Display substrate, preparation method thereof and display device

Abstract

The invention discloses a display substrate, a preparation method of the display substrate and a display device. The display substrate comprises a substrate, a light-emitting structure layer arranged on the substrate and a touch control structure layer arranged on the side, away from the substrate, of the light-emitting structure layer. The touch structure layer comprises a first conducting layer and a second conducting layer which are sequentially stacked in the direction away from the substrate, the first conducting layer comprises a first touch electrode and a first magnetic control electrode, the second conducting layer comprises a second touch electrode and a second magnetic control electrode, the first conducting layer is made of aluminum or copper, and the second conducting layer is made of aluminum or copper. The second conductive layer is made of copper; and the resistance is reduced.

Description

Technical Field

[0001] This article relates to but is not limited to the field of display technology, and specifically to a display substrate and a preparation method thereof, and a display device. Background Art

[0002] The market share of passive electromagnetic pens is gradually increasing. The stylus solutions for display devices (such as mobile phones and tablets) mostly adopt the electromagnetic resonance (EMR) passive pen + flexible printed circuit board (FPC) electromagnetic induction board solution; the stylus solutions for painting displays mostly adopt the electromagnetic resonance (EMR) passive pen + printed circuit board (PCB) electromagnetic induction board solution.

[0003] With the upgrading of demand for mobile phone products, such as the demand for foldable mobile phones, the electromagnetic resonance (EMR) passive pen can be integrated into the display device. However, the magnetic control electrode of the electromagnetic resonance (EMR) passive pen cannot meet the load requirements of the integrated circuit chip in the display device. Summary of the invention

[0004] The embodiments of the present application provide a display substrate and a method for manufacturing the same, and a display device to reduce resistance.

[0005] An embodiment of the present disclosure provides a display substrate, comprising: a substrate, a light-emitting structure layer arranged on the substrate, and a touch-control structure layer arranged on a side of the light-emitting structure layer away from the substrate; the touch-control structure layer comprises a first conductive layer and a second conductive layer stacked in sequence along a direction away from the substrate, the first conductive layer comprises a first touch electrode and a first magnetic control electrode, the second conductive layer comprises a second touch electrode and a second magnetic control electrode, the first conductive layer is made of aluminum or copper, and the second conductive layer is made of copper.

[0006] In an exemplary embodiment, the thickness of the first conductive layer is greater than or equal to 6000 angstroms and less than or equal to 9000 angstroms.

[0007] In an exemplary embodiment, the thickness of the second conductive layer is greater than or equal to 9000 angstroms and less than or equal to 15000 angstroms.

[0008] In an exemplary embodiment, the material of the first conductive layer is aluminum or copper, and the thickness of the first conductive layer is greater than or equal to 6000 angstroms and less than or equal to 7000 angstroms; or, the material of the first conductive layer is copper, and the thickness of the first conductive layer is greater than 7000 angstroms and less than or equal to 9000 angstroms.

[0009] In an exemplary embodiment, an orthographic projection of the second magnetron electrode on the substrate overlaps at least partially with an orthographic projection of the first touch electrode on the substrate, the first touch electrode is made of aluminum, and the second magnetron electrode is made of copper; or, both the first touch electrode and the second magnetron electrode are made of copper.

[0010] In an exemplary embodiment, an orthographic projection of the second touch electrode on the substrate overlaps at least partially with an orthographic projection of the first magnetron electrode on the substrate, a material of the first magnetron electrode is aluminum, and a material of the second touch electrode is copper; or a material of the second touch electrode and a material of the first magnetron electrode are both copper.

[0011] In an exemplary embodiment, the touch structure layer further includes a touch insulating layer, which is disposed between the first conductive layer and the second conductive layer, and has a thickness greater than or equal to 3000 angstroms and less than or equal to 5000 angstroms.

[0012] In an exemplary embodiment, the touch insulating layer is made of an inorganic material or an organic material.

[0013] The present disclosure also provides a method for preparing a display substrate, comprising: forming light-emitting structure layers on the substrate in sequence; forming a touch control structure layer on a side of the light emitting structure layer away from the substrate; The touch structure layer includes a first conductive layer and a second conductive layer stacked in sequence in a direction away from the substrate, the first conductive layer includes a first touch electrode and a first magnetoelectric electrode, the second conductive layer includes a second touch electrode and a second magnetoelectric electrode, the first conductive layer is made of aluminum or copper, and the second conductive layer is made of copper; The first touch control electrode and the first magnetron electrode are made of the same conductive material through the same preparation process; the second touch control electrode and the second magnetron electrode are made of the same conductive material through the same preparation process.

[0014] The disclosed embodiment further provides a display device, characterized in that it includes the aforementioned display substrate.

[0015] The disclosed embodiment shows that the substrate uses metal aluminum or metal copper through the first touch electrode and the first magnetron electrode, and the thickness of the first touch electrode and the first magnetron electrode is greater than or equal to 6000 angstroms and less than or equal to 7000 angstroms, so as to avoid the first touch electrode and the first magnetron electrode from being broken due to material stress, thereby ensuring the electrical connection between the first touch electrode and the first magnetron electrode; and reducing the resistance of the first touch electrode and the first magnetron electrode to meet the load requirements of the integrated circuit chip.

[0016] The disclosed embodiment shows that the substrate uses metal copper through the first touch electrode and the first magnetron electrode, and the thickness of the first touch electrode and the first magnetron electrode is greater than 7000 angstroms and less than or equal to 9000 angstroms, thereby preventing the first touch electrode and the first magnetron electrode from being broken due to material stress, thereby ensuring the electrical connection between the first touch electrode and the first magnetron electrode; and reducing the resistance of the first touch electrode and the first magnetron electrode to meet the requirements of the integrated circuit chip load.

[0017] The disclosed embodiment shows that the thickness of the substrate through the first touch electrode and the first magnetron electrode is greater than or equal to 6000 angstroms and less than or equal to 9000 angstroms, so that the touch insulating layer can cover the first touch electrode and the first magnetron electrode to ensure the insulation of the first touch electrode and the first magnetron electrode.

[0018] The disclosed embodiment shows that the substrate uses metal copper through the second touch electrode and the second magnetron electrode, and the thickness of the second touch electrode and the second magnetron electrode is greater than or equal to 9000 angstroms and less than or equal to 15000 angstroms, thereby preventing the second touch electrode and the second magnetron electrode from being broken due to material stress, thereby ensuring the electrical connection between the second touch electrode and the second magnetron electrode; and reducing the resistance of the second touch electrode and the second magnetron electrode to meet the requirements of the integrated circuit chip load.

[0019] The disclosed embodiment shows that the substrate overlaps at least part of the orthographic projection of the first touch electrode on the substrate through the second magnetron electrode, and the second magnetron electrode is made of metal copper, and the first touch electrode is made of metal aluminum. The stress direction of the metal copper is opposite to the stress direction of the metal aluminum, so that the stress of the second magnetron electrode on the upper layer can offset the stress of the first touch electrode on the lower layer, thereby avoiding the first touch electrode from breaking.

[0020] The disclosed embodiment shows that the substrate is made of metal copper through the second magnetron electrode. Copper has low resistance and can meet the requirements of integrated circuit chip load.

[0021] The disclosed embodiment shows that the substrate overlaps at least part of the orthographic projection of the first magnetron electrode on the substrate through the second touch electrode, and the second touch electrode is made of metal copper, and the first magnetron electrode is made of metal aluminum. The stress direction of the metal copper is opposite to the stress direction of the metal aluminum, so that the stress of the second touch electrode on the upper layer can offset the stress of the first magnetron electrode on the lower layer, thereby avoiding the first magnetron electrode from breaking.

[0022] The disclosed embodiment shows that the substrate is made of metal copper through the second touch electrode. Copper has low resistance and can meet the requirements of integrated circuit chip load.

[0023] Other features and advantages of the present application will be described in the following description, and partly become apparent from the description, or be understood by implementing the present application. Other advantages of the present application can be realized and obtained by the schemes described in the description and the drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] The accompanying drawings are used to provide an understanding of the technical solution of the present application and constitute a part of the specification. Together with the embodiments of the present application, they are used to explain the technical solution of the present application and do not constitute a limitation on the technical solution of the present application.

[0025] Figure 1 is a schematic diagram of a cross-sectional structure of a related display substrate; Figure 2 A schematic cross-sectional structure diagram of a display substrate is provided for an embodiment of the present disclosure; Figure 3 A schematic cross-sectional structure diagram of another display substrate is provided for an embodiment of the present disclosure; Figure 4 A schematic cross-sectional structure diagram of another display substrate is provided for an embodiment of the present disclosure. DETAILED DESCRIPTION

[0026] The present application describes multiple embodiments, but the description is exemplary rather than restrictive, and it is obvious to those skilled in the art that there may be more embodiments and implementations within the scope of the embodiments described in the present application. Although many possible feature combinations are shown in the drawings and discussed in the specific embodiments, many other combinations of the disclosed features are also possible. Unless specifically limited, any feature or element of any embodiment may be used in combination with any other feature or element in any other embodiment, or may replace any other feature or element in any other embodiment.

[0027] The present application includes and contemplates combinations of features and elements known to those of ordinary skill in the art. The embodiments, features and elements disclosed in the present application may also be combined with any conventional features or elements to form a unique invention scheme. Any features or elements of any embodiment may also be combined with features or elements from other invention schemes to form another unique invention scheme. Therefore, it should be understood that any feature shown and / or discussed in the present application may be implemented individually or in any appropriate combination. Therefore, except for the limitations made according to the attached claims and their equivalents, the embodiments are not subject to other restrictions. In addition, various modifications and changes may be made within the scope of protection of the attached claims.

[0028] In addition, when describing representative embodiments, the specification may have presented the method and / or process as a specific sequence of steps. However, to the extent that the method or process does not rely on the specific order of the steps described herein, the method or process should not be limited to the steps of the specific order described. As will be understood by those of ordinary skill in the art, other sequences of steps are also possible. Therefore, the specific sequence of the steps set forth in the specification should not be interpreted as a limitation to the claims. In addition, the claims for the method and / or process should not be limited to the steps of performing them in the order written, and those skilled in the art can easily understand that these sequences can be changed and still remain within the spirit and scope of the embodiments of the present application.

[0029] Figure 1 FIG. 1 is a schematic diagram of a cross-sectional structure of a related display substrate. Figure 1 As shown, the relevant display substrate includes a substrate 101', a driving circuit layer 102' arranged on 101', a light emitting structure layer 103' arranged on the side of the driving circuit layer 102' away from the substrate 101', a packaging structure layer 104' arranged on the side of the light emitting structure layer 103' away from the substrate 101', a buffer layer 107' arranged on the side of the packaging structure layer 104' away from the substrate 101', a touch structure layer 105' arranged on the side of the buffer layer 107' away from the substrate 101', and a color film structure layer 106' arranged on the side of the touch structure layer 105' away from the substrate 101'. The touch structure layer 105' includes a first touch electrode 11' arranged on the side of the packaging structure layer 104' away from the substrate 101', a touch insulating layer arranged on the side of the first touch electrode 11' away from the substrate 101', and a second touch electrode 12' arranged on the side of the touch insulating layer away from the substrate 101'. The first touch electrode 11' and the second touch electrode 12' generally include a first sub-electrode, a second sub-electrode and a third sub-electrode arranged in sequence along a direction away from the substrate. The first sub-electrode and the third sub-electrode are both made of metal titanium with a thickness of 500 angstroms, and the second sub-electrode is made of metal aluminum with a thickness of 6500 angstroms.

[0030] The inventor of the present application has found through research that the use of an external plug-in method to integrate an electromagnetic resonance (EMR) passive pen into the touch structure layer of a display substrate will not increase the thickness of the display substrate. However, when the electromagnetic resonance (EMR) passive pen is integrated into the touch structure layer of a display substrate, the resistance of the magnetic control electrode of the electromagnetic resonance (EMR) passive pen is large and cannot meet the load requirements of the integrated circuit chip in the display substrate.

[0031] An embodiment of the present disclosure provides a display substrate, comprising: a substrate, a light-emitting structure layer arranged on the substrate, and a touch-control structure layer arranged on a side of the light-emitting structure layer away from the substrate; the touch-control structure layer comprises a first conductive layer and a second conductive layer stacked in sequence along a direction away from the substrate, the first conductive layer comprises a first touch electrode and a first magnetic control electrode, the second conductive layer comprises a second touch electrode and a second magnetic control electrode, the first conductive layer is made of aluminum or copper, and the second conductive layer is made of copper.

[0032] In an exemplary embodiment, the first conductive layer is made of aluminum or copper, and the thickness of the first conductive layer is greater than or equal to 6000 angstroms and less than or equal to 7000 angstroms; or, the first conductive layer is made of copper, and the thickness of the first conductive layer is greater than 7000 angstroms and less than or equal to 9000 angstroms.

[0033] In an exemplary embodiment, the thickness of the second conductive layer is greater than or equal to 9000 angstroms and less than or equal to 15000 angstroms.

[0034] In an exemplary embodiment, an orthographic projection of the second magnetron electrode on the substrate overlaps at least partially with an orthographic projection of the first touch electrode on the substrate, the first touch electrode is made of aluminum, and the second magnetron electrode is made of copper.

[0035] In an exemplary embodiment, an orthographic projection of the second touch electrode on the substrate overlaps at least partially with an orthographic projection of the first magnetron electrode on the substrate, the first magnetron electrode is made of aluminum, and the second touch electrode is made of copper.

[0036] In the embodiment of the present disclosure, the touch structure layer in the display substrate is stacked on the packaging structure layer to form a flexible multi-layer on-cell (FMLOC) structure. In a plane parallel to the display substrate, the display substrate includes an active area (AA), a binding area on one side of the active area, and an edge area on the other side of the active area. The active area can be either a touch area or a display area. The touch area and display area in the following description both refer to the active area.

[0037] In an exemplary embodiment, the effective area includes at least a first touch electrode, a second touch electrode, a first magnetron electrode and a second magnetron electrode; the edge area includes at least a first touch lead, a second touch lead, a first magnetron lead and a second magnetron lead; the binding area includes at least an integrated circuit chip; one end of the first touch lead is connected to the first touch electrode, and the other end of the first touch lead is connected to the integrated circuit chip, one end of the second touch lead is connected to the second touch electrode, and the other end of the second touch lead is connected to the integrated circuit chip, one end of the first magnetron lead is connected to the first magnetron electrode, and the other end of the first magnetron lead is connected to the integrated circuit chip, one end of the second magnetron lead is connected to the second magnetron electrode, and the other end of the second touch lead is connected to the integrated circuit chip.

[0038] In an exemplary embodiment, the first touch electrode and the second touch electrode are located in different film layers to form a mutual capacitance touch structure, and the first touch electrode and the second touch electrode are used to determine the touch position by using the change of mutual capacitance when a touch occurs. The first touch electrode can be a driving (Tx) electrode, and the second touch electrode can be a sensing (Rx) electrode. Alternatively, the first touch electrode can be a sensing (Rx) electrode, and the second touch electrode can be a driving (Tx) electrode.

[0039] In an exemplary embodiment, the first magneto-control electrode and the second magneto-control electrode are located in different film layers, the first magneto-control electrode and the first touch electrode are located in the same film layer, and the second magneto-control electrode and the second touch electrode are located in the same film layer. The first magneto-control electrode and the second magneto-control electrode are used to determine the coordinates of the touch point when electromagnetic touch occurs.

[0040] Figure 2 A schematic diagram of a cross-sectional structure of a display substrate is provided for an embodiment of the present disclosure. In an exemplary embodiment, as Figure 2As shown, in a plane perpendicular to the display substrate, the display substrate includes a substrate 101, a driving circuit layer 102 arranged on 101, a light-emitting structure layer 103 arranged on a side of the driving circuit layer 102 away from the substrate 101, an encapsulation structure layer 104 arranged on a side of the light-emitting structure layer 103 away from the substrate 101, a buffer layer 107 arranged on a side of the encapsulation structure layer 104 away from the substrate 101, a touch structure layer 105 arranged on a side of the buffer layer 107 away from the substrate 101, and a color film structure layer 106 arranged on a side of the touch structure layer 105 away from the substrate 101.

[0041] In an exemplary embodiment, the substrate 101 may be a flexible substrate or a rigid substrate. The flexible substrate may include a first flexible material layer, a first inorganic material layer, a semiconductor layer, a second flexible material layer, and a second inorganic material layer stacked together. The materials of the first flexible material layer and the second flexible material layer may be polyimide (PI), polyethylene terephthalate (PET), or a surface-treated polymer soft film, etc. The materials of the first inorganic material layer and the second inorganic material layer may be silicon nitride (SiNx) or silicon oxide (SiOx), etc., to improve the water and oxygen resistance of the substrate. The material of the semiconductor layer may be amorphous silicon (a-Si).

[0042] In an exemplary embodiment, the driving circuit layer 102 may include a plurality of transistors and storage capacitors constituting a pixel driving circuit. In some possible implementations, the driving circuit layer 102 may include: a first insulating layer disposed on a substrate; an active layer disposed on the first insulating layer; a second insulating layer covering the active layer; a gate electrode and a first capacitor electrode disposed on the second insulating layer; a third insulating layer covering the gate electrode and the first capacitor electrode; a second capacitor electrode disposed on the third insulating layer; a fourth insulating layer covering the second capacitor electrode, the second insulating layer, the third insulating layer and the fourth insulating layer having vias provided thereon, the vias exposing the active layer; a source electrode and a drain electrode disposed on the fourth insulating layer, the source electrode and the drain electrode being connected to the active layer through the vias respectively; a flat layer covering the aforementioned structure, the flat layer having vias provided thereon, the vias exposing the drain electrode. The active layer, the gate electrode, the source electrode and the drain electrode constitute a driving transistor, and the first capacitor electrode and the second capacitor electrode constitute a storage capacitor.

[0043] In an exemplary embodiment, the light emitting structure layer 103 includes a plurality of light emitting devices, and the light emitting devices may include a first electrode, a pixel definition layer, an organic light emitting layer, and a second electrode which are sequentially stacked in a direction away from the substrate. The first electrode is disposed on the flat layer and is connected to the drain electrode of the driving transistor through a via hole provided on the flat layer; the pixel definition layer is disposed on the first electrode and the flat layer, and a pixel opening is disposed on the pixel definition layer, and the pixel opening exposes the first electrode; the organic light emitting layer is at least partially disposed in the pixel opening, and the organic light emitting layer is connected to the first electrode; the second electrode is disposed on the organic light emitting layer, and the second electrode is connected to the organic light emitting layer; the organic light emitting layer emits light of corresponding colors under the drive of the first electrode and the second electrode. Among them, the first electrode may be an anode, and the second electrode may be a cathode.

[0044] In an exemplary embodiment, the light emitting device may be an organic light emitting diode (OLED) device, and the organic light emitting layer of the organic light emitting diode device may include an emitting layer (EML), and one or more film layers including a hole injection layer (HIL), a hole transport layer (HTL), a hole blocking layer (HBL), an electron blocking layer (EBL), an electron injection layer (EIL), and an electron transport layer (ETL). Under the voltage drive of the first electrode and the second electrode, the light emitting property of the organic material is used to emit light according to the required grayscale.

[0045] In an exemplary embodiment, the encapsulation structure layer 104 may include a stacked first encapsulation layer, a second encapsulation layer, and a third encapsulation layer. The first encapsulation layer and the third encapsulation layer may be made of inorganic materials, the second encapsulation layer may be made of organic materials, and the second encapsulation layer is arranged between the first encapsulation layer and the third encapsulation layer to ensure that external water vapor cannot enter the light-emitting device.

[0046] In an exemplary embodiment, the buffer layer 107 may be formed of any one or more of silicon oxide (SiOx), silicon nitride (SiNx), and silicon oxynitride (SiON), and may be a single layer, a multi-layer, or a composite layer.

[0047] In an exemplary embodiment, the touch structure layer 105 may include a first conductive layer disposed on a side of the buffer layer 107 away from the substrate 101, a touch insulating layer 201 disposed on a side of the first conductive layer away from the substrate 101, a second conductive layer disposed on a side of the touch insulating layer 201 away from the substrate 101, and a protective layer 202 disposed on a side of the second conductive layer away from the substrate 101.

[0048] In an exemplary embodiment, the first conductive layer includes a first touch electrode 11 and a first magnetron electrode 21. The first touch electrode 11 and the first magnetron electrode 21 are located in the same film layer and are made of the same conductive material through the same preparation process, thereby simplifying the process and reducing production costs.

[0049] In some embodiments, the first touch electrode and the first magnetron electrode are located in the same film layer. The first touch electrode and the first magnetron electrode can be made of the same or different conductive materials through different preparation processes, which will not be described in detail in the present disclosure.

[0050] In an exemplary embodiment, the thickness of the first touch electrode 11 is substantially equal to the thickness of the first magnetron electrode 21 .

[0051] In an exemplary embodiment, the thickness of the first touch electrode 11 is h1, and the range of the thickness of the first touch electrode 11 is: 6000A≤h1≤9000A. The thickness of the first touch electrode 11 is the average size of the first touch electrode 11 in a direction perpendicular to the substrate.

[0052] The embodiment of the present disclosure shows that the thickness of the substrate through the first touch electrode 11 and the first magnetron electrode 21 is greater than or equal to 6000 angstroms and less than or equal to 9000 angstroms, so that the touch insulation layer 201 can cover the first touch electrode 11 and the first magnetron electrode 21 to ensure the insulation of the first touch electrode 11 and the first magnetron electrode 21.

[0053] In an exemplary embodiment, the material of the first touch electrode 11 may be metal aluminum or metal copper, and the thickness of the first touch electrode 11 is in the range of 6000 Å≤h1≤7000 Å.

[0054] The disclosed embodiment shows that the substrate uses metal aluminum or metal copper through the first touch electrode 11, and the thickness of the first touch electrode 11 is greater than or equal to 6000 angstroms and less than or equal to 7000 angstroms, thereby preventing the first touch electrode 11 from breaking due to material stress, thereby ensuring the electrical connection of the first touch electrode 11; and reducing the resistance of the first touch electrode 11 to meet the requirements of the integrated circuit chip load.

[0055] In an exemplary embodiment, the material of the first touch electrode 11 may be copper, and the thickness of the first touch electrode 11 is in the range of 7000 Å < h1 ≤ 9000 Å.

[0056] The disclosed embodiment shows that the substrate uses metal copper through the first touch electrode 11, and the thickness of the first touch electrode 11 is greater than 7000 angstroms and less than or equal to 9000 angstroms, so as to avoid the first touch electrode 11 from being broken due to material stress, thereby ensuring the electrical connection of the first touch electrode 11; and reducing the resistance of the first touch electrode 11 to meet the requirements of the integrated circuit chip load.

[0057] In an exemplary embodiment, the thickness of the first magnetron electrode 21 is h2, and the range of the thickness of the first magnetron electrode 21 is: 6000A≤h2≤9000A. The thickness of the first magnetron electrode 21 is the average size of the first magnetron electrode 21 in a direction perpendicular to the substrate.

[0058] In an exemplary embodiment, the material of the first magnetron electrode 21 may be metal aluminum or metal copper, and the thickness of the first magnetron electrode 21 is in the range of 6000A≤h2≤7000A.

[0059] The disclosed embodiment shows that the substrate uses metal aluminum or metal copper through the first magnetron electrode 21, and the thickness of the first magnetron electrode 21 is greater than or equal to 6000 angstroms and less than or equal to 7000 angstroms, so as to avoid the first magnetron electrode 21 from breaking due to material stress, thereby ensuring the electrical connection of the first magnetron electrode 21; and reducing the resistance of the first magnetron electrode 21 to meet the requirements of the integrated circuit chip load.

[0060] In an exemplary embodiment, the material of the first magnetron electrode 21 may be metal copper, and the thickness of the first magnetron electrode 21 is in the range of 7000A<h2≤9000A.

[0061] The disclosed embodiment shows that the substrate uses metal copper through the first magnetron electrode 21, and the thickness of the first magnetron electrode 21 is greater than 7000 angstroms and less than or equal to 9000 angstroms, so as to avoid the first magnetron electrode 21 from breaking due to material stress, thereby ensuring the electrical connection of the first magnetron electrode 21; and reducing the resistance of the first magnetron electrode 21 to meet the requirements of the integrated circuit chip load.

[0062] In an exemplary embodiment, the touch insulating layer 201 may be any one or more of silicon oxide (SiOx), silicon nitride (SiNx) and silicon oxynitride (SiON), and may be a single layer, a multilayer or a composite layer. The thickness of the touch insulating layer 201 is h3, and the range of the thickness of the touch insulating layer 201 is: 3000A≤h3≤5000A. The thickness of the touch insulating layer 201 is the average size of the touch insulating layer 201 in a direction perpendicular to the substrate.

[0063] In an exemplary embodiment, the second conductive layer includes a second touch electrode 12 and a second magnetron electrode 22. The second touch electrode 12 and the second magnetron electrode 22 are located in the same film layer and are made of the same conductive material through the same preparation process, thereby simplifying the process and reducing production costs.

[0064] In some embodiments, the second touch electrode and the second magnetron electrode are located in the same film layer. The second touch electrode and the second magnetron electrode can be made of the same or different conductive materials through different preparation processes, which will not be described in detail in this disclosure.

[0065] In an exemplary embodiment, the thickness of the second touch electrode 12 is substantially equal to the thickness of the second magnetron electrode 22 .

[0066] In an exemplary embodiment, the second touch electrode 12 may be made of copper, and the thickness of the second touch electrode 12 is h4, and the thickness of the second touch electrode 12 is in the range of 9000A≤h4≤15000A. The thickness of the second touch electrode 12 is the average size of the second touch electrode 12 in a direction perpendicular to the substrate.

[0067] The disclosed embodiment shows that the substrate uses metal copper through the second touch electrode 12, and the thickness of the second touch electrode 12 is greater than or equal to 9000 angstroms and less than or equal to 15000 angstroms, so as to avoid the second touch electrode 12 from being broken due to material stress, thereby ensuring the electrical connection of the second touch electrode 12; and reducing the resistance of the second touch electrode 12 to meet the requirements of the integrated circuit chip load.

[0068] In an exemplary embodiment, the material of the second magnetron electrode 22 may be copper, the thickness of the second magnetron electrode 22 is h5, and the thickness of the second magnetron electrode 22 ranges from 9000A≤h5≤15000A. The thickness of the second magnetron electrode 22 is the average size of the second magnetron electrode 22 in a direction perpendicular to the substrate.

[0069] The disclosed embodiment shows that the substrate uses metal copper through the second magnetron electrode 22, and the thickness of the second magnetron electrode 22 is greater than or equal to 9000 angstroms and less than or equal to 15000 angstroms, so as to avoid the second magnetron electrode 22 from breaking due to material stress, thereby ensuring the electrical connection of the second magnetron electrode 22; and reducing the resistance of the second magnetron electrode 22, which can meet the requirements of the integrated circuit chip load.

[0070] In an exemplary embodiment, the orthographic projection of the second magnetron electrode 22 on the substrate 101 overlaps at least part of the orthographic projection of the first touch electrode 11 on the substrate 101. The first touch electrode 11 is made of metal aluminum, and the thickness of the first touch electrode 11 is in the range of 6000A≤h1≤7000A; or, the first touch electrode 11 is made of metal copper, and the thickness of the first touch electrode 11 is in the range of 7000A﹤h1≤9000A. The second magnetron electrode 22 is made of metal copper, and the thickness of the second magnetron electrode 22 is in the range of 9000A≤h5≤15000A. The thickness of the second magnetron electrode 22 and the thickness of the first touch electrode 11 satisfy the relationship: h1﹤h5.

[0071] The embodiment of the disclosure shows that the substrate overlaps at least part of the orthographic projection of the first touch electrode 11 on the substrate 101 through the second magnetron electrode 22, and the second magnetron electrode 22 is made of metal copper, and the first touch electrode 11 is made of metal aluminum. Metal aluminum is more likely to break than metal copper. The crystal orientations of metal aluminum and metal copper are opposite, so that the stress direction of metal copper is opposite to that of metal aluminum. When the thickness of the first touch electrode 11 of the lower layer is greater than or equal to 6000 angstroms and less than or equal to 7000 angstroms, the second magnetron electrode 22 of the upper layer can offset the stress generated by the first touch electrode 11 of the lower layer, thereby preventing the first touch electrode 11 from breaking. When the thickness of the first touch electrode 11 is less than 6000 angstroms, the thickness of the first touch electrode 11 is too thin and the resistance is high; when the thickness of the first touch electrode 11 is greater than 7000 angstroms, the thickness of the first touch electrode 11 is too thick, and the second magnetron electrode 22 of the upper layer cannot effectively offset the stress generated by the first touch electrode 11 of the lower layer, resulting in the first touch electrode 11 of the lower layer being more likely to break.

[0072] The disclosed embodiment shows that the substrate overlaps at least part of the orthographic projection of the first touch electrode 11 on the base 101 through the second magnetron electrode 22. When the thickness of the first touch electrode 11 of the lower layer is large (for example, greater than 7000 angstroms) and the first touch electrode 11 of the lower layer is made of metal aluminum, the second magnetron electrode 22 of the upper layer cannot effectively offset the stress generated by the first touch electrode 11 of the lower layer, causing the first touch electrode 11 of the lower layer to be easily broken. Therefore, when the thickness of the first touch electrode 11 of the lower layer is greater than 7000 angstroms and less than or equal to 9000 angstroms, the first touch electrode 11 of the lower layer is made of metal copper. Copper has a low resistance, which can reduce the resistance of the first touch electrode 11 and make the first touch electrode 11 less likely to be broken.

[0073] In an exemplary embodiment, the orthographic projection of the second touch electrode 12 on the substrate 101 overlaps at least part of the orthographic projection of the first magnetron electrode 21 on the substrate 101. The first magnetron electrode 21 is made of metal aluminum, and the thickness of the first magnetron electrode 21 is in the range of 6000A≤h2≤7000A; or, the first magnetron electrode 21 is made of metal copper, and the thickness of the first magnetron electrode 21 is in the range of 7000A﹤h1≤9000A. The second touch electrode 12 is made of metal copper, and the thickness of the second touch electrode 12 is in the range of 9000A≤h4≤15000A. The thickness of the second touch electrode 12 and the thickness of the first magnetron electrode 21 satisfy the relationship: h2﹤h4.

[0074] The embodiment of the disclosure shows that the substrate overlaps the orthographic projection of at least part of the first magnetron electrode 21 on the substrate 101 through the second touch electrode 12, and the second touch electrode 12 is made of metal copper, and the first magnetron electrode 21 is made of metal aluminum. Metal aluminum is easy to break relative to metal copper. The crystal orientations of metal aluminum and metal copper are opposite, so that the stress direction of metal copper is opposite to the stress direction of metal aluminum. When the thickness of the first magnetron electrode 21 of the lower layer is greater than or equal to 6000 angstroms and less than or equal to 7000 angstroms, the second touch electrode 12 of the upper layer can offset the stress generated by the first magnetron electrode 21 of the lower layer, and avoid the first magnetron electrode 21 from breaking. When the thickness of the first magnetron electrode 21 is less than 6000 angstroms, the thickness of the first magnetron electrode 21 is too thin and the resistance is high; when the thickness of the first magnetron electrode 21 is greater than 7000 angstroms, the thickness of the first magnetron electrode 21 is too thick, and the second touch electrode 12 of the upper layer cannot effectively offset the stress generated by the first magnetron electrode 21 of the lower layer, resulting in the first magnetron electrode 21 of the lower layer being easy to break.

[0075] The disclosed embodiment shows that the substrate overlaps at least part of the orthographic projection of the first magnetron electrode 21 on the substrate 101 through the second touch electrode 12. When the thickness of the first magnetron electrode 21 of the lower layer is large (greater than 7000 angstroms) and the first magnetron electrode 21 of the lower layer is made of metal aluminum, the second touch electrode 12 of the upper layer cannot effectively offset the stress generated by the first magnetron electrode 21 of the lower layer, causing the first magnetron electrode 21 of the lower layer to be easily broken. Therefore, when the thickness of the first magnetron electrode 21 of the lower layer is greater than 7000 angstroms and less than or equal to 9000 angstroms, the first magnetron electrode 21 of the lower layer is made of metal copper. Copper has a low resistance, which can reduce the resistance of the first magnetron electrode 21 and make the first magnetron electrode 21 less likely to be broken.

[0076] The feeler gauge measurement method is used to measure the deformation value of copper film and aluminum film under stress. The specific steps include: Stress was applied to a copper film with a thickness of 9000A and an aluminum film with a thickness of 6000A, respectively. The deformation value of the copper film was 1.2mm, and the deformation value of the aluminum film was -1mm. Formula 1: (6000 / (6000+9000))*(-1)+ (9000 / (6000+9000))*(1.2)=0.2mm. According to Formula 1, the deformation value after the copper film and the aluminum film are stacked is 0.2mm. It can be seen that the stacking of metal copper and metal aluminum can offset each other's stress and reduce deformation.

[0077] In an exemplary embodiment, the protective layer 202 may be made of an organic material, such as an optically clear adhesive (OC). The thickness of the protective layer 202 is greater than or equal to 1.5 micrometers and less than or equal to 3 micrometers.

[0078] In an exemplary embodiment, the color film structure layer 106 includes a filter and a black matrix. The filter is arranged corresponding to the light-emitting device, and the filter is configured to transmit light of a specific color; the black matrix is ​​located at least between adjacent filters, and the black matrix is ​​configured to block light to prevent light from adjacent sub-pixels from crosstalking with each other.

[0079] The preparation process of the display substrate in the embodiment of the present disclosure includes: Step (1), forming a driving circuit layer 102, a light emitting structure layer 103 and a packaging structure layer 104 on a substrate in sequence; Step (2), forming a buffer layer 107 on the packaging structure layer 104 by an atomic layer deposition process or a chemical vapor deposition process, wherein the material of the buffer layer 107 is silicon nitride (SiNx), and the thickness of the buffer layer 107 is greater than or equal to 1000 angstroms and less than or equal to 4000 angstroms; Step (3), depositing a first conductive film on the buffer layer 107 by a sputtering process; then, forming the first conductive film into a first conductive layer by a patterning process, wherein the first conductive layer includes a first touch electrode 11 and a first magnetron electrode 21; Step (4), forming a touch insulating layer 201 on the first conductive layer by an atomic layer deposition process or a chemical vapor deposition process. The material of the touch insulating layer 201 can be silicon nitride (SiNx); Step (5), depositing a second conductive film on the touch insulating layer 201 by a sputtering process; then, forming the second conductive film into a second conductive layer by a patterning process, wherein the second conductive layer includes the second touch electrode 12 and the second magnetron electrode 22; Step (6), depositing a layer of optically transparent adhesive film on the second conductive layer, and forming the optically transparent adhesive film into a protective layer 202 through a patterning process, wherein the thickness of the protective layer 202 is greater than or equal to 1.5 microns and less than or equal to 3 microns; Step (7), forming a color filter structure layer 106 on the protective layer 202.

[0080] Figure 3 Another cross-sectional structure diagram of a display substrate is provided for the embodiment of the present disclosure. Figure 3 As shown, this embodiment shows the main structure of the substrate and Figure 2 The embodiments shown may be substantially the same, except that the buffer layer 107 of the substrate shown in this embodiment may be made of an organic material, such as an optically clear adhesive (OC).

[0081] Figure 4 Another cross-sectional structure diagram of a display substrate is provided for the embodiment of the present disclosure. Figure 4 As shown, this embodiment shows the main structure of the substrate and Figure 2 The embodiments shown may be substantially the same, except that the buffer layer 107 of the display substrate, the touch insulating layer 201 and the protective layer 202 of the touch structure layer 105 of this embodiment may all be made of organic materials, such as optically clear adhesive (OC).

[0082] The present disclosure also provides a method for preparing a display substrate, comprising: forming light-emitting structure layers on the substrate in sequence; forming a touch control structure layer on a side of the light emitting structure layer away from the substrate; The touch structure layer includes a first conductive layer and a second conductive layer stacked in sequence in a direction away from the substrate, the first conductive layer includes a first touch electrode and a first magnetoelectric electrode, the second conductive layer includes a second touch electrode and a second magnetoelectric electrode, the first conductive layer is made of aluminum or copper, and the second conductive layer is made of copper; The first touch control electrode and the first magnetron electrode are made of the same conductive material through the same preparation process; the second touch control electrode and the second magnetron electrode are made of the same conductive material through the same preparation process.

[0083] The embodiment of the present disclosure further provides a display device, including any of the above-mentioned display substrates. The display device can be any product or component with a display function, such as a mobile phone, a tablet computer, a television, a monitor, a notebook computer, a digital photo frame, a navigator, etc.

[0084] In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0085] In addition, the terms "first", "second", etc. are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first", "second", etc. may explicitly or implicitly include at least one of the features.

[0086] In the description of the present application, “plurality” means at least two, for example, two, three, etc., unless otherwise clearly and specifically defined.

[0087] In this application, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed", etc. should be understood in a broad sense. For example, "connected" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0088] In the present application, unless otherwise clearly specified and limited, a first feature being “above” or “below” a second feature may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, a first feature being “above”, “above”, and “above” a second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. A first feature being “below”, “below”, and “below” a second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0089] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example" or "some examples" etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art may combine and combine the different embodiments or examples described in this specification and the features of the different embodiments or examples, without contradiction.

[0090] Although the embodiments of the present application have been shown and described above, it can be understood that the above embodiments are exemplary and cannot be understood as limitations on the present application. Ordinary technicians in this field can change, modify, replace and modify the above embodiments within the scope of the present application.

Claims

1. A display substrate, characterized in that: include: A substrate, a light-emitting structure layer disposed on the substrate, and a touch-control structure layer disposed on a side of the light-emitting structure layer away from the substrate; The touch structure layer includes a first conductive layer and a second conductive layer stacked in sequence along a direction away from the substrate, the first conductive layer includes a first touch electrode and a first magnetron electrode, the second conductive layer includes a second touch electrode and a second magnetron electrode, the first conductive layer is made of aluminum or copper, and the second conductive layer is made of copper.

2. The display substrate according to claim 1, characterized in that: The thickness of the first conductive layer is greater than or equal to 6000 angstroms and less than or equal to 9000 angstroms.

3. The display substrate according to claim 1, characterized in that: The thickness of the second conductive layer is greater than or equal to 9000 angstroms and less than or equal to 15000 angstroms.

4. The display substrate according to claim 1, characterized in that: The material of the first conductive layer is aluminum or copper, and the thickness of the first conductive layer is greater than or equal to 6000 angstroms and less than or equal to 7000 angstroms; or, the material of the first conductive layer is copper, and the thickness of the first conductive layer is greater than 7000 angstroms and less than or equal to 9000 angstroms.

5. The display substrate according to claim 1, characterized in that: The orthographic projection of the second magnetron electrode on the substrate overlaps at least partially with the orthographic projection of the first touch electrode on the substrate, the first touch electrode is made of aluminum, and the second magnetron electrode is made of copper; or, the first touch electrode and the second magnetron electrode are both made of copper.

6. The display substrate according to claim 1, characterized in that: The orthographic projection of the second touch electrode on the substrate overlaps at least partially with the orthographic projection of the first magnetron electrode on the substrate, the material of the first magnetron electrode is aluminum, and the material of the second touch electrode is copper; or, the material of the second touch electrode and the material of the first magnetron electrode are both copper.

7. The display substrate according to any one of claims 1 to 6, characterized in that: The touch control structure layer further includes a touch control insulating layer, which is disposed between the first conductive layer and the second conductive layer. The thickness of the touch control insulating layer is greater than or equal to 3000 angstroms and less than or equal to 5000 angstroms.

8. The display substrate according to claim 7, characterized in that: The material of the touch insulating layer is inorganic material or organic material.

9. A method for preparing a display substrate, characterized in that: include: forming light-emitting structure layers on the substrate in sequence; forming a touch control structure layer on a side of the light emitting structure layer away from the substrate; The touch structure layer includes a first conductive layer and a second conductive layer stacked in sequence in a direction away from the substrate, the first conductive layer includes a first touch electrode and a first magnetron electrode, the second conductive layer includes a second touch electrode and a second magnetron electrode, the first conductive layer is made of aluminum or copper, and the second conductive layer is made of copper; The first touch control electrode and the first magnetron electrode are made of the same conductive material through the same preparation process; the second touch control electrode and the second magnetron electrode are made of the same conductive material through the same preparation process.

10. A display device, characterized in that: The display substrate comprises any one of claims 1 to 8.

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