Circuit board half-hole polishing device and method

Abstract

The invention provides a circuit board half-hole grinding device and method, and relates to the technical field of circuit board machining. The device comprises a bottom plate, a movable plate, a fixed assembly and a grinding assembly; the movable plate is arranged above the bottom plate in parallel and is movably arranged in the length direction of the bottom plate, and a round hole vertically penetrates through the center of the movable plate; the fixing assembly comprises two pressing plates which are symmetrically arranged above the moving plate and arranged in the length direction of the bottom plate and a lifting plate arranged below the moving plate, the pressing plates and the lifting plate are movably arranged in the vertical direction, a communicating pipe which is in running fit with the lifting plate and synchronously moves is vertically arranged on the lifting plate in a penetrating mode, and the axis of the communicating pipe coincides with the axis of the round hole; the diameter of the suction cup is smaller than or equal to the inner diameter of the round hole. The two polishing assemblies are symmetrically arranged on the two sides of the bottom plate. According to the scheme, the structure is simple, and the grinding efficiency can be improved while the grinding precision of the circuit board is improved.

Description

Technical Field

[0001] The present application relates to the technical field of circuit board processing, and in particular to a circuit board half-hole grinding device and method. Background Art

[0002] With the increase of circuit board integration, 3D design has become an indispensable trend under the premise of subsequent large integrated circuits. In a large number of 3D designs, many integrated functions that cannot be met by conventional electronic ICs must be replaced by small integrated circuit modules. When designing all small integrated circuit modules, the interoperability and stability between the module and the motherboard must be considered, and they must be designed as follows: Figure 1 The semi-counterbore connection method shown is connected to the main board.

[0003] The semi-counterfeit hole is formed on the edge of the circuit board. A semi-through hole is coaxially formed at the bottom of the semi-counterfeit hole. The diameter of the semi-through hole is smaller than that of the semi-counterfeit hole. In the process of semi-through hole forming, the following problems may occur due to the tool: Figure 2 As shown in the figure, due to the missed processing or missing processing, the semi-through hole needs to be polished again manually. However, manual polishing is not only time-consuming and labor-intensive, but also has low polishing accuracy. Therefore, it is necessary to make improvements. Summary of the invention

[0004] In order to solve the above-mentioned deficiencies of the prior art, the present application provides a circuit board half-hole grinding device and method, which has a simple structure and can improve the grinding efficiency while improving the grinding accuracy of the circuit board.

[0005] In order to achieve the above object, the present invention adopts the following technologies: A circuit board half-hole grinding device comprises a bottom plate, a movable plate, a fixing component and a grinding component; The movable plate is arranged parallel to the top of the bottom plate and is arranged to move along the length direction of the bottom plate. A circular hole is vertically penetrated at the center of the movable plate. The fixed assembly includes two pressing plates symmetrically arranged above the movable plate and arranged along the length direction of the bottom plate, and a lifting plate arranged below the movable plate. Both the pressing plate and the lifting plate are arranged to move in the vertical direction. A connecting pipe that rotates with the lifting plate and moves synchronously is vertically penetrated. The connecting pipe is arranged to rotate around its own axis, and the axis coincides with the axis of the circular hole. A suction cup is connected to the top of the connecting pipe, and the diameter of the suction cup is less than or equal to the inner diameter of the circular hole. The two grinding components are symmetrically arranged on both sides of the base plate, including a first vertical plate movable along the width direction of the base plate, a first horizontal plate connected to the inner end of the top of the first vertical plate, a U-shaped block located below the first horizontal plate, and a milling cutter vertically passing through the first horizontal plate and driven to rotate by a first motor. The outer side surface of the arc end of the U-shaped block is arranged toward the movable plate, and is used to cooperate with the inner wall of the semi-counterfeit hole of the circuit board to be polished. The open end of the U-shaped block is connected to a guide rod horizontally passing through the first vertical plate, and the guide rod is sleeved with a first spring located between the first vertical plate and the open end. The shaft of the milling cutter is located between the two straight sections of the U-shaped block, and the knife portion at the bottom end of the shaft is located below the U-shaped block. The inner side surface of the arc end of the U-shaped block is used to cooperate with the outer wall of the shaft, and the milling diameter of the knife portion is equal to the inner diameter of the semi-through hole of the circuit board to be polished.

[0006] Furthermore, the pressing plate is connected to the top end of a second vertical plate, the second vertical plate vertically passes through the movable plate, the bottom end of the second vertical plate is horizontally connected to the second horizontal plate, and limit plates are provided below both ends of the movable plate. When the bottom surface of the limit plate is in contact with the top surface of the second horizontal plate, the distance between the pressing plate and the movable plate is greater than the thickness of the circuit board.

[0007] Furthermore, the second transverse plate and the lifting plate are connected via a second spring arranged vertically.

[0008] Furthermore, fourth vertical plates are provided on both sides of the bottom plate, and a slide groove is provided on the fourth vertical plate, the slide groove includes a first section, a second section, a third section, a fourth section, a fifth section and a sixth section which are connected in sequence, the first section, the third section and the fifth section are transverse grooves, the length of the third section is greater than or equal to the length of the movable plate, the second section is an oblique groove with a downward trend, the fourth section and the sixth section are oblique grooves with an upward trend, sliding rods are horizontally connected on both sides of the lifting plate, and the sliding rods are slidably penetrated in the slide grooves, when the sliding rod is in the first section, the distance between the pressing plate and the movable plate is greater than the thickness of the circuit board, and the suction cup is not higher than the top surface of the movable plate, when the sliding rod is in the third section, the distance between the pressing plate and the movable plate is equal to the thickness of the circuit board, and the suction cup is not higher than the top surface of the movable plate, when the sliding rod is in the fifth section, the distance between the pressing plate and the suction cup is greater than the thickness of the circuit board, and the suction cup is higher than the top surface of the movable plate, when the sliding rod is at the top of the sixth section, the distance between the pressing plate and the movable plate is greater than the thickness of the circuit board, and the distance between the suction cup and the pressing plate is equal to the thickness of the circuit board.

[0009] A circuit board half-hole polishing method, using the circuit board half-hole polishing device, the method comprises the following steps: Circuit board placement: The moving plate is located on one side of the grinding assembly, and the sliding rod is located in the first section, so that the distance between the pressing plate and the moving plate is greater than the thickness of the circuit board, and the suction cup is not higher than the top surface of the moving plate, so that the circuit board is placed in the center of the moving plate; First half hole grinding: the moving plate passes through the grinding assembly along the first moving direction, the sliding rod is located in the third section, so that the distance between the pressing plate and the moving plate is equal to the thickness of the circuit board, and the suction cup is not higher than the top surface of the moving plate, so as to press the circuit board tightly on the moving plate; the two sides of the circuit board parallel to the length direction of the bottom plate are defined as the edges to be ground, the half holes are aligned with the grinding assembly in turn according to the moving direction, and the half holes are ground using the grinding assembly; Circuit board adsorption: The movable plate is located on the other side of the grinding assembly, and the sliding rod is located in the sixth section, so that the distance between the pressing plate and the movable plate is greater than the thickness of the circuit board, and the distance between the suction cup and the pressing plate is equal to the thickness of the circuit board, so that the circuit board can be adsorbed on the suction cup; Circuit board rotation: the moving plate is located on the other side of the grinding assembly, and the sliding rod is located in the fifth section, so that the distance between the pressing plate and the suction cup is greater than the thickness of the circuit board, and the suction cup is higher than the top surface of the moving plate 2, so that the suction cup drives the circuit board to rotate 90 degrees, and the side of the circuit board to be ground is switched to the other two sides that have not been ground; Grinding of the second half hole: the movable plate passes through the grinding assembly along the second moving direction, the first moving direction is opposite to the second moving direction, the sliding rod is located in the third section, and the circuit board is pressed against the movable plate; the two sides of the circuit board parallel to the length direction of the bottom plate are defined as the edges to be polished, the half holes are aligned with the grinding assembly in turn according to the moving direction, and the half holes are polished using the grinding assembly; Circuit board removal: The moving plate is located on one side of the polishing assembly, and the sliding rod is located in the first section, so that the distance between the pressing plate and the moving plate is greater than the thickness of the circuit board, and the suction cup is not higher than the top surface of the moving plate, so as to remove the circuit board from the moving plate.

[0010] The beneficial effects of the present invention are: 1. Through the movement of the pressing plate and the lifting plate, the position relationship between the pressing plate and the suction cup relative to the moving plate and the relative distance between the pressing plate and the suction cup can be adjusted to adapt to the working requirements at different stages; 2. Through the cooperation between the U-shaped block and the milling cutter, the automatic positioning of the milling cutter can be realized, so that the arc segment of the U-shaped block, the milling cutter and the axis of the half hole coincide, and excessive feeding can be prevented, thereby improving the grinding accuracy; 3. By coordinating the movement of the movable plate in the length direction of the base plate and the movement of the grinding assembly in the width direction of the base plate, the half hole of the circuit board can be continuously ground, thereby improving the working efficiency of the half hole grinding.

[0011] 4. Through the setting of the limit plate, the second spring and the six-stage slide, the automatic adjustment of the position of the pressure plate and the suction cup can be achieved only by the movement of the lifting plate, thereby improving the working efficiency of half-hole grinding. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] The drawings described herein are for illustrative purposes only of selected embodiments and not all possible implementations, and are not intended to limit the scope of the present invention.

[0013] Figure 1 It is a schematic diagram of the structure of the circuit board in the embodiment of the present application.

[0014] Figure 2 yes Figure 1 A partial enlarged view of point A in the middle.

[0015] Figure 3 It is a three-dimensional diagram of the overall structure of an embodiment of the present application.

[0016] Figure 4 It is a structural schematic diagram of the movable plate and the fixed component in the embodiment of the present application.

[0017] Figure 5 It is a cross-sectional schematic diagram of the movable plate and the fixed assembly in the embodiment of the present application when they are in the circuit board placement stage and the circuit board removal stage.

[0018] Figure 6 It is a cross-sectional schematic diagram of the movable plate and the fixed assembly in the embodiment of the present application when they are in the first half-hole grinding stage and the second half-hole grinding stage.

[0019] Figure 7 It is a cross-sectional schematic diagram when the movable plate and the fixed component are in the circuit board adsorption stage in the embodiment of the present application.

[0020] Figure 8 It is a side view schematic diagram of the grinding assembly in the embodiment of the present application.

[0021] Fig. 9 It is a top view schematic diagram of the grinding assembly in the embodiment of the present application when it is matched with the half hole.

[0022] Fig.10 It is a side view schematic diagram of the grinding assembly in the embodiment of the present application when it is matched with the half hole.

[0023] Fig.11 It is a schematic diagram of the structure of the slideway in the embodiment of the present application.

[0024] Fig.12 It is a schematic diagram of the structure of the U-shaped matching block and the matching strip in the embodiment of the present application.

[0025] Fig.13 It is a schematic diagram of the internal structure of the lifting plate in the embodiment of the present application.

[0026] Fig.14 It is a flow chart of the method for grinding half a hole of a circuit board in an embodiment of the present application.

[0027] Figure numerals: base plate-1, movable plate-2, fixed assembly-3, grinding assembly-4, worm gear-5, screw-6, fourth vertical plate-11, limit plate-21, third vertical plate-22, pressure plate-31, second vertical plate-32, second horizontal plate-33, lifting plate-34, suction cup-35, second spring-36, connecting pipe-37, first vertical plate-41, first horizontal plate-42, U-shaped block-43, first spring-44, milling cutter-45, guide rod-46, slide groove-111, sliding rod-341, worm-342, U-shaped matching block-431, matching strip-432, first section-1111, second section-1112, third section-1113, fourth section-1114, fifth section-1115, sixth section-1116. DETAILED DESCRIPTION

[0028] To make the objectives, technical solutions and advantages of the embodiments of the present invention more clear, the implementation modes of the present invention are described in detail below with reference to the accompanying drawings. However, the embodiments described in the present invention are only part of the embodiments of the present invention, rather than all the embodiments.

[0029] Example 1 This embodiment provides a circuit board half hole grinding device, such as Figure 3-Figure 10 As shown, it includes a base plate 1, a movable plate 2, a fixed component 3 and a grinding component 4.

[0030] like Figure 3 As shown, the movable plate 2 is arranged above the bottom plate 1 in parallel and is arranged to move along the length direction of the bottom plate 1 . A circular hole is vertically penetrated at the center of the movable plate 2 .

[0031] like Figure 3-Figure 7 As shown, the fixing assembly 3 includes two pressing plates 31 symmetrically arranged above the moving plate 2 and arranged along the length direction of the bottom plate 1, and a lifting plate 34 arranged below the moving plate 2. The pressing plates 31 and the lifting plates 34 are both arranged to move in the vertical direction. The lifting plate 34 is vertically penetrated with a connecting pipe 37 that rotates and moves synchronously with it. The connecting pipe 37 is arranged to rotate around its own axis, and the axis coincides with the axis of the circular hole. The bottom of the connecting pipe is connected to an exhaust hose, and the exhaust hose is connected to an exhaust device. The top of the connecting pipe is connected to a suction cup 35, and the diameter of the suction cup 35 is less than or equal to the inner diameter of the circular hole, so that the suction cup 35 can pass through the circular hole. Specifically, the bottom surface of the pressing plate 31 can be made of rubber or other materials, which can not only avoid damage to the circuit board when pressing the circuit board, but also improve the friction of the pressing plate 31, improve the fixing effect of the pressing plate 31, and avoid the circuit board from being offset due to external force.

[0032] like Figure 3 , Figure 8-Figure 10As shown, two grinding assemblies 4 are symmetrically arranged on both sides of the bottom plate 1, each grinding assembly 4 includes a first vertical plate 41 that is movable along the width direction of the bottom plate 1, a first horizontal plate 42 connected to the inner end of the top of the first vertical plate 41, a U-shaped block 43 located below the first horizontal plate 42, and a milling cutter 45 that vertically passes through the first horizontal plate 42 and is driven to rotate by a first motor. The grinding assembly 4 is driven to move by a cylinder, and the milling cutter 45 is driven to rotate by a first motor. The outer side surface of the arc end of the U-shaped block 43 faces the movable plate 2 The U-shaped block 43 is configured to cooperate with the inner wall of the semi-sunk hole of the circuit board to be polished. The open end of the U-shaped block 43 is connected to the guide rod 46 horizontally passing through the first vertical plate 41. The guide rod 46 is sleeved with a first spring 44 located between the first vertical plate 41 and the open end. The shaft of the milling cutter 45 is located between the two straight sections of the U-shaped block 43. The knife part at the bottom end of the shaft is located below the U-shaped block 43. The inner side surface of the arc end of the U-shaped block 43 is used to cooperate with the outer wall of the shaft. The milling diameter of the knife part is equal to the inner diameter of the semi-through hole of the circuit board to be polished. Through the cooperation between the U-shaped block 43 and the milling cutter 45, the positioning of the milling cutter 45 can be automatically realized, and excessive feeding can be prevented, thereby improving the accuracy of polishing.

[0033] like Figure 8-Figure 10 As shown, the specific grinding method is: move the first vertical plate 41 so that the outer side surface of the arc end of the U-shaped block 43 is in close contact with the inner wall of the semi-counterfeit hole, and the outer wall of the shaft rod is in close contact with the inner side surface of the arc end of the U-shaped block 43. At this time, the first spring 44 is in a compressed state, and the arc end of the U-shaped block 43, the milling cutter 45 and the axis of the half hole coincide. At this time, the rotating milling cutter 45 can grind the half through hole. Specifically, the correspondence between the half hole and the grinding component 4 can be achieved through a detection instrument, which is judged by whether the arc end of the U-shaped block 43 corresponds to the semi-counterfeit hole. More specifically, a grinding component 4 is provided with a detection instrument to ensure that when the grinding object is a circuit board with two parallel side half holes and asymmetric, the two grinding components 4 can also work separately.

[0034] Specifically, Figure 5-Figure 7 As shown, the pressing plate 31 is connected to the top of the second vertical plate 32 vertically passing through the movable plate 2, the bottom end of the second vertical plate 32 is horizontally connected to the second horizontal plate 33, and limit plates 21 are provided below both ends of the movable plate 2. When the bottom surface of the limit plate 21 is in contact with the top surface of the second horizontal plate 33, the distance between the pressing plate 31 and the movable plate 2 is greater than the thickness of the circuit board, so as to limit the predetermined highest point to which the pressing plate 31 can rise.

[0035] Specifically, Figure 4-Figure 7 As shown, the second cross plate 33 and the lifting plate 34 are connected by a second spring 36 arranged vertically. Through the arrangement of the second spring 36 and the limit plate 21, on the one hand, the positions of the pressing plate 31 and the suction cup 35 can be adjusted only according to the height of the lifting plate 34, and on the other hand, the second spring 36 can provide a certain buffering capacity for the pressing plate 31 to avoid damage to the circuit board when pressing.

[0036] Specifically, Figure 3 As shown, both sides of the bottom plate 1 are provided with fourth vertical plates 11, and mounting plates are mounted on the fourth vertical plates 11. The grinding assembly 4 and the cylinder driving the grinding assembly 4 to move are both arranged on the mounting plates. The fourth vertical plates 11 are penetrated with a slide groove 111, as shown in FIG. Fig.11 As shown, the slide groove 111 includes a first section 1111, a second section 1112, a third section 1113, a fourth section 1114, a fifth section 1115 and a sixth section 1116 connected in sequence. The first section 1111, the third section 1113 and the fifth section 1115 are transverse grooves, the second section 1112 is an oblique groove with a downward trend, and the fourth section 1114 and the sixth section 1116 are oblique grooves with an upward trend. Sliding rods 341 are horizontally connected to both sides of the lifting plate 34. The sliding rods 341 are slidably arranged in the slide groove 111. When the sliding rod 341 is in the first section 1111, as shown in FIG. Figure 5 As shown, the distance between the pressing plate 31 and the moving plate 2 is greater than the thickness of the circuit board, and the suction cup 35 is not higher than the top surface of the moving plate 2. When the sliding rod 341 is in the third section 1113, as shown in FIG. Figure 6 As shown, the distance between the pressing plate 31 and the moving plate 2 is equal to the thickness of the circuit board, and the suction cup 35 is not higher than the top surface of the moving plate 2. When the sliding rod 341 is in the fifth section 1115, as shown in FIG. Figure 7 As shown, the distance between the pressing plate 31 and the suction cup 35 is greater than the thickness of the circuit board, and the suction cup 35 is higher than the top surface of the movable plate 2. When the sliding rod 341 is at the top of the sixth section 1116, the distance between the pressing plate 31 and the movable plate 2 is greater than the thickness of the circuit board, and the distance between the suction cup 35 and the pressing plate 31 is equal to the thickness of the circuit board. Among them, the length of the third section 1113 is greater than or equal to the length of the movable plate 2, so that when the entire movable plate 2 passes through the grinding assembly 4, the distance between the pressing plate 31 and the movable plate 2 is always equal to the thickness of the circuit board, and the suction cup 35 is always not higher than the top surface of the movable plate 2, so as to maintain the clamping state of the circuit board, so as to adapt to the half-hole grinding of circuit boards of different lengths or widths. Through the sliding cooperation between the sliding rod 341 and the slide groove 111, the height of the lifting plate 34 can automatically change during the movement of the movable plate 2 along the length direction of the bottom plate 1, and then automatically adjust the position of the pressing plate 31 and the suction cup 35 according to the different positions of the movable plate 2.

[0037] In order to meet the requirements of grinding half holes of different sizes on the circuit board, the milling cutter 45 and the U-shaped matching block 431 are a set of related replaceable components. Fig.12As shown, the U-shaped block 43 includes a U-shaped matching block 431 and two matching strips 432 for inserting into the straight section of the U-shaped matching block 431. The U-shaped matching block 431 and the matching strips 432 are fixed by locking screws. Two first springs 44 and guide rods 46 are provided, correspondingly connected to the outer ends of the two matching strips 432. The shaft of the milling cutter 45 is detachably connected to the output shaft of the first motor. For circuit boards with inconsistent half holes, multiple pairs of grinding components 4 of different specifications can be correspondingly set in a circuit board half hole grinding device to achieve this.

[0038] More specifically, Fig.13 As shown, the lifting plate 34 is hollow inside, and the connecting pipe 37 is provided with a worm wheel 5 on the outer sleeve, and the worm wheel 5 is meshed with a worm 342. The worm wheel 5 and the worm 342 are located in the lifting plate 34 and driven to rotate by a second motor to realize the rotation of the connecting pipe relative to the lifting plate 34.

[0039] More specifically, Figure 3 As shown, a third vertical plate 22 is provided below both ends of the movable plate 2, wherein a screw rod 6 is threadedly passed through one of the third vertical plates 22, and a guide rod is slidably passed through the other third vertical plate 22, and the screw rod 6 and the guide rod are arranged along the length direction of the base plate 1, and the screw rod 6 is driven to rotate by a third motor to realize the movement of the movable plate 2 along the length direction of the base plate 1.

[0040] Example 2 like Fig.14 As shown, this embodiment provides a circuit board half-hole grinding method, using the circuit board half-hole grinding device described in Example 1, the method steps are as follows: Circuit board placement: The movable plate 2 is located on one side of the polishing assembly 4, and the sliding rod 341 is located in the first section 1111, so that the distance between the pressing plate 31 and the movable plate 2 is greater than the thickness of the circuit board, and the suction cup 35 is not higher than the top surface of the movable plate 2, so that the circuit board is placed centered on the movable plate 2.

[0041] First half hole grinding: the moving plate 2 passes through the grinding assembly 4 along the first moving direction, the sliding rod 341 is located in the third section 1113, so that the distance between the pressing plate 31 and the moving plate 2 is equal to the thickness of the circuit board, and the suction cup 35 is not higher than the top surface of the moving plate 2, so as to press the circuit board onto the moving plate 2, and define the two sides of the circuit board parallel to the length direction of the bottom plate 1 as the edges to be grinded, align the half hole with the grinding assembly 4 in turn according to the moving direction, and grind the half hole using the grinding assembly 4. Among them, for circuit boards with asymmetric half holes on both sides, the two grinding assemblies 4 can work separately; for circuit boards with symmetric half holes on both sides, the two grinding assemblies 4 can work simultaneously.

[0042] Circuit board adsorption: The movable plate 2 is located at the other side of the polishing assembly 4, and the sliding rod 341 is located at the sixth section 1116, so that the distance between the pressing plate 31 and the movable plate 2 is greater than the thickness of the circuit board, and the distance between the suction cup 35 and the pressing plate 31 is equal to the thickness of the circuit board, so that the circuit board is adsorbed on the suction cup 35. The pre-step of using the bottom surfaces of the two pressing plates 31 and the suction cup 35 to press the circuit board tightly is to make the adsorption effect of the suction cup 35 more stable.

[0043] Rotation of circuit board: the movable plate 2 is located on the other side of the polishing assembly 4, and the sliding rod 341 is located in the fifth section 1115, so that the distance between the pressing plate 31 and the suction cup 35 is greater than the thickness of the circuit board, and the suction cup 35 is higher than the top surface of the movable plate 2, so that there is a predetermined distance between the pressing plate 31 and the circuit board, so that the suction cup 35 can drive the circuit board to rotate 90 degrees, switching the side of the circuit board to be polished to the other two unpolished side edges.

[0044] Second half hole grinding: the movable plate 2 passes through the grinding assembly 4 along the second moving direction, the sliding rod 341 is located in the third section 1113, the first moving direction is opposite to the second moving direction, and the rest is the same as the first half hole grinding.

[0045] Removing the circuit board: the movable plate 2 is located on one side of the polishing assembly 4, and the sliding rod 341 is located in the first section 1111, so that the distance between the pressing plate 31 and the movable plate 2 is greater than the thickness of the circuit board, and the suction cup 35 is not higher than the top surface of the movable plate 2, so as to remove the circuit board from the movable plate 2.

[0046] The grinding of the half holes at the four sides of the circuit board can be completed by driving the circuit board to complete a reciprocating movement through the movable plate 2.

[0047] According to the reciprocating movement path of the movable plate 2, the corresponding relationship between the position of the sliding rod 341 in the six-section slide groove 111 and the six steps is explained in sequence: the first section 1111 (circuit board placement), the second section 1112, the third section 1113 (first half hole grinding), the fourth section 1114, the fifth section 1115, the sixth section 1116 (circuit board adsorption), the fifth section 1115 (circuit board rotation), the fourth section 1114, the third section 1113 (second half hole grinding), the second section 1112, and the first section 1111 (circuit board removal).

[0048] When applied, the above description is only a preferred embodiment of the present application and is not intended to limit the present application. Obviously, those skilled in the art can make various changes and modifications to the present application without departing from the spirit and scope of the present application.

Claims

1. A circuit board half-hole grinding device, characterized in that: include: Bottom plate (1); The movable plate (2) is arranged parallel to the top of the bottom plate (1) and is movable along the length direction of the bottom plate (1); a circular hole is penetrated at the center of the movable plate (2); The fixed assembly (3) comprises two pressing plates (31) symmetrically arranged above the movable plate (2) and arranged along the length direction of the bottom plate (1), and a lifting plate (34) arranged below the movable plate (2), the pressing plates (31) and the lifting plates (34) being arranged to move in the vertical direction, the lifting plate (34) being vertically penetrated by a connecting pipe (37) which rotates with and moves synchronously with the connecting pipe (37), the axis of the connecting pipe (37) coincides with the axis of the circular hole, the top of the connecting pipe (37) is connected to a suction cup (35), the diameter of the suction cup (35) being less than or equal to the inner diameter of the circular hole; Two grinding assemblies (4) are symmetrically arranged on both sides of the bottom plate (1), comprising a first vertical plate (41) movable along the width direction of the bottom plate (1), a first horizontal plate (42) connected to the inner side of the top of the first vertical plate (41), a U-shaped block (43) located below the first horizontal plate (42), and a milling cutter (45) vertically passing through the first horizontal plate (42) and driven to rotate by a first motor, wherein the outer side surface of the arc end of the U-shaped block (43) is arranged toward the movable plate (2) and is used to engage with the inner side of the semi-sunk hole of the circuit board to be ground. The U-shaped block (43) is connected to a guide rod (46) horizontally passing through the first vertical plate (41), and a first spring (44) is sleeved on the guide rod (46) and is located between the first vertical plate (41) and the open end. The shaft of the milling cutter (45) is located between the two straight sections of the U-shaped block (43), and the knife portion at the bottom end of the shaft is located below the U-shaped block (43). The inner side surface of the arc end of the U-shaped block (43) is used to cooperate with the outer wall of the shaft, and the milling diameter of the knife portion is equal to the inner diameter of the semi-through hole of the circuit board to be polished.

2. A circuit board half-hole grinding device according to claim 1, characterized in that: The pressing plate (31) is connected to the top of a second vertical plate (32), the second vertical plate (32) vertically penetrates the movable plate (2), the bottom of the second vertical plate (32) is horizontally connected to the second horizontal plate (33), and limit plates (21) are provided below both ends of the movable plate (2), and when the bottom surface of the limit plate (21) is in contact with the top surface of the second horizontal plate (33), the distance between the pressing plate (31) and the movable plate (2) is greater than the thickness of the circuit board.

3. A circuit board half hole grinding device according to claim 2, characterized in that: The second transverse plate (33) and the lifting plate (34) are both connected via a second spring (36) arranged vertically.

4. A circuit board half-hole grinding device according to claim 3, characterized in that: A fourth vertical plate (11) is provided on both sides of the bottom plate (1), and a slide groove (111) is provided on the fourth vertical plate (11). The slide groove (111) includes a first section (1111), a second section (1112), a third section (1113), a fourth section (1114), a fifth section (1115) and a sixth section (1116) which are connected in sequence. The first section (1111), the third section (1113) and the fifth section (1115) are transverse grooves. The length of the third section (1113) is greater than or equal to the length of the movable plate (2). The second section (1112) is an oblique groove with a downward trend. The fourth section (1114) and the sixth section (1116) are oblique grooves with an upward trend. Sliding rods (341) are horizontally connected to both sides of the lifting plate (34). The sliding rods (341) are slidably arranged in the slide grooves (111). When the sliding rods ( When the sliding rod (341) is in the first section (1111), the distance between the pressing plate (31) and the movable plate (2) is greater than the thickness of the circuit board, and the suction cup (35) is not higher than the top surface of the movable plate (2); when the sliding rod (341) is in the third section (1113), the distance between the pressing plate (31) and the movable plate (2) is equal to the thickness of the circuit board, and the suction cup (35) is not higher than the top surface of the movable plate (2); when the sliding rod (341) is in the fifth section (1115), the distance between the pressing plate (31) and the suction cup (35) is greater than the thickness of the circuit board, and the suction cup (35) is higher than the top surface of the movable plate (2); when the sliding rod (341) is at the top end of the sixth section (1116), the distance between the pressing plate (31) and the movable plate (2) is greater than the thickness of the circuit board, and the distance between the suction cup (35) and the pressing plate (31) is equal to the thickness of the circuit board.

5. A circuit board half-hole grinding device according to claim 1, characterized in that: The U-shaped block (43) comprises a U-shaped matching block (431) and two matching strips (432) for being inserted into the straight section of the U-shaped matching block (431); the U-shaped matching block (431) and the matching strips (432) are fixed by means of locking screws; two first springs (44) and two guide rods (46) are each provided and correspondingly connected to the outer ends of the two matching strips (432); and the shaft of the milling cutter (45) is detachably connected to the output shaft of the first motor.

6. A circuit board half-hole grinding device according to claim 1, characterized in that: The lifting plate (34) is hollow inside, and a worm wheel (5) is provided on the outer sleeve of the connecting pipe (37). The worm wheel (5) is meshed with a worm (342). The worm wheel (5) and the worm (342) are located inside the lifting plate (34) and are driven to rotate by a second motor.

7. A circuit board half-hole grinding device according to claim 1, characterized in that: A third vertical plate (22) is provided below both ends of the movable plate (2), a screw rod (6) is threadedly passed through one of the third vertical plates (22), and a guide rod is slidably passed through the other third vertical plate (22), the screw rod (6) and the guide rod are arranged along the length direction of the bottom plate (1), and the screw rod (6) is driven to rotate by a third motor.

8. A method for grinding a half hole of a circuit board, characterized in that: Using the circuit board half-hole grinding device as claimed in claim 4, the method comprises the following steps: Placing the circuit board: the movable plate (2) is located on one side of the polishing assembly (4), the sliding rod (341) is located in the first section (1111), and the circuit board is placed centrally on the movable plate (2); First half hole grinding: the movable plate (2) passes through the grinding assembly (4) along the first moving direction, the sliding rod (341) is located in the third section (1113), and the circuit board is pressed against the movable plate (2); the two sides of the circuit board parallel to the length direction of the bottom plate (1) are defined as the edges to be ground, the half hole and the grinding assembly (4) are aligned in turn according to the moving direction, and the half hole is ground using the grinding assembly (4); Circuit board adsorption: the movable plate (2) is located on the other side of the polishing assembly (4), and the sliding rod (341) is located in the sixth section (1116), so as to adsorb the circuit board onto the suction cup (35); Rotation of the circuit board: the movable plate (2) is located at the other side of the grinding assembly (4), and the sliding rod (341) is located at the fifth section (1115), so that the suction cup (35) drives the circuit board to rotate 90 degrees, switching the side of the circuit board to be ground to the other two sides that have not been ground; Second half hole grinding: the movable plate (2) passes through the grinding assembly (4) along the second moving direction, the first moving direction is opposite to the second moving direction, the sliding rod (341) is located in the third section (1113), and the circuit board is pressed against the movable plate (2); the two sides of the circuit board parallel to the length direction of the bottom plate (1) are defined as the edges to be ground, the half hole and the grinding assembly (4) are aligned in turn according to the moving direction, and the half hole is ground using the grinding assembly (4); Removing the circuit board: the movable plate (2) is located at one side of the grinding assembly (4), the sliding rod (341) is located at the first section (1111), and the circuit board is removed from the movable plate (2).

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