Display device and display device detection method
By setting a parallel reference resistor in the display device, the series circuit is used to detect the resistance value to determine the bonding abnormality, which solves the problem of low detection efficiency of the display device, improves the detection efficiency and reduces the risk of damage.
Patent Information
- Application Number
- CN202311524518.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2023-11-15
- Publication Date
- 2026-01-06
- Estimated Expiration
- 2043-11-15
AI Technical Summary
Existing technologies have low detection efficiency for display devices, and testing each FPC bonding resistor individually may introduce new adverse risks.
In the display device, at least two circuit boards are set up, with at least one reference resistor connected in parallel. The reference resistor is connected in series with the bonding resistor. Bonding abnormalities are judged by detecting the resistance value of the series circuit, avoiding individual pin piercing tests.
It improves the testing efficiency of display devices, reduces the risk of damage to display devices, and lowers testing time and workload.
Smart Images
Figure CN120014949B_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of display technology, and in particular to a display device and a method for testing the display device. Background Technology
[0002] OLED (Organic Light-Emitting Diode) display technology is becoming a development trend and is gradually being applied to medium and large-sized products such as smartphones and large-screen TVs. One OLED display module consists of multiple FPC (Flexible Printed Circuit) or COF (Chip On Flex) sheets bonded together.
[0003] In related technologies, to verify the proper bonding of FPCs in an OLED display module, the bonding resistance of each FPC is typically tested individually. However, in practical applications, an OLED display module consists of multiple bonded FPCs. To determine if a specific FPC bonding is abnormal, each bonding point needs to be tested with a pin puncture test. Therefore, this method is not only inefficient but also potentially introduces new defects due to the large number of test points and repeated measurements. Summary of the Invention
[0004] The purpose of this application is to provide a display device and a display device detection method to solve the problem of low detection efficiency of display devices. The specific technical solution is as follows:
[0005] In a first aspect of this application, a display device is provided, the display device including at least two circuit boards and at least two reference resistors;
[0006] Each of the circuit boards is connected in parallel with at least one of the reference resistors, and the reference resistors connected in parallel to each of the circuit boards are different;
[0007] The reference resistors are connected in series, one end of the third series circuit formed by the reference resistors is connected to the first test point, and the other end of the third series circuit is connected to the second test point.
[0008] The resistance value of the reference resistor is much larger than the bonding resistance of the circuit board.
[0009] In one possible implementation, for any of the said circuit boards, the bonding resistors in the circuit board are connected in series, and a reference resistor is connected in parallel to the series circuit formed by the bonding resistors in the circuit board.
[0010] In one possible implementation, for any of the circuit boards, the bonding resistors on one side of the circuit board are connected in series to form a first series circuit, and the bonding resistors on the other side of the circuit board are connected in series to form a second series circuit. The first series circuit is connected in parallel with a reference resistor, and the second series circuit is connected in parallel with a reference resistor. The reference resistors connected in parallel with the first series circuit and the second series circuit are different.
[0011] In one possible implementation, for each of the first type of circuit boards in the circuit boards, the bonding resistors in the first type of circuit boards are connected in series, and a reference resistor is connected in parallel to the series circuit formed by the bonding resistors in the circuit boards.
[0012] For the second type of circuit board in each of the circuit boards, the bonding resistors on one side of the second type of circuit board are connected in series to form a first series circuit, and the bonding resistors on the other side of the second circuit board are connected in series to form a second series circuit. A reference resistor is connected in parallel to the first series circuit and a reference resistor is connected in parallel to the second series circuit. The reference resistors connected in parallel to the first series circuit and the second series circuit are different.
[0013] In one possible implementation, each of the reference resistors is a resistor with the same resistance value.
[0014] In one possible implementation, each of the reference resistors is a resistor with a different resistance value.
[0015] In one possible implementation, the resistance value of each reference resistor in the third series circuit is twice that of the previous reference resistor, arranged in order from one end to the other.
[0016] In one possible implementation, the display device further includes a detection module, the detection module being connected to the first test point and the second test point;
[0017] The detection module is used to: obtain a first resistance value between the first test point and the second test point, and determine the bonding abnormality detection result of each circuit board based on the first resistance value.
[0018] In one possible implementation, the detection module is specifically used to: obtain a predetermined correspondence between resistance values and circuit board bonding detection results; and find the circuit board bonding detection result corresponding to the first resistance value in the correspondence as the bonding anomaly detection result for each circuit board.
[0019] In one possible implementation, the at least two circuit boards are a first circuit board, a second circuit board, a third circuit board, and a fourth circuit board; the at least two reference resistors are a first reference resistor, a second reference resistor, a third reference resistor, and a fourth reference resistor.
[0020] The first circuit board is connected in parallel with the first reference resistor, the second circuit board is connected in parallel with the second reference resistor, the third circuit board is connected in parallel with the third reference resistor, and the fourth circuit board is connected in parallel with the fourth reference resistor;
[0021] The resistance values of the first reference resistor, the second reference resistor, the third reference resistor, and the fourth reference resistor are all R; the resistance values of the first circuit board, the second circuit board, the third circuit board, and the fourth circuit board are all 4R. bond ;
[0022] The detection module is specifically used to: if the first resistance value is approximately equal to 4*4R bond This confirms that all the circuit boards are properly bonded.
[0023] If the first resistance value is approximately equal to R, then it is determined that one of the circuit boards in each of the circuit boards has a bonding abnormality;
[0024] If the first resistance value is approximately equal to 2R, then it is determined that two circuit boards in each of the circuit boards have a bonding abnormality.
[0025] If the first resistance value is approximately 3R, then it is determined that three of the circuit boards in each circuit board have a bonding abnormality.
[0026] If the first resistance value is approximately 4R, then it is determined that each of the circuit boards has a bonding abnormality.
[0027] In one possible implementation, the at least two circuit boards are a first circuit board, a second circuit board, a third circuit board, and a fourth circuit board; the at least two reference resistors are a first reference resistor, a second reference resistor, a third reference resistor, and a fourth reference resistor.
[0028] The first circuit board is connected in parallel with the first reference resistor, the second circuit board is connected in parallel with the second reference resistor, the third circuit board is connected in parallel with the third reference resistor, and the fourth circuit board is connected in parallel with the fourth reference resistor;
[0029] The first reference resistor has a resistance of R, the second reference resistor has a resistance of 2R, the third reference resistor has a resistance of 4R, and the fourth reference resistor has a resistance of 8R; the resistance values of the first circuit board, the second circuit board, the third circuit board, and the fourth circuit board are all 4R. bond ;
[0030] The detection module is specifically used to: if the first resistance value is approximately equal to 4*4R bond This confirms that all the circuit boards are properly bonded.
[0031] If the first resistance value is approximately equal to R, then it is determined that the first circuit board has a bonding abnormality.
[0032] If the first resistance value is approximately 2R, then it is determined that the second circuit board has a bonding abnormality.
[0033] If the first resistance value is approximately 4R, then it is determined that the third circuit board has a bonding abnormality.
[0034] If the first resistance value is approximately 8R, then it is determined that the fourth circuit board has a bonding abnormality.
[0035] If the first resistance value is approximately 3R, then it is determined that the first circuit board and the second circuit board have a bonding abnormality.
[0036] If the first resistance value is approximately 5R, then it is determined that the first circuit board and the third circuit board have a bonding abnormality.
[0037] If the first resistance value is approximately 6R, then it is determined that the second circuit board and the third circuit board have a bonding abnormality.
[0038] If the first resistance value is approximately 7R, then it is determined that the first circuit board, the second circuit board, and the third circuit board have a bonding abnormality.
[0039] If the first resistance value is approximately 9R, then it is determined that the first circuit board and the fourth circuit board have a bonding abnormality.
[0040] If the first resistance value is approximately 10R, then it is determined that the second circuit board and the fourth circuit board have a bonding abnormality.
[0041] If the first resistance value is approximately 11R, then it is determined that the first circuit board, the second circuit board, and the fourth circuit board have a bonding abnormality.
[0042] If the first resistance value is approximately 12R, then it is determined that the third circuit board and the fourth circuit board have a bonding abnormality.
[0043] If the first resistance value is approximately 13R, then it is determined that the first circuit board, the third circuit board, and the fourth circuit board have a bonding abnormality.
[0044] If the first resistance value is approximately 14R, then it is determined that the second circuit board, the third circuit board, and the fourth circuit board have a bonding abnormality.
[0045] If the first resistance value is approximately 15R, then it is determined that all of the circuit boards have a bonding abnormality.
[0046] In a second aspect of this application, a display device detection method is provided, the method being applied to any of the display devices described in the first aspect of this application, the method comprising:
[0047] Obtain the first resistance value between the first test point and the second test point;
[0048] The bonding anomaly detection results for each circuit board are determined based on the first resistance value.
[0049] In one possible implementation, determining the bonding anomaly detection result of each circuit board based on the first resistance value includes:
[0050] Obtain the correspondence between predetermined resistance values and circuit board bonding test results;
[0051] The bonding detection result of the circuit board corresponding to the first resistance value is found in the correspondence and used as the bonding anomaly detection result of each circuit board.
[0052] In one possible implementation, the display device includes at least two circuit boards and at least two reference resistors; the at least two circuit boards are a first circuit board, a second circuit board, a third circuit board, and a fourth circuit board; the at least two reference resistors are a first reference resistor, a second reference resistor, a third reference resistor, and a fourth reference resistor.
[0053] The first circuit board is connected in parallel with the first reference resistor, the second circuit board is connected in parallel with the second reference resistor, the third circuit board is connected in parallel with the third reference resistor, and the fourth circuit board is connected in parallel with the fourth reference resistor;
[0054] The resistance values of the first reference resistor, the second reference resistor, the third reference resistor, and the fourth reference resistor are all R; the resistance values of the first circuit board, the second circuit board, the third circuit board, and the fourth circuit board are all 4R. bond ;
[0055] The step of determining the bonding anomaly detection result of each circuit board based on the first resistance value includes:
[0056] If the first resistance value is approximately equal to 4*4R bond This confirms that all the circuit boards are properly bonded.
[0057] If the first resistance value is approximately equal to R, then it is determined that one of the circuit boards in each of the circuit boards has a bonding abnormality;
[0058] If the first resistance value is approximately equal to 2R, then it is determined that two circuit boards in each of the circuit boards have a bonding abnormality.
[0059] If the first resistance value is approximately 3R, then it is determined that three of the circuit boards in each circuit board have a bonding abnormality.
[0060] If the first resistance value is approximately 4R, then it is determined that each of the circuit boards has a bonding abnormality.
[0061] In one possible implementation, the display device includes at least two circuit boards and at least two reference resistors; the at least two circuit boards are a first circuit board, a second circuit board, a third circuit board, and a fourth circuit board; the at least two reference resistors are a first reference resistor, a second reference resistor, a third reference resistor, and a fourth reference resistor.
[0062] The first circuit board is connected in parallel with the first reference resistor, the second circuit board is connected in parallel with the second reference resistor, the third circuit board is connected in parallel with the third reference resistor, and the fourth circuit board is connected in parallel with the fourth reference resistor;
[0063] The first reference resistor has a resistance of R, the second reference resistor has a resistance of 2R, the third reference resistor has a resistance of 4R, and the fourth reference resistor has a resistance of 8R; the resistance values of the first circuit board, the second circuit board, the third circuit board, and the fourth circuit board are all 4R. bond ;
[0064] The step of determining the bonding anomaly detection result of each circuit board based on the first resistance value includes:
[0065] If the first resistance value is approximately equal to 4*4R bond This confirms that all the circuit boards are properly bonded.
[0066] If the first resistance value is approximately equal to R, then it is determined that the first circuit board has a bonding abnormality.
[0067] If the first resistance value is approximately 2R, then it is determined that the second circuit board has a bonding abnormality.
[0068] If the first resistance value is approximately 4R, then it is determined that the third circuit board has a bonding abnormality.
[0069] If the first resistance value is approximately 8R, then it is determined that the fourth circuit board has a bonding abnormality.
[0070] If the first resistance value is approximately 3R, then it is determined that the first circuit board and the second circuit board have a bonding abnormality.
[0071] If the first resistance value is approximately 5R, then it is determined that the first circuit board and the third circuit board have a bonding abnormality.
[0072] If the first resistance value is approximately 6R, then it is determined that the second circuit board and the third circuit board have a bonding abnormality.
[0073] If the first resistance value is approximately 7R, then it is determined that the first circuit board, the second circuit board, and the third circuit board have a bonding abnormality.
[0074] If the first resistance value is approximately 9R, then it is determined that the first circuit board and the fourth circuit board have a bonding abnormality.
[0075] If the first resistance value is approximately 10R, then it is determined that the second circuit board and the fourth circuit board have a bonding abnormality.
[0076] If the first resistance value is approximately 11R, then it is determined that the first circuit board, the second circuit board, and the fourth circuit board have a bonding abnormality.
[0077] If the first resistance value is approximately 12R, then it is determined that the third circuit board and the fourth circuit board have a bonding abnormality.
[0078] If the first resistance value is approximately 13R, then it is determined that the first circuit board, the third circuit board, and the fourth circuit board have a bonding abnormality.
[0079] If the first resistance value is approximately 14R, then it is determined that the second circuit board, the third circuit board, and the fourth circuit board have a bonding abnormality.
[0080] If the first resistance value is approximately 15R, then it is determined that all of the circuit boards have a bonding abnormality.
[0081] Beneficial effects of the embodiments in this application:
[0082] This application provides a display device and a method for testing the display device. The display device includes at least two circuit boards and at least two reference resistors. Each circuit board has at least one reference resistor connected in parallel, and the reference resistors connected in parallel to each circuit board are different. The reference resistors are connected in series, and one end of a third series circuit formed by the reference resistors is connected to a first test point, and the other end of the third series circuit is connected to a second test point. The resistance value of each reference resistor is much larger than the bonding resistance of the circuit board. By using the display device of this application, the bonding status of each circuit board can be determined by the resistance value in the test circuit through at least one reference resistor connected in parallel to each circuit board, and the resistance value of the reference resistor is much larger than the bonding resistance of the circuit board. This avoids the need for pin-punch testing on each circuit board, thereby improving the testing efficiency of the display device.
[0083] Of course, implementing any product or method of this application does not necessarily require achieving all of the advantages described above at the same time. Attached Figure Description
[0084] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other embodiments can be obtained based on these drawings.
[0085] Figure 1 This is a circuit connection diagram of a display device in related technologies;
[0086] Figure 2 This is a schematic diagram of a first circuit connection of a display device provided in an embodiment of this application;
[0087] Figure 3 Provided for the embodiments of this application Figure 2 The diagram shown is a schematic of a display device.
[0088] Figure 4 This is a second circuit connection diagram of a display device provided in an embodiment of this application;
[0089] Figure 5 Provided for the embodiments of this application Figure 4 The diagram shown is a schematic of a display device.
[0090] Figure 6 This is a schematic diagram of a third circuit connection for a display device provided in an embodiment of this application;
[0091] Figure 7 The embodiments provided in this application are for Figure 2 The circuit diagram shown illustrates the representation of the resistor value lookup function.
[0092] Figure 8 The embodiments provided in this application are for Figure 4 The circuit diagram shown illustrates the representation of the resistor value lookup function.
[0093] Figure 9 This is a flowchart of a display device detection method provided in an embodiment of this application. Detailed Implementation
[0094] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art based on this application are within the scope of protection of this application.
[0095] In relevant OLED display technologies, multiple FPCs or COFs are bonded together in a single display module within a display device. For example... Figure 1 As shown, the display module in this display device has four FPCs bonded together. Detection circuits for the bonding resistance are set on both the left and right sides of each FPC. In related technologies, the bonding resistance of each FPC can only be tested individually to determine if the bonding is normal. For example, in the case of… Figure 1 When testing the display device shown, a pin-punch test is required at each test point. This means that the display module requires eight pin-punches. This method not only increases production time on the production line but also raises the risk of module damage due to the multiple pin-punches, exacerbating the possibility of process defects. Furthermore, performing individual tests reduces the efficiency of display device testing and increases the workload and difficulty for analysis engineers in the event of bonding abnormalities.
[0096] To solve at least one of the above-mentioned technical problems, in a first aspect of the embodiments of this application, a display device is provided, the display device including at least two circuit boards 201 and at least two reference resistors 202;
[0097] Each circuit board has at least one reference resistor connected in parallel, and the reference resistors connected in parallel on each circuit board are different.
[0098] Each reference resistor is connected in series, and one end of the third series circuit composed of the reference resistors is connected to the first test point, and the other end of the third series circuit is connected to the second test point.
[0099] The reference resistor has a resistance value much greater than the bonding resistor on the circuit board.
[0100] The circuit board in this application can be an FPC, COF, or other form of integrated circuit board, all of which are within the scope of protection of this application. In practical applications, display devices often use FPCs or other circuit boards to achieve functions such as control and signal transmission. To detect poor bonding contact or bonding abnormalities in the bonded circuit boards, it is necessary to perform resistance tests on the bonding points to determine whether the bonding of the circuit board is abnormal. The bonding points on the circuit board (e.g., solder points in the soldering process) are considered bonding resistors, and these bonding resistors are connected in series to form a test circuit for the FPC circuit board. The resistance value of the reference resistor is much larger than the resistance value of the bonding resistor in the circuit board. It is understood that, in this field, "the resistance value of the reference resistor is much larger than the resistance value of the bonding resistor" means that the resistance value of the bonding resistor is negligible compared to the resistance value of the reference resistor; that is, the resistance value of the reference resistor is at least two orders of magnitude larger than the resistance value of the bonding resistor. For example, the resistance value of the bonding resistor is 1Ω, and the resistance value of the reference resistor is 1000Ω.
[0101] The display device using the embodiments of this application can determine the bonding status of each circuit board by connecting at least one reference resistor in parallel to each circuit board, and the resistance value of the reference resistor is much larger than the bonding resistance of the circuit board. This avoids having to perform pin piercing tests on each circuit board, thereby improving the testing efficiency of the display device.
[0102] The following will combine Figures 2-5 To provide a more detailed explanation, it is understandable that... Figures 2-5 The number of circuit boards and reference resistors shown is for illustrative purposes only. In actual display devices, the number of circuit boards and reference resistors can be set according to actual needs.
[0103] In one possible implementation, for any one of the circuit boards, the bonding resistors in the circuit board are connected in series, and a reference resistor is connected in parallel to the series circuit formed by the bonding resistors in the circuit board.
[0104] In practical applications, the bonding resistors in each circuit board are connected in series to form the test circuit of that circuit board. A reference resistor is connected in parallel to the test circuit of each circuit board, and the circuit boards are connected in series to form the test circuit of the display device under test. For example... Figure 1 and Figure 2 As shown, a circuit board includes four bonded resistors. If the resistance values of all bonded resistors in the circuit board are equal and the resistance value is R... bond Therefore, the resistance value in the test circuit of a circuit board is approximately 4*R. bond ,4*R bond It is connected in parallel with the reference resistor.
[0105] Figure 2A wiring diagram of a display device provided in an embodiment of this application, such as... Figure 2 As shown, the display device includes four circuit boards: circuit board 1, circuit board 2, circuit board 3, and circuit board 4. The reference resistors connected in parallel on each circuit board are R1, R2, R3, and R4, respectively. R1, R2, R3, and R4 are connected in series to form a third series circuit. One end of the third series circuit is connected to the first test point TP1, and the other end of the third series circuit is connected to the second test point TP2.
[0106] Figure 3 for Figure 2 The equivalent resistance diagram corresponding to the routing diagram shown is as follows: Figure 3 As shown, TP1 is the first test point, and TP2 is the second test point. Since the resistance of the reference resistor is much larger than that of the bonding resistor, the circuit containing the reference resistor can be considered an open circuit if the bonding resistor path is normal. Assume that the resistance values of all bonding resistors in the circuit board are equal and the resistance value is R. bond Then, when the resistance value in the test circuit is approximately 4*4*R bond At this point, it can be confirmed that all circuit boards are properly bonded. If any circuit board experiences a bonding abnormality, its parallel reference resistor will be connected in series into the test circuit, significantly increasing the resistance value of the test circuit. For example, if circuit board 1 experiences a bonding abnormality (e.g., an open circuit at the bonding point), its parallel reference resistor R1 will be connected in series into the test circuit, and the resistance value of the test circuit will be approximately R1 + 3 * 4 * R bond Since R1 is much larger than R bond If the resistance value of the test circuit is approximately equal to R1, then the board 1 is considered to have a bonding abnormality.
[0107] The display device using the embodiments of this application can determine the bonding status of each circuit board by connecting a reference resistor in parallel to each circuit board, and the resistance value of the reference resistor is much larger than the bonding resistance of the circuit board. This avoids having to perform pin piercing tests on each circuit board, thereby improving the testing efficiency of the display device.
[0108] To more specifically pinpoint the location of the bonding anomaly on the circuit board, in one possible implementation, for any one of the circuit boards, the bonding resistors on one side of the circuit board are connected in series to form a first series circuit, and the bonding resistors on the other side of the circuit board are connected in series to form a second series circuit. A reference resistor is connected in parallel to the first series circuit and a reference resistor is connected in parallel to the second series circuit, and the reference resistors connected in parallel to the first series circuit and the second series circuit are different.
[0109] In practical applications, bonding resistors can be evenly distributed around the perimeter of the circuit board, such as... Figure 4The wiring diagram shows that the bonding resistors in each circuit board are evenly distributed near the four corners of the board. Dividing the bonding resistors into two parts along the left-right direction, the left-side bonding resistors form the first series circuit, and the right-side bonding resistors form the second series circuit. Each of the first and second series circuits is connected in parallel with a reference resistor. Therefore, for circuit board 1, the first and second series circuits are connected in parallel with resistors R1 and R2 respectively; for circuit board 2, the first and second series circuits are connected in parallel with resistors R3 and R4 respectively; for circuit board 3, the first and second series circuits are connected in parallel with resistors R5 and R6 respectively; and for circuit board 4, the first and second series circuits are connected in parallel with resistors R7 and R8 respectively. By measuring the resistance value of the test circuit, the specific location of the bonding abnormality in the circuit board can be determined.
[0110] In one example, Figure 5 for Figure 4 The circuit diagram shown is a schematic diagram, in which the resistance of one circuit board is assumed to be 4*R. bond The resistance values on the left and right sides of the circuit board are each 2*R. bond If a binding abnormality occurs on the left side of circuit board 1, the first series circuit of the circuit board will be broken. The reference resistor R1 connected in parallel in the first series circuit will be connected in series into the test circuit. Since the resistance value of the reference resistor is much greater than the resistance value of the binding resistor, the resistance value of the test circuit is approximately the resistance value of R1, thus determining that a binding abnormality has occurred on the left side of circuit board 1.
[0111] The display device using the embodiments of this application can generate a first series circuit and a second series circuit by connecting the bonding resistors on both sides of the circuit board in series. The first series circuit and the second series circuit are each connected in parallel with different reference resistors, thereby determining the specific location of the bonding abnormality on the circuit board based on the resistance value.
[0112] In one possible implementation, the display device in this application embodiment can also be connected in the following way:
[0113] For the first type of circuit board in each circuit board, the bonding resistors in the first type of circuit board are connected in series, and a reference resistor is connected in parallel to the series circuit formed by the bonding resistors in the circuit board.
[0114] For the second type of circuit board in each circuit board, the bonding resistors on one side of the second type of circuit board are connected in series to form a first series circuit, and the bonding resistors on the other side of the second circuit board are connected in series to form a second series circuit. A reference resistor is connected in parallel to the first series circuit and a reference resistor is connected in parallel to the second series circuit. The reference resistors connected in parallel to the first series circuit and the second series circuit are different.
[0115] In practical applications, the series circuits in each circuit board can be connected according to actual needs. For example, circuit boards that only need to detect bonding abnormalities are designated as Category 1 circuit boards, while circuit boards that need to detect the specific location of bonding abnormalities are designated as Category 2 circuit boards. For Category 1 circuit boards, the following can be used... Figure 2 The connection method shown connects the bonding resistors in the first type of circuit board in series to form a series circuit, and then connects this series circuit in parallel with the reference resistor. For the second type of circuit board, it can be connected according to... Figure 4 The connection method shown involves connecting resistors in series on one side of the second type of circuit board to form a first series circuit, and connecting resistors in series on the other side to form a second series circuit. Each of the first and second series circuits is connected in parallel with a reference resistor. For example... Figure 6 As shown, circuit board 1 and circuit board 2 are type 1 circuit boards, according to... Figure 2 Connect as shown. Circuit boards 3 and 4 are type II circuit boards, according to... Figure 4 Connect using the connection method shown.
[0116] The display device using the embodiments of this application can connect the bonding resistors in the circuit board according to actual needs, thereby enabling the determination of the circuit board with bonding abnormalities based on the resistance value in the test circuit.
[0117] In one possible implementation, the reference resistors connected in parallel in the series circuit formed by the series bonding resistors on each circuit board can have the same or different resistance values. In one example, the reference resistors have the same resistance value; in the example above, R1 = R2 = R3 = R4, for example, R1 = R2 = R3 = R4 = 2 × 10⁻⁶. 3 Ω. In another example, the reference resistors are all of different values, so R1, R2, R3, and R4 are all different. For example, R1 = 2 × 10⁻⁶. 3 Ω, R2=3×10 3 Ω, R3 = 4 × 10 3 Ω, R4 = 5 × 10 3 Ω.
[0118] When all reference resistors have different resistance values, to facilitate resistance calculation, they can be arranged in a series circuit from one end to the other, with each reference resistor in the third series circuit having a resistance value twice that of the previous reference resistor. The third series circuit is a series circuit composed of all reference resistors connected in series. In one example, R4 = 2R3 = 4R2 = 8R1, for example, R1 = 2 × 10⁻⁶. 3 Ω, R2 = 4 × 10 3 Ω, R3 = 8 × 10 3 Ω, R4 = 16 × 10 3 Ω.
[0119] The display device using the embodiments of this application can determine the number of circuit boards with bonding abnormalities based on the resistance value in the test circuit during testing by setting the reference resistor to the same value; and can determine the circuit boards with bonding abnormalities based on the resistance value in the test circuit during testing by setting the reference resistor to different values.
[0120] In one possible implementation, the display device of this application embodiment may further include: a detection module, the detection module being connected to a first test point and a second test point;
[0121] The detection module is used to: obtain the first resistance value between the first test point and the second test point, and determine the bonding abnormality detection result of each circuit board based on the first resistance value.
[0122] like Figure 2 As shown, the first test point is TP1, and the second test point is TP2. The detection module obtains the resistance value in the test circuit by connecting the first and second test points. The circuit composed of the circuit board under test constitutes the test circuit, and the resistance value of the test circuit measured by the detection module is the first resistance value. In practical applications, the detection module can be an instrument capable of measuring resistance values, such as a megohmmeter, multimeter, voltmeter, or single-arm bridge.
[0123] The display device using the embodiments of this application can obtain resistance values by connecting a detection module, thereby determining the detection results of bonding abnormalities of each circuit board based on the resistance values, thereby improving the detection efficiency of the circuit boards.
[0124] In one possible implementation, the detection module is specifically used to: obtain a predetermined correspondence between resistance values and circuit board bonding detection results; and find the circuit board bonding detection result corresponding to the first resistance value in the correspondence as the bonding anomaly detection result for each circuit board.
[0125] In practical applications, the resistance values of the test circuit under various operating conditions can be calculated based on the resistance values of each reference resistor and bonding resistor, establishing a correspondence between these resistance values and the board bonding status. For example, for... Figure 2 The display device shown can pre-calculate the resistance values of the test circuits for circuit boards 1, 2, 3, and 4 under bonding abnormality conditions, as well as the resistance values of the test circuits when different numbers of circuit boards exhibit bonding abnormalities, establishing a correspondence between the resistance values of the display device under different conditions and the bonding detection results. In one example, this correspondence can be stored in the form of a table. After obtaining the first resistance value, the bonding abnormality detection result of each circuit board can be determined by querying this table.
[0126] The display device using the embodiments of this application establishes a pre-established correspondence between resistance values and circuit board bonding detection results. By querying the correspondence, the bonding anomaly detection results of each circuit board can be directly obtained, thereby improving the detection efficiency of the display device.
[0127] In one possible implementation, at least two circuit boards are a first circuit board, a second circuit board, a third circuit board, and a fourth circuit board; at least two reference resistors are a first reference resistor, a second reference resistor, a third reference resistor, and a fourth reference resistor;
[0128] The first circuit board is connected in parallel with the first reference resistor, the second circuit board is connected in parallel with the second reference resistor, the third circuit board is connected in parallel with the third reference resistor, and the fourth circuit board is connected in parallel with the fourth reference resistor.
[0129] The resistance values of the first reference resistor, the second reference resistor, the third reference resistor, and the fourth reference resistor are all R; the resistance values of the first circuit board, the second circuit board, the third circuit board, and the fourth circuit board are all 4R. bond ;
[0130] The detection module is specifically used to: if the first resistance value is approximately equal to 4*4R bond This confirms that all circuit boards are properly bonded.
[0131] If the first resistance value is approximately equal to R, then it is determined that one of the circuit boards has a bonding abnormality.
[0132] If the first resistance value is approximately 2R, then it is determined that two circuit boards in each circuit board have a bonding abnormality.
[0133] If the first resistance value is approximately 3R, then it is determined that three circuit boards in each circuit board have a bonding abnormality.
[0134] If the first resistance value is approximately 4R, it is determined that each circuit board has a bonding abnormality.
[0135] In one example, the display module in a display device has four circuit boards, such as... Figure 2 As shown, circuit board 1 is the first circuit board, circuit board 2 is the second circuit board, circuit board 3 is the third circuit board, and circuit board 4 is the fourth circuit board. Each circuit board has four bonding resistors, and the resistance value of each bonding resistor is R. bond Then the resistance of each circuit board is 4R. bond The first, second, third, and fourth reference resistors all have the same resistance value, R. Therefore, R1 = R2 = R3 = R4 = R.
[0136] Based on the resistance values of the bonding resistor and the reference resistor, a correspondence between the first resistance value and the circuit board bonding detection result is established in advance. For example, such as... Figure 7 The following is for Figure 2 The circuit diagram shown establishes a lookup table for resistor values. Figure 2 The parallel resistor scheme shown is Scheme 1, with the resistor settings exemplified as R1 = R2 = R3 = R4. Since the reference resistor's resistance is much larger than the bonded resistor, the bonded resistor's resistance can be ignored. Therefore, the resistance result and determination are: 1. If the first resistance value is approximately equal to 4*4R... bond 1. If the first resistance value is approximately equal to R, then all circuit boards are confirmed to be properly bonded. 2. If the first resistance value is approximately equal to 2R, then one circuit board is confirmed to have a bonding abnormality. 3. If the first resistance value is approximately equal to 2R, then two circuit boards are confirmed to have bonding abnormalities. 4. If the first resistance value is approximately equal to 3R, then three circuit boards are confirmed to have bonding abnormalities. 5. If the first resistance value is approximately equal to 4R, then all circuit boards are confirmed to have bonding abnormalities. Here, "approximately equal to" refers to the calculation result after neglecting the resistance value of the bonding resistors.
[0137] The display device using the embodiments of this application can pre-establish the correspondence between resistance values and circuit board bonding detection results, and can directly obtain the bonding anomaly detection results of each circuit board by querying the correspondence, thereby improving the detection efficiency of the display device.
[0138] In one possible implementation, at least two circuit boards are a first circuit board, a second circuit board, a third circuit board, and a fourth circuit board; at least two reference resistors are a first reference resistor, a second reference resistor, a third reference resistor, and a fourth reference resistor;
[0139] The first circuit board is connected in parallel with the first reference resistor, the second circuit board is connected in parallel with the second reference resistor, the third circuit board is connected in parallel with the third reference resistor, and the fourth circuit board is connected in parallel with the fourth reference resistor.
[0140] The first reference resistor is R, the second reference resistor is 2R, the third reference resistor is 4R, and the fourth reference resistor has a resistance of 8R.
[0141] The detection module is specifically used to: if the first resistance value is approximately equal to 4*4R bond This confirms that all circuit boards are properly bonded.
[0142] If the first resistance value is approximately equal to R, then it is determined that the first circuit board has a bonding abnormality.
[0143] If the first resistance value is approximately 2R, then it is determined that there is a bonding abnormality in the second circuit board;
[0144] If the first resistance value is approximately 4R, then it is determined that there is a bonding abnormality on the third circuit board;
[0145] If the first resistance value is approximately 8R, then the fourth circuit board is confirmed to have a bonding abnormality.
[0146] If the first resistance value is approximately 3R, it is determined that there is a bonding abnormality between the first circuit board and the second circuit board.
[0147] If the first resistance value is approximately 5R, then it is determined that there is a bonding abnormality between the first circuit board and the third circuit board.
[0148] If the first resistance value is approximately 6R, then it is determined that there is a bonding abnormality between the second and third circuit boards.
[0149] If the first resistance value is approximately 7R, then it is determined that there is a bonding abnormality in the first circuit board, the second circuit board, and the third circuit board.
[0150] If the first resistance value is approximately 9R, then it is determined that there is a bonding abnormality between the first circuit board and the fourth circuit board.
[0151] If the first resistance value is approximately 10R, then it is determined that there is a bonding abnormality between the second and fourth circuit boards.
[0152] If the first resistance value is approximately 11R, then it is determined that there is a bonding abnormality in the first circuit board, the second circuit board, and the fourth circuit board.
[0153] If the first resistance value is approximately 12R, then it is determined that there is a bonding abnormality between the third and fourth circuit boards.
[0154] If the first resistance value is approximately 13R, then it is determined that the first circuit board, the third circuit board, and the fourth circuit board have a bonding abnormality.
[0155] If the first resistance value is approximately 14R, then it is determined that the second, third, and fourth circuit boards have a bonding abnormality.
[0156] If the first resistance value is approximately 15R, then it is determined that each circuit board has a bonding abnormality.
[0157] In one example, the display module in a display device has four circuit boards, such as... Figure 4 As shown, circuit board 1 is the first circuit board, circuit board 2 is the second circuit board, circuit board 3 is the third circuit board, and circuit board 4 is the fourth circuit board. Each circuit board has four bonding resistors, and the resistance value of each bonding resistor is R. bond Then the resistance of each circuit board is 4R. bondThe first, second, third, and fourth reference resistors each have different resistance values. Furthermore, following the order from one end to the other in the third series circuit, the resistance value of each reference resistor in the third series circuit is twice the resistance value of the previous reference resistor. Therefore, R4 = 2R3 = 4R2 = 8R1.
[0158] Based on the resistance values of the bonding resistor and the reference resistor, a correspondence between the first resistance value and the circuit board bonding detection result is established in advance. For example, such as... Figure 8 The following is for Figure 4 The circuit diagram shown establishes a lookup table for resistor values. Figure 4 The parallel resistor scheme shown is Scheme 2. For example, its resistance settings are R4 = 2R3 = 4R2 = 8R1. The corresponding resistance results and judgments are as follows: 1. If the first resistance value is 4*4R... bond 1. If the first resistance value is approximately R, then the first circuit board is confirmed to have a bonding abnormality. 2. If the first resistance value is approximately 2R, then the second circuit board is confirmed to have a bonding abnormality. 4. If the first resistance value is approximately 4R, then the third circuit board is confirmed to have a bonding abnormality. 5. If the first resistance value is approximately 8R, then the fourth circuit board is confirmed to have a bonding abnormality. 6. If the first resistance value is approximately 3R, then the first and second circuit boards are confirmed to have a bonding abnormality. 7. If the first resistance value is approximately 5R, then the first and third circuit boards are confirmed to have a bonding abnormality. 8. If the first resistance value is approximately 6R, then the second and third circuit boards are confirmed to have a bonding abnormality. 9. If the first resistance value is approximately 7R, then the first, second, and third circuit boards are confirmed to have a bonding abnormality. 10. If the first resistance value is approximately 9R, then the first and fourth circuit boards are confirmed to have a bonding abnormality. 11. If the first resistance value is approximately 10R, then the second and fourth circuit boards are confirmed to have a bonding abnormality. 12. If the first resistance value is approximately 11 ohms, then the first, second, and fourth circuit boards are confirmed to have bonding abnormalities. 13. If the first resistance value is approximately 12 ohms, then the third and fourth circuit boards are confirmed to have bonding abnormalities. 14. If the first resistance value is approximately 13 ohms, then the first, third, and fourth circuit boards are confirmed to have bonding abnormalities. 15. If the first resistance value is approximately 14 ohms, then the second, third, and fourth circuit boards are confirmed to have bonding abnormalities. 16. If the first resistance value is approximately 15 ohms, then all circuit boards are confirmed to have bonding abnormalities.
[0159] The display device using the embodiments of this application can pre-establish the correspondence between resistance values and circuit board bonding detection results, and can directly obtain the bonding anomaly detection results of each circuit board by querying the correspondence, thereby improving the detection efficiency of the display device.
[0160] In a second aspect of this application, a display device detection method is also provided. This method is applied to any of the display devices described in the first aspect of this application. The method includes the following... Figure 9 The steps shown are as follows:
[0161] Step S901: Obtain the first resistance value between the first test point and the second test point.
[0162] Step S902: Determine the bonding anomaly detection results of each circuit board based on the first resistance value.
[0163] In practical applications, the first resistance value is obtained through the detection module in any of the display devices described in the first aspect of the embodiments of this application. By applying the method of the embodiments of this application, the first resistance value in the display device can be determined by obtaining at least one reference resistor connected in parallel to each circuit board, and the resistance value of the reference resistor is much larger than the bonding resistor of the circuit board. This allows the bonding status of each circuit board in the display device to be judged by the first resistance value, avoiding the need for pin-punch testing on each circuit board and thus improving the detection efficiency of the display device.
[0164] In one possible implementation, step S902 can be achieved through the following steps:
[0165] Step 1: Obtain the correspondence between the predetermined resistance value and the circuit board bonding test results.
[0166] Step 2: Find the circuit board bonding test result corresponding to the first resistance value in the correspondence relationship as the bonding anomaly test result for each circuit board.
[0167] By applying the method of this application embodiment, a correspondence between resistance values and circuit board bonding detection results is established in advance. The bonding anomaly detection results of each circuit board can be directly obtained by querying the correspondence, thereby improving the detection efficiency of the display device.
[0168] In one possible implementation, the display device applying the method of the embodiments of this application includes at least two circuit boards and at least two reference resistors; the at least two circuit boards are a first circuit board, a second circuit board, a third circuit board, and a fourth circuit board; the at least two reference resistors are a first reference resistor, a second reference resistor, a third reference resistor, and a fourth reference resistor;
[0169] The first circuit board is connected in parallel with the first reference resistor, the second circuit board is connected in parallel with the second reference resistor, the third circuit board is connected in parallel with the third reference resistor, and the fourth circuit board is connected in parallel with the fourth reference resistor.
[0170] The resistance values of the first, second, third, and fourth reference resistors are all R; the resistance values of the first, second, third, and fourth circuit boards are all 4R. bond ;
[0171] Then step S902 may include the following steps:
[0172] Step A: If the first resistance value is approximately equal to 4*4R bond This confirms that all circuit boards are properly bonded.
[0173] Step B: If the first resistance value is approximately equal to R, then it is determined that one of the circuit boards has a bonding abnormality.
[0174] Step C: If the first resistance value is approximately 2R, then it is determined that two circuit boards in each circuit board have a bonding abnormality.
[0175] Step D: If the first resistance value is approximately 3R, then it is determined that three circuit boards in each circuit board have a bonding abnormality.
[0176] Step E: If the first resistance value is approximately 4R, then it is determined that each circuit board has a bonding abnormality.
[0177] The display device using the embodiments of this application can calculate the correspondence between the resistance value and the circuit board bonding detection result, thereby determining the bonding abnormality detection result of each circuit board through the first resistance value, thereby improving the detection efficiency of the display device.
[0178] In one possible implementation, the display device applying the method of the embodiments of this application includes at least two circuit boards and at least two reference resistors; the at least two circuit boards are a first circuit board, a second circuit board, a third circuit board, and a fourth circuit board; the at least two reference resistors are a first reference resistor, a second reference resistor, a third reference resistor, and a fourth reference resistor;
[0179] The first circuit board is connected in parallel with the first reference resistor, the second circuit board is connected in parallel with the second reference resistor, the third circuit board is connected in parallel with the third reference resistor, and the fourth circuit board is connected in parallel with the fourth reference resistor.
[0180] The first reference resistor has a resistance of R, the second reference resistor has a resistance of 2R, the third reference resistor has a resistance of 4R, and the fourth reference resistor has a resistance of 8R; the resistance values of the first circuit board, the second circuit board, the third circuit board, and the fourth circuit board are all 4R. bond ;
[0181] Then step S902 may include the following steps:
[0182] Step a: If the first resistance value is approximately equal to 4*4R bond This confirms that all circuit boards are properly bonded.
[0183] Step b: If the first resistance value is approximately equal to R, then it is determined that the first circuit board has a bonding abnormality;
[0184] Step c: If the first resistance value is approximately 2R, then it is determined that the second circuit board has a bonding abnormality;
[0185] Step d: If the first resistance value is approximately 4R, then it is determined that the third circuit board has a bonding abnormality.
[0186] Step e: If the first resistance value is approximately 8R, then it is determined that the fourth circuit board has a bonding abnormality;
[0187] Step f: If the first resistance value is approximately 3R, then it is determined that there is a bonding abnormality between the first circuit board and the second circuit board;
[0188] Step g: If the first resistance value is approximately 5R, then it is determined that there is a bonding abnormality between the first circuit board and the third circuit board;
[0189] Step h: If the first resistance value is approximately 6R, then it is determined that there is a bonding abnormality between the second and third circuit boards;
[0190] Step i: If the first resistance value is approximately 7R, then it is determined that there is a bonding abnormality in the first circuit board, the second circuit board, and the third circuit board;
[0191] Step j: If the first resistance value is approximately 9R, then it is determined that there is a bonding abnormality between the first circuit board and the fourth circuit board;
[0192] Step k: If the first resistance value is approximately 10R, then it is determined that there is a bonding abnormality between the second and fourth circuit boards;
[0193] Step 1: If the first resistance value is approximately 11R, then it is determined that the first circuit board, the second circuit board, and the fourth circuit board have a bonding abnormality.
[0194] Step m: If the first resistance value is approximately 12R, then it is determined that there is a bonding abnormality between the third and fourth circuit boards;
[0195] Step n: If the first resistance value is approximately 13R, then it is determined that the first circuit board, the third circuit board, and the fourth circuit board have a bonding abnormality.
[0196] Step o: If the first resistance value is approximately 14R, then it is determined that the second, third, and fourth circuit boards have a bonding abnormality.
[0197] Step p: If the first resistance value is approximately 15R, then it is determined that each circuit board has a bonding abnormality.
[0198] The display device using the embodiments of this application can calculate the correspondence between the resistance value and the circuit board bonding detection result, thereby determining the bonding abnormality detection result of each circuit board through the first resistance value, thereby improving the detection efficiency of the display device.
[0199] In the above embodiments, implementation can be achieved entirely or partially through software, hardware, firmware, or any combination thereof. When implemented using software, it can be implemented entirely or partially in the form of a computer program product. The computer program product includes one or more computer instructions. When the computer program instructions are loaded and executed on a computer, all or part of the processes or functions described in the embodiments of this application are generated. The computer can be a general-purpose computer, a special-purpose computer, a computer network, or other programmable device. The computer instructions can be stored in a computer-readable storage medium or transmitted from one computer-readable storage medium to another. For example, the computer instructions can be transmitted from one website, computer, server, or data center to another website, computer, server, or data center via wired (e.g., coaxial cable, fiber optic, digital subscriber line (DSL)) or wireless (e.g., infrared, wireless, microwave, etc.) means. The computer-readable storage medium can be any available medium that a computer can access or a data storage device such as a server or data center that integrates one or more available media. The available medium can be a magnetic medium (e.g., floppy disk, hard disk, magnetic tape), an optical medium (e.g., DVD), or a semiconductor medium (e.g., solid state disk (SSD)).
[0200] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.
[0201] The various embodiments in this specification are described in a related manner. Similar or identical parts between embodiments can be referred to mutually. Each embodiment focuses on describing the differences from other embodiments. In particular, the method embodiments are basically similar to the display device embodiments, so the description is relatively simple; relevant parts can be referred to the description of the method embodiments.
[0202] The above description is merely a preferred embodiment of this application and is not intended to limit the scope of protection of this application. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application are included within the scope of protection of this application.
Claims
1. A display device, characterized by comprising: The display device comprises at least two circuit boards, at least two reference resistors, and a detection module; Each of the circuit boards is connected in parallel with at least one reference resistor, and the reference resistors connected in parallel with each of the circuit boards are different; wherein the binding resistors in any of the circuit boards are connected in series to form at least one series circuit, and any of the series circuits is connected in parallel with one reference resistor; The reference resistors are connected in series, and one end of a third series circuit formed by the reference resistors is connected to a first test point, and the other end of the third series circuit is connected to a second test point; The resistance value of the reference resistor is much greater than the binding resistance of the circuit board; The detection module is connected to the first test point and the second test point; The detection module is configured to acquire a first resistance value between the first test point and the second test point, and determine a binding abnormality detection result of each of the circuit boards according to the first resistance value.
2. The display device of claim 1, wherein for any of the circuit boards, the binding resistors in the circuit board are connected in series, and the series circuit formed by the binding resistors in the circuit board is connected in parallel with one reference resistor.
3. The display device of claim 1, wherein for any of the circuit boards, the binding resistors on one side of the circuit board are connected in series to form a first series circuit, the binding resistors on the other side of the circuit board are connected in series to form a second series circuit, the first series circuit is connected in parallel with one reference resistor, the second series circuit is connected in parallel with one reference resistor, and the reference resistors connected in parallel with the first series circuit and the second series circuit are different.
4. The display device of claim 1, wherein for a first type of circuit board, the binding resistors in the first type of circuit board are connected in series, and the series circuit formed by the binding resistors in the circuit board is connected in parallel with one reference resistor; for a second type of circuit board, the binding resistors on one side of the second type of circuit board are connected in series to form a first series circuit, the binding resistors on the other side of the second type of circuit board are connected in series to form a second series circuit, the first series circuit is connected in parallel with one reference resistor, the second series circuit is connected in parallel with one reference resistor, and the reference resistors connected in parallel with the first series circuit and the second series circuit are different. Each of the reference resistors is a resistor with the same resistance value. Each of the reference resistors is a resistor with different resistance values. In order from one end of the third series circuit to the other end, the resistance value of each reference resistor in the third series circuit is twice the resistance value of the previous reference resistor. The detection module is specifically configured to acquire a predetermined correspondence between resistance values and circuit board binding detection results, and find the circuit board binding detection result corresponding to the first resistance value in the correspondence as the binding abnormality detection result of each of the circuit boards.
5. The display device according to any of claims 2-4, characterized in that, The at least two circuit boards are a first circuit board, a second circuit board, a third circuit board, and a fourth circuit board; and the at least two reference resistors are a first reference resistor, a second reference resistor, a third reference resistor, and a fourth reference resistor.
6. The display device according to any of claims 2-4, characterized in that 7. The display device of claim 6, wherein, 8. The display device of claim 1, wherein, 9. The display device according to claim 1 or 8, characterized by The first circuit board is connected in parallel with the first reference resistor, the second circuit board is connected in parallel with the second reference resistor, the third circuit board is connected in parallel with the third reference resistor, and the fourth circuit board is connected in parallel with the fourth reference resistor; The resistance values of the first reference resistor, the second reference resistor, the third reference resistor and the fourth reference resistor are R; the resistance values of the first circuit board, the second circuit board, the third circuit board and the fourth circuit board are 4R bond ; The detection module is specifically configured to: if the first resistance value is approximately equal to 4x4R bond , it is determined that each of the circuit boards is normally bound. If the first resistance value is about equal to R, it is determined that one of the circuit boards has a binding abnormality; If the first resistance value is about equal to 2R, it is determined that two of the circuit boards have a binding abnormality; If the first resistance value is about equal to 3R, it is determined that three of the circuit boards have a binding abnormality; If the first resistance value is about equal to 4R, it is determined that all of the circuit boards have a binding abnormality.
10. The display device according to claim 1 or 8, wherein The at least two circuit boards are a first circuit board, a second circuit board, a third circuit board, and a fourth circuit board; and the at least two reference resistors are a first reference resistor, a second reference resistor, a third reference resistor, and a fourth reference resistor. The first circuit board is connected in parallel with the first reference resistor, the second circuit board is connected in parallel with the second reference resistor, the third circuit board is connected in parallel with the third reference resistor, and the fourth circuit board is connected in parallel with the fourth reference resistor; The first reference resistance is R, the second reference resistance is 2R, the third reference resistance is 4R, and the fourth reference resistance is 8R; the resistance values of the first circuit board, the second circuit board, the third circuit board, and the fourth circuit board are all 4R bond ; The detection module is specifically configured to: if the first resistance value is approximately equal to 4x4R bond , it is determined that each of the circuit boards is normally bound. If the first resistance value is about equal to R, it is determined that the first circuit board has a binding abnormality; If the first resistance value is about equal to 2R, it is determined that the second circuit board has a binding abnormality; If the first resistance value is about equal to 4R, it is determined that the third circuit board has a binding abnormality; If the first resistance value is about equal to 8R, it is determined that the fourth circuit board has a binding abnormality; If the first resistance value is about equal to 3R, it is determined that the first circuit board and the second circuit board have a binding abnormality; If the first resistance value is about equal to 5R, it is determined that the first circuit board and the third circuit board have a binding abnormality; If the first resistance value is about equal to 6R, it is determined that the second circuit board and the third circuit board have a binding abnormality; If the first resistance value is about equal to 7R, it is determined that the first circuit board, the second circuit board, and the third circuit board have a binding abnormality; If the first resistance value is about equal to 9R, it is determined that the first circuit board and the fourth circuit board have a binding abnormality; If the first resistance value is about equal to 10R, it is determined that the second circuit board and the fourth circuit board have a binding abnormality; If the first resistance value is about equal to 11R, it is determined that the first circuit board, the second circuit board, and the fourth circuit board have a binding abnormality; If the first resistance value is about equal to 12R, it is determined that the third circuit board and the fourth circuit board have a binding abnormality; If the first resistance value is about equal to 13R, it is determined that the first circuit board, the third circuit board, and the fourth circuit board have a binding abnormality; If the first resistance value is about equal to 14R, it is determined that the second circuit board, the third circuit board, and the fourth circuit board have a binding abnormality; If the first resistance value is about equal to 15R, it is determined that all of the circuit boards have a binding abnormality.
11. A display device detection method, characterized by, The method is applied to the display device of any one of claims 1-10, and the method comprises: obtaining a first resistance value between the first test point and the second test point; determining a binding abnormality detection result of each circuit board according to the first resistance value.
12. The method of claim 11, wherein, The determination of the binding abnormality detection result of each circuit board according to the first resistance value comprises: obtaining a corresponding relationship between a predetermined resistance value and a circuit board binding detection result; finding the circuit board binding detection result corresponding to the first resistance value in the corresponding relationship as the binding abnormality detection result of each circuit board.
13. The method of claim 11, wherein, The display device comprises at least two circuit boards and at least two reference resistances; the at least two circuit boards are a first circuit board, a second circuit board, a third circuit board and a fourth circuit board; and the at least two reference resistances are a first reference resistance, a second reference resistance, a third reference resistance and a fourth reference resistance. The first circuit board is connected in parallel with the first reference resistance, the second circuit board is connected in parallel with the second reference resistance, the third circuit board is connected in parallel with the third reference resistance, and the fourth circuit board is connected in parallel with the fourth reference resistance. The resistance values of the first reference resistor, the second reference resistor, the third reference resistor and the fourth reference resistor are R; the resistance values of the first circuit board, the second circuit board, the third circuit board and the fourth circuit board are 4R bond ; The determination of the binding abnormality detection result of each circuit board according to the first resistance value comprises: If the first resistance value is about equal to 4x4R bond then it is determined that each of the circuit boards is normally bound. if the first resistance value is obtained as approximately equal to R, it is determined that one of the circuit boards has a binding abnormality; if the first resistance value is obtained as approximately equal to 2R, it is determined that two of the circuit boards have a binding abnormality; if the first resistance value is obtained as approximately equal to 3R, it is determined that three of the circuit boards have a binding abnormality; if the first resistance value is obtained as approximately equal to 4R, it is determined that all of the circuit boards have a binding abnormality.
14. The method of claim 11, wherein, The display device comprises at least two circuit boards and at least two reference resistances; the at least two circuit boards are a first circuit board, a second circuit board, a third circuit board and a fourth circuit board; and the at least two reference resistances are a first reference resistance, a second reference resistance, a third reference resistance and a fourth reference resistance. The first circuit board is connected in parallel with the first reference resistance, the second circuit board is connected in parallel with the second reference resistance, the third circuit board is connected in parallel with the third reference resistance, and the fourth circuit board is connected in parallel with the fourth reference resistance. The first reference resistance is R, the second reference resistance is 2R, the third reference resistance is 4R, and the fourth reference resistance is 8R; the resistance values of the first circuit board, the second circuit board, the third circuit board, and the fourth circuit board are all 4R bond ; The determination of the binding abnormality detection result of each circuit board according to the first resistance value comprises: If the first resistance value is about equal to 4x4R bond , it is determined that each of the circuit boards is normally bound. if the first resistance value is obtained as approximately equal to R, it is determined that the first circuit board has a binding abnormality; if the first resistance value is obtained as approximately equal to 2R, it is determined that the second circuit board has a binding abnormality; if the first resistance value is obtained as approximately equal to 4R, it is determined that the third circuit board has a binding abnormality; if the first resistance value is obtained as approximately equal to 8R, it is determined that the fourth circuit board has a binding abnormality; if the first resistance value is obtained as approximately equal to 3R, it is determined that the first circuit board and the second circuit board have a binding abnormality; if the first resistance value is obtained as approximately equal to 5R, it is determined that the first circuit board and the third circuit board have a binding abnormality; if the first resistance value is obtained as approximately equal to 6R, it is determined that the second circuit board and the third circuit board have a binding abnormality; If the first resistance value is about equal to 7R, it is determined that the first circuit board, the second circuit board and the third circuit board have a binding abnormality; If the first resistance value is about equal to 9R, it is determined that the first circuit board and the fourth circuit board have a binding abnormality; If the first resistance value is about equal to 10R, it is determined that the second circuit board and the fourth circuit board have a binding abnormality; If the first resistance value is about equal to 11R, it is determined that the first circuit board, the second circuit board and the fourth circuit board have a binding abnormality; If the first resistance value is about equal to 12R, it is determined that the third circuit board and the fourth circuit board have a binding abnormality; If the first resistance value is about equal to 13R, it is determined that the first circuit board, the third circuit board and the fourth circuit board have a binding abnormality; If the first resistance value is about equal to 14R, it is determined that the second circuit board, the third circuit board and the fourth circuit board have a binding abnormality; If the first resistance value is about equal to 15R, it is determined that all the circuit boards have a binding abnormality.
Citation Information
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