Display device and method of manufacturing same

Abstract

The invention relates to a display device and a method of manufacturing the same. The display device includes a display panel including a first area including a display area, a second area spaced apart from the first area, and a bendable third area between the first area and the second area; a bonding layer in the second and third regions of the display panel and on the first surface of the display panel; a panel bottom cover in the first area of the display panel and on the first surface of the display panel; a first support film in the second area of the display panel and bonded to the bonding layer; a second support film in a third area of the display panel and bonded to the bonding layer; and a gap in the third region and separating the first support film from the second support film.

Description

[0001] This application claims priority to and the benefit of Korean Patent Application No. 10-2023-0156826 filed in the Korean Intellectual Property Office on November 13, 2023, the disclosure of which is incorporated herein by reference in its entirety. Technical Field

[0002] The present disclosure relates to a display device and a method of manufacturing the display device. Background Art

[0003] Today, display devices are used to display images in many applications. For example, various electronic devices such as smart phones, digital cameras, notebook computers, navigation devices, and smart televisions use display devices. Some popular types of display devices are liquid crystal displays (LCDs) and organic light emitting displays (OLEDs). OLEDs use organic light emitting elements that produce light through the recombination of electrons and holes to display images. OLEDs typically include multiple transistors in a pixel circuit that provides a drive current to the organic light emitting element. Attempts have been made to minimize the thickness of display devices in order to make them lighter. Summary of the invention

[0004] Aspects of the present disclosure may provide a display device having a reduced risk of crack formation in wiring of a display panel when the display panel is bent, may reduce the thickness of the display device and reduce manufacturing costs, and may provide a method of manufacturing a display device with reduced crack formation, reduced thickness or reduced cost.

[0005] The aspects of the present disclosure are not limited to the aspects set forth herein. The above and other aspects of the present disclosure will become more apparent to those of ordinary skill in the art to which the present disclosure pertains by referring to the detailed description of the present disclosure given below.

[0006] According to aspects of the present disclosure, a display device may include: a display panel, including a first area including a display area, a second area spaced apart from the first area, and a bendable third area located between the first area and the second area; a bonding layer, arranged in the second area and the third area of ​​the display panel and located on the first surface of the display panel; a panel bottom cover, arranged in the first area of ​​the display panel and located on the first surface of the display panel; a first supporting film, arranged in the second area of ​​the display panel and bonded to the bonding layer; a second supporting film, arranged in the third area of ​​the display panel and bonded to the bonding layer; and a gap, provided in the third area to separate the first supporting film and the second supporting film from each other.

[0007] In an embodiment, the bonding layer may include a photo-peelable adhesive of a type having an adhesive strength of 100 gf / inch or less after light irradiation.

[0008] In an embodiment, the first supporting film may include a burr pattern protruding downward from the first surface of the first supporting film along an inner surface of the first supporting film adjacent to the gap.

[0009] In an embodiment, an angle formed by the inner surface along which the burr pattern is formed and the first surface of the bonding layer in contact with the first support film may be 70 degrees or less.

[0010] In an embodiment, the display device may further include a driving chip, which is disposed in the second region of the display panel and located on a second surface of the display panel opposite to the first surface of the display panel.

[0011] In an embodiment, the display device may further include: a flexible printed circuit board electrically connected to the driving chip in the second region; and a base covering layer formed on the first surface of the flexible printed circuit board, wherein an end of the flexible printed circuit board can be bonded to an edge of the display panel in the second region, and the base covering layer can be located on the first surface of the flexible printed circuit board at the edge of the display panel and contact the display panel, the bonding layer and the first supporting film in the second region.

[0012] In an embodiment, the base cover layer may further include a covering portion extending from a first surface located at a lower side of the base cover layer toward the first supporting film contacting the base cover layer and covering a portion of a lower region of the first supporting film.

[0013] In an embodiment, the display device may further include a protective layer formed on a second surface of the display panel opposite to the first surface of the display panel in the third region.

[0014] In an embodiment, the display device may further include a supporting film connecting portion formed on the first surface of the bonding layer exposed to the gap and connecting the first supporting film and the second supporting film.

[0015] In an embodiment, the first surface of the display panel may be exposed to a gap in the third region, and the bonding layer may include a first bonding layer disposed in the second region and a second bonding layer spaced apart from the first bonding layer, and the gap is between the first bonding layer and the second bonding layer in the third region.

[0016] In an embodiment, the bonding layer and the second supporting film extend to a portion of the first region to be additionally located in the first region, a side surface of the bonding layer and a side surface of the second supporting film face a side surface of the panel bottom cover, and the display device further includes a supporting film connecting portion formed on a first surface of the bonding layer exposed to the gap and connecting the first supporting film and the second supporting film.

[0017] According to another aspect of the present disclosure, a display device is provided, the display device comprising: a display panel, comprising a first area including a display area, a second area spaced apart from the first area, and a bendable third area located between the first area and the second area; a bonding layer disposed in the second area and the third area of ​​the display panel and located on a first surface of the display panel; a first supporting film disposed in the second area of ​​the display panel and bonded to the bonding layer; a second supporting film disposed in the third area of ​​the display panel at a position spaced apart from the first supporting film and bonded to the bonding layer; a flexible printed circuit board having an end portion bonded to a distal area of ​​the display panel in the second area; and a substrate covering layer formed on the first surface of the flexible printed circuit board.

[0018] In an embodiment, the base cover layer may further include a covering portion extending from a first surface located at a lower side of the base cover layer toward the first supporting film contacting the base cover layer and covering a portion of a lower region of the first supporting film.

[0019] In an embodiment, the bonding layer may include a photo-peelable adhesive of a type having an adhesive strength of 100 gf / inch or less after light irradiation.

[0020] In an embodiment, the display device may further include a panel bottom cover, which is disposed in the first region of the display panel, contacts the bonding layer and the second supporting film, and is located on the first surface of the display panel.

[0021] In an embodiment, the panel bottom cover may include an adhesive member bonded to the first surface of the display panel in the first area, a heat dissipation member bonded to the adhesive member and dissipating the heat of the display panel, and a bending adhesive member bonded to the heat dissipation member and fixing the bending position of the display panel when the display panel is bent, and the third area includes a gap, which is a space formed between the first supporting film and the second supporting film, and the first supporting film may include a burr pattern, which protrudes downward from the first surface of the first supporting film along the inner surface of the first supporting film adjacent to the gap.

[0022] In an embodiment, the display device may further include a driving chip, which is disposed in the second region of the display panel and located on a second surface of the display panel opposite to the first surface of the display panel.

[0023] In an embodiment, the display device may further include a protective layer formed on a second surface of the display panel opposite to the first surface of the display panel in the third region.

[0024] According to another aspect of the present disclosure, a display device is provided, the display device comprising: a display panel comprising a first area including a display area, a second area spaced apart from the first area, and a bendable third area located between the first area and the second area; a panel bottom cover arranged in the first area of ​​the display panel and located on the first surface of the display panel; a bonding layer arranged in the second area, the third area and a part of the first area of ​​the display panel, in contact with the panel bottom cover in the first area, and located on the first surface of the display panel; a first supporting film arranged in the second area of ​​the display panel and bonded to the bonding layer; a second supporting film arranged in the first area of ​​the display panel, in contact with the panel bottom cover in the first area, and bonded to the bonding layer; and a gap provided in the third area of ​​the display panel as a space between the first supporting film and the second supporting film, wherein the bonding layer has a first surface exposed to the gap in the third area, and comprises a first adhesive layer located on the first surface of the display panel and a second adhesive layer in contact with the first adhesive layer.

[0025] According to another aspect of the present disclosure, a method for manufacturing a display device is provided, the display device having a display panel, the display panel including a first area including a display area, a second area spaced apart from the first area, and a bendable third area including a gap between the first area and the second area, the method comprising: preparing a mother substrate structure, the mother substrate structure including a light-peelable bonding body layer and a supporting film layer; forming a cutting line in the mother substrate structure, forming a first supporting film in the second area and a second supporting film in the third area, and forming a gap between the first supporting film and the second supporting film; separating a display unit from the mother substrate structure to prepare a display panel; selectively irradiating light to a first area of ​​the display panel; peeling off and removing the supporting film layer in the first area irradiated with light; and forming a panel bottom cover in the first area where the supporting film layer has been peeled off, so that the panel bottom cover contacts the second supporting film in the third area.

[0026] In an embodiment, in the step of forming the cutting line, the cutting line may be formed by cutting the supporting film layer or cutting the supporting film layer and the photo-peelable bonding body layer through a laser process.

[0027] In an embodiment, in the step of forming the cutting line, a burr pattern protruding from the support film may be formed in a cut region where the cutting line is formed.

[0028] In an embodiment, in the step of forming the cutting line, a cutting surface is formed in the supporting film layer, and an inclined angle formed between the cutting surface and a lower surface of the bonding layer may be 70 degrees or less.

[0029] In an embodiment, in the step of irradiating light, a mask including a light-transmitting portion corresponding to the first area and light-blocking portions corresponding to the second area and the third area may be provided based on the cut line.

[0030] In an embodiment, the step of forming a panel bottom cover may include forming an adhesive member on the display panel in the first area, forming a heat dissipation member coupled to the adhesive member to radiate heat of the display panel, and may include forming a bending adhesive member coupled to the heat dissipation member and fixing the bending position of the display panel when the display panel is bent.

[0031] In an embodiment, the method may further include forming a protection layer on at least one of an upper surface of the display panel and a lower surface of the bonding layer in the third region.

[0032] In an embodiment, the method may further include forming a driving chip disposed in the second region of the display panel and on an upper surface of the display panel.

[0033] In an embodiment, the method may further include forming a flexible printed circuit board electrically connected to the driving chip and having one end coupled to a distal region of the display panel in the second region. The method may further include forming a substrate cover layer in contact with a side surface of the display panel, a side surface of the bonding layer, and a side surface of the supporting film in the second region.

[0034] In an embodiment, in the step of forming the base cover layer, a covering portion may be formed that extends from a lower surface of the base cover layer toward a side of the support film contacting one side of the base cover layer and covers a portion of a lower region of the support film.

[0035] According to the present disclosure, the second supporting film is located in the region where the bending starts when the display panel is bent. That is, the second supporting film is located in the starting region of the third region as the bending region to contact the panel bottom cover. Therefore, when the display panel is bent, the panel bottom cover and the display panel can be prevented from directly contacting and interfering with each other, thereby reducing the risk of crack formation in the wiring of the display panel. If the second supporting film is not provided differently from the present disclosure, bending stress may occur in the region where the bending starts, thereby increasing the risk of crack formation.

[0036] In addition, the second supporting film can support the panel bottom cover when in contact with the panel bottom cover. Therefore, when variable movement (ie, bending) of the display panel occurs, the second supporting film can support the panel bottom cover from one side and stably maintain the position of the panel bottom cover.

[0037] In addition, the second supporting film supports the display panel from below and contacts the panel bottom cover from one side. Therefore, when the display panel is bent, the second supporting film can support the display panel and the panel bottom cover so that the symmetrical position of the structure stacked on the display panel is not affected by the bending operation, that is, the structure can be bent symmetrically.

[0038] In addition, since the bonding layer is formed in the second region and the third region, the first support film and the second support film in different regions can be bonded to the display panel using one bonding layer. Therefore, the number of components for bonding the above-mentioned films can be reduced, thereby reducing the thickness and reducing the manufacturing cost. In addition, since the process of bonding each of the above-mentioned multiple films is simplified, the efficiency of the manufacturing process can be improved.

[0039] If the first supporting film is disposed in the first region, the position of the neutral plane may be changed by the first supporting film when the display panel is bent or folded. However, in the present disclosure, the first supporting film is not disposed in the first region but is located in the second region, and the second supporting film is located in the third region. In this case, the position of the neutral plane may remain unchanged.

[0040] In addition, if the first supporting film is located in the first region, the total thickness may increase because the stacking structure in the first region as the display region increases. However, in the present disclosure, the first supporting film and the second supporting film are located in the second region and the third region as the non-display region, and the first supporting film is not provided in the first region including the display region. In this case, the stacking structure can be reduced in the first region as the display region, thereby reducing the total thickness of the display device.

[0041] In addition, a cover portion may be formed adjacent to the first support film in the second region to seal a portion of the lower surface of the first support film. Thus, moisture can be prevented from penetrating into the flexible printed circuit board and the driving chip connected to the flexible printed circuit board, thereby preventing corrosion caused by moisture.

[0042] During the manufacturing process, the supporting film layer can be joined and then peeled off by the photo-peelable adhesive layer, and the adhesive strength of the photo-peelable adhesive layer is reduced by light irradiation. Therefore, the supporting film layer does not remain to cause defects, and does not leave damage on the peeling surface. Therefore, the defect rate can be reduced, and problems such as tearing during the peeling process can be suppressed.

[0043] However, aspects of the present disclosure are not limited to the aspects set forth herein. The above and other aspects of the present disclosure will become more apparent to those of ordinary skill in the art to which the present disclosure belongs by referring to the claims. BRIEF DESCRIPTION OF THE DRAWINGS

[0044] These and / or other aspects will become apparent and more readily understood from the following description of embodiments taken in conjunction with the accompanying drawings.

[0045] Figure 1 is a perspective view of a display device according to an embodiment.

[0046] Figure 2 yes Figure 1 A plan view of the display device shown in FIG.

[0047] Figure 3 yes Figure 1 A rear view of the display device shown in FIG.

[0048] Figure 4 yes Figure 3 A rear view of a display panel in a display device.

[0049] Figure 5 It is schematically shown Figure 4 A cross-sectional view of the structure of a display panel.

[0050] Figure 6 yes Figure 5 An enlarged cross-sectional view of the stacked structure of a display panel.

[0051] Figure 7 is along Figure 2 and Figure 3 A cross-sectional view taken along line X1-X1'.

[0052] Figure 8 is focused on Figure 7 A magnified view of the first area.

[0053] Fig. 9 is focused on Figure 7 A magnified view of the second region.

[0054] Fig.10 is based on Figure 7 0 is an enlarged view of a second area, a third area, and a portion of the first area of ​​the first embodiment of the display device shown in .

[0055] Fig.11 is based on Figure 7 0 is an enlarged view of a second area, a third area, and a portion of the first area of ​​the second embodiment of the display device shown in .

[0056] Fig.12 is based on Figure 7 0 is an enlarged view of a second area, a third area, and a portion of the first area of ​​the third embodiment of the display device shown in .

[0057] Fig.13 is based on Figure 70 is an enlarged view of a second region, a third region, and a portion of the first region of the fourth embodiment of the display device shown in .

[0058] Fig.14 is based on Figure 7 0 is an enlarged view of a second region, a third region, and a portion of the first region of the fifth embodiment of the display device shown in .

[0059] Fig.15 yes Figure 7 An enlarged view of the second area of ​​the display device and the flexible printed circuit board bonding area shown in FIG.

[0060] Fig.16 When the display panel is in a bent state Figure 7 A cross-sectional view of a portion of a display device.

[0061] Fig.17 is a flowchart illustrating a method of manufacturing a display device according to an embodiment of the present disclosure.

[0062] Fig.18 is a perspective view of an embodiment of a mother substrate structure for a display device.

[0063] Fig.19 yes Fig.18 A rear view of a mother substrate structure for a display device shown in FIG.

[0064] Fig. 20 , Fig.21 , Fig. 22 , Fig.23 , Fig.24 and Fig.25 is Fig.17 A cross-sectional view of a structure caused during a process of forming a first supporting film and a second supporting film, a bonding layer, and a panel bottom cover during a manufacturing process of FIG. DETAILED DESCRIPTION

[0065] Example embodiments of the present disclosure will now be described more fully below with reference to the accompanying drawings. However, the devices and processes described herein may be implemented in different forms and should not be construed as limited to the example embodiments set forth herein. Instead, these embodiments are provided so that the present disclosure will be thorough and complete and will convey to those skilled in the art an understanding of the subject matter defined by the claims.

[0066] Hereinafter, a layer or substrate referred to as being "on" another layer or substrate may be directly on the other layer or substrate, or an intervening layer may also be present. Likewise, "below," "left," and "right" include situations in which one or more elements may be directly adjacent to other elements, or situations in which another element, layer, or material is interposed.

[0067] The terms "first", "second", etc. may be used herein to describe various elements, but these elements should not be limited by these terms. These terms are only used to distinguish one element from another element. For example, without departing from the teachings of the present disclosure, the first element discussed below may be referred to as the second element. Similarly, the second element may also be referred to as the first element.

[0068] The features of each of the various embodiments of the present disclosure may be partially or completely combined with each other and may interact with each other differently, and the respective embodiments may be implemented independently of each other, or may be implemented together in association with each other.

[0069] Hereinafter, embodiments of the present disclosure will be described with reference to the accompanying drawings. The same reference numerals used in the drawings and throughout the specification represent the same or similar components. In the drawings, the thickness of layers and regions may be exaggerated or otherwise changed for clarity or ease of description.

[0070] Figure 1 is a perspective view of a display device 1 according to the embodiment. Figure 2 yes Figure 1 1 is a plan view of the display device 1 shown in FIG. Figure 3 yes Figure 1 2 is a rear view of the display device 1 shown in FIG. Figure 4 yes Figure 3 FIG. 1 is a rear view of the display panel 100 in the display device 1. Here, Figures 1 to 4 The display device 1 is shown in a flat state before the display device 1 is bent or folded.

[0071] The display device 1 can be applied to a portable terminal, etc. Examples of portable terminals may include a tablet personal computer (PC), a smart phone, a personal digital assistant (PDA), a portable multimedia player (PMP), a game console, and a watch-type electronic device. However, the present disclosure is not limited to a specific type of display device 1. For example, in other embodiments of the present disclosure, the display device 1 can be used for small and medium-sized electronic devices such as PCs, notebook computers, car navigation devices, and cameras, as well as for large electronic devices such as televisions and outdoor billboards.

[0072] In an embodiment, the display panel 100 in the display device 1 may have a rectangular shape. The display panel 100 may have a rectangular shape in a plan view, and may include two short sides, two long sides, and a rectangular panel surface surrounded by the short sides and the long sides. Figure 2The display panel 100 having a rectangular planar shape is shown, wherein each corner where the long side and the short side intersect is a right angle. However, the present disclosure is not limited thereto. Optionally, the corners of the display panel 100 may be rounded, and the planar shape of the display panel 100 may also be a circular shape or other various shapes.

[0073] based on Figure 1 , the short side of the display panel 100 may be described as extending in the first direction x, the long side of the display panel 100 may be described as extending in the second direction y, and the direction perpendicular to the panel surface of the display panel 100 may be described as the third direction z. In addition, unless otherwise defined below, in this specification, "above", "top", "upper surface" and "upper side" refer to the direction of the arrow in the third direction z relative to the display panel 100. Figure 1 The display panel 100 shown in FIG. 1 is pointed to the direction, and “below”, “bottom”, “lower surface” and “lower side” refer to the direction in which the arrow in the third direction z is relative to the direction in which the display panel 100 is pointed to. Figure 1 The direction is opposite to the direction in which the display panel 100 shown in FIG. 1 is pointing.

[0074] The display panel 100 may be a display panel 100 including a self-luminous element. In an exemplary embodiment, the self-luminous element may include at least one of an organic light emitting diode, a quantum dot light emitting diode, an inorganic material-based micro light emitting diode (e.g., micro LED), and an inorganic material-based nano light emitting diode (e.g., nano LED). For ease of description, each element of the display panel 100 will be described in detail below using an example in which the self-luminous element is an organic light emitting element.

[0075] The area of ​​the display panel 100 may be divided or zoned based on image display. Therefore, the display panel 100 may include a display area DA that displays an image and a non-display area NDA that does not display an image. The non-display area NDA may be located around the display area DA and may surround the display area DA.

[0076] The area of ​​the display panel 100 may also be divided or zoned based on the bend, and thus the display panel 100 may include a first area A1, a second area A2, and a third area A3.

[0077] The first area A1 may be spaced apart from the second area A2, the first area A1 may include the display area DA, and may be foldable. For example, the first area A1 may be folded upward or downward about a folding axis FX extending along the first direction x. That is, the first area A1 may be folded about the folding axis FX so that the folding will Figure 1A portion of the first area A1 shown in FIG. 1 having a normal in the direction indicated by the arrow of the third direction z (i.e., the upward direction) is redirected to a position where the normal of the folded portion is in the direction opposite to the direction indicated by the arrow of the third direction z (i.e., the downward direction).

[0078] The second area A2 may be spaced apart from the first area A1 and may be a part of the non-display area NDA.

[0079] The third area A3 may be another part of the non-display area NDA and may be between the first area A1 and the second area A2. The third area A3 may include a gap G between the first area A1 and the second area A2. The gap G may be formed to cross the non-display area NDA along the first direction x which is the short side direction of the display panel 100.

[0080] The display panel 100 may be bent in the third area A3 about a bending axis BX extending along the first direction x, and in particular may be bent downward about the bending axis BX in the third area A3. Therefore, a portion of the non-display area NDA of the display panel 100 may be bent toward the bottom of the display panel 100, so that the portion of the non-display area NDA of the display device 1 visible from above may be reduced, and the frame width of the display device 1 may be reduced.

[0081] One or more driver chips IC may be disposed on the display panel 100 in the second area A2, and the second area A2 may include pads connected to the driver chip IC. The driver chip IC may include at least one driving device including a data driver that transmits a data signal to a data line, a gate driver that transmits a gate signal to a gate line, and a signal controller that controls the operation of the data driver and the operation of the gate driver. The display panel 100 is not limited to having a single driver chip as shown in the illustrated example.

[0082] The driver chip IC may be mounted on the display panel 100 using a plastic flip chip method. The driver chip IC may be mounted on the display panel 100 using a pressurizing device. The driver chip IC may be mounted on the display panel 100 using an anisotropic conductive film. Alternatively, in an embodiment, the driver chip IC may be mounted on the display panel 100 using an ultrasonic bonding method without a separate anisotropic conductive film.

[0083] Ultrasonic bonding is a method of joining two metals by applying pressure and ultrasonic vibration. When the driver chip IC is mounted on the display panel 100 using the ultrasonic bonding method, a process of applying pressure and ultrasonic vibration to the driver chip IC may be performed. However, the present disclosure is not limited to the above-described embodiments. In an embodiment, the driver chip IC may be mounted on a flexible printed circuit board FPCB in the form of a chip-on-film.

[0084] An end portion of the flexible printed circuit board FPCB may be located on an edge of the display panel 100 in the second area A2. The flexible printed circuit board FPCB may be connected to a pad provided on the display panel 100, for example, through an anisotropic conductive film or the like. A process of connecting the flexible printed circuit board FPCB to the display panel 100 may include a process of applying pressure to the flexible printed circuit board FPCB.

[0085] The main circuit board MP may be electrically connected to the display panel 100 through the flexible printed circuit board FPCB, and may exchange signals with the driving chip IC. The main circuit board MP may provide image data, control signals, power supply voltage, etc. to the display panel 100 or the flexible printed circuit board FPCB. The main circuit board MP may include active components and passive components.

[0086] Figure 5 It is schematically shown Figure 4 1 is a cross-sectional view of the structure of the display panel 100 . Figure 6 yes Figure 5 An enlarged cross-sectional view of a stacked structure of a display panel 100 is shown.

[0087] The display panel 100 may include a base substrate 110 , a driving layer 120 , an organic light emitting element layer 130 , and an encapsulation layer 140 .

[0088] The base substrate 110 provides the lower surface 101 of the display panel 100. The base substrate 110 may be a flexible substrate and may be made of a flexible polymer material. For example, the base substrate 110 may be made of a plastic having excellent heat resistance and durability, such as polyvinyl ether phthalate, polyethylene naphthalate, polycarbonate, polyarylate, polyetherimide, polyethersulfone, or polyimide. The case where the base substrate 110 includes polyimide will be described below as an example.

[0089] The driving layer 120 includes an element for providing a signal to the organic light emitting element layer 130. The driving layer 120 may include various signal lines, for example, a scan line (not shown), a data line (not shown), a power line (not shown), and an emission line (not shown). The driving layer 120 may include a plurality of transistors and capacitors. The transistor may include a switching transistor (not shown) and a driving transistor Qd provided in each pixel (not shown).

[0090] Figure 6 An example of a driving transistor Qd of the driving layer 120 is shown. The driving transistor Qd includes an active layer 211 in the driving layer 120, a gate electrode 213, a source electrode 215, and a drain electrode 217.

[0091] The active layer 211 may be disposed on the base substrate 110. The active layer 211 may include polycrystalline silicon. Alternatively, the active layer 211 may include single crystal silicon, low temperature polycrystalline silicon, or amorphous silicon. However, the present disclosure is not limited thereto, and the active layer 211 may also include an oxide semiconductor.

[0092] The driving layer 120 may further include a first insulating layer 221 disposed on the active layer 211 , and the gate electrode 213 may be located on the first insulating layer 221 .

[0093] The first insulating layer 221 may insulate the active layer 211 and the gate electrode 213 from each other. The first insulating layer 221 may include an inorganic insulating material such as silicon oxide, silicon nitride, or silicon oxynitride. The first insulating layer 221 may be a single layer or a multilayer consisting of stacked layers of different materials.

[0094] The gate electrode 213 may be located on the first insulating layer 221 and may overlap the active layer 211. The gate electrode 213 may include a conductive material or metal such as gold (Au), silver (Ag), copper (Cu), nickel (Ni), platinum (Pt), palladium (Pd), aluminum (Al), or molybdenum (Mo).

[0095] The driving layer 120 may further include a second insulating layer 223 on the gate electrode 213 , and the source electrode 215 and the drain electrode 217 may be disposed on the second insulating layer 223 .

[0096] The second insulating layer 223 may include at least one of the various insulating materials exemplified in the description of the first insulating layer 221 .

[0097] The source electrode 215 and the drain electrode 217 may be connected to the active layer 211 through respective contact holes CH1 and CH2 provided in the first and second insulating layers 221 and 223. The source electrode 215 and the drain electrode 217 may have a metal multilayer structure of, but not limited to, titanium (Ti) / aluminum (Al) / titanium (Ti).

[0098] The driving layer 120 may further include a protective layer 230 disposed on the source electrode 215 and the drain electrode 217. In some embodiments, the protective layer 230 may be a planarization layer. For example, the protective layer 230 may include an organic insulating material or an inorganic insulating material, or may be implemented as a composite material of an organic insulating material and an inorganic insulating material.

[0099] Despite Figure 6The structure of the switching transistor is not shown in the figure, but the switching transistor (not shown) and the driving transistor Qd may have substantially the same structure or a similar structure. However, the present disclosure is not limited thereto, and the switching transistor (not shown) and the driving transistor Qd may also have different structures. For example, the active layer (not shown) of the switching transistor (not shown) and the active layer 211 of the driving transistor Qd may be made of different materials or may be provided on different layers.

[0100] The driving layer 120 may be located not only in the display area DA (see FIG. Figure 1 ) and may be located in a non-display area NDA (see Figure 1 The portion of the driving layer 120 located in the non-display area NDA (eg, located in the first area A1 (see Figure 1 ) of the non-display area NDA, the second area A2 (see Figure 1 ) or the third area A3 (see Figure 1 ) may include a portion electrically connected to a driver chip IC (see Figure 1 ) wiring and pad unit, and may also include a wiring and pad unit electrically connected to a flexible printed circuit board FPCB (see Figure 1 )’s wiring and pad units.

[0101] The organic light emitting element layer 130 may include an organic light emitting element LD as a self-luminous element. The organic light emitting element LD may be provided as a top emission type and may emit light in a thickness direction of the display panel 100 (which is a third direction z).

[0102] The organic light emitting element LD may include a first electrode AE, an organic layer OL, and a second electrode CE.

[0103] The first electrode AE ​​is disposed on the protective layer 230. The first electrode AE ​​is connected to the drain electrode 217 through a contact hole CH3 formed in the protective layer 230. The first electrode AE ​​may be a pixel electrode or an anode of the organic light emitting element LD. The first electrode AE ​​may be a semi-transmissive and semi-reflective electrode or a reflective electrode. When the organic light emitting element LD is provided as a top emission type, the first electrode AE ​​may be a reflective electrode. The first electrode AE ​​may include a reflective conductor, such as any one or more of silver (Ag), magnesium (Mg), aluminum (Al), platinum (Pt), palladium (Pd), gold (Au), nickel (Ni), neodymium (Nd), iridium (Ir) and chromium (Cr), or an alloy thereof.

[0104] The first electrode AE ​​may be a single-layer structure made of metal oxide or metal or a multi-layer structure having multiple layers. For example, the first electrode AE ​​may have a single-layer structure of (but not limited to) indium tin oxide (ITO), silver (Ag) or a metal mixture (e.g., a mixture of Ag and Mg), indium tin oxide (ITO) / magnesium (Mg) or indium tin oxide (ITO) / magnesium fluoride (MgF 2 ) or a three-layer structure of indium tin oxide (ITO) / silver (Ag) / indium tin oxide (ITO).

[0105] The organic layer OL may include an organic emission layer (EML) made of a low molecular organic material or a high molecular organic material. The organic emission layer may emit light. In addition to the organic emission layer, the organic layer OL may optionally include a hole transport layer (HTL), a hole injection layer (HIL), an electron transport layer (ETL), and an electron injection layer (EIL).

[0106] Holes and electrons respectively from the first electrode AE ​​and the second electrode CE are injected into the organic emission layer inside the organic layer OL. The holes and electrons are recombined in the organic emission layer to form excitons, and light is emitted when the excitons drop from an excited state to a ground state.

[0107] The second electrode CE may be provided on the organic layer OL. The second electrode CE may be a common electrode including a cathode of the organic light emitting element LD. The second electrode CE may be a transmissive electrode or a semi-transmissive and semi-reflective electrode. When the second electrode CE is a semi-transmissive and semi-reflective electrode, it may include lithium (Li), lithium fluoride (LiF), calcium (Ca), lithium fluoride (LiF), aluminum (Al), magnesium (Mg), barium fluoride (BaF 2 ), barium (Ba), silver (Ag), or a compound or mixture thereof (e.g., a mixture of Ag and Mg), or a material having a multilayer structure such as lithium fluoride (LiF) / calcium (Ca) or lithium fluoride (LiF) / aluminum (Al). When the second electrode CE is a transmissive electrode, it may include a transparent metal oxide (such as indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), or indium tin zinc oxide (ITZO)), or may include molybdenum (Mo), titanium (Ti), or silver (Ag).

[0108] The organic light emitting element layer 130 may further include a pixel defining layer PDL disposed on the protective layer 230. The pixel defining layer PDL may include an opening superimposed on the first electrode AE ​​in a plan view, and may define an emission area LTA.

[0109] The encapsulation layer 140 may be disposed on the organic light emitting element layer 130. The encapsulation layer 140 may protect the organic light emitting element layer 130 from external moisture and oxygen. The encapsulation layer 140 may be formed as a thin film encapsulation and may include one or more organic layers and one or more inorganic layers. For example, the encapsulation layer 140 may include a first inorganic layer 141 on the second electrode CE, an organic layer 145 on the first inorganic layer 141, and a second inorganic layer 143 on the organic layer 145.

[0110] The first inorganic layer 141 may be disposed on the organic light emitting element LD and may prevent moisture, oxygen, etc. from penetrating into the organic light emitting element LD. In some embodiments, the first inorganic layer 141 may include an inorganic material, and the inorganic material may include, for example, silicon oxide (SiO x ), silicon nitride (SiN x ) and silicon oxynitride (SiO x N y ) any one or more.

[0111] The organic layer 145 may be on the first inorganic layer 141. The organic layer 145 may improve flatness. The organic layer 145 may include an organic material, and the organic material may include, for example, any one of epoxy resin, acrylate resin, and urethane acrylate resin.

[0112] The second inorganic layer 143 may be located on the organic layer 145. The second inorganic layer 143 may perform substantially the same or similar role as the first inorganic layer 141, and may be made of substantially the same or similar material as the first inorganic layer 141. The second inorganic layer 143 may completely cover the organic layer 145. In some embodiments, the second inorganic layer 143 and the first inorganic layer 141 may contact each other outside the display area DA to form an inorganic-inorganic bond. The inorganic-inorganic bond may effectively prevent moisture from being introduced into the display device 1 from the outside of the display device 1.

[0113] Although each of the first inorganic layer 141, the organic layer 145, and the second inorganic layer 143 is Figure 6 In the figure, it is shown as a single layer, but the present disclosure is not limited thereto. That is, optionally, at least one of the first inorganic layer 141, the organic layer 145, and the second inorganic layer 143 may be a multi-layer structure.

[0114] The encapsulation layer 140 may not completely cover the non-display area NDA of the display panel 100. For example, the encapsulation layer 140 may not exist in a portion of the first area A1 of the display panel 100 between the third area A3 and the display area DA, and may not exist in the second area A2 and the third area A3. Alternatively, the encapsulation layer 140 may be in a portion of the first area A1 of the display panel 100 between the third area A3 and the display area DA, and may not exist in the second area A2 and the third area A3. For ease of description, the following case is described as an example: the encapsulation layer 140 is in the display area DA of the display panel 100, does not exist in a portion of the first area A1 between the third area A3 and the display area DA, and does not exist in the second area A2 and the third area A3.

[0115] Figure 7 is along Figure 2 and Figure 3 A cross-sectional view taken along line X1-X1'. Figure 7 is a cross-sectional view of the display panel 100 , on which the panel bottom cover 300 , the first and second supporting films 400 and 450 , and the base cover layer 500 may be in the first to third areas A1 to A3 .

[0116] The panel bottom cover 300 may be bonded to a lower surface 101 (ie, a first surface) of the display panel 100 in a first area A1 spaced apart from the first supporting film 400 , and may support the display panel 100 .

[0117] The polarizer 310 is located on the panel bottom cover 300, and the display panel 100 is interposed between the polarizer 310 and the panel bottom cover 300. The polarizer 310 may be located on the upper surface 102 (i.e., the second surface) of the display panel 100, may increase the contrast in the displayed image by expressing true black, and may improve the outdoor visibility of the displayed image.

[0118] The panel bottom cover 300 may include an adhesive member 320 attached to the lower surface 101 of the display panel 100, a heat dissipation member 330 for effectively dissipating heat from the display panel 100, and a bending adhesive member 340 for fixing a bent state of the display panel 100 when the display panel 100 is bent.

[0119] The adhesive member 320 is interposed between the display panel 100 and the heat dissipation member 330 to attach the panel bottom cover 300 to the display panel 100. The adhesive member 320 may be an adhesive layer made of a pressure sensitive adhesive (PSA), and may attach the panel bottom cover 300 to the display panel 100. For example, the adhesive member 320 may include, but is not limited to, an acrylic adhesive or a silicone adhesive. The adhesive member 320 may be formed as a pressure sensitive adhesive layer, and may further include a light absorbing material such as a black pigment or a black dye to absorb light incident from the outside of the display panel 100.

[0120] The heat dissipation member 330 may be bonded by the adhesive member 320, and may include a metal layer 331 and a plating layer 332, and the plating layer 332 may be formed on at least one of the upper surface and the lower surface of the metal layer 331. The metal layer 331 may be, but is not limited to, a thin film made of one or more metal materials selected from copper, nickel, ferrite, and silver having excellent thermal conductivity. The plating layer 332 may be made of the same or different metal material as that used in the metal layer 331. Although Figure 8 The plating layer 332 on both the upper and lower surfaces of the metal layer 331 is shown, but alternatively, the plating layer 332 may be formed on only one surface of the metal layer 331 .

[0121] The heat dissipation member 330 may be, but is not limited to, a composite layer including, for example, a first layer containing graphite or carbon nanotubes and a second layer made of a thin film of a material such as copper, nickel, ferrite or silver, which may shield electromagnetic waves and have excellent thermal conductivity.

[0122] When the display panel 100 is bent, the bending adhesive member 340 fixes the bent state of the display panel 100. The bent state of the display panel 100 may be fixed by bending the display panel 100 to contact the first supporting film 400 with the bending adhesive member 340 and attaching the first supporting film 400 to the bending adhesive member 340. The bending adhesive member 340 may include, but is not limited to, an acrylic adhesive or a silicone adhesive.

[0123] The panel bottom cover 300 may further include a buffer member (not shown). The buffer member may be located on the heat dissipation member 330 and the bending adhesive member 340. The buffer member (not shown) may be formed as a cushion layer to support the display panel 100 and prevent damage to the display panel 100 by absorbing external impact. For example, the buffer member (not shown) may be made of a polymer resin such as polyurethane, polycarbonate, polypropylene, or polyethylene, or may be made of an elastic material such as a sponge formed of foam molded rubber, a urethane material, or an acrylic material.

[0124] The first supporting film 400 is spaced apart from the heat dissipation member 330 of the panel bottom cover 300, and the second supporting film 450 is interposed between the first supporting film 400 and the heat dissipation member 330. The first supporting film 400 is spaced apart from the heat dissipation member 330 in the horizontal direction, and the gap G and the second supporting film 450 are interposed between the first supporting film 400 and the heat dissipation member 330. The first supporting film 400 and the heat dissipation member 330 spaced apart from each other may be arranged parallel to each other. The bonding layer 410 may bond the first supporting film 400 to the lower surface 101 of the display panel 100 in the second area A2 at a position overlapping with the driving chip IC in the vertical direction.

[0125] The first supporting film 400 may be made of, for example, at least one of polyethylene terephthalate (PET), polycarbonate (PC), and polymethyl methacrylate (PMMA). The first supporting film 400 may be most preferably made of polyethylene terephthalate (PET), but the present disclosure is not limited thereto.

[0126] The first supporting film 400 may be made of a film having a high tensile modulus or a high light transmittance. When the first supporting film 400 is made of a film having a high tensile modulus, the first supporting film 400 may support the flexible display panel 100, protect the lower surface 101 of the display panel 100, and prevent the formation of cracks in the display panel 100 during the process of mounting the driver chip IC on the display panel 100. When the driver chip IC is mounted on the second area A2 of the display panel 100, pressure may be applied to the second area A2. Here, since the first supporting film 400 disposed on the lower surface 101 of the display panel 100 corresponding to the second area A2 has a high tensile modulus, the first supporting film 400 may prevent cracks from forming in the wiring of the non-display area NDA due to the pressure applied during the process of mounting the driver chip IC.

[0127] The first support film 400 may be made of a film having a high transmittance, and the transmittance of the first support film 400 may be (but not limited to) about 80% or more. When the first support film 400 is made of a film having a high transmittance, the driver chip IC may be mounted on the display panel 100 by high-voltage bonding in the second area A2 to which the first support film 400 is bonded. An optical microscope or the like may be used to observe or inspect the driver chip IC through the first support film 400 to determine whether the driver chip IC has been correctly installed. Here, since the transmittance of the first support film 400 located in the second area A2 where the driver chip IC is mounted is high, the installation state of the driver chip IC may be easily checked. Therefore, the problem of undetected defects caused by compression of the driver chip IC may be avoided.

[0128] The display panel 100 may be folded along the folding axis FX (see Figure 1) folded, especially when the first area A1 is spaced apart from the second area A2. On the contrary, if the first supporting film 400 is in the first area A1 which may be foldable, when the display panel 100 is bent or folded, the first supporting film 400 may change the position of the neutral plane in the first area A1. However, since the first supporting film 400 is not disposed in the first area A1 in the present disclosure, the first supporting film 400 does not change the position of the neutral plane in the first area A1.

[0129] If the first supporting film 400 is located in the first area A1, the total thickness of the display device 1 may increase due to the increase in the number of stacked structures in the first area A1 as the display area DA. However, according to the present disclosure, the first supporting film 400 is disposed in the second area A2 as the non-display area NDA, and is not disposed in the first area A1 as the display area DA. Therefore, the number of stacked structures can be reduced in the first area A1 including the display area DA, thereby reducing the total thickness of the display device 1.

[0130] In addition, since the first supporting film 400 is not disposed in the first area A1, the number of stacked structures in the first area A1 including the display area DA may be reduced, thereby reducing manufacturing costs.

[0131] As described above, the first supporting film 400 is not disposed in the first area A1, but is located on the lower surface 101 of the display panel 100 at a position corresponding to the driving chip IC in the second area A2. Therefore, the first supporting film 400 can protect the display panel 100 accordingly in the second area A2, and the problems of cracks and driving chip defects can be avoided.

[0132] The bonding layer 410 is formed on the lower surface 101 of the display panel 100 and extends in the horizontal direction in the second area A2 and the third area A3. The bonding layer 410 bonds the first support film 400 to the lower surface 101 of the display panel 100 in the second area A2, and bonds the second support film 450 to the lower surface 101 of the display panel 100 in the third area A3. Since the bonding layer 410 is formed in the second area A2 and the third area A3, the first support film 400 and the second support film 450 in different areas (the second area A2 and the third area A3) can be bonded to the lower surface 101 of the display panel 100 using one bonding layer 410. That is, since only one bonding layer 410 is provided in the second area A2 and the third area A3, the number of components for bonding the above-mentioned films can be reduced, thereby reducing the thickness and reducing the manufacturing cost. In addition, since the process of bonding each of the plurality of the above-mentioned films is simplified, the efficiency of the manufacturing process can be improved.

[0133] The bonding layer 410 may have the viscosity that can attach the first support film 400 and the second support film 450, and may be formed to have a high storage modulus. The bonding layer 410 may include, for example, one or more of polyester acrylate resin, unsaturated polyester resin, polyurethane acrylate resin, epoxy acrylate resin, epoxy resin, polyether acrylate resin, and polythiol acrylate resin. The bonding layer 410 may include an ultraviolet (UV) strippable adhesive, but the present disclosure is not limited thereto. When the bonding layer 410 is made of a UV strippable adhesive, the bonding strength of the bonding layer 410 may be reduced to 100gf / inch or less (peeled at 40mm / sec 180 degrees) in response to UV irradiation. However, the present disclosure is not limited thereto. Here, if the bonding layer 410 is made of a UV strippable adhesive, and its bonding strength is reduced to 100gf / inch or less (peeled at 40mm / sec 180 degrees) after light irradiation, the bonding layer 410 may be easily peeled off during the manufacturing process. Therefore, process convenience can be improved, and since there is no residue or damage on the peeled surface, the defect rate can be reduced.

[0134] The storage modulus of the bonding layer 410 may be high to prevent cracks from being formed by pressure during the process of mounting the driving chip IC. Since the bonding layer 410 having a high storage modulus is located on the second area A2 of the display panel 100 to which pressure is applied, cracks may be prevented.

[0135] The second supporting film 450 is disposed at a position spaced apart from the first supporting film 400 in the third area A3 and contacts the panel bottom cover 300. A gap G is formed in the third area A3 as a space between the first supporting film 400 and the second supporting film 450. The second supporting film 450 is spaced apart from the first supporting film 400 in a horizontal direction by the gap G. The second supporting film 450 and the first supporting film 400 spaced apart from each other may be parallel to each other.

[0136] The second supporting film 450 is bonded to the lower surface 101 of the display panel 100 through the bonding layer 410 in the third area A3, and supports the display panel 100 from below. The second supporting film 450 may be made of, for example, at least one of polyethylene terephthalate (PET), polycarbonate (PC), and polymethyl methacrylate (PMMA). The second supporting film 450 may most preferably be made of polyethylene terephthalate (PET), but the present disclosure is not limited thereto.

[0137] The second supporting film 450 is located in a region where bending of the display panel 100 may start when the display panel 100 is bent. That is, the second supporting film 450 is located in the third region A3 as a bending region. The second supporting film 450 may contact the panel bottom cover 300. Therefore, when the display panel 100 is bent, the second supporting film 450 may prevent the panel bottom cover 300 and the display panel 100 from directly contacting and interfering with each other, thereby reducing the risk of crack formation in the wiring of the display panel 100. If the second supporting film 450 is not provided, bending stress may occur in the region where bending starts, thereby increasing the risk of crack formation.

[0138] The second supporting film 450 may additionally support the panel bottom cover 300 while being in contact with the panel bottom cover 300. Therefore, when variable movement (i.e., bending) of the display panel 100 occurs, the second supporting film 450 supports the panel bottom cover 300 from one side to stably maintain the position of the panel bottom cover 300.

[0139] In addition, the second supporting film 450 supports the display panel 100 from below and contacts the panel bottom cover 300 from one side. Therefore, when the display panel 100 is bent, the second supporting film 450 can support the display panel 100 and the panel bottom cover 300 so that the symmetrical position of the structure stacked on the display panel 100 is not affected by the bending operation. As a result, the structure can be bent symmetrically.

[0140] The base cover layer 500 is disposed on the lower surface of the flexible printed circuit board FPCB at a position contacting the bonding layer 410 and the first supporting film 400 in the second area A2 and the display panel 100. The base cover layer 500 may be formed in various forms such as an organic layer, and may include, for example, one or more of an acrylic resin and a urethane resin. However, the present disclosure is not limited thereto.

[0141] The upper protective layer 600a may be located in the third area A3 on the upper surface 102 of the display panel 100, and an edge of the upper protective layer 600a may contact the polarizer 310. Although only the upper protective layer 600a is shown, a lower protective layer (not shown) may also be formed on the bonding layer 410 in the third area A3.

[0142] The upper protective layer 600a is located between the polarizer 310 in the first area A1 and the driving chip IC in the second area A2 along the horizontal direction, and is disposed on the upper surface 102 of the display panel 100. The upper protective layer 600a may act as a neutral plane adjustment layer 600a on the non-display area NDA of the display panel 100. The neutral plane adjustment layer 600a may overlap with the bendable third area A3 of the non-display area NDA of the display panel 100. Although Figure 7An embodiment in which the neutral plane adjusting layer 600 a is only in the third area A3 is shown, but a portion of the neutral plane adjusting layer 600 a may overlap with the first area A1 or the second area A2 .

[0143] The neutral plane adjustment layer 600a can be applied to the driving layer 120 (see Figure 5 ) to prevent the formation of cracks in the wiring within the driving layer 120. More specifically, the driving layer 120 of the display panel 100 may include wiring passing through the non-display area NDA of the first area A1 and the third area A3, and the elements in the driving layer 120 may be electrically connected to the driving chip IC through the wiring. The neutral plane adjustment layer 600a adjusts the position of the neutral plane to prevent tensile stress from acting on the wiring located in the third area A3. Here, the neutral plane refers to a plane on which neither compressive stress nor tensile stress acts when the third area A3 of the display panel 100 is bent. For example, when the third area A3 is bent, compressive stress acts on the inside of the bending arc, and tensile stress acts on the outside of the bending arc. Therefore, from the inside to the outside of the bending arc, the direction of stress gradually changes from the compression direction to the tension direction. At a certain critical point, there is a transition point where neither compressive stress nor tensile stress acts, and this point becomes a neutral plane. If the position of the neutral plane is adjusted by the neutral plane adjusting layer 600a, compressive stress acts on the wiring in the driving layer 120, thereby reducing the risk of crack formation.

[0144] The neutral plane adjustment layer 600a may be made of an organic material, such as a photosensitive organic material, such as an acrylic resin or a urethane resin.

[0145] although Figure 7 An embodiment in which the neutral plane adjustment layer 600a is spaced apart from the driver chip IC is shown, but the present disclosure is not limited thereto. The neutral plane adjustment layer 600a may extend to the driver chip IC and may cover a portion of the driver chip IC. In this case, the coupling reliability between the driver chip IC and the display panel 100 may be improved.

[0146] Figure 8 is focused on Figure 7 An enlarged view of the first area A1. Fig. 9 is focused on Figure 7 An enlarged view of the second area A2. Fig.10 is based on Figure 7 0 is an enlarged view of a portion of the second area A2 , the third area A3 , and the first area A1 of the first embodiment of the display device 1 shown in FIG.

[0147] Figure 8The panel bottom cover 300 may include a side surface or inner surface 301 closest to the gap G, an upper surface 302 opposite to the lower surface of the bonding layer 410, and a lower surface 303 opposite to the upper surface 302. The upper surface 302 of the panel bottom cover 300 contacts the lower surface 101 of the display panel 100. The angle formed by the inner surface 301 of the panel bottom cover 300 and the lower surface 101 of the display panel 100 may be a right angle. In this case, the panel bottom cover 300 may have a shape such as Figure 8 However, the shape of the panel bottom cover 300 is not limited to the rectangular cross-sectional shape.

[0148] like Fig. 9 The bonding layer 410 shown in FIG. 4 may include an upper surface 412 in contact with the lower surface 101 of the display panel 100 and a lower surface 413 (ie, a first surface) opposite to the upper surface 412 .

[0149] like Fig. 9 The first supporting film 400 shown in the figure may include an inner surface or side surface 401 adjacent to the gap G, an upper surface 402 in contact with the lower surface 413 of the bonding layer 410, and a lower surface 403 (i.e., a first surface) opposite to the upper surface 402. The upper surface 402 of the first supporting film 400 contacts the lower surface 413 of the bonding layer 410. The inclination angle θ formed by the inner surface 401 of the first supporting film 400 exposed to the gap G in the third area A3 and the lower surface 413 of the bonding layer 410 may be an acute angle. For example, the inclination angle θ may be greater than 0 degrees and less than about 70 degrees, but the present disclosure is not limited thereto. In addition, the inclination angle θ may be less than the angle formed by the inner surface 301 of the panel bottom cover 300 and the lower surface 413 of the bonding layer 410, but the present disclosure is not limited thereto.

[0150] The first supporting film 400 may further include a burr pattern BU protruding downward from the lower surface 403 of the supporting film 400 and may extend along the inner surface 401 adjacent to the gap G. The burr pattern BU may extend in the same direction (e.g., along the first direction x) as the gap G. During the manufacturing process, when a laser is irradiated on the first supporting film 400, the burr pattern BU of the first supporting film 400 may be formed. The burr pattern BU may be formed when the heat energy of the laser melts a portion of the first supporting film 400.

[0151] like Fig.10 The second supporting film 450 shown in FIG. 4 may include an inner surface or side surface 451 in contact with the heat dissipation member 330 , an upper surface 452 in contact with the lower surface 413 of the bonding layer 410 , and a lower surface 453 opposite to the upper surface 452 . Fig.10A first embodiment is shown, in which the second supporting film 450 may be located in the third area A3 and may contact the heat dissipation member 330. The second supporting film 450 is spaced apart from the first supporting film 400 by a gap G, and an upper surface 452 of the second supporting film 450 is attached to the lower surface 413 of the bonding layer 410 as is the upper surface 402 of the first supporting film 400. More specifically, the lower surface 413 of the bonding layer 410 in the second area A2 is bonded to the first supporting film 400, a portion of the lower surface 413 of the bonding layer 410 in the third area A3 is exposed to the gap G, and another portion of the lower surface 413 of the bonding layer 410 in the third area A3 is bonded to the second supporting film 450.

[0152] Fig.11 is based on Figure 7 The display device 1 shown in Figure 1 ) is an enlarged view of a portion of the second area A2, the third area A3 and the first area A1 of the second embodiment. Fig.11 As shown in the above reference Fig.10 The components described are the same as the components described.

[0153] As a second embodiment, Fig.11 The second supporting film 450 may be located in the third area A3 and may be connected to the first supporting film 400 through the supporting film connecting portion 460. The supporting film connecting portion 460 is located in the third area A3 together with the second supporting film 450 and contacts the lower surface 413 of the bonding layer 410 in the gap G. The supporting film connecting portion 460 may be formed integrally with the first supporting film 400 and the second supporting film 450. For example, when the supporting film layer 400a (see FIG. 1 ) in the original state is irradiated with laser Fig.21 ) and when a gap G is formed in the third area A3 (which will be described later), the entire support film layer 400a can be removed from the gap G so that the lower surface 413 of the bonding layer 410 is exposed to the gap G, as shown by Fig.10 As shown in the first embodiment shown in FIG. Optionally, only a portion of the supporting film layer 400a may be removed so that the remaining portion of the supporting film layer 400a forms the supporting film connecting portion 460, such as by Fig.11 As shown in the second embodiment shown in . Alternatively, a separate supporting film connecting portion 460 may be prepared and then attached to the lower surface 413 of the bonding layer 410 .

[0154] Fig.12 is based on Figure 7 The display device 1 shown in Figure 1 ) is an enlarged view of a portion of the second area A2, the third area A3 and the first area A1 of the third embodiment of the present invention. Fig.12As shown in the above reference Fig.10 The components described are the same as the components described.

[0155] As in the third embodiment, Fig.12 The second supporting film 450 shown in FIG. 4 may be located in the third area A3 and may be bonded by a separate second bonding layer 410_2 formed in the third area A3. Fig.10 In the first embodiment shown in FIG. 1 , the second supporting film 450 is bonded to the display panel 100 through one bonding layer 410 spanning the second area A2 and the third area A3. Fig.12 In the third embodiment shown in , the second supporting film 450 may be bonded to the display panel 100 through a separate second bonding layer 410_2 provided in the third area A3, and the first supporting film 400 may be bonded to the display panel 100 through a separate first bonding layer 410_1 provided in the second area A2. Fig.10 In the embodiment shown in FIG. 1 , the lower surface 101 of the display panel 100 is covered by the bonding layer 410, but Fig.12 In the embodiment shown in , the lower surface 101 of the display panel 100 is exposed to the gap G.

[0156] Fig.13 is based on Figure 7 The display device 1 shown in Figure 1 ) is an enlarged view of a portion of the second area A2, the third area A3 and the first area A1 of the fourth embodiment of the present invention. Fig.13 As shown in the above reference Fig.10 or Fig.11 The components described are the same as the components described.

[0157] As in the fourth embodiment, Fig.13 The second supporting film 450 may span the boundary between the third area A3 and the first area A1. Fig.11 In the second embodiment shown in FIG. , the second supporting film 450 is located in the third area A3. Fig.13 In the fourth embodiment shown in , a portion of the second supporting film 450 may be located in the third area A3, and another portion of the second supporting film 450 may be located in the first area A1.

[0158] exist Fig.11 In the second embodiment shown in FIG. , the bonding layer 410 is in the second area A2 and the third area A3. Fig.13 In the fourth embodiment shown in , the bonding layer 410 c may be in the second area A2 and the third area A3 as well as a portion of the first area A1.

[0159] Fig.14 is based on Figure 7 The display device 1 shown in Figure 1 ) is an enlarged view of a portion of the second area A2, the third area A3 and the first area A1 of the fifth embodiment of the present invention. Fig.14 As shown in the above reference Fig.10 The components described are the same as the components described.

[0160] As in the fifth embodiment, Fig.14 The second supporting film 450 is located in the first area A1. Fig.10 In the first embodiment shown in FIG. , the second supporting film 450 is in the third area A3. Fig.14 In the fifth embodiment shown in , the second supporting film 450 may be formed in the first area A1.

[0161] In such Fig.10 In the first embodiment shown in FIG. , the bonding layer 410 is in the second area A2 and the third area A3. Fig.14 In the fifth embodiment shown in , the bonding layer 410 may be in the second area A2 and the third area A3 as well as a portion of the first area A1. Fig.10 The bonding layer 410 in the first embodiment shown in FIG. 1 is a single layer, while in FIG. Fig.14 In the fifth embodiment shown in , the bonding layer 410 may be a double layer including a first adhesive layer 410 a contacting the display panel 100 and a second adhesive layer 410 b contacting the first adhesive layer 410 a .

[0162] The first adhesive layer 410a may be a fixed adhesive layer 410a having an adhesive strength that remains unchanged when exposed to light irradiation, or may be an optical coupling adhesive layer 410a having an adhesive strength that increases when exposed to light irradiation. When the first adhesive layer 410a is the optical coupling adhesive layer 410a, the adhesive strength of the first adhesive layer 410a may be 100 gf / inch or less before light irradiation, and may be 250 gf / inch or more after light irradiation.

[0163] The second supporting film 450 may be bonded to the second adhesive layer 410b in the first region A1, and the first supporting film 400 may be bonded to the second adhesive layer 410b in the second region A2. The second adhesive layer 410b may be a light-peelable adhesive layer 410b having a reduced adhesive strength when exposed to light irradiation. When the second adhesive layer 410b is a light-peelable adhesive layer 410b, the adhesive strength of the second adhesive layer 410b may be 250gf / inch or more before light irradiation, and may be reduced to 50gf / inch or less after light irradiation. In this case, the second adhesive layer 410b may be easily peeled off during the manufacturing process. Therefore, the manufacture of the fifth embodiment may have improved process convenience, and because there is no residue or damage on the peeled surface, the manufacture of the fifth embodiment may also have a reduced defect rate.

[0164] Fig.15 yes Figure 7 The display device 1 shown in Figure 1 ) is an enlarged view of the second area A2 and the flexible printed circuit board bonding area.

[0165] Fig.15 The base cover layer 500 may include a cover layer side surface 501 in contact with the respective side surfaces 401a, 411a and 103 of the first supporting film 400, the bonding layer 410 and the display panel 100. The cover layer upper surface 502 of the base cover layer 500 is in contact with the lower surface (i.e., the first surface) of the flexible printed circuit board FPCB, and the cover layer lower surface 503 is a surface opposite to the cover layer upper surface 502.

[0166] The cover layer upper surface 502 supports the flexible printed circuit board FPCB from below, and the cover layer side surface 501 supports the respective side surfaces 401a, 411a and 103 of the supporting film 400, the bonding layer 410 and the display panel 100 from one side.

[0167] The cover layer lower surface 503 extends toward the side surface 401a of the support film 400, and the cover portion 504 of the base cover layer 500 may also extend onto the lower surface 403 of the support film 400. The cover portion 504 may be formed to cover (i.e., seal) a portion of the lower surface 403 of the support film 400. Therefore, the base cover layer 500 may prevent moisture from penetrating into the flexible printed circuit board FPCB and the driving chip IC connected to the flexible printed circuit board FPCB, thereby preventing corrosion due to moisture.

[0168] Fig.16 When the display panel 100 is in a bent state Figure 7 Display device 1 (see Figure 1). More specifically, Fig.16 1 shows a cross-sectional view of a non-display area NDA of the display panel 100 when in a bent state. When the display panel 100 is in the bent state, the display area DA of the display panel 100 may remain unbent.

[0169] Reference Fig.16 The end of the display panel 100 of the display device 1 may be bent toward the bottom of the display panel 100, causing a bending axis BX (see FIG. 1 ) extending along the first direction x in the third area A3. Figure 1 ) bend. Since the gap G overlapping the third area A3 is between the second supporting film 450 and the first supporting film 400 contacting the panel bottom cover 300, the display panel 100 can be bent more easily. Here, the first supporting film 400 is coupled to the bending adhesive member 340 of the panel bottom cover 300, so that the bending adhesive member 340 fixes the bending position of the display panel 100.

[0170] The alignment of the bent state of the display panel 100 may depend on the position where the first supporting film 400 is attached to the bending adhesive member 340. For example, the edge of the display panel 100 and the edge of the first supporting film 400 may be aligned in a line with the bending adhesive member 340 in the vertical direction. Fig.16 As shown in FIG. 4 , by moving the first supporting film 400 to the right and fixing the first supporting film 400 at the position, the display panel 100 and the first supporting film 400 may be fixed to form a step with the bending adhesive member 340 .

[0171] Since a portion of the non-display area NDA of the display panel 100 is bent, the area of ​​the non-display area NDA of the display device 1 visible from above can be reduced, and the frame width of the display device 1 can have a reduced frame width. In addition, the neutral plane adjustment layer 600a overlapping the third area A3 of the display panel 100 can prevent the formation of cracks in the wiring of the display panel 100 in the third area A3, and the reliability of the display device 1 can be improved.

[0172] Now refer to Figures 17 to 25 Describes the manufacturing method of the display device 1 (see Figure 1 ) method. Fig.17 is a flowchart illustrating a method of manufacturing the display device 1 according to an embodiment of the present disclosure. Fig.18 is a perspective view of an embodiment of a mother substrate structure MS for the display device 1 . Fig.19 is used for Fig.18 0 is a rear view of the mother substrate structure MS of the display device 1 shown in FIG. Fig. 20 , Fig.21 , Fig. 22 , Fig.23, Fig.24 and Fig.25 is Fig.17 4. A cross-sectional view of a structure caused during a process of forming the first and second supporting films 400 and 450, the bonding layer 410, and the panel bottom cover 300 during a manufacturing process of FIG.

[0173] The method of manufacturing the display device 1 according to the present disclosure may include the following operations.

[0174] First, a mother substrate structure MS ( Fig.17 Referring to operation S110 in Fig.18 and Fig.19 , a mother substrate 2000 may be prepared, a light-peelable bonding body layer 410' may be formed on the lower surface of the mother substrate 2000, and the supporting film layer 400a in the original state may be bonded to the light-peelable bonding body layer 410' to produce a mother substrate structure MS. The mother substrate structure MS may include a plurality of display units 1000 and a dummy area other than the display unit 1000. Each display unit 1000 may be separated from the mother substrate 2000 to form a display panel 100 (see Figure 1 ). Each display unit 1000 may include a first area A1, a second area A2, and a third area A3. The cross-sectional stacking structure of each display unit 1000 may be similar to Figure 5 or Figure 6 The cross-sectional stacking structure of the display panel 100 shown in FIG. 1 is the same as that of FIG. 1. The dummy region may be a portion of the mother substrate structure MS other than the display unit 1000 and may be removed.

[0175] Second, cutting lines can be formed, e.g. Fig. 20 The cutting lines 800a, 800b, 801 and 802 shown in FIG. Fig.17 The cutting lines 800a, 800b, 801 and 802 include a first line 800a, a second line 800b, a second cutting line 801 and a third cutting line 802. Figure 20 to Figure 22, lasers L1 to L3 may be irradiated from below the supporting film layer 400a of the mother substrate structure MS to cut the supporting film layer 400a alone, or to cut the photo-peelable bonding body layer 410' and the supporting film layer 400a together. Here, when the lasers L1 to L3 are irradiated in a line extending in a first direction x which is a short side direction of the display panel 100, a first cutting portion to a third cutting portion are formed. The first cutting portion is a cutting portion formed in the supporting film layer 400a by irradiating the laser L1 on an area extending from a boundary between the second area A2 and the third area A3 into the third area A3. The first cutting portion includes a first line 800a, a second line 800b, and a gap G, the first line 800a being a boundary line between the second area A2 and the third area A3, the second line 800b being formed in a portion of the third area A3, Fig.21 The gap G is located between the first line 800 a and the second line 800 b . Operation S120 forms the gap G, which is defined as a space separating the first supporting film 400 and the second supporting film 450 .

[0176] When the laser L1 is irradiated onto the supporting film layer 400a, Fig. 22 The burr pattern BU is disposed adjacent to the gap G. The burr pattern BU may be formed on a first line 800a adjacent to the gap G, the first line 800a being a cutting line of the support film layer 400a. The burr pattern BU may be formed when the thermal energy of the laser L1 melts a portion of the support film layer 400a. Here, the laser L1 may be, but is not limited to, a laser from CO that provides high energy efficiency. 2 The burr pattern BU may be continuously formed in a boundary area between the third area A3 and the second area A2 along a first direction x which is a short side direction of the display panel 100 .

[0177] The second cutting portion is a cutting portion in a boundary region between the third area A3 and the first area A1, in which a second cutting line 801 is formed in the supporting film layer 400a and the photo-peelable bonding body layer 410' by irradiating the mother substrate structure MS with the laser L2.

[0178] The third cutting portion is a cutting portion in a boundary region between the dummy region and the second region A2, wherein a third cutting line 802 is formed in the supporting film layer 400a and the photo-peelable bonding body layer 410' by irradiating the mother substrate structure MS with the laser L3.

[0179] Here, although the laser is shown in the order of L1, L2, and L3 to indicate the first to third cutting portions, the order of irradiating the laser to form each cutting portion is not limited to the above order.

[0180] Third, the display panel 100 ( Fig.17By removing the dummy area from the mother substrate structure MS based on the third cutting line 802, each display unit 1000 (see operation S130) can be Fig.18 ) is separated from the mother substrate structure MS. Fig.23 , each separated display unit 1000 may be prepared as a display panel 100 having a light-peelable bonding body layer 410' on the lower surface 101 of the display panel 100. On the light-peelable bonding body layer 410', the supporting film layer 400a is in the first area A1, the first supporting film 400 is in the second area A2, and the second supporting film 450 and the gap G are in the third area A3.

[0181] In this example, the first line 800a (see Fig. 20 ) and the second line 800b (see Fig. 20 ) formed by the first cutting portion and the second cutting line 801 (see Fig. 20 ) after the second cutting portion, using the third cutting line 802 (see Fig. 20 ) Each display unit 1000 (see Fig.18 ) and the mother substrate structure MS (see Fig.18 ) separation. However, the present disclosure is not limited thereto. After each display unit 1000 is separated using the third cutting line 802, a laser irradiation process for forming a first cutting portion and a second cutting portion may be performed on the display panel 100 prepared as the separated display unit 1000.

[0182] Fourth, a polarizer 310 ( Fig.17 The polarizer 310 may be formed on the upper surface 102 of the display panel 100 in the first area A1.

[0183] Fifth, an upper protective layer 600a ( Fig.17 An upper protective layer 600a may be formed on the upper surface 102 in the third area A3 of the display panel 100. Although only the upper protective layer 600a is formed in the illustrated embodiment, an operation of forming a lower protective layer on the photo-peelable bonding body layer 410' may also be performed.

[0184] Sixth, the driver chip IC and the flexible printed circuit board FPCB (see Figure 7 )( Fig.17 The driving chip IC may be mounted on the upper surface 102 of the display panel 100 in the second area A2, and an end portion of the flexible printed circuit board FPCB may be coupled to the display panel 100 in the second area A2.

[0185] Seventh, a base cover layer 500 (see Figure 7 )( Fig.17 The base cover layer 500 may be formed on the lower surface of the flexible printed circuit board FPCB and may be disposed adjacent to the edge of the display panel 100. Here, the flexible printed circuit board FPCB and the base cover layer 500 may be disposed adjacent to the edge of the display panel 100. Figure 7 The flexible printed circuit board FPCB shown in FIG. 1 is identical to the base cover layer 500 and thus Figure 23 to Figure 25 Not shown.

[0186] Eighth, it can irradiate light ( Fig.17 ) Referring to operation S180 in Fig.23 , a mask 700 that can selectively allow light to pass through can be placed under the supporting film layer 400a, and then light can be irradiated. The photo-strippable bonding body layer 410' and the supporting film layer 400a located in the first area A1 can be in the light irradiation area, and light can be irradiated into the light irradiation area through the light-transmitting portion 701 of the mask 700. The photo-strippable bonding body layer 410' and the supporting film layer 400a located in the second area A2 and the third area A3 can be in the non-light irradiation area, and the light blocking portion 702 of the mask 700 can prevent light from irradiating the non-light irradiation area. Here, the light irradiation can be irradiation of a UV laser. When the UV laser is irradiated, the adhesive strength of the photo-strippable bonding body layer 410' can be weakened in the first area A1 irradiated with light. On the other hand, the adhesive strength of the photo-strippable bonding body layer 410' can be maintained in the second area A2 and the third area A3 that are not irradiated with light. For example, before UV irradiation, the adhesive strength of the photo-strippable bonding body layer 410' can be 250gf / inch or more, and can be reduced to 100gf / inch or less (peeled at 40mm / sec 180 degrees) after UV irradiation. Therefore, the support film layer 400a in the light irradiation area can be easily removed. Therefore, since the photo-strippable bonding body layer 410' and the support film layer 400a are not retained in the peeling area 910 as the light irradiation area, they do not cause defects or leave damage to the peeling surface, thereby reducing the defect rate. In addition, problems such as tearing during the peeling process can be suppressed. The adhesive strength can also be reduced to 20gf / inch or less, but the present disclosure is not limited to this.

[0187] Ninth, a first support film 400 and a second support film 450 may be formed ( Fig.17 Operation S190 in FIG. Fig.24 , by following Fig. 20The second cutting line 801 of the support film layer 400a located in the first area A1 as the light irradiation area can be peeled off, and the support film layer 400a can be removed. The adhesive strength of the light-peelable bonding body layer 410' located in the first area A1 as the light irradiation area is reduced by light irradiation. Therefore, the support film layer 400a in the first area A1 can be easily peeled off and removed. The area where the support film layer 400a has been removed is the peeling area 910.

[0188] The photo-peelable bonding body layer 410' located in the second area A2 and the third area A3 as the non-light irradiation area maintains its adhesive strength because it is not irradiated by light. Therefore, the photo-peelable bonding body layer 410' located in the second area A2 and the third area A3 and the first support film 400 and the second support film 450 can remain bonded to each other. Here, the area where the photo-peelable bonding body layer 410' and the first support film 400 and the second support film 450 remain bonded to each other can be the bonding area 900. Therefore, the first support film 400 and the second support film 450 can be finally formed in the second area A2 and the third area A3 formed as the bonding area 900 without being peeled off.

[0189] Tenth, a panel bottom cover 300 ( Fig.17 Operation S200 in FIG. Fig.25 In the panel bottom cover 300, the adhesive member 320 is bonded to the display panel 100 in the first area A1 as the peeling area 910. Here, the panel bottom cover 300 contacts the second supporting film 450 of the bonding area 900 and is spaced apart from the first supporting film 400 of the bonding area 900.

[0190] Finally, the first supporting film 400 of the second area A2 and the second supporting film 450 of the third area A3 share the bonding layer 410 formed throughout the second area A2 and the third area A3. The first supporting film 400 of the second area A2 and the second supporting film 450 of the third area A3 can be kept bonded to the lower surface 101 of the display panel 100 by the bonding layer 410, and the gap G of the third area A3 is between the first supporting film 400 and the second supporting film 450. Through these processes, the display device 1 according to the present disclosure (see Figure 1 ).

[0191] As described above, the manufacturing method of the present disclosure can reduce the risk of crack formation in the wiring of the display panel 100 when the display panel 100 is bent, and can reduce the thickness and can reduce the manufacturing cost of the display device 1.

[0192] At the end of the detailed description, it will be appreciated by those skilled in the art that many changes and modifications may be made to the described embodiments without departing substantially from the principles of the present disclosure. Therefore, the present disclosure uses the exemplary embodiments only in a general and descriptive sense, and not for the purpose of limitation. Each component specifically described herein or shown in the accompanying drawings may be modified or changed for different uses or applications, and such modifications or changes should be interpreted as being included within the scope defined by the appended claims.

Claims

1. A display device, wherein: The display device comprises: The display panel comprises a first area including a display area, a second area spaced apart from the first area, and a bendable third area located between the first area and the second area; a bonding layer, disposed in the second area and the third area of ​​the display panel and located on the first surface of the display panel; A panel bottom cover, disposed in the first area of ​​the display panel and located on the first surface of the display panel; a first supporting film, disposed in the second region of the display panel and bonded to the bonding layer; a second supporting film disposed in the third region of the display panel and bonded to the bonding layer; and A gap is provided in the third region to separate the first supporting film and the second supporting film from each other.

2. The display device according to claim 1, wherein: The bonding layer includes a photo-peelable adhesive of a type having an adhesive strength of 100 gf / inch or less after light irradiation.

3. The display device according to claim 1, wherein: The first supporting film includes a burr pattern protruding downward from a first surface of the first supporting film along an inner surface of the first supporting film adjacent to the gap.

4. The display device according to claim 3, wherein: An angle formed by the inner surface along which the burr pattern is formed and a first surface of the bonding layer in contact with the first supporting film is 70 degrees or less.

5. The display device according to claim 1, wherein: The display device further includes a driving chip, which is disposed in the second region of the display panel and located on a second surface of the display panel opposite to the first surface of the display panel.

6. The display device according to claim 5, wherein: The display device further includes: a flexible printed circuit board electrically connected to the driving chip in the second area; and a base covering layer formed on a first surface of the flexible printed circuit board, wherein an end portion of the flexible printed circuit board is bonded to an edge of the display panel in the second region, and the base covering layer is located on the first surface of the flexible printed circuit board at the edge of the display panel and contacts the display panel, the bonding layer and the first supporting film in the second region.

7. The display device according to claim 6, wherein: The base cover layer further includes a covering portion extending from a first surface located at a lower side of the base cover layer toward the first supporting film contacting the base cover layer, the covering portion covering a portion of a lower region of the first supporting film.

8. The display device according to claim 1, wherein: The display device further includes a protective layer formed in the third region on a second surface of the display panel opposite to the first surface of the display panel.

9. The display device according to claim 1, wherein: The display device further includes a supporting film connecting portion formed on a first surface of the bonding layer exposed to the gap and connecting the first supporting film and the second supporting film.

10. The display device according to claim 1, wherein: The first surface of the display panel is exposed to the gap in the third region, and the bonding layer includes a first bonding layer arranged in the second region and a second bonding layer spaced apart from the first bonding layer, and the gap is between the first bonding layer and the second bonding layer in the third region.

11. The display device according to claim 1, wherein: The bonding layer and the second supporting film extend to a portion of the first region to be additionally located in the first region, a side surface of the bonding layer and a side surface of the second supporting film face a side surface of the panel bottom cover, and the display device further includes a supporting film connecting portion formed on the first surface of the bonding layer in the gap and connecting the first supporting film and the second supporting film.

12. A display device, wherein the display device comprises: The display panel comprises a first area including a display area, a second area spaced apart from the first area, and a bendable third area located between the first area and the second area; a bonding layer, disposed in the second area and the third area of ​​the display panel and located on the first surface of the display panel; a first supporting film, disposed in the second region of the display panel and bonded to the bonding layer; a second supporting film disposed in the third region of the display panel at a position spaced apart from the first supporting film and bonded to the bonding layer; a flexible printed circuit board having an end portion bonded to a distal end region of the display panel in the second region; as well as A base cover layer is formed on the first surface of the flexible printed circuit board.

13. The display device according to claim 12, wherein: The base cover layer includes a cover portion extending from a first surface located at a lower side of the base cover layer toward the first supporting film contacting the base cover layer, the cover portion covering a portion of a lower region of the first supporting film.

14. The display device according to claim 12, wherein: The bonding layer includes a photo-peelable adhesive of a type having an adhesive strength of 100 gf / inch or less after light irradiation.

15. The display device according to claim 12, wherein: The display device further includes a panel bottom cover, which is disposed in the first region of the display panel, contacts the bonding layer and the second supporting film, and is located on the first surface of the display panel.

16. The display device according to claim 15, wherein: The panel bottom cover includes an adhesive member bonded to the first surface of the display panel in the first region, a heat dissipation member bonded to the adhesive member and dissipating heat of the display panel, and a bending adhesive member bonded to the heat dissipation member and fixing a bending position of the display panel when the display panel is bent, The third region includes a gap, which is a space formed between the first supporting film and the second supporting film, and The first supporting film includes a burr pattern protruding downward from a first surface of the first supporting film along an inner surface of the first supporting film adjacent to the gap.

17. The display device according to claim 16, wherein: The display device further includes a driving chip, which is disposed in the second region of the display panel and located on a second surface of the display panel opposite to the first surface of the display panel.

18. The display device according to claim 12, wherein: The display device further includes a protective layer formed in the third region on a second surface of the display panel opposite to the first surface of the display panel.

19. A display device, wherein: The display device comprises: The display panel comprises a first area including a display area, a second area spaced apart from the first area, and a bendable third area located between the first area and the second area; A panel bottom cover, disposed in the first area of ​​the display panel and located on a first surface of the display panel; a bonding layer, disposed in the second region, the third region and a portion of the first region of the display panel, in contact with the panel bottom cover in the first region, and located on the first surface of the display panel; a first supporting film, disposed in the second region of the display panel and bonded to the bonding layer; a second supporting film disposed in the first region of the display panel, in contact with the panel bottom cover in the first region, and bonded to the bonding layer; and a gap provided in the third region of the display panel as a space between the first supporting film and the second supporting film, The bonding layer has a first surface exposed to the gap in the third region and includes a first adhesive layer located on the first surface of the display panel and a second adhesive layer contacting the first adhesive layer.

20. A method for manufacturing a display device, wherein: The display device has a display panel, the display panel including a first area including a display area, a second area spaced apart from the first area, and a bendable third area including a gap between the first area and the second area, the method including: preparing a mother substrate structure, the mother substrate structure comprising a photo-strippable bonding body layer and a supporting film layer; forming a cutting line in the mother substrate structure, forming a first supporting film in the second region and a second supporting film in the third region, and forming the gap between the first supporting film and the second supporting film; separating the display unit from the mother substrate structure to prepare the display panel; selectively irradiating light to the first area of ​​the display panel; peeling off and removing the supporting film layer in the first region irradiated with the light; and A panel bottom cover is formed in the first region where the supporting film layer has been peeled off, so that the panel bottom cover contacts the second supporting film in the third region.

Images