Display device and method of manufacturing same

Abstract

A display device and a method of manufacturing the same are provided. The display device includes: a substrate; a first electrode on the substrate; a pixel defining layer on the first electrode; an emission layer on the first electrode and the pixel defining layer; a second electrode on the emission layer; an encapsulation layer on the second electrode; a functional layer on the encapsulation layer; and an enhancement layer between the encapsulation layer and the functional layer, wherein an interface between the enhancement layer and the functional layer is substantially flat.

Description

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application claims priority to and the benefit of Korean Patent Application No. 10-2023-0154042 filed on November 9, 2023, in the Korean Intellectual Property Office (KIPO), the disclosure of which is incorporated herein by reference in its entirety. Technical Field

[0003] The present disclosure relates to a display device, and more particularly, to a display device capable of improving adhesion between a reinforcement layer and a functional layer and a method of manufacturing the display device. Background Art

[0004] Various electronic devices that provide multimedia are being developed, such as televisions, mobile phones, navigation systems, computer monitors, and game consoles. The electronic devices include display panels that display images. Specifically, various portable electronic devices, such as mobile phones and tablet personal computers, are currently being developed. In addition, display devices that work with portable electronic devices are being developed. Summary of the invention

[0005] Aspects of the present disclosure provide a display device capable of improving adhesion between a reinforcement layer and a functional layer and a method of manufacturing the display device.

[0006] The technical objectives to be achieved by the present disclosure are not limited to those described herein, and those skilled in the art will clearly understand other technical objectives not mentioned herein from the description of the present disclosure.

[0007] According to an embodiment of the present disclosure, a display device includes: a substrate; a first electrode on the substrate; a pixel defining layer on the first electrode; an emission layer on the first electrode and the pixel defining layer; a second electrode on the emission layer; an encapsulation layer on the second electrode; a functional layer on the encapsulation layer; and an enhancement layer between the encapsulation layer and the functional layer, wherein an interface between the enhancement layer and the functional layer is substantially flat.

[0008] In an embodiment, the reinforcement layer may contain hydrofluoric acid.

[0009] In an embodiment, the first side surface of the reinforcement layer may contain hydrofluoric acid.

[0010] In an embodiment, the display device may further include a display driver disposed in the pad region on the substrate.

[0011] In an embodiment, the first side surface of the reinforcement layer may be adjacent to the display driver.

[0012] In an embodiment, a second side surface of the reinforcement layer positioned opposite to the first side surface of the reinforcement layer may include a carbonized area.

[0013] In an embodiment, the reinforcement layer may be made of a material including at least one of an optically transparent resin, an epoxy resin, and urethane.

[0014] In an embodiment, the functional layer may include a polarizer.

[0015] In an embodiment, the display device may further include an auxiliary functional layer on the functional layer.

[0016] In an embodiment, the auxiliary function layer may include at least one of an anti-fingerprint layer, an anti-reflection layer, and a hard coating layer.

[0017] In an embodiment, the display device may further include a window layer between the functional layer and the auxiliary functional layer.

[0018] In an embodiment, the display device may further include an intermediate plate connected to the pad area of ​​the substrate.

[0019] In an embodiment, the display device may further include a circuit board connected to the middle board.

[0020] In an embodiment, the display device may further include a protection layer disposed under the substrate.

[0021] According to an embodiment of the present disclosure, a method for manufacturing a display device includes: setting an encapsulation layer on a base substrate; setting a first mask on a pad area of ​​the base substrate to cover the pad area; setting a base enhancement layer on the entire surface of the base substrate including the encapsulation layer and the first mask; setting a second mask on the base enhancement layer in line with the encapsulation layer; patterning the base enhancement layer by selectively removing portions of the base enhancement layer exposed by the second mask; removing the first mask and the second mask; and cutting the base substrate and the base enhancement layer along a scribing line to form a display panel including a substrate and an enhancement layer.

[0022] In an embodiment, patterning the base enhancement layer by selectively removing a portion of the base enhancement layer exposed by the second mask may include selectively removing the portion of the base enhancement layer to expose the first mask.

[0023] In an embodiment, patterning the base enhancement layer by selectively removing portions of the base enhancement layer exposed by the second mask may include etching the base enhancement layer using an etchant.

[0024] In an embodiment, the etchant may include hydrofluoric acid.

[0025] In an embodiment, cutting the base substrate and the base reinforcement layer along the scribe line includes cutting the base substrate and the base reinforcement layer using a laser beam.

[0026] In an embodiment, the method may further include providing a functional layer on the enhancement layer of the display panel.

[0027] In an embodiment, the functional layer may include a polarizer.

[0028] In an embodiment, the method may further include providing an auxiliary functional layer on the functional layer.

[0029] In an embodiment, the auxiliary function layer may include at least one of an anti-fingerprint layer, an anti-reflection layer, and a hard coating layer.

[0030] In an embodiment, the method may further include providing a window layer between the functional layer and the auxiliary functional layer.

[0031] According to an embodiment of the present disclosure, the base reinforcement layer can be formed on the entire surface of the base substrate, and then the base substrate can be cut in the display device. Therefore, the upper surface of the reinforcement layer of the display panel can have a substantially flat surface. Therefore, the adhesion between the functional layer and the reinforcement layer can be improved.

[0032] According to an embodiment of the present disclosure, a base enhancement layer can be formed on the entire surface of a base substrate, and the base substrate can then be cut in a display device, so that the display device can be manufactured faster than a process in which an enhancement layer is formed for each display panel after a cutting process.

[0033] The effects according to the embodiments of the present disclosure are not limited to those mentioned above, and more effects are included in the following description of the present disclosure. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] The above and other aspects and features of the present disclosure will become more apparent by describing in detail embodiments of the present disclosure with reference to the accompanying drawings.

[0035] Figure 1 is a schematic cross-sectional view of a display device according to an embodiment of the present disclosure.

[0036] Figures 2 to 20 is a schematic diagram for illustrating a method of manufacturing a display device according to an embodiment of the present disclosure.

[0037] Fig.21 is along Fig.16 A schematic cross-sectional view taken along line VIII-VIII'.

[0038] Fig. 22 is along Fig.16 A schematic cross-sectional view taken along line IX-IX'.

[0039] Fig.23 is a schematic diagram for illustrating a method of manufacturing a display device according to an embodiment of the present disclosure.

[0040] Fig.24 is a schematic diagram for illustrating a method of manufacturing a display device according to an embodiment of the present disclosure.

[0041] Fig.25 is a schematic cross-sectional view of a display device according to an embodiment of the present disclosure.

[0042] Fig.26 is a schematic cross-sectional view of a display device according to an embodiment of the present disclosure. DETAILED DESCRIPTION

[0043] Advantages and features of the present disclosure and methods for achieving them will become apparent from the description of the embodiments herein below with reference to the accompanying drawings. However, the present disclosure is not limited to the embodiments disclosed herein, but can be implemented in various different ways. The embodiments are provided to make the disclosure of the present disclosure thorough and to convey the scope of the present disclosure to those skilled in the art. It should be noted that the scope of the present disclosure is limited only by the claims.

[0044] As used herein, the phrase "element A on element B" means that element A may be directly disposed on element B and / or element A may be indirectly disposed on element B through another element C. Throughout the description, the same reference numerals / characters may represent the same elements. The figures, sizes, ratios, angles, and quantities of elements given in the drawings are merely exemplary and non-limiting.

[0045] Although terms such as first, second, etc. are used to arbitrarily distinguish between the elements described by such terms, and therefore these terms are not necessarily intended to indicate the temporal or other priority of such elements. These terms are only used to distinguish one element from another element. Therefore, as used herein, within the technical scope of the present disclosure, a first element may be a second element.

[0046] The features of the various embodiments of the present disclosure may be combined in part or in whole. As will be clearly appreciated by those skilled in the art, various interactions and operations are technically possible. The various embodiments can be practiced individually or in combination.

[0047] When an element or layer is referred to as being "on," "connected to," or "coupled to" another element or layer, it may be directly on, connected to, or coupled to the other element or layer, or there may be intervening elements or layers. However, when an element or layer is referred to as being "directly on," "directly connected to," or "directly coupled to" another element or layer, there are no intervening elements or layers. For this purpose, the term "connected" may refer to a physical connection, an electrical connection, and / or a fluid connection with or without intervening elements or layers.

[0048] The terms "about" or "approximately" as used herein include the stated value and mean within an acceptable range of deviation for the particular value as determined by one of ordinary skill in the art, taking into account the measurement in question and the errors associated with the measurement of a particular quantity (i.e., the limitations of the measurement system). For example, "about" can mean within one or more standard deviations, or within ±30%, 20%, 10%, 5% of the stated value.

[0049] The term "and / or" includes all combinations of one or more that the associated configurations may define. For example, "A and / or B" may be understood to mean "A, B, or A and B".

[0050] For the purpose of the present disclosure, the phrase “at least one of A and B” may be interpreted as A only, B only, or a combination of A and B. In addition, “at least one of X, Y, and Z” and “at least one selected from the group consisting of X, Y, and Z” may be interpreted as X only, Y only, Z only, or any combination of two or more of X, Y, and Z.

[0051] Unless otherwise defined or implied herein, all terms (including technical and scientific terms) used herein have the same meaning as those commonly understood by those skilled in the art to which the present disclosure belongs. It will be further understood that terms (such as those defined in commonly used dictionaries) should be interpreted as having a meaning consistent with their meaning in the context of the relevant art and the present disclosure, and should not be interpreted in an idealized or overly formal sense, unless explicitly defined as such herein.

[0052] Hereinafter, embodiments of the present disclosure will be described in detail with reference to the accompanying drawings.

[0053] Figure 1 is a schematic cross-sectional view of a display device according to an embodiment of the present disclosure.

[0054] like Figure 1 As shown in , the display device according to the embodiment may include a display panel 100, a display driver 200, an intermediate board 600, a circuit board 300 and / or a functional layer POL.

[0055] The display panel 100 may include a substrate SUB, an emission material layer EMTL, an encapsulation layer ENC, and / or an enhancement layer CPL disposed in the third direction DR3. Although not shown in the drawings, the display panel 100 may further include a transistor layer disposed between the substrate SUB and the emission material layer EMTL, a touch sensing unit (or touch sensing portion) disposed on the encapsulation layer ENC, and a color filter layer disposed on the touch sensing unit.

[0056] The protective layer 400 may be disposed under the display panel 100. For example, the protective layer 400 may be disposed under the substrate SUB. In other words, the protective layer 400 may be disposed on the opposite side of the functional layer POL, with the display panel 100 between the protective layer 400 and the functional layer POL. The protective layer 400 can prevent external light from being incident on the display panel 100. The protective layer 400 can prevent an external impact from being transmitted to a lower portion of the display panel 100. The protective layer 400 may be implemented as a film.

[0057] The substrate SUB may be disposed on the protective layer 400. The substrate SUB may be a flexible substrate that can be bent, folded, or rolled. For example, the substrate SUB may include, but is not limited to, a polymer resin such as polyimide (PI). For another example, the substrate SUB may include a glass material or a metal material.

[0058] The transistor layer may be disposed on the substrate SUB. The transistor layer may include one or more thin film transistors forming a pixel circuit of a pixel. The transistor layer may also include a gate line, a data line, a voltage line, a gate control line, a fan-out line for connecting a display driver to a data line, and / or a lead for connecting a display driver to a pad. Each of the plurality of transistors may include a semiconductor region, a source electrode, a drain electrode, and a gate electrode. For example, in the case where a gate driver is formed on one side of a non-display area of ​​the display panel 100, the gate driver may include a thin film transistor.

[0059] The transistor layer may be arranged in the display area and the non-display area of ​​the substrate. The thin film transistor in each of the plurality of pixels, the gate line, the data line and / or the voltage line in the transistor layer may be arranged in the display area. The gate control line and the fan-out line of the transistor layer may be arranged in the non-display area.

[0060] The emission material layer EMTL may be disposed on the transistor layer. The emission material layer EMTL may include one or more light emitting elements ED and a pixel defining layer PDL for defining pixels, in each light emitting element ED, a first electrode AND, an emission layer EL, and a second electrode CAT are sequentially stacked to emit light. The light emitting element ED in the emission material layer EMTL may be disposed in a display area of ​​the substrate SUB. According to an embodiment of the present disclosure, the pixel defining layer PDL may further include a spacer SPC protruding from the top of the pixel defining layer PDL in a third direction DR3. The pixel defining layer PDL and the spacer SPC may be formed integrally or integrally with each other. The spacer SPC may support a mask (e.g., a fine metal mask) for forming the emission layer EL.

[0061] The emission layer EL may be, for example, an emission layer EL including an organic material. The emission layer EL may include a hole transport layer, an organic light emitting layer, and an electron transport layer. In the case where the first electrode AND receives a voltage (e.g., a data voltage) and the second electrode CAT receives a common voltage (e.g., a cathode voltage) through a thin film transistor in the transistor layer, holes and electrons may move to the emission layer EL through the hole transport layer and the electron transport layer, respectively, so that they are combined in the emission layer EL to emit light. For example, the first electrode AND may be an anode electrode, and the second electrode CAT may be a cathode electrode. However, it should be understood that the present disclosure is not limited thereto.

[0062] As another example, examples of the light emitting element ED may include a plurality of quantum dot light emitting diodes (each including a quantum dot emission layer), a plurality of inorganic light emitting diodes (each including an inorganic semiconductor), or a plurality of micro light emitting diodes.

[0063] The encapsulation layer ENC may cover the upper surface and the side surface of the emission material layer EMTL and can protect the emission material layer EMTL. The encapsulation layer ENC may include at least one inorganic layer and / or at least one organic layer for encapsulating the emission material layer EMTL.

[0064] The touch sensing unit may be disposed on the encapsulation layer ENC. The touch sensing layer may include one or more touch electrodes for sensing the touch of a user by capacitive sensing and a touch line connecting the touch electrode to a touch driver. For example, the touch sensing layer may sense the touch of a user by mutual capacitance sensing or self capacitance sensing.

[0065] The display driver 200 may output signals and voltages for driving the display panel 100. The display driver 200 may supply data voltages to data lines. The display driver 200 may apply supply voltages to voltage lines, and may supply gate control signals to gate drivers. The display driver 200 may be implemented as an integrated circuit (IC), and may be attached to the display panel 100 by chip on glass (COG) technology, chip on plastic (COP) technology, or ultrasonic bonding technology. For example, the display driver 200 may be disposed in a non-display area of ​​the substrate SUB. For example, the display driver 200 may be disposed in a pad area 900 (or mounting area) in the non-display area.

[0066] The middle plate 600 may physically and electrically connect the substrate SUB of the display panel 100 with the circuit board 300. For example, one side of the middle plate 600 may be physically and electrically connected to the pad area 900 of the display panel 100, and the other side of the middle plate 600 may be physically and electrically connected to the circuit board 300. The middle plate may be bent into a U shape.

[0067] One side of the intermediate plate 600 may be connected to the substrate SUB through a first conductive adhesive member. For example, one side of the intermediate plate 600 may be connected to the pad electrode 700 provided in the pad region 900 of the substrate SUB through the first conductive adhesive member. The pad electrode 700 of the substrate SUB may also be connected to the display driver 200 described above. Therefore, the intermediate plate 600 and the display driver 200 may be electrically connected to each other. The first conductive adhesive member may be, for example, an anisotropic conductive film (ACF).

[0068] According to an embodiment of the present disclosure, the middle board 600 may be, for example, a flexible printed circuit board (FPCB), a printed circuit board (PCB), or a flexible film such as a chip on film (COF).

[0069] The other side of the middle plate 600 may be connected to the circuit board 300 by a second conductive adhesive member. For example, the other side of the middle plate 600 may be connected to the circuit board 300 by a second conductive adhesive member. Therefore, the circuit board 300, the middle plate 600, and the display driver 200 may be electrically connected to each other. The second conductive adhesive member may be, for example, an anisotropic conductive film (ACF).

[0070] According to an embodiment of the present disclosure, the circuit board 300 may be, for example, a flexible printed circuit board (FPCB), a printed circuit board (PCB), or a flexible film such as a chip on film (COF).

[0071] The circuit board 300 may be placed under the protective layer 400. For example, circuit elements such as a touch driver and a power supply unit (or power supply) may be provided on the circuit board 300. For example, the touch driver and the power supply unit may be mounted on the circuit board 300. The circuit elements of the circuit board 300 (for example, at least one of the touch driver and the power supply unit) may be electrically connected to the display driver 200 and the display panel 100 on the substrate SUB through the circuit board 300 and the intermediate board 600.

[0072] The touch driver may be electrically connected to the touch sensing unit of the display panel 100. The touch driver may provide a touch drive signal to one or more touch electrodes of the touch sensing unit, and may sense changes in capacitance between the touch electrodes. For example, the touch drive signal may be a pulse signal having a frequency (e.g., a predetermined or selectable frequency). The touch driver may determine whether there is an input, and may find the coordinates of the input based on the amount of change in capacitance between the touch electrodes. The touch driver may be implemented as an integrated circuit (IC).

[0073] The power supply unit may apply a supply voltage to the display driver 200 and the display panel 100. The power supply unit may generate a driving voltage to supply it to a driving voltage line, may generate an initialization voltage to supply it to an initialization voltage line, and may generate a common voltage to supply it to a second electrode CAT shared by light emitting elements ED of one or more pixels. For example, the driving voltage may be a high level voltage for driving the light emitting element ED, and the common voltage may be a low level voltage for driving the light emitting element ED.

[0074] The reinforcement layer CPL may be disposed on the encapsulation layer ENC. For example, the reinforcement layer CPL may be disposed between the encapsulation layer ENC and the functional layer POL. The reinforcement layer CPL may be in contact with the encapsulation layer ENC and the functional layer POL. The reinforcement layer CPL is capable of protecting the display panel 100 from, for example, external impacts. For example, the reinforcement layer CPL may be made of (or include) a material containing an optically transparent resin having high strength and flexibility. According to an embodiment of the present disclosure, the reinforcement layer CPL may be made of a material containing at least one of epoxy resin and urethane.

[0075] According to an embodiment of the present disclosure, the interface between the reinforcement layer CPL and the functional layer POL may be substantially flat. For example, the top surface (eg, upper surface S3 ) of the reinforcement layer CPL may be flat.

[0076] According to an embodiment of the present disclosure, the reinforcement layer CPL may include at least one of hydrofluoric acid and a carbonized area. For example, the first side surface S1 of the reinforcement layer CPL may be disposed adjacent to the display driver 200, and thus the first side surface S1 may include hydrofluoric acid. The second side surface S2 of the reinforcement layer CPL is opposite to the first side surface S1, and the second side surface S2 may include a carbonized area. The carbonized area may be a blackened portion. According to an embodiment, at least one of the other surfaces adjacent to the second side surface S2 of the reinforcement layer CPL in the first direction DR1 and / or the second direction DR2 and connected to the second side surface S2 may have the carbonized area described above.

[0077] Figures 2 to 20 is a schematic diagram for illustrating a method of manufacturing a display device according to an embodiment of the present disclosure. Figure 3 is along Figure 2 A schematic cross-sectional view taken along line II'. Figure 5 is along Figure 4 Schematic cross-sectional view taken along line II-II'. Figure 7 is along Figure 6 Schematic cross-sectional view taken along line III-III'. Fig. 9 is along Figure 8 Schematic cross-sectional view taken along line IV-IV'. Fig.11 is along Fig.10 Schematic cross-sectional view taken along line V-V'. Fig.13 is along Fig.12 A schematic cross-sectional view taken along line VI-VI'. Fig.15 is along Fig.14 Schematic cross-sectional view taken along line VII-VII'. Fig.18 is along Fig.17 A schematic cross-sectional view taken along line XX'. Fig. 20 is along Fig.19 A schematic cross-sectional view taken along line XI-XI'.

[0078] Start, such as Figure 2 and Figure 3 As shown in , a base substrate BSUB can be prepared, on which a transistor layer, an emission material layer EMTL, an encapsulation layer ENC, a touch sensing unit and a color filter layer are arranged. In other words, one or more transistor layers, one or more emission material layers EMTL, one or more encapsulation layers ENC, one or more touch sensing units and one or more color filter layers can be arranged on the base substrate BSUB. Figure 2 In the example shown in , nine encapsulation layers ENC are arranged in a matrix on a base substrate BSUB. The base substrate BSUB may be, for example, a mother substrate or a source substrate. The base substrate BSUB and the substrate SUB described above may be made of the same material.

[0079] Incidentally, if Figure 2 As shown in FIG. 1 , the base substrate BSUB may include one or more pad regions 900. Figure 2 From the plan view shown in , each of the plurality of pad regions 900 may be disposed adjacent to the corresponding encapsulation layer ENC. For example, each of the plurality of pad regions 900 may be disposed adjacent to the corresponding encapsulation layer ENC in the second direction DR2. Figure 2 In the example shown in , nine pad areas 900 are arranged in a matrix form on the base substrate BSUB.

[0080] The pad regions 900 may be arranged to be adjacent to each other in the first direction DR1 .

[0081] The pad electrodes 700 of the pad region 900 may be disposed adjacent to each other in the first direction DR1 .

[0082] Then, if Figure 4 and Figure 5As shown in FIG. 1 , the first mask MK1 may be disposed on the pad region 900 in correspondence with the pad region 900 of the base substrate BSUB. In other words, the first mask MK1 covering the pad region 900 (or overlapping the pad region 900) may be disposed on the base substrate BSUB. The first mask MK1 may be attached to the pad region 900.

[0083] According to an embodiment, from Figure 4 From the plan view shown in FIG. 1 , the first mask MK1 may include one or more first sub-masks SMK1-1, SMK1-2, and SMK1-3 (collectively referred to as SMK1) separated from each other. Figure 4 In the example shown in , the first mask MK1 may include a (1-1) sub-mask SMK1-1, a (1-2) sub-mask SMK1-2, and a (1-3) sub-mask SMK1-3. Each of the first sub-masks SMK1-1, SMK1-2, and SMK1-3 may have a line shape extending in the first direction DR1. The first sub-masks SMK1-1, SMK1-2, and SMK1-3 may be arranged in the second direction DR2. From a plan view perspective, the first sub-mask may be disposed between an edge of the base substrate BSUB and one or more encapsulation layers ENC, or between one or more encapsulation layers ENC adjacent to each other in the second direction DR2.

[0084] The first mask MK1 may be implemented as, for example, a tape or a coating.

[0085] The first mask MK1 may be made of a material including, for example, an organic material.

[0086] Then, if Figure 6 and Figure 7 As shown in , the base enhancement layer BCPL may be disposed above the first mask MK1 and the encapsulation layer ENC. For example, the base enhancement layer BCPL may be disposed on the entire surface of the base substrate BSUB including the first mask MK1 and one or more encapsulation layers ENC. To this end, according to an embodiment, a raw material for the base enhancement layer BCPL (for example, an optically transparent resin or a material containing at least one of an epoxy resin and urethane) may be applied on the base substrate BSUB including the first mask MK1 and one or more encapsulation layers ENC, and then a curing process is performed on the raw material so that the base enhancement layer BCPL may be formed. The curing process may include, for example, at least one of an ultraviolet curing process of irradiating the raw material for the base enhancement layer BCPL with ultraviolet rays and a thermal curing process of applying heat to the raw material. The base enhancement layer BCPL and the above-mentioned enhancement layer CPL may be made of the same material.

[0087] The first mask MK1 can prevent the raw material for the base reinforcement layer BCPL from penetrating into the pad region 900 of the base substrate BSUB and the pad electrode 700 of the pad region 900 .

[0088] Then, if Figure 8 and Fig. 9 As shown in , the second mask MK2 may be disposed on the base enhancement layer BCPL. The second mask MK2 may be attached to the base enhancement layer BCPL. The second mask MK2 may be disposed on the base enhancement layer BCPL so that the second mask MK2 overlaps with the encapsulation layer ENC without overlapping with the first mask MK1. For example, the second mask MK2 may be disposed on the base enhancement layer BCPL so that, except for the first mask MK1, only the encapsulation layer ENC is selectively hidden (or covered). Therefore, a portion of the base enhancement layer BCPL (hereinafter referred to as an "unexposed portion"; for example, a portion of the base enhancement layer BCPL on the encapsulation layer ENC or a portion of the base enhancement layer BCPL in contact with the encapsulation layer ENC) is covered by the second mask MK2, while another portion of the base enhancement layer BCPL other than the portion (hereinafter referred to as an "exposed portion"; for example, a portion of the base enhancement layer BCPL on the first mask MK1 or a portion of the base enhancement layer BCPL in contact with the first mask MK1 in the third direction DR3) may be exposed to the outside without being covered by the second mask MK2. Herein, the unexposed portion of the base enhancement layer BCPL described above may be disposed between the encapsulation layer ENC and the second mask MK2.

[0089] According to an embodiment, from Figure 8 From the plan view shown in FIG. 1 , the second mask MK2 may include second sub-masks SMK2-1, SMK2-2, and SMK2-3 separated from each other. Figure 8 In the example shown in , the second mask MK2 may include a (2-1) sub-mask SMK2-1, a (2-2) sub-mask SMK2-2, and a (2-3) sub-mask SMK2-3. Each of the second sub-masks SMK2-1, SMK2-2, and SMK2-3 may have a line shape extending in the first direction DR1 to cover the encapsulation layer ENC arranged in the first direction DR1. The second sub-masks SMK2-1, SMK2-2, and SMK2-3 may be arranged in the second direction DR2. From a plan view perspective, the second sub-mask may be disposed between an edge of the base substrate BSUB (or the base enhancement layer BCPL) and the first sub-mask, or between first sub-masks adjacent to each other in the second direction DR2.

[0090] For example, the second mask MK2 may be implemented as a film. According to an embodiment, the second mask MK2 may be an acid-resistant film.

[0091] Then, if Fig.10 and Fig.11 As shown in , a process of patterning the base enhancement layer BCPL may be performed using the second mask MK2. For example, an etching process may be performed to selectively remove exposed portions of the base enhancement layer BCPL that are not hidden by the second mask MK2.

[0092] According to an embodiment of the present disclosure, hydrofluoric acid or a non-hydrofluoric acid etchant may be used as the etchant ECT to remove the base reinforcement layer BCPL.

[0093] like Fig.10 and Fig.11 As shown in , the etchant ECT can be selectively dropped only on the exposed portion of the base enhancement layer BCPL through the second mask MK2.

[0094] Then, if Fig.12 and Fig.13 As shown in FIG, the exposed portion of the base enhancement layer BCPL can be removed by the etchant ECT, so that the first mask MK1 can be exposed to the outside. In other words, the base enhancement layer BCPL patterned by the etching process can be located between the encapsulation layer ENC and the second mask MK2. From a plan view perspective (for example, in FIG. Fig.14 In the plan view shown in FIG. 1 , the patterned base enhancement layer BCPL may also be located between the encapsulation layers ENC adjacent to each other in the first direction DR1 and the second direction DR2. For example, the patterned base enhancement layer BCPL and the second mask MK2 may have the same line shape.

[0095] Incidentally, the first mask MK1 may include a material that does not react with the etchant ECT. Therefore, in the case where the base reinforcement layer BCPL is removed by the etchant ECT, even if the first mask MK1 under the base reinforcement layer BCPL is in contact with the etchant ECT, the first mask MK1 may not be removed. For example, the first mask MK1 may include a material having an etching rate smaller than that of the base reinforcement layer BCPL relative to the etchant ECT. According to an embodiment of the present disclosure, in the case where the etchant ECT includes a hydrofluoric acid material, the first mask MK1 including an organic material may not react with the hydrofluoric acid etchant ECT. Therefore, during the process of etching the base reinforcement layer BCPL, it is possible to prevent the pad electrode 700 in the pad area 900 from being damaged by the etchant ECT.

[0096] Incidentally, in the case where an etchant containing a hydrofluoric acid material is used as the etchant ECT, the base reinforcement layer BCPL may contain hydrofluoric acid. Figure 1 The first side surface S1 of the base reinforcement layer BCPL (or Figure 1The first side surface S1 of the enhancement layer CPL) may refer to the first mask MK1 or the above-described Figure 1 The display driver 200 is adjacent to the surface.

[0097] Then, if Fig.14 and Fig.15 As shown in , the first mask MK1 and the second mask MK2 may be removed. For example, the second mask MK2 may be removed, and then the first mask MK1 may be removed. However, it should be understood that the order in which the first mask MK1 and the second mask MK2 are removed is not limited thereto. For example, the first mask MK1 may be removed, and then the second mask MK2 may be removed.

[0098] As the first mask MK1 is removed, the pad region 900 of the base substrate BSUB and the pad electrode 700 of the pad region 900 may be exposed to the outside.

[0099] In the case where the first mask MK1 is implemented as a tape, the first mask MK1 can be physically removed (or separated) from the pad area 900. For example, the first mask MK1 can be removed (or separated) from the pad area 900 by a pulling force in a direction opposite to the attachment surface (or bonding surface). In the case where the first mask MK1 is implemented as a coating, the first mask MK1 can be chemically removed (or separated) by a solvent-based material. The solvent-based material may include, for example, isopropyl alcohol or acetone.

[0100] As the second mask MK2 is removed, the patterned base enhancement layer BCPL may be exposed to the outside.

[0101] In the case where the second mask MK2 is implemented as a film, the second mask MK2 can be physically removed (or separated) from the base reinforcement layer BCPL. For example, the second mask MK2 can be removed (or separated) from the base reinforcement layer BCPL by a pulling force in a direction opposite to the attachment surface (or bonding surface).

[0102] Then, if Fig.16 As shown in , the base substrate BSUB may be cut along the scribing lines SCL. Therefore, the base reinforcement layer BCPL on the base substrate BSUB may also be cut along the scribing lines SCL.

[0103] One or more display panels 100 may be provided in the form of a cell unit from the base substrate BSUB through a cutting process. Fig.16 In the example shown in , nine display panels 100 can be obtained from one base substrate BSUB. Fig.17 and Fig.18 FIG. 2 shows an example of one of the nine display panels 100 separated from the base substrate BSUB. Fig.17and Fig.18 As shown in , the display panel 100 may include a substrate SUB separated from a base substrate BSUB and an enhancement layer CPL separated from a base enhancement layer BCPL.

[0104] According to an embodiment of the present disclosure, the base substrate BSUB may be cut using a wheel or a laser beam during the cutting process. While the base substrate BSUB and the base reinforcement layer BCPL are cut by the laser beam, at least a portion of the cut surface of the base substrate BSUB and at least a portion of the cut surface of the base reinforcement layer BCPL cut along the scribe line SCL may be carbonized. In other words, at least a portion of the cut surface of the base substrate BSUB and at least a portion of the cut surface of the base reinforcement layer BCPL may each have a carbonized area (or a blackened area). For example, Fig.18 As shown in FIG. 4 , the second side surface S2 of the reinforcement layer CPL or the base reinforcement layer BCPL may have a carbonized area (or a blackened area).

[0105] Then, if Fig.19 and Fig. 20 As shown in , the functional layer POL may be disposed on the display panel 100. For example, the functional layer POL may be disposed on the enhancement layer CPL. The functional layer POL may include, for example, a polarizer.

[0106] Then, if Figure 1 As shown in , the display driver 200 may be disposed in the pad region 900 of the display panel 100 .

[0107] Then, if Figure 1 As shown in , the protective layer 400 may be disposed on a lower surface of the display panel 100 (eg, a lower surface of the substrate SUB).

[0108] Then, if Figure 1 As shown in , one end of the middle board 600 may be connected to the pad area 900 , and the circuit board 300 may be connected to the other end of the middle board 600 .

[0109] Then, if Figure 1 As shown in FIG. 6 , the middle plate 600 may be bent so that the circuit board 300 and the protection layer 400 face each other.

[0110] Incidentally, since the upper surface of the reinforcement layer CPL (e.g., the surface of the reinforcement layer CPL facing the functional layer POL) can be flat, the adhesion between the reinforcement layer CPL and the functional layer POL can be improved. Therefore, since the adhesion between the reinforcement layer CPL and the functional layer POL can be improved, the functional layer POL can be prevented from being separated from the reinforcement layer CPL. Fig.16 , Fig.21 and Fig. 22A manner in which the reinforcement layer CPL (eg, the upper surface S3 of the reinforcement layer CPL) of the display panel 100 according to the embodiment can be flattened is described in detail.

[0111] Fig.21 is along Fig.16 A schematic cross-sectional view taken along line VIII-VIII'. Fig. 22 is along Fig.16 A schematic cross-sectional view taken along line IX-IX'.

[0112] According to the method of manufacturing a display device according to an embodiment, since a cutting process (eg, Fig.16 ), so the non-planar portion of the base enhancement layer BCPL may be formed at the edge of the base substrate BSUB (rather than the display panel 100). This will be described in more detail as follows:

[0113] The raw material for the base enhancement layer BCPL may be applied on the encapsulation layer ENC by a slit coating method. For example, the slit coating device may discharge the raw material through a nozzle while moving from an edge of the base substrate BSUB to an opposite edge of the base substrate BSUB to apply the raw material to the entire surface of the base substrate BSUB. In doing so, due to the nature of the slit coating device, the raw material first discharged from the nozzle of the slit coating device and the raw material last discharged may be raised or lowered in the third direction DR3 compared to other portions at the edge of the base substrate BSUB, such as Fig.21 Part A or Fig. 22 In other words, since the nozzle of the slit coating device is located at the edge of the base substrate BSUB when first discharged through the slit coating device, and the nozzle of the slit coating device is located at the opposite edge of the base substrate BSUB when finally discharged through the slit coating device, the base enhancement layer BCPL can have a Fig.21 The convex shape shown in part A or as Fig. 22 The slope shape shown in part B.

[0114] However, the above-mentioned convex shape and slope shape may be formed at a portion discarded from the base substrate BSUB after the cutting process, and thus they may not have any influence on the display panel 100 separated from the base substrate BSUB after the cutting process. Therefore, the enhancement layer CPL of the display panel 100 separated from the base substrate BSUB after the cutting process may have a flat surface. In other words, the upper surface S3 of the enhancement layer CPL of the display panel 100 may have a flat surface. Therefore, in the display device according to the embodiment, the adhesion between the functional layer POL and the enhancement layer CPL can be improved. In the method according to the embodiment of the present disclosure, the base enhancement layer BCPL is formed on the entire surface of the base substrate BSUB and then the base substrate BSUB is cut, so that the display device can be manufactured faster than the process of forming the enhancement layer CPL for each display panel 100 after the cutting process.

[0115] On the other hand, in the case of performing a process of cutting the base substrate BSUB and then separately performing a process of forming the reinforcement layer CPL for each display panel 100, the reinforcement layer CPL at the edge and the opposite edge of the display panel 100 may not be flat due to the nature of the slit coating apparatus. Therefore, such a method may be inefficient, and the adhesive force between the reinforcement layer CPL and the functional layer POL may become weak, which may cause the functional layer POL to be separated from the reinforcement layer CPL.

[0116] Fig.23 is a schematic diagram for illustrating a method of manufacturing a display device according to an embodiment of the present disclosure.

[0117] Fig.23 The method for manufacturing a display device may be similar to that of Figure 4 The methods of manufacturing the display devices are different, and the description will focus on the differences.

[0118] In addition to the (1-1) sub-mask SMK1-1 to (1-3) sub-mask SMK1-3 described above, Fig.23 The first mask MK1 may further include a (1-4) sub-mask SMK1-4 and a (1-5) sub-mask SMK1-5.

[0119] The (1-1) sub-mask SMK1-1 to the (1-5) sub-mask SMK1-5 may be integrally formed or integrated with each other.

[0120] The (1-4) sub-mask SMK1-4 may extend in a direction (e.g., a second direction DR2) intersecting a direction (e.g., a first direction DR1) in which the (1-1) sub-masks SMK1-1 to (1-3) sub-masks SMK1-3 extend. The (1-4) sub-mask SMK1-4 may connect ends of the (1-1) sub-masks SMK1-1 to (1-3) sub-masks SMK1-3 to each other.

[0121] The (1-5) sub-mask SMK1-5 may extend in a direction (e.g., a second direction DR2) intersecting a direction (e.g., a first direction DR1) in which the (1-1) sub-masks SMK1-1 to (1-3) sub-masks SMK1-3 extend. The (1-5) sub-mask SMK1-5 may connect opposite ends of the (1-1) sub-masks SMK1-1 to (1-3) sub-masks SMK1-3 to each other.

[0122] because Fig.23 The first mask MK1 may include first sub-masks SMK1 - 1 to SMK1 - 5 that are integrally formed, and thus the first mask MK1 can be removed more easily.

[0123] Fig.24 is a schematic diagram for illustrating a method of manufacturing a display device according to an embodiment of the present disclosure.

[0124] Fig.24 The method for manufacturing a display device may be similar to that of Figure 8 The methods of manufacturing the display devices are different, and the description will focus on the differences.

[0125] In addition to the (2-1) sub-mask SMK2-1 to (2-3) sub-mask SMK2-3 described above, Fig.24 The second mask MK2 may further include a (2-4) sub-mask SMK2-4 and a (2-5) sub-mask SMK2-5.

[0126] (2-1) The sub-masks SMK2-1 to (2-5) the sub-masks SMK2-5 may be integrally formed or integrated with each other.

[0127] The (2-4) sub-mask SMK2-4 may extend in a direction (e.g., a second direction DR2) intersecting a direction (e.g., a first direction DR1) in which the (2-1) sub-masks SMK2-1 to (2-3) sub-masks SMK2-3 extend. The (2-4) sub-mask SMK2-4 may connect ends of the (2-1) sub-masks SMK2-1 to (2-3) sub-masks SMK2-3 to each other.

[0128] The (2-5) sub-mask SMK2-5 may extend in a direction (e.g., a second direction DR2) intersecting a direction (e.g., a first direction DR1) in which the (2-1) sub-masks SMK2-1 to (2-3) sub-masks SMK2-3 extend. The (2-5) sub-mask SMK2-5 may connect opposite ends of the (2-1) sub-masks SMK2-1 to (2-3) sub-masks SMK2-3 to each other.

[0129] because Fig.24 The second mask MK2 may include second sub-masks SMK2-1 to SMK2-5 that are integrally formed, and thus the second mask MK2 can be removed more easily.

[0130] Fig.25 is a schematic cross-sectional view of a display device according to an embodiment of the present disclosure.

[0131] Fig.25 The display device described above Figure 1 The difference between the display devices of FIG. 5 and FIG. 6 is at least that the former further includes an auxiliary function layer 510 .

[0132] Fig.25 The display device may further include an auxiliary functional layer 510 disposed on the functional layer POL.

[0133] The auxiliary function layer 510 may include, for example, at least one of an anti-fingerprint layer, an anti-reflection layer, and a hard coating layer.

[0134] The anti-fingerprint layer can prevent fingerprints on the display panel 100 .

[0135] The anti-reflection layer can reduce reflection caused by light incident from the outside of the display panel 100 .

[0136] The hard coating layer can prevent the surface of the display panel from being damaged (eg, scratched).

[0137] Fig.25 The method of manufacturing a display device may further include: after providing the functional layer POL, providing an auxiliary functional layer 510 on the functional layer POL.

[0138] Fig.26 is a schematic cross-sectional view of a display device according to an embodiment of the present disclosure.

[0139] Fig.26 The display device described above Fig.25 The difference between the display devices of FIG. 5 and FIG. 6 is at least that the former further includes a window layer 520 .

[0140] Fig.26 The display device may further include a window layer 520 disposed between the functional layer POL and the auxiliary functional layer 510 .

[0141] The window layer 520 may include a transparent resin. The window layer 520 can improve the strength of the display panel 100.

[0142] The auxiliary function layer 510 may include, for example, at least one of an anti-fingerprint layer, an anti-reflection layer, and a hard coating layer.

[0143] Fig.26 The method of manufacturing a display device may further include: disposing a window layer 520 on the functional layer POL after the functional layer POL has been disposed, and disposing an auxiliary functional layer 510 on the window layer 520 .

[0144] The above description is an example of the technical features of the present disclosure, and those skilled in the art to which the present disclosure belongs will be able to make various modifications and changes.Therefore, the embodiments of the present disclosure described above can be implemented individually or in combination with each other.

[0145] The embodiments disclosed in the present disclosure are not intended to limit the technical spirit of the present disclosure but to describe the technical spirit of the present disclosure, and the scope of the technical spirit of the present disclosure is not limited by these embodiments. The protection scope of the present disclosure should be interpreted by the attached claims, and should be interpreted as all technical spirits within the equivalent scope are included in the scope of the present disclosure.

Claims

1. A display device, comprising: substrate; a first electrode on the substrate; a pixel defining layer on the first electrode; an emission layer on the first electrode and the pixel defining layer; a second electrode on the emitting layer; an encapsulation layer on the second electrode; a functional layer on the encapsulation layer; as well as a reinforcement layer between the encapsulation layer and the functional layer, Wherein, the interface between the reinforcement layer and the functional layer is flat.

2. The display device according to claim 1, wherein: The reinforcement layer contains hydrofluoric acid.

3. The display device according to claim 2, wherein: The first side surface of the reinforcement layer contains the hydrofluoric acid.

4. The display device according to claim 3, further comprising: A display driver is disposed in a pad region on the substrate.

5. The display device according to claim 4, wherein: The first side surface of the reinforcement layer is adjacent to the display driver.

6. The display device according to claim 3, wherein: A second side surface of the reinforcement layer, which is located opposite to the first side surface of the reinforcement layer, includes a carbonized area.

7. The display device according to claim 1, wherein: The reinforcement layer is made of a material including at least one of an optically transparent resin, an epoxy resin, and urethane.

8. The display device according to claim 1, wherein: The functional layer includes a polarizer.

9. The display device according to claim 1, further comprising: An auxiliary functional layer on the functional layer.

10. The display device according to claim 9, wherein: The auxiliary functional layer includes at least one of an anti-fingerprint layer, an anti-reflection layer and a hard coating layer.

11. The display device according to claim 9, further comprising: A window layer is provided between the functional layer and the auxiliary functional layer.

12. The display device according to claim 1, further comprising: Connect to the pad area of ​​the substrate to the middle plate.

13. The display device according to claim 12, further comprising: A circuit board connected to the midplane.

14. The display device according to claim 1, further comprising: A protective layer is disposed below the substrate.

15. A method for manufacturing a display device, the method comprising: providing an encapsulation layer on the base substrate; Disposing a first mask on the pad area of ​​the base substrate to cover the pad area; disposing a base enhancement layer on the entire surface of the base substrate including the encapsulation layer and the first mask; Disposing a second mask on the base enhancement layer in line with the encapsulation layer; patterning the base enhancement layer by selectively removing portions of the base enhancement layer exposed by the second mask; removing the first mask and the second mask; as well as The base substrate and the base reinforcement layer are cut along scribing lines to form a display panel including a substrate and a reinforcement layer.

16. The method for manufacturing a display device according to claim 15, wherein: Patterning the base enhancement layer by selectively removing the portion of the base enhancement layer exposed by the second mask includes selectively removing the portion of the base enhancement layer to expose the first mask.

17. The method for manufacturing a display device according to claim 15, wherein: Patterning the base enhancement layer by selectively removing the portion of the base enhancement layer exposed by the second mask includes etching the base enhancement layer using an etchant.

18. The method for manufacturing a display device according to claim 17, wherein: The etchant includes hydrofluoric acid.

19. The method for manufacturing a display device according to claim 15, wherein: Cutting the base substrate and the base reinforcement layer along the scribing line includes cutting the base substrate and the base reinforcement layer using a laser beam.

20. The method for manufacturing a display device according to claim 15, further comprising: A functional layer is disposed on the enhancement layer of the display panel.

21. The method for manufacturing a display device according to claim 20, wherein: The functional layer includes a polarizer.

22. The method for manufacturing a display device according to claim 20, further comprising: An auxiliary functional layer is arranged on the functional layer.

23. The method for manufacturing a display device according to claim 22, wherein: The auxiliary functional layer includes at least one of an anti-fingerprint layer, an anti-reflection layer and a hard coating layer.

24. The method for manufacturing a display device according to claim 22, further comprising: A window layer is disposed between the functional layer and the auxiliary functional layer.

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