Two-phase thermosyphon radiator

Abstract

The invention relates to the technical field of radiators, in particular to a two-phase thermosyphon radiator which comprises a base serving as a carrier of the whole device, an evaporation assembly is arranged on the base, a fan support is further installed on the base, a condenser connected with the evaporation assembly is arranged in the fan support, and a plurality of electronic fans are further arranged on the base. The evaporation assembly comprises a plate body fixedly connected to the base, the plate body is connected with the fan support, a groove body is formed in the plate body, a plurality of first porous capillary pieces are fixedly connected into the groove body, first heat conduction pieces are distributed between every two first porous capillary pieces in a staggered mode, a plurality of second porous capillary pieces are further fixedly connected into the groove body, and the second heat conduction pieces are arranged between every two second porous capillary pieces. And second heat-conducting fins are distributed between every two porous capillary pieces in a staggered mode, the first heat-conducting fins and the second heat-conducting fins are also installed in the groove body, and a sealing cover is installed on the groove body in a sealed mode. Heat transfer and dissipation can be accelerated, the application range is wide, the device can be applied to various electronic devices, working fluid is not prone to leakage, and the reliability of the devices is improved.

Description

Technical Field

[0001] The invention relates to the technical field of radiators, in particular to a two-phase thermal syphon radiator. Background Art

[0002] As the performance of electronic devices continues to improve, the heat generated during their operation is also increasing. An efficient heat dissipation system has become the key to ensuring the stable operation of electronic devices and extending their service life. Traditional air-cooled radiators have limited heat dissipation efficiency. Although liquid-cooled radiators have better heat dissipation effects, the heat dissipation structure usually adopts traditional metal fins or flat designs, and mainly relies on thermal conductive materials to transfer heat to the working fluid. These structures often lack complex microscopic designs, such as porous capillaries, and thus have multiple defects: first, the heat conduction efficiency is low, the heat flow transfer speed is slow, and the heat cannot be quickly transferred to the fluid; second, the evaporation efficiency is insufficient, and the phase change characteristics of the working fluid are not fully utilized, affecting the heat dissipation effect; in addition, traditional structures often cannot provide effective capillary action, resulting in slow liquid reflux, and liquid accumulation near the heat source may occur, hindering thermal management. Summary of the invention

[0003] In view of the deficiencies in the prior art, the present invention provides a two-phase thermal siphon radiator having the advantages of high efficiency and energy saving, and solves the deficiencies of the prior art radiator such as the need to improve the heat dissipation performance and the narrow scope of application.

[0004] In order to solve the above technical problems, the present invention provides the following technical solutions:

[0005] A two-phase thermosyphon radiator comprises a base as a carrier of the entire device, wherein an evaporation component is arranged on the base, a fan bracket is also installed on the base, a condenser connected to the evaporation component is arranged in the fan bracket, and a plurality of electronic fans are also arranged on the base, wherein the evaporation component comprises a plate body fixedly connected to the base, the plate body is connected to the fan bracket, a groove body is provided on the plate body, a plurality of porous capillary members 1 are fixedly connected to the groove body, heat conductive sheets 1 are staggeredly arranged between the plurality of porous capillary members 1, a plurality of porous capillary members 2 are also fixedly connected to the groove body, heat conductive sheets 2 are staggeredly arranged between the plurality of porous capillary members 1, the heat conductive sheets 1 and the heat conductive sheets 2 are also installed in the groove body, and a sealing cover is sealed on the groove body.

[0006] Preferably, the condenser includes a fixing frame fixed to the plate body, connecting pipes are fixed on both sides of the fixing frame, a guide pipe is installed between the connecting pipe and the plate body, a partition box is installed between the guide pipes, and a plurality of heat dissipating fins are fixed between the guide pipes, and the plurality of heat dissipating fins and the partition boxes are staggeredly distributed.

[0007] Preferably, a plurality of heat-conducting blocks are fixedly connected to the middle portion of the trough body, and the porous capillary member 1 and the porous capillary member 2 are respectively located above and below the heat-conducting blocks.

[0008] Preferably, a refrigerant filling port for conveying refrigerant working fluid is connected and installed on the plate body, and the refrigerant filling port is a valve structure.

[0009] Preferably, the fan bracket includes a shell fixedly connected to the plate body, a plurality of air outlets are provided on the outer side of the shell, and the electronic fan is installed on the corresponding air outlets.

[0010] Preferably, a fan mesh cover is fixedly connected to the housing, the electronic fan is located inside the fan mesh cover, and a transmission component for driving the electronic fan to operate is also provided.

[0011] Preferably, the transmission assembly includes a connecting wire installed in the fan mesh cover, the connecting wire is electrically connected to the electronic fan through a conductor, and the connecting wire extends to the outside of the fan mesh cover and is connected to the fan bundle.

[0012] Preferably, air vents are provided on the top and bottom of the shell, and an air inlet is provided on the side of the shell.

[0013] Preferably, a transmission box is fixedly connected between the tops of the connecting pipes, and a mounting groove corresponding to the electronic fan is provided on the outer shell.

[0014] By means of the above technical solution, the present invention provides a two-phase thermosyphon radiator, which has at least the following beneficial effects:

[0015] 1. The two-phase thermosyphon radiator has higher heat dissipation efficiency. It uses a two-phase liquid heat dissipation medium. After being heated, it evaporates and absorbs heat, and becomes gaseous to take away the heat of the IGBT. At the same time, the special capillary structure design in the cold plate and the efficient air cooling device can accelerate the transfer and dissipation of heat. It has a wide range of applications and can be applied to various electronic equipment, including high-performance computers, servers, communication base station equipment, etc. The structure is relatively simple, the cost is low, and the working fluid is not easy to leak, which improves the reliability of the equipment.

[0016] 2. The materials of the two-phase thermosyphon radiator, evaporation component and condenser are made of metals with excellent thermal conductivity, such as aluminum alloy. The pipes are made of alloy materials, which can not only ensure good sealing but also adapt to different installation environments. The working fluid is a substance with a low boiling point and large latent heat of vaporization, such as R134A.

[0017] 3. The two-phase thermal siphon radiator adopts a special microstructure design inside the plate body. For example, a highly efficient porous capillary component 1 and a porous capillary component 2 are arranged inside, which can quickly transfer heat to the working fluid and promote the evaporation of the working fluid. The capillary structure can be a porous structure formed by sintering metal powder, and its pore size distribution is uniform, which can effectively enhance the capillary force of the liquid and accelerate the reflux rate of the liquid.

[0018] 4. The two-phase thermosyphon radiator adopts the aluminum alloy material extrusion process to extrude partition boxes with different cross-sectional shapes, and then all the parts are welded into a whole through the brazing process. Heat dissipation fins are designed between the connecting pipes to increase the heat dissipation area and improve the heat dissipation efficiency.

[0019] 5. The two-phase thermosyphon heat sink is installed on heat-generating components such as CPU, GPU and IGBT, which can effectively reduce the operating temperature of the components and improve the stability and performance of the machine. In the equipment, the thermosyphon heat sink can adapt to the complex working environment, ensure the long-term stable operation of the equipment, and reduce maintenance costs. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] The accompanying drawings described herein are used to provide a further understanding of the present invention and constitute a part of this application:

[0021] Figure 1 It is a schematic diagram of the three-dimensional structure of the present invention in the front view direction;

[0022] Figure 2 It is a split diagram of the present invention;

[0023] Figure 3 It is a structural schematic diagram of the condenser of the present invention;

[0024] Figure 4 It is a structural schematic diagram of the evaporation plate of the present invention;

[0025] Figure 5 It is a schematic diagram of the external connection structure of the fan guard of the present invention;

[0026] Figure 6 It is a schematic diagram of the external connection structure of the electronic fan of the present invention;

[0027] Figure 7 It is a cross-sectional view of the housing of the present invention.

[0028] Reference numerals:

[0029] 1. Evaporation assembly; 11. Plate body; 12. Sealing cover; 13. Porous capillary component 1; 14. Heat conducting sheet 1; 15. Heat conducting sheet 2; 16. Porous capillary component 2; 17. Heat conducting block;

[0030] 2. Condenser; 21. Fixing frame; 22. Heat dissipation fins; 23. Partition box; 24. Transmission box; 25. Flow guide pipe; 26. Connecting pipe;

[0031] 3. Fan bracket; 31. Housing; 32. Air outlet; 33. Mounting slot;

[0032] 4. Electronic fan;

[0033] 5. Fan guard;

[0034] 6. Transmission assembly; 61. Fan bundle; 62. Connecting wire; 63. Wire;

[0035] 7. Refrigerant filling port. DETAILED DESCRIPTION

[0036] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0037] As an advanced heat dissipation technology, a two-phase thermosyphon heat sink is widely used in electronic equipment, LED lighting, laser systems and other fields that require efficient heat dissipation. As the power of electronic components continues to increase, the heat dissipation problem becomes more and more important. Traditional heat dissipation methods such as air cooling and water cooling can no longer meet the growing heat dissipation needs in some high power density applications.

[0038] Embodiment 1:

[0039] Compared with traditional IGBT heat sinks, air cooling is mainly used, which has low heat dissipation efficiency and requires more fans, resulting in higher system noise. Although some high-power IGBT systems use liquid cooling, the system uses single-phase working fluid for heat dissipation, and the efficiency is improved but not obvious. In order to solve the above problems, combined with Figure 1 , Figure 2 and Figure 4 As shown, a two-phase thermosyphon radiator provided by the present invention includes a base as a carrier of the entire device, an evaporation component 1 is arranged on the base, a fan bracket 3 is also installed on the base, a condenser 2 connected to the evaporation component 1 is arranged in the fan bracket 3, and a plurality of electronic fans 4 are also arranged on the base. The evaporation component 1 and the condenser 2 are made of metals with excellent thermal conductivity, such as aluminum alloy, and the pipes are made of alloy materials, which can ensure good sealing and adapt to different installation environments. The working fluid is a substance with a low boiling point and a large latent heat of vaporization, such as R134A.

[0040] The heat dissipation efficiency of the traditional air-cooled radiator is limited, and although the liquid-cooled radiator has a better heat dissipation effect, it has the problems of complex structure, high cost, easy leakage, etc. In order to solve the above problems, the evaporation component 1 includes a plate body 11 fixed to the base, the plate body 11 is connected to the fan bracket 3, a groove body is provided on the plate body 11, a plurality of porous capillary members 13 are fixed to the groove body, and a plurality of porous capillary members 13 are alternately distributed with heat conducting sheets 14 in pairs, a plurality of porous capillary members 16 are also fixed to the groove body, and a plurality of porous capillary members 13 are alternately distributed with heat conducting sheets 14 in pairs, and a plurality of porous capillary members 16 are also fixed to the groove body. Heat conducting sheets 15 are staggered between each other, heat conducting sheets 14 and 15 are also installed in the tank body, and a sealing cover 12 is sealed on the tank body. The interior of the plate body 11 adopts a special microstructure design. For example, a highly efficient porous capillary piece 13 and a porous capillary piece 2 16 are arranged inside, which can quickly transfer heat to the working fluid and promote the evaporation of the working fluid. The capillary structure can be a porous structure formed by sintering metal powder, and its pore size distribution is uniform, which can effectively enhance the capillary force of the liquid and accelerate the reflux speed of the liquid.

[0041] The dual design of porous capillary element 13 and porous capillary element 2 16 helps to further increase the heat dissipation area and heat exchange efficiency, ensuring that heat can be transferred quickly.

[0042] The evaporation component 1 processes a flow channel structure inside the aluminum alloy plate 11 to form a flow channel plate, and then forms a uniform porous capillary structure inside it through a sintering process. The flow channel plate and the flat plate are brazed into one by a brazing process to form an evaporation component 1 structure with a hollow interior.

[0043] Specifically, a plurality of heat-conducting blocks 17 are fixedly connected to the middle of the trough body, and the porous capillary member 13 and the porous capillary member 2 16 are respectively located above and below the heat-conducting blocks 17 .

[0044] According to the embodiment, the two-phase thermosyphon heat sink has higher heat dissipation efficiency. It uses a two-phase liquid heat dissipation medium, which evaporates and absorbs heat after being heated, and becomes gaseous to take away the heat of the IGBT. At the same time, the special capillary structure design in the cold plate and the efficient air cooling device can accelerate the transfer and dissipation of heat. It has a wide range of applications and can be applied to various electronic devices, including high-performance computers, servers, communication base station equipment, etc. The structure is relatively simple, the cost is low, and the working fluid is not easy to leak, which improves the reliability of the equipment.

[0045] Embodiment 2:

[0046] There is no integral structure welded together, and there may be air isolation between the heat dissipation fins 22 and the partition box 23, which reduces the heat conduction efficiency and affects the heat dissipation effect. In order to solve the above problem, the heat dissipation effect is reduced by combining the heat dissipation fins 22 and the partition box 23. Figure 2 and Figure 3As shown, on the basis of embodiment one, the condenser 2 includes a fixing frame fixedly connected to the plate body 11, connecting pipes 26 are fixedly connected on both sides of the fixing frame 21, a guide pipe 25 is installed between the connecting pipe 26 and the plate body 11, a partition box 23 is installed between the guide pipes 25, and a plurality of heat dissipating fins 22 are fixedly connected between the guide pipes 25. The plurality of heat dissipating fins 22 and the partition boxes 23 are staggeredly distributed. An aluminum alloy material extrusion process is adopted to extrude partition boxes of different cross-sectional shapes, and then all the parts are welded into a whole through a brazing process. Heat dissipating fins 22 are designed between the connecting pipes 26 to increase the heat dissipation area and improve the heat dissipation efficiency.

[0047] Specifically, a refrigerant filling port 7 for conveying the refrigerant working fluid is connected and installed on the plate body 11. The refrigerant filling port 7 is a valve structure, which can realize the rapid replenishment of the refrigerant.

[0048] According to the embodiment, the argon arc welding process is used to connect the condenser 2 and the guide tube 25 on the plate body 11, which has high overall reliability and low cost.

[0049] Embodiment three:

[0050] Combination Figure 5 and Figure 6 As shown, based on the first embodiment, the fan bracket 3 includes a shell 31 fixedly connected to the plate body 11, and a plurality of air vents 32 are provided on the outer side of the shell 31. The electronic fan 4 is installed on the corresponding air vents 32 to allow air circulation, which helps to accelerate the heat dissipation process and further improve the heat dissipation effect.

[0051] Specifically, a fan mesh cover 5 is fixedly connected to the housing 31 , and the electronic fan 4 is located inside the fan mesh cover 5 . A transmission component 6 for driving the electronic fan 4 is also provided, which can protect the electronic fan 4 and is beneficial to improving the service life of the electronic fan 4 .

[0052] Furthermore, the transmission assembly 6 includes a connecting wire 62 installed in the fan mesh 5 , the connecting wire 62 is electrically connected to the electronic fan 4 through a wire 63 , and the connecting wire 62 extends to the outside of the fan mesh 5 and is connected to the fan bundle 61 .

[0053] Embodiment 4:

[0054] Combination Figure 1 and Figure 7 As shown, on the basis of the first embodiment, air vents 32 are provided at the top and bottom of the housing 31 , and air inlets 32 are provided at the side of the housing 31 , forming an air duct structure to improve heat dissipation efficiency.

[0055] Specifically, the transmission box 24 is also fixedly connected to the top of the connecting pipe 26 , and a mounting groove 33 corresponding to the electronic fan 4 is also formed on the outer shell 31 .

[0056] In scenarios where heat dissipation is required, installing a thermosyphon heat sink on heat-generating components such as the CPU, GPU, and IGBT can effectively reduce the operating temperature of the components and improve the stability and performance of the machine. In equipment, the thermosyphon heat sink can adapt to complex working environments, ensure long-term stable operation of the equipment, and reduce maintenance costs.

[0057] It can be seen from the above embodiments that: after the system is sealed, an appropriate amount of refrigerant working fluid is injected into the plate body 11 through the refrigerant filling port 7. The working fluid is vaporized into steam after absorbing heat in the plate body 11. The steam rises to the connecting pipe 26 through the guide pipe 25. The connecting pipe 26 is provided with a large-area heat dissipation fin 22 on the outside and is equipped with a forced air cooling device, such as an electronic fan 4. The steam is liquefied into liquid after being cooled in the connecting pipe 26. Under the action of gravity and capillary force, the liquid flows back to the plate body 11 along the guide pipe 25 to complete a cycle.

[0058] It should be noted that the terms "comprises", "includes" or any other variations thereof are intended to cover non-exclusive inclusion, so that a process, method, article or apparatus that includes a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or apparatus.

[0059] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A two-phase thermosyphon radiator, comprising a base as a carrier of the entire device, characterized in that: The base is provided with an evaporation component (1), a fan bracket (3) is also installed on the base, a condenser (2) connected to the evaporation component (1) is arranged inside the fan bracket (3), and a plurality of electronic fans (4) are also arranged on the base; The evaporation component (1) comprises a plate body (11) fixedly connected to a base, the plate body (11) being connected to a fan bracket (3), a groove body being provided on the plate body (11), a plurality of porous capillary members (13) being fixedly connected in the groove body, heat conducting sheets (14) being staggeredly arranged between the plurality of porous capillary members (13), a plurality of porous capillary members (16) being fixedly connected in the groove body, heat conducting sheets (15) being staggeredly arranged between the plurality of porous capillary members (13), the heat conducting sheets (14) and the heat conducting sheets (15) being also installed in the groove body, and a sealing cover (12) being sealedly installed on the groove body.

2. The two-phase thermosyphon radiator according to claim 1, characterized in that: The condenser (2) comprises a fixing frame fixed to the plate body (11), connecting pipes (26) are fixed to both sides of the fixing frame (21), a flow guide pipe (25) is installed in communication between the connecting pipe (26) and the plate body (11), a partition box (23) is installed in communication between the flow guide pipes (25), and a plurality of heat dissipation fins (22) are also fixed between the flow guide pipes (25), and the plurality of heat dissipation fins (22) and the partition box (23) are arranged in a staggered manner.

3. The two-phase thermosyphon radiator according to claim 1, characterized in that: A plurality of heat-conducting blocks (17) are fixedly connected to the middle of the trough body, and the porous capillary member 1 (13) and the porous capillary member 2 (16) are respectively located above and below the heat-conducting blocks (17).

4. The two-phase thermosyphon radiator according to claim 1, characterized in that: The plate body (11) is connected to and provided with a refrigerant filling port (7) for conveying a refrigerant working fluid, and the refrigerant filling port (7) is a valve structure.

5. The two-phase thermosyphon radiator according to claim 2, characterized in that: The fan bracket (3) comprises a shell (31) fixedly connected to the plate body (11), a plurality of air outlets (32) are provided on the outer side of the shell (31), and the electronic fan (4) is installed on the corresponding air outlets (32).

6. The two-phase thermosyphon radiator according to claim 5, characterized in that: A fan mesh cover (5) is fixedly connected to the housing (31), the electronic fan (4) is located inside the fan mesh cover (5), and a transmission component (6) for driving the electronic fan (4) to operate is also provided.

7. The two-phase thermosyphon radiator according to claim 6, characterized in that: The transmission assembly (6) comprises a connecting wire (62) installed in the fan mesh cover (5), the connecting wire (62) is electrically connected to the electronic fan (4) through a wire (63), and the connecting wire (62) extends to the outside of the fan mesh cover (5) and is connected to a fan bundle (61).

8. The two-phase thermosyphon radiator according to claim 5, characterized in that: The top and bottom of the shell (31) are both provided with air vents (32), and the side of the shell (31) is provided with an air inlet (32).

9. The two-phase thermosyphon radiator according to claim 5, characterized in that: The top of the connecting pipe (26) is also fixedly connected to the transmission box (24), and the outer shell (31) is also provided with a mounting groove (33) corresponding to the electronic fan (4).

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