Bonding wire systems, lead replacement systems, and related methods

Abstract

A wire bonding system is provided. The wire bonding system comprises a welding head assembly, wherein the welding head assembly is configured to carry a wire bonding tool; and a wire replacement system configured to (i) remove a wire portion engaged with the wire bonding tool, the wire portion being part of a wire supply on a wire bonding system, and (ii) replace a wire portion to be engaged with the wire bonding tool.

Description

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application claims priority to U.S. Provisional Application No. 63 / 601,299, filed on November 21, 2023, the contents of which are incorporated herein by reference. Technical Field

[0003] The present invention relates to a wire bonding system, and in particular to a wire bonding system including a wire replacement system and / or a wire bonding tool replacement system. Background Art

[0004] In the processing and packaging of semiconductor devices, wire bonding continues to be the primary method of providing electrical interconnection between two locations within a package (e.g., between a die pad of a semiconductor die and a wire of a lead frame). More specifically, a wire bonder (also known as a wire bonding system) is used to form a wire arc between the various locations to be electrically interconnected. The primary methods for forming a wire arc are ball bonding and wedge bonding. When forming a weld between (a) the end of the wire arc and (b) a welding location (e.g., a pad, a wire, etc.), different types of welding energy may be used, including, for example, ultrasonic energy, thermosonic energy, hot pressing energy, etc., among others. Wire bonding systems (e.g., stud punches) are also used to form conductive bumps from portions of the leads.

[0005] Replacing a portion of a lead on a wire bonding system and / or replacing a wire bonding tool on a wire bonding system often results in significant delays or machine downtime. Therefore, it would be desirable to provide an improved wire bonding system that addresses these issues. Summary of the invention

[0006] According to an exemplary embodiment of the present invention, a wire bonding system is provided. The wire bonding system includes a bonding head assembly configured to carry a wire bonding tool. The wire bonding system also includes a wire replacement system configured to: (i) remove a lead portion engaged with the wire bonding tool, the lead portion being part of a lead supply portion on the wire bonding system; and (ii) replace a lead portion to be engaged with the wire bonding tool.

[0007] According to another exemplary embodiment of the present invention, a lead replacement system for replacing a lead portion on a wire bonding system is provided. The lead replacement system includes a clamping mechanism configured to clamp the lead portion, the clamping mechanism including a threading portion for threading the lead portion through a wire bonding tool of the wire bonding system.

[0008] According to other embodiments of the present invention, the wire bonding system and / or lead replacement system described in the two preceding paragraphs may have any one or more of the following features: the lead replacement includes a clamping mechanism, the clamping mechanism being configured to clamp the lead; the clamping mechanism includes (i) a fixed clamping portion and (ii) a movable clamping portion disposed adjacent to the fixed clamping portion, the movable clamping portion being configured to move in at least one direction relative to the fixed clamping portion; the clamping mechanism includes a spring, the spring being configured to actuate the movable clamping portion relative to the fixed clamping portion; a movable arm assembly, the movable arm assembly being configured to move the clamping mechanism; the clamping mechanism is carried by the movable arm assembly; the clamping mechanism includes a threading portion for threading; the clamping mechanism includes a gripping portion for grasping the lead, a cutting portion for partially cutting the lead, and a threading portion for threading; the clamping mechanism includes a tool clamping portion for clamping a wire bonding tool ; a lead replacement system configured to remove a wire bonding tool from a welding head assembly; a wire bonding tool source configured to provide a plurality of wire bonding tools, the lead replacement system configured to replace the wire bonding tool at the welding head assembly with one of the plurality of wire bonding tools from the wire bonding tool source; the lead replacement system configured to replace a lead portion by reengaging the lead portion with the wire bonding tool; the lead replacement system configured to replace a lead portion by engaging another lead portion with the wire bonding tool; a receiving portion for receiving the lead portion after the lead portion is removed by the lead replacement system; the clamping mechanism includes an image registration feature, the image registration feature provides a reference for determining the position of the clamping mechanism; the vision system is configured to determine the position of the clamping mechanism by collecting an image of the image registration feature; the optical path between the vision system and the image registration feature includes a reflective optical element; and the optical path between the vision system and the image registration feature includes a refractive optical element.

[0009] According to another exemplary embodiment of the present invention, a method for replacing a lead portion on a wire bonding system is provided. The method comprises the following steps: (a) providing a bonding head assembly, the bonding head assembly being configured to carry a wire bonding tool, the lead portion being engaged with the wire bonding tool, the lead portion being part of a wire supply on the wire bonding system; (b) removing the lead portion from the wire bonding tool using a lead replacement system; and (c) replacing the lead portion to the wire bonding tool using the lead replacement system.

[0010] According to other embodiments of the present invention, the method described in the preceding paragraph may have any one or more of the following features: the lead replacement system includes a clamping mechanism, which is configured to clamp the lead; the clamping mechanism includes (i) a fixed clamping portion and (ii) a movable clamping portion arranged adjacent to the fixed clamping portion, and the movable clamping portion is configured to move in at least one direction relative to the fixed clamping portion; the clamping mechanism includes a spring, which is configured to actuate the movable clamping portion relative to the fixed clamping portion; the clamping mechanism is carried by a movable arm assembly; the clamping mechanism includes a gripping portion for gripping the lead, a cutting portion for partially cutting the lead, and a threading portion for threading; the clamping mechanism includes a tool clamping portion for gripping a wire bonding tool ; the lead replacement system is configured to remove the wire bonding tool from the welding head assembly; the lead replacement system includes a wire bonding tool source, the wire bonding tool source is configured to provide a plurality of wire bonding tools, and the lead replacement system is configured to replace the wire bonding tool at the welding head assembly with one of the plurality of wire bonding tools from the wire bonding tool source; the lead replacement system includes a receiving portion for receiving the lead portion after the lead portion is removed in step (b); step (b) includes a sub-step (b1), partially cutting the lead supply portion with a clamping mechanism of the lead replacement system to create a cut, the cut defining an end of the lead portion to be replaced on the welding system, the cut being formed at a position between the lead clamp and the wire bonding tool on the welding system; step (b) includes after sub-step (b1) Sub-step (b2), pulling the lead portion to move the incision position closer to the wire bonding tool; step (b) includes sub-step (b3) after sub-step (b2), disconnecting the lead portion from the lead supply at the incision by pulling the lead with a clamping mechanism when the lead clamp is closed; the cutting portion of the clamping mechanism is used in association with sub-step (b1); between steps (b) and (c), removing the wire bonding tool and providing another wire bonding tool to the bonding head assembly using a lead replacement system; step (c) includes a lead threading process; step (c) includes threading another lead portion through the wire bonding tool and one of another wire bonding tools associated with the lead threading process; step (c) includes threading the lead portion through the wire bonding tool and one of the wire bonding tools associated with the lead threading process one of another wire bonding tools associated with a lead threading process; the lead threading process includes using a threading portion of a clamping mechanism of a lead changing system; the lead threading process includes the steps of: pulling a distal end portion of a lead supply through the wire bonding tool with the clamping mechanism; the clamping mechanism pulls the distal end portion of the lead supply through the wire bonding tool using multiple movements of the clamping mechanism; the lead threading process includes the sub-steps of (i) grasping the distal end portion of the lead supply with the clamping mechanism; (ii) opening the lead clamp, (iii) moving the clamping mechanism so that the distal end portion of the lead supply moves downward, and (iv) closing the lead clamp; repeating each of sub-steps (i)-(iv) until the distal end portion of the lead supply is pulled through the wire bonding tool;and repeating each of sub-steps (i)-(iv) until the end portion of the lead supply is pulled through the wire bonding tool and a lead tail having a predetermined length has been formed below the wire bonding tool. ; BRIEF DESCRIPTION OF THE DRAWINGS

[0011] The present invention may be better understood by reading the following detailed description in conjunction with the accompanying drawings. It should be emphasized that, according to common practice, the various features in the drawings are not drawn to scale. On the contrary, the dimensions of the various features are arbitrarily enlarged or reduced for the sake of clarity. The accompanying drawings include the following schematic diagrams:

[0012] Figures 1A to 1F are various perspective views of portions of a wire bonding system according to an exemplary embodiment of the present invention;

[0013] FIG. 2A to FIG. 2B is a perspective view of a wire bonding tool source according to an exemplary embodiment of the present invention;

[0014] Figure 2C to Figure 2D is a perspective view of another wire bonding tool source according to an exemplary embodiment of the present invention;

[0015] 3A to 3H yes Figures 1A to 1F Various block diagram side views of the wire bonding system;

[0016] 4A to 4D are various perspective views of components of another wire bonding system according to an exemplary embodiment of the present invention;

[0017] FIG. 5A to FIG. 5H yes FIG. 3A to FIG. 3D Various block diagram side views of the components of the wire bonding system;

[0018] FIG. 6A to FIG. 6E are various perspective views illustrating a wire bonding system according to another exemplary embodiment of the present invention;

[0019] 7A to 7F yes FIG. 6A to FIG. 6E Various block diagram side views of the components of the wire bonding system;

[0020] Fig. 8A and Figure 8B is a perspective view illustrating another wire bonding system according to an exemplary embodiment of the present invention;

[0021] Fig. 9A and Fig. 9B is a perspective view illustrating elements of a wire bonding tool changing system according to an exemplary embodiment of the present invention; and

[0022] Fig.10 and Fig.11 is a flow chart illustrating various exemplary embodiments of the present invention. DETAILED DESCRIPTION

[0023] Various wire bonding systems (and components thereof) and related methods are provided herein. In certain embodiments, the wire bonding system includes a wire bonding tool replacement system. In certain embodiments, the wire bonding tool replacement system may be configured to automatically replace a wire bonding tool (e.g., a capillary). The wire bonding tool replacement system may be configured to: precisely position a clamping mechanism (e.g., a "gripper") to clamp the wire bonding tool on a welding system (e.g., a welding machine, a "welder," etc.); loosen a screw (e.g., a "cap screw" or other tightening mechanism) using a robotic wrench; and / or remove a used wire bonding tool from a transducer (e.g., an ultrasonic transducer) of the wire bonding system. In certain embodiments, the wire bonding tool replacement system may be configured to: pick up a new wire bonding tool from a wire bonding tool source (e.g., a capillary supply); insert a new wire bonding tool into a wire bonding tool hole of the transducer; and / or tighten (e.g., automatically tighten) a screw before a subsequent wire bonding operation. In certain embodiments, the wire tool replacement system can be configured to provide real-time communication with the welding system (e.g., a computer of the welding system) regarding: positioning the clamping mechanism with the target wire tool; positioning the wire tool; and / or positioning the wrench (e.g., associated with a servo and / or robotic wrench arm assembly). In certain embodiments, the wire tool replacement system can be configured to provide feedback control associated with robotic positioning. In certain embodiments, open / short detection can be used for wire tool replacement (e.g., removing the wire tool, picking up the wire tool, inserting the wire tool, tightening / loosening screws, etc.).

[0024] Certain embodiments of the present invention provide certain advantages, such as automatically changing wire bonding tools, thereby reducing man-hours (eg, human man-hours).

[0025] A specific embodiment of the present invention provides a wire bonding system, the wire bonding system including a wire replacement system, which is configured to: (i) remove a portion of a wire engaged with a wire bonding tool; and (ii) replace a portion of a wire (e.g., replace with the same portion of a wire, replace with another portion of a wire). A specific embodiment provides automatic threading using a robotic mechanism (e.g., during a wire bonding tool replacement operation in a wire bonding system). A specific embodiment includes: using a cutting mechanism (e.g., a blade, a cutting portion of a clamping mechanism, etc.) to partially cut (e.g., a "half-cut cut") a wire (e.g., a position between a wire clamp and a transducer); moving a clamping mechanism (e.g., a gripper) under the wire bonding tool; pulling the wire downward so that the partial cut / cut is located / approaching the middle of the inner hole of the wire bonding tool; closing the wire clamp and clamping mechanism of the welding head assembly; pulling the wire downward with the clamping mechanism so that the wire is disconnected at the partial cut / cut; completing the wire threading process after removing the wire bonding tool; and / or inserting another (e.g., new) wire bonding tool. Other embodiments include removing a lead portion engaged with a wire bonding tool and replacing the lead portion with an identical lead portion (eg, after replacing the wire bonding tool) without cutting and / or breaking the lead portion.

[0026] Certain embodiments of the present invention provide certain advantages, such as automating lead threading (e.g., in connection with wire bonding tool changes), thereby reducing man-hours (e.g., labor hours). Other advantages include consistent wire disconnection to secure the lead tail position just below the transducer surface within the hole of the wire bonding tool. Certain methods do not require additional mechanisms to secure the positioning of the lead against the hole of the wire bonding tool, but can provide a high success rate (e.g., in part due to the highly reliable alignment calibration provided by the wire bonding system).

[0027] Now referring to the accompanying drawings, Figure 1AA wire bonding system 100 is illustrated. The wire bonding system 100 includes a bonding head assembly 102 (partially illustrated) configured to carry a wire bonding tool 110. The bonding head assembly 102 is illustrated as including a wire clamp 104 and a transducer 106. The wire clamp 104 is configured to switch between (i) allowing a wire supply 108 to pass freely and (ii) grasping the wire supply 108 to prevent relative movement between the wire supply 108 and the bonding head assembly 102. The present invention is not limited to any particular operation of the wire clamp 104 (e.g., the wire clamp 104 may move one portion relative to another portion to grasp the wire supply 108, the lead clamp 104 may move multiple portions relative to each other to grasp the wire supply 108, etc.). The wire supply 108 is illustrated as being disposed through both the wire clamp 104 (e.g., in a closed configuration) and the transducer 106. Wire supply 108 may be continuous with a wire source (eg, a wire spool of a wire bonding system). Wire portion 108 a of wire supply 108 is illustrated as being disposed through wire bonding tool 110 .

[0028] The wire bonding system 100 also includes a wire bonding tool replacement system 112a (partially shown). It should be understood that the wire bonding tool replacement system 112a is similar to that described elsewhere herein (e.g., 4A to 4D , FIG. 5A to FIG. 5H , FIG. 6A to FIG. 6E , 7A to 7F The lead replacement system 112b and / or lead replacement system 112b′ associated with the bonding wire system 300 and 600 described in the drawings and the like share many of the same elements and aspects. For example, both the bonding wire tool replacement system 112a and the lead replacement system 112b include a clamping mechanism 114.

[0029] The wire bonding tool replacement system 112a is configured to replace the wire bonding tool 110 with another wire bonding tool (e.g., another wire bonding tool 110 or a different type of wire bonding tool). The wire bonding tool replacement system 112a is illustrated as including a clamping mechanism 114 for clamping and / or removing the wire bonding tool 110 from the bonding head assembly 102. The clamping mechanism 114 is illustrated as being carried by a movable arm assembly 128 (partially illustrated).

[0030] The clamping mechanism 114 can be configured to clamp the wire bonding tool 110 (e.g., to remove the wire bonding tool 110 from the bonding head assembly 102). In certain embodiments, the clamping mechanism 114 can be configured to include a clamping portion (e.g., a first clamping portion 114a and / or a second clamping portion 114b). In certain embodiments, the clamping mechanism 114 includes: (i) a gripping portion for gripping the wire supply 108; (ii) a cutting portion for partially cutting the wire supply 108; (iii) a threading portion for threading the wire supply 108; and / or (iv) a tool clamping portion for gripping the wire bonding tool 110.

[0031] The clamping mechanism 114 is illustrated as including a first clamping portion 114a (e.g., a mobile clamping portion) and an adjacent second clamping portion 114b (e.g., a fixed clamping portion). The second clamping portion 114b is illustrated as including a gripping portion 114b1 (e.g., for gripping and / or clamping the lead supply 108 and / or the wire bonding tool 110) and a tool clamping portion 114b2 (e.g., for clamping the wire bonding tool 110). It should be understood that in certain embodiments, each clamping portion 114a / 114b may include one or more gripping portions and a tool clamping portion. The first clamping portion 114a may be configured to move relative to the second clamping portion 114b in at least one direction (e.g., laterally along the x-axis).

[0032] The wire tool changing system 112a is configured to provide a clamping force sufficient to support, hold, remove and / or replace the wire tool 110 during a clamping operation and / or a wire tool changing operation. In certain embodiments, the clamping mechanism 114 may include a spring 122 (e.g., a leaf spring) for providing a clamping force associated with a clamping operation. The spring 122 may be configured to actuate at least a portion of the first clamping portion 114a (e.g., a moving clamping portion, a gripping portion, a cutting portion, a threading portion, a tool clamping portion) relative to the second clamping portion 114b (e.g., a fixed clamping portion).

[0033] Reference now Figure 1B , the wire bonding tool replacement system 112a and the clamping mechanism 114 are shown to have been moved (i.e., along the y-axis) below the transducer 106 and around the wire bonding tool 110. A wrench 118 (e.g., a cap screw wrench) is shown rotating about the x-axis to loosen the screw 116 (e.g., a cap screw), thereby loosening the transducer 106 to release the wire bonding tool 110. Prior to (or while) tightening the transducer 106, the clamping mechanism 114 can clamp the wire bonding tool 110 with a desired clamping force (e.g., moving the first clamping portion 114a relative to the second clamping portion 114b). In certain embodiments, the wrench 118 can be included in the wire bonding tool replacement system 112a (e.g., controlled by a general purpose computing system associated with the clamping mechanism 114).

[0034] Reference now Figure 1C , the wire bonding tool replacement system 112a and the clamping mechanism 114 are shown moving the wire bonding tool 110 away (i.e., along the z-axis) from the bonding head assembly 102 and the transducer 106. After the wire bonding tool 110 is removed (e.g., a "used" or damaged wire bonding tool), the wire bonding tool replacement system 112a can discard the wire bonding tool 110.

[0035] Reference now Figure 1D, the figure shows the wire tool replacement system 112a and the clamping mechanism 114 removing the wire tool 110 from the wire tool source 120 (i.e., along the z-axis). The wire tool source 120 defines a storage area for waste materials (e.g., such as 4A to 4D and FIG. 5A to FIG. 5H The receiving portion 120a of the wire bonding tool 110 (e.g., a used wire bonding tool 110, a portion of the wire bonding tool removed by the lead replacement system). The clamping mechanism 114 is shown clamping the wire bonding tool 110 (e.g., a "new" or undamaged wire bonding tool) and begins to move the wire bonding tool 110 away from the wire bonding tool source 120 (i.e., along the z-axis).

[0036] The gripping mechanism 114 is configured to extract the wire bonding tool 110 from the wire bonding tool source 120 and carry the wire bonding tool 110 to the welding head assembly 102. Such a configuration may include a particular gripping portion dimensioned to enable the gripping mechanism 114 to extract one of a plurality of wire bonding tools 110. Such a configuration may also include mechanically coupling portions of the gripping mechanism 114 to a motion system (e.g., of the wire bonding tool replacement system 112a) to move the gripping mechanism 114 across a range of motion (e.g., from the welding head assembly 102 to the wire bonding tool source 120). Such a motion system may be configured to execute computer-readable instructions; such computer-readable instructions may include information related to the plurality of wire bonding tools 110 (e.g., position or size information of each of the plurality of wire bonding tools 110) and motion profiles, and / or predetermined events (e.g., number of welding operations; time since installation; other information related to automatically replacing a wire bonding tool when a predetermined event occurs, etc.).

[0037] Although Figure 1D A particular configuration of the wire bonding tool source 120 is illustrated, but the present invention is not limited thereto. Other configurations of the wire bonding tool source are contemplated. For example, any number of slots for multiple wire bonding tools 110 are contemplated. The wire bonding tool source may be configured to be on the top side rather than Figure 1D The bottom side of the wire bonding tool 110 is shown. Such a wire bonding tool source is illustrated and described herein (e.g., see FIG. 2A to FIG. 2D ). Wire bonding tools are available individually or as part of a cassette set (see, for example, Figure 2C to Figure 2D ). The wire tool source may be included as part of the wire tool replacement system and / or the lead replacement system (eg, structurally integrated, electrically integrated), or may be separate from the wire tool replacement system. No receiving portion is required.

[0038] Reference now Figure 1E , the wire bonding tool replacement system 112a and the clamping mechanism 114 are shown moving the wire bonding tool 110 below the transducer 106 (ie, along the z-axis).

[0039] Reference now Figure 1F , wire bonding tool 110 is disposed within transducer 106. Wrench 118 (e.g., a cap screw wrench) is shown rotated about the x-axis to tighten screw 116 (e.g., a cap screw), thereby tightening transducer 106 to grasp wire bonding tool 110. After (and / or while) tightening transducer 106, clamping mechanism 114 may unclamp from wire bonding tool 110 (e.g., move first clamping portion 114a relative to second clamping portion 114b).

[0040] Although the wire tool replacement system 112a / lead replacement system 112b can be included in a single wire bonding system (e.g., a single wire bonding machine), the present invention is not limited thereto. In certain embodiments, the wire tool replacement system 112a / lead replacement system 112b can be configured to be removed from the wire bonding system 100 and used in association with another wire bonding system. In certain embodiments, the wire tool replacement system 112a / lead replacement system 112b can be automatically (e.g., via a robot) moved between multiple wire bonding systems.

[0041] Reference now FIG. 2A to FIG. 2D , a wire bonding tool source that can be used to replace the wire bonding tool source 120 is shown. In particular, Figure 2A and Figure 2B A wire bonding tool source 120' is shown, and Figure 2C and Figure 2D A wire bonding tool source 120' is illustrated. The wire bonding tool sources 120' and 120" are configured to simultaneously (i) provide a plurality of wire bonding tools 110 (e.g., each of the plurality of wire bonding tools 110 may be mounted in a slot of the wire bonding tool source 120' / 120"), and (ii) provide a receiving portion (such as a receiving portion 120a' defined by the wire bonding tool source 120', or an empty slot 120b' or 120b1") to receive a wire bonding tool from a wire bonding system (e.g., to receive a used wire bonding tool, etc.).

[0042] Figure 2A A lead replacement system 112b' is shown interacting with a wire bonding tool source 120' (the lead replacement system 112b' will be combined with FIG. 6A to FIG. 6E 106 )(wherein the lead replacement system 112b' is configured to replace the wire bonding tool 110). The lead replacement system 112b' carries the wire bonding tool 110 with the clamping mechanism 114' (eg, a used wire bonding tool 110 that has been removed from the transducer 106, such as Figure 1C). Lead replacement system 112b' is aligned with empty slot 120b' so that wire bonding tool 110 (e.g., a used wire bonding tool) can be installed in empty slot 120b'. By receiving wire bonding tool 110 in this manner, empty slot 120b' can be used as a receiving portion (unlike used receiving portion 120a') for receiving wire bonding tool 110 (e.g., a used wire bonding tool) to remove waste from the wire bonding system.

[0043] Although Figure 2A The figure shows the use of empty slot 120b' to receive wire bonding tool 110, but the present invention is not limited to this. It is contemplated that receiving portion 120a' can be used to receive (i) wire bonding tool (e.g., used wire bonding tool) and (ii) lead wire (e.g., such as FIG. 5E to FIG. 5F As described herein, at least one of the lead portions 108a) has been removed.

[0044] exist Figure 2B In the embodiment, the wire bonding tool 110 has been inserted into the empty slot 120b', and the lead replacement system 112b' has removed another wire bonding tool 110 from the wire bonding tool source 120', creating a new empty slot 120b' (e.g., another "used" wire bonding tool 110 can be inserted into the new empty slot 120b'). The lead replacement system 112b' can install the wire bonding tool 110 into the transducer of the wire bonding system (e.g., see Figure 1E and Figure 1F ).

[0045] When some or all of the plurality of wire bonding tools 110 have been removed from the wire bonding tool source 120' (and possibly replaced with a used wire bonding tool 110), the wire bonding tool source 120' can be removed from the lead replacement system 112b'. Alternatively, the used wire bonding tools 110 can also be removed and / or replaced individually (e.g., manually or via an automated process).

[0046] exist Figure 2C , the wire bonding tool source 120" includes a wire bonding tool box 120b" accommodating a plurality of wire bonding tools 110 and an empty slot 120b1". The wire bonding tool box 120b" is an example of a mechanism for holding a plurality of wire bonding tools 110, so that the plurality of wire bonding tools 110 can be efficiently loaded into the wire bonding tool source 120". Figure 2C Lead replacement system 112b' (including clamping portion 114) is shown, which inserts wire bonding tool 110 into empty slot 120b1" (eg, to Figure 2A and Figure 2B similar manner as described in the related section).

[0047] exist Figure 2D, a wire bonding tool box 120b" is being removed from a wire bonding tool source 120", exposing a box base 120c" defined by the wire bonding tool source 120". The box base 120c" is configured to receive another wire bonding tool box 120b". After removal, the wire bonding tool box 120b" can be discarded or reloaded with other / new wire bonding tools (e.g., manually or via an automated process). The wire bonding tool box 120b" can be configured to include a cover to protect the plurality of wire bonding tools 110 from damage during shipping and handling.

[0048] Although FIG. 2A to FIG. 2D The interaction between the lead replacement system 112b' and the wire tool sources 120', 120" is illustrated, but the present invention is not limited to this. That is, any wire tool replacement system or lead replacement system within the scope of the present invention (e.g., wire tool replacement system 112a, lead replacement system 112b, etc.) can be used to interact with any wire tool source within the scope of the present invention (e.g., wire tool source 120', 120").

[0049] Reference now 3A to 3H , which illustrates various block diagram side views of selected portions of the wire bonding system 100. Figure 3A , the wire bonding system 100 is illustrated as including a welding head assembly 102 (including a transducer 106). A wire bonding tool 110 is illustrated as being carried by the welding head assembly 102 and disposed within the transducer 106. The wire bonding system 100 also includes a wire bonding tool replacement system 112a (partially illustrated). The wire bonding tool replacement system 112a is configured to replace the wire bonding tool 110 with another wire bonding tool (e.g., another wire bonding tool 110). The wire bonding tool replacement system 112a is illustrated as including a clamping mechanism 114 for clamping and removing the wire bonding tool 110 from the welding head assembly 102. The clamping mechanism 114 includes a first clamping portion 114a (e.g., a moving clamping portion) and a second clamping portion 114b (e.g., a fixed clamping portion) adjacent to the first clamping portion 114a. Figure 3B , a clamping mechanism 114 is shown gripping the wire bonding tool 110 .

[0050] Reference now Figure 3C , a wrench 118 (e.g., a cap screw wrench) is illustrated as being rotated about the x-axis to loosen a screw 116 (e.g., a cap screw), thereby loosening the transducer 106 to release the wire bonding tool 110. Prior to (and / or while) loosening the transducer 106, the clamping mechanism 114 may clamp the wire bonding tool 110 (e.g., by moving the first clamping portion 114a relative to the second clamping portion 114b).

[0051] Reference now Figure 3D, the clamping mechanism 114 is shown moving the wire bonding tool 110 away (ie, along the z-axis) from the bond head assembly 102 and the transducer 106. The wire bonding tool 110 may be discarded before retrieving another wire bonding tool.

[0052] Reference now Figure 3E , the wire bonding tool source 120' is shown as including a plurality of wire bonding tools 110 (ie, FIG. 3E to FIG. 3F In the block diagram representation of FIG. 1 , only four wire bonding tools 110 and corresponding slots are shown.) The second clamping portion 114b is shown adjacent to the wire bonding tool source 120'.

[0053] Reference now Figure 3F , the clamping mechanism 114 is shown removing the wire bonding tool 110 from the wire bonding tool source 120 ′ (ie, along the z-axis).

[0054] Reference now Figure 3G , the figure shows that the clamping mechanism 114 moves the wire bonding tool 110 below the transducer 106 (ie, along the z-axis).

[0055] Reference now Figure 3H , a wire bonding tool 110 is shown disposed within transducer 106. A wrench 118 (e.g., a cap screw wrench) is illustrated as being rotated about an x-axis to tighten a screw 116 (e.g., a cap screw) to tighten transducer 106 to grip wire bonding tool 110. After (and / or while) tightening transducer 106, clamping mechanism 114 may unclamp from wire bonding tool 110 (e.g., move first clamping portion 114a relative to second clamping portion 114b).

[0056] Although the wire bonding system 100 (combined Figures 1A to 1F and 3A to 3H 10 is described) configured to (e.g., automatically) remove and replace the wire bonding tool, but the invention is not limited thereto. For example, a similar wire bonding system can be used to (e.g., automatically) remove and replace the lead. The movable arm assembly 128 and / or the clamping mechanism 114 can be configured to remove the lead from the wire bonding tool 110, and to replace the lead in connection with replacing the wire bonding tool 110. In one aspect, the clamping mechanism can include (i) a gripping portion for gripping the lead, (ii) a cutting portion for partially cutting the lead, and (iii) a threading portion for threading the wire (in addition to the tool clamping portion for gripping the wire bonding tool).

[0057] Reference now Figure 4A , the figure shows the lead replacement system 112b (partially shown) of the bonding wire system 300. It should be understood that the lead replacement system 112b is different from other parts of this document (e.g. Figures 1A to 1D , 3A to 3HThe wire bonding tool replacement system 112a described in the examples 110 and 111b of the drawings and the like shares many of the same elements and aspects with the wire bonding system 100. For example, Figure 4A Various elements of the clamping mechanism 114 are illustrated, including the wire bonding tool 110 which is illustrated being clamped by the clamping mechanism 114 .

[0058] Lead replacement system 112b is configured to: (i) remove a portion of a lead engaged with wire bonding tool 110; and (ii) replace the lead portion (eg, with the same lead portion or another lead portion). Lead replacement system 112b includes a clamping mechanism 114 configured to clamp a lead.

[0059] The clamping mechanism 114 is illustrated as including a first clamping portion 114a (e.g., a mobile clamping portion) and a second clamping portion 114b (e.g., a fixed clamping portion) disposed adjacent to the first clamping portion 114a. The clamping mechanism 114 is illustrated as including a spring 122 configured to actuate the mobile clamping portion (e.g., the first clamping portion 114a) relative to the fixed clamping portion (e.g., the second clamping portion 114b). The clamping mechanism 114 is illustrated as including a gripping portion 114a1 / 114b1 for gripping a lead. The clamping mechanism 114 is illustrated as including a cutting portion 324 for cutting a lead (e.g., completely cutting a lead, half-cutting a lead, partially cutting a lead, creating a cut, etc.). The clamping mechanism 114 is illustrated as including a threading portion 326 for threading a wire. The clamping mechanism 114 is illustrated as including a tool gripping portion 114b2 for gripping the wire bonding tool 110. In particular embodiments, the clamping mechanism 114 may be carried by a movable arm assembly 128 .

[0060] The movable arm assembly 128 is configured to move the clamping mechanism 114 independently of the bond head assembly 102 and / or the XY table that carries the bond head assembly 102. Thus, the clamping mechanism 114 is distinguished from the wire clamp 104 in that the wire clamp 104 is part of the bond head assembly 102 and, therefore, cannot be moved independently of the bond head assembly 102. The movable arm assembly 128 can have its own motion system / positioning system, for example, where the motion system / positioning system is housed within the wire bonding tool replacement system 112a / wire replacement system 112b.

[0061] Reference now Figure 4B , a wire bonding system 300 is shown. The wire bonding system 300 includes a bonding head assembly 102 (partially shown) configured to carry a wire bonding tool 110. The bonding head assembly 102 is shown to include a wire clamp 104 and a transducer 106. A wire supply 108 is shown to be disposed through both the wire clamp 104 and the transducer 106. A wire portion 108a of the wire supply 108 is shown to be disposed through the wire bonding tool 110.

[0062] The wire bonding system 300 also includes a wire replacement system 112b (partially shown) configured to (i) remove a portion of a wire engaged with a wire bonding tool and (ii) replace a portion of the wire (e.g., with the same wire portion or another wire portion). It should be understood that while the wire replacement system 112b may primarily replace a wire, the present invention is not so limited; in certain embodiments, the wire replacement system 112b may be configured to provide (or remove) the wire bonding tool 110 to the bonding head assembly 102. It should be understood that the wire bonding tool 110 may be provided to the transducer 106 (of the bonding head assembly 102) by the wire replacement system 112b.

[0063] exist Figure 4B , the lead replacement system 112b is illustrated as cutting the lead supply 108 with a cutting portion 324 (e.g., a "half-cut blade") to partially cut (e.g., "half-cut") the lead supply 108. The clamping mechanism 114 has been positioned (e.g., along the z-axis when in an "open" configuration) and then closed to perform the cutting operation, thereby forming a "half-cut" (or partial severance) on the lead supply 108. It should be understood that the cutting portion 324 can be spring-controlled (e.g., using spring 122) and can provide a clamping force that is different from a gripping force or a cutting force. During this cutting operation, the lead clamp 104 can be in a "closed" configuration.

[0064] After cutting the lead supply 108 , the lead clamp 104 can be opened (ie, in an “open” configuration) and the clamping mechanism 114 of the lead replacement system 112 b can be moved away from the lead clamp 104 (ie, downward or along the z-axis) to feed the lead supply 108 through the wire bonding tool 110 .

[0065] exist Figure 4C , the cutting operation and the first lead feeding operation have been completed. The clamping mechanism 114 of the lead replacement system 112b is shown as having been moved below the wire bonding tool 110. The clamping mechanism 114 can grasp the lead portion 108a using the gripping portion 114a1 (and the gripping portion 114b1, not shown), and feed the lead supply 108 in association with the feeding operation. This feeding operation can be repeated for multiple cycles (e.g., two cycles, three cycles, etc.). This feeding operation includes opening and closing the lead clamp 104 in association with each cycle. At the end of the feeding operation, the partial cutting portion is roughly aligned with the top of the wire bonding tool 110. Then, the lead clamp 104 is closed, and the clamping mechanism 114 can pull the lead supply 108 (e.g., along the z-axis) so that the lead supply 108 is disconnected at the partial cutting portion / cut. In a specific embodiment, after the lead supply 108 is disconnected at the partial cutting portion / cut, a new wire bonding tool can be provided.

[0066] exist Figure 4D , the lead supply 108 has been disconnected at a partial cut / incision, and the clamping mechanism 114 of the lead replacement system 112b is shown as having been moved above the transducer 106. The clamping mechanism 114 is shown as being closed around the lead supply 108 using a threading portion 326 (e.g., a threading blade). The clamping mechanism 114 can be moved away from the lead clamp 104 in association with the lead threading process. Such a threading process can be repeated for multiple cycles (e.g., two cycles, three cycles, etc.). Such a threading process includes opening and closing the lead clamp 104 in association with each cycle. Such a threading process is repeated until the lead portion 108a is extended to a desired length (e.g., as shown in FIG. 1 ). Figure 4D As shown, the lead portion 108a extends out of the wire bonding tool 110. After the wire threading process is completed, the lead clamp 104 is closed.

[0067] FIG. 5A to FIG. 5H Various cross-sectional block diagrams of various portions of the wire bonding system 300 and / or the lead replacement system 112b are illustrated in connection with certain exemplary embodiments of the present invention.

[0068] exist Figure 5A 1 and 2 illustrate a clamping mechanism 114 of a lead replacement system 112b. The clamping mechanism 114 is illustrated as including a first clamping portion 114a (movable clamping portion) and a second clamping portion 114b (e.g., fixed clamping portion) disposed adjacent to the first clamping portion 114a. The first clamping portion 114a is configured to move in at least one direction relative to the second clamping portion 114b. The clamping mechanism 114 is illustrated as including a gripping portion 114a1 for gripping a lead, a cutting portion 324 for cutting (e.g., half-cutting) a lead, and a threading portion 326 for threading a wire. The clamping mechanism 114 is illustrated as including a tool gripping portion 114b2 for gripping a tool (e.g., a wire bonding tool 110).

[0069] The clamping mechanism 114 is shown as including a spring 122, which is configured to actuate the first clamping portion 114a relative to the second clamping portion 114b. The spring 122 is shown as including a plurality of springs, including a spring 122a (configured to provide a cutting force for the cutting portion 324) and a spring 122b (configured to provide a gripping force for the threading portion 326). The cutting portion 324 and the threading portion 326 can be controlled by springs with different mechanical forces (e.g., different spring constants) from each other.

[0070] exist Figure 5B , the clamping mechanism 114 is shown positioned above the transducer 106 prior to a cutting operation. The cutting portion 324 is shown adjacent to the lead supply 108, with the clamping mechanism 114 in an "open" position prior to a cutting operation. The lead clamp 104 is shown in a "closed" position.

[0071] exist Figure 5C 3, the clamping mechanism 114 has been closed in connection with the cutting operation. The clamping mechanism 114 of the lead replacement system 112b is shown partially cutting the lead supply 108 to create a cut 330. The cut 330 defines the end of the lead portion 108a to be replaced on the wire bonding system 300. The cut 330 has been formed at a location between the lead clamp 104 and the wire bonding tool 110 on the wire bonding system 300. The clamping mechanism 114 can then be moved in connection with the first feeding operation (e.g., downward along the z-axis).

[0072] exist Figure 5D , the cutout 330 has been formed. The clamping mechanism 114 is shown as having been moved (e.g., moved downward along the z-axis) below the wire bonding tool 110 and disposed adjacent to the lead supply 108. The clamping mechanism 114 has been positioned so that the gripping portion 114a1 / 114b1 contacts and clamps the lead supply 108. The clamping mechanism 114 is shown as being moved further downward (i.e., along the z-axis) in relation to the feeding operation. This feeding operation can be repeated for multiple cycles (e.g., two cycles, three cycles, etc.). This feeding operation includes opening and closing the lead clamp 104 in relation to each cycle.

[0073] exist Figure 5E , the feeding operation has been completed, and the cutout 330 is substantially aligned with the top of the wire bonding tool 110. The lead clamp 104 is closed, and the clamping mechanism 114 can pull the lead portion 108a (eg, along the z-axis) so that the lead supply 108 is disconnected at the cutout 330.

[0074] exist Fig. 5F In the embodiment, lead portion 108a has been removed to form new lead end portion 108a1. Removed lead portion 108a can be discarded in a receiving portion (e.g., for waste, such as used wire bonding tools or leads) of lead replacement system 112b. Figure 1D In the receiving part 120a).

[0075] exist Figure 5G In the present invention, another wire bonding tool 110 is provided (for example, using a combination of Figures 1A to 1F and / or 3A to 3H104 and the process described herein). The clamping mechanism 114 has been moved between the lead clamp 104 and the transducer 106 so that the threading portion 326 is positioned to perform the lead threading process. The lead threading process includes pulling the end portion of the lead supply 108 through the wire bonding tool 110 with the clamping mechanism 114. For example, the clamping mechanism 114 can grasp the end portion of the lead supply 108. Then, as the lead clamp 104 opens, the clamping mechanism 114 can move so that the end portion of the lead supply 108 moves downward. Then, the clamping mechanism 114 can be opened, the lead clamp 104 can be closed, and the clamping mechanism 114 can move upward relative to the lead supply 108 and the lead clamp 104. The threading process can be repeated for multiple cycles (e.g., two cycles, three cycles, etc.). Such a threading process includes opening and closing the lead clamp 104 in association with each cycle. This threading process is repeated until the lead portion 108a is extended to a desired length (eg, the lead portion 108a extends out of the wire bonding tool 110; a suitable lead tail of a desired length is formed, etc.) After the threading process is completed, the lead clamp 104 is closed.

[0076] exist Figure 5H , the threading process has concluded and a new lead end portion 108 a 1 has now been threaded through the wire bonding tool 110 .

[0077] Although 4A to 4D and FIG. 5A to FIG. 5H The process of using half-cutting to facilitate removal of a portion of the lead during a wire bonding tool change process is illustrated and described, but the present invention is not limited thereto. FIG. 6A to FIG. 6E An exemplary process of removing a portion of a wire from a wire bonding tool without cutting the wire is illustrated on wire bonding system 600 . FIG. 6A to FIG. 6E Each of the figures in the drawings illustrates the wire supply 108 being disposed through: (i) a clamping mechanism 114' of a wire replacement system 112b'; (ii) a bond head assembly 102, including a wire clamp 104 and a transducer 106; and (iii) a wire bonding tool 110 (before the wire supply 108 is removed from the wire bonding tool 110).

[0078] exist Fig. 6A , the lead replacement system 112b' is positioned above the bond head assembly 102. The clamping mechanism 114' of the lead replacement system 112b' is engaged against the lead supply 108, preventing the lead supply 108 from moving relative to the clamping mechanism 114' (e.g., the moving / actuating clamping portion presses the lead supply 108 against the fixed clamping portion). The lead clamp 104 is in an open position, allowing the lead supply 108 to pass freely.

[0079] exist Figure 6BIn the embodiment of the present invention, the welding head assembly 102 including the lead clamp 104, the transducer 106 and the wire bonding tool 110 moves downward (i.e., away from the clamping mechanism 114'). Since the lead clamp 104 is opened, the welding head assembly 102 and the transducer 106 pass over the lead supply 108, allowing the end of the lead supply 108 to move upward relative to the wire bonding tool 110.

[0080] exist Figure 6C 1 , the clamping mechanism 114' opens, allowing the wire supply 108 to move through the clamping mechanism 114'. The wire clamp 104 closes, preventing the wire supply 108 from moving relative to the bond head assembly 102. The bond head assembly 102 moves upward toward the clamping mechanism 114'. From the time the wire clamp 104 closes, the wire supply 108 moves upward with the bond head assembly 102 and through the clamping mechanism 114'.

[0081] exist Fig.6D In the embodiment of the present invention, the clamping mechanism 114' is closed again and the wire clamp 104 is opened. The bonding head assembly 102 moves downward, allowing the wire supply 108 to pass through the wire bonding tool 110 until the wire supply 108 is removed from the wire bonding tool 110 (eg, completely removed).

[0082] exist Fig. 6E In the embodiment, the lead supply 108 is removed from the wire bonding tool 110 so that the wire bonding tool 110 can be used as described herein (e.g., see Figures 1A to 1F , FIG. 2A to FIG. 2B and 3A to 3H ) were removed and replaced. In addition, in combination FIG. 6A to FIG. 6D After the described process, the lead supply 108 can be rethreaded / replaced by the wire bonding tool 110 (see, for example, Figure 4D and Figure 5G , as described herein).

[0083] 7A to 7F Various cross-sectional block diagrams of portions of a wire bonding system 600 and / or a lead replacement system 112b' are illustrated that are associated with certain exemplary embodiments of the present invention. 7A to 7F The diagram shows FIG. 6A to FIG. 6E A similar process is shown in the figure.

[0084] Fig. 7A A lead replacement system 112b' is shown. The lead replacement system 112b' includes a clamping mechanism 114', which includes a first clamping portion 114a' (a mobile clamping portion) and a second clamping portion 114b' (a fixed clamping portion). The first clamping portion 114a' includes a threading portion 326'. The threading portion 326' is actuated by a spring 122b' (e.g., a leaf spring). The second clamping portion 114b' includes a tool clamping portion 114b2' for grasping the wire bonding tool 110.

[0085] exist Figure 7B , the wire supply 108 is shown as being engaged by the threading portion 326' of the clamping mechanism 114' at an upper position of the wire clamp 104. The wire clamp 104 is open. Therefore, the wire supply 108 cannot move relative to the clamping mechanism 114', but the bonding head assembly 102 (including the wire clamp 104, the transducer 106 and the wire bonding tool 110) can move relative to the wire supply 108. Figure 7B The bond head assembly 102 is shown beginning to move downward. This downward movement will cause the wire supply 108 to move upward relative to the bond head assembly 102.

[0086] exist Figure 7C In the embodiment, the welding head assembly 102 has moved downward relative to the lead supply portion 108 (ie, the lead supply portion 108 is no longer Figure 7B 10. The wire bonding tool 110 is fully threaded as in FIG. 10. The clamping mechanism 114' is now open, and the wire clamp 104 is now closed. Thus, the wire supply 108 can move relative to the clamping mechanism 114', and the movement of the bonding head assembly 102 will be transmitted to the wire supply 108. Figure 7C The bonding head assembly 102 is shown as it begins to move upward. This upward movement will cause the bonding head assembly 102 and the wire supply 108 to move upward relative to the clamping mechanism 114'. This upward movement of the wire can be facilitated by an air guide (not shown) of the wire bonding system 600.

[0087] Fig.7D The bond head assembly 102 is shown having moved upward. The clamping mechanism 114' is closed again, and the wire clamp 104 is opened again. The bond head assembly 102 begins to move downward so that the bond head assembly 102 will move downward relative to the wire supply 108 and the clamping mechanism 114'. Fig. 7E The bond head assembly 102 is shown having been moved downward and the wire supply 108 has been further removed from the wire bonding tool 110 .

[0088] FIG. 7B to FIG. 7E The illustrated process may be repeated multiple times until wire supply 108 is completely removed from wire bonding tool 110 . Figure 7F After the lead supply 108 is removed from the wire bonding tool 110, the wire bonding tool 110 may be replaced with another wire bonding tool 110 (e.g., Figures 1A to 1F , FIG. 2A to FIG. 2B and 3A to 3H ) and the lead replacement system 112b' can replace the lead supply 108 (e.g., as shown) by inserting the lead supply into the wire bonding tool 110. Figure 4D and Figure 5G to Figure 5H shown).

[0089] Reference now Fig. 8A and Figure 8B , illustrating a wire bonding system 800. As shown, the wire bonding system 800 may include any of a wire bonding tool replacement system 112a, a lead replacement system 112b, or a lead replacement system 112b'. It should be understood that the wire bonding tool replacement system 112a is similar to the lead replacement systems 112b and 112b' described elsewhere herein (e.g., 4A to 4D , FIG. 5A to FIG. 5H etc.) share many of the same components and aspects.

[0090] exist Fig. 8A and Figure 8B , a wire tool replacement system 112a (or a lead replacement system 112b, 112b') is extracting a wire bonding tool 110 from a wire bonding tool source 120, 120', 120" and installing the wire bonding tool 110 into a transducer 106. A support structure 800b is configured to support a workpiece during a wire bonding operation. The support structure 800b and the wire bonding tool replacement system 112a (or a lead replacement system 112b, 112b') are supported by a machine base 800a. The wire bonding tool replacement system 112a (or a lead replacement system 112b, 112b') is illustrated as including: (i) a clamping mechanism 114 / 114' carried by a movable arm assembly 128; (ii) a wrench 118; and (iii) a wire bonding tool source 120, 120', 120".

[0091] exist Fig. 8A , the movable arm assembly 128 is shown at the wire bonding tool source 120, 120', 120". In such a position, the clamping mechanism 114 / 114' can pick up a new wire bonding tool 110 (e.g., see Figure 1D , Figure 2A , Figure 2C , Figure 3E and Figure 3F ).exist Figure 8B In the embodiment, the movable arm assembly 128 has moved the clamping mechanism 114 / 114' toward the wire bonding tool 110 (eg, to install the wire bonding tool 110, such as Figures 1A to 1F and 3A to 3H , and / or replace the leads, such as 4A to 4D , FIG. 5A to FIG. 5H and FIG. 6A to FIG. 6E ).exist Figure 8B , the wire bonding tool 110 has been installed in the transducer 106 (see, for example, Figure 1E to Figure 1F ).

[0092] It is contemplated that the wire tool replacement system 112a and / or the lead replacement system 112b / 112b' can be removed from the machine base 800a. For example, each of the machine base 800a and the wire tool replacement system 112a can include, for example: (i) electrical connectors for power and / or data communications, and / or (ii) guide pins / locating holes for alignment.

[0093] In many operations performed by the wire tool replacement system 112a and / or the lead replacement system 112b, 112b', high precision is required to prevent damage or errors (e.g., failure to grasp the wire tool, improper threading, misplacing another wire tool, etc.). In this way, it is envisioned that the wire tool replacement system 112a and / or the lead replacement system 112b / 112b' will include a positioning system for controlling the position of the clamping mechanism, the movable arm assembly and / or the wrench. An exemplary positioning system can communicate with the wire system. The wire tool replacement system can be configured to provide feedback control related to the positioning system. The positioning system can be configured to use open circuit / short circuit detection, servo controller feedback and / or a visual system for positioning.

[0094] It is contemplated that the vision system of the wire bonding system may be used to determine the precise position of the clamping mechanism 114 / 114' (and / or movable arm assembly and / or wrench) of the wire bonding tool replacement system 112a and / or the lead replacement system 112b / 112b'. Such use of the vision system is described by reference to Fig. 9A and Fig. 9B 1 and 2 are illustrated and described, and may be used with any wire tool replacement system or lead replacement system (eg, wire tool replacement system 112a, lead replacement system 112b / 112b', etc.) within the scope of the present invention.

[0095] Fig. 9A Certain common features of the wire tool replacement system 112a and the lead replacement system 112b' are illustrated, including a clamping mechanism 114', a first clamping portion 114a' (eg, a moving clamping portion), and a second clamping portion 114b' (eg, a fixed clamping portion). Fig. 9A Provide with Fig. 9B Related references. Fig. 9A and Fig. 9B The prism 114b3' is shown, referring to Fig. 9B Described in more detail.

[0096] Fig. 9BAdditional details of the second clamping portion 114b' are shown. An eye point 114b4' is disposed on the second clamping portion 114b' and is oriented toward the wire bonding system (i.e., toward the negative Y direction, as shown). The eye point 114b4' provides a reference feature for determining the position of the clamping mechanism 114'. As shown, the eye point 114b4' has a specific image registration feature, but any image registration feature (e.g., a marking or other feature) may be used. The second clamping portion 114b' includes a prism 114b3'. The prism 114b3' is configured to reflect an image of the eye point 114b4' toward the vision system 140 of the wire bonding system. The prism 114b3' is a reflective optical element that is configured to reflect the image of the eye point 114b4' at an angle of approximately 90° (e.g., in the range of 70°-110°). The vision system 140 includes a computer (or other processing device, not shown) configured to determine the position of the exit point 114b4' (and therefore the clamping mechanism 114') based on the images collected by the vision system 140. Because the exit point 114b4' is rigidly attached to the clamping mechanism 114', the image provided by the vision system 140 can be used to determine the precise position of the clamping mechanism 114'. Such position information can be used to determine the position of the clamping mechanism 114' during the wire bonding tool replacement process (e.g., Figures 1A to 1F and 3A to 3H ) and / or lead replacement procedures (e.g., as shown and described in 4A to 4D , FIG. 5A to FIG. 5H and FIG. 6A to FIG. 6E Movement of the clamping mechanism 114' in FIG.

[0097] FIG. 9A to FIG. 9B The diagram illustrates imaging the exit point 114b4' (or other image registration feature) by setting a prism 114b3' in the optical path. For example, such a prism may be included to extend the working distance of the imaging path to provide a clear exit point image. However, it should be understood that a prism (or other reflective optical element) is not required. For example, a more direct imaging path can be adopted without a prism or a reflective optical element. In a specific example, a refractive optical element (such as glass, plastic, etc.) can be set in the imaging path to reduce the working distance of the imaging path, thereby providing a clear exit point image (or other image registration feature). Such a refractive optical element may be set at (or adjacent to) the exit point (or other image registration feature). Of course, other configurations are contemplated.

[0098] Fig.10 and Fig.11Flowcharts illustrating exemplary embodiments and / or aspects of the present invention. As will be appreciated by those skilled in the art, certain steps included in the flow charts may be omitted; certain additional steps may be added; and the order of the steps may be changed from the order illustrated, all within the scope of the present invention.

[0099] Reference now Fig.10 , illustrates a method for replacing a wire bonding tool using a wire bonding tool replacement system on a wire bonding system. At optional step 1000, a portion of the lead wire (e.g., see FIG. 5B to FIG. 5F and 7A to 7F 1002, the wire bonding tool is removed from the bonding head assembly using a wire bonding tool replacement system (e.g., see Figures 1A to 1D and FIG. 3A to FIG. 3D At step 1004, another wire bonding tool is provided to the bonding head assembly using a wire bonding tool replacement system (e.g., see FIG. 3E to FIG. 3H At optional step 1006, a portion of the lead is provided through a wire bonding tool (eg, see FIG. 5F to FIG. 5H and Fig. 6E ).

[0100] Reference now Fig.11 , illustrates a method for replacing a lead portion on a wire bonding system. At step 1100, a welding head assembly configured to carry a wire bonding tool (e.g., see Figure 4B The lead portion is engaged with the wire bonding tool. The lead portion is part of the wire supply on the wire bonding system. At step 1102, the lead portion is removed using a lead replacement system (e.g., see FIG. 5B to FIG. 5F The lead removal process of removing lead portion 108a from wire bonding tool 110 is shown in FIG. 7A to 7F At optional step 1104, the wire bonding tool is removed and a wire bonding tool replacement system is used (e.g., see Figures 1A to 1F ) provides another wire bonding tool to the bonding head assembly. At step 1106, a wire replacement system (e.g., see FIG. 5F to FIG. 5H and Fig. 6E )Replace the lead portion (e.g., with the removed lead portion or with another lead portion).

[0101] Although aspects of the present invention are illustrated and described herein with reference to creating a partial cut in a lead supply, the present invention is not limited thereto. It is envisioned that during a lead replacement process, the cutting / gripping portion of a wire tool replacement system or a lead replacement system can be used to completely cut the lead.

[0102] While the invention has been illustrated and described herein with reference to specific embodiments, the invention is not limited to the details shown, but rather various modifications may be made in the details within the scope and range of equivalents of the claims and without departing from the invention.

Claims

1. A wire bonding system, comprising: a welding head assembly configured to carry a wire bonding tool; as well as A lead replacement system is configured to: (i) remove a lead portion engaged with the wire bonding tool, the lead portion being part of a lead supply on a wire bonding system; and (ii) replace a lead portion to be engaged with the wire bonding tool. 2 . The wire bonding system of claim 1 , wherein the lead replacement system comprises a clamping mechanism configured to clamp the lead.

3. The wire bonding system of claim 2, wherein the clamping mechanism comprises (i) a fixed clamping portion and (ii) a movable clamping portion disposed adjacent to the fixed clamping portion, the movable clamping portion being configured to move in at least one direction relative to the fixed clamping portion. 4 . The wire bonding system of claim 3 , wherein the clamping mechanism comprises a spring configured to actuate the mobile clamping portion relative to the fixed clamping portion.

5. The wire bonding system of claim 2, wherein the clamping mechanism is carried by a movable arm assembly. The wire bonding system according to claim 2 , wherein the clamping mechanism comprises a threading portion for threading a wire. 7 . The wire bonding system of claim 2 , wherein the clamping mechanism comprises a gripping portion for gripping the wire, a cutting portion for partially cutting the wire, and a threading portion for threading the wire.

8. The wire bonding system of claim 2, wherein the clamping mechanism comprises a tool clamping portion for clamping the wire bonding tool.

9. The wire bonding system of claim 1, wherein the wire replacement system is configured to remove and replace the wire bonding tool from the bond head assembly.

10. The wire bonding system of claim 9, further comprising a wire bonding tool source configured to provide a plurality of wire bonding tools, the wire replacement system configured to replace the wire bonding tool at the bonding head assembly with one of the plurality of wire bonding tools from the wire bonding tool source. 11 . The wire bonding system of claim 1 , wherein the lead replacement system is configured to replace the lead portion by reengaging the lead portion with the wire bonding tool. 12 . The wire bonding system of claim 1 , wherein the lead replacement system is configured to replace the lead portion by engaging another lead portion with the wire bonding tool.

13. The wire bonding system of claim 12, further comprising a receiving portion for receiving the lead portion after the lead portion is removed by the lead replacement system.

14. The wire bonding system of claim 1, wherein the lead replacement system comprises a clamping mechanism configured to clamp a lead, and the clamping mechanism comprises an image registration feature that provides a reference for determining a position of the clamping mechanism. 15 . The wire bonding system of claim 14 , further comprising a vision system configured to determine a position of the clamping mechanism by collecting an image of the image registration feature.

16. The wire bonding system of claim 15, wherein an optical path between the vision system and the image registration feature includes a reflective optical element.

17. The wire bonding system of claim 15, wherein an optical path between the vision system and the image registration feature includes a refractive optical element.

18. A method for replacing a lead portion on a wire bonding system, the method comprising the steps of: (a) providing a welding head assembly, wherein the welding head assembly is configured to carry a wire bonding tool, the lead portion is engaged with the wire bonding tool, and the lead portion is part of a lead supply portion on the wire bonding system; (b) removing the lead portion from the wire bonding tool using a lead replacement system; as well as (c) replacing the lead portion to the wire bonding tool using the lead replacement system.

19. The method of claim 18, wherein the lead replacement system comprises a clamping mechanism configured to clamp a lead.

20. The method of claim 19, wherein the clamping mechanism comprises (i) a fixed clamping portion and (ii) a movable clamping portion disposed adjacent to the fixed clamping portion, the movable clamping portion being configured to move in at least one direction relative to the fixed clamping portion.

21. The method of claim 20, wherein the clamping mechanism comprises a spring configured to actuate the mobile clamping portion relative to the fixed clamping portion.

22. The method of claim 19, wherein the clamping mechanism is carried by a movable arm assembly.

23. The method of claim 19, wherein the clamping mechanism comprises a gripping portion for gripping the lead, a cutting portion for partially cutting the lead, and a threading portion for threading the lead.

24. The method of claim 19, wherein the clamping mechanism comprises a tool clamping portion for clamping the wire bonding tool.

25. The method of claim 18, wherein the lead replacement system is configured to remove the wire bonding tool from the bond head assembly.

26. The method of claim 25, wherein the wire replacement system comprises a wire bonding tool source configured to provide a plurality of wire bonding tools, the wire replacement system configured to replace the wire bonding tool at the bonding head assembly with one of the plurality of wire bonding tools from the wire bonding tool source.

27. The method of claim 18, wherein the lead replacement system includes a receiving portion for receiving the lead portion after the lead portion is removed in step (b).

28. The method of claim 18, wherein step (b) includes a sub-step (b1) of partially cutting the lead supply with a clamping mechanism of the lead replacement system to create a cutout defining an end of the lead portion to be replaced on the wire bonding system, the cutout being formed at a location between a lead clamp and the wire bonding tool on the wire bonding system.

29. The method of claim 28, wherein step (b) comprises, after sub-step (b1), a sub-step (b2) of pulling the lead portion to move the position of the cut closer to the wire bonding tool.

30. The method of claim 29, wherein step (b) includes, after sub-step (b2), a sub-step (b3) of disconnecting the lead portion from the lead supply at the cutout by pulling the lead with the clamping mechanism when the lead clamp is closed.

31. The method of claim 28, wherein a cutting portion of the clamping mechanism is used in conjunction with sub-step (b1).

32. The method of claim 18, further comprising removing the wire bonding tool between steps (b) and (c) and providing another wire bonding tool to the bond head assembly using the wire replacement system.

33. The method of claim 18, wherein step (c) comprises a lead threading process.

34. The method of claim 33, wherein step (c) comprises threading another lead portion through one of the wire bonding tool and another wire bonding tool associated with the wire threading process.

35. The method of claim 33, wherein step (c) comprises threading the lead portion through one of the wire bonding tool and another wire bonding tool associated with the wire threading process.

36. The method of claim 33, wherein the lead threading procedure includes using a threading portion of a clamping mechanism of the lead exchange system.

37. The method of claim 33, wherein the lead threading process comprises the following steps: A distal portion of the wire supply is pulled through the wire bonding tool using a clamping mechanism.

38. The method of claim 37, wherein the clamping mechanism draws the end portion of the wire supply through the wire bonding tool using multiple movements of the clamping mechanism.

39. The method of claim 37, wherein the lead threading process comprises the sub-steps of: (i) gripping the end portion of the lead supply with the clamping mechanism; (ii) opening the lead clamp; (iii) moving the clamping mechanism so that the end portion of the lead supply moves downward; and (iv) closing the lead clamp.

40. The method of claim 39, wherein each of sub-steps (i)-(iv) are repeated until the end portion of the wire supply is pulled through the wire bonding tool.

41. The method of claim 39, wherein each of sub-steps (i)-(iv) is repeated until a terminal portion of the wire supply is pulled through the wire bonding tool and a wire tail having a predetermined length has been formed beneath the wire bonding tool.

42. A lead replacement system for replacing a lead portion on a wire bonding system, the lead replacement system comprising: The clamping mechanism is configured to clamp the lead portion, and the clamping mechanism includes a threading portion for threading the lead portion through a wire bonding tool of the wire bonding system.

43. A lead replacement system according to claim 42, wherein the clamping mechanism includes (i) a fixed clamping portion and (ii) a movable clamping portion arranged adjacent to the fixed clamping portion, and the movable clamping portion is configured to move in at least one direction relative to the fixed clamping portion.

44. The lead replacement system of claim 43, wherein the clamping mechanism comprises a spring configured to actuate the mobile clamping portion relative to the fixed clamping portion.

45. The lead replacement system of claim 42, further comprising a movable arm assembly configured to move the clamping mechanism.

46. ​​The lead replacement system of claim 42, wherein the gripping mechanism comprises a gripping portion for gripping the lead and a cutting portion for partially cutting the lead.

47. The lead replacement system of claim 42, wherein the clamping mechanism includes a tool clamping portion for clamping the wire bonding tool.

48. The lead replacement system of claim 47, further comprising a wire bonding tool source configured to provide a plurality of wire bonding tools, the lead replacement system configured to replace a wire bonding tool at a bonding head assembly of the wire bonding system with one of the plurality of wire bonding tools from the wire bonding tool source.

49. The lead replacement system of claim 42, further comprising an image registration feature that provides a reference for determining a position of the clamping mechanism.

Images