Electronic device

Abstract

The invention provides an electronic device. The electronic device comprises a flexible substrate, a plurality of electronic units, a peripheral circuit and a circuit board, the flexible substrate includes a first region, a second region and a dummy region. The second region is adjacent to the first region, and the dummy region partially surrounds the second region and forms an interval. The electronic unit is arranged in the first area. The peripheral circuit is arranged in the second area and used for driving the electronic unit, and the peripheral circuit comprises a wire which extends to the outer edge of the flexible substrate. The circuit board is electrically connected to the peripheral circuit through the space. The dummy region of the flexible substrate is not provided with a conductor and a semiconductor.

Description

[0001] This application is a divisional application of the invention patent application with application date of January 12, 2021, application number 202110038172.8, and invention name “Display Panel and Window”. Technical Field

[0002] The present disclosure relates to an electronic device. Background Art

[0003] In recent years, display panels have evolved from flat display panels to curved display panels and even foldable display panels, making the application of display panels more and more extensive. However, when a flexible display panel is applied to an object with a curved surface, such as a car window with a spherical surface, the flexible display panel may be wrinkled, causing damage to wires and components, thus limiting the application field of the display panel. Summary of the invention

[0004] The embodiment of the present disclosure provides an electronic device, which includes a flexible substrate, a plurality of electronic units, a peripheral circuit and a circuit board. The flexible substrate includes a first area, a second area and a dummy area. The second area is adjacent to the first area, and the dummy area partially surrounds the second area and forms a gap. The electronic unit is arranged in the first area. The peripheral circuit is arranged in the second area and is used to drive the electronic unit, and the peripheral circuit includes a wire extending to the outer edge of the flexible substrate. The circuit board is electrically connected to the peripheral circuit through the gap. No conductor and semiconductor are arranged on the dummy area of ​​the flexible substrate. The position between the first point and the second point on the inner side of the dummy area that is farthest from the electronic unit is defined as the gap. The length of the gap of the dummy area is defined as the distance between the first point and the second point, the perimeter of the dummy area is defined as the distance from the first point along the outer edge of the dummy area to the second point, and the length of the gap of the dummy area is less than half of the perimeter of the dummy area. BRIEF DESCRIPTION OF THE DRAWINGS

[0005] Figure 1 Shown are schematic diagrams of windows according to some embodiments of the present disclosure.

[0006] Figure 2 Shown is a schematic top view of a window according to some embodiments of the present disclosure.

[0007] Figure 3 FIG. 4 is a schematic top view of a display panel according to some embodiments of the present disclosure.

[0008] Figure 4 Shown is a schematic top view of a window according to some embodiments of the present disclosure.

[0009] Figure 5 The display panel is shown along Figure 4 Schematic cross-sectional view of section line AA'.

[0010] Figure 6 Shown is a schematic top view of a window according to some embodiments of the present disclosure.

[0011] Figure 7 Shown Figure 6 An enlarged schematic diagram of the region RB.

[0012] Figure 8 Shown along Figure 7 Schematic cross-sectional view of section line BB'.

[0013] Fig. 9 Shown is a schematic top view of a window according to some embodiments of the present disclosure.

[0014] Fig.10 FIG. 4 is a schematic cross-sectional view of a display panel according to some embodiments of the present disclosure.

[0015] Fig.11 FIG. 4 is a schematic cross-sectional view of a display panel according to some embodiments of the present disclosure.

[0016] Fig.12 FIG. 4 is a schematic cross-sectional view of a display panel according to some embodiments of the present disclosure.

[0017] Fig.13 FIG. 4 is a partial top view of a display panel according to some embodiments of the present disclosure.

[0018] Fig.14 Shown along Fig.13 Schematic diagram of the cross section along the section line CC'.

[0019] Fig.15 Shown is a schematic top view of a window according to some embodiments of the present disclosure.

[0020] Fig.16 FIG. 1 is a top view of a display panel according to some embodiments of the present disclosure, which is attached to a transparent substrate and before being cut.

[0021] Fig.17 Shown Fig.16 A schematic cross-sectional view of the display panel and the transparent substrate in the region RC after bonding and cutting.

[0022] Fig.18 Shown is a schematic top view of a window according to some embodiments of the present disclosure.

[0023] Explanation of reference numerals: 1-window; 10, 10A, 10B, 10C, 10D, 10E, 10F-display panel; 12-flexible substrate; 121-substrate; 1211-flexible substrate material; 1212, 1221, 1222, 463-inorganic insulating layer; 122-buffer layer; 12a-opening; 12a1-sub-opening; 12P1-island-shaped portion; 12P2-connecting portion; 12P3-sheet portion; 14-light-emitting unit; 16-peripheral circuit; 18-conductive pad; 2-transparent substrate; 20-circuit board; 22, 50-conducting wire; 24-conducting wire; 26-conductive adhesive; 28-protective layer; 2A-exposed portion; 2B; 2C-shielding portion; embedded portion; 2S-curved surface; 2S1, 12S1-outer edge; 2S2, 12S2-outer edge ; 3-door; 30, 32, 34, 321-insulating layer; 36-flat layer; 38, 42, 44-electrode; 40-connecting line; 46-crack blocking structure; 461, 462-grooves; 464-organic insulating layer; 48-cutting tool; 52-circuit; C1-first conductive layer; C2-second conductive layer; C3-third conductive layer; d1, d2, d3-distance; G-interval; H1, H2-depth; H3-height; k1, k2-direction vector; L1-length; L2-perimeter; ND-top view direction; P, P1-point; R1-display area; R2-peripheral circuit area; R3-dummy area; RA, RB, RC-area; T1-thickness; TH1, TH2, TH3, TH4-hole; W1, W2, W3-width; θ-cone angle. DETAILED DESCRIPTION

[0024] The following is a detailed description of the display panel and window of the disclosed embodiment. It should be understood that many different embodiments are provided below to implement different aspects. The following specific elements and arrangements are only for simple and clear description of some embodiments. Of course, these are only used for example and not for limitation. In addition, similar and / or corresponding numbers may be used in different embodiments to indicate similar elements for clear description. However, these similar numbers are only for simple and clear description of some embodiments and do not represent any correlation between the different embodiments and / or structures discussed.

[0025] When the term “on” or “over” is used, it includes a situation of direct contact, or one or more other elements may be interposed between the two, in which case the two may not be in direct contact.

[0026] The content of the present disclosure is described in detail below in conjunction with specific embodiments and drawings. In order to make the content of the present disclosure clearer and easier to understand, the following drawings may be simplified schematic diagrams, and the elements therein may not be drawn to scale. In addition, the number and size of each element in the drawings are only for illustration and are not intended to limit the scope of the present disclosure.

[0027] Certain words are used throughout this disclosure and in the appended claims to refer to specific components. Those skilled in the art will appreciate that electronic device manufacturers may refer to the same components by different names, and this disclosure does not intend to distinguish between components that have the same function but different names. In the following description and claims, the words "including" and "comprising" are open-ended words and should be interpreted as "including but not limited to..."

[0028] The use of ordinal numbers such as "first", "second", etc. in the specification and claims to modify claim elements does not in itself imply any previous ordinal number of the claimed element, nor does it represent the order of one claimed element and another claimed element, or the order in the manufacturing method. The use of these ordinal numbers is only used to clearly distinguish one claimed element with a certain name from another claimed element with the same name.

[0029] In addition, when a component is referred to as being “on another component”, the two have an up-and-down relationship in a plan view, and the component may be above or below the other component. The up-and-down relationship depends on the orientation of the device.

[0030] In the text, the terms "approximately", "about", and "substantially" generally mean within 10%, or within 5%, or within 3%, or within 2%, or within 1%, or within 0.5% of a given value or range. The numbers given here are approximate numbers, that is, in the absence of specific instructions for "approximately", "about", and "substantially", the meanings of "approximately", "about", and "substantially" can still be implied. In addition, the term "ranging from a first value to a second value" means that the range includes the first value, the second value, and other values ​​between them.

[0031] It should be understood that the following embodiments may replace, reorganize, or mix features in several different embodiments to complete other embodiments without departing from the spirit of the present disclosure. Features between embodiments may be mixed and matched as long as they do not violate the spirit of the invention or conflict with each other.

[0032] In the present disclosure, the depth, length and width can be measured by an optical microscope, and the depth can be measured by a cross-sectional image in an electron microscope, but it is not limited thereto. In addition, any two values ​​or directions used for comparison may have a certain error. If the first value is equal to the second value, it implies that there may be an error of about 10% between the first value and the second value; if the first direction is perpendicular to the second direction, the angle between the first direction and the second direction may be between 80 degrees and 100 degrees; if the first direction is parallel to the second direction, the angle between the first direction and the second direction may be between 0 degrees and 10 degrees.

[0033] Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meanings as commonly understood by those skilled in the art to which the present disclosure belongs. It is understood that these terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning consistent with the background or context of the relevant technology and the present disclosure, and should not be interpreted in an idealized or overly formal manner unless specifically defined in the embodiments of the present disclosure.

[0034] The electronic device disclosed herein may include, for example, a display device, an antenna device, a sensing device, a touch display, a curved display, or a free shape display, and may also be a bendable or flexible spliced ​​electronic device, but is not limited thereto. The electronic device may include, for example, a light-emitting diode, a liquid crystal, fluorescence, phosphor, a quantum dot (QD), other suitable display media, or a combination of the foregoing, but is not limited thereto. The light-emitting diode (LED) may include, for example, an organic light-emitting diode (OLED), an inorganic light-emitting diode, a sub-millimeter light-emitting diode (mini LED), a micro LED, or a quantum dot light-emitting diode (QD, which may be, for example, QLED, QDLED), or other suitable materials or any combination of the foregoing, but is not limited thereto. The antenna device may be, for example, a liquid crystal antenna, but is not limited thereto. It should be noted that the electronic device disclosed herein can be any combination of the above, but is not limited thereto. In addition, the appearance of the electronic device can be rectangular, circular, polygonal, a shape with curved edges, or other suitable shapes. The electronic device can have peripheral systems such as a drive system, a control system, a light source system, a shelf system, etc. to support a display device or an antenna device. The following electronic device takes a display panel attached to a transparent substrate of a window as an example, but is not limited thereto.

[0035] Figure 1 Schematic diagrams of windows according to some embodiments of the present disclosure are shown. Figure 1As shown, the window 1 may, for example, include a transparent substrate 2 for attaching a display panel of any of the following embodiments. The transparent substrate 2 may have a Gaussian curvature that is not equal to 0. Specifically, the transparent substrate 2 may have a curved surface 2S, and the curved surface 2S may have a Gaussian curvature that is not equal to 0. For example, the transparent substrate 2 may include glass, quartz, plastic or other substrates. For example, the window 1 may, for example, include a window of a vehicle, a window of a building or other window with a curved surface. When the display panel is attached to the curved surface 2S, the display panel may be bent along the contour of the curved surface 2S of the transparent substrate 2. When the transparent substrate 2 includes a curved surface 2S with a Gaussian curvature that is not 0, the curved surface 2S will bend in at least two different directions at the same time. For example, the Gaussian curvature of the transparent substrate 2 may be greater than 0 or less than 0. In some embodiments, the transparent substrate 2 may also be replaced with an opaque substrate, but is not limited thereto.

[0036] The Gaussian curvature referred to in the present disclosure can be a point at any position on the surface 2S. This point can extend two principal curvatures along the surface 2S, and the Gaussian curvature is the product of these two principal curvatures. In detail, a point on the surface 2S can extend an infinite number of curves in all directions along the surface 2S, and each curve has its own curvature. The principal curvature described here is defined as: among these infinite curvatures, there is a maximum value, and the curvature of the curve perpendicular to the curve with the maximum value (Max) is the minimum value (Min) among these infinite curvatures, then the curve with the maximum value and the curve with the minimum value are the two principal curvatures of this point.

[0037] A method for determining Gaussian curvature in the present disclosure may be, for example, to use a scanning device and 3D analysis software (such as Design X 3D, but not limited thereto) to scan and model the target surface 2S, and obtain an objective Gaussian curvature value after analysis.

[0038] The present disclosure provides several other methods for determining Gaussian curvature. A surface with a positive Gaussian curvature may appear similar to a sphere or a protruding shape, while a surface with a negative Gaussian curvature may appear similar to a saddle shape. In the present disclosure, there are several methods for determining whether the Gaussian curvature is positive, negative, or 0. The first method is to arbitrarily select three non-collinear points on the surface 2S to form a triangle, and then determine whether the sum of the interior angles of the triangle is greater than 180 degrees, equal to 180 degrees, or less than 180 degrees. When the Gaussian curvature of the surface is positive, the sum of the interior angles of the triangle will be greater than 180 degrees. When the Gaussian curvature of the surface is negative, the sum of the interior angles of the triangle will be less than 180 degrees. When the Gaussian curvature of the surface is 0, the sum of the interior angles of the triangle will be equal to 180 degrees. It is worth noting that the sum of the interior angles of the triangle is equal to 180 degrees within an error range of plus or minus 5 degrees, which can be a condition of 0 Gaussian curvature, but is not limited to this.

[0039] Another method for determining Gaussian curvature in the present disclosure is to select any point P on the surface 2S, where the point P has a direction vector k1 and a direction vector k2 that are perpendicular to each other, each having a curvature, and the Gaussian curvature of the surface 2S is the product of the curvature of the direction vector k1 and the curvature of the direction vector k2. Figure 1 As shown, the curvature of the direction vector k1 and the curvature of the direction vector k2 are both positive numbers, so the product of the curvatures of the two direction vectors k1 and k2 is also a positive number. By analogy, the Gaussian curvature of surfaces of other shapes can also be determined in this way, which will not be repeated here.

[0040] Figure 2 FIG. 2 is a schematic top view of a window according to some embodiments of the present disclosure. Figure 2 As shown, the window 1 may include a transparent substrate 2 and a display panel 10. The transparent substrate 2 may have a Gaussian curvature that is not equal to 0, and the display panel 10 may be attached to the transparent substrate 2. The transparent substrate 2 may be, for example, the transparent substrate 2 described above (e.g. Figure 1 ), a surface 2S with Gaussian curvature not equal to 0, but not limited to this. The window 1 below will take a car window as an example. Figure 2 In the embodiment, when viewed from one side of the window 1, such as along the top-view direction ND of the display panel 10, the transparent substrate 2 may include, for example, an outer edge 2S1 and an outer edge 2S2, but is not limited thereto. In one embodiment, the outer edge 2S1 may be an arc, and the outer edge 2S2 may be substantially a straight line, but is not limited thereto. The two ends of the outer edge 2S1 may be connected to the two ends of the outer edge 2S2 to form the outer contour of the transparent substrate 2, but the window 1 disclosed herein is not limited thereto. In some embodiments, the top-view direction ND of the display panel 10 may be, for example, the normal direction of the tangent plane of any point on the curved surface 2S, but the disclosure herein is not limited thereto. In some embodiments, the window 1 may include, for example, a window of a vehicle, a window of a building, or other window with a curved surface, and the window 1 may be disposed in a window frame. Figure 2 In the embodiment, the window frame may be, for example, a frame disposed at the periphery of the window 1 or may be at least a portion of a door 3 of a vehicle, but is not limited thereto.

[0041] In some embodiments, the transparent substrate 2 may include an exposed portion 2A, a shielding portion 2B, and an embedded portion 2C, but is not limited thereto. When the window 1 is in a closed state, the exposed portion 2A may be a portion of the transparent substrate 2 that is not shielded by the door 3, and the shielding portion 2B and the embedded portion 2C may be portions shielded by the door 3. For example, when the window 1 is in an open state, the shielding portion 2B may still be shielded by the door, while the embedded portion 2C may be exposed and not shielded by the door, but is not limited thereto. The transparent substrate 2 disclosed herein is not limited thereto. In some embodiments, the exposed portion 2A, the shielding portion 2B, and the embedded portion 2C of the transparent substrate 2 may all have a curved surface 2S, but is not limited thereto. In some embodiments, the exposed portion 2A and the embedded portion 2C may have a curved surface 2S, and the shielding portion 2B may have a flat surface, but is not limited thereto.

[0042] The display panel 10 disclosed herein may be a flexible display panel that can be bent in at least two different directions so as to substantially conform to a curved surface 2S having a Gaussian curvature that is not equal to 0. Figure 2 As shown, the display panel 10 may include a flexible substrate 12, a plurality of light-emitting units 14 and a peripheral circuit 16, wherein the light-emitting units 14 and the peripheral circuit 16 may be disposed on the flexible substrate 12. Specifically, the flexible substrate 12 may include a display area R1, a peripheral circuit area R2 and a dummy area R3, wherein the peripheral circuit area R2 may be adjacent to the display area R1, and the dummy area R3 may be disposed at the periphery of the peripheral circuit area R2 and form a gap G. In some embodiments, the dummy area R3 may surround the peripheral circuit area R2. For example, the dummy area R3 may be disposed at the periphery of the peripheral circuit area, and when the outer perimeter of the dummy area R3 accounts for more than half of the peripheral circuit area R2, it can be considered that the dummy area R3 may surround the peripheral circuit area R2. The light-emitting unit 14 may be disposed in the display area R1 to display an image, and the peripheral circuit 16 may be disposed in the peripheral circuit area R2 to drive the light-emitting unit 14. In the present disclosure, the display area R1 may be defined by the connection of the outer edge or outer corner of the outermost light-emitting unit 14. The peripheral circuit area R2 can be defined as an area where the light-emitting unit 14 is not provided and the peripheral circuit 16 is provided. For example, the peripheral circuit area R2 can be an area from the outer edge of the first conductive element (such as a wire or other element with conductive properties) encountered inward from the outer edge of the flexible substrate 12 to the edge of the display area R1, but is not limited thereto. The dummy area R3 can be defined as an area where there are no peripheral circuits 16 (such as wires, circuits or elements) and light-emitting units 14, such as an area where there are no conductors and semiconductors on the flexible substrate 12. In other words, the dummy area R3 can be an area from the outer edge of the first conductive element (such as a wire or other element with conductive properties) encountered inward from the outer edge of the flexible substrate 12 to the outer edge of the flexible substrate 12. Figure 2 In the embodiment of the present invention, the peripheral circuit area R2 may completely surround the display area R1, but is not limited thereto. Figure 4As shown, the peripheral circuit area R2 may partially surround the display area R1, so that part of the display area R1 may be adjacent to the dummy area R3. Fig.15 As shown, the peripheral circuit region R2 may be located at one side of the display region R1.

[0043] It is worth mentioning that, since a dummy area R3 may be provided between the peripheral circuit area R2 and the outer edge of the flexible substrate 12 and / or between the display area R1 and the outer edge of the flexible substrate 12, when the display panel 10 is attached to the transparent substrate 2 or when the display panel 10 is cut, the dummy area R3 of the flexible substrate 12 may provide a buffer for attachment or cutting, so as to reduce the damage of the light-emitting unit 14 and the peripheral circuit 16 due to being close to the outer edge of the transparent substrate 2 or being located in the wrinkles. In addition, the dummy area R3 of the flexible substrate 12 may also reduce the impact of cracks on the outer edge of the flexible substrate 12 on the light-emitting unit 14 and the peripheral circuit 16.

[0044] like Figure 2 As shown, the flexible substrate 12 may have a patterned structure to reduce wrinkles or creases generated by the adhesion to the display panel 10. For example, the flexible substrate 12 may include an opening 12a, which is located in the display area R1 and / or the peripheral circuit area R2. In detail, the flexible substrate 12 may include a plurality of sub-openings 12a1, which are arranged in the display area R1 and the peripheral circuit area R2, and the sub-openings 12a1 may be holes that pass through the flexible substrate 12, but are not limited thereto. In the present disclosure, the opening 12a may include a plurality of sub-openings 12a1. Through the design of the opening 12a, the degree of bending of the display panel 10 in at least two directions at the same time can be increased, and wrinkles or creases are less likely to occur. Therefore, when the display panel 10 is directly attached to a curved surface 2S whose Gaussian curvature is not zero and which is bent in at least two different directions at the same time, the display panel 10 can roughly conform to the curved surface 2S (especially the curved surface 2S whose Gaussian curvature is not zero). Figure 2 In the embodiment of the present invention, the flexible substrate 12 in the dummy region R3 may not have an opening, so as to increase the contact area between the flexible substrate 12 and the curved surface 2S, so as to help attach the display panel 10 to the curved surface 2S, but the present invention is not limited thereto. Fig.18 As shown, the flexible substrate 12 in the dummy region R3 may also have an opening 12 a.

[0045] The flexible substrate 12 may include, for example, a stretchable substrate, a bendable substrate, or a foldable substrate. The stretchable substrate may include, for example, a stretchable or extensible substrate. In some embodiments, if the flexible substrate 12 can conform to a curved surface (e.g., a curved surface 2S whose Gaussian curvature is not 0) by deformation or other suitable methods, it can be regarded as a stretchable substrate. In some embodiments, Figure 5As shown, the flexible substrate 12 may include a substrate 121 and a buffer layer 122, wherein the buffer layer 122 may be disposed between the substrate 121 and the light emitting unit 14 and between the substrate 121 and the peripheral circuit 16. In the present disclosure, the flexible substrate 12 having an opening may mean that the sub-opening 12a1 may penetrate the buffer layer 122 and the substrate 121. The specific structure of the substrate 121 and the buffer layer 122 will be described in the following embodiments, and the following embodiments of the substrate 121 and the buffer layer 122 may be applicable to Figure 2 In the embodiment of .

[0046] Furthermore, in certain embodiments, Figure 2 As shown, the flexible substrate 12 may include a plurality of island portions 12P1, a plurality of connecting portions 12P2, and a sheet portion 12P3. The width of the connecting portion 12P2 in a direction perpendicular to its extension direction may be smaller than the width of the side of the island portion 12P1, and two adjacent island portions 12P1 may be connected to each other through a connecting portion 12P2, so that the island portion 12P1 and the connecting portion 12P2 may be connected to form a grid-like shape, and thus the island portion 12P1 and the connecting portion 12P2 may form a plurality of sub-openings 12a1. For example, the sheet portion 12P3 may be a sheet structure disposed on the periphery of the island portion 12P1 and the connecting portion 12P2. In some embodiments, the area enclosed by the minimum distance between two adjacent openings 12a1 may be the connecting portion 12P2, and in other embodiments, the connection between two adjacent end points of the island portion 12P1 may serve as a dividing line between the island portion 12P1 and the connecting portion 12P2. In some embodiments, the maximum thickness of the connection portion 12P2 in the top-view direction ND may be less than the maximum thickness of the island portion 12P1 in the top-view direction ND, but is not limited thereto. Figure 2 In the embodiment of FIG. 1 , the island portion 12P1 and the connection portion 12P2 may be disposed in the display region R1 and the peripheral circuit region R2 , and the sheet portion 12P3 may be at least partially disposed in the dummy region R3 , but is not limited thereto. Figure 2 In the embodiment, the sheet-shaped portion 12P3 may be connected to the outermost island-shaped portion 12P1 and / or the outermost connecting portion 12P2, but is not limited thereto. Figure 2 As shown, one light emitting unit 14 may be disposed on one island portion 12P1, but the present disclosure is not limited thereto. In some embodiments, a plurality of light emitting units 14 may be disposed on one island portion 12P1, such as Figure 3 shown.

[0047] In some embodiments, Figure 2As shown, the flexible substrate 12 may have an outer edge 12S1 and an outer edge 12S2 , wherein the outer edge 12S1 may be substantially arc-shaped and disposed along the outer edge 2S1 of the transparent substrate 2 , and the outer edge 12S2 may be substantially straight and disposed along the outer edge 2S2 of the transparent substrate 2 .

[0048] The light-emitting unit 14 may include a light-emitting diode, fluorescence, phosphor, quantum dot (QD), other suitable display media, or a combination thereof, but is not limited thereto. In some embodiments, the display panel 10 may further include a transistor (not shown) and a wire (e.g., a transistor) electrically connecting the light-emitting unit 14, the transistor, and the peripheral circuit 16. Figure 3 The wire 22 shown in the figure), and the transistor and the wire can be arranged in the display area R1, wherein the wire can be a signal line, and the signal line can include, for example, a data line, a scan line, a shared line, a power line and / or other suitable signal lines, but is not limited thereto.

[0049] The peripheral circuit 16 may include, for example, a wire, a circuit, a conductive pad 18, and / or other suitable conductive elements. In some embodiments, the wire may be a trace, and the trace may include, for example, a line electrically connected to the signal line, the circuit, the conductive pad 18, and / or other suitable conductive elements, such as Fig.18 The conductive pad 18 may be, for example, a pad. The conductive wire may be, for example, disposed on the island portion 12P1, the connecting portion 12P2, and the sheet portion 12P3 located in the peripheral circuit region R2. In some embodiments, the conductive wire may also selectively include a crack sensing line (not shown) as the line closest to the outer edge of the flexible substrate 12 in the peripheral circuit 16. By setting the crack detection line, it is possible to detect whether the crack detection line is open at any time point to determine whether the crack extends into the peripheral circuit region R2 or the display region R1. The circuit may, for example, be disposed in the island portion 12P1, and may be electrically connected to the light-emitting unit 14 and / or the conductive pad 18 via a conductive wire. The circuit may, for example, include a gate drive circuit, a source drive circuit, a multiplexer (Mux), a demultiplexer (DeMux) and / or other suitable circuits, such as Fig.18 The circuit 52 shown in the figure, wherein the gate driver circuit may be, for example, a gate driver on panel (GOP). The conductive pad 18 may be, for example, disposed on the sheet portion 12P3 located in the peripheral circuit region R2, and is used to electrically connect the light emitting unit 14 to a control chip or other suitable components. Part of the peripheral circuit 16 may be disposed outside the display region R1. Figure 2In the embodiment of the present invention, the peripheral circuit 16 may surround the display region R1, for example, but is not limited thereto.

[0050] In the present disclosure, the interval G may be defined as the connection of two points P1 farthest from the light emitting unit 14 in the inner side of the dummy region R3 (e.g., the boundary between the dummy region R3 and the peripheral circuit region R2). In the present embodiment, the peripheral circuit 16 may extend to the outer edge of the flexible substrate 12 at the interval G to further electrically connect to other conductive elements. In some embodiments, the length of the interval G may be less than the perimeter of the dummy region R3.

[0051] exist Figure 2 In the embodiment of the present invention, the conductive pad 18 of the peripheral circuit 12 may be disposed adjacent to the gap G, so that the conductive pad 18 of the peripheral circuit 12 may be electrically connected to other circuits through the gap G.

[0052] exist Figure 2 In the embodiment of the present invention, the display panel 10 may include a circuit board 20, which is electrically connected to the peripheral circuit 16 through the gap G. Specifically, the circuit board 20 may be electrically connected to the peripheral circuit 16 through a conductive adhesive (e.g. Figure 5 The conductive adhesive 26 shown in the figure is electrically connected and bonded to the conductive pad 18 of the peripheral circuit 16, but is not limited to this. The circuit board 20 may, for example, include a flexible circuit board, a rigid circuit board, or a combination thereof. In some embodiments, a control chip may be selectively provided on the circuit board 20, but is not limited to this. In some embodiments, the display panel 10 may, for example, include a control chip or a control circuit, which is disposed on the conductive pad 18 in the peripheral circuit 16. It should be noted that the circuit board 20 and part of the peripheral circuit 16 may be disposed on the shielding portion 2B of the transparent substrate 2, and may be shielded by the door 3. For example, the circuit board 20 and at least part of the peripheral circuit 16 may overlap with the door 3 in the top-down direction ND of the display panel 10.

[0053] In addition, if Figure 2As shown, the gap G may have a length L1, and the dummy region R3 may have a perimeter L2. The perimeter L2 of the dummy region R3 may be defined as the distance from a point P1 along the outer edge of the dummy region R3 to another point P1. For example, the length L1 of the gap G may be less than the perimeter L2 of the dummy region R3 (L1 < L2). Alternatively, the length L1 of the gap G may be less than half of the perimeter L2 of the dummy region R3 (L1 < 0.5×L2). Or, the ratio of the length L1 of the gap G to the perimeter L2 ranges from 0.1 to 0.4 (0.1×L2 ≦ L1 ≦ 0.4×L2). It should be noted that when the gap G is too small, the density of the wires electrically connecting the conductive pads 18 in the peripheral circuit 16 may be too high, so that the wires made are prone to short circuits due to incomplete etching or external particles. When the gap G is too large, the dummy region R3 may not provide enough space, resulting in an increased risk of damage to the peripheral circuit 16 when attaching and / or cutting the display panel 10. Therefore, through the relationship between the length L1 of the gap G and the perimeter L2 as described above, the gap G and the dummy region R3 can have appropriate sizes, thereby reducing the short circuit of the peripheral circuit 16 or damage during attachment or cutting. In some embodiments, the perimeter of the dummy region R3 may be regarded as the perimeter L2 of the dummy region R3, and the perimeter L2 may not include the part where the dummy region R3 is connected to the display region R1 and the part where the dummy region R3 is connected to the peripheral circuit region R2. In Figure 2 In embodiments, the gap G may correspond to a part of the outer edge 12S2 of the flexible substrate 12, but is not limited thereto. In other words, in the top view direction ND, the gap G and the outer edge 12S2 may partially overlap. In some embodiments, the gap G may also correspond to a part of the outer edge 12S1 of the flexible substrate 12. In other words, in the top view direction ND, the gap G and the outer edge 12S2 may partially overlap.

[0054] The display panel and the window disclosed herein are not limited to the above embodiments. More variant embodiments and other embodiments of the present disclosure are described below. For the convenience of comparing different embodiments and simplifying the description, the same elements will be labeled with the same symbols below. The following description will detail the differences between different embodiments, and the same features will not be repeated.

[0055] Figure 3 Shown is a top view schematic diagram of a display panel according to some embodiments of the present disclosure. As Figure 3 shown, the gap G may correspond to at least part of the peripheral circuit region R2. For example, according to the design requirements of the vehicle door, such as the vehicle door switch corresponding to the outer edge 12S1 of the flexible substrate 12, the vehicle door opening upwards or other suitable designs, or other application requirements, the gap G corresponding to the peripheral circuit 12 may not be limited to being located at the outer edge 12S2 of the flexible substrate 12, at the outer edge 12S1, or in the peripheral circuit region.

[0056] In some embodiments, as Figure 3 As shown, a plurality of light emitting units 14 may be disposed on one island portion 12P1, but the present invention is not limited thereto. This situation may be applicable to any of the above or below embodiments. In some embodiments, the display panel 10A may further include a wire 22 electrically connecting the light emitting unit 14, but the present invention is not limited thereto.

[0057] Figure 4 FIG. 1 is a schematic top view of a window according to some embodiments of the present disclosure. Figure 5 The display panel is shown along Figure 4 A schematic cross-sectional view of the cross-sectional line A-A'. Figure 4 In the figure, the right part is an enlarged schematic diagram of the area RA, mainly showing the conductive pad 18 and the wire 24, and omitting the circuit board 20, but not limited thereto. Figure 4 As shown, in some embodiments, the peripheral circuit 16 of the display panel 10B may further include a wire 24 extending to the outer edge of the flexible substrate 12, for example, extending to the outer edge 12S2 of the flexible substrate 12, but not limited thereto. In some embodiments, when the interval G is located at the outer edge 12S1, the wire 24 may extend to the outer edge 12S1 of the flexible substrate 12. Specifically, the wire 24 may be electrically connected to the conductive pad 18 and extend to the outer edge of the display panel 10B, so that the end of the wire 24 may be exposed and the static electricity therein is released, so the wire 24 may serve as an electrostatic protection element. By setting the wire 24, the circuit board 20 or the element electrically connected to the conductive pad 18 may be protected from damage by static electricity. The wire 24 may include a semiconductor, a conductor, or a combination thereof. The semiconductor may, for example, include polysilicon, an oxide semiconductor, or other suitable semiconductors. The conductor may, for example, include a metal, a transparent conductive composite (such as indium tin oxide), or a combination thereof. When the wire 24 includes a semiconductor, since the semiconductor is not easily oxidized by water vapor or oxygen, a good electrostatic protection effect may be achieved.

[0058] like Figure 5 As shown, in one embodiment, the flexible substrate 12 may include a substrate 121 and a buffer layer 122 stacked in sequence. Figure 5Not shown, but the substrate 121 and the buffer layer 122 may extend into the display region R1 and the dummy region R3. In some embodiments, the substrate 121 may, for example, include a single-layer structure or a multi-layer structure. In the case where the substrate 121 includes a multi-layer structure, the substrate 121 may, for example, include a stack of a soft substrate material 1211, an inorganic insulating layer 1212, and a soft substrate material 1211, wherein the inorganic insulating layer 1212 is disposed between the soft substrate material 1211, so as to enhance the ability of the soft substrate 12 to block moisture and oxygen, but is not limited thereto. For example, the material of the substrate 121 may include a suitable transparent material, a translucent material, or an opaque substrate material, but is not limited thereto. In some embodiments, the soft substrate material 1211 may, for example, include polycarbonate (PC), polyimide (PI), polypropylene (PP), or polyethylene terephthalate (PET), other suitable materials, or a combination of the foregoing materials, but is not limited thereto. The inorganic insulating layer 1212 may include, for example, silicon oxide, silicon nitride, silicon oxynitride, a combination of at least two thereof, and / or other suitable inorganic insulating materials.

[0059] The buffer layer 122 may include a single-layer structure or a multi-layer structure. In some embodiments, when the buffer layer 122 includes a multi-layer structure, the buffer layer 122 may include a stack of multiple inorganic insulating layers 1221 to enhance the ability of the flexible substrate 12 to block moisture and oxygen, but is not limited thereto. The number of inorganic insulating layers 1221 in the buffer layer 122 can be adjusted according to demand. In some embodiments, the inorganic insulating layer 1221 of the buffer layer 122 may, for example, include silicon oxide, silicon nitride, silicon oxynitride, a combination of at least two of the above, and / or other suitable inorganic insulating materials. In some embodiments, the buffer layer 122 may also include an inorganic insulating layer 1221, an organic insulating layer, and a stack of an inorganic insulating layer 1221, but is not limited thereto. Figure 5 In the embodiment of the present invention, the conductive pad 18 may be disposed in the hole of the buffer layer 122, but is not limited thereto. Figure 5 As shown, the conductive wire 24 may be disposed between the inorganic insulating layers 1221 of the buffer layer 122, but is not limited thereto. In some embodiments, the buffer layer 122 may be omitted, but is not limited thereto.

[0060] It should be noted that since the flexible substrate 12 is patterned, the ability of the flexible substrate 12 to block moisture and oxygen may be reduced. Therefore, the multi-layer buffer layer 122 and the multi-layer substrate 121 can improve the ability of the flexible substrate 12 to block moisture and oxygen, thereby improving the reliability of the display panel 1.

[0061] like Figure 5 As shown, the circuit board 20 can be electrically connected to the conductive pad 18 through the conductive adhesive 26. The conductive adhesive 26 can include, for example, an anisotropic conductive film (ACF). In some embodiments, the display panel 10B further includes a protective layer 28, which is disposed on the flexible substrate 12, the conductive pad 18 and a portion of the circuit board 20 to protect the peripheral circuit 16, the light-emitting unit 14 and the junction between the circuit board 20 and the conductive pad 18. The protective layer 28 can include, for example, an organic material or other suitable materials.

[0062] In some embodiments, Figure 4 As shown, the display area R1 may be adjacent to the dummy area R3. For example, the peripheral circuit area R2 may partially surround the display area R1. This situation may be applicable to any of the above or below embodiments. In some embodiments, Figure 4 The peripheral circuit region R2 of the embodiment may also surround the display region R1 or be located at one side of the display region R1.

[0063] Figure 6 FIG. 1 is a schematic top view of a window according to some embodiments of the present disclosure. Figure 7 Shown Figure 6 An enlarged schematic diagram of the region RB, Figure 8 Shown along Figure 7 In order to clearly illustrate the top view structure of the conductive pad 18 and the conductive wire 24 of the display panel 10B, Figure 6 The circuit board 20 is omitted, and the area RB corresponds to a single conductive pad 18 and a conductive wire 24, but is not limited thereto. Figure 8 The substrate 121 is omitted to clearly illustrate the cross-sectional structure of the electrically connected conductive pad 18 and the conductive wire 24, but the present disclosure is not limited thereto. Figure 6 In the embodiment of the present invention, the display panel 10B may include a plurality of conductive pads 18 and a plurality of conductive wires 24, and the conductive pads 18 may be electrically connected to corresponding conductive wires 24, but the present disclosure is not limited thereto. Figure 7 and Figure 8 As shown, in one embodiment, the display panel 10B includes not only the buffer layer 122 and the conductive wire 24, but also an insulating layer 30, a first conductive layer C1, an insulating layer 32, a second conductive layer C2, an insulating layer 34, a third conductive layer C3 and / or a planar layer 36, but is not limited thereto. Figure 7 and Figure 8In the embodiment of the present invention, the wire 24 may be disposed on the buffer layer 122. For example, the wire 24 and the semiconductor layer of the transistor of the display panel 10B in the display area R1 may include the same material, be formed by the same process, or be formed by the same film layer. The insulating layer 30 may be disposed on the wire 24 and the buffer layer 122. The first conductive layer C1 may include an electrode 38 disposed on the insulating layer 30, and the insulating layer 32 may be disposed on the first conductive layer C1. The insulating layer 30 and the insulating layer 32 may have a hole TH1 corresponding to the wire 24, and the insulating layer 32 may have a hole TH2 and a plurality of holes TH3. The second conductive layer C2 is formed on the insulating layer 32 and may include a connecting wire 40 and an electrode 42. The connecting wire 40 may extend into the hole TH1 and the hole TH2 to be electrically connected to the wire 24 and the electrode 38, respectively, so that the wire 24 and the electrode 38 may be electrically connected to each other. The electrode 42 may extend into the hole TH3 to be electrically connected to the electrode 38. The insulating layer 34 is disposed on the second conductive layer C2 and has a hole TH4 corresponding to the electrode 38. The third conductive layer C3 is formed on the insulating layer 34 and includes an electrode 44. The electrode 44 can extend into the hole TH4 to be electrically connected to the electrode 42, so that the electrode 44 can be electrically connected to the corresponding wire 24 through the electrode 42, the electrode 38 and the connecting line 40. Figure 8 In the embodiment, the conductive pad 18 may be, for example, a multilayer structure, and include an electrode 44, an electrode 42, and an electrode 38, but the present disclosure is not limited thereto. Through the connecting wire 40, the conductive pad 18 may be electrically connected to the corresponding wire 24, and the static electricity is guided to the outer edge of the display panel 10B through the connecting wire 40 through the wire 24, thereby reducing the damage of the display panel 10B caused by static electricity. It should be noted that since the electrode 44 extends into the hole TH4, it may have an undulating upper surface. When the circuit board is bonded to the conductive pad 18 through the conductive adhesive, the undulating upper surface of the electrode 44 may help to increase the area bonded to the circuit board, thereby improving the bonding degree between the conductive pad 18 and the circuit board.

[0064] For example, the first conductive layer C1, the second conductive layer C2, and the third conductive layer C3 may each include a metal, a transparent conductive compound, other suitable conductive materials, or a combination thereof, but is not limited thereto. The metal may, for example, include molybdenum (Mo), aluminum (Al), titanium (Ti), copper (Cu), other suitable metals, or a combination thereof. The transparent conductive compound may, for example, include indium tin oxide (ITO), indium zinc oxide (IZO), or other suitable transparent conductive materials. The first conductive layer C1, the second conductive layer C2, and the third conductive layer C3 may, for example, be a single-layer structure or a multi-layer structure. The multi-layer structure may, for example, include a stack of molybdenum / aluminum / molybdenum, a stack of titanium / aluminum / titanium, a stack of titanium / aluminum / molybdenum, a stack of titanium / copper / titanium, or other suitable metal stack combinations.

[0065] The insulating layer 30, the insulating layer 32, the insulating layer 34 and the planar layer 36 may include insulating materials, for example, the insulating materials may include inorganic insulating materials or organic insulating materials. The inorganic insulating materials may include silicon oxide, silicon nitride, silicon oxynitride or other suitable inorganic materials. In some embodiments, the insulating layer 32 may include a multilayer structure, for example, including a multilayer insulating layer 321. In some embodiments, two insulating layers 321 adjacent to each other may include different insulating materials, for example, silicon oxide and silicon nitride, respectively, but not limited thereto.

[0066] Fig. 9 FIG. 2 is a schematic top view of a window according to some embodiments of the present disclosure. Fig. 9 As shown, in some embodiments, the flexible substrate 12 may selectively include a crack blocking structure 46, which is located in the dummy area R3, to prevent the side cracks of the flexible substrate 12 from further extending into the peripheral circuit area R2 and the display area R1, so as to reduce damage to the display panel 10C. For example, the crack blocking structure 46 may include at least one groove. The groove may extend along the outer edge 12S1 of the flexible substrate 12, and the two ends of the groove may be, for example, adjacent to the outer edge 12S2 of the flexible substrate 12. In some embodiments, the groove may be bent toward the peripheral circuit area R2 adjacent to the outer edge 12S2, so that at least one end thereof may be adjacent to the peripheral circuit area R2, but is not limited thereto. In some embodiments, the peripheral circuit area R2 may surround or partially surround the display area R1, or be located on one side of the display area R1. In some embodiments, Fig. 9 The crack barrier structure 46 shown may be suitable for use in any of the above or below described embodiments.

[0067] Fig.10 FIG. 2 is a schematic cross-sectional view of a display panel according to some embodiments of the present disclosure. Fig.10 As shown, in some embodiments, the crack blocking structure 46 may have at least one trench, and the trench may be located in the buffer layer 122. Fig.10 In the embodiment, the buffer layer 122 may be, for example, a single-layer inorganic insulating layer, and the crack blocking structure 46 includes the groove 461 and the groove 462, but is not limited thereto. In this case, the width W1 of the crack blocking structure 46 may be defined as the width W1 from the closest to the display area (e.g. Fig. 9 In some embodiments, the width W1 of the crack blocking structure 46 may be a distance from an edge of the groove 461 closest to the display area to an edge of the groove 462 farthest from the display area (as viewed in the cross-sectional direction). In some embodiments, the width W1 of the crack blocking structure 46 may be a distance from an edge of the bottom of the groove 461 closest to the display area to an edge of the bottom of the groove 462 farthest from the display area away from the display area (as viewed in the cross-sectional direction).

[0068] like Fig.10As shown, in one embodiment, the depth of the groove (e.g., the depth H1 of the groove 461) may be less than the thickness T1 of the buffer layer 122. In some embodiments, the groove (e.g., the groove 462) may penetrate the buffer layer 122 to expose the substrate 121, and the groove 462 may have a depth H2 that is substantially the same as the thickness T1 of the buffer layer 122. In some embodiments, the groove (e.g., the groove 462) may penetrate the buffer layer 122 and a portion of the substrate 121, and the depth H2 of the groove 462 may be greater than the thickness T1 of the buffer layer 122. In some embodiments, the protective layer 28 may be disposed in the groove 461 and the groove 462, but is not limited thereto. In some embodiments, the buffer layer 122 may have a taper angle θ at the sidewalls of the groove 461 and / or the groove 462, which may range, for example, from about 70 degrees to about 90 degrees, for example, 80 degrees, but is not limited thereto. In some embodiments, Fig.10 The crack barrier structure 46 shown may be suitable for use in any of the above or below described embodiments.

[0069] Fig.11 FIG. 2 is a schematic cross-sectional view of a display panel according to some embodiments of the present disclosure. Fig.11 As shown, in some embodiments, the buffer layer 122 of the flexible substrate 12 may be, for example, a single-layer structure or a multi-layer structure. The multi-layer structure may, for example, include an inorganic insulating layer 1221 and an inorganic insulating layer 1222. The groove 461 of the crack blocking structure 46 may penetrate the inorganic insulating layer 1221 but not the inorganic insulating layer 1222. The number of the inorganic insulating layer 1221 and the inorganic insulating layer 1222 may be, for example, one or more layers respectively. Fig.11 In the embodiment, the groove 46 may penetrate the multi-layer inorganic insulating layer 1221, and the groove 461 does not penetrate the inorganic insulating layer 1222. The inorganic insulating layer 1221 penetrated by the groove 46 may have a taper angle θ, and the taper angle θ may range from about 70 degrees to about 90 degrees, for example.

[0070] exist Fig.11 In the embodiment of the present invention, the width W1 of the crack blocking structure 46 may be defined as the width closest to the display area (eg Fig. 9The distance between the edge of the groove 461 closest to the display area side of the display area R1 shown and the edge of the groove 461 farthest from the display area side farthest from the display area side (as viewed from the cross-sectional direction). In some embodiments, the width W1 of the crack blocking structure 46 may be the distance from the edge of the bottom of the groove 461 closest to the display area side to the edge of the bottom of the groove 462 farthest from the display area side farthest from the display area side (as viewed from the cross-sectional direction). For example, the width W1 of the crack blocking structure 46 may be greater than or equal to 10 microns and less than or equal to 100 microns (10μm≦W1≦100μm), such as 30 microns, 50 microns, 70 microns, or 90 microns, but not limited thereto. Alternatively, the width W1 of the crack blocking structure 46 may be greater than or equal to 20 microns and less than or equal to 40 microns (20μm≦W1≦40μm). In some embodiments, Fig.11 The crack barrier structure 46 shown may be suitable for use in any of the above or below described embodiments.

[0071] Fig.12 FIG. 2 is a schematic cross-sectional view of a display panel according to some embodiments of the present disclosure. Fig.12 As shown, in some embodiments, the crack blocking structure 46 may include an inorganic insulating layer 463 and an organic insulating layer 464 in addition to the groove 461, and is disposed between the protection layer 28 and the buffer layer 122. Fig.12 In the embodiment of , the organic insulating layer 464 may be disposed in the groove 461, and the inorganic insulating layer 463 is disposed on the organic insulating layer 464 and the buffer layer 122, so that the portion of the inorganic insulating layer 463 disposed on the organic insulating layer 464 is separated from the buffer layer 122. Fig.12 In the embodiment of the present invention, the groove 461 near the display area (eg Fig. 9 The display area R1 shown in the figure is from one side of the groove 461 to the dummy area (eg Fig. 9 In the cross section of the side of the dummy region R3 shown in the figure, for example, in the cross section perpendicular to the extension direction of the crack blocking structure 46, the width W1 of the crack blocking structure 46 can be defined as the distance between the projection of the starting point and the end point of the separation of the inorganic insulating layer 463 and the buffer layer 122 onto the same horizontal plane (for example, the surface of the substrate 121). In this case, the width W1 of the crack blocking structure 46 can be greater than or equal to 10 microns and less than or equal to 100 microns (10μm≦W1≦100μm), for example, 20 microns, 40 microns, 60 microns, or 80 microns. In some embodiments, the organic insulating layer 464 can have a maximum height H3, and the range of the height H3 can be, for example, greater than or equal to 0.5 microns and less than or equal to 10 microns (0.5μm≦H3≦10μm), for example, 2 microns, 4 microns, 6 microns, or 8 microns, or greater than or equal to 1 micron and less than or equal to 3 microns (1μm≦H3≦3μm). Fig.12In the embodiment of the present invention, a portion of the inorganic insulating layer 463 may contact the uppermost inorganic insulating layer 1221 of the buffer layer 122, and another portion may contact the inorganic insulating layer 1222 of the buffer layer 122, but the present invention is not limited thereto. In some embodiments, portions of the inorganic insulating layer 463 located on both sides of the organic insulating layer 464 may both contact the uppermost inorganic insulating layer 1221 of the buffer layer 122.

[0072] In some embodiments, the inorganic insulating layer 1222 in the buffer layer 122 that is not penetrated by the groove 461 can be a single-layer structure or a multi-layer structure. For example, the multi-layer structure of the inorganic insulating layer 1222 may include different insulating materials, such as silicon oxide or silicon nitride, respectively. For example, silicon oxide layers and silicon nitride layers can be stacked alternately. In some embodiments, the inorganic insulating layer 463 can be a single-layer structure or a multi-layer structure. For example, the multi-layer structure of the inorganic insulating layer 463 can include different insulating materials, such as silicon oxide or silicon nitride, respectively. For example, silicon oxide layers and silicon nitride layers can be stacked alternately. In some embodiments, the above-mentioned crack blocking structure 46 can be applicable to any of the above-mentioned or following embodiments.

[0073] Fig.13 FIG. 1 is a partial top view of a display panel according to some embodiments of the present disclosure. Fig.14 Shown along Fig.13 To clearly show the relationship between the crack blocking structure 46 and the outer edge of the flexible substrate 12 and the peripheral circuit 16, Fig.13 The portion of the flexible substrate 12 adjacent to the connection between the outer edge 12S1 and the outer edge 12S2 is shown, but the present invention is not limited thereto. Fig.13 As shown, in some embodiments, the distance d1 between the crack blocking structure 46 and the peripheral circuit region R2 may be smaller than the distance d2 between the crack blocking structure 46 and the outer edge of the dummy region R3. Fig.13 As shown, the distance d1 may be, for example, the distance (minimum distance) between the groove 461 and the peripheral circuit region R2 in a direction parallel to the extension direction of the interval G, and the groove 461 and the outer edge of the flexible substrate 12 (i.e., the outer edge of the dummy region R3) may have a distance d2 along the extension line of the distance d1. It should be noted that since the distance d1 is smaller than the distance d2, when the display panel 10C is cut, the damage to the crack blocking structure 46 caused by cutting can be reduced.

[0074] In some embodiments, Fig.13 As shown, a portion of the dummy region R3 may extend between the peripheral circuit region R2 and the outer edge 12S2 of the flexible substrate 12 , but is not limited thereto.

[0075] exist Fig.14In the embodiment of the present invention, when the crack blocking structure 46 includes a plurality of grooves 461, the distance d1 between the crack blocking structure 46 and the peripheral circuit region R2 may refer to the distance between the bottom of the groove 461 closest to the peripheral circuit region R2 and the outer edge of the peripheral circuit 16 when viewed from the top view direction ND of the display panel 10C. The distance d2 between the crack blocking structure 46 and the outer edge of the dummy region R3 may refer to the distance between the bottom of the groove 461 closest to the outer edge of the flexible substrate 12 and the outer edge of the flexible substrate 12 when viewed from the top view direction ND of the display panel 10C. In some embodiments, as Fig.14 As shown, the trench 461 may penetrate the buffer layer 122 , but is not limited thereto.

[0076] In some embodiments, when the crack blocking structure 46 is Fig.12 In the structure shown, the distance d1 between the crack blocking structure 46 and the peripheral circuit area R2 may refer to the distance between the outer edge of the organic insulating layer 464 adjacent to the peripheral circuit area R2 and the peripheral circuit 16 when viewed from the top direction ND of the display panel 10C, and the distance d2 between the crack blocking structure 46 and the outer edge of the dummy area R3 may refer to the distance between the edge of the organic insulating layer 464 adjacent to the outer edge of the dummy area R3 and the outer edge of the dummy area R3.

[0077] Fig.15 FIG. 2 is a schematic top view of a window according to some embodiments of the present disclosure. Fig.15 As shown, the width W2 of the dummy region R3 may be greater than or equal to 50 microns and less than or equal to half of the width W3 of the display region R1 (50μm≦W2≦0.5×W3). The width W3 of the display region R1 here may be defined as the maximum width of the display region R1 in any direction. For example, the width W2 of the dummy region R3 may be the minimum width of the dummy region R3 in a direction parallel to the extension direction of the interval G, and the width W3 of the display region R1 may be the maximum width in a direction parallel to the extension direction of the interval G. It should be noted that by having a dummy region R3 with sufficient width, the deviation of the bonding can be allowed when the display panel 10D is bonded to the transparent substrate 2, thereby reducing the abnormality caused by the light-emitting unit 14 and / or the peripheral circuit 16 being bonded beyond the transparent substrate 2. Alternatively, due to a deposition process, such as physical vapor deposition or chemical vapor deposition, on an adjacent substrate (such as Figure 5 The film thickness formed in the edge area of ​​the substrate 121 shown in the figure is prone to be uneven, so by limiting the width W2 of the above-mentioned dummy area R3, it is possible to reduce or avoid the peripheral circuit 16 being formed by an uneven film layer.

[0078] In some embodiments, the dummy region R3 may be adjacent to the display region R1, so that the peripheral circuit region R2 is located on one side of the display region R1 adjacent to the gap G. This situation may be applicable to any of the above or below embodiments. In some embodiments, Fig.15 In the embodiment of the present invention, the peripheral circuit region R2 may also surround or partially surround the display region R1.

[0079] Fig.16 FIG. 1 is a top view of a display panel of some embodiments of the present disclosure attached to a transparent substrate before being cut. Fig.17 Shown Fig.16 A schematic cross-sectional view of the display panel and the transparent substrate after bonding and cutting in the region RC. Fig.16 As shown, before cutting the display panel 10E, the size of the display panel 10E can be larger than the exposed portion 2A of the transparent substrate 2. Moreover, after the display panel 10E is attached to the transparent substrate 2, the portion of the display panel 10E that exceeds the edge of the transparent substrate 2 can be removed by the cutting tool 48. Specifically, the portion of the display panel 10E that exceeds the transparent substrate 2 is the dummy region R3 of the flexible substrate 12, so the portion of the dummy region R3 of the flexible substrate 12 is removed during cutting. Therefore, by designing the dummy region R3 of the flexible substrate 12 before cutting to exceed the outer edge of the exposed portion 2A of the transparent substrate 2, the difficulty of alignment can be reduced and / or the lamination time can be reduced.

[0080] like Fig.17 As shown, after cutting the display panel 10E, the outer edge of the display panel 10E (e.g., the outer edge 12S1 of the flexible substrate 12) and the outer edge of the transparent substrate 2 (e.g., the outer edge 2S1 of the transparent substrate 2) may have a distance d3. For example, the distance d3 may be greater than or equal to 1 millimeter (mm) and less than or equal to 20 millimeters (1mm≦d3≦20mm), such as 5 mm, 10 mm, or 15 mm, but is not limited thereto. It is worth mentioning that in the application of car windows, the distance d3 between the outer edge of the display panel 10E and the outer edge of the transparent substrate 2 is used to reduce the peeling of the display panel 10E caused by the window opening and closing. In some embodiments, the shape of the display panel 10E before cutting may be the same as or similar to the shape of the transparent substrate 2, or the shape of the display panel 10E may be the same as the shape of the transparent substrate 2 only after cutting.

[0081] Fig.18 FIG. 2 is a schematic top view of a window according to some embodiments of the present disclosure. Fig.18As shown, in some embodiments, the opening 12a may be further located in the dummy area R3. Specifically, the flexible substrate 12 in the dummy area R3 may also have a patterned structure, that is, the flexible substrate 12 may include a plurality of sub-openings 12a1, which are disposed in the dummy area R3. Therefore, the opening 12a formed by all the sub-openings 12a1 may be located in the display area R1, the peripheral circuit area R2, and the dummy area R3. In detail, the sheet portion 12P3 of the flexible substrate 12 may overlap with the door 3 in the top-view direction ND of the display panel 10F, and be disposed on a portion of the shielding portion 2B of the transparent substrate 2, so that the plurality of island portions 12P1 and the plurality of connecting portions 12P2 of the flexible substrate 12 may be disposed in the display area R1, the peripheral circuit area R2, and the dummy area R3. In this case, the outer edge of the part of the dummy area R3 may be defined by the outer edge or outer corner of the outermost island portion 12P1 of the flexible substrate 12. By disposing the opening 12 a in the dummy region R3 , the display panel 10F can be substantially attached to the curved surface 2S whose Gaussian curvature is not zero and which is curved in at least two different directions.

[0082] In some embodiments, the shapes of the island portions 12P1 in the display region R1, the peripheral circuit region R2, and the dummy region R3 may be substantially the same, or the shapes of the island portions 12P1 in at least two of them may be different. For example, the shape of the island portion 12P1 may include a rhombus, a rectangle, or other suitable shapes. In some embodiments, the sizes of the island portions 12P1 in the display region R1, the peripheral circuit region R2, and the dummy region R3 may be substantially the same, or the sizes of the island portions 12P1 in at least two of them may be different. For example, the size of the island portion 12P1 in the dummy region R3 may be larger than the size of the island portion 12P1 in the peripheral circuit region R2, and the size of the island portion 12P1 in the peripheral circuit region R2 may be larger than the size of the island portion 12P1 in the display region R1, but is not limited thereto.

[0083] In some embodiments, the peripheral circuit 16 may include a wire 50 disposed on at least one of the island portions 12P1. In some embodiments, the peripheral circuit 16 may include a circuit 52 and a wire 50 disposed on at least one of the island portions 12P1.

[0084] In some embodiments, when the opening 12a may be further located in the dummy region R3, the display region R1 may be adjacent to the dummy region R3, for example, the peripheral circuit region R2 may partially surround the display region R1. Alternatively, the dummy region R3 may be adjacent to the display region R1, so that the peripheral circuit region R2 is located on one side of the display region R1 adjacent to the gap G.

[0085] In summary, in the window disclosed herein, the transparent substrate has a Gaussian curvature not equal to 0. In order to reduce damage to the peripheral circuits and light-emitting units in the display panel after being attached to the transparent substrate, the flexible substrate of the display panel may have a dummy area without conductors and semiconductors around the peripheral circuits. Therefore, when attaching the display panel to the transparent substrate or cutting the display panel, the dummy area of ​​the flexible substrate may provide a buffer for attachment or cutting, or the setting of the dummy area may also reduce the impact of cracks on the outer edge of the flexible substrate on the light-emitting units and peripheral circuits. Through the above design, the flexible display panel can be attached to a curved surface with a Gaussian curvature not equal to 0, thereby improving the application field of the display panel.

[0086] The above description is only an embodiment of the present disclosure and is not intended to limit the present disclosure. For those skilled in the art, the present disclosure may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present disclosure shall be included in the protection scope of the present disclosure.

Claims

1. An electronic device, characterized in that: include: A flexible substrate, comprising:

1. District 1; a second region adjacent to the first region; and a dummy region partially surrounding the second region and forming a gap; a plurality of electronic units disposed in the first area; a peripheral circuit disposed in the second area and used to drive the plurality of electronic units, the peripheral circuit comprising a conductive line extending to an outer edge of the flexible substrate; and a circuit board electrically connected to the peripheral circuit through the spacer, Wherein, no conductor or semiconductor is arranged on the dummy area of ​​the flexible substrate. The position between a first point and a second point on the inner side of the dummy area farthest from the plurality of electronic units is defined as the interval, The length of the interval of the dummy area is defined as the distance between the first point and the second point, the perimeter of the dummy area is defined as the distance from the first point to the second point along the outer edge of the dummy area, and the length of the interval of the dummy area is less than half of the perimeter of the dummy area.

2. The electronic device according to claim 1, wherein: A ratio of the length of the interval of the dummy region to the perimeter of the dummy region is greater than or equal to 0.1 and less than or equal to 0.

4.

3. The electronic device according to claim 1, wherein: The plurality of electronic units include a plurality of organic light emitting diodes.

4. The electronic device according to claim 1, wherein: The plurality of electronic units include a plurality of inorganic light emitting diodes.

5. The electronic device according to claim 1, wherein: The flexible substrate includes a crack blocking structure arranged in the dummy area.

6. The electronic device as claimed in claim 5, characterized in that: The crack blocking structure includes a trench.

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