Multilayer ceramic capacitor

Abstract

The disclosed multilayer ceramic capacitor includes: a ceramic body; a plurality of first internal electrodes and a plurality of second internal electrodes, the plurality of first internal electrodes and the plurality of second internal electrodes being disposed inside the ceramic body; and a first external electrode and a second external electrode, the first external electrode and the second external electrode being disposed outside the ceramic body. Each of the first external electrode and the second external electrode includes an electrode layer disposed on an end surface of the ceramic body and electrically connected to the first internal electrode or the second internal electrode, a non-conductive resin layer, and a conductive resin layer disposed on an end surface of the ceramic body and electrically connected to the non-conductive resin layer. And a non-conductive resin layer provided on at least one surface of the ceramic body connected to the end surface and in contact with the electrode layer, the conductive resin layer covering at least a portion of the non-conductive resin layer.

Description

Technical Field

[0001] The present disclosure relates to a multilayer ceramic capacitor. Background Art

[0002] Electronic components using ceramic materials include capacitors, inductors, piezoelectric elements, varistors, thermistors, etc. Among ceramic electronic components, multilayer ceramic capacitors (MLCCs) are used in various electronic devices due to their advantages of miniaturization, high capacity, and easy mounting.

[0003] For example, multilayer ceramic capacitors can be mounted on substrates of various electronic products (such as imaging devices (such as liquid crystal displays (LCDs), plasma display panels (PDPs), organic light emitting diode (OLED) displays, etc.), computers, personal portable terminals, and smart phones), so that the multilayer ceramic capacitors are used as chip capacitors that are charged or discharged therefrom.

[0004] A multilayer ceramic capacitor may include an inner electrode disposed inside a ceramic body and an outer electrode disposed outside the ceramic body and connected to the inner electrode. If the outer electrode is too thick, a volume occupied by the outer electrode is large, thereby causing a problem of reducing the effective capacitance of the multilayer ceramic capacitor.

[0005] The information disclosed in the above Background section is to assist in understanding the background of the present disclosure and should not be regarded as an admission that this information forms any part of the prior art. Summary of the invention

[0006] An aspect of the present disclosure is to provide a multilayer ceramic capacitor including an external electrode having a reduced volume.

[0007] However, the problems to be solved by the embodiments of the present disclosure are not limited to the above-mentioned problems, and various extensions can be made within the scope of the technical concept included in the present disclosure.

[0008] A multilayer ceramic capacitor according to one aspect of the present disclosure includes: a ceramic body, the ceramic body including a first surface and a second surface opposite to each other in a first direction, a third surface and a fourth surface opposite to each other in a second direction and connecting the first surface and the second surface, and a fifth surface and a sixth surface opposite to each other in a third direction and connecting the first surface and the second surface; a plurality of first inner electrodes and a plurality of second inner electrodes, the plurality of first inner electrodes and the plurality of second inner electrodes being arranged inside the ceramic body; and a first outer electrode and a second outer electrode, the first outer electrode and the second outer electrode being arranged outside the ceramic body. The first external electrode includes a first electrode layer, a first non-conductive resin layer and a first conductive resin layer, the first electrode layer is arranged on the first surface of the ceramic body and is electrically connected to the multiple first internal electrodes, the first non-conductive resin layer is arranged on at least one of the third surface, the fourth surface, the fifth surface and the sixth surface of the ceramic body and is in contact with the first electrode layer, and the first conductive resin layer covers at least a portion of the first non-conductive resin layer, and the second external electrode includes a second electrode layer, a second non-conductive resin layer and a second conductive resin layer, the second electrode layer is arranged on the second surface of the ceramic body and is electrically connected to the multiple second internal electrodes, the second non-conductive resin layer is arranged on at least one of the third surface, the fourth surface, the fifth surface and the sixth surface of the ceramic body and is in contact with the second electrode layer, and the second conductive resin layer covers at least a portion of the second non-conductive resin layer.

[0009] The first non-conductive resin layer may include a first end in contact with the first electrode layer and a second end opposite to the first end in the first direction, and the second non-conductive resin layer may include a third end in contact with the second electrode layer and a fourth end opposite to the third end in the first direction.

[0010] The first conductive resin layer may cover the first end portion and the second end portion of the first non-conductive resin layer, and the second conductive resin layer may cover the third end portion and the fourth end portion of the second non-conductive resin layer.

[0011] The first conductive resin layer may cover the first end portion of the first non-conductive resin layer and may expose the second end portion, and the second conductive resin layer may cover the third end portion of the second non-conductive resin layer and may expose the fourth end portion.

[0012] The length of the first non-conductive resin layer in the first direction may be greater than the length of the first conductive resin layer in the first direction, and the length of the second non-conductive resin layer in the first direction may be greater than the length of the second conductive resin layer in the first direction.

[0013] The first electrode layer may also include a first extension portion, which is arranged on at least one of the third surface, the fourth surface, the fifth surface and the sixth surface of the ceramic body, and the second electrode layer may also include a second extension portion, which is arranged on at least one of the third surface, the fourth surface, the fifth surface and the sixth surface of the ceramic body.

[0014] The first extension portion may be covered by the first non-conductive resin layer, and the second extension portion may be covered by the second non-conductive resin layer.

[0015] The first non-conductive resin layer may include a first end in contact with the first electrode layer and a second end opposite to the first end in the first direction, and the second non-conductive resin layer may include a third end in contact with the second electrode layer and a fourth end opposite to the third end in the first direction.

[0016] The first conductive resin layer may cover the second end portion of the first non-conductive resin layer, and the second conductive resin layer may cover the fourth end portion of the second non-conductive resin layer.

[0017] The first conductive resin layer may expose the second end portion of the first non-conductive resin layer, and the second conductive resin layer may expose the fourth end portion of the second non-conductive resin layer.

[0018] The length of the first non-conductive resin layer in the first direction may be greater than the length of the first conductive resin layer in the first direction, and the length of the second non-conductive resin layer in the first direction may be greater than the length of the second conductive resin layer in the first direction.

[0019] The first electrode layer may include copper (Cu) or nickel (Ni), and the second electrode layer may include copper (Cu) or nickel (Ni).

[0020] The first non-conductive resin layer may include epoxy resin, and the second non-conductive resin layer may include epoxy resin.

[0021] The first conductive resin layer may include a conductive metal and an epoxy resin, and the second conductive resin layer may include a conductive metal and an epoxy resin.

[0022] The first conductive resin layer may include an intermetallic compound and an epoxy resin, and the second conductive resin layer may include an intermetallic compound and an epoxy resin.

[0023] The multilayer ceramic capacitor may further include: a first plating layer covering at least a portion of the first external electrode; and a second plating layer covering at least a portion of the second external electrode.

[0024] The first plating layer may include a first layer disposed on the first external electrode and a second layer disposed on the first layer, and the second plating layer may include a third layer disposed on the second external electrode and a fourth layer disposed on the third layer.

[0025] The first layer and the third layer may include nickel (Ni), and the second layer and the fourth layer may include tin (Sn).

[0026] A multilayer ceramic capacitor according to another aspect of the present disclosure includes: a ceramic body including a first surface and a second surface opposite to each other in a first direction, a third surface and a fourth surface opposite to each other in a second direction and connecting the first surface and the second surface, and a fifth surface and a sixth surface opposite to each other in a third direction and connecting the first surface and the second surface; a plurality of first internal electrodes and a plurality of second internal electrodes, the plurality of first internal electrodes and the plurality of second internal electrodes being disposed inside the ceramic body; a non-conductive resin layer disposed on at least one of the third surface, the fourth surface, the fifth surface, and the sixth surface of the ceramic body; and a first external electrode and a second external electrode, the first external electrode and the second external electrode being disposed outside the ceramic body. The first external electrode includes a first electrode layer and a first conductive resin layer, the first electrode layer is disposed on the first surface of the ceramic body and electrically connected to the plurality of first internal electrodes, the first conductive resin layer covers a portion of the non-conductive resin layer, and the second external electrode includes a second electrode layer and a second conductive resin layer, the second electrode layer is disposed on the second surface of the ceramic body and electrically connected to the plurality of second internal electrodes, the second conductive resin layer covers another portion of the non-conductive resin layer.

[0027] The first electrode layer may also include a first extension portion, which is arranged on at least one of the third surface, the fourth surface, the fifth surface and the sixth surface of the ceramic body and is covered by the non-conductive resin layer, and the second electrode layer may also include a second extension portion, which is arranged on at least one of the third surface, the fourth surface, the fifth surface and the sixth surface of the ceramic body and is covered by the non-conductive resin layer.

[0028] According to the multilayer ceramic capacitor of the present disclosure, the portion contributing to capacitance can be increased by reducing the volume of the external electrodes. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] Figure 1 is a perspective view schematically showing a multilayer ceramic capacitor according to an embodiment.

[0030] Figure 2 is along Figure 1 A cross-sectional view taken along line II-II'.

[0031] Figure 3 It is shown Figure 1 An exploded perspective view of the stacking structure of the ceramic body in a multilayer ceramic capacitor.

[0032] Figure 4 is a perspective view schematically showing a multilayer ceramic capacitor according to another embodiment.

[0033] Figure 5 is along Figure 4 A cross-sectional view taken along line V-V'.

[0034] Figure 6 is a cross-sectional view schematically showing a multilayer ceramic capacitor according to another embodiment.

[0035] Figure 7 is a cross-sectional view schematically showing a multilayer ceramic capacitor according to another embodiment.

[0036] Figure 8 is a perspective view schematically showing a multilayer ceramic capacitor according to another embodiment.

[0037] Fig. 9 is along Figure 8 A cross-sectional view taken along line IX-IX'.

[0038] Fig.10 is a cross-sectional view schematically showing a multilayer ceramic capacitor according to another embodiment.

[0039] Fig.11 is a view schematically showing a bending test method of a multilayer ceramic capacitor.

[0040] Fig.12 It is shown that the use Fig.11 Graph of the test results of the bending test method.

[0041] Fig.13 : is a graph comparing the equivalent series resistance (ESR) of the example with the equivalent series resistance (ESR) of the comparative example 1 and the equivalent series resistance (ESR) of the comparative example 2. DETAILED DESCRIPTION

[0042] Hereinafter, various embodiments of the present disclosure will be described in detail so that a person skilled in the art of the present disclosure can easily implement the present disclosure with reference to the accompanying drawings. In order to clearly describe the present disclosure, parts or portions not related to the description are omitted in the accompanying drawings, and the same or similar constituent elements are represented by the same reference numerals throughout the specification. In addition, some constituent elements in the accompanying drawings are enlarged, omitted or schematically shown, and the size of each constituent element does not fully reflect the actual size.

[0043] The accompanying drawings are provided only to allow easy understanding of the embodiments disclosed in this specification and should not be interpreted as limiting the spirit disclosed in this specification, and it should be understood that the present disclosure includes all modifications, equivalents, and replacements without departing from the scope and spirit of the present disclosure.

[0044] Terms including ordinal numbers such as first, second, etc. will only be used to describe various components and should not be construed as limiting these components. These terms are only used to distinguish one component from other components.

[0045] It should be understood that when an element such as a layer, film, region, or substrate is referred to as being "on" or "above" another element, it may be directly on the other element, or there may be intervening elements. In contrast, when an element is referred to as being "directly on" another element, there are no intervening elements. In addition, in the specification, the words "on..." or "above..." mean being disposed on or below a target portion, and do not necessarily mean being disposed on the upper side of a target portion based on the direction of gravity.

[0046] It will be further understood that the terms "include / comprises" or "having" used throughout the specification indicate the presence of stated features, numbers, steps, operations, components, parts, or combinations thereof, but do not exclude the presence or addition of one or more other features, numbers, steps, operations, components, parts, or combinations thereof. Therefore, unless explicitly described to the contrary, the word "include" and variations such as "comprising" or "having" will be understood to imply the inclusion of stated elements but not the exclusion of any other elements.

[0047] Furthermore, throughout the specification, the phrase “in a plan view” or “on a plane” means observing a target portion from the top, and the phrase “in a cross-sectional view” or “on a cross section” means observing a cross section formed by vertically cutting the target portion from the side.

[0048] Furthermore, throughout the specification, “connected” means not only a case where two or more elements are directly connected, but also a case where two or more elements are indirectly connected through other elements, and a case where two or more elements are physically or electrically connected, and further, elements may be represented by different names according to positions or functions, and “connected” may also mean a case where corresponding parts that are substantially integrated are associated with each other.

[0049] Figure 1 is a perspective view schematically showing a multilayer ceramic capacitor according to an embodiment, Figure 2 is along Figure 1 A cross-sectional view taken along line II-II', Figure 3 It is shown Figure 1 An exploded perspective view of the stacking structure of the ceramic body in a multilayer ceramic capacitor.

[0050] Reference Figure 1 , Figure 2 and Figure 3 , the multilayer ceramic capacitor 1000 according to the present embodiment includes a ceramic body 110 , a first external electrode 120 , a second external electrode 130 , a plurality of first internal electrodes 150 , and a plurality of second internal electrodes 160 .

[0051] First, directions are defined to clearly describe the present embodiment. The L-axis direction, W-axis direction, and T-axis direction shown in the figure represent the length direction, width direction, and thickness direction of the multilayer ceramic capacitor 1000, respectively.

[0052] The thickness direction (T-axis direction) may be a direction perpendicular to the wide surface (main surface) of the constituent element having a sheet shape. For example, the thickness direction (T-axis direction) may be used as the same concept as the direction in which the dielectric layer 140 is stacked.

[0053] The length direction (L-axis direction) may be a direction parallel to the wide surface (main surface) of the constituent element having a sheet shape and intersecting (or perpendicular to) the thickness direction (T-axis direction). For example, the length direction (L-axis direction) may be a direction in which the first external electrode 120 and the second external electrode 130 are opposite to each other.

[0054] The width direction (W-axis direction) may be a direction parallel to a wide surface (main surface) of a component having a sheet shape and intersecting (or perpendicular to) the thickness direction (T-axis direction) and the length direction (L-axis direction).

[0055] The ceramic body 110 may have an approximately hexahedral shape, but the present embodiment is not limited thereto. Due to shrinkage during sintering, the ceramic body 110 may not have a completely hexahedral shape, but may have a substantially hexahedral shape. For example, the ceramic body 110 may have an approximately rectangular parallelepiped shape, but portions corresponding to corners or vertices may have a rounded shape.

[0056] For the convenience of describing the present embodiment, surfaces opposite to each other in the length direction (L-axis direction) are defined as a first surface S1 and a second surface S2, surfaces opposite to each other in the width direction (W-axis direction) and connecting the first surface S1 and the second surface S2 are defined as a third surface S3 and a fourth surface S4, and surfaces opposite to each other in the thickness direction (T-axis direction) and connecting the first surface S1 and the second surface S2 are defined as a fifth surface S5 and a sixth surface S6.

[0057] Therefore, the first direction, which is the direction in which the first surface S1 and the second surface S2 are relative to each other, can be the length direction (L-axis direction), and the second direction and the third direction perpendicular to the first direction and to each other can be the thickness direction (T-axis direction) and the width direction (W-axis direction) or the width direction (W-axis direction) and the thickness direction (T-axis direction), respectively.

[0058] The length of the ceramic body 110 may mean the maximum value among the lengths of the multiple line segments connecting the two outermost boundary lines of the ceramic body 110 shown in the cross-sectional photo that are opposite to each other in the length direction (L-axis direction) and parallel to the length direction (L-axis direction). The cross-sectional photo may be an optical microscope photo or a scanning electron microscope (SEM) photo of the cross section in the length direction (L-axis direction)-thickness direction (T-axis direction) at the central part in the width direction (W-axis direction) of the ceramic body 110. On the other hand, the length of the ceramic body 110 may mean the minimum value among the lengths of the multiple line segments connecting the two outermost boundary lines of the ceramic body 110 shown in the cross-sectional photo that are opposite to each other in the length direction (L-axis direction) and parallel to the length direction (L-axis direction). On the other hand, the length of the ceramic body 110 may mean the arithmetic mean of the lengths of at least two of the multiple line segments connecting the two outermost boundary lines of the ceramic body 110 shown in the cross-sectional photo that are opposite to each other in the length direction (L-axis direction) and parallel to the length direction (L-axis direction).

[0059] The thickness of the ceramic body 110 may mean the maximum value of the lengths of the multiple line segments connecting the two outermost boundary lines of the ceramic body 110 shown in the cross-sectional photo that are opposite to each other in the thickness direction (T-axis direction) and parallel to the thickness direction (T-axis direction). The cross-sectional photo may be an optical microscope photo or a scanning electron microscope (SEM) photo of the length direction (L-axis direction)-thickness direction (T-axis direction) cross section at the central part in the width direction (W-axis direction) of the ceramic body 110. On the other hand, the thickness of the ceramic body 110 may mean the minimum value of the lengths of the multiple line segments connecting the two outermost boundary lines of the ceramic body 110 shown in the cross-sectional photo that are opposite to each other in the thickness direction (T-axis direction) and parallel to the thickness direction (T-axis direction). On the other hand, the thickness of the ceramic body 110 may mean the arithmetic mean of the lengths of at least two of the multiple line segments connecting the two outermost boundary lines of the ceramic body 110 shown in the cross-sectional photo that are opposite to each other in the thickness direction (T-axis direction) and parallel to the thickness direction (T-axis direction).

[0060] The width of the ceramic body 110 may mean the maximum value of the lengths of the multiple line segments connecting the two outermost boundary lines of the ceramic body 110 shown in the cross-sectional photo that are opposite to each other in the width direction (W-axis direction) and parallel to the width direction (W-axis direction). The cross-sectional photo may be an optical microscope photo or a scanning electron microscope (SEM) photo of the length direction (L-axis direction)-width direction (W-axis direction) cross section at the central part in the thickness direction (T-axis direction) of the ceramic body 110. On the other hand, the width of the ceramic body 110 may mean the minimum value of the lengths of the multiple line segments connecting the two outermost boundary lines of the ceramic body 110 shown in the cross-sectional photo that are opposite to each other in the width direction (W-axis direction) and parallel to the width direction (W-axis direction). On the other hand, the width of the ceramic body 110 may mean the arithmetic mean of the lengths of at least two of the multiple line segments connecting the two outermost boundary lines of the ceramic body 110 shown in the cross-sectional photo that are opposite to each other in the width direction (W-axis direction) and parallel to the width direction (W-axis direction).

[0061] The length, thickness, and width of the ceramic body 110 may be measured by standard methods that will be readily understood and appreciated by one of ordinary skill in the art.

[0062] The ceramic body 110 may include a plurality of dielectric layers 140 stacked in a thickness direction (T-axis direction). The boundaries between the dielectric layers 140 may be unclear. For example, it is difficult to observe the boundaries between the dielectric layers 140 without using a scanning electron microscope (SEM), and the plurality of dielectric layers 140 may appear to be an integrated structure.

[0063] The first internal electrodes 150 and the second internal electrodes 160 may be alternately stacked with the dielectric layer 140 interposed between the first internal electrodes 150 and the second internal electrodes 160. The stacking structure may be repeated within the ceramic body 110, and the internal electrode closest to the fifth surface S5 of the ceramic body 110 may be the first internal electrode 150 or the second internal electrode 160, and the internal electrode closest to the sixth surface S6 may be the first internal electrode 150 or the second internal electrode 160.

[0064] The first and second internal electrodes 150 and 160 may have different polarities and may be electrically insulated from each other by the dielectric layer 140 disposed therebetween.

[0065] The first internal electrode 150 and the second internal electrode 160 may be disposed to be offset from each other in the length direction (L-axis direction) with the dielectric layer 140 interposed therebetween. One end of the first internal electrode 150 may be exposed through the first surface S1 of the ceramic body 110, and one end of the second internal electrode 160 may be exposed through the second surface S2 of the ceramic body 110. The end of the first internal electrode 150 exposed from the first surface S1 of the ceramic body 110 may be connected to the first external electrode 120. The end of the second internal electrode 160 exposed from the second surface S2 of the ceramic body 110 may be connected to the second external electrode 130.

[0066] The first and second internal electrodes 150 and 160 may be formed by printing a conductive paste including a conductive metal on the surface of the dielectric layer 140. For example, a conductive paste including nickel (Ni) or a nickel (Ni) alloy may be printed on the surface of the dielectric layer using screen printing or gravure printing to form the internal electrodes. However, the present embodiment is not limited thereto.

[0067] For example, the average thickness of the first and second internal electrodes 150 and 160 may be approximately greater than or equal to 0.1 μm and less than or equal to 2 μm.

[0068] Here, the thickness of the inner electrode may mean the average thickness of one inner electrode disposed between two dielectric layers. The average thickness of the inner electrode may be the arithmetic mean of the values ​​measured at 30 equally spaced points on one inner electrode in a scanning electron microscope (SEM) photograph magnified 10,000 times of a cross section taken in the length direction (L axis direction)-thickness direction (T axis direction) at the central portion in the width direction (W axis direction) of the ceramic body 110. 30 points may be specified in an effective area (to be described later). The average thickness of the inner electrode may be more generalized by measuring the average thickness of each of the ten inner electrodes using the above method and then obtaining the arithmetic mean of the measured values. The thickness of the inner electrode may be measured by a standard method that will be easily understood and appreciated by a person of ordinary skill in the art.

[0069] If a voltage is applied to the first and second external electrodes 120 and 130, charges are accumulated between the first and second internal electrodes 150 and 160 facing each other. That is, capacitance may be obtained between the first internal electrode 150 electrically connected to the first external electrode 120 and the second internal electrode 160 electrically connected to the second external electrode 130. The capacitance of the multilayer ceramic capacitor 1000 is proportional to the overlapping area of ​​the first and second internal electrodes 150 and 160 overlapping each other in the thickness direction (T-axis direction).

[0070] In other words, the ceramic body 110 of the multilayer ceramic capacitor 1000 may include an active region and an edge region. The active region may refer to a region where the first internal electrode 150 and the second internal electrode 160 overlap along the thickness direction (T-axis direction), and the edge region may refer to a region between the active region and the first surface S1 of the ceramic body 110 and a region between the active region and the second surface S2 of the ceramic body 110.

[0071] The multilayer ceramic capacitor 1000 is classified based on its length and width. Therefore, even in a multilayer ceramic capacitor having the same size (e.g., length and / or width), the size of the ceramic body may vary according to the thickness of the external electrode. That is, a multilayer ceramic capacitor having a thinner external electrode may have a larger ceramic body than a multilayer ceramic capacitor having a thicker external electrode. A larger ceramic body may mean a larger effective area, which in turn may mean a larger capacitance. Therefore, as the external electrodes of the multilayer ceramic capacitor become thinner, the capacitance may be increased. In the present embodiment, by forming a thin electrode layer on the first surface and the second surface of the ceramic body, the thickness of the external electrode may be reduced and a corresponding advantageous effect may be obtained. This will be described in more detail below.

[0072] The first cover layer 143 and the second cover layer 145 may be disposed outside the active region in the thickness direction (T-axis direction).

[0073] The first cover layer 143 is disposed between the fifth surface S5 of the ceramic body 110 and the inner electrode closest to the fifth surface S5 of the ceramic body 110. The second cover layer 145 is disposed between the sixth surface S6 of the ceramic body 110 and the inner electrode closest to the sixth surface S6 of the ceramic body 110.

[0074] That is, in the ceramic body 110, the first cover layer 143 may be disposed on the upper portion of the uppermost inner electrode, and the second cover layer 145 may be disposed on the lower portion of the lowermost inner electrode. The first cover layer 143 and the second cover layer 145 may have the same composition as that of the dielectric layer 140. The first cover layer 143 and the second cover layer 145 may be formed by stacking one or more dielectric layers on the outer surface of the uppermost inner electrode and the outer surface of the lowermost inner electrode, respectively.

[0075] The first covering layer 143 and the second covering layer 145 can be used to prevent damage to the first inner electrode 150 and the second inner electrode 160 caused by physical stress or chemical stress.

[0076] The dielectric layer 140 may include a ceramic material with a high dielectric constant. For example, the ceramic material may include a dielectric ceramic (including main components such as BaTiO 3 , CaTiO 3 , SrTiO 3 , CaZrO 3 ). The dielectric ceramic may also include secondary components (such as manganese (Mn), iron (Fe), chromium (Cr), cobalt (Co), nickel (Ni), etc.). For example, the dielectric layer includes calcium (Ca), zirconium (Zr), etc. partially dissolved in BaTiO 3 of (Ba 1-x Ca x )TiO 3 (0 < x < 1), Ba(Ti 1-y Ca y )O 3 (0 < y < 1), (Ba 1-x Ca x )(Ti 1-y Zr y )O 3 (0 < x < 1 and 0 < y < 1), Ba(Ti 1-y Zry)O 3 (0 < y < 1), etc., but the present disclosure is not limited thereto.

[0077] In addition, the dielectric layer 140 may also include one or more of ceramic additives, organic solvents, plasticizers, binders, and dispersants. For example, the ceramic additive may be a transition metal oxide or a transition metal carbide, a rare earth element, magnesium (Mg), aluminum (Al), etc.

[0078] As an example, the average thickness of the dielectric layer 140 may be from 0.1 μm to 10 μm, but this embodiment is not limited thereto.

[0079] The first outer electrode 120 and the second outer electrode 130 are disposed outside the ceramic body 110.

[0080] The first outer electrode 120 may be disposed on the first surface S1 of the ceramic body 110 and may extend to at least one of the third surface S3, the fourth surface S4, the fifth surface S5, and the sixth surface S6. The second outer electrode 130 may be disposed on the second surface S2 of the ceramic body 110 and may extend to at least one of the third surface S3, the fourth surface S4, the fifth surface S5, and the sixth surface S6.

[0081] The first external electrode 120 includes a first electrode layer 121 , a first non-conductive resin layer 123 , and a first conductive resin layer 125 .

[0082] The first electrode layer 121 may cover the first surface S1 of the ceramic body 110 and be electrically connected to exposed ends of the plurality of first internal electrodes 150 .

[0083] The first electrode layer 121 may be formed by transferring a sheet including a conductive metal (e.g., copper (Cu) or nickel (Ni)) to the first surface S1 of the ceramic body 110. The thickness of the first electrode layer 121 formed using the above method may be formed to be thinner than the thickness of the first electrode layer formed using a conventional dipping method. Therefore, the first external electrode 120 may become relatively thin. Therefore, the ceramic body 110 may become relatively large and the overlapping area of ​​the internal electrodes may increase, thereby increasing capacitance.

[0084] In addition, a sheet including a conductive metal may be transferred to the first surface S1 of the ceramic body 110 to form the first electrode layer 121 , and thus the first electrode layer 121 may not be disposed on the third, fourth, fifth, and sixth surfaces S3 , S4 , S5 , and S6 of the ceramic body 110 .

[0085] The first non-conductive resin layer 123 may contact the first electrode layer 121 and cover a portion of the third surface S3 , a portion of the fourth surface S4 , a portion of the fifth surface S5 , and a portion of the sixth surface S6 of the ceramic body 110 .

[0086] The first non-conductive resin layer 123 may include a first end portion 123a in contact with the first electrode layer 121 and a second end portion 123b opposite to the first end portion 123a in the length direction (L-axis direction). The first end portion 123a may cover an end portion of the first electrode layer 121 in the thickness direction (T-axis direction).

[0087] A portion of the first non-conductive resin layer 123 may be in direct contact with the third surface S3 , the fourth surface S4 , the fifth surface S5 , and the sixth surface S6 .

[0088] The first non-conductive resin layer 123 may be made of an insulating and stretchable material. For example, the first non-conductive resin layer 123 may include various polymers that do not include metal and have a low elastic modulus. Therefore, the first non-conductive resin layer 123 may have high elasticity. Therefore, when a drop impact or a flexural stress (or bending stress) of the mounting substrate occurs, the first non-conductive resin layer 123 may absorb the stress, thereby suppressing the generation of flexural cracks in the multilayer ceramic capacitor.

[0089] For example, the resin included in the first non-conductive resin layer 123 may be various known thermosetting resins such as epoxy resin, phenolic resin, polyurethane resin, silicone resin, polyimide resin, etc. It is preferable to use epoxy resin excellent in heat resistance, moisture resistance, adhesion, etc.

[0090] After forming the first electrode layer 121 on the first surface S1 of the ceramic body 110, the first non-conductive resin layer 123 may be formed. That is, after forming the first electrode layer 121, a non-conductive epoxy paste having a low elastic modulus may be applied to the first surface S1, the third surface S3, the fourth surface S4, the fifth surface S5, and the sixth surface S6 of the ceramic body 110, and then the non-conductive epoxy paste on the first surface S1 is removed to form the first non-conductive resin layer 123. For example, after removing the non-conductive epoxy paste on the first surface S1 of the ceramic body 110 using a non-woven fabric, a curing heat treatment may be performed to form the first non-conductive resin layer 123 on the third surface S3, the fourth surface S4, the fifth surface S5, and the sixth surface S6. Therefore, the first electrode layer 121 may be provided on the first surface S1 of the ceramic body 110, and the first non-conductive resin layer 123 may be provided on the third surface S3, the fourth surface S4, the fifth surface S5, and the sixth surface S6.

[0091] In addition, the first non-conductive resin layer 123 may include a filler for maintaining coating properties and shape. The filler may be a material having no conductivity or very low conductivity, and for example, the filler may include glass powder or silicon dioxide.

[0092] The first conductive resin layer 125 may cover the first non-conductive resin layer 123 , and cover a portion of the third surface S3 , a portion of the fourth surface S4 , a portion of the fifth surface S5 , and a portion of the sixth surface S6 of the ceramic body 110 .

[0093] For example, the first end 123a and the second end 123b of the first non-conductive resin layer 123 may be covered by the first conductive resin layer 125 and may not be exposed to the outside. In this embodiment, a portion of the first conductive resin layer 125 may be in direct contact with the third surface S3, the fourth surface S4, the fifth surface S5, and the sixth surface S6 of the ceramic body 110.

[0094] The first conductive resin layer 125 may be made of a conductive and stretchable material. For example, the first conductive resin layer 125 may include a conductive metal or an intermetallic compound, and may include various polymers having a low elastic modulus.

[0095] For example, the resin included in the first conductive resin layer 125 may be various known thermosetting resins such as epoxy resin, phenolic resin, polyurethane resin, silicone resin, polyimide resin, etc. It is preferable to use epoxy resin excellent in heat resistance, moisture resistance, adhesion, etc.

[0096] In addition, the first conductive resin layer 125 may include a conductive metal as a filler. For example, the filler may include copper (Cu), silver (Ag), nickel (Ni), tin (Sn), or an alloy thereof.

[0097] After forming the first non-conductive resin layer 123 on the third surface S3, the fourth surface S4, the fifth surface S5, and the sixth surface S6 of the ceramic body 110, the first conductive resin layer 125 may be formed. That is, after forming the first non-conductive resin layer 123, the conductive epoxy paste may be applied to the first surface S1, the third surface S3, the fourth surface S4, the fifth surface S5, and the sixth surface S6 of the ceramic body 110, and then the conductive epoxy paste on the first surface S1 may be removed to form the first conductive resin layer 125. For example, after removing the conductive epoxy paste on the first surface S1 of the ceramic body 110 using an adhesive sheet, a curing heat treatment may be performed to form the first conductive resin layer 125 on the third surface S3, the fourth surface S4, the fifth surface S5, and the sixth surface S6. Therefore, the first electrode layer 121 may be disposed on the first surface S1 of the ceramic body 110, and the first non-conductive resin layer 123 and the first conductive resin layer 125 may be disposed on the third surface S3, the fourth surface S4, the fifth surface S5, and the sixth surface S6.

[0098] Unlike the present embodiment, if both the electrode layer and the resin layer covering the electrode layer are disposed on the first surface of the ceramic body, the resin layer will reduce the electrical connectivity, which may lead to the problem of increased equivalent series resistance (ESR) of the first external electrode. During the high-temperature reflow process, there is a risk of warping due to the degassing of the resin layer. In addition, if both the electrode layer and the resin layer covering the electrode layer are disposed on the first surface of the ceramic body, due to the presence of the resin layer on the electrode layer, the thickness of the external electrode is greater and the relative volume of the ceramic body is smaller than when only the electrode layer is present, resulting in the problem of reduced effective capacitance of the multilayer ceramic capacitor.

[0099] However, according to the present embodiment, the first electrode layer 121 is disposed on the first surface S1 of the ceramic body 110 , and the first non-conductive resin layer 123 and the first conductive resin layer 125 are not disposed on the first surface S1 , so the above problem does not occur.

[0100] The second external electrode 130 includes a second electrode layer 131 , a second non-conductive resin layer 133 , and a second conductive resin layer 135 .

[0101] The second electrode layer 131 may cover the second surface S2 of the ceramic body 110 and be electrically connected to exposed ends of the plurality of second internal electrodes 160 .

[0102] The second non-conductive resin layer 133 may contact the second electrode layer 131 and cover a portion of the third surface S3 , a portion of the fourth surface S4 , a portion of the fifth surface S5 , and a portion of the sixth surface S6 of the ceramic body 110 .

[0103] The second non-conductive resin layer 133 may include a first end portion 133a in contact with the second electrode layer 131 and a second end portion 133b opposite to the first end portion 133a in the length direction (L-axis direction). The first end portion 133a may cover an end portion of the second electrode layer 131 in the thickness direction (T-axis direction).

[0104] The second conductive resin layer 135 may cover the second non-conductive resin layer 133 , and cover a portion of the third surface S3 , a portion of the fourth surface S4 , a portion of the fifth surface S5 , and a portion of the sixth surface S6 of the ceramic body 110 .

[0105] For example, the first end 133a and the second end 133b of the second non-conductive resin layer 133 may be covered by the second conductive resin layer 135 and may not be exposed to the outside. In this embodiment, a portion of the second conductive resin layer 135 may be in direct contact with the third surface S3, the fourth surface S4, the fifth surface S5, and the sixth surface S6 of the ceramic body 110.

[0106] The structure, material, and function of the second external electrode 130 correspond to those of the first external electrode 120 except for the position of the second external electrode 130 , and thus their repeated description will be omitted.

[0107] In addition, the multilayer ceramic capacitor 1000 may further include a first plating layer 180 and a second plating layer 190 .

[0108] The first plating layer 180 may cover the first external electrode 120. Figure 2 As shown, the first plating layer 180 may cover the end of the first conductive resin layer 125 so that the first conductive resin layer 125 may not be exposed. The first plating layer 180 may include a first layer 181 and a second layer 183. The first layer 181 may be disposed on the first external electrode 120, and the second layer 183 may be disposed on the first layer 181. The first layer 181 may include nickel (Ni), and the second layer 183 may include tin (Sn), but the present embodiment is not limited thereto.

[0109] In one embodiment, the first non-conductive resin layer 123 and the first conductive resin layer 125 may each have an opening on the first surface S1 of the ceramic body 110 so that the first plating layer 180 may directly contact the first electrode layer 121 .

[0110] The second plating layer 190 may cover the second external electrode 130. Figure 2 As shown, the second plating layer 190 may cover the end of the second conductive resin layer 135 so that the second conductive resin layer 135 may not be exposed. The second plating layer 190 may include a first layer 191 and a second layer 193. The first layer 191 may be disposed on the second external electrode 130, and the second layer 193 may be disposed on the first layer 191. The first layer 191 may include nickel (Ni), and the second layer 193 may include tin (Sn), but the present embodiment is not limited thereto.

[0111] In one embodiment, the second non-conductive resin layer 133 and the second conductive resin layer 135 may each have an opening on the second surface S2 of the ceramic body 110 so that the second plating layer 190 may directly contact the second electrode layer 131 .

[0112] Figure 4 is a perspective view schematically showing a multilayer ceramic capacitor according to another embodiment, and Figure 5 is along Figure 4 A cross-sectional view taken along line V-V'.

[0113] Reference Figure 4 and Figure 5 The multilayer ceramic capacitor 2000 includes a ceramic body 110, a first external electrode 1120, a second external electrode 1130, a plurality of first internal electrodes 150, and a plurality of second internal electrodes 160. Except for the structure of the first external electrode 1120 and the second external electrode 1130 of the multilayer ceramic capacitor 2000, the remaining components are the same as those of the Figure 1 Components of the multilayer ceramic capacitor 1000 are the same or correspond, and thus their repeated descriptions will be omitted.

[0114] The first external electrode 1120 may be disposed on the first surface S1 of the ceramic body 110 and may extend to the third surface S3, the fourth surface S4, the fifth surface S5, and the sixth surface S6. The second external electrode 1130 may be disposed on the second surface S2 of the ceramic body 110 and may extend to the third surface S3, the fourth surface S4, the fifth surface S5, and the sixth surface S6.

[0115] The first external electrode 1120 includes a first electrode layer 1121 , a first non-conductive resin layer 1123 , and a first conductive resin layer 1125 .

[0116] The first electrode layer 1121 covers the first surface S1 of the ceramic body 110 and is electrically connected to exposed ends of the plurality of first internal electrodes 150 .

[0117] The first non-conductive resin layer 1123 contacts the first electrode layer 1121 , and covers a portion of the third surface S3 , a portion of the fourth surface S4 , a portion of the fifth surface S5 , and a portion of the sixth surface S6 of the ceramic body 110 .

[0118] The first non-conductive resin layer 1123 may include a first end portion 1123a in contact with the first electrode layer 1121 and a second end portion 1123b opposite to the first end portion 1123a in the length direction (L-axis direction). The first end portion 1123a may cover an end portion of the first electrode layer 1121 in the thickness direction (T-axis direction).

[0119] The first conductive resin layer 1125 covers a portion of the first non-conductive resin layer 1123 .

[0120] The first end portion 1123a of the first nonconductive resin layer 1123 may be covered by the first conductive resin layer 1125 and may not be exposed to the outside, but the second end portion 1123b of the first nonconductive resin layer 1123 may not be covered by the first conductive resin layer 1125 and may be exposed to the outside.

[0121] In addition, the length of the first non-conductive resin layer 1123 may be greater than the length of the first conductive resin layer 1125. Specifically, the length of the first non-conductive resin layer 1123 in the length direction may be greater than the length of the first conductive resin layer 1125 in the length direction. Here, the length of the first non-conductive resin layer 1123 and the length of the first conductive resin layer 1125 are measured based on an optical microscope photograph or a scanning electron microscope (SEM) photograph of a cross section taken in the length direction (L axis direction)-thickness direction (T axis direction) at the central portion in the width direction (W axis direction) of the multilayer ceramic capacitor 1000. The length of the first non-conductive resin layer 1123 may mean the maximum value among the lengths of a plurality of line segments connecting two outermost boundary lines of the first non-conductive resin layer 1123 shown in the cross-sectional photograph that are opposite to each other in the length direction (L axis direction) and are parallel to the length direction (L axis direction). In addition, the length of the first conductive resin layer 1125 may refer to the maximum value of the lengths of multiple line segments connecting the two outermost boundary lines of the first conductive resin layer 1125 shown in the cross-sectional photograph that are opposite to each other in the length direction (L-axis direction) and parallel to the length direction (L-axis direction).

[0122] The second external electrode 1130 includes a second electrode layer 1131 , a second non-conductive resin layer 1133 , and a second conductive resin layer 1135 .

[0123] The second electrode layer 1131 covers the second surface S2 of the ceramic body 110 and is electrically connected to exposed ends of the plurality of second internal electrodes 160 .

[0124] The second non-conductive resin layer 1133 contacts the second electrode layer 1131 , and covers a portion of the third surface S3 , a portion of the fourth surface S4 , a portion of the fifth surface S5 , and a portion of the sixth surface S6 of the ceramic body 110 .

[0125] The second conductive resin layer 1135 covers a portion of the second non-conductive resin layer 1133 .

[0126] The first end 1133a of the second non-conductive resin layer 1133 may be covered by the second conductive resin layer 1135 and may not be exposed to the outside, but the second end 1133b of the second non-conductive resin layer 1133 may not be covered by the second conductive resin layer 1135 and may be exposed to the outside.

[0127] The second end portion 1123 b of the first non-conductive resin layer 1123 may be spaced apart from the second end portion 1133 b of the second non-conductive resin layer 1133 .

[0128] The structure, material, and function of the second external electrode 1130 correspond to those of the first external electrode 1120 except for the position of the second external electrode 1130 , and thus their repeated description will be omitted.

[0129] In addition, the multilayer ceramic capacitor 2000 may further include a first plating layer 1180 and a second plating layer 1190 .

[0130] The first plating layer 1180 covers a portion of the first external electrode 1120. The first plating layer 1180 may include a first layer 1181 and a second layer 1183. The first layer 1181 may be disposed on the first external electrode 1120, and the second layer 1183 may be disposed on the first layer 1181. The first layer 1181 may completely cover the first electrode layer 1121 and the first conductive resin layer 1125, but the first layer 1181 may expose a portion of the first non-conductive resin layer 1123 without covering a portion of the first non-conductive resin layer 1123. The second layer 1183 may completely cover the first layer 1181, but the second layer 1183 may expose a portion of the first non-conductive resin layer 1123 without covering a portion of the first non-conductive resin layer 1123. The first layer 1181 may include nickel (Ni), and the second layer 1183 may include tin (Sn), but the present embodiment is not limited thereto.

[0131] The second plating layer 1190 covers a portion of the second external electrode 1130. The second plating layer 1190 may include a first layer 1191 and a second layer 1193. The first layer 1191 may be disposed on the second external electrode 1130, and the second layer 1193 may be disposed on the first layer 1191. The first layer 1191 may completely cover the second electrode layer 1131 and the second conductive resin layer 1135, but the first layer 1191 may expose a portion of the second non-conductive resin layer 1133 without covering a portion of the second non-conductive resin layer 1133. The second layer 1193 may completely cover the first layer 1191, but the second layer 1193 may expose a portion of the second non-conductive resin layer 1133 without covering a portion of the second non-conductive resin layer 1133. The first layer 1191 may include nickel (Ni), and the second layer 1193 may include tin (Sn), but the present embodiment is not limited thereto.

[0132] Figure 6 is a cross-sectional view schematically showing a multilayer ceramic capacitor according to another embodiment.

[0133] Reference Figure 6 The multilayer ceramic capacitor 3000 includes a ceramic body 110, a first external electrode 2120, a second external electrode 2130, a plurality of first internal electrodes 150, and a plurality of second internal electrodes 160. Except for the structure of the first external electrode 2120 and the second external electrode 2130 of the multilayer ceramic capacitor 3000, the remaining components are the same as those of the Figure 1 Components of the multilayer ceramic capacitor 1000 are the same or correspond, and thus their repeated descriptions will be omitted.

[0134] The first external electrode 2120 may be disposed on the first surface S1 of the ceramic body 110 and may extend to at least one of the third surface S3, the fourth surface S4, the fifth surface S5, and the sixth surface S6. The second external electrode 2130 may be disposed on the second surface S2 of the ceramic body 110 and may extend to at least one of the third surface S3, the fourth surface S4, the fifth surface S5, and the sixth surface S6.

[0135] The first external electrode 2120 includes a first electrode layer 2121 , a first non-conductive resin layer 2123 , and a first conductive resin layer 2125 .

[0136] The first electrode layer 2121 covers the first surface S1 of the ceramic body 110 and is electrically connected to the exposed ends of the plurality of first internal electrodes 150. The first electrode layer 2121 may further include a first extension portion 2122 disposed on at least one of the third surface S3, the fourth surface S4, the fifth surface S5, and the sixth surface S6 of the ceramic body 110. That is, the first electrode layer 2121 may have a shape extending from the first surface S1 of the ceramic body 110 to at least one of the third surface S3, the fourth surface S4, the fifth surface S5, and the sixth surface S6.

[0137] The first nonconductive resin layer 2123 covers the first extension portion 2122 of the first electrode layer 2121 , and covers a portion of the third surface S3 , a portion of the fourth surface S4 , a portion of the fifth surface S5 , and a portion of the sixth surface S6 of the ceramic body 110 .

[0138] The first non-conductive resin layer 2123 may include a first end portion 2123 a covering the first extension portion 2122 and a second end portion 2123 b opposite to the first end portion 2123 a in the length direction (L-axis direction).

[0139] The first conductive resin layer 2125 covers the first non-conductive resin layer 2123 , and covers a portion of the third surface S3 , a portion of the fourth surface S4 , a portion of the fifth surface S5 , and a portion of the sixth surface S6 of the ceramic body 110 .

[0140] The first end portion 2123 a and the second end portion 2123 b of the first non-conductive resin layer 2123 may be covered by the first conductive resin layer 2125 and may not be exposed to the outside.

[0141] The second external electrode 2130 includes a second electrode layer 2131 , a second non-conductive resin layer 2133 , and a second conductive resin layer 2135 .

[0142] The second electrode layer 2131 covers the second surface S2 of the ceramic body 110 and is electrically connected to the exposed ends of the plurality of second internal electrodes 160. The second electrode layer 2131 may further include a second extension portion 2132 disposed on at least one of the third surface S3, the fourth surface S4, the fifth surface S5, and the sixth surface S6 of the ceramic body 110. That is, the second electrode layer 2131 may have a shape extending from the second surface S2 of the ceramic body 110 to at least one of the third surface S3, the fourth surface S4, the fifth surface S5, and the sixth surface S6.

[0143] The second nonconductive resin layer 2133 covers the second extension portion 2132 of the second electrode layer 2131 , and covers a portion of the third, fourth, fifth, and sixth surfaces S3, S4, S5, and S6 of the ceramic body 110 .

[0144] The first end portion 2133 a and the second end portion 2133 b of the second non-conductive resin layer 2133 may be covered by the second conductive resin layer 2135 and may not be exposed to the outside.

[0145] Except for the position of the second external electrode 2130 , the structure, material, and function of the second external electrode 2130 correspond to those of the first external electrode 2120 , and thus their repeated description will be omitted.

[0146] In addition, the multilayer ceramic capacitor 3000 may further include a first plating layer 2180 and a second plating layer 2190 .

[0147] Figure 7 is a cross-sectional view schematically showing a multilayer ceramic capacitor according to another embodiment.

[0148] Reference Figure 7 The multilayer ceramic capacitor 4000 includes a ceramic body 110, a first external electrode 3120, a second external electrode 3130, a plurality of first internal electrodes 150, and a plurality of second internal electrodes 160. Except for the structure of the first external electrode 3120 and the second external electrode 3130 of the multilayer ceramic capacitor 4000, the remaining components are the same as those of the Figure 1 Components of the multilayer ceramic capacitor 1000 are the same or correspond, and thus their repeated descriptions will be omitted.

[0149] The first external electrode 3120 may be disposed on the first surface S1 of the ceramic body 110 and may extend to at least one of the third surface S3, the fourth surface S4, the fifth surface S5, and the sixth surface S6. The second external electrode 3130 may be disposed on the second surface S2 of the ceramic body 110 and may extend to at least one of the third surface S3, the fourth surface S4, the fifth surface S5, and the sixth surface S6.

[0150] The first external electrode 3120 includes a first electrode layer 3121 , a first non-conductive resin layer 3123 , and a first conductive resin layer 3125 .

[0151] The first electrode layer 3121 covers the first surface S1 of the ceramic body 110 and is electrically connected to the exposed ends of the plurality of first internal electrodes 150. The first electrode layer 3121 may further include a first extension portion 3122 disposed on at least one of the third surface S3, the fourth surface S4, the fifth surface S5, and the sixth surface S6 of the ceramic body 110. That is, the first electrode layer 3121 may have a shape extending from the first surface S1 of the ceramic body 110 to at least one of the third surface S3, the fourth surface S4, the fifth surface S5, and the sixth surface S6.

[0152] The first nonconductive resin layer 3123 covers the first extension portion 3122 of the first electrode layer 3121 , and covers a portion of the third surface S3 , a portion of the fourth surface S4 , a portion of the fifth surface S5 , and a portion of the sixth surface S6 of the ceramic body 110 .

[0153] The first non-conductive resin layer 3123 may include a first end portion 3123 a covering the first extension portion 3122 and a second end portion 3123 b opposite to the first end portion 3123 a in the length direction (L-axis direction).

[0154] The first conductive resin layer 3125 covers a portion of the first non-conductive resin layer 3123 .

[0155] The first end portion 3123a of the first non-conductive resin layer 3123 may be covered by the first conductive resin layer 3125 and may not be exposed to the outside, but the second end portion 3123b of the first non-conductive resin layer 3123 may not be covered by the first conductive resin layer 3125 and may be exposed to the outside.

[0156] In addition, the length of the first non-conductive resin layer 3123 may be greater than the length of the first conductive resin layer 3125. Specifically, the length of the first non-conductive resin layer 3123 in the length direction may be greater than the length of the first conductive resin layer 3125 in the length direction.

[0157] The second external electrode 3130 includes a second electrode layer 3131 , a second non-conductive resin layer 3133 , and a second conductive resin layer 3135 .

[0158] The second electrode layer 3131 covers the second surface S2 of the ceramic body 110 and is electrically connected to the exposed ends of the plurality of second internal electrodes 160. The second electrode layer 3131 may further include a second extension portion 3132 disposed on at least one of the third surface S3, the fourth surface S4, the fifth surface S5, and the sixth surface S6 of the ceramic body 110. That is, the second electrode layer 3131 may have a shape extending from the first surface S1 of the ceramic body 110 to at least one of the third surface S3, the fourth surface S4, the fifth surface S5, and the sixth surface S6.

[0159] The second nonconductive resin layer 3133 covers the second extension portion 3132 of the second electrode layer 3131 , and covers a portion of the third surface S3 , a portion of the fourth surface S4 , a portion of the fifth surface S5 , and a portion of the sixth surface S6 of the ceramic body 110 .

[0160] The second conductive resin layer 3135 covers a portion of the second non-conductive resin layer 3133 .

[0161] The first end 3133a of the second non-conductive resin layer 3133 may be covered by the second conductive resin layer 3135 and may not be exposed to the outside, but the second end 3133b of the second non-conductive resin layer 3133 may not be covered by the second conductive resin layer 3135 and may be exposed to the outside.

[0162] Except for the position of the second external electrode 3130 , the structure, material, and function of the second external electrode 3130 correspond to those of the first external electrode 3120 , and thus their repeated description will be omitted.

[0163] In addition, the multilayer ceramic capacitor 4000 may further include a first plating layer 3180 and a second plating layer 3190 .

[0164] Figure 8 is a perspective view schematically showing a multilayer ceramic capacitor according to another embodiment, and Fig. 9 is along Figure 8 A cross-sectional view taken along line IX-IX'.

[0165] Reference Figure 8 and Fig. 9 The multilayer ceramic capacitor 5000 includes a ceramic body 110, a first external electrode 4120, a second external electrode 4130, a plurality of first internal electrodes 150, a plurality of second internal electrodes 160, and a non-conductive resin layer 500. Except for the structure of the first external electrode 4120, the second external electrode 4130, and the non-conductive resin layer 500 of the multilayer ceramic capacitor 5000, the remaining components are the same as Figure 1 Components of the multilayer ceramic capacitor 1000 are the same or correspond, and thus their repeated descriptions will be omitted.

[0166] The non-conductive resin layer 500 may be disposed on at least one of the third surface S3 , the fourth surface S4 , the fifth surface S5 , and the sixth surface S6 of the ceramic body 110 .

[0167] The non-conductive resin layer 500 may include a first end portion 500 a and a second end portion 500 b opposite to the first end portion 500 a in the length direction (L-axis direction).

[0168] The non-conductive resin layer 500 may cover all portions of the third surface S3 , the fourth surface S4 , the fifth surface S5 , and the sixth surface S6 of the ceramic body 110 .

[0169] The non-conductive resin layer 500 may be made of an insulating and stretchable material. For example, the non-conductive resin layer 500 may include various polymers that do not include metal and have a low elastic modulus. Therefore, the non-conductive resin layer 500 may have high elasticity. Therefore, when a drop impact or a flexural stress (or bending stress) of the mounting substrate occurs, the non-conductive resin layer 500 may absorb the stress, thereby suppressing the generation of flexural cracks in the multilayer ceramic capacitor.

[0170] For example, the resin included in the non-conductive resin layer 500 may be various known thermosetting resins such as epoxy resin, phenolic resin, polyurethane resin, silicone resin, polyimide resin, etc. It is preferable to use epoxy resin having excellent heat resistance, moisture resistance, adhesiveness, etc.

[0171] The first external electrode 4120 may be disposed on the first surface S1 of the ceramic body 110 and may extend to at least one of the third surface S3, the fourth surface S4, the fifth surface S5, and the sixth surface S6. The second external electrode 4130 may be disposed on the second surface S2 of the ceramic body 110 and may extend to at least one of the third surface S3, the fourth surface S4, the fifth surface S5, and the sixth surface S6.

[0172] The first external electrode 4120 includes a first electrode layer 4121 and a first conductive resin layer 4125 .

[0173] The first electrode layer 4121 covers the first surface S1 of the ceramic body 110 and is electrically connected to exposed ends of the plurality of first internal electrodes 150 .

[0174] The first end portion 500 a of the non-conductive resin layer 500 may make contact with the first electrode layer 4121 .

[0175] The first conductive resin layer 4125 covers a portion of the non-conductive resin layer 500 .

[0176] The second external electrode 4130 includes a second electrode layer 4131 and a second conductive resin layer 4135 .

[0177] The second electrode layer 4131 covers the second surface S2 of the ceramic body 110 and is electrically connected to exposed ends of the plurality of second internal electrodes 160 .

[0178] The second end portion 500 b of the non-conductive resin layer 500 may make contact with the second electrode layer 4131 .

[0179] The second conductive resin layer 4135 covers a portion of the non-conductive resin layer 500 .

[0180] In the above another embodiment, the non-conductive resin layer is divided into a first non-conductive resin layer included in the first external electrode and a second non-conductive resin layer included in the second external electrode, the first non-conductive resin layer covers a portion of the surface of the ceramic body close to the first external electrode, and the second non-conductive resin layer covers another portion of the surface of the ceramic body close to the second external electrode. Therefore, a portion of the surface of the ceramic body located between the first non-conductive resin layer and the second non-conductive resin layer is exposed.

[0181] However, the non-conductive resin layer 500 of the present embodiment is an integral resin layer and may cover the third surface S3, the fourth surface S4, the fifth surface S5, and the sixth surface S6 of the ceramic body 110. In other words, the non-conductive resin layer 500 may cover all outer surfaces of the ceramic body 110 except the first surface S1 and the second surface S2. Therefore, when a drop shock or a flexural stress (or bending stress) of the mounting substrate occurs, the non-conductive resin layer 500 may absorb the stress, thereby better suppressing the generation of flexural cracks in the multilayer ceramic capacitor.

[0182] In addition, the multilayer ceramic capacitor 5000 may further include a first plating layer 4180 and a second plating layer 4190 .

[0183] Fig.10 is a cross-sectional view schematically showing a multilayer ceramic capacitor according to another embodiment.

[0184] Reference Fig.10 The multilayer ceramic capacitor 6000 includes a ceramic body 110, a first external electrode 5120, a second external electrode 5130, a plurality of first internal electrodes 150, a plurality of second internal electrodes 160, and a non-conductive resin layer 1500. Except for the structure of the first external electrode 5120, the second external electrode 5130, and the non-conductive resin layer 1500 of the multilayer ceramic capacitor 6000, the remaining components are the same as Figure 8 Components of the multilayer ceramic capacitor 5000 are the same or correspond, and thus their repeated descriptions will be omitted.

[0185] The non-conductive resin layer 1500 may be disposed on at least one of the third surface S3 , the fourth surface S4 , the fifth surface S5 , and the sixth surface S6 of the ceramic body 110 .

[0186] The non-conductive resin layer 1500 may include a first end portion 1500 a and a second end portion 1500 b opposite to the first end portion 1500 a in the length direction (L-axis direction).

[0187] The non-conductive resin layer 1500 may be made of an insulating and stretchable material. For example, the non-conductive resin layer 1500 may include various polymers that do not include metal and have a low elastic modulus. Therefore, the non-conductive resin layer 1500 may have high elasticity. Therefore, when a drop impact or a flexural stress (or bending stress) of the mounting substrate occurs, the non-conductive resin layer 1500 may absorb the stress, thereby suppressing the generation of flexural cracks in the multilayer ceramic capacitor.

[0188] For example, the resin included in the non-conductive resin layer 1500 may be various known thermosetting resins such as epoxy resin, phenolic resin, polyurethane resin, silicone resin, polyimide resin, etc. It is preferable to use epoxy resin having excellent heat resistance, moisture resistance, adhesiveness, etc.

[0189] The first external electrode 5120 may be disposed on the first surface S1 of the ceramic body 110 and may extend to at least one of the third surface S3, the fourth surface S4, the fifth surface S5, and the sixth surface S6. The second external electrode 5130 may be disposed on the second surface S2 of the ceramic body 110 and may extend to at least one of the third surface S3, the fourth surface S4, the fifth surface S5, and the sixth surface S6.

[0190] The first external electrode 5120 includes a first electrode layer 5121 and a first conductive resin layer 5125 .

[0191] The first electrode layer 5121 covers the first surface S1 of the ceramic body 110 and is electrically connected to the exposed ends of the plurality of first internal electrodes 150. The first electrode layer 5121 may further include a first extension portion 5122 disposed on at least one of the third surface S3, the fourth surface S4, the fifth surface S5, and the sixth surface S6 of the ceramic body 110. That is, the first electrode layer 5121 may have a shape extending from the first surface S1 of the ceramic body 110 to at least one of the third surface S3, the fourth surface S4, the fifth surface S5, and the sixth surface S6.

[0192] The non-conductive resin layer 1500 covers the first extension portion 5122 of the first electrode layer 5121, and covers a portion of the third surface S3, a portion of the fourth surface S4, a portion of the fifth surface S5, and a portion of the sixth surface S6 of the ceramic body 110. The first end portion 1500a of the non-conductive resin layer 1500 may cover the first extension portion 5122 of the first electrode layer 5121.

[0193] The first conductive resin layer 5125 covers a portion of the non-conductive resin layer 1500 .

[0194] The second external electrode 5130 includes a second electrode layer 5131 and a second conductive resin layer 5135 .

[0195] The second electrode layer 5131 covers the second surface S2 of the ceramic body 110 and is electrically connected to the exposed ends of the plurality of second internal electrodes 160. The second electrode layer 5131 may further include a second extension portion 5132 disposed on at least one of the third surface S3, the fourth surface S4, the fifth surface S5, and the sixth surface S6 of the ceramic body 110. That is, the second electrode layer 5131 may have a shape extending from the first surface S1 of the ceramic body 110 to at least one of the third surface S3, the fourth surface S4, the fifth surface S5, and the sixth surface S6.

[0196] The second end portion 1500 b of the non-conductive resin layer 1500 may cover the second extension portion 5132 of the second electrode layer 5131 .

[0197] The second conductive resin layer 5135 covers a portion of the non-conductive resin layer 1500 .

[0198] The non-conductive resin layer 1500 may be an integral resin layer and may cover the third surface S3, the fourth surface S4, the fifth surface S5, and the sixth surface S6 of the ceramic body 110. In other words, the non-conductive resin layer 1500 may cover all outer surfaces of the ceramic body 110 except the first surface S1 and the second surface S2. Therefore, when a drop shock or a flexural stress (or bending stress) of the mounting substrate occurs, the non-conductive resin layer 1500 may absorb the stress, thereby better suppressing the generation of flex cracks in the multilayer ceramic capacitor.

[0199] In addition, the multilayer ceramic capacitor 6000 may further include a first plating layer 5180 and a second plating layer 5190 .

[0200] Experimental Example 1

[0201] Fig.11 is a view schematically showing a bending test method of a multilayer ceramic capacitor, and Fig.12 It is shown that the use Fig.11 Graph of the test results of the bending test method.

[0202] Fig.11 and Fig.12 A test showing the frequency of cracks occurring in a ceramic body of a multilayer ceramic capacitor according to whether a non-conductive resin layer and a conductive resin layer are coated is shown.

[0203] Here, the comparative example is a multilayer ceramic capacitor in which the external electrodes do not include a non-conductive resin layer and a conductive resin layer, and the example is Figure 1 The illustrated multilayer ceramic capacitor has an external electrode having a thickness of 10 μm, 15 μm, 20 μm, or 30 μm and includes a non-conductive resin layer and a conductive resin layer.

[0204] Reference Fig.11The substrate on which the multilayer ceramic capacitor is mounted is placed in a device capable of pressing the substrate, and the frequency of crack generation can be measured by pressing 6 mm toward the mounting surface on the opposite side of the substrate to the mounting surface on which the multilayer ceramic capacitor is mounted to check whether flex cracks occur.

[0205] Reference Fig.12 , for the comparative example not including the non-conductive resin layer and the conductive resin layer, 19 out of 30 samples had peeling defects (the external electrode was peeled off from the ceramic body) or crack defects (the ceramic body was broken).

[0206] However, for the example including the non-conductive resin layer and the conductive resin layer, only one sample with a thickness of 10 μm failed among 30 samples, and it was confirmed that the bending strength (or flexural strength) could be guaranteed during the 6 mm bending strength test (or flexural strength test).

[0207] Experimental Example 2

[0208] Fig.13 : is a graph comparing the equivalent series resistance (ESR) of the example with the equivalent series resistance (ESR) of the comparative example 1 and the equivalent series resistance (ESR) of the comparative example 2.

[0209] An example is Figure 1 A multilayer ceramic capacitor: The external electrodes on the first surface and the second surface of the ceramic body include an electrode layer and a plating layer.

[0210] Comparative Example 1 is a multilayer ceramic capacitor in which external electrodes on first and second surfaces of a ceramic body include an electrode layer, a conductive resin layer (including copper and epoxy resin), and a plating layer.

[0211] Comparative Example 2 is a multilayer ceramic capacitor in which the external electrodes on the first and second surfaces of the ceramic body include an electrode layer, a conductive resin layer (including an intermetallic compound and an epoxy resin), and a plating layer.

[0212] Reference Fig.13 , the equivalent series resistance (ESR) of the example is lower than that of the comparative example 1 and the equivalent series resistance (ESR) of the comparative example 2. This is because the electrical connectivity is improved by forming the plating layer directly on the electrode layer on the first surface and the second surface of the ceramic body without providing the resin layer on the electrode layer on the first surface and the second surface of the ceramic body.

[0213] While the present disclosure has been described in connection with what are presently considered to be practical embodiments, it is to be understood that the disclosure is not limited to the disclosed embodiments, but on the contrary is intended to cover various modifications and equivalent arrangements included within the spirit and scope of the appended claims.

Claims

1. A multilayer ceramic capacitor comprising: a ceramic body including a first surface and a second surface opposite to each other in a first direction, a third surface and a fourth surface opposite to each other in a second direction and connecting the first surface and the second surface, and a fifth surface and a sixth surface opposite to each other in a third direction and connecting the first surface and the second surface; a plurality of first internal electrodes and a plurality of second internal electrodes, the plurality of first internal electrodes and the plurality of second internal electrodes being disposed inside the ceramic body; as well as a first external electrode and a second external electrode, the first external electrode and the second external electrode being disposed outside the ceramic body, wherein the first external electrode comprises a first electrode layer, a first non-conductive resin layer and a first conductive resin layer, the first electrode layer being disposed on the first surface of the ceramic body and being electrically connected to the plurality of first internal electrodes, the first non-conductive resin layer being disposed on at least one of the third surface, the fourth surface, the fifth surface and the sixth surface of the ceramic body and being in contact with the first electrode layer, the first conductive resin layer covering at least a portion of the first non-conductive resin layer, and The second external electrode includes a second electrode layer, a second non-conductive resin layer and a second conductive resin layer, the second electrode layer is arranged on the second surface of the ceramic body and is electrically connected to the plurality of second internal electrodes, the second non-conductive resin layer is arranged on at least one of the third surface, the fourth surface, the fifth surface and the sixth surface of the ceramic body and contacts the second electrode layer, and the second conductive resin layer covers at least a portion of the second non-conductive resin layer.

2. The multilayer ceramic capacitor according to claim 1, wherein The first non-conductive resin layer includes a first end portion contacting the first electrode layer and a second end portion opposite to the first end portion in the first direction, and The second non-conductive resin layer includes a third end portion contacting the second electrode layer and a fourth end portion opposite to the third end portion in the first direction.

3. The multilayer ceramic capacitor according to claim 2, wherein: The first conductive resin layer covers the first end portion and the second end portion of the first non-conductive resin layer, and The second conductive resin layer covers the third end portion and the fourth end portion of the second non-conductive resin layer.

4. The multilayer ceramic capacitor according to claim 2, wherein: The first conductive resin layer covers the first end portion of the first non-conductive resin layer and exposes the second end portion, and The second conductive resin layer covers the third end portion of the second non-conductive resin layer and exposes the fourth end portion.

5. The multilayer ceramic capacitor according to claim 4, wherein: The length of the first non-conductive resin layer in the first direction is greater than the length of the first conductive resin layer in the first direction, and A length of the second non-conductive resin layer in the first direction is greater than a length of the second conductive resin layer in the first direction.

6. The multilayer ceramic capacitor according to claim 1, wherein The first electrode layer further includes a first extension portion, the first extension portion being disposed on at least one of the third surface, the fourth surface, the fifth surface, and the sixth surface of the ceramic body, and The second electrode layer further includes a second extension portion disposed on at least one of the third surface, the fourth surface, the fifth surface, and the sixth surface of the ceramic body.

7. The multilayer ceramic capacitor according to claim 6, wherein: The first extension portion is covered by the first non-conductive resin layer, and The second extending portion is covered by the second non-conductive resin layer.

8. The multilayer ceramic capacitor according to claim 6, wherein: The first non-conductive resin layer includes a first end portion contacting the first electrode layer and a second end portion opposite to the first end portion in the first direction, and The second non-conductive resin layer includes a third end portion contacting the second electrode layer and a fourth end portion opposite to the third end portion in the first direction.

9. The multilayer ceramic capacitor according to claim 8, wherein: The first conductive resin layer covers the second end portion of the first non-conductive resin layer, and The second conductive resin layer covers the fourth end portion of the second non-conductive resin layer.

10. The multilayer ceramic capacitor according to claim 8, wherein The first conductive resin layer exposes the second end portion of the first non-conductive resin layer, and The second conductive resin layer exposes the fourth end portion of the second non-conductive resin layer.

11. The multilayer ceramic capacitor according to claim 8, wherein The length of the first non-conductive resin layer in the first direction is greater than the length of the first conductive resin layer in the first direction, and A length of the second non-conductive resin layer in the first direction is greater than a length of the second conductive resin layer in the first direction.

12. The multilayer ceramic capacitor according to claim 1, wherein The first electrode layer comprises copper or nickel, and The second electrode layer includes copper or nickel.

13. The multilayer ceramic capacitor according to claim 1, wherein The first non-conductive resin layer includes epoxy resin, and The second non-conductive resin layer includes epoxy resin.

14. The multilayer ceramic capacitor according to claim 1, wherein The first conductive resin layer includes conductive metal and epoxy resin, and The second conductive resin layer includes conductive metal and epoxy resin.

15. The multilayer ceramic capacitor according to claim 1, wherein The first conductive resin layer includes an intermetallic compound and an epoxy resin, and The second conductive resin layer includes an intermetallic compound and an epoxy resin.

16. The multilayer ceramic capacitor of claim 1, further comprising: a first plating layer, wherein the first plating layer covers at least a portion of the first external electrode; as well as A second plating layer covers at least a portion of the second external electrode.

17. The multilayer ceramic capacitor according to claim 16, wherein: The first plating layer includes a first layer disposed on the first external electrode and a second layer disposed on the first layer, and The second plating layer includes a third layer disposed on the second external electrode and a fourth layer disposed on the third layer.

18. The multilayer ceramic capacitor according to claim 17, wherein: The first layer and the third layer include nickel, and The second layer and the fourth layer include tin.

19. A multilayer ceramic capacitor comprising: a ceramic body including a first surface and a second surface opposite to each other in a first direction, a third surface and a fourth surface opposite to each other in a second direction and connecting the first surface and the second surface, and a fifth surface and a sixth surface opposite to each other in a third direction and connecting the first surface and the second surface; a plurality of first internal electrodes and a plurality of second internal electrodes, the plurality of first internal electrodes and the plurality of second internal electrodes being disposed inside the ceramic body; a non-conductive resin layer disposed on at least one of the third surface, the fourth surface, the fifth surface, and the sixth surface of the ceramic body; as well as a first external electrode and a second external electrode, the first external electrode and the second external electrode being disposed outside the ceramic body, wherein the first external electrode comprises a first electrode layer and a first conductive resin layer, the first electrode layer being disposed on the first surface of the ceramic body and being electrically connected to the plurality of first internal electrodes, the first conductive resin layer covering a portion of the non-conductive resin layer, and The second external electrode includes a second electrode layer and a second conductive resin layer, the second electrode layer is disposed on the second surface of the ceramic body and is electrically connected to the plurality of second internal electrodes, and the second conductive resin layer covers another portion of the non-conductive resin layer.

20. The multilayer ceramic capacitor according to claim 19, wherein The first electrode layer further includes a first extension portion, which is provided on at least one of the third surface, the fourth surface, the fifth surface, and the sixth surface of the ceramic body and is covered by the non-conductive resin layer, and The second electrode layer further includes a second extension portion that is disposed on at least one of the third surface, the fourth surface, the fifth surface, and the sixth surface of the ceramic body and is covered by the non-conductive resin layer.

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