Data center cooling system including pressure exchanger

Abstract

A system includes a refrigeration system for exchanging heat between a first cooling circuit and a second cooling circuit. The refrigeration system includes a pressure exchanger (310) for receiving a first fluid at a first pressure and a second fluid at a second pressure and exchanging pressure between the first fluid and the second fluid. The refrigeration system also includes a first heat exchanger (318) for exchanging heat between the first cooling circuit and a portion of the first fluid output from the pressure exchanger. The refrigeration system also includes a second heat exchanger (329) for exchanging heat between a portion of the first fluid entering the pressure exchanger and the second cooling circuit.

Description

Technical Field

[0001] The present disclosure relates to systems and, more particularly, to data center cooling systems including pressure exchangers. Background Art

[0002] The system uses fluids at different pressures. The system uses a pump or compressor to increase the pressure of the fluid. BRIEF DESCRIPTION OF THE DRAWINGS

[0003] The present disclosure is illustrated by way of example and not by way of limitation in the figures of the accompanying drawings.

[0004] Figures 1A to 1C A schematic diagram of a fluid handling system including a hydraulic energy transfer system is shown, according to certain embodiments.

[0005] FIG. 2A to FIG. 2E is an exploded perspective view of a pressure exchanger (PX) according to certain embodiments.

[0006] FIG. 3A to FIG. 3C is a schematic diagram of a data center cooling system including a pressure exchanger, according to certain embodiments.

[0007] Figure 4 is a schematic diagram of a data center cooling system including a pressure exchanger, according to certain embodiments.

[0008] FIG. 5A to FIG. 5F is a schematic diagram of a data center cooling system including a pressure exchanger, according to certain embodiments.

[0009] Figure 6 is a flow chart illustrating an example method for controlling a data center cooling system in accordance with certain embodiments.

[0010] Figure 7 is a block diagram illustrating a computer system according to some embodiments. DETAILED DESCRIPTION

[0011] Embodiments described herein relate to data center cooling systems (eg, data center cooling systems, fluid handling systems, heat transfer systems, pressure exchanger systems, carbon dioxide (CO 2 ) refrigeration systems, etc.) that include pressure exchangers.

[0012] Systems can use fluids at different pressures. These systems may include hydraulic fracturing (e.g., fracking or fracing) systems, desalination systems, refrigeration systems, air conditioning systems, data center cooling systems, heat pump systems, energy generation systems, mud pumping systems, slurry pumping systems, industrial fluid systems, waste fluid systems, fluid delivery systems, etc. Pumps or compressors can be used to increase the pressure of the fluid used by the system.

[0013] Traditionally, refrigeration and / or air conditioning systems use compressors to increase the pressure of a fluid (e.g., a refrigeration fluid such as CO2, R-134a, hydrocarbons, hydrofluorocarbons (HFCs), hydrochlorofluorocarbons (HCFCs), ammonia (NH3), refrigerant mixtures, R-407A, R-404A, etc.). Traditionally, a separate compressor mechanically coupled to a motor is used to increase the pressure of the fluid. Pumps and compressors operating on large pressure differentials (e.g., causing a substantial increase in fluid pressure) require a large amount of energy. Therefore, conventional systems consume a large amount of energy to increase fluid pressure (via a pump or compressor driven by a motor). In addition, conventional refrigeration systems reduce the pressure of the fluid through an expansion valve.

[0014] Although the fluid of a conventional refrigeration system is reduced in pressure (e.g., expanded, etc.) by passing through an expansion valve, no useful work is extracted from the expanded fluid, resulting in energy inefficiency in conventional systems. In addition, hydrofluorocarbon (HFC) refrigerants (e.g., R-134a, R-404a, etc.) are alleged to contribute to climate change and are being phased out in some countries. Conventional HFC refrigerants are being replaced by natural refrigerants such as carbon dioxide (e.g., R-744) that have negligible environmental impact. However, the operating pressure of a refrigeration system using CO2 as a refrigerant is much higher than that of a refrigeration system using HFC refrigerants (e.g., 900psi to 1500psi, vs. 200psi to 300psi, etc.). Therefore, a refrigeration system using CO2 refrigerant may consume more energy than a conventional refrigeration system using HFC refrigerants. When operating in warmer ambient conditions, the energy consumption of a refrigeration system using CO2 refrigerant increases because as the ambient temperature increases, the pressure in the gas cooler / condenser also increases, and therefore the compressor does more work to overcome the increase in pressure. This is one of the key challenges associated with CO2 refrigeration systems. The system of the present disclosure addresses this challenge by extracting energy during the expansion of the high pressure CO2 refrigerant and using the expanded refrigerant to compress a portion of the refrigerant flow, which can reduce the energy consumption of the main compressor of the refrigeration system.

[0015] Air conditioning systems (e.g., refrigeration systems, etc.) are commonly used for data center cooling. Conventional air conditioning systems can be used to cool the air provided within a data center computer room to cool computer components such as servers and / or server components. However, conventional air conditioning systems for data center cooling have the same disadvantages as described above, particularly inefficiency when the refrigerant expands under large pressure differentials. A large amount of energy is used to operate conventional air conditioning systems for data center cooling. This problem is exacerbated as data centers grow in size and new computing components increase in computing power, resulting in increased heat output. The increased heat output of computing components with increased computing power and / or increased data center size requires increased cooling capacity, which cannot be effectively provided using conventional air conditioning systems.

[0016] The systems, devices and methods disclosed herein provide a data center cooling system (e.g., a data center refrigeration system, etc.). In some embodiments, the data center cooling system includes a refrigeration system to exchange heat between a first cooling circuit and a second cooling circuit. The first cooling circuit can flow a first heat transfer fluid or coolant (e.g., water or a water-glycol mixture, etc.) to cool a plurality of servers (e.g., computing units, computing components, server components, etc.) disposed in a data center server room (e.g., a data center room, etc.). In some embodiments, the first cooling circuit is configured to cool the air in the data center. For example, the first cooling circuit can cool the airflow in a data center server room (e.g., a computer room, etc.) via a cooling coil (e.g., a cooling coil of a computer room air conditioner, etc.). Warm air from the server can flow through the cooling coil (e.g., can be blown onto the cooling coil by a fan). The warm air can be cooled, and the cooled air can be circulated back to the server in the server room to cool the server. Heat from the server can be transferred from the warm air to the first cooling circuit (e.g., through the cooling coil).

[0017] In some embodiments, the first cooling loop provides heat from the servers to a refrigeration system (e.g., a data center cooling system having a pressure exchanger as described herein). In some embodiments, the refrigeration system provides heat from the servers to a second cooling loop. The second cooling loop may flow a second heat transfer fluid or coolant (e.g., water or a water-glycol mixture, etc.) to a cooling tower and / or chiller unit. In some embodiments, the cooling tower or chiller unit discharges heat from the second cooling loop to the surrounding environment (e.g., a radiator, etc.).

[0018] In some embodiments, a refrigeration system (e.g., a data center cooling system, a heat transfer system, a CO2 refrigeration system, etc.) causes a refrigerant (e.g., a CO2 refrigerant or other suitable refrigerant, etc.) to flow along a refrigeration cycle. In some embodiments, the refrigeration system includes a pressure exchanger (PX) configured to exchange pressure between a first fluid (e.g., a high pressure portion of a refrigeration fluid in a refrigeration cycle) and a second fluid (e.g., a low pressure portion of a refrigeration fluid in a refrigeration cycle). In some embodiments, the PX may receive a first fluid (e.g., a high pressure portion of a refrigeration fluid) via a first inlet (e.g., a high pressure inlet) and receive a second fluid (e.g., a low pressure portion of a refrigeration fluid) via a second inlet (e.g., a low pressure inlet). In some embodiments, the first fluid is received at a high pressure from a second heat exchanger at the first inlet. When entering the PX, the first fluid may have a higher pressure than the second fluid. The PX may exchange pressure between the first fluid and the second fluid. The first fluid may leave the PX via a first outlet (e.g., a low pressure outlet), and the second fluid may leave the PX via a second outlet (e.g., a high pressure outlet). In some embodiments, the second fluid is provided to the first heat exchanger from the second outlet. When exiting the PX, the second fluid may have a higher pressure than the first fluid (eg, due to pressure exchange between the first and second fluids).

[0019] In some embodiments, the data center cooling system includes a first heat exchanger for exchanging heat between a first cooling loop and a refrigeration system. The first cooling loop can provide heat from a plurality of servers to the first heat exchanger, which can then provide the heat to the refrigeration system (e.g., heat is transferred from the first cooling loop to the refrigeration fluid in the first heat exchanger). The first heat exchanger can be an evaporator (e.g., evaporating the refrigerant from a liquid state to a gaseous state, etc.). In some embodiments, the first heat exchanger exchanges heat between the fluid of the first cooling loop and at least a portion of the first fluid output from the first outlet of the PX. The first heat exchanger can exchange heat between the coolant of the first cooling loop and at least a portion of the refrigeration fluid output from the first outlet of the PX. In some embodiments, the data center cooling system includes a second heat exchanger to exchange heat between the refrigeration system and the second cooling loop. The refrigeration system can provide heat from a plurality of servers to the second heat exchanger, which can then provide the heat to the second cooling loop. In some embodiments, the second heat exchanger exchanges heat between at least a portion of the first fluid that is about to enter the first inlet of the PX and the fluid of the second cooling loop. The second heat exchanger may be a gas cooler (eg, for cooling a gaseous refrigerant) or a condenser (eg, condensing a refrigerant from a gaseous state to a liquid state). The second cooling circuit may take the heat to a cooling tower and / or chiller unit to process the heat.

[0020] The systems, devices and methods disclosed herein have advantages over conventional solutions. Compared with conventional systems, the systems disclosed herein can use reduced energy (e.g., using less energy to provide data center cooling, etc.). PX can allow the recovery of energy (e.g., pressure energy, etc.) in the refrigeration system that is usually lost in conventional systems. The recovered energy can be used to compress a portion of the refrigerant (e.g., in a vapor state) to a high pressure (e.g., the working pressure of a condenser or gas cooler, etc.). This can reduce the amount of refrigerant compressed by the main compressor of the refrigeration system, thereby reducing the energy consumption of the main compressor. This makes the system disclosed herein more efficient, thereby using less energy than conventional solutions and having lower costs to end users over time. In addition, in the case of electricity generation by burning fossil fuels, the system disclosed herein can reduce the carbon footprint of the data center cooling system. In addition, compared with conventional systems, the system disclosed herein reduces the wear of components (e.g., pumps, compressors) because the pumps or compressors of the system disclosed herein can operate more efficiently (e.g., PX performs a portion of increasing fluid pressure to reduce the load on the pump and / or compressor) compared to conventional systems. In addition, some of the systems described herein reduce the number of moving parts (e.g., some systems use auxiliary coolers, receivers, etc. instead of boosters or compressors, etc.). This also allows the disclosed systems to have higher reliability, less maintenance, longer component life, less system downtime, and higher production (e.g., refrigeration, cooling, heating, etc.). The disclosed systems can use pressure exchangers, which allow system components to last longer, increase system efficiency, allow the end user to choose from a wider range of pumps and / or compressors, reduce maintenance and downtime to service pumps and / or compressors, and allow new instrumentation and controls.

[0021] Although some embodiments of the present disclosure are described with respect to pressure exchangers, energy recovery devices, and hydraulic energy transfer systems, the present disclosure can be applied to other systems and devices (e.g., non-isobaric pressure exchangers, rotating components other than pressure exchangers, non-rotating pressure exchangers, systems that do not include pressure exchangers, etc.).

[0022] Although some embodiments of the present disclosure are described with respect to pressure exchange between fluids used in data center cooling systems, data center cooling systems, fracturing systems, desalination systems, heat pump systems, and / or refrigeration systems, the present disclosure may also be applied to other types of systems. Fluids may refer to liquids, gases, transcritical fluids, supercritical fluids, subcritical fluids, and / or combinations thereof.

[0023] Figure 1A A schematic diagram of a fluid handling system 100A including a hydraulic energy transfer system 110 is shown, according to certain embodiments.

[0024] In some embodiments, the hydraulic energy transfer system 110 includes a pressure exchanger (e.g., PX). The hydraulic energy transfer system 110 (e.g., PX) receives a low pressure fluid input 120 from a low pressure (LP) input system 122 (e.g., via a low pressure inlet). The hydraulic energy transfer system 110 also receives a high pressure fluid input 130 from a high pressure (HP) input system 132 (e.g., via a high pressure inlet). In some embodiments, the high pressure input system 132 exchanges heat with a cooling tower or chiller unit to discharge the heat to the surrounding environment (e.g., a radiator). The hydraulic energy transfer system 110 (e.g., PX) exchanges pressure between the high pressure fluid input 130 and the low pressure fluid input 120 to provide a low pressure fluid output 140 to a low pressure fluid output system 142 (e.g., via a low pressure outlet), and to provide a high pressure fluid output 150 to a high pressure fluid output system 152 (e.g., via a high pressure outlet). The controller 180 can adjust the flow rate of the high pressure fluid input 130 and the low pressure fluid output 140 through one or more flow valves, pumps, and / or compressors (not shown). The controller 180 may actuate the flow valve.

[0025] In some embodiments, the hydraulic energy transfer system 110 includes a PX to exchange pressure between a high pressure fluid input 130 and a low pressure fluid input 120. In some embodiments, the PX is substantially or partially isobaric (e.g., an isobaric pressure exchanger (IPX)). The PX may be a device that transfers fluid pressure between a high pressure fluid input 130 and a low pressure fluid input 120 with an efficiency (e.g., pressure transfer efficiency, substantially isobaric) of more than about 50%, 60%, 70%, 80%, 90% or more (e.g., without using centrifugal techniques) . High pressure (e.g., high pressure fluid input 130, high pressure fluid output 150) refers to a pressure that is higher than a low pressure (e.g., low pressure fluid input 120, low pressure fluid output 140). The low-pressure fluid input 120 of the PX can be pressurized and exit the PX at a high pressure (e.g., a high-pressure fluid output 150, whose pressure is greater than the pressure of the low-pressure fluid input 120), while the high-pressure fluid input 130 can be at least partially depressurized and exit the PX at a low pressure (e.g., a low-pressure fluid output 140, whose pressure is lower than the high-pressure fluid input 130).

[0026] The PX can operate with a high pressure fluid input 130, directly pressurizing the low pressure fluid input 120, with or without a fluid separator between the fluids. Examples of fluid separators that can be used with the PX include, but are not limited to, pistons, capsules, diaphragms, and / or the like. In some embodiments, the PX can be a rotary device. A rotary PX, such as the one manufactured by Energy Recovery, Inc. of San Leandro, California, may not have any separate valves because the effective valve adjustment action is accomplished inside the device via the relative movement of the rotor relative to the end cap. In some embodiments, the rotary PX operates with an internal piston to isolate the fluids and transfer pressure with relatively little mixing of the inlet fluid streams. In some embodiments, the rotary PX operates between fluids without an internal piston. A reciprocating PX may include a piston that reciprocates in a cylinder for transferring pressure between the fluid streams. Any or more PXs may be used in the present disclosure, such as, but not limited to, a rotary PX, a reciprocating PX, or any combination thereof. Additionally, the PX can be provided on a skid that is separate from the other components of the fluid treatment system 100A (e.g., where the PX is attached to an existing fluid treatment system). In some examples, the PX can be secured to a structure that can be moved from one location to another. The PX can be coupled to a system that is constructed on site (e.g., piping, etc. of the system).

[0027] In some embodiments, the motor 160 is coupled to the hydraulic energy transfer system 110 (e.g., coupled to the PX, coupled to a rotor of the PX, etc.). In some embodiments, the motor 160 controls the speed of the rotor of the hydraulic energy transfer system 110 (e.g., to increase the pressure of the high pressure fluid output 150, decrease the pressure of the high pressure fluid output 150, etc.). In some embodiments, the motor 160 generates energy based on the pressure exchange in the hydraulic energy transfer system 110 (e.g., acts as a generator).

[0028] The hydraulic energy transfer system 110 may include a hydraulic turbocharger or a hydraulic pressure exchanger, such as a rotary PX. The PX may include one or more chambers and / or channels (e.g., 1 to 100) to facilitate pressure transfer between a first fluid and a second fluid (e.g., gas, liquid, multiphase fluid).

[0029] In some embodiments, the low pressure input system 122 includes a booster (e.g., a pump and / or a compressor) to increase the pressure of the fluid, thereby forming the low pressure fluid input 120. In some embodiments, the low pressure input system 122 includes an ejector to increase the pressure of the fluid, thereby forming the low pressure fluid input 120. In some embodiments, the low pressure input system 122 receives gas from the low pressure output system 142. In some embodiments, the low pressure input system 122 receives fluid from a receiver (e.g., a flash tank, etc.). The receiver can receive the low pressure fluid output 140 output from the hydraulic energy transfer system 110. In some embodiments, the low pressure output system 142 exchanges heat with a data center server room to cool the servers.

[0030] The fluid treatment system 100A may further include one or more sensors to provide sensor data (e.g., flow data, pressure data, velocity data, etc.) associated with the fluid of the fluid treatment system 100A. The controller 180 may control one or more flow rates of the fluid treatment system 100A based on the sensor data. In some embodiments, the controller 180 actuates one or more flow valves based on the received sensor data. In some embodiments, the controller 180 may perform Figure 6 method.

[0031] Figure 1B A schematic diagram of a fluid handling system 100B including a hydraulic energy transfer system 110 is shown according to certain embodiments. The fluid handling system 100B can be a refrigeration system, such as a data center refrigeration system. In some embodiments, the fluid handling system 100B is a thermal energy (e.g., heat) transfer system (e.g., a heat transfer system, a heat transfer system). The fluid handling system 100B can be configured to cool an environment (e.g., an indoor space, a refrigerator, a freezer, a data center server room, etc.). In some embodiments, the fluid handling system 100B includes a plurality of Figure 1B More components, fewer components, same routes, different routes, etc. shown. Figure 1B The reference numerals of some features in Figure 1A Similar to the reference numerals in Figure 1A Those similar features, functions and / or structures in.

[0032] The hydraulic energy transfer system 110 (e.g., PX) may receive a low pressure fluid input 120 from a low pressure input system 122 (e.g., a low pressure lift device 128, a low pressure fluid pump, a low pressure booster, a low pressure compressor, a low pressure ejector, etc.) and a high pressure fluid input 130 from a high pressure input system 132 (e.g., a condenser 138, a gas cooler, a heat exchanger, etc.). The hydraulic energy transfer system 110 (e.g., PX) may exchange pressure between the low pressure fluid input 120 and the high pressure fluid input 130 to provide a high pressure fluid output 150 to a high pressure output system 152 (e.g., a high pressure lift device 159, a high pressure fluid pump, a high pressure booster, a high pressure compressor, a high pressure ejector, etc.) and provide a low pressure fluid output 140 to a low pressure output system 142 (e.g., an evaporator 144, a heat exchanger, a receiver 113, etc.). The low pressure output system 142 (e.g., evaporator 144, receiver 113) can provide fluid to the compressor 178 and the low pressure lift device 128. The evaporator 144 can provide fluid to the compressor 178, and the receiver 113 (e.g., flash tank) can provide fluid to the low pressure lift device 128. The condenser 138 can receive fluid from the compressor 178 and the high pressure lift device 159. The high pressure lift device 159 can be a high pressure booster, and the low pressure lift device 128 can be a low pressure booster.

[0033] In some embodiments, the evaporator 144 receives heat from a computer room air conditioner (CRAC) 146 via a first cooling loop 186. The first cooling loop 186 can carry heat from a plurality of servers in the server room (e.g., cooled by the CRAC 146). The coolant of the first cooling loop 186 can be cooled in the evaporator 144 and circulated to the CRAC 146. The CRAC 146 can use the cooled coolant to cool the air in the server room to cool the servers. In some embodiments, the cooling tower 136 receives heat from the condenser 138 via a second cooling loop 170. The second cooling loop 170 can carry heat from a plurality of servers in the server room. The coolant of the second cooling loop 170 can be heated in the condenser 138 and circulated to the cooling tower 136. The coolant of the second cooling loop 170 can be cooled in the cooling tower 136. The cooled coolant can be recirculated from the cooling tower 136 to the condenser 138. The controller 180 can control one or more components of the fluid handling system 100B.

[0034] The fluid treatment system 100B may be a closed system. The low pressure fluid input 120, the high pressure fluid input 130, the low pressure fluid output 140 and the high pressure fluid output 150 may all be fluids (eg, refrigerants, same fluids) circulating in the closed system of the fluid treatment system 100B.

[0035] The fluid handling system 100B may further include one or more sensors configured to provide sensor data associated with the fluid. One or more flow valves may control the flow rate of the fluid based on the sensor data received from the one or more sensors. In some embodiments, one or more pressure control valves may be included in the system 100B to separate the high-pressure fluid from the low-pressure fluid. In some embodiments, the system 100B may include a flash tank or a receiver to receive a two-phase liquid-gas mixture and use a density difference to separate the mixture into a liquid phase portion and a gas phase portion. The liquid phase portion may be provided to the evaporator after being decompressed by a valve (e.g., an expansion valve, etc.). The gas phase portion may be provided to the low-pressure lifting device 128. Excess gas not received by the low-pressure lifting device 128 may be sent to the compressor 178 after the pressure is reduced to the working pressure of the evaporator 144 by a valve (e.g., an expansion valve). In some embodiments, the controller 180 actuates one or more flow valves (not shown) based on the received sensor data.

[0036] Figure 1C A schematic diagram of a fluid handling system 100C including a hydraulic energy transfer system 110 is shown according to certain embodiments. The fluid handling system 100C can be a refrigeration system, such as a data center refrigeration system. In some embodiments, the fluid handling system 100C is a thermal energy (e.g., heat) transfer system (e.g., a heat transfer system, a heat transfer system). The fluid handling system 100C can be configured to cool an environment (e.g., an indoor space, a refrigerator, a freezer, a data center server room, etc.). In some embodiments, the fluid handling system 100C includes a plurality of Figure 1C More components, fewer components, same routes, different routes, etc. shown. Figure 1C The reference numerals of some features in Figure 1A Similar to the reference numerals in Figure 1A and Figure 1B Those similar features, functions and / or structures in.

[0037] In some embodiments, the refrigeration system 164 is used to cool the servers of the data center 190. The refrigeration system 164 can cool the servers of the data center by cooling the air in the data center 190 and / or by cooling the liquid coolant. A plurality of servers can be arranged in the data center 190. For example, the data center 190 can include one or more rooms, each of which contains one or more racks, and each rack supports a plurality of servers. In some embodiments, the refrigeration system 164 includes a hydraulic energy transfer system 110 (e.g., a pressure exchanger, etc.) and a compressor 178 as described herein. In some embodiments, the refrigeration system 164 includes a first heat exchanger 118 and a second heat exchanger 129. The heat exchanger 118 can exchange heat between a fluid (e.g., at least a portion of the fluid) output from the hydraulic energy transfer system 110 and a fluid of a first cooling circuit 186. The cooling circuit 186 can provide a cooled coolant for the servers in the data center 190. The heat from the server can be transferred to the heat exchanger 118 through the cooling circuit 186. In some embodiments, the heated refrigeration fluid flows from the first heat exchanger 118 to the second heat exchanger 129. A flow of refrigeration fluid may be provided to or from the hydraulic energy transfer system 110. In some embodiments, the second heat exchanger 129 exchanges heat between the fluid to be introduced into the hydraulic energy transfer system 110 and the fluid of the second cooling circuit 170. Heat may be transferred by the second cooling circuit 170 to a cooling tower 174 for cooling the coolant. The cooled coolant may be provided by the second cooling circuit 170 back to the second heat exchanger 129. In some embodiments, the cooled refrigeration fluid flows from the second heat exchanger 129 to the hydraulic energy transfer system 110. References herein FIG. 3A to FIG. 3C , Figure 4 and FIG. 5A to FIG. 5F Several possible arrangements of fluid treatment system 100C are shown and described.

[0038] FIG. 2A to FIG. 2E is an exploded perspective view of a rotary PX 40 (eg, a rotary pressure exchanger, a rotary liquid piston compressor (LPC)) according to certain embodiments. FIG. 2A to FIG. 2E Some features in one or more of the graphs may have Figure 1A to Figure 1B The similar features, functions and / or structures in one or more of the figures herein may be used to represent the similar features, functions and / or structures in the embodiment of the present invention.

[0039] The PX 40 is configured to transfer pressure and / or work between a first fluid (e.g., refrigerant, supercritical carbon dioxide, high pressure fluid input 130) and a second fluid (e.g., refrigerant, superheated gaseous carbon dioxide, low pressure fluid input 120) with minimal mixing of the fluids. The rotary PX 40 may include a generally cylindrical body portion 42 including a sleeve 44 (e.g., a rotor sleeve) and a rotor 46. The rotary PX 40 may also include two end caps 48 and 50 including manifolds 52 and 54, respectively. The manifold 52 includes respective inlet ports 56 and outlet ports 58, while the manifold 54 includes respective inlet ports 60 and outlet ports 62. In operation, these inlet ports 56, 60 enable the first and second fluids to enter the rotary PX 40 to exchange pressures, while the outlet ports 58, 62 enable the first and second fluids to subsequently exit the rotary PX 40. In operation, the inlet port 56 can receive the high pressure first fluid (e.g., high pressure fluid input 130) output from the condenser, and after exchanging pressures, the outlet port 58 can be used to deliver the low pressure first fluid (e.g., low pressure fluid output 140) from the rotary PX 40 to a receiver (e.g., a flash tank) configured to receive the first fluid from the rotary PX 40. The receiver can form a chamber configured to separate the fluid into gas and liquid. Similarly, the inlet port 60 can receive the low pressure second fluid (e.g., low pressure slurry fluid, low pressure fluid input 120) from the booster, which is configured to receive a portion of the gas from the receiver and increase the pressure of the gas, and the outlet port 62 can be used to discharge the high pressure second fluid (e.g., high pressure slurry fluid, high pressure fluid output 150) out of the rotary PX 40. The end caps 48, 50 include respective end caps 64, 66 (e.g., end plates) disposed within the respective manifolds 52, 54, which enable fluid-tight contact with the rotor 46.

[0040] One or more components of the PX 40, such as the rotor 46, the end cap 64, and / or the end cap 66, may be constructed of a wear-resistant material (e.g., carbide, cemented carbide, silicon carbide, tungsten carbide, ceramics such as alumina ceramic, etc.) having a hardness greater than a predetermined threshold (e.g., a Vickers hardness value of at least 1000, 1250, 1500, 1750, 2000, 2250, or more). In some examples, tungsten carbide may be more durable and may provide improved wear resistance to abrasive fluids compared to other materials such as alumina ceramic. Additionally, in some embodiments, one or more components of the PX 40, such as the rotor 46, the end cap 64, the end cap 66, and / or other sealing surfaces of the PX 40, may include inserts. In some embodiments, the insert may be formed of one or more wear-resistant materials (e.g., carbide, cemented carbide, silicon carbide, tungsten carbide, etc.) having a hardness greater than a predetermined threshold (e.g., a Vickers hardness value of at least 1000, 1250, 1500, 1750, 2000, 2250 or more) to provide improved wear resistance.

[0041] The rotor 46 may be cylindrical and may be disposed within the sleeve 44, which enables the rotor 46 to rotate about the axis 68. The rotor 46 may have a plurality of passages 70 (e.g., ducts, rotor ducts) extending substantially longitudinally through the rotor 46, with openings 72 and 74 (e.g., rotor ports) at each end symmetrically arranged about the longitudinal axis 68. The openings 72 and 74 of the rotor 46 are arranged to be hydraulically connected to inlet apertures 76 and outlet apertures 78 (e.g., end cap inlet ports and end cap outlet ports) and inlet apertures 80 and outlet apertures 82 (e.g., end cap inlet ports and end cap outlet ports) in the end caps 64, 66, so that the passages 70 are exposed to fluids at high pressure and fluids at low pressure during rotation. As shown, the inlet apertures 76 and outlet apertures 78 and the inlet apertures 80 and outlet apertures 82 may be designed in the form of arcs or segments of a circle (e.g., C-shaped).

[0042] In some embodiments, a controller using sensor data (e.g., revolutions per minute measured by a tachometer or optical encoder, volume flow measured by a flow meter, etc.) can control the degree of mixing between the first fluid and the second fluid in the rotary PX, which can be used to improve the fluid handling system (e.g., Figure 1A to Figure 1BThe invention also provides an embodiment of the present invention and provides an embodiment of the present invention to improve the operability of the fluid handling system 100A-100B of the rotary PX 40. In some examples, varying the volumetric flow rate of the first fluid and / or the second fluid entering the rotary PX 40 allows an operator (e.g., a system operator, a plant operator) to control the amount of fluids that are mixed within the PX 40. In addition, varying the rotational speed of the rotor 46 (e.g., via a motor) also allows the operator to control mixing. Three features of the rotary PX 40 that affect mixing are: (1) the aspect ratio of the rotor channel 70; (2) the duration of exposure between the first fluid and the second fluid; and (3) the formation of a barrier (e.g., a fluid barrier, a piston, an interface) between the first fluid and the second fluid within the rotor channel 70. First, the rotor channel 70 (e.g., a pipe) is typically long and narrow, which stabilizes the flow within the rotary PX 40. In addition, the first fluid and the second fluid can move through the channel 70 in a piston flow state with minimal axial mixing. Second, in some embodiments, the speed of the rotor 46 reduces the contact between the first fluid and the second fluid. In some examples, the speed of the rotor 46 (e.g., a rotor speed of about 1200 revolutions per minute (RPM)) can reduce the contact time between the first fluid and the second fluid to less than about 0.15 seconds, 0.10 seconds, or 0.05 seconds. Third, the rotor channel 70 (e.g., a small portion of the rotor channel 70) is used for pressure exchange between the first fluid and the second fluid. In some embodiments, a certain volume of fluid is retained in the channel 70 to act as a barrier between the first fluid and the second fluid. All of these mechanisms can limit mixing within the rotary PX 40. In addition, in some embodiments, the rotary PX 40 can be designed to operate with an internal piston or other barrier that completely or partially isolates the first fluid from the second fluid while achieving pressure transfer.

[0043] FIG. 2B to FIG. 2E is an exploded view of an embodiment of a rotary PX 40 showing the sequence of positions of a single rotor channel 70 in the rotor 46 as the channel 70 rotates through a complete cycle. Note that FIG. 2B to FIG. 2E is a simplified diagram of a rotary PX 40 showing one rotor channel 70, and the channel 70 is shown as having a circular cross-sectional shape. In other embodiments, the rotary PX 40 may include multiple channels 70 having the same or different cross-sectional shapes (e.g., circular, oval, square, rectangular, polygonal, etc.). Thus, FIG. 2B to FIG. 2E is a simplification for illustrative purposes, and other embodiments of the rotary PX 40 may have the same FIG. 2A to FIG. 2E. As described in detail below, the rotary PX 40 facilitates pressure exchange between a first fluid and a second fluid (e.g., a particle-free fluid and a slurry fluid, a high pressure refrigerant and a low pressure refrigerant, etc.) by enabling the first fluid and the second fluid to briefly contact each other within the rotor 46. In some embodiments, the PX facilitates pressure exchange between a first fluid and a second fluid by enabling the first fluid and the second fluid to contact opposite sides of a barrier (e.g., a reciprocating barrier, a piston, not shown). In some embodiments, the exchange occurs at a speed that causes limited mixing of the first fluid and the second fluid. The speed of the pressure wave traveling through the rotor passage 70 (once the passage is exposed to the orifice 76), the diffusion rate of the fluids, and / or the rotational speed of the rotor 46 may determine whether any mixing occurs and the extent of mixing.

[0044] Figure 2B is a perspective view of an embodiment of a rotary PX 40 according to some embodiments. Figure 2B 64 and the manifold 52, while the opposing channel opening 74 is in fluid communication with the orifice 82 in the end cap 66 and, by extension, the manifold 54. The rotor 46 can rotate in a clockwise direction as indicated by arrow 84. In operation, a low pressure second fluid 86 (e.g., a low pressure slurry fluid) passes through the end cap 66 and enters the channel 70 where it contacts the first fluid 88 at the dynamic fluid interface 90. The second fluid 86 then drives the first fluid 88 out of the channel 70, through the end cap 64, and out of the rotary PX 40. However, due to the short duration of contact, mixing between the second fluid 86 (e.g., a slurry fluid) and the first fluid 88 (e.g., a particle-free fluid) is minimal. In some embodiments, the low pressure second fluid 86 contacts a first side of a barrier (e.g., a piston, not shown) disposed in the passage 70, which contacts (e.g., on the opposite side of the barrier) the first fluid 88. The second fluid 86 drives the barrier, which pushes the first fluid 88 out of the passage 70. In such embodiments, there is negligible mixing between the second fluid 86 and the first fluid 88.

[0045] Figure 2C is an exploded perspective view of an embodiment of a rotary PX 40 according to certain embodiments. Figure 2C , the passage 70 has been rotated clockwise through an arc of approximately 90 degrees. In this position, the opening 74 (e.g., outlet) is no longer in fluid communication with the orifices 80 and 82 of the end cap 66, and the opening 72 is no longer in fluid communication with the orifices 76 and 78 of the end cap 64. Thus, the low pressure second fluid 86 is temporarily contained within the passage 70.

[0046] Figure 2D is an exploded perspective view of an embodiment of a rotary PX 40 according to certain embodiments. Figure 2D In the channel 70, Figure 2B The position shown is rotated through a first specified angle of arc (e.g., approximately 60 degrees of arc). The opening 74 is now in fluid communication with the orifice 80 in the end cap 66, and the opening 72 of the passage 70 is now in fluid communication with the orifice 76 of the end cap 64. In this position, the high pressure first fluid 88 enters and pressurizes the low pressure second fluid 86, thereby driving the second fluid 86 out of the rotor passage 70 and through the orifice 80.

[0047] Figure 2E is an exploded perspective view of an embodiment of a rotary PX 40 according to certain embodiments. Figure 2E In the channel 70, Figure 2B The illustrated position is rotated through a second specified angle of arc (e.g., approximately 270 degrees of arc). In this position, opening 74 is no longer in fluid communication with orifices 80 and 82 of end cap 66, and opening 72 is no longer in fluid communication with orifices 76 and 78 of end cap 64. Thus, first fluid 88 is no longer pressurized and is temporarily contained within passage 70 until rotor 46 rotates another 90 degrees to begin the cycle again.

[0048] FIG. 3A to FIG. 3C is a schematic diagram of a data center cooling system 300A- 300C including a pressure exchanger according to certain embodiments. FIG. 3A to FIG. 3C Some features in one or more of the graphs may have Figure 1A to Figure 1B One or more images in and / or FIG. 2A to FIG. 2E Those similar features, functions and / or structures in one or more of the figures. FIG. 3A to FIG. 3C and / or Figure 4 One or more of the systems in FIG. 5 may be used to perform Figure 6 method.

[0049] Figure 3A310 is a schematic diagram of a data center cooling system 300A including a PX 310 according to certain embodiments. In some embodiments, the data center cooling system 300A is a thermal energy delivery system and / or a fluid handling system. The PX 310 can be a rotary pressure exchanger. In some embodiments, the PX 310 is an isobaric or substantially isobaric pressure exchanger. The PX 310 can be configured to exchange pressure between a first fluid and a second fluid. In some embodiments, the PX 310 is coupled to a motor 360 (e.g., the rotation of a rotor of the PX 310 is controlled by the motor 360). In some embodiments, the motor 360 controls the rotational speed of the PX 310. The mass flow rate (e.g., of the first fluid and / or the second fluid) through the PX 310 can be related to the rotational speed of the PX 310. In some embodiments, the pressure of the fluid (e.g., the first fluid) in the gas cooler 329 can be related to the rotational speed of the PX 310. In some embodiments, a controller (e.g., a controller 380) receives sensor data from one or more sensors of the motor 360.

[0050] In some embodiments, PX 310 receives a high pressure first fluid (e.g., Figure 1A to Figure 1B In some embodiments, the PX 310 receives a low pressure second fluid (e.g., Figure 1A to Figure 1B 120). Although there are references to "high pressure" and "low pressure", "high pressure" and "low pressure" may be relative to each other and may not include certain pressure values ​​(e.g., the pressure of high pressure fluid input 130 is higher than the pressure of low pressure fluid input 120). PX 310 can exchange pressure between a first fluid and a second fluid. PX 310 can provide a first fluid via a low pressure outlet (e.g., low pressure fluid output 140) and can provide a second fluid via a high pressure outlet (e.g., high pressure fluid output 150). In some embodiments, the first fluid provided via the low pressure outlet is at a low pressure, and the second fluid provided via the high pressure outlet is at a high pressure.

[0051] In some embodiments, the PX 310 is a rotary PX with multiple tubes. In some embodiments, a low-pressure gaseous refrigerant (e.g., a second fluid at a second pressure) enters the tube and is sealed in the tube as the tube rotates past the low-pressure inlet. When the tube is exposed to the high-pressure outlet, a pressure wave is generated that compresses the low-pressure gaseous refrigerant to a high pressure. The low-pressure gaseous refrigerant may increase in temperature when compressed. Therefore, the low-pressure gaseous refrigerant may be converted into a high-pressure, high-temperature refrigerant (e.g., in a supercritical state, etc.). When the high-pressure, medium-temperature supercritical refrigerant (e.g., the first fluid at the first pressure) enters the other end of the tube (e.g., from the high-pressure inlet port), the high-pressure, high-temperature (e.g., supercritical) refrigerant (e.g., the second fluid at a fourth pressure) may be ejected from the tube through the high-pressure outlet port. The high-pressure, medium-temperature supercritical refrigerant may push the now compressed fluid plug out of the high-pressure outlet port. As the tube continues to rotate through the high-pressure inlet port, the high-pressure, medium-temperature fluid plug may be sealed in the tube. When the tube is exposed to the low-pressure outlet port, an expansion wave propagates through the tube and converts the high-pressure, medium-temperature supercritical refrigerant into a low-pressure, low-temperature two-phase liquid-gas mixture (e.g., the first fluid at the third pressure) and then discharges the tube through the low-pressure outlet port.

[0052] In some embodiments, the fluid handling system 300A includes a gas cooler 329 (e.g., a condenser, etc.), an evaporator 318, and a compressor 322. In some embodiments, the gas cooler 329 is a heat exchanger that provides heat from a refrigerant (e.g., a first fluid) to a cooling circuit (e.g., a second cooling circuit 370). The gas cooler 329 can remove heat from the refrigerant and provide the heat to the cooling circuit. In some embodiments, the gas cooler 329 is a heat exchanger that cools a fluid flowing through the gas cooler 329 (e.g., cooling a gaseous refrigerant, etc.). In some embodiments, the gas cooler 329 is a heat exchanger that condenses a fluid flowing through the gas cooler 329 (e.g., while cooling a flowing fluid) from a gas state to a liquid state. In some embodiments, the fluid pressure within the gas cooler 329 is higher than the critical pressure of the fluid. The gas cooler 329 can provide heat from a fluid (e.g., a gas) to the second cooling circuit 370. In some embodiments, the temperature of the fluid in the gas cooler 329 can be reduced, but the fluid may not condense (e.g., the fluid does not change phase from a gas to a liquid). In some embodiments, above the critical pressure of the fluid (eg, refrigerant), the thermodynamic distinction between the liquid and gas phases of the fluid within the gas cooler 329 disappears, leaving only one fluid state known as a supercritical state.

[0053] In some examples, the evaporator 318 can provide the heat received by the system 300A from the first cooling loop 386 to a refrigeration fluid. In some embodiments, the refrigeration fluid is CO2 or another refrigeration fluid. The heat can be discharged to the second cooling loop 370 via the gas cooler 329. In some embodiments, the heat received by the system 300A is excess heat from a plurality of servers (e.g., computing units, server components, etc.) disposed in a server room 390A. Details on the cooling of the plurality of servers in the server room 390A are discussed below.

[0054] The compressor 322 can increase the corresponding pressure of the refrigerant fluid along the flow path between the evaporator 318 and the gas cooler 329. The refrigerant fluid can flow substantially in a cycle (e.g., from the gas cooler 329 to the PX 310 to the evaporator 318 to the compressor 322 to the gas cooler 329, etc.). All fluid flowing into the compressor 322 can be in a gaseous state (e.g., a superheated gaseous state) so that no liquid can enter the compressor 322. Preventing liquid from entering the compressor 322 can minimize damage to the compressor 322 (e.g., due to incompressible liquid).

[0055] In some embodiments, the fluid handling system 300A includes a low-pressure booster (e.g., low-pressure booster 314) and / or a high-pressure booster (e.g., high-pressure booster 324). Both the low-pressure booster 314 and the high-pressure booster 324 can be configured to increase (e.g., "boost") the pressure of the second fluid. For example, the low-pressure booster 314 can increase the pressure of the second fluid output from the evaporator 318 (e.g., received from the PX 310). The high-pressure booster 324 can increase the pressure of the second fluid output by the PX 310. The second fluid can be provided (e.g., by the high-pressure booster 324) to combine with the fluid output from the compressor 322 (e.g., upstream of the inlet of the gas cooler 329) to supply the gas cooler 329. The low-pressure booster 314 can increase the pressure to less than a threshold amount (e.g., the low-pressure booster 314 can operate on a pressure difference less than a threshold amount). In some examples, the low-pressure supercharger 314 may increase the pressure of the second fluid by about 10 to 60 psi. As the second fluid flows from the low-pressure supercharger 314 to the second inlet of the PX 310, the second fluid may experience a pressure loss (e.g., due to fluid friction losses in the pipeline). The high-pressure supercharger 324 may increase the pressure of the second fluid between the second outlet of the PX 310 and the inlet of the gas cooler 329. The high-pressure supercharger 324 may increase the pressure to less than a threshold amount (e.g., the high-pressure supercharger 324 may operate on a pressure difference less than a threshold amount). In some examples, the high-pressure supercharger 324 may increase the pressure of the second fluid by about 10 to 60 psi. The high-pressure supercharger 324 may increase the pressure of the second fluid to a pressure that substantially matches the pressure of the fluid output from the compressor 322 (e.g., the pressure of the gas cooler 329). Compared to the low-pressure supercharger 314 and the high-pressure supercharger 324, the compressor 322 increases the pressure of the fluid to more than a threshold amount (e.g., the compressor 322 may operate on a pressure difference greater than a threshold amount). In some examples, compressor 322 may increase the pressure of the fluid to greater than about 200 psi. In some embodiments, controller 380 controls the flow rate of the fluid through PX 310 by controlling the flow rate of low pressure booster 314. In some examples, controller 380 may set the flow rate of low pressure booster 314 to control the flow rate of the first fluid through PX 310.

[0056] In some embodiments, the evaporator 318 is a heat exchanger for exchanging (e.g., providing) corresponding heat energy from the first cooling loop 386 to a refrigeration fluid. The refrigeration fluid can be transformed from a liquid state to a gaseous state (e.g., a gaseous state, etc.) in the evaporator 318. In some examples, the evaporator 318 can receive heat (e.g., thermal energy) from a coolant (e.g., a heat transfer fluid, water, a water-glycol mixture, etc.) of the first cooling loop and provide the heat to the refrigeration fluid. In some embodiments, the heat is excess heat from the servers in the racks 399 in the server room 390A. In some embodiments, the air circulating in the server room 390A is used to cool the servers (e.g., server components, etc.). In some embodiments, the circulating air 398 takes the heat away from the servers and is directed to the CRAC 391. The CRAC 391 can be a cooler unit for cooling the air 398. The fan 392 can blow the air 398 through an optional humidifier 394. The humidifier 394 can add moisture to the air 398. In some embodiments, the fan 392 blows air over the cooling coil 396. In some embodiments, the cooling coil 396 is a heat exchanger (e.g., a brazed plate heat exchanger, a shell and tube heat exchanger, etc.) configured to exchange heat between the air 398 and the coolant of the first cooling loop 386. In some embodiments, heat from the air 398 is provided to the coolant of the first cooling loop 386 via the cooling coil 396. In some embodiments, the pump 388 is configured to pump the coolant along the flow path of the first cooling loop 386 between the cooling coil 396 and the evaporator 318. Heat from the server can be provided to the evaporator 318 through the first cooling loop 386. In some embodiments, the air 398 is cooled by the coolant via the cooling coil 396. In some embodiments, the cooling air 398 is directed from the CRAC 391 to the space below the raised floor 397 (e.g., via a duct, etc.). The cooling air 398 then flows upward through the perforations in the raised floor 397 and flows between the servers in the rack 399 to cool the servers. The hot air 398 is then directed to the CRAC 391. In some embodiments, the raised floor 397 is configured to support a plurality of server racks 399, each server rack supporting a plurality of servers.

[0057] In some embodiments, the gas cooler 329 is a heat exchanger for transferring corresponding thermal energy (e.g., heat) between the refrigeration fluid and the second cooling loop 370. In some embodiments, the gas cooler 329 provides heat energy from the refrigeration fluid to the coolant (e.g., heat transfer fluid, water, water-glycol mixture, etc.) of the second cooling loop 370. In some embodiments, the heat transferred to the second cooling loop 370 by the gas cooler 329 corresponds to the heat transferred from the first cooling loop 386 in the evaporator 318 (e.g., heat from the server in the server room 390A). In some embodiments, the pump 372 circulates the coolant between the gas cooler 329 and the cooling tower 374 along the flow path of the second cooling loop 370. The cooling tower 374 can be a cooling tower or a chiller unit. In some embodiments, the cooling tower 374 receives warm coolant and cools the coolant by discharging the heat of the coolant to the surrounding environment. The surrounding environment can be a cooling radiator for heat dissipation. The cooled coolant can flow from the cooling tower 374 to the gas cooler 329.

[0058] In some embodiments, the temperature and / or humidity of the surrounding environment affects the performance of the cooling tower 374. The performance of the cooling tower 374 may affect the performance of the system 300A. For example, the cooling tower 374 can cool the coolant of the second cooling loop 370 to a temperature determined by the relative humidity and / or temperature of the surrounding environment. The refrigerant flowing through the gas cooler 329 can be cooled to a temperature no lower than the temperature of the coolant of the second coolant loop 370. Cooling the refrigerant to a cooler temperature in the gas cooler 329 provides more efficient cooling of the coolant of the first cooling loop 386 in the evaporator 318. When the temperature of the refrigerant leaving the gas cooler 329 is lower, the refrigerant after expansion through the PX 310 is closer to a saturated liquid state, which means that the refrigerant contains more liquid in the saturated mixture. Compared with gaseous refrigerant, liquid refrigerant provides greater cooling capacity when flowing through the evaporator 318. Thus, lowering the temperature of the coolant of the second cooling loop 370 (eg, cooled by the cooling tower 374 ) allows the evaporator 318 (eg, the refrigerant) to absorb more heat, thereby increasing the efficiency of the system 300A.

[0059] System 300A may include a controller 380 (e.g., Figure 1A1D ). Controller 380 may control a supercharger and / or compressor of system 300A. Controller 380 may receive sensor data from one or more sensors of system 300A. The sensors may include pressure sensors, flow rate sensors, and / or temperature sensors. In some embodiments, controller 380 controls a motor (e.g., motor 360) coupled to PX 310. In some embodiments, controller 380 receives motor data from one or more motor sensors associated with motor 360. The motor data received from the motor sensors may include current motor speed (e.g., revolutions per minute), total motor run time, motor run time between maintenance operations, and / or total motor revolutions. The motor data may indicate a performance status of the motor.

[0060] In some embodiments, the controller 380 receives sensor data indicating the temperature of the coolant of the first cooling loop 386 and / or the temperature of the air 398 in the server room 390A. The controller 380 can control the low-pressure booster 314, the high-pressure booster 324, and / or the compressor 322 based on the sensor data received from one or more sensors (e.g., one or more fluid flow rate sensors, temperature sensors, pressure sensors, etc.) of the system 300A. In some embodiments, one or more sensors (e.g., pressure sensors, flow sensors, temperature sensors, etc.) are disposed near the inlet and / or outlet of various components of the system 300A. In some embodiments, one or more sensors are disposed inside the components of the system 300A. In some examples, a pressure sensor may be disposed near the inlet of the compressor 322, and an additional pressure sensor may be disposed near the outlet of the compressor 322. In some examples, a temperature sensor may be disposed near the inlet of the evaporator 318, and another temperature sensor may be disposed near the outlet of the evaporator 318. In some examples, the temperature sensor may be disposed inside the gas cooler 329. In some examples, flow sensors may be located at each of the inlet and outlet of the PX 310 to measure the flow of the first and second fluids into and out of the PX 310 .

[0061] Reference is made herein to a "first fluid" and a "second fluid". In some embodiments, the first fluid and the second fluid are the same type of fluid (e.g., a refrigerant fluid flowing in a fluid handling system). The "first fluid" may refer to a fluid that flows from a high pressure inlet of PX 310 through PX 310 to a low pressure outlet of PX 310 and / or to or away from a high pressure inlet and / or a low pressure outlet of PX 410. The "second fluid" may refer to a fluid that flows from a low pressure inlet of PX 310 through PX 310 to a high pressure outlet of PX 310 and / or to or away from a low pressure inlet and / or a high pressure outlet of PX 410. In some embodiments, the first fluid may be a refrigerant fluid in a supercritical state (e.g., supercritical CO2). In some embodiments, the first fluid may be a refrigerant fluid in a liquid state (e.g., liquid CO2). In some embodiments, the second fluid may be a refrigerant fluid in a gaseous state (e.g., CO2 vapor). In some embodiments, the second fluid may be a refrigerant fluid in a two-phase state (e.g., a CO2 liquid-gas mixture). In some embodiments, the second fluid may be a refrigerant fluid in a liquid state (eg, liquid CO 2 ).

[0062] Figure 3B 310 is a schematic diagram of a data center cooling system 300B including a PX 310 according to certain embodiments. In some embodiments, features with reference numbers similar to those in other figures include similar properties, structures, and / or functionality to features described in other figures. In some examples, features of system 300B have similar Figure 3A similar features, structure and / or functionality to system 300A.

[0063] In some embodiments, the system 300B provides cooling for servers disposed in a server room 390B. In some embodiments, cold air 398 is provided to racks 399 by CRAC 391. Servers may be disposed in racks 399. In some embodiments, cold air 398 receives heat from the servers (e.g., from server components) and flows upward in a hot aisle 395. In some embodiments, a hot aisle 395 is a space between two racks 399. In some embodiments, the hot aisle 395 separates heated air from cooled air, so that the servers can be cooled more efficiently. The hot aisle 395 can direct heated air away from cooled air and / or away from the servers. In some embodiments, ducts direct hot air 398 from the hot aisle 395 to the inlet of the CRAC 391 for cooling and / or conditioning (e.g., by a humidifier 394 and / or cooling coil 396, etc.).

[0064] Figure 3Cis a schematic diagram of a data center cooling system 300C including a PX 310 according to certain embodiments. In some embodiments, features having reference numbers similar to reference numbers in other figures include similar properties, structures, and / or functionality to features described in other figures. In some examples, features of system 300C have similar Figure 3A System 300A and / or Figure 3B Similar features, structure and / or functionality to system 300B.

[0065] In some embodiments, the system 300C provides cooling for servers disposed in a server room 390C. In some embodiments, warm air 398 from the server room 390C is directed (e.g., via ducts, etc.) to the CRAC 391. In some embodiments, the CRAC 391 includes an evaporator 318. In some embodiments, the warm air 398 exchanges heat with the refrigerant via the evaporator 318. In some embodiments, the evaporator 318 is configured to cool the air 398 circulating through the server room 390C. The refrigerant flowing through the evaporator 318 may be heated and the air 398 may be cooled. In some embodiments, the cooled air 398 is directed (e.g., via ducts, etc.) from the CRAC 391 to the space below the raised floor 397 of the server room 390C. In some embodiments, the air 398 flows through the perforations in the raised floor 397, passes upward through the racks 399, to cool the servers. The hot air 398 that takes away heat from the servers is directed to the CRAC 391 to provide the heat of the servers to the refrigerant through the evaporator 318. In some embodiments, heat is rejected directly to the surrounding environment by the gas cooler 329 (e.g., without using a cooling loop or cooling tower). The fan 331 can blow air through the gas cooler 329 (e.g., across the fins of the gas cooler 329) to help reject the heat of the refrigerant to the surrounding environment. In some embodiments, the system 300C can be used to consider cost savings and / or situations where the data center operates in a cold (e.g., colder) climate (such as an Arctic climate).

[0066] Figure 4 is a schematic diagram of a data center cooling system 400 including a PX 310 according to some embodiments. In some embodiments, features having reference numbers similar to reference numbers in other figures include similar properties, structures, and / or functionality to features described in other figures. In some examples, features of system 400 have similar Figure 3A The system 400 may include the following: FIG. 3A to FIG. 3C Any of the server rooms 390A, 390B and / or 390C shown.

[0067] In some embodiments, system 400 includes a flash tank 313 (e.g., a receiver, etc.). In some embodiments, flash tank 413 is a receiver configured to receive a fluid stream (e.g., a first fluid) output from a low pressure outlet of PX 310. Flash tank 413 may form a chamber to collect the first fluid from the first outlet of PX 310. Flash tank 413 may receive a first fluid in a two-phase state (e.g., liquid and gas). In some embodiments, flash tank 413 is a tank made of welded metal sheets. Flash tank 413 may be made of steel (e.g., steel sheet metal, steel plate, etc.). The first fluid (e.g., under low pressure) may be separated into gas and liquid in flash tank 413. Liquid may be deposited at the bottom of flash tank 413, while gas may rise to the top of flash tank 413. Liquid may flow from flash tank 413 to evaporator 318 (e.g., via expansion valve 416). The chamber of flash tank 413 may be maintained at a set pressure. The pressure can be set by a user (e.g., an operator, a technician, an engineer, etc.) and / or by a controller (e.g., controller 380). In some embodiments, the pressure of the flash tank 413 is controlled by one or more valves (e.g., a flash gas valve 420, a pressure regulating valve, a safety valve, etc.). In some embodiments, the flash tank 413 includes at least one pressure sensor (e.g., a pressure transducer).

[0068] In some embodiments, system 400 includes expansion valve 416. In some embodiments, expansion valve 416 is arranged along the flow path between flash tank 413 and evaporator 318. Expansion valve 416 can be an adjustable valve (e.g., electronic expansion valve, thermostatic expansion valve, ball valve, gate valve, poppet valve, etc.). Expansion valve 416 can be controlled by a user (e.g., technician, operator, engineer, etc.) and / or by controller 380. In some embodiments, expansion valve 416 is actuated by controller 380 based on sensor data (e.g., pressure sensor data, flow rate sensor data, temperature sensor data, etc.). In some embodiments, expansion valve 416 is a thermal expansion valve. Expansion valve 416 can be actuated (e.g., opened and / or closed) based on temperature data associated with evaporator 318 (e.g., temperature data of the refrigeration fluid leaving the evaporator). In some examples, the sensing bulb (e.g., a temperature sensor, a pressure sensor dependent on temperature, etc.) of the expansion valve 416 can increase or decrease the pressure on the diaphragm of the expansion valve 416, causing the lift valve connected to the diaphragm to open or close, thereby causing more or less fluid to flow to the evaporator 318, thereby causing more or less fluid expansion. The sensing bulb of the expansion valve can be positioned near the downstream end of the evaporator 318 (e.g., near the fluid outlet of the evaporator 318), and can be fluidly coupled to the diaphragm via a sensing capillary (e.g., a conduit between the sensing bulb and the expansion valve 416). In some embodiments, the expansion valve 416 is controlled and / or actuated entirely based on electronic commands (e.g., from the controller 380). In some embodiments, the enthalpy of the refrigerant flowing through the expansion valve 416 is the same on the upstream side of the valve as on the downstream side. Therefore, the enthalpy of the liquid refrigerant leaving the flash tank 413 can be the same as the enthalpy of the refrigerant entering the evaporator 318.

[0069] In some embodiments, system 400 includes a flash gas valve 420 to adjust the gas flow on the flash gas bypass flow path. In some embodiments, the flash gas valve 420 is a bypass valve that adjusts the gas flow from the gas outlet of the flash tank 413 to be combined with the output of the evaporator 318. In some embodiments, the gas flow from the flash tank 413 flows along the flash gas bypass flow path to bypass the evaporator 318. In some embodiments, the flash gas flow path is between the flash tank 413 and the position downstream of the outlet of the evaporator 318. The gas flowing along the flash gas bypass flow path can be combined with the output of the evaporator 318. As the gas flows to the compressor 420, the flash gas valve 322 can expand the gas collected in the flash tank 413 (e.g., the pressure is reduced). In some embodiments, the flash gas valve 420 can be an adjustable valve. In some embodiments, the flash gas valve 420 is actuated by the controller 380 based on sensor data.

[0070] In some embodiments, the low pressure booster 314 receives a fluid flow from the flash tank 413. In some embodiments, the low pressure booster 314 receives a gas flow from the flash tank 413. In some examples, the low pressure booster 314 receives a portion of the gas flowing along the flash gas bypass flow path between the flash tank 413 and the flash gas valve 420. In some embodiments, the low pressure booster 314 receives a fluid and increases the pressure of the fluid to form a second fluid (e.g., at a second pressure). The fluid under the increased pressure (e.g., the second pressure) is provided to the second inlet of the PX 310 as the second fluid. In some embodiments, the low pressure booster 314 is a compressor or pump that operates on a low pressure difference to "boost" the pressure of the gas received from the flash tank 413. In some embodiments, the high pressure booster 324 is a compressor or pump that operates on a low pressure difference to "boost" the pressure of the fluid (e.g., the second fluid) received from the second outlet of the PX. In some embodiments, the compressor is configured to increase the pressure of a fluid consisting essentially of a gas, while the pump is configured to increase the pressure of a fluid consisting essentially of a liquid.

[0071] FIG. 5A to FIG. 5F is a schematic diagram of a data center cooling system 500A to 500F including a pressure exchanger according to some embodiments. Figure 5A , which is a schematic diagram of a data center cooling system 500A including a PX 310 according to some embodiments. In some embodiments, features with reference numbers similar to reference numbers in other figures include similar properties, structures, and / or functionality to features described in other figures. In some examples, features of system 500A have similar FIG. 3A to FIG. 3C Systems 300A to 300C and Figure 4 In some embodiments, system 500A may include: FIG. 3A to FIG. 3C Any of the server rooms 390A, 390B and / or 390C shown.

[0072] In some embodiments, the system 500A includes a parallel valve 548. The parallel valve 548 can be an expansion valve or a flow control valve. In some embodiments, the parallel valve 548 selectively regulates the flow of fluid from the outlet of the gas cooler 329 to the flash tank 413 in parallel with the PX 310. In some embodiments, the parallel valve 548 controls the pressure of the gas cooler 329 (e.g., the gas cooler) by selectively opening or closing the orifice (e.g., of the parallel valve 548). In some embodiments, the parallel valve 548 can be actuated to selectively regulate the flow of fluid or selectively regulate the pressure of the fluid in the gas cooler 329. The parallel valve 548 can selectively provide a portion of the fluid output by the gas cooler 329 to the expansion tank 413. In some examples, the parallel valve 548 can be actuated to open further, so that more fluid flows from the gas cooler 329 to the flash tank 413, or the parallel valve 548 can be actuated to close further, so that less fluid flows from the gas cooler 329 to the flash tank 413. As the fluid flows through the parallel valve 548, the fluid may expand, causing the pressure and / or temperature of the fluid to decrease. In some embodiments, the controller 380 may actuate (eg, open and / or close) the parallel valve 548 based on sensor data received from one or more sensors.

[0073] In some embodiments, the system 500A includes an auxiliary gas cooler 565 (e.g., an auxiliary condenser, an auxiliary heat exchanger, etc.), an auxiliary parallel valve 568, and / or a low pressure selector valve 563. In some embodiments, the auxiliary gas cooler 565 receives the second fluid from the high pressure outlet of the PX 310. The auxiliary gas cooler 565 can be a condenser and / or a gas cooler as described herein. In some embodiments, the auxiliary gas cooler 565 is a heat exchanger that exchanges thermal energy (e.g., heat) between the second fluid and the surrounding environment. In some embodiments, the auxiliary gas cooler 565 exchanges thermal energy between the second fluid and the coolant of the second cooling circuit 370. In some embodiments, the auxiliary gas cooler 565 operates at a different (e.g., lower) pressure than the gas cooler 329. The auxiliary gas cooler 564 operating at a lower pressure than the gas cooler 329 can eliminate the need for a booster (e.g., a high pressure booster 324) to make up for this pressure difference, because the pressure of the second fluid output (e.g., at high pressure) of the PX 310 may be lower than the pressure of the gas cooler 329.

[0074] In some embodiments, the second fluid flows from the auxiliary gas cooler 565 to the auxiliary parallel valve 568. In some embodiments, the auxiliary parallel valve 568 is substantially similar to the parallel valve 548. In some examples, the auxiliary parallel valve 568 can be a flow control valve to control the flow of the second fluid from the auxiliary gas cooler 565 toward the flash tank 413. In some embodiments, the auxiliary parallel valve 568 is an expansion valve. When the second fluid flows through the auxiliary parallel valve 568, the second fluid can expand. In some embodiments, the auxiliary parallel valve 568 can be controlled (e.g., by the controller 380). In some examples, the controller 380 can actuate (e.g., open and / or close) the auxiliary parallel valve 568 based on sensor data received from one or more sensors. In some embodiments, the second fluid output of the auxiliary parallel valve 568 can be combined with the fluid output of the parallel valve 548.

[0075] In some embodiments, system 500A includes a low pressure selector valve 563. The low pressure selector valve 563 can receive gas output from the flash tank 413 through a first port and / or receive fluid output from the flash gas valve 420 and the evaporator 318 through a second port. The low pressure selector valve 564 can direct the airflow and / or fluid flow to the low pressure supercharger 314 through a third port. In some embodiments, the low pressure selector valve 561 is controllable. In some examples, a user (e.g., an engineer, an operator, a technician, etc.) can actuate the low pressure selector valve 563 (e.g., the first port, the second port, and / or the third port can be opened or closed), and / or the controller 380 can actuate the low pressure selector valve 563. In some embodiments, the controller 380 actuates the low pressure selector valve 563 based on the received sensor data. In some embodiments, the low pressure selector valve 563 receives the airflow from the flash tank 413 via the first port, and directs the airflow to the low pressure supercharger 314 via the third port when the second port is closed. In some embodiments, the low pressure selector valve 563 receives gas flow from the flash tank 322 via the second port and directs the gas flow to the low pressure booster 314 via the third port when the first port is closed. In some embodiments, the low pressure selector valve 563 can allow fluid to be drawn from the suction side of the compressor 322 when there is not enough flash gas available in the flash tank 413. The low pressure selector valve 563 can be provided with fluid from the flash tank 413 and / or the suction side of the compressor 322 (e.g., the outlet side of the evaporator 318, etc.).

[0076] refer to Figure 5B , which is a schematic diagram of a data center cooling system 500B including a PX 310 according to some embodiments. In some embodiments, features with reference numbers similar to those in other figures include similar properties, structures, and / or functionality to features described in other figures. In some examples, features of system 500A have similar FIG. 3A to FIG. 3C Systems 300A to 300C, Figure 4 System 400 and Figure 5A The system 500B may include the following: FIG. 3A to FIG. 3C Any of the server rooms 390A, 390B and / or 390C shown.

[0077] In some embodiments, the system 500B includes an air handling unit 599. The air handling unit 599 can receive the warm air flow 398 and can direct the warm air to the evaporator 318 along the flow path of the air circuit 587. In some embodiments, the warm air is cooled in the evaporator 318 (e.g., by a refrigerant). The cooled air can be provided to the air handling unit 599. In some embodiments, a duct network directs the air 398 between the air handling unit 599 and the evaporator 318. In some embodiments, the air 398 passes through a filter 595 within the air handling unit 599. The filter 595 can be a particle filter for filtering pollutants in the air 398. In some embodiments, a fan 592 blows cool air from the air handling unit 599 into the server room 390B. In some embodiments, multiple fans are used to move the air 398.

[0078] refer to Figure 5C , which is a schematic diagram of a data center cooling system 500C including a PX 310 according to some embodiments. In some embodiments, features with reference numbers similar to those in other figures include similar properties, structures, and / or functionality to features described in other figures. In some examples, features of system 500A have similar FIG. 3A to FIG. 3C Systems 300A to 300C, Figure 4 System 400 and FIG. 5A to FIG. 5B The system 500C may include the following: FIG. 3A to FIG. 3C Any of the server rooms 390A, 390B and / or 390C shown.

[0079] In some embodiments, the system 500C includes an auxiliary gas cooler 566 that receives a fluid (e.g., a second fluid at a fourth pressure) output from the high pressure outlet of the PX 310. In some embodiments, heat is removed from the fluid output from the high pressure outlet of the PX 310 via the auxiliary gas cooler 566. In some embodiments, an auxiliary high pressure valve 569 controls the flow of fluid through the auxiliary gas cooler 566, thereby controlling the flow of fluid output from the high pressure outlet of the PX 310. In some embodiments, as the fluid loses heat in the auxiliary gas cooler 566, the temperature of the fluid may decrease. The fluid may be mixed with the fluid output from the low pressure outlet of the PX 310 and provided to the flash tank 413. In some embodiments, by including the auxiliary gas cooler 566, a high pressure booster (e.g., the high pressure booster 324) may be eliminated from the system while maintaining the same functionality. Eliminating the high pressure booster may reduce cost and maintenance (e.g., due to a reduced number of moving parts and / or components, etc.) and improve the reliability of the system.

[0080] In some embodiments, the fluid flowing out of the gas cooler 329 passes through the subcooling heat exchanger 530. In some embodiments, the fluid is subcooled (e.g., cooled to a temperature below the saturation temperature) so that the fluid is converted to at least a partial liquid state. Upon leaving the subcooling heat exchanger 530, a first subportion of the fluid is provided to the high pressure inlet of the PX 310 (e.g., a first fluid at a first pressure). A second subportion of the fluid is provided to the subcooling heat exchanger 530 to cool the fluid flowing out of the gas cooler 329. The second subportion of the fluid may pass through a bypass high pressure valve 549. In some embodiments, the second subportion of the fluid expands and / or decreases in temperature when flowing through the bypass high pressure valve 549. In some embodiments, the bypass high pressure valve 549 is actuatable. The actuation of the bypass high pressure valve 549 may be controlled by the controller 380 (e.g., based on sensor data, etc.). The second subportion of the fluid may be provided to the low pressure inlet of the PX 310 (e.g., a second fluid at a second pressure). In some embodiments, a low-pressure booster (e.g., low-pressure booster 314) may be eliminated from the system while maintaining the same functionality by including the subcooling heat exchanger 530. Eliminating the low-pressure booster may result in reduced power requirements, reduced maintenance (e.g., due to a reduced number of moving parts and / or components, etc.), and increased system reliability.

[0081] refer to Figure 5D , which is a schematic diagram of a data center cooling system 500D including a PX 310 according to some embodiments. In some embodiments, features with reference numbers similar to those in other figures include similar properties, structures, and / or functionality to features described in other figures. In some examples, features of system 500A have similar FIG. 3A to FIG. 3CSystems 300A to 300C, Figure 4 System 400 and FIG. 5A to FIG. 5C The system 500D may include the following: FIG. 3A to FIG. 3C Any of the server rooms 390A, 390B and / or 390C shown.

[0082] In some embodiments, the system 500D includes an auxiliary flash tank 514. The auxiliary flash tank 514 can be a receiver (e.g., a receiver tank, etc.) for receiving a fluid flow from the gas cooler 329 and / or the auxiliary gas cooler 565. The auxiliary flash tank 514 can receive a second fluid output from a second outlet of the PX 310 (e.g., via the auxiliary gas cooler 565 and the auxiliary parallel valve 568). In some embodiments, the auxiliary flash tank 514 can maintain a pressure difference (e.g., a small pressure difference, 10 psi, 20 psi, 30 psi, 40 psi, 50 psi, etc.) between the auxiliary flash tank 414 and the main flash tank 413. The pressure difference between the flash tanks can drive the fluid to flow through the low pressure inlet of the PX 310 to the high pressure outlet of the PX 310, thereby performing the function of a low pressure booster (e.g., the low pressure booster 314). Fluid from the gas cooler 329 may pass through a subcooling heat exchanger 530 and / or a parallel valve 548 before entering the auxiliary flash tank 514. In some embodiments, the subcooling heat exchanger 530 exchanges heat between a portion of the fluid flow output from the gas cooler 329 and the fluid flow output from the low-pressure outlet of the PX 310. In some embodiments, the fluid output from the low-pressure outlet of the PX 310 is subcooled in the subcooling heat exchanger 530. In some embodiments, the fluid output from the low-pressure outlet of the PX 310 flows through a first low-pressure valve 517 downstream of the subcooling heat exchanger 530. The first low-pressure valve 517 may be actuated (e.g., by a technician, an engineer, the controller 380, etc.) to control the flow of the fluid.

[0083] The fluid from the auxiliary gas cooler 565 may pass through the auxiliary parallel valve 568 before entering the auxiliary flash tank 514. In some embodiments, the fluid is separated into gas and liquid within the auxiliary flash tank 514. The gas collected in the auxiliary flash tank 514 may be provided to the low pressure inlet of the PX 310 (e.g., the second fluid at the second pressure). The liquid collected in the auxiliary flash tank 514 may flow out of the auxiliary flash tank, pass through the second low pressure valve 519, and flow into the flash tank 413. In some embodiments, the liquid is mixed with the fluid output from the low pressure outlet of the PX 310 (e.g., the first fluid at the third pressure). The second low pressure valve 519 may be actuated (e.g., by a technician, engineer, controller 380, etc.) to control the flow of the fluid. In some embodiments, by including the auxiliary flash tank 514, a low pressure booster (e.g., low pressure booster 314) may be eliminated from the system while maintaining the same functionality. Eliminating the low-pressure booster may result in reduced power requirements, reduced maintenance (eg, due to a reduced number of moving parts and / or components, etc.), reduced costs, and increased system reliability.

[0084] refer to Figure 5E , which is a schematic diagram of a data center cooling system 500E including a PX 310 according to certain embodiments. In some embodiments, features with reference numbers similar to those in other figures include similar properties, structures, and / or functionality to features described in other figures. In some examples, features of system 500A have similar FIG. 3A to FIG. 3C Systems 300A to 300C, Figure 4 System 400 and FIG. 5A to FIG. 5D Systems 500A to 500D may have similar characteristics, structures, and / or functions.

[0085] In some embodiments, the refrigeration system / cycle of system 500E can be substantially similar to the refrigeration system or cycle of system 500C. However, in some embodiments, system 500E includes a first cooling loop 386 and CRAC 391 in the server room to cool air 398 for cooling servers in racks 399. In some embodiments, system 500E can include any of server rooms 390A, 390B, and / or 390C.

[0086] refer to Fig. 5F , which is a schematic diagram of a data center cooling system 500F including a PX 310 according to certain embodiments. In some embodiments, features with reference numbers similar to reference numbers in other figures include similar properties, structures, and / or functionality to features described in other figures. In some examples, features of system 500F have similar FIG. 3A to FIG. 3C Systems 300A to 300C, Figure 4 System 400 and FIG. 5A to FIG. 5E Systems 500A to 500E may have similar characteristics, structures and / or functions.

[0087] In some embodiments, the refrigeration system / cycle of system 500F can be substantially similar to the refrigeration system or cycle of system 500D. However, in some embodiments, system 500F includes a first cooling loop 386 and CRAC 391 in the server room to cool air 398 for cooling servers in racks 399. In some embodiments, system 500E can include any of server rooms 390A, 390B, and / or 390C. In some embodiments, system 500F includes a second cooling loop 370 to remove heat from the servers to the surrounding environment through a cooling tower 374.

[0088] Figure 6 is a diagram illustrating a method for controlling a data center cooling system (e.g., FIG. 3A to FIG. 3C 300A-300C). In some embodiments, method 600 is performed by processing logic, which includes hardware (e.g., circuits, dedicated logic, programmable logic, microcode, processing devices, etc.), software (such as instructions running on a processing device, a general-purpose computer system, or a dedicated machine), firmware, microcode, or a combination thereof. In some embodiments, method 600 is performed at least in part by a controller (e.g., Figure 1A to Figure 1B Controller 180, FIG. 3A to FIG. 3C In some embodiments, the non-transitory storage medium stores instructions, which are executed by a processing device (e.g., a controller 380, etc.). Figure 1A to Figure 1B Controller 180, FIG. 3A to FIG. 3C When executed by a controller 380, etc., these instructions cause the processing device to execute method 600.

[0089] For simplicity of description, method 600 is depicted and described as a series of operations. However, operations according to the present disclosure may occur in various orders and / or simultaneously with other operations not presented and described herein. In addition, in some embodiments, not all illustrated operations are performed to implement method 600 according to the disclosed subject matter. In addition, those skilled in the art will appreciate and understand that method 600 may alternatively be represented as a series of interrelated states via a state diagram or events.

[0090] At block 602, processing logic exchanges heat between a first cooling loop and a refrigeration system via a first heat exchanger (eg, evaporator 318). In some embodiments, the first cooling loop is a data center cooling loop for cooling servers in a server room.

[0091] At block 604, processing logic cools a plurality of servers in a data center via a first cooling loop (e.g., cooling loop 386). In some embodiments, the first cooling loop is provided with a cooled coolant (e.g., water, a water-glycol mixture, etc.) to a CRAC (e.g., CRAC 391) in a server room. The CRAC may cool air circulating in the server room. The cooling coils of the CRAC may cool the air in the server room to cool the servers. The servers may heat the air in the server room, and the heated air may be delivered to the CRAC. Heat from the servers may be provided to the first cooling loop (e.g., via the cooling coils of the CRAC). Heat from the servers may be exchanged between the first cooling loop and the refrigeration system (e.g., at block 602).

[0092] In block 606, processing logic exchanges pressure between a first fluid of a refrigeration system and a second fluid of a refrigeration system through a pressure exchanger (e.g., PX 310). In some examples, processing logic (e.g., of controller 380) may cause a pressure exchanger to operate to exchange pressure between a first fluid and a second fluid. Specifically, processing logic may cause one or more valves to be opened, and one or more pumps and / or compressors may provide a first fluid and a second fluid to an inlet of a pressure exchanger. Processing logic may cause a compressor and / or a supercharger (e.g., a low-pressure supercharger 314) to flow (respectively) to a pressure exchanger based on sensor data (e.g., temperature sensor data, pressure sensor data, flow sensor data, etc.). A first fluid may be provided to a first inlet of a pressure exchanger at a first pressure, and a second fluid may be provided to a second inlet of a pressure exchanger at a second pressure. The first pressure may be higher than the second pressure. In some embodiments (e.g., in an embodiment where the pressure exchanger is a rotary pressure exchanger), processing logic may cause a motor to rotate a rotor of the pressure exchanger. The pressure of the first fluid and the second fluid can be exchanged by providing the first fluid and the second fluid to the inlet of the pressure exchanger via a compressor and / or a supercharger, and / or rotating the rotor of the pressure exchanger via a motor. The first fluid can leave the pressure exchanger via the first outlet at a third pressure, and the second fluid can leave the pressure exchanger via the second outlet at a fourth pressure. The third pressure can be lower than the fourth pressure.

[0093] At block 608, processing logic exchanges heat between the refrigeration system and a second cooling loop (e.g., cooling loop 370) via a second heat exchanger (e.g., gas cooler 329). In some embodiments, the refrigeration system provides heat (e.g., heat from the server cooled at block 604) from the first heat exchanger to the second heat exchanger.

[0094] At block 610, processing logic removes heat from the second cooling loop to the surrounding environment via a cooling tower (e.g., cooling tower 374). In some embodiments, the cooling tower receives the coolant of the second cooling loop and cools the coolant by removing heat to the surrounding environment. The surrounding environment can be an environment outside the refrigeration system and / or outside the data center. In some embodiments, a chiller unit is used to remove heat to the surrounding environment.

[0095] Figure 7 700 according to some embodiments. In some embodiments, the computer system 700 is a client device. In some embodiments, the computer system 700 is a controller device (e.g., a server, Figure 1A to Figure 1B Controller 180, FIG. 3A to FIG. 3C , Figure 4 , FIG. 5A to FIG. 5F controller 380, etc.).

[0096] In some embodiments, the computer system 700 is connected to other computer systems (e.g., via a network such as a local area network (LAN), an intranet, an extranet, or the Internet). The computer system 700 operates in the capacity of a server or client computer in a client-server environment, or as a peer computer in a peer-to-peer or distributed network environment. In some embodiments, the computer system 700 is provided by a personal computer (PC), a tablet PC, a set-top box (STB), a personal digital assistant (PDA), a cellular phone, a network appliance, a server, a network router, a switch or a bridge, or any device capable of executing a group of instructions (sequential or otherwise) specifying the action to be taken by the device. In addition, the term "computer" should include any collection of computers that execute a set (or multiple sets) of instructions to perform any one or more of the methods described herein, either individually or in combination.

[0097] In some embodiments, the computer system 700 includes a processing device 702, a volatile memory 704 (e.g., a random access memory (RAM)), a non-volatile memory 706 (e.g., a read-only memory (ROM) or an electrically erasable programmable read-only memory (EEPROM)), and / or a data storage device 716, which communicate with each other via a bus 708.

[0098] In some embodiments, the processing device 702 is provided by one or more processors, such as a general-purpose processor (such as, in some examples, a complex instruction set computing (CISC) microprocessor, a reduced instruction set computing (RISC) microprocessor, a very long instruction word (VLIW) microprocessor, a microprocessor that implements other types of instruction sets, or a microprocessor that implements a combination of various instruction sets) or a special-purpose processor (such as, in some examples, an application-specific integrated circuit (ASIC), a field programmable gate array (FPGA), a digital signal processor (DSP), or a network processor). In some embodiments, the processing device 702 is provided by one or more of a single processor, multiple processors, a single processor with multiple processing cores, and / or the like.

[0099] In some embodiments, the computer system 700 further includes a network interface device 722 (e.g., coupled to the network 774). In some embodiments, the computer system 700 includes one or more input / output (I / O) devices. In some embodiments, the computer system 700 further includes a video display unit 710 (e.g., a liquid crystal display (LCD)), an alphanumeric input device 712 (e.g., a keyboard), a cursor control device 714 (e.g., a mouse), and / or a signal generating device 720.

[0100] In some embodiments, the data storage device 718 (e.g., disk drive storage, fixed and / or removable storage, fixed disk drives, removable memory cards, optical storage, network attached storage (NAS), and / or storage area network (SAN)) includes a non-transitory computer-readable storage medium 724 on which are stored instructions 726 encoding any one or more of the methods or functions described herein, as well as instructions 526 for implementing the methods described herein.

[0101] In some embodiments, the instructions 526 also reside, in whole or in part, within the volatile memory 702 and / or within the processing device 700 during execution of the instructions 726 by the computer system 704, and thus, in some implementations, the volatile memory 704 and the processing device 702 also constitute machine-readable storage media.

[0102] Although the computer-readable storage medium 724 is shown as a single medium in the illustrative example, the term "computer-readable storage medium" shall include a single medium or multiple media (e.g., a centralized or distributed database and / or associated caches and servers) that store one or more sets of executable instructions. The term "computer-readable storage medium" shall also include any tangible medium that can store or encode a set of instructions for execution by a computer, which instructions cause the computer to perform any one or more of the methods described herein. The term "computer-readable storage medium" shall include, but is not limited to, solid-state memories, optical media, and magnetic media.

[0103] The methods, components and features described herein may be implemented by decentralized hardware components, or may be integrated in the functionality of other hardware components such as ASICS, FPGAs, DSPs or similar devices. In addition, the methods, components and features may be implemented by firmware modules or functional circuits within a hardware device. In addition, the methods, components and features may be implemented in any combination of hardware devices and computer program components or in a computer program.

[0104] Unless otherwise specifically stated, terms such as "actuate", "adjust", "cause", "control", "determine", "identify", "provide", "receive", "adjust", etc. refer to actions and processes performed or implemented by a computer system that manipulate data represented as physical (electronic) quantities within computer system registers and memories and convert them into physical quantities similarly represented within computer system memories or registers or other such information storage, transmission or display devices. In addition, the terms "first", "second", "third", "fourth", etc. used herein are intended to be labels for distinguishing between different elements and may not have ordinal meanings according to their numerical names.

[0105] The examples described herein also relate to an apparatus for performing the methods described herein. The apparatus may be specially configured to perform the methods described herein, or it may include a general-purpose computer system selectively programmed by a computer program stored in the computer system. Such a computer program may be stored in a computer-readable tangible storage medium.

[0106] The methods and illustrative examples described herein are not inherently related to any particular computer or other device. Various general purpose systems may be used in accordance with the teachings described herein, or it may prove convenient to construct more specialized equipment to perform the methods described herein and / or their respective functions, routines, subroutines, or operations. Architectural examples of various such systems are set forth in the description above.

[0107] The foregoing description presents many specific details, such as examples of specific systems, components, methods, etc., in order to provide a good understanding of several embodiments of the present disclosure. However, it will be apparent to those skilled in the art that at least some embodiments of the present disclosure may be implemented without these specific details. In other cases, well-known components or methods are not described in detail, or are presented in a simple block diagram format to avoid unnecessary confusion of the present disclosure. Therefore, the specific details set forth are merely exemplary. Specific embodiments may differ from these exemplary details and may still be expected to be within the scope of the present disclosure.

[0108] References throughout this specification to "an embodiment" or "an embodiment" mean that a particular feature, structure, or characteristic associated with the description of the embodiment is included in at least one embodiment. Therefore, the phrases "in one embodiment" or "in an embodiment" appearing in various places throughout this specification do not necessarily refer to the same embodiment. In addition, the term "or" is intended to represent an inclusive "or" rather than an exclusive "or". When the terms "approximately", "substantially", or "approximately" are used herein, this means that the nominal values ​​presented are accurate to within ±10%. In addition, the terms "first", "second", "third", "fourth", etc., used herein are meant to be labels that distinguish between different elements and do not necessarily have an ordinal meaning according to their numerical names.

[0109] As used herein, the terms "above," "below," "between," "disposed on," and "on" refer to the relative position of one material layer or component with respect to other layers or components. In some examples, a layer disposed on, over, or below another layer may be in direct contact with the other layer, or may have one or more intervening layers. Additionally, a layer disposed between two layers may be in direct contact with the two layers, or may have one or more intervening layers. Similarly, unless expressly stated otherwise, a feature disposed between two features may be in direct contact with the adjacent feature, or may have one or more intervening layers.

[0110] Although the operations of the methods herein are shown and described in a particular order, the order of operations of each method can be changed so that certain operations can be performed in reverse order, or so that certain operations can be performed at least partially simultaneously with other operations. In another embodiment, instructions or sub-operations of different operations can be performed in an intermittent and / or alternating manner. In one embodiment, multiple metal bonding operations are performed as a single step.

[0111] It should be understood that the above description is intended to illustrate rather than to limit. After reading and understanding the above description, many other embodiments will be apparent to those skilled in the art. Therefore, the scope of the present disclosure should be determined with reference to the attached claims and the full range of equivalents covered by each claim.

Claims

1. A system comprising: A refrigeration system for exchanging heat between a first cooling loop and a second cooling loop, wherein the first cooling loop is configured to cool a plurality of servers of a data center, wherein the second cooling loop is configured to provide heat to a cooling tower to discharge the heat to an ambient environment, and wherein the refrigeration system comprises: a pressure exchanger (PX) configured to receive a first fluid at a first pressure via a first inlet of the pressure exchanger, receive a second fluid at a second pressure via a second inlet of the pressure exchanger, and exchange pressure between the first fluid and the second fluid, wherein the first fluid exits the pressure exchanger at a third pressure via a first outlet of the pressure exchanger, and wherein the second fluid exits the pressure exchanger at a fourth pressure via a second outlet of the pressure exchanger; a first heat exchanger configured to exchange a first heat between the first cooling circuit and at least a portion of a first fluid output from a first outlet of the pressure exchanger; and A second heat exchanger configured to exchange second heat between at least a portion of the first fluid entering the first inlet of the pressure exchanger and the second cooling circuit.

2. The system according to claim 1, characterized in that The first heat exchanger includes an evaporator of the refrigeration system, the evaporator being configured to transform at least a portion of the first fluid output from the first outlet of the pressure exchanger from a liquid state to a gaseous state.

3. The system according to claim 1, characterized in that The second heat exchanger comprises a gas cooler of the refrigeration system, the gas cooler being configured to cool at least a portion of the first fluid.

4. The system according to claim 1, characterized in that The first fluid and the second fluid include carbon dioxide (CO2), wherein the first pressure is higher than the second pressure, and wherein the third pressure is lower than the fourth pressure.

5. The system according to claim 1, characterized in that The refrigeration system further comprises: An auxiliary heat exchanger is configured to receive the second fluid output from the second outlet of the pressure exchanger and exchange third heat from the second fluid with a surrounding environment.

6. The system according to claim 5, characterized in that The refrigeration system further comprises: A valve is configured to receive the second fluid from the auxiliary heat exchanger and regulate a flow of the second fluid to a receiver.

7. The system according to claim 1, characterized in that The refrigeration system further comprises: a third heat exchanger configured to exchange a third amount of heat between at least a portion of the first fluid entering the first inlet of the pressure exchanger and a sub-portion of the fluid output from the third heat exchanger to subcool at least a portion of the first fluid entering the first inlet of the pressure exchanger.

8. The system according to claim 7, characterized in that The refrigeration system further comprises: A supercharger, the supercharger being configured as follows: receiving the second fluid at the fourth pressure output from the pressure exchanger; increasing the pressure of the second fluid; and The second fluid is provided upstream of an inlet of the second heat exchanger.

9. The system according to claim 1, characterized in that The refrigeration system further comprises: A first receiver configured to receive the first fluid from the first outlet of the pressure exchanger, wherein the receiver forms a chamber configured to separate the first fluid into a first gas and a first liquid.

10. The system according to claim 9, characterized in that The refrigeration system further comprises: A supercharger, the supercharger being configured as follows: receiving a portion of the first gas from the first receiver; increasing the pressure of the portion of the first gas to form the second fluid at the second pressure; and A second fluid at the second pressure is provided to the pressure exchanger via the second inlet.

11. The system according to claim 8, characterized in that The refrigeration system further comprises: A second receiver configured to receive the second fluid output from the second outlet of the pressure exchanger and provide at least a portion of the second fluid output from the second outlet of the pressure exchanger to the second inlet of the pressure exchanger as the second fluid at the second pressure.

12. The system according to claim 1, characterized in that The refrigeration system further comprises: A compressor is configured to receive at least a portion of the first fluid output from the first heat exchanger, increase a corresponding pressure of at least a portion of the first fluid, and provide at least a portion of the first fluid to the second heat exchanger.

13. The system according to claim 1, characterized in that Also includes: A chiller unit is configured to exchange third heat between the first cooling loop and air circulating in the data center to cool the plurality of servers.

14. The system according to claim 13, characterized in that Also includes: A pump is configured to pump coolant along the first cooling circuit between the first heat exchanger and the chiller unit.

15. The system according to claim 13, characterized in that The chiller unit includes a cooling coil configured to receive coolant from the first heat exchanger along the first cooling circuit and exchange heat between air in the data center and the coolant.

16. The system according to claim 13, characterized in that The data center includes a raised floor configured to support a plurality of server racks to support the plurality of servers, wherein the air flows through the raised floor to the plurality of server racks.

17. The system according to claim 13, characterized in that The data center includes a duct configured to direct heated air away from the plurality of servers and toward the chiller unit.

18. A system comprising: A refrigeration system configured to cool a plurality of servers in a data center, wherein the refrigeration system comprises: a pressure exchanger (PX) configured to receive a first fluid at a first pressure via a first inlet of the pressure exchanger, receive a second fluid at a second pressure via a second inlet of the pressure exchanger, and exchange pressure between the first fluid and the second fluid, wherein the first fluid exits the pressure exchanger at a third pressure via a first outlet of the pressure exchanger, and wherein the second fluid exits the pressure exchanger at a fourth pressure via a second outlet of the pressure exchanger; a first heat exchanger configured to provide first heat from the plurality of servers to at least a portion of a first fluid output from a first outlet of the pressure exchanger; and A second heat exchanger is configured to provide a second heat to a cooling radiator from at least a portion of the first fluid that will enter the first inlet of the pressure exchanger.

19. The system according to claim 18, characterized in that The first fluid and the second fluid include carbon dioxide (CO2), wherein the first pressure is higher than the second pressure, and wherein the third pressure is lower than the fourth pressure.

20. The system according to claim 18, characterized in that The first heat exchanger is configured to cool air circulated in the data center.

21. The system according to claim 18, characterized in that The refrigeration system further comprises: a receiver configured to receive a first fluid from the first outlet of the pressure exchanger, wherein the receiver forms a chamber configured to separate the first fluid into a first gas and a first liquid; and A supercharger, the supercharger being configured as follows: receiving a portion of the first gas from the receiver; increasing the pressure of the portion of the first gas to form the second fluid at the second pressure; and A second fluid at the second pressure is provided to the pressure exchanger via the second inlet.

22. The system according to claim 18, characterized in that The refrigeration system further comprises: A compressor configured to receive at least a portion of the first fluid output from the second heat exchanger, increase a corresponding pressure of the at least a portion of the first fluid, and provide the at least a portion of the first fluid to the first heat exchanger, wherein the first heat exchanger is configured to provide the first fluid to the pressure exchanger via the first inlet.

23. A system comprising: A refrigeration system configured to cool a plurality of servers, wherein the refrigeration system comprises: a pressure exchanger (PX) configured to receive a first refrigerant fluid at a first pressure via a first inlet of the pressure exchanger, receive a second refrigerant fluid at a second pressure via a second inlet of the pressure exchanger, and exchange pressure between the first refrigerant fluid and the second refrigerant fluid, wherein the first refrigerant fluid exits the pressure exchanger at a third pressure via a first outlet of the pressure exchanger, and wherein the second refrigerant fluid exits the pressure exchanger at a fourth pressure via a second outlet of the pressure exchanger; a first heat exchanger configured to provide first heat from the plurality of servers to at least a portion of the first refrigerant fluid output from a first outlet of the pressure exchanger; and A second heat exchanger is configured to remove a second amount of heat from at least a portion of the first refrigerant fluid entering the first inlet of the pressure exchanger.

24. The system according to claim 23, characterized in that The first pressure is higher than the second pressure, wherein the third pressure is lower than the fourth pressure.

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