Rigid-flex printed board assembly repair device and use method thereof

Abstract

The invention provides a rigid-flex printed board assembly repair device and a use method thereof. The rigid-flex printed board assembly repair device comprises a base, a supporting frame, a lower limiting unit and an upper limiting unit, the support frame is fixedly connected with the base, the support frame is provided with a first groove and a through hole, and the first groove is used for placing a plurality of printed boards between a first to-be-repaired printed board and a second to-be-repaired printed board; the lower limiting unit is arranged on one side of the supporting frame, the lower limiting unit is connected with the base and can move relative to the base in the X-axis direction, and a second groove used for containing a first printed board to be repaired is formed in the lower limiting unit; the upper limiting unit is arranged on the other side of the supporting frame, the upper limiting unit is connected with the base and can move relative to the base in the X-axis direction and the Z-axis direction, the upper limiting unit is provided with a third groove for containing a second printed board to be repaired, and the second printed board to be repaired penetrates into the other side of the supporting frame from one side of the supporting frame through the through hole.

Description

Technical Field

[0001] The present invention relates to the technical field of printed circuit board rework, and in particular to a rework device for a rigid-flexible printed circuit board assembly and a use method thereof. Background Art

[0002] With the influence of foreign chips and the rapid development of aerospace products, the assembly requirements of high-density printed circuit board components have led to the widespread use of highly integrated, domestically produced high-density devices. As electronic products develop towards high-density miniaturization, aerospace complete machine products have also developed from the original large chassis to small single boards. A new single-board product may have replaced an old model of the complete machine. Therefore, single-board products play an increasingly important role in aerospace subsystems at all levels. In order to ensure its high-quality and highly reliable product characteristics, a lot of work needs to be done in the design, process and production details, and reasonable measures need to be taken to meet the requirements of the development of aerospace electronic products.

[0003] When high-density printed circuit boards are delivered to the testing department after welding, some components may fail and cause product repairs. Since most printed circuit board components are surface-mount leadless package components, it is very easy to cause improper operation during the repair process, which seriously affects the welding reliability and service life of the product. Therefore, in the repair process of electronic assemblies that require high reliability and long life, such components must be protected during repair. At present, this type of rigid-flexible printed circuit board assembly relies on the technical level of the operator during the repair process, and the product is repaired based on experience. The product consistency is poor, and there are risks such as overheating damage and component failure. Summary of the invention

[0004] The invention provides a rework device for a rigid-flex printed circuit board assembly and a use method thereof, which can solve the technical problem of poor rework consistency in the prior art.

[0005] According to one aspect of the present invention, there is provided a rework device for a rigid-flex printed circuit board assembly, the device comprising a base and a support frame, a lower limit unit, and an upper limit unit arranged on the base;

[0006] The support frame is fixedly connected to the base, and the support frame is provided with a first groove and a through hole, wherein the first groove is used to place a plurality of printed boards between the first printed board to be repaired and the second printed board to be repaired;

[0007] The lower limit unit is arranged on one side of the support frame, the lower limit unit is connected to the base, and can move relative to the base along the X-axis direction, and the lower limit unit is provided with a second groove for placing the first printed circuit board to be repaired;

[0008] The upper limit unit is arranged at the other side of the support frame, the upper limit unit is connected to the base, and can move relative to the base along the X-axis direction and the Z-axis direction, the upper limit unit is provided with a third groove for placing the second printed circuit board to be repaired, and the second printed circuit board to be repaired passes through the through hole from one side of the support frame to the other side of the support frame;

[0009] The X-axis direction is a direction perpendicular to the support frame, and the Z-axis direction is a direction perpendicular to the base.

[0010] Preferably, the device also includes a first connecting member, a first sliding rail is provided on the lower limit unit, and a first connecting hole is provided on the base. The first connecting member can slide relatively in the first sliding rail, and the first connecting member passes through the first sliding rail and the first connecting hole to realize the connection between the lower limit unit and the base.

[0011] Preferably, the device also includes a second connecting member, a second slide rail is provided on the upper limit unit, a second connecting hole is provided on the base, the second connecting member can slide relatively in the second slide rail, and the second connecting member passes through the second slide rail and the second connecting hole to realize the connection between the upper limit unit and the base.

[0012] Preferably, the device also includes a threaded column, a first threaded hole is provided on the base, and a second threaded hole corresponding to the position of the first threaded hole is provided on the upper limit unit. One end of the threaded column extends into the first threaded hole and is threadedly connected to the base, and the other end extends into the second threaded hole and is threadedly connected to the upper limit unit. The upper limit unit can be moved along the Z-axis direction by rotating the threaded column.

[0013] Preferably, the depth of the second groove is the same as the thickness of the first printed circuit board to be reworked, and the depth of the third groove is the same as the thickness of the second printed circuit board to be reworked.

[0014] Preferably, the depth of the first groove is greater than the thickness of a plurality of printed boards between the first printed board to be reworked and the second printed board to be reworked.

[0015] Preferably, the shape of the second groove is adapted to the shape of the first printed board to be reworked, the shape of the third groove is adapted to the shape of the second printed board to be reworked, and the shape of the first groove is adapted to the shapes of several printed boards between the first printed board to be reworked and the second printed board to be reworked.

[0016] Preferably, the first printed board to be reworked is connected to the lower limit unit via a pin, the second printed board to be reworked is connected to the upper limit unit via a pin, and several printed boards between the first printed board to be reworked and the second printed board to be reworked are connected to the support frame via pins.

[0017] According to another aspect of the present invention, a method for using a rework device for a rigid-flex printed circuit board assembly is provided, wherein the method uses any of the above-mentioned devices to rework a rigid-flex printed circuit board, and the method comprises:

[0018] Placing the first printed circuit board to be repaired in the rigid-flex printed circuit board assembly into the second groove;

[0019] The flexible wire connected to the first printed board to be repaired is bent so that a plurality of printed boards between the first printed board to be repaired and the second printed board to be repaired are placed in the first groove;

[0020] The flexible wire connected to the second printed board to be repaired is bent, and the second printed board to be repaired is passed through the through hole, so that the second printed board to be repaired is placed in the third groove;

[0021] The first printed circuit board to be repaired and the second printed circuit board to be repaired are repaired in sequence.

[0022] Preferably, after the first printed board to be repaired is placed in the second groove, the method further comprises: fixing the first printed board to be repaired in the second groove by means of a pin;

[0023] After placing the plurality of printed boards between the first printed board to be repaired and the second printed board to be repaired in the first groove, the method further includes: fixing the plurality of printed boards between the first printed board to be repaired and the second printed board to be repaired in the first groove by pins;

[0024] After the second printed board to be repaired is placed in the third groove, the method further includes: fixing the second printed board to be repaired in the third groove by means of pins.

[0025] Compared with the prior art, the technical solution of the present invention has the following beneficial effects:

[0026] 1. During the rework process of the rigid-flex PCB assembly, the upper limit unit is driven by the thread, and the upper limit unit drives the rigid-flex PCB assembly to move. The thread stroke is controllable (the thread connection has high accuracy). By controlling the up and down movement distance, the quality of the product rework and the consistency of the heat during rework can be guaranteed, and the qualified rate of one-time successful rework can be improved;

[0027] 2. The upper limit unit, the lower limit unit, the support frame and the base are connected by threads and are movable components. They can be replaced according to the thickness and size of the rigid-flexible printed circuit board assembly. This tooling is universal and can meet the quality control of the rework of some rigid-flexible printed circuit board assemblies, thereby improving production efficiency and product quality, and at the same time, it can save costs to the maximum extent;

[0028] 3. The rework device is placed on the hot air rework station. During the rework process, it can be kept away from the equipment to ensure the safety of the operator. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] The included drawings are used to provide a further understanding of the embodiments of the present invention, which constitute a part of the specification, are used to illustrate the embodiments of the present invention, and together with the text description, explain the principles of the present invention. Obviously, the drawings in the following description are only some embodiments of the present invention, and for ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0030] Figure 1 A schematic diagram of one side structure of a rework device for a rigid-flex printed circuit board assembly provided according to an embodiment of the present invention is shown;

[0031] Figure 2 A schematic structural diagram of another side of a device for repairing a rigid-flex printed circuit board assembly provided according to an embodiment of the present invention is shown.

[0032] The above drawings include the following reference numerals:

[0033] 1. Base; 2. Support frame; 21. First groove; 22. Through hole; 3. Lower limit unit; 31. Second groove; 32. First slide rail; 4. Upper limit unit; 41. Third groove; 42. Second slide rail. DETAILED DESCRIPTION

[0034] It should be noted that, in the absence of conflict, the embodiments in this application and the features in the embodiments can be combined with each other. The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. The following description of at least one exemplary embodiment is actually only illustrative and is by no means intended to limit the present invention and its application or use. Based on the embodiments in the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0035] It should be noted that the terms used herein are only for describing specific embodiments and are not intended to limit the exemplary embodiments according to the present application. As used herein, unless the context clearly indicates otherwise, the singular form is also intended to include the plural form. In addition, it should be understood that when the terms "comprise" and / or "include" are used in this specification, it indicates the presence of features, steps, operations, devices, components and / or combinations thereof.

[0036] Unless otherwise specifically stated, the relative arrangement of the parts and steps described in these embodiments, numerical expressions and numerical values ​​do not limit the scope of the present invention. At the same time, it should be understood that, for ease of description, the sizes of the various parts shown in the accompanying drawings are not drawn according to the actual proportional relationship. The technology, method and equipment known to ordinary technicians in the relevant field may not be discussed in detail, but in appropriate cases, the technology, method and equipment should be regarded as a part of the authorization specification. In all examples shown and discussed here, any specific value should be interpreted as being merely exemplary, rather than as a limitation. Therefore, other examples of exemplary embodiments may have different values. It should be noted that similar reference numerals and letters represent similar items in the following drawings, so once a certain item is defined in an accompanying drawing, it does not need to be further discussed in subsequent drawings.

[0037] like Figure 1 and 2 As shown, the present invention provides a repair device for a rigid-flexible printed circuit board assembly, the device comprising a base 1 and a support frame 2, a lower limit unit 3, and an upper limit unit 4 arranged on the base 1;

[0038] The support frame 2 is fixedly connected to the base 1, and the support frame 2 is provided with a first groove 21 and a through hole 22, wherein the first groove 21 is used to place a plurality of printed boards between the first printed board to be repaired and the second printed board to be repaired;

[0039] The lower limit unit 3 is arranged at one side of the support frame 2, the lower limit unit 3 is connected to the base 1, and can move relative to the base 1 along the X-axis direction, and the lower limit unit 3 is provided with a second groove 31 for placing the first printed circuit board to be repaired;

[0040] The upper limit unit 4 is arranged at the other side of the support frame 2, the upper limit unit 4 is connected to the base 1, and can move relative to the base 1 along the X-axis direction and the Z-axis direction, and the upper limit unit 4 is provided with a third groove 41 for placing the second printed circuit board to be repaired, and the second printed circuit board to be repaired passes through the through hole 22 from one side of the support frame 2 to the other side of the support frame 2;

[0041] The X-axis direction is a direction perpendicular to the support frame 2 , and the Z-axis direction is a direction perpendicular to the base 1 .

[0042] Compared with the prior art, the present invention has the following beneficial effects:

[0043] 1. During the rework process of the rigid-flex PCB assembly, the upper limit unit 4 is driven by the thread, and the upper limit unit 4 drives the rigid-flex PCB assembly to move. The thread stroke is controllable (the thread connection has high accuracy). By controlling the up and down movement distance, the rework quality of the product and the consistency of heating during rework can be guaranteed, and the qualified rate of one-time successful rework can be improved;

[0044] 2. The upper limit unit 4, the lower limit unit 3, the support frame 2 and the base 1 are connected by threads and are movable components. They can be replaced according to the thickness and size of the rigid-flexible printed circuit board assembly. This tooling is universal and can meet the quality control of the repair of some rigid-flexible printed circuit board assemblies, thereby improving production efficiency and product quality, and at the same time, can save costs to the maximum extent;

[0045] 3. The rework device is placed on the hot air rework station. During the rework process, it can be kept away from the equipment to ensure the safety of the operator.

[0046] In the present invention, the upper limit unit 4 and the lower limit unit 3 are adjusted to ensure that the position to be repaired maintains a certain distance from the hot air repair station, so as to ensure that the printed circuit board assembly can be better heated and heat evenly, and prevent thermal shock from damaging surrounding devices.

[0047] According to one embodiment of the present invention, the base 1 is the base of the entire tooling. While ensuring the overall stability, it is necessary to ensure that the rework device is completely located directly above the hot air rework platform, and can ensure that the printed circuit board assembly to be reworked in the rework device is at a certain height of the air outlet of the hot air rework platform, which is convenient for the subsequent operation of the rework device. The base 1 serves as the overall support of the entire tooling.

[0048] According to an embodiment of the present invention, the support frame 2 is used to support the overall structure of the rework device. The support frame 2 is designed to have a threaded hole at the bottom and a groove on the upper surface for limiting the shape of the rigid-flexible printed circuit board. Under the premise of ensuring the stability of the bottom, the printed circuit board assembly is made to fit perfectly on the rework device as much as possible. A circular hole is opened and threaded at a suitable position at the lower end, and it is installed on the base 1 by screws. The connection between the rigid-flexible printed circuit board assemblies on both sides of the support frame 2 is achieved through the circular hole, ensuring the stability of the overall structure of the rework device in the hot air rework device.

[0049] Among them, a plurality of printed boards between the first printed board to be repaired and the second printed board to be repaired are connected to the support frame 2 through pins to achieve compression and fixation of the plurality of printed boards.

[0050] In addition, in order to better dissipate heat for printed boards that do not need to be reworked, the depth of the first groove 21 of the support frame 2 is greater than the thickness of several printed boards between the first printed board to be reworked and the second printed board to be reworked.

[0051] According to one embodiment of the present invention, the device also includes a threaded column, a first threaded hole is provided on the base 1, and a second threaded hole corresponding to the position of the first threaded hole is provided on the upper limit unit 4. One end of the threaded column extends into the first threaded hole and is threadedly connected to the base 1, and the other end extends into the second threaded hole and is threadedly connected to the upper limit unit 4. The upper limit unit 4 is moved along the Z-axis direction by rotating the threaded column.

[0052] Through the above-mentioned setting, the upper limit unit 4 can be adjusted in height in the Z direction, which is mainly used to compensate for the height difference caused by the size inconsistency of the flexible line position of the printed circuit board assembly, thereby ensuring that the upper limit unit 4 and the lower limit unit 3 can be stably placed in the hot air rework device for rework. The upper limit unit 4 adjusts the height between the control rework position and the air outlet of the hot air rework station to ensure that the upper limit unit 4 can maintain the same distance from the air outlet of the hot air rework station and does not fall into the air outlet, so that the rigid-flexible printed circuit board assembly is evenly heated during the rework process, so as to ensure the rework quality of the rigid-flexible printed circuit board assembly during the rework process.

[0053] According to one embodiment of the present invention, the device also includes a first connecting member, a first slide rail 32 is provided on the lower limit unit 3, and a first connecting hole is provided on the base 1. The first connecting member can slide relatively in the first slide rail 32, and the first connecting member passes through the first slide rail 32 and the first connecting hole to realize the connection between the lower limit unit 3 and the base 1.

[0054] Specifically, the first connecting member can be a screw. The fixed connection of the screw can prevent the lower limit unit 3 from moving randomly in the X-axis direction.

[0055] The first printed circuit board to be repaired is connected to the lower limit unit 3 via a pin to achieve the pressing and fixing of the first printed circuit board to be repaired.

[0056] According to one embodiment of the present invention, the device also includes a second connecting member, a second slide rail 42 is provided on the upper limit unit 4, and a second connecting hole is provided on the base 1. The second connecting member can slide relatively in the second slide rail 42, and the second connecting member passes through the second slide rail 42 and the second connecting hole to realize the connection between the upper limit unit 4 and the base 1.

[0057] Specifically, the second connecting member can be a screw. The fixed connection of the screw prevents the upper limit unit 4 from moving randomly in the X-axis direction.

[0058] The second printed circuit board to be repaired is connected to the upper limit unit 4 via a pin to achieve the pressing and fixing of the second printed circuit board to be repaired.

[0059] According to one embodiment of the present invention, the device also includes a threaded column, a first threaded hole is provided on the base 1, and a second threaded hole corresponding to the position of the first threaded hole is provided on the upper limit unit 4. One end of the threaded column extends into the first threaded hole and is threadedly connected to the base 1, and the other end extends into the second threaded hole and is threadedly connected to the upper limit unit 4. The upper limit unit 4 is moved along the Z-axis direction by rotating the threaded column.

[0060] In addition, the depth of the second groove 31 is the same as the thickness of the first printed circuit board to be repaired, and the depth of the third groove 41 is the same as the thickness of the second printed circuit board to be repaired.

[0061] According to one embodiment of the present invention, the shape of the second groove 31 is adapted to the shape of the first printed board to be reworked, the shape of the third groove 41 is adapted to the shape of the second printed board to be reworked, and the shape of the first groove 21 is adapted to the shapes of several printed boards between the first printed board to be reworked and the second printed board to be reworked.

[0062] In the present invention, the support frame 2, the upper limit unit 4, and the lower limit unit 3 on the rework device can be replaced, which can meet the rework quality assurance requirements of rigid-flexible printed circuit board assemblies of different sizes, so that the same tooling can replace some components to meet the rework requirements of various types of rigid-flexible printed circuit board assemblies, but they need to be replaced in pairs. The size of the grooves in the support frame 2, the upper limit unit 4, and the lower limit unit 3 matches the size of the limit holes of the rigid-flexible printed circuit board placement position, and the end face must be in contact with the surface of the rigid-flexible printed circuit board placement position. At the same time, the difference between the height of the upper limit unit 4 and the thickness of the base 1 is equal to the height of the rework part, and the height of the rework part is determined according to the welding position of the printed circuit board assembly.

[0063] In addition, while ensuring that the upper limit unit 4 can move up and down, the support frame 2 that ensures the placement of the rigid-flexible printed circuit board assembly can limit the forward, backward, left and right movement of the device, avoiding unreliable support of the rigid-flexible printed circuit board assembly and affecting the rework quality.

[0064] The present invention also provides a method for using a rework device for a rigid-flexible printed circuit board assembly, wherein the method uses any of the above-mentioned devices to rework a rigid-flexible printed circuit board, and the method comprises:

[0065] Place the first printed circuit board to be repaired in the rigid-flexible printed circuit board assembly in the second groove 31; fix the first printed circuit board to be repaired in the second groove 31 by pins;

[0066] The flexible wire connected to the first printed board to be repaired is bent so that the printed boards between the first printed board to be repaired and the second printed board to be repaired are placed in the first groove 21; the printed boards between the first printed board to be repaired and the second printed board to be repaired are fixed in the first groove 21 by pins;

[0067] The flexible wire connected to the second printed board to be repaired is bent, and the second printed board to be repaired is passed through the through hole 22, so that the second printed board to be repaired is placed in the third groove 41; the second printed board to be repaired is fixed in the third groove 41 by a pin;

[0068] The first printed circuit board to be repaired and the second printed circuit board to be repaired are repaired in sequence.

[0069] In the present invention, the distance between the first printed circuit board to be reworked and the second printed circuit board to be reworked is adjusted by the upper limit unit 4 and the lower limit unit 3 to ensure that the rigid-flex printed circuit board assembly is directly above the air outlet of the hot air rework equipment on the rework device, thereby ensuring the rework quality.

[0070] In summary, the present invention provides a rework device for a rigid-flex printed circuit board assembly and a method for using the same. Compared with the prior art, the present invention has the following beneficial effects:

[0071] 1. During the rework process of the rigid-flex PCB assembly, the upper limit unit 4 is driven by the thread, and the upper limit unit 4 drives the rigid-flex PCB assembly to move. The thread stroke is controllable (the thread connection has high accuracy). By controlling the up and down movement distance, the rework quality of the product and the consistency of heating during rework can be guaranteed, and the qualified rate of one-time successful rework can be improved;

[0072] 2. The upper limit unit 4, the lower limit unit 3, the support frame 2 and the base 1 are connected by threads and are movable components. They can be replaced according to the thickness and size of the rigid-flexible printed circuit board assembly. This tooling is universal and can meet the quality control of the repair of some rigid-flexible printed circuit board assemblies, thereby improving production efficiency and product quality, and at the same time, can save costs to the maximum extent;

[0073] 3. The rework device is placed on the hot air rework station. During the rework process, it can be kept away from the equipment to ensure the safety of the operator.

[0074] Parts of the present invention that are not described in detail are well known to those skilled in the art.

[0075] In the description of the present invention, it is necessary to understand that the directions or positional relationships indicated by directional words such as "front, back, up, down, left, right", "lateral, vertical, perpendicular, horizontal" and "top, bottom" are usually based on the directions or positional relationships shown in the drawings. They are only for the convenience of describing the present invention and simplifying the description. Unless otherwise specified, these directional words do not indicate or imply that the devices or elements referred to must have a specific direction or be constructed and operated in a specific direction. Therefore, they cannot be understood as limiting the scope of protection of the present invention. The directional words "inside and outside" refer to the inside and outside relative to the contours of each component itself.

[0076] For ease of description, spatially relative terms such as "above", "above", "on the upper surface of", "above", etc. may be used here to describe the spatial positional relationship between a device or feature and other devices or features as shown in the figure. It should be understood that spatially relative terms are intended to include different orientations of the device in use or operation in addition to the orientation described in the figure. For example, if the device in the accompanying drawings is inverted, the device described as "above other devices or structures" or "above other devices or structures" will be positioned as "below other devices or structures" or "below other devices or structures". Thus, the exemplary term "above" can include both "above" and "below". The device can also be positioned in other different ways (rotated 90 degrees or in other orientations), and the spatially relative descriptions used here are interpreted accordingly.

[0077] In addition, it should be noted that the use of terms such as "first" and "second" to limit components is only for the convenience of distinguishing the corresponding components. If not otherwise stated, the above terms have no special meaning and therefore cannot be understood as limiting the scope of protection of the present invention.

[0078] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. For those skilled in the art, the present invention may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. A repair device for rigid-flex printed circuit board assembly, characterized in that: The device comprises a base and a support frame, a lower limit unit and an upper limit unit arranged on the base; The support frame is fixedly connected to the base, and the support frame is provided with a first groove and a through hole, wherein the first groove is used to place a plurality of printed boards between the first printed board to be repaired and the second printed board to be repaired; The lower limit unit is arranged on one side of the support frame, the lower limit unit is connected to the base, and can move relative to the base along the X-axis direction, and the lower limit unit is provided with a second groove for placing the first printed circuit board to be repaired; The upper limit unit is arranged at the other side of the support frame, the upper limit unit is connected to the base, and can move relative to the base along the X-axis direction and the Z-axis direction, the upper limit unit is provided with a third groove for placing the second printed circuit board to be repaired, and the second printed circuit board to be repaired passes through the through hole from one side of the support frame to the other side of the support frame; The X-axis direction is a direction perpendicular to the support frame, and the Z-axis direction is a direction perpendicular to the base.

2. The device according to claim 1, characterized in that The device also includes a first connecting member, a first slide rail is provided on the lower limit unit, and a first connecting hole is provided on the base. The first connecting member can slide relatively in the first slide rail, and the first connecting member passes through the first slide rail and the first connecting hole to realize the connection between the lower limit unit and the base.

3. The device according to claim 1, characterized in that The device also includes a second connecting member, a second slide rail is provided on the upper limit unit, and a second connecting hole is provided on the base. The second connecting member can slide relatively in the second slide rail, and the second connecting member passes through the second slide rail and the second connecting hole to realize the connection between the upper limit unit and the base.

4. The device according to claim 1, characterized in that The device also includes a threaded column, a first threaded hole is provided on the base, and a second threaded hole corresponding to the position of the first threaded hole is provided on the upper limit unit. One end of the threaded column extends into the first threaded hole and is threadedly connected to the base, and the other end extends into the second threaded hole and is threadedly connected to the upper limit unit. The upper limit unit can be moved along the Z-axis direction by rotating the threaded column.

5. The device according to claim 1, characterized in that The depth of the second groove is the same as the thickness of the first printed circuit board to be repaired, and the depth of the third groove is the same as the thickness of the second printed circuit board to be repaired.

6. The device according to claim 1, characterized in that The depth of the first groove is greater than the thickness of a plurality of printed boards between the first printed board to be repaired and the second printed board to be repaired.

7. The device according to claim 1, characterized in that The shape of the second groove matches the shape of the first printed board to be repaired, the shape of the third groove matches the shape of the second printed board to be repaired, and the shape of the first groove matches the shapes of several printed boards between the first printed board to be repaired and the second printed board to be repaired.

8. The device according to claim 1, characterized in that The first printed board to be repaired is connected to the lower limit unit through a pin, the second printed board to be repaired is connected to the upper limit unit through a pin, and several printed boards between the first printed board to be repaired and the second printed board to be repaired are connected to the support frame through pins.

9. A method for using a rework device for a rigid-flex printed circuit board assembly, characterized in that: The method uses the device described in any one of claims 1 to 8 to repair a rigid-flexible printed circuit board, and the method comprises: placing a first printed circuit board to be repaired in a rigid-flexible printed circuit board assembly in a second groove; The flexible wire connected to the first printed board to be repaired is bent so that a plurality of printed boards between the first printed board to be repaired and the second printed board to be repaired are placed in the first groove; The flexible wire connected to the second printed board to be repaired is bent, and the second printed board to be repaired is passed through the through hole, so that the second printed board to be repaired is placed in the third groove; The first printed circuit board to be repaired and the second printed circuit board to be repaired are repaired in sequence.

10. The method according to claim 9, characterized in that After the first printed board to be repaired is placed in the second groove, the method further includes: fixing the first printed board to be repaired in the second groove by means of a pin; After placing the plurality of printed boards between the first printed board to be repaired and the second printed board to be repaired in the first groove, the method further includes: fixing the plurality of printed boards between the first printed board to be repaired and the second printed board to be repaired in the first groove by pins; After the second printed board to be repaired is placed in the third groove, the method further includes: fixing the second printed board to be repaired in the third groove by means of pins.

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