Substrate processing apparatus

Abstract

An apparatus for processing a substrate includes: a housing having an inlet through which a substrate is loaded and having an internal space; a support unit for supporting the substrate in the internal space; and a drive unit for moving the support unit between a first position and a second position; a partition plate for dividing the internal space into a processing space and a driving space, and having an opening formed when extending from a first position toward a second position; and a discharge port connected to the driving space to discharge the atmosphere in the driving space and disposed closer to the second position than the first position, in which the support unit includes: a support plate positioned in the processing space and on which the substrate is placed; a support shaft supporting the support plate and extending from the processing space to the driving space through the opening; and a baffle plate positioned so as to overlap the opening when viewed from above, and disposed toward the first position with respect to the support shaft.

Description

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application claims priority to and the benefit of Korean Patent Application No. 10-2023-0158060 filed in the Korean Intellectual Property Office on November 15, 2023, the entire contents of which are incorporated herein by reference. Technical Field

[0003] The present invention relates to an apparatus for processing a substrate, and more particularly, to an apparatus for inspecting defects of a substrate. Background Art

[0004] In order to manufacture semiconductor devices or flat display panels, various processes such as deposition, photography, etching and cleaning need to be performed. Among these processes, the photography process includes: a coating process of coating a photosensitive liquid (such as photoresist) onto the surface of a substrate to form a film, an exposure process of transferring a circuit pattern to the film formed on the substrate, and a development process of selectively removing the film formed on the substrate from an exposed area or an area opposite to the exposed area. Further, a heat treatment process is performed before and after the coating process, the exposure process and the development process.

[0005] After the coating process is completed, the substrate W may be subjected to a predetermined post-processing process before the development process is performed. The post-processing process may be an edge bead removal (Edge Bead Removal, hereinafter referred to as "EBR") process for removing an edge portion of a photoresist film or a circuit pattern, an edge exposure of a wafer (Edge Exposure of Wafer, hereinafter referred to as "EEW") process, and an inspection process for performing a predetermined inspection on the substrate W. The chamber for performing the inspection process of the substrate performs the inspection while a support unit supporting the substrate moves relative to a fixed inspection unit, and when the support unit moves in a direction away from a discharge port formed on one side of the chamber, the atmosphere of the driving space may enter the processing space and contaminate the substrate in the chamber, which is divided into a driving space and a processing space. Summary of the invention

[0006] The present invention aims to provide a substrate processing device capable of preventing contamination of a substrate.

[0007] The present invention also aims to provide a substrate processing apparatus capable of smoothly exhausting the atmosphere in a chamber.

[0008] The objects of the present invention are not limited thereto, and other objects not mentioned can be clearly understood by those skilled in the art from the following description.

[0009] An exemplary embodiment of the present invention provides an apparatus for processing a substrate, the apparatus comprising: a shell having an entrance through which the substrate is loaded and having an internal space; a support unit for supporting the substrate in the internal space; and a driving unit for moving the support unit between a first position and a second position; a partition for dividing the internal space into a processing space and a driving space and having an opening formed while extending from the first position toward the second position; and an exhaust port connected to the driving space to exhaust the atmosphere in the driving space, and the exhaust port is arranged to be closer to the second position than the first position, wherein the support unit comprises: a support plate positioned in the processing space and on which the substrate is placed; a support shaft supporting the support plate and extending from the processing space to the driving space through the opening; and a baffle positioned to overlap with the opening when viewed from above and arranged toward the first position relative to the support shaft.

[0010] In an exemplary embodiment, the apparatus may further include: a processing unit that processes the substrate; and an inspection unit that inspects defects of the substrate.

[0011] In an exemplary embodiment, the processing unit may include an edge exposure unit which exposes an edge of the substrate.

[0012] In an exemplary embodiment, a baffle may be located in the drive space.

[0013] In an exemplary embodiment, the baffle may be provided only in a direction facing the first position between the direction facing the first position and the direction facing the second position with respect to the support shaft.

[0014] In an exemplary embodiment, the baffle may be positioned adjacent to the partition and may be disposed without contacting the partition.

[0015] In an exemplary embodiment, the width of the baffle may be set to be greater than the width of the opening.

[0016] In an exemplary embodiment, the inlet may be disposed closer to the first location than to the second location.

[0017] In an exemplary embodiment, when the support unit is in the first position, the baffle may be arranged to extend further than one end of the opening in a direction toward the inlet when viewed from above.

[0018] In an exemplary embodiment, the driving unit may include: a first driver that is positioned in the driving space and rotates the support shaft; and a second driver that moves the support shaft in a straight line between the first position and the second position.

[0019] In an exemplary embodiment, the average pressure of the driving space may be lower than the average pressure of the processing space.

[0020] Another exemplary embodiment of the present invention provides an apparatus for processing a substrate, the apparatus comprising: a housing having an inlet through which a substrate is loaded and having an internal space; a support unit for supporting the substrate in the internal space; and a driving unit for moving the support unit between a first position and a second position and rotating the support unit; a partition for dividing the internal space into a processing space and a driving space, and the partition having an opening formed while extending from the first position toward the second position; and an exhaust port connected to the driving space to exhaust an atmosphere in the driving space, and the exhaust port is disposed closer to the second position than the first position; And an inspection unit, which is used to inspect defects of the substrate, wherein the support unit includes: a support plate, which is positioned in the processing space and the substrate is placed on the support plate; a support shaft, which supports the support plate and extends from the processing space to the driving space through the opening; and a baffle, which is positioned to overlap with the opening when viewed from above and is set toward a first position relative to the support shaft, and the driving unit may include: a first driver, which is positioned in the driving space and rotates the support shaft; and a second driver, which moves the support shaft in a straight line between the first position and the second position, and the entrance is set to be closer to the first position than to the second position.

[0021] In an exemplary embodiment, the apparatus may further include an edge exposure unit which exposes an edge of the substrate.

[0022] In an exemplary embodiment, a baffle may be located in the drive space.

[0023] In an exemplary embodiment, the baffle may be provided only in the direction facing the first position between the direction facing the first position and the direction facing the second position with respect to the support shaft.

[0024] In an exemplary embodiment, the width of the baffle may be set to be greater than the width of the opening.

[0025] In an exemplary embodiment, when the support unit is in the first position, the baffle may be arranged to extend further than one end of the opening in a direction toward the inlet when viewed from above.

[0026] Another exemplary embodiment of the present invention provides an apparatus for processing a substrate, the apparatus comprising: a shell having an inlet through which a substrate is loaded and having an internal space; a support unit for supporting the substrate in the internal space and rotating the substrate; a drive unit for moving the support unit between a first position and a second position and rotating the support unit; a partition for dividing the internal space into a processing space and a driving space, and the partition having an opening formed while extending from the first position toward the second position; an exhaust port connected to the driving space to exhaust an atmosphere in the driving space, and the exhaust port is disposed closer to the second position than the first position; and an inspection unit. A support unit is used to check defects of a substrate; and an edge exposure unit, which exposes an edge of the substrate, wherein the support unit includes: a support plate, which is positioned in a processing space and the substrate is placed on the support plate; a support shaft, which supports the support plate and extends from the processing space to the driving space through an opening; and a baffle, which is positioned to overlap with the opening when viewed from above and is set toward a first position relative to the support shaft, and the driving unit includes: a first driver, which is positioned in the driving space and rotates the support shaft; and a second driver, which moves the support shaft in a straight line between the first position and the second position, and the entrance is set to be closer to the first position than to the second position.

[0027] In an exemplary embodiment, the baffle may be located in the driving space, and the baffle may be provided only in a direction facing the first position between a direction facing the first position and a direction facing the second position with respect to the support shaft.

[0028] In an exemplary embodiment, the baffle may have a width greater than a width of the opening, and when the support unit is in the first position, the baffle may be arranged to extend further than one end of the opening in a direction toward the inlet when viewed from above.

[0029] According to the exemplary embodiments of the present invention, contamination of a substrate can be prevented.

[0030] Furthermore, the atmosphere in the chamber can be smoothly exhausted.

[0031] The effects of the present invention are not limited to the above-mentioned effects, and those skilled in the art can clearly understand unmentioned effects from the specification and the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] The various features and advantages of the non-limiting exemplary embodiments of the present specification may become apparent upon reviewing the detailed description in conjunction with the accompanying drawings. The accompanying drawings are provided for illustrative purposes only and should not be construed as limiting the scope of the claims. Unless explicitly stated, the drawings are not to be considered drawn to scale. The various dimensions in the drawings may be exaggerated for clarity and understanding.

[0033] Figure 1 FIG. 1 is a perspective view schematically showing a substrate processing apparatus according to an exemplary embodiment of the present invention.

[0034] Figure 2 for Figure 1 Front view of a substrate processing apparatus.

[0035] Figure 3 For Figure 1 A top plan view of an applying block in a substrate processing apparatus.

[0036] Figure 4 For Figure 1 A top plan view of a developing block in a substrate processing device.

[0037] Figure 5 To schematically show Figure 3 Top view of the transfer robot.

[0038] Figure 6 for Figure 3 A top plan view of a post-processing chamber.

[0039] Figure 7 for Figure 6 A cross-sectional view taken along line A-A'.

[0040] Figure 8 is a schematic diagram schematically showing a view of the interior of a post-processing chamber when a support unit moves from a first position to a second position.

[0041] Fig. 9 The diagram schematically shows a view of the interior of the post-processing chamber when the support unit is located in the second position.

[0042] Fig.10 is a schematic diagram schematically showing a view of the interior of the post-processing chamber when the support unit moves from the second position to the first position.

[0043] Fig.11 The figure schematically shows a view of the interior of the post-processing chamber when the supporting unit is located in the first position.

[0044] Fig.12The figure is a schematic diagram schematically showing a view of the interior of the post-processing chamber when the support unit is not equipped with baffles. DETAILED DESCRIPTION

[0045] Example embodiments will now be described more fully with reference to the accompanying drawings. Providing example embodiments will make the disclosure thorough and fully convey the scope to those skilled in the art. Many specific details (such as examples of specific components, equipment and methods) are set forth to provide a thorough understanding of the embodiments of the present disclosure. It will be apparent to those skilled in the art that specific details do not need to be adopted, and example embodiments can be embodied in many different forms, and specific details should not be construed as limiting the scope of the present disclosure. In some example embodiments, known processes, known equipment structures and known technologies are not described in detail.

[0046] The terms used herein are only for the purpose of describing specific example embodiments and are not intended to be restrictive. As used herein, unless the context clearly indicates otherwise, the singular forms "a, an" and "the" may be intended to include plural forms. The terms "comprises, comprising", "including" and "having" are inclusive, and therefore specifically refer to the presence of the feature, integer, step, operation, element and / or component, but do not exclude the presence or increase of one or more other features, integers, steps, operations, elements, components and / or combinations thereof. Unless explicitly identified as an execution order, the method steps, processes and operations described herein should not be interpreted as having to be performed in the specific order discussed or shown. It should also be understood that additional or alternative steps may be adopted.

[0047] When an element or layer is referred to as being "on another element or layer," "engaged to another element or layer," "connected to another element or layer," or "coupled to another element or layer," the element or layer may be directly on, directly engaged to, connected to, or coupled to another element or layer, or there may be intermediate elements or layers. Conversely, when an element is referred to as being "directly on another element or layer," "directly engaged to," "directly connected to," or "directly coupled to," there may be no intermediate elements or layers. Other words used to describe the relationship between elements should be interpreted similarly (e.g., "between" versus "directly between," "adjacent" versus "directly adjacent," etc.). As used herein, the term "and / or" includes any and all combinations of one or more of the relevant listed items.

[0048] Although the term first, second, third, etc. can be used to describe different elements, components, regions, layers and / or sections in this article, unless otherwise specified, these elements, components, regions, layers and / or sections should not be limited by these terms. These terms can only be used to distinguish an element, component, region, layer and / or section from another region, layer and / or section. When used in this article, unless the context clearly indicates, terms such as "first", "second" and other numerical items do not imply order or sequence. Therefore, without departing from the teaching of the example embodiment, the first element, the first component, the first area, the first layer or the first section discussed below can be referred to as the second element, the second component, the second area, the second layer or the second section.

[0049] For ease of description, spatially relative terms (e.g., "inside," "outside," "below," "below," "below," "above," and "above," etc.) may be used herein to describe the relationship of one element or feature shown in the drawings to another (or other) element or feature. Spatially relative terms may be intended to cover different orientations of the device in use or operation in addition to the orientations described in the drawings. For example, if the device in the figure is turned over, an element described as being "below" or "beneath" other elements or features will subsequently be oriented to be "above" the other elements or features. Thus, the example term "below" may cover both above and below orientations. The device may be oriented in other ways (rotated 90 degrees or oriented in other orientations), and the spatially relative descriptors used herein are interpreted accordingly.

[0050] When the terms "same" or "same" are used in the description of the exemplary embodiments, it should be understood that some imprecision may exist. Therefore, when an element or value is referred to as being the same as another element or value, it should be understood that the element or value is the same as the other element or value within a manufacturing or operating tolerance range (e.g., ±10%).

[0051] When the term "about" or "substantially" is used with a numerical value, it should be understood that the associated numerical value includes a manufacturing or operating tolerance (e.g., ±10%) around the numerical value. In addition, when the words "generally" and "substantially" are used in conjunction with geometric shapes, it should be understood that the exactness of the geometric shape is not required, but the latitude of the shape is within the scope of the present disclosure.

[0052] Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which the exemplary embodiments belong. It should be further understood that terms, including those defined in commonly used dictionaries, should be interpreted as having a meaning consistent with their meaning in the context of the relevant art, and will not be interpreted in an idealized or overly formal sense unless explicitly defined herein.

[0053] In the present exemplary embodiment, a wafer will be described as an example of an object to be processed. The technical spirit of the present invention can also be applied to equipment for processing other types of substrates other than wafers.

[0054] Hereinafter, exemplary embodiments of the present invention will be described with reference to the accompanying drawings.

[0055] Figure 1 is a perspective view schematically showing a substrate processing apparatus according to an exemplary embodiment of the present invention, and Figure 2 for Figure 1 Front view of a substrate processing apparatus. Figure 3 For Figure 1 A top plan view of a coating block in a substrate processing device of Figure 4 For Figure 1 A top plan view of a developing block in a substrate processing device.

[0056] Reference Figures 1 to 4 , the substrate processing apparatus 10 includes an index module 100, a processing module 300, and an interface module 500. According to an exemplary embodiment, the index module 100, the processing module 300, and the interface module 500 are sequentially arranged in a row. Hereinafter, a direction in which the index module 100, the processing module 300, and the interface module 500 are arranged is defined as a first direction 12, a direction perpendicular to the first direction 12 when viewed from above is defined as a second direction 14, and a direction perpendicular to both the first direction 12 and the second direction 14 is defined as a third direction 16.

[0057] The index module 100 is provided for transferring the substrate W between the container F containing the substrate W therein and the processing module 300. The longitudinal direction of the index module 100 is arranged along the second direction 14. The index module 100 includes a loading port 110 and an index frame 130. The container F containing the substrate W therein is placed on the loading port 110. The loading port 110 is located on the opposite side of the processing module 300 with respect to the index frame 130. A plurality of loading ports 110 may be provided, and the plurality of loading ports 110 may be arranged along the second direction 14.

[0058] In the example, an airtight container F, such as a front open unified pod (FOUP), may be used as the container F. The container F may be placed on the load port 110 by a conveying device (not shown) such as an overhead conveyor, an overhead transporter, or an automated guided vehicle, or by an operator.

[0059] The index robot 132 is disposed inside the index frame 130. A guide rail 136 is disposed inside the index frame 130. The longitudinal direction of the guide rail 136 is disposed along the second direction 14. The index robot 132 is mounted on the guide rail 136 so as to be movable along the guide rail 136. The index robot 132 includes a hand 132a on which the substrate W is placed. The hand 132a may be configured to be movable forward and backward, linearly movable along the third direction, and rotationally movable around an axis of the third direction 16.

[0060] The process module 300 performs a coating process and a developing process on the substrate W. The process module 300 includes a coating block 300 a and a developing block 300 b .

[0061] The coating block 300a performs a coating process on the substrate W before the exposure process. The developing block 300b performs a developing process on the substrate W after the exposure process. A plurality of coating blocks 300a are provided. A plurality of coating blocks 300a can be provided in a state where they are stacked on top of each other. A plurality of developing blocks 300b are provided. A plurality of developing blocks 300b can be provided to be stacked on top of each other. In one example, two coating blocks 300a are provided, and two developing blocks 300b are provided. A plurality of coating blocks 300a can be located below the developing blocks 300b.

[0062] In one example, a plurality of coating blocks 300a may be arranged to have the same structure as each other. The film applied to the substrate W in each of the plurality of coating blocks 300a may be a film of the same type. Alternatively, the film applied to the substrate W by each coating block 300a may be a film of a different type. The film applied to the substrate W includes a photoresist film. The film applied to the substrate W may also include an anti-reflection film. Alternatively, the film applied to the substrate W may further include a protective film.

[0063] In addition, the two developing blocks 300b can be arranged to have the same structure as each other. The developer supplied to the substrate W in the plurality of developing blocks 300b can be the same type of liquid. Alternatively, the developer supplied to the substrate W can be a developer of a different type according to the developing block 300b. For example, a process for removing the irradiated area in the area of ​​the register film on the substrate W can be performed in any one of the two developing blocks 300b, and a process for removing the non-irradiated area can be performed in the other of the two developing blocks 300b.

[0064] Reference Figure 3 The coating block 300 a includes a buffer unit 310 , a cooling unit 320 , a hydrophobizing chamber 340 , a transfer chamber 350 , a heat treatment chamber 360 , a liquid treatment chamber 380 , and a post-treatment chamber 400 .

[0065] The buffer unit 310, the cooling unit 320, and the hydrophobic chamber 340 are disposed adjacent to the index module 100. The hydrophobic chamber 340 and the buffer unit 310 may be sequentially disposed along the second direction 14. In addition, the cooling unit 320 and the buffer unit 310 may be disposed to be stacked on top of each other in a vertical direction.

[0066] The buffer unit 310 includes one or more buffer zones 312. When multiple buffer zones 312 are provided, the multiple buffer zones 312 may be arranged to be stacked on top of each other. When the substrate W is transferred between the index module 100 and the processing module 300, the buffer zone 312 provides a space for the substrate W to stay. The hydrophobic chamber 340 provides a hydrophobic treatment to the surface of the substrate W. The hydrophobic treatment may be performed before the coating process is performed on the substrate W. The hydrophobic treatment may be completed by supplying a hydrophobic gas to the substrate W while heating the substrate W. The cooling unit 320 cools the substrate W. The cooling unit 320 includes one or more cooling plates. When multiple cooling plates are provided, the multiple cooling plates may be arranged to be stacked on top of each other. In one example, the cooling unit 320 may be provided below the buffer unit 310. The cooling plate may have a flow path through which a coolant flows. The substrate W after the hydrophobic treatment may be cooled on the cooling plate.

[0067] The transfer mechanism 330 is disposed between the hydrophobizing chamber 340 and the buffer unit 310 and between the hydrophobizing chamber 340 and the cooling unit 320. The transfer mechanism 330 is provided to transfer the substrate W between the buffer unit 310, the hydrophobizing chamber 340, and the cooling unit 320.

[0068] The conveying mechanism 330 includes a hand 332 on which the substrate W is placed, and the hand 332 can be arranged to be movable forward and backward, rotatable around the third direction 16, and movable along the third direction 16. In one example, the conveying mechanism 330 moves in the third direction 16 along a guide rail 334. The guide rail 334 extends from the coating block located at the lowest point of the coating block 300a to the developing block located at the highest point of the developing block 300b. This allows the conveying mechanism 330 to convey the substrate W between the coating block 300a and the developing block 300b arranged on different layers. For example, the conveying mechanism 330 can convey the substrate W between the coating block 300a and the developing block 300b arranged on different layers. The conveying mechanism 330 can also convey the substrate W between the coating block 300a and the developing block 300b.

[0069] In addition, another conveying unit 331 may be further provided on the opposite side of the hydrophobizing chamber 340 relative to the side where the buffer unit 310 is provided. The another conveying unit 331 may be provided to convey the substrate W between the buffer unit 310 and the cooling unit 320 provided in the same blocks 300a and 300b. Further, the another conveying unit 331 may be provided to convey the substrate W between the buffer unit 310 and the cooling unit 320 provided in different blocks 300a and 300b.

[0070] The transfer chamber 350 is disposed such that its longitudinal direction is parallel to the first direction 12. One end of the transfer chamber 350 may be located adjacent to the buffer unit 310 and / or the cooling unit 320. The other end of the transfer chamber 350 may be located adjacent to the interface module 500.

[0071] A plurality of heat treatment chambers 360 are provided. Some of the heat treatment chambers 360 are arranged along the first direction 12. In addition, some of the heat treatment chambers 360 may be stacked along the third direction 16. The heat treatment chambers 360 may all be located on one side of the transfer chamber 350.

[0072] The liquid processing chamber 380 performs a liquid film forming process to form a liquid film on the substrate W. In one example, the liquid film forming process includes a resist film forming process. The liquid film forming process may include an anti-reflective film forming process. Optionally, the liquid film forming process may also include a protective film forming process. A plurality of liquid processing chambers 380 are provided. The liquid processing chamber 380 may be located on the opposite side of the thermal treatment chamber 360. For example, all liquid processing chambers 380 may be located on the other side of the transfer chamber 350. The liquid processing chambers 380 are arranged side-by-side along the first direction 12. Optionally, some of the liquid processing chambers 380 may be stacked along the third direction 16.

[0073] In one example, the liquid processing chamber 380 includes a front-end liquid processing chamber 382 and a rear-end liquid processing chamber 384. The front-end liquid processing chamber 382 is disposed relatively close to the index module 100, and the rear-end liquid processing chamber 384 is disposed closer to the interface module 500.

[0074] The front-end liquid processing chamber 382 applies the first liquid to the substrate W, and the rear-end liquid processing chamber 384 applies the second liquid to the substrate W. The first liquid and the second liquid may be different types of liquids. In one example, the first liquid may be a liquid for forming an anti-reflective film, and the second liquid may be a liquid for forming a photoresist film. The photoresist film may be formed on a substrate W already coated with an anti-reflective film. Alternatively, the first liquid may be a liquid for forming a photoresist film, and the second liquid may be a liquid for forming an anti-reflective film. In this case, the anti-reflective film may be formed on a substrate on which a photoresist film is formed. Alternatively, the first liquid and the second liquid may be the same type of liquid, and both may be liquids for forming a photoresist film.

[0075] Reference Figure 4 , the developing block 300b includes a buffer unit 310, a cooling unit 320, a transfer chamber 350, a heat treatment chamber 360, and a liquid treatment chamber 380. The arrangement of the buffer unit 310, the cooling unit 320, the transfer chamber 350, the heat treatment chamber 360, and the liquid treatment chamber 380 in the developing block 300b may be the same as the arrangement of the buffer unit 310, the cooling unit 320, the transfer chamber 350, the heat treatment chamber 360, and the liquid treatment chamber 380 in the coating block 300a. When viewed from above, the buffer unit 310, the cooling unit 320, the transfer chamber 350, the heat treatment chamber 360, and the liquid treatment chamber 380 in the developing block 300b and the buffer unit 310, the cooling unit 320, the transfer chamber 350, the heat treatment chamber 360, and the liquid treatment chamber 380 in the coating block 300a may be disposed in an overlapping position.

[0076] The heat treatment chamber 360 performs a heating process on the substrate W. The heating process includes a post-exposure baking process performed on the substrate W after the exposure process is completed, and a hard baking process performed on the substrate W after the development process is completed.

[0077] The liquid processing chamber performs a developing process by supplying a developer onto the substrate W to develop the substrate W.

[0078] exist Figure 3 or Figure 4In the embodiment, the transfer chamber 350 is provided with a transfer robot 351. The transfer robot 351 transfers the substrate W between the buffer unit 310, the cooling unit 320, the heat treatment chamber 360, the liquid treatment chamber 380, the post-treatment chamber 400 and the buffer unit 510 or the cooling unit 520 of the interface module 500. In one example, the transfer robot 351 includes a hand 352 on which the substrate W is placed. The hand 352 can be configured to be movable forward and backward, rotatable around the third direction 16, and movable along the third direction 16. A guide rail 356 whose longitudinal direction is parallel to the first direction 12 is provided in the transfer chamber 350, and the transfer robot 351 can be configured to be movable on the guide rail 356.

[0079] Figure 5 FIG. 1 is a schematic diagram showing an example of a hand of a transfer robot. Figure 5 , the hand 352 includes a base 352a and a support protrusion 352b. The base 352a may have an annular ring shape in which a portion of the circumference is curved. The base 352a has an inner diameter greater than the diameter of the substrate W. The support protrusion 352b extends inward from the base 352a. A plurality of support protrusions 352b are provided, and the plurality of support protrusions support the edge region of the substrate W. In one example, the support protrusions 352b may be provided in a row of four equally spaced portions.

[0080] The post-processing chamber 400 can perform a post-processing process on the substrate W that has been processed in the coating block 300a. In one example, before the substrate W that has been processed in the coating block 300a is loaded into the exposure device 700, the post-processing chamber 400 can perform a post-processing process. The post-processing process may include an edge exposure process for exposing the edge area of ​​the substrate W, or an inspection process for performing a predetermined inspection on the substrate W. The post-processing chamber 400 can perform an edge exposure process and an inspection process, or can optionally perform only one of the edge exposure process or the inspection process. The post-processing chamber 400 can optionally perform a post-processing process other than the edge exposure process or the inspection process. A plurality of post-processing chambers 400 can be provided, and they can be stacked on top of each other.

[0081] Hereinafter, the post-processing chamber 400 will be described.

[0082] Figure 6 for Figure 3 A top plan view of a post-processing chamber, and Figure 7 for Figure 6 A cross-sectional view taken along line A-A'.

[0083] Reference Figure 6 and Figure 7The post-processing chamber 400 includes a housing 410 , a supporting unit 420 , a driving unit 430 , a partition 440 , an inspection unit 450 , and a processing unit 460 .

[0084] The housing 410 has a processing space 414 and a driving space 416 therein.

[0085] On one side of the housing 410 , an inlet 412 is formed to load or unload a substrate W. The inlet 412 is provided with a door (not shown) that can be opened and closed. A substrate can be loaded into the processing space 414 through the inlet 412 .

[0086] The housing 410 includes a partition 440. The partition 440 divides the internal space of the housing 410 into a processing space 414 and a driving space 416. Based on the partition 440, the upper part of the internal space of the housing 410 is divided into the processing space 414, and the lower part of the internal space of the housing 410 is divided into the driving space 416. An opening 442 is formed in the partition 440. When viewed from above, the opening 442 is formed as an elongated square slit. The opening 442 extends in a direction from a first position to a second position. The first position and the second position will be described later.

[0087] An exhaust port 418 is installed on one side of the housing 410, and the exhaust port is connected to the driving space 416 to exhaust the atmosphere of the driving space 416. The exhaust port 418 may be connected to an exhaust pipe outside the housing 410. The exhaust port 418 and the exhaust pipe may be connected to a device such as a pump to apply a negative pressure to the driving space 416. The exhaust port 418 may exhaust the atmosphere in the driving space 416 to maintain the average pressure in the driving space 416 at a pressure lower than the average pressure of the processing space 414. The exhaust port 418 is formed in the side wall of the housing 410 opposite to the inlet 412, centered on the moving path.

[0088] The supporting unit 420 supports and rotates the substrate W. The supporting unit 420 includes a supporting plate 422, a supporting shaft 424, a baffle 426, and a first driver 432. The supporting plate 422 is provided with a circular top surface. The supporting plate 422 has a diameter smaller than the substrate W. The supporting plate 422 is provided to support the substrate W under vacuum pressure. The supporting shaft 424 is coupled to the center of the bottom surface of the supporting plate 422, and the supporting shaft 424 is coupled to the first driver 432 that provides a rotational force to the supporting shaft 424. The first driver 432 may be a motor.

[0089] The support plate 422 is located in the processing space 414 , and the support shaft 424 is coupled to the support plate 422 and extends from the processing space 414 to the driving space 416 through the opening 442 .

[0090] The support unit 420 moves in a straight line between a first position and a second position along a moving path by a driving unit 430 to be described later. The first position is a position of the support unit 420 when the support unit 420 is at one end of the moving path, and the second position is a position of the support unit 420 when the support unit 420 is at the other end of the moving path. Between the first position and the second position, a position adjacent to the inlet 412 will be described herein as the first position, and a position away from the inlet 412 will be described as the second position. As described above, the discharge port 418 is formed on a side wall of the housing 410 opposite to the inlet 412, centered on the moving path, so that the discharge port 418 is disposed closer to the second position than the first position.

[0091] In a state where the support plate 422 is located at the first position, the substrate W is placed on the support plate 422 from the transport robot 351 .

[0092] The baffle plate 426 is coupled to the first driver 432. The baffle plate 426 is positioned in the driving space 416. The baffle plate 426 is provided only on one side with respect to the support shaft 424. The baffle plate 426 is formed in a direction facing the side wall with respect to the support shaft 424, the side wall facing the side wall on which the discharge port 418 is formed. Since the discharge port 418 is provided closer to the second position than the first position, the baffle plate 426 is provided only in a direction facing the first position between the direction facing the first position and the direction facing the second position with respect to the support shaft 424.

[0093] The baffle 426 is disposed adjacent to the partition 440 and is disposed parallel to the partition 440. The baffle 426 is disposed so as not to contact the partition 440. That is, the baffle 426 is disposed to have a predetermined gap with the partition 440. When viewed from above, the baffle 426 is positioned to overlap with the opening 442 formed in the partition 440. The width of the baffle 426 is disposed to be greater than the width of the opening 442. When the support unit 420 is located in the first position, the end of the baffle 426 is disposed to coincide with one end of the opening 442 when viewed from above, or to extend further than one end of the opening 442 in the direction toward the inlet 412.

[0094] The driving unit 430 is located in the driving space 416. The driving unit 430 moves and rotates the supporting unit 420. The driving unit 420 includes the above-mentioned first driver 432 and the second driver 434. The second driver 434 is configured to horizontally move the supporting unit 420 between the first position and the second position along the moving path. In one example, the second driver 434 includes a motor that moves the supporting shaft 424 in a straight line and a guide that guides the straight line movement of the supporting shaft 424, and the supporting shaft 424 is provided on the guide so that the supporting unit 420 can move in a straight line along the guide.

[0095] The inspection unit 450 is disposed at an upper portion of the processing space 414 , and is installed at a position to inspect an edge of the substrate W placed on the support plate 422 .

[0096] The inspection unit 450 emits light onto the substrate W supported on the supporting unit 420 to inspect defects of the substrate W. The inspection unit 450 is fixedly installed, and inspects defects of the substrate W in a case where the supporting unit 420 moves from a first position to a second position and / or in a case where the supporting unit 420 moves from a second position to a first position. The inspection unit 450 may acquire an image of the substrate W supported by the supporting unit 420. The inspection unit 450 may include a line scanner that may scan a surface of the substrate W in a line scanning manner when the substrate W moves between the first position and the second position.

[0097] The processing unit 460 is disposed above the second position in the processing space 414 and processes the substrate W. In the present exemplary embodiment, the present invention will be described based on an example in which the processing unit 460 is an edge exposure unit that exposes the edge of the substrate W. The edge exposure process is performed by the edge exposure unit in a state in which the support plate 422 is positioned at the second position.

[0098] In the following, reference will be made to Figures 8 to 12 Description used in Figure 7 An exemplary embodiment of a process for processing a substrate in a post-processing chamber.

[0099] Figure 8 Schematic diagram schematically showing the interior of the post-processing chamber when the support unit moves from the first position to the second position. Fig. 9 The diagram schematically shows a view of the interior of the post-processing chamber when the supporting unit is located at the second position.

[0100] Fig.10 is a schematic diagram schematically showing a view of the interior of the post-processing chamber when the support unit moves from the second position to the first position, and Fig.11 The figure schematically shows a view of the interior of the post-processing chamber when the supporting unit is located at the first position.

[0101] Fig.12 The figure is a schematic diagram schematically showing a view of the interior of the post-processing chamber when the support unit is not equipped with baffles.

[0102] The substrate W is loaded into the post-processing chamber 400 and loaded onto the support plate 422 of the support unit 420 located at the first position by the transfer robot 351 and is vacuum-adsorbed.

[0103] The driving unit 430 moves the supporting unit 420 from the first position to the second position along the moving path. The inspection unit 450 may inspect the state of the substrate W moved from the first position to the second position. In the inspection process, the supporting unit 420 may stop moving, and the substrate W may be rotated by the first driver 432. In one example, the state of the substrate may be that beads on the edge of the substrate W have been removed.

[0104] After the support unit 420 is moved to the second position by the driving unit 430, the edge exposure may be performed. During the rotation of the substrate W by the first driver 432, the edge exposure unit 460 emits light to an edge portion of the substrate W for an exposure process.

[0105] When the substrate edge exposure is completed, the driving unit 430 moves the supporting unit 420 from the second position to the first position along the moving path again. The inspection unit 450 may inspect the state of the substrate W moved from the second position to the first position. During the inspection process, the supporting unit 420 may stop moving, and the substrate W may be rotated by the first driver 432. In one example, the state of the substrate may be that the edge of the substrate W has been exposed.

[0106] The substrate W moved to the first position is unloaded to the outside of the post-processing chamber 400 by the transfer robot 351 .

[0107] The inspection unit 450 acquires a first image from the substrate W when the substrate W moves from the first position to the second position, and acquires a second image from the substrate W when the substrate W moves from the second position to the first position after edge exposure. The first image is used to check the glue drop removal state at the edge of the substrate, and the second image is used to check the edge exposure state. The inspection unit 450 detects the width of the edge glue drop removal area or the width of the edge exposure area through image processing, and detects particles. The inspection unit 450 can check the removal state of the glue drop at the edge of the substrate through the width of the glue drop removal area detected in the first image. The inspection unit 450 can check and determine the edge exposure state at the edge of the substrate through the width of the photoresist removal area detected in the second image.

[0108] During the above-mentioned processing of the substrate W in the post-processing chamber 400, the atmosphere in the driving space 416 is exhausted through the exhaust port 418. Due to the exhaust flow through the exhaust port 418, an air flow is formed from the processing space 414 through the driving space 416 to the exhaust port 418. Since the exhaust port 418 is formed on the side wall adjacent to the second position, the exhaust direction of the driving space 416 is from the first position to the second position.

[0109] In the driving space 416 , the driving unit 430 and components such as electronic devices and wires are arranged, and due to the horizontal movement of the supporting unit 420 , the atmosphere within the driving space 416 may flow in the moving direction of the supporting unit 420 .

[0110] Reference Figure 8 When the support unit 420 moves from the first position to the second position, the moving direction of the support unit 420 and the exhaust direction are consistent, so that the atmosphere in the driving space 416 flowing along the moving direction of the support unit 420 is smoothly exhausted. Fig.10 As shown, when the support unit 420 moves from the second position to the first position, the support unit 420 moves in a direction away from the discharge direction. Therefore, due to the movement of the support unit 420, the atmosphere in the driving space 416 can flow from the second position to the first position along the moving direction of the support unit 420. When the support unit 420 is adjacent to the first position, the pressure in the direction toward the first position may increase with the support unit 420 as the center. In other words, a compression area A can be generated in which the atmosphere in the area in front of the moving direction of the support unit 420 is compressed. Therefore, the atmosphere in the driving space 416 can flow into the processing space 414 through the opening 442. When the support unit 420 is not provided with a Fig.12 When the support unit 420 decelerates when reaching the first position, the atmosphere in the driving space 416 may flow backward. As a result, various particles generated by the driving unit 430 and the like may flow out of the driving space 416, flow into the processing space 414, and contaminate the substrate W.

[0111] As described above, the baffle 426 is positioned to overlap the opening 442 when viewed from above, and an end of the baffle 426 is arranged to coincide with or extend further than one end of the opening 442 in a direction toward the inlet 412 .

[0112] Therefore, if Fig.11 As shown, when the support unit 420 is adjacent to the first position, the baffle 426 is used to cover the opening 442. This can minimize the introduction of the atmosphere from the driving space 416 into the processing space 414 through the opening 442. In addition, particles in the driving space 416 can be prevented from entering the processing space 414 to prevent contamination of the substrate W. Since the atmosphere in the driving space 416 is prevented from entering the processing space 414, the atmosphere in the post-processing chamber 400 can be smoothly evacuated.

[0113] The interface module 500 connects the process module 300 with the external exposure device 700. The interface module 500 includes an interface frame 501, a buffer unit 510, a cooling unit 520, a transfer mechanism 530, an interface robot 540, and an additional process chamber 560.

[0114] A fan filter unit forming a downward airflow therein may be disposed at the top end of the interface frame 501 . The buffer unit 510 , the cooling unit 520 , the transfer mechanism 530 , the interface robot 540 , and the additional process chamber 560 are disposed inside the interface frame 501 .

[0115] The structures and arrangements of the buffer unit 510 and the cooling unit 520 may be the same or similar to those of the buffer unit 310 and the cooling unit 320 provided in the process module 300. The buffer unit 510 and the cooling unit 520 are provided adjacent to the end of the transfer chamber 350. The substrate W transferred between the process module 300, the cooling unit 520, the additional process chamber 560, and the exposure device 700 may temporarily stay in the buffer unit 510. The cooling unit 520 may be provided only between the coating block 300a and the developing block 300b at a height corresponding to the coating block 300a.

[0116] The conveying mechanism 530 may convey the substrate W between the buffer units 510. The conveying mechanism 530 may convey the substrate W between the buffer unit 510 and the cooling unit 520. The conveying mechanism 530 may be provided with a structure that is the same as or similar to the conveying mechanism 330 of the process module 300. Another conveying mechanism 531 may be further provided in an area opposite to the area where the conveying mechanism 530 is provided with respect to the buffer unit 510.

[0117] The interface robot 540 is disposed between the buffer unit 510 and the exposure device 700. The interface unit 540 is configured to transfer the substrate W between the buffer unit 510, the cooling unit 520, the additional process chamber 560, and the exposure device 700. The interface robot 540 has a hand 542 on which the substrate W is placed, and the hand 542 may be configured to be movable forward and backward, rotatable about an axis parallel to the third direction 16, and movable along the third direction 16.

[0118] The additional process chamber 560 may perform a predetermined additional process before loading the substrate W completely processed in the coating block 300a to the exposure device 700. Alternatively, the additional process chamber 560 may perform a predetermined additional process before loading the substrate W that has been completely processed in the exposure device 700 to the developing block 300b. In one example, the additional process may be a top surface cleaning process for cleaning the top surface of the substrate W, or a bottom surface cleaning process for cleaning the bottom surface of the substrate W. A plurality of additional process chambers 560 may be provided, and they may be stacked on top of each other.

[0119] In the above exemplary embodiment, the present invention is described as baffle 426 being positioned below baffle 440 and in driving space 416. However, baffle 426 may be positioned above baffle 440 and in processing space 416 instead.

[0120] In the above exemplary embodiment, the present invention is described as an apparatus in which the inspection unit 450 irradiates the substrate W with light to inspect defects of the substrate W. However, the inspection unit 450 may be any other apparatus that inspects defects of the substrate W. For example, the inspection unit 450 may be an apparatus that photographs and inspects the substrate W. The inspection unit 450 may include an area camera that photographs the surface of the substrate W by area scanning in a manner including a glue droplet removal area at the edge of the substrate and an edge exposure area.

[0121] In the above exemplary embodiment, it has been described that the processing unit 460 disposed above the second position is an edge exposure unit and exposes the edge of the substrate W. However, other processes than the edge exposure process may be performed in the post-processing chamber 400, and thus, the processing unit 460 may be a device that performs other processes than the edge exposure unit.

[0122] In the above exemplary embodiment, it has been described that the post-processing chamber 400 is disposed in the process module 300. However, alternatively, the post-processing chamber 400 may be disposed in the interface module 500. In this case, the post-processing chamber 400 may be disposed to be stacked with the above-described additional process chamber 560.

[0123] It should be understood that exemplary embodiments are disclosed herein and that other variations are possible. Individual components or features of a particular exemplary embodiment are generally not limited to that particular exemplary embodiment, but are interchangeable and can be used in a selected exemplary embodiment where applicable, even if not specifically shown or described. These modifications should not be considered as departing from the spirit and scope of the present disclosure, and all such modifications that are obvious to one of ordinary skill in the art are intended to be included within the scope of the appended claims.

Claims

1. An apparatus for processing a substrate, the apparatus comprising: a housing having an inlet through which the substrate is loaded and having an internal space; a supporting unit, the supporting unit being used to support the substrate in the internal space; as well as a driving unit, the driving unit being used to move the supporting unit between a first position and a second position; a partition plate for dividing the internal space into a processing space and a driving space, and the partition plate has an opening formed while extending from the first position toward the second position; as well as an exhaust port connected to the driving space to exhaust the atmosphere in the driving space, and the exhaust port is arranged closer to the second position than the first position, Wherein, the supporting unit comprises: a support plate positioned in the processing space and on which the substrate is placed; a supporting shaft that supports the supporting plate and extends from the processing space to the driving space through the opening; and The baffle is positioned so as to overlap the opening when viewed from above, and the baffle is disposed toward the first position relative to the support shaft.

2. The device according to claim 1, wherein: The device also includes: a processing unit, wherein the processing unit processes the substrate; and An inspection unit is used to inspect defects of the substrate.

3. The device according to claim 2, wherein: The processing unit includes an edge exposure unit, and the edge exposure unit exposes an edge of the substrate.

4. The device according to claim 1, wherein: The baffle is located in the driving space.

5. The device according to claim 1, wherein: The baffle is provided only in a direction facing the first position between a direction facing the first position and a direction facing the second position with respect to the support shaft.

6. The device according to claim 1, wherein: The baffle is positioned adjacent to the partition and is arranged not to contact the partition.

7. The device according to claim 1, wherein: The width of the baffle is set to be greater than the width of the opening.

8. The device according to claim 1, wherein: The inlet is disposed closer to the first position than to the second position.

9. The device according to claim 8, wherein: When the support unit is in the first position, the baffle is arranged to extend further than one end of the opening in a direction toward the inlet when viewed from above.

10. The device according to claim 1, wherein: The driving unit comprises: a first driver positioned in the drive space and rotating the support shaft; and A second actuator moves the support shaft in a straight line between the first position and the second position.

11. The device according to claim 1, wherein: An average pressure of the driving space is lower than an average pressure of the processing space.

12. An apparatus for processing a substrate, the apparatus comprising: a housing having an inlet through which the substrate is loaded and having an internal space; a supporting unit, the supporting unit being used to support the substrate in the internal space; as well as a driving unit, the driving unit being used to move the supporting unit between a first position and a second position and to rotate the supporting unit; a partition plate for dividing the internal space into a processing space and a driving space, and the partition plate has an opening formed while extending from the first position toward the second position; as well as an exhaust port connected to the driving space to exhaust the atmosphere in the driving space, and the exhaust port is disposed closer to the second position than the first position; as well as an inspection unit, the inspection unit being used to inspect defects of the substrate, Wherein, the supporting unit comprises: a support plate, the support plate being positioned in the processing space, and the substrate being placed on the support plate; a supporting shaft that supports the supporting plate and extends from the processing space to the driving space through the opening; and a baffle, the baffle being positioned so as to overlap the opening when viewed from above, and the baffle being disposed toward the first position relative to the support shaft, and The driving unit comprises: a first driver positioned in the drive space and rotating the support shaft; and a second drive that moves the support shaft in a straight line between the first position and the second position, and The inlet is disposed closer to the first position than to the second position.

13. The device according to claim 12, wherein: The device also includes: An edge exposure unit is used to expose the edge of the substrate.

14. The device according to claim 12, wherein: The baffle is located in the driving space.

15. The device according to claim 12, wherein: The baffle is provided only in a direction facing the first position between a direction facing the first position and a direction facing the second position with respect to the support shaft.

16. The device according to claim 12, wherein: The width of the baffle is set to be greater than the width of the opening.

17. The device according to claim 12, wherein: When the support unit is in the first position, the baffle is arranged to extend further in a direction toward the inlet than one end of the opening when viewed from above.

18. An apparatus for processing a substrate, the apparatus comprising: a housing having an inlet through which the substrate is loaded and having an internal space; a supporting unit, the supporting unit being used to support and rotate the substrate in the internal space; a driving unit, the driving unit being used to move the supporting unit between a first position and a second position and to rotate the supporting unit; a partition plate for dividing the internal space into a processing space and a driving space, and the partition plate has an opening formed while extending from the first position toward the second position; an exhaust port connected to the driving space to exhaust the atmosphere in the driving space, and the exhaust port is disposed closer to the second position than the first position; as well as An inspection unit, the inspection unit is used to inspect defects of the substrate; as well as an edge exposure unit, wherein the edge exposure unit exposes the edge of the substrate, Wherein, the supporting unit comprises: a support plate, the support plate being positioned in the processing space, and the substrate being placed on the support plate; a supporting shaft that supports the supporting plate and extends from the processing space to the driving space through the opening; and a baffle, the baffle being positioned so as to overlap the opening when viewed from above, and the baffle being disposed toward the first position relative to the support shaft, and The driving unit comprises: a first driver positioned in the drive space and rotating the support shaft; and a second drive that moves the support shaft in a straight line between the first position and the second position, and The inlet is disposed closer to the first position than to the second position.

19. The device according to claim 18, wherein: The baffle is located in the drive space, and the baffle is provided only in a direction facing the first position between a direction facing the first position and a direction facing the second position with respect to the support shaft.

20. The device according to claim 18, wherein The width of the baffle is set to be greater than the width of the opening, and When the support unit is in the first position, the baffle is arranged to extend further than one end of the opening in a direction toward the inlet when viewed from above.

Images