Display module and manufacturing method thereof

Abstract

A display module and a manufacturing method thereof, the display module comprising: a display panel; the display panel comprising a display area, a bending area and a binding area; the bending area being located between the display area and the binding area; a flexible circuit board being located on a side of the display area away from a display side and being bound with the binding area; a heat dissipation film being attached to a back surface of the display panel away from the display side and being bonded with the flexible circuit board and the binding area; the back surface comprising an upper area and a lower area, the lower area being located between the upper area and the bending area, the heat dissipation film comprising electrically connected first and second sub heat dissipation films, the first sub heat dissipation film being attached to at least the lower area, and the second sub heat dissipation film being attached to the upper area; at least a partial area of the flexible circuit board and the binding area being located in a front projection of the back surface in the lower area; the back surface being provided with an alignment mark, the alignment mark being located in the lower area close to the bending area and being covered by the first sub heat dissipation film.

Description

Technical Field

[0001] The present disclosure relates to the field of display technology, and in particular to a display module and a manufacturing method thereof. Background Art

[0002] In the display field, organic light-emitting diode (OLED) modules have become the preferred display modules for smartphones due to their advantages such as high brightness, high contrast, and high refresh rate.

[0003] Currently, flexible OLED display modules first bind the display panel to a flexible printed circuit (FPC), then attach a glass cover and a heat dissipation film (SCF) to the display panel. Finally, the binding area is bent and the binding area and FPC are attached to the SCF surface.

[0004] In order to ensure bending accuracy, it is necessary to grasp the alignment mark (T mark for short) in the display area of ​​the display panel before performing alignment bending. This requires the SCF to be grooved at the position corresponding to the above-mentioned alignment mark, and because the SCF has an attachment tolerance, the groove is usually required to be larger than the alignment mark.

[0005] However, with the further development of OLED display modules and the increasingly stringent demand for narrow bezels, the aforementioned slots expose the display panel's alignment marks and nearby wiring. In an electrostatic field, static electricity can cause burns on the display panel, short-circuiting the wiring exposed in the slots and causing screen flickering. Summary of the Invention

[0006] The embodiments of the present disclosure provide a display module and a manufacturing method thereof, so as to solve the above-mentioned technical problems existing in the prior art.

[0007] In a first aspect, to solve the above technical problems, the present disclosure provides a display module, comprising:

[0008] The display panel comprises a display area, a bending area and a binding area; the bending area is located between the display area and the binding area;

[0009] a flexible circuit board, located on a side of the display area away from the display side and bound to the binding area;

[0010] A heat dissipation film is applied to the back side of the display panel away from the display side and is bonded to the flexible circuit board and the binding area; the back side includes an upper area and a lower area, the lower area is located between the upper area and the bending area, the heat dissipation film includes a first sub-heat dissipation film and a second sub-heat dissipation film that are electrically connected, the first sub-heat dissipation film is at least attached to the lower area, and the second sub-heat dissipation film is attached to the upper area; at least part of the area of ​​the flexible circuit board and the binding area are projected on the back side in the lower area; an alignment mark is provided on the back side, the alignment mark is located in the lower area close to the bending area and is covered by the first sub-heat dissipation film.

[0011] In a possible implementation manner, the first sub-heat dissipation film includes a first sub-conductive layer, the second sub-heat dissipation film includes a second sub-conductive layer, and a gap is provided between the first sub-heat dissipation film and the second sub-heat dissipation film;

[0012] The display module further includes: a conductive structure, which covers the gap and is connected to the first sub-conductive layer and the second sub-conductive layer; wherein the conductive structure is light-shielding.

[0013] In a possible implementation manner, the first sub-heat dissipation film covers the flexible circuit board, and the conductive structure is:

[0014] A first conductive adhesive covers the gap area; wherein the first conductive adhesive is light-shielding.

[0015] In one possible implementation manner, the first conductive adhesive includes:

[0016] Conductive glue is filled in the gap between the first sub-heat dissipation film and the second sub-heat dissipation film;

[0017] Alternatively, a conductive tape or conductive paper is arranged to overlap with the first sub-conductive layer and the second sub-conductive layer.

[0018] In one possible implementation, the conductive glue includes:

[0019] A first sub-glue is filled in the gap between the first sub-heat dissipation film and the second sub-heat dissipation film; wherein the first sub-glue is light-shielding;

[0020] The second sub-glue is coated on the side of the first sub-glue away from the back side and the coating width is greater than the width of the gap. The second sub-glue is connected to the first sub-conductive layer and the second sub-conductive layer; wherein the second sub-glue is conductive.

[0021] In a possible embodiment, the width of the overlapping area between the conductive tape or the charged adhesive paper and the first sub-heat dissipation film is in the range of 2mm to 5mm, and / or the width of the overlapping area between the conductive tape or the charged adhesive paper and the second sub-heat dissipation film is in the range of 2mm to 5mm.

[0022] In one possible implementation, the flexible circuit board covers the gap and overlaps the first sub-heat dissipation film and the second sub-heat dissipation film; a conductive glue is provided on a side of the flexible circuit board close to the first sub-heat dissipation film; the conductive glue covers the gap and overlaps the first sub-heat dissipation film and the second sub-heat dissipation film;

[0023] The flexible circuit board and the conductive glue are reused to form the conductive structure.

[0024] In a possible implementation manner, the first sub-heat dissipation film and the second sub-heat dissipation film overlap and are electrically connected.

[0025] In a possible implementation manner, the heat dissipation film includes:

[0026] an adhesive layer located on one side of the back surface; the adhesive layer includes a first sub-adhesive layer and a second sub-adhesive layer, and a gap is formed between the first sub-adhesive layer and the second sub-adhesive layer;

[0027] A conductive layer is located on the side of the adhesive layer away from the back side; the conductive layer includes a first sub-conductive layer and a second sub-conductive layer that are overlapped; wherein the first sub-conductive layer covers the first sub-adhesive layer and the gap and the overlapping area between the first sub-conductive layer and the second sub-conductive layer, the orthographic projection of the overlapping area on the adhesive layer is located within the second sub-adhesive layer, the second sub-conductive layer covers the second sub-adhesive layer, the first sub-heat dissipation film includes the first sub-adhesive layer and the first sub-conductive layer, and the second sub-heat dissipation film includes the second sub-adhesive layer and the second sub-conductive layer.

[0028] In a possible implementation manner, the heat dissipation film includes:

[0029] an adhesive layer located on one side of the back surface;

[0030] The conductive layer is located on a side of the adhesive layer away from the back surface.

[0031] In some embodiments, in the arrangement direction of the first sub-heat dissipation films, a ratio of a length of the first sub-heat dissipation film to a length of the second sub-heat dissipation film is in a range of 1 / 2 to 1.

[0032] In a second aspect, an embodiment of the present disclosure provides a method for manufacturing a display module, comprising:

[0033] Binding the flexible circuit board to the binding area of ​​the display panel; the display panel includes a display area, a bending area and the binding area; the bending area is located between the display area and the binding area;

[0034] attaching a first sub-heat dissipation film to the binding area and at least a portion of the flexible circuit board;

[0035] Attaching the second sub-heat dissipation film to the upper area; wherein the back of the display panel includes the upper area and the lower area, and the lower area is located between the upper area and the bending area;

[0036] Based on the alignment mark on the display panel, the bending area is bent, and the side of the first sub-heat dissipation film facing away from the binding area is adhered to at least the lower area; wherein, at least part of the area of ​​the flexible circuit board and the positive projection of the binding area on the back are located in the lower area; an alignment mark is provided on the back, and the alignment mark is located in the lower area close to the bending area, and after bending, the first sub-heat dissipation film covers the alignment mark.

[0037] In one possible implementation manner, the first sub-heat dissipation film includes a first sub-conductive layer, and the second sub-heat dissipation film includes a second sub-conductive layer. After adhering a side of the first sub-heat dissipation film facing away from the binding area to at least the lower region, the method further comprises:

[0038] A conductive structure is provided to connect the first sub-conductive layer and the second sub-conductive layer; the conductive structure covers the gap between the first sub-heat dissipation film and the second sub-heat dissipation film. BRIEF DESCRIPTION OF THE DRAWINGS

[0039] Figure 1 A top view of the back of a display panel in the related art;

[0040] Figure 2 A top view of the back of a display module before being bent provided by an embodiment of the present disclosure;

[0041] Figure 3 A schematic diagram of the structure of a display module after bending provided by an embodiment of the present disclosure;

[0042] Figure 4 A schematic structural diagram of another display module provided in an embodiment of the present disclosure;

[0043] Figure 5-Figure 6 A schematic structural diagram of another display module provided in an embodiment of the present disclosure;

[0044] Figure 7 A schematic structural diagram of another display module provided in an embodiment of the present disclosure;

[0045] Figure 8 A schematic structural diagram of another display module provided in an embodiment of the present disclosure;

[0046] Figure 9 A schematic structural diagram of a heat dissipation film provided in an embodiment of the present disclosure;

[0047] Figure 10 A schematic structural diagram of another display module provided in an embodiment of the present disclosure;

[0048] Figure 11 A schematic structural diagram of another display module provided in an embodiment of the present disclosure;

[0049] Figure 12 A schematic structural diagram of another display module provided in an embodiment of the present disclosure;

[0050] Figure 13 A schematic diagram of manufacturing a display module provided in an embodiment of the present disclosure.

[0051] Reference numerals:

[0052] Display panel 1, display area AA, bending area BB, binding area CC, upper area 1a, lower area 1b, flexible circuit board 2, heat dissipation film 3, first sub-heat dissipation film 31, second sub-heat dissipation film 32, conductive structure 4, first sub-glue 41, second sub-glue 42, adhesive layer 3a, conductive layer 3b, first sub-adhesive layer 31a, second sub-adhesive layer 32a, first sub-conductive layer 31b, second sub-conductive layer 32b, polarizer 5, optical glue 6, cover plate 7, support layer 8, alignment mark M1. DETAILED DESCRIPTION

[0053] The embodiments of the present disclosure provide a display module and a manufacturing method thereof to solve the above-mentioned technical problems.

[0054] It should be understood that the specific structural and functional details disclosed in the embodiments of the present disclosure are merely representative and are for the purpose of describing exemplary embodiments of the present disclosure. However, the present disclosure can be implemented in many alternative forms or combinations and should not be construed as being limited to the embodiments described herein.

[0055] In the description of the present disclosure, it should be understood that the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of the present disclosure, unless otherwise specified, "plurality" means two or more. In addition, the term "including" and any variations thereof are intended to cover non-exclusive inclusions.

[0056] In the description of this disclosure, it should be noted that, unless otherwise expressly specified or limited, the terms "mounted," "connected," and "connected" should be understood broadly. For example, they may refer to fixed connections, detachable connections, or integral connections; mechanical connections or electrical connections; direct connections or indirect connections through an intermediate medium; and internal connections between two components. Those skilled in the art will understand the specific meanings of the above terms in this disclosure based on the specific circumstances.

[0057] The term "and / or" in the embodiments of the present disclosure is simply a description of the association relationship between associated objects, indicating that three relationships can exist. For example, A and / or B can represent three situations: A exists alone, A and B exist simultaneously, and B exists alone. In addition, the character " / " in this document generally indicates that the associated objects are in an "or" relationship.

[0058] In order to make the above-mentioned purposes, features and advantages of the present disclosure more obvious and easy to understand, the present disclosure will be further described below with reference to the accompanying drawings and examples. However, the example embodiments can be implemented in various forms and should not be understood as being limited to the embodiments set forth herein; on the contrary, these embodiments are provided to make the present disclosure more comprehensive and complete, and to fully convey the concepts of the example embodiments to those skilled in the art. The same figure marks in the figures represent the same or similar structures, and their repeated descriptions will be omitted. The words expressing position and direction described in the present disclosure are all explained using the accompanying drawings as examples, but changes can be made as needed, and all changes are included in the scope of protection of the present disclosure. The drawings of the present disclosure are only used to illustrate relative position relationships and do not represent true proportions.

[0059] It should be noted that specific details are set forth in the following description to facilitate a full understanding of the present disclosure. However, the present disclosure can be implemented in a variety of ways different from those described herein, and those skilled in the art can make similar generalizations without violating the connotation of the present disclosure. Therefore, the present disclosure is not limited to the specific embodiments disclosed below. The subsequent description of the specification is a preferred embodiment of the present disclosure, but the description is for the purpose of illustrating the general principles of the present disclosure and is not intended to limit the scope of the present disclosure. The scope of protection of the present disclosure shall be as defined by the appended claims.

[0060] Please refer to Figure 1 A top view of the back of a display panel in the related art;

[0061] In the related art, in order to improve the bending precision, alignment marks M1 are arranged on the back of the display panel 1, the heat dissipation film 3 is attached to the back of the display panel 1, is arranged relatively inward relative to the back of the display panel 1, and the heat dissipation film 3 is provided with a slot at a position where the alignment mark M1 is located, so as to expose the alignment mark M1. When bending, the flexible portion 1F extending out of the back of the display panel 1 and the flexible circuit board 2 (not shown in the figure) bound with the binding area CC in the flexible portion are bent to the back of the display panel 1 by grabbing the alignment mark M1. Figure 1

[0062] However, in the narrow frame design, the wiring in the display panel 1 passes through the area where the alignment mark M1 is located, which causes the slot to expose the wiring on the display panel 1. In the electrostatic field environment, electrostatic shock can cause the display panel 1 to be burned, so that the circuit exposed in the slot is short-circuited, causing the screen to flash.

[0063] To solve the above problems, the display module and the manufacturing method thereof provided by the embodiments of the present disclosure are provided, which will be described in detail below with reference to the accompanying drawings.

[0064] Please refer to Figure 2 and Figure 3 , Figure 2 A top view of the back of a display module provided by the embodiments of the present disclosure before bending, Figure 3 A structural schematic diagram of a display module provided by the embodiments of the present disclosure after bending, the display module comprising:

[0065] A display panel 1 comprising a display area AA, a bending area BB and a binding area CC; the bending area BB is located between the display area AA and the binding area CC;

[0066] A flexible circuit board 2 located on a side of the display area AA away from the display side and bound with the binding area CC;

[0067] A heat dissipation film 3 attached to the back of the display panel 1 away from the display side and bonded with the flexible circuit board 2 and the binding area CC; the back comprises an upper area 1a and a lower area 1b, the lower area 1b is located between the upper area 1a and the bending area BB, the heat dissipation film 3 comprises a first sub-heat dissipation film 31 and a second sub-heat dissipation film 32 electrically connected, the first sub-heat dissipation film 31 is attached to the lower area 1b, and the second sub-heat dissipation film 32 is attached to the upper area 1a; the orthographic projection of the flexible circuit board 2 and the binding area CC on the back is located in the lower area 1b; the back is provided with an alignment mark M1, the alignment mark M1 is located between the display area AA and the bending area BB and is covered by the first sub-heat dissipation film 31.

[0068] As Figure 2 ​As shown, the first sub-heat dissipation film 31 and the second sub-heat dissipation film 32 of the present disclosure are equivalent to cutting an original complete heat dissipation film 3 into two parts corresponding to the lower area 1b and upper area 1a of the display panel 1. However, before bending, the first sub-heat dissipation film 31 is attached to the binding area CC and the flexible circuit board 2, while the second sub-heat dissipation film 32 is attached to the upper area 1a of the display panel 1. Because the first sub-heat dissipation film 31 is not attached to the upper area 1a of the back of the display panel 1 before bending, the alignment mark M1 provided in the lower area 1b of the back of the display panel 1 near the bending area BB is not obstructed. Therefore, the alignment mark M1 can be grasped when bending the bending area BB of the display panel 1, and the bending area BB of the display panel 1 can be bent.

[0069] After the display panel 1 is bent at the bending area BB, the first sub-heat dissipation film 31 is attached to the lower area 1b on the back of the display panel 1. At this time, the alignment mark M1 is blocked by the first sub-heat dissipation film 31. Therefore, the problem of exposing the display panel 1 circuit due to the groove provided at the position corresponding to the alignment mark M1 in the related art can be avoided. Since the display panel 1 circuit is not exposed, it can also prevent electrostatic damage that may cause burns to the display panel 1, circuit short circuits, screen flickering and other problems. In an ideal case, Figure 3 As shown, the edge of the first sub-heat dissipation film 31 close to the second sub-heat dissipation film 32 and the edge of the second sub-heat dissipation film 32 close to the first sub-heat dissipation film 31 are just connected together. At this time, the first sub-heat dissipation film 31 and the second sub-heat dissipation film 32 are electrically connected. In this way, the first sub-heat dissipation film 31 and the second sub-heat dissipation film 32 can achieve the same heat dissipation and anti-static effects as the original uncut complete heat dissipation film 3.

[0070] In the embodiments provided in the present disclosure, by arranging the heat dissipation film 3 as the electrically connected first sub heat dissipation film 31 and the second sub heat dissipation film 32, and attaching the first sub heat dissipation film 31 to the lower area 1b on the back of the display panel 1 and covering the alignment mark M1 in the lower area 1b, while the normal projection of at least part of the area of the flexible circuit board 2 and the binding area CC on the back of the display panel 1 is located in the lower area 1b, and attaching the second sub heat dissipation film 32 to the upper area 1a, the first sub heat dissipation film 31 can be attached to the binding area CC and the flexible circuit board 2 before the bending area BB of the display panel 1 is bent, and the first sub heat dissipation film 31 is attached to the lower area 1b on the back of the display panel 1 after bending, so that without opening a slot corresponding to the alignment mark M1 on the first sub heat dissipation film 31, the alignment mark M1 can be grabbed for bending alignment during bending, and the first sub heat dissipation film 31 can shield the alignment mark M1 after bending, avoiding exposure of the circuit in the area of the display panel 1 where the alignment mark M1 is located, preventing problems such as static shock causing burns to the display panel 1 and screen flashing caused by circuit breakage. And since the first sub heat dissipation film 31 is electrically connected to the second sub heat dissipation film 32, the heat dissipation film 3 composed of the first sub heat dissipation film 31 and the second sub heat dissipation film 32 has the same functions of heat dissipation and anti-static as using a whole heat dissipation film 3 in related technologies.

[0071] Please continue to see Figure 2 The edge of the second sub heat dissipation film 32 (except the edge close to the edge of the first sub heat dissipation film 31) is arranged to be recessed relative to the edge of the display panel 1, and the recessed distance d1 is in the range of 0.15mm-0.25mm, such as 0.2mm; after the first sub heat dissipation film 31 is attached to the back of the display panel 1, the first sub heat dissipation film 31 is also arranged to be recessed relative to the edge of the display panel 1, and the recessed distance is also in the range of 0.15mm-0.25mm, such as 0.2mm.

[0072] Please continue to see Figure 3 In the arrangement direction of the first sub heat dissipation film 31 and the second sub heat dissipation film 32, the ratio (L1 / L2) of the length L1 of the first sub heat dissipation film 31 to the length L2 of the second sub heat dissipation film 32 can be in the range of 1 / 2-1, so as to ensure that the first sub heat dissipation film 31 covers at least part of the area of the binding area CC and the flexible circuit board 2, and facilitates the attachment of the first sub heat dissipation film 31 and the second sub heat dissipation film 32 to the back of the display panel 1.

[0073] As shown in Figure 2 When the first sub heat dissipation film 31 covers the flexible circuit board 2, the distance d2 between the edge of the first sub heat dissipation film 31 away from the second sub heat dissipation film 32 and the closest edge of the flexible circuit board 2 is in the range of 10-20mm, such as 15mm.

[0074] Figure 3 The first sub heat dissipation film 31 and the second sub heat dissipation film 32 are shown in the ideal case of attachment, and in fact, due to the existence of attachment errors, there is a gap between the first sub heat dissipation film 31 and the second sub heat dissipation film 32, which will reduce the anti-static effect of the heat dissipation film 3 composed of the first sub heat dissipation film 31 and the second sub heat dissipation film 32, and there is a problem of light leakage at the gap position.

[0075] Please refer to Figure 4 Another structure schematic diagram of a display module provided by the embodiment of the present disclosure is provided, the first sub heat dissipation film 31 includes a first sub conductive layer 31b, the second sub heat dissipation film 32 includes a second sub conductive layer 32b, and the first sub heat dissipation film 31 and the second sub heat dissipation film 32 have a gap therebetween; the first sub conductive layer 31b and the second sub conductive layer 32b can be copper foils; as Figure 4 shown, the first sub heat dissipation film 31 further includes a first sub adhesive layer 31a located between the first sub conductive layer 31b and the back surface of the display panel 1, and the second sub heat dissipation film 32 further includes a second sub adhesive layer 32a located between the second sub conductive layer 32b and the back surface of the display panel 1;

[0076] The display module further includes a conductive structure 4 covering the gap and connected with the first sub conductive layer 31b and the second sub conductive layer 32b; wherein the conductive structure 4 is provided in a light-shielding manner.

[0077] By setting the conductive structure 4 having light-shielding and conductive properties, and letting the conductive structure 4 cover the gap between the first sub heat dissipation film 31 and the second sub heat dissipation film 32, and the conductive structure 4 being connected with the first sub conductive layer 31b and the second sub conductive layer 32b, the first sub heat dissipation film 31 and the second sub heat dissipation film 32 can be electrically connected through the conductive structure 4, and the gap between the first sub heat dissipation film 31 and the second sub heat dissipation film 32 is shielded, thereby improving the conductive property of the heat dissipation film 3 and preventing light leakage in the gap between the first sub heat dissipation film 31 and the second sub heat dissipation film 32.

[0078] Please refer to Figure 5-Figure 6 Another structure schematic diagram of a display module provided by the embodiment of the present disclosure is provided, the first sub heat dissipation film 31 covers the flexible circuit board 2, and the conductive structure 4 is:

[0079] a first conductive adhesive covering the gap region; wherein the first conductive adhesive is light-shielding.

[0080] As Figure 5 shown, the first conductive adhesive is conductive glue, which is filled in the gap between the first sub heat dissipation film 31 and the second sub heat dissipation film 32; the conductive glue can be black conductive glue, which can electrically connect the first sub heat dissipation film 31 and the second sub heat dissipation film 32, and shield the gap between the first sub heat dissipation film 31 and the second sub heat dissipation film 32;

[0081] As Figure 6 As shown, the first conductive adhesive can also be a conductive tape or conductive paper, and the conductive tape or conductive paper is overlapped with the first sub-heat dissipation film 31 and the second sub-heat dissipation film 32. In this way, the conductive tape or conductive paper can also be used to electrically connect the first sub-heat dissipation film 31 and the second sub-heat dissipation film 32, and to shield the gap between the first sub-heat dissipation film 31 and the second sub-heat dissipation film 32.

[0082] In some embodiments, the thickness of the conductive tape or the conductive paper is in the range of 0.3 to 0.4 mm, for example, it can be set to 0.05 mm.

[0083] In some embodiments, the width of the overlapping area between the conductive tape or charged adhesive paper and the first sub-heat dissipation film 31 is in the range of 2mm to 5mm, and / or the width of the overlapping area between the conductive tape or charged adhesive paper and the second sub-heat dissipation film 32 is in the range of 2mm to 5mm, and can be set to 3mm, so that the conductive tape or conductive adhesive paper can be stably bonded to the first sub-heat dissipation film 31 and the second sub-heat dissipation film 32.

[0084] Please refer to Figure 7 This is a schematic structural diagram of another display module provided by an embodiment of the present disclosure. When the first conductive adhesive is conductive glue, the conductive glue includes:

[0085] The first sub-glue 41 is filled in the gap between the first sub-heat dissipation film 31 and the second sub-heat dissipation film 32; wherein the first sub-glue 41 is light-shielding; the first sub-glue 41 includes a conversion value, UV glue, acrylic glue, etc.;

[0086] The second sub-glue 42 is coated on the side of the first sub-glue 41 away from the back, and the coating width is greater than the width of the gap. The second sub-glue 42 is connected to the first sub-conductive layer 31b and the second sub-conductive layer 32b; wherein the second sub-glue 42 is conductive.

[0087] By filling the gap between the first sub-heat dissipation film 31 and the second sub-heat dissipation film 32 with a first sub-glue 41 that can block light, light leakage from the gap between the first sub-heat dissipation film 31 and the second sub-heat dissipation film 32 can be prevented; and by coating the second sub-glue 42 with a width greater than the gap width and being conductive on the side of the first sub-glue 41 away from the back of the display panel 1, the second sub-glue 42 can be used to electrically connect the first sub-heat dissipation film 31 and the second sub-heat dissipation film 32, thereby improving the anti-static performance of the heat dissipation film 3.

[0088] Please refer to Figure 8 This is a schematic diagram of the structure of another display module provided by an embodiment of the present disclosure. The flexible circuit board 2 covers the gap and overlaps with the first sub-heat dissipation film 31 and the second sub-heat dissipation film 32. Conductive glue (not shown) is provided on the side of the flexible circuit board 2 close to the heat dissipation film 3. The conductive glue covers the gap and overlaps with the first sub-heat dissipation film 31 and the second sub-heat dissipation film 32.

[0089] The flexible circuit board 2 and the conductive glue are reused to form the conductive structure 4 .

[0090] like Figure 8 As shown, the first sub-heat dissipation film 31 covers a portion of the flexible circuit board 2, while the second sub-heat dissipation film 32 overlaps a portion of the flexible circuit board 2, but does not overlap with the first sub-heat dissipation film 31. This allows the flexible circuit board 2 to shield the gap between the first and second sub-heat dissipation films 31, 32 from light. Furthermore, because conductive glue is applied to the side of the flexible circuit board 2 closest to the first sub-heat dissipation film 31, the conductive glue covers the gap between the first and second sub-heat dissipation films 31, 32, and overlaps with the first and second sub-heat dissipation films 31, 32. This conductive glue allows the first and second sub-heat dissipation films 31, 32 to be electrically connected.

[0091] Please refer to Figure 9 A schematic structural diagram of a heat dissipation film provided in an embodiment of the present disclosure, the heat dissipation film 3, includes:

[0092] Adhesive layer 3a, located on one side of the back surface; adhesive layer 3a comprises foam or silicone gel;

[0093] The conductive layer 3b is located on the side of the adhesive layer 3a away from the back surface. The conductive layer 3b includes copper foil, or graphite and copper foil.

[0094] Figure 7 The thickness of the first sub-glue 41 can be the same as the thickness of the adhesive layer 3a.

[0095] The heat dissipation film 3 may be composed of stacked foam and copper foil, or stacked foam and other metal materials, or stacked silicone gel and copper foil, or stacked foam, graphite and copper foil.

[0096] The foregoing Figure 2-Figure 8 The first sub-heat dissipation film 31 and the second sub-heat dissipation film 32 in the embodiment both adopt the above-mentioned film layer structure.

[0097] Please refer to Figure 10 A structural schematic diagram of another display module provided in an embodiment of the present disclosure, wherein the first sub-heat dissipation film 31 overlaps with the second sub-heat dissipation film 32 and is electrically connected, that is, a portion of the first sub-heat dissipation film 31 is attached to the lower area 1b, and the overlapping portion of the first sub-heat dissipation film 31 and the second sub-heat dissipation film 32 is attached to the surface of the second sub-heat dissipation film 32 and is electrically connected, so that even if there is an attachment error, the first sub-heat dissipation film 31 can be connected to the second sub-heat dissipation film 32, thereby realizing the functions of heat dissipation and anti-static.

[0098] If the side of the first sub-heat dissipation film 31 away from the flexible circuit board 2 is non-conductive, Figure 9Conductive glue is applied to the edge of the first sub-heat dissipation film 31 near the second sub-heat dissipation film 32 to connect the first sub-heat dissipation film 31 and the second sub-heat dissipation film 32; or conductive tape or conductive paper is pasted to connect the first sub-heat dissipation film 31 and the second sub-heat dissipation film 32.

[0099] Please refer to Figure 11 A schematic structural diagram of another display module provided in an embodiment of the present disclosure, wherein the heat dissipation film 3 includes:

[0100] The adhesive layer is located on one side of the back surface; the adhesive layer includes a first sub-adhesive layer 31a and a second sub-adhesive layer 32a, and a gap is formed between the first sub-adhesive layer 31a and the second sub-adhesive layer 32a;

[0101] The conductive layer is located on the side of the adhesive layer away from the back surface; the conductive layer includes a first sub-conductive layer 31b and a second sub-conductive layer 32b that are overlapped; wherein the first sub-conductive layer 31b covers the first sub-adhesive layer 31a and the gap and the overlapping area between the first sub-conductive layer 31b and the second sub-conductive layer 32b, and the orthographic projection of the overlapping area on the adhesive layer 3a is located within the second sub-adhesive layer 32a, the second sub-conductive layer 32b covers the second sub-adhesive layer 32a, the first sub-heat dissipation film 31 includes the first sub-adhesive layer and the first sub-conductive layer 31b, and the second sub-heat dissipation film 32 includes the second sub-adhesive layer and the second sub-conductive layer 32b.

[0102] By setting a gap between the first sub-adhesive layer 31a and the second sub-adhesive layer 32a, and allowing the first sub-conductive layer 31b to overlap with the second sub-conductive layer 32b, and the first sub-conductive layer 31b covering the first sub-adhesive layer 31a and the gap and the overlapping area between the first sub-conductive layer 31b and the second sub-conductive layer 32b, the second sub-conductive layer 32b covers the second sub-adhesive layer 32a, and the positive projection of the overlapping area on the adhesive layer 3a is located within the second sub-adhesive layer 32a, the first sub-conductive layer 31b can be used to shield the gap between the first sub-adhesive layer 31a and the second sub-adhesive layer 32a, and the first sub-conductive layer 31b is connected to the second sub-conductive layer 32b at the position where it overlaps with the second sub-conductive layer 32b, thereby not only preventing light leakage from the above-mentioned gap and improving the anti-static performance, but also reducing the thickness of the overlapping position of the first sub-heat dissipation film 31 and the second sub-heat dissipation film 32.

[0103] Please refer to Figure 12 A schematic structural diagram of another display module provided in an embodiment of the present disclosure, wherein the display module further comprises:

[0104] The polarizer 5 is located on a side of the display panel 1 away from the heat dissipation film 3;

[0105] Optical adhesive 6, located on a side of the polarizer 5 away from the display panel 1;

[0106] a cover plate 7 , located on a side of the optical adhesive 6 away from the display panel 1 ;

[0107] The support layer 8 is located between the first sub-heat dissipation film 31 and the binding area CC.

[0108] In some embodiments, Figure 6 When the conductive structure 4 is a conductive tape or conductive paper, the conductive tape or conductive paper can also be connected to the polarizer 5, so that a loop can be formed to conduct away the static electricity generated by contact or friction, thereby reducing the impact of contact static electricity or friction static electricity on the screen display of the display panel 1 to a certain extent.

[0109] Based on the same inventive concept, the present disclosure provides a method for manufacturing a display module. Figure 13 A schematic diagram of manufacturing a display module provided in an embodiment of the present disclosure, wherein the manufacturing method includes:

[0110] S11: Binding the flexible circuit board 2 to the binding area CC of the display panel 1; the display panel 1 includes a display area AA, a bending area BB and a binding area CC; the bending area BB is located between the display area AA and the binding area CC;

[0111] S12: attaching the first sub-heat dissipation film 31 to the binding area CC and at least a portion of the flexible circuit board 2;

[0112] S13: Attach the second sub-heat dissipation film 32 to the upper area 1a

[0113] S14: Based on the alignment mark on the display panel 1, the bending area BB is bent, and the side of the first sub-heat dissipation film 31 facing away from the binding area CC is adhered to at least the lower area 1b on the back of the display panel 1; wherein, the back also includes an upper area 1a, and the lower area 1b is located between the upper area 1a and the bending area BB; the positive projection of at least part of the flexible circuit board 2 and the binding area CC on the back is located in the lower area 1b; an alignment mark M1 is provided on the back, and the alignment mark M1 is located in the lower area 1b close to the bending area BB, and after bending, the first sub-heat dissipation film 31 covers the alignment mark M1.

[0114] The above step S13 may also be executed before or after step S12, or executed synchronously with step S12, or executed after step S14, without specific limitation.

[0115] By attaching the first sub-heat dissipation film to the binding area and at least part of the flexible circuit board before bending, the alignment mark on the back of the display panel can be directly grasped during bending, thereby eliminating the need to groove the sub-heat dissipation film and preventing various problems caused by grooves; and after bending, the first sub-heat dissipation film is attached to the lower area, and the first sub-heat dissipation film can be used to block the alignment mark, allowing the first sub-heat dissipation film to be electrically connected to the second heat dissipation film attached to the upper area, thereby ensuring that the heat dissipation and anti-static functions of the heat dissipation film are the same as those of the heat dissipation film with the positive film covering the upper and lower areas.

[0116] In addition, directly attaching the first sub-heat dissipation film to the binding area and the flexible circuit board before bending can avoid the problem of poor molding during the attachment process.

[0117] In some embodiments, the first sub-heat dissipation film includes a first sub-conductive layer, the second sub-heat dissipation film includes a second sub-conductive layer, a gap is provided between the first sub-heat dissipation film and the second sub-heat dissipation film, and after attaching the second sub-heat dissipation film to the upper region, the following steps are further included:

[0118] A conductive structure is provided to connect the first sub-conductive layer and the second sub-conductive layer; the conductive structure covers the gap between the first sub-heat dissipation film and the second sub-heat dissipation film. The conductive structure can be Figure 5-Figure 7 The conductive structure in .

[0119] Setting the conductive structure requires that the first sub-heat dissipation film be attached to the lower area and the second sub-heat dissipation film be attached to the upper area.

[0120] After the first sub-heat dissipation film is attached to the lower area and the second sub-heat dissipation film is attached to the upper area, when there is a gap between the first sub-heat dissipation film and the second sub-heat dissipation film, the anti-static performance of the heat dissipation film can be improved by setting a conductive structure connecting the first sub-conductive layer and the second sub-conductive layer.

[0121] The display panel may be an organic light emitting diode (OLED) display panel, a quantum dot light emitting diode (QLED) display panel, a micro light emitting diode (Micro LED) display panel, etc., and the present disclosure does not make any specific limitations on this.

[0122] Although the preferred embodiments of the present disclosure have been described, those skilled in the art may make additional changes and modifications to these embodiments once they have learned the basic creative concepts. Therefore, the appended claims are intended to be interpreted as including the preferred embodiments and all changes and modifications that fall within the scope of the present disclosure.

[0123] Obviously, those skilled in the art may make various changes and modifications to the present disclosure without departing from the spirit and scope of the present disclosure. Thus, if these modifications and variations of the present disclosure fall within the scope of the claims of the present disclosure and their equivalents, the present disclosure is intended to include these modifications and variations.

Claims

1. A display module, wherein: include: A display panel, comprising a display area, a bending area, and a binding area; The bending area is located between the display area and the binding area; a flexible circuit board, located on a side of the display area away from the display side and bound to the binding area; a heat dissipation film applied to a back surface of the display panel facing away from the display side and bonded to the flexible circuit board and the binding area; the back surface includes an upper area and a lower area, the lower area is located between the upper area and the bending area, the heat dissipation film includes a first sub-heat dissipation film and a second sub-heat dissipation film that are electrically connected, the first sub-heat dissipation film being attached to at least the lower area, and the second sub-heat dissipation film being attached to the upper area; The orthographic projections of at least a portion of the flexible circuit board and the binding area on the back are located in the lower area; an alignment mark is provided on the back, and the alignment mark is located in the lower area close to the bending area and is covered by the first sub-heat dissipation film.

2. The display module according to claim 1, wherein: The first sub-heat dissipation film includes a first sub-conductive layer, the second sub-heat dissipation film includes a second sub-conductive layer, and there is a gap between the first sub-heat dissipation film and the second sub-heat dissipation film; The display module further includes: a conductive structure, which covers the gap and is connected to the first sub-conductive layer and the second sub-conductive layer; wherein the conductive structure is light-shielding.

3. The display module according to claim 2, wherein: The first sub-heat dissipation film covers the flexible circuit board, and the conductive structure is: A first conductive adhesive covers the gap area; wherein the first conductive adhesive is light-shielding.

4. The display module according to claim 3, wherein: The first conductive adhesive includes: Conductive glue is filled in the gap between the first sub-heat dissipation film and the second sub-heat dissipation film; Alternatively, a conductive tape or conductive paper is arranged to overlap with the first sub-conductive layer and the second sub-conductive layer.

5. The display module according to claim 4, wherein: The conductive glue comprises: A first sub-glue is filled in the gap between the first sub-heat dissipation film and the second sub-heat dissipation film; wherein the first sub-glue is light-shielding; The second sub-glue is coated on the side of the first sub-glue away from the back side and the coating width is greater than the width of the gap. The second sub-glue is connected to the first sub-conductive layer and the second sub-conductive layer; wherein the second sub-glue is conductive.

6. The display module according to claim 4, wherein: The width of the overlapping area between the conductive tape or the conductive paper and the first sub-heat dissipation film ranges from 2mm to 5mm, and / or the width of the overlapping area between the conductive tape or the conductive paper and the second sub-heat dissipation film ranges from 2mm to 5mm.

7. The display module according to claim 2, wherein: The flexible circuit board covers the gap and overlaps with the first sub-heat dissipation film and the second sub-heat dissipation film; a conductive glue is provided on a side of the flexible circuit board close to the first sub-heat dissipation film; the conductive glue covers the gap and overlaps with the first sub-heat dissipation film and the second sub-heat dissipation film; The flexible circuit board and the conductive glue are reused to form the conductive structure.

8. The display module according to claim 1, wherein: The first sub-heat dissipation film overlaps with the second sub-heat dissipation film and is electrically connected.

9. The display module according to claim 8, wherein: The heat dissipation film comprises: an adhesive layer located on one side of the back surface; the adhesive layer includes a first sub-adhesive layer and a second sub-adhesive layer, and a gap is formed between the first sub-adhesive layer and the second sub-adhesive layer; A conductive layer is located on the side of the adhesive layer away from the back side; the conductive layer includes a first sub-conductive layer and a second sub-conductive layer that are overlapped; wherein the first sub-conductive layer covers the first sub-adhesive layer and the gap and the overlapping area between the first sub-conductive layer and the second sub-conductive layer, the orthographic projection of the overlapping area on the adhesive layer is located within the second sub-adhesive layer, the second sub-conductive layer covers the second sub-adhesive layer, the first sub-heat dissipation film includes the first sub-adhesive layer and the first sub-conductive layer, and the second sub-heat dissipation film includes the second sub-adhesive layer and the second sub-conductive layer.

10. The display module according to any one of claims 1 to 8, wherein: The heat dissipation film comprises: an adhesive layer located on one side of the back surface; The conductive layer is located on a side of the adhesive layer away from the back surface.

11. The display module according to any one of claims 1 to 10, wherein: In the arrangement direction of the first sub-heat dissipation films, a ratio of a length of the first sub-heat dissipation film to a length of the second sub-heat dissipation film is in a range of 1 / 2 to 1.

12. A method for manufacturing a display module, wherein: include: Binding the flexible circuit board to the binding area of ​​the display panel; The display panel includes a display area, a bending area and the binding area; The bending area is located between the display area and the binding area; attaching a first sub-heat dissipation film to the binding area and at least a portion of the flexible circuit board; Attaching the second sub-heat dissipation film to the upper area; wherein the back of the display panel includes the upper area and the lower area, and the lower area is located between the upper area and the bending area; Based on the alignment mark on the display panel, the bending area is bent, and the side of the first sub-heat dissipation film facing away from the binding area is adhered to at least the lower area; wherein, at least part of the area of ​​the flexible circuit board and the positive projection of the binding area on the back are located in the lower area; an alignment mark is provided on the back, and the alignment mark is located in the lower area close to the bending area, and after bending, the first sub-heat dissipation film covers the alignment mark.

13. The production method according to claim 12, wherein: The first sub-heat dissipation film includes a first sub-conductive layer, and the second sub-heat dissipation film includes a second sub-conductive layer. After adhering the side of the first sub-heat dissipation film away from the binding area to at least the lower area, the following steps are further included: A conductive structure is provided to connect the first sub-conductive layer and the second sub-conductive layer; the conductive structure covers the gap between the first sub-heat dissipation film and the second sub-heat dissipation film.

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