Mechanical unsealing device and method for plastic package device

Abstract

The invention relates to the technical field of plastic package devices, and particularly discloses a mechanical unsealing device of a plastic package device, which comprises a hot air gun assembly, a mechanical unsealing device and a mechanical unsealing device, and is characterized in that the hot air gun assembly comprises a hot air gun body and a shell for fixing the hot air gun body; the clamping and extruding assembly comprises a basic frame and an adjustable clamping plate which is arranged in the basic frame and is used for clamping the plastic package device; the multiple adjusting assemblies comprise an up-down adjusting assembly and a left-right adjusting assembly, and the up-down adjusting assembly and the left-right adjusting assembly are arranged based on the shell and used for adjusting the relative left-right position of the heat gun body and the adjustable clamping plate and the relative up-down position of the heat gun body and the adjustable clamping plate; a cutting edge assembly capable of moving left and right is arranged outside the shell, the acting face of the cutting edge assembly is located on the lower bottom face of the basic frame, and the unsealing device for the plastic package device through a pure physical means is provided, foreign matter cannot be introduced, and original information of a sample can be stored.

Description

Technical Field

[0001] The present application relates to the technical field of plastic-sealed components, and specifically discloses a mechanical unsealing device and method for plastic-sealed components. Background Art

[0002] Component unsealing is also called component uncapping. The principle of uncapping is to remove the packaging on the surface of the component by using chemical or physical methods to observe the lead connection inside the component. As a common uncapping method, automatic uncapping machines have the following defects: Automatic uncapping machines are relatively expensive, and most companies and laboratories have not yet been equipped with them. Automatic uncapping machines are suitable for batch uncapping of components; and most uncapping machines do not meet the quantity and condition requirements for batch operations;

[0003] With the development of modern chip packaging, various sealing methods are changing with each passing day. As various packaging methods develop, it is also a problem for the unsealing of samples. The more common chemical unsealing has the advantages of fast unsealing speed and good unsealing effect, but it also inevitably introduces foreign matter and destroys the original information of the sample. If PFTB is used for treatment, it is also impossible to open the sample on a large scale. Therefore, it is particularly important to develop a method that does not introduce foreign matter and preserves the complete information and function of the sample as much as possible.

[0004] In the field of molded package reliability, failure analysis and destructive physical analysis are two basic projects. In both projects, the molded packaged device needs to be unsealed for internal inspection. The unsealing of the plastic packaged device requires that as little external damage as possible be introduced during unsealing, so that the device structure and internal chips are not damaged.

[0005] China Publication No. CN106683977A, comprising a container, a bottom plate and a clamping device, wherein the bottom of the container is provided with an opening, and the edge of the bottom of the container is provided with an extension plate, the clamping device is connected with the extension plate and the bottom plate located below the container, and the extension plate and the bottom plate can be fastened by the clamping device, and when unsealing, concentrated acid is added to the container and heated to 80°C, so that the unsealing window of the unsealed molded packager can be corroded and unsealed; the present invention can quickly and safely unseal the molded packaged device, the external frame structure of the device after unsealing is intact, the surface cleanliness of the chip can meet the subsequent inspection requirements, and the amount of acid used and the reagents required for cleaning can be reduced, and it has good economic benefits;

[0006] However, the above scheme still adds concentrated acid into the container when opening, and still adopts certain chemical means, which will inevitably introduce foreign matter and destroy the original information of the sample. In view of this, the present invention proposes a purely physical unsealing means. In view of this, the inventor provides a mechanical unsealing device and method for plastic-sealed components to solve the above problems. Summary of the invention

[0007] The purpose of the present invention is to provide a purely physical means of unsealing a plastic-sealed device, which will not introduce foreign matter and preserve the original information of the sample.

[0008] In order to achieve the above object, the present invention provides the following basic scheme

[0009] A mechanical unsealing device for a plastic-sealed component, comprising:

[0010] Hot air gun assembly: including a hot air gun body and a shell for fixing the hot air gun body;

[0011] Clamping and extruding assembly: comprising a base frame and an adjustable clamping plate arranged in the base frame for clamping the plastic-encapsulated device;

[0012] Multiple adjustment components: including an up-down adjustment component and a left-right adjustment component, which are arranged based on the shell to adjust the relative left-right position of the hot air gun body and the adjustable clamping plate and the relative up-down position of the hot air gun body and the adjustable clamping plate;

[0013] A cutting edge assembly which can move left and right is arranged outside the shell, and the action surface of the cutting edge assembly is on the lower bottom surface of the base frame.

[0014] Furthermore, a mounting plate is provided at one end of the shell, the hot air gun body is mounted on the mounting plate, and the output end of the hot air gun body passes through the other end of the shell.

[0015] Furthermore, the up and down adjustment assembly includes a plurality of installation grooves opened around the shell, a plurality of sliding rods slidably connected to the installation grooves, and a supporting member arranged at the other end of the sliding rod, and the other end of the sliding rod is fixedly connected to the base frame.

[0016] Furthermore, the inner wall of the base frame is provided with a tilting block, and the tilting block is tilted toward the outer shell. The adjustable clamping plate is arranged at the terminal end of the tilting block. The adjustable clamping plate includes a sliding rod arranged around the base frame and a clamping and extruding plate arranged on the inner wall of the base frame. The clamping and extruding plate is fixedly connected to the sliding rod, and the sliding rod is slidably connected to the base frame. A spring is arranged between the clamping and extruding plate and the inner wall of the base frame.

[0017] Furthermore, the left and right adjustment assembly includes a connecting block arranged between the hot air gun body and the mounting plate, a through groove penetrating the connecting block and the outer shell, a threaded rod installed on the connecting block and the outer shell, and a fixing nut threadedly connected to the threaded rod.

[0018] Furthermore, the blade assembly is fixedly connected to the outside of the shell, and the blade assembly includes a horizontal plate with one end fixed to the outside of the shell, a limit block fixed to the other end of the horizontal plate, a movable groove opened at the bottom of the horizontal plate, and a vertical plate slidably connected to the movable groove, and the blade plate is fixedly connected to one end of the shell facing the shell, and the blade plate acts on the lower bottom surface of the base frame.

[0019] The present invention also provides a method for using the mechanical unsealing device based on the plastic-sealed device, which includes the following steps:

[0020] S01: Pretreatment: used to heat the sample after insulation, and use the above device to perform artificial stratification on the sample;

[0021] S02: using a clamping and squeezing assembly to clamp and squeeze the plastic-sealed shell of the sample, and to remove the substrate of the sample, so that the plastic-sealed shell is separated from the substrate;

[0022] S03: Continue to heat the plastic package shell until the chip body inside the plastic package shell is taken out.

[0023] Further, in step S01, the heat preservation step is: use a heating box to heat the sample to 300°, keep it warm for 1 hour to make the overall temperature of the sample consistent, then adjust the temperature of the hot air gun body to 500°, use the hot air gun to evenly heat the sample, and rapidly heat it to cause the sample to stratify.

[0024] Further, in step S02, when the plastic-encapsulated shell and the substrate are not separated, a cutting edge assembly is used to apply a lateral external force to the connection between the plastic-encapsulated shell and the substrate to accelerate the separation of the plastic-encapsulated shell and the substrate.

[0025] Furthermore, in step S03, tweezers are used to take out the chip body inside the plastic package.

[0026] The principle and effect of this scheme are:

[0027] 1. Compared with the prior art, this device is a purely physical means to separate the plastic-sealed device and the chip inside, which can effectively protect the chip. Compared with the traditional chemical means, the purpose of the present invention is to provide a purely physical means of unsealing plastic-sealed devices, which will not introduce foreign matter and the original information of the sample can be preserved.

[0028] 2. Compared with the prior art, the present invention is provided with a hot air gun, and multiple adjustment components are provided based on the hot air gun, the multiple adjustment components include a front and rear adjustment component and an up and down adjustment component, through the action of the front and rear adjustment component and the up and down adjustment component, the clamping and extruding component can better make the hot air gun contact with the sample, and improvements are made on the clamping and extruding component, so that the clamping and extruding component can be suitable for unsealing plastic-sealed devices of different sizes.

[0029] 3. Compared with the prior art, this device is equipped with a hot air gun. Based on the metal thermal conductivity of the plastic-sealed component and the melting property of the solder, this device is equipped with a hot air gun. The hot air gun is one of the cores of this case. The hot air gun is used to heat the sample as a whole, and the metal thermal conductivity of the plastic-sealed component is used to first remove the substrate, thereby separating the plastic-sealed shell from the substrate and exposing the chip body in the plastic-sealed shell.

[0030] 4. Compared with the prior art, the device is provided with a cutting edge assembly. Since the plastic-sealed shell and the substrate are not separated due to the solder, the device applies a lateral external force to the connection between the plastic-sealed shell and the substrate through the cutting edge assembly to accelerate the separation of the plastic-sealed shell and the substrate.

[0031] 5. Compared with the existing technology, this device can achieve large-area unsealing of plastic-sealed devices. This device will not introduce foreign matter and the original information of the sample can be preserved. It is a purely physical unsealing method with a high unsealing effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For those skilled in the art, other drawings can be obtained based on these drawings without creative work.

[0033] Figure 1 A schematic structural diagram of a mechanical unsealing device and method for a plastic-sealed component proposed in an embodiment of the present application is shown;

[0034] Figure 2 A schematic front view of a mechanical unsealing device and method for a plastic-sealed component provided in an embodiment of the present application is shown;

[0035] Figure 3 The mechanical unsealing device and method of a plastic-sealed device proposed in the embodiment of the present application are shown. Figure 1 A schematic diagram of the structure from another angle. DETAILED DESCRIPTION

[0036] In order to further explain the technical means and effects adopted by the present invention to achieve the predetermined invention purpose, the specific implementation mode, structure, characteristics and effects of the present invention are described in detail below in combination with the accompanying drawings and preferred embodiments.

[0037] The figure marks in the drawings of the specification include: shell 1, mounting plate 2, sliding rod 3, supporting member 4, threaded rod 5, fixing nut 6, horizontal plate 7, vertical plate 8, cutting edge plate 9, base frame 10, sliding rod 11, clamping and extruding plate 12, hot air gun body 13, movable slot 14, tilting block 15.

[0038] Implementation example Figure 1 , Figure 2 and Figure 3 As shown:

[0039] A mechanical unsealing device for a plastic-sealed component, comprising:

[0040] The hot air gun assembly includes a hot air gun body 13 and a housing 1 for fixing the hot air gun body 13;

[0041] About the installation of the hot air gun body 13:

[0042] A mounting plate 2 is provided at one end of the housing 1 , and the hot air gun body 13 is mounted on the mounting plate 2 . The output end of the hot air gun body 13 passes through the other end of the housing 1 .

[0043] The plastic sealed device is heat treated by the hot air gun body 13, thereby unsealing the plastic sealed device;

[0044] The clamping and extruding assembly includes a base frame 10 and an adjustable clamping plate disposed in the base frame 10 for clamping the plastic-encapsulated device;

[0045] Specific:

[0046] The inner wall of the base frame 10 is provided with a tilting block 15, and the tilting block 15 is tilted toward the outer shell 1. The adjustable clamping plate is arranged at the terminal end of the tilting block 15. The adjustable clamping plate includes a sliding rod 3 arranged around the base frame 10 and a clamping and extruding plate 12 arranged on the inner wall of the base frame 10. The clamping and extruding plate 12 is fixedly connected to the sliding rod 3, and the sliding rod 3 is slidably connected to the base frame 10. A spring is arranged between the clamping and extruding plate 12 and the inner wall of the base frame 10.

[0047] A spring is provided between the clamping and squeezing plate 12 and the inner wall of the base frame 10 to adapt to plastic-encapsulated components of different sizes. Most of the plastic-encapsulated components have a substrate, which contacts the ground of the base frame 10, and the core on the substrate is clamped and squeezed by the clamping and squeezing plate 12;

[0048] Under the action of the hot air gun body 13, the core on the substrate is separated from the substrate;

[0049] In order to accelerate the separation, the device is arranged vertically, and the core on the substrate is clamped and squeezed by the clamping and squeezing plate 12 to offset its own gravity, and the substrate cannot be affected by gravity, thereby accelerating the separation of the substrate;

[0050] Multiple adjustment components: including an up-down adjustment component and a left-right adjustment component, which are arranged based on the housing 1 to adjust the relative left-right position of the hot air gun body 13 and the adjustable clamping plate, as well as the relative up-down position of the hot air gun body 13 and the adjustable clamping plate;

[0051] About the upper and lower adjustment components:

[0052] The up and down adjustment assembly includes a plurality of mounting grooves opened around the housing 1 , a plurality of sliding rods 3 slidably connected to the mounting grooves, and a supporting member 4 arranged at the other end of the sliding rod 3 , and the other end of the sliding rod 3 is fixedly connected to the base frame 10 .

[0053] Holding the housing, moving the supporting member 4, the movement of the supporting member 4 drives the clamping and extruding assembly to move toward the housing, thereby making the distance between the clamping and extruding assembly and the hot air gun body 13 farther or closer, thereby adjusting the relative up and down position of the hot air gun body 13 and the adjustable clamping plate;

[0054] About the left and right adjustment components:

[0055] The left and right adjustment assembly includes a connecting block arranged between the hot air gun body 13 and the mounting plate 2, a through groove penetrating the connecting block and the outer shell 1, a threaded rod 5 installed on the connecting block and the outer shell 1, and a fixing nut 6 threadedly connected to the threaded rod 5.

[0056] By moving the threaded rod 5 left and right, the position of the connecting block is changed, and the change of the position of the connecting block changes the left and right position of the hot air gun body 13. After the left and right position adjustment is completed, the position of the connecting block is fixed by fixing the nut 6 to achieve the fixed position of the hot air gun body 13;

[0057] A cutting edge assembly that can move left and right is disposed outside the housing 1 , and an action surface of the cutting edge assembly is on the lower bottom surface of the base frame 10 .

[0058] The cutting edge assembly is fixedly connected to the outside of the shell 1, and the cutting edge assembly includes a horizontal plate 7 with one end fixed to the outside of the shell 1, a limit block fixed to the other end of the horizontal plate 7, a movable groove 14 opened at the bottom of the horizontal plate 7 and a vertical plate 8 slidably connected to the movable groove 14, and a cutting edge plate 9 is fixedly connected to one end of the shell 1 facing the shell 1, and the cutting edge plate 9 acts on the lower bottom surface of the base frame 10.

[0059] Due to the stickiness of solder, in order to accelerate the separation of the substrate and the plastic packaged device, the cutting edge plate 9 is moved. Since the cutting edge plate 9 acts on the lower bottom surface of the base frame 10, and the substrate contacts the lower bottom surface of the base frame 10, the cutting edge plate 9 acts on this position and on the substrate, thereby accelerating the separation of the substrate.

[0060] The present invention also provides a method for using the mechanical unsealing device based on the plastic-sealed device, which includes the following steps:

[0061] S01: Pretreatment: used to heat the sample after insulation, and use the above device to perform artificial stratification on the sample;

[0062] Specific:

[0063] In step S01, the heat preservation step is: use a heating box to heat the sample to 300°, keep it warm for 1 hour to make the overall temperature of the sample consistent, then adjust the temperature of the hot air gun body 13 to 500°, use the hot air gun to evenly heat the sample, and heat it rapidly to cause the sample to stratify.

[0064] S02: using a clamping and squeezing assembly to clamp and squeeze the plastic-encapsulated shell 1 of the sample, and to remove the substrate of the sample, so that the plastic-encapsulated shell 1 is separated from the substrate;

[0065] Specific:

[0066] In step S02 , when the plastic-encapsulated housing 1 is not separated from the substrate, a cutting edge assembly is used to apply a lateral external force to the connection between the plastic-encapsulated housing 1 and the substrate to accelerate the separation of the plastic-encapsulated housing 1 from the substrate.

[0067] S03: Continue to heat the plastic package shell 1 until the chip body inside the plastic package shell 1 is taken out. In step S03, tweezers are used to take out the chip body inside the plastic package shell 1.

[0068] The purpose of the present invention is to provide a purely physical means of unsealing a plastic-sealed device, which will not introduce foreign matter and preserve the original information of the sample.

[0069] The above description is only a preferred embodiment of the present invention and does not limit the present invention in any form. Although the present invention has been disclosed as a preferred embodiment as above, it is not used to limit the present invention. Any technical personnel in this field can make some changes or modify the technical contents disclosed above into equivalent embodiments without departing from the scope of the technical solution of the present invention. However, any brief modifications, equivalent changes and modifications made to the above embodiments based on the technical essence of the present invention without departing from the content of the technical solution of the present invention are still within the scope of the technical solution of the present invention.

Claims

1. A mechanical unsealing device for a plastic-sealed component, characterized in that: include Hot air gun assembly: including a hot air gun body and a shell for fixing the hot air gun body; Clamping and extruding assembly: comprising a base frame and an adjustable clamping plate arranged in the base frame for clamping the plastic-encapsulated device; Multiple adjustment components: including an up-down adjustment component and a left-right adjustment component, which are arranged based on the shell to adjust the relative left-right position of the hot air gun body and the adjustable clamping plate and the relative up-down position of the hot air gun body and the adjustable clamping plate; A cutting edge assembly which can move left and right is arranged outside the shell, and the action surface of the cutting edge assembly is on the lower bottom surface of the base frame.

2. The mechanical unsealing device for a plastic-sealed component according to claim 1, characterized in that: A mounting plate is provided at one end of the shell, the hot air gun body is mounted on the mounting plate, and the output end of the hot air gun body passes through the other end of the shell.

3. The mechanical unsealing device for a plastic-sealed component according to claim 2, characterized in that: The up and down adjustment assembly includes a plurality of installation grooves opened around the shell, a plurality of sliding rods slidably connected to the installation grooves, and a supporting member arranged at the other end of the sliding rod, and the other end of the sliding rod is fixedly connected to the base frame.

4. The mechanical unsealing device for a plastic-sealed component according to claim 3, characterized in that: The inner wall of the base frame is provided with a tilting block, and the tilting block is tilted toward the outer shell. The adjustable clamping plate is arranged at the terminal end of the tilting block. The adjustable clamping plate includes a sliding rod arranged around the base frame and a clamping and extruding plate arranged on the inner wall of the base frame. The clamping and extruding plate is fixedly connected to the sliding rod, and the sliding rod is slidably connected to the base frame. A spring is arranged between the clamping and extruding plate and the inner wall of the base frame.

5. The mechanical unsealing device for a plastic-sealed component according to claim 3, characterized in that: The left and right adjustment assembly includes a connecting block arranged between the hot air gun body and the mounting plate, a through slot penetrating the connecting block and the shell, a threaded rod installed on the connecting block and the shell, and a fixing nut threadedly connected to the threaded rod.

6. The mechanical unsealing device for a plastic-sealed component according to claim 5, characterized in that: The blade assembly is fixedly connected to the outside of the shell, and includes a horizontal plate with one end fixed to the outside of the shell, a limit block fixed to the other end of the horizontal plate, a movable groove opened at the bottom of the horizontal plate, and a vertical plate slidably connected to the movable groove, and a blade plate is fixedly connected to one end of the shell facing the shell of the vertical plate, and the blade plate acts on the lower bottom surface of the base frame.

7. A method for using a mechanical unsealing device for a plastic-sealed component according to any one of claims 1 to 6, characterized in that: The following steps are involved: S01: Pretreatment: used to heat the sample after insulation, and use the above device to perform artificial stratification on the sample; S02: using a clamping and squeezing assembly to clamp and squeeze the plastic-sealed shell of the sample, and to remove the substrate of the sample, so that the plastic-sealed shell is separated from the substrate; S03: Continue to heat the plastic package shell until the chip body inside the plastic package shell is taken out.

8. The method for using the mechanical unsealing device for a plastic-sealed component according to claim 7, characterized in that: In step S01, the heat preservation step is: use a heating box to heat the sample to 300°, keep it warm for 1 hour to make the overall temperature of the sample consistent, then adjust the temperature of the hot air gun body to 500°, use the hot air gun to evenly heat the sample, and heat it rapidly to cause the sample to stratify.

9. The method for using the mechanical unsealing device for a plastic-sealed component according to claim 7, characterized in that: In step S02, when the plastic-encapsulated shell and the substrate are not separated, a cutting edge assembly is used to apply a lateral external force to the connection between the plastic-encapsulated shell and the substrate to accelerate the separation of the plastic-encapsulated shell and the substrate.

10. The method for using the mechanical unsealing device for a plastic-sealed component according to claim 7, characterized in that: In step S03, tweezers are used to take out the chip body inside the plastic package.

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