Mini high-speed mini-led chip transfer device and method

Abstract

The application discloses a micro-distance high-speed Mini LED chip transfer device and method, and belongs to the technical field of chip conveying devices and methods, and comprises a workbench, chip bearing discs and conveying lines are connected to the two ends of the workbench respectively, the conveying line is installed on a frame and extends along a preset direction to bear and convey circuit boards, a needle punching transfer mechanism, the needle punching transfer mechanism comprises a first U-shaped frame arranged on the workbench, a first motor is fixedly installed on the first U-shaped frame, the output shaft of the first motor extends to a lead screw shaft on the other end side wall of the first U-shaped frame, a first sliding block fixedly installed on a moving plate is spirally driven on the lead screw shaft, and first lifting cylinders are fixedly installed on the two sides of the moving plate. The application solves the technical problems that the existing transfer technology cannot realize mass transfer of chips, and the positioning accuracy is weakened after long-term use, and the light emitting surface consistency is poor due to the tin paste reflow welding of the swing arm transfer technology.

Images