Temperature control method and related equipment

By identifying the protective film and shell and dynamically adjusting the thermal control strategy, the temperature control problem of electronic equipment after using protective accessories is solved, achieving a balanced optimization of safety and performance.

CN119987459BActive Publication Date: 2025-09-09XIAN GLORY TERMINAL CO LTD
View PDF 2 Cites 0 Cited by

Patent Information

Application Number
CN202510474028.7
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2025-04-16
Publication Date
2025-09-09
Estimated Expiration
2045-04-16

AI Technical Summary

Technical Problem

Overheating of electronic devices during use may cause burns and degraded device performance. Existing thermal control strategies cannot adapt to changes in users' use of protective accessories, affecting safety and performance satisfaction.

Method used

By identifying whether the electronic device is using a protective film and/or protective case, the thermal control strategy is dynamically switched, the hotspot temperature is obtained based on sensor data fitting, and the device performance parameters are adjusted to meet user needs.

Benefits of technology

Without affecting user safety, the device performance requirements are met to the greatest extent possible, avoiding the risk of burns and optimizing device performance.

✦ Generated by Eureka AI based on patent content.

Smart Images

  • Figure CN119987459B_ABST
    Figure CN119987459B_ABST
Patent Text Reader

Abstract

The present application provides a temperature control method and related equipment, which relate to the field of terminal technology. The temperature control method includes: when the electronic device is not using protective accessories, a first thermal control strategy is used to control the temperature of the device; when the electronic device is using protective accessories, a second thermal control strategy different from the first thermal control strategy is used to control the temperature of the device, and both the first thermal control strategy and the second thermal control strategy include adjusting the working parameters of at least one of the following: processor, memory, display, communication module, audio module, camera module, battery charging and discharging module. Using the above method, the thermal control strategy is dynamically switched based on whether the electronic device uses protective accessories to meet the user's device performance requirements to the greatest extent.
Need to check novelty before this filing date? Find Prior Art

Description

Technical Field

[0001] The present application relates to the field of terminal technology, and in particular to a temperature control method and related equipment. Background Art

[0002] With the development of mobile internet, electronic devices are becoming increasingly powerful, and more and more people are using them in their daily lives and work. During the operation of electronic devices, overheating can cause burns and affect user safety. Therefore, there is a need for temperature control during the use of electronic devices. Summary of the Invention

[0003] In order to overcome the problems existing in the related art, the present application provides a temperature control method and related equipment.

[0004] In a first aspect, the present application provides a temperature control method applied to an electronic device, the temperature control method comprising: when the electronic device does not use protective accessories, adopting a first thermal control strategy to control the device temperature; when the electronic device uses protective accessories, adopting a second thermal control strategy different from the first thermal control strategy to control the device temperature, the first thermal control strategy and the second thermal control strategy both including adjusting the working parameters of at least one of the following: processor, memory, display, communication module, audio module, camera module, and battery charging and discharging module.

[0005] By adopting the above technical solution, since the device temperature perceived by the user when using protective accessories is different from the device temperature perceived by the user when not using protective accessories, the electronic device dynamically switches the thermal control strategy based on whether the protective accessories are used, thereby achieving the maximum satisfaction of the user's device performance requirements without affecting the safety of the user during use of the device.

[0006] In a possible implementation, the protective accessory includes a protective film and / or a protective case.

[0007] By adopting the above technical solution, protective accessories include but are not limited to protective films and protective cases. When electronic devices use protective films and / or protective cases, a thermal control strategy different from that of the bare device can be adopted to achieve the maximum satisfaction of the user's device performance requirements without affecting the safety of the user during use of the device.

[0008] In one possible implementation, the electronic device includes a display screen and a housing, the protective accessory includes a protective film provided on the display screen, and a second thermal control strategy different from the first thermal control strategy is adopted to control the device temperature, including: obtaining a first hotspot temperature on the surface of the protective film and a second hotspot temperature on the surface of the housing; and controlling the device temperature based on the second thermal control strategy and the larger of the first hotspot temperature and the second hotspot temperature.

[0009] By adopting the above technical solution, temperature control is performed based on the highest hot spot temperature of the protective film surface and the outer shell surface in contact with the user and the corresponding thermal control strategy, which can meet the user's device performance requirements to the greatest extent while ensuring the user's safety during use of the device.

[0010] In one possible implementation, the temperature control method also includes: obtaining the thickness of the protective film; performing device temperature control based on a second thermal control strategy and the larger of the first hotspot temperature and the second hotspot temperature, including: performing device temperature control based on a second thermal control strategy corresponding to the thickness of the protective film and the larger of the first hotspot temperature and the second hotspot temperature.

[0011] Using the above technical solution, protective films of different thicknesses may have different effects on the hotspot temperature and thermal insulation effect on the display surface. By setting protective films of different thicknesses to correspond to different thermal control strategies, more accurate temperature control of electronic equipment can be achieved, and the user's device performance requirements can be met to the greatest extent without affecting the safety of the user during use of the device.

[0012] In one possible implementation, the electronic device includes multiple first sensors for sensing the temperature of the display screen and multiple second sensors for sensing the temperature of the outer shell, and obtains the first hotspot temperature of the protective film surface and the second hotspot temperature of the outer shell surface, including: fitting the temperatures of multiple first position points located on the surface of the protective film based on the temperature sensing data of the multiple first sensors, and taking the maximum temperature of the multiple first position points as the first hotspot temperature; fitting the temperatures of multiple second position points located on the surface of the outer shell based on the temperature sensing data of the multiple second sensors, and taking the maximum temperature of the multiple second position points as the second hotspot temperature.

[0013] By adopting the above technical solution, the temperature sensor data arranged in the electronic device is fitted to accurately map the temperature sensor data into the temperature distribution of the device surface and the surface of the protective accessories, so as to accurately reflect the hot spot temperature of the surface that comes into contact with the user (the shell surface and the protective film surface), thereby avoiding the risk of burns when the user comes into contact with the electronic device and meeting the user's device performance requirements to the greatest extent.

[0014] In one possible implementation, the display screen includes a third sensor for detecting a protective film, and the temperature control method further includes: in response to a first touch operation on the display screen, obtaining sensing data of the third sensor, the third sensor including a capacitive touch sensor or an elastic wave sensor; based on the sensing data of the third sensor, determining whether a protective film is provided on the display screen and the thickness of the protective film.

[0015] By adopting the above technical solution, it is possible to accurately identify whether a protective film is provided on the display screen and the thickness of the protective film.

[0016] In one possible implementation, the electronic device includes a display screen and a housing, the protective accessory includes a protective shell disposed on the housing, and a second thermal control strategy different from the first thermal control strategy is adopted to control the device temperature, including: obtaining a third hotspot temperature on the surface of the display screen and a fourth hotspot temperature on the surface of the protective shell; and controlling the device temperature based on the second thermal control strategy and the larger of the third hotspot temperature and the fourth hotspot temperature.

[0017] By adopting the above technical solution, temperature control is performed based on the highest hot spot temperature of the display surface and the protective case surface that come into contact with the user and the corresponding thermal control strategy. This can meet the user's device performance requirements to the greatest extent while ensuring the user's safety during use of the device.

[0018] In one possible implementation, the temperature control method also includes: obtaining the material and / or thickness of the protective shell; performing device temperature control based on the second thermal control strategy and the larger of the third hotspot temperature and the fourth hotspot temperature, including: performing device temperature control based on the second thermal control strategy corresponding to the material and / or thickness of the protective shell and the larger of the third hotspot temperature and the fourth hotspot temperature.

[0019] By adopting the above technical solution, protective shells of different materials and / or thicknesses may have different effects on the hot spot temperature of the outer shell surface and the thermal insulation effect. By setting protective shells of different materials and / or thicknesses to correspond to different thermal control strategies, more accurate temperature control of electronic equipment can be achieved, and the user's device performance requirements can be met to the greatest extent without affecting the safety of the user during use of the device.

[0020] In one possible implementation, the electronic device includes multiple first sensors for sensing the temperature of the display screen and multiple second sensors for sensing the temperature of the outer shell, and obtains a third hotspot temperature on the surface of the display screen and a fourth hotspot temperature on the surface of the protective shell, including: fitting the temperatures of multiple third position points located on the surface of the display screen based on the temperature sensing data of the multiple first sensors, and taking the maximum temperature of the multiple third position points as the third hotspot temperature; fitting the temperatures of multiple fourth position points located on the surface of the protective shell based on the temperature sensing data of the multiple second sensors, and taking the maximum temperature of the multiple fourth position points as the fourth hotspot temperature.

[0021] By adopting the above technical solution, the temperature sensor data arranged in the electronic device is fitted to accurately map the temperature sensor data into the temperature distribution of the device surface and the surface of the protective accessories, so as to accurately reflect the hot spot temperature of the surface that comes into contact with the user (the display surface and the protective case surface), thereby avoiding the risk of burns when the user comes into contact with the electronic device and meeting the user's device performance requirements to the greatest extent.

[0022] In one possible implementation, the electronic device includes a display screen and a housing, and the protective accessories include a protective film provided on the display screen and a protective shell provided on the housing. A second thermal control strategy different from the first thermal control strategy is adopted to control the device temperature, including: obtaining a first hotspot temperature on the surface of the protective film and a fourth hotspot temperature on the surface of the protective shell; and controlling the device temperature based on the second thermal control strategy and the larger of the first hotspot temperature and the fourth hotspot temperature.

[0023] By adopting the above technical solution, temperature control is performed based on the highest hot spot temperature of the protective film surface and the protective shell surface in contact with the user and the corresponding thermal control strategy, which can meet the user's device performance requirements to the greatest extent while ensuring the user's safety during use of the device.

[0024] In one possible implementation, the temperature control method further includes: obtaining the thickness of the protective film; obtaining the material and / or thickness of the protective shell; and determining a second thermal control strategy based on the thickness of the protective film and the material and / or thickness of the protective shell.

[0025] By adopting the above technical solution, protective films of different thicknesses may have different effects on the hotspot temperature of the display screen surface and the thermal insulation effect. Protective cases of different materials and / or thicknesses may also have different effects on the hotspot temperature of the outer shell surface and the thermal insulation effect. By setting a variety of thermal control strategies, corresponding to protective films and protective cases in various situations, more accurate temperature control of electronic equipment can be achieved, and the user's device performance requirements can be met to the greatest extent without affecting the safety of the user during use of the device.

[0026] In one possible implementation, the electronic device includes a first interface electrically connected to the protective shell, and the temperature control method further includes: determining whether a protective shell is provided on the shell based on connection information of the first interface, the first interface including a universal serial bus (USB) interface or an interface electrically connected to a pogo pin (Pogopin).

[0027] By adopting the above technical solution, the electronic device can reuse the existing interface module and accurately identify whether a protective cover is provided on the housing without the need for additional hardware configuration.

[0028] In a possible implementation, the protective shell includes a Hall sensor, and the temperature control method further includes: determining whether the protective shell is provided on the housing based on sensing data reported by the Hall sensor.

[0029] By adopting the above technical solution, it is possible to accurately identify whether a protective shell is provided on the housing by reusing the existing Hall sensor on the protective shell.

[0030] In one possible implementation, the electronic device includes a wireless charging module, and the temperature control method further includes: when the electronic device is charged based on the wireless charging module, obtaining the transmission power and quality factor during the wireless charging process; based on the transmission power and quality factor, determining whether a protective shell is provided on the outer shell.

[0031] By adopting the above technical solution, the electronic device can reuse the existing wireless charging module and accurately identify whether a protective case is provided on the outer shell without the need for additional hardware configuration.

[0032] In one possible implementation, the temperature control method also includes: in response to a second touch operation on the display screen, obtaining a signal amount of the second touch operation, the second touch operation being an operation in which the user holds the electronic device with his hand and touches the display screen; based on the signal amount of the second touch operation, determining whether a protective shell is provided on the outer shell.

[0033] By adopting the above technical solution, the electronic device can accurately identify whether a protective case is provided on the casing based on the antenna feed ground of the frame or the metal casing, without the need for additional hardware configuration.

[0034] In one possible implementation, the electronic device includes a fourth sensor for detecting a protective shell, and the fourth sensor is arranged below the surface of the shell. The temperature control method also includes: obtaining sensing data of the fourth sensor, the fourth sensor including one of the following: an elastic wave sensor, an acceleration + gyroscope sensor, a light sensor, and a capacitive touch sensor; based on the sensing data of the fourth sensor, determining whether a protective shell is provided on the shell.

[0035] By adopting the above technical solution, the electronic device can reuse existing sensors (acceleration + gyroscope sensor) or add additional sensors to accurately identify whether a protective case is provided on the outer shell.

[0036] In one possible implementation, the temperature control method further includes: obtaining a preset hot zone temperature and a preset cold zone temperature of the electronic device in a high-heat state, the high-heat state including a charging state or a hardware performance overload state; and determining whether a protective shell is provided on the outer shell based on the temperature difference between the preset hot zone temperature and the preset cold zone temperature.

[0037] By adopting the above technical solution, the electronic device can reuse the existing temperature sensor to accurately identify whether a protective cover is provided on the housing without the need for additional hardware configuration.

[0038] In a possible implementation, the temperature control method further includes: when it is determined that the electronic device uses a protective accessory, displaying a first window including information about the protective accessory.

[0039] With the above technical solution, after intelligently identifying the protective accessory information, the information of the protective accessory can be visually displayed through pop-up boxes / notification bars / floating windows, etc., so that users can know whether the intelligent identification results are accurate and provide feedback on misidentification.

[0040] In one possible implementation, the temperature control method further includes: in response to a first operation, displaying a first interface, the first interface including controls for setting protective accessories used by the electronic device; and determining the protective accessories used by the electronic device based on a second operation on the controls.

[0041] The above technical solution can also support users to manually configure the protective accessories used by electronic devices to meet the user's device performance requirements to the greatest extent, and avoid the possibility of misidentification by intelligent recognition affecting the accuracy of device temperature control.

[0042] In the second aspect, the present application provides a temperature control method applied to an electronic device, the temperature control method comprising: when the electronic device is not using protective accessories, the maximum surface temperature of the electronic device is less than or equal to the safety temperature, and the surface temperature includes the temperature of the display surface and the temperature of the outer casing surface; when the electronic device is using protective accessories, the maximum surface temperature of the electronic device may be greater than the safety temperature.

[0043] By adopting the above technical solution, since the device temperature perceived by the user when using the protective accessories is lower than the device temperature perceived by the user when not using the protective accessories, when using the protective accessories, the maximum value of the device surface temperature can be allowed to be greater than the safety temperature. In this case, due to the presence of the protective accessories, the temperature of the protective accessory surface is lower than the safety temperature, which will not affect the safety of the user when using the device, and can maximize the satisfaction of the user's device performance requirements.

[0044] In a possible implementation, when the electronic device uses a protective accessory, the difference between the maximum surface temperature of the electronic device and the safety temperature is greater than a preset value.

[0045] By adopting the above technical solution, when using protective accessories, the maximum surface temperature of the electronic device can allow a significant safety temperature. Based on the thermal insulation of the protective accessories, it will not affect the safety of the user when using the device, and can meet the user's device performance requirements to the greatest extent.

[0046] In a third aspect, the present application provides a temperature control method, which is applied to an electronic device. The temperature control method includes: if the electronic device does not use protective accessories, the performance of the electronic device in a first preset scenario is a first performance, and the performance of the electronic device includes at least one of the following: processor performance, memory performance, display performance, communication module performance, audio module performance, camera module performance, and battery charging and discharging module performance; if the electronic device uses protective accessories, the performance of the electronic device in the first preset scenario is a second performance, and the second performance is higher than the first performance.

[0047] By adopting the above technical solution, since the device temperature perceived by the user when using protective accessories is lower than the device temperature perceived by the user when not using protective accessories, when using protective accessories, the device can be allowed to use relatively relaxed working parameters to operate, and performance release is relaxed. When not using protective accessories, the device uses relatively tightened working parameters to operate, and performance release is tightened. In the same scenario, the performance of the device using protective accessories is higher than that of the device not using protective accessories, thereby meeting the user's device performance requirements to the greatest extent.

[0048] In a possible implementation, in the second preset scenario, a difference between a maximum surface temperature of the electronic device with the protective accessory used and a maximum surface temperature of the electronic device without the protective accessory used is greater than a preset value.

[0049] By adopting the above technical solution, when using protective accessories, the maximum surface temperature of the electronic device can be significantly greater than the maximum surface temperature when not using protective accessories. Based on the thermal insulation of the protective accessories, it will not affect the safety of the user when using the device, and can maximize the satisfaction of the user's device performance requirements.

[0050] In a fourth aspect, the present application provides an electronic device, which includes a memory and a processor; the memory and the processor are coupled; the memory is used to store program instructions; the processor is used to read the program instructions stored in the memory to implement the temperature control method of the above-mentioned first aspect and its possible implementation methods, or implement the temperature control method of the above-mentioned second aspect and its possible implementation methods, or implement the temperature control method of the above-mentioned third aspect and its possible implementation methods.

[0051] In a fifth aspect, the present application provides a computer-readable storage medium, which stores computer-readable instructions. When the computer-readable instructions are executed by a processor, the temperature control method of the first aspect and its possible implementation methods is implemented, or the temperature control method of the second aspect and its possible implementation methods is implemented, or the temperature control method of the third aspect and its possible implementation methods is implemented.

[0052] In a sixth aspect, the present application provides a computer program product, which includes computer-readable instructions. When the computer-readable instructions are executed by a processor, the temperature control method of the first aspect and its possible implementation methods are implemented, or the temperature control method of the second aspect and its possible implementation methods are implemented, or the temperature control method of the third aspect and its possible implementation methods are implemented.

[0053] In addition, the technical effects brought about by the fourth to sixth aspects can be found in the descriptions of the methods of each design in the above method part, and will not be repeated here. BRIEF DESCRIPTION OF THE DRAWINGS

[0054] Figure 1 This is a schematic diagram of a possible surface hotspot distribution of an electronic device provided by an embodiment of the present application during use;

[0055] Figure 2 This is a schematic diagram of a thermal control strategy that may be applied to electronic devices, provided by an embodiment of the present application;

[0056] Figure 3 This is a schematic diagram showing changes in the amount of a touch coupling signal before and after a protective film is applied to a display screen according to an embodiment of the present application;

[0057] Figure 4 This is a schematic diagram of the connection structure between an electronic device and a keyboard provided in one embodiment of the present application;

[0058] Figure 5 This is a schematic structural diagram of an electronic device provided in one embodiment of the present application;

[0059] Figure 6 1 is a schematic structural diagram of an electronic device including a capacitive proximity sensor for detecting a protective case, provided by an embodiment of the present application;

[0060] Figure 7 This is a schematic diagram showing the change in charging current and temperature difference between hot and cold zones over time for an electronic device with and without a protective case, provided by an embodiment of the present application;

[0061] Figure 8 This is a schematic diagram of the software and hardware architecture of an electronic device provided in an embodiment of the present application;

[0062] Figure 9 This is a flow chart of the steps of a temperature control method provided in one embodiment of the present application;

[0063] Figure 10 Schematic diagram of hot spot temperatures on the display screen surface and the protective film surface provided by one embodiment of the present application;

[0064] Figure 11 is a flow chart of the steps of a temperature control method provided by another embodiment of the present application;

[0065] Figure 12 Schematic diagram of hot spot temperatures on the outer shell surface and the protective shell surface provided by one embodiment of the present application;

[0066] Figure 13 This is a flow chart of the steps of a temperature control method provided in another embodiment of the present application;

[0067] Figure 14 This is a schematic diagram of module interaction in an electronic device provided by an embodiment of the present application;

[0068] Figure 15 This is a schematic diagram of an interface of an electronic device provided in one embodiment of the present application;

[0069] Figure 16 This is a flow chart of the steps of a temperature control method provided in another embodiment of the present application;

[0070] Figure 17 This is a flow chart of the steps of a temperature control method provided in another embodiment of the present application;

[0071] Figure 18 This is a flow chart of the steps of a temperature control method provided in another embodiment of the present application;

[0072] Figure 19 This is a hardware architecture diagram of an electronic device provided in one embodiment of the present application. DETAILED DESCRIPTION

[0073] The following will describe the technical solutions in the embodiments of this application in conjunction with the drawings in the embodiments of this application. Obviously, the embodiments described are only part of the embodiments of this application, not all of the embodiments. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of this application.

[0074] In the following, the terms "first" and "second" are used for descriptive purposes only and are not to be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, the features defined as "first" and "second" may explicitly or implicitly include one or more of such features. In the description of the embodiments of the present application, words such as "exemplary", "or", and "for example" are used to indicate examples, illustrations, or descriptions. Any embodiment or design described as "exemplary" or "for example" in the embodiments of the present application should not be interpreted as being more preferred or more advantageous than other embodiments or design schemes. Specifically, the use of words such as "exemplary", "or", and "for example" is intended to present related concepts in a concrete way.

[0075] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those skilled in the art to which this application belongs. The terms used in the specification of this application are for the purpose of describing specific embodiments only and are not intended to limit this application. It should be understood that, unless otherwise specified in this application, " / " means or. For example, A / B can mean A or B. "And / or" in this application is merely a way to describe the association relationship of associated objects, indicating that three relationships can exist. For example, A and / or B can mean: A exists alone, A and B exist at the same time, and B exists alone. "At least one" means one or more. "Multiple" means two or more than two. For example, at least one of a, b or c can mean: a, b, c, a and b, a and c, b and c, a, b and c. It should be understood that the order of the steps shown in the flowcharts herein can be changed, and some can be omitted.

[0076] When a user uses an electronic device, the temperature of the device may rise. Excessive temperature not only easily leads to excessive power consumption, damaging the device's hardware and corresponding functions, but also may affect the user's safety during use of the device. For example, for portable electronic devices, to prevent burns caused by user contact with electronic device components (such as screens and casings), the 3C safety certification standard also stipulates that the surface temperature of the electronic device must be lower than the safety temperature (for example, the safety temperature of portable devices such as mobile phones and tablets is 48°C).

[0077] In order to solve the above problems, a thermal control strategy is generally configured in the electronic device. According to the temperature of the electronic device, the performance of the device is limited based on the corresponding thermal control strategy. For example, the operating frequency of the processor is reduced, the brightness of the display screen is reduced, etc., so as to achieve the purpose of reducing the temperature of the device. After purchasing an electronic device, the user may stick a protective film on the display screen and / or use a protective case for actual use needs. However, the preset thermal control strategy is a thermal control strategy set based on the bare device form of the device when it leaves the factory, which may not be consistent with the actual user usage habits. The bare device form referred to in the embodiment of the present application may refer to a form that does not include a protective film or a protective case.

[0078] In view of this, an embodiment of the present application provides a temperature control method that can be applied to electronic devices. It can dynamically switch the thermal control strategy by identifying whether the electronic device uses a protective film and / or protective case, so as to maximize the satisfaction of the user's device performance requirements without affecting the safety of the user during use of the device.

[0079] The temperature of an electronic device can be detected in real time using a temperature sensor. For example, in the case of a mobile phone, the electronic device can obtain the temperature of the display screen using multiple temperature sensors mounted on the display screen. These multiple temperature sensors can be positioned at different locations on the display screen. For another example, the electronic device can also obtain the temperature of the outer casing using multiple temperature sensors mounted on the outer casing. These multiple temperature sensors can be positioned at different locations on the outer casing, such as at different locations on the rear housing.

[0080] like Figure 1 As shown, taking the electronic device 100 as a mobile phone as an example, the hotspot distribution of the electronic device 100 during use is illustrated. The hotspot referred to in the embodiment of the present application may be a local high-temperature area with a temperature higher than other areas. The determination of the hotspot can be achieved using a thermal imaging device, for example. The thermal imaging device can detect infrared radiation emitted by an object to generate a temperature distribution image, thereby accurately displaying the temperature hotspot on the surface of the electronic device. The temperature value of the hotspot can be obtained by directly detecting the thermal imaging device, or by fitting the sensed values ​​of multiple temperature sensors.

[0081] Assuming four temperature sensors are used to detect the temperature of the display screen, for any candidate hotspot on the display screen (the candidate hotspot can be set to a common location of a hotspot on the display screen), the temperature change data for the candidate hotspot and the temperature change data of the four temperature sensors can be measured and recorded. Based on the recorded data, a mathematical relationship between the temperature of the candidate hotspot and the temperatures of the four temperature sensors can be constructed. Subsequently, the electronic device 100 can determine the temperature of the candidate hotspot based on this mathematical relationship and the temperature values ​​sensed in real time by the four temperature sensors. Similarly, for any candidate hotspot on the housing (the candidate hotspot can be set to a common location of a hotspot on the housing, for example, near the processor, battery, camera, etc.), a mathematical relationship between the temperature of the candidate hotspot and the temperatures of multiple temperature sensors on the housing can be constructed based on the recorded data. Subsequently, the electronic device 100 can determine the temperature of the candidate hotspot based on this mathematical relationship and the temperature values ​​sensed in real time by the multiple temperature sensors. During the temperature control process of the electronic device 100, the device performance can be limited by the thermal control parameters corresponding to the maximum hotspot temperature in the housing and the display screen.

[0082] In some embodiments, using a protective film may affect the hotspot temperature on the display screen, while using a protective case may affect the hotspot temperature on the back cover. For the display screen, temperature fitting can be performed separately with and without a protective film. For the back cover, temperature fitting can be performed separately with and without a protective case.

[0083] For a bare-device electronic device 100, if the hotspot temperature on the display screen is higher than the hotspot temperature on the outer casing, in this case, the highest hotspot temperature is located on the display screen, and the presence or absence of a protective case generally does not affect the highest hotspot temperature of the electronic device 100. However, the presence or absence of a protective film will affect the highest hotspot temperature of the electronic device 100 and / or the hotspot distribution on the display screen. Conversely, if the hotspot temperature on the outer casing is higher than the hotspot temperature on the display screen, in this case, the highest hotspot temperature is located on the outer casing, and the presence or absence of a protective case will affect the highest hotspot temperature and / or the hotspot distribution on the outer casing, while the presence or absence of a protective film generally does not affect the highest hotspot temperature of the electronic device 100.

[0084] For the electronic device 100 in the form of a bare device, using a protective case can reduce the surface temperature of the outer shell in contact with the human body, and using a protective film can reduce the surface temperature of the display screen in contact with the human body.

[0085] like Figure 1 As shown in (a), the hot spots on the display screen of the electronic device 100 in the bare device form include hot spots 101 and 102 during use. Figure 1 As shown in (b) in FIG. 1 , it is shown that during the use of the electronic device 100 , the hot spots on the display screen with the protective film include the hot spots 103 .

[0086] like Figure 1 As shown in (c), it illustrates that when the electronic device 100 in the bare device form is in use, the hot spots on the back cover include hot spots 104, 105 and 106. Figure 1 As shown in (d) in FIG. 1 , it is shown that during the use of the electronic device 100 , the hot spots on the back cover of the protective cover include hot spots 107 and 108 .

[0087] In some embodiments, by measuring the case temperature of the electronic device 100 with and without a protective case, the case temperature reduction benefit (reduction value of the case hot spot with and without a protective case) shown in Table 1 below is obtained.

[0088]

[0089] As can be seen from Table 1 above, using a protective case reduces the surface temperature of the housing where it contacts the human body. That is, when the electronic device 100 is in the same operating state, the user perceives a lower housing temperature when using the protective case than when not using the protective case. This means that when using a protective case, the performance of the electronic device 100 can be limited to a lesser extent to maximize the user's performance requirements. However, when not using a protective case, greater performance limitations may be imposed on the electronic device 100 to ensure user safety during use.

[0090] In some embodiments, the use of a protective film and a protective case have a certain mutual impact on the hotspot temperature benefits of the entire device. Table 2 below illustrates the hotspot temperature reduction benefits under different usage scenarios (compared to the hotspot temperature reduction value of the bare device form factor, where the hotspot of the entire device can be the hotspot with the highest temperature within the housing and display). Electronic device 100 can pre-store multiple thermal control strategies to address different usage scenarios.

[0091]

[0092] As can be seen from Table 2 above, the use of a protective case and / or protective film will reduce the surface temperature of the electronic device 100 in contact with the human body. That is, when the electronic device 100 is in the same operating state, the temperature of the entire device perceived by the user when using a protective case and / or protective film is lower than the temperature of the entire device perceived by the user when the device is in bare form. In other words, when using a protective case and / or protective film, the performance of the electronic device 100 can be relatively slightly restricted to maximize the user's device performance requirements. In contrast, in the case of a bare device, relatively large performance restrictions can be placed on the electronic device 100 to ensure the safety of the user when using the device.

[0093] Figure 2A possible thermal control strategy for electronic devices is illustrated.

[0094] The thermal control strategy may refer to a strategy for limiting the performance of functional modules in the electronic device 100 according to the hotspot temperature, including but not limited to regulating the CPU / GPU / NPU / DDR memory frequency, display frame rate / refresh rate / brightness, RF antenna power, audio tone / loudness, camera performance, charging power, etc.

[0095] like Figure 2 As shown, as the hotspot temperature increases, the various performances of the electronic device 100 can be gradually restricted: screen brightness is reduced, refresh rate is reduced, CPU / GPU frequency is limited, camera frame rate is reduced, beauty algorithms are turned off, cellular network is switched from 5G to 4G, game frame rate is reduced, background downloads are paused, network speed is limited, flash is turned off, hotspot is turned off, etc., high temperature pop-up window is displayed, and the device is shut down.

[0096] In order to achieve more accurate temperature control of the electronic device 100 , the electronic device 100 involved in the embodiment of the present application needs to have the ability to identify the protective film and / or protective case.

[0097] The following describes how to identify a protective film and a protective case.

[0098] Identification of protective film:

[0099] The material of the protective film used in electronic devices is generally a polymer material (PET, TPU material, etc.) or a composite material (tempered glass, etc.). The thermal conductivity of the materials does not vary much, but the protective film may have different thicknesses, and the thermal conductivity of protective films of different thicknesses has certain differences. Therefore, different thermal control strategies can be set based on the different thicknesses of the protective film. The thermal control strategy can be composed of multiple thermal control temperatures and thermal control parameters corresponding to each thermal control temperature. Different thermal control strategies can refer to different thermal control parameters or different thermal control parameter values. If the thickness of the protective film cannot be identified, different thermal control strategies can be set based on whether the protective film exists. For example, the presence of a protective film corresponds to one thermal control strategy, and the absence of a protective film corresponds to another thermal control strategy.

[0100] For capacitive touchscreens, the following mathematical relationship holds: C = εS / d, where C is the capacitance of the capacitor, S is the area facing the capacitor's plates, d is the distance between the plates, and ε is the dielectric constant of the dielectric. When a finger touches the display, the dielectric at the touch point changes from air to a mixture of finger and air, causing the value of ε to change. When a finger touches the display, there is a certain contact or interaction area between the finger and the sensing electrode, causing the value of S to change. This means that when a finger touches the display, the dielectric constant ε and the area facing S change, causing the capacitance C at the touch point to change. This change in capacitance can then be used to determine the location of the touch point.

[0101] Furthermore, after applying the protective film to the display screen, the value of d increases, which in turn causes the capacitance C to decrease. The change in the value of d can be used to determine whether the display screen has a protective film, and the thickness of the protective film can be determined by determining the d value before and after applying the protective film.

[0102] In the practical application of capacitive touch screens, measuring the capacitance value C is relatively inconvenient. Typically, the amount of the coupled signal is measured, and the location of the touch point is determined based on the change in the coupled signal. When a finger touches the display, the capacitance value C at the touch point increases, the amount of stored charge increases, and the amount of the coupled signal also increases. There is a positive correlation between the amount of the coupled signal and the capacitance value C. Applying a protective film to the display causes the capacitance value C to decrease, which in turn reduces the amount of the coupled signal. In other words, using a protective film reduces the amount of the coupled signal.

[0103] like Figure 3 The figure shows that the signal strength of the coupling signal before the display screen is covered with a protective film is greater than that after the protective film is applied. For example, the signal strength of the coupling signal during a touch operation on a certain electronic device is 3000 before the protective film is applied, while the signal strength of the coupling signal during the touch operation after the protective film is applied is 1600.

[0104] In some embodiments, it is also possible to determine whether there is a protective film on the display screen and the thickness of the protective film by configuring an elastic wave sensor on the display screen. For example, the elastic wave sensor can be set under the cover glass or the touch layer. When a finger touches the display screen, a pressure pulse is generated. This pressure pulse will propagate in the medium in the form of an elastic wave, and the elastic wave sensor can sense the propagation of this elastic wave. For display screens with and without a protective film, the values ​​sensed by the elastic wave sensor are different, and for display screens with protective films of different thicknesses, the values ​​sensed by the elastic wave sensor will also be different. Therefore, based on the data sensed by the elastic wave sensor, it is possible to determine whether there is a protective film on the display screen and the thickness of the protective film.

[0105] In some embodiments, since the electronic device obtains the temperature sensing data of the temperature sensor, different temperature fitting strategies can be adopted for protective films of different thicknesses, so as to obtain the surface temperature of protective films of different thicknesses based on the sensing data of the temperature sensor. Under the same temperature sensing data, protective films of different thicknesses may correspond to different temperature control strategies due to the different surface temperatures obtained by fitting.

[0106] Identification of protective case:

[0107] The material of the protective case used in electronic devices is generally insulating material (for example, tempered glass, silicone, plastic) or metal material (aluminum alloy, stainless steel, etc.). The thermal conductivity of insulating materials and metal materials is different to a certain extent, and the protective case may have different thicknesses. The thermal conductivity of protective cases of different thicknesses is also different to a certain extent. Therefore, if the material of the protective case (insulating material or metal material) can be identified, different thermal control strategies can be set based on the material of the protective case. If the thickness of the protective case can be identified, different thermal control strategies can be set based on the different thicknesses of the protective case. If the material and thickness of the protective case cannot be identified, different thermal control strategies can be set based on whether a protective case exists.

[0108] In some embodiments, for electronic devices such as mobile phones and tablet computers, a keyboard protective cover may be provided with a pogo pin. When the pogo pin is connected to the electronic device, it can be determined that the electronic device uses the keyboard protective cover.

[0109] like Figure 4As shown, taking the electronic device as a tablet computer as an example, the electronic device 100 has a first connection end 1001 and the keyboard 200 has a second connection end 2001. The keyboard 200 includes a keyboard portion and a protective shell portion. The electronic device 100 can be fixedly connected to the keyboard 200 to keep the electronic device 100 in an inclined state at a preset tilt angle, which is convenient for the user to use. The fixed connection can be, for example, adsorption by opposite magnets or snap connection with a card slot, so that the position of the electronic device 100 relative to the keyboard 200 remains fixed. The fixed connection is a detachable connection. After the electronic device 100 and the keyboard 200 are fixedly connected, the first connection end 1001 of the electronic device 100 contacts and is electrically connected to the second connection end 2001 of the keyboard 200. The electrical connection between the first connection end 1001 and the second connection end 2001 enables the transmission of electrical signals between the electronic device 100 and the keyboard 200, such as communication or charging and discharging. The second connection end 2001 of the keyboard 200 may be a pogo pin, and the first connection end 1001 of the electronic device 100 may be a contact for connecting to the pogo pin. That is, the electronic device 100 can determine whether the keyboard protective case is connected by identifying whether the first connection end 1001 is electrically connected to the pogo pin, thereby realizing identification of the protective case.

[0110] In some embodiments, some keyboard cases may also connect to the electronic device 100 via an interface such as Bluetooth or USB Type-C. For example, a keyboard case with a Bluetooth module may connect to the electronic device 100 via Bluetooth. Another example is that if a keyboard case or other type of case is equipped with a micro-pump for cooling, a flashlight, or a fan, it has a large power supply requirement and is generally connected to the electronic device 100 via a USB Type-C interface. In other words, the electronic device 100 can also determine whether the keyboard case is connected based on Bluetooth connection information or USB Type-C interface connection information, thereby realizing the recognition of the case.

[0111] In some embodiments, the keyboard protective case or other types of protective cases may also be equipped with a Hall sensor, and the Hall sensor is used to implement intelligent sleep and wake-up functions. For example, when the user closes the protective case, the Hall sensor inside the protective case will sense the change in the magnetic field and send a signal to the electronic device 100. After receiving the signal, the electronic device 100 automatically enters the sleep state. When the user opens the protective case, the Hall sensor detects the change in the magnetic field again and sends another signal to the electronic device 100. The electronic device 100 then automatically wakes up and enters normal working state. In this case, the identification of the protective case can be achieved by multiplexing the Hall sensor. If the electronic device 100 is in contact with a protective case with a Hall sensor, the Hall sensor can sense the change in the magnetic field and send a sensing signal to the electronic device 100. The sensing signal of the Hall sensor is used to determine whether the protective case is used. For example, in the case where the sensing signal of the Hall sensor is not received, it can be considered that the protective case is not in use. In the case where the sensing signal of the Hall sensor can be continuously received, it can be considered that the protective case is in use.

[0112] For a magnetic protective case, a Hall sensor may also be provided in the electronic device 100 , and the electronic device 100 may also determine whether a protective case is used based on magnetic field change data from the Hall sensor.

[0113] In some embodiments, for electronic devices 100 that support wireless charging, the wireless charging coil is typically placed in the back cover of the device. There are differences in wireless transmission power and quality factor (Q factor) between using a protective case and not using one. For example, if the electronic device 100 with a protective case is placed on a wireless charging pad, the thickness of the protective case increases the distance between the transmitting coil on the pad and the receiving coil on the electronic device compared to when the back cover is directly in contact with the pad. The magnetic field strength generated by the transmitting coil decreases with increasing distance, weakening the magnetic field strength received by the receiving coil and reducing the induced electromotive force generated in the receiving coil, resulting in reduced transmission power. This increased distance also reduces the number of magnetic field lines generated by the transmitting coil that can pass through the receiving coil, resulting in reduced magnetic flux coupling. This reduced magnetic flux coupling leads to reduced power transmitted to the receiving end. Similarly, increased distance increases energy loss during magnetic field transmission, resulting in a lower Q factor. This increased distance also reduces the mutual inductance between the transmitting and receiving coils, resulting in a lower Q factor. Therefore, the presence of a protective case can be determined by measuring transmission power and Q factor.

[0114] In some embodiments, whether a protective case is used can also be identified by how the hand holding the electronic device 100 affects the touch screen (touch panel, TP) signal strength. For example, for a protective case made of insulating material, if the electronic device 100 has a metal back shell, when the protective case is not used, the hand holding the electronic device 100 and the finger touching the TP form a loop between the TP, the hand, and the metal back shell. The signal generated by the finger touching the TP is a first signal. When the protective case is used, the hand holding the electronic device 100 and the finger touching the TP, because the metal back shell is covered by the protective case, the hand does not touch the metal back shell and a loop cannot be formed. The signal generated by the finger touching the TP is a second signal. The first signal and the second signal have a large difference, which can be used to identify whether a protective case is used.

[0115] For example, Figure 5 As shown, the middle frame of the electronic device 100 has an antenna feed 1002. For a protective case made of insulating material, if the electronic device 100 is a non-metallic back shell device, when the protective case is not used, the hand holding the electronic device 100 and the finger touching the TP, since the antenna feed 1002 is generally located in the lower area of ​​the middle frame, the hand holding the electronic device 100 is likely to come into contact with the antenna feed 1002 when holding the electronic device 100. The TP, hand, and antenna feed 1002 form a loop, and the signal amount generated by the finger touching the TP is the third signal amount. When a protective case is used, the hand holding the electronic device 100 and the finger touching the TP, since the antenna feed 1002 is covered by the protective case, the hand does not contact the antenna feed 1002 and a loop cannot be formed. The signal amount generated by the finger touching the TP is the fourth signal amount. The third signal amount and the fourth signal amount have a large difference, which can be used to identify whether a protective case is used.

[0116] In some embodiments, a light sensor can also be used to identify whether a protective case is used. For example, a light sensor (a light sensor that senses proximity light, ambient light, or color temperature) can be installed at a certain position in the middle frame, back shell, or rear camera area of ​​the electronic device 100. The protective case can be identified by identifying whether the light sensor is blocked, combining the blocking time and the screen-on time of the electronic device. Specifically, when the electronic device 100 is in the screen-on stage and the light sensor is continuously blocked, it can be considered that the electronic device 100 is using a protective case. When the electronic device 100 is in the screen-off stage and the light sensor is continuously blocked, it may be that the electronic device 100 is placed in a pocket. When the electronic device 100 is in the screen-on stage and the light sensor is not blocked, it can be considered that the electronic device is not using a protective case.

[0117] In some embodiments, a capacitive proximity sensor can also be used to identify whether a protective case is in use. For example, a capacitive proximity sensor can be installed at the corner of the middle frame of the electronic device 100. For a capacitive proximity sensor, the following mathematical relationship also exists: C = εS / d. Using a protective case and not using a protective case will change the value of the parameter d. Therefore, when the hand is holding the electronic device 100, the capacitance value C sensed by the capacitive proximity sensor can be used to identify whether a protective case is in use.

[0118] like Figure 6 As shown in (a) of FIG, the capacitive proximity sensor 1003 is disposed at a corner of the middle frame 1004 of the electronic device 100. Figure 6 As shown in (b), the capacitive proximity sensor 1003 is located below the middle frame 1004. There is a certain gap between the middle frame 1004 and the capacitive proximity sensor 1003. This gap can prevent the middle frame 1004 from continuously contacting the capacitive proximity sensor 1003 and can protect the capacitive proximity sensor 1003. When a protective case is not used, when a finger or palm holds the middle frame 1004, the finger or palm contacts the capacitive proximity sensor 1003 through the middle frame 1004. Figure 6 As shown in (c), when a protective case is used and the finger or palm is holding the protective case, the finger or palm contacts the capacitive proximity sensor 1003 through the protective case and the middle frame 1004. The signal amount that the capacitive proximity sensor 1003 can detect is significantly different from that when the protective case is not used. For example, when the protective case is not used and the finger or palm is holding the middle frame 1004, the signal amount that the capacitive proximity sensor 1003 can detect is 13,000. When the protective case is used and the finger or palm is holding the middle frame 1004, the signal amount that the capacitive proximity sensor 1003 can detect is 6,000.

[0119] In some embodiments, whether a protective case is used can also be identified by the amount of vibration after the electronic device 100 is vibrated. For example, the electronic device 100 is generally equipped with an accelerometer and a gyroscope, and the amount of vibration can be sensed by the accelerometer and the gyroscope. Taking the electronic device 100 as a mobile phone as an example, the weight of a mobile phone is generally 180g-240g, and the weight of a protective case is generally 10g-20g. Using a protective case and not using a protective case will result in a certain difference in the weight of the device. When the mobile phone motor vibrates, there is a certain difference in the amount of vibration detected by the accelerometer and the gyroscope, based on which it is possible to identify whether a protective case is used.

[0120] For example, when a user connects the charger to charge the electronic device 100, the electronic device 100 will generally vibrate, which can trigger the identification of whether a protective case is used. For another example, when the electronic device 100 vibrates for an alarm, an incoming call, or a message reminder, it can also trigger the identification of whether a protective case is used.

[0121] In some embodiments, it is also possible to identify whether a protective case is used by the temperature difference inside or on the surface of the electronic device 100. Generally speaking, using a protective case will increase the temperature inside the device, and the temperature difference between the cold area and the hot area of ​​the device will further increase, thereby identifying whether a protective case is used. Figure 7 As shown in the figure, taking the charging scenario as an example, under the same charging current, the temperature difference between the cold and hot zones when using a protective case is different from that when not using a protective case. The hot zone can refer to the charging circuit module, and the cold zone can be the USB board or the audio processing module (when charging without playing audio).

[0122] like Figure 7 As shown in (a), it is a schematic diagram of the charging current and temperature difference (temperature difference between the cold zone and the hot zone) changing with time when the electronic device 100 is charged without using a protective case. Curve S1 is the temperature difference between the cold zone and the hot zone, and curve S2 is the charging current. Figure 7 As shown in (b), the charging current and temperature difference (temperature difference between the cold zone and the hot zone) of the electronic device 100 are changed over time when the electronic device 100 is charged in the protective case. Curve S3 is the temperature difference between the cold zone and the hot zone, and curve S4 is the charging current. Figure 7 From (a) and (b), we can see that under the same charging current (3500mA), without a protective case, the temperature difference between the cold and hot areas is about 3.5°C, while with a protective case, the temperature difference between the cold and hot areas is about 4°C. Figure 7 The vertical coordinates of (a) and (b) are dimensionless coordinates used to indicate the charging current and temperature difference at the same time, with 1°C corresponding to 1000 on the vertical scale.

[0123] In some embodiments, it is also possible to determine whether there is a protective case and the thickness of the protective case by configuring an elastic wave sensor on the outer shell. For example, the elastic wave sensor can be set in a position area such as the middle frame or the back shell. When the electronic device 100 is held by the hand, a pressure pulse is generated. This pressure pulse will propagate in the medium in the form of an elastic wave, and the elastic wave sensor can sense the propagation of this elastic wave. For electronic devices 100 with and without a protective case, the values ​​sensed by the elastic wave sensor are different, and for protective cases with different thicknesses, the values ​​sensed by the elastic wave sensor will also be different. Therefore, based on the data sensed by the elastic wave sensor, it can be determined whether the electronic device 100 uses a protective case and the thickness of the protective case.

[0124] In some embodiments, the above-mentioned two methods of identifying the protective shell can also be combined to determine the material of the protective shell. For example, it is determined based on the Pogopin or Hall sensor that the electronic device 100 uses a protective shell, and then the material of the protective shell is identified based on the way in which the hand holding the electronic device 100 affects the touch screen signal strength. For protective shells made of insulating materials and protective shells made of metal materials, the degree to which the hand holding the electronic device 100 affects the touch screen signal strength is different. For protective shells made of insulating materials, a loop cannot be formed when the hand holds the electronic device 100 and the finger touches the TP. For protective shells made of metal materials, the TP, the hand, and the protective shell form a loop.

[0125] In some embodiments, since the electronic device acquires temperature sensing data from a temperature sensor, different temperature fitting strategies can be used for protective cases of different thicknesses. The surface temperatures of protective cases of different thicknesses can be fitted based on the sensing data from the temperature sensor. This allows protective cases of different thicknesses to correspond to different temperature control strategies due to different fitted surface temperatures under the same temperature sensing data. Similarly, different temperature fitting strategies can be used for protective cases of different materials. The surface temperatures of protective cases of different materials can be fitted based on the sensing data from the temperature sensor. This allows protective cases of different materials to correspond to different temperature control strategies due to different fitted surface temperatures under the same temperature sensing data.

[0126] In order to more clearly understand the implementation details of the above temperature control method on electronic equipment, Figures 8 to 14 Let's introduce the process of implementing the above temperature control method by cooperating various software and hardware components in electronic equipment. The details are as follows:

[0127] The operating system of the electronic device can adopt a layered architecture, event-driven architecture, micro-kernel architecture, micro-service architecture, or cloud architecture. The embodiment of the present application takes the Android system of layered architecture as an example to illustrate the software structure of the electronic device. Figure 8As shown, a layered architecture divides software into several layers, each with distinct roles and responsibilities. Layers communicate with each other through software interfaces. Taking the Android system as an example, in some embodiments, the Android system is divided into four layers: from top to bottom, the application layer (APK), the application framework layer (Framework), the hardware abstraction layer (HAL), and the kernel layer (Kernel).

[0128] The application layer can include a series of application packages. For example, an application package may include instant messaging applications, video applications, and settings applications. Instant messaging applications can support instant messaging and / or instant calling, while video applications can support video / short video playback. Settings applications can be used for system configuration, device management, application management, and personalization.

[0129] The application framework layer may include an input system, a window manager, a content provider, a view system, a resource manager, and the like. The input system is used to process input events. The window manager is used to manage window programs. The window manager can obtain the size of the display screen, determine whether there is a status bar, lock the screen, and so on. The content provider is used to store and obtain data and make the data accessible to applications. The data may include videos, images, and the like. The view system includes visual controls, such as controls for displaying text, controls for displaying pictures, and the like. The view system can be used to build applications. The display interface may consist of one or more views. The resource manager provides various resources for applications, such as localized strings, icons, pictures, layout files, video files, and the like.

[0130] The hardware abstraction layer is an interface layer located between the operating system kernel and the hardware circuit. The HAL layer includes, but is not limited to, accessory identification services and thermal control strategy setting services. In an embodiment of the present application, the accessory pattern recognition service can be used to identify whether an electronic device is using protective accessories (for example, protective accessories include but are not limited to protective cases and protective films) under the call of a preset service, or to trigger the identification of whether an electronic device is using protective accessories under a preset state, or to identify whether an electronic device is using protective accessories once every preset time. The preset service can be set according to actual identification requirements. The preset service can be a system service or an application service, which is not limited in the embodiment of the present application.

[0131] For example, it can be set to trigger the identification of whether the electronic device is using a protective accessory in a vibration state or a screen-on unlock state.

[0132] The Thermal Control Strategy Setting Service can be used to set different thermal control strategies based on the identification results of the Accessory Identification Service. For example, the Thermal Control Strategy Setting Service can set a corresponding thermal control strategy based on the identification results of the Accessory Identification Service and the current highest hotspot temperature.

[0133] In some embodiments, the accessory identification service may determine whether the electronic device is using a protective accessory based on an intelligent identification method. The intelligent identification method may refer to determining whether the electronic device is using a protective accessory based on sensor detection data.

[0134] In some embodiments, the accessory recognition service can also be based on artificial intelligence technology to improve accessory recognition accuracy. For example, the electronic device may have a pre-installed accessory recognition model, or a large model with accessory recognition capabilities. During the accessory recognition process, the model determines whether the electronic device is using a protective accessory based on sensor detection data. If a protective accessory is used, it further determines whether it is a protective case or a protective film, the material and / or thickness of the protective case, and the thickness of the protective film. The model training samples may include multiple sample subsets, such as sensor detection datasets without a protective film or protective case, sensor detection datasets with only a protective film (including protective films of various thicknesses), sensor detection datasets with only a protective case (including protective cases of various thicknesses, including insulating and metallic materials), and sensor detection datasets with both a protective film and a protective case (including protective films and protective cases of various thicknesses, including insulating and metallic materials). The model training method can be any of the training methods described in related art and is not limited in this application example.

[0135] In some embodiments, surface temperature fitting can also be performed based on artificial intelligence technology. For example, surface temperature fitting can be trained based on sensor detection data and surface thermal imaging data of different protective films and / or protective cases, so that the model has the ability to fit the surface temperature of protective films and / or protective cases.

[0136] In some embodiments, the accessory identification service can also obtain user-defined protective accessory information. For example, a user can set the protective accessory currently used by the electronic device through the Settings app or the Control Center. To avoid conflicts between intelligent identification and user settings, the user-defined protective accessory information can be prioritized over the protective accessory information obtained through intelligent identification.

[0137] The kernel layer may include drivers associated with the hardware in the hardware layer. The kernel layer may also include programs closely related to the hardware, such as interrupt handlers. The kernel layer may also include basic, common, and high-frequency modules, such as clock management modules and process scheduling modules.

[0138] For example, the hardware layer includes the display and sensors (accelerometers, touch sensors, gyroscopes, etc.). The kernel layer may include display drivers, touch drivers, and sensor drivers. The display driver drives the display panel in the display to display content, the touch driver receives user touch operations on the display from the touch layer in the display, and the sensor driver drives the sensors to perform sensing.

[0139] Please also see Figure 9 , is a flow chart of a temperature control method provided in one embodiment of the present application. This is described using the example of identifying whether a protective film is used on a display screen.

[0140] 901: The electronic device identifies whether a protective film is used on the display screen in response to a preset trigger condition.

[0141] In some embodiments, the preset trigger condition may refer to a condition that triggers the electronic device to identify whether a protective film is used on the display screen. The preset trigger condition can be set according to actual needs and is not limited in the embodiments of the present application. For example, the preset trigger condition may be the call of a preset service, or the device being in a preset state, or every preset time.

[0142] For example, the preset trigger conditions include but are not limited to opening an application with high power consumption, the device temperature being greater than a certain threshold, being in the charging state, and performing identification every preset time.

[0143] In some embodiments, whether a protective film is used on the display screen can be identified by the above-mentioned method of identifying the protective film, which will not be described in detail here.

[0144] 902: If it is determined that no protective film is used on the display screen, the electronic device uses a default thermal control strategy to control the temperature.

[0145] In some embodiments, the default thermal control strategy can be set as needed, and this is not limited in the present application. For example, the default thermal control strategy can be a thermal control strategy described in related art, which limits the performance of functional modules in the electronic device based on the hotspot temperature to prevent excessive hotspot temperatures from affecting user safety when using the device. The hotspot temperature can be the larger of the hotspot temperature on the display surface and the hotspot temperature on the housing surface.

[0146] 903: If it is determined that a protective film is used on the display screen, the electronic device obtains the thickness of the protective film.

[0147] In some embodiments, the thickness of the protective film can be obtained by using the above-mentioned identification method of the thickness of the protective film, which will not be repeated here.

[0148] 904: The electronic device performs temperature control using a thermal control strategy corresponding to the thickness of the protective film.

[0149] In some embodiments, protective films of varying thicknesses can correspond to different thermal control strategies, enabling more accurate temperature control of electronic devices and maximizing the performance requirements of users without compromising safety during device use. Assuming that increasing protective film thickness improves the ability to isolate the display's hotspot temperature, the user's perceived display temperature will be relatively lower. The electronic device can then employ a relatively weaker performance limitation strategy to maximize performance requirements and prevent excessively high hotspot temperatures from impacting user safety.

[0150] In some embodiments, the electronic device may also be configured to use a common thermal control strategy for protective films of all thicknesses, ie, identification and differentiation of the thickness of the protective films is not performed.

[0151] like Figure 10 As shown in (a) and (b) in Figure 2, it is assumed that the highest hotspot temperature on the display surface is 46°C and the highest hotspot temperature on the protective film surface is 43°C. Assuming that the highest temperature hotspot is on the display, for Figure 10 For (a), no protective film is used on the display screen, and the electronic device adopts the thermal control strategy corresponding to 46°C for temperature control. Figure 10 As for (b) in the figure, the electronic equipment adopts the thermal control strategy corresponding to 43℃ for temperature control, which can achieve greater performance release than the thermal control strategy corresponding to 46℃.

[0152] As shown in Table 3 below, a possible thermal control strategy is illustrated. The thermal control strategy includes thermal control parameters corresponding to multiple hot spot temperatures.

[0153]

[0154] In some embodiments, it can be set that when the highest hot spot temperature on the surface is lower than a certain temperature value, no restriction is imposed on the device performance.

[0155] In some embodiments, taking the device surface temperature as an example, with a safety rating of 48°C, assuming the highest hotspot is located on the display screen, without a protective film, the highest hotspot temperature on the display screen surface is 48°C. As the temperature approaches 48°C, stricter performance limits are required to prevent the hotspot temperature on the display screen surface from exceeding 48°C. When a protective film is used, the highest hotspot temperature on the protective film surface is 48°C. Performance limits are imposed based on the hotspot temperature on the protective film surface. In this scenario, if the highest hotspot temperature on the protective film surface is 48°C, and the highest hotspot temperature on the display screen surface is 52°C, the device performance is released more significantly when the hotspot temperature on the display screen surface approaches 48°C, compared to when the protective film is not used, causing the hotspot temperature on the display screen surface to rise to a maximum of 52°C.

[0156] In actual application scenarios, considering that there may be fitting errors in the hotspot temperature on the surface of the protective film, in order to maximize the safety of the user's device, the maximum hotspot temperature on the surface of the protective film can be set slightly lower than 48°C, for example, 47°C. In this case, the maximum hotspot temperature on the surface of the display will still be greater than 48°C, which is more effective than the related art that strictly adheres to the hotspot temperature on the surface of the display not exceeding 48°C. The device performance is released. In addition, for the related art, when using a protective film, even if the use of the protective film will change the hotspot temperature on the surface of the display, the hotspot temperature on the surface of the display generally varies within 0~1°C compared to the case where the protective film is not used (for example, the hotspot temperature of the display surface obtained by fitting is 48°C, but due to the use of the protective film, the actual hotspot temperature on the surface of the display may reach 48.8°C), which cannot reach the level of releasing device performance, resulting in the hotspot temperature on the surface of the display being allowed to increase significantly.

[0157] Please also see Figure 11 , which is a flow chart of a temperature control method provided by another embodiment of the present application. The method is described by taking the example of identifying whether a protective cover is used on a housing.

[0158] 111: The electronic device identifies whether a protective case is used on the housing in response to a preset trigger condition.

[0159] In some embodiments, the preset trigger condition may refer to a condition that triggers the electronic device to identify whether a protective case is used on the housing. The preset trigger condition can be set according to actual needs and is not limited in the embodiments of the present application. For example, the preset trigger condition may be the call of a preset service, or the device being in a preset state, or every preset time.

[0160] For example, the preset trigger conditions include but are not limited to opening an application with high power consumption, the device temperature being greater than a certain threshold, being in the charging state, and performing identification every preset time.

[0161] In some embodiments, whether a protective case is used on the housing can be identified by the above-mentioned method of identifying the protective case, which will not be described in detail here.

[0162] 112: If it is determined that no protective case is used on the housing, the electronic device uses a default thermal control strategy for temperature control.

[0163] In some embodiments, the default thermal control policy can be set as needed, and this embodiment of the present application is not limited to this. For example, the default thermal control policy can be a thermal control policy described in related art to limit the performance of functional modules in the electronic device based on the hotspot temperature to prevent excessive hotspot temperatures from affecting the safety of users using the device.

[0164] 113: If it is determined that a protective case is used on the housing, the electronic device obtains the material and / or thickness of the protective case.

[0165] In some embodiments, the material and / or thickness of the protective shell can be obtained by the above-mentioned identification method of the material or thickness of the protective shell, which will not be repeated here.

[0166] 114: The electronic device uses a thermal control strategy corresponding to the material and / or thickness of the protective case to control temperature.

[0167] In some embodiments, protective cases of varying thicknesses can correspond to different thermal control strategies, and protective cases made of different materials can also correspond to different thermal control strategies, enabling more accurate temperature control of the electronic device and maximizing the user's device performance requirements without compromising safety during use. Assuming that as the thickness of the protective case increases, its ability to isolate the hotspot temperature of the case becomes stronger, the user's perceived temperature of the case will be relatively lower. The electronic device can then use a relatively weaker performance limitation strategy to maximize the user's device performance requirements.

[0168] For example, metal materials generally have higher thermal conductivity than insulating materials. That is, the user perceives a lower temperature of the protective case using insulating materials than using metal materials. Electronic devices can use relatively weaker performance limitation strategies to maximize the user's device performance requirements.

[0169] In some embodiments, the electronic device may also be configured to share a common thermal control strategy for protective shells of all thicknesses and materials, ie, identification and differentiation of the thickness and material of the protective shells is not performed.

[0170] like Figure 12 As shown in (a) and (b) in the figure, it is assumed that the highest hot spot temperature on the outer shell surface is 46°C and the highest hot spot temperature on the protective shell surface is 44°C. Assuming that the highest temperature hot spot is located on the rear shell of the outer shell, for Figure 12 For (a), no protective case is used on the outer shell, and the electronic device adopts a thermal control strategy corresponding to 46°C for temperature control. For example, the frame rate of a currently open game application is limited to a maximum of 60FPS, and the refresh rate of the display is also limited to a maximum of 60Hz. Figure 12 For example, the frame rate of a currently running game application is limited to a maximum of 90 FPS, and the refresh rate of the display is also limited to a maximum of 90 Hz. Figure 12 (a) in the figure adopts the thermal control strategy corresponding to 46°C, which can achieve greater performance release.

[0171] In some embodiments, taking the safety temperature of the device surface as 48°C as an example, assuming the highest hotspot is located on the housing, without a protective case, the highest hotspot temperature on the housing surface is 48°C. When the temperature approaches 48°C, stricter performance restrictions are required to prevent the hotspot temperature on the housing surface from exceeding 48°C. When a protective case is used, the highest hotspot temperature on the protective case surface is 48°C. Performance restrictions are imposed based on the hotspot temperature on the protective case surface. In this case, if the highest hotspot temperature on the protective case surface is 48°C, assuming the highest hotspot temperature on the housing surface is 53°C, the device performance is released more when the hotspot temperature on the housing surface approaches 48°C, compared to when the protective case is not used, causing the hotspot temperature on the housing surface to rise to a maximum of 53°C.

[0172] In actual application scenarios, considering that there may be fitting errors in the hotspot temperature on the surface of the protective case, in order to maximize the safety of the user's device use, the maximum hotspot temperature on the surface of the protective case can be set to be slightly lower than 48°C, for example, 47°C. In this case, the maximum hotspot temperature on the surface of the outer shell will still be greater than 48°C, which will release greater device performance than the related art that strictly adheres to the hotspot temperature on the surface of the outer shell not exceeding 48°C. Moreover, for the related art, when using a protective case, even if the use of the protective case will change the hotspot temperature on the surface of the outer shell, the hotspot temperature on the surface of the outer shell generally varies within 0~1°C relative to the case where the protective case is not used (for example, the hotspot temperature of the outer shell surface obtained by fitting is 48°C, but due to the use of the protective case, the actual hotspot temperature of the outer shell surface may reach 49°C), which cannot reach the level of releasing device performance, resulting in the hotspot temperature on the surface of the outer shell being allowed to increase significantly.

[0173] Please also see Figure 13 , which is a flow chart of a temperature control method provided by another embodiment of the present application. This is illustrated by taking the example of identifying whether a protective case is used on a housing and whether a protective film is used on a display screen.

[0174] 131: The electronic device identifies whether a protective case is used on the housing in response to a preset trigger condition.

[0175] Step 131 of the embodiment of the present application is similar to step 111 of the aforementioned embodiment, and will not be described again here to avoid repetition.

[0176] 132: If it is determined that no protective cover is used on the housing, the electronic device continues to identify whether a protective film is used on the display screen.

[0177] In some embodiments, whether a protective film is used on the display screen can be identified by the above-mentioned method of identifying the protective film, which will not be described in detail here.

[0178] 133: If it is determined that no protective film is used on the display screen, the electronic device uses a default thermal control strategy for temperature control.

[0179] In some embodiments, the default thermal control strategy can be set according to needs, and the embodiments of the present application are not limited to this.

[0180] 134: If it is determined that a protective film is used on the display screen, the electronic device obtains the thickness of the protective film.

[0181] Step 134 of the embodiment of the present application is similar to step 903 of the aforementioned embodiment, and will not be described again here to avoid repetition.

[0182] 135: Electronic devices use a thermal control strategy corresponding to the thickness of the protective film for temperature control.

[0183] Step 135 of the embodiment of the present application is similar to step 904 of the aforementioned embodiment, and will not be described again here to avoid repetition.

[0184] 136: If a protective case is used on the housing, the electronic device obtains the material and / or thickness of the protective case.

[0185] Step 136 of the embodiment of the present application is similar to step 113 of the aforementioned embodiment, and will not be described again here to avoid repetition.

[0186] 137: The electronic device identifies whether a protective film is used on the display screen.

[0187] In some embodiments, whether a protective film is used on the display screen can be identified by the above-mentioned method of identifying the protective film, which will not be described in detail here.

[0188] 138: If it is determined that no protective film is used on the display screen, the electronic device uses a thermal control strategy corresponding to the material and / or thickness of the protective cover to control the temperature.

[0189] Step 138 of the embodiment of the present application is similar to step 114 of the aforementioned embodiment, and will not be described again here to avoid repetition.

[0190] 139: If it is determined that a protective film is used on the display screen, the electronic device obtains the thickness of the protective film.

[0191] Step 139 of the embodiment of the present application is similar to step 903 of the aforementioned embodiment, and will not be described again here to avoid repetition.

[0192] 140: The electronic device performs temperature control using a thermal control strategy corresponding to the thickness of the protective film and the material and / or thickness of the protective case.

[0193] In scenarios where both a protective film and a protective case exist, the hotspot temperature of the protective film surface and the hotspot temperature of the protective case surface can be comprehensively considered. Device performance can be limited based on the highest hotspot temperature of the two. Temperature control can be implemented based on the thermal control strategy corresponding to the protective case and the protective film to avoid the impact of excessively high hotspot temperatures on user device safety.

[0194] In a scenario where only a protective film exists, the hotspot temperature of the protective film surface and the hotspot temperature of the outer shell surface obtained by fitting can be comprehensively considered, and device performance can be limited based on the highest hotspot temperature of the two to maximize the user's device performance requirements and avoid the impact of excessively high hotspot temperatures on the user's use of the device.

[0195] In a scenario where only a protective case is present, the hotspot temperature of the protective case surface and the hotspot temperature of the display screen surface can be comprehensively considered, and device performance can be limited based on the highest hotspot temperature of the two to maximize the user's device performance requirements and avoid any impact on the user's device safety caused by excessively high hotspot temperatures.

[0196] In scenarios where there is no protective film or protective case, the hotspot temperature of the outer shell surface and the hotspot temperature of the display surface can be comprehensively considered, and device performance can be limited based on the highest hotspot temperature of the two to maximize the user's device performance requirements and avoid the impact of excessive hotspot temperature on the user's use of the device safety.

[0197] like Figure 14 , which is a schematic diagram of the interaction between various modules in the electronic device provided in an embodiment of the present application.

[0198] 141: In response to a preset trigger condition, the accessory identification service obtains protected accessory information.

[0199] In some embodiments, the preset trigger condition may be a condition that triggers the accessory identification service to identify whether a protective case is used on the housing and / or whether a protective film is used on the display screen, which is not limited in this embodiment of the present application. The protective accessory information may include at least one of the following: whether a protective film is used on the display screen, the thickness of the protective film, whether a protective case is used on the housing, the material of the protective case, and the thickness of the protective case.

[0200] 142: The accessory identification service sends the protection accessory information to the thermal control strategy setting service.

[0201] For example, the protective accessory information might indicate that the housing is not in use with a protective case and the display is not in use with a protective film. Another example might indicate that the housing is not in use with a protective case and the display is in use with a protective film. Another example might indicate that the housing is in use with a protective case and the display is not in use with a protective film. Another example might indicate that the housing is not in use with a protective case and the display is in use with a protective film, and the thickness of the protective film is X1 mm. Another example might indicate that the housing is in use with a plastic protective case and the display is not in use with a protective film.

[0202] 143: The thermal control strategy setting service sets the thermal control strategy corresponding to the protection accessory information.

[0203] In some embodiments, different protective accessory information may correspond to different thermal control strategies. A mapping relationship between multiple protective accessory information and multiple thermal control strategies can be pre-stored in the electronic device, with each piece of protective accessory information corresponding to a specific thermal control strategy. This allows for more accurate temperature control of the electronic device, maximally meeting the user's device performance requirements without compromising user safety during device use.

[0204] For electronic devices, it is possible to add options for protective accessories in the control center, or add a setting interface for protective accessories in the settings application, so that users can actively choose whether the electronic device has a protective case and / or film. The electronic device can implement corresponding thermal control strategies based on the protective accessory information set by the user.

[0205] like Figure 15 , which illustrates a user setting whether an electronic device is using a protective case and / or protective film through a settings application. In response to the user's operation on the settings application, the electronic device may display a protective accessory interface 1005. Protective accessory interface 1005 includes four control options: a control option 1006 for not using a protective case and no protective film, a control option 1007 for using only a protective case, a control option 1008 for using only a protective film, and a control option 1009 for using both a protective case and a protective film. The user can set the protective accessory information for the electronic device by selecting a control option.

[0206] In some embodiments, the protective accessory information obtained by intelligent identification can also be displayed in visual ways such as pop-up windows (which may disappear automatically after a period of time), notification bars, floating prompts (which may disappear automatically after a period of time), etc.

[0207] In some embodiments, the visually displayed protective accessory information may also provide controls for the user to confirm and / or provide feedback on erroneous recognition results, thereby enhancing the accuracy of intelligent recognition.

[0208] See Figure 16FIG. 1 is a temperature control method provided in an embodiment of the present application. The temperature control method can be applied to electronic devices. The temperature control method can include the following steps:

[0209] 161: When the electronic device does not use protective accessories, use a first thermal control strategy to control the device temperature.

[0210] In some embodiments, protective accessories include, but are not limited to, protective films and protective cases. If the electronic device does not use protective accessories, a default thermal control strategy (referred to as the first thermal control strategy) may be used to control device temperature. This default thermal control strategy may be a thermal control strategy described in related art. This strategy limits the performance of functional modules in the electronic device based on the highest hotspot temperature between the display screen and the housing, preventing excessively high hotspot temperatures from impacting user safety.

[0211] 162: When the electronic device uses a protective accessory, a second thermal control strategy different from the first thermal control strategy is used to control the device temperature.

[0212] In some embodiments, the first thermal control strategy and the second thermal control strategy may both include adjusting operating parameters of at least one of the following: a processor, a memory, a display screen, a communication module, an audio module, a camera module, and a battery charging and discharging module.

[0213] In some embodiments, under normal circumstances, the use of protective accessories on electronic devices will cause the surface temperature of the device to increase. For protective accessories with better heat dissipation effects, the surface temperature of the device may also decrease to a certain extent.

[0214] In some embodiments, adjusting the working parameters of the processor, memory, display, communication module, audio module, camera module, battery charging and discharging module, etc. may refer to: adjusting the frequency of the processor, adjusting the frequency of the memory, adjusting the brightness, frame rate, refresh rate, etc. of the display, adjusting the antenna power, communication frequency band, network rate, etc. in the communication module, adjusting the tone, loudness, etc. of the audio module, adjusting the shooting frame rate of the camera module, turning off the flash, turning off the beauty algorithm, etc., adjusting the charging current, battery discharge current, etc.

[0215] In some embodiments, the electronic device can determine whether protective accessories are used and the protective accessory information used through intelligent identification, or the user manually sets the protective accessory information of the electronic device, and the electronic device can directly obtain the protective accessory information, and then determine whether protective accessories are used and which protective accessories are used.

[0216] For example, a setting interface for protective accessories is added to the settings application. The temperature control method may further include: in response to a first operation on the settings application, displaying a first interface (an interface for setting protective accessories), the first interface including controls for setting protective accessories used by the electronic device, and the user can use the controls to set protective accessory information for the electronic device; and determining the protective accessories used by the electronic device based on a second operation on the controls by the user.

[0217] In some embodiments, the protective accessory may include a protective film disposed on the display screen. A second thermal control strategy, different from the first thermal control strategy, may be used to control device temperature. This may include: obtaining a first hotspot temperature on the surface of the protective film and a second hotspot temperature on the surface of the housing; and controlling device temperature based on the second thermal control strategy and the larger of the first and second hotspot temperatures. Through the above solution, the second thermal control strategy may include thermal control parameters corresponding to multiple thermal control temperatures. When only the protective film is used, the corresponding thermal control parameters may be retrieved from the second thermal control strategy based on the larger of the hotspot temperature on the surface of the protective film and the hotspot temperature on the surface of the housing. Device temperature control is then performed based on the thermal control parameters to maximize the user's device performance requirements.

[0218] In some embodiments, controlling the device temperature based on the thermal control parameters may refer to adjusting the operating parameters of the corresponding hardware modules based on the thermal control parameters to reduce the device temperature or suppress excessive temperature growth of the device.

[0219] In some embodiments, protective films of varying thickness can be assigned corresponding second thermal control strategies. Device temperature control can be performed based on the second thermal control strategy corresponding to the protective film thickness and the greater of the first and second hotspot temperatures. Specifically, based on the greater of the first and second hotspot temperatures, the corresponding thermal control parameters are retrieved from the corresponding second thermal control strategy to control device temperature.

[0220] In some embodiments, the surface temperature of the device and the surface temperature of the protective accessory can be obtained by fitting the temperature sensor data inside the electronic device. For example, the electronic device includes multiple first sensors for sensing the temperature of the display screen and multiple second sensors for sensing the temperature of the outer shell. Obtaining the first hotspot temperature on the surface of the protective film and the second hotspot temperature on the surface of the outer shell may include: fitting the temperatures of multiple first positions located on the surface of the protective film based on the temperature sensing data of the multiple first sensors, and taking the maximum temperature of the multiple first positions as the first hotspot temperature; fitting the temperatures of multiple second positions located on the surface of the outer shell based on the temperature sensing data of the multiple second sensors, and taking the maximum temperature of the multiple second positions as the second hotspot temperature. For another example, fitting the temperatures of multiple third positions located on the surface of the display screen based on the temperature sensing data of the multiple first sensors, and taking the maximum temperature of the multiple third positions as the third hotspot temperature; fitting the temperatures of multiple fourth positions located on the surface of the protective shell based on the temperature sensing data of the multiple second sensors, and taking the maximum temperature of the multiple fourth positions as the fourth hotspot temperature.

[0221] In some embodiments, determining whether there is a protective film on the display screen and the thickness of the protective film can be achieved in the following manner: in response to a first touch operation on the display screen, acquiring sensing data from a third sensor, where the third sensor may be a capacitive touch sensor provided by the display screen or an additional elastic wave sensor; based on the sensing data from the third sensor, determining whether there is a protective film on the display screen and the thickness of the protective film.

[0222] In some embodiments, the protective accessory includes a protective case mounted on the housing. A second thermal control strategy, different from the first thermal control strategy, is used to control device temperature. This may include: obtaining a third hotspot temperature on the display screen surface and a fourth hotspot temperature on the protective case surface; and controlling device temperature based on the second thermal control strategy and the greater of the third and fourth hotspot temperatures. Specifically, when only the protective case is used, the corresponding thermal control parameters can be retrieved from the second thermal control strategy based on the greater of the hotspot temperatures on the protective case surface and the display screen surface. Device temperature control is then performed based on the thermal control parameters to maximize user performance requirements.

[0223] In some embodiments, protective cases of different thicknesses or materials can be configured with different second thermal control strategies. By obtaining the material and / or thickness of the protective case, device temperature control can be performed based on the second thermal control strategy corresponding to the material and / or thickness of the protective case and the larger of the third hotspot temperature and the fourth hotspot temperature. That is, based on the larger of the third hotspot temperature and the fourth hotspot temperature, the corresponding thermal control parameters are retrieved from the corresponding second thermal control strategy to control device temperature.

[0224] In some embodiments, the protective accessories include a protective film disposed on the display screen and a protective case disposed on the housing. A second thermal control strategy, different from the first thermal control strategy, is employed to control device temperature. The strategy includes: obtaining a first hotspot temperature on the surface of the protective film and a fourth hotspot temperature on the surface of the protective case; and controlling device temperature based on the second thermal control strategy and the greater of the first and fourth hotspot temperatures. Specifically, when both the protective film and the protective case are used, the corresponding thermal control parameters can be retrieved from the second thermal control strategy based on the greater of the hotspot temperatures on the surface of the protective film and the surface of the protective case. Device temperature control is then performed based on the thermal control parameters to maximize the user's device performance requirements.

[0225] In some embodiments, the second thermal control strategy may be further determined based on the thickness of the protective film and the material and / or thickness of the protective shell.

[0226] In some embodiments, the detection method of the protective case may include multiple methods, for example: determining whether the protective case is provided on the housing based on the connection information of the first interface, and the first interface may include a USB interface or an interface electrically connected to a Pogopin. For another example, the protective case includes a Hall sensor, and the determination of whether the protective case is provided on the housing may be based on the sensing data reported by the Hall sensor. For another example, the electronic device includes a wireless charging module. When the electronic device is charged based on the wireless charging module, by obtaining the transmission power and quality factor during the wireless charging process, it is possible to determine whether the protective case is provided on the housing based on the transmission power and quality factor. For another example, when a user holds the electronic device and touches the display screen, the presence or absence of the protective case will affect the signal volume of the touch. Specifically, in response to a second touch operation on the display screen, the signal volume of the second touch operation is obtained. The second touch operation is an operation in which the user holds the electronic device and touches the display screen. Based on the signal volume of the second touch operation, it is determined whether the protective case is provided on the housing. For another example, an electronic device can reuse existing sensors or set up additional sensors to detect the presence of a protective case. Specifically, sensing data from a fourth sensor used to detect the protective case is obtained. The fourth sensor includes one of the following: an elastic wave sensor, an acceleration + gyroscope sensor, a light sensor, and a capacitive touch sensor. Based on the sensing data from the fourth sensor, it is determined whether a protective case is provided on the outer shell. For another example, the presence or absence of a protective case will affect the temperature difference between the hot zone and the cold zone. The detection of the protective case can be achieved by obtaining the temperature difference between the hot zone and the cold zone. Specifically, the preset hot zone temperature and the preset cold zone temperature of the electronic device in a high-heat state are obtained. The high-heat state includes a charging state or a hardware performance overload state. Based on the temperature difference between the preset hot zone temperature and the preset cold zone temperature, it is determined whether the outer shell is provided with a protective case.

[0227] In some embodiments, when it is intelligently recognized that the electronic device is using protective accessories, a visual prompt can be given to the user. For example, when it is determined that the electronic device is using protective accessories, a first window is displayed, and the first window includes information about the protective accessories.

[0228] See Figure 17 FIG. 1 is a temperature control method provided in an embodiment of the present application. The temperature control method can be applied to electronic devices. The temperature control method can include the following steps:

[0229] 171: When the electronic device is not using protective accessories, the maximum surface temperature of the electronic device is less than or equal to the safety temperature. The surface temperature includes the temperature of the display surface and the temperature of the casing surface.

[0230] In some embodiments, to ensure user safety during device use, the surface temperature of the electronic device must not exceed the safety temperature. For example, the surface of the electronic device in its bare form includes the display screen and the outer casing. Therefore, the temperature of both the display screen and the outer casing must not exceed the safety temperature.

[0231] 172: When electronic equipment uses protective accessories, the maximum surface temperature of the electronic equipment may be greater than the safety temperature.

[0232] Generally speaking, when using protective accessories for electronic devices, the user perceives a lower device temperature than when not using them. This means that when using protective accessories, the maximum device surface temperature is allowed to exceed the safety rating. In this case, due to the presence of the protective accessories, the surface temperature is less than or equal to the safety rating, which does not affect user safety during device use and maximizes the user's device performance needs.

[0233] In some embodiments, when a protective accessory is used on an electronic device, the difference between the maximum surface temperature of the electronic device and the safety temperature may be greater than a first preset value. The first preset value is related to the heat dissipation / insulation capabilities of the protective accessory, and may be, for example, 2°C, 3°C, etc.

[0234] See Figure 18 FIG. 1 is a temperature control method provided in an embodiment of the present application. The temperature control method can be applied to electronic devices. The temperature control method can include the following steps:

[0235] 181: If the electronic device is not using protective accessories, the performance of the electronic device in the first preset scenario is the first performance.

[0236] In some embodiments, the performance of the electronic device may include at least one of the following: processor performance (e.g., processor frequency), memory performance (e.g., memory frequency), display performance (e.g., display refresh rate), communication module performance (e.g., antenna frequency), audio module performance (e.g., audio pitch / loudness), camera module performance (e.g., camera frame rate), battery charging and discharging module performance (e.g., charging current, discharging current).

[0237] 182: If the electronic device uses a protective accessory, the performance of the electronic device in the first preset scenario is a second performance, and the second performance is higher than the first performance.

[0238] In some embodiments, the device temperature perceived by the user when using protective accessories is lower than the device temperature perceived by the user when not using protective accessories. In the same scenario, when using protective accessories, the device can be allowed to work using relatively relaxed operating parameters, and the performance release is relaxed, while when not using protective accessories, the device uses relatively tightened operating parameters to work, and the performance release is tightened. That is, in the same scenario, the performance of the device using protective accessories can be set higher than the performance of the device without protective accessories, so as to meet the user's device performance requirements to the greatest extent. For example, in the same scenario, the highest hot spot temperature on the surface of the device is the same, and the use of protective accessories causes the user to perceive a lower device temperature than the device temperature perceived by the user when not using protective accessories, and thus the performance of the device using protective accessories can be set higher than the performance of the device without protective accessories.

[0239] In some embodiments, the second performance being higher than the first performance may mean that in the same scenario, when protective accessories are used compared to when no protective accessories are used: the processor frequency may be higher, or the memory frequency may be higher, or the display refresh rate / brightness may be higher, or the camera frame rate may be higher, or the charging current may be larger, etc.

[0240] In some embodiments, in a second preset scenario, the difference between the maximum surface temperature of the electronic device with and without the protective accessory is greater than a second preset value. The second preset scenario may be a scenario where the device surface temperature is close to the safety temperature. For example, without the protective accessory, the surface temperature of the bare device is close to the safety temperature; with the protective accessory, the surface temperature of the protective accessory is close to the safety temperature, but the device surface temperature is greater than the safety temperature. The second preset value is related to the heat dissipation / insulation capabilities of the protective accessory. For example, the second preset value may be 3°C, 4°C, etc.

[0241] That is, the maximum surface temperature of an electronic device when using protective accessories can be significantly greater than the maximum surface temperature when not using protective accessories. Based on the thermal insulation of the protective accessories, it will not affect the safety of users when using the equipment, and can meet the user's equipment performance requirements to the greatest extent.

[0242] See Figure 19 As shown, the electronic device 100 involved in the embodiment of the present application is introduced below. The electronic device 100 in the embodiment of the present application can be a mobile phone, a tablet computer, a handheld computer, a laptop computer, an ultra-mobile personal computer (UMPC), a netbook, a cellular phone, a personal digital assistant (PDA), an augmented reality (AR) or virtual reality (VR) device, etc. The embodiment of the present application does not impose any special restrictions on the specific form of the electronic device. Please refer to Figure 19 , Figure 19 1 is a schematic structural diagram of an electronic device 100 provided in an embodiment of the present application.

[0243] The electronic device 100 may include a processor 110, an external memory interface 120, an internal memory 121, a universal serial bus (USB) interface 130, a charging management module 140, a power management module 141, a battery 142, an antenna 1, an antenna 2, a mobile communication module 150, a wireless communication module 160, an audio module 170, a speaker 170A, a receiver 170B, a microphone 170C, an earphone interface 170D, a sensor module 180, a button 190, a motor 191, an indicator 192, a camera 193, a display 194, and a subscriber identification module (SIM) card interface 195, etc.

[0244] It should be understood that the structure illustrated in the embodiments of the present invention does not constitute a specific limitation on the electronic device 100. In other embodiments of the present application, the electronic device 100 may include more or fewer components than shown, or may combine or separate certain components, or arrange the components differently. The illustrated components may be implemented in hardware, software, or a combination of software and hardware.

[0245] In addition, operating systems run on the above components, such as the iOS operating system developed by Apple, the Android open source operating system developed by Google, and the Windows operating system developed by Microsoft.

[0246] The processor 110 may include one or more processing units. For example, the processor 110 may include an application processor (AP), a modem processor, a graphics processing unit (GPU), an image signal processor (ISP), a controller, a video codec, a digital signal processor (DSP), a baseband processor, and / or a neural-network processing unit (NPU). The different processing units may be independent devices or integrated into one or more processors.

[0247] For example, the processor 110 may be used to perform the above-mentioned temperature control method to select and execute a thermal control strategy. For another example, the processor 110 may also be used to perform surface temperature fitting.

[0248] Processor 110 may also include a memory for storing instructions and data. In some embodiments, the memory in processor 110 is a cache memory. This memory can store instructions or data that have just been used or are being recycled by processor 110. If processor 110 needs to use these instructions or data again, it can directly access them from the memory. This avoids duplicate accesses, reduces processor 110 latency, and thus improves system efficiency.

[0249] In some embodiments, the processor 110 may include one or more interfaces. The interfaces may include an inter-integrated circuit (I2C) interface, an inter-integrated circuit sound (I2S) interface, a pulse code modulation (PCM) interface, a universal asynchronous receiver / transmitter (UART) interface, a mobile industry processor interface (MIPI), a general-purpose input / output (GPIO) interface, a subscriber identity module (SIM) interface, and / or a universal serial bus (USB) interface.

[0250] The wireless communication function of the electronic device 100 can be implemented through the antenna 1, the antenna 2, the mobile communication module 150, the wireless communication module 160, the modem processor and the baseband processor.

[0251] Antenna 1 and Antenna 2 are used to transmit and receive electromagnetic wave signals. Each antenna in electronic device 100 can be used to cover a single or multiple communication frequency bands. Different antennas can also be reused to improve antenna utilization. For example, antenna 1 can be reused as a diversity antenna for a wireless local area network. In other embodiments, the antennas can be used in conjunction with a tuning switch.

[0252] The mobile communication module 150 can provide wireless communication solutions, including 2G / 3G / 4G / 5G, for the electronic device 100. The mobile communication module 150 can include at least one filter, a switch, a power amplifier, a low-noise amplifier (LNA), and the like. The mobile communication module 150 can receive electromagnetic waves from the antenna 1, filter and amplify the received electromagnetic waves, and transmit them to the modem processor for demodulation. The mobile communication module 150 can also amplify the signals modulated by the modem processor and convert them into electromagnetic waves for radiation via the antenna 1. In some embodiments, at least some of the functional modules of the mobile communication module 150 can be located in the processor 110. In some embodiments, at least some of the functional modules of the mobile communication module 150 can be located in the same device as at least some of the modules of the processor 110.

[0253] The wireless communication module 160 can provide wireless communication solutions applied to the electronic device 100, including wireless local area networks (WLAN) (such as wireless fidelity (Wi-Fi) networks), Bluetooth (BT), global navigation satellite system (GNSS), frequency modulation (FM), near field communication (NFC), infrared (IR), etc. The wireless communication module 160 can be one or more devices integrating at least one communication processing module. The wireless communication module 160 receives electromagnetic waves via the antenna 2, frequency modulates and filters the electromagnetic wave signals, and sends the processed signals to the processor 110. The wireless communication module 160 can also receive signals to be transmitted from the processor 110, frequency modulate them, amplify them, and convert them into electromagnetic waves for radiation through the antenna 2.

[0254] In some embodiments, antenna 1 of electronic device 100 is coupled to mobile communication module 150, and antenna 2 is coupled to wireless communication module 160, so that electronic device 100 can communicate with a network and other devices via wireless communication technologies. The wireless communication technologies may include global system for mobile communications (GSM), general packet radio service (GPRS), code division multiple access (CDMA), wideband code division multiple access (WCDMA), time-division code division multiple access (TD-SCDMA), long term evolution (LTE), Bluetooth, GNSS, WLAN, NFC, FM, and / or IR technology. The GNSS may include global positioning system (GPS), global navigation satellite system (GLONASS), Beidou navigation satellite system (BDS), quasi-zenith satellite system (QZSS), and / or satellite-based augmentation system (SBAS).

[0255] Electronic device 100 implements display functionality through a GPU, display screen 194, and an application processor. A GPU is a microprocessor for image processing that connects display screen 194 and the application processor. The GPU is used to perform mathematical and geometric calculations for graphics rendering. Processor 110 may include one or more GPUs, which execute program instructions to generate or modify display information.

[0256] Display screen 194 is used to display images, videos, and the like. It can also be used to display the control center interface, settings application interface, and the like. Display screen 194 includes a display panel. The display panel can be a liquid crystal display (LCD), organic light-emitting diode (OLED), active-matrix organic light-emitting diode (AMOLED), flexible light-emitting diode (FLED), miniLED, microLED, micro-OLED, quantum dot light-emitting diode (QLED), and the like. In some embodiments, electronic device 100 may include one or N display screens 194, where N is a positive integer greater than 1. In the embodiments of the present application, display screen 194 may be a touch screen, i.e., the display screen 194 may have an integrated touch sensor 180K.

[0257] Internal memory 121 may include one or more random access memories (RAMs) and one or more non-volatile memories (NVMs). RAMs may include static random access memories (SRAMs), dynamic random access memories (DRAMs), synchronous dynamic random access memories (SDRAMs), and double data rate synchronous dynamic random access memories (DDR SDRAMs, such as the fifth generation DDR SDRAM, commonly referred to as DDR5 SDRAMs). NVMs may include disk storage devices and flash memories.

[0258] Flash memory can be divided into NOR FLASH, NAND FLASH, 3D NAND FLASH according to the operating principle, single-level cell (SLC), multi-level cell (MLC), triple-level cell (TLC), quad-level cell (QLC) according to the storage cell potential level, and universal flash storage (UFS) and embedded multi media card (eMMC) according to the storage specification.

[0259] The random access memory can be directly read and written by the processor 110, and can be used to store executable programs (such as machine instructions) of the operating system or other running programs, and can also be used to store user and application data.

[0260] The non-volatile memory may also store executable programs and user and application data, etc., and may be loaded into the random access memory in advance for direct reading and writing by the processor 110 .

[0261] The external memory interface 120 can be used to connect to an external non-volatile memory to expand the storage capacity of the electronic device 100. The external non-volatile memory communicates with the processor 110 through the external memory interface 120 to implement a data storage function.

[0262] The temperature control methods in the above embodiments can all be implemented in the electronic device 100 having the above hardware structure.

[0263] This embodiment further provides a computer-readable storage medium, which stores computer instructions. When the computer instructions are executed on the electronic device 100, the electronic device 100 performs the above-mentioned related method steps to implement the temperature control method in the above-mentioned embodiment.

[0264] This embodiment further provides a computer program product. When the computer program product is run on a computer, it enables the computer to perform the above-mentioned related steps to implement the temperature control method in the above-mentioned embodiment.

[0265] This embodiment further provides a chip system, which is coupled to a memory. The chip system is used to read and execute a computer program stored in the memory to implement the temperature control method in the above embodiment.

[0266] Through the description of the above implementation methods, technical personnel in the relevant field can clearly understand that for the convenience and simplicity of description, only the division of the above-mentioned functional modules is used as an example. In actual applications, the above-mentioned functions can be assigned to different functional modules as needed, that is, the internal structure of the device can be divided into different functional modules to complete all or part of the functions described above.

[0267] In the several embodiments provided in this application, it should be understood that the disclosed devices and methods can be implemented in other ways. For example, the device embodiments described above are merely schematic. For example, the division of the modules or units is only a logical function division. In actual implementation, there may be other division methods, such as multiple units or components can be combined or integrated into another device, or some features can be ignored or not performed. Another point is that the mutual coupling or direct coupling or communication connection shown or discussed can be through some interfaces, indirect coupling or communication connection of devices or units, which can be electrical, mechanical or other forms.

[0268] The units described as separate components may or may not be physically separate, and the components shown as units may be one physical unit or multiple physical units, that is, they may be located in one place or distributed in multiple places. Some or all of the units may be selected according to actual needs to achieve the purpose of the present embodiment.

[0269] In addition, the functional units in the various embodiments of the present application may be integrated into a single processing unit, or each unit may exist physically separately, or two or more units may be integrated into a single unit. The aforementioned integrated units may be implemented in the form of hardware or software functional units.

[0270] If the integrated unit is implemented in the form of a software functional unit and sold or used as an independent product, it can be stored in a readable storage medium. Based on this understanding, the technical solution of the embodiment of the present application, or the part that contributes to the prior art, or all or part of the technical solution can be embodied in the form of a software product, which is stored in a storage medium and includes several instructions for enabling a device (which can be a single-chip microcomputer, chip, etc.) or a processor to perform all or part of the steps of the various embodiments of the present application. The aforementioned storage medium includes: U disk, mobile hard disk, read-only memory (ROM), random access memory (RAM), disk or optical disk, and other media that can store program code.

[0271] The above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit them. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present application.

Claims

1. A temperature control method, applied to electronic equipment, characterized in that: The method comprises: When the electronic device does not use a protective accessory, a first thermal control strategy is used to control the device temperature; When the electronic device uses the protective accessories, a second thermal control strategy different from the first thermal control strategy is adopted to control the temperature of the device. Both the first thermal control strategy and the second thermal control strategy include adjusting the working parameters of at least one of the following: processor, memory, display, communication module, audio module, camera module, battery charging and discharging module, and the working parameters adjusted by the second thermal control strategy are higher than the working parameters adjusted by the first thermal control strategy.

2. The temperature control method according to claim 1, wherein: The protective accessories include a protective film and / or a protective case.

3. The temperature control method according to claim 1, wherein: The electronic device includes a display screen and a housing, the protective accessory includes a protective film provided on the display screen, and the device temperature control using a second thermal control strategy different from the first thermal control strategy includes: Obtaining a first hot spot temperature on the surface of the protective film and a second hot spot temperature on the surface of the housing; Device temperature control is performed based on the second thermal control strategy and the larger of the first hotspot temperature and the second hotspot temperature.

4. The temperature control method according to claim 3, wherein: The method further comprises: Obtaining the thickness of the protective film; The performing device temperature control based on the second thermal control strategy and the larger of the first hotspot temperature and the second hotspot temperature includes: Device temperature control is performed based on a second thermal control strategy corresponding to the thickness of the protective film and the larger of the first hotspot temperature and the second hotspot temperature.

5. The temperature control method according to claim 3, wherein: The electronic device includes a plurality of first sensors for sensing the temperature of the display screen and a plurality of second sensors for sensing the temperature of the housing. The method of obtaining the first hotspot temperature on the surface of the protective film and the second hotspot temperature on the surface of the housing includes: fitting the temperatures of a plurality of first positions located on the surface of the protective film based on the temperature sensing data of the plurality of first sensors, and taking the maximum value of the temperatures of the plurality of first positions as the first hotspot temperature; Based on the temperature sensing data of the plurality of second sensors, the temperatures of the plurality of second position points on the surface of the housing are obtained by fitting, and the maximum value of the temperatures of the plurality of second position points is used as the second hot spot temperature.

6. The temperature control method according to claim 3, wherein: The display screen includes a third sensor for detecting the protective film, and the method further includes: In response to a first touch operation on the display screen, acquiring sensing data of the third sensor, where the third sensor includes a capacitive touch sensor or an elastic wave sensor; Based on the sensing data of the third sensor, it is determined whether the protective film is provided on the display screen and the thickness of the protective film.

7. The temperature control method according to claim 1, wherein: The electronic device includes a display screen and a housing, the protective accessory includes a protective shell provided on the housing, and the device temperature is controlled by adopting a second thermal control strategy different from the first thermal control strategy, including: Obtaining a third hotspot temperature on the surface of the display screen and a fourth hotspot temperature on the surface of the protective cover; Device temperature control is performed based on the second thermal control strategy and the larger of the third hotspot temperature and the fourth hotspot temperature.

8. The temperature control method according to claim 7, wherein: The method further comprises: Obtaining the material and / or thickness of the protective shell; The performing device temperature control based on the second thermal control strategy and the larger of the third hotspot temperature and the fourth hotspot temperature includes: Device temperature control is performed based on a second thermal control strategy corresponding to the material and / or thickness of the protective shell and the larger of the third hotspot temperature and the fourth hotspot temperature.

9. The temperature control method according to claim 7, wherein: The electronic device includes a plurality of first sensors for sensing a display screen temperature and a plurality of second sensors for sensing a housing temperature, and obtaining a third hotspot temperature on a surface of the display screen and a fourth hotspot temperature on a surface of the protective housing includes: fitting the temperatures of a plurality of third points on the surface of the display screen based on the temperature sensing data of the plurality of first sensors, and taking the maximum value of the temperatures of the plurality of third points as the third hotspot temperature; Based on the temperature sensing data of the plurality of second sensors, the temperatures of a plurality of fourth position points on the surface of the protective shell are obtained by fitting, and the maximum value of the temperatures of the plurality of fourth position points is used as the fourth hotspot temperature.

10. The temperature control method according to claim 1, wherein: The electronic device includes a display screen and a housing, the protective accessory includes a protective film provided on the display screen and a protective shell provided on the housing, and the device temperature control using a second thermal control strategy different from the first thermal control strategy includes: Obtaining a first hotspot temperature on the surface of the protective film and a fourth hotspot temperature on the surface of the protective shell; Device temperature control is performed based on the second thermal control strategy and the larger of the first hotspot temperature and the fourth hotspot temperature.

11. The temperature control method according to claim 10, wherein: The method further comprises: Obtaining the thickness of the protective film; Obtaining the material and / or thickness of the protective shell; The second thermal control strategy is determined based on the thickness of the protective film and the material and / or thickness of the protective shell.

12. The temperature control method according to claim 10, wherein: The electronic device includes a first interface electrically connected to the protective shell, and the method further includes: Based on the connection information of the first interface, it is determined whether the protective shell is provided on the housing, where the first interface includes a universal serial bus (USB) interface or an interface electrically connected to a pogo pin (Pogopin).

13. The temperature control method according to claim 10, wherein: The protective shell includes a Hall sensor, and the method further includes: Based on the sensing data reported by the Hall sensor, it is determined whether the protective shell is provided on the housing.

14. The temperature control method according to claim 10, wherein: The electronic device includes a wireless charging module, and the method further includes: When the electronic device is charged based on the wireless charging module, obtaining the transmission power and quality factor during the wireless charging process; Based on the transmission power and the quality factor, it is determined whether the protective shell is provided on the housing.

15. The temperature control method according to claim 10, wherein: The method further comprises: In response to a second touch operation on the display screen, acquiring a signal amount of the second touch operation, where the second touch operation is an operation in which a user holds the electronic device and touches the display screen; Based on the signal amount of the second touch operation, it is determined whether the protective cover is provided on the housing.

16. The temperature control method according to claim 10, wherein: The electronic device includes a fourth sensor for detecting the protective case, wherein the fourth sensor is disposed below a surface of the housing. The method further includes: Acquiring sensing data from the fourth sensor, where the fourth sensor includes one of the following: an elastic wave sensor, an acceleration + gyroscope sensor, a light sensor, or a capacitive touch sensor; Based on the sensing data of the fourth sensor, it is determined whether the protective cover is provided on the housing.

17. The temperature control method according to claim 10, wherein: The method further comprises: Obtaining a preset hot zone temperature and a preset cold zone temperature of the electronic device in a high-heat state, wherein the high-heat state includes a charging state or a hardware performance overload state; Based on the temperature difference between the preset hot zone temperature and the preset cold zone temperature, it is determined whether the protective shell is provided on the housing.

18. The temperature control method according to any one of claims 6 or 12 to 17, characterized in that: The method further comprises: When it is determined that the electronic device uses the protective accessory, a first window is displayed, where the first window includes information about the protective accessory.

19. The temperature control method according to any one of claims 1 to 17, wherein: The method further comprises: In response to a first operation, displaying a first interface, the first interface including a control for setting a protective accessory used with the electronic device; Based on a second operation on the control, a protective accessory used by the electronic device is determined.

20. A temperature control method, applied to electronic equipment, characterized in that: The method comprises: When the electronic device is not using protective accessories, the maximum surface temperature of the electronic device is controlled to be less than or equal to the safety temperature, the surface temperature including the temperature of the display surface and the temperature of the housing surface; When the electronic device uses the protective accessory, the maximum value of the surface temperature of the electronic device is increased. Increasing the maximum value of the surface temperature of the electronic device includes improving the performance of the electronic device. When the electronic device uses the protective accessory, the maximum value of the surface temperature may be greater than the safety temperature.

21. The temperature control method according to claim 20, wherein: When the electronic device uses the protective accessory, the difference between the maximum value of the surface temperature of the electronic device and the safety temperature is greater than a preset value.

22. A temperature control method, applied to electronic equipment, characterized in that: The method comprises: If the electronic device is not using a protective accessory, controlling the performance of the electronic device in a first preset scenario to be a first performance, where the performance of the electronic device includes at least one of the following: processor performance, memory performance, display performance, communication module performance, audio module performance, camera module performance, and battery charging and discharging module performance; If the electronic device uses a protective accessory, the performance of the electronic device in the first preset scenario is controlled to be a second performance, and the second performance is higher than the first performance.

23. The temperature control method according to claim 22, wherein: In the second preset scenario, a difference between a maximum value of the surface temperature of the electronic device when the protective accessory is used and a maximum value of the surface temperature of the electronic device when the protective accessory is not used is greater than a preset value.

24. An electronic device, characterized in that: The electronic device includes a memory and a processor; The memories are all coupled to the processor; The memory is used to store program instructions; The processor is used to read the program instructions stored in the memory to implement the temperature control method according to any one of claims 1 to 23.

25. A computer-readable storage medium, characterized in that The computer-readable storage medium stores computer-readable instructions, and when the computer-readable instructions are executed by a processor, the temperature control method according to any one of claims 1 to 23 is implemented.

26. A computer program product comprising computer-readable instructions, characterized in that: When the computer-readable instructions are executed by a processor, the temperature control method according to any one of claims 1 to 23 is implemented.

Citation Information

Patent Citations

  • Smart case for a portable electronic device

    US10838462B1

  • Adjustment of device operations based on an enclosure

    US20170031398A1