Broaching tool and reaming method for ceramic chip of feed-through capacitor

Abstract

The invention discloses a feed-through capacitor ceramic chip chambering tool and method, and relates to the field of feed-through capacitor chambering equipment and method.The chambering tool comprises a packaging cavity assembly and a product loading assembly, a containing cavity is formed in the packaging cavity assembly, and the product loading assembly is arranged in the containing cavity; at least one capacitor chip is loaded in the product loading assembly, at least one through hole is formed in the product loading assembly, and the single through hole is communicated with an inner hole of the single capacitor chip; a first pipe opening assembly is arranged at one end of the packaging cavity assembly, a second pipe opening assembly is arranged at the other end of the packaging cavity assembly, and the first pipe opening assembly and the second pipe opening assembly communicate with the containing cavity. According to the invention, the capacitor chip is loaded in the product loading assembly, the product loading assembly is arranged in the accommodating chamber of the packaging cavity assembly, and the sand blasting liquid is conveyed to the accommodating chamber, so that the purposes of uniformly reaming and preventing the porcelain body from cracking are achieved.

Description

Technical Field

[0001] The invention relates to the field of hole enlarging equipment and methods for through-hole capacitors, and in particular to a hole enlarging tool and a hole enlarging method for a through-hole capacitor ceramic chip. Background Art

[0002] Through-hole ceramic dielectric capacitors have the advantages of special structure, stable electrical performance, high reliability, less influence of electrical parameters due to environmental changes, superior performance at high frequencies, high operating frequency, high self-resonance frequency, etc. They can meet the needs of microwave and millimeter wave frequency band electronic circuits, and are mainly used in radio frequency and microwave circuits for DC isolation, bypass, coupling, tuning, filtering, etc., and are widely used in launch vehicles, satellites, missiles, radars, electronic communications and other fields.

[0003] The through-hole ceramic capacitor chip is in the shape of a ring. After sintering, the shrinkage of the inner electrode is greater than that of the ceramic, which causes the inner electrode of the ring to be wrapped in the ceramic and cannot be effectively led out. The inner electrode of the ring needs to be fully exposed, and then the inner electrode is connected through the external terminal electrode to achieve the lead-out of the capacity. The reliability of the connection between the inner electrode and the terminal electrode directly affects the quality reliability of the final product. However, due to the small size of the inner hole (with the inner electrode inside) of the ring-shaped ceramic chip, the conventional method of synchronous chamfering of the outer circle and the inner hole and mechanical drilling method are used to chamfer the inner hole. There are problems such as poor uniformity of the inner hole chamfering and cracks in the ceramic body, which leads to poor connection between the terminal electrode and the inner electrode at the inner hole of the product, thus affecting the electrical performance of the product.

[0004] In view of this, this application is hereby filed. Summary of the invention

[0005] The purpose of the present invention is to provide a through-hole capacitor ceramic chip expansion tool and expansion method, by loading the capacitor chip in a product loading component, setting the product loading component in a accommodating chamber of a packaging cavity component, and conveying sandblasting liquid to the accommodating chamber, so as to solve the problems of poor uniformity of inner hole chamfering and cracks in the ceramic body in the mechanical drilling method in the prior art.

[0006] The embodiment of the present invention is implemented by the following technical solutions: First, the embodiment of the present invention provides a through-hole capacitor ceramic chip expansion tool, including a packaging cavity component and a product loading component, wherein a receiving chamber is provided in the packaging cavity component, and the product loading component is provided in the receiving chamber;

[0007] At least one capacitor chip is loaded in the product loading component, and at least one through hole is provided on the product loading component, and a single through hole is connected to an inner hole of a single capacitor chip;

[0008] A first nozzle assembly is disposed at one end of the packaging cavity assembly, and a second nozzle assembly is disposed at the other end, and both the first nozzle assembly and the second nozzle assembly are communicated with the accommodating chamber;

[0009] The first nozzle assembly or the second nozzle assembly is configured to transport the sandblasting liquid into the accommodating chamber after being connected to the sandblasting liquid supply device. In the accommodating chamber, the sandblasting liquid flows along the inner hole of the capacitor chip through the through hole, and the sandblasting liquid that passes through the inner hole flows out of the packaging cavity assembly from the second nozzle assembly or the first nozzle assembly.

[0010] Optionally, the packaging cavity assembly includes an end cover assembly and a cavity assembly, the cavity assembly forms a receiving chamber, and the end cover assembly is configured to seal the receiving chamber.

[0011] Optionally, the end cover assembly includes an upper end cover and a lower end cover, the cavity assembly includes an upper cavity member and a lower cavity member disposed adjacent to each other, the upper end cover is disposed on the outer side of the upper cavity member, and the lower end cover is disposed on the outer side of the lower cavity member;

[0012] The first nozzle assembly is arranged on the upper end cover, and the second nozzle assembly is arranged on the lower end cover.

[0013] Optionally, the accommodating chamber includes a plurality of accommodating cavities, the product loading assembly includes a plurality of loading carriers, a single loading carrier is installed in a single accommodating cavity, and at least one through hole is provided on the single loading carrier, and at least one capacitor chip is provided in the single loading carrier;

[0014] The first nozzle assembly includes a plurality of first nozzle pieces, the second nozzle assembly includes a plurality of second nozzle pieces, and a single first nozzle piece and a single second nozzle piece are connected to a single accommodating cavity.

[0015] Optionally, the accommodating chamber includes four accommodating cavities, the product loading assembly includes four loading carriers, each loading carrier is provided with twenty-five through holes, and each loading body is provided with twenty-five capacitor chips;

[0016] The first nozzle assembly includes four first nozzle pieces, the second nozzle assembly includes four second nozzle pieces, and each accommodating cavity is connected to a first nozzle piece and a second nozzle piece.

[0017] Optionally, the single accommodating cavity comprises an upper accommodating cavity and a lower accommodating cavity, the upper accommodating cavity is arranged on the upper end cover, the lower accommodating cavity is arranged on the lower end cover, the upper end and the lower end of the upper accommodating cavity are both provided with openings, the upper end and the lower end of the lower accommodating cavity are both provided with openings, and the opening at the lower end of the upper accommodating cavity is arranged to fit the opening at the upper end of the lower accommodating cavity;

[0018] The size of the opening at the upper end of the upper accommodating cavity is smaller than the size of the opening at the lower end thereof, and the size of the opening at the lower end of the lower accommodating cavity is smaller than the size of the opening at the upper end thereof;

[0019] The opening at the upper end of the upper accommodating chamber is configured to limit the upper end of a single loading body in the upper accommodating chamber, and the opening at the lower end of the lower accommodating chamber is configured to limit the lower end of a single loading body in the lower accommodating chamber.

[0020] Optionally, the cross-section of the opening at the upper end of the upper accommodating cavity is a rectangle, and the cross-section of the opening at the lower end of the lower accommodating cavity is a rectangle;

[0021] The size and shape of the inner cross section of the upper accommodating cavity are the same as the size and shape of the opening at the lower end of the upper accommodating cavity;

[0022] The size and shape of the inner cross section of the lower accommodating cavity are the same as the size and shape of the opening at the upper end of the lower accommodating cavity;

[0023] The size and shape of the opening at the lower end of the upper accommodating chamber are the same as the size and shape of the opening at the upper end of the lower accommodating chamber;

[0024] The single loading body is in the shape of a cuboid, and the cross-sectional size and shape thereof are adapted to the opening size and shape of the lower end of the upper accommodating cavity.

[0025] Optionally, a single carrier includes a first sealing layer, a mounting and positioning layer, a first product protection layer, a first product fixing layer, a second product protection layer, a second product fixing layer, a third product protection layer, a flattening layer, and a second sealing layer stacked in sequence;

[0026] At least one capacitor chip is laid between the first product fixing layer and the second product protection layer, and at least one capacitor chip is laid between the second product fixing layer and the third product protection layer.

[0027] Optionally, the first sealing layer and the second sealing layer are both silicone carriers, the installation positioning layer and the flattening layer are both stainless steel cover plates, the first product protection layer, the second product protection layer and the third product protection layer are all silicone carriers, and the first product fixing layer and the second product fixing layer are both fiberglass boards.

[0028] Secondly, in order to better solve the above problems, an embodiment of the present invention also provides a method for expanding the hole of a through-hole capacitor ceramic chip, using the above-mentioned through-hole capacitor ceramic chip expanding tooling for hole expansion, the volume ratio of water and sand in the sandblasting liquid is 6 to 8:3, and the diameter expansion value of the inner hole of a single capacitor chip is 0.05 to 0.2 mm.

[0029] Compared with the prior art, the embodiments of the present invention have the following advantages and beneficial effects:

[0030] 1. The through-hole capacitor ceramic chip expansion tool provided in the embodiment of the present invention provides a closed processing environment for the sandblasting liquid by setting a packaging cavity component for accommodating and sealing the product loading component, thereby ensuring that the sandblasting liquid can act evenly on the inner hole of the capacitor chip; a product loading component is set to fix the capacitor chip to ensure that the chip remains stable during the sandblasting process, and a through hole is set to guide the sandblasting liquid into the inner hole of the chip to achieve a uniform sandblasting effect.

[0031] The sandblasting liquid passes through the sandblasting liquid supply device and enters the containing chamber of the packaging cavity assembly through the first nozzle assembly (or the second nozzle assembly). The sandblasting liquid enters the inner hole of the capacitor chip through the through hole of the product loading assembly. The sandblasting liquid flows in the inner hole and performs uniform sandblasting on the surface of the inner hole to remove excess material and achieve hole expansion and chamfering effects. The sandblasting liquid passing through the inner hole flows out of the packaging cavity assembly from the second nozzle assembly (or the first nozzle assembly), completing the sandblasting process.

[0032] In an embodiment of the present invention, the sandblasting liquid is evenly distributed in the packaging cavity assembly and enters the inner hole of the capacitor chip through the through hole, thereby ensuring the uniformity of the chamfer of the inner hole and avoiding the unevenness caused by mechanical drilling. At the same time, the physical impact of the sandblasting liquid is relatively mild and will not produce excessive stress on the ceramic chip, thereby effectively reducing the occurrence of cracks in the porcelain body. The uniform chamfer and crack-free inner hole surface improve the electrical performance and reliability of the capacitor chip and meet the application requirements of high-frequency and microwave circuits.

[0033] 2. The embodiment of the present invention sets a plurality of accommodating cavities, and sets a carrier independently in each accommodating cavity. Each accommodating cavity is provided with an independent first nozzle and a second nozzle, that is, each accommodating cavity is connected to a sandblasting liquid separately, so that sand and water can pass through fully and evenly. The upper end cover and the lower end cover can be positioned and locked by pins to avoid alignment errors. The cavity assembly can adopt a symmetrical design without disassembly. By manually replacing the inlet and outlet joints with the first nozzle and the second nozzle, the flow direction of the sandblasting liquid can be changed to perform double-sided sandblasting. This structure can improve the uniformity of the inner hole sandblasting of multiple capacitor chips, improve the efficiency and qualified rate of the hole expansion of multiple capacitor chips, and avoid the efficiency difference when multiple capacitor chips are expanded together.

[0034] 3. The embodiment of the present invention can effectively remove the excess ceramic part by repeatedly pressurizing the water-sand mixture to blast the sand according to the control of the sandblasting time and the water-sand content, and effectively expand the inner hole of the ceramic through-hole capacitor by 0.05-0.2mm, so that the inner electrode of the ceramic ring is fully exposed. Compared with the traditional chamfering process and mechanical drilling method, this method avoids damage to the product and improves production consistency.

[0035] 4. The product loading assembly provided in the embodiment of the present invention includes nine layers. Two silicone carriers are sealing layers to prevent leakage of sandblasting liquid. One stainless steel positioning cover plate is an installation positioning layer to facilitate product installation. Three silicone carriers are product protection layers to prevent product damage, and two fiberglass boards are product fixing layers to prevent product movement. Another stainless steel cover plate is a flattening layer to prevent the product from shaking. Through the protection and fixation of the multi-layer structure, it is ensured that the chip will not shift or be damaged during the sandblasting process, thereby improving the processing quality and reliability of the product.

[0036] In general, an embodiment of the present invention provides a through-hole capacitor ceramic chip expansion tool and expansion method, which loads the capacitor chip into a product loading component, sets the product loading component in a receiving chamber of a packaging cavity component, and delivers sandblasting liquid to the receiving chamber to achieve the purpose of uniform hole expansion and preventing cracks in the ceramic body. BRIEF DESCRIPTION OF THE DRAWINGS

[0037] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required for use in the embodiments are briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present invention and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without creative work.

[0038] Figure 1 An exploded view of a hole expansion tool provided in an embodiment of the present invention;

[0039] Figure 2 An internal cross-sectional view of a hole expansion tool provided in an embodiment of the present invention;

[0040] Figure 3 A schematic diagram of the external structure of a hole expansion tool provided in an embodiment of the present invention;

[0041] Figure 4 An exploded view of a packaging cavity assembly provided by an embodiment of the present invention;

[0042] Figure 5 A schematic diagram of the structure of a product loading assembly provided by an embodiment of the present invention;

[0043] Figure 6 A top view of a packaging cavity assembly provided by an embodiment of the present invention;

[0044] Figure 7 A schematic diagram of the structure of the lower accommodating cavity in the cavity assembly provided in an embodiment of the present invention;

[0045] Figure 8 A schematic diagram of the structure of the upper accommodating cavity in the cavity assembly provided in an embodiment of the present invention;

[0046] Fig. 9FIG. 1 is a diagram showing the inner hole state of a capacitor chip in an embodiment of the present invention, wherein Fig. 9 a is the state diagram of the inner hole before sandblasting. Fig. 9 b is the state diagram of the inner hole after sandblasting.

[0047] Marks and corresponding parts names in the attached drawings:

[0048] 1-through hole, 2-end cover assembly, 3-cavity assembly, 4-upper end cover, 5-lower end cover, 6-upper cavity member, 7-lower cavity member, 8-accommodating cavity, 9-carrier, 10-first pipe mouth member, 11-second pipe mouth member, 12-upper accommodating cavity, 13-lower accommodating cavity, 14-first sealing layer, 15-installation positioning layer, 16-first product protection layer, 17-first product fixing layer, 18-second product protection layer, 19-second product fixing layer, 20-third product protection layer, 21-flattening layer, 22-second sealing layer. DETAILED DESCRIPTION

[0049] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Generally, the components of the embodiments of the present invention described and shown in the drawings here can be arranged and designed in various different configurations.

[0050] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the invention claimed for protection, but merely represents selected embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0051] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, further definition and explanation thereof is not required in subsequent drawings.

[0052] In the description of the present invention, it should be noted that the terms "first", "second", "third", etc. are only used to distinguish the description and cannot be understood as indicating or implying relative importance.

[0053] Example

[0054] Embodiment 1:

[0055] like Figure 1-Figure 3As shown, an embodiment of the present invention provides a through-hole capacitor ceramic chip expansion tool, including a packaging cavity component 3 and a product loading component, wherein a accommodating chamber is arranged in the packaging cavity component 3, and the product loading component is arranged in the accommodating chamber; at least one capacitor chip is loaded in the product loading component, and at least one through hole 1 is arranged on the product loading component, and a single through hole 1 is connected to the inner hole of a single capacitor chip; a first nozzle component is arranged at one end of the packaging cavity component 3, and a second nozzle component is arranged at the other end, and the first nozzle component and the second nozzle component are both connected to the accommodating chamber; the first nozzle component or the second nozzle component is configured to transport the sandblasting liquid into the accommodating chamber after being connected to the sandblasting liquid supply equipment, and the sandblasting liquid in the accommodating chamber flows along the inner hole of the capacitor chip through the through hole 1, and the sandblasting liquid passing through the inner hole flows out of the packaging cavity component 3 from the second nozzle component or the first nozzle component.

[0056] Specifically, the packaging cavity assembly 3 is used to accommodate and seal the product loading assembly, provide a closed processing environment for the sandblasting liquid, and ensure that the sandblasting liquid can evenly act on the inner hole of the capacitor chip. A accommodating chamber is provided inside the packaging cavity assembly 3 for placing the product loading assembly, and a first nozzle assembly and a second nozzle assembly are respectively provided at both ends thereof for inputting and outputting the sandblasting liquid; the product loading assembly is used to fix the capacitor chip, ensure that the chip remains stable during the sandblasting process, and guide the sandblasting liquid into the inner hole of the chip, and the through hole 1 is connected to the inner hole of the capacitor chip to ensure that the sandblasting liquid can smoothly enter the inner hole. The first nozzle assembly and the second nozzle assembly are respectively located at both ends of the packaging cavity assembly 3, and are both connected to the accommodating chamber, one of the nozzle assemblies is connected to the sandblasting liquid supply device, and is used to transport the sandblasting liquid to the accommodating chamber; the other nozzle assembly is used to discharge the sandblasting liquid, and the sandblasting liquid supply device is used to provide the sandblasting liquid, and the sandblasting liquid is transported to the packaging cavity assembly 3 through the nozzle assembly.

[0057] When in use, the sandblasting liquid passes through the sandblasting liquid supply equipment, enters the accommodating chamber of the packaging cavity assembly 3 through the first nozzle assembly (or the second nozzle assembly), and the sandblasting liquid enters the inner hole of the capacitor chip through the through hole 1 of the product loading assembly. The sandblasting liquid flows in the inner hole and evenly sandblasts the surface of the inner hole to remove excess material and achieve hole expansion and chamfering effects. The sandblasting liquid passing through the inner hole flows out of the packaging cavity assembly 3 from the second nozzle assembly (or the first nozzle assembly), completing the sandblasting process.

[0058] In the embodiment of the present invention, first, the sandblasting liquid is evenly distributed in the packaging cavity assembly 3, and enters the inner hole of the capacitor chip through the through hole 1, ensuring the uniformity of the chamfer of the inner hole and avoiding the unevenness caused by the mechanical drilling method. Secondly, the physical impact of the sandblasting liquid is relatively mild and will not produce excessive stress on the ceramic chip, thereby effectively reducing the generation of cracks in the porcelain body. In the actual operation process, the pressure, flow rate and composition of the sandblasting liquid can be adjusted to accurately control the effects of hole expansion and chamfering to adapt to ceramic chips of different specifications. Through the hole expansion tooling provided by the embodiment of the present invention, uniform chamfering and crack-free inner hole surface of the ceramic chip can be achieved, the electrical performance and reliability of the capacitor chip can be improved, the application requirements of high-frequency and microwave circuits can be met, the shortcomings of the traditional mechanical drilling method are solved, and the processing quality and reliability of the through-hole capacitor ceramic chip are significantly improved.

[0059] It should be noted that the number of capacitor chips loaded is not limited here, and they can be laid out according to actual needs. The number of through holes 1 is also not limited here. Generally speaking, the maximum number of single-layer capacitor chips laid is consistent with the number of through holes 1. This ensures that the inner hole of each capacitor chip is connected to a through hole 1. Preferably, during installation, the axis of the inner hole of a single capacitor chip coincides with the axis of a single through hole 1. This ensures that the through hole 1 can smoothly guide the sandblasting liquid to each inner hole, thereby improving the consistency of hole expansion of batch capacitor chips.

[0060] It should also be noted that, in the embodiment of the present invention, the first nozzle assembly can be connected to the inlet end of the sandblasting liquid, and then the second nozzle assembly can be connected to the outlet end of the sandblasting liquid. Of course, the first nozzle assembly can also be connected to the outlet end of the sandblasting liquid, and then the second nozzle assembly can be connected to the inlet end of the sandblasting liquid. There is no limitation here. In the actual operation process, it can also be selectively replaced in the middle of the sandblasting according to the requirements of the sandblasting process. There is no need for disassembly and assembly. By manually replacing the inlet and outlet water joints of the first nozzle piece 10 and the second nozzle piece 11, the flow direction of the sandblasting liquid can be changed to perform double-sided sandblasting.

[0061] For example, Figure 4 As shown, the encapsulated cavity assembly 3 includes an end cap assembly 2 and a cavity assembly 3, the cavity assembly 3 forms a receiving chamber, and the end cap assembly 2 is configured to seal the receiving chamber. Through the close fit between the cavity assembly 3 and the end cap assembly 2, it is ensured that the sandblasting liquid will not leak under high pressure, thereby improving the safety of the operation. Preferably, in order to improve the distribution of the sandblasting liquid in the receiving chamber and allow it to smoothly enter each through hole 1, the sealing cavity wall at the upper end of the end cap assembly 2 can be configured to have a gap with the upper end of the cavity assembly 3, and the sealing cavity wall at the lower end of the end cap assembly 2 can be configured to have a gap with the lower end of the cavity assembly 3.

[0062] Specifically, the end cap assembly 2 includes an upper end cap 4 and a lower end cap 5, and the cavity assembly 3 includes an upper cavity member 6 and a lower cavity member 7 which are arranged adjacent to each other. The upper end cap 4 is arranged on the outer side of the upper cavity member 6, and the lower end cap 5 is arranged on the outer side of the lower cavity member 7; the first nozzle assembly is arranged on the upper end cap 4, and the second nozzle assembly is arranged on the lower end cap 5. In detail, the upper end cap 4 can be installed on the outer side of the upper cavity member 6 by means of threads or flanges, and the lower end cap 5 can also be installed on the outer side of the lower cavity member 7 by means of threads or flanges. At the same time, a sealing ring or a sealing gasket can also be installed at the connection to ensure that the sandblasting liquid does not leak from the connection. The upper end cap 4 and the lower end cap 5 cooperate to encapsulate the upper cavity member 6 and the lower cavity member 7, and seal the containing chamber at the same time, to ensure that the sandblasting liquid does not leak under high pressure, thereby improving the safety and reliability of the operation. The split design of the upper cavity member 6 and the lower cavity member 7 is convenient for assembly and disassembly, and convenient for installing and removing the product loading assembly.

[0063] As a preferred embodiment of the present invention, the accommodating chamber includes a plurality of accommodating cavities 8, the product loading assembly includes a plurality of carriers 9, a single carrier 9 is installed in a single accommodating cavity 8, and a single carrier 9 is provided with at least one through hole 1, and a single carrier 9 is provided with at least one capacitor chip; the first nozzle assembly includes a plurality of first nozzle pieces 10, the second nozzle assembly includes a plurality of second nozzle pieces 11, and a single first nozzle piece 10 and a single second nozzle piece 11 are connected to a single accommodating cavity 8. By separating and setting, it is ensured that the sandblasting liquid in each carrier 9 flows independently, avoiding mutual interference, and ensuring the processing quality of each chip.

[0064] For example, Figure 1 , Figure 4 , Figure 5 and Figure 6 As shown, the accommodating chamber includes four accommodating chambers 8, the product loading assembly includes four loading carriers 9, and a single loading carrier 9 is provided with twenty-five through holes 1, and a single loading carrier 9 is provided with twenty-five capacitor chips; the first nozzle assembly includes four first nozzle pieces 10, and the second nozzle assembly includes four second nozzle pieces 11, and each accommodating chamber 8 is connected to a first nozzle piece 10 and a second nozzle piece 11. That is, in the embodiment of the present invention, the accommodating chamber is composed of four independent accommodating chambers 8, each accommodating chamber 8 is used to load a loading carrier 9, and each accommodating chamber 8 inputs and outputs the sandblasting liquid through an independent first nozzle piece 10 and a second nozzle piece 11, ensuring that the sandblasting liquid in each loading carrier 9 flows independently to avoid mutual interference, and the size and shape of each accommodating chamber 8 can be set according to the size of the loading carrier 9 to ensure sufficient space for the sandblasting liquid to flow. The reaming tool can process 100 capacitor chips at the same time, significantly improving production efficiency, and at the same time, each accommodating chamber 8 operates independently to avoid mutual interference, ensuring the processing quality of each chip.

[0065] Compared with only one large accommodating cavity 8 for processing 100 capacitor chips at the same time, the structure of only one first nozzle piece 10 on the upper end cover 4 and one second nozzle piece 11 on the lower end cover 5 reduces the difference in sandblasting effect between the intermediate product and the edge product. Of course, in other embodiments, the number of accommodating cavities 8 is not limited to four, and the number of through holes 1 on a single carrier 9 is not limited to twenty-five. They can be set according to actual needs and are not limited here. At the same time, in other embodiments, the arrangement of the four accommodating cavities 8 is not limited to a matrix arrangement with equal spacing, as long as the purpose of batch ceramic chip hole expansion consistency can be achieved.

[0066] Preferably, if Figure 7 and Figure 8 As shown, a single accommodating cavity 8 includes an upper accommodating cavity 12 and a lower accommodating cavity 13. The upper accommodating cavity 12 is arranged on the upper end cover 4, and the lower accommodating cavity 13 is arranged on the lower end cover 5. The upper and lower ends of the upper accommodating cavity 12 are both provided with openings, and the upper and lower ends of the lower accommodating cavity 13 are both provided with openings. The opening at the lower end of the upper accommodating cavity 12 is fitted with the opening at the upper end of the lower accommodating cavity 13; the size of the opening at the upper end of the upper accommodating cavity 12 is smaller than the size of the opening at its lower end, and the size of the opening at the lower end of the lower accommodating cavity 13 is smaller than the size of the opening at its upper end; the opening at the upper end of the upper accommodating cavity 12 is arranged to limit the upper end of the single loading body 9 in the upper accommodating cavity 12, and the opening at the lower end of the lower accommodating cavity 13 is arranged to limit the lower end of the single loading body 9 in the lower accommodating cavity 13.

[0067] Specifically, the upper end opening size of the upper accommodating cavity 12 is smaller than the lower end opening size, which is used to limit the upper end of the carrier 9 in the upper accommodating cavity 12, and the lower end opening size of the lower accommodating cavity 13 is smaller than the upper end opening size, which is used to limit the lower end of the carrier 9 in the lower accommodating cavity 13, ensuring that the carrier 9 will not move during the sandblasting process, and at the same time ensuring that the sandblasting liquid can enter the inner hole of the capacitor chip through the through hole 1.

[0068] Exemplarily, the cross-section of the opening at the upper end of the upper accommodating chamber 12 is a rectangle, and the cross-section of the opening at the lower end of the lower accommodating chamber 13 is a rectangle; the size and shape of the inner cross-section of the upper accommodating chamber 12 are the same as the size and shape of the opening at the lower end of the upper accommodating chamber 12; the size and shape of the inner cross-section of the lower accommodating chamber 13 are the same as the size and shape of the opening at the upper end of the lower accommodating chamber 13; the size and shape of the opening at the lower end of the upper accommodating chamber 12 are the same as the size and shape of the opening at the upper end of the lower accommodating chamber 13; the single loading body 9 is a rectangular parallelepiped, and its cross-sectional size and shape are adapted to the size and shape of the opening at the lower end of the upper accommodating chamber 12. It should be noted that in other embodiments of the present invention, the cross-section of the opening at the upper end of the upper accommodating chamber 12 and the cross-section of the opening at the lower end of the lower accommodating chamber 13 are not limited to rectangles, and can also be set to circles, irregular shapes, etc., and the single loading body 9 can also be set to a cylindrical shape, etc., which are not limited here.

[0069] Furthermore, if Figure 5 As shown, a single carrier 9 includes a first sealing layer 14, a mounting and positioning layer 15, a first product protection layer 16, a first product fixing layer 17, a second product protection layer 18, a second product fixing layer 19, a third product protection layer 20, a flattening layer 21, and a second sealing layer 22, which are stacked in sequence; at least one capacitor chip is laid between the first product fixing layer 17 and the second product protection layer 18, and at least one capacitor chip is laid between the second product fixing layer 19 and the third product protection layer 20. Preferably, the first sealing layer 14 and the second sealing layer 22 are both silicone carriers, the mounting and positioning layer 15 and the flattening layer 21 are both stainless steel cover plates, the first product protection layer 16, the second product protection layer 18, and the third product protection layer 20 are all silicone carriers, and the first product fixing layer 17 and the second product fixing layer 19 are both fiberglass boards.

[0070] Specifically, in an embodiment of the present invention, the first sealing layer 14 is set as a silicone carrier. Silicone has good flexibility and elasticity, can adapt to different pressure and temperature conditions, and has high chemical stability and is not easily corroded by sandblasting liquid, so that the first sealing layer 14 can prevent the sandblasting liquid from leaking from the bottom of the carrier 9; the installation positioning layer 15 is a stainless steel positioning cover plate. Stainless steel has high strength and corrosion resistance and can withstand the impact of sandblasting liquid. The positioning cover plate is designed with precise positioning holes or grooves, so that the installation positioning layer 15 can provide installation positioning for the capacitor chip, ensure the accurate position of the chip in the carrier 9, and also facilitate the installation and removal of the chip; the first product protection layer 16 is a silicone carrier. The softness of silicone can absorb part of the energy of the sandblasting liquid and reduce the impact on the chip, so that the first product protection layer 16 can protect the capacitor chip from the direct impact of the sandblasting liquid and reduce surface damage. It can also buffer the energy of the sandblasting liquid and protect the integrity of the chip.

[0071] The first product fixing layer 17 is a glass fiber board, which has high strength and low expansion coefficient and can remain stable during the sandblasting process, so that the first product fixing layer 17 can fix the capacitor chip to prevent it from moving during the sandblasting process and ensure the stability of the chip in the carrier 9; the second product protection layer 18 is a silicone carrier, which can further protect the capacitor chip and reduce the damage to its surface caused by the sandblasting liquid; the second product fixing layer 19 is a glass fiber board, which is used to fix the capacitor chip to prevent it from moving during the sandblasting process; the third product protection layer 20 is a silicone carrier, which is used to protect the capacitor chip from direct impact of the sandblasting liquid and reduce surface damage; the flattening layer 21 is a stainless steel cover plate, which is used to prevent the capacitor chip from shaking during the sandblasting process and ensure its flatness. It can cooperate with the positioning cover plate to further fix the chip; the second sealing layer 22 is a silicone carrier, which is used to prevent the sandblasting liquid from leaking from the top of the carrier 9, provide good sealing performance, and protect internal components.

[0072] In the embodiment of the present invention, a plurality of capacitor chips are laid on the first product fixing layer 17 and the second product fixing layer 19, which are divided into two layers, upper and lower. If a single carrier 9 is laid with twenty-five capacitor chips per layer, then a single carrier 9 can batch process fifty capacitor chips at one time, further expanding the batch hole expansion quantity of capacitor chips. During the installation process, first put the first sealing layer 14 at the bottom, then place the installation positioning layer 15, place the first product protection layer 16, then place the product on the first product fixing layer 17 and continue to stack, then place the second product protection layer 18, then place the product on the second product fixing layer 19 and continue to stack, place the third product protection layer 20, then place the flattening layer 21 and the second sealing layer 22 in turn, finally put the entire carrier 9 into the accommodating cavity 8, perform liquid sandblasting, align the upper cavity member 6 with the lower cavity member 7 through the pin hole and then connect them with threads, and align the upper end cover 4 with the lower end cover 5 through the pin hole and then connect them with threads.

[0073] The embodiment of the present invention adopts a multi-layer structure design for the carrier 9, with different layers made of different materials and stainless steel at the ends to provide strength support. The middle layer is a combination of glass fiber board and silicone, which can fix the product while avoiding crushing the product. The top and bottom layers are both made of silicone, which can better seal the cavity.

[0074] Embodiment 2:

[0075] The embodiment of the present invention provides a method for expanding a hole in a through-hole capacitor ceramic chip. The through-hole capacitor ceramic chip expansion tool of embodiment 1 is used for expanding the hole. The volume ratio of water to sand in the sandblasting liquid is 6 to 8:3. Fig. 9 As shown, the diameter expansion value of the inner hole of a single capacitor chip is 0.05 to 0.2 mm.

[0076] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. For those skilled in the art, the present invention may have various modifications and variations. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention shall be included in the protection scope of the present invention. It should be noted that the structures or components illustrated in the accompanying drawings are not necessarily drawn to scale, and the present invention omits the description of known components and processing technologies and processes to avoid unnecessary limitations on the present invention.

Claims

1. A through-hole capacitor ceramic chip expansion tool, characterized in that: It comprises a packaging cavity component and a product loading component, wherein a receiving chamber is arranged in the packaging cavity component, and the product loading component is arranged in the receiving chamber; At least one capacitor chip is loaded in the product loading component, and at least one through hole (1) is provided on the product loading component, and a single through hole (1) is connected to an inner hole of a single capacitor chip; A first nozzle assembly is disposed at one end of the packaging cavity assembly, and a second nozzle assembly is disposed at the other end, wherein the first nozzle assembly and the second nozzle assembly are both communicated with the accommodating cavity; The first nozzle assembly or the second nozzle assembly is configured to deliver the sandblasting liquid into the accommodating chamber after being connected to the sandblasting liquid supply device. In the accommodating chamber, the sandblasting liquid flows along the inner hole of the capacitor chip through the through hole (1). The sandblasting liquid that passes through the inner hole flows out of the packaging cavity assembly from the second nozzle assembly or the first nozzle assembly.

2. The hole enlarging tool for a through-hole capacitor ceramic chip according to claim 1, characterized in that: The packaging cavity assembly comprises an end cover assembly (2) and a cavity assembly (3), wherein the cavity assembly (3) forms a receiving chamber, and the end cover assembly (2) is configured to seal the receiving chamber.

3. The hole enlarging tool for a through-hole capacitor ceramic chip according to claim 2, characterized in that: The end cover assembly (2) comprises an upper end cover (4) and a lower end cover (5), the cavity assembly (3) comprises an upper cavity member (6) and a lower cavity member (7) which are arranged adjacent to each other, the upper end cover (4) is arranged on the outer side of the upper cavity member (6), and the lower end cover (5) is arranged on the outer side of the lower cavity member (7); The first nozzle assembly is arranged on the upper end cover (4), and the second nozzle assembly is arranged on the lower end cover (5).

4. The hole enlarging tool for a through-hole capacitor ceramic chip according to claim 3, characterized in that: The accommodating chamber comprises a plurality of accommodating cavities (8), the product loading assembly comprises a plurality of loading carriers (9), a single loading carrier (9) is installed in a single accommodating cavity (8), and a single loading carrier (9) is provided with at least one through hole (1), and a single loading carrier (9) is provided with at least one capacitor chip; The first nozzle assembly comprises a plurality of first nozzle pieces (10), the second nozzle assembly comprises a plurality of second nozzle pieces (11), and a single first nozzle piece (10) and a single second nozzle piece (11) are connected to a single accommodating cavity (8).

5. The hole enlarging tool for a through-hole capacitor ceramic chip according to claim 4, characterized in that: The accommodating chamber comprises four accommodating cavities (8), the product loading assembly comprises four loading carriers (9), each of the loading carriers (9) is provided with twenty-five through holes (1), and each of the loading carriers (9) is provided with twenty-five capacitor chips; The first nozzle assembly comprises four first nozzle pieces (10), the second nozzle assembly comprises four second nozzle pieces (11), and each of the accommodating cavities (8) is connected to a first nozzle piece (10) and a second nozzle piece (11).

6. The hole enlarging tool for a through-hole capacitor ceramic chip according to claim 4, characterized in that: The single accommodating cavity (8) comprises an upper accommodating cavity (12) and a lower accommodating cavity (13); the upper accommodating cavity (12) is arranged on the upper end cover (4), and the lower accommodating cavity (13) is arranged on the lower end cover (5); the upper end and the lower end of the upper accommodating cavity (12) are both provided with openings, and the upper end and the lower end of the lower accommodating cavity (13) are both provided with openings, and the opening at the lower end of the upper accommodating cavity (12) is arranged to fit the opening at the upper end of the lower accommodating cavity (13); The size of the opening at the upper end of the upper accommodating cavity (12) is smaller than the size of the opening at the lower end thereof, and the size of the opening at the lower end of the lower accommodating cavity (13) is smaller than the size of the opening at the upper end thereof; The opening at the upper end of the upper accommodating chamber (12) is configured to limit the upper end of a single loading body (9) within the upper accommodating chamber (12), and the opening at the lower end of the lower accommodating chamber (13) is configured to limit the lower end of a single loading body (9) within the lower accommodating chamber (13).

7. The hole enlarging tool for a through-hole capacitor ceramic chip according to claim 6, characterized in that: The cross section of the opening at the upper end of the upper accommodating chamber (12) is rectangular, and the cross section of the opening at the lower end of the lower accommodating chamber (13) is rectangular; The inner cross-sectional size and shape of the upper accommodating cavity (12) are the same as the opening size and shape of the lower end of the upper accommodating cavity (12); The inner cross-sectional size and shape of the lower accommodating cavity (13) are the same as the opening size and shape of the upper end of the lower accommodating cavity (13); The size and shape of the opening at the lower end of the upper accommodating chamber (12) are the same as the size and shape of the opening at the upper end of the lower accommodating chamber (13); The single loading carrier (9) is in the shape of a rectangular parallelepiped, and its cross-sectional size and shape are adapted to the size and shape of the opening at the lower end of the upper accommodating cavity (12).

8. The hole enlarging tool for a through-hole capacitor ceramic chip according to claim 4, characterized in that: The single carrier (9) comprises a first sealing layer (14), a mounting and positioning layer (15), a first product protection layer (16), a first product fixing layer (17), a second product protection layer (18), a second product fixing layer (19), a third product protection layer (20), a flattening layer (21) and a second sealing layer (22) which are stacked in sequence; At least one capacitor chip is laid between the first product fixing layer (17) and the second product protection layer (18), and at least one capacitor chip is laid between the second product fixing layer (19) and the third product protection layer (20).

9. The hole enlarging tool for a through-hole capacitor ceramic chip according to claim 9, characterized in that: The first sealing layer (14) and the second sealing layer (22) are both silicone carriers, the installation positioning layer (15) and the flattening layer (21) are both stainless steel cover plates, the first product protection layer (16), the second product protection layer (18) and the third product protection layer (20) are all silicone carriers, and the first product fixing layer (17) and the second product fixing layer (19) are both glass fiber boards.

10. A method for expanding a hole in a ceramic chip of a through-hole capacitor, characterized in that: The hole expansion tool for the through-hole capacitor ceramic chip as described in any one of claims 1 to 9 is used for hole expansion, the volume ratio of water to sand in the sandblasting liquid is 6 to 8:3, and the diameter expansion value of the inner hole of a single capacitor chip is 0.05 to 0.2 mm.

Images