Radio frequency circuit, radio frequency control method and device, electronic equipment and medium

Abstract

The invention discloses a radio frequency circuit, a radio frequency control method and device, electronic equipment and a medium, and belongs to the technical field of communication. The radio frequency circuit comprises a radio frequency module; the input end of the power amplifier PA is connected with the transmitting end of the radio frequency module; the output end of the LNA is connected with the receiving end of the radio frequency module; the first end of the duplexer is connected with the output end of the PA, and the second end of the duplexer is connected with the input end of the LNA; the first end of the coupler is connected with the third end of the duplexer; the antenna is connected with the second end of the coupler; the first end of the attenuation unit is connected with the feedback end of the radio frequency module, the second end of the attenuation unit is connected with the third end of the coupler, the attenuation unit comprises a first path and a second path, and the attenuation value corresponding to the first path is smaller than the attenuation value corresponding to the second path; and the first passage and the second passage respectively work at different environment temperatures.

Description

Technical Field

[0001] The present application belongs to the field of communication technology, and specifically relates to a radio frequency circuit, a radio frequency control method, a device, an electronic device and a medium. Background Art

[0002] At present, major mobile communication equipment manufacturers are committed to improving the transmission power and receiving sensitivity of RF front-end devices in pursuit of a better communication experience. For example, the maximum transmission power of a certain RF power amplifier (PA) is 28dBm. Excluding the insertion loss caused by factors such as filters, switches, and wiring at the PA output (assuming it is 2dB) and the upper limit of the production line test fluctuation of 1dB, the target power of the RF test socket is required to be 25dBm. However, sometimes under extreme environmental conditions, the transmission power of the device may be abnormal.

[0003] Usually, the platform will set multiple high-temperature gears for writing temperature compensation parameters, such as 50℃, 70℃, 80℃, etc., and call different PA input power and feedback (FBRX) path loss (Loss) at different temperatures to make the PA transmit power reach the target value. However, due to hardware limitations, the highest compensation parameters can only be achieved at the 50℃ gear. For gears above 50℃, the parameters of the 50℃ gear are used. This will make the PA transmit power at high temperature too high, which will cause device reliability problems and affect the service life of the equipment. Summary of the invention

[0004] The purpose of the embodiments of the present application is to provide a radio frequency circuit, a radio frequency control method, an apparatus, an electronic device and a medium, which can solve the problem in the prior art that the PA transmission power is too high at high temperature, thereby causing device reliability problems and affecting the service life of the equipment.

[0005] In a first aspect, an embodiment of the present application provides a radio frequency circuit, including:

[0006] RF module;

[0007] A power amplifier PA, wherein an input end of the PA is connected to a transmitting end of the RF module;

[0008] A low noise amplifier LNA, wherein an output end of the LNA is connected to a receiving end of the radio frequency module;

[0009] A duplexer, wherein a first end of the duplexer is connected to an output end of the PA, and a second end of the duplexer is connected to an input end of the LNA;

[0010] a coupler, a first end of the coupler being connected to a third end of the duplexer;

[0011] an antenna connected to the second end of the coupler;

[0012] an attenuation unit, wherein a first end of the attenuation unit is connected to a feedback end of the radio frequency module, a second end of the attenuation unit is connected to a third end of the coupler, the attenuation unit comprises a first path and a second path, and an attenuation value corresponding to the first path is smaller than an attenuation value corresponding to the second path;

[0013] The first passage and the second passage operate at different ambient temperatures respectively.

[0014] In a second aspect, an embodiment of the present application provides an electronic device, comprising the radio frequency circuit described in the first aspect.

[0015] In a third aspect, an embodiment of the present application provides a radio frequency control method, which is performed by the electronic device according to the second aspect, and the method includes:

[0016] When it is detected that the ambient temperature is lower than a preset temperature threshold, controlling the attenuation unit to operate using the second path;

[0017] When it is detected that the ambient temperature is higher than or equal to the preset temperature threshold, the attenuation unit is controlled to operate using the first path.

[0018] In a fourth aspect, an embodiment of the present application provides a radio frequency control device, which is provided in the electronic device according to the second aspect, and the radio frequency control device includes:

[0019] A first control module, configured to control the attenuation unit to operate using the second path when detecting that the ambient temperature is lower than a preset temperature threshold;

[0020] The second control module is used to control the attenuation unit to work using the first path when it is detected that the ambient temperature is higher than or equal to the preset temperature threshold.

[0021] In a fifth aspect, an embodiment of the present application provides an electronic device, which includes a processor and a memory, wherein the memory stores programs or instructions that can be run on the processor, and when the program or instructions are executed by the processor, the steps of the method described in the third aspect are implemented.

[0022] In a sixth aspect, an embodiment of the present application provides a readable storage medium, on which a program or instruction is stored, and when the program or instruction is executed by a processor, the steps of the method described in the third aspect are implemented.

[0023] In a seventh aspect, an embodiment of the present application provides a chip, comprising a processor and a communication interface, wherein the communication interface is coupled to the processor, and the processor is used to run a program or instruction to implement the method described in the third aspect.

[0024] In an eighth aspect, an embodiment of the present application provides a computer program product, which is stored in a storage medium and is executed by at least one processor to implement the method described in the third aspect.

[0025] In an embodiment of the present application, a radio frequency circuit includes: a radio frequency module; a power amplifier PA, wherein the input end of the PA is connected to the transmitting end of the radio frequency module; a low noise amplifier LNA, wherein the output end of the LNA is connected to the receiving end of the radio frequency module; a duplexer, wherein the first end of the duplexer is connected to the output end of the PA, and the second end of the duplexer is connected to the input end of the LNA; a coupler, wherein the first end of the coupler is connected to the third end of the duplexer; an antenna, wherein the antenna is connected to the second end of the coupler; an attenuation unit, wherein the first end of the attenuation unit is connected to the feedback end of the radio frequency module, and the second end of the attenuation unit is connected to the third end of the coupler, wherein the attenuation unit includes a first path and a second path, and the attenuation value corresponding to the first path is less than the attenuation value corresponding to the second path; wherein the first path and the second path operate at different ambient temperatures respectively.

[0026] When the ambient temperature is detected to be lower than the preset temperature threshold, the attenuation unit is controlled to work using the second path; when the ambient temperature is detected to be higher than or equal to the preset temperature threshold, the attenuation unit is controlled to work using the first path. In this way, by adding an attenuation unit with multiple attenuation values ​​to the feedback path, the loss of the feedback path can be dynamically adjusted in a high temperature environment, thereby achieving the purpose of reducing the PA output power, avoiding device failure caused by excessive PA output power, and extending the service life of the equipment. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figure 1 It is a schematic diagram of the structure of a traditional RF transceiver link;

[0028] Figure 2a to 2c It is a schematic diagram of the output power of a traditional RF transceiver link changing with temperature;

[0029] Figure 3a It is one of the structural schematic diagrams of the radio frequency circuit provided in the embodiment of the present application;

[0030] Figure 3b It is one of the structural schematic diagrams of the radio frequency circuit provided in the embodiment of the present application;

[0031] Figure 4a This is one of the structural schematic diagrams of the π-type attenuation circuit provided in the embodiment of the present application;

[0032] Figure 4bis a schematic diagram of attenuation simulation of a π-type attenuation circuit provided in an embodiment of the present application;

[0033] Figure 5a This is the second structural schematic diagram of the π-type attenuation circuit provided in the embodiment of the present application;

[0034] Figure 5b This is the second attenuation simulation schematic diagram of the π-type attenuation circuit provided in the embodiment of the present application;

[0035] Figure 6 This is one of the flow charts of the radio frequency control method provided in the embodiment of the present application;

[0036] Figure 7 This is the second flowchart of the radio frequency control method provided in the embodiment of the present application;

[0037] Figure 8 is a structural diagram of a radio frequency control device provided in an embodiment of the present application;

[0038] Fig. 9 is a structural diagram of an electronic device provided in an embodiment of the present application;

[0039] Fig.10 It is a hardware structure diagram of the electronic device provided in the embodiment of the present application. DETAILED DESCRIPTION

[0040] The following will be combined with the drawings in the embodiments of the present application to clearly describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, rather than all the embodiments. All other embodiments obtained by ordinary technicians in this field based on the embodiments in the present application belong to the scope of protection of this application.

[0041] The terms "first", "second", etc. in the specification and claims of the present application are used to distinguish similar objects, and are not used to describe a specific order or sequence. It should be understood that the terms used in this way are interchangeable where appropriate, so that the embodiments of the present application can be implemented in an order other than those illustrated or described herein, and the objects distinguished by "first", "second", etc. are generally of one type, and the number of objects is not limited. For example, the first object can be one or more. In addition, "and / or" in the specification and claims represents at least one of the connected objects, and the character " / " generally indicates that the objects associated with each other are in an "or" relationship.

[0042] In order to make the embodiments of the present application clearer, the relevant technical knowledge involved in the embodiments of the present application is first introduced as follows:

[0043] When making high-temperature compensation parameters, the mobile phone motherboard needs to be placed in a 60℃+ environment in a temperature box, but the temperature of the SOC chip can easily rise to 100℃+, thus triggering the SOC over-temperature protection. The SOC restart will cause the mobile phone to drop the port, resulting in the inability to make parameters for the corresponding temperature level. Therefore, currently, the highest compensation parameters are usually only 50℃, and the parameters above 50℃ are used for the 50℃ level. However, this will make the PA transmission power at high temperature too high, which will then cause device reliability problems and affect the service life of the mobile phone.

[0044] Figure 1 The figure shows a conventional RF signal transceiver link block diagram. The TX signal is amplified by the PA and then transmitted to the antenna (ANT) through the duplexer TX end and the coupler; for frequency division duplex (FDD), the TX and RX signals can work simultaneously, and the RX signal is amplified by the ANT antenna, coupler, duplexer RX end, low noise amplifier (LNA), and finally transmitted back to the wireless transceiver (WTR) for signal processing.

[0045] The reasons why PA output power is high at high temperature are: Figure 2a As shown, when the ambient temperature is 30℃, the mainboard calls the parameters of the 30℃ gear, the PA input power is 0dBm, the gain is 30dB, the PA output power Pout is 30dBm, the actual FBRXLoss is -30dB, and the feedback power Pdet detected by WTR is 0dBm. Since the FBRX Loss written in the RF NV memory is also -30dB, the system believes that Pout outputs 0-(-30)=30dBm, and the actual PA transmission power is 30dBm, which corresponds exactly.

[0046] like Figure 2b As shown in the figure, when the ambient temperature is 60℃+, the mainboard calls the parameters of the 70℃ gear. PA input power is 0dBm, gain is 30dB, PA output power is 30dBm, the actual FBRX Loss at this temperature is -31dB, and the feedback power Pdet detected by WTR is -1dBm; while the FBRX Loss written by the RF NV is consistent with the 50℃ gear, which is -30.5dB. The system determines that Pout outputs -1-(-30.5)=29.5dBm, which is 0.5dB lower than the target power of 30dBm.

[0047] To this end, the system will increase the PA input power to 0.5dBm, such as Figure 2cAs shown, at this time, the actual output power of the PA is 30.5dBm, and the feedback power actually detected by the WTR is 30.5-31=-0.5dBm. Since the FBRX Loss written in the RF NV is -30.5dB, the system determines that the PA transmit power is 30dBm at this time, which is in line with expectations. However, the actual transmit power under this condition is too high.

[0048] Currently, conventional RF transceiver links cannot overcome the defect of high PA output power under high temperature conditions, so the circuit needs to be improved.

[0049] The high actual transmission power of the PA at a high temperature of 70°C is caused by the FBRX Loss compensation error. The actual Loss is -31dB, and the Loss written in the RF NV is -30.5dB. If the actual transmission power needs to be reduced, the actual Loss needs to be reduced. Therefore, this application improves the FBRX feedback path and adds a multi-level π-type attenuation circuit to the path, which can achieve three levels of attenuation: 0dB, XdB, or even 2XdB, where X can define a specific attenuation value according to actual needs.

[0050] The following, in conjunction with the accompanying drawings, describes in detail the RF circuit and RF control method provided in the embodiments of the present application through specific embodiments and their application scenarios.

[0051] See also Figure 3a , Figure 3a A schematic diagram of the structure of the radio frequency circuit provided in the embodiment of the present application is shown in FIG. Figure 3a As shown, the radio frequency circuit includes:

[0052] Radio frequency module 10;

[0053] A power amplifier PA20, wherein the input end of PA20 is connected to the transmitting end TX of the radio frequency module 10;

[0054] A low noise amplifier LNA30, wherein the output end of the LNA30 is connected to the receiving end RX of the radio frequency module 10;

[0055] A duplexer 40, wherein a first end of the duplexer 40 is connected to an output end of the PA 20, and a second end of the duplexer 40 is connected to an input end of the LNA 30;

[0056] A coupler 50, wherein a first end of the coupler 50 is connected to a third end of the duplexer 40;

[0057] An antenna 60 connected to the second end of the coupler 50;

[0058] An attenuation unit 70, wherein a first end of the attenuation unit 70 is connected to a feedback end FBRX of the RF module 10, a second end of the attenuation unit 70 is connected to a third end of the coupler 50, and the attenuation unit 70 includes a first path and a second path, and an attenuation value corresponding to the first path is less than an attenuation value corresponding to the second path;

[0059] The first passage and the second passage operate at different ambient temperatures respectively.

[0060] like Figure 3a As shown, the embodiment of the present application has made an improved design for the feedback FBRX path, and an attenuation unit circuit with switchable attenuation gears is added thereto, which is used to switch to different attenuation gears under different ambient temperatures, thereby realizing dynamic adjustment of the loss of the feedback path, thereby achieving the purpose of reducing the PA output power.

[0061] Specifically, the attenuation unit 70 includes at least two paths, and different paths correspond to different attenuation gears, that is, different attenuation values. In specific implementation, one of the paths can be a direct path, that is, the coupler 50 directly passes through the feedback end FBRX of the RF module 10, and the corresponding attenuation value is 0, and the other path is an attenuation circuit, that is, an attenuation circuit such as a π-type attenuation circuit passes between the coupler 50 and the feedback end FBRX of the RF module 10, corresponding to the attenuation value X, and the specific value of X can be designed according to requirements; or, one of the paths is an attenuation circuit corresponding to a first attenuation value X1, and the other path is an attenuation circuit corresponding to a second attenuation value X2, and the specific values ​​of X1 and X2 can be designed according to requirements.

[0062] In actual application, the attenuation unit 70 can switch different paths to select different attenuation gears according to different external ambient temperatures, thereby realizing dynamic adjustment of FBRX loss. For example, when the ambient temperature is higher than a preset temperature threshold, the first path of the attenuation unit 70 can be used between the coupler 50 and the feedback end FBRX of the RF module 10 to reduce FBRXLoss by a first loss value. When the ambient temperature is lower than the preset temperature threshold, the second path of the attenuation unit 70 can be used between the coupler 50 and the feedback end FBRX of the RF module 10 to reduce FBRX Loss by a second loss value.

[0063] like Figure 3aAs shown, the RF circuit includes a RF module 10, a power amplifier PA20, a low noise amplifier LNA30, a duplexer 40, a coupler 50, an antenna 60 and an attenuation unit 70, wherein the RF module 10 may also be called a wireless transceiver WTR, which is used to transmit and receive RF signals, the PA20 is connected to the TX end of the RF module 10, and is used to amplify the signal transmitted from the RF module 10, that is, to increase the transmission power of the RF signal, and the LNA30 is connected to the RX end of the RF module 10, and is used to denoise and amplify the signal received from the antenna 60.

[0064] The TX end and the RX end of the duplexer 40 are connected to the output end of the PA20 and the input end of the LNA30 respectively, and the third end of the duplexer 40 is connected to the first end of the coupler 50. The duplexer 40 is used to isolate the transmission and reception signals in wireless communication, ensuring that the RF circuit can simultaneously transmit and receive signals. The second end and the third end of the coupler 50 are connected to the antenna 60 and the attenuation unit 70 respectively, and can be used for signal transmission, signal isolation, signal enhancement, etc.

[0065] The two ends of the attenuation unit 70 are respectively connected to the FBRX end of the RF module 10 and the coupler 50. The attenuation unit 70 is used to adjust the loss of the feedback path from the coupler 50 to the FBRX end of the RF module 10. The attenuation unit 70 includes a first path and a second path. The first path corresponds to a first attenuation value, and the second path corresponds to a second attenuation value. The first attenuation value is less than the second attenuation value. The first path and the second path work at different ambient temperatures. In this way, different attenuation unit paths can be switched to adjust the feedback path loss under different ambient temperatures, thereby avoiding the problem of excessive PA transmission power.

[0066] Alternatively, if Figure 3b As shown, the attenuation unit 70 includes a first switching switch SW1, a π-type attenuation circuit 71, and a second switching switch SW2. The fixed end of the first switching switch SW1 is connected to the feedback end of the RF module 10, the first movable end of the first switching switch SW1 is connected to the first movable end of the second switching switch SW2, the second movable end of the first switching switch SW1 is connected to the first end of the π-type attenuation circuit 71, the second movable end of the second switching switch SW2 is connected to the second end of the π-type attenuation circuit 71, and the fixed end of the second switching switch SW1 is connected to the second end of the coupler 50;

[0067] Among them, when the fixed end of the first switching switch SW1 is connected to the first moving end and the fixed end of the second switching switch SW2 is connected to the first moving end, the attenuation unit 70 works through the first path; when the fixed end of the first switching switch SW1 is connected to the second moving end and the fixed end of the second switching switch SW2 is connected to the second moving end, the attenuation unit 70 works through the second path.

[0068] That is, in some embodiments, the attenuation unit 70 may be composed of a first switch SW1, a π-type attenuation circuit 71, and a second switch SW2, and form at least two paths, different paths corresponding to different attenuation gears, one of the paths, namely the first path, is a direct path, such as Figure 3b The path ① shown in FIG. 1 corresponds to an attenuation value of 0, and the other path, that is, the second path, passes through a π-type attenuation circuit 71, as shown in FIG. Figure 3b The path ② shown in FIG. 1 corresponds to an attenuation value of X, where X is determined by the device value on the π-type attenuation circuit 71 and can be specifically designed according to actual needs. In one implementation, the π-type attenuation circuit 71 can be Figure 4a The device shown is composed of three resistor components. The first switch SW1 and the second switch SW2 can be single-pole double-throw switches, namely 1P2T switches.

[0069] In this embodiment, when the ambient temperature is higher than the preset temperature threshold, the first switching switch SW1 and the second switching switch SW2 can be controlled to switch to the first path to select a path with a smaller attenuation value. When the ambient temperature is higher than the preset temperature threshold, the first switching switch SW1 and the second switching switch SW2 can be controlled to switch to the first path to select a path with a smaller attenuation value, and a smaller feedback path loss can be selected accordingly. When the ambient temperature is lower than the preset temperature threshold, the first switching switch SW1 and the second switching switch SW2 can be controlled to switch to the second path to select a path with a larger attenuation value, and a larger feedback path loss can be selected accordingly.

[0070] In this way, through this implementation, two attenuation paths with different gears can be formed by two switching switches and a π-type attenuation circuit, thereby realizing dynamic adjustment of the feedback path loss.

[0071] Optionally, the π-type attenuation circuit 71 includes a first component, a second component and a third component, the first end and the second end of the first component are respectively connected to the second moving end of the first switching switch SW1 and the second moving end of the second switching switch SW2, the first end of the second component is connected to the second moving end of the first switching switch SW1, the second end of the second component is grounded, the first end of the third component is connected to the second moving end of the second switching switch SW2, and the second end of the third component is grounded.

[0072] That is, in one embodiment, the π-type attenuation circuit 71 can be composed of a series component and two symmetrical parallel components. For example, Figure 4a As shown, the π-type attenuation circuit 71 is a conventional π-type attenuation circuit, which is composed of a series resistor R1 and two parallel resistors R1 of the same resistance value. If the load impedance and the source impedance are both 50 ohms and the target attenuation value is 1 dB, the following formula is used for calculation:

[0073]

[0074] The resistance values ​​can be obtained as R1=870Ω, R2=6Ω, and the simulation results are as follows Figure 4b As shown, the RF frequency band in the range of 600MHz to 4.2GHz has a stable 1dB loss, which is roughly equivalent to the target attenuation value.

[0075] Through this embodiment, it can be achieved that the second path of the attenuation unit has a desired attenuation value.

[0076] Optionally, the first component includes a first resistor R1 and a second resistor R2, the second component includes a third resistor R3 and a fourth resistor R4, the third component includes a fifth resistor R5 and a sixth resistor R6, and the π-type attenuation circuit 71 further includes a third switch SW3, wherein the first end of the first resistor R1 is connected to the second movable end of the first switch SW1, the second end of the first resistor R1 is connected to the first end of the second resistor R2, the second end of the second resistor R2 is connected to the second movable end of the second switch SW2, the first end of the third resistor R3 is connected to the first end of the first switch SW1, and the third resistor R The second end of the fifth resistor R5 is connected to the second movable end of the second switch SW2, the second end of the fifth resistor R5 is connected to the first end of the sixth resistor R6, the second end of the sixth resistor R6 is grounded, the first end and the second end of the second resistor R2 are respectively connected to the first end and the fourth end of the third switch SW3, the first end and the second end of the fourth resistor R4 are respectively connected to the second end and the third end of the third switch SW3, and the first end and the second end of the sixth resistor R6 are respectively connected to the fifth end and the sixth end of the third switch SW3;

[0077] The second path includes a first subpath and a second subpath;

[0078] Among them, when the fixed end of the first switching switch SW1 is connected to the second movable end, the fixed end of the second switching switch SW2 is connected to the second movable end, the first end of the third switching switch SW3 is connected to the fourth end, the second end and the third end of the third switching switch SW3 are disconnected, and the fifth end and the sixth end of the third switching switch SW3 are disconnected, the attenuation unit 70 works through the first sub-path; when the fixed end of the first switching switch SW1 is connected to the second movable end, the fixed end of the second switching switch SW2 is connected to the second movable end, the first end of the third switching switch SW3 is disconnected, the second end and the third end of the third switching switch SW3 are connected, and the fifth end and the sixth end of the third switching switch SW3 are connected, the attenuation unit 70 works through the second sub-path; the attenuation value corresponding to the first sub-path is less than the attenuation value corresponding to the second sub-path.

[0079] That is, in some embodiments, an improved π-type attenuation circuit 71 can be designed to realize a total of 3 channels and 3 attenuation gears for switching, such as Figure 3b As shown, the improved π-type attenuation circuit 71 is composed of a multi-pole multi-throw switch and 6 resistors. Figure 4a On the basis of the π-type attenuation circuit shown, a resistor is connected in series with the resistor in series and in parallel to the ground. The third switching switch SW3 can be a 3P3T switch, wherein ports 1 and 4 of the switch are respectively connected to both ends of resistor R2, ports 2 and 3 are respectively connected to both ends of resistor R4, ports 5 and 6 are respectively connected to both ends of resistor R6, for controlling whether resistors R2, R4 and R6 are enabled, thereby realizing that the π-type attenuation circuit 71 has two more paths available for switching.

[0080] In this way, in the improved π-type attenuation circuit 71, when the two ends of R2 are connected through the 3P3T switch to make it short-circuited, a sub-path is formed, that is, the resistors R1, R3 and R4, R5 and R6 constitute a π-type attenuation circuit, and the corresponding attenuation value is X1 at this time; when the two ends of R4 and R6 are connected through the 3P3T switch to make the two resistors short-circuited, another sub-path is formed, that is, the resistors R1, R2, R3, R5 constitute a π-type attenuation circuit, and the corresponding attenuation value is X2 at this time, and the attenuation value X1 can be smaller than the attenuation value X2.

[0081] In actual application, when the ambient temperature is lower than the preset temperature threshold, the second sub-path of the maximum attenuation gear can be enabled to ensure that the total feedback path loss read at this time is the largest; when the ambient temperature is higher than the preset temperature threshold, further determine which path to enable based on the difference between the actual transmit power of the current PA and the target power. If the difference between the actual transmit power and the target power does not exceed the attenuation value X1, the first sub-path of the second largest attenuation gear can be enabled to ensure that the total feedback path loss read at this time is suitable to match the current ambient temperature and transmit power; if the difference between the actual transmit power and the target power exceeds the attenuation value X1 but does not exceed X2, the first path of the minimum attenuation gear can be enabled to ensure that the total feedback path loss read at this time is the smallest; if the difference between the actual transmit power and the target power exceeds X2, the first path of the minimum attenuation gear can be enabled to ensure that the total feedback path loss read at this time is the smallest, and then reduce the system transmit power by a certain value, such as reducing it by 1dBm, so as to avoid device failure caused by excessive PA output power.

[0082] In this way, through this implementation, the three-speed attenuation gear of the feedback path can be adjusted, which helps to select the corresponding attenuation gear according to the ambient temperature and actual transmission power conditions, so as to correctly compensate the PA transmission power, thereby avoiding excessive PA transmission power affecting device reliability.

[0083] Furthermore, the resistance values ​​of the first resistor R1 and the second resistor R2 are equal, the resistance values ​​of the third resistor R3 and the fourth resistor R4 are equal, and the resistance values ​​of the fifth resistor R5 and the sixth resistor R6 are equal.

[0084] That is, in some embodiments, the resistance values ​​of R1 and R2 can be designed to be equal, the resistance values ​​of R3 and R4 can be equal, and the resistance values ​​of R5 and R6 can be equal. In this way, it can be ensured that the attenuation value X1 of the first sub-path and the attenuation value X2 of the second sub-path are 2 times, that is, X2=2X1, so that the three-speed design is more balanced, which is conducive to ensuring the adjustment effect of the feedback path loss.

[0085] Combine the following Figure 3b , take the attenuation level of the first sub-channel X1 = 0.5db, and the attenuation level of the second sub-channel X2 = 1db as an example for explanation:

[0086] State 1 is 0dB attenuation position, two 1P2T switches are switched to RF1 port, and path ① is used;

[0087] State 2 is the small attenuation gear, the two 1P2T switches are switched to the RF2 port, and the path ② is taken; assuming that the target attenuation X1 = 0.5dB, the 1st port and the 4th port of the 3P3T switch are connected, the resistor R2 is short-circuited, and the resistance of the series resistor R1 is 3Ω; the 2nd port and the 3rd port of the 3P3T switch are disconnected, and the total resistance of the parallel network R3 and R4 is 1740Ω; the 5th port and the 6th port of the 3P3T switch are disconnected, and the total resistance of the parallel network R5 and R6 is 1740Ω. The effect of the π-type attenuation circuit formed at this time is as follows Figure 5a The simulation results are shown in Figure 5b As shown, there is a stable 0.5dB loss in the RF frequency band within the range of 600MHz to 4.2GHz.

[0088] State three is the large attenuation gear, the two 1P2T switches are switched to the RF2 port, and the path ② is taken; assuming that the target attenuation X2 = 1dB, the 1st and 4th ports of the 3P3T switch are disconnected, and the total resistance of the series positions R1 and R2 is 6Ω; the 2nd and 3rd ports of the 3P3T switch are connected, the resistor R4 is short-circuited, and the resistance of the parallel network R3 is 870Ω; the 5th and 6th ports of the 3P3T switch are connected, the resistor R6 is short-circuited, and the resistance of the parallel network R5 is 870Ω. The effect of the π-type attenuation circuit formed at this time is as follows Figure 4a The simulation results are shown in Figure 4b As shown, there is a stable 1dB loss in the RF frequency band within the range of 600MHz to 4.2GHz.

[0089] In this way, it can be achieved that the π-type attenuation circuit 71 has three adjustable attenuation gears, and the attenuation gear to be switched to can be determined according to the ambient temperature and the difference between the actual transmission power and the target power.

[0090] In an embodiment of the present application, the radio frequency circuit includes: a radio frequency module; a power amplifier PA, the input end of the PA is connected to the transmitting end of the radio frequency module; a low noise amplifier LNA, the output end of the LNA is connected to the receiving end of the radio frequency module; a duplexer, the first end of the duplexer is connected to the output end of the PA, and the second end of the duplexer is connected to the input end of the LNA; a coupler, the first end of the coupler is connected to the third end of the duplexer; an antenna, the antenna is connected to the second end of the coupler; an attenuation unit, the first end of the attenuation unit is connected to the feedback end of the radio frequency module, and the second end of the attenuation unit is connected to the third end of the coupler, the attenuation unit includes a first path and a second path, the attenuation value corresponding to the first path is less than the attenuation value corresponding to the second path; wherein the first path and the second path work at different ambient temperatures respectively. In this way, by adding an attenuation unit with multiple attenuation values ​​to the feedback path, the loss of the feedback path can be dynamically adjusted in a high temperature environment, thereby achieving the purpose of reducing the output power of the PA, avoiding the failure of the device due to excessive output power of the PA, and extending the service life of the equipment.

[0091] The present application also provides an electronic device, including Figure 3a or Figure 3b The radio frequency circuit in the embodiment shown in the figure can be referred to in the related introduction of the above embodiment for its specific implementation, and can achieve the same technical effect, so it will not be described here in detail to avoid repetition.

[0092] See also Figure 6 , Figure 6 A flowchart of a radio frequency control method provided in an embodiment of the present application, such as Figure 1 As shown, the method comprises the following steps:

[0093] Step 601: When it is detected that the ambient temperature is lower than a preset temperature threshold, control the attenuation unit to work using the second path;

[0094] Step 602: When it is detected that the ambient temperature is higher than or equal to the preset temperature threshold, control the attenuation unit to operate using the first path.

[0095] It should be noted that this embodiment is Figure 3a or Figure 3b The specific implementation methods of the method embodiments corresponding to the illustrated embodiments can be found in the aforementioned related introductions, and will not be described again here to avoid repetition.

[0096] Optionally, in the case where the second path includes a first sub-path and a second sub-path, the step 601 includes:

[0097] When it is detected that the ambient temperature is lower than the preset temperature threshold, controlling the attenuation unit to operate using the second sub-path;

[0098] The step 602 includes:

[0099] In the case where it is detected that the ambient temperature is higher than or equal to the preset temperature threshold, determining whether the difference between the actual transmit power and the target power is less than or equal to a first attenuation value, wherein the first attenuation value is an attenuation value corresponding to the first sub-channel;

[0100] When the difference between the actual transmission power and the target power is greater than the first attenuation value, controlling the attenuation unit to operate using the first path;

[0101] The method further comprises:

[0102] When the difference between the actual transmit power and the target power is less than or equal to the first attenuation value, the attenuation unit is controlled to operate using the first sub-path.

[0103] Optionally, when the difference between the actual transmit power and the target power is greater than the first attenuation value, controlling the attenuation unit to operate using the first path includes:

[0104] In the case where the difference between the actual transmit power and the target power is greater than the first attenuation value, determining whether the difference between the actual transmit power and the target power is less than or equal to a second attenuation value, wherein the first attenuation value is an attenuation value corresponding to the second sub-path;

[0105] When the difference between the actual transmission power and the target power is less than or equal to the second attenuation value, controlling the attenuation unit to operate using the first path;

[0106] When the difference between the actual transmit power and the target power is greater than the second attenuation value, the attenuation unit is controlled to work using the first path, and the transmit power of the radio frequency module is reduced by a target value.

[0107] The above optional implementation modes can also be referred to Figure 3a or Figure 3b Related introduction in the illustrated embodiment.

[0108] Combine the following Figure 7 A specific example is used to illustrate the specific implementation of the embodiment of the present application:

[0109] Added Figure 3bAfter the adjustable attenuation circuit is shown, when calibrating the RF parameters, the above three attenuation states all need to be calibrated to establish the corresponding relationship between the PA input power Pin, the gain Gain, the PA output power Pout and the feedback power Pdet.

[0110] like Figure 7 The specific working scenarios are as follows:

[0111] S71: The test starts, the electronic equipment and the communication instrument establish a signaling connection, and the FBRX channel uses the state 3 with the highest attenuation by default;

[0112] S72: Mainboard detection temperature;

[0113] S73: Determine whether the temperature is higher than 50 degrees. If not, continue to operate in state 3.

[0114] S74: If it is higher than 50 degrees, it is necessary to call the temperature compensation parameters of the 70-degree gear, and determine whether the difference between the actual transmission power and the target power is between 0 and X dB (X is the attenuation value of state 2); if not, continue to determine whether the difference is between X and 2XdB (2X is the attenuation value of state 3);

[0115] S75: If the difference is between 0 and X dB, the FBRX channel continues to operate in state 2; if the difference is between X and 2X dB, the FBRX channel continues to operate in state 1; if the difference exceeds 2X, the system automatically reduces the transmission power by 1 dBm, and the FBRX channel continues to operate in state 1. The test ends here.

[0116] The embodiment of the present application improves the FBRX feedback path and adds a multi-stage π-type attenuation circuit to the path, so as to dynamically adjust the FBRX path Loss under high temperature conditions, thereby achieving the purpose of reducing the PA output power, avoiding device failure due to excessive PA output power, and increasing the service life of mobile electronic devices.

[0117] The RF control method provided in the embodiment of the present application may be executed by a RF control device. In the embodiment of the present application, the RF control device provided in the embodiment of the present application is described by taking the RF control method executed by the RF control device as an example.

[0118] See also Figure 8 , Figure 8 A schematic diagram of the structure of a radio frequency control device provided in an embodiment of the present application, which is arranged in the Figure 3a or Figure 3b Electronic devices of the RF circuit shown, such as Figure 8 As shown, the radio frequency control device 800 includes:

[0119] A first control module 801 is used to control the attenuation unit to work using the second path when it is detected that the ambient temperature is lower than a preset temperature threshold;

[0120] The second control module 802 is used to control the attenuation unit to work using the first path when it is detected that the ambient temperature is higher than or equal to the preset temperature threshold.

[0121] Optionally, in the case where the second circuit includes a first sub-path and a second sub-path, the first control module 801 is used to control the attenuation unit to work using the second sub-path when it is detected that the ambient temperature is lower than the preset temperature threshold;

[0122] The second control module 802 includes:

[0123] a judging unit, configured to judge whether a difference between an actual transmission power and a target power is less than or equal to a first attenuation value when it is detected that the ambient temperature is higher than or equal to the preset temperature threshold, wherein the first attenuation value is an attenuation value corresponding to the first sub-channel;

[0124] A first control unit, configured to control the attenuation unit to work using the first path when the difference between the actual transmit power and the target power is greater than the first attenuation value;

[0125] The second control unit is configured to control the attenuation unit to operate using the first sub-path when the difference between the actual transmit power and the target power is less than or equal to the first attenuation value.

[0126] Optionally, the first control unit is used for:

[0127] In the case where the difference between the actual transmit power and the target power is greater than the first attenuation value, determining whether the difference between the actual transmit power and the target power is less than or equal to a second attenuation value, wherein the first attenuation value is an attenuation value corresponding to the second sub-path;

[0128] When the difference between the actual transmission power and the target power is less than or equal to the second attenuation value, controlling the attenuation unit to operate using the first path;

[0129] When the difference between the actual transmit power and the target power is greater than the second attenuation value, the attenuation unit is controlled to work using the first path, and the transmit power of the radio frequency module is reduced by a target value.

[0130] In the embodiment of the present application, the RF control device 800 controls the attenuation unit to work using the second path when it detects that the ambient temperature is lower than the preset temperature threshold; and controls the attenuation unit to work using the first path when it detects that the ambient temperature is higher than or equal to the preset temperature threshold. In this way, since an attenuation unit with multiple attenuation values ​​is added to the feedback path of the RF circuit, the loss Loss of the feedback path can be dynamically adjusted in a high temperature environment, thereby achieving the purpose of reducing the PA output power, avoiding device failure caused by excessive PA output power, and extending the service life of the equipment.

[0131] The radio frequency control device in the embodiment of the present application can be an electronic device, or a component in the electronic device, such as an integrated circuit or a chip. The electronic device can be a terminal, or it can be other devices other than a terminal. Exemplarily, the electronic device can be a mobile phone, a tablet computer, a laptop computer, a PDA, a vehicle-mounted electronic device, a mobile Internet device (Mobile Internet Device, MID), an augmented reality (augmented reality, AR) / virtual reality (virtual reality, VR) device, a robot, a wearable device, an ultra-mobile personal computer (ultra-mobile personal computer, UMPC), a netbook or a personal digital assistant (personal digital assistant, PDA), etc., and can also be a server, a network attached storage (Network Attached Storage, NAS), a personal computer (personal computer, PC), a television (television, TV), a teller machine or a self-service machine, etc., which is not specifically limited in the embodiment of the present application.

[0132] The radio frequency control device in the embodiment of the present application may be a device having an operating system. The operating system may be an Android operating system, an iOS operating system, or other possible operating systems, which are not specifically limited in the embodiment of the present application.

[0133] The radio frequency control device provided in the embodiment of the present application can achieve Figure 6 The various processes implemented by the method embodiment can achieve the same technical effect, and to avoid repetition, they will not be described here.

[0134] Alternatively, if Fig. 9As shown, an embodiment of the present application also provides an electronic device 900, including a processor 901 and a memory 902, and the memory 902 stores a program or instruction that can be run on the processor 901. When the program or instruction is executed by the processor 901, the various steps of the above-mentioned radio frequency control method embodiment are implemented, and the same technical effect can be achieved. To avoid repetition, it will not be repeated here.

[0135] It should be noted that the electronic devices in the embodiments of the present application include the mobile electronic devices and non-mobile electronic devices mentioned above.

[0136] Fig.10 A schematic diagram of the hardware structure of an electronic device to implement an embodiment of the present application.

[0137] The electronic device 1000 includes but is not limited to: a radio frequency unit 1001, a network module 1002, an audio output unit 1003, an input unit 1004, a sensor 1005, a display unit 1006, a user input unit 1007, an interface unit 1008, a memory 1009, and a processor 1010. The radio frequency unit 1001 includes Figure 3a or Figure 3b The RF circuit shown.

[0138] Those skilled in the art will appreciate that the electronic device 1000 may also include a power source (such as a battery) for supplying power to each component, and the power source may be logically connected to the processor 1010 through a power management system, thereby implementing functions such as managing charging, discharging, and power consumption management through the power management system. Fig.10 The electronic device structure shown in the figure does not constitute a limitation on the electronic device. The electronic device may include more or fewer components than shown in the figure, or combine certain components, or arrange the components differently, which will not be described in detail here.

[0139] The processor 1010 is configured to:

[0140] When it is detected that the ambient temperature is lower than a preset temperature threshold, controlling the attenuation unit to operate using the second path;

[0141] When it is detected that the ambient temperature is higher than or equal to the preset temperature threshold, the attenuation unit is controlled to operate using the first path.

[0142] Optionally, the processor 1010 is further configured to:

[0143] When it is detected that the ambient temperature is lower than the preset temperature threshold, controlling the attenuation unit to operate using the second sub-path;

[0144] In the case where it is detected that the ambient temperature is higher than or equal to the preset temperature threshold, determining whether the difference between the actual transmit power and the target power is less than or equal to a first attenuation value, wherein the first attenuation value is an attenuation value corresponding to the first sub-channel;

[0145] When the difference between the actual transmission power and the target power is greater than the first attenuation value, controlling the attenuation unit to operate using the first path;

[0146] When the difference between the actual transmit power and the target power is less than or equal to the first attenuation value, the attenuation unit is controlled to operate using the first sub-path.

[0147] Optionally, the processor 1010 is further configured to:

[0148] In the case where the difference between the actual transmit power and the target power is greater than the first attenuation value, determining whether the difference between the actual transmit power and the target power is less than or equal to a second attenuation value, wherein the first attenuation value is an attenuation value corresponding to the second sub-path;

[0149] When the difference between the actual transmission power and the target power is less than or equal to the second attenuation value, controlling the attenuation unit to operate using the first path;

[0150] When the difference between the actual transmit power and the target power is greater than the second attenuation value, the attenuation unit is controlled to work using the first path, and the transmit power of the radio frequency module is reduced by a target value.

[0151] It should be understood that in the embodiment of the present application, the input unit 1004 may include a graphics processor (Graphics Processing Unit, GPU) 10041 and a microphone 10042, and the graphics processor 10041 processes the image data of the static picture or video obtained by the image capture device (such as a camera) in the video capture mode or the image capture mode. The display unit 1006 may include a display panel 10061, and the display panel 10061 may be configured in the form of a liquid crystal display, an organic light emitting diode, etc. The user input unit 1007 includes a touch panel 10071 and at least one of other input devices 10072. The touch panel 10071 is also called a touch screen. The touch panel 10071 may include two parts: a touch detection device and a touch controller. Other input devices 10072 may include, but are not limited to, a physical keyboard, function keys (such as volume control keys, switch keys, etc.), a trackball, a mouse, and a joystick, which will not be repeated here.

[0152] The memory 1009 can be used to store software programs and various data. The memory 1009 may mainly include a first storage area for storing programs or instructions and a second storage area for storing data, wherein the first storage area may store an operating system, an application program or instructions required for at least one function (such as a sound playback function, an image playback function, etc.), etc. In addition, the memory 1009 may include a volatile memory or a non-volatile memory, or the memory 1009 may include both volatile and non-volatile memories. Among them, the non-volatile memory may be a read-only memory (ROM), a programmable read-only memory (PROM), an erasable programmable read-only memory (EPROM), an electrically erasable programmable read-only memory (EEPROM), or a flash memory. The volatile memory may be a random access memory (RAM), a static random access memory (SRAM), a dynamic random access memory (DRAM), a synchronous dynamic random access memory (SDRAM), a double data rate synchronous dynamic random access memory (DDRSDRAM), an enhanced synchronous dynamic random access memory (ESDRAM), a synchronous link dynamic random access memory (SLDRAM) and a direct memory bus random access memory (DRRAM). The memory 1009 in the embodiment of the present application includes but is not limited to these and any other suitable types of memory.

[0153] The processor 1010 may include one or more processing units; optionally, the processor 1010 integrates an application processor and a modem processor, wherein the application processor mainly processes operations related to an operating system, a user interface, and application programs, and the modem processor mainly processes wireless communication signals, such as a baseband processor. It is understandable that the modem processor may not be integrated into the processor 1010.

[0154] An embodiment of the present application also provides a readable storage medium, on which a program or instruction is stored. When the program or instruction is executed by a processor, each process of the above-mentioned radio frequency control method embodiment is implemented, and the same technical effect can be achieved. To avoid repetition, it will not be repeated here.

[0155] The processor is the processor in the electronic device described in the above embodiment. The readable storage medium includes a computer readable storage medium, such as a computer read-only memory ROM, a random access memory RAM, a magnetic disk or an optical disk.

[0156] An embodiment of the present application further provides a chip, which includes a processor and a communication interface, the communication interface is coupled to the processor, and the processor is used to run programs or instructions to implement the various processes of the above-mentioned radio frequency control method embodiment, and can achieve the same technical effect. To avoid repetition, it will not be repeated here.

[0157] It should be understood that the chip mentioned in the embodiments of the present application can also be called a system-level chip, a system chip, a chip system or a system-on-chip chip, etc.

[0158] An embodiment of the present application provides a computer program product, which is stored in a storage medium. The program product is executed by at least one processor to implement the various processes of the above-mentioned radio frequency control method embodiment, and can achieve the same technical effect. To avoid repetition, it will not be repeated here.

[0159] It should be noted that, in this article, the terms "comprise", "include" or any other variant thereof are intended to cover non-exclusive inclusion, so that the process, method, article or device including a series of elements includes not only those elements, but also includes other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the sentence "comprise one..." do not exclude the presence of other identical elements in the process, method, article or device including the element. In addition, it should be pointed out that the scope of the methods and devices in the embodiments of the present application is not limited to performing functions in the order shown or discussed, and may also include performing functions in a substantially simultaneous manner or in reverse order according to the functions involved, for example, the described method may be performed in an order different from that described, and various steps may also be added, omitted, or combined. In addition, the features described with reference to certain examples may be combined in other examples.

[0160] Through the description of the above implementation methods, those skilled in the art can clearly understand that the above-mentioned embodiment methods can be implemented by means of software plus a necessary general hardware platform, and of course by hardware, but in many cases the former is a better implementation method. Based on such an understanding, the technical solution of the present application, or the part that contributes to the prior art, can be embodied in the form of a computer software product, which is stored in a storage medium (such as ROM / RAM, a disk, or an optical disk), and includes a number of instructions for a terminal (which can be a mobile phone, a computer, a server, or a network device, etc.) to execute the methods described in each embodiment of the present application.

[0161] The embodiments of the present application are described above in conjunction with the accompanying drawings, but the present application is not limited to the above-mentioned specific implementation methods. The above-mentioned specific implementation methods are merely illustrative and not restrictive. Under the guidance of the present application, ordinary technicians in this field can also make many forms without departing from the purpose of the present application and the scope of protection of the claims, all of which are within the protection of the present application.

Claims

1. A radio frequency circuit, characterized in that: include: RF module; A power amplifier PA, wherein an input end of the PA is connected to a transmitting end of the RF module; A low noise amplifier LNA, wherein an output end of the LNA is connected to a receiving end of the radio frequency module; a duplexer, wherein a first end of the duplexer is connected to an output end of the PA, and a second end of the duplexer is connected to an input end of the LNA; a coupler, wherein a first end of the coupler is connected to a third end of the duplexer; an antenna connected to the second end of the coupler; an attenuation unit, wherein a first end of the attenuation unit is connected to a feedback end of the radio frequency module, a second end of the attenuation unit is connected to a third end of the coupler, the attenuation unit comprises a first path and a second path, and an attenuation value corresponding to the first path is smaller than an attenuation value corresponding to the second path; The first passage and the second passage operate at different ambient temperatures respectively.

2. The radio frequency circuit according to claim 1, characterized in that: The attenuation unit includes a first switch, a π-type attenuation circuit, and a second switch, wherein a fixed end of the first switch is connected to a feedback end of the RF module, a first movable end of the first switch is connected to a first movable end of the second switch, a second movable end of the first switch is connected to a first end of the π-type attenuation circuit, a second movable end of the second switch is connected to a second end of the π-type attenuation circuit, and a fixed end of the second switch is connected to a second end of the coupler; Among them, when the fixed end of the first switching switch is connected to the first moving end and the fixed end of the second switching switch is connected to the first moving end, the attenuation unit works through the first path; when the fixed end of the first switching switch is connected to the second moving end and the fixed end of the second switching switch is connected to the second moving end, the attenuation unit works through the second path.

3. The radio frequency circuit according to claim 2, characterized in that: The π-type attenuation circuit includes a first component, a second component and a third component. The first end and the second end of the first component are respectively connected to the second moving end of the first switch and the second moving end of the second switch. The first end of the second component is connected to the second moving end of the first switch, and the second end of the second component is grounded. The first end of the third component is connected to the second moving end of the second switch, and the second end of the third component is grounded.

4. The radio frequency circuit according to claim 3, characterized in that: The first component includes a first resistor and a second resistor, the second component includes a third resistor and a fourth resistor, the third component includes a fifth resistor and a sixth resistor, and the π-type attenuation circuit also includes a third switch, wherein the first end of the first resistor is connected to the second movable end of the first switch, the second end of the first resistor is connected to the first end of the second resistor, the second end of the second resistor is connected to the second movable end of the second switch, the first end of the third resistor is connected to the first end of the first switch, the second end of the third resistor is connected to the first end of the fourth resistor, the second end of the fourth resistor is grounded, the first end of the fifth resistor is connected to the second movable end of the second switch, the second end of the fifth resistor is connected to the first end of the sixth resistor, the second end of the sixth resistor is grounded, the first end and the second end of the second resistor are respectively connected to the first end and the fourth end of the third switch, the first end and the second end of the fourth resistor are respectively connected to the second end and the third end of the third switch, and the first end and the second end of the sixth resistor are respectively connected to the fifth end and the sixth end of the third switch; The second path includes a first subpath and a second subpath; Wherein, when the fixed end of the first switching switch is connected to the second movable end, the fixed end of the second switching switch is connected to the second movable end, the first end of the third switching switch is connected to the fourth end, the second end and the third end of the third switching switch are disconnected, and the fifth end and the sixth end of the third switching switch are disconnected, the attenuation unit works through the first sub-pathway; when the fixed end of the first switching switch is connected to the second movable end, the fixed end of the second switching switch is connected to the second movable end, the first end of the third switching switch is disconnected, the second end and the third end of the third switching switch are connected, and the fifth end and the sixth end of the third switching switch are connected, the attenuation unit works through the second sub-pathway; the attenuation value corresponding to the first sub-pathway is less than the attenuation value corresponding to the second sub-pathway.

5. The radio frequency circuit according to claim 4, characterized in that: The resistance values ​​of the first resistor and the second resistor are equal, the resistance values ​​of the third resistor and the fourth resistor are equal, and the resistance values ​​of the fifth resistor and the sixth resistor are equal.

6. An electronic device, characterized in that: The invention comprises the radio frequency circuit according to any one of claims 1 to 5.

7. A radio frequency control method, characterized in that: Executed by the electronic device of claim 6, the method comprising: When it is detected that the ambient temperature is lower than a preset temperature threshold, controlling the attenuation unit to operate using the second path; When it is detected that the ambient temperature is higher than or equal to the preset temperature threshold, the attenuation unit is controlled to operate using the first path.

8. The method according to claim 7, characterized in that In the case where the radio frequency circuit is the radio frequency circuit according to claim 4, when it is detected that the ambient temperature is lower than a preset temperature threshold, controlling the attenuation unit to operate using the second path comprises: When it is detected that the ambient temperature is lower than the preset temperature threshold, controlling the attenuation unit to operate using the second sub-path; When it is detected that the ambient temperature is higher than or equal to the preset temperature threshold, controlling the attenuation unit to operate using the first path includes: In the case where it is detected that the ambient temperature is higher than or equal to the preset temperature threshold, determining whether the difference between the actual transmit power and the target power is less than or equal to a first attenuation value, wherein the first attenuation value is an attenuation value corresponding to the first sub-channel; When the difference between the actual transmission power and the target power is greater than the first attenuation value, controlling the attenuation unit to operate using the first path; The method further comprises: When the difference between the actual transmit power and the target power is less than or equal to the first attenuation value, the attenuation unit is controlled to operate using the first sub-path.

9. The method according to claim 8, characterized in that When the difference between the actual transmission power and the target power is greater than the first attenuation value, controlling the attenuation unit to use the first path to operate includes: In the case where the difference between the actual transmit power and the target power is greater than the first attenuation value, determining whether the difference between the actual transmit power and the target power is less than or equal to a second attenuation value, wherein the first attenuation value is an attenuation value corresponding to the second sub-path; When the difference between the actual transmission power and the target power is less than or equal to the second attenuation value, controlling the attenuation unit to operate using the first path; When the difference between the actual transmit power and the target power is greater than the second attenuation value, the attenuation unit is controlled to work using the first path, and the transmit power of the radio frequency module is reduced by a target value.

10. A radio frequency control device, characterized in that: In the electronic device as claimed in claim 6, the radio frequency control device comprises: A first control module, configured to control the attenuation unit to operate using the second path when detecting that the ambient temperature is lower than a preset temperature threshold; The second control module is used to control the attenuation unit to work using the first path when it is detected that the ambient temperature is higher than or equal to the preset temperature threshold.

11. An electronic device, characterized in that: It comprises a processor and a memory, wherein the memory stores a program or instruction that can be run on the processor, and when the program or instruction is executed by the processor, the steps of the radio frequency control method according to any one of claims 7 to 9 are implemented.

12. A readable storage medium, characterized in that: The readable storage medium stores a program or instruction, and when the program or instruction is executed by the processor, the steps of the radio frequency control method according to any one of claims 7 to 9 are implemented.

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