A power amplifier module base for low temperature and an optimization design method thereof

Abstract

The application discloses a power amplification module base for low temperature and an optimization design method thereof, relates to the technical field of laser components, and comprises a seat plate, a fixing assembly is arranged on the top of the seat plate near one side, a floating assembly is arranged on the top of the seat plate near the other side, a first heat sink is fixedly installed on the top of the fixing assembly, a second heat sink is fixedly installed on the top of the floating assembly, a gain medium is installed between the first heat sink and the second heat sink, the first heat sink and the second heat sink are fixedly connected with the gain medium in an indium soldering mode, the fixing assembly fixes the first heat sink on the seat plate, and the floating assembly enables the second heat sink to slightly move in the X direction, the Y direction and the Z direction relative to the seat plate. The application solves the problem that the existing base is affected by tensile stress in a low-temperature environment and causes the power amplification module to be open-welded, and the base is suitable for fixing and supporting the power amplification module in a low-temperature environment, is uniformly stressed, and prevents local stress concentration.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of laser components, in particular to a power amplification module base for low temperature and an optimized design method thereof. BACKGROUND

[0002] The power amplification module is the core component of the laser, which is used to absorb the energy brought by the excitation source to realize the function of power amplification. The power amplification module includes a gain medium, a heat sink and a base, wherein the base mainly plays a supporting role, and is usually fixed on the heat sink to ensure that the power amplification module has good stability and reliability. The gain medium in the power amplification module is excited to radiate and generate heat, and the heat accumulation will reduce the laser spot quality and service life, so a cooling medium is needed to cool it down so that it can be used normally. For low-power and small-energy power amplification modules, water is often used as the cooling medium; while for high-power and large-energy power amplification modules, liquid nitrogen is often used as the cooling medium.

[0003] At present, the base of the high-power and large-energy power amplification module generally adopts an integrated structure of stainless steel material, which is connected with the left and right heat sinks by bolts. This structure is uniformly stressed and has good rigidity at room temperature, providing good support for the power amplification module. However, in a low-temperature environment, the left and right heat sinks will expand and contract, and the integrated base will stretch the heat sink. Since the heat sink and the gain medium are connected by indium solder, the stretching stress will cause the power amplification module to open the solder and cannot be used normally. To solve this problem, relevant practitioners usually connect one side of the heat sink to the base by bolts and connect the other side of the heat sink to the base by indium solder. Although this solves the problem of stretching stress on both sides of the heat sink in a low-temperature environment, the indium material is prone to stretching fatigue under repeated high and low temperature conditions, which causes the heat sink and the base to open the solder, resulting in a cantilever structure between the power amplification module and the base. Figure 1 As shown in FIG. 1, it is a stress cloud diagram of the power amplification module after the indium solder is opened. It can be seen that in a low-temperature environment, the overall stress of the power amplification module is uneven and the local stress is too large, which will cause the bending resistance to decrease, resulting in the deviation of the optical path, the decrease of the power and the spot quality, and the stability and reliability of the power amplification module cannot be guaranteed. Therefore, a technical solution for the power amplification module base in a low-temperature environment is needed. SUMMARY

[0004] The purpose of the present application is to provide a power amplification module base for low temperature and an optimized design method thereof to solve the above problems.

[0005] The present application achieves the above-mentioned purpose by the following technical solutions:

[0006] The utility model provides a power amplification module base for low temperature, including seat board, fixed component is arranged on the top of seat board near one side position, floating component is arranged on the top of seat board near the other side position, first heat sink is fixedly installed on the top of fixed component, second heat sink is fixedly installed on the top of floating component, gain medium is installed between first heat sink and second heat sink, and first heat sink and second heat sink are fixedly connected with gain medium through indium soldering mode, the fixed component fixes first heat sink on seat board, and floating component makes second heat sink can move slightly in X direction, Y direction and Z direction relative to seat board, the fixed component includes connecting plate and first insulating block, first insulating block is placed on the top of seat board near one side position, connecting plate is placed on the top of first insulating block, first through -hole is arranged on the corresponding position of seat board, first insulating block and connecting plate, and seat board, first insulating block, connecting plate and first heat sink are fixedly connected through first bolt.

[0007] Preferably, the floating component includes a connecting plate, a second insulating block, and a top plate. The top plate is placed on the top of the seat plate near the other side position. The second insulating block is placed on the top of the top plate. The connecting plate is placed on the top of the second insulating block. First through-holes are arranged on the corresponding positions of the top plate, the second insulating block, and the connecting plate. The top plate, the second insulating block, the connecting plate, and the second heat sink are fixedly connected through first bolts. An installation slot is arranged on the bottom of the seat plate corresponding to the position of the top plate. A bottom plate is fittedly arranged in the installation slot. A first placement slot is arranged on one side of the top plate near the bottom position. The first placement slot is in communication with the bottom of the top plate. The first placement slot is distributed in a linear shape along the width direction of the top plate. A plurality of balls are arranged in the first placement slot. The balls are in a gap-fitted state with the first placement slot. There are a plurality of first placement slots, which are evenly distributed on the top plate. A baffle is fixedly arranged on the side surface of the top plate near the first placement slot. A through slot is arranged on the seat plate corresponding to the position of the first placement slot. A second placement slot is arranged on the top of the bottom plate corresponding to the position of the through slot. A sliding table is arranged in the second placement slot. The sliding table transversely passes through the through slot, and the top surface of the sliding table is in contact with the balls. Second through-holes are arranged on the corresponding positions of the seat plate and the bottom plate. A disc spring is arranged in the second through-hole of the bottom plate. The bottom plate is installed on the seat plate by passing the second bolt through the disc spring.

[0008] Preferably, the cross section of the first placement slot is in the shape of three-quarters of a circle with a notch.

[0009] Preferably, the length of the first placement slot is greater than the sum of the diameters of the plurality of balls.

[0010] Preferably, the width of the sliding platform is greater than the diameter of the ball.

[0011] Preferably, the top of the connecting plate of the fixed assembly is at the same level as the top of the connecting plate of the floating assembly.

[0012] Preferably, the top of the connecting plate of the fixed assembly is provided with protrusions, the protrusions are multiple and parallel to each other, and the top of the protrusions is in close contact with the bottom of the first heat sink; the top of the connecting plate of the floating assembly is provided with protrusions, the protrusions are multiple and parallel to each other, and the top of the protrusions is in close contact with the bottom of the second heat sink.

[0013] Preferably, the seat plate is made of iron-nickel alloy material; the connecting plate, the first insulating block and the second insulating block are made of quartz material.

[0014] Preferably, the seat plate is provided with material reduction grooves corresponding to the bottom position of the fixed assembly, and the material reduction grooves are evenly distributed on the seat plate.

[0015] An optimization design method of a power amplification module base at low temperature, comprising the following steps:

[0016] (1) Construct the geometric models of the gain medium, the first heat sink, the second heat sink, the fixed assembly and the floating assembly by using three-dimensional modeling software;

[0017] (2) Import all the geometric models constructed in step (1) into ANSYS software, select Static Structural and Steady State Thermal modules, and perform static structural analysis and steady state temperature field analysis on them;

[0018] (3) Define the physical property parameters of the gain medium, the first heat sink, the second heat sink, the fixed assembly and the floating assembly;

[0019] (4) Import all the constructed geometric models into HyperMesh software, adopt the idea of two-dimensional to three-dimensional mesh division according to the structure of the geometric model, divide the geometric model by the ALL Quad method; set the three-dimensional mesh refinement method according to the size of the geometric model, and check the three-dimensional mesh common node condition, through the setting of the mesh size, ensure that the mesh layer of each part of the geometric model meets the calculation requirements;

[0020] (5) According to the connection relationship between the gain medium, the first heat sink, the second heat sink, the fixed assembly and the different parts of the floating assembly, the boundary conditions are set, the contact mode between the first heat sink, the second heat sink and the gain medium is set as Bonded contact, the contact mode between the ball of the floating assembly and the first placing groove and the ball and the sliding table is set as Frictional contact, the connection mode between the second bolt and the bottom plate is set as Non-separation, and the rest is the default contact mode; the temperature values of the first heat sink and the second heat sink are set as the temperature of the cooling liquid used, the surface of the power amplification module in contact with the surrounding environment is set as a heat convection surface, and different convection heat transfer coefficients are set according to the results obtained from experiments;

[0021] (6) Displacement probes are arranged on the gain medium, the surface of the seat plate and the upper edge position of the second heat sink, respectively;

[0022] (7) Program Controlled is used for solving calculation, and the temperature field result is introduced into statics structure as an initial condition; the support of the seat plate is set as a fixed constraint, a bolt force vertically upward is added to the first through hole of the seat plate, and a standard gravity vertically downward is added to the whole geometric model; the weak spring option in the calculation condition is set as Program Controlled, linear method is used for calculation, and the deformation result of the geometric model under the low-temperature condition is obtained by the deformation amount of the geometric model after the calculation is completed;

[0023] (8) Steps (1) to (7) are repeated, the deformation results under different temperatures are calculated, the structure is optimized according to the deformation amount suffered by the power amplification module, iterative calculation is repeatedly carried out, the calculation result is optimized, the adjustment range of the floating assembly is adjusted according to the final deformation result, and the number of disc springs and the pre-tightening force of the second bolt are adaptively selected in combination with the thickness of the single disc spring.

[0024] The power amplification module base of the application has the advantages that: (1) the base solves the problem that the existing base is affected by tensile stress under a low-temperature environment to cause the power amplification module to be opened, and the base is suitable for fixing and supporting the power amplification module under a low-temperature environment, the stress is uniform, and local stress concentration is prevented; (2) the floating assembly enables the second heat sink to move slightly in X, Y and Z directions relative to the seat plate, so that the tensile stress generated by the thermal expansion and contraction of the two heat sinks under a low-temperature environment can be balanced, and the adjustment amount in each direction is controllable; (3) the power amplification module base is simple to install, convenient to use, high in stability and reliability; and (4) the optimization design method of the power amplification module base can effectively calculate the deformation amount suffered by the power amplification module, the base structure is repeatedly optimized through the numerical simulation calculation result, and the design cost is saved. BRIEF DESCRIPTION OF DRAWINGS

[0025] Figure 1 Force diagram of power amplification module of prior art;

[0026] Figure 2 First perspective view of overall structure of the present application;

[0027] Figure 3 Second perspective view of overall structure of the present application;

[0028] Figure 4 Third perspective view of overall structure of the present application;

[0029] Figure 5 Perspective view of fixed assembly and floating assembly of the present application;

[0030] Figure 6 Sectional view of floating assembly of the present application;

[0031] Figure 7 Perspective view of top plate of the present application;

[0032] Figure 8 Perspective view of seat plate of the present application;

[0033] Figure 9 Perspective view of bottom plate of the present application;

[0034] Figure 10 Force diagram of power amplification module of the present application.

[0035] Explanation of reference numerals:

[0036] 1, power amplification module; 11, gain medium; 12, first heat sink; 13, second heat sink; 14, seat plate; 141, first through hole; 142, mounting groove; 143, through groove; 144, second through hole; 145, material reducing groove;

[0037] 21, fixed assembly; 211, connecting plate; 2111, protrusion; 212, first insulating block;

[0038] 22, floating assembly; 221, second insulating block; 222, top plate; 2221, first placing groove; 223, bottom plate; 2231, second placing groove; 224, baffle; 225, sliding table; 226, ball;

[0039] 31, first bolt; 32, second bolt;

[0040] 4, disc spring. DETAILED DESCRIPTION

[0041] The present application will be further described below in conjunction with the drawings:

[0042] As Figure 2 , Figure 4 andFigure 5 As shown in the drawings, the application provides a power amplifier module base for low temperature, which comprises a seat plate 14, a fixed assembly 21 arranged on one side of the top of the seat plate 14, and a floating assembly 22 arranged on the other side of the top of the seat plate 14. A first heat sink 12 is fixedly installed on the top of the fixed assembly 21, and a second heat sink 13 is fixedly installed on the top of the floating assembly 22. A gain medium 11 is installed between the first heat sink 12 and the second heat sink 13, and the first heat sink 12 and the second heat sink 13 are fixedly connected with the gain medium 11 by indium soldering. The fixed assembly 21 fixes the first heat sink 12 on the seat plate 14, and the floating assembly 22 allows the second heat sink 13 to move slightly in the X direction, the Y direction and the Z direction relative to the seat plate 14. The fixed assembly 21 comprises a connecting plate 211 and a first insulating block 212. The first insulating block 212 is placed on one side of the top of the seat plate 14, and the connecting plate 211 is placed on the top of the first insulating block 212. First through holes 141 are arranged on the seat plate 14, the first insulating block 212 and the connecting plate 211 in corresponding positions. The seat plate 14, the first insulating block 212, the connecting plate 211 and the first heat sink 12 are fixedly connected by first bolts 31. Specifically, a flat washer is sleeved on the first bolt 31, then the first bolt 31 passes through the first through holes 141 of the seat plate 14, the first insulating block 212 and the connecting plate 211 in sequence, and finally screws into the mounting hole at the bottom of the first heat sink 12 to realize the fixed connection of the seat plate 14, the first insulating block 212, the connecting plate 211 and the first heat sink 12.

[0043] As shown in the drawings, Figure 3 , Figure 4 , Figure 5 and Figure 6 In this embodiment, the floating assembly 22 comprises a connecting plate 211, a second insulating block 221 and a top plate 222. The top plate 222 is placed on the other side of the top of the seat plate 14, the second insulating block 221 is placed on the top of the top plate 222, and the connecting plate 211 is placed on the top of the second insulating block 221. First through holes 141 are arranged on the top plate 222, the second insulating block 221 and the connecting plate 211 in corresponding positions. The top plate 222, the second insulating block 221, the connecting plate 211 and the second heat sink 13 are fixedly connected by first bolts 31. Specifically, a flat washer is sleeved on the first bolt 31, then the first bolt 31 passes through the first through holes 141 of the top plate 222, the second insulating block 221 and the connecting plate 211 in sequence, and finally screws into the mounting hole at the bottom of the second heat sink 13 to realize the fixed connection of the top plate 222, the second insulating block 221, the connecting plate 211 and the second heat sink 13. The first bolt 31 not only has the function of positioning and fastening, but also can improve the shear resistance of the fixed assembly 21 and the floating assembly 22. An installation groove 142 is arranged on the bottom of the seat plate 14 corresponding to the position of the top plate 222, and a bottom plate 223 is arranged in the installation groove 142. As shown in the drawings, Figure 6 and Figure 7As shown, the first placing groove 2221 is provided on one side of the top plate 222 close to the bottom position. The first placing groove 2221 is in communication with the bottom of the top plate 222, and the first placing groove 2221 is in linear distribution along the width direction of the top plate 222. The cross section of the first placing groove 2221 is in the shape of three-quarters of a circle with a notch, and the notch is located at the bottom position of the top plate 222. The bottom of the ball 226 extends to the outside of the first placing groove 2221 through the notch and is in contact with the top surface of the sliding table 225. A plurality of balls 226 are arranged in the first placing groove 2221, and the balls 226 are in a gap fit state with the first placing groove 2221. The length of the first placing groove 2221 is greater than the sum of the diameters of the plurality of balls 226, that is, the number of balls 226 can be adjusted according to the length of the first placing groove 2221, but it is necessary to ensure that there is a mutual movement amount between any two adjacent balls 226. There are a plurality of first placing grooves 2221 and they are uniformly distributed on the top plate 222. In this embodiment, the number of first placing grooves 2221 is four. Figure 5 As shown, the side of the top plate 222 close to the first placing groove 2221 is fixedly provided with a baffle 224. The baffle 224 is fixedly installed on the side of the top plate 222 by screws, and the baffle 224 can prevent the balls 226 in the first placing groove 2221 of the top plate 222 from falling out. Figure 6 、 Figure 8 and Figure 9 As shown, the seat plate 14 is provided with a through groove 143 corresponding to the position of the first placing groove 2221, and the top of the bottom plate 223 is provided with a second placing groove 2231 corresponding to the position of the through groove 143. The sliding table 225 is arranged in the second placing groove 2231, and the sliding table 225 crosses the through groove 143 and its top surface is in contact with the ball 226. The width of the sliding table 225 is greater than the diameter of the ball 226. When the first heat sink 12 and the second heat sink 13 are subjected to tensile stress due to thermal expansion and cold contraction in a low-temperature environment, the ball 226 can move and adjust in the X direction and the Y direction on the sliding table 225 in a small amount. The second through hole 144 is arranged on the corresponding position of the seat plate 14 and the bottom plate 223, and the disc spring 4 is arranged in the second through hole 144 of the bottom plate 223. The bottom plate 223 is installed on the seat plate 14 by the second bolt 32 passing through the disc spring 4. When the first heat sink 12 and the second heat sink 13 are subjected to tensile stress due to thermal expansion and cold contraction in a low-temperature environment, the ball 226 can extrude the sliding table 225 to move and adjust in the Z direction in a small amount.

[0044] As shown, Figure 2 、 Figure 3 and Figure 5 In this embodiment, when the power amplification module 1 is not subjected to stress, the top of the connecting plate 211 of the fixed assembly 21 and the top of the connecting plate 211 of the floating assembly 22 are in the same horizontal plane.

[0045] As shown, Figure 2 and Figure 5As shown in the drawings, in the embodiment, the top of the connecting plate 211 of the fixed assembly 21 is fixedly provided with protrusions 2111, the protrusions 2111 are multiple and parallel to each other, and the top of the protrusions 2111 is in close contact with the bottom of the first heat sink 12. The top of the connecting plate 211 of the floating assembly 22 is fixedly provided with protrusions 2111, the protrusions 2111 are multiple and parallel to each other, and the top of the protrusions 2111 is in close contact with the bottom of the second heat sink 13. The protrusions 2111 reduce heat transfer when the fixed assembly 21 is in direct contact with the first heat sink 12 and the floating assembly 22 is in direct contact with the second heat sink 13, and make them bear force uniformly.

[0046] As shown in the drawings, Figure 5 In the embodiment, the seat plate 14 is made of iron-nickel alloy material, specifically, the seat plate 14 can be made of 4J36 low-expansion iron-nickel alloy. The connecting plate 211, the first insulating block 212 and the second insulating block 221 are all made of quartz material, specifically, the connecting plate 211, the first insulating block 212 and the second insulating block 221 can be made of JGS1 quartz.

[0047] As shown in the drawings, Figure 4 In the embodiment, the seat plate 14 is provided with material reduction grooves 145 at positions corresponding to the bottom of the fixed assembly 21, the material reduction grooves 145 are multiple and uniformly distributed on the seat plate 14. The material reduction grooves 145 can save the use amount of production raw materials and reduce the weight of the seat plate 14.

[0048] As shown in the drawings, Figure 10 As shown in the force stress diagram of the power amplification module 1, it can be seen that the power amplification module 1 bears force uniformly in a low-temperature environment, and the stability and reliability of the power amplification module 1 are high.

[0049] The application further provides an optimization design method for a power amplification module base under low temperature, comprising the following steps: (1) constructing geometric models of a gain medium 11, a first heat sink 12, a second heat sink 13, a fixed assembly 21 and a floating assembly 22 through three-dimensional modeling software; (2) importing all the geometric models constructed in step (1) into ANSYS software, selecting StaticStructural and Steady State Thermal modules, and performing static structural analysis and steady state temperature field analysis; (3) defining physical property parameters of the gain medium 11, the first heat sink 12, the second heat sink 13, the fixed assembly 21 and the floating assembly 22; (4) importing all the constructed geometric models into HyperMesh software, adopting a two-dimensional-to-three-dimensional mesh division idea according to the geometric model structure, performing mesh division on the geometric models through an ALL Quad mode; setting a three-dimensional mesh refinement mode according to the geometric model size, and checking three-dimensional mesh common node conditions, so as to ensure that the geometric model satisfies the calculation requirements through the setting of the mesh size; (5) setting boundary conditions according to the connection relationship between different parts of the gain medium 11, the first heat sink 12, the second heat sink 13, the fixed assembly 21 and the floating assembly 22, setting the contact mode between the first heat sink 12 and the second heat sink 13 and the gain medium 11 as Bonded contact, setting the contact mode between the ball 226 of the floating assembly 22 and the first placing groove 2221 and the ball 226 and the sliding table 225 as Frictional contact, setting the connection mode between the second bolt 32 and the bottom plate 223 as Non-separation, and setting the rest as a default contact mode; setting the temperature values of the first heat sink 12 and the second heat sink 13 as the temperature of the cooling liquid used, setting the surface of the power amplification module 1 in contact with the surrounding environment as a heat convection surface, and setting different convection heat transfer coefficients according to the experimental results; (6) setting displacement amount probes on the gain medium 11, the surface of the seat plate 14 and the upper edge position of the second heat sink 13, respectively; (7) using Program Controlled to solve and calculate, importing the temperature field results into static structural analysis as initial conditions, setting the support of the seat plate 14 as a fixed constraint, adding a vertically upward bolt force at the first through hole 141 of the seat plate 14, and adding a vertically downward standard gravity to the whole geometric model; setting the weak spring option in the calculation conditions as Program Controlled, using a linear method to calculate, and checking the deformation results of the geometric model under low temperature conditions through the deformation amount of the geometric model after the calculation is completed.(8) repeating steps (1) to (7), calculating the deformation results at different temperatures, optimizing the structure according to the deformation of the power amplifier module 1, repeatedly iterating the calculation, optimizing the calculation results, adjusting the adjustment range of the floating assembly 22 according to the final deformation results, and adaptively selecting the number of disc springs 4 and customizing the pre-tightening force of the second bolt 32 in combination with the thickness of the individual disc springs 4.

[0050] The above merely describes the preferred embodiments of the present application, and is not intended to limit the patent scope of the present application. Those skilled in the art should understand that various changes, modifications, replacements and deformations can be made to the embodiments without departing from the principles and purposes of the present application, and all should be covered within the protection scope of the present application. The protection scope of the present application is defined by the claims and their equivalents.

Claims

1. A base for a power amplifier module used at low temperatures, characterized in that: The system includes a base plate, a fixing component located near one side of the top of the base plate, and a floating component located near the other side of the top of the base plate. A first heat sink is fixedly mounted on the top of the fixing component, and a second heat sink is fixedly mounted on the top of the floating component. A gain medium is installed between the first and second heat sinks, and both the first and second heat sinks are fixedly connected to the gain medium by indium solder. The fixing component fixes the first heat sink to the base plate, and the floating component allows the second heat sink to move slightly relative to the base plate in the X, Y, and Z directions. The fixing component includes a connecting plate and a first insulating block. The first insulating block is placed near one side of the top of the base plate, and the connecting plate is placed on top of the first insulating block. First through holes are provided at corresponding positions on the base plate, the first insulating block, and the connecting plate. The base plate, the first insulating block, the connecting plate, and the first heat sink are fixedly connected by first bolts. The floating component includes a connecting plate, a second insulating block, and a top plate. The top plate is placed near the other side of the top of the base plate, and the second insulating block is placed on top of the top plate. The connecting plate is placed on top of the second insulating block. The second insulating block and the connecting plate each have a first through hole at corresponding positions. The top plate, the second insulating block, the connecting plate, and the second heat sink are fixedly connected by first bolts. The bottom of the base plate has a mounting groove corresponding to the position of the top plate, and a bottom plate is fitted into the mounting groove. A first placement groove is provided on one side of the top plate near the bottom, and the first placement groove is connected to the bottom of the top plate. The first placement groove is arranged in a straight line along the width direction of the top plate, and a plurality of ball bearings are provided in the first placement groove, with the ball bearings in a clearance fit with the first placement groove. The first placement slot has multiple slots and is evenly distributed on the top plate. A baffle is fixedly installed on the side of the top plate near the first placement slot. A through slot is provided on the seat plate corresponding to the position of the first placement slot. A second placement slot is provided on the top of the bottom plate corresponding to the position of the through slot. A slide is provided in the second placement slot. The slide passes through the through slot and its top surface contacts the ball. A second through hole is provided at a corresponding position on both the seat plate and the bottom plate. A disc spring is provided in the second through hole of the bottom plate. The bottom plate is installed on the seat plate by passing a second bolt through the disc spring.

2. A power amplifier module base for low-temperature applications according to claim 1, characterized in that: The cross-section of the first placement slot is a three-quarter circle with a notch.

3. A power amplifier module base for low-temperature applications according to claim 1, characterized in that: The length of the first placement groove is greater than the sum of the diameters of the balls.

4. A power amplifier module base for low-temperature applications according to claim 1, characterized in that: The width of the slide is greater than the diameter of the ball bearing.

5. A power amplifier module base for low-temperature applications according to claim 1, characterized in that: The top of the connecting plate of the fixed component and the top of the connecting plate of the floating component are on the same horizontal plane.

6. A power amplifier module base for low-temperature applications according to claim 1, characterized in that: The top of the connecting plate of the fixed component is fixedly provided with a protrusion, there are multiple protrusions and they are distributed parallel to each other, and the top of the protrusion is in contact with the bottom of the first heat sink; the top of the connecting plate of the floating component is fixedly provided with a protrusion, there are multiple protrusions and they are distributed parallel to each other, and the top of the protrusion is in contact with the bottom of the second heat sink.

7. A power amplifier module base for low-temperature applications according to claim 1, characterized in that: The base plate is made of iron-nickel alloy; the connecting plate, the first insulating block and the second insulating block are all made of quartz.

8. A power amplifier module base for low-temperature applications according to claim 1, characterized in that: The base plate is provided with a material reduction groove at the bottom position corresponding to the fixing component, and there are several material reduction grooves evenly distributed on the base plate.

9. An optimized design method for a power amplifier module base at low temperatures as described in any one of claims 1-8, characterized in that: Includes the following steps: (1) Construct geometric models of the gain medium, the first heat sink, the second heat sink, the fixed component and the floating component using 3D modeling software; (2) Import all the geometric models constructed in step (1) into ANSYS software, select the Static Structural and Steady State Thermal modules, and perform static structural analysis and steady-state temperature field analysis on them. (3) Define the physical properties of the gain medium, the first heat sink, the second heat sink, the fixed component, and the floating component; (4) Then import all the constructed geometric models into HyperMesh software. Based on the structure of the geometric model, adopt the idea of ​​meshing from two-dimensional to three-dimensional and mesh the geometric model through ALL Quad. Set the three-dimensional mesh refinement method according to the size of the geometric model, and check the common nodes of the three-dimensional mesh. By setting the mesh size, ensure that the number of mesh layers in each part of the geometric model meets the calculation requirements. (5) Set boundary conditions according to the connection relationship between different parts of the gain medium, the first heat sink, the second heat sink, the fixed component and the floating component. Set the contact mode between the first heat sink, the second heat sink and the gain medium to Bonded contact. Set the contact mode between the ball of the floating component and the first placement groove and the ball and the slide to Frictional contact. Set the connection mode between the second bolt and the base plate to Non-separation. Set the default contact mode for the rest. Set the temperature values ​​of the first heat sink and the second heat sink to the temperature of the coolant used. Set the surface of the power amplifier module in contact with the surrounding environment to the heat convection surface. Set different convection heat transfer coefficients according to the experimental results. (6) Displacement probes are respectively set at the gain medium, the surface of the base plate, and the upper edge of the second heat sink; (7) Use Program Controlled to solve the problem and import the temperature field results into the static structure as initial conditions. Set the support of the seat plate as a fixed constraint, add a vertically upward bolt force at the first through hole of the seat plate, and add a vertically downward standard gravity force to the overall geometric model. Set the weak spring option in the calculation conditions to ProgramControlled, use the linear method for calculation, and after the calculation is completed, check the deformation results of the geometric model under low temperature conditions by the deformation amount of the geometric model. (8) Repeat steps (1) to (7) to calculate the deformation results at different temperatures. Based on the deformation of the power amplifier module, optimize the structure, iterate the calculation repeatedly, optimize the calculation results, adjust the adjustment range of the floating component based on the final deformation results, and combine the thickness of a single disc spring to adaptively select the number of disc springs and the preload of the customized second bolt.

Images