Electronic device

Abstract

The invention discloses an electronic device. The electronic equipment comprises a first shell, a second shell and a hinge assembly, the hinge assembly comprises a hinge body and a hinge cover which are connected with each other, and the first shell and the second shell are rotationally connected through the hinge body, so that the electronic equipment is switched between an unfolded state and a folded state; wherein the first shell is provided with a first signal receiving and transmitting part, the second shell is provided with a second signal receiving and transmitting part, the surface of the hinge cover is provided with a metasurface structure, and a signal sent by the first signal receiving and transmitting part is received by the second signal receiving and transmitting part after being reflected by the metasurface structure. And / or a signal sent by the second signal transceiving part is received by the first signal transceiving part after being reflected by the metasurface structure, and the metasurface structure is arranged on the surface of the hinge cover, so that communication connection between the first shell and the second shell is realized.

Description

Technical Field

[0001] The present application relates to the technical field of electronic equipment, and in particular to an electronic equipment. Background Art

[0002] With the development of science and technology, various electronic devices have become indispensable products in daily life and production. Among them, foldable electronic devices have gradually become a development trend due to their advantages of large display area and easy portability.

[0003] In the related art, since the two parts of the folding device are separated by a hinge assembly, the two parts usually transmit signals between the two parts through a cross-axis flexible circuit board. When the folding device switches between the unfolded and folded states, the flexible circuit board is stretched or squeezed as the body rotates. After multiple cycles, the flexible circuit board is easily damaged, thereby affecting the service life of the folding device. Summary of the invention

[0004] An embodiment of the present application provides an electronic device that can solve the problem in the prior art that the reliability of the transmission mechanism between the two parts of the body of a foldable electronic device is insufficient, resulting in poor reliability of the communication connection between the two parts.

[0005] An embodiment of the present application provides an electronic device, including a first shell, a second shell and a hinge assembly, the hinge assembly including a hinge body and a hinge cover connected to each other, the first shell and the second shell are rotatably connected through the hinge body so that the electronic device can switch between an unfolded state and a folded state; wherein, the first shell is provided with a first signal transceiver unit, the second shell is provided with a second signal transceiver unit, the surface of the hinge cover is provided with a metasurface structure, the signal sent by the first signal transceiver unit is received by the second signal transceiver unit after being reflected by the metasurface structure, and / or the signal sent by the second signal transceiver unit is received by the first signal transceiver unit after being reflected by the metasurface structure.

[0006] In this way, the electronic device provided in the embodiment of the present application includes a first shell, a second shell and a hinge assembly, the hinge assembly includes a hinge body and a hinge cover, the first shell and the second shell are rotatably connected to the hinge body so that the electronic device can switch between an unfolded state and a folded state, and the hinge cover covers the hinge body to provide protection for the hinge body; the first shell is provided with a first signal transceiver part, the second shell is provided with a second signal transceiver part, and the surface of the hinge cover is provided with a metasurface structure, the signal sent by the first signal transceiver part is received by the second signal transceiver part after being reflected by the metasurface structure, and / or the signal sent by the second signal transceiver part is received by the first signal transceiver part after being reflected by the metasurface structure, so as to realize the communication connection between the first shell and the second shell.

[0007] Therefore, in an embodiment of the present application, a metasurface structure is provided on the surface of the hinge cover so that a signal sent by the first signal transceiver unit of the first shell can be received by the second signal transceiver unit of the second shell after being reflected by the metasurface structure, and / or a signal sent by the second signal transceiver unit of the second shell can be received by the first signal transceiver unit of the first shell after being reflected by the metasurface structure. This eliminates the need to provide a flexible circuit board between the first shell and the second shell to transmit signals, thereby improving the problem of reliability of communication connection between the first shell and the second shell affected by fatigue damage caused by multiple bending of the foldable electronic device. Furthermore, the difficulty of providing a metasurface structure on the surface of the hinge cover is lower than the difficulty of matching the flexible circuit board with the first shell and the second shell, which helps to reduce the difficulty of preparing the foldable electronic device. BRIEF DESCRIPTION OF THE DRAWINGS

[0008] In order to more clearly illustrate the technical solution of the embodiments of the present application, the following is a brief introduction to the drawings required for use in the embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0009] Figure 1 A schematic diagram of the structure of an electronic device according to some embodiments of the present application;

[0010] Figure 2 A partial structural schematic diagram of an electronic device according to some embodiments of the present application;

[0011] Figure 3 This is a flow chart of the control method of the electronic device in this application;

[0012] Figure 4 A schematic diagram of the structure of an electronic device according to some other embodiments of the present application;

[0013] Figure 5 A partial structural schematic diagram of an electronic device according to some embodiments of the present application;

[0014] Figure 6 A partial structural schematic diagram of an electronic device according to some other embodiments of the present application;

[0015] Figure 7 for Figure 6 Sectional view at AA in the middle;

[0016] Figure 8 A partial structural schematic diagram of an electronic device according to some other embodiments of the present application;

[0017] Fig. 9 for Figure 8 Sectional view at the middle BB;

[0018] Fig.10A partial structural schematic diagram of an electronic device according to some other embodiments of the present application;

[0019] Fig.11 for Fig.10 Cross-sectional view at CC.

[0020] Description of Figure Numbers:

[0021] 100. Electronic equipment;

[0022] 110, hinge assembly; 111, hinge body; 112, hinge cover; 1121, metasurface structure; 1122, electromagnetic unit; 1123, insulating part; 1124, conductive part; 1125, shielding part; 1126, thermal insulation part;

[0023] 120, first housing; 121, first signal transceiver; 1211, first transceiver; 1212, first antenna; 1213, first modem; 1214, processor;

[0024] 130, second housing; 131, second signal transceiver; 1311, second transceiver; 1312, second antenna; 1313, second modem; 1314, functional device;

[0025] 140. Controller;

[0026] 150. Angle sensor. DETAILED DESCRIPTION

[0027] The embodiments of the present application will be described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present application, and should not be construed as limitations on the present application. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in the field without making creative work are within the scope of protection of the present application.

[0028] The term "first" or "second" in the specification and claims of this application may include one or more of the features explicitly or implicitly. In the description of this application, unless otherwise specified, "plurality" means two or more. In addition, "and / or" in the specification and claims means at least one of the connected objects, and the character " / " generally means that the objects connected before and after are in an "or" relationship.

[0029] In the description of the present application, it should be understood that the terms "longitudinal", "lateral", "upper", "lower", "front", "middle", "back", "left", "right", "clockwise", "counterclockwise", etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0030] In the description of this application, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0031] See also Figure 1 and Figure 2 , Figure 1 A schematic diagram of the structure of an electronic device according to some embodiments of the present application; Figure 2 This is a schematic diagram of a portion of the structure of an electronic device according to some embodiments of the present application.

[0032] like Figure 1 and Figure 2 As shown, an embodiment of the present application provides an electronic device 100, which includes a first shell 120, a second shell 130 and a hinge assembly 110, wherein the hinge assembly 110 includes a hinge body 111 and a hinge cover 112 connected to each other, and the first shell 120 and the second shell 130 are rotatably connected through the hinge body 111 so that the electronic device 100 can switch between an unfolded state and a folded state; wherein the first shell 120 is provided with a first signal transceiver unit 121, the second shell 130 is provided with a second signal transceiver unit 131, and the surface of the hinge cover 112 is provided with a metasurface structure 1121, and the signal sent by the first signal transceiver unit 121 is received by the second signal transceiver unit 131 after being reflected by the metasurface structure 1121, and / or the signal sent by the second signal transceiver unit 131 is received by the first signal transceiver unit 121 after being reflected by the metasurface structure 1121.

[0033] The electronic device 100 provided in the embodiment of the present application includes a first shell 120, a second shell 130 and a hinge assembly 110, the hinge assembly 110 includes a hinge body 111 and a hinge cover 112, the first shell 120 and the second shell 130 are rotatably connected to the hinge body 111 so that the electronic device 100 can be switched between an unfolded state and a folded state, and the hinge cover 112 covers the hinge body 111 to provide protection for the hinge body 111; the first shell 120 is provided with a first signal transceiver 121, the second shell 130 is provided with a second signal transceiver 131, and the surface of the hinge cover 112 is provided with a super surface structure 1121, and the signal sent by the first signal transceiver 121 is reflected by the super surface structure 1121. The signal received by the second signal transceiver unit 131, and / or the signal sent by the second signal transceiver unit 131 is received by the first signal transceiver unit 121 after being reflected by the super-surface structure 1121, so as to realize the communication connection between the first shell 120 and the second shell 130, thereby eliminating the need to set a flexible circuit board between the first shell 120 and the second shell 130 to transmit signals, thereby improving the problem of the reliability of the communication connection between the first shell 120 and the second shell 130 being affected by fatigue damage caused by multiple bending of the foldable electronic device 100, and the difficulty of setting the super-surface structure 1121 on the surface of the hinge cover 112 is lower than the difficulty of matching the flexible circuit board with the first shell 120 and the second shell 130, which helps to reduce the difficulty of preparing foldable electronic devices.

[0034] The embodiment of the present application discloses an electronic device 100, which is a foldable electronic device 100. The electronic device 100 in the embodiment of the present application includes but is not limited to a mobile phone, a personal digital assistant (PDA), a tablet computer, a laptop computer, an e-book, and other foldable electronic devices 100.

[0035] The electronic device 100 further includes a flexible screen body, which covers the first shell 120 and the second shell 130. The first shell 120 and the second shell 130 are rotatably connected to the hinge body 111, so that in the foldable electronic device 100, the first shell 120 and the second shell 130 can drive the flexible screen body to fold or unfold.

[0036] The hinge body 111 includes a base and a swing arm assembly. The base is a basic component in the hinge assembly 110, and can be used as a mounting base for other components in the hinge assembly 110, so that the components are connected to each other to form a whole. The hinge cover 112 is connected to the base by means of snap connection, bonding, bolt connection, riveting, etc. The base can be made of a hard material such as metal or plastic, and the base is provided with structures such as slots or holes for connecting with other components, or structures such as slots or holes for installing other components. In actual applications, the specific shape and structure of the base can be determined according to actual conditions, and this document does not limit this.

[0037] The surface of the hinged cover 112 is provided with a metasurface structure 1121, which refers to RIS (Reconfigurable intelligent surface). The intelligent metasurface is a two-dimensional material designed by humans that can dynamically control the propagation characteristics of electromagnetic waves, such as reflection, refraction and scattering. The intelligent metasurface is composed of a large number of sub-wavelength unit structures, each of which can independently control the phase, amplitude and polarization state of the electromagnetic wave. Through external control signals (such as voltage, optical signals, etc.), the characteristics of these units can be adjusted in time, thereby achieving precise control of electromagnetic waves.

[0038] By integrating the metasurface structure 1121 into the hinge cover 112, the electromagnetic waves emitted by one of the first signal transceiver unit 121 and the second signal transceiver unit 131 are reflected by the metasurface structure 1121 at the hinge cover 112 and received by the other, thereby realizing the communication connection between the first shell 120 and the second shell 130.

[0039] See also Figure 3 , Figure 3 This is a flow chart of the control method of the electronic device in this application.

[0040] In some embodiments, Figure 1 and Figure 2As shown, the first housing 120 is further provided with a processor 1214, the first signal transceiver 121 includes a first transceiver 1211 and a first antenna 1212, the first transceiver 1211 is electrically connected to the processor 1214 and the first antenna 1212, the second housing 130 is provided with a functional device 1314, the second signal transceiver 131 includes a second transceiver 1311 and a second antenna 1312, the second transceiver 1311 is electrically connected to the second antenna 1312 and the functional device 1314, wherein the processor 1214 transmits a signal to the first transceiver 1211, the first transceiver 1211 receives the signal and transmits the signal to the first housing 130. The first transceiver 1211 receives the signal through the second antenna 1312 and transmits the signal to the functional device 1314, and / or the functional device 1314 transmits the signal to the second transceiver 1311, the second transceiver 1311 receives the signal and transmits it to the metasurface structure 1121 through the second antenna 1312, the metasurface structure 1121 reflects the signal to the first antenna 1212, the first transceiver 1211 receives the signal through the first antenna 1212 and transmits the signal to the processor 1214.

[0041] In these embodiments, the first transceiver 1211 transmits a signal to the supersurface structure 1121 through the first antenna 1212, the supersurface structure 1121 reflects the signal, and the second transceiver 1311 receives the signal through the second antenna 1312 to achieve communication connection between the first shell 120 and the second shell 130. The combination of the supersurface structure 1121, the first antenna 1212, the second antenna 1312, the first transceiver 1211, and the second transceiver 1311 replaces the RF signal routing arranged in the main and auxiliary bodies in the related technology, which not only helps to reduce the processing difficulty of the equipment, but also reduces the risk of line damage after multiple bending.

[0042] Exemplarily, the first shell 120 is the main body, and a processor 1214 is disposed in the first shell 120. The processor 1214 may be a CPU (Central Processing Unit; central processor 1214), and the second shell 130 is the auxiliary body. The functional device 1314 may be a secondary screen, a speaker or a camera, etc. The processor 1214 of the main body transmits a control signal to the functional device 1314 of the auxiliary body through the metasurface structure 1121, and / or receives a feedback signal from the functional device 1314 of the auxiliary body to achieve communication connection between the main body and the auxiliary body. For the convenience of description, Figure 1 and Figure 4 Only arrows are used to illustrate the process in which the processor 1214 of the main body transmits control signals to the functional device 1314 of the sub-body through the super-surface structure 1121.

[0043] Optionally, the first signal transceiver unit 121 further includes a first modem 1213, the first modem 1213 is electrically connected between the first transceiver 1211 and the processor 1214, the first modem 1213 modulates the digital signal of the processor 1214 onto a carrier, the first transceiver 1211 receives the carrier and transmits it through the first antenna 1212, or the first modem 1213 receives the carrier of the first transceiver 1211, demodulates the carrier into a digital signal and transmits it to the processor 1214;

[0044] The second signal transceiver unit 131 also includes a second modem 1313, which is electrically connected between the second transceiver 1311 and the functional device 1314. The second modem 1313 demodulates the carrier received by the second transceiver 1311 into a control signal and sends it to the functional device 1314, or the second modem 1313 receives a digital signal from the functional device 1314 and modulates the digital signal onto a carrier. The second transceiver 1311 receives the carrier and transmits it through the second antenna 1312.

[0045] For example, Figure 3 As shown, the process of the processor 1214 of the first housing 120 controlling the functional device 1314 of the second housing 130 is as follows:

[0046] S01: The processor 1214 converts the control signal of each functional device 1314 to be controlled into a digital signal sequence, and sends the digital signal sequence to the first modem 1213;

[0047] S02: The first modem 1213 receives a digital signal sequence, modulates the digital signal sequence onto a carrier, and transmits the carrier to the first transceiver 1211;

[0048] S03: The first transceiver 1211 receives the carrier and radiates the signal to the metasurface structure 1121 of the hinge cover 112 through the first antenna 1212;

[0049] S04: the metasurface structure 1121 reflects the signal to the second antenna 1312 , the second transceiver 1311 receives the signal through the second antenna 1312 , and transmits the signal to the second modem 1313 ;

[0050] S05: The second modem 1313 demodulates and restores the control signal in the carrier, and transmits the corresponding control signal to the corresponding functional device 1314, and each functional device 1314 performs a corresponding action.

[0051] In step S01 , if there are signals that need to be controlled simultaneously, a digital signal sequence is generated separately.

[0052] In step S01, the controller 140 obtains the current communication status of the electronic device 100 and selects a frequency band that will not interfere with the current communication frequency band, and the first antenna 1212 radiates the carrier signal in this frequency band. In this step, the frequency band selection can be achieved by calling the interference relationship correspondence table generated by the test during the product development process.

[0053] In step S05 , the second modem 1313 outputs different control signals to the corresponding functional devices 1314 through different input and output ports.

[0054] Optionally, the electronic device 100 also includes a controller 140, which is connected to the supersurface structure 1121. The controller 140 is used to modulate the bias voltage of the supersurface structure 1121 when the supersurface structure 1121 is installed on the hinge cover 112, so that when the folding device is in an unfolded state, the signal radiated by the first antenna 1212 can be reflected to the second antenna 1312. The controller 140 can be a fixed input and output port.

[0055] See also Figure 4 , Figure 4 Schematic diagram of the structure of electronic devices according to other embodiments of the present application.

[0056] In other embodiments, Figure 4 As shown, the electronic device 100 also includes a controller 140, and the metasurface structure 1121 is electrically connected to the controller 140. The controller 140 adjusts the bias voltage of the metasurface structure 1121 according to the angle between the first shell 120 and the second shell 130.

[0057] In these embodiments, the controller 140 can adjust the bias voltage of the metasurface structure 1121 according to the angle between the first shell 120 and the second shell 130, so that when the foldable electronic device 100 is at different folding angles, a reliable communication connection can still be maintained between the first shell 120 and the second shell 130.

[0058] Exemplarily, the controller 140 and the processor 1214 are integrated together, or the controller 140 is a chip independent of the processor 1214 , and the controller 140 adjusts the bias voltage of the metasurface structure 1121 in real time according to the angle between the first shell 120 and the second shell 130 .

[0059] The metasurface structure 1121 is composed of a large number of sub-wavelength unit structures, which usually include diodes. The electromagnetic properties of the unit structures are adjusted by adjusting the bias voltage of the diodes, thereby achieving the purpose of intelligent regulation of electromagnetic waves by the metasurface structure 1121.

[0060] See also Figure 5 , Figure 5This is a schematic diagram of a portion of the structure of an electronic device according to some embodiments of the present application.

[0061] In some embodiments, Figure 4 and Figure 5 As shown, the metasurface structure 1121 includes a plurality of electromagnetic units 1122 , which are arranged in an array. The controller 140 is electrically connected to each electromagnetic unit 1122 , and the controller 140 can adjust the electromagnetic properties of each electromagnetic unit 1122 .

[0062] In these embodiments, the metasurface structure 1121 includes a plurality of electromagnetic units 1122 arranged in an array, and the controller 140 is electrically connected to each electromagnetic unit 1122 to adjust the electromagnetic properties of each electromagnetic unit 1122, which helps to accurately control the reflection direction of electromagnetic waves by the metasurface structure 1121 to improve the communication reliability between the first shell 120 and the second shell 130.

[0063] It should be clear that the electromagnetic unit 1122 here is the "unit structure" in the above embodiment.

[0064] Exemplarily, the electromagnetic unit 1122 includes metal, dielectric and adjustable element, and the adjustable element may be a varactor diode, a positive-intrinsic-negative diode, a PIN diode, etc.

[0065] The controller 140 adjusts the bias voltage of the adjustable element to adjust the electromagnetic properties of the electromagnetic unit 1122, and then the electromagnetic parameters of the incident electromagnetic wave can be changed in a programmable manner, thereby achieving the purpose of intelligent control of the electromagnetic wave. The electromagnetic properties include the voltage, current, impedance, capacitance, polarization and other characteristics of the electromagnetic unit 1122, and the electromagnetic parameters can be phase, amplitude, polarization state, etc.

[0066] Optionally, the plurality of electromagnetic units 1122 are arranged in a rectangular array along the length or width direction of the hinge cover 112; or the plurality of electromagnetic units 1122 are arranged in a circular or annular array. The specific number of the electromagnetic units 1122 can be determined by the user.

[0067] In some embodiments, Figure 4 and Figure 5 As shown, the electronic device 100 also includes an angle sensor 150, which is disposed in the first shell 120 and / or the second shell 130. The angle sensor 150 is used to obtain angle information of the angle between the first shell 120 and the second shell 130. The angle sensor 150 is connected to the controller 140, and the controller 140 adjusts the polarization performance of the electromagnetic unit 1122 according to the angle information.

[0068] In these embodiments, an angle sensor 150 is disposed on the first shell 120 and / or the second shell 130, and the angle sensor 150 can obtain the angle information between the first shell 120 and the second shell 130, so that the controller 140 can accurately adjust the polarization performance of each electromagnetic unit 1122 according to the angle information provided by the angle sensor 150, and adjust the reflection direction of the electromagnetic wave by the metasurface structure 1121, so as to improve the communication reliability between the first shell 120 and the second shell 130.

[0069] The angle sensor 150 is used to obtain the angle information of the angle between the first shell 120 and the second shell 130. The controller 140 adjusts the polarization performance of each electromagnetic unit 1122 according to the angle information, so that the metasurface structure 1121 can match different angle information to adjust the reflection direction of the electromagnetic wave, so that when the first shell 120 and the second shell 130 are at different angles, the metasurface structure 1121 adjusts the electromagnetic wave propagation path according to the angle information, so that the first shell 120 and the second shell 130 maintain a reliable communication connection under different angle states.

[0070] Exemplarily, when the angle between the first shell 120 and the second shell 130 changes to a preset angle, the controller 140 adjusts each electromagnetic unit 1122 to a preset state, and the preset angle range can be between 0° and 180°. Exemplarily, the angle difference between adjacent preset angles can be 1°, 2°, 5°, 10°, etc.

[0071] Optionally, the controller 140 may adjust the electromagnetic unit 1122 by calling different angle information tested during the product development process and data corresponding to the status of each electromagnetic unit 1122 .

[0072] Optionally, the angle sensor 150 may be a potentiometer, a photoelectric encoder, a magnetic encoder, or a Hall effect sensor.

[0073] Optionally, the controller 140 adjusts the polarization performance of the electromagnetic unit 1122, which means that the controller 140 inputs different control signals to the electromagnetic unit 1122. The control signal may be a voltage signal, an electric field signal, a magnetic field signal, an optical signal, a temperature signal, etc., to adjust the polarization performance of each electromagnetic unit 1122, thereby adjusting the polarization state, phase, amplitude and propagation direction of the electromagnetic wave.

[0074] See also Figure 6 and Figure 7 , Figure 6 A partial structural schematic diagram of an electronic device according to some other embodiments of the present application; Figure 7 for Figure 6 Cross-sectional view at AA in the middle.

[0075] In some embodiments, Figure 4, Figure 6 and Figure 7 As shown, the hinge cover 112 includes an insulating portion 1123 and a conductive member 1124 that are connected to each other, the insulating portion 1123 is connected to the hinge body 111 , and the controller 140 is electrically connected to each electromagnetic unit 1122 via the conductive member 1124 .

[0076] In these embodiments, the insulating part 1123 is connected to the hinge body 111 to provide dust blocking and protection for the hinge body 111 and its internal parts, and helps to keep the super surface structure 1121 and the internal devices of the device insulated. The controller 140 is electrically connected to each electromagnetic unit 1122 through the conductive member 1124, and the conductive member 1124 is connected to the insulating part 1123. The insulating part 1123 provides support and protection for the conductive member 1124.

[0077] The controller 140 is connected to each electromagnetic unit 1122 via the conductive member 1124 , so that the controller 140 can adjust the performance of each electromagnetic unit 1122 individually.

[0078] Exemplarily, the conductive member 1124 may be a copper wire, the insulating portion 1123 may be a glass fiber or a resin board or a FR-4 composite material, etc. The conductive member 1124 covers at least a portion of the surface of the insulating portion 1123, or is embedded in the insulating portion 1123. The conductive member 1124 is connected to the controller 140 and each electromagnetic unit 1122. The combination of the conductive member 1124 and the insulating portion 1123 can replace the circuit board of the intelligent super surface structure 1121 in the related technology.

[0079] Optionally, the conductive member 1124 and each electromagnetic unit 1122 are connected by welding. Exemplarily, a port of the conductive member 1124 and a welding point of the electromagnetic unit 1122 are connected by welding.

[0080] Optionally, the insulating portion 1123 and the hinge body 111 are connected by snapping, bolting, bonding or riveting.

[0081] See also Figure 8 and Fig. 9 , Figure 8 A partial structural schematic diagram of an electronic device according to some other embodiments of the present application; Fig. 9 for Figure 8 Cross-sectional view at BB in the middle.

[0082] In some embodiments, Figure 4 , Figure 8 and Fig. 9 As shown, the hinge cover 112 further includes a shielding member 1125 , and the shielding member 1125 is disposed between the insulating portion 1123 and the electromagnetic unit 1122 .

[0083] In these embodiments, by providing a shielding member 1125 between the insulating portion 1123 and the electromagnetic unit 1122 , it helps to reduce energy loss of electromagnetic wave signals, thereby improving the communication connection quality between the first shell 120 and the second shell 130 .

[0084] Optionally, the shielding member 1125 and the conductive member 1124 are spaced apart, or the shielding member 1125 and welding points of the electromagnetic unit 1122 are spaced apart, so that the shielding member 1125 is insulated from the conductive member 1124 and the electromagnetic unit 1122 .

[0085] Optionally, the shielding member 1125 can be a plate-like member or a mesh-like member independent of the insulating portion 1123 and sandwiched between the supersurface structure 1121 and the insulating portion 1123, and the conductive member 1124 is welded and connected to the electromagnetic unit 1122 through the through-hole structure or mesh structure of the plate; or the shielding member 1125 can be a coating or plating arranged on the side of the insulating portion 1123 facing the supersurface structure 1121.

[0086] Optionally, the specific material of the shielding component 1125 can be determined by oneself. Exemplarily, the shielding component 1125 is made of metal, conductive rubber, carbon fiber, etc.

[0087] Exemplarily, the shielding member 1125 is a copper plating layer or a carbon fiber coating disposed on a portion of the surface of the insulating portion 1123 ; or the shielding member 1125 is a copper plate disposed between the insulating portion 1123 and the electromagnetic unit 1122 .

[0088] In some embodiments, Figure 4 , Figure 8 and Fig. 9 As shown, the shielding member 1125 is made of metal, and covers a surface of the insulating portion 1123 facing the conductive member 1124 .

[0089] In these embodiments, the metal shielding member 1125 helps to improve the structural strength of the hinge cover 112 and increase its service life.

[0090] Exemplarily, the shielding member 1125 is a copper plate, a copper plating, an aluminum foil or a copper mesh.

[0091] Optionally, the shielding member 1125 covers a side surface of the insulating portion 1123 facing the conductive member 1124 , and the shielding member 1125 is provided with an avoidance hole structure to connect the electromagnetic unit 1122 and the conductive member 1124 , and the shielding member 1125 and the conductive member 1124 are insulated from each other.

[0092] Optionally, the thickness of the shielding member 1125 is between 0.2 mm and 0.3 mm, which improves the problem that the device is too heavy and affects the user experience due to the shielding member 1125 being too thick, and improves the problem that the shielding member 1125 is too thin and has low structural strength and is easy to be damaged. Exemplarily, the thickness of the shielding member 1125 is 0.2 mm, 0.25 mm, 0.3 mm, etc.

[0093] In some embodiments, Figure 1 , Figure 2 and Fig. 9 As shown, the super surface structure 1121 is arranged on a side of the hinge cover 112 away from the hinge body 111 .

[0094] In these embodiments, the super-surface structure 1121 is arranged on the side of the hinge cover 112 away from the hinge body 111, thereby reducing the risk of the super-surface structure 1121 being squeezed and damaged during the connection between the hinge cover 112 and the hinge body 111, reducing the difficulty of matching the hinge cover 112 and the hinge body 111, and improving the shielding effect of the metal structure in the shell and hinge assembly 110 on electromagnetic waves, which helps to improve the connection quality between the first shell 120 and the second shell 130.

[0095] Specifically, a plurality of electromagnetic units 1122 are arranged in an array on a side of the insulating portion 1123 away from the hinge body 111 , and the shielding member 1125 is arranged between the insulating portion 1123 and the hinge body 111 .

[0096] Exemplarily, the metal structure in the shell may be a metal frame, and the metal structure of the hinge assembly 110 may be a metal swing arm of the hinge. When the folding device is in the unfolded state, the metal structures of the shell and the hinge assembly 110 may block the super-surface structure 1121 located at the hinge cover 112, thereby shielding part of the electromagnetic waves propagating toward the super-surface structure 1121.

[0097] Optionally, along the arrangement direction of the first shell 120 and the second shell 130, the super-surface structure 1121 is centrally arranged on the hinge cover 112 to improve the shielding of the super-surface structure 1121 by the metal structure of the shell and the hinge assembly 110 when the folding device is in the unfolded state.

[0098] See also Fig.10 and Fig.11 , Fig.10 A partial structural schematic diagram of an electronic device according to some other embodiments of the present application; Fig.11 for Fig.10 Cross-sectional view at CC.

[0099] In some embodiments, Figure 1 , Figure 2 , Fig.10 and Fig.11As shown, the electronic device 100 further includes a heat insulating member 1126 , and the heat insulating member 1126 is disposed on a side of the hinge cover 112 facing the hinge body 111 .

[0100] In these embodiments, a heat insulating member 1126 is provided on the side of the hinge cover 112 facing the hinge body 111 to reduce the effect of internal heat of the device on the supersurface structure 1121 , thereby helping to extend the service life of the supersurface structure 1121 .

[0101] Optionally, the heat insulating member 1126 may be in the form of an independent flat plate, or a plating or coating disposed on the surface of the hinge cover 112. Exemplarily, the heat insulating member 1126 covers the side of the hinge cover 112 facing the hinge body 111, increasing the coverage area of ​​the heat insulating member 1126 and improving the heat insulating capacity of the heat insulating member 1126.

[0102] Optionally, the material of the thermal insulation member 1126 can be selected by oneself. Exemplarily, the material of the thermal insulation member 1126 is ceramic fiber, glass fiber, silicone, polyimide, etc.

[0103] The above is only a specific implementation of the present application. Those skilled in the art can clearly understand that for the convenience and simplicity of description, the specific working processes of the systems, modules and units described above can refer to the corresponding processes in the aforementioned method embodiments, and will not be repeated here. It should be understood that the protection scope of the present application is not limited to this. Any technician familiar with the technical field can easily think of various equivalent modifications or replacements within the technical scope disclosed in this application, and these modifications or replacements should be included in the protection scope of this application.

Claims

1. An electronic device, characterized in that: The electronic device comprises a first shell, a second shell and a hinge assembly, wherein the hinge assembly comprises a hinge body and a hinge cover connected to each other, and the first shell and the second shell are rotatably connected through the hinge body so that the electronic device can be switched between an unfolded state and a folded state; wherein, The first shell is provided with a first signal transceiver unit, the second shell is provided with a second signal transceiver unit, and the surface of the hinge cover is provided with a supersurface structure. The signal sent by the first signal transceiver unit is received by the second signal transceiver unit after being reflected by the supersurface structure, and / or the signal sent by the second signal transceiver unit is received by the first signal transceiver unit after being reflected by the supersurface structure.

2. The electronic device according to claim 1, characterized in that: The electronic device also includes a controller, the metasurface structure is electrically connected to the controller, and the controller adjusts the bias voltage of the metasurface structure according to the angle between the first shell and the second shell.

3. The electronic device according to claim 2, characterized in that: The metasurface structure includes a plurality of electromagnetic units arranged in an array. The controller is electrically connected to each of the electromagnetic units, and the controller is capable of adjusting the electromagnetic properties of each of the electromagnetic units.

4. The electronic device according to claim 3, characterized in that: The electronic device further includes an angle sensor, which is disposed on the first shell and / or the second shell, and is used to obtain angle information between the first shell and the second shell. The angle sensor is connected to the controller, and the controller adjusts the polarization performance of the electromagnetic unit according to the angle information.

5. The electronic device according to claim 3, characterized in that: The hinge cover comprises an insulating part and a conductive member connected to each other, the insulating part is connected to the hinge body, and the controller is electrically connected to each of the electromagnetic units through the conductive member.

6. The electronic device according to claim 5, characterized in that: The hinge cover further includes a shielding member disposed between the insulating portion and the electromagnetic unit.

7. The electronic device according to claim 6, characterized in that: The shielding component is made of metal and covers a surface of the insulating portion facing the conductive component.

8. The electronic device according to claim 1, characterized in that: The super surface structure is arranged on a side of the hinge cover away from the hinge body.

9. The electronic device according to claim 8, characterized in that: The electronic device further comprises a heat insulating member, and the heat insulating member is arranged on a side of the hinge cover facing the hinge body.

10. The electronic device according to claim 1, characterized in that: The first housing is further provided with a processor, the first signal transceiver unit includes a first transceiver and a first antenna, and the first transceiver is electrically connected to the processor and the first antenna. The second housing is provided with a functional device, the second signal transceiver unit includes a second transceiver and a second antenna, and the second transceiver is electrically connected to the second antenna and the functional device. The processor transmits a signal to the first transceiver, the first transceiver receives the signal and transmits it to the metasurface structure through the first antenna, the metasurface structure reflects the signal to the second antenna, the second transceiver receives the signal through the second antenna and transmits the signal to the functional device, and / or the functional device transmits a signal to the second transceiver, the second transceiver receives the signal and transmits it to the metasurface structure through the second antenna, the metasurface structure reflects the signal to the first antenna, the first transceiver receives the signal through the first antenna and transmits the signal to the processor.

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