Positioning method of cleaning component

Abstract

A method of positioning a cleaning member is provided. The present invention relates to a method for positioning a roller brush (37) in a substrate cleaning device (100) provided with: a plurality of conveyance rollers (11) that convey a glass plate (G) along a horizontal path line (PL); and a roller brush (37) that is disposed on at least one of the top and bottom of the path line (PL) along a path width direction (PW) orthogonal to the path line (PL) in at least one position between two adjacent conveyance rollers (11), and that rotates while being in contact with the glass plate (G) to clean the main surface. A plurality of positioning substrates (SGR, SGC, SGL) are arranged in the path width direction (PW) and erected on conveying rollers (11) adjacent upstream and downstream of a roller brush (37), the roller brush (37) is close to the positioning substrates (SGR, SGC, SGL) and rotated, and the height of the roller brush (37) is positioned by monitoring the movement of the plurality of positioning substrates (SGR, SGC, SGL).

Description

Technical Field

[0001] The present invention relates to a method for positioning a cleaning component. Background Technology

[0002] For example, the surface of a glass plate used in a flat panel display (FPD: Flat Panel Display) such as LCD (Liquid Crystal Display) and OLED (Organic Light-Emitting Diode) is cleaned by a cleaning device.

[0003] Patent Document 1 discloses a glass plate cleaning device that rotates a cleaning member composed of a plurality of disc brushes in contact with the surface of a glass plate being conveyed to remove deposits attached to the surface of the glass plate. In this cleaning device, an adjustment unit is used to fine-tune the position of the cleaning member relative to the surface of the glass plate to adjust the contact state.

[0004] Prior Art Literature

[0005] Patent Literature

[0006] Patent Document 1: Japanese Patent Application Publication No. 2015-30570 SUMMARY OF THE INVENTION

[0007] Problems to be solved by the invention

[0008] However, as in Patent Document 1, if only the height of the cleaning member is adjusted, it is sometimes difficult to position the cleaning member so that the contact state is uniform in the width direction perpendicular to the conveying path due to the influence of the deflection of the glass plate and the inclination of the cleaning member.

[0009] Therefore, an object of the present invention is to provide a method for positioning a cleaning member, which can position a cleaning member for cleaning a glass plate with high precision.

[0010] Technical solutions for solving problems

[0011] The present invention is composed of the following structures.

[0012] A method for positioning a cleaning member in a substrate cleaning device, the substrate cleaning device comprising: a plurality of conveying rollers conveying a glass plate along a horizontal conveying path; and the cleaning member, at least one of the upper and lower sides of the conveying path, arranged along a path width direction orthogonal to the conveying path at least at one point between two adjacent conveying rollers, and rotating while contacting the glass plate conveyed by the conveying rollers to clean the main surface, wherein

[0013] ​​Arrange a plurality of positioning substrates in the width direction of the path and mount them on the conveying rollers adjacent to the upstream and downstream of the conveying path of the cleaning member, and

[0014] Bring the cleaning member closer to the positioning substrate, rotate the cleaning member, and monitor the movement of the plurality of positioning substrates to position the height of the cleaning member.

[0015] Advantages of the Invention

[0016] According to the present invention, it is possible to accurately position the cleaning member for cleaning the glass plate. Description of the Drawings

[0017] Figure 1 It is a schematic top view of a substrate cleaning apparatus that applies the positioning method of the cleaning member according to the first embodiment, with the upper brush mechanism portion omitted.

[0018] Figure 2 It is a schematic side view of a substrate cleaning apparatus that applies the positioning method of the cleaning member according to the first embodiment.

[0019] Figure 3 It is a schematic top view of a substrate cleaning apparatus that illustrates the positioning process of the roller brush, with the upper brush mechanism portion omitted.

[0020] Figure 4 It is a schematic side view of a substrate cleaning apparatus that illustrates the positioning process of the lower roller brush.

[0021] Figure 5 It is a schematic side view of a substrate cleaning apparatus that illustrates the positioning process of the upper roller brush.

[0022] Figure 6 It is a schematic top view of a substrate cleaning apparatus that applies the positioning method of the cleaning member according to the second embodiment, with the upper brush mechanism portion omitted.

[0023] Figure 7 It is a schematic side view of a substrate cleaning apparatus that applies the positioning method of the cleaning member according to the second embodiment.

[0024] Figure 8 It is a schematic top view of a substrate cleaning apparatus that illustrates the positioning process of the disk brush, with the upper brush mechanism portion omitted.

[0025] Figure 9 It is a schematic side view of a substrate cleaning apparatus that illustrates the positioning process of the lower disk brush.

[0026] Figure 10 It is a schematic side view of a substrate cleaning apparatus that illustrates the positioning process of the upper disk brush. Detailed Description of the Invention

[0027] Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.

[0028] <First Embodiment>

[0029] First, the first embodiment will be described.

[0030] (Cleaning Device)

[0031] Figure 1 FIG. 15 is a schematic top view of a substrate cleaning apparatus 100 that applies the positioning method of the cleaning member according to the first embodiment, with the upper brush mechanism portion 33 omitted. Figure 2 FIG. 16 is a schematic side view of a substrate cleaning apparatus 100 that applies the positioning method of the cleaning member according to the first embodiment.

[0032] As Figure 1 and Figure 2 shown, the substrate cleaning apparatus 100 that applies the positioning method of the cleaning member according to the first embodiment includes a plurality of conveying rollers 11 and a cleaning processing unit 13.

[0033] The conveying rollers 11 convey the glass plate G along a path line PL in a horizontal direction in one conveying direction X. The cleaning processing unit 13 cleans the main surface of the glass plate G conveyed along the path line PL.

[0034] The substrate cleaning apparatus 100 is an apparatus for cleaning the main surface of a rectangular glass plate G. The glass plate G cleaned by the substrate cleaning apparatus 100 is made of, for example, an alkali-free glass material for a flat panel display (FPD) such as an LCD (Liquid Crystal Display) or an OLED (Organic Light-Emitting Diode).

[0035] The glass plate G is, for example, a large-sized glass plate having a fifth-generation size (long side: 1,300 mm, short side: 1,000 mm) to an eleventh-generation size (long side: 3,320 mm, short side: 3,000 mm).

[0036] The conveying rollers 11 are horizontally arranged along a path width direction PW orthogonal to the path line PL and are arranged at intervals along the path line PL. And, the horizontal plane at the upper end positions of these conveying rollers 11 becomes the reference position of the substrate cleaning apparatus 100, that is, the path line PL.

[0037] The conveying roller 11 has a rotating shaft 21 and a plurality of roller portions 23 provided on the rotating shaft 21. The rotating shaft 21 of the conveying roller 11 rotates in the same rotating direction by a driving mechanism (not shown). Thus, the glass plate G is conveyed in the conveying direction X along the path line PL on the rotating conveying roller 11.

[0038] The cleaning treatment unit 13 is disposed between two specific adjacent conveying rollers 11 among the plurality of conveying rollers 11. In this example, a pair of brush mechanism portions 31, 33 are provided. The brush mechanism portions 31, 33 are disposed along the path width direction PW at opposite positions above and below the path line PL. Specifically, one brush mechanism portion 31 is disposed below the path line PL, and the other brush mechanism portion 33 is disposed above the path line PL. Examples of the cleaning treatment performed by the cleaning treatment unit 13 include slurry cleaning, cleaning with a cleaning agent (alkaline or acidic), pure water cleaning, and the like. There may be a plurality of cleaning treatment units 13, all of which are disposed between two adjacent conveying rollers 11.

[0039] The brush mechanism portions 31, 33 each include a roller brush 37. The roller brush 37 has a rotating shaft 35 and a brush portion 38 provided around the rotating shaft 35. The rotating shaft 35 of the roller brush 37 rotates by a driving mechanism (not shown). Thus, the roller brushes 37 rotate respectively about a horizontal axis. The brush portion 38 is, for example, a brush made of nylon (nylon 6, nylon 610, nylon 612) or the like with a wire diameter of 0.05 mm to 0.1 mm and a length of about 10 mm to 20 mm. In addition, the roller brush 37 may not be a brush, but a sponge made of a resin such as PVA (polyvinyl alcohol) or polyurethane.

[0040] These brush mechanism portions 31, 33 each include a lifting mechanism (not shown) and are lifted and lowered in the vertical direction by the lifting mechanism. In addition, height adjustment mechanisms (not shown) are provided at both ends of the rotating shaft 35 of the roller brush 37, and height adjustment can be performed at both ends of the rotating shaft 35. The lower brush mechanism portion 31 is positioned by the height adjustment mechanism so that the roller brush 37 contacts the main surface on the back side of the glass plate G conveyed along the path line PL. Similarly, the upper brush mechanism portion 33 is positioned by the height adjustment mechanism so that the roller brush 37 contacts the main surface on the front side of the glass plate G conveyed along the path line PL.

[0041] Moreover, in the cleaning treatment unit 13 of the substrate cleaning device 100, a cleaning liquid such as a slurry containing cerium oxide, a cleaning agent (alkaline or acidic), or pure water is sprayed from a nozzle (not shown) onto the main surface of the glass plate G conveyed in the conveying direction X, and the roller brushes 37 of the brush mechanism portions 31, 33 rotate while contacting the main surface. Thus, the main surface of the glass plate G is cleaned. For example, when stacked and bundled, attachments such as paper powder and particles of the backing paper between the front and back surfaces are removed from the main surface of the glass plate G.

[0042] However, in the substrate cleaning apparatus 100, if the position of the roller brushes 37 of the brush mechanism units 31, 33 is shifted, it may not be possible to sufficiently clean the main surface of the glass plate G with the roller brushes 37. For example, there are cases where the roller brushes 37 of at least one of the brush mechanism units 31, 33 are not in contact with the main surface of the glass plate G, and cases where the roller brushes 37 are unevenly in contact with the main surface of the glass plate G due to inclination. In such cases, cleaning defects such as uneven cleaning may occur on the glass plate G. In addition, since the roller brushes 37 are not evenly in contact with the glass plate G, the contact resistance to the glass plate G may deviate, resulting in a conveyance defect such as the glass plate G being conveyed meanderingly, and damage such as breakage and chipping may occur on the glass plate G.

[0043] In addition, if a part of the roller brush 37 of the lower brush mechanism unit 31 exceeds the path line PL and the glass plate G is in a state of being lifted by the roller brush 37, the conveyance force of the conveyance roller 11 on the glass plate G decreases, and a conveyance failure may occur where the glass plate G is not smoothly conveyed.

[0044] Therefore, in the present invention, the roller brushes 37 of the brush mechanism units 31, 33 are positioned with high precision through the following process.

[0045] Figure 3 FIG. is a schematic top view of the substrate cleaning apparatus 100 for explaining the positioning process of the roller brush 37, with the upper brush mechanism unit 33 omitted. Figure 4 FIG. is a schematic side view of the substrate cleaning apparatus 100 for explaining the positioning process of the lower roller brush 37. Figure 5 FIG. is a schematic side view of the substrate cleaning apparatus for explaining the positioning process of the upper roller brush 37.

[0046] (Preparation of the positioning substrate)

[0047] As Figure 3 shown, a plurality of positioning substrates SGR, SGC, SGL for performing the positioning operation are prepared. In this example, a case where three positioning substrates SGR, SGC, SGL are used is illustrated. These three positioning substrates SGR, SGC, SGL have a width dimension W that is approximately 1 / 3 of the width of the glass plate G to be cleaned, and have a length dimension L that is sufficiently mounted with respect to the conveyance rollers 11 adjacent to the upstream and downstream of the brush mechanism units 31, 33.

[0048] These positioning substrates SGR, SGC, and SGL use glass plates having the same thickness as the glass plate G to be cleaned. In this way, if a glass plate is used as the positioning substrates SGR, SGC, and SGL, the roller brushes 37 of the brush mechanism parts 31 and 33 can be positioned with high precision according to the conditions during the actual cleaning process. When using a glass plate as the positioning substrates SGR, SGC, and SGL, it is preferable to cover the outer peripheral edge with a protective member such as a tape. Thereby, breakage and damage of the positioning substrates SGR, SGC, and SGL during the positioning operation can be suppressed, and the positioning operation can be smoothly performed. In addition, as the positioning substrates SGR, SGC, and SGL, resin plates, metal plates, etc. having the same thickness as the glass plate G to be cleaned can also be used.

[0049] (Substrate Arrangement Process)

[0050] As Figure 3 and Figure 4 shown, the positioning substrates SGR, SGC, and SGL are arranged in sequence in the path width direction PW and are installed on the conveying rollers 11 adjacent to the upstream and downstream of the brush mechanism parts 31 and 33.

[0051] (Positioning Process)

[0052] Next, the height adjustment of the roller brushes 37 of the brush mechanism parts 31 and 33 is performed in sequence. In this example, the case where the height adjustment of the roller brush 37 of the lower brush mechanism part 31 is first performed and then the height adjustment of the roller brush 37 of the upper brush mechanism part 33 is performed will be described.

[0053] (1) Positioning of the Roller Brush 37 of the Lower Brush Mechanism Part 31

[0054] As Figure 4 shown, the roller brush 37 of the upper brush mechanism part 33 is moved upward (in the direction of arrow U in Figure 4 ) by the lifting mechanism so as to form a gap between the main surface of the positioning substrates SGR, SGC, and SGL and the roller brush 37 of the upper brush mechanism part 33.

[0055] Next, the lower brush mechanism part 31 in a state where the roller brush 37 is not in contact with the positioning substrates SGR, SGC, and SGL is moved upward little by little by the height adjustment mechanism to approach the positioning substrates SGR, SGC, and SGL, and the roller brush 37 of the brush mechanism part 31 is manually rotated. And the movement of the plurality of positioning substrates SGR, SGC, and SGL caused by the contact of the rotating roller brush 37 is monitored.

[0056] For example, the upward movement of the roller brush 37 of the brush mechanism part 31 is performed by 0.1 mm each time. In addition, the rotation of the roller brush 37 of the brush mechanism part 31 is in one direction ( Figure 4in the direction of arrow R1) and the other direction ( Figure 4 in the direction of arrow R2) alternately. That is, after moving the roller brush 37 of the brush mechanism unit 31 upward by 0.1 mm, the roller brush 37 is rotated. In addition, the roller brush 37 of the brush mechanism unit 31 is not limited to being rotated manually, and may also be rotated by a drive mechanism.

[0057] When the roller brush 37 of the brush mechanism unit 31 moving upward contacts the positioning substrates SGR, SGC, and SGL, due to the movement and rotation of the roller brush 37, the positioning substrates SGR, SGC, and SGL move. For example, the positioning substrates SGR, SGC, and SGL move in the upstream and downstream directions (refer to Figure 3 and Figure 4 arrow A in). Therefore, the movement of the positioning substrates SGR, SGC, and SGL is monitored, and the height position of the roller brush 37 of the brush mechanism unit 31 when the positioning substrates SGR, SGC, and SGL move is taken as the origin position.

[0058] At this time, when the roller brush 37 of the brush mechanism unit 31 is tilted, the positioning substrates SGR, SGC, and SGL move differently respectively. For example, when one side positioning substrate SGR moves, but the central and the other side positioning substrates SGC and SGL do not move, it can be known that the roller brush 37 of the brush mechanism unit 31 is tilted so as to be lower toward the other side. In this case, the height of the roller brush 37 of the brush mechanism unit 31 is adjusted at both ends so that all the positioning substrates SGR, SGC, and SGL move equally. Thereby, the tilt of the roller brush 37 is corrected.

[0059] (2) Positioning of the roller brush 37 of the upper brush mechanism unit 33

[0060] As Figure 5 shown, after the positioning of the roller brush 37 of the lower brush mechanism unit 31, the roller brush 37 of the lower brush mechanism unit 31 is moved downward ( Figure 5 in the direction of arrow D in) by the lifting mechanism to form a gap between the main surfaces of the positioning substrates SGR, SGC, and SGL and the roller brush 37 of the lower brush mechanism unit 31.

[0061] Next, the upper brush mechanism unit 33 in a state where the roller brush 37 is not in contact with the positioning substrates SGR, SGC, and SGL is moved downward little by little by the height adjustment mechanism to approach the positioning substrates SGR, SGC, and SGL, and the roller brush 37 is rotated manually. And the movement of the plurality of positioning substrates SGR, SGC, and SGL caused by the contact of the rotating roller brush 37 is monitored.

[0062] When the position of the roller brush 37 of the upper brush mechanism 33 is aligned, for example, the roller brush 37 moves downward by 0.1 mm at a time, and the rotation of the roller brush 37 is in one direction ( Figure 5 R1 direction) and another direction ( Figure 5 The roller brush 37 is rotated alternately in the direction of the arrow R2. That is, after the roller brush 37 is moved downward by 0.1 mm, the roller brush 37 is rotated. In addition, the roller brush 37 of the brush mechanism 33 is not limited to being rotated manually, but can also be rotated by a driving mechanism.

[0063] When the roller brush 37 of the brush mechanism 33 moving downward contacts the positioning substrates SGR, SGC, and SGL, the positioning substrates SGR, SGC, and SGL move due to the movement and rotation of the roller brush 37 (see Figure 3 and Figure 5 Arrow A in the middle). Therefore, the movement of the positioning substrates SGR, SGC, and SGL is monitored, and the height position of the roller brush 37 when the positioning substrates SGR, SGC, and SGL move is used as the origin position.

[0064] In addition, when the roller brush 37 of the brush mechanism 33 is tilted, and thus the movement of the positioning substrates SGR, SGC, and SGL is deviated, the height of the roller brush 37 is adjusted at both ends so that all the positioning substrates SGR, SGC, and SGL move in the same manner. In this way, the tilt of the roller brush 37 is corrected.

[0065] Also, in the above example, the roller brush 37 of the upper brush mechanism unit 33 is positioned after the roller brush 37 of the lower brush mechanism unit 31 is positioned, but the roller brush 37 of the lower brush mechanism unit 31 may be positioned after the roller brush 37 of the upper brush mechanism unit 33 is positioned.

[0066] As described above, according to the positioning method of the cleaning member involved in the first embodiment, the movement of the plurality of positioning substrates SGR, SGC, and SGL arranged in the path width direction PW orthogonal to the path line PL is monitored to position the height of the roller brush 37. Thus, compared with the case where the height of the roller brush 37 is positioned using a glass plate G whose width dimension extends throughout the path width direction PW, it is possible to suppress the reduction in positioning accuracy caused by the deflection of the glass plate G in the path width direction PW, and finely adjust the height of the roller brush 37 in the path width direction PW. In addition, by making the movement of the plurality of positioning substrates SGR, SGC, and SGL consistent, the inclination of the roller brush 37 can be corrected with high precision. Furthermore, by positioning the roller brush 37 using this positioning method, the roller brush 37 can be brought into uniform contact with the glass plate G in the path width direction PW, and the glass plate G can be cleaned well.

[0067] ​​<Second Embodiment>

[0068] Next, the second embodiment will be described.

[0069] In addition, the same components as those in the first embodiment described above are denoted by the same reference numerals and their description is omitted.

[0070] Figure 6 FIG. 10 is a schematic top view of a substrate cleaning apparatus 200 to which the positioning method of the cleaning member according to the second embodiment is applied, with the upper brush mechanism portion 43 omitted. Figure 7 FIG. 11 is a schematic side view of a substrate cleaning apparatus 200 to which the positioning method of the cleaning member according to the second embodiment is applied.

[0071] As Figure 6 and Figure 7 shown, in a substrate cleaning apparatus 200 to which the positioning method of the cleaning member according to the second embodiment is applied, the cleaning processing unit 13 includes a pair of brush mechanism portions 41 and 43. The brush mechanism portions 41 and 43 are arranged along the path width direction PW at upper and lower relative positions across the path line PL. Specifically, one brush mechanism portion 41 is arranged below the path line PL, and the other brush mechanism portion 43 is arranged above the path line PL.

[0072] The brush mechanism portions 41 and 43 have a frame 45 and a plurality of disk brushes 47 provided on the frame 45. The disk brushes 47 are arranged in the length direction of the frame 45. The lower brush mechanism portion 41 has disk brushes 47 arranged on the upper side of the frame 45, and the upper brush mechanism portion 43 has disk brushes 47 arranged on the lower side of the frame 45. The disk brushes 47 are each rotated about an axis in the vertical direction by a rotating shaft 49. Adjacent disk brushes 47 rotate in opposite directions.

[0073] The disk brush 47 has a brush portion 48. The brush portion 48 is, for example, a brush made of nylon (nylon 6, nylon 610, nylon 612) or the like with a wire diameter of 0.05 mm to 0.1 mm and a length of about 10 mm to 20 mm. In addition, the disk brush 47 may not be a brush but a sponge made of a resin such as PVA (polyvinyl alcohol) or polyurethane.

[0074] These brush mechanism portions 41 and 43 each include a lifting mechanism (not shown), and are lifted and lowered in the vertical direction by the lifting mechanism. In addition, height adjustment mechanisms (not shown) are provided at both ends of the frame 45, and height adjustment can be performed at both ends of the frame 45. The lower brush mechanism portion 41 is positioned by the height adjustment mechanism so that its disk brush 47 contacts the main surface on the back side of the glass plate G conveyed along the path line PL. Similarly, the upper brush mechanism portion 43 is positioned by the height adjustment mechanism so that its disk brush 47 contacts the main surface on the front side of the glass plate G conveyed along the path line PL.

[0075] Further, in the cleaning section 13 of the substrate cleaning apparatus 200, a glass plate G conveyed in the conveying direction X is sprayed with a cleaning liquid such as a slurry containing cerium oxide, a cleaning agent (alkaline or acidic), or pure water from a nozzle (not shown) onto its main surface, and the disk brush 47 of the brush mechanism sections 41 and 33 contacts the main surface while rotating. Thus, the main surface of the glass plate G is cleaned, and for example, attachments such as paper powder and particles of the backing paper interposed between the front and back surfaces when stacked and bundled are removed from the main surface of the glass plate G.

[0076] Next, the process of positioning the disk brushes 47 of the brush mechanism sections 41 and 43 in the substrate cleaning apparatus 200 will be described.

[0077] Figure 8 FIG. is a schematic top view of the substrate cleaning apparatus 200 for explaining the positioning process of the disk brush 47, with the upper brush mechanism section 41 omitted. Figure 9 FIG. is a schematic side view of the substrate cleaning apparatus 200 for explaining the positioning process of the lower disk brush 47. Figure 10 FIG. is a schematic side view of the substrate cleaning apparatus 200 for explaining the positioning process of the upper disk brush 47.

[0078] (Preparation of positioning substrates)

[0079] As Figure 8 shown, a plurality of (three in this example) positioning substrates SGR, SGC, and SGL for performing the positioning operation are prepared.

[0080] (Substrate alignment process)

[0081] As Figure 8 and Figure 9 shown, the positioning substrates SGR, SGC, and SGL are sequentially aligned in the path width direction PW and mounted on the conveying rollers 11 adjacent to the upstream and downstream of the brush mechanism sections 41 and 43.

[0082] (Positioning process)

[0083] Next, the height adjustment of the disk brushes 47 of the brush mechanism sections 41 and 43 is performed sequentially. In this example, the case where the height adjustment of the disk brush 47 of the lower brush mechanism section 41 is first performed and then the height adjustment of the disk brush 47 of the upper brush mechanism section 43 is performed will be described.

[0084] (1) Positioning of the disk brush 47 of the lower brush mechanism section 41

[0085] As Figure 9 shown, the upper brush mechanism section 43 is moved upward by the lifting mechanism ( Figure 9It moves in the direction of arrow U so as to form a gap between the main surfaces of the positioning substrates SGR, SGC, and SGL and the disk brush 47 of the upper brush mechanism portion 43.

[0086] Next, using the height adjustment mechanism, the lower brush mechanism portion 41 in a state where the disk brush 47 is not in contact with the positioning substrates SGR, SGC, and SGL is moved little by little upward to approach the positioning substrates SGR, SGC, and SGL, and the disk brush 47 of this brush mechanism portion 41 is manually rotated. Also, the movement of the plurality of positioning substrates SGR, SGC, and SGL caused by the contact of the rotating disk brush 47 is monitored.

[0087] For example, the upward movement of the brush mechanism portion 41 is performed by 0.1 mm each time. In addition, the rotation of the disk brush 47 of the brush mechanism portion 41 is performed alternately in one direction ( Figure 9 arrow R3 direction in Figure 9 and the other direction (

[0088] arrow R4 direction in Figure 8 ). That is, after moving the brush mechanism portion 41 upward by 0.1 mm, the disk brush 47 is rotated. In addition, the disk brush 47 is not limited to being rotated manually, and may also be rotated by a drive mechanism.

[0089] When the disk brush 47 of the brush mechanism portion 41 moving upward comes into contact with the positioning substrates SGR, SGC, and SGL, due to the movement and rotation of the disk brush 47, the positioning substrates SGR, SGC, and SGL move. For example, the positioning substrates SGR, SGC, and SGL swing in a plan view (refer to

[0090] (2) Positioning of the upper brush mechanism portion 43

[0091] As Figure 10 shown, using the lifting mechanism, the lower brush mechanism portion 41 is moved downward ( Figure 10 arrow D direction in

[0092] so as to form a gap between the main surface of the positioning substrates SGR, SGC, and SGL and the disk brush 47 of the lower brush mechanism portion 41.Next, the upper brush mechanism portion 43 in a state where the disk brush 47 does not contact the positioning substrates SGR, SGC, and SGL is moved downward little by little by the height adjustment mechanism to approach the positioning substrates SGR, SGC, and SGL, and the disk brush 47 of the brush mechanism portion 43 is manually rotated. Moreover, the movement of the plurality of positioning substrates SGR, SGC, and SGL caused by the contact of the rotating disk brush 47 is monitored.

[0093] For example, the downward movement of the brush mechanism portion 43 is performed by 0.1 mm each time. In addition, the rotation of the disk brush 47 of the brush mechanism portion 43 is alternately performed in one direction ( Figure 10 the direction of arrow R3 in ) and the other direction ( Figure 10 the direction of arrow R4 in ). That is, after the brush mechanism portion 43 is moved downward by 0.1 mm, the disk brush 47 is rotated. In addition, the disk brush 47 is not limited to being rotated manually, and may be rotated by a driving mechanism.

[0094] When the disk brush 47 of the brush mechanism portion 43 moving downward contacts the positioning substrates SGR, SGC, and SGL, due to the movement and rotation of the disk brush 47, the positioning substrates SGR, SGC, and SGL move (refer to Figure 8 arrow B in ). Therefore, the movement of the positioning substrates SGR, SGC, and SGL is monitored, and the height position of the brush mechanism portion 43 when the positioning substrates SGR, SGC, and SGL move is taken as the origin position.

[0095] In addition, when the movement of the positioning substrates SGR, SGC, and SGL deviates due to the inclination of the brush mechanism portion 43, the height of the brush mechanism portion 43 is adjusted at both ends so that all the positioning substrates SGR, SGC, and SGL move equally. Thereby, the inclination of the brush mechanism portion 43 is corrected.

[0096] In addition, in the above example, the positioning of the disk brush 47 of the upper brush mechanism portion 43 is performed after the positioning of the disk brush 47 of the lower brush mechanism portion 41, but the positioning of the disk brush 47 of the lower brush mechanism portion 41 may also be performed after the positioning of the disk brush 47 of the upper brush mechanism portion 43.

[0097] As described above, according to the positioning method of the cleaning member according to the second embodiment, the movement of the plurality of positioning substrates SGR, SGC, and SGL arranged in the path width direction PW orthogonal to the path line PL is monitored to position the height of the disk brush 47. Thus, compared with the case where the height of the disk brush 47 is positioned using a single glass plate G with a width dimension extending over the path width direction PW, it is possible to suppress a decrease in positioning accuracy caused by the deflection of the glass plate G in the path width direction PW, and finely adjust the height of the disk brush 47 in the path width direction PW. In addition, by making the movements of the plurality of positioning substrates SGR, SGC, and SGL consistent, it is possible to accurately correct the inclination of the arrangement of the disk brush 47. And by positioning the disk brush 47 using this positioning method, the disk brush 47 can be uniformly brought into contact with the glass plate G in the path width direction PW, and the glass plate G can be cleaned well.

[0098] In addition, in the above-described embodiment, the case of using three positioning substrates SGR, SGC, and SGL is illustrated, but the number of positioning substrates may be plural, and is not limited to three.

[0099] As described above, the present invention is not limited to the above-described embodiment, and it is within the scope of the present invention to combine the respective structures of the embodiment, and for those skilled in the art to make changes and applications based on the description of the specification and known techniques.

[0100] As described above, the following matters are disclosed in the present specification.

[0101] (1) A positioning method of a cleaning member in a substrate cleaning apparatus, the substrate cleaning apparatus including: a plurality of conveying rollers that convey a glass plate along a horizontal conveying path; and the cleaning member that is disposed at at least one of the upper and lower sides of the conveying path in the path width direction orthogonal to the conveying path at at least one position between two adjacent conveying rollers, and rotates while contacting the glass plate conveyed by the conveying rollers to clean the main surface, wherein

[0102] a plurality of positioning substrates are arranged in the path width direction and installed on the conveying rollers adjacent to the upstream and downstream of the conveying path of the cleaning member, and

[0103] the cleaning member is brought close to the positioning substrates, and the cleaning member is rotated, and the movement of the plurality of positioning substrates is monitored to position the height of the cleaning member.

[0104] According to the positioning method of the cleaning member, the movement of a plurality of positioning substrates arranged in the path width direction orthogonal to the conveying path is monitored to position the height of the cleaning member. Thus, compared with the case of positioning the height of the cleaning member using a single glass plate with a width dimension covering the path width direction, it is possible to suppress a decrease in positioning accuracy caused by the flexure of the glass plate in the path width direction, and finely adjust the height of the cleaning member in the path width direction. In addition, by making the movements of the plurality of positioning substrates consistent, it is possible to accurately correct the inclination of the cleaning member. Moreover, by positioning the cleaning member using this positioning method, it is possible to make the cleaning member uniformly contact the glass plate in the path width direction and clean the glass plate well.

[0105] (2) According to the positioning method of the cleaning member described in (1), a glass plate is used as the positioning substrate.

[0106] According to the positioning method of the cleaning member, since a glass plate made of the same material as the actually conveyed glass plate is used as the positioning substrate, it is possible to accurately position the cleaning member according to the conditions during actual cleaning processing.

[0107] (3) According to the positioning method of the cleaning member described in (2), a protective member is used to cover the outer peripheral edge of the positioning substrate composed of the glass plate.

[0108] According to the positioning method of the cleaning member, it is possible to suppress breakage and damage of the positioning substrate during positioning operations and smoothly perform the positioning operations.

[0109] (4) According to the positioning method of the cleaning member described in any one of (1) to (3), the cleaning member is provided above and below the conveying path, and for the upper and lower cleaning members, the positioning of the other is performed after the positioning of one.

[0110] According to the positioning method of the cleaning member, it is possible to accurately position the upper and lower cleaning members respectively.

[0111] (5) According to the positioning method of the cleaning member described in any one of (1) to (4), the cleaning member is a roller brush that rotates around a rotation axis in the path width direction.

[0112] According to the positioning method of the cleaning member, it is possible to accurately position the roller brush in the path width direction.

[0113] (6) According to the positioning method of the cleaning member described in any one of (1) to (4), the cleaning member is a plurality of disk brushes arranged in a frame arranged in the path width direction and rotating around a rotation axis in the up and down direction.

[0114] According to the positioning method of this cleaning member, multiple disk brushes arranged in the path width direction can be accurately positioned respectively.

[0115] This application is based on Japanese Patent Application No. 2023-195975 filed on November 17, 2023, the content of which is incorporated herein by reference.

[0116] Reference numeral description

[0117] 11 Conveyor roller;

[0118] 35 Rotating shaft;

[0119] 37 Roller brush (cleaning member);

[0120] 45 Frame;

[0121] 47 Disk brush (cleaning member);

[0122] 49 Rotating shaft;

[0123] 100, 200 Substrate cleaning device;

[0124] G Glass plate;

[0125] PL Path line (conveyor path);

[0126] PW Path width direction;

[0127] SGR, SGC, SGL Substrate for positioning.

Claims

1. A method for positioning a cleaning member in a substrate cleaning device, the substrate cleaning device comprising: a plurality of conveying rollers conveying a glass plate along a conveying path in a horizontal direction; and the cleaning member being arranged at least one of the upper and lower sides of the conveying path along a path width direction orthogonal to the conveying path at at least one point between two adjacent conveying rollers, and contacting the glass plate conveyed by the conveying rollers while rotating to clean the main surface thereof, wherein: A plurality of positioning substrates are arranged in the width direction of the path and are mounted on the conveying rollers adjacent to each other upstream and downstream of the conveying path of the cleaning member, and The cleaning member is brought close to the positioning substrate and rotated, and the height of the cleaning member is positioned by monitoring the movement of the plurality of positioning substrates.

2. The method for positioning a cleaning member according to claim 1, wherein: A glass plate was used as the positioning substrate.

3. The method for positioning a cleaning member according to claim 2, wherein: The outer periphery of the positioning substrate formed of a glass plate is covered with a protective member.

4. The method for positioning a cleaning member according to claim 1, wherein: The cleaning members are provided above and below the conveying path, and after one of the upper and lower cleaning members is positioned, the other is positioned.

5. The method for positioning a cleaning member according to any one of claims 1 to 4, wherein: The cleaning member is a roller brush that rotates around a rotation axis in the path width direction.

6. The method for positioning a cleaning member according to any one of claims 1 to 4, wherein: The cleaning member is a plurality of disc brushes arranged on a frame arranged in the path width direction and rotating around a rotation axis in the vertical direction.

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