Display device and method of manufacturing same

Abstract

A display device and a method of manufacturing the same are disclosed. The display device includes: a display panel including a first portion and a second portion bent in one direction from the first portion and disposed to overlap the first portion; a driving integrated circuit (IC) chip disposed on the second portion; and a printed circuit board including a bending unit bent in a direction opposite to the one direction and a wiring unit extending from the bending unit and disposed to overlap the first portion and the second portion.

Description

[0001] This application claims priority to and all benefits derived from Korean Patent Application No. 10-2023-0161370, filed on November 20, 2023, the contents of which are incorporated herein by reference in their entirety. Technical Field

[0002] Embodiments of the present invention relate to a display device and a method of manufacturing the display device. Background Art

[0003] In recent years, interest in information display has been increasing. In particular, as demand for high-quality display devices increases, research and development of display devices continues.

[0004] A display device including a display panel may include a printed circuit board (PCB), and electronic components inside the display device may be connected to the printed circuit board to receive power or transmit and receive signals. Summary of the invention

[0005] Embodiments of the present invention provide a display device having improved ease of design and a method of manufacturing the display device.

[0006] An embodiment of the present invention relates to a display device. The display device according to the embodiment of the present invention includes: a display panel including a first portion and a second portion bent in one direction from the first portion and arranged to overlap with the first portion; a driving integrated circuit (IC) chip arranged on the second portion; and a printed circuit board including a bending unit bent in a direction opposite to the one direction and a wiring unit extending from the bending unit and arranged to overlap with the first portion and the second portion.

[0007] In an embodiment, the second portion may include an input pad unit, and the printed circuit board may further include an output pad unit disposed on the input pad unit and electrically connected to the input pad unit.

[0008] In an embodiment, the bending unit may extend from the output pad unit.

[0009] In an embodiment, the wiring unit may be adhered to the display panel by an adhesive member.

[0010] In an embodiment, the adhesive member may include a first adhesive member that adheres the wiring unit to the first portion and a second adhesive member that adheres the wiring unit to the second portion.

[0011] In an embodiment, the printed circuit board may further include a protection layer having a predetermined curvature and disposed on the bending unit.

[0012] In an embodiment, the protective layer may include resin.

[0013] In an embodiment, the first portion may include a first sub-portion extending in a direction perpendicular to the one direction to a portion where the first portion overlaps with an end portion of the bending unit that protrudes most in a direction opposite to the direction, and a second sub-portion between the first sub-portion and the second portion, and the first sub-portion may include a supporting unit protruding in the one direction.

[0014] In an embodiment, the supporting unit may be spaced apart from the bending unit, and may have a shape surrounding the bending unit.

[0015] Another embodiment of the present invention relates to a method for manufacturing a display device. The method for manufacturing a display device according to an embodiment of the present invention includes: providing a display panel, the display panel including a first portion and a second portion different from the first portion and including an area where a driver IC chip is disposed; disposing a printed circuit board on an upper surface of the second portion so as not to overlap the area; bending the printed circuit board in such a manner that the printed circuit board is disposed on a rear surface of the second portion; and bending the second portion in such a manner that the printed circuit board overlaps the first portion and the second portion.

[0016] In an embodiment, the second portion may include an input pad unit, and the printed circuit board may include an output pad unit disposed on and electrically connected to the input pad unit, and a bending unit bent from the output pad unit.

[0017] In an embodiment, the printed circuit board may include a wiring unit extending from the bending unit, and the wiring unit may be adhered to the display panel by the first adhesive member and the second adhesive member.

[0018] In an embodiment, the wiring unit may be adhered to the rear surface of the second portion by a first adhesive member.

[0019] In an embodiment, the wiring unit may be adhered to the rear surface of the first portion by a second adhesive member.

[0020] In an embodiment, the method of manufacturing a display device may further include: forming a protection layer having a predetermined curvature on the bending unit.

[0021] In an embodiment, the protective layer may include resin.

[0022] In an embodiment, the first portion may include a first sub-portion extending in one direction to a portion where the first portion overlaps with an end portion of the bending unit that protrudes most in a direction opposite to the one direction, and a second sub-portion between the first sub-portion and the second portion, and the first sub-portion may include a supporting unit protruding in a direction perpendicular to the one direction.

[0023] In an embodiment, the supporting unit may be spaced apart from the bending unit, and may have a shape surrounding the bending unit. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] The above and other features of the present invention will become more apparent by further describing the embodiments of the present invention in detail with reference to the accompanying drawings, in which:

[0025] Figure 1 is a perspective view of a display panel according to an embodiment of the present invention;

[0026] Figure 2 is a plan view of a display panel according to an embodiment of the present invention;

[0027] Figure 3 It includes according to Figure 1 A perspective view of a display device of a display panel of an embodiment;

[0028] Figure 4 It includes according to Figure 2 A plan view of a display device of a display panel of an embodiment;

[0029] Figure 5 is a flowchart illustrating a method of manufacturing a display device according to an embodiment of the present invention;

[0030] Figure 6 is a side view illustrating a display device according to an embodiment of the present invention;

[0031] Figure 7 The printed circuit board is in a bent state. Figure 6 A side view of a display device;

[0032] Figure 8 The display panel is in a bent state. Figure 7 A side view of a display device;

[0033] Fig. 9 is a side view of a display device according to an embodiment of the present invention; and

[0034] Fig.10 is a side view of a display device according to an embodiment of the present invention. DETAILED DESCRIPTION

[0035] The present invention will now be described more fully below with reference to the accompanying drawings in which various embodiments are shown. However, the present invention can be implemented in many different forms and should not be construed as being limited to the embodiments set forth herein. On the contrary, these embodiments are provided so that the present disclosure will be thorough and complete, and will fully convey the scope of the present invention to those skilled in the art. The same reference numerals always refer to the same elements.

[0036] It will be understood that when an element is referred to as being “on” another element, it can be directly on the other element or intervening elements may be present therebetween. In contrast, when an element is referred to as being “directly on” another element, there are no intervening elements present.

[0037] Throughout the specification, when a part is “connected” to another part, this case includes not only a case where the part is “directly connected” to the other part but also a case where the part is “indirectly connected” to the other part with another element interposed therebetween.

[0038] The term used in this article is only used to describe the purpose of specific embodiments, and is not intended to be limited. As used in this article, "one", "the (described)" and "at least one" do not represent the limitation of quantity, and unless the context clearly indicates otherwise, it is intended to include both singular and plural. Therefore, the reference to "one" element in the claim (followed by the reference to "described" element) includes one element and multiple elements. For example, unless the context clearly indicates otherwise, "element" has the same meaning as "at least one element". "At least one" should not be interpreted as being limited to "one". "Or" means "and / or". As used in this article, the term "and / or" includes any combination and all combinations of one or more related listed items. "At least one of X, Y and Z" and "selected from at least one of X, Y and Z" can be interpreted as any combination of only X, only Y, only Z or two or more of X, Y and Z (for example, XYZ, XY, YZ and XZ). It will be further understood that when used in this specification, the terms “comprises” or “includes” and / or variations thereof indicate the presence of stated features, regions, integers, steps, operations, elements and / or parts, but do not exclude the presence or addition of one or more other features, regions, integers, steps, operations, elements, parts and / or groups thereof.

[0039] It will be understood that although the terms "first", "second", "third", etc. may be used herein to describe various elements, components, regions, layers and / or portions, these elements, components, regions, layers and / or portions should not be limited by these terms. These terms are only used to distinguish one element, component, region, layer or portion from another element, component, region, layer or portion. Therefore, the first element, component, region, layer or portion discussed below may be referred to as a second element, component, region, layer or portion without departing from the teachings herein.

[0040] Spatially relative terms such as "under" and "on" can be used for descriptive purposes to describe the relationship between one element or feature and another (other) element or feature as shown in the drawings. In addition to the orientation depicted in the drawings, spatially relative terms are intended to include other orientations of the device in use, in operation and / or in manufacture. For example, when the device shown in the drawings is reversed, an element depicted as being positioned "under" other elements or features will be positioned "on" the other elements or features. Therefore, in an embodiment, the term "under" can include two orientations of upper and lower. In addition, the device can be oriented in other ways (e.g., rotated 90 degrees or in other orientations), and the spatially relative terms used in this article are therefore interpreted accordingly.

[0041] Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as those commonly understood by those of ordinary skill in the art to which the present disclosure belongs. It will be further understood that terms (such as those defined in general dictionaries) should be interpreted as having a meaning consistent with their meaning in the context of the relevant art and the present disclosure, and will not be interpreted in an idealized or overly formal sense unless explicitly so defined herein.

[0042] Embodiments are described herein with reference to cross-sectional illustrations that are schematic illustrations of ideal embodiments. As such, variations in the shapes of the illustrations, for example due to manufacturing techniques and / or tolerances, are contemplated. Therefore, the embodiments described herein should not be construed as being limited to the specific shapes of the zones as illustrated herein, but rather to include deviations in shapes, for example due to manufacturing. For example, a zone illustrated or described as flat may typically have rough and / or nonlinear features. Moreover, the illustrated sharp corners may be rounded. Therefore, the zones illustrated in the accompanying drawings are schematic in nature, and their shapes are not intended to illustrate the precise shapes of the zones and are not intended to limit the scope of the invention.

[0043] Figure 1 is a perspective view of a display panel according to an embodiment of the present invention. Figure 2 is a plan view of a display panel according to an embodiment of the present invention.

[0044] In an embodiment, when the display panel DP is in an unfolded state, the front surface DP-FS of the display panel DP may be parallel to a plane defined by the first direction axis DR1 and the second direction axis DR2. The normal direction of the front surface DP-FS of the display panel DP (i.e., the thickness direction of the display panel DP) may be indicated by the third direction axis DR3. The upper surface (or front surface) and the lower surface (or rear surface) of each of the layers constituting the display panel DP may be determined or defined based on the third direction axis DR3. In the following, the first to third directions may be directions indicated by the first to third direction axes DR1, DR2, and DR3, respectively, and the same reference numerals are used.

[0045] Reference Figure 1 , on the front surface DP-FS, the display panel DP may include a display area DP-DA where the pixels PX are disposed and a non-display area DP-NDA adjacent to the display area DP-DA. The non-display area DP-NDA may be an area where the pixels PX are not disposed. Some of the signal lines SGL and / or the drive circuit GDC may be disposed in the non-display area DP-NDA.

[0046] According to an embodiment, the display area DP-DA may have a rectangular shape. The non-display area DP-NDA may surround the display area DP-DA. However, the present invention is not limited thereto, and the shape of the display area DP-DA and the shape of the non-display area DP-NDA may be relatively designed. In an embodiment, for example, the non-display area DP-NDA may be provided only in areas facing each other in the first direction DR1. The display area DP-DA may have a circular shape.

[0047] The display panel DP may be bent. Since the display panel DP is bent, the display panel DP may be divided into a second area BA and a first area NBA which is a non-bending area. In an embodiment, for example, the second area BA of the display panel DP may include a bending area BA-DP, and the bending area BA-DP may be bent in a direction opposite to the third direction DR3. Accordingly, the bending area BA-DP may have a predetermined curvature, so that the display panel DP may be divided into the first area NBA and the second area BA.

[0048] Reference Figure 1 and Figure 2 , an embodiment of the display panel DP may include a driving circuit GDC, a plurality of signal lines SGL, a plurality of input pads DP-PD, and a plurality of pixels PX.

[0049] The pixels PX may be divided into a plurality of groups based on the displayed color. The pixels PX may include, for example, red pixels, green pixels, and blue pixels. The pixels PX may further include white pixels. Even if the pixels PX are divided into different groups based on the displayed color, the pixel driving circuits of the pixels may be the same as each other.

[0050] The driving circuit GDC may include a scan driving circuit. The scan driving circuit may generate a plurality of scan signals and sequentially output the scan signals to a plurality of scan lines GL, which will be described later. The scan driving circuit may further output another control signal to the pixel driving circuit of the pixel PX.

[0051] The scan driving circuit may include a plurality of thin film transistors formed through the same process (eg, a low temperature polysilicon (LTPS) process or a low temperature polycrystalline oxide (LTPO) process) as the pixel driving circuit of the pixel PX.

[0052] The signal line SGL may include a scan line GL, a data line DL, a power line PL, and a control signal line CSL. The scan line GL may be connected to a corresponding pixel among the pixels PX, and the data line DL may be connected to a corresponding pixel among the pixels PX. The power line PL may be connected to the pixel PX. The control signal line CSL may provide a control signal to the scan driving circuit. The input pads DP-PD may be connected to the corresponding signal lines among the signal lines SGL.

[0053] Figure 3 It includes according to Figure 1 A perspective view of a display device of a display panel of an embodiment. Figure 4 It includes according to Figure 2 A plan view of a display device of a display panel of an embodiment.

[0054] Reference Figure 3 and Figure 4 , an embodiment of the display device DD may include a display panel DP, a driving integrated circuit (IC) chip DIC, and a printed circuit board PCB. Figure 3 and Figure 4 The display panel DP can be Figure 1 and Figure 2 The display panel DP is substantially the same as or similar to the above-described display panel DP. Hereinafter, any repeated detailed description of elements that are the same as or similar to the above-described elements will be omitted.

[0055] The display panel DP may include wirings connecting the driving IC chip DIC and the printed circuit board PCB. In an embodiment, for example, the display panel DP may include connection lines CL that transmit and receive electrical signals between the driving IC chip DIC and the printed circuit board PCB.

[0056] The driver IC chip DIC may be disposed on the display panel DP. In an embodiment, for example, the driver IC chip DIC may be mounted on the non-display area DP-NDA. According to an embodiment, the driver IC chip DIC may be disposed on the display panel DP using a chip on glass (COG) method or a chip on plastic (COP) method.

[0057] The driving IC chip DIC may be connected to the signal line SGL. In an embodiment, for example, the driving IC chip DIC may be connected to the data line DL and the control signal line CSL.

[0058] The printed circuit board PCB may be disposed on the display panel DP. In an embodiment, for example, the printed circuit board PCB may be disposed on the display panel DP to contact the input pads DP-PD (see Figure 2 ) overlap. Accordingly, the printed circuit board PCB can be electrically connected to the display panel DP through the input pads DP-PD. In an embodiment, for example, the printed circuit board PCB can be electrically connected to the driver IC chip DIC and the display panel DP via the input pads DP-PD and the connection lines CL.

[0059] In this specification, the expression "electrically connected" may include not only a structure in which a first electrical component and a second electrical component are directly connected but also a structure in which the first electrical component and the second electrical component are connected with other electrical components interposed therebetween.

[0060] The printed circuit board PCB may be a flexible printed circuit board. Accordingly, the printed circuit board PCB may be bent in a direction opposite to the third direction DR3.

[0061] The printed circuit board PCB may include a third area BA-PCB and a fourth area NBA-PCB. In an embodiment, for example, the printed circuit board PCB may include a third area BA-PCB bent in a direction opposite to the third direction DR3. In addition, when the third area BA-PCB is bent, the printed circuit board PCB may include a fourth area NBA-PCB disposed on the rear surface of the display panel DP.

[0062] The printed circuit board PCB may transmit a signal received from the outside. In an embodiment, for example, the printed circuit board PCB may be connected to the display panel DP and the driving IC chip DIC to supply a signal received from the outside.

[0063] Next, we will refer to Figures 5 to 8 A method of manufacturing a display device according to an embodiment of the present invention is described.

[0064] Figure 5 is a flowchart illustrating a method of manufacturing a display device according to an embodiment of the present invention. Figure 6is a side view illustrating a display device according to an embodiment of the present invention. Figure 7 The printed circuit board is in a bent state. Figure 6 A side view of a display device. Figure 8 The display panel is in a bent state. Figure 7 A side view of a display device.

[0065] Reference Figure 5 According to an embodiment, the method for manufacturing a display device may include providing (or preparing) a display panel (S510), disposing a printed circuit board so as not to overlap with an area (S520), bending the printed circuit board so that the printed circuit board is disposed on a rear surface of the second portion (or bending the printed circuit board in such a manner that the printed circuit board is disposed on the rear surface of the second portion) (S530), and bending the second portion so that the printed circuit board overlaps with the first portion and the second portion (S540).

[0066] Reference Figure 1 , Figure 5 and Figure 6 In operation S510, a display panel DP may be provided. In an embodiment, for example, a display panel DP including a first portion DP1 and a second portion DP2 different from the first portion DP1 may be provided. The first portion DP1 may be a portion of the display panel DP overlapping the first area NBA. The second portion DP2 may be a portion of the display panel DP overlapping the second area BA and adjacent to the first portion DP1.

[0067] In operation S510, a driving IC chip DIC may be disposed on the display panel DP. In an embodiment, for example, the driving IC chip DIC may be disposed on a region of the second portion DP2 overlapping the second area BA.

[0068] The display panel DP may include an input pad unit DP-PDU. In an embodiment, for example, the display panel DP may include an input pad DP-PDU (see Figure 2 )’s input pad unit DP-PDU.

[0069] The input pad unit DP-PDU may be disposed in the second portion DP2. In an embodiment, for example, the input pad unit DP-PDU may be disposed in the second portion DP2 so as not to overlap with the driver IC chip DIC. The input pad unit DP-PDU may receive an electrical signal from the outside through the input pad DP-PD.

[0070] Reference Figure 3 , Figure 5 and Figure 6In operation S520, the printed circuit board PCB may be disposed not to overlap with a region. In an embodiment, for example, the printed circuit board PCB may be disposed not to overlap with a region of the upper surface of the second portion DP2 where the driver IC chip DIC is disposed.

[0071] The printed circuit board PCB may include an output pad unit PCB-PDU. In an embodiment, for example, the printed circuit board PCB may include an output pad unit PCB-PDU arranged to overlap with the input pad unit DP-PDU. Although not shown, the output pad unit PCB-PDU may include a plurality of output pads. The output pads may be electrically connected to the input pads PD-PD, respectively. Accordingly, the printed circuit board PCB may be electrically connected to the display panel DP and the driver IC chip DIC.

[0072] The printed circuit board PCB may further include a bending unit BU and a wiring unit WU extending from the bending unit BU. In an embodiment, for example, the printed circuit board PCB may further include a bending unit BU arranged to overlap with the third area BA-PCB and a wiring unit WU arranged to overlap with the fourth area NBA-PCB. The bending unit BU may extend from the output pad unit PCB-PDU. The wiring unit WU may include a plurality of wirings. In such an embodiment, the third area BA-PCB and the fourth area NBA-PCB may not overlap with the first area NBA and the second area BA.

[0073] Refer to Figures 6 to 8 In operation S530, a first adhesive member TP1 and a second adhesive member TP2 may be disposed on the printed circuit board PCB. In an embodiment, for example, the first adhesive member TP1 and the second adhesive member TP2 may be disposed on the rear surface and the front surface of the wiring unit WU, respectively. Accordingly, the wiring unit WU may be bonded to the first portion DP1 and the second portion DP2.

[0074] Reference Figure 5 and Figure 7 In operation S530, the printed circuit board PCB may be bent so that the printed circuit board PCB is disposed on the rear surface of the second portion DP2. In an embodiment, for example, the third area BA-PCB of the printed circuit board PCB may be bent in a direction opposite to the third direction DR3. Accordingly, the bending unit BU may be bent at a predetermined curvature. In this case, the wiring unit WU of the printed circuit board PCB may be disposed on the rear surface of the second portion DP2. In an embodiment, for example, the fourth area NBA-PCB may be disposed to overlap the second area BA.

[0075] According to an embodiment, the printed circuit board PCB may be bent more than twice. In an embodiment, for example, the printed circuit board PCB may include a plurality of bending units, each of which may be bent, and thus the printed circuit board PCB may be bent twice or more.

[0076] In an embodiment, the wiring unit WU may be bonded to the second portion DP2 by an adhesive member. In an embodiment, for example, a first adhesive member TP1 may be provided on the rear surface of the wiring unit WU. Thereafter, the wiring unit WU may be provided on the second portion DP2, and the first adhesive member TP1 may be brought into contact with the rear surface of the second portion DP2. Accordingly, the wiring unit WU may be bonded to the rear surface of the second portion DP2.

[0077] Reference Figure 5 and Figure 8 , in operation S540, the second part DP2 may be bent so that the printed circuit board PCB is arranged to overlap with the first part DP1 and the second part DP2. In an embodiment, for example, the second part DP2 may be bent in a direction opposite to the third direction DR3. In this case, the second part DP2 may overlap with the first part DP1. A wiring unit WU of the printed circuit board PCB may be arranged on the rear surface of the first part DP1. Accordingly, the risk of electrical interference between the wiring unit WU and the input pad unit DP-PDU can be relatively reduced. In an embodiment, for example, the wiring unit WU may include an electronic circuit arranged to send and receive electrical signals. In such an embodiment, the wiring unit WU may be arranged to be spaced apart from the input pad unit DP-PDU in the third direction DR3, and the second part DP2 is inserted therebetween. Accordingly, the occurrence of electrical interference between the electronic circuit included in the wiring unit WU and the input pad unit DP-PDU can be significantly reduced or effectively prevented.

[0078] In this operation, the third area BA-PCB may be set to overlap the first area NBA. In addition, the fourth area NBA-PCB may be set to overlap the first area NBA and the second area BA. In this operation, the bending unit BU may be set to be bent in the third direction DR3.

[0079] In this operation, the wiring unit WU may be bonded to the first portion DP1 by the bonding member. In an embodiment, for example, a second bonding member TP2 may be provided on the front surface of the wiring unit WU. Thereafter, since the second portion DP2 is bent, the wiring unit WU may be provided on the first portion DP1 and the second bonding member TP2 may be brought into contact with the rear surface of the first portion DP1. Accordingly, the wiring unit WU may be bonded to the rear surface of the first portion DP1.

[0080] According to an embodiment of the present invention, it is possible to improve the ease of designing the display device DD. For example, in the case where a plurality of electronic components for driving the display device DD can be disposed on the rear surface of the display panel DP, it may be desirable for the display device DD to provide a component space ES in which the electronic components are disposed on the rear surface of the display panel DP (e.g., the rear surface of the first portion DP1).

[0081] In the case where the printed circuit board PCB of the display device DD is not bent and only the display panel DP is bent, the printed circuit board PCB may extend in a direction parallel to the second portion DP2 (e.g., a direction opposite to the first direction DR1). Accordingly, the first portion DP1 and the second portion DP2 may be spaced apart from each other in the third direction DR3, so that an empty space may exist between the first portion DP1 and the second portion DP2. Accordingly, a filling member may need to be provided to fill the empty space between the first portion DP1 and the second portion DP2. In addition, the component space ES provided on the rear surface of the first portion DP1 may be relatively reduced, and the ease of designing the display device DD may be reduced.

[0082] In an embodiment of the present invention, as described above, the bending unit BU of the printed circuit board PCB is bent and the wiring unit WU is disposed between the first part DP1 and the second part DP2, so that the printed circuit board PCB can be disposed on the rear surface of the display panel DP, and the space occupied by the printed circuit board PCB can be relatively reduced. Accordingly, the component space ES can be relatively increased, and the display device DD can be manufactured so that the thickness of the display device DD (for example, the height in the third direction DR3) is relatively thin. In addition, according to an embodiment of the present invention, by arranging the wiring unit WU between the first part DP1 and the second part DP2, the display device DD can be manufactured without arranging a filling member between the first part DP1 and the second part DP2. Accordingly, the ease of designing the display device DD can be improved.

[0083] Fig. 9 is a side view of a display device according to an embodiment of the present invention.

[0084] Reference Fig. 9 , an embodiment of the display panel DP' may include a first portion DP1' and a second portion DP2. The printed circuit board PCB may include an output pad unit PCB-PDU, a bending unit BU and a wiring unit WU.

[0085] In addition to the support unit SU, Fig. 9 The display device DD and Figure 8 The display device DD is substantially the same as that described above, and any repeated detailed description of elements that are the same as or identical to those described above will be omitted.

[0086] In an embodiment, the first portion DP1 ′ may include a first sub-portion DP1_a and a second sub-portion DP1_b different from the first sub-portion DP1_a.

[0087] The first subportion DP1_a may be a portion extending in the first direction DR1 to a portion where the first portion DP1' overlaps with an end of the bending unit BU most protruding in a direction (eg, a direction opposite to the first direction DR1). The first subportion DP1_a may overlap the first area NBA.

[0088] The second subportion DP1_b may be disposed between the first subportion DP1_a and the second portion DP2. The second subportion DP1_b may overlap the third area BA-PCB and the fourth area NBA-PCB.

[0089] The first sub-portion DP1_a may include a support unit SU protruding in one direction. The support unit SU may protrude in a direction opposite to the third direction DR3 on a rear surface of the first sub-portion DP1_a.

[0090] The support unit SU may be disposed to be spaced apart from the bending unit BU by a predetermined distance. In addition, the support unit SU may have a shape surrounding the bending unit BU. In an embodiment, for example, the support unit SU may have a shape surrounding the bending unit BU having a predetermined curvature in the first direction DR1 and / or the third direction DR3. According to an embodiment, the support unit SU may have an "L" shape, may be spaced apart from the bending unit BU, and may cover the bending unit BU. However, this is only an example, and as long as the support unit SU can protect the printed circuit board PCB from external impact, its shape is not limited.

[0091] According to an embodiment of the present invention, the support unit SU can protect the printed circuit board PCB from external impact. For example, as described above, a plurality of electronic components can be arranged in the component space ES, and the corresponding electronic components may hit the printed circuit board PCB (e.g., the bending unit BU or the output pad unit PCB-PDU) in the first direction DR1 and / or the third direction DR3. In such an embodiment, the support unit SU can effectively prevent the printed circuit board PCB from colliding with the electronic components, and can effectively prevent the impact from being applied to the printed circuit board PCB.

[0092] Refer to Figure 5 , Figure 8 and Fig. 9After bending the second portion DP2 so that the printed circuit board PCB overlaps the first portion DP1' and the second portion DP2, the support unit SU may be disposed on the first sub-portion DP1_a. According to some embodiments, the method of manufacturing a display device according to an embodiment of the present invention may further include curing the support unit SU.

[0093] Fig.10 is a side view of a display device according to an embodiment of the present invention.

[0094] Reference Fig.10 , an embodiment of the display panel DP may include a first portion DP1 and a second portion DP2. The printed circuit board PCB' may include an output pad unit PCB-PDU, a bending unit BU, a wiring unit WU and a protection layer BL.

[0095] In addition to the protective layer BL, Fig.10 The display device DD can be used with Figure 8 The display device DD is substantially the same as that described above, and any repeated detailed description of elements that are the same as or identical to those described above will be omitted.

[0096] In an embodiment, Fig.10 As shown in , the protection layer BL may be formed on the bending unit BU and have a predetermined curvature. In an embodiment, for example, the protection layer BL may be formed by applying a material forming the protection layer BL onto the bending unit BU having a predetermined curvature. According to an embodiment, the protection layer BL may include a resin.

[0097] The protection layer BL may be a bending protection layer. In an embodiment, for example, the protection layer BL may be formed by coating a material including silicon on the bending unit BU several times.

[0098] Refer to Figure 5 , Figure 8 and Fig.10 After bending the second portion DP2 so that the printed circuit board PCB overlaps the first portion DP1 and the second portion DP2, a protective layer BL may be formed on the bending unit BU. According to some embodiments, the method of manufacturing a display device according to an embodiment of the present invention may further include curing the protective layer BL.

[0099] According to an embodiment of the present invention, the protective layer BL can protect the printed circuit board PCB from external impact. In an embodiment, for example, the bending unit BU is completely covered by the protective layer BL, so that the bending unit BU can be protected from impact caused by the electronic component in the first direction DR1 and / or the third direction DR3. Accordingly, the protective layer BL can minimize or at least reduce the impact transmitted from the bending unit BU to the wiring unit WU and / or the output pad unit PCB-PDU.

[0100] According to the embodiments of the present invention, a display device having improved ease of design and a method of manufacturing the display device can be provided.

[0101] The present invention should not be construed as being limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the concept of the present invention to those skilled in the art.

[0102] While the invention has been particularly shown and described with reference to embodiments thereof, it will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit or scope of the invention as defined by the claims.

Claims

1. A display device, comprising: The display panel comprises a first portion and a second portion bent in one direction from the first portion and arranged to overlap with the first portion; A driving integrated circuit chip is arranged on the second part; as well as The printed circuit board includes a bending unit bent in a direction opposite to the one direction and a wiring unit extending from the bending unit and disposed to overlap the first portion and the second portion.

2. The display device according to claim 1, wherein: The second portion includes an input pad unit, and The printed circuit board further includes an output pad unit disposed on the input pad unit and electrically connected to the input pad unit.

3. The display device according to claim 2, wherein: The bending unit extends from the output pad unit.

4. The display device according to claim 3, wherein: The wiring unit is adhered to the display panel by an adhesive member.

5. The display device according to claim 4, wherein: The adhesive member includes a first adhesive member that adheres the wiring unit to the first portion and a second adhesive member that adheres the wiring unit to the second portion.

6. The display device according to any one of claims 2 to 5, wherein: The printed circuit board further includes a protection layer having a predetermined curvature and disposed on the bending unit.

7. The display device according to claim 6, wherein: The protective layer includes resin.

8. The display device according to any one of claims 2 to 5, wherein: The first portion includes a first sub-portion extending in a direction perpendicular to the one direction to a portion where the first portion overlaps an end portion of the bending unit that most protrudes in a direction opposite to the one direction and a second sub-portion between the first sub-portion and the second portion, and Wherein, the first sub-portion includes a supporting unit protruding in the one direction.

9. The display device according to claim 8, wherein: The supporting unit is spaced apart from the bending unit and has a shape surrounding the bending unit.

10. A method for manufacturing a display device, the method comprising: Providing a display panel, the display panel comprising a first portion and a second portion different from the first portion and comprising an area where a driving integrated circuit chip is disposed; placing a printed circuit board on the upper surface of the second portion so as not to overlap the area; bending the printed circuit board in such a manner that the printed circuit board is disposed on a rear surface of the second portion; as well as The second portion is bent in such a manner that the printed circuit board overlaps the first portion and the second portion.

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