Temperature cycle test equipment

Abstract

The invention relates to the technical field of test equipment, and particularly discloses temperature cycle test equipment, which comprises a carrying disc, a first temperature control platform, a second temperature control platform and a test assembly, a placement groove is formed in the carrying disc, and a to-be-tested chip can be placed in the placement groove; the first temperature control platform can bear the carrying disc and is used for transmitting temperature on one side of the chip to be tested; the second temperature control platform is provided with a temperature transfer cover plate, the temperature transfer cover plate can be pressed on the carrying disc, and the second temperature control platform can transfer temperature on the other side of the to-be-tested chip through the temperature transfer cover plate; the testing assembly is provided with a testing probe, and the testing assembly can be connected to the temperature transfer cover plate in a pressing mode so that the testing probe can be electrically connected to the chip to be tested. The temperature cycle test equipment transmits temperature through direct contact, is fast in temperature response, can prevent temperature difference between two sides of the to-be-tested chip, avoids influence on the test precision of the to-be-tested chip, is high in test efficiency due to fast temperature increasing and decreasing speed, and improves the energy consumption utilization rate.

Description

Technical Field

[0001] The present invention relates to the technical field of testing equipment, and in particular to a temperature cycle testing equipment. Background Art

[0002] Temperature cycle test is a reliability test method used to test the stability and reliability of products under different temperature environments. It can expose potential material defects and manufacturing quality defects in products and evaluate product weaknesses, so it is widely used in various fields. During the test, the test conditions need to be adjusted according to the product application conditions, such as temperature change rate, number of cycles, etc.

[0003] At present, the temperature cycle test of the chip is generally carried out through a high and low temperature chamber. In the prior art, after the chip to be tested is placed in the high and low temperature chamber, the temperature is increased and decreased through the heating wire and the compressor condenser inside the chamber, and the temperature is transmitted to the chip to be tested through the air, so as to achieve the purpose of reciprocating temperature increase of the chip to be tested in the chamber. However, the high and low temperature chamber indirectly transmits the temperature to the chip to be tested through the air, and its temperature response is slow, which in turn affects the test accuracy. In addition, due to the slow heating and cooling speed, the test efficiency is affected, and the energy consumption utilization rate is low. Summary of the invention

[0004] The purpose of the present invention is to provide a temperature cycle test device to solve the problem that in the existing test process, the temperature response of the chip to be tested is slow, which in turn affects the test accuracy, and the test efficiency is affected due to the slow heating and cooling speed, resulting in low energy consumption utilization.

[0005] To achieve the above object, the present invention adopts the following technical solutions:

[0006] The present invention provides a temperature cycle test device for performing a temperature cycle test on a chip to be tested, the temperature cycle test device comprising:

[0007] A carrier plate, wherein a placement slot is provided on the carrier plate, and the chip to be tested can be placed in the placement slot;

[0008] A first temperature control platform, which can carry the carrier and is used to transfer temperature on one side of the chip to be tested;

[0009] A second temperature control platform, wherein the second temperature control platform is provided with a temperature transfer cover plate, and the temperature transfer cover plate can be pressed onto the carrier; the first temperature control platform can transfer the temperature on the other side of the chip to be tested through the temperature transfer cover plate;

[0010] A test component is provided with a test probe, and the test component can be crimped onto the temperature transfer cover plate so that the test probe is electrically connected to the chip to be tested.

[0011] As an optional solution for the above-mentioned temperature cycle test equipment, a film is provided on the side of the temperature transfer cover plate facing the carrier plate, and a conductive contact is provided on the film. The temperature transfer cover plate is provided with a through groove, and the test probe, the through groove, the conductive contact and the chip to be tested can be arranged relatively to each other in sequence.

[0012] As an optional solution for the above-mentioned temperature cycle testing equipment, a plurality of positioning protrusions are protruding from the outer periphery of the temperature transfer cover plate toward the side of the carrier plate, and the film is provided with a plurality of mounting through holes, and a plurality of the positioning protrusions are inserted into a plurality of the mounting through holes in a one-to-one correspondence.

[0013] As an optional solution of the above-mentioned temperature cycle testing equipment, the placement groove includes a positioning surface and a guide surface, the positioning surface is perpendicular to the bottom of the placement groove; the guide surface is inclined toward the opening of the placement groove, and the guide surface is located above the positioning surface.

[0014] As an optional solution of the above-mentioned temperature cycle test equipment, the carrier plate is further provided with an avoidance groove, and the avoidance groove is connected to the diagonal position of the placement groove.

[0015] As an optional solution for the above-mentioned temperature cycle test equipment, a plurality of positioning members are arranged on the periphery of the first temperature control platform, a plurality of first positioning holes are opened on the carrier plate, a plurality of second positioning holes are opened on the temperature transfer cover plate, and a plurality of the positioning members can be inserted into a plurality of the first positioning holes and a plurality of the second positioning holes one by one.

[0016] As an optional solution of the above-mentioned temperature cycle testing equipment, the temperature cycle testing equipment also includes a first lifting assembly and a second lifting assembly, the driving end of the first lifting assembly is connected to the second temperature control platform for driving the second temperature control platform to rise and fall, and the driving end of the second lifting assembly is connected to the test assembly for driving the test assembly to rise and fall.

[0017] As an optional solution for the above-mentioned temperature cycle test equipment, a plurality of guide members are further arranged on the periphery of the test component, and the temperature transfer cover plate is provided with a plurality of positioning grooves, and a plurality of the guide members can be inserted into the plurality of positioning grooves in a one-to-one corresponding manner.

[0018] As an optional solution of the above-mentioned temperature cycle test equipment, the temperature cycle test equipment further includes a temperature sensor, and the temperature sensor is used to detect the temperature of the chip to be tested.

[0019] As an optional solution of the above-mentioned temperature cycle test equipment, a plurality of placement slots are provided, and a plurality of the chips to be tested can be placed in the plurality of placement slots one by one; a plurality of groups of test probes are provided, and a plurality of groups of test probes can be electrically connected to a plurality of the chips to be tested one by one.

[0020] The beneficial effects of the present invention are:

[0021] The temperature cycle test equipment includes a carrier, a first temperature control platform, a second temperature control platform and a test assembly. A placement slot is provided on the carrier, and the chip to be tested can be placed in the placement slot, so that the chip to be tested can be carried by the placement slot, which is convenient for the carrier to store and carry the chip to be tested, and to transfer and transport the chip to be tested. Among them, the first temperature control platform can carry the carrier, which is used to transfer the temperature on one side of the chip to be tested, the second temperature control platform is provided with a temperature transfer cover plate, the temperature transfer cover plate can be crimped on the carrier, the second temperature control platform can transfer the temperature on the other side of the chip to be tested through the temperature transfer cover plate, and the test assembly is provided with a test probe, the test assembly can be crimped on the temperature transfer cover plate, so that the test probe is electrically connected to the chip to be tested, so that the test assembly can perform a temperature cycle test on the chip to be tested, the temperature cycle test equipment transfers temperature by direct contact, its temperature response is fast, and it can prevent temperature difference on both sides of the chip to be tested, avoid affecting the test accuracy of the chip to be tested, and at the same time, due to the fast heating and cooling speed, the test efficiency is high, thereby improving the energy consumption utilization rate. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 A schematic diagram of the structure of a temperature cycle test device provided in an embodiment of the present invention;

[0023] Figure 2 A first partial enlarged view of the temperature cycle test device provided in an embodiment of the present invention;

[0024] Figure 3 A second partial enlarged view of the temperature cycle test device provided in an embodiment of the present invention;

[0025] Figure 4 This is a third partial enlarged view of the temperature cycle testing device provided in an embodiment of the present invention.

[0026] In the figure:

[0027] 1. Carrying plate; 11. Placement groove; 111. Positioning surface; 112. Guide surface; 12. Avoidance groove; 13. First positioning hole; 2. First temperature control platform; 3. Second temperature control platform; 31. Temperature transfer cover; 311. Through groove; 312. Positioning protrusion; 313. Second positioning hole; 314. Positioning groove; 32. Film; 321. Conductive contact; 4. Test assembly; 41. Test probe; 42. Guide piece; 5. Chip to be tested. DETAILED DESCRIPTION

[0028] The technical solution of the present invention will be described clearly and completely below in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0029] In the description of the present invention, it should be noted that the orientations or positional relationships indicated by the terms "center", "up", "down", "left", "right", "vertical", "horizontal", "inside", "outside", etc. are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first" and "second" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance. Among them, the terms "first position" and "second position" are two different positions, and the first feature "above", "above" and "above" the second feature include the first feature being directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. The first feature "below", "below" and "below" the second feature include the first feature being directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0030] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0031] Embodiments of the present invention are described in detail below, examples of which are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and cannot be understood as limiting the present invention.

[0032] like Figure 1 to Figure 4 As shown, this embodiment provides a temperature cycle test device for performing a temperature cycle test on a chip 5 to be tested.

[0033] The temperature cycle test equipment comprises a carrier plate 1, a first temperature control platform 2, a second temperature control platform 3 and a test assembly 4. The carrier plate 1 is provided with a placement slot 11, and the chip to be tested 5 can be placed in the placement slot 11, so that the chip to be tested 5 can be carried by the placement slot 11, which is convenient for the carrier plate 1 to store and carry the chip to be tested 5, and to transfer and transport the chip to be tested 5.

[0034] Among them, the first temperature control platform 2 can carry the carrier 1, which is used to transfer temperature on one side of the chip to be tested 5. The second temperature control platform 3 is provided with a temperature transfer cover 31, which can be crimped on the carrier 1. The second temperature control platform 3 can transfer temperature on the other side of the chip to be tested 5 through the temperature transfer cover 31, and the test component 4 is provided with a test probe 41, which can be crimped on the temperature transfer cover 31 so that the test probe 41 is electrically connected to the chip to be tested 5, so that the test component 4 can perform a temperature cycle test on the chip to be tested 5. The temperature cycle test equipment transfers temperature through direct contact, and its temperature response is fast. It can also prevent temperature difference on both sides of the chip to be tested 5, thereby avoiding affecting the test accuracy of the chip to be tested 5. At the same time, due to the fast heating and cooling speed, the test efficiency is high, thereby improving the energy consumption utilization rate.

[0035] At the same time, a plurality of placement slots 11 are provided, and a plurality of chips to be tested 5 can be placed in the plurality of placement slots 11 in a one-to-one correspondence. A plurality of groups of test probes 41 are provided, and a plurality of groups of test probes 41 can be electrically connected to a plurality of chips to be tested 5 in a one-to-one correspondence, so that a plurality of chips to be tested 5 can be placed on the carrier 1 at the same time, so that the temperature cycle test equipment can test a plurality of chips to be tested 5 at the same time, and its test rate is relatively fast, which is suitable for mass testing of the chips to be tested 5. Optionally, the temperature cycle test equipment further includes a temperature sensor, which is used to detect the temperature of the chip to be tested 5. The temperature sensor detects the real-time temperature of the chip to be tested 5, improves the detection accuracy, and prevents the first temperature control platform 2 and / or the second temperature control platform 3 from malfunctioning and causing a difference in temperature rise and fall.

[0036] like Figure 2 and Figure 3 As shown, a film 32 is provided on the side of the temperature transfer cover 31 facing the carrier 1, and a conductive contact 321 is provided on the film 32. The temperature transfer cover 31 is provided with a through slot 311, and the test probe 41, the through slot 311, the conductive contact 321 and the chip to be tested 5 can be arranged relatively in sequence, so that the test probe 41 can abut against the conductive contact 321 after passing through the through slot 311, and the film 32 is deformed, and then the conductive contact 321 can abut against the chip to be tested 5, so as to realize the electrical connection between the test probe 41 and the chip to be tested 5. By using the film 32 and the conductive contact 321, the test probe 41 can be prevented from directly contacting the chip to be tested 5, and at the same time, the film 32 and the conductive contact 321 are used for buffering, so that the chip to be tested 5 is prevented from being damaged.

[0037] Specifically, a plurality of positioning protrusions 312 are protruding from the outer periphery of the temperature transfer cover plate 31 toward the side of the carrier plate 1, and a plurality of mounting through holes are opened in the film 32. The plurality of positioning protrusions 312 are inserted into the plurality of mounting through holes in a one-to-one correspondence, so that the through grooves 311 and the conductive contacts 321 on the film 32 can be made to correspond to each other through the positioning installation between the positioning protrusions 312 and the mounting through holes, thereby preventing misalignment from causing the temperature transfer cover plate 31 to block the conductive contacts 321 and affect the circuit connection.

[0038] like Figure 3 and Figure 4 As shown, the placement groove 11 includes a positioning surface 111 and a guide surface 112, the positioning surface 111 is perpendicular to the bottom of the placement groove 11, the guide surface 112 is inclined toward the opening of the placement groove 11, and the guide surface 112 is located above the positioning surface 111, so that the placement of the chip 5 to be tested in the placement groove 11 can be guided by the guide surface 112, reducing the difficulty of placement, so that the chip 5 to be tested can slide to the bottom of the groove, and the positioning of the chip 5 to be tested is achieved by the positioning surface 111, preventing the chip 5 to be tested from failing due to position error during the temperature cycle test. Optionally, the carrier 1 is also provided with an avoidance groove 12, and the avoidance groove 12 is connected to the diagonal part of the placement groove 11, so that the avoidance groove 12 can avoid the diagonal part of the chip 5 to be tested, avoiding damage to the diagonal part of the chip 5 to be tested, and at the same time, it is convenient to remove the chip 5 to be tested from the avoidance groove 12.

[0039] Further, a plurality of positioning members are arranged on the periphery of the first temperature control platform 2, a plurality of first positioning holes 13 are provided on the carrier plate 1, and a plurality of second positioning holes 313 are provided on the temperature transfer cover plate 31, and a plurality of positioning members can be inserted into the plurality of first positioning holes 13 and the plurality of second positioning holes 313 one by one, so that the carrier plate 1 and the temperature transfer cover plate 31 can be positioned by the positioning members to prevent misalignment between the carrier plate 1 and the temperature transfer cover plate 31 and affect the temperature cycle test. Optionally, the positioning member is a positioning pin.

[0040] like Figure 1 to Figure 3As shown, the temperature cycle test equipment also includes a first lifting component and a second lifting component. The driving end of the first lifting component is connected to the second temperature control platform 3, which is used to drive the second temperature control platform 3 to rise and fall, so that the second temperature control platform 3 can drive the temperature transfer cover 31 to rise and fall, so that the temperature transfer cover 31 abuts against the carrier or is separated from the carrier. The driving end of the second lifting component is connected to the test component 4, which is used to drive the test component 4 to rise and fall, so that the test component 4 can drive the test probe 41 to rise and fall, so that the test probe 41 is electrically connected to the chip 5 to be tested or is separated from the chip 5 to be tested. Optionally, a plurality of guide members 42 are further provided on the periphery of the test component 4, and a plurality of positioning grooves 314 are opened on the temperature transfer cover plate 31. The plurality of guide members 42 can be inserted into the plurality of positioning grooves 314 in a one-to-one correspondence. Thus, through the setting of the guide members 42 and the positioning grooves 314, the test component 4 and the temperature transfer cover plate 31 can be guided and aligned, and then the test probe 41 can be electrically connected to the chip to be tested 5, so as to avoid damage to the test probe 41 due to misalignment between the test component 4 and the temperature transfer cover plate 31.

[0041] Obviously, the above embodiments of the present invention are merely examples for clearly illustrating the present invention, and are not intended to limit the embodiments of the present invention. For those skilled in the art, other different forms of changes or modifications can be made based on the above description. It is not necessary and impossible to list all the embodiments here. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the protection scope of the claims of the present invention.

Claims

1. A temperature cycle test device for performing a temperature cycle test on a chip to be tested (5), characterized in that: The temperature cycle test equipment comprises: A carrier plate (1), wherein a placement groove (11) is provided on the carrier plate (1), and the chip to be tested (5) can be placed in the placement groove (11); A first temperature control platform (2), the first temperature control platform (2) being capable of carrying the carrier (1) and being used for transferring temperature on one side of the chip to be tested (5); A second temperature control platform (3), wherein the second temperature control platform (3) is provided with a temperature transfer cover plate (31), and the temperature transfer cover plate (31) can be pressed onto the carrier plate (1); the first temperature control platform (2) can transfer temperature on the other side of the chip to be tested (5) through the temperature transfer cover plate (31); A test component (4), wherein the test component (4) is provided with a test probe (41), and the test component (4) can be crimped onto the temperature transfer cover plate (31) so that the test probe (41) is electrically connected to the chip to be tested (5).

2. The temperature cycle test equipment according to claim 1, characterized in that: A film (32) is arranged on the side of the temperature transfer cover plate (31) facing the carrier plate (1), and a conductive contact (321) is arranged on the film (32). The temperature transfer cover plate (31) is provided with a through slot (311), and the test probe (41), the through slot (311), the conductive contact (321) and the chip to be tested (5) can be arranged relatively to each other in sequence.

3. The temperature cycle test equipment according to claim 2, characterized in that: A plurality of positioning protrusions (312) are protrudingly provided on the outer periphery of the heat transfer cover plate (31) on one side facing the carrier plate (1), and a plurality of mounting through holes are opened on the film (32), and the plurality of positioning protrusions (312) are inserted into the plurality of mounting through holes in a one-to-one correspondence.

4. The temperature cycle test equipment according to claim 1, characterized in that: The placement groove (11) comprises a positioning surface (111) and a guide surface (112); the positioning surface (111) is perpendicular to the groove bottom of the placement groove (11); the guide surface (112) is arranged to be inclined toward the opening of the placement groove (11), and the guide surface (112) is located above the positioning surface (111).

5. The temperature cycle test equipment according to claim 4, characterized in that: The carrier plate (1) is also provided with an avoidance groove (12), and the avoidance groove (12) is connected to the diagonal position of the placement groove (11).

6. The temperature cycle test equipment according to claim 1, characterized in that: A plurality of positioning members are arranged on the outer periphery of the first temperature control platform (2), the carrier plate (1) is provided with a plurality of first positioning holes (13), the temperature transfer cover plate (31) is provided with a plurality of second positioning holes (313), and a plurality of the positioning members can be inserted into a plurality of the first positioning holes (13) and a plurality of the second positioning holes (313) in a one-to-one correspondence.

7. The temperature cycle test equipment according to claim 1, characterized in that: The temperature cycle test device further comprises a first lifting assembly and a second lifting assembly, wherein a driving end of the first lifting assembly is connected to the second temperature control platform (3) for driving the second temperature control platform (3) to be lifted and lowered, and a driving end of the second lifting assembly is connected to the test assembly (4) for driving the test assembly (4) to be lifted and lowered.

8. The temperature cycle test equipment according to claim 7, characterized in that: The outer periphery of the test assembly (4) is also provided with a plurality of guide members (42), the temperature transfer cover plate (31) is provided with a plurality of positioning grooves (314), and the plurality of guide members (42) can be inserted into the plurality of positioning grooves (314) in a one-to-one corresponding manner.

9. The temperature cycle test equipment according to claim 1, characterized in that: The temperature cycle test equipment further comprises a temperature sensor, and the temperature sensor is used to detect the temperature of the chip (5) to be tested.

10. The temperature cycle test equipment according to any one of claims 1 to 9, characterized in that: A plurality of the placement slots (11) are provided, and a plurality of the chips to be tested (5) can be placed in the plurality of placement slots (11) in a one-to-one correspondence; a plurality of groups of the test probes (41) are provided, and a plurality of groups of the test probes (41) can be electrically connected to a plurality of the chips to be tested (5) in a one-to-one correspondence.

Images