Display module, preparation method of display module and display device

Abstract

The invention discloses a display module, a display module preparation method and a display device, and the display module comprises a display panel which comprises a display part, a bending part and a connecting part, and the bending part is connected with the display part and the connecting part; the cover plate assembly comprises a cover plate body and a fixing part and participates in defining a first accommodating space; the circuit board assembly is electrically connected with the connecting part; the protection assembly comprises a first protection structure and a second protection structure, the first protection structure is at least located on one side of the bending part, the second protection structure covers the first protection structure, part of the second protection structure extends and fills the first containing space, and part of the second protection structure extends to the position of the connecting part. According to the display module provided by the embodiment of the first aspect, the second protection structure is further arranged at the position of the bending part on the basis of the first protection structure, the performance of the position of the bending part is enhanced, meanwhile, the size of the second protection structure is limited through an existing structure of the display module, and the difficulty and cost can be reduced.

Description

Technical Field

[0001] The present invention relates to the field of display technology, and in particular to a display module, a method for preparing the display module, and a display device. Background Art

[0002] With the development of display technology, people have higher and higher requirements for narrow-border screens. Among them, since a large number of circuits and cables are integrated at the bottom border of the screen, narrowing the bottom border is the most difficult. The existing process requires that part of the display panel at the bottom border be bent 180° toward the backlight side, and the bending of the display panel will produce a semi-arc structure. In order to improve the mechanical properties and electrical protection performance at the position of the semi-arc structure, a thin layer of protective glue is generally applied on the surface of the display panel. However, due to the limited thickness of the protective glue, there is still the problem of the protective glue layer falling off in the subsequent extrusion test, and the semi-arc structure being injured by the static electricity released by the electrostatic discharge circuit in the electrostatic test. Summary of the invention

[0003] The embodiments of the present application provide a display module, a method for preparing the display module, and a display device, which can effectively enhance the mechanical properties and electrical protection performance at the bending portion.

[0004] In the first aspect, an embodiment of the present application provides a display module, including a back panel assembly, a display panel, a cover panel assembly, a circuit board assembly and a protective assembly, the back panel assembly including a first surface and a second surface arranged opposite to each other in a thickness direction; the display panel includes a display portion, a bending portion and a connecting portion, the display portion is arranged on the first surface, the connecting portion is arranged on the second surface, and the bending portion connects the display portion and the connecting portion; the cover panel assembly is arranged on one side of the first surface, the cover panel assembly includes a cover panel body and a fixing portion attached to one side of the cover panel body, the cover panel body, the fixing portion, the display portion and the bending portion participate in defining a first accommodating space; the circuit board assembly is arranged on one side of the second surface and is electrically connected to the connecting portion; the protective assembly includes a first protective structure and a second protective structure, the first protective structure is at least located on a side of the bending portion away from the back panel assembly, the second protective structure covers the first protective structure, and a portion of the second protective structure extends and fills the first accommodating space, and a portion of the second protective structure extends to the position of the connecting portion.

[0005] The display module provided by the first aspect embodiment of the present application is further provided with a second protective structure at the bending portion on the basis of the first protective structure, so as to enhance the mechanical properties and electrical protection performance at the bending portion, and at the same time, utilize the existing structure of the display module to limit the size of the second protective structure. The shape of the second protective structure can be flexibly adjusted, and the error value within the allowable range of the process is increased, which is conducive to reducing the difficulty and cost of forming the second protective structure.

[0006] In a second aspect, based on the same inventive concept, an embodiment of the present application provides a method for preparing a display module, comprising:

[0007] A prefabricated module is provided, the prefabricated module comprising a back panel assembly, a display panel and a first protective structure, the display panel comprising a display portion, a bending portion and a connecting portion, the back panel assembly comprising a first surface and a second surface arranged opposite to each other in a thickness direction, the first protective structure covers a side of the display panel away from the back panel assembly, the display portion is arranged on the first surface, the connecting portion is arranged on the second surface, and the bending portion is bent on one side of the back panel assembly to connect the display portion and the connecting portion;

[0008] A cover assembly is formed on one side of the first surface, the cover assembly includes a cover body and a fixing portion, the fixing portion and the cover body are sequentially attached to one side of the first surface, and the cover body, the fixing portion, the display portion and the bending portion participate in defining a first accommodation space;

[0009] A circuit board assembly is formed on one side of the second surface, and the circuit board assembly is electrically connected to the connecting portion, the circuit board assembly includes a circuit board and a binding member, the binding member includes a strap and a stopper, a circuit board is arranged on one side of the second surface, the strap passes over the circuit board and is attached to opposite sides of the circuit board, the strap is arranged beyond the back plate assembly on one side of the back plate assembly, the strap, the connecting portion and the bending portion participate in defining a second accommodation space, and / or, the stopper is attached, part of the stopper is arranged beyond the back plate assembly on one side of the back plate assembly, the stopper, the connecting portion and the bending portion participate in defining the second accommodation space;

[0010] In the first accommodating space, a second protective structure is formed on the first protective structure and in the second accommodating space, and the second protective structure partially filled in the second accommodating space extends to the position of the connecting portion.

[0011] In the third aspect, based on the same inventive concept, an embodiment of the present application provides a display device, including a display module provided by any embodiment of the first aspect of the present application, or a display module prepared by the preparation method of the display module provided by any embodiment of the second aspect of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] Features, advantages, and technical effects of exemplary embodiments of the present invention will be described below with reference to the accompanying drawings.

[0013] Figure 1 It is a schematic diagram of the overall structure of a display panel and its cross-sectional structure along the AA direction provided by the related technology;

[0014] Figure 2 It is a schematic diagram of the overall structure of another display panel and the cross-sectional structure along the BB direction provided by the related art;

[0015] Figure 3is a schematic diagram of the overall structure of a display panel provided by an embodiment of the first aspect of the present application;

[0016] Figure 4 yes Figure 3 A schematic diagram of a cross-sectional structure along the CC direction;

[0017] Figure 5 yes Figure 3 Another schematic diagram of the cross-sectional structure along the CC direction;

[0018] Figure 6 is a schematic diagram of the overall structure of another display panel provided by an embodiment of the first aspect of the present application;

[0019] Figure 7a yes Figure 6 Another schematic diagram of the cross-sectional structure along the DD direction;

[0020] Figure 7b yes Figure 6 Another schematic diagram of the cross-sectional structure along the DD direction;

[0021] Figure 8 yes Figure 3 Another schematic diagram of the cross-sectional structure along the CC direction;

[0022] Fig. 9 is another schematic diagram of a cross-sectional structure along the CC direction in FIG7 ;

[0023] Fig.10 is another schematic diagram of a cross-sectional structure along the CC direction in FIG7 ;

[0024] Fig.11 yes Figure 4 Schematic diagram of the enlarged structure of the middle E region;

[0025] Fig.12 yes Figure 4 Another enlarged structural diagram of the E region in the middle;

[0026] Fig.13 is a flowchart of the steps of a method for preparing a display module provided in an embodiment of the second aspect of the present application;

[0027] Fig.14 is a flowchart of another method for preparing a display module provided by an embodiment of the second aspect of the present application;

[0028] Fig.15 is a flowchart of another method for preparing a display module provided by an embodiment of the second aspect of the present application;

[0029] Fig.16 is a flowchart of another method for preparing a display module provided by an embodiment of the second aspect of the present application;

[0030] Figures 17a to 17e It is a process step diagram of a method for preparing a display module provided in an embodiment of the second aspect of the present application;

[0031] Figures 18a to 18f is a process step diagram of another method for preparing a display module provided by an embodiment of the second aspect of the present application;

[0032] Figures 19a to 19f is a process step diagram of another method for preparing a display module provided by an embodiment of the second aspect of the present application;

[0033] Figures 20a to 20f is a process step diagram of another method for preparing a display module provided by an embodiment of the second aspect of the present application;

[0034] Figures 21a to 21d is a process step diagram of another method for preparing a display module provided by an embodiment of the second aspect of the present application;

[0035] Figures 22a to 22d is a process step diagram of another method for preparing a display module provided by an embodiment of the second aspect of the present application;

[0036] Fig.23 It is a schematic diagram of the overall structure of a display device provided in an embodiment of the third aspect of the present application.

[0037] Reference numerals:

[0038] 100-display module; 100'-prefabricated module;

[0039] 10-back panel assembly; 10a-first surface; 10b-second surface; 10c-first side surface; 10d-second side surface;

[0040] 20-display panel; 21-display portion; 22-bending portion; 23-connecting portion; 24-polarizer layer;

[0041] 30-cover plate assembly; 31-cover plate body; 32-fixing part;

[0042] 40-circuit board assembly; 41-circuit board; 42-binding member; 42a-binding strap; 42b-limiting member; 421-first spacing portion; 422-second spacing portion; 423-stiffening section; 424-supporting portion; 425-first limiting portion; 426-second limiting portion;

[0043] 50-protection assembly; 51-first protection structure; 52-second protection structure;

[0044] S1-first storage space; S2-second storage space;

[0045] D1-first preset distance; D2-second preset distance; D3-third preset distance;

[0046] Z-thickness direction; H-plane direction;

[0047] 200-display device.

[0048] In the drawings, the same reference numerals are used for the same components. The drawings are not drawn to scale. DETAILED DESCRIPTION

[0049] The features and exemplary embodiments of various aspects of the present invention will be described in detail below. In the detailed description below, many specific details are proposed in order to provide a comprehensive understanding of the present invention. However, it is obvious to those skilled in the art that the present invention can be implemented without some of these specific details. The following description of the embodiments is only to provide a better understanding of the present invention by illustrating examples of the present invention. In the drawings and the following description, at least part of the known structures and technologies are not shown in order to avoid unnecessary ambiguity of the present invention; and, for clarity, the size of some structures may be exaggerated. In addition, the features, structures or characteristics described below may be combined in one or more embodiments in any suitable manner.

[0050] The directional words appearing in the following description are all directions shown in the figures, and do not limit the specific structure of the display module and display device of the present invention. In the description of the present invention, it should also be noted that, unless otherwise clearly specified and limited, the terms "installation" and "connection" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be directly connected or indirectly connected. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to the specific circumstances.

[0051] It is obvious to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit or scope of the present invention. Therefore, the present invention is intended to cover modifications and variations of the present invention that fall within the scope of the corresponding claims (technical solutions claimed for protection) and their equivalents. It should be noted that the implementation methods provided in the embodiments of the present invention can be combined with each other without contradiction.

[0052] Figure 1 The figure shows the overall structure of a display panel provided by the related art and the cross-sectional structure along the AA direction. Figure 2 The overall structure of another display panel provided by the related art and the cross-sectional structure along the BB direction are shown.

[0053] In related technologies, in order to meet the growing demand for full-screen displays, the industry has gradually developed extremely narrow bezels, with narrowing the lower bezel as the core technology. Since the lower bezel is integrated with a large number of circuit traces and the extended wires that electrically connect the screen and the control chip (Integrated Circuit, IC), narrowing the lower bezel is the most difficult. In related technologies, the latest developed lower bezel screen bending technology (Chip On Panel, COP) is a new technology.

[0054] The COP process requires that the non-display portion of the screen near the bottom frame be bent 180° to the backlight side of the screen, and the display panel is bent at the bottom frame to form a semi-circular arc structure. Since the structure at the bending position is relatively fragile, the semi-circular arc structure at the bending position has poor reliability during the bending process and in the mechanical extrusion test and electrostatic test after the bending.

[0055] See also Figure 1 One solution in the related art is to first apply a layer of border protective glue (Border Protective Layer, BPL) near the bending position of the display panel. The border protective glue can not only play the role of dust, water and oil resistance, but also further improve the reliability of the screen bending at this point, as well as further improve the mechanical anti-extrusion performance and electrical protection performance in the subsequent mechanical extrusion test and electrostatic test after bending.

[0056] However, when adopting the BPL solution, it is difficult to ensure that the thickness of the BPL does not exceed the thickness of the polarizer (POL) on the polarizer side of the screen when applying the frame protection glue at the bending position with the current glue coating process.

[0057] Under the existing glue coating process, BPL will overflow to the surface of POL. When the cover assembly is attached to the POL surface in the subsequent process, part of the BPL that overflows to the POL surface will come into contact with the transparent optical adhesive (Optical Clear Adhesive, OCA) used for bonding and bulge out inside the OCA, causing air entrapment problems, resulting in frequent defects of bubbles inside the OCA, affecting the performance of the final product.

[0058] See also Figure 2 In order to solve the problems existing in the above solutions, eliminate the frequent defects of bubbles caused by the BPL solution and further protect the semi-arc structure at the bending position, the industry has further developed a solution to omit the border protective glue (BPL Skip), canceling the BPL glue coating and directly attaching a thin organic protective film layer on the top of the screen. At the same time, the holes in the semi-arc structure formed at the bending position are filled with inner sealing glue.

[0059] Among them, in addition to setting a clearance area on the light-emitting side of the screen so that the setting of the organic protective film layer does not affect the light-emitting effect of the screen, the organic protective film layer adheres to other areas of the screen. The setting of the organic protective film layer and the inner sealing glue can also achieve the improvement of the reliability of the screen bending here and the further improvement of the mechanical anti-extrusion performance and electrical protection performance in the subsequent mechanical extrusion test and electrostatic test after bending.

[0060] However, under the stacking thickness limit of the entire display module, the thickness of the organic protective film layer used in the BPL Skip solution is limited, and the thickness of the organic protective film layer is generally set within 3μm. Under the premise that the thickness of the organic protective film layer is thin, the modulus of the organic protective film layer is less than 10Mpa, while the modulus of the frame protective glue in the BPL solution is not less than 210Mpa after curing. The organic protective film layer in the BPLSkip solution is more brittle than the frame protective glue in the BPL solution.

[0061] Therefore, the organic protective film layer is relatively brittle, so there is a performance problem that the organic protective film layer is easy to break and fall off in the subsequent frame extrusion test; at the same time, the organic protective film layer is relatively thin, so there is a performance problem that it is easily broken down by the static electricity released by the electrostatic discharge circuit in the electrostatic test, resulting in the problem of electrical components of the semi-circular arc structure at the bending position being broken down by static electricity. The BPL Skip solution still has the problem of poor reliability in the subsequent mechanical extrusion test after bending and the electrostatic test.

[0062] In order to further solve the above-mentioned technical problems and technical considerations, the embodiments of the present application provide a display module, a method for preparing a display module and a display device.

[0063] Figure 3 The overall structure of the display panel 20 provided by the first embodiment of the present application is shown. Figure 4 Shows Figure 3 A cross-sectional structure along the CC direction.

[0064] See also Figure 3 and Figure 4 In a first aspect, an embodiment of the present application provides a display module 100 , including a back panel assembly 10 , a display panel 20 , a cover panel assembly 30 , a circuit board assembly 40 and a protective assembly 50 .

[0065] The back plate assembly 10 includes a first surface 10 a and a second surface 10 b disposed opposite to each other in the thickness direction Z.

[0066] The display panel 20 includes a display portion 21 , a bending portion 22 and a connecting portion 23 . The display portion 21 is disposed on the first surface 10 a , the connecting portion 23 is disposed on the second surface 10 b , and the bending portion 22 connects the display portion 21 and the connecting portion 23 .

[0067] The cover assembly 30 is disposed on one side of the first surface 10a. The cover assembly 30 includes a cover body 31 and a fixing portion 32 attached to one side of the cover body 31. The cover body 31, the fixing portion 32, the display portion 21 and the bending portion 22 participate in defining a first accommodating space S1.

[0068] The circuit board assembly 40 is disposed on one side of the second surface 10 b and is electrically connected to the connecting portion 23 .

[0069] The protective assembly 50 includes a first protective structure 51 and a second protective structure 52. The first protective structure 51 is located at least on the side of the bending portion 22 away from the back panel assembly 10. The second protective structure 52 covers the first protective structure 51, and part of the second protective structure 52 extends and fills the first accommodating space S1, and part of the second protective structure 52 extends to the position of the connecting portion 23.

[0070] On the one hand, the display module 100 provided in the embodiment of the present application is further provided with a second protective structure 52 at the position of the bending portion 22 on the basis of the first protective structure 51, so as to enhance the mechanical properties and electrical protection performance at the position of the bending portion 22, and at the same time, utilize the existing structure of the display module 100 to limit the size of the second protective structure 52. The shape of the second protective structure 52 can be flexibly adjusted, and the error value within the allowable range of the process is increased, which is conducive to reducing the difficulty and cost of forming the second protective structure 52.

[0071] There are many ways to set the backplane assembly 10. The backplane assembly 10 may include a super clean foam layer (SCF), multiple backplanes and support layers arranged on both sides of the SCF layer. The SCF layer is mainly composed of a three-layer structure of foam, graphite and copper foil. The SCF layer mainly plays a role in supporting and resisting impact. The support layer and other film layers such as the backplane are stacked on the substrate in sequence. The stacking arrangement mentioned here means that the other film layers are arranged in sequence along the thickness direction Z of the substrate.

[0072] The SCF layer may also include a variety of film layer structures, and the embodiments of the present application do not limit the specific film layer structure composition in the SCF layer.

[0073] The display panel 20, the cover plate assembly 30 and the circuit board assembly 40 are all arranged on one side of the first surface 10a or the second surface 10b. The back plate assembly 10 has a first surface 10a and a second surface 10b arranged opposite to each other along the thickness direction Z. Therefore, the thickness direction Z of the display panel 20, the cover plate assembly 30 and the circuit board assembly 40 is the same as the thickness direction Z of the back plate assembly 10, and the display panel 20, the cover plate assembly 30 and the circuit board assembly 40 are also arranged along the thickness direction Z.

[0074] The thickness direction Z of other film layers such as the support layer and the backplane located on one side of the SCF layer is usually consistent with the thickness direction Z of the SCF layer itself, and the thickness direction Z of the display panel 20, the cover plate assembly 30 and the circuit board assembly 40 arranged on the backplane assembly 10 is also consistent with the thickness direction Z of the SCF layer itself. Therefore, for the convenience of description, the thickness directions Z of other different film layers mentioned later in the embodiments of the present application are all in the same direction.

[0075] The display panel 20 is a functional device that plays a major display role in the display module 100. On one side of the back panel assembly 10, exemplarily, at the position of the lower frame, the connection portion 23 of the display panel 20 is bent to the second surface 10b of the back panel assembly 10, and the bent portion 22 connects the display portion 21 located on the first surface 10a and the connection portion 23 located on the second surface 10b. The bent portion 22 can form a semicircular arc structure on one side of the back panel assembly 10.

[0076] Exemplarily, the cover body 31 in the cover assembly 30 generally includes a protective film layer covering the outermost layer and an ultra-thin glass (UTG) indented in the protective film layer. The indented setting of the UTG serves to prevent the edge of the UTG from being easily cracked due to being too thin. The fixing portion 32 is a structure that fixes the cover body 31 to the display panel 20. The fixing portion 32 is adapted to the size of the UTG. Therefore, the cover assembly 30 is arranged on one side of the first surface 10a. The cover body 31, the fixing portion 32 and the bending portion 22 can participate in defining the first accommodating space S1.

[0077] Exemplarily, the fixing portion 32 is OCA transparent optical adhesive.

[0078] Exemplarily, the display panel 20 is further provided with a polarizer layer 24 above the display portion 21 on one side of the first surface 10a, so the cover body 31, the fixing portion 32, the polarizer layer 24 and the bending portion 22 can further also participate in defining the first accommodating space S1.

[0079] Exemplarily, the cover assembly 30 is arranged on one side of the first surface 10a, and the cover body 31 in the cover assembly 30 is arranged on the side of the display panel 20 where the bending portion 22 is provided. Exemplarily, it is arranged beyond the back panel assembly 10 at the position of the lower frame, thereby forming a first accommodating space S1 on one side of the back panel assembly 10 in which the cover body 31 and the bending portion 22 on both sides are protruding and the fixing portion 32 is recessed.

[0080] The first accommodating space S1 is more obvious because the cover body 31 is disposed beyond the backplane assembly 10 on one side of the backplane assembly 10. In fact, the first aspect embodiment of the present application does not limit the positional relationship between the cover body 31 and the backplane assembly 10 on one side of the backplane assembly 10. The cover body 31 can be disposed beyond the backplane assembly 10 on one side of the backplane assembly 10, or can be flush with the backplane assembly 10 on one side of the backplane assembly 10, or can be retracted into the backplane assembly 10 on one side of the backplane assembly 10.

[0081] The main function of the circuit board assembly 40 is to control the light-emitting function of the display panel 20. After the circuit board assembly 40 is electrically connected to the connecting portion 23 bent to the second surface 10b, the light-emitting function of the light-emitting device inside the display portion 21 located on the first surface 10a can be controlled, and different instructions can be sent to achieve the required light-emitting function. It should be noted that the display portion includes a display area and a non-display area.

[0082] In addition to the first protective structure 51 that is located at least on one side of the bending portion 22 before the bending portion 22 is bent to form a semi-circular arc structure, the protective component 50 is also provided with a second protective structure 52 at the bending portion 22 that forms a semi-circular arc structure after bending, so as to further enhance the mechanical properties and electrical protection performance at the bending portion 22.

[0083] Exemplarily, the first protective structure 51 is an organic protective film layer. Since the first protective structure 51 is relatively thin, when the organic protective film layer is coated at the bending portion 22 before bending, there is a low risk that the thickness of the first protective structure 51 exceeds the thickness of the polarizer layer 24. The first protective structure 51 can effectively protect the bending portion 22 when it is bent. When the cover plate assembly 30 is subsequently provided, air entrapment problems can also be avoided between the fixing portion 32 and the polarizer layer 24, thereby reducing the risk of frequent bubble problems.

[0084] Exemplarily, the protective component 50 may also include an inner sealing glue arranged in the inner cavity of the semicircular arc structure formed by the bending portion 22, which can protect the bending portion 22 on both opposite sides of the bending portion 22, and further provide effective protection for the bending portion 22 when it is bent.

[0085] The second protective structure 52 covers the first protective structure 51. It should be understood that after the display panel 20 is bent and the cover body 31 is set on the first surface 10a of the back panel assembly 10, the second protective structure 52 at least covers the first protective structure 51 set at the position of the bent portion 22 to protect the bent portion 22. The setting of the second protective structure 52 can further protect the bent portion 22. The first protective structure 51 is thin and brittle on the side of the bent portion 22, which has the problem of poor reliability in subsequent tests. This type of problem has a lower risk of occurrence after the second protective structure 52 is set.

[0086] At the same time, the boundary and shape size of the second protective structure 52 utilize the first accommodating space S1 and other partial structures formed by the existing structure to achieve the limitation of the second protective structure 52 on both sides of the first surface 10a and the second surface 10b, which can effectively increase the allowable error range value in the production process and reduce the difficulty and cost of forming the second protective structure 52.

[0087] In the first accommodation space S1 formed by the existing structure, part of the second protection structure 52 on one side of the first surface 10 a can only extend and fill the first accommodation space S1 .

[0088] A portion of the second protective structure 52 is limited by the existing structure or a portion of the auxiliary structure, and can only extend to the position of the connecting portion 23 on one side of the second surface 10b. The specific arrangement of the second protective structure 52 on one side of the second surface 10b will be further elaborated in other embodiments of the first aspect of the present application and embodiments of the second aspect of the present application.

[0089] Please continue reading Figure 3 and Figure 4 In some embodiments, the circuit board assembly 40 includes a circuit board 41 and a binding member 42. The binding member 42 is arranged on one side of the backplane assembly 10 and partially exceeds the backplane assembly 10. The binding member 42, the connecting portion 23 and the bending portion 22 participate in defining a second accommodating space S2. The second protective structure 52 extends and fills the second accommodating space S2.

[0090] In these embodiments, the binding member 42 forms a second accommodating space S2 on one side of the second surface 10b, so that the second protective structure 52 can only extend to and fill the second accommodating space S2 on one side of the second surface 10b, thereby limiting the second protective structure 52 on one side of the second surface 10b when forming the second protective structure 52, further effectively increasing the allowable error range value in the production process, and reducing the difficulty and cost of forming the second protective structure 52.

[0091] Exemplarily, the circuit board 41 is a circuit board where the control chip IC is located.

[0092] Please continue reading Figure 3 and Figure 4 In some embodiments, the binding member 42 includes a strap 42a, which is attached to the side of the circuit board 41 away from the second surface 10b, and the strap 42a extends and exceeds the opposite sides of the circuit board 41 and is bonded and fixed to the connecting portion 23. The strap 42a is arranged on one side of the backplane assembly 10 partially beyond the backplane assembly 10. The strap 42a, the connecting portion 23 and the bending portion 22 participate in defining the second accommodating space S2, and the second protective structure 52 extends and fills the second accommodating space S2.

[0093] In these embodiments, in addition to being used to fix the circuit board 41, the strap 42a is disposed partially beyond the backplane assembly 10 on one side of the backplane assembly 10, and a second accommodating space S2 can be formed using the existing structure, thereby further achieving positioning of the second protective structure 52 on one side of the second surface 10b when the second protective structure 52 is formed, further effectively increasing the allowable error range value in the production process, and reducing the difficulty and cost of forming the second protective structure 52.

[0094] Exemplarily, the binding tape 42a is an electrical tape having good insulation properties.

[0095] Figure 5 Shows Figure 3 Another cross-sectional structure along the CC direction.

[0096] See also Figure 5 In some embodiments, the strap 42a also includes a stiff section 423, which is disposed on one side of the backplane assembly 10 and extends beyond the backplane assembly 10. The stiff section 423, the connecting portion 23, and the bending portion 22 participate in defining a second accommodating space S2, and the second protective structure 52 extends and fills the second accommodating space S2.

[0097] In these embodiments, the provision of the stiff section 423 can more conveniently realize the formation of the second accommodating space S2 by utilizing the structure of the strap 42a itself, so that the existing structure used to form the second accommodating space S2 is not easily deformed, and further realizes the limitation of the second protective structure 52 on one side of the second surface 10b when forming the second protective structure 52, further effectively increases the allowable error range value in the production process, and reduces the difficulty and cost of forming the second protective structure 52.

[0098] The stiff section 423 should be understood as a part of the structure of the strap 42a close to the back panel assembly 10 having stronger stiffness, and an external force applied to a part of the structure of the strap 42a close to the back panel assembly 10 and perpendicular to the surface of this part makes it difficult for the strap 42a to deform to the sides.

[0099] The provision of the stiff section 423 makes the formation of the second accommodating space S2 more stable, and is more conducive to limiting the position of the second protective structure 52 on one side of the second surface 10 b.

[0100] In some embodiments, the stiff segment 423 includes a glass fiber material or a polyester fiber material, which can realize the basic function of the binding strap 42a while having greater stiffness.

[0101] Figure 6 The overall structure of another display panel 20 provided by the first embodiment of the present application is shown. Figure 7a Shows Figure 6 Another cross-sectional structure along the DD direction, Figure 7b Shows Figure 6 Another cross-sectional structure along the DD direction.

[0102] See also Figure 6 and Figures 7a to 7b In some embodiments, the binding member 42 further includes a first spacer 421, which is disposed between the stiff segment 423 and the connecting portion 23, and the connecting portion 23, the stiff segment 423, the first spacer 421 and the bent portion 22 participate in defining a second accommodation space S2, and the second protective structure 52 extends and fills the second accommodation space S2;

[0103] Alternatively, the first spacer 421 is disposed between the strap 42a and the connecting portion 23, the connecting portion 23, the strap 42a, the first spacer 421 and the bent portion 22 participate in defining the second accommodating space S2, and the second protective structure 52 extends and fills the second accommodating space S2.

[0104] In these embodiments, the provision of the first spacer 421 can further increase the effective volume of the second accommodating space S2, prevent the problem of overflow caused by excessive glue when forming the second protective structure 52, further effectively increase the allowable error range value in the production process, and reduce the difficulty and cost of forming the second protective structure 52.

[0105] Please continue reading Figure 7a and Figure 7b In some embodiments, the dimension of the first spacer 421 along the thickness direction Z is consistent with the dimension of one end of the second protective structure 52 extending to the second accommodating space S2 along the thickness direction Z.

[0106] In these embodiments, the provision of the first spacer 421 can control the dimension of the second protective structure 52 extending from one side of the second surface 10b to one end in the second accommodating space S2 along the thickness direction Z, further achieving partial size and shape control of the second protective structure 52.

[0107] In some embodiments, the first spacer 421 includes a foam material. The foam material is light and elastic, has the characteristic of rapid fixing by setting a pressure-sensitive adhesive, and has excellent characteristics such as being able to effectively resist electrochemical corrosion in an environment with many electronic components.

[0108] See also Figure 4 and Figure 5 In some embodiments, the planar direction H is parallel to the plane of the backplane assembly 10, and a first preset distance D1 is set between the stiff section 423 or the strap 42a and the arc top of the bending portion 22 along the planar direction H, and the planar direction H intersects with the thickness direction Z.

[0109] In these embodiments, by controlling the first preset distance D1, the distance between the stiff section 423 or one end of the strap 42a and the arc top of the bending portion 22 is controlled, which can further increase the effective volume of the second accommodating space S2, prevent the problem of overflow caused by excessive glue when forming the second protective structure 52, further effectively increase the allowable error range value in the production process, and reduce the difficulty and cost of forming the second protective structure 52.

[0110] The plane direction H should be understood as any direction parallel to the plane where the backplane assembly 10 is located. Therefore, the plane direction H must intersect with the thickness direction Z.

[0111] Figure 8 Shows Figure 3 Another cross-sectional structure along the CC direction, Fig. 9 Shows Figure 3 Another cross-sectional structure along the CC direction.

[0112] See also Figures 8 to 9 In some embodiments, the circuit board assembly 40 includes a circuit board 41 and a binding member 42, the binding member 42 includes a binding band 42a, the binding band 42a is attached to the side of the circuit board 41 away from the second surface 10b, and the binding band 42a extends and exceeds the opposite sides of the circuit board 41 to be bonded and fixed to the connecting portion 23, the plane direction H is a direction parallel to the plane of the backplane assembly 10, the second protective structure 52 extends to the end of the binding band 42a close to the bending portion 22, and a second preset distance D2 is set between the second protective structure 52 and the binding band 42a along the plane direction H, and the plane direction H intersects with the thickness direction Z;

[0113] Alternatively, the second protective structure 52 extends and covers one end of the strap 42a near the bending portion 22, and the second protective structure 52 extends from the end of the strap 42a near the bending portion 22 to the connecting portion 23 along the planar direction H with a third preset distance D3, and the planar direction H intersects with the thickness direction Z.

[0114] In these embodiments, due to the provision of other auxiliary structures, the positional relationship between the extension position of the second protective structure 52 on one side of the second surface 10b and the strap 42a can be adjusted at any time, and a second preset distance D2 can be set between the second protective structure 52 and the strap 42a. The second protective structure 52 can also cover the strap 42a and extend with a third preset distance D3, which can be adjusted at any time according to actual needs to further achieve partial size and shape control of the second protective structure 52.

[0115] Fig.10 Shows Figure 3 Another cross-sectional structure along the CC direction.

[0116] See also Fig.10In some embodiments, the second preset distance D2 or the third preset distance D3 is 0, and the second protective structure 52 abuts against the binding strap 42a.

[0117] In these embodiments, the second protective structure 52 is actually in contact with the binding belt 42 a , and the binding belt 42 a also partially participates in limiting the position of the second protective structure 52 .

[0118] Fig.11 Shows Figure 3 The enlarged structure of the E region in the middle.

[0119] See also Fig.11 In some embodiments, the second protective structure 52 extends along the display portion 21 in the first accommodating space S1 to a side of the fixing portion 32 close to the display portion 21 .

[0120] In these embodiments, the second protective structure 52 is arranged in the first accommodating space S1 and can only extend along the display portion 21 to the side of the fixed portion 32 close to the display portion 21, which can prevent the second protective structure 52 from extending between the fixed portion 32 and the display portion 21, avoid the problem of trapped air, and further avoid the formation of edge bubble defects.

[0121] Fig.12 Shows Figure 3 Another enlarged structure of the middle E area.

[0122] See also Fig.12 In some embodiments, the second protective structure 52 extends in the first accommodation space S1 and covers at least a portion of the side of the fixing portion 32 .

[0123] In these embodiments, the second protective structure 52 is arranged in the first accommodating space S1. Further, when the amount of glue in the second protective structure 52 is too large, the second protective structure 52 can only extend to and cover the side of the fixing portion 32, which can further prevent the second protective structure 52 from extending between the fixing portion 32 and the display portion 21, avoiding the problem of trapped air and further avoiding the formation of edge bubble defects.

[0124] Fig.13 The flowchart of the step of the method for preparing the display module 100 provided in the second embodiment of the present application is shown.

[0125] See also Fig.13 In a second aspect, an embodiment of the present application provides a method for preparing a display module 100, comprising:

[0126] Step S10, providing a prefabricated module 100', the prefabricated module 100' comprising a back panel assembly 10, a display panel 20 and a first protective structure 51, the display panel 20 comprising a display portion 21, a bent portion 22 and a connecting portion 23, the back panel assembly 10 comprising a first surface 10a and a second surface 10b arranged opposite to each other along a thickness direction Z, the first protective structure 51 being located at least on a side of the bent portion 22 away from the back panel assembly 10, the display portion 21 being arranged on the first surface 10a, the connecting portion 23 being arranged on the second surface 10b, and the bent portion 22 being bent on one side of the back panel assembly 10 to connect the display portion 21 and the connecting portion 23;

[0127] Step S20, forming a cover assembly 30 on one side of the first surface 10a, the cover assembly 30 comprising a cover body 31 and a fixing portion 32, the fixing portion 32 and the cover body 31 are sequentially attached to one side of the first surface 10a, the cover body 31, the fixing portion 32, the display portion 21 and the bending portion 22 participate in defining a first accommodation space S1;

[0128] Step S30, forming a circuit board assembly 40 on one side of the second surface 10b, and the circuit board assembly 40 is electrically connected to the connecting portion 23, the circuit board assembly 40 includes a circuit board 41 and a binding member 42, the binding member 42 includes a binding belt 42a and a limiting member 42b, the circuit board 41 is arranged on one side of the second surface 10b, the binding belt 42a passes over the circuit board 41 and is attached to the opposite sides of the circuit board 41, the limiting member 42b is attached, part of the binding member 42 is arranged beyond the back plate assembly 10 on one side of the back plate assembly 10, and part of the binding member 42, the connecting portion 23 and the bending portion 22 participate in defining the second accommodating space S2;

[0129] Step S40 , forming a second protective structure 52 in the first accommodating space S1 , on the first protective structure 51 and in the second accommodating space S2 , and the second protective structure 52 partially filled in the second accommodating space S2 extends to the position of the connecting portion 23 .

[0130] On the second aspect, the preparation method of the display module 100 provided in the embodiment of the present application further forms a second protective structure 52 at the position of the bending portion 22 on one side of the first protective structure 51, and enhances the mechanical properties and electrical protection properties at the position of the bending portion 22. At the same time, the existing structure of the display module 100 and the limiting member 42b are used to form the required first accommodating space S1 and second accommodating space S2, so that when the second protective structure 52 is formed, the shape and size of the second protective structure 52 are limited on the first surface 10a side and the second surface 10b side. The setting of the cover plate assembly 30 precedes the formation of the second protective structure 52, which can also avoid the problem of trapped air and avoid the risk of a large number of bubble defects at the edge of the cover plate in the final display module 100 product.

[0131] In step S10 , the prefabricated module 100 ′ refers to the intermediate structure of the display module 100 obtained by coating the first protective structure 51 at the bending portion 22 of the display panel 20 and partially bending the display panel 20 at the bending portion 22 .

[0132] In step S30, the attached limiting member 42b is involved in defining the second accommodating space S2. After the second protective structure 52 is formed, there is also a step of removing part of the limiting member 42b to further narrow the stacking thickness and frame width of the display module 100. The relevant embodiments will be further explained in other subsequent embodiments of the second aspect of this application.

[0133] Some of the limiting members 42b and the binding belt 42a can be freely combined and participate in defining the formation of the second accommodating space S2. The embodiments of the combination between the partial limiting members 42b and the binding belt 42a will be further described in the following specific embodiments.

[0134] Figures 17a to 17e The process steps of a method for preparing a display module 100 provided in an embodiment of the second aspect of the present application are shown.

[0135] Illustratively, a method for preparing a display module 100 provided in an embodiment of the second aspect of the present application includes:

[0136] See also Fig.17a , step S10, providing a prefabricated module 100 ′;

[0137] See also Fig.17b , step S20, forming a cover plate assembly 30 on one side of the first surface 10a;

[0138] See also Fig.17c , step S30, forming a circuit board assembly 40 on one side of the second surface 10b, and the circuit board assembly 40 is electrically connected to the connecting portion 23, the circuit board assembly 40 includes a circuit board 41 and a binding member 42, the binding member 42 includes a binding band 42a and a limiting member 42b, the circuit board 41 is arranged on one side of the second surface 10b, the binding band 42a goes over the circuit board 41 and is attached to the opposite sides of the circuit board 41, the limiting member 42b is attached, part of the limiting member 42b and the binding band 42a are arranged beyond the back plate assembly 10 on one side of the back plate assembly 10, the binding band 42a, the limiting member 42b, the connecting portion 23 and the bending portion 22 participate in defining the second accommodating space S2;

[0139] See also Fig.17d , step S40, forming a second protective structure 52.

[0140] Figures 18a to 18f The process steps of another method for preparing a display module 100 provided in an embodiment of the second aspect of the present application are shown.

[0141] Illustratively, another method for preparing a display module 100 provided in the second aspect of the present application includes:

[0142] See also Fig.18a , step S10, providing a prefabricated module 100 ′;

[0143] See also Fig.18b , step S20, forming a cover plate assembly 30 on one side of the first surface 10a;

[0144] See also Fig.18c , step S30, forming a circuit board assembly 40 on one side of the second surface 10b, and the circuit board assembly 40 is electrically connected to the connecting portion 23, the circuit board assembly 40 includes a circuit board 41 and a binding member 42, the binding member 42 includes a binding belt 42a and a limiting member 42b, the circuit board 41 is arranged on one side of the second surface 10b, the binding belt 42a passes over the circuit board 41 and is attached to the opposite sides of the circuit board 41, the limiting member 42b is attached, and part of the limiting member 42b is arranged on one side of the back plate assembly 10 beyond the back plate assembly 10, the binding belt 42a, the limiting member 42b, the connecting portion 23 and the bending portion 22 participate in defining the second accommodating space S2;

[0145] See also Fig.18d , step S40, forming a second protective structure 52.

[0146] Figures 19a to 19f The process steps of another method for preparing a display module 100 provided in an embodiment of the second aspect of the present application are shown.

[0147] Illustratively, another method for preparing a display module 100 provided in the second aspect of the present application includes:

[0148] See also Fig.19a , step S10, providing a prefabricated module 100 ′;

[0149] See also Fig.19b , step S20, forming a cover plate assembly 30 on one side of the first surface 10a;

[0150] See also Fig.19c, step S30, forming a circuit board assembly 40 on one side of the second surface 10b, and the circuit board assembly 40 is electrically connected to the connecting portion 23, the circuit board assembly 40 includes a circuit board 41 and a binding member 42, the binding member 42 includes a strap 42a and a stopper 42b, the circuit board 41 is arranged on one side of the second surface 10b, the strap 42a goes over the circuit board 41 and is attached to the opposite sides of the circuit board 41, the stopper 42b is attached, part of the stopper 42b and the strap 42a are arranged beyond the back plate assembly 10 on one side of the back plate assembly 10, the strap 42a, the stopper 42b, the connecting portion 23 and the bending portion 22 participate in defining the second accommodating space S2;

[0151] See also Fig.19d , step S40, forming a second protective structure 52.

[0152] Figures 20a to 20f The process steps of another method for preparing a display module 100 provided in an embodiment of the second aspect of the present application are shown.

[0153] Illustratively, another method for preparing a display module 100 provided in the second aspect of the present application includes:

[0154] See also Fig.20a , step S10, providing a prefabricated module 100 ′;

[0155] See also Fig.20b , step S20, forming a cover plate assembly 30 on one side of the first surface 10a;

[0156] See also Fig.20c , step S30, forming a circuit board assembly 40 on one side of the second surface 10b, and the circuit board assembly 40 is electrically connected to the connecting portion 23, the circuit board assembly 40 includes a circuit board 41 and a binding member 42, the binding member 42 includes a strap 42a and a stopper 42b, the circuit board 41 is arranged on one side of the second surface 10b, the strap 42a passes over the circuit board 41 and is attached to the opposite sides of the circuit board 41, the stopper 42b is attached, part of the stopper 42b is arranged beyond the back plate assembly 10 on one side of the back plate assembly 10, the stopper 42b, the connecting portion 23 and the bending portion 22 participate in defining the second accommodating space S2;

[0157] See also Fig.20d , step S40, forming a second protective structure 52.

[0158] Figures 21a to 21d The process steps of another method for preparing a display module 100 provided in an embodiment of the second aspect of the present application are shown.

[0159] Illustratively, another method for preparing a display module 100 provided in the second aspect of the present application includes:

[0160] See also Fig.21a , step S10, providing a prefabricated module 100 ′;

[0161] See also Figure 21b , step S20, forming a cover plate assembly 30 on one side of the first surface 10a;

[0162] See also Fig.21c , step S30, forming a circuit board assembly 40 on one side of the second surface 10b, and the circuit board assembly 40 is electrically connected to the connecting portion 23, the circuit board assembly 40 includes a circuit board 41 and a binding member 42, the binding member 42 includes a binding band 42a and a stopper 42b, the circuit board 41 is arranged on one side of the second surface 10b, the binding band 42a passes over the circuit board 41 and is attached to opposite sides of the circuit board 41, the binding band 42a is arranged beyond the back plate assembly 10 on one side of the back plate assembly 10, and the binding band 42a, the connecting portion 23 and the bending portion 22 participate in defining a second accommodating space S2;

[0163] See also Fig.21d , step S40, forming a second protective structure 52.

[0164] Exemplarily, the material of the portion of the strap 42a that extends beyond one side of the backplane assembly 10 is glass fiber or polyester fiber, which has relatively high stiffness.

[0165] In the above embodiment, the binding strap 42a and the limiting member 42b in the freely combined binding member 42 can both participate in defining the second accommodation space S2, and can be flexibly adjusted according to actual needs.

[0166] Fig.14 The figure shows the step flow of another method for preparing a display module 100 provided in the second aspect of the embodiment of the present application.

[0167] See also Fig.14 In some embodiments, after step S40, the following steps are further included:

[0168] Step S50, remove the support portion 424, the limiting member 42b includes the support portion 424, the support portion 424 is arranged on one side of the backplane assembly 10 beyond the backplane assembly 10, and the support portion 424 is arranged on the side of the strap 42a away from the second surface 10b.

[0169] Exemplarily, the dimension of the support portion 424 along the thickness direction Z is 0.1 to 0.4 mm.

[0170] See also Fig.17e The method for preparing a display module 100 provided in the second aspect of the present application further includes:

[0171] Step S50, remove the support portion 424, the limiting member 42b includes the support portion 424, the support portion 424 and the strap 42a are both arranged beyond the backplane assembly 10 on one side of the backplane assembly 10, the support portion 424 is arranged on the side of the strap 42a away from the second surface 10b, and the support portion 424 serves to temporarily enhance the stiffness of the strap 42a.

[0172] See also Fig.18e Another method for preparing a display module 100 provided in the second aspect of the present application further includes:

[0173] Step S50, remove the support portion 424, the limiting member 42b includes the support portion 424, the support portion 424 is arranged on one side of the backplane assembly 10 beyond the backplane assembly 10, the support portion 424 is arranged on the side of the strap 42a away from the second surface 10b, and the support portion 424 serves to temporarily limit the second accommodating space S2.

[0174] See also Fig.19e Another method for preparing a display module 100 provided in the second aspect of the present application further includes:

[0175] Step S50, remove the support portion 424, the limiting member 42b includes the support portion 424, the strap 42a and the support portion 424 are both arranged beyond the backplane assembly 10 on one side of the backplane assembly 10, the support portion 424 is arranged on the side of the strap 42a away from the second surface 10b, and the support portion 424 serves to temporarily limit the second accommodating space S2.

[0176] See also Fig.20e Another method for preparing a display module 100 provided in the second aspect of the present application further includes:

[0177] Step S50, remove the support portion 424, the limiting member 42b includes the support portion 424, the support portion 424 is arranged on one side of the backplane assembly 10 beyond the backplane assembly 10, the support portion 424 is arranged on the side of the strap 42a away from the second surface 10b, and the support portion 424 serves to temporarily limit the second accommodating space S2.

[0178] In the above embodiment, the support portion 424 can temporarily enhance the stiffness of the strap 42a, and the auxiliary strap 42a participates in defining the second accommodating space S2, or the support portion 424 can temporarily participate in defining the second accommodating space S2. The role of the support portion 424 can be flexibly adjusted according to actual needs.

[0179] Fig.15 The figure shows the step flow of another method for preparing a display module 100 provided in the second aspect of the embodiment of the present application.

[0180] See also Fig.15In some embodiments, after step S40, the following steps are further included:

[0181] Step S60 , remove the second spacer 422 , the limiting member 42 b further includes a second spacer 422 , the second spacer 422 is disposed between the connecting portion 23 and the supporting portion 424 , or the second spacer 422 is disposed between the binding band 42 a and the supporting portion 424 .

[0182] See also Fig.18f The method for preparing a display module 100 provided in the second aspect of the present application further includes:

[0183] Step S60 , removing the second spacer 422 . The limiting member 42 b further includes a second spacer 422 , and the second spacer 422 is disposed between the binding belt 42 a and the supporting portion 424 .

[0184] See also Fig.19f Another method for preparing a display module 100 provided in the second aspect of the present application further includes:

[0185] Step S60 , removing the second spacer 422 . The limiting member 42 b further includes a second spacer 422 , and the second spacer 422 is disposed between the binding belt 42 a and the supporting portion 424 .

[0186] See also Fig.20f Another method for preparing a display module 100 provided in the second aspect of the present application further includes:

[0187] Step S60 , removing the second spacer 422 . The limiting member 42 b further includes a second spacer 422 , and the second spacer 422 is disposed between the binding belt 42 a and the connecting portion 23 .

[0188] In the above embodiment, the second spacer 422 can increase the volume of the second accommodating space S2, and the error value within the allowable range of the process is increased, which is beneficial to reduce the difficulty and cost of forming the second protective structure 52. At the same time, the second spacer 422 can further limit the size of the second protective structure 52 at one end of the second surface 10b along the thickness direction Z, and the shape of the second protective structure 52 can be flexibly adjusted according to actual needs.

[0189] In some embodiments, step S40 further includes:

[0190] By dispensing glue, the packaging glue is dripped into the first protective structure 51 at the bent portion 22, and the packaging glue flows into the first accommodation space S1 and the second accommodation space S2 toward both sides along the thickness direction Z;

[0191] The packaging glue is cured to form a second protection structure 52 .

[0192] In these embodiments, the second protective structure 52 is formed by dripping packaging glue using a dispensing process to form a first accommodating space S1 and a second accommodating space S2 on both sides of the first surface 10a and the second surface 10b, respectively, so as to limit the flow direction and position of the packaging glue.

[0193] Fig.16 The figure shows the steps of another method for preparing a display module 100 provided in the second aspect of the present application. Figures 22a to 22d The process steps of another method for preparing a display module 100 provided in an embodiment of the second aspect of the present application are shown.

[0194] See also Fig.16 and Figures 22a to 22d In some embodiments, step S40 further includes:

[0195] Step S41, a first limiting portion 425 and a second limiting portion 426 are respectively provided on the first side surface 10c and the second side surface 10d which are relatively provided along the plane direction H of the back plate assembly 10, the limiting member 42b further includes the first limiting portion 425 and the second limiting portion 426, the first side surface 10c and the second side surface 10d are connected to the side of the back plate assembly 10 provided with the bending portion 22, the first limiting portion 425 and the second limiting portion 426 are provided beyond the back plate assembly 10 near the side of the back plate assembly 10 provided with the bending portion 22, the plane direction H is a direction parallel to the plane of the back plate assembly 10, and the plane direction H intersects with the thickness direction Z;

[0196] Step S42, dripping packaging glue into the first protective structure 51 at the bending portion 22 by dispensing;

[0197] Step S43, curing the packaging glue to form a second protective structure 52;

[0198] Step S44: remove the first limiting portion 425 and the second limiting portion 426.

[0199] In these embodiments, in the step of forming the second protective structure 52, the first side 10c and the second side 10d of the back panel assembly 10 also need to be limited, to further ensure that when the amount of packaging glue is too much, the packaging glue can flow to the first side 10c and the second side 10d to achieve effective limitation.

[0200] Fig.23 The overall structure of a display device 200 provided in an embodiment of the third aspect of the present application is shown.

[0201] See also Fig.23In a third aspect, an embodiment of the present application provides a display device 200, comprising a display module 100 provided by any embodiment of the first aspect of the present application, or a display module 100 prepared by the method for preparing the display module 100 provided by any embodiment of the second aspect of the present application.

[0202] In the third aspect, the display device 200 provided in the embodiment of the present application includes the display module 100 provided in any embodiment of the first aspect of the present application, or includes the display module 100 prepared by the preparation method of the display module 100 provided in any embodiment of the second aspect of the present application. Therefore, the display device 200 provided in the embodiment of the third aspect of the present application has the beneficial effects possessed by the display module 100 provided in any embodiment of the first aspect of the present application, or the display device 200 provided in the embodiment of the third aspect of the present application has the beneficial effects possessed by the preparation method of the display module 100 provided in any embodiment of the second aspect of the present application, which will not be repeated here.

[0203] The display device 200 in the embodiment of the present application includes but is not limited to mobile phones, personal digital assistants (PDAs), tablet computers, e-books, televisions, access control systems, smart landline phones, consoles, and other devices with display functions.

[0204] Although the present invention has been described with reference to preferred embodiments, various modifications may be made thereto and parts thereof may be replaced by equivalents without departing from the scope of the present invention. In particular, the various technical features mentioned in the various embodiments may be combined in any manner as long as there are no structural conflicts. The present invention is not limited to the specific embodiments disclosed herein, but includes all technical solutions falling within the scope of the claims.

Claims

1. A display module, characterized in that: include: A back plate assembly, comprising a first surface and a second surface arranged opposite to each other in a thickness direction; The display panel comprises a display portion, a bending portion and a connecting portion, wherein the display portion is arranged on the first surface, the connecting portion is arranged on the second surface, and the bending portion connects the display portion and the connecting portion; A cover assembly is disposed on one side of the first surface, the cover assembly includes a cover body and a fixing portion attached to one side of the cover body, the cover body, the fixing portion, the display portion and the bending portion participate in defining a first accommodation space; A circuit board assembly, disposed on one side of the second surface and electrically connected to the connecting portion; The protective assembly includes a first protective structure and a second protective structure, wherein the first protective structure is at least located on a side of the bending portion away from the backplane assembly, the second protective structure covers the first protective structure, and a portion of the second protective structure extends and fills the first accommodating space, and a portion of the second protective structure extends to the connection portion.

2. The display module according to claim 1, characterized in that: The circuit board assembly includes a circuit board and a binding member, wherein the binding member is arranged on one side of the backplane assembly and partially exceeds the backplane assembly, and the binding member, the connecting portion and the bending portion participate in defining a second accommodating space, and the second protective structure extends and fills the second accommodating space.

3. The display module according to claim 2, characterized in that: The binding member includes a strap, which is attached to the side of the circuit board away from the second surface, and the strap extends and exceeds the opposite two sides of the circuit board to be bonded and fixed to the connecting part. The strap is arranged on one side of the backplane assembly partially beyond the backplane assembly, and the strap, the connecting part and the bent part participate in defining the second accommodating space, and the second protective structure extends and fills the second accommodating space.

4. The display module according to claim 3, characterized in that: The strap also includes a stiff section, which is arranged on one side of the backplane assembly beyond the backplane assembly. The stiff section, the connecting portion and the bending portion participate in defining the second accommodating space, and the second protective structure extends to and fills the second accommodating space.

5. The display module according to claim 4, characterized in that: The stiff segment comprises glass fiber material or polyester fiber material.

6. The display module according to claim 4, characterized in that: The binding member further includes a first spacer, which is disposed between the stiff section and the connecting section. The connecting section, the stiff section, the first spacer and the bent section participate in defining the second accommodation space. The second protective structure extends and fills the second accommodation space. Alternatively, the first spacer is disposed between the binding strap and the connecting portion, the connecting portion, the binding strap, the first spacer and the bent portion participate in defining the second accommodating space, and the second protective structure extends to and fills the second accommodating space.

7. The display module according to claim 6, characterized in that: A dimension of the first spacer along the thickness direction is consistent with a dimension of one end of the second protective structure extending to the second accommodating space along the thickness direction.

8. The display module according to claim 6, characterized in that: The first spacer includes a foam material.

9. The display module according to claim 4, characterized in that: The planar direction is a direction parallel to the plane of the back panel assembly, a first preset distance is set between the stiff segment or the strap and the arc top of the bending portion along the planar direction, and the planar direction intersects with the thickness direction.

10. The display module according to claim 1, characterized in that: The circuit board assembly includes a circuit board and a binding member, the binding member includes a binding strap, the binding strap is attached to the side of the circuit board away from the second surface, and the binding strap extends and exceeds the opposite sides of the circuit board to be bonded and fixed to the connecting portion, the plane direction is parallel to the plane direction of the backplane assembly, the second protective structure extends to one end of the binding strap close to the bending portion, and a second preset distance is set between the second protective structure and the binding strap along the plane direction, and the plane direction intersects with the thickness direction. Alternatively, the second protective structure extends and covers one end of the strap near the bending portion, and the second protective structure extends a third preset distance from the end of the strap near the bending portion toward the connecting portion along the planar direction, and the planar direction intersects with the thickness direction.

11. The display module according to claim 10, characterized in that: The second preset distance or the third preset distance is 0, and the second protective structure is in contact with the binding belt.

12. The display module according to claim 1, characterized in that: The second protective structure extends in the first accommodating space along the display portion to a side of the fixing portion close to the display portion.

13. The display module according to claim 12, characterized in that: The second protective structure extends in the first accommodating space and covers at least a portion of a side portion of the fixing portion.

14. A method for preparing a display module, characterized in that: include: A prefabricated module is provided, the prefabricated module comprising a back panel assembly, a display panel and a first protective structure, the display panel comprising a display portion, a bending portion and a connecting portion, the back panel assembly comprising a first surface and a second surface arranged opposite to each other in a thickness direction, the first protective structure covers a side of the display panel away from the back panel assembly, the display portion is arranged on the first surface, the connecting portion is arranged on the second surface, and the bending portion is bent on one side of the back panel assembly to connect the display portion and the connecting portion; A cover assembly is formed on one side of the first surface, the cover assembly comprising a cover body and a fixing portion, the fixing portion and the cover body are sequentially attached to one side of the first surface, and the cover body, the fixing portion, the display portion and the bending portion participate in defining a first accommodation space; A circuit board assembly is formed on one side of the second surface, and the circuit board assembly is electrically connected to the connecting portion, the circuit board assembly includes a circuit board and a binding member, the binding member includes a strap and a stopper, a circuit board is arranged on one side of the second surface, the strap goes over the circuit board and is attached to two opposite sides of the circuit board, the stopper is attached, part of the binding member is arranged beyond the back plate assembly on one side of the back plate assembly, and part of the binding member, the connecting portion and the bending portion participate in defining a second accommodation space; A second protective structure is formed in the first accommodating space, on the first protective structure and in the second accommodating space, and the second protective structure partially filled in the second accommodating space extends to the position of the connecting portion.

15. The method for preparing a display module according to claim 14, characterized in that: After the step of forming the second protective structure, the following steps are further included: The support portion is removed, the limiting member includes the support portion, the support portion is arranged beyond the backplane assembly on one side of the backplane assembly, and the support portion is arranged on the side of the strap away from the second surface.

16. The method for preparing a display module according to claim 15, characterized in that: After the step of forming the second protective structure, the following steps are further included: The second spacer is removed, and the limiting member further comprises the second spacer, and the second spacer is arranged between the connecting portion and the supporting portion, or the second spacer is arranged between the binding strap and the supporting portion.

17. The method for preparing a display module according to claim 14, characterized in that: The step of forming the second protective structure also includes: By dispensing glue, packaging glue is dripped into the first protective structure at the bending portion, and the packaging glue flows into the first accommodation space and the second accommodation space toward both sides along the thickness direction; The packaging glue is cured to form the second protective structure.

18. The method for preparing a display module according to claim 14, characterized in that: The step of forming the second protective structure also includes: A first limiting portion and a second limiting portion are respectively provided on a first side surface and a second side surface that are oppositely arranged along a plane direction of the back plate assembly, the limiting member further comprises the first limiting portion and the second limiting portion, the first side surface and the second side surface are connected to a side of the back plate assembly where the bending portion is arranged, the first limiting portion and the second limiting portion are arranged beyond the back plate assembly at a side close to the back plate assembly where the bending portion is arranged, the plane direction is a direction parallel to the plane of the back plate assembly, and the plane direction intersects with the thickness direction; Using glue dispensing method, dripping packaging glue into the first protective structure at the bending portion; Curing the packaging glue to form the second protective structure; Remove the first limiting portion and the second limiting portion.

19. A display device, characterized in that: A display module comprising any one of claims 1 to 13, or a display module prepared by the method for preparing a display module according to claims 14 to 18.

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