Integrated air cooling heat dissipation structure based on piezoelectric fan

Abstract

The integrated air cooling heat dissipation structure based on the piezoelectric fan comprises a heat dissipation shell and a plurality of heat dissipation fins fixedly installed on the back face of the heat dissipation shell, the heat dissipation fins are distributed on the front face of the heat dissipation shell in a central symmetry mode, and installation supports are fixedly installed on the two sides of the bottom of the back face of the heat dissipation shell. A vibration reduction assembly is arranged on the surface of the mounting support, and a piezoelectric fan is connected to the top of the vibration reduction assembly in a clamped mode. According to the integrated air cooling heat dissipation structure based on the piezoelectric fan, through the arrangement of the piezoelectric fan device, the piezoelectric fan is driven to achieve air forced convection when the environment temperature is high, the upper limit of the heat dissipation capacity of the heat dissipation structure is greatly improved, the heat dissipation requirement of equipment is met, and through cooperation of the piezoelectric fan and the heat dissipation fins, the heat dissipation effect is good when the environment temperature is low. And when the piezoelectric fan device does not work, the piezoelectric fan device still has high natural heat dissipation capacity, the energy efficiency ratio of the system can be increased, and the service life of a driving component can be prolonged.

Description

Technical Field

[0001] The invention relates to the technical field of electronic equipment cooling, and in particular to an integrated air-cooling and heat dissipation structure based on a piezoelectric fan. Background Art

[0002] Natural heat dissipation is a cooling method that uses the buoyancy generated by the temperature difference of the air around the heating device to form natural convection from bottom to top, thereby removing the heat from the surface of the heating device. This cooling method does not require the use of power-driven components such as water pumps and fans. Through a reasonable heat dissipation structure design, it can achieve unpowered air cooling. It has the advantages of high reliability, maintenance-free, low cost, no energy consumption, and quietness. It is widely used in power communication, security, photovoltaic and other industries. However, compared with traditional air cooling, due to the lack of power drive, natural heat dissipation has a relatively low convection heat transfer coefficient and is generally used for low surface heat flux density, i.e. 600W / m 2 -800W / m 2 In some situations, insufficient heat dissipation capacity limits the application scope of natural heat dissipation.

[0003] Forced air cooling is one of the most commonly used cooling methods at present. It realizes forced convection of air through driving components such as fans, thereby achieving the purpose of increasing air flow rate and enhancing convective heat exchange. Conventional air cooling systems are generally composed of fans, air-cooled radiators and corresponding air duct structures. In order to make full use of the cooling air volume generated by the fan, the air duct generally adopts a closed structure to reduce air leakage, and all the cooling air volume is discharged after passing through the air-cooled radiator. This cooling method has the advantages of high cooling efficiency and low one-time investment cost. However, it also has disadvantages such as high operating energy consumption, regular maintenance and replacement of fans, and high noise. When the fan fails or stops due to power supply abnormality, the air-cooled radiator is located inside the closed air duct and cannot meet normal cooling needs under natural cooling conditions. This causes the fan to become a single point of failure in the conventional air cooling system. In order to improve the reliability of the system, it is necessary to design backups for the fan and power supply equipment, which brings about the problem of a significant increase in equipment volume and cost.

[0004] Based on the retrieval of the above information, an integrated air-cooled heat dissipation structure based on a piezoelectric fan is proposed, which can not only increase the upper limit of natural heat dissipation capacity, but also retain the natural heat dissipation capacity under unpowered conditions, and avoid the heat dissipation structure of the cooling system overheating problem after the fan fails, meeting the needs of electronic equipment for high reliability, high integration, and high energy efficiency ratio. Summary of the invention

[0005] In view of the deficiencies in the prior art, the present invention provides an integrated air-cooled heat dissipation structure based on a piezoelectric fan, which solves the problems of low convective heat transfer efficiency and insufficient heat dissipation capacity of the traditional natural heat dissipation structure.

[0006] To achieve the above objectives, the present invention is implemented through the following technical solutions: an integrated air-cooled heat dissipation structure based on a piezoelectric fan, comprising a heat dissipation shell and a plurality of heat dissipation fins fixedly mounted on the back of the heat dissipation shell, wherein the plurality of heat dissipation fins are centrally symmetrically distributed on the front of the heat dissipation shell, and mounting brackets are fixedly mounted on both sides of the bottom of the back of the heat dissipation shell, a vibration reduction assembly is arranged on the surface of the mounting bracket, and a piezoelectric fan component is clamped on the top of the vibration reduction assembly, and a reserved groove for use with the piezoelectric fan component is provided at the bottom of the front of the heat dissipation fin.

[0007] The present invention is further configured as follows: the mounting bracket comprises two groups of fixing seats, the bottom of the front faces of the two groups of fixing seats are fixedly mounted with supporting plates, and a cross supporting plate is fixedly connected between the two supporting plates; The two sets of fixing seats are fixedly mounted on the back of the heat dissipation housing by means of bolts.

[0008] The present invention is further configured as follows: the vibration reduction assembly includes two assembly plates, a cross clamping plate is fixedly connected between the two assembly plates, pins are fixed to the bottom of the two assembly plates and the bottom of the cross clamping plate, a sleeve is sleeved and slidably installed on the outer periphery of the pin, and a damping spring is fixedly installed on the bottom end of the pin and located inside the sleeve.

[0009] The present invention is further configured as follows: the three sleeves are respectively fixedly mounted on the tops of the two support plates and the cross supporting plate, the backs of the two assembly plates are respectively in sliding contact with the backs of the two fixing seats, and the bottom ends of the three damping springs are respectively fixedly connected to the tops of the two support plates and the cross supporting plate.

[0010] The present invention is further configured as follows: rubber pads are fixedly mounted on the bottoms of the cross clamping plate and the two assembly plates, the rubber pads are sleeved on the outer circumferences of the three pins, and the bottoms of the rubber pads are in contact with the tops of the sleeves.

[0011] The present invention is further configured as follows: the piezoelectric fan component includes a power supply module, piezoelectric fans are symmetrically fixedly installed on both sides of the power supply module, the two piezoelectric fans are driven by an alternating potential provided by the power supply module, and the alternating potentials of the two piezoelectric fans have a phase difference of 180°; The bottoms of the power supply module and the two piezoelectric fans are fixedly mounted with T-shaped card blocks, and the tops of the two assembly plates and the cross card plate are provided with card slots used in conjunction with the T-shaped card blocks.

[0012] The present invention is further configured as follows: one side of the two assembly plates and one side of the cross clamping plate are provided with interconnected through holes, one side of the T-shaped clamping block is provided with a through hole used in conjunction with the through hole, a single-head screw is arranged between the through hole and the through hole, and a fastening nut is also sleeved on the outer periphery of the threaded end of the single-head screw.

[0013] The present invention is further configured as follows: the piezoelectric fan comprises a grooved mounting base, a plurality of conductive fixing blocks are plugged and fixed on the top of the grooved mounting base, a piezoelectric ceramic module is plugged and fixed inside the conductive fixing block, and a flexible fan blade is fixedly installed on the top of the piezoelectric ceramic module; A temperature sensor is also fixedly mounted on the top of the grooved mounting base.

[0014] The present invention provides an integrated air-cooling heat dissipation structure based on a piezoelectric fan. It has the following beneficial effects: (1) The present invention drives the piezoelectric fan to realize forced air convection when the ambient temperature is high, thereby greatly improving the upper limit of the heat dissipation capacity of the heat dissipation structure and meeting the heat dissipation requirements of the equipment. Through the coordination of the piezoelectric fan and the heat dissipation fins, when the ambient temperature is low and the piezoelectric fan component is not working, the system still has a high natural heat dissipation capacity, which is beneficial to improving the energy efficiency ratio of the system and the service life of the driving components.

[0015] (2) The present invention provides convenience for the disassembly and assembly of the piezoelectric fan component by installing the bracket and the vibration reduction assembly, and can also effectively reduce the impact of the vibration generated by the piezoelectric fan component during operation on the heat dissipation housing, thereby further improving the effective service life of the entire device. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a schematic diagram of the external structure of the present invention; Figure 2 It is a schematic diagram of the connection between the mounting bracket and the vibration reduction assembly structure of the present invention; Figure 3 This is a schematic diagram of the structure of the T-shaped block and the through hole of the present invention; Figure 4 It is a schematic diagram of the connection between the support plate and the vibration reduction assembly structure of the present invention; Figure 5 It is a schematic structural diagram of the piezoelectric fan component of the present invention.

[0017] In the figure: 1. Heat dissipation housing; 2. Heat dissipation fins; 201. Reserved slots; 3. Mounting bracket; 301. Fixing seat; 302. Support plate; 303. Cross supporting plate; 4. Vibration reduction assembly; 401. Assembly plate; 402. Cross clamp; 403. Pin; 404. Sleeve; 405. Damping spring; 406. Rubber pad; 407. Clamping slot; 408. Single-head screw; 409. Fastening nut; 4010. Through hole; 5. Piezoelectric fan component; 501. Power supply module; 502. Piezoelectric fan; 5021. Grooved mounting base; 5022. Conductive fixing block; 5023. Piezoelectric ceramic module; 5024. Flexible fan blade; 503. T-shaped block; 504. Through hole; 505. Temperature sensor. DETAILED DESCRIPTION

[0018] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the accompanying drawings in the embodiments of the present invention.

[0019] See also Figure 1-5 The embodiment of the present invention provides the following technical solution: an integrated air-cooled heat dissipation structure based on a piezoelectric fan, comprising a heat dissipation shell 1 and a plurality of heat dissipation fins 2 fixedly mounted on the back of the heat dissipation shell 1, the plurality of heat dissipation fins 2 are centrally symmetrically distributed on the front of the heat dissipation shell 1, two groups of mounting brackets 3, two groups of vibration reduction components 4 and two piezoelectric fan components 5.

[0020] As a preferred solution, a reserved groove 201 for use with the piezoelectric fan component 5 is provided at the bottom of the front side of the heat dissipation fin 2 .

[0021] As a preferred solution, the piezoelectric fan component 5 includes a power supply module 501, and piezoelectric fans 502 are symmetrically fixed on both sides of the power supply module 501. The power supply module 501 is powered by an external DC power supply of 9 to 32V. The two piezoelectric fans 502 are both driven by alternating potential provided by the power supply module 501, and there is a 180° phase difference in the alternating potential of the two piezoelectric fans 502, that is, when the left piezoelectric fan 502 fans toward one side, the right piezoelectric fan 502 fans toward the opposite side, and the vibrations generated by the two are canceled out, thereby reducing the vibration impact on the heat dissipation shell 1.

[0022] As a detailed explanation, in order to ensure that effective air convection can be performed when the piezoelectric fan 502 is not started, the piezoelectric fan 502 includes a grooved mounting base 5021, a plurality of conductive fixing blocks 5022 are plugged and fixed on the top of the grooved mounting base 5021, and a piezoelectric ceramic module 5023 is plugged and fixed inside the conductive fixing block 5022, and a flexible fan blade 5024 is fixedly installed on the top of the piezoelectric ceramic module 5023, wherein the arrangement of the grooved mounting base 5021 provides an effective circulation channel for air convection.

[0023] As a detailed explanation, the grooved mounting base 5021 adopts a partially hollow design and adopts a conformal design with several heat dissipation fins 2 in structure. When the piezoelectric fan 502 is not working, the natural rising airflow can still smoothly pass through the grooved mounting base 5021 and the flexible fan blades 5024, thereby ensuring that the heat dissipation housing 1 still has a good natural heat dissipation effect.

[0024] As a preferred solution, the mounting bracket 3 includes two sets of fixing seats 301, both sets of fixing seats 301 are fixedly mounted on the back of the heat dissipation shell 1 by bolts, and support plates 302 are fixedly mounted on the bottom of the front of the two sets of fixing seats 301, and a cross supporting plate 303 is fixedly connected between the two support plates 302.

[0025] As a preferred solution, in order to reduce the impact of the vibration of the piezoelectric fan 502 on the heat dissipation shell 1, the vibration reduction assembly 4 includes two assembly plates 401, the backs of the two assembly plates 401 are respectively in sliding contact with the backs of the two fixed seats 301, and a cross clamping plate 402 is fixedly connected between the two assembly plates 401. Pins 403 are fixed to the bottom of the two assembly plates 401 and the bottom of the cross clamping plate 402. Sleeves 404 are sleeved and slidably installed on the outer periphery of the pins 403. The three sleeves 404 are respectively fixedly installed on the tops of the two support plates 302 and the cross supporting plate 303. A damping spring 405 is fixedly installed at the bottom end of the pin 403 and inside the sleeve 404. The bottom ends of the three damping springs 405 are respectively fixedly connected to the tops of the two support plates 302 and the cross supporting plate 303.

[0026] In order to further reduce the impact of vibration, rubber pads 406 are fixedly installed on the bottom of the cross clamping plate 402 and the two assembly plates 401. The rubber pads 406 are sleeved on the outer circumference of the three pins 403, and the bottom of the rubber pads 406 is in contact with the top of the sleeve 404.

[0027] As a preferred solution, in order to achieve convenient assembly of the piezoelectric fan 502, a T-shaped block 503 is fixedly installed at the bottom of the power supply module 501 and the grooved mounting base 5021, and a slot 407 for use with the T-shaped block 503 is provided on the top of the two assembly plates 401 and the cross clamp plate 402. A connected through hole 4010 is provided on one side of the two assembly plates 401 and one side of the cross clamp plate 402, and a through hole 504 for use with the through hole 4010 is provided on one side of the T-shaped block 503. A single-head screw 408 is arranged between the through hole 4010 and the through hole 504, and a fastening nut 409 is also sleeved on the outer periphery of the threaded end of the single-head screw 408.

[0028] As a detailed description, a temperature sensor 505 is also fixedly installed on the top of the grooved mounting base 5021. The temperature sensor 505 can monitor the ambient temperature. When the ambient temperature is lower than the set threshold value, the piezoelectric fan 502 does not work. When the ambient temperature rises and exceeds the set threshold value, the piezoelectric fan 502 starts to run, which can ensure the heat dissipation effect of the electronic equipment while reducing the power consumption and operation time of the piezoelectric fan 502, which is conducive to extending the service life of the piezoelectric fan 502. When the temperature sensor 505 detects that the ambient temperature reaches the set threshold value, the power supply module 501 starts working, and the piezoelectric ceramic module 5023 drives the flexible fan blades 5024 to swing periodically under the action of the inverse piezoelectric effect generated by the alternating electric potential. The flexible fan blades 5024 arranged in parallel form a fan array, which drives the air to force convection through the heat dissipation fins 2 on the upper part thereof, thereby greatly improving the air flow and convection heat transfer effect, thereby achieving the purpose of enhancing the heat dissipation effect. The actual measured results show that the air flow rate can be increased from 0.5m / s under the original natural convection conditions to 1.7m / s or above.

[0029] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device.

[0030] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. An integrated air-cooled heat dissipation structure based on a piezoelectric fan, comprising a heat dissipation housing (1) and a plurality of heat dissipation fins (2) fixedly mounted on the back of the heat dissipation housing (1), wherein the plurality of heat dissipation fins (2) are centrally symmetrically distributed on the front of the heat dissipation housing (1), characterized in that: Mounting brackets (3) are fixedly mounted on both sides of the bottom of the back side of the heat dissipation housing (1); a vibration reduction assembly (4) is arranged on the surface of the mounting bracket (3); and a piezoelectric fan component (5) is clamped on the top of the vibration reduction assembly (4); and a reserved groove (201) for use with the piezoelectric fan component (5) is provided at the bottom of the front side of the heat dissipation fin (2).

2. The integrated air-cooling heat dissipation structure based on a piezoelectric fan according to claim 1, characterized in that: The mounting bracket (3) comprises two groups of fixing seats (301), and a support plate (302) is fixedly mounted on the bottom of the front of the two groups of fixing seats (301), and a cross receiving plate (303) is fixedly connected between the two support plates (302); The two sets of fixing seats (301) are both fixedly mounted on the back of the heat dissipation housing (1) by means of bolts.

3. The integrated air-cooling heat dissipation structure based on a piezoelectric fan according to claim 2 is characterized in that: The vibration reduction assembly (4) comprises two assembly plates (401), a cross clamping plate (402) being fixedly connected between the two assembly plates (401), pins (403) being fixedly provided at the bottom of the two assembly plates (401) and the bottom of the cross clamping plate (402), a sleeve (404) being sleeved and slidably mounted on the outer periphery of the pin (403), and a damping spring (405) being fixedly mounted at the bottom end of the pin (403) and inside the sleeve (404).

4. The integrated air-cooling heat dissipation structure based on a piezoelectric fan according to claim 3 is characterized in that: The three sleeves (404) are respectively fixedly mounted on the tops of the two support plates (302) and the cross support plate (303); the backs of the two assembly plates (401) are respectively in sliding contact with the backs of the two fixing seats (301); and the bottom ends of the three damping springs (405) are respectively fixedly connected to the tops of the two support plates (302) and the cross support plate (303).

5. The integrated air-cooling heat dissipation structure based on a piezoelectric fan according to claim 3 is characterized in that: The bottoms of the cross clamping plate (402) and the two assembly plates (401) are fixedly mounted with rubber pads (406), the rubber pads (406) are sleeved on the outer circumferences of the three pins (403), and the bottoms of the rubber pads (406) are in contact with the tops of the sleeves (404).

6. The integrated air-cooling heat dissipation structure based on a piezoelectric fan according to claim 3, characterized in that: The piezoelectric fan component (5) comprises a power supply module (501), and piezoelectric fans (502) are symmetrically fixedly mounted on both sides of the power supply module (501), and the two piezoelectric fans (502) are both driven by an alternating electric potential provided by the power supply module (501), and the alternating electric potentials of the two piezoelectric fans (502) have a phase difference of 180°; The bottoms of the power supply module (501) and the two piezoelectric fans (502) are fixedly mounted with T-shaped card blocks (503), and the tops of the two assembly plates (401) and the cross card plate (402) are provided with card slots (407) for use with the T-shaped card blocks (503).

7. The integrated air-cooling heat dissipation structure based on a piezoelectric fan according to claim 6, characterized in that: One side of the two assembly plates (401) and one side of the cross clamping plate (402) are both provided with interconnected through holes (4010), one side of the T-shaped clamping block (503) is provided with a through hole (504) for use with the through hole (4010), a single-head screw (408) is provided between the through hole (4010) and the through hole (504), and a fastening nut (409) is also sleeved on the outer periphery of the threaded end of the single-head screw (408).

8. The integrated air-cooling heat dissipation structure based on a piezoelectric fan according to claim 6, characterized in that: The piezoelectric fan (502) comprises a grooved mounting base (5021), a plurality of conductive fixing blocks (5022) are plugged and fixed on the top of the grooved mounting base (5021), a piezoelectric ceramic module (5023) is plugged and fixed inside the conductive fixing block (5022), and a flexible fan blade (5024) is fixedly mounted on the top of the piezoelectric ceramic module (5023); A temperature sensor (505) is also fixedly mounted on the top of the grooved mounting base (5021).

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