Packaging shell, packaging structure and electronic equipment

Abstract

The invention discloses a packaging shell, a packaging structure and electronic equipment, and relates to the technical field of semiconductors, the packaging shell comprises a main shell and a terminal module, one side of the main shell is provided with an opening, the terminal module is arranged on the side, opposite to the opening, of the main shell and penetrates through the main shell, one end of the terminal module is exposed out of the main shell to form a packaging bonding pad, and the other end of the terminal module is connected with the packaging bonding pad. One end of the terminal module is used for being electrically connected with an external device, and the other end of the terminal module extends towards the opening and is used for being electrically connected with a circuit board of the packaging structure; according to the technical scheme, the packaging shell serves as a welding interface, the structural design of the packaging shell is relatively compact, the assembling process is simple, quality control is relatively stable, the product yield is high, and the packaging shell is suitable for mass production.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor technology, and in particular to a packaging shell, a packaging structure and an electronic device. Background Art

[0002] At present, the sensor packaging structure usually includes a circuit board, a chip mounted on the surface of the circuit board, and a packaging shell mounted on the circuit board and covering the periphery of the chip, wherein the packaging shell plays a role in protecting the chip from the external environment. In application design, the circuit board is usually used as the welding interface, that is, the pads are arranged on the outer surface of the circuit board. However, the circuit board is usually a multi-layer board structure, which requires pre-assembly and welding of the multi-layer board. The assembly quality of the multi-layer board is unstable, and the product yield is relatively low. Summary of the invention

[0003] The main purpose of the present invention is to provide a packaging shell, a packaging structure and an electronic device, aiming to improve the yield of the product.

[0004] To achieve the above-mentioned purpose, the present invention provides a packaging shell, which is applied to a packaging structure, and the packaging shell includes:

[0005] a main housing having an opening on one side; and

[0006] A terminal module is arranged on a side of the main shell opposite to the opening and passes through the main shell, one end of the terminal module is exposed from the main shell to form a packaging pad for electrical connection with an external device, and the other end of the terminal module extends toward the opening for electrical connection with the circuit board of the packaging structure.

[0007] In one embodiment, the main shell is a metal shell, and the terminal module includes a conductive terminal and an insulating member, the insulating member is arranged on a side of the main shell opposite to the opening and passes through the main shell, the conductive terminal is arranged on the insulating member and passes through the insulating member, one end of the conductive terminal is exposed from the main shell to form the packaging pad, and the other end extends toward the opening.

[0008] In one embodiment, the insulating member is a sheet-like structure, and a plurality of assembly holes are arranged at intervals on the insulating member; a plurality of the conductive terminals are arranged, and the plurality of the conductive terminals are correspondingly assembled in the plurality of the assembly holes.

[0009] In one embodiment, the insulating member and the plurality of conductive terminals are an integral structure.

[0010] In one embodiment, the insulating member is a tubular structure, and a plurality of the insulating members are provided. The plurality of insulating members are spaced apart on a side of the main shell opposite to the opening, and all pass through the main shell. A plurality of the conductive terminals are provided, and the plurality of conductive terminals are correspondingly assembled in the plurality of insulating members.

[0011] In one embodiment, the plurality of conductive terminals are located on the same side of the main housing; or, the plurality of conductive terminals are located on different sides of the main housing.

[0012] In one embodiment, the main housing is further provided with a through hole penetrating two opposite surfaces; and / or an end portion of the terminal module extending toward the opening is flush with a side of the opening of the main housing.

[0013] The present invention also proposes a packaging structure, which includes: a circuit board and a packaging shell as described above, wherein the opening side of the packaging shell is mounted on the circuit board, and one end of the terminal module of the packaging shell extending toward the opening is electrically connected to the circuit board.

[0014] In one embodiment, a connection solder joint is provided on a surface of the circuit board facing the packaging shell corresponding to the terminal module, and an end of the terminal module extending toward the opening is electrically connected to the connection solder joint; and / or,

[0015] An external solder pad is also provided on the surface of the circuit board facing away from the packaging shell. The external solder pad is electrically connected to the connection solder point and is used to be electrically connected to an external device.

[0016] The packaging shell provided by the present invention includes a main shell and a terminal module, the main shell has an opening on one side, the terminal module is arranged on a side of the main shell opposite to the opening and penetrates the main shell, one end of the terminal module is exposed from the main shell to form a packaging pad for electrically connecting to an external device, and the other end of the terminal module extends toward the opening for electrically connecting to a circuit board of the packaging structure. When the packaging shell of the present invention is applied to the packaging structure of the sensor, the opening side of the packaging shell is mounted on the circuit board, wherein the end of the terminal module extending toward the opening is electrically connected to the circuit board, and the conductive terminal is exposed from one end of the main shell to form a packaging pad for electrically connecting to an external device, meeting the assembly requirements, that is, the present invention uses the packaging shell as a welding interface, the structural design of the packaging shell is relatively compact, and the assembly process is simple, the quality control is relatively stable, the product yield is high, and it is suitable for mass production. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on the structures shown in these drawings without paying creative work.

[0018] Figure 1 A schematic structural diagram of an embodiment of a packaging shell provided by the present invention;

[0019] Figure 2 for Figure 1 A schematic diagram of the structure of the packaging shell from another perspective;

[0020] Figure 3 A schematic structural diagram of another embodiment of the packaging housing provided by the present invention;

[0021] Figure 4 for Figure 3 A schematic diagram of the structure of the packaging shell from another perspective;

[0022] Figure 5 A schematic structural diagram of another embodiment of the packaging shell provided by the present invention;

[0023] Figure 6 for Figure 5 A schematic diagram of the structure of the packaging shell from another perspective;

[0024] Figure 7 A schematic structural diagram of another embodiment of the packaging shell provided by the present invention;

[0025] Figure 8 for Figure 7 A schematic diagram of the structure of the packaging shell from another perspective;

[0026] Fig. 9 A schematic diagram of the structure of an embodiment of a packaging structure provided by the present invention;

[0027] Fig.10 for Fig. 9 A schematic diagram of the structure of the circuit board from one perspective in the packaging structure;

[0028] Fig.11 for Fig. 9 Schematic diagram of the structure of the circuit board in the packaging structure from another perspective.

[0029] Description of Figure Numbers:

[0030] 100, packaging shell; 10, main shell; 11, through hole; 20, insulating member; 30, conductive terminal; 200, circuit board; 201, connecting solder joint; 202, external solder pad.

[0031] The realization of the purpose, functional features and advantages of the present invention will be further explained in conjunction with embodiments and with reference to the accompanying drawings. DETAILED DESCRIPTION

[0032] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0033] It should be noted that if the embodiments of the present invention involve directional indications (such as up, down, left, right, front, back, etc.), the directional indications are only used to explain the relative position relationship, movement status, etc. between the components in a certain specific posture. If the specific posture changes, the directional indication will also change accordingly.

[0034] In addition, if there are descriptions involving "first", "second", etc. in the embodiments of the present invention, the descriptions of "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of technical features indicated. Therefore, the features limited to "first" and "second" may explicitly or implicitly include at least one of the features. In addition, if "and / or" or "and / or" appears in the full text, its meaning includes three parallel solutions. Taking "A and / or B" as an example, it includes solution A, solution B, or solutions that satisfy both A and B. In addition, the technical solutions between the various embodiments can be combined with each other, but it must be based on the ability of ordinary technicians in this field to implement. When the combination of technical solutions is contradictory or cannot be implemented, it should be deemed that such combination of technical solutions does not exist and is not within the scope of protection required by the present invention.

[0035] In view of the technical problems of unstable quality and low product yield caused by using a circuit board as a welding interface, the present invention provides a packaging shell to improve the product yield.

[0036] See also Figure 1 and Figure 2 In one embodiment of the present invention, the packaging shell 100 includes a main shell 10 and a terminal module. The main shell 10 has an opening on one side. The terminal module is arranged on the side of the main shell 10 opposite to the opening and penetrates the main shell 10. One end of the terminal module is exposed from the main shell 10 to form a packaging pad for electrical connection with an external device. The other end of the terminal module extends toward the opening for electrical connection with the circuit board 200 of the packaging structure.

[0037] Specifically, the main housing 10 is roughly a square housing or a housing of other reasonable shapes. The material of the main housing 10 can be selected from metal materials, such as iron, Kovar, stainless steel, copper, etc., and can be made by mechanical stamping or stretching. Making the main housing 10 as a metal housing can achieve a better electromagnetic shielding effect. Of course, if the sensor does not have high requirements for electromagnetic shielding, the main housing 10 can also be selected from a non-metallic injection molding housing, and the material can be selected from engineering plastics (such as ABS, LCP). When the main housing 10 is a metal housing, the terminal module includes a conductive portion (i.e., a conductive terminal 30) and an insulating portion (i.e., an insulating member 20). The conductive terminal 30 is roughly in the shape of a long strip, and can be selected from a cylindrical, prismatic, or other reasonable shapes. The insulating member 20 is used for electrical isolation of the conductive terminal 30 and the metal housing to prevent short circuits. The specific structure and size of the insulating member 20 are not limited, as long as it can play an electrical isolation role between the conductive terminal 30 and the metal housing. When the main housing 10 adopts a non-metallic injection molding housing, the terminal module can only include a conductive portion (i.e., a conductive terminal 30). Of course, in order to facilitate the assembly operation of the conductive terminal 30, the terminal module may also include an insulating member 20 for assembling the conductive terminal 30, that is, the conductive terminal 30 is assembled to the main housing 10 through the insulating member 20. One specific implementation is: the conductive terminal 30 is first inserted into the assembly hole of the insulating member 20, and then the insulating member 20 with the conductive terminal 30 is assembled together into the mounting hole on the side opposite to the opening of the main housing 10. After the assembly is completed, the insulating member 20 penetrates the two opposite surfaces of the main housing 10, and one end of the conductive terminal 30 is exposed on the outer surface of the main housing 10 to form a packaging pad. The packaging pad is electrically connected to an external device when used, and the other end of the conductive terminal 30 extends toward the opening. When applied to the packaging structure of the sensor, the end of the conductive terminal 30 facing the opening is electrically connected to the circuit board of the packaging structure.

[0038] It should be noted that the conductive terminal 30 may be made of iron, kovar, iron-nickel alloy or other metal materials. The insulating member 20 may be made of ceramic, glass, engineering plastic or other insulating materials.

[0039] When the packaging shell 100 of the present invention is applied to the packaging structure of a sensor, the opening side of the packaging shell 100 is mounted on the circuit board 200, wherein the end of the terminal module extending toward the opening is electrically connected to the circuit board 200, and the end of the terminal module exposed to the main shell 10 forms a packaging pad for electrically connecting to external devices to meet assembly requirements. That is, the present invention uses the packaging shell 100 as a welding interface, the structural design of the packaging shell 100 is relatively compact, the assembly process is simple, the quality control is relatively stable, the product yield is high, and it is suitable for mass production.

[0040] Since the material of the circuit board 200 is relatively soft, using the circuit board 200 as a welding interface usually results in performance deviation or failure due to stress. However, the embodiment of the present invention uses the packaging shell 100 as a welding interface. The packaging shell 100 has a higher hardness, especially a metal shell, which has a higher welding strength, better reliability, and is more suitable for mass production.

[0041] Please refer again Figure 1 and Figure 2 In one embodiment of the present invention, the main shell 10 is a metal shell, and the terminal module includes a conductive terminal 30 and an insulating member 20. The insulating member 20 is arranged on a side of the main shell 10 opposite to the opening and passes through the main shell 10. The conductive terminal 30 is arranged on the insulating member 20 and passes through the insulating member 20. One end of the conductive terminal 30 is exposed from the main shell 10 to form a packaging pad, and the other end extends toward the opening.

[0042] In this embodiment, since the main housing 10 is a metal housing, in order to avoid short circuit caused by electrical conduction between the conductive terminal 30 and the metal housing, an insulating ring is provided to insulate and isolate the metal housing and the conductive terminal 30. Specifically, the insulating member 20 is provided with an assembly hole (not shown), which passes through two opposite surfaces of the insulating member 20. The radial dimension of the assembly hole is matched with the radial dimension of the conductive terminal 30. During assembly, the conductive terminal 30 can be fixed in the assembly hole. After assembly, the two ends of the conductive terminal 30 are respectively exposed on two opposite surfaces of the insulating member 20. Among them, the length of the conductive terminal 30 can be determined according to the product assembly requirements. The main housing 10 includes a top and a side portion surrounding the edge of the top. The top is opposite to the opening. A mounting hole (not shown) is provided on the top. The mounting hole passes through two opposite surfaces of the top. The radial dimension of the mounting hole matches the radial dimension of the insulating member 20 in the terminal module. When assembling, the insulating member 20 (i.e., the terminal module) with the conductive terminal 30 is fixed in the mounting hole. After the assembly is completed, the opposite surfaces of the insulating member 20 are respectively exposed to the opposite surfaces of the top. That is, the size of the insulating member 20 is larger than the size of the top in the direction perpendicular to the top. At the same time, one end of the conductive terminal 30 is exposed at the top of the main housing 10 to form a packaging pad, and the other end extends toward the opening. That is, the length of the conductive terminal 30 extends in a direction perpendicular to the top.

[0043] During assembly, the conductive terminal 30 and the insulating part 20 can be assembled first to obtain a terminal module, and then the terminal module can be assembled to the main shell 10. The modular assembly method can improve the assembly accuracy, simplify the assembly process, and improve the assembly efficiency. At the same time, it can enhance the structural stability of the overall module, thereby improving the reliability of the packaging structure. In addition, it is convenient for quality control, improves design flexibility, enhances product versatility, and facilitates maintenance and replacement, which is suitable for large-scale, high-performance, and low-cost production.

[0044] Among them, the fixed connection method between the conductive terminal 30 and the insulating part 20 can be a high-temperature sintering assembly connection, glue bonding or other reasonable connection methods; the fixed connection method between the insulating part 20 (i.e., the terminal module) with the conductive terminal 30 and the main shell 10 can be a high-temperature sintering assembly connection, resistance hot pressing welding, glue bonding or other reasonable connection methods.

[0045] It should be noted that when the main shell 10 is a metal shell, the stamped surface of the main shell 10 needs to be processed. Specifically, the surface of the main shell 10 is nickel-plated, gold-plated or nickel-gold-plated. Of course, polishing, sandblasting, water washing, pickling and other treatments can also be performed. The specific operations of the above surface treatments are all routine operations and will not be repeated here.

[0046] Please refer again Figure 1 and Figure 2 In one embodiment of the present invention, the insulating member 20 is a sheet-like structure, and a plurality of assembly holes are arranged at intervals on the insulating member 20; a plurality of conductive terminals 30 are arranged, and the plurality of conductive terminals 30 are correspondingly assembled in the plurality of assembly holes.

[0047] Specifically, the insulating member 20 is a long sheet structure, the shape of the assembly hole is the same as the cross-sectional outer contour shape of the conductive terminal 30, and the radial dimension of the assembly hole is adapted to the radial dimension of the conductive terminal 30, and multiple assembly holes are spaced apart and distributed along the length direction of the insulating member 20, and can be evenly distributed, and multiple assembly holes are used to assemble multiple conductive terminals 30, that is, the number of assembly holes is the same as the number of conductive terminals 30, and the specific number can be selected to be 3-6.

[0048] The embodiment of the present invention rationally arranges multiple conductive terminals 30, which can effectively transmit multiple signals, reduce signal interference, and disperse the stress of package welding to improve package reliability. In addition, multiple conductive terminals 30 and insulating members 20 form a modular structure, which can simplify the assembly process, improve assembly efficiency, and improve product versatility to meet the needs of different application scenarios.

[0049] The packaging shell 100 of the embodiment of the present invention has various conduction solutions, which can realize the electrical interconnection of the three-dimensional structure, thereby realizing a small size and various wiring solutions.

[0050] It should be noted that, in the embodiment of the present invention, since the plurality of conductive terminals 30 and the insulating member 20 are assembled into a module, the plurality of conductive terminals 30 are arranged on the same side of the top of the main shell 10, and the assembly operation is relatively simple. At the same time, this design can reduce the complexity of wiring inside the packaging structure and facilitate design and layout.

[0051] Optionally, the insulating member 20 and the plurality of conductive terminals 30 are an integral structure. Specifically, the insulating member 20 and the plurality of conductive terminals 30 can be assembled into an integral structure by high temperature sintering, thereby the arrangement stability of the conductive terminals 30 is high, thereby improving the electrical interconnection reliability of the package housing 100.

[0052] In the embodiment of the present invention, the insulating member 20 and the plurality of conductive terminals 30 are designed as an integrated module, which can simplify the assembly process and improve the assembly efficiency.

[0053] See also Figure 3 and Figure 4 The insulating member 20 is a cylindrical structure, and a plurality of insulating members 20 are provided. The plurality of insulating members 20 are spaced apart on a side of the main housing 10 opposite to the opening, and all penetrate the main housing 10 ; a plurality of conductive terminals 30 are provided, and the plurality of conductive terminals 30 are correspondingly assembled in the plurality of insulating members 20 .

[0054] Specifically, the insulating member 20 is a cylindrical structure, and an assembly space is formed inside. The radial dimension of the assembly space is matched with the radial dimension of the conductive terminal 30. The conductive terminal 30 is assembled in the assembly space inside the insulating member 20. After assembly, both ends of the conductive terminal 30 are exposed in the assembly space. Correspondingly, a plurality of mounting holes penetrating two opposite surfaces are arranged at intervals on the top of the main housing 10. The radial dimension of the mounting holes is matched with the radial dimension of the insulating member 20. The plurality of insulating members 20 are correspondingly assembled into the plurality of mounting holes. After assembly, the opposite ends of the insulating member 20 are respectively exposed on the opposite surfaces of the top of the main housing 10.

[0055] During assembly, the conductive terminal 30 and the insulating member 20 may be assembled into a single terminal module, and then the terminal module may be assembled on the main housing 10 .

[0056] In this embodiment, the insulating part 20 and the conductive terminal 30 correspond one to one, forming an independent single terminal module, rather than the integrated module of the above embodiment. Compared with the integrated module, the embodiment of the present invention adopts an independent module design, and the position of the conductive terminal 30 can be flexibly designed according to needs to realize a variety of wiring methods. At the same time, it simplifies the assembly process, improves assembly efficiency, and improves product versatility to meet the needs of different application scenarios.

[0057] See again Figure 3 and Figure 4 In one embodiment of the present invention, the plurality of insulating members 20 are located on the same side of the main housing 10 , that is, the plurality of conductive terminals 30 are located on the same side of the top of the main housing 10 .

[0058] In the embodiment of the present invention, the plurality of conductive terminals 30 are arranged on the same side, which can reduce the complexity of wiring inside the packaging structure and facilitate flexible design and layout.

[0059] Of course, if Figure 5 and Figure 6 As shown, in one embodiment of the present invention, multiple insulating members 20 are located on different sides of the main housing 10, that is, multiple conductive terminals 30 are respectively located on different sides of the top of the main housing 10, and the specific layout is not limited and is within the protection scope of the present invention.

[0060] The present invention arranges multiple conductive terminals 30 on different sides, which can make full use of the three-dimensional space of the package housing 100, avoid crowded layout of the conductive terminals 30 on a single side, and help reduce the size of the package structure in a single direction, achieve a more compact design, and is suitable for micro sensor packaging or high-density packaging application scenarios. In addition, it can also reduce signal interference, provide packaging flexibility, disperse stress, and improve reliability.

[0061] In an optional specific embodiment, the main shell 10 is a square shell, and four terminal modules are provided, that is, four insulating parts 20 and four conductive terminals 30 are provided, wherein one insulating part 20 and one conductive terminal 30 are assembled into a terminal module, and the four terminal modules are respectively located at the four corners of the main shell 10, thereby being more conducive to reducing the size of the packaging structure in a single direction, achieving a more compact design, and being more suitable for application scenarios of micro sensor packaging or high-density packaging.

[0062] See also Figure 7 and Figure 8 In one embodiment of the present invention, the main housing 10 is further provided with a through hole 11 penetrating through two opposite surfaces.

[0063] In the embodiment of the present invention, the through hole 11 can be optionally arranged on the top or side of the main housing 10, and its specific arrangement position is not limited. The through hole 11 can be used as a vent or a sound hole. When the packaging structure is a packaging structure of a MEMS microphone sensor, the through hole 11 can be used as a sound hole; when the packaging structure is a packaging structure of a pressure sensor, the through hole 11 can be used as a vent; when the packaging structure is a packaging structure of a combination of a MEMS microphone sensor and a pressure sensor, the through hole 11 can be used as both a vent and a sound hole.

[0064] It should be noted that, in some other embodiments, the through hole 11 may not be provided on the main housing 10 , but may be provided on the circuit board 200 of the packaging structure.

[0065] In one embodiment of the present invention, the end portion of the terminal module extending toward the opening is flush with the opening side of the main housing 10 .

[0066] Specifically, the end of the conductive terminal 30 extending toward the opening is flush with the opening side of the main housing 10 . Such a design facilitates the electrical connection between the end of the conductive terminal 30 extending toward the opening and the circuit board 200 of the packaging structure.

[0067] The packaging shell 100 provided in the embodiment of the present invention can meet the requirements of airtight packaging, can withstand high temperature reflow, and can be applied by SMT surface mounting or other welding methods.

[0068] Reference Fig. 9 and Fig.10 The present invention also proposes a packaging structure, which includes a circuit board 200 and a packaging shell 100 chip. The specific structure of the packaging shell 100 refers to the above embodiment. Since the present packaging structure adopts all the technical solutions of all the above embodiments, it at least has all the beneficial effects brought by the technical solutions of the above embodiments, which will not be described one by one here. Among them, the opening side of the packaging shell 100 is mounted on the circuit board 200, and the end of the terminal module of the packaging shell 100 extending toward the opening is electrically connected to the circuit board 200.

[0069] Specifically, a plurality of connection solder joints 201 are provided on one surface of the circuit board 200, and the connection solder joints 201 are electrically connected to the conductive layer inside the circuit board 200. The packaging shell 100 is mounted on the surface of the circuit board 200 facing the connection solder joints 201. After mounting, one end of the conductive terminal 30 extending toward the opening is connected to the corresponding connection solder joints 201 on the surface of the circuit board 200 to realize the electrical connection between the terminal module and the circuit board 200. The connection method can be selected from solder paste welding, silver paste welding or gluing. When welding is used, a high-temperature reflow or baking process is required. These processes are all conventional processes and will not be described one by one here.

[0070] It should be noted that the circuit board 200 may be a printed circuit board (ie, PCB board), and the thickness of the PCB board is determined according to product design requirements and is not limited here.

[0071] In addition, the packaging structure also includes components, which are arranged on the surface of the circuit board 200 facing the packaging shell 100, and the components may optionally include chips (such as MEMS chips, ASIC chips, etc.). There may be multiple components, and the components may be attached or wired according to product requirements to achieve the interconnection of one or more internal components.

[0072] In the packaging structure provided by the embodiment of the present invention, the packaging shell 100 is used as a welding interface, the structural design of the packaging shell 100 is relatively compact, and the assembly process is simple, the quality control is relatively stable, the product yield is high, and it is suitable for mass production. At the same time, the hardness of the packaging shell 100 is high, especially when a metal shell is used, the welding strength is higher and the reliability is better.

[0073] Since the package shell 100 is provided with a plurality of conductive terminals 30, the leads of the plurality of conductive terminals 30 can be interconnected, thereby achieving a package structure with small size, low stress and high performance. Meanwhile, the structure is simple, low cost and suitable for mass production.

[0074] Please refer to Fig.11 In one embodiment of the present invention, the surface of the circuit board 200 facing away from the packaging shell 100 is further provided with an external solder pad 202, the external solder pad 202 is electrically connected to the connection solder point 201, and the external solder pad 202 is used to be electrically connected to an external device.

[0075] Specifically, the circuit board 200 has two opposite surfaces, one of which is provided with a connection solder joint 201 for electrically connecting to the conductive terminal 30 of the package shell 100, and the other surface is provided with an external solder pad 202 for electrically connecting to an external device. The connection solder joint 201 and the external solder pad 202 are electrically connected through the metal traces inside the circuit board 200, so that the conductive terminal 30, the connection solder joint 201 and the external solder pad 202 are all electrically connected.

[0076] In the embodiment of the present invention, the packaging structure uses both the packaging shell 100 and the circuit board 200 as welding interfaces, thereby realizing double-sided mounting applications. Customers can arbitrarily select welding interfaces according to the application requirements of the final product, thereby increasing the versatility of the packaging product.

[0077] The present invention also provides an electronic device, which includes a packaging structure. The specific structure of the packaging structure refers to the above embodiments. Since the electronic device adopts all the technical solutions of all the above embodiments, it at least has all the beneficial effects brought by the technical solutions of the above embodiments, which will not be described one by one here. Among them, the electronic device includes but is not limited to headphones, mobile phones, smart watches and tablet computers.

[0078] The above description is only an exemplary embodiment of the present invention, and does not limit the patent scope of the present invention. All equivalent structural changes made by using the contents of the present invention specification and drawings under the technical concept of the present invention, or directly / indirectly applied in other related technical fields are included in the patent protection scope of the present invention.

Claims

1. A packaging shell, applied to a packaging structure, characterized in that: The packaging shell comprises: a main housing having an opening on one side; and A terminal module is arranged on a side of the main shell opposite to the opening and passes through the main shell, one end of the terminal module is exposed from the main shell to form a packaging pad for electrical connection with an external device, and the other end of the terminal module extends toward the opening for electrical connection with the circuit board of the packaging structure.

2. The packaging shell according to claim 1, characterized in that: The main shell is a metal shell, and the terminal module includes a conductive terminal and an insulating member. The insulating member is arranged on a side of the main shell opposite to the opening and passes through the main shell. The conductive terminal is arranged on the insulating member and passes through the insulating member. One end of the conductive terminal is exposed from the main shell to form the packaging pad, and the other end extends toward the opening.

3. The packaging shell according to claim 2, characterized in that: The insulating member is a sheet-like structure, and a plurality of assembly holes are arranged at intervals on the insulating member; A plurality of the conductive terminals are provided, and the plurality of the conductive terminals are correspondingly assembled in the plurality of the assembly holes.

4. The packaging shell according to claim 3, characterized in that: The insulating member and the plurality of conductive terminals are an integral structure.

5. The packaging shell according to claim 2, characterized in that: The insulating member is a cylindrical structure, and a plurality of the insulating members are provided. The plurality of insulating members are arranged at intervals on a side of the main housing opposite to the opening, and all pass through the main housing; A plurality of the conductive terminals are provided, and the plurality of the conductive terminals are correspondingly assembled in the plurality of the insulating members.

6. The packaging shell according to claim 5, characterized in that: The plurality of conductive terminals are located on the same side of the main housing; or, The plurality of conductive terminals are located on different sides of the main housing.

7. The packaging shell according to any one of claims 1 to 6, characterized in that: The main housing is further provided with a through hole penetrating through two opposite surfaces; and / or, An end portion of the terminal module extending toward the opening is flush with an opening side of the main housing.

8. A packaging structure, characterized in that: The packaging structure comprises: Circuit boards; and The packaging shell according to any one of claims 1 to 7, wherein the opening side of the packaging shell is mounted on the circuit board, and an end of the terminal module of the packaging shell extending toward the opening is electrically connected to the circuit board.

9. The packaging structure according to claim 8, characterized in that: A connection solder joint is provided on a surface of the circuit board facing the packaging shell corresponding to the terminal module, and an end of the terminal module extending toward the opening is electrically connected to the connection solder joint; and / or, An external solder pad is also provided on the surface of the circuit board facing away from the packaging shell. The external solder pad is electrically connected to the connection solder point and is used to be electrically connected to an external device.

10. An electronic device, characterized in that: The electronic device comprises the packaging structure as claimed in claim 8 or 9.

Images