A solar net panel partitioning method, terminal, medium and product

Abstract

The application discloses a solar screen partition method, a terminal, a medium and a product, and obtains layer identification and screen size information by identifying a solar screen layout. The number of partitions is calculated based on the range of a laser processing device and the size of the screen, and the layout is divided into corresponding partitions by using horizontal and vertical partition lines. It is determined whether the horizontal and vertical distances of each pattern and the nearest partition line meet the control requirements. If the horizontal or vertical distance is not up to standard, the corresponding size in the partition size is adjusted by a preset first step length within the device processing range, and the number of partitions is recalculated after updating. If the horizontal and vertical distances of all patterns meet the standard, the screen layout is output according to the current partition. In this way, the probability of poor connection of automatic partition processing is effectively reduced.

Description

Technical Field

[0001] This invention relates to the field of laser technology for solar screen printing, and in particular to a method for partitioning solar screens, a terminal, a medium, and a product. Background Technology

[0002] Solar panels are widely used in the semiconductor field due to their advantages such as being clean and pollution-free, renewable, and having stable performance. To connect solar panels to electrical devices, grid electrodes need to be installed on the surface of the solar panel to facilitate current conduction.

[0003] In current production processes, stencils are typically used to print grid lines, while the grid patterns on the stencils are created using laser engraving. When using laser engraving to produce high-precision stencils, the equipment operates in a segmented processing manner. To improve the poor connection between processing segments, it is necessary to simulate and calculate the segment range that does not contact the high-precision graphic, and the connection between segments must meet the graphic control accuracy requirements. Currently, the segmentation is mainly calculated manually.

[0004] However, manual simulation calculation has significant drawbacks. It struggles to accurately determine the partitioning range for areas that don't require high-precision graphics and to meet the accuracy requirements at partition junctions. This necessitates constant trial and error and repeated checks, a time-consuming process that leads to low production efficiency and an inability to meet the growing demand for high-precision printing screens. Manual partitioning is inefficient, inaccurate, and susceptible to subjective interference, making it difficult to achieve the required precision. This can result in deviations in the grid pattern, affecting solar panel performance. Furthermore, the instability of manual operation and the difficulty in accurately planning partitions greatly increase the probability of poor junction connections at automatic partitioning processes. Summary of the Invention

[0005] This application provides a method, terminal, medium, and product for partitioning solar panels, which reduces the probability of poor connection at the partitioning processing point in automatic partitioning.

[0006] Firstly, this application provides a method for partitioning a solar grid panel. The method includes: identifying a solar grid panel layout imported by a user, obtaining layer identifiers and grid panel size information; wherein each layer identifier corresponds to a layer containing graphics with corresponding precision requirements; graphics with different precision requirements are pre-defined to have different horizontal and vertical control distances; calculating partition dimensions based on a pre-defined processing range of a laser processing device; calculating the number of partitions based on the grid panel size information and the partition dimensions; generating multiple mutually perpendicular horizontal and vertical dividing lines to divide the grid panel layout into the number of partitions, with each partition corresponding to a grid panel size of that partition; for each graphic in the grid panel layout, determining the nearest horizontal dividing line and... The system checks whether the horizontal distance of the graphic is greater than the horizontal control distance of the graphic, and whether the vertical distance between the nearest vertical dividing line and the graphic is greater than the vertical control distance of the graphic. If the horizontal or vertical distance is not greater than the horizontal or vertical control distance of the graphic, the horizontal or vertical dimension in the partition size is adjusted according to the preset first step length within the processing range of the laser processing equipment to obtain the updated partition size. The system then jumps to the step of calculating the number of partitions based on the screen size information and the partition size. If the horizontal distance of all graphics in the screen layout is greater than the horizontal control distance of the graphic and the vertical distance is greater than the vertical control distance of the graphic, the screen layout is output according to the currently divided partitions.

[0007] By adopting the above technical solution, upon completion of the stencil layout import, its basic information is effectively detected and identified, and then partitioned into zones that meet the control requirements based on this basic information. The method provided in this embodiment involves the program identifying the stencil layout information after the user imports it into the terminal. If the partitions defined based on the stencil layout and the processing range of the processing equipment do not meet the control requirements, the partition size is incremented. If the incremented partition size exceeds the processing range of the laser processing equipment, the partition size is decremented. If the decremented partition size exceeds the minimum processing range of the laser processing equipment, the control distance is decremented, and the partitions are recalculated. This method effectively solves the problems of existing technologies where manual simulation calculations of partitions require constant attempts and visual inspection, resulting in a cumbersome process prone to omissions, and the low production efficiency caused by the difficulty in meeting requirements with existing manual simulation calculation methods, which necessitate constant attempts and checks. It successfully simplifies the operation process and significantly improves production efficiency, enabling users to easily and quickly calculate the stencil partitioning scheme that meets control requirements, and reducing the probability of poor connection at the partitioning processing point of automatic partitioning.

[0008] In conjunction with some embodiments of the first aspect, in some embodiments, the partition size is calculated based on the preset processing range of the laser processing equipment. Specifically, this includes: calculating the median value of the horizontal processing range and the median value of the vertical processing range based on the maximum and minimum values ​​of the preset horizontal and vertical processing ranges of the laser processing equipment, and using these as the horizontal and vertical dimensions of the partition size.

[0009] In the above embodiments, by using the maximum and minimum values ​​of the horizontal and vertical processing ranges to determine the intermediate value as the partition size, it is possible to fully adapt to the capability characteristics of the laser processing equipment, ensure that the partitions are within the size range that the equipment can process, and effectively avoid processing failures due to partition sizes that are too large and exceed the processing capacity of the equipment, or production efficiency reduction due to partition sizes that are too small and cannot fully utilize the processing area of ​​the equipment.

[0010] In conjunction with some embodiments of the first aspect, in some embodiments, when the lateral or longitudinal distance is not greater than the lateral or longitudinal control distance of the graphic, the lateral or longitudinal dimension in the partition size is adjusted according to a preset first step length within the processing range of the laser processing equipment to obtain the updated partition size, and then the step of calculating the number of partitions based on the screen size information and the partition size is executed. Specifically, this includes: when the lateral distance is not greater than the lateral control distance of the graphic but the longitudinal distance is greater than the longitudinal control distance of the graphic, storing the longitudinal control distance and the corresponding longitudinal dividing line information; adjusting the lateral dimension in the partition size according to a preset first step length within the processing range of the laser processing equipment to obtain the updated partition size, and then the step of calculating the number of partitions based on the screen size information and the partition size is executed. The steps for obtaining the number of partitions are as follows: If the vertical distance is not greater than the vertical control distance of the graphic but the horizontal distance is greater than the horizontal control distance of the graphic, store the horizontal control distance and the corresponding horizontal dividing line information; within the processing range of the laser processing equipment, adjust the vertical dimension of the partition size according to the preset first step length to obtain the updated partition size, and then proceed to the step of calculating the number of partitions based on the screen size information and the partition size; if the horizontal distance is not greater than the horizontal control distance of the graphic and the vertical distance is not greater than the vertical control distance of the graphic, simultaneously adjust the horizontal and vertical dimensions of the partition size within the processing range of the laser processing equipment according to the preset first step length to obtain the updated partition size, and then proceed to the step of calculating the number of partitions based on the screen size information and the partition size.

[0011] In the above embodiments, when the horizontal or vertical distance does not meet the control distance requirements, the partition size can be precisely adjusted for different situations. This refined adjustment strategy effectively improves the flexibility and adaptability of partitioning. For example, when the horizontal distance is not met but the vertical distance is, by storing the vertical information and adjusting the horizontal size, the horizontal partitioning can be optimized while ensuring the relative stability of the vertical layout, and vice versa. This makes the partitioning more in line with the actual distribution and control requirements of the graphic, minimizing the adverse effects on the integrity of the graphic and the convenience of processing. For complex situations where neither the horizontal nor vertical distance is met, the method of adjusting the size simultaneously can quickly explore a suitable partitioning scheme, avoiding getting stuck in a local optimum due to adjustment of a single dimension, and improving the overall partitioning optimization efficiency. After each adjustment, the process jumps back to the partition count calculation step, forming a closed-loop optimization iteration process that can continuously approach and finally determine the optimal partitioning scheme that meets all control requirements, ensuring the accuracy and reliability of solar grid partitioning.

[0012] In conjunction with some embodiments of the first aspect, in some embodiments, when the lateral or longitudinal distance is not greater than the lateral or longitudinal control distance of the graphic, the lateral or longitudinal dimension in the partition size is adjusted according to a preset first step length within the processing range of the laser processing equipment to obtain the updated partition size. After jumping to the step of calculating the number of partitions based on the screen size information and the partition size, the method further includes: after traversing and adjusting within the processing range of the laser processing equipment, if the lateral or longitudinal distance is not greater than the lateral or longitudinal control distance of the graphic, the lateral and longitudinal control distances corresponding to the graphic preset for each accuracy requirement are reduced according to a preset second step length, the partition size is reset, and the step of calculating the number of partitions based on the screen size information and the partition size is executed.

[0013] In the above embodiments, when the partition size is adjusted by traversing the processing range of the laser processing equipment according to the preset first step length, and there are still cases where the horizontal or vertical distance does not meet the control distance, the horizontal and vertical control distances corresponding to the graphic presets for each accuracy requirement are reduced accordingly by the preset second step length, and the partition size is reset and the number of partitions is recalculated. This can further expand the exploration space of partitioning schemes. It helps to find feasible solutions within a wider range of parameters, avoids the predicament of not being able to obtain a suitable partitioning scheme due to the initial control distance setting being too strict, and improves the robustness of the partitioning algorithm.

[0014] In conjunction with some embodiments of the first aspect, in some embodiments, after the traversal and adjustment within the processing range of the laser processing equipment is completed, if the lateral or longitudinal distance is not greater than the lateral or longitudinal control distance of the graphic, the lateral and longitudinal control distances corresponding to the preset precision requirements of the graphic are reduced according to the preset second step length, the partition size is reset, and the step of calculating the number of partitions based on the screen size information and the partition size is executed is performed. The method further includes: recording in detail all parameter changes during each iteration of partition size adjustment, control distance change, and recalculation of the number of partitions; after the partitioning process is completed, analyzing the key factors that cause repeated adjustments to the partitioning results to obtain analysis results; and generating optimization suggestions and strategy reports for partitioning improvement based on the analysis results.

[0015] In the above embodiments, detailed recording of parameter changes during each iteration of partition size adjustment, control distance change, and recalculation of partition count provides a comprehensive and accurate data foundation for subsequent analysis. After the partitioning process is completed, by analyzing the key factors causing repeated adjustments to the partitioning results, we can gain a deeper understanding of the root causes of problems in the partitioning process. For example, is the control distance setting for a specific graphic precision unreasonable, or are there special difficulties in the compatibility between the stencil size and the equipment's processing range? Based on these analysis results, optimization suggestions and strategy reports for partitioning improvement are generated, which helps technical personnel to optimize and improve partitioning methods, parameter settings, and even equipment selection in a targeted manner.

[0016] In conjunction with some embodiments of the first aspect, in some embodiments, calculating the number of partitions based on the screen panel size information and the partition size specifically includes: calculating the area of ​​the screen panel and the area of ​​the partition based on the screen panel size and the partition size; and calculating the number of partitions based on the area of ​​the screen panel and the area of ​​the partition.

[0017] In the above embodiments, calculating the number of partitions based on the area of ​​the mesh panel and the partition area can significantly improve the accuracy and rationality of partition division. The accurate number of partitions ensures that each partition is evenly and appropriately laid out on the mesh panel, laying a solid foundation for subsequent processing steps. This enables the laser processing equipment to efficiently process each partition with better parameter settings and processing paths, effectively reducing processing errors, improving processing quality and increasing production efficiency, and fundamentally ensuring the high quality and high efficiency of solar mesh panel production.

[0018] In conjunction with some embodiments of the first aspect, in some embodiments, after identifying the grid layout of the solar grid imported by the user and obtaining the layer identifier and grid size information, the method further includes: performing a consistency check on the layer identifier and a preset standard layer identifier system; if an inconsistency exists, matching the layer identifier with a preset identifier association library and correcting the layer identifier to the identifier in the preset identifier association library that is closest to the layer identifier; if the imported grid layout has missing or incorrect size information, calling the historical imported grid layout database and extracting sample data similar to the current grid layout in terms of graphic features and structural layout through a preset data mining and analysis algorithm; based on the sample... This data calculates the average and range of the proportional relationship between the current stencil and the current stencil layout in terms of key dimensional parameters; it reads the stencil layout data and calculates the stencil size based on the average and range of the proportional relationship; it compares the stencil size with the original dimension annotations on the stencil layout, correcting any errors and adding any missing annotations; based on this layer identifier, the graphics are categorized into low-precision, medium-high-precision, and high-precision graphics. Low-precision graphics have no control distance requirements with horizontal and vertical dividing lines; medium-high-precision graphics have no control distance requirements with horizontal dividing lines but must maintain a control distance with vertical dividing lines; high-precision graphics must maintain a control distance with all horizontal and vertical dividing lines.

[0019] In the above embodiments, by performing consistency verification and correction on the layer identifiers, it is ensured that the layer identifiers of the stencil layout conform to the standard system. This facilitates the accurate execution of various subsequent processing based on the layer identifiers, avoiding processing errors or mismatches caused by identifier confusion, and improving the accuracy and stability of the entire processing flow. For handling missing or incorrect dimensional information, historical data mining and analysis are used to effectively supplement and correct the stencil dimensional information. Based on the corrected layer identifiers, graphics are classified and their distance requirements from dividing lines are clearly defined. This allows for appropriate strategies to be adopted for graphics of different precision during partitioning and processing. This ensures the processing accuracy and integrity of high-precision graphics while allowing for reasonable processing in low-precision graphic areas, optimizing the allocation of overall processing resources, further improving processing quality and efficiency. From multiple dimensions, this ensures the efficient, accurate, and stable production of solar stencils, enhancing the product's competitiveness and reliability in the market.

[0020] In a second aspect, embodiments of the present invention provide a graphics processing terminal, comprising: one or more processors and a memory; the memory is coupled to the one or more processors, the memory being used to store computer program code, the computer program code including computer instructions, the one or more processors calling the computer instructions to cause the graphics processing terminal to perform a method as described in the first aspect or the second aspect, and any possible implementation thereof.

[0021] Thirdly, the present invention provides a computer-readable storage medium including instructions that, when executed on the graphics processing terminal, cause the graphics processing terminal to perform the method described in the first aspect or the second aspect, and any possible implementation thereof.

[0022] Fourthly, the present invention provides a computer program product containing instructions that, when the computer program product is run on the graphics processing terminal, causes the graphics processing terminal to execute the method described in the first aspect or the second aspect, and any possible implementation thereof.

[0023] Understandably, the graphics processing terminal provided in the second aspect, the storage medium provided in the third aspect, and the computer program product provided in the fourth aspect are all used to execute the method provided by this invention. Therefore, the beneficial effects they can achieve can be referred to the beneficial effects in the corresponding methods, and will not be repeated here.

[0024] In summary, this application includes at least one of the following beneficial technical effects:

[0025] 1. This application effectively detects and identifies the basic information of the stencil layout upon import, and then divides the area into zones that meet control requirements based on this basic information. The method provided in this embodiment involves the program identifying the stencil layout information after the user imports the stencil layout to be calculated on the terminal. If the partitions divided based on the stencil layout and the processing range of the processing equipment do not meet control requirements, the partition size is incremented. If the incremented partition size exceeds the processing range of the laser processing equipment, the partition size is decremented. If the decremented partition size exceeds the minimum processing range of the laser processing equipment, the control distance is decremented, and the partitions are recalculated. This method effectively solves the problems of existing technologies where manual simulation calculation of partitions requires constant trial and error and relies on visual inspection, making the process extremely cumbersome and prone to omissions. It also addresses the issue that existing manual simulation calculation methods are difficult to meet requirements, requiring constant trial and error and resulting in low production efficiency. This method successfully simplifies the operation process and significantly improves production efficiency, allowing users to easily and quickly calculate stencil partitioning schemes that meet control requirements, reducing the probability of poor connection at the automatic partitioning processing points.

[0026] 2. This application addresses situations where, after adjusting the partition size within the processing range of the laser processing equipment according to a preset first step length, the lateral or longitudinal distance still does not meet the control distance. Instead, it reduces the corresponding lateral and longitudinal control distances for each precision requirement according to a preset second step length, resets the partition size, and recalculates the number of partitions. This expands the exploration space for partitioning schemes, helps find feasible solutions within a wider parameter range, avoids the predicament of failing to obtain a suitable partitioning scheme due to overly strict initial control distance settings, and improves the robustness of the partitioning algorithm.

[0027] 3. This application ensures that the layer identifiers of the stencil layout conform to the standard system by verifying and correcting the consistency of layer identifiers. This facilitates the accurate execution of various subsequent processing based on layer identifiers, avoiding processing errors or mismatches caused by identifier confusion, and improving the accuracy and stability of the entire processing flow. For handling missing or incorrect dimensional information, historical data mining and analysis are used to effectively supplement and correct stencil dimensional information. Based on the corrected layer identifiers, graphics are classified and their distance requirements from dividing lines are clearly defined. This allows for appropriate strategies to be adopted for graphics of different precision during partitioning and processing. This ensures the processing accuracy and integrity of high-precision graphics while allowing for reasonable processing in low-precision areas, optimizing the allocation of overall processing resources, further improving processing quality and efficiency. From multiple dimensions, this ensures the efficient, accurate, and stable production of solar stencils, enhancing the product's competitiveness and reliability in the market. Attached Figure Description

[0028] Figure 1 This is a schematic diagram of the partitioning method for the solar grid panel and an information interaction scenario of the graphics processing terminal in this application.

[0029] Figure 2 This is an exemplary scenario diagram of manually simulated partition calculation in the related technology of this application.

[0030] Figure 3-7 This is an exemplary scenario diagram illustrating the partitioning method of the solar grid panel used in this application embodiment.

[0031] Figure 8 This is a flowchart illustrating a method for partitioning solar panels in an embodiment of this application. Detailed Implementation

[0032] The terminology used in the following embodiments of this application is for the purpose of describing particular embodiments only and is not intended to be limiting of this application. As used in the specification and appended claims of this application, the singular expressions “a,” “an,” “the,” “the,” “the,” and “this” are intended to include the plural expressions as well, unless the context clearly indicates otherwise. It should also be understood that the term “and / or” as used in this application refers to and includes any or all possible combinations of one or more of the listed items.

[0033] Hereinafter, the terms "first" and "second" are used for descriptive purposes only and should not be construed as implying or suggesting relative importance or implicitly indicating the number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature, and in the description of the embodiments of this application, unless otherwise stated, "multiple" means two or more.

[0034] The following describes the zoning method for the solar grid panels involved in this application:

[0035] It is understood that, in some embodiments, for ease of description, the partitioning method of the solar grid in this application may also be referred to as a partitioning method, or other names, which are not limited here.

[0036] like Figure 1 The diagram illustrates an information interaction scenario for the partitioning method described in this application. The implementation environment includes a terminal and laser processing equipment. The terminal can communicate with the laser equipment, which supports communication protocols and can respond to commands from the terminal. The user sets commands for the terminal based on manually calculated data, the terminal sends the commands to the laser processing equipment, and the laser processing equipment performs processing according to the commands. Communication protocols include one or two of the following: Modbus TCP protocol, Ethernet / IP protocol, Profibus protocol, CAN bus protocol, and RS-232 protocol; no specific limitation is made here.

[0037] It is understood that the terminal can be any terminal with computing, communication and graphics output capabilities, such as industrial computers, desktop computers, portable laptops, server terminals, and professional graphics workstations; no limitation is made here.

[0038] like Figure 2 The diagram shown is an exemplary scenario of manually simulating partition calculation in the related technology of this application.

[0039] like Figure 2As shown in (a), based on the imported data, the user calculates the dimensions and number of sections using the stencil size and processing equipment parameters. After obtaining the results, the user draws and adjusts the dividing lines in a professional graphic design tool, dividing the stencil layout into sections that correspond to the calculated dimensions and number of sections. The user manually judges whether the divided sections meet the requirements; if not, the sections are manually adjusted until they do. The user then submits the data to the terminal for processing. Figure 2 The laser emitter shown in (b) sends a command, and the laser emitter responds to the terminal command as follows: Figure 2 The solar grid panel shown in (c) is processed.

[0040] However, relying on manual monitoring and adjustment has many drawbacks. It is extremely inefficient and cannot guarantee the accuracy of each adjusted partition. Users are forced to frequently engage in trial and error and repeated adjustments, which undoubtedly consumes a significant amount of time and effort.

[0041] On the one hand, due to the subjectivity of manual operation, different users have different standards for judging whether the partitioning is reasonable, and it is difficult to achieve precise control during operation. For example, deviations may occur when determining the partition boundaries. Even if measures such as visual inspection, coordinate comparison, and size comparison using software measurement tools are taken during the inspection process, it is still difficult to completely avoid quality problems caused by unreasonable partitioning. On the other hand, the whole process relies on manual operation. From the initial calculation of partitioning parameters and drawing and adjusting the dividing lines, to the subsequent multiple trial and error adjustments, and then to various manual comparison operations during inspection, the steps are cumbersome and time-consuming, resulting in low efficiency and seriously hindering the needs of large-scale, high-quality production.

[0042] It is understandable that users have various methods to try to deal with processing problems during the production of solar printed screens, including but not limited to this method of continuously trying partitioned calculations and processing. Each method can be independent and there is no conflict between them.

[0043] This application provides a method for partitioning solar grid panels. After the user imports a pre-designed solar grid panel layout, the terminal identifies the layer identifier and the panel size information. Based on the preset processing range of the laser processing equipment, it calculates the partition size, quickly determines the number of partitions, and generates precise horizontal and vertical dividing lines, dividing the grid panel layout into reasonable partitions. For graphics of varying precision within the grid panel layout, the terminal can quickly determine their distance relationship with the dividing lines. If the distance control requirements are not met, the terminal efficiently adjusts the partition size within the processing range according to preset rules, recalculates the number of partitions, and iterates until the optimal partitioning scheme is found. This significantly improves partitioning accuracy, effectively ensuring high precision and high quality in solar grid panel graphic processing, reducing the probability of poor connection at the partition processing points in automatic partitioning; it also significantly improves production efficiency, reduces labor and time costs, and enhances the stability and controllability of the production process.

[0044] like Figures 3-7 The diagram shown is an exemplary scenario diagram after the solar grid panel is partitioned using the partitioning method of this application embodiment.

[0045] like Figure 3 As shown in (a), the user imports the stencil layout on the terminal. After importing, the user clicks as follows: Figure 3 The "Start Identifying Screen Information" button, shown in (b) above, displays the following page: Figure 3 As shown in (c) of the diagram, the program begins to identify the basic information of the current stencil layout. This basic information includes the stencil size and the layer identifiers corresponding to different layers in the stencil layout. Layer identifiers are categorized into high-precision graphics, medium-high precision graphics, and low-precision graphics. High-precision graphics refer to graphics that cannot be divided, such as certain graphics with precise circuit structures and extremely high requirements for circuit continuity; dividing them could lead to circuit malfunction. Medium-high precision graphics refer to graphics that can be cut by horizontal dividing lines but not by vertical dividing lines, such as graphics with a certain extension in the horizontal direction and structural continuity requirements in the vertical direction, such as certain special electrode wiring patterns. Horizontal cutting has little impact on their function, but vertical cutting may damage their electrical performance. Low-precision graphics refer to graphics that can be cut without easily causing problems such as poor contact at the joints, such as large non-critical conductive areas or simple pattern marking areas.

[0046] After recognition, the currently imported screen printing pattern is displayed on the page, along with the screen printing pattern dimensions. The user clicks on the... Figure 3The "Start Calculation" button, shown in (d), initiates the calculation of partitions that meet the control distance requirements. Control requirements refer to compliance with the corresponding graphic processing accuracy standards, ensuring that the partition connections meet the accuracy requirements of the graphic control and do not cause poor connection issues. Specifically, for high-precision graphic areas, the processing accuracy error must be controlled within ±[X] micrometers, and the gap at the partition connection must not exceed ±[Y] micrometers; for medium-high precision graphic areas, the processing accuracy error can be relaxed to ±[A] micrometers, and the gap at the connection must not exceed ±[B] micrometers; for low-precision graphic areas, the processing accuracy error is allowed within ±[M] micrometers, and the gap at the connection must not exceed ±[N] micrometers.

[0047] After the terminal receives the user's instruction to start the calculation, as follows: Figure 4 As shown in (a), the horizontal and vertical processing ranges of the current laser processing equipment are obtained, as follows: Figure 4 As shown in (b), the median values ​​of the horizontal and vertical processing ranges are calculated based on the horizontal and vertical processing ranges of the laser processing equipment. These median values ​​correspond to the horizontal and vertical dimensions of the initial partition. The number of partitions is calculated based on the identified stencil size and the initial partition size.

[0048] According to such Figure 4 The calculated partition size and number of partitions shown in (c) generate multiple mutually perpendicular horizontal and vertical dividing lines, dividing the screen layout into partitions. The screen size corresponding to each partition is the partition size. Among them, high-precision graphics need to maintain a control distance (ax) with the vertical dividing lines and a control distance (by) with the horizontal dividing lines; medium-high precision graphics need to maintain a control distance (ax) with the vertical dividing lines, but there is no control distance requirement with the horizontal dividing lines; low-precision graphics have no control distance requirement with either the horizontal or vertical dividing lines.

[0049] Check if the current partition exceeds the corresponding control distance requirement. If both the horizontal and vertical dividing lines exceed the control distance requirement, then display as shown below. Figure 3 The information shown in (e) includes the divided grid layout, the number of partitions, and the partition sizes that meet the control requirements.

[0050] like Figure 5 As shown in (a), if both the horizontal and vertical dividing lines are smaller than the control distance requirement, the horizontal and vertical dimensions based on the initial partition size are increased by 0.01 mm to obtain the new partition size. The number of partitions is recalculated based on the new partition size. Multiple mutually perpendicular horizontal dividing lines and multiple vertical dividing lines are regenerated according to the new partition size and the number of partitions. The screen layout is divided into the number of partitions, and the screen size corresponding to each partition is the partition size.

[0051] Check again whether the current partition exceeds the corresponding control distance requirement, such as... Figure 5 As shown in (b), if the detected horizontal dividing line is greater than the control distance requirement, but the vertical dividing line is not greater than the control distance requirement, then the current horizontal control distance that meets the control distance requirement and the corresponding horizontal dividing line information are stored, based on the current partition size, such as... Figure 5 As shown in (c), the longitudinal dimension of the partition is increased by 0.01 mm;

[0052] Check if the current partition is larger than the corresponding vertical control distance requirement. If the partition is larger than the vertical control distance requirement, display the following: Figure 3 The information shown in (e) includes the divided grid layout, the number of partitions, and the partition sizes that meet the control requirements.

[0053] like Figure 5 As shown in (d), if the current partition is still not greater than the longitudinal control distance requirement, the longitudinal dimension of the current partition will continue to be increased by 0.01mm until the control distance requirement is met.

[0054] like Figure 6 As shown in (a), if the incremented partition size exceeds the maximum processing range of the laser processing equipment, the longitudinal dimension of the partition that does not currently meet the control requirements will be restored to the longitudinal dimension corresponding to the initial partition, such as... Figure 6 As shown in (b), the initial longitudinal dimension is reduced by 0.01 mm. Based on the transverse and longitudinal partition dimensions that meet the control requirements, the number of partitions is recalculated. Multiple longitudinal partition lines perpendicular to the transverse partition lines are regenerated according to the new partition dimensions and the number of partitions. The screen layout is divided into partitions, and the screen size corresponding to each partition is the partition size.

[0055] Check if the current partition is larger than the corresponding vertical control distance requirement. If the partition is larger than the vertical control distance requirement, display the following: Figure 3 The information shown in (e) includes the divided grid layout, the number of partitions, and the partition sizes that meet the control requirements.

[0056] like Figure 6 As shown in (c), if the current partition is still not greater than the longitudinal control distance requirement, the longitudinal dimension of the current partition will continue to be reduced by 0.01mm until the control distance requirement is met.

[0057] like Figure 7As shown in (a), if the reduced partition size exceeds the minimum processing range of the laser processing equipment, the longitudinal dimension of the partition that does not currently meet the control requirements is restored to the longitudinal dimension corresponding to the initial partition, the longitudinal control distance corresponding to the partition is reduced by 0.005mm, and the above incrementing and decrementing operation is repeated until the requirements are met. Figure 7 The control distance requirement is shown in (b) of the table.

[0058] The result after calculation is displayed as follows Figure 3 The information shown in (e) includes the divided grid layout, the number of partitions, and the partition sizes that meet the control requirements.

[0059] It is understood that the above scenario is only an example. In actual applications, the various information and controls displayed on the page can be displayed in other content and forms, and other triggering methods can be used. No limitation is made here.

[0060] The method for partitioning the solar grid panels in the embodiments of this application is described below:

[0061] like Figure 8 The diagram shown is a flowchart illustrating a method for partitioning solar panels in an embodiment of this application.

[0062] S801: The user has imported a stencil layout, and the layer identifier and stencil size information are obtained.

[0063] In this embodiment, users can import stencil layout files by selecting the "Import Stencil Layout" option to trigger a file selection dialog box or by dragging and dropping files. The specific import method is not limited to one method.

[0064] In some cases, users may import incorrect files due to operational errors, resulting in the inability to recognize the stencil layout information subsequently. Such incorrect files will prevent the program from correctly recognizing the stencil layout information. If the imported file format is incorrect, the program will provide a corresponding error message, requiring the user to re-import the correct format stencil layout file. The program will only proceed to the next step if the import is successful and the format is correct.

[0065] The terminal detects that the user has imported a stencil layout and confirms that the stencil layout file format is correct. It then identifies the successfully imported stencil layout and parses out information such as the size and layer identifiers of the stencil. The layers corresponding to the layer identifiers contain graphics with corresponding precision requirements. Different precision requirements of graphics are preset with different horizontal and vertical control distances.

[0066] Specifically, the names of layers usually contain precision information. For example, the layer containing high-precision graphics is named "High-PrecisionLayer", the layer containing medium-high precision graphics is named "Medium-High-PrecisionLayer", and the layer containing low-precision graphics is named "low-PrecisionLayer". The program determines the precision of the graphics by recognizing these name keywords, thereby ensuring that the graphics corresponding to the precision meet the cutting standards.

[0067] After obtaining the layer identifier, the terminal immediately performs a consistency check between the layer identifier and the preset standard layer identifier system. If an inconsistency is found, the layer identifier is matched with the preset identifier association library, and the layer identifier is corrected to the identifier in the preset identifier association library that is closest to the layer identifier.

[0068] Meanwhile, if the imported stencil layout has missing or incorrect dimensional information, the database of historically imported stencil layouts is accessed. Using pre-defined data mining and analysis algorithms, sample data similar to the current stencil layout in terms of graphic features and structural layout are extracted. Based on the sample data, the average and range of the proportional relationship between the sample data and the current stencil layout in key dimensional parameters are calculated. The stencil layout data is then read, and the stencil dimensions are calculated based on the average and range of the proportional relationship. The stencil dimensions are compared with the original dimension annotations on the stencil layout; if the annotations are incorrect, they are corrected; if annotations are missing, they are added.

[0069] In some embodiments, the size of the screen determines the overall divisible area, while the graphic precision information affects how different precision graphics are processed during the partitioning process, ensuring that high-precision graphics are not destroyed during partitioning, and that medium and low precision graphics are partitioned according to appropriate rules.

[0070] In some embodiments, the stencil layout is designed by a designer using professional design software. Such professional design software includes, but is not limited to, commonly used CAD (Computer-Aided Design) software and specific software designed for solar stencil design, such as SolarCAD, etc., and is not limited here. The designer creates key graphic files based on the functional requirements, established technical specifications, and relevant industry standards of the solar stencil to guide the graphic printing stage in the solar stencil manufacturing process.

[0071] It includes a grid electrode pattern designed to ensure effective current conduction between the solar panel and the electrical equipment. The shape, width, spacing, and other parameters of the grid lines are strictly set according to electrical performance requirements. It also includes auxiliary elements such as positioning markers to ensure precise alignment between the stencil and the solar panel substrate during the printing process.

[0072] In addition, the layout includes test pattern areas for detecting the quality and process parameters of the stencil. These test pattern areas, through specific circuit layouts and graphic features, can effectively detect quality indicators such as the conductivity and resistance of the printed circuit, as well as process parameters such as printing accuracy and ink adhesion. This provides a comprehensive and accurate graphical guidance foundation for the high-quality and high-precision production of solar stencils.

[0073] S802. Calculate the partition size based on the preset processing range of the laser processing equipment;

[0074] The terminal calculates the median values ​​of the horizontal and vertical processing ranges based on the initial values ​​of the horizontal and vertical processing ranges of the laser processing equipment. The median value of the horizontal processing range corresponds to the horizontal dimension of the initial partition size, and the median value of the vertical processing range corresponds to the vertical dimension of the initial partition size. The initial dimensions of the partition can be defined as follows:

[0075]

[0076] Among them, L 分 and W 分 These are the length and width of the partition, respectively. The minimum range of the lateral processing dimension of the laser processing equipment is L. min The maximum value is L max The minimum value for the longitudinal machining dimension is set to W. min The maximum value is W max The terminal calculates the initial partition size based on the median value of the horizontal and vertical processing ranges of the laser processing equipment.

[0077] Understandably, when the laser equipment is first connected to the terminal, it is necessary to set the processing range, processing type, and corresponding precision requirements of the laser processing equipment. The precision requirements cover at least one aspect such as cutting accuracy, surface flatness, and roughness. Specific precision requirements are not further limited here. When using the terminal and laser processing equipment again, the processing type can be modified according to actual needs; otherwise, processing will proceed according to the default type of the laser processing equipment's processing range.

[0078] S803. Calculate the number of partitions based on the stencil size information and partition size;

[0079] Based on the identified stencil size information and the initial partition size, the number of partitions is calculated. The number of partitions can be defined as follows:

[0080]

[0081] Where N is the number of partitions, L 整 and W 整These are the length and width of the entire image. When recognizing the screen layout file, the program accurately obtains the length and width data of the entire image based on a specific parsing algorithm; L 分 and W 分 It refers to the length and width of the partition.

[0082] Understandably, the calculation process comprehensively considers the compatibility between the actual size of the stencil and the processing capacity of the equipment, ensuring that the divided zones can be effectively processed within the equipment's processing range while maximizing processing efficiency and guaranteeing processing quality. For example, for larger stencils, a reasonable number of zones is calculated based on the median value of the equipment's processing range, avoiding the adverse effects of too many or too few zones on the processing process.

[0083] S804. Generate multiple horizontal and vertical dividing lines that are perpendicular to each other, dividing the stencil layout into a number of partitions, with the stencil size corresponding to each partition being the partition size.

[0084] Based on the calculated number of partitions and partition size information, the terminal automatically generates multiple horizontal and vertical dividing lines that are perpendicular to each other, dividing the stencil into partitions of the specified number of partitions. The partition size is the size of the stencil after the division.

[0085] In some embodiments, when generating horizontal and vertical dividing lines, the position of the dividing lines is optimized based on the aspect ratio of the partitions and the graphic distribution characteristics, so as to reduce the impact on graphic integrity and processing convenience.

[0086] S805. For each graphic in the stencil layout, determine whether the horizontal distance between the nearest horizontal dividing line and the graphic is greater than the horizontal control distance of the graphic, and determine whether the vertical distance between the nearest vertical dividing line and the graphic is greater than the vertical control distance of the graphic.

[0087] For each graphic in the stencil layout, determine whether the nearest horizontal dividing line of each graphic is greater than the horizontal control distance requirement of that graphic, and whether the nearest vertical dividing line is greater than the vertical control distance requirement of that graphic. If for each graphic in the stencil layout, the horizontal distance between the nearest horizontal dividing line and the graphic is greater than the horizontal control distance of that graphic, and the vertical distance between the nearest vertical dividing line and the graphic is greater than the vertical control distance of that graphic, then execute step S807 to output the completed stencil layout according to the currently divided partitions;

[0088] If the horizontal distance between the nearest horizontal dividing line and the horizontal distance between the graphic in the stencil layout or the vertical distance between the nearest vertical dividing line and the vertical dividing line of the graphic does not meet the corresponding control distance, then proceed to step S806.

[0089] Understandably, low-precision graphics have no control distance requirements with horizontal and vertical dividing lines; medium- and high-precision graphics have no control distance requirements with horizontal dividing lines, but must maintain a control distance with vertical dividing lines; high-precision graphics must maintain a control distance with all horizontal and vertical dividing lines.

[0090] In some embodiments of this application, the partition size includes a range of partition sizes; in other embodiments, the partition size also includes factors such as the regularity of the partition shape, graphic integrity, and the stability of the connection between partitions, which are not limited here. The shape of the partition should be as close to a rectangle as possible to ensure the smoothness of the laser processing path; graphic integrity requires that there should be no missing or damaged graphics at the partition boundaries; the stability of the connection between partitions is ensured through specific connection point design and spacing requirements to ensure that each partition can work together in the overall structure to achieve the normal function of the solar grid.

[0091] Understandably, the connections between zones must also meet regulations to ensure that each zone can work collaboratively within the overall structure and achieve the normal functioning of the solar grid panels. The program uses precise algorithms and logical judgments to check each zone one by one to determine whether it fully complies with these control requirements.

[0092] S806. If the horizontal or vertical distance is not greater than the horizontal or vertical control distance of the graphic, adjust the horizontal or vertical dimension in the partition size according to the preset first step length within the processing range of the laser processing equipment to obtain the updated partition size, and then jump to execute S803.

[0093] In some embodiments, the graphics in the partition after being divided by the dividing line generated based on the partition size and the screen size may have a horizontal distance or a vertical distance that is greater than the horizontal control distance or vertical control distance corresponding to the graphics. The terminal will store the horizontal distance or vertical distance of the graphics in the partition after being divided by the dividing line generated based on the partition size and the screen size that is greater than the horizontal control distance or vertical control distance corresponding to the graphics, store the corresponding dividing line and partition size, and retry on the other side.

[0094] In some embodiments, if the lateral distance between the nearest horizontal dividing line and each graphic in the stencil layout is less than the lateral control distance of the graphic, but the lateral distance between the nearest vertical dividing line and the graphic is greater than the vertical control distance of the graphic, then the vertical control distance and the corresponding vertical dividing line information are stored, the lateral dimension of the partition size is incremented by 0.01mm, and it is determined whether the incremented lateral dimension exceeds the maximum size of the lateral processing range of the laser processing equipment.

[0095] If the error does not exceed the limit, then repeat step S803.

[0096] If it exceeds the limit, the horizontal dimension of the partition size is reset to the horizontal dimension of the initial partition, the horizontal dimension of the partition size is decreased by 0.01mm, and it is determined whether the increased horizontal dimension exceeds the minimum size of the horizontal processing range of the laser processing equipment.

[0097] If the error does not exceed the limit, then repeat step S803.

[0098] If the error exceeds the limit, the horizontal dimension of the partition is reset to the horizontal dimension of the initial partition, the control distance corresponding to the graphic accuracy is reduced by 0.005mm, and step S803 is executed again. Based on the new control distance requirement, the horizontal dimension of the partition is incremented or decremented until the horizontal distance between the nearest horizontal dividing line and the graphic is greater than the horizontal control distance of the graphic, and then step S807 is executed.

[0099] In some embodiments, if the lateral distance between the nearest horizontal dividing line and each graphic in the stencil layout is greater than the lateral control distance of the graphic, but the lateral distance between the nearest vertical dividing line and the graphic is less than the lateral control distance of the graphic, then the lateral control distance and the corresponding horizontal dividing line information are stored, the lateral dimension of the partition size is incremented by 0.01mm, and it is determined whether the incremented lateral dimension exceeds the maximum size of the lateral processing range of the laser processing equipment.

[0100] If the error does not exceed the limit, then repeat step S803.

[0101] If it exceeds the limit, the vertical dimension of the partition size is reset to the vertical dimension of the initial partition, the vertical dimension of the partition size is decreased by 0.01mm, and it is determined whether the increased vertical dimension exceeds the minimum size of the vertical processing range of the laser processing equipment.

[0102] If the error does not exceed the limit, then repeat step S803.

[0103] If the error exceeds the limit, the vertical dimension of the partition size is reset to the initial vertical dimension of the partition, the control distance corresponding to the graphic accuracy is reduced by 0.005mm, and step S803 is executed again. Based on the new control distance requirement, the vertical dimension of the partition is incremented or decremented until the vertical distance between the nearest vertical dividing line and the graphic is greater than the vertical control distance of the graphic, and then step S807 is executed.

[0104] In some embodiments, if the horizontal distance between the nearest horizontal dividing line and the graphic in the stencil layout is less than the horizontal control distance of the graphic, and the vertical distance between the nearest vertical dividing line and the graphic is also less than the vertical control distance of the graphic, then the horizontal and vertical dimensions of the partition size are simultaneously increased by 0.01mm, and it is determined whether the increased horizontal and vertical dimensions exceed the maximum dimensions of the corresponding horizontal and vertical processing ranges of the laser processing equipment.

[0105] If none of them are outside the range, proceed to step S803;

[0106] If the lateral dimension exceeds the maximum lateral processing range of the laser processing equipment, but the longitudinal dimension does not exceed the maximum longitudinal processing range of the laser processing equipment, then the lateral dimension of the partition size is reset to the lateral dimension of the initial partition, and the lateral dimension of the initial partition is decreased by 0.01mm. It is then determined whether the updated lateral dimension of the partition exceeds the minimum processing range of the laser processing equipment. If it does, the lateral control distance corresponding to the graphic accuracy is decreased by 0.005mm, and the lateral dimension of the partition size is reset to the lateral dimension of the initial partition. If it does not exceed, the longitudinal partition size that does not exceed the maximum longitudinal processing range of the laser processing equipment is simultaneously increased by 0.01mm, and then step S803 is executed.

[0107] If the lateral dimension does not exceed the maximum lateral processing range of the laser processing equipment, but the longitudinal dimension exceeds the maximum longitudinal processing range of the laser processing equipment, then the longitudinal dimension of the partition size is reset to the longitudinal dimension of the initial partition, and the longitudinal dimension of the initial partition is decreased by 0.01mm. It is then determined whether the updated longitudinal dimension of the partition exceeds the minimum processing range of the laser processing equipment. If it does, the longitudinal control distance corresponding to the graphic accuracy is decreased by 0.005mm, and the longitudinal dimension of the partition size is reset to the longitudinal dimension of the initial partition. If it does not exceed, the lateral partition size that does not exceed the maximum longitudinal processing range of the laser processing equipment continues to increase by 0.01mm, and then step S803 is executed.

[0108] If the horizontal and vertical dimensions of the partition exceed the maximum horizontal and vertical processing range corresponding to the laser processing equipment, then the horizontal and vertical dimensions of the partition are reset to the initial horizontal and vertical dimensions corresponding to the partition. After simultaneously decreasing the horizontal and vertical dimensions by 0.01mm, it is determined whether the updated horizontal and vertical dimensions of the partition exceed the minimum horizontal and minimum vertical processing range corresponding to the laser processing equipment. If they exceed, then the horizontal and vertical control distances corresponding to the graphic accuracy are reduced by 0.005mm respectively, and the horizontal dimension of the partition is reset to the initial vertical dimension of the partition. If they do not exceed, then step S803 is executed.

[0109] S807. If the horizontal distance of all graphics in the screen layout is greater than the horizontal control distance of the graphic and the vertical distance is greater than the vertical control distance of the graphic, then the screen layout is output according to the current partition.

[0110] After successfully calculating a stencil layout scheme that fully meets the control requirements, the program outputs the stencil layout information that conforms to the control requirements. This information includes stencil dimensions, number of partitions, and partition dimensions. The specific information displayed is not limited here. Simultaneously, convenient operation options and navigation functions are provided for users to further view or edit partition information. Clicking on the divided stencil layout will take users to a detailed graphical preview and attribute editing interface for each partition. The output information can also include detailed log records of the testing process. The detailed log records are presented in tabular form, including the test results of each partition (such as "pass" or "fail"), whether there are any potential risks (such as "the partition edge is close to the critical graphic, which may affect electrical performance"), and corresponding optimization suggestions (such as "adjust the partition boundary, away from the critical graphic by 2mm"). Users can click the filter button in the log record area to filter and view the log records according to the partition number, test results, and other conditions, so that users can refer to and further optimize in subsequent operations. Users can export the current stencil layout for use in subsequent production and processing stages, or they can choose to continue to perform other stencil layout calculation tasks to improve the continuity and flexibility of the workflow. This is only an example and no additional limitations are made.

[0111] In summary, the method provided in this embodiment can effectively detect and identify the basic information of the stencil layout after it is imported, and then divide the area into zones that meet the control requirements based on this basic information. When the user imports the stencil layout to be calculated into the terminal, the program will identify the stencil layout information. If the partitions divided based on the stencil layout and the processing range of the processing equipment do not meet the control requirements, the partition size is first incremented. If the incremented partition size exceeds the processing range of the laser processing equipment, the partition size is decremented. If the decremented partition size exceeds the minimum processing range of the laser processing equipment, the control distance is decremented, and the partitions are recalculated. This method effectively solves the problems of existing technologies where manual simulation calculation of partitions requires constant trial and error and relies on visual inspection, which is extremely cumbersome and prone to omissions. It also addresses the difficulty of meeting requirements with manual simulation calculations, which necessitates constant trial and error and leads to low production efficiency. This method successfully simplifies the operation process and significantly improves efficiency, enabling users to easily and quickly calculate stencil partitioning schemes that meet control requirements, thereby improving production efficiency.

[0112] The method provided in the above embodiments can be executed by a computer device, which is a graphics processing terminal.

[0113] In some embodiments, the graphics processing terminal is a computer device, which may be a terminal device. The computer device includes an arithmetic logic unit (ALU), a memory, a graphics processor (GPU), a central processing unit (CPU), an input device, and an output device connected via a terminal bus. The ALU of the computer device is used to provide arithmetic and logical calculations. The memory of the computer device includes a non-volatile storage medium and internal memory. The non-volatile storage medium stores the operating terminal, computer programs, and a database. The internal memory provides an environment for the operation of the operating terminal and computer programs in the non-volatile storage medium. The database is used to store data. The GPU of the computer device is used to accelerate the display of the stencil design drawing, efficiently process graphics-related operations, and assist in the visualization of partitioning results. The CPU of the computer device is used to run the operating terminal and related software, coordinate the work of various hardware devices, and perform complex numerical calculations such as calculating the number and size of partitions based on the stencil size and processing equipment range, as well as control the data transmission and processing flow between components. The input device of the computer device is used to transmit the solar stencil layout into the terminal. The output device of the computer device is used to provide real-time feedback on partitioning results, assist in viewing and analyzing the design drawing, and provide an interactive interface. When the computer program is executed by the central processing unit, it implements the solar grid partitioning method in the embodiments of this application.

[0114] Those skilled in the art will understand that the structure described above is merely a block diagram of a portion of the structure related to the present application and does not constitute a limitation on the computer device to which the present application is applied. Specific computer devices may include more or fewer components than shown in the figures, or combine certain components, or have different component arrangements.

[0115] In some embodiments of this application, a computer-readable storage medium is also provided, including instructions that, when executed on the graphics processing terminal, cause the graphics processing terminal to execute the solar grid partitioning method in the embodiments of this application.

[0116] The above-described embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit it. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application.

[0117] As used in the above embodiments, depending on the context, the term "when..." can be interpreted as meaning "if...", "after...", "in response to determining...", or "in response to detecting...". Similarly, depending on the context, the phrase "when determining..." or "if (the stated condition or event) is interpreted as meaning "if determining...", "in response to determining...", "when (the stated condition or event) is detected", or "in response to detecting (the stated condition or event)".

[0118] In the above embodiments, implementation can be achieved entirely or partially through software, hardware, firmware, or any combination thereof. When implemented using software, it can be implemented entirely or partially in the form of a computer program product. The computer program product includes one or more computer instructions. When the computer program instructions are loaded and executed on a computer, all or part of the processes or functions described in the embodiments of this application are generated. The computer can be a general-purpose computer, a special-purpose computer, a computer network, or other programmable device. The computer instructions can be stored in a computer-readable storage medium or transmitted from one computer-readable storage medium to another. For example, the computer instructions can be transmitted from one website, computer, server, or data center to another website, computer, server, or data center via wired (e.g., coaxial cable, fiber optic, digital subscriber line) or wireless (e.g., infrared, wireless, microwave, etc.) means. The computer-readable storage medium can be any available medium that a computer can access or a data storage device such as a server or data center that integrates one or more available media. The available medium can be a magnetic medium (e.g., floppy disk, hard disk, magnetic tape), an optical medium (e.g., DVD), or a semiconductor medium (e.g., solid-state drive), etc.

[0119] Those skilled in the art will understand that all or part of the processes in the methods of the above embodiments can be implemented by a computer program instructing related hardware. This program can be stored in a computer-readable storage medium, and when executed, it can include the processes described in the above method embodiments. The aforementioned storage medium includes various media capable of storing program code, such as ROM or random access memory (RAM), magnetic disks, or optical disks.

Claims

1. A method for dividing solar grid panels into zones, characterized in that, The method comprises the following steps: identifying a solar panel layout of a solar panel imported by a user to obtain layer identification and panel size information; each layer identification corresponds to a layer carrying a pattern with a corresponding precision requirement; different precision requirements correspond to different horizontal control distances and vertical control distances; calculating a partition size based on a preset processing range of a laser processing device; calculating a number of partitions based on the panel size information and the partition size; generating a plurality of horizontal division lines and a plurality of vertical division lines perpendicular to each other, and dividing the panel layout into the number of partitions, each partition corresponding to a panel size of the partition size; for each pattern in the panel layout, determining whether the horizontal distance between the nearest horizontal division line and the pattern is greater than the horizontal control distance of the pattern, and determining whether the vertical distance between the nearest vertical division line and the pattern is greater than the vertical control distance of the pattern; if the horizontal distance or the vertical distance is not greater than the horizontal control distance or the vertical control distance of the pattern, adjusting the horizontal size or the vertical size of the partition size by a preset first step length within the processing range of the laser processing device to obtain an updated partition size, and jumping to the step of calculating the number of partitions based on the panel size information and the partition size; if the horizontal distance of all patterns in the panel layout is greater than the horizontal control distance of the pattern and the vertical distance is greater than the vertical control distance of the pattern, outputting the completed panel layout according to the currently divided partitions.

2. The method of claim 1, wherein, The method for calculating the partition size based on the preset processing range of the laser processing device comprises the following steps: calculating the middle value of the horizontal processing range and the middle value of the vertical processing range based on the maximum and minimum values of the preset horizontal processing range and vertical processing range of the laser processing device, and taking the middle values as the horizontal size and vertical size of the partition size.

3. The method of claim 1, wherein, The method for adjusting the horizontal size or the vertical size of the partition size by a preset first step length within the processing range of the laser processing device to obtain an updated partition size, and jumping to the step of calculating the number of partitions based on the panel size information and the partition size, comprises the following steps: in the case where the horizontal distance is not greater than the horizontal control distance of the pattern but the vertical distance is greater than the vertical control distance of the pattern, storing the vertical control distance and the corresponding vertical division line information; adjusting the horizontal size of the partition size by a preset first step length within the processing range of the laser processing device to obtain an updated partition size, and jumping to the step of calculating the number of partitions based on the panel size information and the partition size; in the case where the vertical distance is not greater than the vertical control distance of the pattern but the horizontal distance is greater than the horizontal control distance of the pattern, storing the horizontal control distance and the corresponding horizontal division line information; adjusting the longitudinal size in the updated partition size according to a preset first step length within the processing range of the laser processing equipment, obtaining an updated partition size, and jumping to execute the step of calculating the number of partitions according to the screen size information and the partition size; adjusting the longitudinal size in the updated partition size according to a preset first step length within the processing range of the laser processing equipment, obtaining an updated partition size, and jumping to execute the step of calculating the number of partitions according to the screen size information and the partition size.

4. The method of claim 1, wherein, After the step of adjusting the longitudinal size or the transverse size in the partition size according to a preset first step length within the processing range of the laser processing equipment, obtaining an updated partition size, and jumping to execute the step of calculating the number of partitions according to the screen size information and the partition size, the method further comprises: After the step of adjusting the longitudinal size or the transverse size in the partition size according to a preset first step length within the processing range of the laser processing equipment, obtaining an updated partition size, and jumping to execute the step of calculating the number of partitions according to the screen size information and the partition size, the method further comprises:

5. The method of claim 4, wherein, After the step of adjusting the longitudinal size or the transverse size in the partition size according to a preset first step length within the processing range of the laser processing equipment, obtaining an updated partition size, and jumping to execute the step of calculating the number of partitions according to the screen size information and the partition size, the method further comprises: detailed recording of all parameter changes in the iteration operation process of each partition size adjustment, control distance change, and recalculation of the number of partitions; after the partition division process ends, analyzing the key factors that cause repeated adjustment of the partition result to obtain an analysis result; based on the analysis result, generating an optimization suggestion and strategy report for improvement of partition division.

6. The method of claim 1, wherein, The step of calculating the number of partitions according to the screen size information and the partition size specifically comprises: calculating the area of the screen and the area of the partition according to the size of the screen and the partition size; calculating the number of partitions based on the area of the screen and the area of the partition.

7. The method of claim 1, wherein, After the step of identifying the screen layout of the solar screen imported by the user to obtain the layer identifier and the screen size information, the method further comprises: performing consistency verification on the layer identifier and a preset standard layer identifier system, if there is an inconsistency, matching the layer identifier with a preset identifier association library, and correcting the layer identifier to the identifier in the preset identifier association library that is closest to the layer identifier; If the imported screen plate layout is missing or incorrect in size information, a historical imported screen plate layout database is called to extract sample data similar to the current screen plate layout in terms of graphic features and structural layout through a preset data mining and analysis algorithm; Based on the sample data, the average ratio and the ratio range of the key size parameters of the screen plate layout are calculated; The screen plate layout data is read, and the screen plate size is calculated based on the average ratio and the ratio range; The screen plate size is compared with the original size annotation of the screen plate layout, and if the annotation is incorrect, it is corrected, and if the annotation is missing, it is added; Based on the layer identifier, the graphics are divided into low-precision graphics, medium-high-precision graphics, and high-precision graphics. The low-precision graphics do not have distance control requirements with the horizontal and vertical division lines. The medium-high-precision graphics do not have distance control requirements with the horizontal division lines, but need to maintain a distance control with the vertical division lines. The high-precision graphics need to maintain a distance control with all horizontal and vertical division lines.

8. A graphics processing terminal, characterized by comprise one or more processors and a memory; The memory is coupled to the one or more processors, and the memory is configured to store computer program code comprising computer instructions, and the one or more processors are configured to invoke the computer instructions to cause the server to perform the method of any one of claims 1-7.

9. A computer readable storage medium storing computer instructions, characterized in that, When the computer instructions are executed on the graphic processing terminal, the graphic processing terminal is caused to perform the method of any one of claims 1-7.

10. A computer program product, characterised in that, When the computer program product is executed on the graphic processing terminal, the graphic processing terminal is caused to perform the method of any one of claims 1-7.

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