Display substrate, preparation method thereof and display device

Abstract

A display substrate, a manufacturing method thereof and a display device, the display substrate comprising: a substrate, a light-emitting structure layer arranged on the substrate, and a touch structure layer arranged on a side of the light-emitting structure layer away from the substrate; the touch structure layer comprises a first conductive layer and a second conductive layer arranged in sequence along a direction away from the substrate, the first conductive layer comprises a first touch electrode and a first magnetic control electrode, the second conductive layer comprises a second touch electrode and a second magnetic control electrode, a material of the first conductive layer adopts aluminum or copper, and a material of the second conductive layer adopts copper, so as to reduce resistance.

Description

TECHNICAL FIELD

[0001] The present disclosure relates to, but is not limited to, the technical field of display, and particularly relates to a display substrate, a preparation method thereof and a display device. BACKGROUND

[0002] The market share of passive electromagnetic pens is gradually increasing. The pen solution of display devices (such as mobile phones and tablet computers) mostly adopts an Electro-Magnetic Resonance (EMR) passive pen + Flexible Printed Circuit (FPC) electromagnetic induction board solution. The pen solution of drawing display screens mostly adopts an Electro-Magnetic Resonance (EMR) passive pen + Printed Circuit Board (PCB) electromagnetic induction board solution.

[0003] With the upgrading of mobile phone product demand, such as the demand for folding mobile phones, Electro-Magnetic Resonance (EMR) passive pens can be integrated inside display devices. However, the magnetic control electrodes of Electro-Magnetic Resonance (EMR) passive pens cannot meet the load requirements of integrated circuit chips in display devices. SUMMARY

[0004] The display substrate and the preparation method thereof and the display device provided by the embodiments of the present application can reduce the resistance.

[0005] The display substrate provided by the embodiments of the present disclosure includes a substrate, a light-emitting structure layer arranged on the substrate, and a touch structure layer arranged on a side of the light-emitting structure layer away from the substrate. The touch structure layer includes a first conductive layer and a second conductive layer arranged in sequence along a direction away from the substrate. The first conductive layer includes a first touch electrode and a first magnetic control electrode, and the second conductive layer includes a second touch electrode and a second magnetic control electrode. The material of the first conductive layer is aluminum or copper, and the material of the second conductive layer is copper.

[0006] In an example embodiment, the thickness of the first conductive layer is greater than or equal to 6000 angstroms and less than or equal to 9000 angstroms.

[0007] In an example embodiment, the thickness of the second conductive layer is greater than or equal to 9000 angstroms and less than or equal to 15000 angstroms.

[0008] In an example embodiment, the material of the first conductive layer is aluminum or copper, the thickness of the first conductive layer is greater than or equal to 6000 angstroms and less than or equal to 7000 angstroms; or, the material of the first conductive layer is copper, the thickness of the first conductive layer is greater than 7000 angstroms and less than or equal to 9000 angstroms.

[0009] In an example embodiment, the orthographic projection of the second magnetic control electrode on the substrate at least partially overlaps with the orthographic projection of the first touch control electrode on the substrate, the material of the first touch control electrode is aluminum, and the material of the second magnetic control electrode is copper; or, the material of the first touch control electrode and the material of the second magnetic control electrode are both copper.

[0010] In an example embodiment, the orthographic projection of the second touch control electrode on the substrate at least partially overlaps with the orthographic projection of the first magnetic control electrode on the substrate, the material of the first magnetic control electrode is aluminum, and the material of the second touch control electrode is copper; or, the material of the second touch control electrode and the material of the first magnetic control electrode are both copper.

[0011] In an example embodiment, the touch control structure layer further comprises a touch control insulating layer, the touch control insulating layer is arranged between the first conductive layer and the second conductive layer, and the thickness of the touch control insulating layer is greater than or equal to 3000 angstroms and less than or equal to 5000 angstroms.

[0012] In an example embodiment, the material of the touch control insulating layer is inorganic material or organic material.

[0013] The disclosure embodiments further provide a preparation method of a display substrate, comprising:

[0014] forming a light emitting structure layer on a substrate;

[0015] forming a touch control structure layer on the side of the light emitting structure layer away from the substrate;

[0016] The touch control structure layer comprises a first conductive layer and a second conductive layer arranged in sequence along the direction away from the substrate, the first conductive layer comprises a first touch control electrode and a first magnetic control electrode, the second conductive layer comprises a second touch control electrode and a second magnetic control electrode, the material of the first conductive layer is aluminum or copper, and the material of the second conductive layer is copper.

[0017] The first touch control electrode and the first magnetic control electrode are prepared by the same preparation process using the same conductive material; and the second touch control electrode and the second magnetic control electrode are prepared by the same preparation process using the same conductive material.

[0018] The disclosure embodiments further provide a display device, characterized by comprising the display substrate described above.

[0019] The display substrate of the embodiment of the present disclosure adopts metal aluminum or metal copper for the first touch electrode and the first magnetic control electrode, the thickness of the first touch electrode and the first magnetic control electrode is greater than or equal to 6000 angstroms and less than or equal to 7000 angstroms, so as to avoid the first touch electrode and the first magnetic control electrode from being broken due to material stress, thereby ensuring the electrical connection of the first touch electrode and the first magnetic control electrode, and reducing the resistance of the first touch electrode and the first magnetic control electrode to meet the demand of integrated circuit chip load.

[0020] The display substrate of the embodiment of the present disclosure adopts metal copper for the first touch electrode and the first magnetic control electrode, the thickness of the first touch electrode and the first magnetic control electrode is greater than 7000 angstroms and less than or equal to 9000 angstroms, so as to avoid the first touch electrode and the first magnetic control electrode from being broken due to material stress, thereby ensuring the electrical connection of the first touch electrode and the first magnetic control electrode, and reducing the resistance of the first touch electrode and the first magnetic control electrode to meet the demand of integrated circuit chip load.

[0021] The display substrate of the embodiment of the present disclosure has a thickness of the first touch electrode and the first magnetic control electrode greater than or equal to 6000 angstroms and less than or equal to 9000 angstroms, so that the touch insulation layer can cover the first touch electrode and the first magnetic control electrode, and the insulation of the first touch electrode and the first magnetic control electrode is ensured.

[0022] The display substrate of the embodiment of the present disclosure adopts metal copper for the second touch electrode and the second magnetic control electrode, the thickness of the second touch electrode and the second magnetic control electrode is greater than or equal to 9000 angstroms and less than or equal to 15000 angstroms, so as to avoid the second touch electrode and the second magnetic control electrode from being broken due to material stress, thereby ensuring the electrical connection of the second touch electrode and the second magnetic control electrode, and reducing the resistance of the second touch electrode and the second magnetic control electrode to meet the demand of integrated circuit chip load.

[0023] The display substrate of the embodiment of the present disclosure has the second magnetic control electrode and the first touch electrode at least partially overlapping on the base in orthographic projection, the second magnetic control electrode adopts metal copper, the first touch electrode adopts metal aluminum, the stress direction of the metal copper is opposite to the stress direction of the metal aluminum, so that the stress of the upper second magnetic control electrode can offset the stress of the lower first touch electrode, and the first touch electrode is prevented from being broken.

[0024] The display substrate of the embodiment of the present disclosure adopts metal copper for the second magnetic control electrode, the resistance of copper is low, and the demand of integrated circuit chip load can be met.

[0025] The display substrate of the embodiment of the present disclosure is overlapped by the second touch electrode and the at least part of the first magnetic control electrode on the substrate, the second touch electrode adopts metal copper, the first magnetic control electrode adopts metal aluminum, the stress direction of the metal copper is opposite to the stress direction of the metal aluminum, so that the stress of the upper second touch electrode can offset the stress of the lower first magnetic control electrode, and the first magnetic control electrode is prevented from being broken.

[0026] The display substrate of the embodiment of the present disclosure adopts metal copper for the second touch electrode, and the low resistance of copper can meet the demand of the integrated circuit chip load.

[0027] Other features and advantages of the present application will be set forth in the following description, and in part will become apparent to those skilled in the art from the description, or can be learned by practice of the present application. Other advantages of the present application can be realized and obtained by means of the instrumentalities and combinations pointed out in the following description. BRIEF DESCRIPTION OF DRAWINGS

[0028] The accompanying drawings are included to provide a further understanding of the present application, and constitute a part of the specification, illustrate the present application, and are used to explain the technical scheme of the present application, and do not constitute a limitation on the technical scheme of the present application.

[0029] Figure 1 It is a cross-sectional structure schematic diagram of a related display substrate;

[0030] Figure 2 It is a cross-sectional structure schematic diagram of a display substrate provided by the embodiment of the present disclosure;

[0031] Figure 3 It is another cross-sectional structure schematic diagram of a display substrate provided by the embodiment of the present disclosure;

[0032] Figure 4 It is another cross-sectional structure schematic diagram of a display substrate provided by the embodiment of the present disclosure. DETAILED DESCRIPTION

[0033] The present application describes a plurality of embodiments, but the description is exemplary rather than limiting, and it is obvious to those skilled in the art that there can be more embodiments and implementation schemes within the scope of the embodiments described in the present application. Although many possible combinations of features are shown in the drawings and discussed in the detailed description, many other combinations of the disclosed features are also possible. Unless specifically limited, any feature or element of any embodiment can be used with any other feature or element of any other embodiment, or can replace any other feature or element of any other embodiment.

[0034] This application includes and contemplates combinations of features and elements known to those skilled in the art. The embodiments, features, and elements disclosed in this application can also be combined with any conventional features or elements to form unique inventive solutions. Any feature or element of any embodiment can also be combined with features or elements from other inventive solutions to form another unique inventive solution. Therefore, it should be understood that any feature shown and / or discussed in this application can be implemented individually or in any suitable combination. Therefore, the embodiments are not limited except by the limitations imposed by the appended claims and their equivalents. Furthermore, various modifications and changes can be made within the scope of the appended claims.

[0035] Furthermore, in describing representative embodiments, the specification may have presented methods and / or processes as a specific sequence of steps. However, the method or process should not be limited to the specific order of steps described herein, to the extent that it does not depend on such a specific order. As will be understood by those skilled in the art, other sequences of steps are also possible. Therefore, the specific order of steps set forth in the specification should not be construed as a limitation of the claims. Moreover, the claims concerning the method and / or process should not be limited to the steps performed in the written order, and those skilled in the art will readily understand that these orders can be varied and still remain within the spirit and scope of the embodiments of this application.

[0036] Figure 1 This is a schematic cross-sectional view of the relevant display substrate. Figure 1 As shown, the related display substrate includes a substrate 101', a driving circuit layer 102' disposed on 101', a light-emitting structure layer 103' disposed on the side of the driving circuit layer 102' away from the substrate 101', an encapsulation structure layer 104' disposed on the side of the light-emitting structure layer 103' away from the substrate 101', a buffer layer 107' disposed on the side of the encapsulation structure layer 104' away from the substrate 101', a touch structure layer 105' disposed on the side of the buffer layer 107' away from the substrate 101', and a color filter structure layer 106' disposed on the side of the touch structure layer 105' away from the substrate 101'. The touch structure layer 105' includes a first touch electrode 11' disposed on the side of the encapsulation structure layer 104' away from the substrate 101', a touch insulating layer disposed on the side of the first touch electrode 11' away from the substrate 101', and a second touch electrode 12' disposed on the side of the touch insulating layer away from the substrate 101'. The first touch electrode 11' and the second touch electrode 12' generally include a first sub-electrode, a second sub-electrode and a third sub-electrode arranged sequentially along the direction away from the substrate. The first sub-electrode and the third sub-electrode are both made of titanium with a thickness of 500 angstroms, and the second sub-electrode is made of aluminum with a thickness of 6500 angstroms.

[0037] The inventors of this application discovered that integrating an electromagnetic resonance (EMR) passive pen into the touch structure layer of a display substrate using an external method does not increase the thickness of the display substrate. However, integrating the EMR passive pen into the touch structure layer of the display substrate results in high resistance of the magnetic control electrodes, which cannot meet the load requirements of the integrated circuit chips in the display substrate.

[0038] This disclosure provides a display substrate, including: a substrate, a light-emitting structure layer disposed on the substrate, and a touch structure layer disposed on the side of the light-emitting structure layer away from the substrate; the touch structure layer includes a first conductive layer and a second conductive layer sequentially stacked along a direction away from the substrate, the first conductive layer including a first touch electrode and a first magnetron electrode, the second conductive layer including a second touch electrode and a second magnetron electrode, the first conductive layer being made of aluminum or copper, and the second conductive layer being made of copper.

[0039] In an exemplary embodiment, the material of the first conductive layer is aluminum or copper, and the thickness of the first conductive layer is greater than or equal to 6000 angstroms and less than or equal to 7000 angstroms; or, the material of the first conductive layer is copper, and the thickness of the first conductive layer is greater than 7000 angstroms and less than or equal to 9000 angstroms.

[0040] In an exemplary embodiment, the thickness of the second conductive layer is greater than or equal to 9000 angstroms and less than or equal to 15000 angstroms.

[0041] In an exemplary embodiment, the orthographic projection of the second magnetron electrode on the substrate overlaps at least partially with the orthographic projection of the first touch electrode on the substrate, wherein the first touch electrode is made of aluminum and the second magnetron electrode is made of copper.

[0042] In an exemplary embodiment, the orthographic projection of the second touch electrode on the substrate overlaps at least partially with the orthographic projection of the first magnetron electrode on the substrate, wherein the first magnetron electrode is made of aluminum and the second touch electrode is made of copper.

[0043] In this embodiment of the display substrate, the touch structure layer is stacked on the encapsulation structure layer to form a flexible multilayer on cell (FMLOC) structure. In a plane parallel to the display substrate, the display substrate includes an effective area (AA), a bonding area located on one side of the effective area, and edge areas located on other sides of the effective area. The effective area can be either a touch area or a display area; in the following description, both touch area and display area refer to the effective area.

[0044] In an exemplary embodiment, the effective area includes at least a first touch electrode, a second touch electrode, a first magnetic control electrode, and a second magnetic control electrode; the edge area includes at least a first touch lead, a second touch lead, a first magnetic control lead, and a second magnetic control lead; the bonding area includes at least an integrated circuit chip; one end of the first touch lead is connected to the first touch electrode, and the other end of the first touch lead is connected to the integrated circuit chip; one end of the second touch lead is connected to the second touch electrode, and the other end of the second touch lead is connected to the integrated circuit chip; one end of the first magnetic control lead is connected to the first magnetic control electrode, and the other end of the first magnetic control lead is connected to the integrated circuit chip; one end of the second magnetic control lead is connected to the second magnetic control electrode, and the other end of the second touch lead is connected to the integrated circuit chip.

[0045] In an exemplary embodiment, the first touch electrode and the second touch electrode are located on different film layers, forming a mutual capacitance touch structure. The first touch electrode and the second touch electrode are used to determine the touch position by utilizing the change in mutual capacitance when a touch occurs. The first touch electrode can be a driving (Tx) electrode, and the second touch electrode can be a sensing (Rx) electrode. Alternatively, the first touch electrode can be a sensing (Rx) electrode, and the second touch electrode can be a driving (Tx) electrode.

[0046] In an exemplary embodiment, the first magnetically controlled electrode and the second magnetically controlled electrode are located in different film layers. The first magnetically controlled electrode may be located in the same film layer as the first touch electrode, and the second magnetically controlled electrode may be located in the same film layer as the second touch electrode. The first and second magnetically controlled electrodes are used to determine the coordinates of the touch point when electromagnetic touch occurs.

[0047] Figure 2 This is a schematic cross-sectional view of a display substrate provided in an embodiment of the present disclosure. In an exemplary embodiment, such as... Figure 2As shown, in a plane perpendicular to the display substrate, the display substrate includes a substrate 101, a driving circuit layer 102 disposed on the substrate 101, a light-emitting structure layer 103 disposed on the side of the driving circuit layer 102 away from the substrate 101, an encapsulation structure layer 104 disposed on the side of the light-emitting structure layer 103 away from the substrate 101, a buffer layer 107 disposed on the side of the encapsulation structure layer 104 away from the substrate 101, a touch structure layer 105 disposed on the side of the buffer layer 107 away from the substrate 101, and a color filter structure layer 106 disposed on the side of the touch structure layer 105 away from the substrate 101.

[0048] In an exemplary embodiment, the substrate 101 may be a flexible substrate or a rigid substrate. The flexible substrate may include a first flexible material layer, a first inorganic material layer, a semiconductor layer, a second flexible material layer, and a second inorganic material layer stacked together. The materials of the first and second flexible material layers may be polyimide (PI), polyethylene terephthalate (PET), or a surface-treated polymer film, etc. The materials of the first and second inorganic material layers may be silicon nitride (SiNx) or silicon oxide (SiOx), etc., to improve the substrate's resistance to water and oxygen. The material of the semiconductor layer may be amorphous silicon (a-Si).

[0049] In an exemplary embodiment, the driving circuit layer 102 may include a plurality of transistors and a storage capacitor constituting a pixel driving circuit. In some possible implementations, the driving circuit layer 102 may include: a first insulating layer disposed on a substrate; an active layer disposed on the first insulating layer; a second insulating layer covering the active layer; a gate electrode and a first capacitor electrode disposed on the second insulating layer; a third insulating layer covering the gate electrode and the first capacitor electrode; a second capacitor electrode disposed on the third insulating layer; a fourth insulating layer covering the second capacitor electrode, wherein vias are formed in the second, third, and fourth insulating layers, exposing the active layer; a source electrode and a drain electrode disposed on the fourth insulating layer, the source electrode and drain electrode being connected to the active layer respectively through vias; and a planarization layer covering the aforementioned structure, wherein vias are formed in the planarization layer, exposing the drain electrode. The active layer, gate electrode, source electrode, and drain electrode constitute driving transistors, and the first capacitor electrode and the second capacitor electrode constitute a storage capacitor.

[0050] In an exemplary embodiment, the light-emitting structure layer 103 includes a plurality of light-emitting devices. Each light-emitting device may include a first electrode, a pixel definition layer, an organic light-emitting layer, and a second electrode, sequentially stacked along a direction away from the substrate. The first electrode is disposed on a planarization layer and connected to the drain electrode of a driving transistor through a via formed in the planarization layer. The pixel definition layer is disposed on the first electrode and the planarization layer, and has a pixel opening that exposes the first electrode. The organic light-emitting layer is at least partially disposed within the pixel opening and is connected to the first electrode. The second electrode is disposed on the organic light-emitting layer and is connected to the organic light-emitting layer. The organic light-emitting layer emits light of a corresponding color under the drive of the first and second electrodes. The first electrode may be an anode, and the second electrode may be a cathode.

[0051] In an exemplary embodiment, the light-emitting device can be an Organic Light Emitting Diode (OLED) device. The organic light-emitting layer of the OLED device can include an emitting layer (EML) and one or more films selected from the following: a hole injection layer (HIL), a hole transport layer (HTL), a hole block layer (HBL), an electron block layer (EBL), an electron injection layer (EIL), and an electron transport layer (ETL). Under the voltage drive of the first and second electrodes, the light-emitting characteristics of the organic material are utilized to emit light at the required grayscale.

[0052] In an exemplary embodiment, the encapsulation structure layer 104 may include a first encapsulation layer, a second encapsulation layer, and a third encapsulation layer stacked together. The first and third encapsulation layers may be made of inorganic materials, while the second encapsulation layer may be made of organic materials. The second encapsulation layer is disposed between the first and third encapsulation layers to ensure that external moisture cannot enter the light-emitting device.

[0053] In an exemplary embodiment, the buffer layer 107 may be any one or more of silicon oxide (SiOx), silicon nitride (SiNx), and silicon oxynitride (SiON), and may be a single layer, multiple layers, or a composite layer.

[0054] In an exemplary embodiment, the touch structure layer 105 may include a first conductive layer disposed on the side of the buffer layer 107 away from the substrate 101, a touch insulating layer 201 disposed on the side of the first conductive layer away from the substrate 101, a second conductive layer disposed on the side of the touch insulating layer 201 away from the substrate 101, and a protective layer 202 disposed on the side of the second conductive layer away from the substrate 101.

[0055] In an exemplary embodiment, the first conductive layer includes a first touch electrode 11 and a first magnetostatic electrode 21. The first touch electrode 11 and the first magnetostatic electrode 21 are located in the same film layer and are prepared by the same conductive material and the same preparation process, thereby simplifying the process and reducing production costs.

[0056] In some embodiments, the first touch electrode and the first magnetoelectric electrode are located in the same film layer. The first touch electrode and the first magnetoelectric electrode can be prepared by the same or different conductive materials through different preparation processes, which will not be elaborated here.

[0057] In an exemplary embodiment, the thickness of the first touch electrode 11 is approximately equal to the thickness of the first magnetoelectric electrode 21.

[0058] In an exemplary embodiment, the thickness of the first touch electrode 11 is h1, and the thickness of the first touch electrode 11 ranges from 6000 Å to h1 to 9000 Å. The thickness of the first touch electrode 11 is the average dimension of the first touch electrode 11 in the direction perpendicular to the substrate.

[0059] The embodiments disclosed herein show that the substrate has a thickness of 6000 angstroms or less than or equal to 9000 angstroms, so that the touch insulating layer 201 can cover the first touch electrode 11 and the first magnetoelectric electrode 21, thereby ensuring the insulation of the first touch electrode 11 and the first magnetoelectric electrode 21.

[0060] In an exemplary embodiment, the material of the first touch electrode 11 can be aluminum or copper, and the thickness of the first touch electrode 11 is in the range of 6000A≤h1≤7000A.

[0061] The embodiments disclosed herein show that the substrate uses aluminum or copper as the first touch electrode 11. The thickness of the first touch electrode 11 is greater than or equal to 6000 angstroms and less than or equal to 7000 angstroms, which avoids the first touch electrode 11 from breaking due to material stress, thereby ensuring the electrical connection of the first touch electrode 11; and reduces the resistance of the first touch electrode 11 to meet the load requirements of the integrated circuit chip.

[0062] In an exemplary embodiment, the material of the first touch electrode 11 can be metallic copper, and the thickness of the first touch electrode 11 is in the range of: 7000A < h1 ≤ 9000A.

[0063] The embodiments disclosed herein show that the substrate uses copper for the first touch electrode 11, and the thickness of the first touch electrode 11 is greater than 7000 angstroms and less than or equal to 9000 angstroms, to prevent the first touch electrode 11 from breaking due to material stress, thereby ensuring the electrical connection of the first touch electrode 11; and reducing the resistance of the first touch electrode 11 to meet the load requirements of the integrated circuit chip.

[0064] In an exemplary embodiment, the thickness of the first magnetron electrode 21 is h2, and the thickness of the first magnetron electrode 21 ranges from 6000 Å to h2 to 9000 Å. The thickness of the first magnetron electrode 21 is the average dimension of the first magnetron electrode 21 in the direction perpendicular to the substrate.

[0065] In an exemplary embodiment, the material of the first magnetron electrode 21 can be aluminum or copper, and the thickness of the first magnetron electrode 21 is in the range of 6000A≤h2≤7000A.

[0066] The embodiments disclosed herein show that the substrate uses aluminum or copper as the first magnetron electrode 21. The thickness of the first magnetron electrode 21 is greater than or equal to 6000 angstroms and less than or equal to 7000 angstroms, which avoids the first magnetron electrode 21 from breaking due to material stress, thereby ensuring the electrical connection of the first magnetron electrode 21; and reduces the resistance of the first magnetron electrode 21 to meet the load requirements of the integrated circuit chip.

[0067] In an exemplary embodiment, the material of the first magnetron electrode 21 can be metallic copper, and the thickness of the first magnetron electrode 21 is in the range of: 7000A < h2 ≤ 9000A.

[0068] The embodiments disclosed herein show that the substrate uses copper as the first magnetron electrode 21. The thickness of the first magnetron electrode 21 is greater than 7000 angstroms and less than or equal to 9000 angstroms, which avoids the first magnetron electrode 21 from breaking due to material stress, thereby ensuring the electrical connection of the first magnetron electrode 21; and reduces the resistance of the first magnetron electrode 21 to meet the load requirements of the integrated circuit chip.

[0069] In an exemplary embodiment, the touch insulating layer 201 can be any one or more of silicon oxide (SiOx), silicon nitride (SiNx), and silicon oxynitride (SiON), and can be a single layer, multiple layers, or a composite layer. The thickness of the touch insulating layer 201 is h3, and the thickness range of the touch insulating layer 201 is: 3000 Å ≤ h3 ≤ 5000 Å. The thickness of the touch insulating layer 201 is the average dimension of the touch insulating layer 201 in the direction perpendicular to the substrate.

[0070] In an exemplary embodiment, the second conductive layer includes a second touch electrode 12 and a second magnetostatic electrode 22. The second touch electrode 12 and the second magnetostatic electrode 22 are located in the same film layer and are prepared by the same conductive material and the same preparation process, thereby simplifying the process and reducing production costs.

[0071] In some embodiments, the second touch electrode and the second magnetoelectric electrode are located in the same film layer. The second touch electrode and the second magnetoelectric electrode can be prepared using the same or different conductive materials through different preparation processes, which will not be elaborated further in this disclosure.

[0072] In an exemplary embodiment, the thickness of the second touch electrode 12 is approximately equal to the thickness of the second magnetoelectric electrode 22.

[0073] In an exemplary embodiment, the material of the second touch electrode 12 can be metallic copper, and the thickness of the second touch electrode 12 is h4. The thickness range of the second touch electrode 12 is: 9000 Å ≤ h4 ≤ 15000 Å. The thickness of the second touch electrode 12 is the average dimension of the second touch electrode 12 in the direction perpendicular to the substrate.

[0074] The embodiments disclosed herein show that the substrate uses copper for the second touch electrode 12, and the thickness of the second touch electrode 12 is greater than or equal to 9000 angstroms and less than or equal to 15000 angstroms. This avoids the second touch electrode 12 from breaking due to material stress, thereby ensuring the electrical connection of the second touch electrode 12; and reduces the resistance of the second touch electrode 12 to meet the load requirements of the integrated circuit chip.

[0075] In an exemplary embodiment, the material of the second magnetron electrode 22 can be metallic copper, and the thickness of the second magnetron electrode 22 is h5. The thickness range of the second magnetron electrode 22 is: 9000 Å ≤ h5 ≤ 15000 Å. The thickness of the second magnetron electrode 22 is the average dimension of the second magnetron electrode 22 in the direction perpendicular to the substrate.

[0076] The embodiments disclosed herein show that the substrate uses copper as the second magnetron electrode 22. The thickness of the second magnetron electrode 22 is greater than or equal to 9000 angstroms and less than or equal to 15000 angstroms, which avoids the second magnetron electrode 22 from breaking due to material stress, thereby ensuring the electrical connection of the second magnetron electrode 22; and reduces the resistance of the second magnetron electrode 22, which can meet the load requirements of the integrated circuit chip.

[0077] In an exemplary embodiment, at least a portion of the orthographic projection of the second magnetron electrode 22 onto the substrate 101 overlaps with the orthographic projection of the first touch electrode 11 onto the substrate 101. The first touch electrode 11 is made of aluminum, and its thickness ranges from 6000 Å to h1 to 7000 Å; or, the first touch electrode 11 is made of copper, and its thickness ranges from 7000 Å to h1 to 9000 Å. The second magnetron electrode 22 is made of copper, and its thickness ranges from 9000 Å to h5 to 15000 Å. The thickness of the second magnetron electrode 22 and the thickness of the first touch electrode 11 satisfy the relationship: h1 < h5.

[0078] This embodiment of the disclosure shows that the substrate overlaps with at least a portion of the first touch electrode 11 on the substrate 101 via the orthographic projection of the second magnetron electrode 22 and the first touch electrode 11. The second magnetron electrode 22 is made of copper, and the first touch electrode 11 is made of aluminum. Aluminum is more prone to fracture than copper. The crystal orientations of aluminum and copper are opposite, causing the stress direction of copper to be opposite to that of aluminum. When the thickness of the lower first touch electrode 11 is greater than or equal to 6000 angstroms and less than or equal to 7000 angstroms, the upper second magnetron electrode 22 can counteract the stress generated by the lower first touch electrode 11, preventing the first touch electrode 11 from fracture. When the thickness of the first touch electrode 11 is less than 6000 angstroms, the first touch electrode 11 is too thin and has high resistance; when the thickness of the first touch electrode 11 is greater than 7000 angstroms, the first touch electrode 11 is too thick, and the upper second magnetron electrode 22 cannot effectively counteract the stress generated by the lower first touch electrode 11, causing the lower first touch electrode 11 to be prone to fracture.

[0079] This embodiment of the disclosure shows that the substrate overlaps with at least a portion of the first touch electrode 11 on the substrate 101 through the orthographic projection of the second magnetron electrode 22 and the first touch electrode 11. When the thickness of the lower first touch electrode 11 is large (e.g., greater than 7000 angstroms) and the lower first touch electrode 11 is made of aluminum, the upper second magnetron electrode 22 cannot effectively counteract the stress generated by the lower first touch electrode 11, causing the lower first touch electrode 11 to be prone to breakage. Therefore, when the thickness of the lower first touch electrode 11 is greater than 7000 angstroms and less than or equal to 9000 angstroms, the lower first touch electrode 11 is made of copper. Copper has low resistance, which can reduce the resistance of the first touch electrode 11 and make the first touch electrode 11 less prone to breakage.

[0080] In an exemplary embodiment, at least a portion of the orthographic projection of the second touch electrode 12 onto the substrate 101 overlaps with the orthographic projection of the first magnetron electrode 21 onto the substrate 101. The first magnetron electrode 21 is made of aluminum, and its thickness ranges from 6000 Å to h2 to 7000 Å; or, the first magnetron electrode 21 is made of copper, and its thickness ranges from 7000 Å to h1 to 9000 Å. The second touch electrode 12 is made of copper, and its thickness ranges from 9000 Å to h4 to 15000 Å. The thicknesses of the second touch electrode 12 and the first magnetron electrode 21 satisfy the relationship: h2 < h4.

[0081] This embodiment of the disclosure shows that the substrate overlaps with at least a portion of the orthographic projection of the second touch electrode 12 and the first magnetron electrode 21 onto the substrate 101. The second touch electrode 12 is made of copper, and the first magnetron electrode 21 is made of aluminum. Aluminum is more prone to fracture than copper. The crystal orientations of aluminum and copper are opposite, causing the stress direction of copper to be opposite to that of aluminum. When the thickness of the lower first magnetron electrode 21 is greater than or equal to 6000 angstroms and less than or equal to 7000 angstroms, the upper second touch electrode 12 can counteract the stress generated by the lower first magnetron electrode 21, preventing the first magnetron electrode 21 from fracture. When the thickness of the first magnetron electrode 21 is less than 6000 angstroms, the first magnetron electrode 21 is too thin, resulting in high resistance; when the thickness of the first magnetron electrode 21 is greater than 7000 angstroms, the first magnetron electrode 21 is too thick, and the upper second touch electrode 12 cannot effectively counteract the stress generated by the lower first magnetron electrode 21, making the lower first magnetron electrode 21 prone to fracture.

[0082] This embodiment of the disclosure shows that the substrate overlaps on the substrate 101 through the orthographic projection of at least a portion of the second touch electrode 12 and the first magnetron electrode 21. When the thickness of the lower first magnetron electrode 21 is large (greater than 7000 angstroms) and the lower first magnetron electrode 21 is made of aluminum, the upper second touch electrode 12 cannot effectively counteract the stress generated by the lower first magnetron electrode 21, causing the lower first magnetron electrode 21 to be prone to breakage. Therefore, when the thickness of the lower first magnetron electrode 21 is greater than 7000 angstroms and less than or equal to 9000 angstroms, the lower first magnetron electrode 21 is made of copper. Copper has low resistance, which can reduce the resistance of the first magnetron electrode 21 and make the first magnetron electrode 21 less prone to breakage.

[0083] The deformation values ​​of copper and aluminum thin films under stress were measured using the feeler gauge method. Specific steps included:

[0084] Stress was applied to a copper film with a thickness of 9000A and an aluminum film with a thickness of 6000A, respectively. The deformation value of the copper film was 1.2 mm and the deformation value of the aluminum film was -1 mm.

[0085] Formula 1: (6000 / (6000+9000))*(-1) + (9000 / (6000+9000))*(1.2) = 0.2mm. According to Formula 1, the deformation value after the copper and aluminum films are stacked is 0.2mm. Therefore, it can be seen that the stacking of copper and aluminum can cancel each other out and reduce deformation.

[0086] In an exemplary embodiment, the protective layer 202 may be made of an organic material, such as optically clear adhesive (OC). The thickness of the protective layer 202 is greater than or equal to 1.5 micrometers and less than or equal to 3 micrometers.

[0087] In an exemplary embodiment, the color filter structure layer 106 includes a filter and a black matrix. The filter is disposed corresponding to the light-emitting device and is configured to transmit light of a specific color. The black matrix is ​​located at least between adjacent filters and is configured to block light to prevent light from interfering with each other from adjacent sub-pixels.

[0088] The fabrication process of the display substrate in this embodiment includes:

[0089] Step (1): A driving circuit layer 102, a light-emitting structure layer 103, and an encapsulation structure layer 104 are sequentially formed on the substrate;

[0090] Step (2): A buffer layer 107 is formed on the packaging structure layer 104 by atomic layer deposition or chemical vapor deposition. The material of the buffer layer 107 is silicon nitride (SiNx), and the thickness of the buffer layer 107 is greater than or equal to 1000 angstroms and less than or equal to 4000 angstroms.

[0091] Step (3): A first conductive film is deposited on the buffer layer 107 by sputtering process; then, the first conductive film is used to form a first conductive layer by patterning process. The first conductive layer includes a first touch electrode 11 and a first magnetron electrode 21.

[0092] Step (4): A touch insulating layer 201 is formed on the first conductive layer by atomic layer deposition or chemical vapor deposition. The material of the touch insulating layer 201 can be silicon nitride (SiNx).

[0093] Step (5): A second conductive film is deposited on the touch insulating layer 201 by sputtering process; then, the second conductive film is used to form a second conductive layer by patterning process. The second conductive layer includes a second touch electrode 12 and a second magnetron electrode 22.

[0094] Step (6): Deposit an optically transparent adhesive film on the second conductive layer. Through a patterning process, the optically transparent adhesive film forms a protective layer 202. The thickness of the protective layer 202 is greater than or equal to 1.5 micrometers and less than or equal to 3 micrometers.

[0095] Step (7): A color filter structure layer 106 is formed on the protective layer 202.

[0096] Figure 3 This provides another cross-sectional structural diagram of a display substrate for embodiments of this disclosure. For example... Figure 3 As shown, the main structure of the display substrate in this embodiment is similar to... Figure 2 The embodiments shown can be substantially the same, except that the buffer layer 107 of the display substrate in this embodiment can be made of organic materials, such as optically clear adhesive (OC).

[0097] Figure 4 This provides another cross-sectional structural diagram of a display substrate for embodiments of this disclosure. For example... Figure 4 As shown, the main structure of the display substrate in this embodiment is similar to... Figure 2 The embodiments shown can be substantially the same, except that in this embodiment, the buffer layer 107 of the display substrate, the touch insulating layer 201 of the touch structure layer 105, and the protective layer 202 can all be made of organic materials, such as optically clear adhesive (OC).

[0098] This disclosure also provides a method for preparing a display substrate, comprising:

[0099] A light-emitting structure layer is sequentially formed on the substrate;

[0100] A touch structure layer is formed on the side of the light-emitting structure layer away from the substrate;

[0101] The touch structure layer includes a first conductive layer and a second conductive layer stacked sequentially along the direction away from the substrate. The first conductive layer includes a first touch electrode and a first magnetostatic electrode, and the second conductive layer includes a second touch electrode and a second magnetostatic electrode. The material of the first conductive layer is aluminum or copper, and the material of the second conductive layer is copper.

[0102] The first touch electrode and the first magnetron electrode are made of the same conductive material and prepared using the same manufacturing process; the second touch electrode and the second magnetron electrode are made of the same conductive material and prepared using the same manufacturing process.

[0103] This disclosure also provides a display device, including any of the display substrates described above. The display device can be any product or component with display function, such as a mobile phone, tablet computer, television, monitor, laptop computer, digital photo frame, or navigator.

[0104] In the description of this application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicating the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0105] Furthermore, the terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined with "first," "second," etc., may explicitly or implicitly include at least one of those features.

[0106] In the description of this application, "multiple" means at least two, such as two, three, etc., unless otherwise expressly and specifically limited.

[0107] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "joining," "fixing," etc., should be interpreted broadly. For example, "connection" can be a fixed connection, a detachable connection, or an integral part; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium; it can be the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0108] In this application, unless otherwise expressly specified and limited, "above" or "below" the second feature can mean that the first and second features are in direct contact, or that the first and second features are in indirect contact through an intermediate medium. Furthermore, "above," "over," and "on top" of the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0109] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of different embodiments or examples.

[0110] Although embodiments of this application have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting this application. Those skilled in the art can make changes, modifications, substitutions and variations to the above embodiments within the scope of this application.

Claims

1. A display substrate, characterized in that, include: A substrate, a light-emitting structure layer disposed on the substrate, and a touch structure layer disposed on the side of the light-emitting structure layer away from the substrate; The touch structure layer includes a first conductive layer and a second conductive layer sequentially stacked along a direction away from the substrate. The first conductive layer includes a first touch electrode and a first magnetron electrode, and the second conductive layer includes a second touch electrode and a second magnetron electrode. The material of the first conductive layer is aluminum or copper, and the material of the second conductive layer is copper. The thickness of the second conductive layer is greater than or equal to 9000 angstroms and less than or equal to 15000 angstroms. Alternatively, the material of the first conductive layer is aluminum, and the thickness of the first conductive layer is greater than or equal to 6000 angstroms and less than or equal to 7000 angstroms; or, the material of the first conductive layer is copper, and the thickness of the first conductive layer is greater than 7000 angstroms and less than or equal to 9000 angstroms. At least a portion of the orthographic projection of the second magnetron electrode on the substrate overlaps with the orthographic projection of the first touch electrode on the substrate.

2. The display substrate according to claim 1, characterized in that, The first touch electrode is made of aluminum, and the second magnetron electrode is made of copper; or, both the first touch electrode and the second magnetron electrode are made of copper.

3. The display substrate according to claim 1, characterized in that, The first magnetron electrode is made of aluminum, and the second touch electrode is made of copper; or, both the second touch electrode and the first magnetron electrode are made of copper.

4. The display substrate according to any one of claims 1 to 3, characterized in that, The touch structure layer further includes a touch insulating layer, which is disposed between the first conductive layer and the second conductive layer. The thickness of the touch insulating layer is greater than or equal to 3000 angstroms and less than or equal to 5000 angstroms.

5. The display substrate according to claim 4, characterized in that, The material of the touch insulation layer is an inorganic material or an organic material.

6. A method for preparing a display substrate, characterized in that, include: Light-emitting structural layers are sequentially formed on the substrate; A touch structure layer is formed on the side of the light-emitting structure layer away from the substrate; The touch structure layer includes a first conductive layer and a second conductive layer sequentially stacked along a direction away from the substrate. The first conductive layer includes a first touch electrode and a first magnetron electrode, and the second conductive layer includes a second touch electrode and a second magnetron electrode. The material of the first conductive layer is aluminum or copper, and the material of the second conductive layer is copper. The thickness of the second conductive layer is greater than or equal to 9000 angstroms and less than or equal to 15000 angstroms. Alternatively, the material of the first conductive layer is aluminum, and the thickness of the first conductive layer is greater than or equal to 6000 angstroms and less than or equal to 7000 angstroms; or, the material of the first conductive layer is copper, and the thickness of the first conductive layer is greater than 7000 angstroms and less than or equal to 9000 angstroms. At least a portion of the orthographic projection of the second magnetron electrode on the substrate overlaps with the orthographic projection of the first touch electrode on the substrate. The first touch electrode and the first magnetron electrode are made of the same conductive material and prepared using the same manufacturing process; the second touch electrode and the second magnetron electrode are made of the same conductive material and prepared using the same manufacturing process.

7. A display device, characterized in that, Includes the display substrate as described in any one of claims 1 to 5.

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