Arrangement data creation device, arrangement data creation method, and laser cutting processing method

Abstract

The arrangement data creation device (21) has an arrangement processing unit (21c) that arranges a cutting path for cutting a product (100) from a material (200) by a processing machine (50) that performs laser cutting processing. When a notch part (111) is included in the outer line (110) of the product (100), the arrangement processing part (21c) sets a joint part (170) for connecting a hole region (150) including the notch part (111) in the outer line (151) for either the product (100) or the remaining material (210), and sets the arrangement processing part (21c) in such a manner that a part of the outer line (151) of the hole region (150) is retained corresponding to the joint part (170). A cutting path is arranged on a contour line (151) of the hole region (150) and a contour line (110) of the product (100) other than the notch portion (111).

Description

Technical Field

[0001] The present disclosure relates to a layout data preparation device, a layout data preparation method and a laser cutting processing method. Background Art

[0002] Patent Document 1 discloses a processing system including a processing machine that performs laser cutting processing using a laser beam irradiated from a processing head. The processing machine can cut a product from a material by irradiating a laser beam along a cutting path arranged along the outer shape of the product.

[0003] Patent Document 2 points out that in laser cutting processing, products and chips stand up and interfere with the processing head.

[0004] Prior art literature

[0005] Patent Literature

[0006] Patent Document 1: Japanese Patent Application Publication No. 2006-192465

[0007] Patent Document 2: Japanese Patent Application Publication No. 2015-044231 Summary of the invention

[0008] In the processing of products with notches on the outline, when the product is unloaded by the product unloading device, the notches of the product interfere with the remaining material, and sometimes the product unloading fails. Therefore, a method is adopted to cut off the area inside the notches, that is, the hole area including the notches on the outline as waste. However, there is a risk that the waste cut from the material will stand up, and there is a problem of interference with the unloading arm of the product unloading device.

[0009] A bending machine according to one embodiment of the present invention comprises: a layout processing unit, which arranges a cutting path for a processing machine that performs laser cutting processing to cut the product from a material based on product data including the shape of the product; when the outer contour line of the product includes a notch, the layout processing unit sets a joint for connecting a hole area including the notch on the outer contour line for one of the product and the remaining material, and arranges the cutting path on the outer contour line of the hole area and the outer contour line of the product excluding the notch in a manner that retains a portion of the outer contour line of the hole area corresponding to the joint.

[0010] According to one aspect of the present disclosure, the hole regions are connected by the joints, so that the rising of the hole regions can be restricted.

[0011] According to one aspect of the present disclosure, when processing a product having a notch, interference with a product unloading device can be suppressed, thereby improving the product unloading rate. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] Figure 1It is a block diagram showing the configuration of the entire system including the layout data creation device according to the present embodiment.

[0013] Figure 2 It is a diagram for explaining the shape of a product in which a cutting path is arranged.

[0014] Figure 3A It is a figure explaining the joining part.

[0015] Figure 3B It is a figure explaining the joining part.

[0016] Figure 4A This is a diagram showing an example of an operation screen.

[0017] Figure 4B This is a diagram showing an example of an operation screen.

[0018] Figure 5 This is a flowchart showing the flow of the automatic arrangement process of the cutting paths.

[0019] Fig. 6A This is a diagram schematically showing a joining portion set on the product side.

[0020] Figure 6B It is a diagram schematically showing a joining portion set on the remaining material side.

[0021] Figure 7 It is a diagram schematically showing a cutting path.

[0022] Figure 8 It is a diagram schematically showing a cutting path.

[0023] Fig. 9 This is a diagram showing an example of an operation screen.

[0024] Fig.10 This is a diagram for explaining a layout state in which a notch portion is used as a hole region.

[0025] Fig.11 This is a diagram showing a state where a joint portion is set on the product side.

[0026] Fig.12 This is a flowchart showing the flow of the placement process of the carry-out arm.

[0027] Fig.13 This is an explanatory diagram showing the layout concept of the product and the arm as the suction object.

[0028] Fig.14 This is an explanatory diagram showing the concept of a layout in which only products are adsorbed.

[0029] Fig.15A This is a diagram for explaining an example of arranged cutting paths.

[0030] Fig. 15B This is a diagram for explaining an example of arranged cutting paths. DETAILED DESCRIPTION

[0031] Figure 1 1 is a block diagram showing the structure of the entire system including the layout data preparation device of the present embodiment. The layout data preparation device 21 according to the present embodiment includes: a layout processing unit 21c, which arranges a cutting path for cutting the product 100 from the material 200 by the processing machine 50 performing laser cutting processing based on the product data including the shape of the product 100, and when the outer shape line 110 of the product 100 includes the notch 111, the layout processing unit 21c sets a joint portion 170 for connecting the hole region 150 including the notch 111 on the outer shape line 151 for one of the product 100 and the remaining material 210, and arranges the cutting path on the outer shape line 151 of the hole region 150 and the outer shape line 110 of the product 100 except the notch 111 so as to leave a part of the outer shape line 151 of the hole region 150 corresponding to the joint portion 170.

[0032] The overall system is described below. The overall system mainly includes CAD (Computer Aided Design) 10, CAM (Computer Aided Manufacturing) 20, a control device 30, and a processing system 40.

[0033] CAD10 is a computer equipped with CAD functions. CAD10 is composed of a computer having a hardware processor such as a CPU (Central Processing Unit), a memory, and various interfaces. The memory and various interfaces are connected to the hardware processor via a bus. The various functions of CAD10 are realized by making the hardware processor execute the program stored in the memory.

[0034] The CAD 10 functions as a product data creation device 11 by executing a computer program. The product data creation device 11 creates product data related to a product cut from a material. The product data includes information such as the shape (graphic), size, and weight of the product. The product data created by the product data creation device 11 is input to the CAM 20.

[0035] CAM20 is a computer equipped with CAM functions. CAM20 is composed of a computer having a hardware processor such as a CPU, a memory, and various interfaces. The memory and various interfaces are connected to the hardware processor via a bus. The various functions of CAM20 are realized by making the hardware processor execute the program stored in the memory.

[0036] The CAM 20 functions as a layout data creation device 21 by executing a computer program. The layout data creation device 21 creates data used by a control device 30 that controls the machining system 40. The layout data creation device 21 is connected to an input device 22 for inputting information to the layout data creation device 21 and a display device 23 for displaying information created by the layout data creation device 21.

[0037] The product data created by the product data creating device 11 is input to the layout data creating device 21. Material data including the size, thickness, material, etc. of the material 200 is input to the layout data creating device 21 from the input device 22. Device data including information of the processing system 40 is input to the layout data creating device 21. The device data may be acquired from the processing system 40 or from an external device that holds information of the processing system 40.

[0038] The layout data preparation device 21 prepares layout data. The layout data is data that arranges the cutting path of the laser beam for the product (i.e., a graphic that represents the shape of the product). In addition, the layout data is also data that arranges the carrying arm 61 for the product. The layout data preparation device 21 prepares a processing program based on the layout data. The processing program is composed of a mechanical control code for the control device 30 to control the processing system 40.

[0039] The processing program created by the layout data creation device 21 is transferred to the control device 30. In addition, the layout data creation device 21 can also store the created processing program in a database in a data management server (not shown). In this case, the control device 30 can also read the processing program stored in the database of the data management server.

[0040] In relation to the present embodiment, the layout data creation device 21 includes an acquisition unit 21a, a recognition unit 21b, and a layout processing unit 21c. The acquisition unit 21a acquires product data, etc. The recognition unit 21b recognizes the shape of the product based on the product data. The layout processing unit 21c creates layout data based on the product data.

[0041] The control device 30 is a device that controls the machining system 40 based on the machining program, and includes, for example, an NC device (numerical control device). The control device 30 is composed of a computer having a hardware processor such as a CPU, a memory, and various interfaces. The memory and various interfaces are connected to the hardware processor via a bus. The various functions of the control device 30 are realized by executing the program stored in the memory by the hardware processor.

[0042] For example, the control device 30 controls the processing machine 50 based on the processing program so as to cut out the product from the material. The processing machine 50 cuts out the product from the material, thereby manufacturing the product. In addition, the control device 30 controls the product unloading device 60 based on the processing program so as to unload the product cut out from the material. By unloading the product by the product unloading device 60, the product is unloaded and the product is stacked on the stacking tray (not shown).

[0043] The processing system 40 includes a processing machine 50 and a product unloading device 60 .

[0044] The processing machine 50 includes a punching processing unit 51 and a laser processing unit 52. The punching processing unit 51 performs a punching process on the material using a metal mold composed of a punch and a die. The laser processing unit 52 performs a laser cutting process on the material using a laser beam emitted from a processing head. In addition, the processing machine 50 may also be a structure that only includes the laser processing unit 52.

[0045] The product carrying device 60 takes out the product cut from the material and carries out the taken out product. Whenever the product is cut from the material by the laser processing unit 52, the product is carried out by the product carrying device 60. The product carrying device 60 includes a pair of carrying arms 61 for carrying out the product from the remaining material which is the remaining part of the material after the product is cut out. A plurality of suction pads for sucking the product are provided on the surface of each carrying arm 61 facing the material.

[0046] Figure 2 It is a diagram for explaining the shape of a product in which a cutting path is arranged. Figure 3A and Figure 3B Next, a layout process in which the layout data creating device 21 arranges cutting paths for the product 100 will be described.

[0047] In the following description, Figure 2 The shape of the product 100 shown is used as an example to explain the layout process. The shape of the product 100 is specified by the product data. The outline 110 of the product 100 includes a notch 111. The notch 111 is a part of the outline 110 that is retreated toward the inside of the product 100. In addition, the notch 111 is also recognized as a cutout in which a part of the product 100 is cut off. In addition, Figure 2 In order to facilitate understanding of the notch portion 111 , a reference line (dashed line) 111 a is drawn along the notch portion 111 .

[0048] Figure 3A and Figure 3B1 is a diagram for explaining a joint. If a product 100 including a notch 111 in an outer shape line 110 is directly cut out from a material 200, an excess material 210 overlaps the cut product 100, causing poor transport by the carrying arm 61. Therefore, when a product 100 is cut out from a material 200, a hole region 150 including a notch 111 in an outer shape line 151 is cut out in advance. The hole region 150 is a region adjacent to the inner side of the notch 111, and is usually cut out as a frame.

[0049] As one of the features of this embodiment, when the outer line 151 of the hole area 150 is cut, the outer line 151 is not cut along the entire periphery, but a reserved portion is provided. The reserved portion is provided at the boundary line with the product 100 or the boundary line with the remaining material 210. Therefore, the hole area 150 is connected to one of the product 100 and the remaining material 210 via the joint 170. Here, Figure 3A Indicates the state where the joint 170 is located on the product 100 side, Figure 3B This shows a state where the joint portion 170 is located on the side of the remaining material 210 .

[0050] Next, the automatic layout process in which the layout data creating device 21 automatically performs the layout process will be described.

[0051] Figure 4A as well as Figure 4B 2 is a diagram showing an example of an operation screen. Before executing the automatic layout process, the operator uses the input device 22 to input information required for the layout process according to the operation screen displayed on the display device 23.

[0052] like Figure 4A As shown, the operator can select the processing condition of the notch portion 111 by operating the item 310 of "Processing" on the operation screen 300. When "Jointing portion" is selected as the processing condition of the notch portion 111, a cutting path can be arranged in which the hole area 150 is not cut off as a waste material but is connected to one of the product 100 and the remaining material 210 via the joint 170.

[0053] When "Joint" is selected as the processing condition, Figure 4B As shown, the operator selects the position of the joint 170 of the connection hole area 150 by operating the item 320 of "Joint Position". Specifically, the operator can select whether to set the joint 170 on the "product side" or on the "remaining material side".

[0054] In addition, if Figure 4BAs shown, the operator can input the items 321, 322, and 323 of "maximum joint interval", "offset from the outer shape", and "minimum number of joints" with numerical values. The item 321 of "maximum joint interval" is an item that specifies the maximum interval between adjacent joints 170. The item 322 of "offset from the outer shape" is an item that defines the degree of offset from the right end or the left end at which the joint 170 is set. The item 323 of "minimum number of joints" is an item that specifies the minimum number of joints 170.

[0055] When the operator inputs necessary information using the input device 22 according to the operation screen 300 displayed on the display device 23 , the automatic layout process is executed by the layout data creation device 21 .

[0056] Figure 5 1 is a flowchart showing the process of automatic layout processing of the cutting path. First, in step S10, the acquisition unit 21a acquires product data. For example, the acquisition unit 21a acquires product data from the product data creation device 11. In addition, when the product data created by the product data creation device 11 is stored in a database in a data management server not shown in the figure, the acquisition unit 21a can also read the product data stored in the data management server.

[0057] In step S11, the recognition unit 21b recognizes a hole (opening) located inside the product 100 based on the product data. When a hole (opening) is recognized inside the product 100, in step S12, the layout processing unit 21c lays out a cutting path for the hole.

[0058] In step S13, the recognition section 21b recognizes the outer shape line 110 of the product 100 based on the product data. Next, in step S14, the recognition section 21b recognizes the notch portion 111 on the outer shape line 110.

[0059] In step S15, the layout processing unit 21c determines whether there is a notch 111 on the outline 110. This determination is made based on the recognition result of the recognition unit 21b in step S14. If there is no notch 111, the process proceeds to step S16, and if there is a notch 111, the process proceeds to step S17.

[0060] In step S16, the arrangement processing unit 21c arranges the cutting path on the outer shape line 110 of the product 100. The cutting path for the outer shape line 110 of the product 100 is arranged so as to be cut behind the hole inside the product 100.

[0061] In step S17, the arrangement processing unit 21c determines whether the processing condition of the notch portion 111 is "joint portion". If the processing condition of the notch portion 111 is not "joint portion", the process proceeds to step S18, and if the processing condition of the notch portion 111 is "joint portion", the process proceeds to step S19.

[0062] In step S18, the layout processing unit 21c arranges a cutting path on the outer line 151 of the hole area 150 by a method according to the processing conditions of the notch portion. The cutting path for the outer line 151 of the hole area 150 is arranged to be cut after the hole inside the product 100 is cut.

[0063] In step S19, the layout processing unit 21c determines whether the position of the joint 170 is on the product 100 side based on the input content of the item 320 of "Joint position". If the position of the joint 170 is on the product 100 side, the process proceeds to step S20, and if the position of the joint 170 is on the remaining material 210 side, the process proceeds to step S21.

[0064] Fig. 6A 2 is a diagram schematically showing a joint portion set on the product side. In step S19 , the layout processing unit 21 c sets the joint portion 170 on the product 100 side. Figure 6B 2 is a diagram schematically showing a joint portion set on the side of the remaining material. In step S21, the layout processing unit 21c sets the joint portion 170 on the side of the remaining material 210. In each process of steps S20 and S21, the layout processing unit 21c sets the joint portion 170 to satisfy the number and position of the instruction values ​​input to items 321, 322, and 323.

[0065] Figure 7 Schematically showing a cutting path. In step S22, the layout processing unit 21c arranges a cutting path (first cutting path) R1 for the outer contour 151 of the hole area 150 in consideration of the joint 170. The cutting path R1 is arranged to retain a portion of the outer contour 151 of the hole area 150 corresponding to the joint 170. In addition, the cutting path R1 is arranged to cut after the hole inside the product 100. In addition, the cutting path R1 also includes perforation, approach, avoidance, etc., but in Figure 7 Omitted (the same below).

[0066] Figure 8 2 is a diagram schematically showing a cutting path. In step S23 , the layout processing unit 21 c arranges a cutting path R2 for the outer shape line 110 of the product 100 except for the notch portion 111 . The cutting path R2 is arranged so as to be cut after the hole region 150 .

[0067] After such a series of processing, the automatic layout processing is completed.

[0068] Next, a manual layout process in which the layout process is manually performed using the layout data creating device 21 will be described.

[0069] When performing the manual arrangement process, the operator uses the input device 22 to input information required for the manual arrangement process according to the operation screen displayed on the display device 23 .

[0070] Fig. 9 This is a diagram showing an example of an operation screen. Fig.10 This is a diagram for explaining a layout state in which a notch portion is used as a hole region. Fig.11 This is a diagram showing a state where a joint portion is set on the product side.

[0071] exist Fig. 9 The operation screen 300 shown in FIG. 300 shows a graphic of a product 100 on which a cutting path is arranged. The product 100 shown in the operation screen 300 has a notch 111 on the outer shape 110 of the product 100. For example, the operator selects a line segment of the notch 111 on the operation screen 328, as shown in FIG. Fig.10 As shown, the recessed portion 111 can be arranged as a hole region 150 .

[0072] In addition, the operator can set the joint 170 by designating an arbitrary position on the outer line 151 of the hole region 150. At this time, the operator can set an arbitrary number of joints 170 at arbitrary positions on either the product 100 side or the surplus material 210 side.

[0073] The flow after the joining portion 170 is set on the product 100 side or the remaining material 210 side is the same as that of the automatic process. Thus, the layout process of the cutting path based on the manual layout process is completed.

[0074] Fig.12 This is a flowchart showing the flow of the placement process of the carry-out arm. Fig.13 This is an explanatory diagram showing the layout concept of the product and the hole area as the adsorption target. Fig.14 This is an explanatory diagram showing the concept of a layout in which only products are adsorbed.

[0075] The arrangement processing unit 21 c performs an arrangement process for arranging the carry-out arm 61 with respect to the product 100 in consideration of the above-mentioned arrangement process of the cutting path.

[0076] First, in step S30, the layout processing unit 21c determines whether the notch portion 111 is processed as the hole region 150. If it is processed as the hole region 150, the process proceeds to step S31, and if it is not processed as the hole region 150, the process proceeds to step S33 described later.

[0077] In step S31, the arrangement processing unit 21c determines whether the joint 170 is located on the product 100 side. If the joint 170 is located on the product 100 side, the process proceeds to step S32, and if the joint 170 is located on the surplus material 210 side, the process proceeds to step S33.

[0078] In step S32, the layout processing unit 21c arranges the transport arm 61 with both the product 100 and the hole area 150 as the adsorption targets. The arrangement of the transport arm 61 includes the position of the transport arm 61, the selection of the adsorption pad 62 to be adsorbed from among the plurality of adsorption pads 62 provided in the transport arm 61, and the like. Fig.13 As shown by the shading of , in addition to the adsorption pad 62 arranged on the product 100 , the adsorption pad 62 arranged in the hole area 150 is also set as a pad that performs an adsorption action.

[0079] In step S33, the arrangement processing unit 21c arranges the transport arm 61 only with the product 100 as the adsorption target. The arrangement of the transport arm 61 includes the position of the transport arm 61, the selection of the adsorption pad 62 to be adsorbed from among the plurality of adsorption pads 62 provided in the transport arm 61, and the like. Fig.14 As shown by the shading of , only the adsorption pad 62 arranged on the product 100 is set as the pad that performs the adsorption action.

[0080] Layout data is created through such layout processing. The layout data creation device 21 creates a machining program based on the layout data. The machining program created by the layout data creation device 21 is transferred to the control device 30.

[0081] The control device 30 controls the processing machine 50 based on the processing program so as to cut out the product 100 from the material 200. The laser processing unit 52 of the processing machine 50 first cuts the outer contour line 151 of the hole region 150. When the outer contour line 151 of the hole region 150 is cut, the outer contour line 151 is not cut along the entire circumference, but a remaining portion is provided. Thus, the hole region 150 is connected to one of the product 100 and the remaining material 210 via the joint 170.

[0082] Next, the laser processing unit 52 of the processing machine 50 cuts the outer contour 110 of the product 100 except the notch 111. At this time, the hole region 150 is connected to one of the product 100 and the remaining material 210 via the joint 170. Therefore, the hole region 150 can be suppressed from rising, thereby preventing interference with the processing head of the processing machine 50.

[0083] Then, when the cutting of the product 100 is completed, the control device 30 controls the product unloading device 60 based on the processing program to unload the product 100 cut from the material 200. The product unloading device 60 uses a pair of unloading arms 61 to remove the product 100 from the remaining material 210. At this time, the hole area 150 is suppressed from rising, so that interference with the pair of unloading arms 61 can be prevented.

[0084] In addition, the pair of carry-out arms 61 operates according to the layout data. When the joint 170 is located on the product 100 side, the pair of carry-out arms 61 adsorbs the product 100 and the hole area 150. The hole area 150 also becomes an adsorption target, so the adsorption area is expanded. As a result, the carry-out rate can be improved.

[0085] On the other hand, when the joint 170 is located on the side of the surplus material 210, only the product 100 is sucked by the pair of unloading arms 61. In this case, the connection between the hole area 150 and the notch 111 becomes weak, so the notch 111 becomes difficult to get caught during suction. As a result, the unloading rate can be improved.

[0086] Thus, according to the present embodiment, the hole region 150 is connected by the joint 170, so that the rising of the hole region 150 can be limited. When processing the product 100 having the notch 111, the interference with the product unloading device 60 can be suppressed. Thus, the product unloading rate can be improved. In addition, according to the present embodiment, when processing the product 100 having the notch 111, the hole region 150 is first cut off, so the hole region 150 sometimes stands up. According to the present embodiment, the hole region 150 is connected by the joint 170, so that the rising of the hole region 150 can be limited. Thus, the interference between the processing head of the processing machine 50 and the product 100 can be suppressed. Thus, the reduction in productivity caused by the stop of processing can be suppressed.

[0087] In this embodiment, the layout processing unit 21c also arranges the carry-out arm 61 for adsorbing and conveying the product cut from the material 200. When the joint 170 is set for the product 100, the carry-out arm 61 is arranged with both the product 100 and the hole area 150 as adsorption objects.

[0088] According to this configuration, since the hole region 150 is also an adsorption target, the adsorption region is expanded. Thus, the unloading rate of the product unloading device 60 can be improved.

[0089] In this embodiment, the arrangement processing unit 21c also arranges the carry-out arm 61 for sucking and conveying the product 100 cut from the material 200. When the joint unit 170 is set for the remaining material 210, the carry-out arm is arranged only with the product 100 as the suction object.

[0090] According to this structure, it is possible to properly adsorb only the product 100 without adsorbing the hole region 150 connected to the excess material 210. In addition, the connection between the hole region 150 and the notch 111 becomes weaker, so it becomes difficult for the notch 111 to get caught during adsorption. As a result, the unloading rate can be improved.

[0091] In this embodiment, the layout data creating device 21 further includes a recognition unit 21b that recognizes the shape of the product 100. The layout processing unit 21c determines that the outline 110 of the product 100 includes the notch 111 based on the recognition result of the recognition unit 21b.

[0092] According to this configuration, the layout processing unit 21c can perform settings of the hole region 150 and the joint portion 170 based on the recognized notch portion 111. Thus, the layout processing unit 21c can automatically perform the layout processing.

[0093] In the layout data preparation method according to the present embodiment, the computer 20 performs a layout process for arranging a cutting path for cutting the product 100 from the material 200 by the processing machine 50 that performs the laser cutting process, based on the product data including the shape of the product 100. The layout process includes: when the outer shape line 110 of the product 100 includes the notch 111, setting a joint 170 for connecting the hole region 150 including the notch 111 on the outer shape line 151 to one of the product 100 and the remaining material 210, and arranging the cutting path on the outer shape line 151 of the hole region 150 and the outer shape line 110 of the product 100 excluding the notch 111 in a manner that a part of the outer shape line 151 of the hole region 150 is left corresponding to the joint 170.

[0094] According to this method, the hole region 150 is connected by the joint 170, so that the rising of the hole region 150 can be restricted. Therefore, when processing the product 100 having the notch 111, interference with the processing machine 50 or the product unloading device 60 can be suppressed. Thus, the reduction in productivity due to processing stoppage can be suppressed, and the product unloading rate can be improved.

[0095] The laser cutting method of this embodiment includes: a cutting step, in which a processing machine 50 performing laser cutting cuts a product 100 having a notch 111 on an outer shape line 110 from a material 200; and a carrying-out step, in which a product carrying-out device 60 carries out the product 100 cut from the material 200. The cutting step includes cutting a hole region 150 having a notch 111 on an outer shape line 151, and leaving a portion of the outer shape line 151 of the hole region 150 connected to one of the product 100 and the remaining material 210.

[0096] According to this method, at this time, the hole region 150 is connected to one of the product 100 and the surplus material 210 via the joint 170. Therefore, the hole region 150 can be suppressed from rising, and interference with the processing head of the processing machine 50 can be prevented. In addition, since the hole region 150 is restricted from rising, interference with the pair of carry-out arms 61 can be prevented. Thus, the reduction in productivity due to processing stop can be suppressed, and the carry-out rate of the product 100 can be improved.

[0097] Furthermore, in the present embodiment, the arrangement processing section 21c arranges the first cutting path R1 on the outer shape line 151 of the hole region 150 so as to keep a part of the outer shape line 151 of the hole region 150 corresponding to the joint portion 170, and arranges the second cutting path R2 different from the first cutting path R1 on the outer shape line 110 of the product 100 except the notch portion 111. However, the arrangement of the cutting paths is not limited thereto, and the cutting paths may be arranged on the outer shape line 151 of the hole region 150 and the outer shape line 110 of the product 100 except the notch portion 111 so as to keep a part of the outer shape line 151 of the hole region 150 corresponding to the joint portion 170.

[0098] Fig.15A FIG. 1 is a diagram illustrating an example of a cutting path arranged. Fig.15A As shown, the cutting path arranged on the outer shape line 151 of the hole area 150 and the outer shape line 110 of the product 100 except the notch 111 may also include the following two cutting paths Ra1 and Ra2. Here, the cutting path Ra1 is arranged on the outer shape line 151 of the hole area from one end of the notch 111 to the joint 170. The cutting path Ra2 is arranged on the outer shape line 151 of the hole area 150 from the joint 170 to the other end of the notch 111, the outer shape line 110 of the product 100 except the notch 111, and the outer shape line 151 of the hole area 150 except the notch 111.

[0099] Fig. 15B FIG. 1 is a diagram illustrating an example of a cutting path arranged. Fig. 15B As shown, the cutting path arranged on the outer line 151 of the hole area 150 and the outer line 110 of the product 100 except the notch 111 may also include the following three cutting paths Rb1, Rb2, and Rb3. Here, the cutting path Rb1 is arranged on the outer line 151 of the hole area from one end of the notch 111 to the joint 170. The cutting path Rb2 is arranged on the outer line 151 of the hole area 150 from the joint 170 to the other end of the notch 111. The cutting path Rb3 is arranged on the outer line 110 of the product 100 except the notch 111, and the outer line 151 of the hole area 150 except the notch 111.

[0100] Even in such an arrangement, when processing the product 100 having the notched portion 111, interference with the product carrying-out device 60 can be suppressed. Thus, the product carrying-out rate can be improved.

[0101] In addition, in this embodiment, the layout data creating device 21 that creates layout data is realized by the CAM 20. However, the layout data creating device 21 may be realized by the control device 30. Thus, layout data can be created at the processing site.

[0102] As described above, this embodiment is described, but the description and drawings constituting a part of this embodiment should not be understood to limit this embodiment. Based on this embodiment, various alternative embodiments, examples, and operation techniques can be clearly understood by those skilled in the art.

[0103] The disclosure of this application is related to the subject matter described in Japanese Patent Application No. 2022-154970 filed on September 28, 2022, and all of these disclosures are incorporated herein by reference.

Claims

1. A layout data production device, characterized in that: have: a layout processing unit that arranges a cutting path for a processing machine that performs laser cutting processing to cut the product from a material based on product data including a shape of the product, In a case where the outline of the product includes a notch, the layout processing unit sets a joining portion for connecting a hole area on the outline including the notch for one of the product and the remaining material, and the layout processing unit arranges a cutting path on the outline of the hole area and the outline of the product excluding the notch in a manner that retains a portion of the outline of the hole area corresponding to the joining portion.

2. The layout data creating device according to claim 1, characterized in that: The arrangement processing unit arranges a first cutting path on the outer line of the hole area in a manner that retains a portion of the outer line of the hole area corresponding to the joining portion, and arranges a second cutting path different from the first cutting path on the outer line of the product except for the notch portion.

3. The layout data creating device according to claim 1, characterized in that: The arrangement processing unit also arranges a carry-out arm for conveying the product separated from the material by suction, and when the joint portion is set for the product, the carry-out arm is arranged with both the product and the hole area as suction targets.

4. The layout data creating device according to claim 1, characterized in that: The arrangement processing unit further arranges a carry-out arm for conveying the product separated from the material by suction, and when the joint portion is set for the surplus material, the carry-out arm is arranged with only the product as a suction target.

5. The layout data creating device according to any one of claims 1 to 4, characterized in that: The layout data preparation device further includes a recognition unit for recognizing the shape of the product based on the product data. The layout processing unit determines that the notch portion is included in the outer shape line of the product based on the recognition result of the recognition unit.

6. A method for producing layout data, characterized in that: The computer performs a layout process for arranging a cutting path for cutting the product from a material by a processing machine that performs a laser cutting process based on product data including the shape of the product. The arrangement process comprises: When the outer shape line of the product includes a notch, a joint portion for connecting the hole region including the notch on the outer shape line is set on one of the product and the remaining material. A cutting path is arranged on the outer line of the hole area and the outer line of the product except the notch portion in such a manner that a part of the outer line of the hole area remains corresponding to the engaging portion.

7. A laser cutting method, characterized in that: Include: In a cutting process, a processing machine performing laser cutting processing cuts the product having a notch on the outer shape line from the material; and In the unloading process, the product unloading device unloads the product cut from the material. The cutting step includes cutting the hole region including the notch portion on the outer shape line, and includes leaving a part of the outer shape line of the hole region in such a manner that the hole region is connected to one of the product and the remaining material.

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