Cooling body and electrical and / or electronic device comprising a cooling body

Abstract

The invention relates to a heat sink (1) for cooling an electrical and / or electronic component (41), comprising a support surface (31) for supporting the electrical and / or electronic component (41), a cooling channel (5) being formed in the heat sink (1), the cooling channel (5) extends through the cooling body (1) from an inflow opening (8) of the cooling body (1) to an outflow opening (9) of the cooling body (1) and through which a cooling medium can flow, the cooling channel (5) having a turbulent flow section (51), in which turbulent flow structures (61) are arranged, the turbulent flow structures (61) being formed from deformed plates, and the cooling channel (5) having a plurality of cooling channels (6), at least one locally defined press-in (66) is formed in the turbulence structure (61).

Description

Technical Field

[0001] The invention relates to a heat sink for cooling an electrical and / or electronic component, and to an electrical and / or electronic device comprising a heat sink and an electrical and / or electronic component, having the features of the preamble of independent claim 1 . Background Art

[0002] In hybrid vehicles or electric vehicles, electrical and / or electronic components, such as inverter structures or converter structures, are used as power modules, for example. An inverter that provides phase current to an electric motor is used, for example, to operate the motor. Electrical and / or electronic components, for example, can form a power module. Electrical and / or electronic components, for example, can include a carrier substrate with a conductor line, on which heat-generating components, such as power semiconductors, are arranged, for example, and these components, together with the carrier substrate, form an electronic device unit. The carrier substrate can be, for example, an AMB (Active Metal Brazed)-power substrate or a DBC (Direct Bonded Copper)-power substrate. The power semiconductors in the power electronic device conduct high currents. The conduction losses caused thereby, together with the switching losses, are the cause of high loss heat power, which must be discharged on a small surface through a cooling solution. The maximum allowable semiconductor temperature is critical for failures, so it is crucial to minimize the thermal resistance between the power module and the cooling body. Heat is generated by the power module during operation, and this heat must be conducted to the cooling body. For this reason, the electronic device unit is thermally connected to the cooling body. The cooling body is composed of aluminum, aluminum silicon carbide or a copper alloy, for example. For the purpose of low thermal resistance between the carrier substrate of the electrical and / or electronic component and the cooling body, the carrier substrate is connected to the cooling body by means of a soldering process or a sintering process. For this purpose, the cooling body top side of the cooling body can be coated with a material suitable for the soldering process or the sintering process.

[0003] In the cooling channels of the cooling body, there are arranged deformed plates, in particular with periodically repeating structures, which guide the cooling medium in the cooling channels. The deformed plates generate eddies in the cooling medium and increase the surface between the cooling body and the cooling medium, thereby ensuring good heat transfer between the cooling body and the cooling medium. Summary of the invention

[0004] According to the invention, a heat sink for cooling electrical and / or electronic components is proposed. A support surface for supporting the electrical and / or electronic components is formed on the heat sink, wherein a cooling channel is formed in the heat sink, which extends through the heat sink from an inlet opening to an outlet opening of the heat sink and can be flowed through by a cooling medium, wherein the cooling channel has a turbulent section, wherein a turbulent structure is arranged in the turbulent section, wherein the turbulent structure is formed by a deformed plate. According to the invention, at least one locally defined press-in portion is formed in the turbulent structure.

[0005] Advantages of the present invention.

[0006] Compared to the prior art, the heat sink having the features of the independent claim has the advantage that the heat sink has a different heat transfer coefficient in the area of ​​the press-in portion than in the area of ​​the heat sink surrounding the press-in portion. The press-in portion deflects the flow of the cooling medium through the cooling channel locally in a direction perpendicular to the support surface. The heat transfer at the location of the press-in portion is thus improved. At the same time, the flow cross section is locally reduced at the location of the press-in portion. This results in a locally higher speed, which also improves the heat transfer. The heat transfer from the turbulent structure to the cooling medium is thus increased in a targeted manner at the location of the press-in portion. Therefore, the press-in portion can be used to specifically define the area in the heat sink that is characterized by particularly good heat transfer. The press-in portion can be implemented in a targeted manner at the location where the locally increased heat must be removed. Therefore, the heat sink can be easily and flexibly adapted to the requirements of different electrical and / or electronic components by means of the press-in portion.

[0007] The pressure losses that occur due to the press-fit and the deflection of the cooling fluid that is associated therewith, in particular in a direction perpendicular to the bearing surface, are limited to the region in which an increased heat transfer is to be achieved. The pressure losses of the flow of the cooling medium through the cooling body are therefore increased only insignificantly by the local press-fit. An optimum can thus be achieved in the conflict of objectives between increased heat transfer for better heat dissipation and simultaneously low pressure losses that result from the design of the turbulent structure.

[0008] Further advantageous embodiments and improvements of the invention are possible by means of the features specified in the dependent claims.

[0009] According to an advantageous embodiment, it is provided that the heat sink is designed for cooling a further electrical and / or electronic component, wherein a further bearing surface for bearing the further electrical and / or electronic component is formed on the heat sink, wherein the cooling channel has a further turbulent section, wherein a further turbulent structure is arranged in the further turbulent section, wherein at least one further locally defined press-in is formed in the further turbulent structure. The shape and / or size of the press-in can be adapted to the corresponding requirements of the assigned electrical and / or electronic component and also to one another. The coolant flows in the cooling channel from the inlet opening through the turbulent section and then through the further turbulent section of the cooling channel to the outlet opening. The press-in and the further press-in can achieve proportional compensation of the lateral heating of the coolant. Thus, the further electrical and / or electronic component at the further bearing surface can be cooled by the heat sink, for example, with a higher heat transfer than the electrical and / or electronic component at the bearing surface.

[0010] According to an advantageous embodiment, it is provided that the turbulence structure and the further turbulence structure are designed integrally as sections of a turbulator. Thus, the two turbulence structures can be produced from one plate. The turbulator can be introduced as a component into the cooling channel and fastened there.

[0011] According to an advantageous embodiment, it is provided that the turbulence structure and / or the further turbulence structure has a periodically repeating structure, in particular a wave-shaped structure, wherein the structure is interrupted by an indentation and / or by a further indentation. In particular, the entire turbulator can have the same periodically repeating structure. The two turbulence structures can then be manufactured in the same way as one another. The two turbulence structures then dissipate heat in the same way via the same structure. The heat transfer coefficient can thus be determined solely by the size of the respective indentations.

[0012] According to an advantageous embodiment, it is provided that the indentation is formed on the side of the turbulence structure facing away from the contact surface and / or that the further indentation is formed on the side of the further turbulence structure facing away from the further contact surface.

[0013] According to an advantageous embodiment, it is provided that the cooling body comprises at least one base plate and at least one cover plate, wherein the support surface and / or the further support surface is formed on the cover plate, wherein the base plate is formed in particular as a deep-drawn plate with a deepening, wherein the cover plate covers the deepening in the base plate, so that cooling channels are formed in the deepening of the base plate between the base plate and the cover plate. A cooling body that is easy to manufacture is thus achieved in a compact design. Turbulence structures formed by the deformed plate can be integrated particularly easily and well into such a cooling body.

[0014] According to an advantageous embodiment, it is provided that the indentation extends over the entire width of the turbulence structure and / or that the further indentation extends over the entire width of the further turbulence structure.

[0015] According to an advantageous embodiment, it is provided that the press-in portion has a smaller cross-section in a plane parallel to the support surface than another press-in portion in the same plane and / or that the press-in portion has a smaller maximum cross-section in a plane perpendicular to the support surface than another press-in portion in a plane perpendicular to the support surface. The press-in portion in the turbulent section is then smaller than another press-in portion in another turbulent section. The turbulent structure then has different heat transfer coefficients. The coolant flows through the other turbulent section after the turbulent section. The coolant is therefore already hotter in the other turbulent section and can only output a sufficiently large amount of heat to the coolant through the larger other press-in portion. As a result, a higher heat transfer and therefore better warming is achieved in the other turbulent section, while a reduced heat transfer is achieved in the turbulent section.

[0016] Furthermore, according to the invention, an electrical and / or electronic device is proposed, which comprises a heat sink and an electrical and / or electronic component with at least one heat-generating component, wherein the electrical and / or electronic component bears against a support surface of the heat sink and is connected to the heat sink, wherein the turbulence structure is arranged directly below the first electrical and / or electronic component and / or the press-fit is arranged directly below the heat-generating component. The heat transfer coefficient can then be increased precisely at the locations where an increased heat input into the heat sink occurs, and the heat can be locally dissipated particularly well to the coolant. In contrast, in other regions, the heat transfer coefficient is not increased and the pressure of the coolant is not reduced.

[0017] Furthermore, according to the invention, an electrical and / or electronic device is proposed, comprising: a heat sink; and an electrical and / or electronic component with at least one heat-generating component; and a further electrical and / or electronic component with at least one further heat-generating component, wherein the electrical and / or electronic component bears against a support surface of the heat sink on the heat sink and is connected to the heat sink, wherein the further electrical and / or electronic component bears against a further support surface of the heat sink on the heat sink and is connected to the heat sink, wherein the turbulence structure is arranged directly below the first electrical and / or electronic component and / or the press-in is arranged directly below the heat-generating component, wherein the further turbulence structure is arranged directly below the further electrical and / or electronic component and / or the further press-in is arranged directly below the further heat-generating component. The heat absorption along the cooling channel can be easily set by the shape, size, number and position of the press-in compared to the shape, size, number and position of the further press-in. A uniform temperature can then be set within each of the electrical and / or electronic components and between two electrical and / or electronic components. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Embodiments of the invention are shown in the drawings and explained in more detail in the following description.

[0019] Figure 1 A schematic cross section of an electrical and / or electronic device is shown in the region of a support surface perpendicular to the flow direction of the coolant through the cooling channels.

[0020] Figure 2 In a plane perpendicular to the support surface, the flow direction of the coolant through the cooling channel is shown. Figure 1 a schematic cross section of an electrical and / or electronic device,

[0021] Figure 3 A schematic cross section of a first exemplary embodiment of a heat sink is shown in a plane parallel to the support surface.

[0022] Figure 4 A schematic cross section of a second exemplary embodiment of a heat sink is shown in a plane parallel to the support surface.

[0023] Figure 5 A diagram of an exemplary embodiment of a turbulence structure is shown before the indentation is introduced. DETAILED DESCRIPTION

[0024] exist Figure 1 and Figure 2 1 shows different views of a schematically illustrated electrical and / or electronic device 100. Figure 1 , a cross section is shown perpendicular to the bearing surface 31 and perpendicular to the flow direction of the coolant through the cooling channel 5 . Figure 2 The cross section in φ is perpendicular to the bearing surface 31 and extends along the flow direction of the coolant through the cooling channel 5 . Figure 1 The cross section is perpendicular to Figure 2 Cross-sectional stretching in .

[0025] The electrical and / or electronic device 100 comprises a heat sink 1 having support surfaces 31, 32 for electrical and / or electronic components 41, 42. The electrical and / or electronic components 41, 42 each bear against one of the support surfaces 31, 32 and are connected to the respective support surface 31, 32. The heat sink 1 is provided for cooling the electrical and / or electronic component 41 and the further electrical and / or electronic component 42.

[0026] The electrical and / or electronic components 41, 42 include, for example, power circuits. This may involve power circuits of hybrid vehicles or electric vehicles, such as inverter structures or converter structures. The electrical and / or electronic components 41, 42 may be configured as power modules, for example. The electrical and / or electronic components 41, 42 may include, for example, carrier substrates with conductor tracks. Heat-generating components 46, 47, such as power semiconductors, are arranged on the carrier substrate. The heat-generating components 46, 47 may be configured, in particular, as power semiconductors. The maximum waste heat in the electrical and / or electronic components 41, 42 occurs locally at the corresponding heat-generating components 46, 47. The heat-generating components 46, 47 together with the carrier substrate form an electronic device unit. The carrier substrate may be, for example, an AMB-power substrate or a DBC-power substrate. The electrical and / or electronic components 41, 42 have a bottom side, which is connected to the corresponding support surfaces 31, 32. The bottom side of the electrical and / or electronic components 41 , 42 can be, for example, the bottom side of the carrier substrate. The bottom side of the electrical and / or electronic components 41 , 42 can consist of copper, for example.

[0027] During operation of the electrical and / or electronic components 41, 42, heat is generated, which is dissipated to the heat sink 1. For this purpose, the electrical and / or electronic components 41, 42 are arranged on the support surfaces 31, 32 of the heat sink 1, for example, on the cover plate 3 of the heat sink 1. The electrical and / or electronic components 41, 42 are fastened, in particular soldered or sintered, to the support surfaces 31, 32 of the heat sink 1. One or more layers for fastening and thermally connecting the electrical and / or electronic components 41, 42 to the heat sink 1 can be arranged between the heat sink 1 and the electrical and / or electronic components 41, 42. The electrical and / or electronic components 41, 42 can be soldered, for example, to the support surfaces 31, 32 of the heat sink 1. A copper coating is provided on the support surfaces 31, 32 of the cover plate 3. As in the illustrated embodiment, on the heat sink 1, a plurality of, for example, three, electrical and / or electronic components 41, 42 can be arranged, for example, next to each other on the support surfaces 31, 32 of the heat sink 1. Each of the electrical and / or electronic components 41, 42 is then thermally connected to the heat sink 1 and fastened thereto. Here, each of the electrical and / or electronic components 41, 42 rests on the support surfaces 31, 32, which are in particular flat, on the heat sink 1 and is fastened thereto.

[0028] As in the embodiment shown in the drawings, the cooling body 1 can be composed of plate parts stacked one above the other and connected to each other, for example, by brazing. In the present embodiment, the cooling body 1 includes at least one base plate 2 and at least one cover plate 3. The cover plate 3 forms the outer wall of the cooling body 1 together with the base plate 2. The base plate 2 forms the lower side of the cooling body 1. The cover plate 3 forms the upper side of the cooling body 1. The base plate 2 and / or the cover plate 3 can be composed of a material with high thermal conductivity, for example, metal, for example, aluminum. The base plate 2 and / or the cover plate 3 can be a plate, for example. The base plate 2 and / or the cover plate 3 have a constant thickness, for example. The thickness is also referred to as the thickness d of the plate used to make the base plate 2 and / or the cover plate 3. The base plate 2 and the cover plate 3 can have the same thickness or different thicknesses, for example.

[0029] The bottom plate 2 is configured as a deep-drawn part, for example. One or more deepenings 20 can be configured in the bottom plate 2. The bottom plate 2 is configured substantially in a pot-shaped manner. The cover plate 3 is arranged on the bottom plate 2 in such a way that the deepening 20 in the bottom plate 2 is shielded by the cover plate 3. The bottom plate 2 and the cover plate 3 are arranged to each other in such a way that a space in which the cooling channel 5 extends is formed by the deepening 20. The edge 25 of the bottom plate 2, for example, configured in a plane, is at least partially connected to the edge 35 of the cover plate 3. The bottom plate 2 and the cover plate 3 or, for example, another plate member, for example, abut against each other at their edges and are connected to each other, for example, brazed. Thus, a closed space in which the cooling channel 5 extends is formed. The edge 25 of the bottom plate 2, for example, surrounds the deepening 20 in the bottom plate 2. The edge 25 of the bottom plate 2 is placed on the edge 35 of the cover plate 3, for example, directly or with one or more intermediate plates or intermediate layers placed in between. The edge 25 of the bottom plate 2 is firmly connected to the edge 35 of the cover plate 3, especially brazed. The base plate 2 and the cover plate 2 can be connected to one another, for example, by means of a brazing process.

[0030] In addition, the cooling body 1 comprises an inlet opening 8, through which a cooling medium can be supplied to the cooling channel 5 in the cooling body 1. In addition, the cooling body 1 comprises an outlet opening 9, through which a cooling medium can flow out of the cooling channel 5 and the cooling body 1. The cooling medium can be water, for example. The inlet opening 8 and / or the outlet opening 9 can be formed, for example, by openings in the base plate 2 and / or the cover plate 3. For example, an inlet sleeve can be arranged or constructed at the inlet opening 8. The inlet sleeve can be, for example, an independent component composed of aluminum, which is, for example, cylindrically constructed. The inlet sleeve can be fastened to the inlet opening 8 by means of a brazing connection. Similarly, a discharge sleeve can be arranged or constructed at the discharge opening 9. The discharge sleeve can be, for example, an independent component composed of aluminum, which is, for example, cylindrically constructed. The discharge sleeve can be fastened to the discharge opening 9 by means of a brazing connection, for example. These sleeves can be joined, for example, in the same step as other components of the cooling body 1 that are connected to each other by brazing. A coolant flow of a coolant can flow through the cooling channel 5 from the inlet opening 8 to the outlet opening 9 .

[0031] The cooling channel 5 includes a turbulent section 51 and a further turbulent section 52. The cooling medium can flow into the cooling channel 5 through the inlet opening 8 of the cooling body 1, and then flow out of the cooling channel 5 of the cooling body 1 through the turbulent section 51 of the cooling channel 5, and then through the further turbulent section 52 of the cooling channel 5, and then through the outlet opening 9 of the cooling body 1. The turbulent sections 51, 52 are regions of the cooling channel 5 that are arranged one after another with respect to the flow direction of the cooling medium through the cooling channel 5. The turbulent section 51 is assigned to the support surface 31. The further turbulent section 52 is assigned to the further support surface 32. The cooling channel 5 is configured to pass the cooling medium guided through the cooling body 1. The cooling channel 5 in the cooling body 1 extends in the cooling body 1 from the inlet opening 8 of the cooling body 1 through the turbulent section 51 and then through the further turbulent section 52 to the outlet opening 9 of the cooling body 1. Perpendicularly to the flow direction of the coolant through the cooling channel 5 , the cooling channel 5 has the same cross section in the turbulence section 51 as in the further turbulence section 52 .

[0032] In addition, the cooling body 1 includes a turbulence structure 61 and a further turbulence structure 62. The turbulence structures 61, 62 are configured, for example, as sub-regions of a turbulator 60 that is configured in one piece. However, the turbulence structures 61, 62 can also be configured as components that are separated from each other. The turbulence structures 61, 62 are used to increase and specifically control the heat transfer coefficient of the heat absorbed by the cooling body 1 to the cooling medium. The desired heat transfer coefficient can then be achieved by the turbulence structures 61, 62. The turbulence structures 61, 62 are configured, for example, as turbulence interlayers that are inserted into the cooling channel 5 of the cooling body 1. The turbulence structures 61, 62 are arranged between the cover plate 3 and the base plate 2. The turbulence structures 61, 62 can extend completely through the cooling channel 5 from the cover plate 3 to the base plate 2. In particular, the turbulence structures 61, 62 are in indirect and / or direct heat-conducting contact with the base plate 2 and with the cover plate 3. The turbulence structures 61, 62 are fastened to the cover plate 3 and / or the base plate 2, for example, by means of a brazing process. The turbulence structure 61 is flowed through by the coolant parallel to the support surface 31. The other turbulence structure 62 is flowed through by the coolant parallel to the other support surface 32. The turbulence structure 61 is arranged in the turbulence section 51 of the cooling channel 5. The other turbulence structure 62 is arranged in the other turbulence section 52 of the cooling channel 5. The turbulence structure 61 is used to conduct the heat absorbed by the support surface 31 of the cooling body 1 to the cooling medium in the turbulence section 51. The other turbulence structure 62 is used to conduct the heat absorbed by the other support surface 32 of the cooling body 1 to the cooling medium in the other turbulence section 52. The other turbulence structure 62 is arranged in the other turbulence section 52 of the cooling channel 5. The turbulence structure 61 conducts the heat generated by the electrical and / or electronic structural component 41 to the cooling medium in the turbulence section 51. The further turbulence structure 62 dissipates the heat generated by the further electrical and / or electronic component 42 to the cooling medium in the further turbulence section 51. The turbulence structure 61 is arranged on the side of the cover plate 3 facing away from the support surface 31. The further turbulence structure 62 is arranged on the side of the cover plate 3 facing away from the further support surface 32. The cover plate 3 separates the turbulence structure 61 from the electrical and / or electronic component 41. The cover plate 3 separates the further turbulence structure 62 from the further electrical and / or electronic component 42. The support surface 31 is arranged between the turbulence structure 61 and the electrical and / or electronic component 41. The further support surface 32 is arranged between the further turbulence structure 62 and the further electrical and / or electronic component 42. The turbulence structure 61 and / or the further turbulence structure 62 are connected to the cover plate 3 and / or the base plate 2.

[0033] The turbulence structures 61, 62 are formed by deformed plates. The turbulence structures 61, 62 are formed by heat-conducting materials, such as metals, such as aluminum. The turbulence structures 61, 62 each have a surface-enlarged, flow-guiding and heat-transferring structure. The turbulence structure 61 has a periodically repeating structure for guiding the coolant through the cooling channel 5. The turbulence structure 61 and the other turbulence structure 62 have the same periodically repeating structure. The other turbulence structure 62 has another periodically repeating structure for guiding the coolant through the cooling channel 5. The turbulence structures 61, 62 are made, for example, by a stamping or roll forming process. The periodically repeating structure guides the coolant through the cooling channel, in particular only parallel to the support surface 31. When the coolant flows through the cooling channel 5, in particular only deflects in a direction parallel to the support surface 31 and / or the support surface 31. The turbulence structures 61, 62 can, for example, have a wavy or stepped structure. The turbulence structures 61, 62 can, for example, not have a recess. The turbulence structures 61, 62 can be constructed in a closed manner and have no recesses, for example. The turbulence structures 61, 62 can be constructed as corrugated plates, for example. The turbulence structures 61, 62 can form channels in the cooling channel, in particular together with the base plate 2 and the cover plate 3, which guide the cooling medium outside the press-fit portion parallel to the support surface and just pass it through the guide cooling channel 5. However, the turbulence structures 61, 62 can also form channels in the cooling channel, in particular together with the base plate 2 and the cover plate 3, which guide the cooling medium outside the press-fit portion parallel to the support surface and in a corrugated manner through the cooling channel 5. Figure 5 Such turbulent structures 61, 62 are shown in FIG. Figure 5 Only the course of the turbulence structures 61 , 62 outside the indentations 66 , 67 is shown.

[0034] At least one locally defined indentation 66 is formed in the turbulence structure 61. The locally defined indentation 66 deflects the coolant flowing through the cooling channel 5 in a direction perpendicular to the support surface 61. At least one further locally defined indentation 67 is formed in the further turbulence structure 62. The further locally defined indentation 66 deflects the coolant flowing through the cooling channel 5 in a direction perpendicular to the further support surface 62. This deflection in a direction perpendicular to the support surface generates eddies in the coolant.

[0035] The periodically repeating structure of the turbulence structure 61 outside the indentation is interrupted by a locally defined indentation 66 in the turbulence structure 61. The periodically repeating structure of the further turbulence structure 62 outside the further indentation 67 is interrupted by a further locally defined indentation 67 in the further turbulence structure 62. The height of the turbulence structure 61 measured perpendicularly to the support surface 31 is reduced in the region of the indentation 66 by a locally defined indentation 66 in the turbulence structure 61. The height of the further turbulence structure 62 measured perpendicularly to the support surface 32 is reduced in the region of the further indentation 67 by a further locally defined indentation 67 in the further turbulence structure 62. The indentation 66 is preferably constructed on the side of the turbulence structure 61 facing away from the support surface 31. The further indentation 67 is preferably constructed on the side of the further turbulence structure 62 facing away from the further support surface 32. However, the indentations 66, 67 can also be formed on both sides of the turbulence structures 61, 62. Figure 5 As shown in FIG. 1 , the impressions 66 , 67 are produced by embossing an already shaped plate.

[0036] The height of each of the press-ins 66, 67 is advantageously in the range of 10-50% of the height of the corresponding turbulence structure 61, 62 outside the press-ins 66, 67. The height is measured perpendicularly to the support surface 31 or the further support surface 32. The height of each of the press-ins 66, 67 is advantageously in the range of 10-50% of the spacing of the base plate 2 from the cover plate 3 in the region of the turbulence structures 61, 62. The gap generated by the press-ins 66, 67 between the base plate 2 and the respective turbulence structure 61, 62 is closed by bending the base plate 2 into the respective press-ins 66, 67. The press-ins 66, 67 can have, for example, a circular, in particular a semicircular, cross section in a plane perpendicular to the support surface 31 and / or the further support surface 32. However, the press-in portions 66, 67 can also have, for example, an angular, in particular a triangular, cross section in a plane perpendicular to the support surface 31 and / or the further support surface 32. The cross section is defined by the turbulence structures 61, 62 and the base plate 2. The press-in portions 66, 67 can, for example, extend over the entire width of the respective turbulence structure 61, 62. In this case, the press-in portions 66, 67 can extend perpendicularly to the flow direction of the coolant through the cooling channel 5 and parallel to the respective support surface 31, 32.

[0037] The turbulence structure 61 is arranged, for example, directly below the first electrical and / or electronic component 41. The press-in 66 can be arranged directly below the heat-generating component element 46.

[0038] Likewise, the further turbulence structure 62 can be arranged directly below the further electrical and / or electronic component 42. The further press-in 67 can be arranged directly below the further heat-generating component element 47. In the context of the present application, an "object" is understood to be a press-in 66, 67, an electrical and / or electronic component 41, 42, a turbulence structure 61, 62 or a heat-generating component element 46, 47. If a first object is arranged directly below a second object, this is understood in the context of the present application to mean that the first object and the second object are arranged relative to one another in such a way that a perpendicular projection of the first object onto the plane of the support surfaces 31, 32 has at least one intersection with a perpendicular projection of the second object onto the plane of the support surfaces 31, 32.

[0039] like Figure 2 As shown in , the press-in portion 51 can have a smaller cross section in a plane parallel to the support surface 31 than the other press-in portion 52 in the same plane. The press-in portion 51 can also have a smaller maximum cross section in a plane perpendicular to the support surface 31 than the other press-in portion 52 in a plane perpendicular to the other support surface 32.

[0040] It goes without saying that still further embodiments and combinations of the embodiments shown are possible.

Claims

1. A heat sink (1) for cooling an electrical and / or electronic component (41), the heat sink having a support surface (31) for supporting the electrical and / or electronic component (41), wherein: A cooling channel (5) is formed in the cooling body (1), which extends through the cooling body (1) from an inlet opening (8) of the cooling body (1) to an outlet opening (9) of the cooling body (1) and through which a cooling medium can flow. The cooling channel (5) has a turbulence section (51), a turbulence structure (61) is arranged in the turbulence section (51), the turbulence structure (61) is formed by a deformed plate, It is characterized in that at least one locally defined indentation (66) is formed in the turbulence structure (61).

2. The cooling body according to claim 1, characterized in that The heat sink (1) is designed for cooling a further electrical and / or electronic component (42), wherein a further bearing surface (32) for supporting the further electrical and / or electronic component (42) is formed on the heat sink (1), wherein the cooling channel (5) has a further turbulence section (52), wherein a further turbulence structure (62) is arranged in the further turbulence section (52), wherein at least one further locally defined press-in portion (67) is formed in the further turbulence structure (62).

3. The cooling body according to claim 2, characterized in that The turbulence structure (61) and the further turbulence structure (62) are designed integrally as sections of a turbulator (60).

4. The cooling body according to any one of claims 2 or 3, characterized in that The turbulence structure (61) and / or the further turbulence structure (62) have a periodically repeating structure, in particular a wave-like structure, wherein the structure is interrupted by the indentation (66) and / or by the further indentation (67).

5. The cooling body according to any one of claims 2 to 4, characterized in that The indentation (66) is formed on the side of the turbulence structure (61) facing away from the contact surface (31), and / or the further indentation (67) is formed on the side of the further turbulence structure (62) facing away from the further contact surface (32).

6. The cooling body according to any one of the preceding claims, characterized in that The cooling body (1) comprises at least one base plate (2) and at least one cover plate (3), wherein the support surface (31) and / or the further support surface (32) are formed on the cover plate (3), wherein the base plate (2) is in particular formed as a deep-drawn plate with a deepening (20), wherein the cover plate (3) covers the deepening (20) in the base plate (2), so that the cooling channel (5) is formed in the deepening (20) of the base plate (2) between the base plate (2) and the cover plate (3).

7. The cooling body according to any one of claims 2 to 6, characterized in that The indentation (66) extends over the entire width of the turbulence structure (61) and / or the further indentation (67) extends over the entire width of the further turbulence structure (62).

8. The cooling body according to any one of claims 2 to 7, characterized in that The press-in portion (51) has a smaller cross-section in a plane parallel to the support surface (31) than the other press-in portion (52) in the same plane, and / or the press-in portion (51) has a smaller maximum cross-section in a plane perpendicular to the support surface (31) than the other press-in portion (52) in a plane perpendicular to the other support surface (32).

9. An electrical and / or electronic device (100) comprising a cooling body (1) according to any one of the preceding claims and an electrical and / or electronic component (41) having at least one heat-generating component element (46), wherein: The electrical and / or electronic component (41) rests on the heat sink (1) against a contact surface (31) of the heat sink (1) and is connected to the heat sink (1). Therein, the turbulence structure (61) is arranged directly below the first electrical and / or electronic component (41) and / or the press-in (66) is arranged directly below the heat-generating component element (46).

10. An electrical and / or electronic device (100), comprising: The cooling body (1) according to any one of claims 2 to 8; and an electrical and / or electronic component (41) with at least one heat-generating component element (46); and a further electrical and / or electronic component (42) with at least one further heat-generating component element (47), wherein the electrical and / or electronic component (41) bears against a support surface (31) of the heat sink (1) and is connected to the heat sink (1), wherein the further electrical and / or electronic component (42) bears against a further support surface (32) of the heat sink (1) and is connected to the heat sink (1), wherein the turbulence structure (61) is arranged directly below the first electrical and / or electronic component (41) and / or the press-in portion (66) is arranged directly below the heat-generating component element (46), wherein the further turbulence structure (62) is arranged directly below the further electrical and / or electronic component (42) and / or the further press-in portion (67) is arranged directly below the further heat-generating component element (47).

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