Packaging substrate testing device and testing method

Abstract

The invention provides a packaging substrate testing device and testing method, and belongs to the technical field of performance testing. The preparation module is used for placing a to-be-tested packaging substrate on a test platform by using a precise positioning device and acquiring basic information of the packaging substrate; the image detection module is used for acquiring original image information of the packaging substrate by using image detection equipment and analyzing to obtain an image detection result; the electrical test module is used for connecting an electrical signal to a test point of the packaging substrate through a probe and obtaining an electrical detection result based on signal transmission; the thermal cycle test module is used for performing thermal cycle test on the packaging substrate and detecting the performance change degree of the packaging substrate to obtain a thermal cycle detection result; and the evaluation module is used for generating a detailed test report, wherein the report comprises a result of each test and whether the test passes or not. The quality of the packaging substrate is ensured through multi-module testing, and the reliability of packaging testing is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of performance testing, and in particular to a packaging substrate testing device and a testing method. Background Art

[0002] At present, the packaging substrate is an important component of the connection between electronic components and integrated circuits (ICs) in electronic devices. With the continuous advancement of electronic technology, the functions of integrated circuits are becoming more and more powerful, and the size is constantly decreasing. The packaging technology is also gradually developing in the direction of higher density, smaller size, and more complex. The usual packaging test only uses a single test, resulting in large errors in the packaging results and inaccurate test results.

[0003] Therefore, the present invention provides a packaging substrate testing device and a testing method. Summary of the invention

[0004] The present invention provides a packaging substrate testing device and a testing method, which are used to comprehensively evaluate the performance of the packaging substrate by placing the packaging substrate on a platform, performing image detection, electrical signal testing, thermal cycle testing, and finally generating a detailed report to ensure that its quality meets the design requirements.

[0005] In one aspect, the present invention provides a packaging substrate testing device, comprising: Preparation module: Use a precise positioning device to place the package substrate to be tested on the test platform and obtain basic information of the package substrate; Image detection module: Use image detection equipment to obtain the original image information of the packaging substrate and analyze it to obtain the image detection results; Electrical test module: connects the electrical signal to the test point of the package substrate through the probe, and obtains the electrical test result based on the signal transmission; Thermal cycle test module: Through thermal cycle test on the package substrate, the performance change degree of the package substrate is detected and the thermal cycle test result is obtained; Evaluation Module: Generates a detailed test report that includes the results of each test and whether it passed or failed.

[0006] On the other hand, the preparation module includes: Calibration unit: select any package substrate as the target to be measured, calibrate the precision positioning device, and set the maximum working range of the precision positioning device according to the factory size of the package substrate; Positioning unit: Use a precision positioning device in conjunction with an automated gripping system to take out the package substrate from the storage location, perform preliminary positioning of the package substrate according to the pin position of the package substrate, input preliminary positioning parameters of the package substrate through the control system of the positioning device, and accurately control the position of the substrate until the substrate is fully aligned with the test platform; Basic information acquisition unit: Use a precision positioning device in conjunction with a laser measurement system to obtain basic information about the package substrate.

[0007] On the other hand, the image detection module includes: Image acquisition unit: Based on the precise positioning device combined with the image detection equipment, the original image of the packaging substrate is acquired; Image processing: using a Gaussian filter to perform denoising on the original image to obtain a first image, and performing grayscale processing on the first image to obtain a second image; Image analysis module: Get the gradient matrix of any pixel point in the second image as: ;in, Represents the gradient matrix of the pixel point (x, y), represents the gradient of the pixel in the x direction, Represents the gradient of the pixel in the y direction; The deviation of the pixel point obtained by the response function is: ;in, represents the deviation of the pixel point, represents the determinant function, represents the determinant of the gradient matrix, represents the coefficient of variation, represents the trace function, represents the trace of the gradient matrix; If the deviation of the pixel point is greater than a preset deviation, the pixel point is determined to be an edge point, all edge points of the second image are acquired, and a plurality of feature images surrounded by the edge points are acquired.

[0008] On the other hand, the image detection module further includes: Recognition unit: performs image matching with the feature image based on the package substrate substructure template in the expert library, and identifies and determines the substructure template corresponding to the feature image; Comparison unit: obtain any feature image, compare the feature image with the corresponding substructure template, and obtain the similarity as: ;in, Represents the similarity between the feature image and the substructure template at point (x, y), represents the feature image, Represents a substructure template, Represents the pixel point (x, y) of the feature image, Represents the pixel point of the substructure template ,u represents the lateral translation of the substructure template relative to the feature image, and v represents the longitudinal translation of the substructure template relative to the feature image. Represents the mean value of the pixel values ​​of the feature image, Represents the mean value of the pixel values ​​of the substructure template; If the mean similarity of the pixel points is less than a preset standard threshold, it is determined that there is a problem at the position of the pixel point; otherwise, it means that there is no problem at the pixel point; The comparison result of the packaging substrate constitutes the image detection result of the packaging substrate.

[0009] On the other hand, the electrical test module comprises: Test point unit: Based on the substructure type and distribution of the package substrate, a probe is used to connect the electrical signal to any substructure of the package substrate; Signal processing unit: inputs a preset electrical signal into any substructure through a signal transmission device, and receives an output signal; Signal comparison unit: By comparing the input signal and output signal of the substructure, the signal deviation is obtained as follows: ;in, Indicates the signal deviation between the output signal and the input signal. Represents the output signal, represents the input signal, f represents the frequency, t represents the time, j represents the imaginary coefficient, Represents the preset gain weight coefficient, represents the preset phase weight coefficient, ( ) represents the phase function; If the signal deviation is greater than a preset electrical threshold, it is determined that an electrical fault exists in the substructure; All substructures of the package substrate are tested to generate electrical test results.

[0010] On the other hand, the thermal cycle test module comprises: Thermal cycle unit: raises the temperature of the package substrate from a preset low temperature to a preset high temperature, keeps it at the preset high temperature for a period of time, and then lowers it to the preset low temperature for multiple cycles; Fatigue unit: obtain the thermal cycle result of the packaging substrate, and based on the performance parameters of the packaging substrate in each thermal cycle, obtain the fatigue degree of the packaging substrate: ;in, Indicates the fatigue degree of the package substrate after the nth thermal cycle, represents the stress variation coefficient of the nth thermal cycle, Indicates the temperature difference between the nth thermal cycle and the preset low temperature, represents the fatigue strength function; The fatigue degree of each thermal cycle of the packaging substrate is recorded to generate a thermal cycle detection result.

[0011] On the other hand, the evaluation module comprises: Report unit: Design the framework of the test report, input the image test results, electrical test results, and thermal cycle test results into the framework, and generate the first report; Evaluation unit: if there is a substructure fault in the image detection result or the electrical detection result, it is determined that the package substrate has a fault, and the corresponding detection failure of the package substrate is added to the first report; If the fatigue degree of the thermal cycle test result is greater than a preset fatigue threshold within a preset number of cycles, it is determined that the packaging substrate does not meet the fatigue standard, and the failure of the packaging substrate to pass the fatigue test is added to the first report to generate a second report.

[0012] In another aspect, the present invention provides a packaging substrate testing method, comprising: Step 1: Use a precision positioning device to place the package substrate to be tested on the test platform to obtain basic information of the package substrate; Step 2: Use image detection equipment to obtain original image information of the package substrate, and analyze to obtain image detection results; Step 3: Connect the electrical signal to the test point of the package substrate through the probe, and obtain the electrical test result based on the signal transmission; Step 4: Perform a thermal cycle test on the package substrate to detect the degree of change in the performance of the package substrate and obtain a thermal cycle test result; Step 5: Generate a detailed test report that includes the results of each test and whether it passed or failed.

[0013] Compared with the prior art, the present invention has the following beneficial effects: The present invention provides a packaging substrate testing device and a testing method, which are used to comprehensively evaluate the performance of the packaging substrate by placing the packaging substrate on a platform, performing image detection, electrical signal testing, thermal cycle testing, and finally generating a detailed report to ensure that its quality meets the design requirements. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] In order to more clearly illustrate the technical solutions in the present invention or the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0015] Figure 1 It is a schematic flow chart of a packaging substrate testing method provided by an embodiment of the present invention; Figure 2It is a structural schematic diagram of a packaging substrate testing device provided by an embodiment of the present invention. DETAILED DESCRIPTION

[0016] In order to make the purpose, technical solution and advantages of the present invention clearer, the technical solution of the present invention will be clearly and completely described below in conjunction with the drawings of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0017] Embodiment 1: like Figure 1 As shown, an embodiment of the present invention provides a packaging substrate testing device, comprising: Preparation module: Use a precise positioning device to place the package substrate to be tested on the test platform and obtain basic information of the package substrate; Image detection module: Use image detection equipment to obtain the original image information of the packaging substrate and analyze it to obtain the image detection results; Electrical test module: connects the electrical signal to the test point of the package substrate through the probe, and obtains the electrical test result based on the signal transmission; Thermal cycle test module: Through thermal cycle test on the package substrate, the performance change degree of the package substrate is detected and the thermal cycle test result is obtained; Evaluation Module: Generates a detailed test report that includes the results of each test and whether it passed or failed.

[0018] In this embodiment, the precision positioning device is a high-precision device used to accurately place the object to be tested (such as a packaging substrate) at a specified position on the test platform. It is equipped with high-precision sensors, positioning systems and control modules, which can ensure that the object to be tested maintains a stable and precise position during the test process.

[0019] In this embodiment, the packaging substrate is a key component in electronic packaging and is used to carry and connect integrated circuit (IC) chips.

[0020] In this embodiment, the test platform is a workspace for performing various tests and evaluations on electronic components, assemblies or devices.

[0021] In this embodiment, the basic information includes physical and structural characteristics of the substrate, including: package type, substrate size, material information, etc.

[0022] In this embodiment, the image detection device refers to a device used to acquire and analyze the surface image of the packaging substrate, and is mainly used to detect the appearance characteristics and possible defects of the substrate, including: a high-definition camera, a scanner, etc.

[0023] In this embodiment, the original image information refers to preliminary image data of the packaging substrate collected by an image detection device.

[0024] In this embodiment, the image detection result is an output result obtained after the original image information of the packaging substrate is processed and analyzed by the image detection device, reflecting the health status of the surface of the packaging substrate and related structures.

[0025] In this embodiment, the electrical detection result is obtained through the electrical test module, reflecting the performance of the packaging substrate in terms of electrical properties.

[0026] In this embodiment, the thermal cycle test result refers to the performance change of the packaging substrate after undergoing a series of temperature changes.

[0027] In this embodiment, the probe is a tool used to connect to the electrical test points on the package substrate, and is usually a small, thin, metal tool.

[0028] In this embodiment, the electrical signal refers to the electrical energy information transmitted in the circuit.

[0029] In this embodiment, the test point refers to a specially designed contact point on the circuit board of the packaging substrate.

[0030] In this embodiment, thermal cycling refers to repeatedly cycling the package substrate or device between predetermined high and low temperatures.

[0031] In this embodiment, the test report is a detailed record and evaluation of the performance of the package substrate in various tests, which is used to summarize and analyze the test results to ensure that the product meets the design requirements and quality standards.

[0032] The working principle and beneficial effects of the above technical solution are: The working principle and beneficial effects of the above technical solution are: Through precise positioning, image detection, electrical signal transmission and thermal cycle testing, the performance of the package substrate is comprehensively evaluated. Finally, a test report is generated to ensure that the quality of the substrate meets the requirements, improve test efficiency and accuracy, and ensure product reliability.

[0033] Embodiment 2: Based on the above embodiment 1, the preparation module includes: Calibration unit: select any package substrate as the target to be measured, calibrate the precision positioning device, and set the maximum working range of the precision positioning device according to the factory size of the package substrate; Positioning unit: Use a precision positioning device in conjunction with an automated gripping system to take out the package substrate from the storage location, perform preliminary positioning of the package substrate according to the pin position of the package substrate, input preliminary positioning parameters of the package substrate through the control system of the positioning device, and accurately control the position of the substrate until the substrate is fully aligned with the test platform; Basic information acquisition unit: Use a precision positioning device in conjunction with a laser measurement system to obtain basic information about the package substrate.

[0034] In this embodiment, the maximum working range refers to the spatial range in which the positioning device can accurately operate and move.

[0035] In this embodiment, the grabbing system is an automated device used to grab, move and transfer items from a storage location to a specified location.

[0036] In this embodiment, the pin refers to a point on the package substrate that is used to connect to an external circuit and is connected to a pad on a circuit board by welding or insertion.

[0037] In this embodiment, the positioning device refers to a mechanical system used to accurately control and adjust the position of the target to be measured (such as a packaging substrate).

[0038] In this embodiment, the preliminary positioning parameters refer to a set of parameters used to align the packaging substrate approximately to a target position during the positioning process.

[0039] In this embodiment, the laser measurement system is a device that uses laser technology to accurately measure an object.

[0040] The working principle and beneficial effects of the above technical solution are: through the precision positioning device, the automatic gripping system and the laser measurement system, the accurate positioning and basic information acquisition of the package substrate are realized, the positioning accuracy and automation level are improved, the substrate is aligned with the test platform, and the test efficiency and accuracy are improved.

[0041] Embodiment 3: Based on the above embodiment 1, the image detection module includes: Image acquisition unit: Based on the precise positioning device combined with the image detection equipment, the original image of the packaging substrate is acquired; Image processing: using a Gaussian filter to perform denoising on the original image to obtain a first image, and performing grayscale processing on the first image to obtain a second image; Image analysis module: Get the gradient matrix of any pixel point in the second image as: ;in, Represents the gradient matrix of the pixel point (x, y), represents the gradient of the pixel in the x direction, Represents the gradient of the pixel in the y direction; The deviation of the pixel point obtained by the response function is: ;in, represents the deviation of the pixel point, represents the determinant function, represents the determinant of the gradient matrix, represents the coefficient of variation, represents the trace function, represents the trace of the gradient matrix; If the deviation of the pixel point is greater than a preset deviation, the pixel point is determined to be an edge point, all edge points of the second image are acquired, and a plurality of feature images surrounded by the edge points are acquired.

[0042] In this embodiment, the Gaussian filter is a smoothing filter commonly used in image processing, and its main function is to remove noise in the image.

[0043] In this embodiment, the denoising process removes noise in the image, improves the image quality, and makes subsequent image analysis and processing more accurate.

[0044] In this embodiment, the grayscale processing is to convert a color image into a grayscale image, remove the color information of the image, and only retain the brightness information.

[0045] In this embodiment, the gradient matrix is ​​a matrix that describes the brightness change of a certain pixel in the image, and reflects the brightness change degree of the pixel in the image in different directions (usually x and y directions).

[0046] In this embodiment, the deviation is used to determine whether the pixel point is located in the edge area of ​​the image.

[0047] In this embodiment, the preset deviation is a preset threshold used to measure whether a pixel point is an edge point.

[0048] In this embodiment, the feature image refers to a sub-image with specific important information extracted from the original image, and includes features related to the image analysis target (for example, edges, shapes, contours, etc.).

[0049] The working principle and beneficial effects of the above technical solution are: through image acquisition, denoising, grayscale processing and gradient analysis, the edge points of the package substrate can be accurately identified. The edge can be determined by deviation, the feature image can be extracted, the image processing accuracy and quality can be improved, and the substrate detection and analysis process can be optimized.

[0050] Embodiment 4: Based on the above embodiment 3, the image detection module further includes: Recognition unit: performs image matching with the feature image based on the package substrate substructure template in the expert library, and identifies and determines the substructure template corresponding to the feature image; Comparison unit: obtain any feature image, compare the feature image with the corresponding substructure template, and obtain the similarity as: ;in, Represents the similarity between the feature image and the substructure template at point (x, y), represents the feature image, Represents a substructure template, Represents the pixel point (x, y) of the feature image, Represents the pixel point of the substructure template ,u represents the lateral translation of the substructure template relative to the feature image, and v represents the longitudinal translation of the substructure template relative to the feature image. Represents the mean value of the pixel values ​​of the feature image, Represents the mean value of the pixel values ​​of the substructure template; If the mean similarity of the pixel points is less than a preset standard threshold, it is determined that there is a problem at the position of the pixel point; otherwise, it means that there is no problem at the pixel point; The comparison result of the packaging substrate constitutes the image detection result of the packaging substrate.

[0051] In this embodiment, the substructure template refers to a standard image template used to match and recognize a specific image structure.

[0052] In this embodiment, the substructure refers to a part or region on the packaging substrate that has a specific function, shape or structure, including: a conductive layer, a pad layer, a filling layer, etc.

[0053] In this embodiment, the similarity is a quantitative indicator for measuring the similarity between the feature image and the substructure template. The higher the similarity, the more similar the two are visually and structurally.

[0054] In this embodiment, the preset standard threshold The working principle and beneficial effect of the above technical solution are: through image matching and similarity comparison, the substructure template on the package substrate is identified, and the similarity between the feature image and the template is determined. If the similarity is lower than the threshold, it is determined that there is a problem, thereby improving the accuracy and automation level of substrate detection.

[0055] Embodiment 5: Based on the above embodiment 4, the electrical test module includes: Test point unit: Based on the substructure type and distribution of the package substrate, a probe is used to connect the electrical signal to any substructure of the package substrate; Signal processing unit: inputs a preset electrical signal into any substructure through a signal transmission device, and receives an output signal; Signal comparison unit: By comparing the input signal and output signal of the substructure, the signal deviation is obtained as follows: ;in, Indicates the signal deviation between the output signal and the input signal. Represents the output signal, represents the input signal, f represents the frequency, t represents the time, j represents the imaginary coefficient, Represents the preset gain weight coefficient, represents the preset phase weight coefficient, ( ) represents the phase function; If the signal deviation is greater than a preset electrical threshold, it is determined that an electrical fault exists in the substructure; All substructures of the package substrate are tested to generate electrical test results.

[0056] In this embodiment, the signal transmission device transmits an input electrical signal to a target area or substructure and receives an output signal returned from the substructure.

[0057] In this embodiment, the input signal refers to an electrical signal provided by a signal transmission device (eg, a signal generator or a signal source).

[0058] In this embodiment, the output signal refers to a signal measured from the substructure of the package substrate by a probe or other testing means. The output signal is the substructure of the package substrate after the electrical signal is input.

[0059] In this embodiment, the preset electrical signal refers to a known, specific electrical signal input into the substructure of the package substrate during the test process.

[0060] In this embodiment, the signal deviation is a metric for measuring the difference between the output signal and the input signal.

[0061] In this embodiment, the phase function is used to represent the relationship between the phase information of the signal and the change of time or frequency.

[0062] In this embodiment, the preset electrical threshold refers to a standard value used to determine whether the signal deviation exceeds an allowable range during the electrical detection process.

[0063] In this embodiment, the electrical fault includes: short circuit, open circuit, overload, etc.

[0064] The working principle and beneficial effect of the above technical solution are: by testing the input and output signals of the substructure of the package substrate, calculating the signal deviation, and judging whether there is an electrical fault. If the deviation exceeds the threshold, the substructure fault is judged, thereby improving the accuracy and efficiency of the electrical detection of the package substrate.

[0065] Embodiment 6: Based on the above embodiment 1, the thermal cycle test module includes: Thermal cycle unit: raises the temperature of the package substrate from a preset low temperature to a preset high temperature, keeps it at the preset high temperature for a period of time, and then lowers it to the preset low temperature for multiple cycles; Fatigue unit: obtain the thermal cycle result of the packaging substrate, and based on the performance parameters of the packaging substrate in each thermal cycle, obtain the fatigue degree of the packaging substrate: ;in, Indicates the fatigue degree of the package substrate after the nth thermal cycle, represents the stress variation coefficient of the nth thermal cycle, Indicates the temperature difference between the nth thermal cycle and the preset low temperature, represents the fatigue strength function; The fatigue degree of each thermal cycle of the packaging substrate is recorded to generate a thermal cycle detection result.

[0066] In this embodiment, the preset low temperature refers to the lowest temperature to which the packaging substrate is cooled during the thermal cycle.

[0067] In this embodiment, the preset high temperature refers to the highest temperature to which the packaging substrate is heated during the thermal cycle.

[0068] In this embodiment, the cycle result refers to the detection data related to the performance of the packaging substrate recorded and calculated after each thermal cycle.

[0069] In this embodiment, the performance parameters of the packaging substrate refer to the physical and mechanical properties of the packaging substrate used to evaluate and record after each thermal cycle during the thermal cycle, such as temperature change, stress change, etc.

[0070] In this embodiment, the fatigue degree is used to describe the gradual damage degree of the material of the packaging substrate caused by stress and temperature changes during multiple thermal cycles.

[0071] In this embodiment, the stress variation coefficient is a parameter describing the stress variation caused by temperature variation in a material during a thermal cycle.

[0072] In this embodiment, the fatigue strength function The working principle and beneficial effects of the above technical solution are: by simulating the thermal cycle process of the package substrate, recording the fatigue degree after each thermal cycle, and evaluating its thermal fatigue resistance. The fatigue strength is calculated by stress change and temperature difference, providing accurate thermal cycle test results, and improving the reliability evaluation of the package substrate.

[0073] Embodiment 7: Based on the above embodiment 1, the evaluation module includes: Report unit: Design the framework of the test report, input the image test results, electrical test results, and thermal cycle test results into the framework, and generate the first report; Evaluation unit: if there is a substructure fault in the image detection result or the electrical detection result, it is determined that the package substrate has a fault, and the corresponding detection failure of the package substrate is added to the first report; If the fatigue degree of the thermal cycle test result is greater than a preset fatigue threshold within a preset number of cycles, it is determined that the packaging substrate does not meet the fatigue standard, and the failure of the packaging substrate to pass the fatigue test is added to the first report to generate a second report.

[0074] In this embodiment, the framework refers to a structured template design used to integrate and present the content of the test report.

[0075] In this embodiment, the first report is a preliminary, summary report that integrates the results of image testing, electrical testing, and thermal cycling testing.

[0076] In this embodiment, the second report is a detailed data analysis report based on the first report, aiming to provide in-depth data support and analysis results of the packaging substrate inspection results.

[0077] In this embodiment, the preset number of cycles refers to a preset threshold of the number of cycles in order to test the fatigue tolerance of the packaging substrate during the thermal cycle detection process.

[0078] In this embodiment, the preset fatigue threshold refers to a standard for the maximum number of thermal cycles that the packaging substrate can withstand, which is set according to material and design requirements during thermal cycle testing.

[0079] The working principle and beneficial effect of the above technical solution are: by integrating the image, electrical and thermal cycle test results, a first report is generated to evaluate whether the package substrate meets various standards. If the test results show a failure or fatigue exceeds the standard, the report will indicate failure, and finally a second report containing all data will be generated to improve the comprehensiveness and accuracy of the test.

[0080] Embodiment 8: like Figure 2 As shown, an embodiment of the present invention provides a packaging substrate testing method, comprising: Step 1: Use a precision positioning device to place the package substrate to be tested on the test platform to obtain basic information of the package substrate; Step 2: Use image detection equipment to obtain original image information of the package substrate, and analyze to obtain image detection results; Step 3: Connect the electrical signal to the test point of the package substrate through the probe, and obtain the electrical test result based on the signal transmission; Step 4: Perform a thermal cycle test on the package substrate to detect the degree of change in the performance of the package substrate and obtain a thermal cycle test result; Step 5: Generate a detailed test report that includes the results of each test and whether it passed or failed.

[0081] The working principle and beneficial effects of the above technical solution are: through precise positioning, image detection, electrical signal transmission and thermal cycle testing, the performance of the package substrate is comprehensively evaluated. Finally, a test report is generated to ensure that the substrate quality meets the requirements, improve test efficiency and accuracy, and ensure product reliability.

[0082] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A packaging substrate testing device, characterized in that: include: Preparation module: Use a precise positioning device to place the package substrate to be tested on the test platform and obtain basic information of the package substrate; Image detection module: Use image detection equipment to obtain the original image information of the packaging substrate and analyze it to obtain the image detection results; Electrical test module: connects the electrical signal to the test point of the package substrate through the probe, and obtains the electrical test result based on the signal transmission; Thermal cycle test module: Through thermal cycle test on the package substrate, the performance change degree of the package substrate is detected and the thermal cycle test result is obtained; Evaluation Module: Generates a detailed test report that includes the results of each test and whether it passed or failed.

2. A packaging substrate testing device according to claim 1, characterized in that: The preparation module comprises: Calibration unit: select any package substrate as the target to be measured, calibrate the precision positioning device, and set the maximum working range of the precision positioning device according to the factory size of the package substrate; Positioning unit: Use a precision positioning device in conjunction with an automated gripping system to take out the package substrate from the storage location, perform preliminary positioning of the package substrate according to the pin position of the package substrate, input preliminary positioning parameters of the package substrate through the control system of the positioning device, and accurately control the position of the substrate until the substrate is fully aligned with the test platform; Basic information acquisition unit: Use a precision positioning device in conjunction with a laser measurement system to obtain basic information about the package substrate.

3. The packaging substrate testing device according to claim 1, characterized in that: The image detection module comprises: Image acquisition unit: Based on the precise positioning device combined with the image detection equipment, the original image of the packaging substrate is acquired; Image processing: using a Gaussian filter to perform denoising on the original image to obtain a first image, and performing grayscale processing on the first image to obtain a second image; Image analysis module: Get the gradient matrix of any pixel point in the second image as: ;in, Represents the gradient matrix of the pixel point (x, y), represents the gradient of the pixel in the x direction, Represents the gradient of the pixel in the y direction; The deviation of the pixel point obtained by the response function is: ;in, represents the deviation of the pixel point, represents the determinant function, represents the determinant of the gradient matrix, represents the coefficient of variation, represents the trace function, represents the trace of the gradient matrix; If the deviation of the pixel point is greater than a preset deviation, the pixel point is determined to be an edge point, all edge points of the second image are acquired, and a plurality of feature images surrounded by the edge points are acquired.

4. A packaging substrate testing device according to claim 3, characterized in that: The image detection module further includes: Recognition unit: performs image matching with the feature image based on the package substrate substructure template in the expert library, and identifies and determines the substructure template corresponding to the feature image; Comparison unit: obtain any feature image, compare the feature image with the corresponding substructure template, and obtain the similarity as: ;in, Represents the similarity between the feature image and the substructure template at point (x, y), represents the feature image, Represents a substructure template, Represents the pixel point (x, y) of the feature image, Represents the pixel point of the substructure template ,u represents the lateral translation of the substructure template relative to the feature image, and v represents the longitudinal translation of the substructure template relative to the feature image. Represents the mean value of the pixel values ​​of the feature image, Represents the mean value of the pixel values ​​of the substructure template; If the mean similarity of the pixel points is less than a preset standard threshold, it is determined that there is a problem at the position of the pixel point; otherwise, it means that there is no problem at the pixel point; The comparison result of the packaging substrate constitutes the image detection result of the packaging substrate.

5. The packaging substrate testing device according to claim 4, characterized in that: The electrical test module comprises: Test point unit: Based on the substructure type and distribution of the package substrate, a probe is used to connect the electrical signal to any substructure of the package substrate; Signal processing unit: inputs a preset electrical signal into any substructure through a signal transmission device, and receives an output signal; Signal comparison unit: By comparing the input signal and the output signal of the substructure, the signal deviation is obtained as follows: ;in, Indicates the signal deviation between the output signal and the input signal. Represents the output signal, represents the input signal, f represents the frequency, t represents the time, j represents the imaginary coefficient, Represents the preset gain weight coefficient, represents the preset phase weight coefficient, ( ) represents the phase function; If the signal deviation is greater than a preset electrical threshold, it is determined that an electrical fault exists in the substructure; All substructures of the package substrate are tested to generate electrical test results.

6. The packaging substrate testing device according to claim 1, characterized in that: The thermal cycle test module comprises: Thermal cycle unit: raises the temperature of the package substrate from a preset low temperature to a preset high temperature, keeps it at the preset high temperature for a period of time, and then lowers it to the preset low temperature for multiple cycles; Fatigue unit: obtain the thermal cycle result of the packaging substrate, and based on the performance parameters of the packaging substrate in each thermal cycle, obtain the fatigue degree of the packaging substrate: ;in, Indicates the fatigue degree of the package substrate after the nth thermal cycle, represents the stress variation coefficient of the nth thermal cycle, Indicates the temperature difference between the nth thermal cycle and the preset low temperature, represents the fatigue strength function; The fatigue degree of each thermal cycle of the packaging substrate is recorded to generate a thermal cycle detection result.

7. The packaging substrate testing device according to claim 1, characterized in that: The evaluation module comprises: Report unit: Design the framework of the test report, input the image test results, electrical test results, and thermal cycle test results into the framework, and generate the first report; Evaluation unit: if there is a substructure fault in the image detection result or the electrical detection result, it is determined that the package substrate has a fault, and the corresponding detection failure of the package substrate is added to the first report; If the fatigue degree of the thermal cycle test result is greater than a preset fatigue threshold within a preset number of cycles, it is determined that the packaging substrate does not meet the fatigue standard, and the failure of the packaging substrate to pass the fatigue test is added to the first report to generate a second report.

8. A packaging substrate testing method, applied to a packaging substrate testing device as claimed in any one of claims 1 to 7, characterized in that: include: Step 1: Use a precision positioning device to place the package substrate to be tested on the test platform to obtain basic information of the package substrate; Step 2: Use image detection equipment to obtain original image information of the package substrate, and analyze to obtain image detection results; Step 3: Connect the electrical signal to the test point of the package substrate through the probe, and obtain the electrical test result based on the signal transmission; Step 4: Perform a thermal cycle test on the package substrate to detect the degree of change in the performance of the package substrate and obtain a thermal cycle test result; Step 5: Generate a detailed test report that includes the results of each test and whether it passed or failed.

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