensor on the tested circuit board, the buzzer can be used to send the sound signal required for the test to the microphone sensor of the tested circuit board, so as to test the microphone sensor of the tested circuit board. In addition, the buzzer is also used to issue a reminder when the test of the tested circuit board is completed.
[0054] The spare interface is mainly used for the later expansion of external sensors to achieve the expansion of test items.
[0055] The production test interface is mainly used to achieve the electrical connection between the test box and the circuit board under test. The production test interface can include simulated battery voltage, charging voltage 5V motherboard (not shown in the figure), current test module, voltage A / D sampling port, firmware burning module, serial port, in-position identification GPIO and spare GPIO.
[0056] The simulated battery voltage is mainly used to power the circuit board under test. During this process, the power supply current can be measured in real time through the current test module.
[0057] The charging voltage 5V mainboard is mainly used to test the charging function of the circuit board under test. During this process, the charging current can be measured in real time through the current test module.
[0058] The voltage A / D sampling port is mainly used to test whether the 1.8V and 3.3V main power supplies of the circuit board under test are normal.
[0059] The firmware burning module is mainly used to write the firmware matching the circuit board under test into the circuit board under test according to the burning protocol.
[0060] The serial port is mainly used for communication between the test box and the circuit board under test.
[0061] The in-place identification GPIO is mainly used to identify whether the circuit board under test is in place, that is, whether it is placed on the fixture to be described below and has established an electrical connection with the test box. Among them, the level of the signal at the in-place identification GPIO can be used to determine whether the circuit board under test is in place, a low level indicates that it is in place, and a high level indicates that it is not in place.
[0062] The spare GPIO is mainly used for the expansion of later test items.
[0063] In order to ensure that the circuit board under test can reliably establish electrical connection with the test box and realize reliable fixation of the circuit board under test, such as Figure 1 As shown, the production test system disclosed in the present invention may also include a fixture corresponding to the circuit board under test.
[0064] The fixture is mainly used to position the circuit board under test. Figure 3As shown, the fixture may include a positioning groove, a test probe and a pressing member, wherein the positioning groove substantially matches the shape of the circuit board to be tested, so that the circuit board to be tested can be received and positioned in the positioning groove.
[0065] One end of the test probe establishes an electrical connection with the production test interface of the test box through the test line group, and the other end of the test probe can be located in the positioning groove and corresponds to the test pin on the circuit board under test. In this way, when the circuit board under test is placed in the positioning groove, the test probe can contact the test pin on the circuit board under test and form an electrical connection, thereby achieving an electrical connection between the circuit board under test and the test box.
[0066] The test probe can be, but is not limited to, a spring pin. In addition, one of the test probes is separately connected to the in-place identification GPIO of the production test interface so that the test box can identify whether the circuit board under test is in place. For example, when the circuit board under test is not positioned on the fixture, the signal at the in-place identification GPTD is high level. When the circuit board under test is positioned on the fixture, the test probe connected to the in-place identification GPIO will contact the corresponding test pin on the circuit board under test. At this time, the signal at the in-place identification GPTD will be pulled down to a low level to indicate that the circuit board under test is in place.
[0067] The pressing member is used to apply pressure to the circuit board under test toward the positioning groove after the circuit board under test is positioned in the positioning groove, so that the test pins on the circuit board under test can reliably contact the corresponding test probes and achieve reliable fixation of the circuit board under test. The pressing member can be a component that is arranged opposite to the positioning groove and can move closer to or farther from the positioning groove. For example, the pressing member can be a pressure plate that can move closer to or farther from the positioning groove under the drive of a linear actuator.
[0068] On the other hand, the present invention further discloses a production test method for testing a circuit board under test using the production test system described above, so as to more clearly and intuitively understand the process of the production test system disclosed in the present invention testing the circuit board under test.
[0069] Specifically, Figure 4 As shown, the production test method disclosed in the present invention includes:
[0070] Step S1: The test box is powered on and establishes a communication connection with the server.
[0071] Wherein, step S1 may also include: the test box obtains the version information of the firmware matching the test box from the server, and compares it with the version of its own firmware to determine whether the firmware of the test box needs to be upgraded. If the version of the firmware matching the test box stored in the server is higher, it means that the firmware of the test box needs to be upgraded, the test box obtains the firmware matching the test box from the server, and stores it in its own storage unit, and then the test box restarts to complete the upgrade of its own firmware.
[0072] Step S2: Setting the model of the circuit board to be tested in the test box through the human-computer interaction unit of the test box.
[0073] Wherein, step S2 may also include: the test box obtains the version information of the firmware matching the tested circuit board from the server, and compares it with the version of the firmware matching the tested circuit board stored in the test box to determine whether the firmware matching the tested circuit board needs to be updated. If the version of the firmware matching the tested circuit board stored in the test box is higher, the test box obtains the firmware matching the tested circuit board from the server and stores it in its own storage unit, so that the firmware subsequently written into the tested circuit board can better match the tested circuit board.
[0074] Step S3: Determine whether the circuit board under test is in place, that is, determine whether the circuit board under test is positioned on the fixture and has established electrical connection with the test box. If the circuit board under test is in place, the test box supplies power to the circuit board under test through its own simulated battery voltage.
[0075] Among them, step S3 may also include: the test box detects the power supply current and voltage when the circuit board under test is powered through its own current test module and voltage A / D sampling port, and compares the detected power supply current and voltage with the current threshold and voltage threshold respectively. If the power supply current and voltage exceed the threshold, the test box turns off the simulated battery voltage to stop power supply. At this time, the test box writes the fault code and ends the test, and the human-computer interaction unit of the test box displays the test result. If the power supply current is normal, enter step S4.
[0076] Step S4. The test box writes the firmware matching the circuit board under test into the circuit board under test according to the burning protocol. After the firmware matching the circuit board under test is written, the test box sends a test signal to the circuit board under test. The circuit board under test responds to the test signal and starts a self-test program to complete the self-test.
[0077] In step S4, the test box is also configured to wait for the circuit board under test to send test data after self-test within a predetermined time period. If the test box does not receive the test data sent by the circuit board under test within the predetermined time period, it means that the self-test of the circuit board under test fails, the test box writes a fault code and ends the test, and the human-computer interaction unit of the test box displays the test result; if the test box receives the test data sent by the circuit board under test within the predetermined time period, the test box stores the test data and sends the test data to the server, and the server stores the test data in the database and classifies and manages it.
[0078] It is worth noting that after the tested circuit board completes the self-test, it is necessary to determine whether there are other test items for the tested circuit board that need to be executed according to the test requirements. For example, other test items include testing of peripheral devices such as Bluetooth, WIFI, and environmental monitoring devices of the tested circuit board. If there are other test items that need to be executed, execute the other test items; if there are no other test items that need to be executed, end the test.
[0079] For ease of understanding, the following briefly describes the testing process for the Bluetooth, WIFI, and environmental monitoring devices of the circuit board under test.
[0080] Specifically, the process of testing the Bluetooth of the circuit board under test is as follows: the circuit board under test sends a Bluetooth test command containing its own Bluetooth name to the test box, the test box parses the Bluetooth name of the circuit board under test from the Bluetooth test command, and lets its own Bluetooth unit establish a connection with the Bluetooth of the circuit board under test. Subsequently, the test box sends test data to the Bluetooth of the circuit board under test through its own Bluetooth unit to test the Bluetooth of the circuit board under test, and after the test is completed, the test result is sent to the test box, and the Bluetooth connection is disconnected.
[0081] The process of testing the WIFI of the circuit board under test is as follows: the circuit board under test sends a WIFI test command containing its own WIFI name to the test box, the test box parses the WIFI name of the circuit board under test from the WIFI test command, and lets its own WIFI unit establish a connection with the WIFI of the circuit board under test. Subsequently, the test box sends test data to the WIFI of the circuit board under test through its own WIFI unit to test the WIFI of the circuit board under test, and after the test is completed, the test result is sent to the test box, and the WIFI connection is disconnected.
[0082] The process of testing the environmental monitoring device of the circuit board under test is as follows: the circuit board under test sends an environmental monitoring device test command to the test box, the test box obtains the environmental information detected by its own environmental monitoring unit and sends it to the circuit board under test, the circuit board under test compares the environmental information sent by the test box with the environmental information detected by its own environmental monitoring device to test the environmental monitoring device of the circuit board under test, and sends the test results to the test box after the test is completed.
[0083] Furthermore, if there are multiple other test items, the multiple other test items can be performed in sequence according to a predetermined time period. That is, each test item is executed in a predetermined time period, and will automatically jump to the next test item after reaching the predetermined time period. For example, the above-mentioned Bluetooth test, WIFI test, and environmental monitoring device test can be performed in sequence.
[0084] Specifically, the circuit board under test can send a Bluetooth test command, a WIFI test command, and an environmental monitoring device test command to the test box in sequence.
[0085] After the circuit board under test sends a Bluetooth test command to the test box, the circuit board under test waits for the data sent by the test box for testing Bluetooth within a predetermined time period. If the circuit board under test receives the data sent by the test box for testing Bluetooth within a predetermined time period, the circuit board under test sends the result of successful Bluetooth test to the test box and enters the WIFI test phase; if the circuit board under test does not receive the data sent by the test box for testing Bluetooth within a predetermined time period, the circuit board under test sends the result of failed Bluetooth test to the test box and enters the WIFI test phase. In other words, within the predetermined time period, regardless of whether the circuit board under test receives the data sent by the test box for testing Bluetooth, it will enter the WIFI test phase.
[0086] In the WIFI test phase, after the circuit board under test sends a WIFI test command to the test box, the circuit board under test waits for the data sent by the test box for testing WIFI within a predetermined time period. If the circuit board under test receives the data sent by the test box for testing WIFI within a predetermined time period, the circuit board under test sends the result of successful WIFI test to the test box and enters the environmental monitoring device test phase; if the circuit board under test does not receive the data sent by the test box for testing WIFI within a predetermined time period, the circuit board under test sends the result of failed WIFI test to the test box and enters the environmental monitoring device test phase. In other words, within the predetermined time period, regardless of whether the circuit board under test receives the data sent by the test box for testing WIFI, it will enter the environmental monitoring device test phase.
[0087] In the environmental monitoring device test phase, after the tested circuit board sends the environmental monitoring device test command to the test box, the tested circuit board waits for the environmental information sent by the test box within a predetermined time period. If the tested circuit board receives the environmental information sent by the test box within the predetermined time period, the tested circuit board compares the environmental information sent by the test box with the environmental information detected by its own environmental monitoring device, and sends the comparison result to the test box; if the tested circuit board does not receive the environmental information sent by the test box within the predetermined time period, the tested circuit board sends the result of the environmental monitoring device test failure to the test box. In other words, within the predetermined time period, regardless of whether the tested circuit board receives the environmental information sent by the test box, the test of the environmental monitoring device of the tested circuit board will end.
[0088] By analogy, when there are no other test items to be executed, the test of the circuit board under test is completed.
[0089] It is understandable that, through this approach, when errors occur in the execution process of one or more test items, the testing of the remaining test items will not be affected.
[0090] Of course, in addition to the above-mentioned tests on the Bluetooth, WIFI and environmental monitoring devices of the circuit board under test, other devices on the circuit board under test can also be tested through the cooperation of the test box and the circuit board under test, such as testing the microphone on the circuit board under test, which will not be elaborated here.
[0091] The above are only preferred embodiments of the present invention and are not intended to limit the present invention. For those skilled in the art, the present invention may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.
Claims
1. An automated production and testing system for wearable device circuit boards, characterized in that: It includes a server and a test box corresponding to the circuit board under test; The circuit board under test includes a processing chip with a self-test program embedded therein; The server is communicatively connected to the test box, and the server is configured to provide the test box with firmware matching the circuit board under test; The test box is electrically connected to the corresponding circuit board under test; the test box is configured to be able to write firmware matching the circuit board under test into the circuit board under test; and the test box is also configured to be able to send a test signal to the circuit board under test, and the circuit board under test can respond to the test signal and start the self-test program to complete the self-test.
2. The wearable device circuit board automated production and testing system according to claim 1, characterized in that: The circuit board under test is configured to be able to send test data obtained after self-testing to the test box, so as to send the test data to the server through the test box; The server is further configured to receive and store the test data sent by the test box to classify and manage the test data.
3. The wearable device circuit board automated production and testing system according to claim 1, characterized in that: The test box includes an MCU, and a storage unit and a production test interface electrically connected to the MCU; The storage unit stores firmware matching multiple models of the tested circuit boards; The production test interface is used for electrical connection between the test box and the circuit board under test.
4. The wearable device circuit board automated production and testing system according to claim 3, characterized in that: The production test interface includes an in-place identification GPIO, and the in-place identification GPIO is used to identify whether the circuit board under test is in place.
5. The wearable device circuit board automated production and testing system according to claim 1, characterized in that: The server is further configured to provide the test box with firmware matching the test box.
6. The wearable device circuit board automated production and testing system according to claim 1, characterized in that: It also includes a fixture corresponding to the circuit board under test; the fixture includes a positioning groove, a test probe and a pressing member; The positioning groove is configured to receive and position the circuit board under test, one end of the test probe is electrically connected to the test box; the other end of the test probe is located in the positioning groove and contacts the test pin on the circuit board under test to form an electrical connection; The pressing member is configured to apply pressure toward the positioning groove to the circuit board under test positioned in the positioning groove.
7. A production testing method, characterized in that: Using the wearable device circuit board automated production and testing system according to any one of claims 1 to 6, the production and testing method comprises: Step S1. The test box is powered on and establishes a communication connection with the server; Step S2. Entering the model of the circuit board under test in the test box; Step S3. Determine whether the circuit board under test is in place; if the circuit board under test is in place, the test box supplies power to the circuit board under test; Step S4. The test box writes the firmware matching the circuit board under test into the circuit board under test; After the firmware matching the circuit board under test is written, the test box sends a test signal to the circuit board under test, and the circuit board under test responds to the test signal and starts a self-test program to complete the self-test.
8. The production testing method according to claim 7, characterized in that: In step S4, the test box is configured to wait for the circuit board under test to send test data after self-test within a predetermined time period; Among them, if the test box does not receive the test data sent by the circuit board under test within a predetermined time period, the test box writes a fault code and ends the test; if the test box receives the test data sent by the circuit board under test within a predetermined time period, the test box sends the test data to the server, and the server stores the test data in a database and classifies and manages it.